Production line for a special chip in an electrical component

Abstract

This invention relates to the field of chip manufacturing technology, specifically to a production line for specialized chips used in electrical components. The production line includes a conveyor belt with inclined plates fixed to both sides of one end. A temporary storage box is fixed to the end of the inclined plates away from the conveyor belt. A robotic arm is mounted on one side of the temporary storage box, and an LED chip detection device body is mounted on one side of the robotic arm. A detection light source is connected to the top of the LED chip detection device body, and an offset component is disposed in the middle of the LED chip detection device body. By setting the offset component, the specialized chip for electrical components being detected can be offset during the detection process, causing its angle to change. This transforms static detection into dynamic detection, simulating various postures that the chip may exhibit in practical applications. The detection light is then directed to illuminate the chip surface at different incident angles, thereby more accurately capturing subtle defects that are easily overlooked under conventional vertical detection.

Description

Technical Field

[0001] This invention relates to the field of chip manufacturing technology, and more specifically, to a production line for a dedicated chip used in electrical components. Background Technology

[0002] The production line for specialized chips in electrical components is a highly automated and precise manufacturing system that integrates multidisciplinary technologies. Its equipment covers the entire process from chip design to finished product packaging and testing, thereby ensuring that the chips meet the stringent requirements of electrical components in terms of electrical performance, reliability, and cost-effectiveness.

[0003] After the chips are manufactured, LED chip inspection devices are usually used to detect common defects such as scratches, stains, and damage on the chip surface. However, when inspecting chips, because the chips are often fixed in a specific position, the inspection light is only incident from a single or a few fixed angles. This limited inspection mode makes it difficult to discover potential problems exposed by the chip due to changes in posture under different application scenarios. Moreover, for some chips with complex surface structures, static inspection is prone to missing defects in local areas, causing defective products to flow into subsequent stages, increasing quality risks and production costs.

[0004] Based on this, the present invention discloses a production line for dedicated chips in electrical components. Summary of the Invention

[0005] To address the issues raised in the background section, where LED chip inspection devices are typically used to detect common defects such as scratches, stains, and breakage on the chip surface after chip production, the limited inspection mode, where chips are often fixed in specific positions and inspection light only enters from a single or a few fixed angles, makes it difficult to detect potential problems exposed by chip posture changes in different application scenarios. Furthermore, for chips with complex surface structures, static inspection can easily miss defects in localized areas, leading to defective products flowing into subsequent stages, increasing quality risks and production costs, this invention provides a production line for dedicated chips in electrical components. The production line includes a conveyor belt with inclined plates fixed to both sides at one end. A temporary storage box is fixed to the end of the inclined plates away from the conveyor belt. A robotic arm is mounted on one side of the temporary storage box, and an LED chip inspection device body is mounted on one side of the robotic arm. A detection light source is connected to the top of the LED chip inspection device body. An offset component is located in the middle of the LED chip inspection device body, a correction component is located in the middle of the inclined plates, and a buffer component is located in the middle of the temporary storage box.

[0006] Preferably, the offset assembly includes a layer plate, a first servo motor, a limiting groove, a bending guide rail, a reciprocating screw, and a slider. The layer plate is fixed to the middle of the main body of the LED chip detection device. The first servo motor is installed at one end of the bottom of the main body of the LED chip detection device. The limiting groove is opened in the middle of the layer plate. The bending guide rail is fixed to the middle of the layer plate. One end of the reciprocating screw is connected to the output end of the first servo motor. The other end of the reciprocating screw is rotatably connected to the side of the main body of the LED chip detection device away from the first servo motor. The slider is threadedly connected to the middle of the reciprocating screw.

[0007] Preferably, the offset assembly further includes a drive rod, a first connecting shaft, two sets of first baffles, a detection disc, two sets of second baffles, a second connecting shaft, a driven rod, a pulley, and a guide groove. The bottom end of the drive rod is fixed to the top of the slider, and the middle part of the drive rod is slidably connected to the middle of the limiting groove. The middle part of the first connecting shaft is rotatably connected to the top end of the drive rod. The two first baffles are respectively fixed to the two ends of the first connecting shaft. One side of the bottom of the detection disc is fixed to the top of the two sets of first baffles. The tops of the two second baffles are both fixed to the bottom of the detection disc on the side away from the first baffles. The two ends of the second connecting shaft are respectively fixed to the middle of the two sets of second baffles. The top end of the driven rod is rotatably connected to the middle of the second connecting shaft. The pulley is installed at the bottom end of the driven rod. The guide groove is opened in the middle of the pulley and fits against the curved guide rail. A clamping mechanism is provided on the top of the detection disc.

[0008] Preferably, the clamping mechanism includes a large-diameter support plate, a small-diameter support plate, a linkage shaft, a linkage gear, four sets of driven shafts, and four sets of driven gears. The bottom of the large-diameter support plate is fixed to the outer side of the detection disc, the bottom of the small-diameter support plate is fixed to the middle of the detection disc, the middle of the linkage shaft is rotatably connected to the middle of the detection disc, the middle of the linkage gear is fixed to the top of the linkage shaft, the bottom ends of the four driven shafts are rotatably connected to the top of the detection disc, and the middle parts of the four driven gears are respectively fixed to the top of the four sets of driven shafts.

[0009] Preferably, the clamping mechanism further includes a fixed plate, multiple sets of suction cups, a circular groove, a toothed ring, and multiple sets of sliding grooves. The bottom of the fixed plate is fixed to the top of the large-diameter support plate and the small-diameter support plate. The bottoms of the multiple suction cups are all connected to the top of the fixed plate. The circular groove is opened on the inner side of the middle of the large-diameter support plate. The toothed ring is rotatably connected to the middle of the circular groove. The multiple sliding grooves are respectively opened in the middle of the large-diameter support plate and the small-diameter support plate.

[0010] Preferably, the clamping mechanism further includes four sets of driven rack plates, four sets of clamping blocks, a sealing box, a triangular support plate, and an active rack plate. The four driven rack plates are slidably connected to the middle of multiple sets of sliding grooves, and the four sets of driven rack plates mesh with four sets of driven gears. The four clamping blocks are fixed to the ends of the four sets of driven rack plates that are far apart from each other. The top of the sealing box is fixed to the bottom of the detection disc near the linkage shaft. One end of the triangular support plate is fixed to one side of the main body of the LED chip detection device. One end of the active rack plate is fixed to the other end of the triangular support plate, and the middle of the active rack plate is slidably connected to the middle of the sealing box.

[0011] Preferably, the clamping mechanism further includes a one-way threaded rod, a drive gear, a hollow sleeve, and a rectangular groove. The bottom end of the one-way threaded rod is rotatably connected to the bottom of the sealing box, the top end of the one-way threaded rod is fixed to the bottom end of the driven shaft, the drive gear is fixed to the bottom end of the driven shaft and meshes with the drive rack plate, the hollow sleeve is threaded to the middle of the one-way threaded rod, and the rectangular groove is formed on one side of the sealing box.

[0012] Preferably, the clamping mechanism further includes a rectangular slide rod, a first strong magnetic ring, and a second strong magnetic ring. One end of the rectangular slide rod is fixed to the middle of the hollow sleeve, and the other end of the rectangular slide rod is slidably connected to the middle of the rectangular groove. The two sides of the rectangular slide rod are in contact with the two sides of the rectangular groove. The first strong magnetic ring is connected to the top of the hollow sleeve, and the second strong magnetic ring is connected to the bottom of the drive gear.

[0013] Preferably, the calibration assembly includes multiple sets of rotating shafts, two sets of calibration plates, a support plate, a second servo motor, two sets of rectangular support plates, and a bidirectional threaded rod. The two ends of the multiple rotating shafts are respectively rotatably connected to the sides of the two sets of inclined plates that are close to each other. The two calibration plates are respectively slidably connected to the two ends of the multiple sets of rotating shafts. The support plate is fixed to one side of one set of inclined plates. The second servo motor is installed in the middle of the support plate. The tops of the two rectangular support plates are respectively fixed to the bottoms of the two sets of inclined plates. The two ends of the bidirectional threaded rod are respectively rotatably connected to the middle of the two sets of rectangular support plates. One end of the bidirectional threaded rod is connected to the output end of the second servo motor, and the bottoms of the two sets of calibration plates are respectively threaded to the two ends of the two sets of bidirectional threaded rods.

[0014] Preferably, the buffer assembly includes two sets of spring posts and a movable plate, with the bottom of each of the two spring posts fixed to the bottom of the temporary storage box, and the bottom of the movable plate fixed to the top of the two sets of spring posts.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0016] 1. In the production line of a special chip for electrical components, by setting an offset component, the special chip of the electrical component being tested can be offset during the testing process, causing its angle to change. This transforms static testing into dynamic testing, simulating various postures that the chip may exhibit in actual applications. The test light is then irradiated onto the chip surface at different incident angles, thereby more accurately capturing those minute defects that are easily overlooked under conventional vertical testing, such as tiny cracks on the chip edge, uneven adhesion of the surface coating, or impurities hidden in structural shadows. This effectively improves the comprehensiveness and accuracy of the testing.

[0017] 2. In the production line of a special chip for electrical components, the special chip for electrical components to be tested can be clamped and fixed by the clamping mechanism, thereby reducing the risk of the chip slipping due to imbalance when the offset component tilts the chip, which would force the testing work to be interrupted and reduce the testing efficiency. At the same time, the chip is also prone to damage due to falling.

[0018] 3. In the production line of the special chip in the electrical component, by setting the calibration component, the chip that falls into the temporary storage box can be calibrated before it falls, thereby reducing the situation where the chip is scattered when it falls into the temporary storage box due to the lack of restraint during free fall. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0020] Figure 2 This is a cross-sectional view of the transmission belt structure of the present invention;

[0021] Figure 3 This is a schematic diagram of the overall structure of the calibration component of the present invention;

[0022] Figure 4 This is a schematic diagram of the bottom structure of the calibration component of the present invention;

[0023] Figure 5 This is a cross-sectional view of the temporary storage box of the present invention;

[0024] Figure 6 This is a schematic diagram of the back structure of the main body of the LED chip detection device of the present invention;

[0025] Figure 7 This is a front structural diagram of the main body of the LED chip detection device of the present invention;

[0026] Figure 8 This is a schematic diagram of the detection light source of the present invention;

[0027] Figure 9 This is a cross-sectional view of the main body of the LED chip detection device of the present invention.

[0028] Figure 10 This is a schematic diagram of the reciprocating lead screw of the present invention;

[0029] Figure 11 This is a cross-sectional view of the layer structure of the present invention;

[0030] Figure 12 This is a schematic diagram of the bottom structure of the detection disk of the present invention;

[0031] Figure 13 This is a cross-sectional view of the fixed disk of the present invention;

[0032] Figure 14 This is a schematic diagram of the top structure of the detection disk of the present invention;

[0033] Figure 15 This is a cross-sectional view of the detection disk of the present invention;

[0034] Figure 16 This is a cross-sectional view of the sealing box of the present invention;

[0035] Figure 17 This is a schematic diagram of the unidirectional threaded rod of the present invention;

[0036] Figure 18 This is a schematic diagram of the rectangular groove of the present invention;

[0037] Figure 19 This is a schematic diagram of the bottom structure of the drive gear of the present invention.

[0038] The meanings of the labels in the diagram are as follows:

[0039] 1. Conveyor belt; 11. Inclined plate; 12. Temporary storage box; 13. Robotic arm; 14. Main body of LED chip detection device; 15. Detection light source; 2. Shelf; 21. First servo motor; 22. Limiting groove; 23. Bending guide rail; 24. Reciprocating lead screw; 25. Slider; 3. Drive rod; 31. First connecting shaft; 32. First baffle; 33. Detection disc; 34. Second baffle; 35. Second connecting shaft; 36. Driven rod; 37. Pulley; 38. Guide groove; 4. Large-circle support plate; 41. Small-circle support plate; 42. Linkage shaft; 43. Linkage gear; 44. Driven shaft; 45. Driven gear; 5. Fixed plate; 51. Suction cup; 52. Circular groove; 53. Gear ring; 54. Slide groove; 6. Driven rack plate; 61. Clamping block; 62. Sealing box; 63. Triangular support plate; 64. Driven rack plate; 7. Drive gear; 71. One-way threaded rod; 72. Hollow sleeve; 73. Rectangular groove; 8. Rectangular slide rod; 81. First strong magnetic ring; 82. Second strong magnetic ring; 9. Rotating shaft; 91. Correction plate; 92. Support plate; 93. Second servo motor; 94. Rectangular support plate; 95. Two-way threaded rod; 10. Spring column; 101. Movable plate. Detailed Implementation

[0040] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] After the chips are manufactured, LED chip inspection devices are usually used to detect common defects such as scratches, stains, and damage on the chip surface. However, when inspecting chips, because the chips are often fixed in a specific position, the inspection light is only incident from a single or a few fixed angles. This limited inspection mode makes it difficult to discover potential problems exposed by the chip due to changes in posture under different application scenarios. Moreover, for some chips with complex surface structures, static inspection is prone to missing defects in local areas, causing defective products to flow into subsequent stages, increasing quality risks and production costs.

[0042] Therefore, this invention provides a production line for dedicated chips used in electrical components, see [link to relevant documentation]. Figure 1As shown, it includes a conveyor belt 1, with inclined plates 11 fixed to both sides of one end of the conveyor belt 1. A temporary storage box 12 is fixed to the end of the inclined plate 11 away from the conveyor belt 1. A robotic arm 13 is installed on one side of the temporary storage box 12. An LED chip detection device body 14 is installed on one side of the robotic arm 13. A detection light source 15 is connected to the top of the LED chip detection device body 14. An offset component is provided in the middle of the LED chip detection device body 14. A correction component is provided in the middle of the inclined plate 11. A buffer component is provided in the middle of the temporary storage box 12.

[0043] For details, see Figures 1 to 16 As shown, the offset assembly includes a layer plate 2, a first servo motor 21, a limiting groove 22, a bending guide rail 23, a reciprocating screw 24, and a slider 25. The layer plate 2 is fixed to the middle of the main body 14 of the LED chip detection device. The first servo motor 21 is installed at one end of the bottom of the main body 14 of the LED chip detection device. The limiting groove 22 is opened in the middle of the layer plate 2. The bending guide rail 23 is fixed to the middle of the layer plate 2. One end of the reciprocating screw 24 is connected to the output end of the first servo motor 21, and the other end of the reciprocating screw 24 is rotatably connected to the side of the main body 14 of the LED chip detection device away from the first servo motor 21. The slider 25 is threadedly connected to the middle of the reciprocating screw 24.

[0044] The offset assembly also includes a drive rod 3, a first connecting shaft 31, two sets of first baffles 32, a detection disc 33, two sets of second baffles 34, a second connecting shaft 35, a driven rod 36, a pulley 37, and a guide groove 38. The bottom end of the drive rod 3 is fixed to the top of the slider 25, and the middle part of the drive rod 3 is slidably connected to the middle of the limiting groove 22. The middle part of the first connecting shaft 31 is rotatably connected to the top end of the drive rod 3. The two first baffles 32 are respectively fixed to the two ends of the first connecting shaft 31. The bottom of the detection disc 33... The two sets of first baffles 32 are fixed to the top of the two sets of second baffles 34. The tops of the two second baffles 34 are fixed to the bottom of the detection disc 33 on the side away from the first baffles 32. The two ends of the second connecting shaft 35 are fixed to the middle of the two sets of second baffles 34 respectively. The top of the driven rod 36 is rotatably connected to the middle of the second connecting shaft 35. The pulley 37 is installed at the bottom of the driven rod 36. The guide groove 38 is opened in the middle of the pulley 37 and fits with the curved guide rail 23. The top of the detection disc 33 is provided with a clamping mechanism.

[0045] During operation, the pre-produced electrical component chips are first transported to the next production equipment via conveyor belt 1. During transport, the chips are moved to the temporary storage box 12 by the calibration component. Then, the robotic arm 13 picks up the chips inside the temporary storage box 12 and places them on the detection disk 33. At this time, the chip is clamped by the clamping mechanism. Then, the drive offset component moves the chip on the detection disk 33 and performs defect detection on the chip surface under the illumination of the detection light source 15.

[0046] When driving the offset component, the first servo motor 21 can be started first, thereby driving the reciprocating screw 24 to rotate. While the reciprocating screw 24 is rotating, it will drive the slider 25 to move synchronously. The movement of the slider 25 will drive the drive rod 3 to move. When the drive rod 3 moves, it will be restricted by the limiting groove 22, thereby changing the movement trajectory of the drive rod 3 and the slider 25, so that the drive rod 3 and the slider 25 slide in a straight line. The movement of the drive rod 3 will drive the first connecting shaft 31, the first baffle 32 and the detection disk 33 to move. During the movement of the detection disk 33, it will move synchronously with the second baffle 34, the second connecting shaft 35, the driven rod 36 and the pulley 37. At this time, when the pulley 37 moves, it will be restricted by the cooperation of the guide groove 38 and the curved guide rail 23, so that the pulley 37 moves at the curved guide rail 23.

[0047] Because the curved guide rail 23 is in a curved state, the pulley 37 will cause the driven rod 36 to tilt at different angles as the curved guide rail 23 moves. When the driven rod 36 tilts, the height of its top end will change, causing the driven rod 36 to rotate in the middle of the second connecting shaft 35. At the same time, it will also cause the detection disk 33 to tilt synchronously. When the detection disk 33 tilts, the side of it closest to the first baffle 32 will move in the opposite direction, thereby causing the first baffle 32 and the first connecting shaft 31 to tilt. During the tilting process, the first connecting shaft 31 will rotate at the top of the drive rod 3, thereby changing the angle of the chip at the detection disk 33 during detection.

[0048] This step, through the setting of the offset component, causes the dedicated chip of the electrical component being tested to shift during the testing process, changing its angle. This transforms static testing into dynamic testing, simulating various postures that the chip may exhibit in practical applications. It allows the testing light to illuminate the chip surface at different incident angles, thereby more accurately capturing subtle defects that are easily overlooked under conventional vertical testing, such as tiny cracks on the chip edge, uneven adhesion of the surface coating, or impurities hidden in structural shadows. This effectively improves the comprehensiveness and accuracy of the testing.

[0049] Further, see Figures 6-7 and Figures 9-19 As shown, the clamping mechanism includes a large-diameter support plate 4, a small-diameter support plate 41, a linkage shaft 42, a linkage gear 43, four sets of driven shafts 44, and four sets of driven gears 45. The bottom of the large-diameter support plate 4 is fixed to the outer side of the detection disc 33, the bottom of the small-diameter support plate 41 is fixed to the middle of the detection disc 33, the middle of the linkage shaft 42 is rotatably connected to the middle of the detection disc 33, the middle of the linkage gear 43 is fixed to the top of the linkage shaft 42, the bottom ends of the four driven shafts 44 are rotatably connected to the top of the detection disc 33, and the middle parts of the four driven gears 45 are respectively fixed to the top of the four sets of driven shafts 44.

[0050] The clamping mechanism also includes a fixed plate 5, multiple suction cups 51, a circular groove 52, a toothed ring 53, and multiple sliding grooves 54. The bottom of the fixed plate 5 is fixed to the top of the large-circle support plate 4 and the small-circle support plate 41. The bottoms of the multiple suction cups 51 are all connected to the top of the fixed plate 5. The circular groove 52 is opened on the inner side of the middle of the large-circle support plate 4. The toothed ring 53 is rotatably connected to the middle of the circular groove 52. The multiple sliding grooves 54 are respectively opened in the middle of the large-circle support plate 4 and the small-circle support plate 41.

[0051] The clamping mechanism also includes four sets of driven rack plates 6, four sets of clamping blocks 61, a sealing box 62, a triangular support plate 63, and an active rack plate 64. The four driven rack plates 6 are slidably connected to the middle of multiple sets of sliding grooves 54, and the four sets of driven rack plates 6 are respectively meshed with four sets of driven gears 45. The four clamping blocks 61 are respectively fixed to the ends of the four sets of driven rack plates 6 that are far apart from each other. The top of the sealing box 62 is fixed to the bottom of the detection disc 33 near the linkage shaft 42. One end of the triangular support plate 63 is fixed to one side of the LED chip detection device body 14. One end of the active rack plate 64 is fixed to the other end of the triangular support plate 63, and the middle of the active rack plate 64 is slidably connected to the middle of the sealing box 62.

[0052] The clamping mechanism also includes a one-way threaded rod 71, a drive gear 7, a hollow sleeve 72, and a rectangular groove 73. The bottom end of the one-way threaded rod 71 is rotatably connected to the bottom of the sealing box 62, and the top end of the one-way threaded rod 71 is fixed to the bottom end of the driven shaft 44. The drive gear 7 is fixed to the bottom end of the driven shaft 44 and meshes with the drive rack plate 64. The hollow sleeve 72 is threaded to the middle of the one-way threaded rod 71, and the rectangular groove 73 is opened on one side of the sealing box 62.

[0053] The clamping mechanism also includes a rectangular slide bar 8, a first strong magnetic ring 81, and a second strong magnetic ring 82. One end of the rectangular slide bar 8 is fixed to the middle of the hollow sleeve 72, and the other end of the rectangular slide bar 8 is slidably connected to the middle of the rectangular groove 73. The two sides of the rectangular slide bar 8 are in contact with the two sides of the rectangular groove 73. The first strong magnetic ring 81 is connected to the top of the hollow sleeve 72, and the second strong magnetic ring 82 is connected to the bottom of the drive gear 7.

[0054] During operation, when the robotic arm 13 grasps the chip inside the temporary storage box 12, it will grab the chip onto the fixed plate 5, and the bottom of the chip will contact the suction cup 51. At this time, the chip can be initially fixed with the help of the suction cup 51. When the offset component moves the detection disc 33, the detection disc 33 will move the large-circle support plate 4, the small-circle support plate 41, the fixed plate 5, the suction cup 51, and the chip held by the suction cup 51 synchronously. At the same time, when the detection disc 33 moves, it will also move the linkage shaft 42, the linkage gear 43, the driven shaft 44, the driven gear 45, and the sealing box 62. During the movement, the driven shaft 44 will drive the drive gear 7 to move synchronously. At this time, because the drive gear 7 and the active rack plate 64 are in a meshing state, the movement of the driven shaft 44 will drive the linkage gear 43 to rotate through the cooperation of the drive gear 7 and the active rack plate 64.

[0055] Meanwhile, since the linkage gear 43 and the gear ring 53 are in a meshing state, the rotation of the linkage gear 43 will drive the gear ring 53 to rotate in the middle of the circular groove 52. The rotation of the gear ring 53 will drive the driven gear 45 and the driven shaft 44 to rotate. During the rotation, the bottom end of the driven shaft 44 rotates in the middle of the detection disk 33. The rotation of the driven gear 45 will push the driven rack plate 6 to slide in the middle of the slide groove 54. The sliding of the driven rack plate 6 will drive the clamping block 61 to move synchronously, so that the four sets of clamping blocks 61 move closer to each other, thereby clamping the chip at the suction cup 51, thus cooperating with the suction cup 51 to reinforce the position of the chip.

[0056] Furthermore, when the driven shaft 44 rotates, it drives the one-way threaded rod 71 and the hollow sleeve 72 to move synchronously. During the rotation of the hollow sleeve 72, it drives the rectangular slide bar 8 to move. At this time, the movement of the rectangular slide bar 8 is restricted by the setting of the rectangular groove 73, which can change the movement trajectory of the rectangular slide bar 8 and the hollow sleeve 72, so that the rectangular slide bar 8 and the hollow sleeve 72 move towards the drive gear 7. At the same time, the movement of the hollow sleeve 72 will drive the first strong magnetic ring 81 to move until the first strong magnetic ring 81 moves to contact the second strong magnetic ring 82. The drive gear 7 will disengage from the active rack plate 64 under the operation of the offset component, thus causing the clamping mechanism to lack a power source, and the clamping block 61 will no longer move. At this time, the mutual attraction of the first strong magnetic ring 81 and the second strong magnetic ring 82 can restrict the drive gear 7, thereby helping the clamping block 61 to maintain a stable position.

[0057] When the offset component moves the detection disk 33 to the end of the LED chip detection device body 14 away from the first servo motor 21, the reciprocating screw 24 will drive the clamping mechanism to reset until the detection disk 33 moves the sealing box 62 and the drive gear 7 to contact the active rack plate 64. The active rack plate 64 will mesh with the drive gear 7 again, and under the action of the counter-thrust, it will drive the drive gear 7 to reverse, thereby causing the driven shaft 44 and the driven gear 45 to reverse, and then drive the four sets of clamping blocks 61 to gradually move away, so that the chip at the suction cup 51 is released from the clamp. The reverse rotation of the driven shaft 44 will also drive the one-way threaded rod 71 to reverse, thereby driving the hollow sleeve 72 to move towards the bottom end of the one-way threaded rod 71, so that the first strong magnetic ring 81 and the second strong magnetic ring 82 are released.

[0058] This step, through the clamping mechanism, can clamp and fix the special chip of the electrical component to be tested, thereby reducing the risk of the chip slipping due to imbalance when the offset component tilts the chip, which would force the testing work to be interrupted, reduce testing efficiency, and also reduce the risk of chip damage due to falling.

[0059] Among them, see Figures 1-4 As shown, the calibration assembly includes multiple sets of rotating shafts 9, two sets of calibration plates 91, a support plate 92, a second servo motor 93, two sets of rectangular support plates 94, and a bidirectional threaded rod 95. The two ends of the multiple rotating shafts 9 are rotatably connected to the sides of the two sets of inclined plates 11 that are close to each other. The two calibration plates 91 are slidably connected to the two ends of the multiple sets of rotating shafts 9. The support plate 92 is fixed to one side of one set of inclined plates 11. The second servo motor 93 is installed in the middle of the support plate 92. The tops of the two rectangular support plates 94 are fixed to the bottoms of the two sets of inclined plates 11. The two ends of the bidirectional threaded rod 95 are rotatably connected to the middle of the two sets of rectangular support plates 94. One end of the bidirectional threaded rod 95 is connected to the output end of the second servo motor 93, and the bottoms of the two sets of calibration plates 91 are threaded to the two ends of the two sets of bidirectional threaded rods 95.

[0060] During operation, when the conveyor belt 1 transports the chip to the inclined plate 11, the chip is moved to the rotating shaft 9. Due to the slope of the inclined plate 11, the chip slides into the temporary storage box 12 at the rotating shaft 9. As the chip slides, it rubs against the rotating shaft 9, which pushes the rotating shaft 9 to rotate at the inclined plate 11. At the same time, it drives the second servo motor 93 to rotate forward, thereby driving the bidirectional threaded rod 95 to rotate at the rectangular support plate 94. The rotation of the bidirectional threaded rod 95 drives the two sets of correction plates 91 to move. The correction plates 91 are restricted by the rotating shaft 9 during movement, thereby changing the movement trajectory of the correction plates 91 and causing the two sets of correction plates 91 to move closer to each other. When the correction plates 91 move closer, they will contact the two sides of the chip at the rotating shaft 9 to correct the chip. Then, the second servo motor 93 can be driven to rotate in reverse, thereby causing the two sets of correction plates 91 to move away. This process is repeated to complete the correction work.

[0061] This step, through the setting of the calibration component, can perform calibration processing on the chip that slides into the temporary storage box 12 before it slides out, thereby reducing the possibility that the chip will be scattered when it slides into the temporary storage box 12 due to the lack of restraint during free fall.

[0062] Among them, see Figure 5 As shown, the buffer assembly includes two sets of spring pillars 10 and a movable plate 101. The bottom of each of the two spring pillars 10 is fixed to the bottom of the temporary storage box 12, and the bottom of the movable plate 101 is fixed to the top of the two sets of spring pillars 10.

[0063] During operation, the movable plate 101 is supported by the spring column 10, so that the movable plate 101 is close to the top of the temporary storage box 12, which facilitates the collection of the falling chips. As the number of chips collected gradually increases, the load on the movable plate 101 will gradually increase, and then the spring column 10 will be compressed under the action of gravity, causing the spring column 10 to retract, thereby moving the movable plate 101 downward.

[0064] This step, through the setting of the buffer component, can reduce the sliding height of the chip when it falls into the temporary storage box 12, thereby mitigating the impact force when the chip falls and reducing the possibility of chip damage due to excessive impact force.

[0065] In summary, this effectively solves the problem that after chip production, LED chip inspection devices are typically used to detect common defects such as scratches, stains, and damage on the chip surface. However, when inspecting chips, because the chips are often fixed in a specific position, the inspection light only enters from a single or a few fixed angles. This limited inspection mode makes it difficult to discover potential problems exposed by the chip due to changes in posture under different application scenarios. Furthermore, for some chips with complex surface structures, static inspection is prone to missing defects in local areas, leading to defective products flowing into subsequent stages, increasing quality risks and production costs.

[0066] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0067] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A production line for dedicated chips in electrical components, comprising a conveyor belt (1), characterized in that: The transmission belt (1) is fixed with an inclined plate (11) on both sides of one end, the inclined plate (11) is fixed with a temporary storage box (12) away from the one end of the transmission belt (1), one side of the temporary storage box (12) is installed with a mechanical arm (13), one side of the mechanical arm (13) is installed with an LED chip detection device main body (14), the top of the LED chip detection device main body (14) is connected with a detection light source (15), the middle of the LED chip detection device main body (14) is provided with an offset component, the middle of the inclined plate (11) is provided with a correction component, and the middle of the temporary storage box (12) is provided with a buffer component. The offset component includes a layer plate (2), a first servo motor (21), a limiting groove (22), a curved guide rail (23), a reciprocating screw (24), a sliding block (25), a driving rod (3), a first connecting shaft (31), two groups of first baffles (32), a detection disc (33), two groups of second baffles (34), a second connecting shaft (35), a driven rod (36), a pulley (37) and a guide groove (38), the layer plate (2) is fixed in the middle of the LED chip detection device main body (14), the first servo motor (21) is installed at one end of the bottom of the LED chip detection device main body (14), the limiting groove (22) is opened in the middle of the layer plate (2), the curved guide rail (23) is fixed in the middle of the layer plate (2), one end of the reciprocating screw (24) is connected to the output end of the first servo motor (21), the other end of the reciprocating screw (24) is rotatably connected to the side of the LED chip detection device main body (14) away from the first servo motor (21), the sliding block (25) is threadedly connected to the middle of the reciprocating screw (24), the driving rod (3) is fixed at the bottom of the sliding block (25), and the middle of the driving rod (3) is slidably connected to the middle of the limiting groove (22), the first connecting shaft (31) is rotatably connected to the top end of the driving rod (3), the two first baffles (32) are fixed at both ends of the first connecting shaft (31), the detection disc (33) is fixed at the top of the two first baffles (32), the two second baffles (34) are fixed at the top of the detection disc (33), the second connecting shaft (35) is fixed at the middle of the two second baffles (34), the driven rod (36) is rotatably connected to the middle of the second connecting shaft (35), the pulley (37) is installed at the bottom of the driven rod (36), the guide groove (38) is opened in the middle of the pulley (37), and the guide groove (38) is combined with the curved guide rail (23), and the detection disc (33) is provided with a clamping mechanism.

2. The production line of a chip for electric and electronic devices according to claim 1, wherein: The clamping mechanism comprises a large-circle-orifice supporting disc (4), a small-circle-orifice supporting disc (41), a linkage shaft (42), a linkage gear (43), four groups of driven shafts (44) and four groups of driven gears (45), the bottom of the large-circle-orifice supporting disc (4) is fixedly connected to the outer side of the detection disc (33), the bottom of the small-circle-orifice supporting disc (41) is fixedly connected to the middle part of the detection disc (33), the middle part of the linkage shaft (42) is rotatably connected to the middle part of the detection disc (33), the middle part of the linkage gear (43) is fixedly connected to the top of the linkage shaft (42), the bottom ends of the four driven shafts (44) are rotatably connected to the top of the detection disc (33), and the middle parts of the four driven gears (45) are fixedly connected to the top ends of the four groups of driven shafts (44).

3. The production line for chips dedicated to electric and electronic devices according to claim 2, characterized in that: The clamping mechanism further comprises a fixed disc (5), a plurality of suction discs (51), a circular groove (52), a gear ring (53) and a plurality of sliding grooves (54), the bottom of the fixed disc (5) is fixedly connected to the top of the large-circle-orifice supporting disc (4) and the small-circle-orifice supporting disc (41), the bottoms of the plurality of suction discs (51) are connected to the top of the fixed disc (5), the circular groove (52) is formed in the inner side of the middle part of the large-circle-orifice supporting disc (4), the gear ring (53) is rotatably connected to the middle part of the circular groove (52), and the plurality of sliding grooves (54) are respectively formed in the middle parts of the large-circle-orifice supporting disc (4) and the small-circle-orifice supporting disc (41).

4. The production line for chips dedicated to electric and electronic devices according to claim 3, characterized in that: The clamping mechanism further comprises four groups of driven rack plates (6), four groups of clamping blocks (61), a sealing box (62), a triangular supporting plate (63) and a driving rack plate (64), the four driven rack plates (6) are respectively slidably connected to the middle parts of the plurality of sliding grooves (54), and the four groups of driven rack plates (6) are respectively engaged with the four groups of driven gears (45), the four clamping blocks (61) are respectively fixedly connected to the ends of the four groups of driven rack plates (6) away from each other, the top of the sealing box (62) is fixedly connected to the bottom of the detection disc (33) near one side of the linkage shaft (42), one end of the triangular supporting plate (63) is fixedly connected to one side of the LED chip detection device main body (14), one end of the driving rack plate (64) is fixedly connected to the other end of the triangular supporting plate (63), and the middle part of the driving rack plate (64) is slidably connected to the middle part of the sealing box (62).

5. The production line for chips dedicated to electric and electronic devices according to claim 4, characterized in that: The clamping mechanism further comprises a one-way threaded rod (71), a driving gear (7), a hollow sleeve (72) and a rectangular groove (73), the bottom end of the one-way threaded rod (71) is rotatably connected to the bottom of the sealing box (62), the top end of the one-way threaded rod (71) is fixedly connected to the bottom end of the driven shaft (44), the driving gear (7) is fixedly connected to the bottom end of the driven shaft (44) and engaged with the driving rack plate (64), the hollow sleeve (72) is threadedly connected to the middle part of the one-way threaded rod (71), and the rectangular groove (73) is formed in one side of the sealing box (62).

6. The production line of a chip for electric and electronic devices according to claim 5, wherein: The clamping mechanism further comprises a rectangular slide rod (8), a first strong magnetic ring (81) and a second strong magnetic ring (82), one end of the rectangular slide rod (8) is fixedly connected to the middle part of the hollow sleeve (72), the other end of the rectangular slide rod (8) is slidingly connected to the middle part of the rectangular groove (73), and the two sides of the rectangular slide rod (8) are attached to the two sides of the rectangular groove (73), the first strong magnetic ring (81) is connected to the top of the hollow sleeve (72), and the second strong magnetic ring (82) is connected to the bottom of the driving gear (7).

7. The production line of a chip for electric and electronic devices according to claim 1, wherein: The correction assembly comprises a plurality of rotating shafts (9), two correction plates (91), a supporting plate (92), a second servo motor (93), two rectangular support plates (94) and a bidirectional threaded rod (95), two ends of each rotating shaft (9) are rotatably connected to one side of two sets of inclined plates (11) that are close to each other, two correction plates (91) are slidingly connected to two ends of the plurality of rotating shafts (9), respectively, the supporting plate (92) is fixedly connected to one side of one set of inclined plates (11), the second servo motor (93) is installed in the middle part of the supporting plate (92), the top of each rectangular support plate (94) is fixedly connected to the bottom of each set of inclined plates (11), respectively, two ends of the bidirectional threaded rod (95) are rotatably connected to the middle part of each rectangular support plate (94), one end of the bidirectional threaded rod (95) is connected to the output end of the second servo motor (93), and the bottom of each correction plate (91) is threadedly connected to the two ends of each bidirectional threaded rod (95).

8. The production line of a chip for electric and electronic devices according to claim 1, wherein: The buffer assembly comprises two spring columns (10) and a movable plate (101), the bottom of each spring column (10) is fixedly connected to the bottom of the temporary storage box (12), and the bottom of the movable plate (101) is fixedly connected to the top of the two spring columns (10).

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