A wet cleaning machine for semiconductor manufacturing

Abstract

This invention discloses a wet cleaning machine for semiconductor manufacturing, relating to the technical field of semiconductor wet cleaning equipment. It includes a closed-loop track for continuous wet cleaning of semiconductors. A cleaning component is slidably mounted on the closed-loop track, and a wafer is placed and fixed inside the cleaning component. The cleaning component is driven by a transfer mechanism to slide on the closed-loop track. The closed-loop track includes at least one arc-shaped segment. At least one set of chemical rinsing components and pure water rinsing components are respectively arranged on the outer and inner sides of the arc-shaped segment. By setting up the closed-loop track and driving the cleaning component to move on the closed-loop track through the transfer mechanism, in conjunction with the chemical rinsing components and pure water rinsing components, continuous wet cleaning of wafers can be achieved, simultaneously cleaning multiple wafers without waiting for the next wafer to be cleaned, effectively improving the efficiency of wafer cleaning and ensuring semiconductor production efficiency.

Description

Technical Field

[0001] This invention relates to the field of semiconductor wet cleaning equipment technology, specifically a wet cleaning machine for semiconductor production. Background Technology

[0002] In the semiconductor manufacturing process, wafers undergo hundreds of processes, such as photolithography, etching, ion implantation, thin film deposition, and chemical mechanical polishing. These processes introduce various contaminants onto the wafer surface. As chip manufacturing processes have entered the nanoscale, the size of transistors has become as small as the atom. Any tiny contamination can be fatal. Therefore, semiconductor wet cleaning technology is a core step throughout the entire semiconductor manufacturing process, and its cleanliness directly determines the chip's performance, yield, and reliability.

[0003] Chinese invention patent (CN112768378A) discloses an "interleaved wafer surface wet cleaning system and cleaning method," specifically disclosing that: the cleaning system includes a wafer carrier mechanism and a wafer cleaning mechanism. The wafer carrier mechanism is used to place wafers, and the wafers are fixed on the surface of the wafer carrier mechanism and rotate under the drive of the wafer carrier mechanism; the wafer cleaning mechanism includes a first cleaning mechanism, a second cleaning mechanism, a third cleaning mechanism, and a fourth cleaning mechanism. The first cleaning mechanism, the second cleaning mechanism, the third cleaning mechanism, and the fourth cleaning mechanism are all arranged on the outside of the wafer carrier mechanism for cleaning the surface of the wafers. The above disclosure uses multiple cleaning solutions for interleaved cleaning, and the cleaning processes do not interfere with each other, thereby improving the cleaning quality of the wafer surface and ensuring the cleaning effect of the wafers.

[0004] However, while the aforementioned disclosure can improve the cleaning quality of wafer surfaces and ensure cleaning effectiveness, it can only clean one wafer at a time, resulting in reduced semiconductor cleaning efficiency and affecting the overall production efficiency of the semiconductor production line. Summary of the Invention

[0005] The purpose of this invention is to provide a wet cleaning machine for semiconductor manufacturing, so as to solve the problem of low efficiency in semiconductor wet cleaning that leads to reduced production efficiency in the prior art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a wet cleaning machine for semiconductor production, comprising a closed-loop track for realizing continuous wet cleaning of semiconductors, a cleaning component slidably mounted on the closed-loop track, a wafer placed and fixed inside the cleaning component, the cleaning component being driven by a transfer mechanism to slide on the closed-loop track, the closed-loop track including at least one arc segment, at least one set of chemical rinsing components and pure water rinsing components respectively provided on the outer and inner sides of the arc segment of the closed-loop track, for realizing staggered cleaning of the wafers.

[0007] By using the above technical solution, the cleaning components are driven to slide on a closed-loop track by a transfer mechanism. Combined with the chemical rinsing components and the pure water rinsing components, continuous and staggered wet cleaning of wafers can be achieved, which effectively improves the cleaning efficiency of wafers. Combined with the loading and unloading robot for automatic loading and unloading of wafers, fully automated cleaning of wafers is realized, which improves the production efficiency of semiconductors.

[0008] As a preferred technical solution, the cleaning component includes a rotating component, which is driven to rotate by a power component. A fixing component is provided on the upper surface of the rotating component, and the wafer is placed and fixed on the fixing component. A protective cover is provided on the outside of the rotating component to block the chemicals and / or pure water in the wet cleaning process of the wafer.

[0009] With the above technical solution, after spraying the agent or pure water onto the surface of the wafer, the wafer can be rotated by the rotating component, so that the agent or pure water on the surface of the wafer can be diffused, thereby achieving wet cleaning of the wafer. At the same time, under the action of the protective cover, the agent or pure water can be effectively prevented from diffusing outward and affecting the normal operation of the entire cleaning machine.

[0010] As a preferred technical solution, a water collection part is provided between the rotating part and the protective cover, and a drain pipe is also provided at the bottom of the protective cover, with the drain pipe connected to the water collection part;

[0011] The water collection part has an upward-protruding sealing boss on the side near the rotating part, and a downward-extending sealing strip on the side of the rotating part near the water collection part. The sealing strip is located above the sealing boss and is in contact with it.

[0012] The above technical solution can, on the one hand, collect and discharge the chemicals or pure water generated during the wet cleaning process of wafers, thus avoiding any impact on the wet cleaning of wafers; on the other hand, it can effectively prevent the chemicals or pure water generated during the cleaning process from entering the area below the rotating parts, causing corrosion to other components and affecting the normal use of the cleaned parts.

[0013] As a preferred technical solution, the rotating component has a disc-shaped structure, and the height of the center point of the rotating component is greater than the height of the edge.

[0014] The above technical solution can effectively prevent the accumulation of medicine or pure water on the rotating parts, and can promptly guide the medicine or pure water dripping on the rotating parts to the water collection part for waste liquid collection.

[0015] As a preferred technical solution, the transfer mechanism includes a support member located on a closed-loop track, a cleaning component positioned above the support member, and a dual-winding motor positioned below the support member. One output end of the dual-winding motor drives the cleaning component to rotate, and the other output end is equipped with a drive gear that meshes with a closed-loop rack. The position of the closed-loop rack is fixed, and the dual-winding motor is controlled by a controller.

[0016] The above technical solution utilizes the drive gear at one end of a dual-winding motor to mesh with a closed-loop rack. Driven by the dual-winding motor, the entire transfer mechanism can move along the trajectory of the closed-loop rack. Since the trajectory of the closed-loop rack is consistent with the trajectory of the closed-loop track, the cleaning parts can move on the closed-loop track. The dual-winding motor is controlled by a controller to achieve the dual functions of transfer and cleaning. At the same time, the overall integration is improved, making the structure more streamlined.

[0017] As a preferred technical solution, the closed-loop track includes an inner rail and an outer rail, with a groove formed between the inner rail and the outer rail. The transfer mechanism slides in the groove, and ball bearings are embedded in both the inner rail and the outer rail.

[0018] The above technical solution can limit the movement trajectory of the transfer mechanism, thereby ensuring smoother cleaning of the wafers. The ball bearing design can effectively prevent jamming during the movement of the transfer mechanism.

[0019] As a preferred technical solution, a water collection trough is provided on the inner side of the closed-loop track, and the water collection trough is arranged in a closed loop along the inner side of the closed-loop track, with the end of the drain pipe extending into the water collection trough.

[0020] The above technical solution can effectively collect the wastewater generated during the wet cleaning process of wafers. Since the wastewater contains corrosive agents, it can effectively prevent the wastewater from corroding the cleaning machine and affecting its service life.

[0021] As a preferred technical solution, the chemical rinsing component includes at least one chemical tube for spraying chemical agents onto the wafers in the cleaning component, and the chemical tubes are distributed circumferentially along the arc-shaped segment of the closed-loop track.

[0022] By using the above technical solution, chemical tubes are distributed circumferentially on the outer side of the arc section of the closed-loop track, which can realize continuous rinsing of multiple wafers. Under the multi-step cleaning conditions of wafers, the cleaning efficiency of wafers can be effectively improved, thereby improving the production efficiency of semiconductors.

[0023] As a preferred technical solution, the reagent tube is designed to extend and retract vertically, enabling the reagent tube nozzle to spray the wafer at close range.

[0024] The above technical solution ensures that all the chemicals sprayed by the chemical tube nozzle adhere to the surface of the wafer. On the one hand, it reduces the waste of chemicals, and on the other hand, it avoids the chemicals from corroding other components. When the cleaning component moves to the bottom of the chemical tube through the transfer mechanism, the nozzle of the chemical tube is moved downward by the vertical extension design of the chemical tube, shortening the distance between the nozzle of the chemical tube and the wafer.

[0025] As a preferred technical solution, a support plate is provided in the enclosed area inside the closed-loop track;

[0026] The pure water rinsing component includes a rotating component. The bottom of the rotating component has several lifting grooves circumferentially. The support plate is provided with lifting protrusions that are adapted to the lifting grooves. A spline tube is provided at the center point of the bottom of the rotating component. A drive motor is provided at the bottom of the support plate. A spline column is provided on the output shaft of the drive motor. The spline column is inserted into the spline tube and is retractably connected to the spline tube. The rotating component is driven to rotate by the drive motor.

[0027] At least one pure water pipe is circumferentially arranged on the upper surface of the rotating part. When the lifting protrusion is located inside the lifting groove, at least one pure water pipe is located between two adjacent drug pipes.

[0028] The above technical solution utilizes a drive motor to rotate the rotating component. During this process, if the lifting protrusion fails to engage with the lifting groove, the entire rotating component will be lifted to avoid collisions with the chemical rinsing component outside the closed-loop track. If the lifting protrusion engages with the lifting groove, the rotating component will fall under gravity, causing the pure water pipe to fall as well. This ensures that the nozzle of the pure water pipe can smoothly enter the protective cover, while also reducing the distance between the nozzle of the pure water pipe and the wafer moving on the closed-loop track, thus achieving wafer cleaning.

[0029] Compared with the prior art, the beneficial effects of the present invention are:

[0030] 1. This invention, by setting up a closed-loop track and driving the cleaning components to move on the closed-loop track through a transfer mechanism, in conjunction with the chemical rinsing components and the pure water rinsing components, can realize continuous wet cleaning of wafers, and simultaneously perform cleaning work on multiple wafers. There is no need to wait for the cleaning of one wafer to be completed before the cleaning work of the next wafer can be carried out, which effectively improves the efficiency of wafer cleaning and ensures the production efficiency of semiconductors.

[0031] 2. The present invention, through the design of the water collection part, sealing boss and sealing strip, can guide the wastewater during the wet cleaning of wafers, reduce the downward impact of wastewater on the cleaning parts, and at the same time, prevent wastewater leakage from causing corrosion to other components, effectively ensuring the service life of the wet cleaning machine.

[0032] 3. This invention, through the design of lifting grooves and lifting protrusions, combined with spline tubes and spline columns, can intermittently drive the pure water tube to lift and fall when the rotating part is driven to rotate by the drive motor, so as to avoid the chemical tube outside the closed loop track. At the same time, the distance between the pure water tube nozzle and the wafer can be adjusted to ensure the cleanliness of pure water rinsing. Attached Figure Description

[0033] Figure 1This is a schematic diagram of the structure of a wet cleaning machine for semiconductor manufacturing according to the present invention;

[0034] Figure 2 This is a schematic diagram showing the relationship between the closed-loop track and the cleaning component of the present invention;

[0035] Figure 3 This is a schematic diagram of the closed-loop rack in the transfer mechanism of the present invention;

[0036] Figure 4 This is a schematic diagram of the transfer mechanism and cleaning component of the present invention;

[0037] Figure 5 This is a cross-sectional view of the cleaning component of the present invention;

[0038] Figure 6 For the present invention Figure 5 Enlarged structural diagram of region A in the middle;

[0039] Figure 7 This is a schematic diagram showing the relationship between the rotating component and the lifting protrusion of the present invention;

[0040] Figure 8 This is a schematic diagram of the lifting groove and lifting protrusion of the present invention;

[0041] Figure 9 This is a top view of a wet cleaning machine for semiconductor manufacturing according to the present invention;

[0042] Figure 10 This is a schematic diagram of a second embodiment of the closed-loop track of the present invention.

[0043] The diagram is labeled as follows: 100, closed-loop track; 101, inner rail; 102, outer rail; 103, chute; 104, ball bearing; 105, water collection trough.

[0044] 200. Transfer mechanism; 201. Support component; 202. Dual-winding motor; 203. Drive gear; 204. Closed-loop rack;

[0045] 300. Cleaning component; 301. Rotating component; 302. Fixing component; 303. Protective cover; 304. Water collection section; 305. Drain pipe; 306. Sealing boss; 307. Sealing strip;

[0046] 400. Wafer;

[0047] 501. Pharmaceutical tube;

[0048] 601. Rotating component; 602. Lifting groove; 603. Lifting protrusion; 604. Spline tube; 605. Spline column; 606. Pure water pipe. Detailed Implementation

[0049] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0050] Example 1: As Figure 1 As shown, a wet cleaning machine for semiconductor manufacturing is disclosed, including a closed-loop track 100, which comprises two arc-shaped segments and two straight segments, as shown. Figure 9 As shown, the straight section is the loading and unloading area, and the arc section is the cleaning area. A chemical rinsing component is set on the outside of the arc section, and a pure water rinsing component is set on the inside of the arc section. The semiconductor is cleaned in an alternating manner using the chemical rinsing component and the pure water rinsing component.

[0051] Specifically, such as Figure 2 As shown, the closed-loop track 100 consists of an inner track 101 and an outer track 102. There is a gap between the inner track 101 and the outer track 102, forming a groove 103. A transfer mechanism 200 is slidably installed in the groove 103. A cleaning component 300 is installed above the transfer mechanism 200. A wafer 400 is placed and fixed in the cleaning component 300. In order to make the transfer mechanism 200 slide more smoothly inside the groove 103, ball bearings 104 are embedded and installed on the upper surfaces of both the inner track 101 and the outer track 102.

[0052] In this embodiment, as Figures 3-4 As shown, the transfer mechanism 200 includes a dual-winding motor 202, which is a motor with two output shafts. One of the output shafts is connected to a drive gear 203, which meshes with a closed-loop rack 204. The closed-loop rack 204 follows the same trajectory as the closed-loop track 100. Movement can be achieved by rotating the drive gear 203 in conjunction with the fixedly installed closed-loop rack 204. At the same time, several support members 201 that can slide along the closed-loop track 100 are placed on the closed-loop track 100. The other output shaft of the dual-winding motor 202 passes through the support member 201 and is connected to the cleaning member 300.

[0053] Specifically, such as Figure 5 As shown, the cleaning component 300 includes a rotating component 301, a fixing component 302, and a protective cover 303. The rotating component 301 is driven to rotate by one of the output shafts of the dual-winding motor 202. The protective cover 303 is fitted on the outside of the rotating component 301 to prevent splashing of chemicals or pure water during semiconductor cleaning. The fixing component 302 is also provided on the rotating component 301 for placing and fixing the wafer 400.

[0054] Furthermore, such as Figure 6 As shown, a water collection part 304 is provided between the rotating part 301 and the protective cover 303. A drain pipe 305 is also provided at the bottom of the protective cover 303. The drain pipe 305 is connected to the water collection part 304. An annular water collection trough 105 is provided on the inner side of the closed-loop track 100. The end of the drain pipe 305 extends into the water collection trough 105, and the wastewater discharged from the drain pipe 305 is collected through the water collection trough 105.

[0055] The water collection part 304 has an upwardly protruding sealing boss 306 on the side near the rotating part 301, and the rotating part 301 has a downwardly extending sealing strip 307 on the side near the water collection part 304. The sealing strip 307 is located above the sealing boss 306 and is in contact with it. Through the cooperation of the sealing boss 306 and the sealing strip 307, the wastewater generated during the cleaning of the wafer 400 can be prevented from corroding the support 201 or the output shaft of the dual-winding motor 202, effectively extending the service life of the wet cleaning machine.

[0056] In this embodiment, as Figure 9 As shown, the chemical rinsing unit consists of three chemical tubes 501, which are evenly distributed on the outside of the closed-loop track 100. The three chemical tubes 501 spray hydrofluoric acid solution, a mixed solution of sulfuric acid and hydrogen peroxide, and a mixed solution of ammonia and hydrogen peroxide, respectively, to clean the wafer 400. A certain gap is left between each adjacent chemical tube 501 for inserting a pure water tube 606. By spraying pure water, the chemical sprayed by the chemical tubes 501 is rinsed to ensure that there is no chemical residue on the surface of the wafer 400.

[0057] It should be further explained that the agent tube 501 is designed with a telescopic structure to shorten the distance between the nozzle of the agent tube 501 and the wafer 400, ensuring comprehensive agent spraying. Specifically, the telescopic movement can be driven by telescopic drive components such as cylinders. A telescopic corrugated tube is set inside the agent tube 501, while the outside of the agent tube 501 is a sleeved metal structure. The telescopic movement of the entire agent tube 501 can be achieved by driving the sleeved metal structure to extend or retract through telescopic components such as cylinders.

[0058] like Figure 1As shown, a support plate is provided on the inner side of the closed-loop track 100, and a rotating component 601 is provided on the support plate. Pure water pipes 606 are evenly installed on the rotating component 601 for spraying pure water onto the wafer 400 after chemical rinsing to clean the chemical residue. In this embodiment, it should be noted that the pure water tank can be set on the support plate, inside the rotating component 601, or externally. When the pure water tank is not set inside the rotating component 601, pure water can be indirectly supplied to the rotating component 601 through the pure water tank. That is, when the rotating component 601 is not rotating, pure water is supplied through the external pure water tank. As for the connection between the pure water tank and the rotating component 601, the existing sealing structure can be used to ensure the supply of pure water, which will not be elaborated on here.

[0059] It should be further explained that the spraying of chemicals or pure water in both the chemical tube 501 and the pure water tube 606 is achieved through the control of electronic pumps to achieve rapid response and supply.

[0060] Specifically, such as Figures 7-8 As shown, several lifting grooves 602 are circumferentially formed at the bottom of the rotating component 601. Lifting protrusions 603, adapted to the lifting grooves 602, are provided on the support plate. When the rotating component 601 rotates, the lifting grooves 602 and the lifting protrusions 603 are in a state of mutual contact, separation, and then mutual contact again. Combined with the spline tube 604 located at the center point of the bottom of the rotating component 601 and the matching spline column 605, the rotating component 601 can be moved on the support plate... The floating mechanism ensures that the pure water pipe 606 does not collide with the reagent pipe 501 located on the outside of the closed-loop track 100. The design of the lifting groove 602 and the lifting protrusion 603 is intended to lift and lower the pure water pipe 606 on the rotating part 601 when it is about to collide with the reagent pipe 501. The purpose of lowering it is also to ensure that the nozzle of the pure water pipe 606 can extend into the protective cover 303, thereby shortening the distance between the nozzle of the pure water pipe 606 and the wafer 400.

[0061] It should be further explained that the spline column 605 is mounted on the output shaft of the drive motor, which is mounted on the bottom of the support plate. The drive motor drives the spline column 605 to rotate, which in turn drives the rotating component 601 to rotate in conjunction with the spline tube 604.

[0062] The specific process for cleaning wafer 400 is as follows: The cleaning component 300 is moved by the transfer mechanism 200. When the cleaning component 300 carrying wafer 400 moves to the first reagent tube 501, the nozzle of the first reagent tube 501 is driven to fall by a cylinder or other telescopic component, aiming at the wafer 400 and spraying hydrofluoric acid solution to clean the wafer 400 once. After one cleaning cycle, the nozzle of the first reagent tube 501 is driven to rise again by a cylinder or other telescopic component. Simultaneously, the cleaning process is... The motor drives the rotating component 601 to rotate. Under the rotation of the rotating component 601, the pure water pipe 606 moves. Under the action of the lifting groove 602 and the lifting protrusion 603, when the pure water pipe 606 is about to collide with the medicine pipe 501, the entire rotating component 601 is lifted to avoid collision between the pure water pipe 606 and the medicine pipe 501. At the same time, the transfer mechanism 200 also drives the cleaning component 300 to continue moving on the closed-loop track 100. When the cleaning component 300 moves to the position where the first medicine pipe 501 and the second medicine pipe 501 collide, the cleaning component 601 moves to the position where the first medicine pipe 501 collide with the second medicine pipe 501. When the second reagent tube 501 reaches its midpoint, the pure water tube 606 on the rotating component 601 also completes its movement and, under the action of the lifting groove 602 and the lifting protrusion 603, falls into the protective cover 303. At this time, the wafer 400, which has been cleaned by the first reagent tube 501, can be rinsed with pure water through the pure water tube 606 on the rotating component 601 to remove the residual hydrofluoric acid solution on the wafer 400. Other transfer mechanisms 200 on the closed-loop track 100 have driven the other cleaning components 300 to move below the first reagent tube 501, and used the first reagent tube 501 to spray hydrofluoric acid solution onto the other wafers 400. Then the entire rotating component 601 moves with the cleaning components 300 to complete the subsequent cleaning process. It can be seen that the wet cleaning machine of the present invention can clean multiple wafers 400 simultaneously in a sequential process, which greatly improves the cleaning efficiency of the wafers 400.

[0063] Furthermore, it should be noted that when the reagent tube 501 is cleaning the wafer 400, the rotating component 601 remains stationary, that is, the pure water tube 606 on the rotating component 601 remains stationary. After the reagent tube 501 finishes cleaning the wafer 400, the drive motor will drive the rotating component 601 to rotate and follow the cleaning component 300 to move a certain distance. At this time, when the cleaning component 300 is below the second reagent tube 501, the rotating component 601 stops rotating. After the second reagent tube 501 finishes spraying the mixed solution of sulfuric acid and hydrogen peroxide, the controller controls the drive motor to rotate and drive the rotating component 601 to rotate. At this time, the rotation speed of the rotating component 601 will be greater than the moving speed of the cleaning component 300, so that the pure water tube 606 can catch up with the cleaning component 300, ensuring that when the cleaning component 300 moves between the two reagent tubes 501, one of the pure water tubes 606 on the rotating component 601 can enter the protective cover 303.

[0064] In this embodiment, when the agent or pure water is sprayed from the agent tube 501 or the pure water tube 606, the rotating component 301 is driven to rotate by the dual-winding motor 202 to diffuse the agent or pure water sprayed on the wafer 400, thereby achieving the purpose of cleaning the wafer 400 and removing some of the agent or pure water at the same time.

[0065] Example 2: As Figure 10 As shown, the other features in this embodiment are exactly the same as those in Embodiment 1. The difference is that the closed-loop track 100 provided in this embodiment consists of a three-quarters circular arc segment, two straight segments, and a half-circular arc segment with a diameter less than the three-quarters circular arc segment. In this embodiment, a set of chemical rinsing components and pure water rinsing components are arranged only on the outer and inner sides of the three-quarters circular arc segment, respectively. It can be found that the closed-loop track 100 of the present invention can also be composed of other forms. As long as the track completes the closed loop, it can achieve the technical effect of efficient cleaning of wafers 400 and improved semiconductor production efficiency of the present invention.

[0066] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A wet cleaning machine for semiconductor manufacturing, characterized in that: The system includes a closed-loop track (100) for continuous wet cleaning of semiconductors. A cleaning component (300) is slidably mounted on the closed-loop track (100). A wafer (400) is placed and fixed inside the cleaning component (300). The cleaning component (300) is driven by a transfer mechanism (200) to slide on the closed-loop track (100). The closed-loop track (100) includes at least one arc segment. At least one set of chemical rinsing components and pure water rinsing components are respectively provided on the outer and inner sides of the arc segment of the closed-loop track (100) to achieve staggered cleaning of the wafer (400). The chemical rinsing unit includes at least one chemical tube (501) for spraying chemical agent onto the wafer (400) in the cleaning unit (300), and the chemical tube (501) is circumferentially distributed along the arc segment of the closed loop track (100); A support plate is provided in the closed area inside the closed loop track (100); The pure water rinsing component includes a rotating component (601). The bottom of the rotating component (601) is provided with several lifting grooves (602) around its circumference. The support plate is provided with lifting protrusions (603) that are adapted to the lifting grooves (602). A spline tube (604) is provided at the center point of the bottom of the rotating component (601). A drive motor is provided at the bottom of the support plate. A spline column (605) is provided on the output shaft of the drive motor. The spline column (605) is inserted into the spline tube (604) and is retractably connected to the spline tube (604). The rotating component (601) is driven to rotate by the drive motor. At least one pure water pipe (606) is circumferentially provided on the upper surface of the rotating part (601). When the lifting protrusion (603) is located inside the lifting groove (602), at least one pure water pipe (606) is located between two adjacent medicine pipes (501).

2. The wet cleaning machine for semiconductor manufacturing according to claim 1, characterized in that: The cleaning component (300) includes a rotating component (301), which is driven to rotate by a power component. A fixing component (302) is provided on the upper surface of the rotating component (301). The wafer (400) is placed and fixed on the fixing component (302). A protective cover (303) is provided on the outside of the rotating component (301) to block the chemicals and / or pure water in the wet cleaning process of the wafer (400).

3. A wet cleaning machine for semiconductor manufacturing according to claim 2, characterized in that: A water collection part (304) is provided between the rotating part (301) and the protective cover (303), and a drain pipe (305) is also provided at the bottom of the protective cover (303), and the drain pipe (305) is connected to the water collection part (304); The water collection part (304) is provided with an upwardly protruding sealing boss (306) on the side near the rotating part (301), and a downwardly extending sealing strip (307) is provided on the side of the rotating part (301) near the water collection part (304). The sealing strip (307) is located above the sealing boss (306) and is in contact with each other.

4. A wet cleaning machine for semiconductor manufacturing according to claim 2, characterized in that: The rotating component (301) has a disc-shaped structure, and the height of the center point of the rotating component (301) is greater than the height of the edge.

5. A wet cleaning machine for semiconductor manufacturing according to claim 1, characterized in that: The transfer mechanism (200) includes a support (201) located on a closed-loop track (100), a cleaning component (300) positioned above the support (201), and a dual-winding motor (202) positioned below the support (201). One output end of the dual-winding motor (202) drives the cleaning component (300) to rotate, and the other output end is equipped with a drive gear (203). The drive gear (203) meshes with a closed-loop rack (204), the position of which is fixed. The dual-winding motor (202) is controlled by a controller.

6. A wet cleaning machine for semiconductor manufacturing according to claim 1, characterized in that: The closed-loop track (100) includes an inner rail (101) and an outer rail (102). A groove (103) is formed between the inner rail (101) and the outer rail (102). The transfer mechanism (200) slides in the groove (103). Ball bearings (104) are embedded in both the inner rail (101) and the outer rail (102).

7. A wet cleaning machine for semiconductor manufacturing according to claim 3, characterized in that: A water collection trough (105) is provided inside the closed-loop track (100). The water collection trough (105) is arranged in a closed loop along the inside of the closed-loop track (100), and the end of the drain pipe (305) extends into the water collection trough (105).

8. A wet cleaning machine for semiconductor manufacturing according to claim 1, characterized in that: The agent tube (501) is designed to extend and retract vertically, enabling the agent tube (501) nozzle to spray the wafer (400) at close range.

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