Energy-saving circulating cooling liquid system applied to semiconductor equipment and control method

Abstract

The invention discloses an energy-saving circulating cooling liquid system applied to semiconductor equipment and a control method, and belongs to the technical field of semiconductor cooling. In the energy-saving circulating cooling liquid system, first passages of a first temperature controller and a second temperature controller are both connected with cooling water, and second passages of the first temperature controller and the second temperature controller are communicated with cooling liquid; a second outlet of the first temperature controller is connected with a heating area, and an outlet of the heating area is divided into two paths through a first three-way valve, the b port returns to the first temperature controller, and the c port enters the second temperature controller; an outlet of the second temperature controller is connected with a cooling area, an outlet of the cooling area is divided into two paths through a second three-way valve, an opening b returns to the second temperature controller, an opening c enters the first temperature controller, and closed-loop temperature control is achieved. Through the first three-way valve and the second three-way valve, cooling liquid needed by the heating area is preheated through waste heat of the cooling area by switching a cooling liquid channel, the heating power of the first temperature controller is reduced, energy is saved, meanwhile, the low-temperature cooling liquid flowing out of the heating area is introduced into the second temperature controller, cooling water is saved, and the cooling efficiency is improved. And the temperature is ensured to reach the standard and energy is saved.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor cooling technology, and particularly relates to an energy-saving circulating coolant system and control method for semiconductor equipment. Background Technology

[0002] With the rapid development of semiconductor technology, higher demands are being placed on semiconductor equipment, especially thin film deposition and etching equipment. The process chamber, a crucial component of semiconductor equipment, is typically maintained under vacuum. A dielectric window mounted above the process chamber isolates it from the external atmosphere via a sealing ring. Dry pumps and molecular pumps, either individually or in combination, provide the power required for the vacuum. The entire process of thin film deposition and etching occurs within the process chamber. An RF component above the dielectric window generates an alternating magnetic field, ionizing the process gas entering the process chamber through the nozzle into high-density plasma. An electrostatic chuck installed inside the process chamber generates a bias voltage to guide the plasma to contact the silicon wafer surface, thereby achieving thin film deposition or etching. The plasma contact with the silicon wafer generates a significant amount of heat, and this high heat load can easily cause thermal stress on the wafer; therefore, this heat must be removed promptly. To ensure more uniform deposition or etching, the process must be maintained in a relatively stable temperature environment, requiring precise temperature control of the process chamber and dielectric window.

[0003] Helium gas is typically introduced between the silicon wafer and the electrostatic chuck. Heat from the silicon wafer is transferred to the electrostatic chuck via the helium. The electrostatic chuck has internal flow channels where coolant flows, carrying away heat and causing the wafer to be heated. The process chamber is generally made of aluminum alloy, which has a high thermal conductivity (160 W / (m·K)-210 W / (m·K)) and is usually maintained at 70℃-80℃, controlled by a combination of heating elements and circulating cooling water. Temperature control is adjusted by changing the power of the heating elements and the flow rate of the cooling water. The dielectric window is typically made of ceramic or quartz, which has a low thermal conductivity (10 W / (m·K)-30 W / (m·K)) and is usually maintained above 100℃, controlled by circulating high-temperature air (CDA). The supplied room-temperature CDA is heated to a high temperature by heating wires. The high-temperature CDA continuously blows through the dielectric window to reach the set temperature. Temperature control is adjusted by changing the amount of room-temperature CDA mixed in and the power of the heating wires.

[0004] Temperature control in the process chamber is achieved by adjusting the power of the heating rod and the flow rate of the cooling water. A gap inevitably exists between the heating rod and the heating holes in the process chamber. An excessively large gap leads to low heat transfer efficiency, affecting the overall heating effect; a gap that is too small makes the heating rod difficult to disassemble and maintain. Temperature control in the medium window is achieved by adjusting the amount of room-temperature CDA mixed in and the power of the heating wire. The amount of room-temperature CDA mixed in is determined by the orifice size. A larger orifice results in a larger amount of room-temperature CDA mixed in, reducing heating efficiency and increasing noise; a smaller orifice results in a smaller amount of room-temperature CDA mixed in, causing the medium window temperature to rise continuously and become unsustainable. Summary of the Invention

[0005] Based on the technical problems existing in the prior art, the present invention provides an energy-saving circulating coolant system and control method for semiconductor equipment.

[0006] To achieve the above objectives, according to a first aspect of the present invention, an energy-saving circulating coolant system for semiconductor equipment is provided, comprising a first thermostat, a second thermostat, a first three-way valve, and a second three-way valve. The first passage of the first thermostat and the first passage of the second thermostat are both connected to cooling water. Coolant is present in the second passages of the first thermostat and the second passage of the second thermostat. The second outlet of the first thermostat is connected to the inlet of a heating zone. The outlet of the heating zone is connected to port a of the first three-way valve. Port b of the first three-way valve is connected to the second inlet of the first thermostat. Port c of the first three-way valve is connected to the second inlet of the second thermostat. The second outlet of the second thermostat is connected to the inlet of a cooling zone. The outlet of the cooling zone is connected to port a of the second three-way valve. Port b of the second three-way valve is connected to the second inlet of the second thermostat. Port c of the second three-way valve is connected to the second inlet of the first thermostat.

[0007] A further improvement of the present invention is that the energy-saving circulating coolant system applied to semiconductor equipment further includes a central control module, which is used to obtain the first liquid temperature at the outlet of the heating zone and the second liquid temperature at the outlet of the cooling zone, and generate control commands based on the first liquid temperature, the second liquid temperature and the preset temperature, and the control commands are used to control the first three-way valve and the second three-way valve.

[0008] A further improvement of the present invention is that: the heating zone includes an electrostatic chuck and a process chamber, the inlet of the electrostatic chuck is connected to the second outlet of the first temperature controller, the outlet of the electrostatic chuck is connected to the inlet of the process chamber, and the outlet of the process chamber is connected to port a of the first three-way valve.

[0009] A further improvement of the present invention is that the cooling zone is a radio frequency component, which includes a cooling plate, a heating plate and a coil arranged sequentially from top to bottom.

[0010] A further improvement of the present invention is that quick connectors are provided at the inlet of the heating zone, the outlet of the heating zone, the inlet of the cooling zone, and the outlet of the cooling zone.

[0011] A further improvement of the present invention is that: the first thermostat and the second thermostat have the same structure, including a first pipe and a second pipe, the first pipe is filled with cooling water, the second pipe contains coolant, a heat exchanger is provided at the adjacent position of the first pipe and the second pipe, heating wires are provided on both sides of the second pipe, and a water pump is provided on the second pipe.

[0012] A further improvement of the present invention is that a first flow meter is provided at the outlet of the heating zone, and a second flow meter is provided at the outlet of the cooling zone.

[0013] A further improvement of the present invention is that the coolant is any one or any combination of ultrapure water, ethylene glycol solution or fluorinated liquid.

[0014] According to a second aspect of the present invention, a control method for an energy-saving circulating coolant system applied to semiconductor equipment is provided, based on an energy-saving circulating coolant system for semiconductor equipment according to the first aspect, comprising the following steps: Obtain the first liquid temperature at the outlet of the heating zone and the second liquid temperature at the outlet of the cooling zone; The opening and closing of the first three-way valve and the second three-way valve are controlled according to the first liquid temperature, the second liquid temperature and the preset temperature. When the first liquid temperature, the second liquid temperature, and the preset temperature meet the first operating conditions, the a port of the first three-way valve, the b port of the first three-way valve, the a port of the second three-way valve, and the b port of the second three-way valve are opened, and the c port of the first three-way valve and the c port of the second three-way valve are closed. When the first liquid temperature, the second liquid temperature, and the preset temperature meet the second operating conditions, the a port of the first three-way valve, the c port of the first three-way valve, the a port of the second three-way valve, and the c port of the second three-way valve are opened, and the b port of the first three-way valve and the b port of the second three-way valve are closed.

[0015] A further improvement of the present invention is that: the first operating condition is that the sum of the first liquid temperature and the preset temperature is greater than or equal to the second liquid temperature, and the second operating condition is that the sum of the first liquid temperature and the preset temperature is less than the second liquid temperature.

[0016] Compared with the prior art, the energy-saving circulating coolant system and control method of the present invention applied to semiconductor equipment has the following beneficial technical effects: 1. This invention switches the coolant passage under different conditions through the first three-way valve and the second three-way valve. It utilizes the residual heat of the cooling zone to preheat the coolant required by the heating zone, thereby reducing the heating power of the first thermostat and achieving energy saving. At the same time, the low-temperature coolant flowing out of the heating zone is fed into the second thermostat, saving the use of cooling water. This ensures that the temperature meets the standard while saving energy.

[0017] 2. The present invention introduces the coolant from the first temperature controller 1 into the electrostatic chuck, and uses the heat dissipated by the electrostatic chuck to heat the coolant, thereby reducing the heat required to maintain the temperature of the process chamber and improving temperature stability.

[0018] 3. This invention maintains the temperature of the electrostatic chuck and process chamber by using coolant, which reduces energy loss. It also improves temperature control efficiency and safety by using coolant and heating plate to maintain temperature.

[0019] 4. This invention enables quick plugging and unplugging by setting up quick connectors, which facilitates inspection and maintenance.

[0020] 5. The first liquid temperature and the second liquid temperature are obtained through the first flow meter and the second flow meter, thereby improving the accuracy of data acquisition. Attached Figure Description

[0021] The accompanying drawings are provided to better understand the invention and are not intended to unduly limit the invention, wherein: Figure 1 This is a schematic diagram of the structure of an energy-saving circulating coolant system for semiconductor equipment according to the present invention; Figure 2 This is a schematic diagram of the heating zone and cooling zone in an energy-saving circulating coolant system for semiconductor equipment according to the present invention; Figure 3 This is a schematic diagram of the structure of an RF component in an energy-saving circulating coolant system for semiconductor equipment according to the present invention; Figure 4 This is a schematic diagram of the structure of the first and second temperature controllers in an energy-saving circulating coolant system for semiconductor equipment according to the present invention.

[0022] The reference numerals in the attached figures are as follows: 1. First temperature controller; 2. First three-way valve; 3. First flow meter; 4. Quick connector; 5. Electrostatic chuck; 6. Process chamber; 7. Medium window; 8. Radio frequency assembly; 81. Cooling plate; 82. Heating plate; 83. Coil; 9. Nozzle; 10. Second flow meter; 11. Second three-way valve; 12. Second temperature controller; 13. Water pump; 14. Heating wire; 15. Heat exchanger. Detailed Implementation

[0023] The following description, in conjunction with the accompanying drawings, illustrates exemplary embodiments of the present invention, including various details to aid understanding. These details should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the invention. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description.

[0024] The following embodiments further illustrate the energy-saving circulating coolant system and control method of the present invention applied to semiconductor equipment.

[0025] Example 1 like Figure 1 As shown, an energy-saving circulating coolant system for semiconductor equipment includes a first temperature controller 1, a second temperature controller 12, a first three-way valve 2, a second three-way valve 11, and a central control module. Cooling water enters through the first inlet of the first temperature controller 1 and exits through its first outlet. Cooling water enters through the first inlet of the second temperature controller 12 and exits through its first outlet. The second outlet of the first temperature controller 1 is connected to the inlet of the heating zone. The outlet of the heating zone is connected to port a of the first three-way valve 2. Port b of the first three-way valve 2 is connected to the second inlet of the first temperature controller 1. Port c of the first three-way valve 2 is connected to the second inlet of the second temperature controller 12. The second outlet of valve 12 is connected to the inlet of the cooling zone. The outlet of the cooling zone is connected to port a of the second three-way valve 11. Port b of the second three-way valve is connected to the second inlet of the second thermostat 12. Port c of the second three-way valve is connected to the second inlet of the first thermostat 1. Coolant flows between the second inlet and the second outlet of the first thermostat 1, and coolant also flows between the second inlet and the second outlet of the second thermostat 12. The central control module is used to acquire the first liquid temperature T3 at the outlet of the heating zone and the second liquid temperature T10 at the outlet of the cooling zone, and to generate control commands based on the first liquid temperature, the second liquid temperature, and a preset temperature. The control commands are used to control the first three-way valve 2 and the second three-way valve 11. The inlet liquid temperature of the heating zone is higher than the outlet liquid temperature, and the inlet liquid temperature of the cooling zone is lower than the outlet liquid temperature.

[0026] Specifically, both the first thermostat 1 and the second thermostat 12 include two passages, wherein the first passage is connected to the cooling water, the second passage of the first thermostat 1 includes the second inlet of the first thermostat 1 and the second outlet of the first thermostat 1, and the second passage of the second thermostat 12 includes the second inlet of the second thermostat 12 and the second outlet of the second thermostat 12.

[0027] Specifically, taking semiconductor process chambers as an example, such as Figure 1-2 As shown, the heating zone is an electrostatic chuck 5 and a process chamber 6, and the cooling zone is an RF component 8. The process chamber 6 is equipped with an electrostatic chuck 5, and a dielectric window 7 is provided above the process chamber 6. The RF component 8 is provided on the dielectric window, and a nozzle 9 is provided inside the dielectric window 7. The nozzle 9 is used to send the alternating magnetic field generated by the RF component 8 into the process chamber 6, so that the process gas in the process chamber 6 is ionized into high-density plasma. Cooling water is introduced into the first inlet of the first temperature controller 1 and discharged from the first outlet of the first temperature controller 1. Cooling water is introduced into the first inlet of the second temperature controller 12 and discharged from the first outlet of the second temperature controller 12. The second outlet of the first temperature controller 1 is connected to the inlet of the electrostatic chuck 5. The outlet of the electrostatic chuck 5 is connected to the inlet of the process chamber 6. The outlet of the process chamber 6 is connected to port a of the first three-way valve 2. Port b of the first three-way valve 2 is connected to the second inlet of the first temperature controller 1. Port c of the first three-way valve 2 is connected to the second inlet of the second temperature controller 12. The second outlet of the second temperature controller 12 is connected to the inlet of the radio frequency component 8. The outlet of the radio frequency component is connected to port a of the second three-way valve 11, port b of the second three-way valve is connected to the second inlet of the second temperature controller 12, and port c of the second three-way valve is connected to the second inlet of the first temperature controller 1. Coolant flows between the second inlet and the second outlet of the first temperature controller 1, and coolant also flows between the second inlet and the second outlet of the second temperature controller 12. The central control module is used to acquire the first liquid temperature at the outlet of the process chamber 6 and the second liquid temperature at the outlet of the radio frequency component 8, and to generate control commands based on the first liquid temperature, the second liquid temperature, and a preset temperature. The control commands are used to control the first three-way valve 2 and the second three-way valve 11. The coolant in the first temperature controller 1 is first heated by the electrostatic chuck 5, and then loses heat before entering the process chamber 6 to maintain the process chamber 6 at a first temperature, preferably 70℃-80℃. The coolant in the first temperature controller 1 flows through the radio frequency component 8, causing the radio frequency component 8 to cool down and the coolant temperature to rise.

[0028] Specifically, such as Figure 3 As shown, the radio frequency component 8 includes a cooling plate 81, a heating plate 82, and a coil 83 arranged sequentially from top to bottom.

[0029] Specifically, the internal structures of the first thermostat 1 and the second thermostat 12 are the same, such as... Figure 4As shown, it includes a first pipeline and a second pipeline. The first pipeline is filled with cooling water, and the second pipeline contains coolant. A heat exchanger 15 is provided at the adjacent position of the first pipeline and the second pipeline. Heating wires 14 are provided on both sides of the second pipeline. A water pump 13 is provided on the second pipeline. The water pump 13 is used to provide power to the coolant and promote circulation. The cooling water is used to remove excess heat from the coolant. The heating wires 14 are used to heat the coolant to a preset coolant temperature.

[0030] Specifically, a first flow meter 3 is provided between the outlet of the heating zone and port a of the first three-way valve 2, and a second flow meter 10 is provided between the outlet of the cooling zone and port a of the second three-way valve 11. The first flow meter is used to obtain the temperature of the coolant flowing out of the heating zone, i.e., the first liquid temperature T3; the second flow meter is used to obtain the temperature of the coolant flowing out of the cooling zone, i.e., the second liquid temperature T10.

[0031] Specifically, a first flow meter 3 is provided between the outlet of the process chamber 6 and port a of the first three-way valve 2, and a second flow meter 10 is provided between the outlet of the radio frequency component 8 and port a of the second three-way valve 11.

[0032] Specifically, quick connectors 4 are provided at the inlet of the heating zone, the outlet of the heating zone, the inlet of the cooling zone, and the outlet of the cooling zone. The quick connectors 4 are preferably self-locking quick connectors, which are used for direct plugging and unplugging for easy maintenance.

[0033] Specifically, quick connectors 4 are provided at the inlet and outlet of the electrostatic chuck 5, the inlet and outlet of the process chamber 6, the inlet and outlet of the radio frequency component 8.

[0034] Specifically, under normal conditions, in the first operating mode, ports a and b of the first three-way valve 2 are open, and port c is closed. Ports a and b of the second three-way valve 11 are open, and port c is closed. At this time, the coolant in the first temperature controller 1 (denoted as the first coolant) passes through the electrostatic chuck 5, causing its temperature to rise. The heated first coolant enters the process chamber 6, maintaining the first temperature within the process chamber 6. The temperature of the first coolant flowing through the process chamber 6 decreases, and it flows back to the first temperature controller 1 through the first three-way valve 2. The coolant in the second temperature controller 12 (denoted as the second coolant) flows into the cooling plate 81 in the RF component 8, carrying away excess heat from the cooling plate 81. The temperature of the second coolant rises, and it flows back to the second temperature controller 12 through the second three-way valve 11.

[0035] Specifically, the normal state is when T10≤T3+n℃, where T3 is the first liquid temperature, T10 is the second liquid temperature, and n is the preset temperature.

[0036] Specifically, when T10 > T3 + n℃, the second operating mode is entered. Ports a and c of the first three-way valve 2 are open, and port b is closed. Ports a and c of the second three-way valve 11 are open, and port b is closed. The coolant flowing out of the RF component 8 flows sequentially into the first temperature controller, the electrostatic chuck 5, and the process chamber 6. The coolant flowing out of the process chamber 6 enters the second temperature controller 12 through ports a and c of the first three-way valve 2 for cooling. The cooled coolant then re-enters the RF component 8 for circulation.

[0037] Specifically, the coolant is any one or any combination of ultrapure water, ethylene glycol solution, or fluorinated liquid.

[0038] Example 2 This invention provides a control method for an energy-saving circulating coolant system applied to semiconductor equipment, comprising the following steps: Obtain the first liquid temperature at the outlet of the heating zone and the second liquid temperature at the outlet of the cooling zone; A control command is generated based on the first liquid temperature, the second liquid temperature, and the preset temperature. When the first liquid temperature, the second liquid temperature, and the preset temperature meet the first operating conditions, the a port of the first three-way valve 2, the b port of the first three-way valve 2, the a port of the second three-way valve 11, and the b port of the second three-way valve 11 are opened, and the c port of the first three-way valve 2 and the c port of the second three-way valve 11 are closed. When the first liquid temperature, the second liquid temperature, and the preset temperature meet the second operating conditions, the a port of the first three-way valve 2, the c port of the first three-way valve 2, the a port of the second three-way valve 11, and the c port of the second three-way valve 11 are opened, and the b port of the first three-way valve 2 and the b port of the second three-way valve 11 are closed.

[0039] Specifically, the first operating condition is that the sum of the first liquid temperature and the preset temperature is greater than or equal to the second liquid temperature, and the second operating condition is that the sum of the first liquid temperature and the preset temperature is less than the second liquid temperature.

[0040] Specifically, when the central control module is used for control, control commands are generated to control the first three-way valve 2 and the second three-way valve 11. When the control command is the first command, the a port of the first three-way valve 2, the b port of the first three-way valve 2, the a port of the second three-way valve 11, and the b port of the second three-way valve 11 are opened, and the c port of the first three-way valve 2 and the c port of the second three-way valve 11 are closed. The coolant in the first thermostat 1 flows through the heating zone and returns to the first thermostat 1, and the coolant in the second thermostat 12 flows through the cooling zone and returns to the second thermostat 12. When the control command is the second command, the a port of the first three-way valve 2, the c port of the first three-way valve 2, the a port of the second three-way valve 11, and the c port of the second three-way valve 11 are opened, and the b port of the first three-way valve 2 and the b port of the second three-way valve 11 are closed. The coolant in the first temperature controller 1 flows sequentially through the heating zone, the second temperature controller 12, and the radio frequency component 8 back to the first temperature controller 1.

[0041] Specifically, in the step of generating control commands based on the first liquid temperature, the second liquid temperature, and the preset temperature, a first command is generated when T10 ≤ T3 + n℃, and a second command is generated when T10 > T3 + n℃, where n is the preset temperature. When T10 > T3 + n℃, the coolant flowing out of the RF component 8 flows directly into the first temperature controller 1, making it easier for the coolant to reach the set temperature within the first temperature controller 1, recovering the heat from the coolant flowing out of the RF component 8, reducing the heating power of the first temperature controller 1, and achieving energy saving. When T10 > T3 + n℃, the coolant circulating back to the second temperature controller 12 has a lower temperature, and the second temperature controller 12 provides less cooling to lower the coolant to the set temperature, saving cooling water usage. n℃ can be determined based on the actual temperature of the coolant in the first temperature controller 1 and the second temperature controller 12; with experience, the first flow meter 3 can be removed, and the temperature of the coolant flowing out of the heating zone can be disregarded, with trigger signal conditions set based on experience, such as T10 > 70℃.

[0042] Taking a high-density plasma equipment (HDP) as an example, the coolant is a mixture of ethylene glycol and pure water in a 1:1 volume ratio. The density of ethylene glycol is ρ. eg ≈1110kg / m³, specific heat capacity C eg ≈2380 J / (kg·K); water density ρ w =1000kg / m³, specific heat capacity C w =4184J / (kg·K), according to formula (1): ; In the formula, C mix m is the specific heat capacity of the coolant. eg The mass of ethylene glycol is represented by C. eg m is the specific heat capacity of ethylene glycol. w C represents water quality. w This is the specific heat capacity of water.

[0043] The specific heat capacity C of the mixture, i.e., the coolant, is calculated according to formula (1). mix =3.23 kJ / (kg·K), and then according to formula (2): ; In the formula, ρ mix ρ is the density of the mixture. eg V is the density of ethylene glycol. eg V is the volume of ethylene glycol. w Let be the volume of water.

[0044] The density ρ of the mixture is calculated according to formula (2). mix =1055kg / m³, the supply and return water temperature difference is 3℃ to 8℃, here taking T as T w回 -T w供 Taking 6℃ as an example, in the formula, T w供 For water supply temperature, T w回 The return water temperature is specified. The cooling water flow rate is 25 L / min. Ideally, the heating wire 14 in the first thermostat 1 can convert 100% of electrical energy into heat, i.e., 1 kWh = 3600 kJ; the set temperature of the second thermostat 12 is 35℃, which is the supply temperature T of the coolant flowing out of the second thermostat 12. B供 =35℃, the temperature of the coolant flowing out of the RF component 8 is 80℃, and the return temperature T is at this time. B回 =80℃, coolant flow rate q of the second thermostat B =6L / min; the set temperature of the first temperature controller 1 is 75℃, that is, the coolant supply temperature T flowing out of the first temperature controller. A供 =75℃, the temperature of the coolant flowing out of process chamber 6 is 60℃, and the return temperature T is at this time. A回 =60℃, coolant flow rate q of the first thermostat A =6L / min.

[0045] When the first instruction is executed, the temperature of process chamber 6 is maintained by a coolant at 75°C, according to formula (3): ; In the formula, Q1 represents the hourly heating power of the coolant of the first thermostat, and W is the hourly power consumption of the first thermostat 1 under the first command; W≈5.11kWh, no cooling water is required, q A ρ is the coolant flow rate of the first thermostat. mix T is the density of the mixture. A供 T is the coolant supply temperature from the first temperature controller. A回 C represents the temperature of the coolant flowing out of the process chamber. mix This refers to the specific heat capacity of the coolant.

[0046] The second temperature controller 12 continuously supplies coolant at 35°C, according to formula (4): C w *m 1w *(T)w回 -T w供 )= C mix *q B *ρ mix *60*(T) B供 -T B回 ); In the formula, C w m is the specific heat capacity of water. 1w T represents the amount of cooling water consumed per hour by the second temperature controller 12 under the first command. w回 T represents the return water temperature. w供 q represents the water supply temperature. B C is the coolant flow rate of the second thermostat. mix This refers to the specific heat capacity of the coolant.

[0047] The amount of cooling water consumed per hour by the second temperature controller 12 under the first command was calculated (m). 1W It weighs approximately 3199 kg and requires no electricity.

[0048] When the second instruction is executed, the temperature of process chamber 6 is maintained by the coolant flowing out of RF component 8. At this time, the coolant needs to flow from T... B回 Down to T A供 According to formula (5): C w *m 2w *(T) w回 -T w供 )= C mix *q B *ρ mix *60*(T) B回 -T A供 ); In the formula, C w C is the specific heat capacity of water. mix m is the specific heat capacity of the coolant. 2w This refers to the amount of cooling water consumed per hour by the first temperature controller 1.

[0049] When the second instruction is received, the first temperature controller 1 consumes m of cooling water per hour. 2w ≈244.3kg, consumes no electricity, and the return liquid temperature flowing into the second temperature controller is T. A回 According to formula (6): C w *m 3w *(T) w回 -T w供 )= C mix *q B *ρ mix *60*(T) A回 -T B供 ); In the formula, m 3w This refers to the amount of cooling water consumed per hour by the second thermostat 12.

[0050] When the second command is received, the second temperature controller 12 consumes m of cooling water per hour. 3w It weighs approximately 1221.67 kg and consumes no electricity.

[0051] Comparing the power consumption and cooling water volume of the first and second commands, 5.11 kWh of power and m³ of cooling water are saved per hour. 1w -m 2w -m 3w =733.03kg. Assuming it operates for 300 days a year and 8 hours a day in mode 2, each device can save approximately 12264 kWh of electricity and approximately 1759 tons of cooling water per year.

[0052] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0053] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can occur depending on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. An energy saving circulating coolant system for semiconductor equipment, characterized by, The temperature control device comprises a first temperature controller (1), a second temperature controller (12), a first three-way valve (2) and a second three-way valve (11), the first passage of the first temperature controller (1) and the first passage of the second temperature controller (12) are connected with cooling water, the second passage of the first temperature controller (1) and the second passage of the second temperature controller (12) contain cooling liquid, the second outlet of the first temperature controller (1) is connected with the inlet of a heating area, the outlet of the heating area is connected with the a port of the first three-way valve (2), the b port of the first three-way valve (2) is connected with the second inlet of the first temperature controller (1), the c port of the first three-way valve (2) is connected with the second inlet of the second temperature controller (12), the second outlet of the second temperature controller (12) is connected with the inlet of a cooling area, the outlet of the cooling area is connected with the a port of the second three-way valve (11), the b port of the second three-way valve is connected with the second inlet of the second temperature controller (12), and the c port of the second three-way valve is connected with the second inlet of the first temperature controller (1).

2. The energy-saving circulating cooling liquid system for semiconductor equipment according to claim 1, wherein, The temperature control device further comprises a central control module, which is used to acquire the first liquid temperature at the outlet of the heating area and the second liquid temperature at the outlet of the cooling area, and generate a control instruction according to the first liquid temperature, the second liquid temperature and a preset temperature, the control instruction being used to control the first three-way valve (2) and the second three-way valve (11).

3. The energy-saving circulating cooling liquid system for semiconductor equipment according to claim 1, wherein, The heating area comprises an electrostatic chuck (5) and a process chamber (6), the inlet of the electrostatic chuck (5) is connected with the second outlet of the first temperature controller (1), the outlet of the electrostatic chuck (5) is connected with the inlet of the process chamber (6), and the outlet of the process chamber (6) is connected with the a port of the first three-way valve (2).

4. The energy-saving circulating cooling liquid system for semiconductor equipment according to claim 1, wherein, The cooling area is a radio frequency assembly (8), which comprises, from top to bottom, a cooling disc (81), a heating disc (82) and a coil (83).

5. The energy-saving circulating coolant system for semiconductor equipment according to claim 1, wherein, Quick couplings (4) are arranged at the inlet of the heating area, the outlet of the heating area, the inlet of the cooling area and the outlet of the cooling area.

6. The energy-saving circulating coolant system for semiconductor equipment according to claim 1, wherein, The first temperature controller (1) and the second temperature controller (12) are the same in structure and comprise first pipelines and second pipelines, the first pipelines are connected with cooling water, the second pipelines contain cooling liquid, heat exchangers (15) are arranged at the positions adjacent to the first pipelines and the second pipelines, heating wires (14) are arranged on the two sides of the second pipelines, and water pumps (13) are arranged on the second pipelines.

7. The energy-saving circulating coolant system for semiconductor equipment according to claim 1, wherein, A first flowmeter (3) is arranged at the outlet of the heating area, and a second flowmeter (10) is arranged at the outlet of the cooling area.

8. The energy-saving circulating cooling liquid system for semiconductor equipment according to claim 1, wherein, The cooling liquid is any one or any combination of ultrapure water, ethylene glycol solution and fluorinated liquid.

9. A control method of an energy-saving circulating coolant system applied to a semiconductor device, based on the energy-saving circulating coolant system applied to a semiconductor device according to claim 1, characterized in that, The temperature control device comprises the following steps: acquiring the first liquid temperature at the outlet of the heating area and the second liquid temperature at the outlet of the cooling area; controlling the opening and closing of the first three-way valve (2) and the second three-way valve (11) according to the first liquid temperature, the second liquid temperature and a preset temperature; When the first liquid temperature, the second liquid temperature and a preset temperature satisfy a first operation condition, a port a of the first three-way valve (2), a port b of the first three-way valve (2), a port a of the second three-way valve (11) and a port b of the second three-way valve (11) are opened, and a port c of the first three-way valve (2) and a port c of the second three-way valve (11) are closed. When the first liquid temperature, the second liquid temperature and a preset temperature satisfy a second operation condition, a port a of the first three-way valve (2), a port c of the first three-way valve (2), a port a of the second three-way valve (11) and a port c of the second three-way valve (11) are opened, and a port b of the first three-way valve (2) and a port b of the second three-way valve (11) are closed.

10. The control method of the energy-saving circulating cooling liquid system applied to the semiconductor device according to claim 9, characterized in that, The first operation condition is that a sum of the first liquid temperature and the preset temperature is greater than or equal to the second liquid temperature, and the second operation condition is that the sum of the first liquid temperature and the preset temperature is less than the second liquid temperature.

Images