Enhanced security system in substrate processing using compressed dry air

Abstract

A security system in substrate processing includes a substrate processing apparatus configured to process a substrate, the apparatus including a chamber and a showerhead; an input line configured to receive process cooling water (PCW) from an external PCW source for cooling the substrate processing apparatus; an inlet valve disposed at an inlet of the input line to control input of the PCW; a discharge line configured to collect the PCW for cooling from the substrate processing apparatus and discharge the collected PCW; a plurality of channels configured to be connected between the input line and the discharge line, and the PCW flows inside the channels; and a safety unit configured to inject compressed drying air (CDA) into the input line and / or purge the CDA and PCW from the plurality of channels and discharge lines.

Description

Technical Field

[0001] This disclosure generally relates to substrate processing systems, and more specifically to substrate processing systems that use process cooling water (PCW) for thermal management, the substrate processing system having a safety unit that uses compressed dry air (CDA). Background Technology

[0002] Process cooling water (PCW) is used in some PEALD deposition chambers for thermal conditioning / management of various components. Components include, for example, the chamber body, base heater, RPU, and spray nozzles. The operating temperature range is between 150°C and 650°C.

[0003] PCW plays a crucial role in effectively cooling these high-temperature components and dissipating excess heat during operation. PCW cooling operation begins by injecting PCW from a PCW source (or PCW cartridge) into the system by opening an electronically controlled inlet valve. When a chamber alarm event occurs, this inlet valve is triggered to close, cutting off the PCW flow into the chamber components and preventing any potential hazards.

[0004] However, a significant hazard arises when the inlet valve is triggered and closed due to an alarm. In such an event, a significant volume of PCW (water) can be trapped inside the high-temperature temperature components (within the channels allocated to the components). Each component, characterized by a large thermal mass, exhibits an extended cooling duration as it transitions from its elevated operating temperature to ambient room temperature.

[0005] The problem with this thermal gradient is that residual PCW trapped in these components may boil (or evaporate). If the trapped PCW boils, the pressure inside the channel may increase, posing a potential safety hazard. Conventionally, when the channel pressure increases due to PCW evaporation and / or boiling, a person (usually the operator) should loosen the PCW channel fitting to release the pressure and tighten it again before initiating PCW recirculation back into the chamber components.

[0006] The above process is prone to errors, therefore this disclosure provides a system and method with automated safety features for substrate processing systems using CDA. Summary of the Invention

[0007] This summary is provided to present the chosen concepts in a simplified form. These concepts are further described in detail in the following description of exemplary embodiments of this disclosure. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to limit the scope of the claimed subject matter.

[0008] According to one embodiment, an enhanced safety system for using process cooling water (PCW) in substrate processing can be provided, the system comprising: a substrate processing apparatus configured to process a substrate, the apparatus including a chamber and a spray head; an inlet line configured to receive PCW from an external PCW source to cool the chamber and spray head in the substrate processing apparatus; an inlet valve disposed at the inlet of the inlet line to control the input of PCW into the inlet line; an outlet line configured to collect PCW from the substrate processing apparatus for cooling the chamber and spray head and to discharge the collected PCW; a plurality of channels connected between the inlet line and the outlet line, wherein PCW flows within the channels, each of the plurality of channels being adjacent to the chamber and the spray head respectively; and a safety unit configured to inject compressed dry air (CDA) into the inlet line and / or remove CDA and PCW from the plurality of channels and the outlet line.

[0009] In an extended embodiment, the safety unit may further include an air tank configured to contain CDA; an air inlet valve configured to control the injection of CDA into an input line; an air outlet valve configured to control the discharge of CDA from an outlet line; and a controller configured to control the opening / closing of the air inlet valve and the air outlet valve.

[0010] On the other hand, the controller is also configured to monitor the status of the system.

[0011] On the other hand, the controller is also configured to open the air inlet valve and the air outlet valve when a system alarm is triggered.

[0012] On the one hand, the time difference between the opening of the air inlet valve and the air outlet valve is equal to or less than 10ms.

[0013] According to another embodiment, a safety protection method for use in a substrate processing system can be provided, wherein the system includes an input line for injecting process cooling water (PCW) for cooling the system and an outlet line for discharging PCW from the system, the method comprising: monitoring the status of the system; determining whether the system status is in an alarm state; if the monitored status is in an alarm state, opening an air inlet valve to inject compressed dry air (CDA) into the input line; and if the monitored status is in an alarm state, opening an air outlet valve to purge CDA and PCW from the system.

[0014] In an extended embodiment, it may be specified that if the monitored state is an alarm, a message is sent to the operator of the alarm and / or valve opening. Attached Figure Description

[0015] It should be understood that the elements in the accompanying drawings are shown for simplicity and clarity and are not necessarily drawn to scale. For example, the dimensions of some elements in the drawings may be exaggerated relative to other elements to help improve the understanding of the embodiments illustrated in this disclosure.

[0016] Figure 1 An overview of a substrate processing system with extended security according to embodiments of the present disclosure is shown.

[0017] Figure 2 A flowchart of a method for extended security in a substrate processing system according to another embodiment of the present disclosure is shown. Detailed Implementation

[0018] Although certain embodiments and examples are disclosed below, those skilled in the art will understand that the invention extends beyond the specific disclosed embodiments and / or uses of the invention and their obvious modifications and equivalents. Therefore, it is intended that the scope of the disclosed invention should not be limited to the specific disclosed embodiments described below.

[0019] As used herein, the term "substrate" can refer to any one or more underlying materials, including any one or more underlying materials that can be modified or on which devices, circuits, or films can be formed. A "substrate" can be continuous or discontinuous; rigid or flexible; solid or porous; and combinations thereof. A substrate can be in any form, such as powder, plate, or workpiece. Plate-type substrates can include wafers of various shapes and sizes. Substrates can be made of semiconductor materials, including, for example, silicon, silicon germanium, silicon oxide, gallium arsenide, gallium nitride, and silicon carbide.

[0020] As an example, the powdered substrate may have applications for pharmaceutical manufacturing. The porous substrate may contain polymers. Examples of workpieces may include medical devices (e.g., stents and syringes), jewelry, tooling devices, components for battery manufacturing (e.g., anodes, cathodes, or separators), or components for photovoltaic cells, etc.

[0021] A continuous substrate can extend beyond the boundaries of the processing chamber, where a deposition process takes place. In some processes, the continuous substrate can move through the processing chamber, allowing the process to continue until the end of the substrate is reached. A continuous substrate can be supplied from a continuous substrate feed system to allow for the fabrication and output of the continuous substrate in any suitable form.

[0022] Non-limiting examples of continuous substrates may include sheets, nonwoven films, rollers, foils, meshes, flexible materials, bundles of continuous filaments or fibers (e.g., ceramic or polymer fibers). Continuous substrates may also include carriers or sheets on which discontinuous substrates are mounted.

[0023] The illustrations presented herein are not intended to be actual views of any particular material, structure, or device, but are merely idealized representations used to describe embodiments of this disclosure.

[0024] The specific embodiments shown and described are illustrative of the invention and its best mode, and are not intended to further limit the scope of aspects and embodiments in any way. In fact, for the sake of brevity, conventional manufacturing, connection, preparation, and other functional aspects of the system may not be described in detail. Furthermore, the connecting lines shown in the figures are intended to represent exemplary functional relationships and / or physical connections between various elements. Many alternative or additional functional relationships or physical connections may exist in the actual system, and / or may not exist in some embodiments.

[0025] It should be understood that the configurations and / or methods described herein are exemplary in nature, and these specific embodiments or examples should not be considered limiting, as many variations are possible. The particular routines or methods described herein may represent one or more of any number of processing strategies. Therefore, the various actions shown may be performed in the order shown, in a different order, or in some cases omitted.

[0026] The subject matter of this disclosure includes all novel and non-obvious combinations and sub-combinations of the various processes, systems and configurations disclosed herein, as well as any and all equivalents thereof.

[0027] Figure 1 An overview of a substrate processing system with extended security according to embodiments of the present disclosure is shown.

[0028] An enhanced safety system in substrate processing according to embodiments of the present disclosure may include a substrate processing apparatus 100, which may include a reaction chamber 101, a spray head 102, and a remote plasma unit (RPU) 103. Components 101, 102, and 103 may be examples, and may also include other components.

[0029] An inlet line 120 and an outlet line 121 can be provided for thermal control of components 101, 102, and 103 in device 100. Each component can have its own channels A, B, and C for cooling. Each channel A, B, and C can be connected between the inlet line 120 and the outlet line 121, allowing PCW to flow through each channel A, B, and C respectively.

[0030] PCW can come from an external PCW source 110, and PCW can flow into the input line 120 through the input flow path M. PCW can flow into each channel A, B, C to cool components 101, 102, 103, and finally flow into the discharge line 121 and the output flow path N for circulation.

[0031] During normal operation, PCW can flow from PCW source 110 and eventually return to PCW source 110, where it can be recirculated. Some leakage may occur, and this leakage may accumulate in leakage tray 135 via leakage path Z. Inlet valve 122 controls the inflow of PCW into inlet line 120. Inlet line 120 may be electronically controlled, allowing it to automatically shut off at any time in the event of a system malfunction.

[0032] Safety unit 130 may include controller 132, air tank 131, air inlet valve 133, and air outlet valve 134. Safety unit 130 may also include air inlet path X and air outlet path Y. Air inlet path X may connect air tank 131 and input line 120, allowing compressed dry air (CDA) from air tank 131 to flow into input line 120. Air outlet path Y may connect exhaust line 121 and leak tray 135, allowing CDA and residual PCW to be purged from input line 120, from channels A, B, and C, and from exhaust line 121 into leak tray 135.

[0033] The controller 132 can be configured to monitor the operating status of the device 100. The controller 132 can also be configured to control the opening / closing of the air inlet valve 133 and the air outlet valve 134.

[0034] When the equipment 100 is operating normally, valves 133 and 134 can be closed. When the equipment 100 is operating abnormally (alarm triggered), inlet valve 122 can be automatically closed and PCW flow can be stopped. This means that hot PCW (water) may still remain in inlet line 120, outlet line 121, and in each channel A, B, and C.

[0035] Controller 132 can detect a situation where the pressure in the cooling path of the system rises too much due to PCW boiling or evaporation. Controller 132 can then control the opening of air inlet valve 133, allowing CDA from air tank 131 to be injected into inlet line 120. Controller 132 can control the closing of air outlet valve 134, allowing residual PCW in inlet line 120, outlet line 121, and channels A, B, and C to be cleared using CDA and residual PCW from air inlet valve 133. The opening sequence of air inlet valve 133 and air outlet valve 134 can be simultaneous. Alternatively, the opening sequence of air inlet valve 133 and air outlet valve 134 can be interchanged, as long as the time difference between the two openings is less than a certain amount of time. For safety reasons, the certain amount of time difference between the two openings can be equal to or less than 10 ms.

[0036] During cleanup, the pressure within the device may drop below a safe threshold. This safe threshold can vary depending on application settings and the environment being processed.

[0037] Figure 2 A flowchart of a method for an extended security system according to an embodiment is shown.

[0038] In step 210 of the method, controller 132 may monitor the operating status of the substrate processing apparatus (or the entire system, whichever is most suitable for the purpose). In this step 210 of the method, controller 132 may also control the air inlet valve 133 and air outlet valve 134 to close tightly.

[0039] In step 220 of the method, controller 132 can determine the monitoring results of system 100.

[0040] If system 100 is in a normal state, controller 132 can maintain monitoring of the operation of system 100. Conversely, if controller 132 determines that an alarm has been triggered, controller 132 can control the air inlet valve 133 and air outlet valve 134 to open.

[0041] In steps 230 and 240, controller 132 may open the air inlet / outlet valve.

[0042] Air inlet valve 133 and air outlet valve 134 can open simultaneously. Alternatively, the opening order of the two valves is interchangeable. This means that air inlet valve 133 can open first, and then air outlet valve 134 can open later, or vice versa. The order is irrelevant as long as the time difference between the two openings is equal to or less than 10 ms. The time difference threshold, 10 ms, can be varied in different systems to suit system requirements and safety options. Generally, the shorter the threshold, the better the system safety.

[0043] In step 250 of the method, controller 132 may notify the operator or user of an alarm in system 100. Step 250 may also be executed immediately after step 220 when controller 132 determines that the operating state of system 100 may be an alarm state.

[0044] The above-described arrangement of the system and method is merely an illustration of the application of the principles of the invention, and many other embodiments and modifications may be made without departing from the spirit and scope of the invention as defined in the claims. Therefore, the scope of the invention should not be determined by reference to the above description, but rather by the full scope of the appended claims and their equivalents.

Claims

1. An enhanced safety system for using process cooling water (PCW) in substrate processing, the system comprising: a substrate processing apparatus configured to process a substrate, the apparatus comprising a chamber and a showerhead; an input line configured to receive process cooling water (PCW) from an external PCW source to cool the chamber and the showerhead in the substrate processing apparatus; an inlet valve provided at an inlet of the input line to control input of PCW into the input line; a drain line configured to collect PCW for cooling the chamber and the showerhead from the substrate processing apparatus, the drain line further configured to drain the collected PCW; a plurality of channels connecting the input line and the drain line, wherein PCW flows inside the channels, and wherein each of the plurality of channels is proximate to the chamber and the showerhead, respectively; and a safety unit configured to inject compressed dry air (CDA) into the input line and / or configured to purge CDA and PCW from the plurality of channels and the drain line.

2. The system of claim 1, the safety unit further comprising: an air tank containing the CDA; an air inlet valve controlling injection of CDA into the input line; an air outlet valve controlling drainage of CDA from the drain line; and a controller configured to control opening / closing of the air inlet valve and the air outlet valve. The controller is further configured to monitor a status of the system. The controller is further configured to open the air inlet valve and the air outlet valve when a system alarm is triggered.

3. The system of claim 2, wherein, A time difference between opening of the air inlet valve and the air outlet valve is equal to or less than 10 ms.

4. The system of claim 3, wherein, The system comprising an input line for injecting process cooling water (PCW) for cooling the system and a drain line for draining PCW from the system, the method comprising:

5. The system of claim 4, wherein, monitoring a status of the system; 6. A safety protection method for use in a substrate processing system, wherein, determining whether the system status is in alarm; if the monitored status is in alarm, opening an air inlet valve to inject compressed dry air (CDA) into the input line; and if the monitored status is in alarm, opening an air outlet valve to purge CDA and PCW from the system.

7. The method of claim 6, further comprising: if the monitored status is in alarm, sending a message to an operator of the alarm and / or valve opening.

8. A safety system for a substrate processing apparatus using process cooling water (PCW), the apparatus comprising a chamber and a showerhead, an input line configured to receive process cooling water (PCW), a drain line configured to collect PCW and drain the collected PCW, and a plurality of channels connecting the input line and the drain line, wherein PCW flows inside the channels, the system comprising: an air tank containing compressed dry air (CDA); an air inlet path connecting the air tank to the input line; an air inlet valve provided on the air inlet path and controlling injection of CDA into the input line; an air outlet path connecting the drain line to an external leak tray; an air outlet valve provided on the air outlet path and controlling drainage of CDA from the drain line; and a controller configured to control opening / closing of the air inlet valve and the air outlet valve. ​ ​ ​

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