Wafer carrier with function of adapting to multiple sizes

Abstract

The invention discloses a wafer carrier with a function of adapting to multiple sizes, and relates to the technical field of wafer carriers, the wafer carrier comprises a case, a bottom box and a side box, the case is located on the upper end surface of the bottom box, the side box is located on one side of the bottom box, a displacement mechanism is arranged on the inner side of the case, a transportation mechanism is arranged on the inner side of the side box, and multiple groups of slots with different sizes are arranged on the inner side of the case. A ventilation box is arranged on the inner side of the bottom box, a through groove is formed in one side of the ventilation box, a ventilation pipe is arranged in the through groove, one end of the ventilation pipe extends out of one side of the bottom box, the case, the bottom box and the side box provide an installation foundation for the whole wafer carrier, and the displacement mechanism is used for enabling the circle centers of wafers of different sizes to be located on the same straight line. The conveying mechanism is used for classifying the wafers according to the sizes and storing the wafers in the groove positions of different sizes, the wafer storage device can flexibly adapt to the wafers of different sizes through the design of the groove positions in the case, and the safety and stability of wafer storage are improved.

Description

Technical Field

[0001] This invention relates to the field of wafer carrier technology, specifically a wafer carrier with multi-size adaptability. Background Technology

[0002] As the semiconductor industry continues to demand higher production efficiency and product precision, the design of wafer storage carriers faces challenges in terms of diversification and accuracy. Traditional wafer storage carriers are typically only suitable for single-size wafers, lacking adaptability to different wafer sizes. This not only increases the time and cost of carrier replacement but may also affect wafer stability and storage accuracy. Therefore, developing a wafer storage carrier with multi-size adaptability is particularly important.

[0003] The prior art CN223066133U discloses a wafer carrier, which states that "This application relates to the semiconductor field and discloses a wafer carrier, comprising: a first mounting plate and a second mounting plate, with multiple mounting slots corresponding to opposite sides of the first and second mounting plates for supporting wafers; a first adjustment mechanism and a second adjustment mechanism disposed opposite to each other along the height direction of the supporting assembly, for adjusting the spacing between the first and second mounting plates and locking the relative positions of the first and second mounting plates. This solves the problem that existing wafer carriers can only adapt to wafers of one size. By using the first and second adjustment mechanisms, the spacing between the first and second mounting plates along the width direction of the supporting assembly is controlled, ensuring that the spacing between the first and second mounting plates along the height direction of the supporting assembly is equal everywhere, and locking them in a designated position, thereby enabling the wafer carrier to adapt to wafers of different sizes and improving the adaptability of the wafer carrier." Although existing technologies have disclosed wafer carriers, there are still some shortcomings, including: 1. When carrying wafers, existing wafer carriers can only accommodate wafers of the same size at the same time, which cannot meet the needs of storing wafers of multiple sizes at the same time in actual production. This leads to the need to frequently change carriers when handling wafers of different specifications, which not only reduces work efficiency but also increases the risk of operational errors.

[0004] 2. The wafer carrier uses a horizontal placement method when storing wafers, which may cause surface damage due to friction between wafers during storage and transportation, affecting product quality. In addition, prolonged horizontal placement of wafers will cause dust to accumulate on the surface, affecting wafer quality. Summary of the Invention

[0005] The purpose of this invention is to provide a wafer carrier with multi-size adaptability to solve the problems raised in the prior art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a wafer carrier with multi-size adaptability, comprising a chassis, a base box, and a side box. The chassis is located on the upper surface of the base box, and the side box is located on one side of the base box. A displacement mechanism is provided inside the chassis, and a transport mechanism is provided inside the side box. Multiple sets of slots of different sizes are provided inside the chassis. A venting box is provided inside the base box, and a through slot is opened on one side of the venting box. A venting pipe is provided in the through slot, and one end of the venting pipe extends from one side of the base box. The chassis, base box, and side boxes provide the mounting foundation for the entire wafer carrier, ensuring the stability and durability of the entire equipment and providing a clean environment for wafer storage. The displacement mechanism is used to adjust the height of the wafers inside the chassis, so that the centers of wafers of different sizes are on the same straight line, making it easier to remove the wafers during subsequent use. The transport mechanism is responsible for accurately delivering the wafers into the corresponding slots, ensuring that each wafer can be placed in a slot that matches its size. The ventilation box drives multiple sets of wedge blocks to move in the sliding groove through airflow.

[0007] The displacement mechanism includes multiple sets of limiting plates, with an arc-shaped plate positioned between two adjacent limiting plates. The slot is composed of two adjacent limiting plates and an arc-shaped plate. Fixing plates are located at the upper and lower ends of each limiting plate, respectively connecting to the upper inner wall of the chassis and the upper surface of the ventilation box. A mounting plate is located on one side of each limiting plate. The slot formed by the two limiting plates and the arc-shaped plate is used to accommodate wafers. The fixing plates at the upper and lower ends are used to fix the position of the limiting plates, and the mounting plate is used to fix multiple sets of suction nozzles.

[0008] The centers of the two limiting plates and the arc-shaped plate are located on the same horizontal line. The dimensions of the limiting plates and the arc-shaped plate are the same as the dimensions of the wafer. The dimensions of the limiting plates and the arc-shaped plate decrease sequentially along the direction from the insertion end of the vent pipe into the interior of the casing, with the dimensions of the limiting plates and the arc-shaped plate gradually changing in the middle section. The fact that the centers of the limiting plates and the arc-shaped plate are located on the same horizontal line ensures the stability and neatness of the wafers during storage, facilitating easy removal of the wafers for subsequent use. The size of the slots is designed according to the size of the wafers, enabling the device to store wafers of different sizes.

[0009] A pad is provided between two adjacent limiting plates. A wedge-shaped block is provided on the lower side of the pad. Multiple sets of sliding grooves are provided on the inner side of the vent box. The sliding grooves are located on the lower side of the two adjacent limiting plates. A wedge-shaped block is provided on the inner side of the sliding groove. The wedge-shaped block is slidably connected to the sliding groove. The shapes of the wedge-shaped block and the wedge-shaped block are matched. Vertical protrusions are provided on both sides of the sliding groove near the wedge-shaped block. The wedge-shaped block and the sliding groove are matched. The groove has a sliding connection with the protrusions. The pad is provided with a ramp. The wedge block two is provided with a spring two on the side away from the side box. The other end of the spring two is connected to the vent pipe. The vent pipe has a circular through groove on the side near the spring two. The vent pipe has an installation groove on the side of the pipe wall near the circular through groove. An electromagnet one is provided at the bottom of the installation groove. Two telescopic columns are provided on one side of the electromagnet one. An air blocking plate is provided on one side of the two telescopic columns. A spring three is sleeved on the outside of the two telescopic columns. The pad is used to support the bottom of the wafer. The shapes of wedge block one and wedge block two are matched to adjust the height of the pad. The pad is sloped so that the wafer will not rotate outward in the device, ensuring the stability of wafer storage. Spring two is used to absorb the elastic potential energy generated when wedge block two moves and can drive wedge block two back to its original position when the wafer is removed, so that the pad can also be reset, which is convenient for storing new wafers next time. The vent pipe pumps airflow into the sliding groove through the circular through groove, pushing wedge block two to move in the sliding groove and pushing wedge block two and the pad to move in the vertical direction. The size of the air blocking plate is larger than the size of the circular through groove, which is used to control whether air is vented into the sliding groove. The telescopic column is used to limit the movement direction of the air blocking plate. Spring three is used to push the air blocking plate to seal the circular through groove when electromagnet one is de-energized.

[0010] The second wedge has circular grooves on both sides near the sliding groove. An electromagnet is installed at the bottom of each groove, and a spring is installed on one side of the electromagnet. A limit pin is installed on one side of the spring. Multiple sets of limit holes are formed on the side of the sliding groove near the first wedge. The shape of the limit pin matches the shape of the limit holes. The dimensions of the first and second wedges increase sequentially from left to right. The air-blocking plate and the limit pin are magnetic. The second electromagnet controls the movement of the limit pin, and the spring pushes the limit pin to move when the second electromagnet is de-energized. The limit pin engages with the limit holes, thereby fixing the second wedge.

[0011] Two rotating drums are arranged inside the side box. A drive component one is located on the side of the side box away from the bottom box, situated on one side of the rotating drums. Conveyor belts are sleeved on the outer sides of the two rotating drums. Guide rails are arranged on both sides of the inner wall of the side box, and three sets of sliders one are arranged on each of the two guide rails. The sliders one are slidably connected to the guide rails. A drive component two is located on one side of each of the two guide rails. Drive component one provides rotational power to the rotating drums, thereby driving the conveyor belt to rotate. Drive component two is used to drive sliders one to move along the guide rails. Slider one provides a mounting base for the barrier plate and drive component three.

[0012] A barrier plate is positioned between two opposing sliders. The size of the barrier plate decreases from left to right, and the shape of the barrier plate is a semi-circular arc. The size of the barrier plate is smaller than that of the wafer to be stored. The barrier plate is used to classify the wafers by size, allowing wafers of different sizes to enter the slots corresponding to their own sizes.

[0013] The conveyor belt is equipped with a clamping plate, which is U-shaped. The inner walls of the clamping plate have protrusions on both sides. A second slider is located at the bottom of the clamping plate and is slidably connected to it. A first rotating plate is located on the upper side of the second slider. A third driving component is located at the upper end of the first slider, and its output end is connected to the first rotating plate. Two second rotating plates are located on the side of the clamping plate near the base. Multiple sets of first springs are installed on the inner walls of the first and second rotating plates, with rubber pads at the other ends of the springs. The two second rotating plates are rotatably connected to the clamping plate. The clamping plate provides the mounting base for the second slider and the second rotating plates. The first and second rotating plates cooperate to clamp wafers of different sizes. The first springs and the rubber pads ensure the stability of the wafers during clamping.

[0014] The chassis has a door on the side near the side enclosure. Multiple suction nozzles are located on the mounting plate near the slot. The vent pipe and suction nozzles are connected to an external air pump. Two position sensors (first type) are located on the inner walls of the chassis near the side enclosure, and two position sensors (second type) are located on the upper surface of the side enclosure away from the chassis. The two position sensors (first type) and two position sensors (second type) are electrically connected to the control system. The door prevents dust and other impurities from contaminating the wafers. The suction nozzles are used to absorb the wafers inside the chassis, ensuring stable wafer storage. Position sensors (first type) monitor the position of the wafers inside the chassis in real time. Position sensors (second type) monitor the position of the wafers on the side enclosure in real time.

[0015] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention uses a transport mechanism to accurately move wafers of different sizes to the storage slots of different wafers, and then pushes them into the slots for storage. This avoids misalignment, displacement, and skipping of wafers during transportation. In addition, the device is easy to operate, significantly reduces human intervention, and lowers the risk of wafer damage caused by human error, thereby further improving the quality of wafer storage.

[0016] 2. The present invention uses a displacement mechanism to move the wafers in the slots up and down, so that the centers of wafers of different sizes are located on a straight line at the same height, thereby ensuring the stability of the wafers during storage and transportation, and facilitating the convenience of subsequent wafer retrieval. This not only improves the adaptability of the wafer carrier, but also optimizes storage efficiency, enabling wafers of various sizes to be stored in an orderly manner in the same carrier. Attached Figure Description

[0017] Figure 1 This is a perspective view of the overall structure of the present invention; Figure 2 This is a perspective view of the box body and bottom box structure of the present invention; Figure 3 This is a perspective view of the internal structure of the housing of the present invention; Figure 4 This is a perspective view of the internal structure of the sliding groove of the present invention; Figure 5 This is a perspective view of the internal structure of the bottom box of the present invention; Figure 6 This is a cross-sectional view of the second wedge block of the present invention; Figure 7 For the present invention Figure 4 A magnified view of a portion of region A in the middle; Figure 8 This is a perspective view of the side box structure of the present invention; Figure 9 This is a perspective view of the transportation mechanism of the present invention.

[0018] In the diagram: 1. Chassis; 2. Base box; 3. Side box; 4. Displacement mechanism; 401. Limiting plate; 402. Arc plate; 403. Fixing plate; 404. Mounting plate; 405. Pad; 406. Wedge block one; 407. Wedge block two; 5. Transport mechanism; 501. Drive component one; 502. Rotary drum; 503. Drive component two; 504. Guide rail; 505. Conveyor belt; 506. Slider one; 507. Barrier plate; 508. Clamping plate 509. Drive component three; 510. Rotating plate one; 511. Slider two; 512. Spring one; 513. Rubber pad; 514. Rotating plate two; 6. Cabinet door; 7. Vent pipe; 8. Spring two; 9. Electromagnet one; 10. Telescopic column; 11. Spring three; 12. Air blocking plate; 13. Electromagnet two; 14. Spring four; 15. Limit pin; 16. Vent box; 17. Suction nozzle; 18. Position sensor one; 19. Position sensor two. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Please see Figure 1 - Figure 9 The present invention provides a technical solution: a wafer carrier with multi-size adaptability, including a chassis 1, a bottom box 2 and a side box 3. The chassis 1 is located on the upper surface of the bottom box 2, and the side box 3 is located on one side of the bottom box 2. A displacement mechanism 4 is provided inside the chassis 1, and a transport mechanism 5 is provided inside the side box 3. Multiple sets of slots of different sizes are provided inside the chassis 1. A venting box 16 is provided inside the bottom box 2. A through slot is opened on one side of the venting box 16, and a venting pipe 7 is provided in the through slot. One end of the venting pipe 7 extends out from one side of the bottom box 2. The chassis 1, base box 2, and side box 3 provide the mounting base for the entire wafer carrier, ensuring the stability and durability of the entire equipment and providing a clean environment for wafer storage. The displacement mechanism 4 is used to adjust the height of the wafers inside the chassis 1 so that the centers of wafers of different sizes are on the same straight line, making it easier to remove the wafers during subsequent use. The transport mechanism 5 is responsible for accurately delivering the wafers into the corresponding slots, ensuring that each wafer can be placed in a slot that matches its size. The ventilation box 16 drives multiple sets of wedge blocks 407 to move in the sliding groove through airflow.

[0021] The displacement mechanism 4 includes multiple sets of limiting plates 401. An arc-shaped plate 402 is disposed between two adjacent limiting plates 401. The slot is composed of two adjacent limiting plates 401 and an arc-shaped plate 402. Fixing plates 403 are respectively disposed at the upper and lower ends of the limiting plates 401. The fixing plates 403 at both ends are connected to the upper side of the inner wall of the chassis 1 and the upper end face of the ventilation box 16, respectively. A mounting plate 404 is disposed on one side of the limiting plate 401. The slot formed by the two limiting plates 401 and the arc-shaped plate 402 is used to accommodate the wafer. The fixing plates 403 at the upper and lower ends are used to fix the position of the limiting plates 401. The mounting plate 404 is used to fix multiple sets of suction nozzles 17.

[0022] The centers of the two limiting plates 401 and the arc-shaped plate 402 are located on the same horizontal line. The dimensions of the limiting plates 401 and the arc-shaped plate 402 are the same as the dimensions of the wafer. The dimensions of the limiting plates 401 and the arc-shaped plate 402 decrease sequentially along the direction from the insertion end of the vent pipe 7 into the interior of the bottom box 2, with the dimensions of the limiting plates 401 and the arc-shaped plate 402 gradually changing in the middle section. The fact that the centers of the limiting plates 401 and the arc-shaped plate 402 are located on the same horizontal line ensures the stability and neatness of the wafers during storage, facilitating easy removal of the wafers for subsequent use. The size of the slots is designed according to the size of the wafers, enabling the device to store wafers of different sizes.

[0023] A pad 405 is provided between two adjacent limiting plates 401. A wedge block 406 is provided on the lower side of the pad 405. Multiple sliding grooves are provided on the inner side of the vent box 16. The sliding grooves are located on the lower side of the two adjacent limiting plates 401. A wedge block 407 is provided on the inner side of the sliding groove. The wedge block 407 is slidably connected to the sliding groove. The shape of the wedge block 406 matches that of the wedge block 407. Vertical protrusions are provided on both sides of the sliding groove near the wedge block 406. The wedge block 406 matches the protrusions on the sliding groove. 406 is slidably connected to the protrusion on the sliding groove. A ramp is provided on the pad 405. A spring 8 is provided on the side of the wedge block 407 away from the side box 3. The other end of the spring 8 is connected to the vent pipe 7. A circular through groove is opened on the side of the vent pipe 7 near the spring 8. An installation groove is opened on the side of the vent pipe 7 near the wall of the circular through groove. An electromagnet 9 is provided at the bottom of the installation groove. Two telescopic columns 10 are provided on one side of the electromagnet 9. An air-blocking plate 12 is provided on one side of the two telescopic columns 10. A spring 11 is sleeved on the outside of the two telescopic columns 10. The pad 405 is used to support the bottom of the wafer. The shapes of the wedge block 1 406 and the wedge block 2 407 are matched to adjust the height of the pad 405. The pad 405 is provided with a slope so that the wafer will not rotate outward in the device, ensuring the stability of wafer storage. The spring 2 8 is used to absorb the elastic potential energy generated when the wedge block 2 407 moves, and can drive the wedge block 2 407 back to its original position when the wafer is taken out, so that the pad 405 can also be reset, which is convenient for storing new wafers next time. The vent pipe 7 pumps airflow into the sliding groove through the circular through slot, pushing the wedge block 2 407 to move in the sliding groove, and pushing the wedge block 2 407 and the pad 405 to move in the vertical direction. The size of the air blocking plate 12 is larger than the size of the circular through slot, and is used to control whether air is vented into the sliding groove. The telescopic column 10 is used to limit the movement direction of the air blocking plate 12. The spring 3 11 is used to push the air blocking plate 12 to block the circular through slot when the electromagnet 1 9 is de-energized.

[0024] Wedge block 2 407 has circular grooves on both sides near the sliding groove. Electromagnet 2 13 is installed at the bottom of each groove. Spring 4 14 is installed on one side of electromagnet 2 13, and a limit pin 15 is installed on one side of spring 4 14. Multiple sets of limit holes are opened on the side of the sliding groove near wedge block 1 406. The shape of the limit pin 15 matches the shape of the limit holes. The dimensions of wedge block 1 406 and wedge block 2 407 increase sequentially from left to right. The air-blocking plate 12 and the limit pin 15 are magnetic. Electromagnet 2 13 controls the movement of the limit pin 15. Spring 4 14 pushes the limit pin 15 to move when electromagnet 2 13 is de-energized. The limit pin 15 engages with the limit holes, thereby fixing wedge block 2 407.

[0025] Two rotating drums 502 are installed inside the side box 3. A drive component 501 is installed on the side of the side box 3 away from the bottom box 2. The drive component 501 is located on one side of the rotating drums 502. Conveyor belts 505 are sleeved on the outer sides of the two rotating drums 502. Guide rails 504 are installed on both sides of the inner wall of the side box 3. Three sets of sliders 506 are installed on each of the two guide rails 504. The sliders 506 are slidably connected to the guide rails 504. A drive component 503 is installed on one side of each of the two guide rails 504. The drive component 501 provides rotational power to the rotating drums 502, thereby driving the conveyor belt 505 to rotate. The drive component 503 is used to drive the sliders 506 to move along the guide rails 504. The sliders 506 provide the mounting base for the barrier plate 507 and the drive component 509.

[0026] A barrier plate 507 is disposed between two opposing sliders 506. The size of the barrier plate 507 decreases from left to right, and the shape of the barrier plate 507 is a semi-circular arc. The size of the barrier plate 507 is smaller than that of the wafer to be stored. The barrier plate 507 is used to classify the size of the wafers, so that wafers of different sizes can enter the slots corresponding to their own sizes.

[0027] A clamping plate 508 is provided on the conveyor belt 505. The clamping plate 508 is U-shaped. Protrusions are provided on both sides of the inner wall of the clamping plate 508. A slider 2 511 is provided at the bottom of the clamping plate 508. The slider 2 511 is slidably connected to the clamping plate 508. A rotating plate 1 510 is provided on the upper side of the slider 2 511. A driving component 3 509 is provided at the upper end of the slider 1 506. The output end of the driving component 3 509 is connected to the rotating plate 1 510. Two rotating plates 2 514 are provided on the side of the clamping plate 508 near the bottom box 2. Multiple sets of springs 1 512 are provided on the inner walls of the rotating plate 1 510 and the rotating plate 2 514. A rubber pad 513 is provided at the other end of the spring 1 512. The two rotating plates 2 514 are rotatably connected to the clamping plate 508. The clamping plate 508 provides a mounting base for the slider 2 511 and the rotating plate 2 514. The rotating plate 1 510 cooperates with the rotating plate 2 514 to clamp wafers of different sizes. The spring 1 512 and the rubber pad 513 ensure the stability of the wafer during the clamping process.

[0028] A cabinet door 6 is located on the side of the chassis 1 near the side enclosure 3. Multiple suction nozzles 17 are located on the side of the mounting plate 404 near the slot. The vent pipe 7 and the suction nozzles 17 are connected to an external air pump. Two position sensors 18 are located on both sides of the inner wall of the chassis 1 near the side enclosure 3, and two position sensors 19 are located on the upper surface of the side enclosure 3 away from the chassis 1. The two position sensors 18 and two position sensors 19 are electrically connected to the control system. The cabinet door 6 prevents external dust and other impurities from contaminating the wafers. The suction nozzles 17 are used to absorb the wafers inside the chassis 1, ensuring stable wafer storage. The position sensors 18 are used to monitor the position information of the wafers inside the chassis 1 in real time. The position sensors 19 are used to monitor the position information of the wafers on the side enclosure 3 in real time.

[0029] The working principle of this invention is as follows: When using this wafer carrier, the operator first opens the cabinet door 6 and places the wafer to be stored on the clamping plate 508. The control system controls the operation of the drive component 3 509, which pushes the rotating plate 1 510 to move towards the wafer side. The rubber pads 513 on the rotating plate 1 510 and the rotating plate 2 514 clamp the wafer. The spring 1 512 allows the rubber pads 513 to clamp the wafer at different angles. The drive component 2 503 drives the slider 1 506 along the guide rail. 504 moves, slider 1 506 drives the barrier plate 507 to move to the side of the slot that matches its size, drive component 2 503 stops operating, drive component 1 501 drives the rotating drum 502 to rotate, conveyor belt 505 drives the clamping plate 508 to move. When the wafer moves to the side of the barrier plate 507, if the wafer passes the barrier plate 507, it continues to move until the barrier plate 507 blocks the wafer. Drive component 3 509 drives the rotating plate 1 510 to move to the side of the chassis 1, moving the wafer onto the pad 405.

[0030] When the electromagnet 9 inside the vent pipe 7 near the pad 405 is energized, the electromagnet 9 attracts the air blocking plate 12 to move, the circular through hole on one side of the sliding groove opens, and the external air pump pumps airflow into the vent pipe 7, pushing the wedge block 407 to move along the sliding groove. The wedge block 407 pushes the wedge block 406 to move upward along the protrusion of the sliding groove. The wedge block 406 pushes the pad 405 to move upward. The wafer moves upward under the drive of the pad 405. When the position sensor 18 detects that the center of the wafer is on the same horizontal straight line as the center of the slot, the electromagnet 13 is de-energized, and the spring 14 pushes the limiting pin 15 inside the wedge block 407 to move outward. The limiting pin 15 enters the limiting hole and fixes the wedge block 407. The air pump stops running, and then the next wafer is stored.

[0031] After the wafer on the pad 405 is removed, the control system controls the electromagnet 2 13 to be energized. The electromagnet 2 13 attracts the limit pin 15 to the inside of the wedge block 2 407. The wedge block 2 407 returns to its original position under the pull of the spring 2 8. The wedge block 1 406 drives the pad 405 to return to its original position.

[0032] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A wafer carrier having a multi-size adaptive function, characterized by: Including the chassis (1), the bottom box (2) and the side box (3), the chassis (1) is located at the upper end surface of bottom box (2), the side box (3) is located at one side of bottom box (2), the inside of the chassis (1) is provided with displacement mechanism (4), the inside of the side box (3) is provided with transport mechanism (5), the inside of the chassis (1) is provided with multiple groups of different size slot, the inside of the bottom box (2) is provided with ventilation box (16), the ventilation box (16) one side is provided with through slot, the through slot is provided with ventilation pipe (7), the ventilation pipe (7) one end from the side of bottom box (2) extends.

2. The wafer carrier with multi-size adaptation function according to claim 1, wherein: The displacement mechanism (4) includes multiple groups of limit plate (401), two adjacent limit plate (401) is provided with arc plate (402), the slot is composed of two adjacent limit plate (401) and arc plate (402), the upper and lower ends of the limit plate (401) are provided with fixed plate (403) respectively, the fixed plate (403) of both ends is connected with the inner wall upper side of the chassis (1) and the upper end surface of the ventilation box (16) respectively, the limit plate (401) one side is provided with mounting plate (404).

3. The wafer carrier with the multi-size adaptation function according to claim 2, wherein: Two limit plate (401) and arc plate (402) center is located on the same horizontal line, the size of limit plate (401) and arc plate (402) is same with the size of wafer, the size of limit plate (401) and arc plate (402) gradually decreases along the direction of ventilation pipe (7) into the inside of bottom box (2), the size of limit plate (401) and arc plate (402) gradually changes in the middle part.

4. The wafer carrier with the multi-size adaptation function according to claim 3, wherein: Two adjacent limit plate (401) is provided with pad (405), the lower side of the pad (405) is provided with wedge block one (406), the inside of the ventilation box (16) is provided with multiple groups of sliding groove, the sliding groove is located at the lower side of two adjacent limit plate (401), the inside of the sliding groove is provided with wedge block two (407), the wedge block two (407) is connected with the sliding groove, the shape of wedge block one (406) and wedge block two (407) is matched, the both sides of the sliding groove close to the wedge block one (406) is provided with vertical protrusion, the wedge block one (406) is matched with the protrusion on the sliding groove, the wedge block one (406) is connected with the protrusion on the sliding groove, the wedge block one (406) is provided with slope, the side of the wedge block two (407) away from the side box (3) is provided with spring two (8), the other end of the spring two (8) is connected with the ventilation pipe (7), the side of the ventilation pipe (7) close to the spring two (8) is provided with circular through slot, the pipe wall side of the ventilation pipe (7) close to the circular through slot is provided with mounting slot, the bottom end of the mounting slot is provided with electromagnet one (9), the side of the electromagnet one (9) is provided with two telescopic columns (10), the side of the two telescopic columns (10) is provided with gas stop plate (12), the outside of the two telescopic columns (10) is sleeved with spring three (11).

5. The wafer carrier with multi-size adaptation function according to claim 4, wherein: The wedge block two (407) is provided with a circular groove near the two sides of the sliding groove, the bottom of the circular groove is provided with an electromagnet two (13), one side of the electromagnet two (13) is provided with a spring four (14), one side of the spring four (14) is provided with a limiting pin (15), a plurality of limiting holes are formed in the side of the sliding groove near the wedge block one (406), the shape of the limiting pin (15) is matched with the shape of the limiting hole, the sizes of the wedge block one (406) and the wedge block two (407) gradually increase from left to right, and the blocking plate (12) and the limiting pin (15) have magnetism.

6. The wafer carrier with the multi-size adaptation function according to claim 5, wherein: Two rotating drums (502) are arranged in the inner side of the side box (3), a driving component one (501) is arranged on the side, away from the bottom box (2), of the side box (3), the driving component one (501) is located on one side of the rotating drum (502), a conveying belt (505) is sleeved on the outer side of the two rotating drums (502), guide rails (504) are arranged on the inner walls of the side box (3) on both sides, three groups of sliding blocks one (506) are arranged on the two guide rails (504) respectively, the plurality of groups of sliding blocks one (506) are slidably connected with the guide rails (504), and driving component twos (503) are arranged on one side of the two guide rails (504) respectively.

7. The wafer carrier with the multi-size adaptation function according to claim 6, wherein: A blocking plate (507) is arranged between the two sliding blocks one (506), the size of the blocking plate (507) gradually decreases from left to right, the shape of the blocking plate (507) is in the shape of a semicircular arc, and the size of the blocking plate (507) is smaller than the wafer to be stored.

8. The wafer carrier with the multi-size adaptation function according to claim 7, wherein: A clamping plate (508) is arranged on the conveying belt (505), the shape of the clamping plate (508) is in the shape of a "U", protrusions are arranged on the inner walls of the clamping plate (508) on both sides, a sliding block two (511) is arranged on the bottom of the clamping plate (508), the sliding block two (511) is slidably connected with the clamping plate (508), a rotating plate one (510) is arranged on the upper side of the sliding block two (511), a driving component three (509) is arranged on the upper end of the sliding block one (506), the output end of the driving component three (509) is connected with the rotating plate one (510), two rotating plate twos (514) are arranged on the side, close to the bottom box (2), of the clamping plate (508), a plurality of spring ones (512) are arranged on one side of the rotating plate one (510) and the inner walls of the rotating plate two (514), rubber pads (513) are arranged on the other ends of the spring ones (512), and the two rotating plate twos (514) are rotatably connected with the clamping plate (508).

9. The wafer carrier with multi-size adaptation function according to claim 1 or 2, wherein: A cabinet door (6) is arranged on the side, close to the side box (3), of the case (1), a plurality of suction nozzles (17) are arranged on the side, close to the groove, of the mounting plate (404), the air pipe (7) and the suction nozzle (17) are connected with an external air pump, two position sensors one (18) are arranged on the inner walls of the case (1) on both sides, close to the side box (3), and two position sensors two (19) are arranged on the upper end face of the side box (3), away from the case (1), the two position sensors one (18) and the two position sensors two (19) are electrically connected with a control system.

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