High-cleanliness semiconductor wafer automatic loading equipment

Abstract

The invention discloses a high-cleanliness semiconductor wafer automatic loading device which comprises a lifting bearing table, a wafer filling box is borne on the surface of the lifting bearing table, a conveying device is arranged on one side of the lifting bearing table, the conveying device can convey machined wafer workpieces, and the wafer filling box is arranged on the other side of the lifting bearing table. A clamping structure is arranged on one side of the lifting bearing table through a transmission structure, the transmission structure can carry the clamping structure to move to the top of the transportation equipment and clamp and transport wafer workpieces transported on the surface of the transportation equipment, the lifting bearing table comprises a bearing plate, and the wafer filling box is inserted into the top of the bearing plate. Through a full-automatic system composed of the lifting bearing table, the transportation equipment and the clamping structure controlled through the transmission structure, manual operation is fundamentally abandoned, the production bottleneck problem of low loading efficiency is solved through mechanical automation, and meanwhile a structural foundation is laid for achieving the pollution-free and low-damage loading process.

Description

Technical Field

[0001] This invention relates to the field of semiconductor wafer processing technology, specifically to a high-cleanliness semiconductor wafer automatic loading device. Background Technology

[0002] Semiconductor wafers are the substrate material for manufacturing chips. The silicon used to manufacture wafers must be ultra-high purity electronic-grade silicon. Any tiny impurities can cause the chips on the entire wafer to fail. After the wafers are processed, they need to be installed into the wafer cassette for storage using loading equipment.

[0003] For example, patent application number 201910908155.8 published on the China Patent Network, entitled "A High-Cleanliness Semiconductor Wafer Automatic Loading Equipment," mainly consists of three parts: a sealing gate assembly, a wafer carrier assembly, and a frame assembly. The frame of the high-cleanliness semiconductor wafer automatic loading equipment is connected and fixed to the semiconductor process equipment. Wafer cassettes are placed on the wafer carrier assembly and automatically enter and exit the semiconductor process equipment through the sealing gate assembly. This high-cleanliness semiconductor wafer automatic loading equipment plays a fully automated role in ensuring wafers enter and exit the equipment in a high-cleanliness environment, guaranteeing that the wafers are not contaminated during the process, improving process standards, and increasing finished product yield.

[0004] However, the loading method of existing loading equipment is relatively simple. It requires manual pushing to push the wafers on the surface of the conveyor belt into the inside of the wafer box. Loading a whole box of wafers takes a long time, which becomes a bottleneck in the production process. Moreover, manually aligning each wafer with the narrow slots of different heights in the wafer box is very time-consuming and requires the operator to concentrate highly, which can easily lead to fatigue.

[0005] Secondly, when manually handling and pushing wafers, contaminants such as oil and dust particles from the skin can easily transfer to the wafer surface. In the semiconductor and photovoltaic industries, even nanoscale particles are enough to cause product scrap. Wafers are very fragile, and uneven force or angle deviation during manual operation can easily lead to wafer bending, cracking, or edge chipping.

[0006] Therefore, it is necessary to redesign and modify the high-cleanliness semiconductor wafer automated loading equipment. Summary of the Invention

[0007] To address the problems mentioned in the background art, the present invention aims to provide a high-cleanliness semiconductor wafer automatic loading device, which has the advantages of improving loading efficiency and ensuring wafer loading qualification rate.

[0008] To achieve the above objectives, the present invention provides the following technical solution: a high-cleanliness semiconductor wafer automatic loading device, including a lifting support platform; The surface of the lifting platform carries a wafer loading box. A transport device is provided on one side of the lifting platform. The transport device can transport the processed wafer workpieces. A clamping structure is provided on one side of the lifting platform through a transmission structure. The transmission structure can carry the clamping structure to the top of the transport device and clamp and transport the wafer workpieces transported on the surface of the transport device.

[0009] In a preferred embodiment of the present invention, the lifting platform includes a support plate, the wafer loading cassette is inserted into the top of the support plate, a base is provided at the bottom of the support plate, and guide rods are fixedly connected to both sides of the top of the base. The end of the guide rod away from the base passes through the support plate and extends to the top of the support plate. A top cover is fixedly connected to the top of the guide rod. The support plate and the guide rod are slidably connected. A lifting structure is provided between the top cover and the base. The lifting structure can control the vertical lifting of the support plate and make the insertion slots inside the wafer loading cassette on its surface correspond sequentially with the transport equipment. The clamping structure is installed on one side of the top cover through a transmission structure.

[0010] As a preferred embodiment of the present invention, the lifting structure includes a screw that is movably connected between the top cover and the base via bearings. The screws rotate in the same direction. The bearing plate is sleeved on the surface of the screw and threadedly connected to the screw. Synchronous motors are fixedly connected to both sides of the top of the top cover. The output end of the synchronous motor passes through the top cover and is fixedly connected to the top end of the screw. The synchronous motor can drive the screw to rotate and use the thread to push the bearing plate to lift vertically.

[0011] In a preferred embodiment of the present invention, the clamping structure includes limiting rods disposed at both ends of the front side of the top cover. Each end of the limiting rod is fixedly connected to a vertical plate. The vertical plate near the top cover is fixedly connected to the top cover. A support plate is slidably connected to the surface of the limiting rod. A transverse rod is fixedly connected to the inner side of the support plate. An extension frame is slidably connected to both sides of the surface of the transverse rod. The end of the extension frame away from the transverse rod extends to the top of the transport equipment. A jaw is fixedly connected to the inner side of the extension frame. The jaws are located on both sides of the wafer workpiece at the top of the transport equipment. The extension frame can drive the jaws to move towards each other on the surface of the transverse rod and clamp the wafer workpiece after displacement to the inward side. The transmission structure can drive the transverse rod to move horizontally, causing the jaws carrying the wafer workpiece to reciprocate between the transport equipment and the wafer loading cassette.

[0012] As a preferred embodiment of the present invention, the transmission structure includes a transmission motor fixedly connected to the right side of the upright plate, a lead screw fixedly connected to the output end of the transmission motor, the end of the lead screw away from the transmission motor passing through the upright plate and movably connected to the upright plate through a bearing, a threaded sleeve connected to the surface of the lead screw, the threaded sleeve being sleeved on the surface of the transverse rod and fixedly connected to the transverse rod, and when the transmission motor drives the lead screw to rotate, the thread on the surface of the lead screw can be used to control the threaded sleeve to carry the transverse rod to slide displacement on the surface of the limiting rod.

[0013] In a preferred embodiment of the present invention, a fork is fixedly connected to the inner side of the upright plate. Both ends of the fork are inclined outwards, and the middle part of the fork is parallel to the limiting rod. A movable block is fixedly connected to the top of the extension frame. The movable block extends to the bottom of the fork from the side away from the extension frame and is fixedly connected to a push rod located inside the fork. The push rod is slidably connected to the fork. When the transmission structure controls the extension frame to follow the displacement of the transverse rod, the push rod at the top of the extension frame slides inside the fork and automatically controls the jaws to open when it moves to the inclined parts at both ends of the fork, so that the jaws disengage from the clamping state of the wafer workpiece.

[0014] As a preferred embodiment of the present invention, the inner side of the extension frame is movably connected to a swing arm sleeved on the surface of the transverse rod via a bearing. The extension frame can carry the swing arm and synchronously adjust the spacing on the surface of the transverse rod during sliding displacement. The side of the swing arm away from the transverse rod extends to the right side of the wafer workpiece. The swing arm can swing around the transverse rod as the axis and push the wafer workpiece inside the chuck to move continuously to the left.

[0015] In a preferred embodiment of the present invention, both ends of the left vertical plate are fixedly connected to transmission rods located on both sides of the lead screw. The end of the swing arm near the transverse rod is fixedly connected to a sleeve plate fitted onto the surface of the transverse rod. The side of the transmission rod away from the vertical plate extends to the inner side of the sleeve plate. The side of the transmission rod away from the vertical plate is fixedly connected to a force-bearing rod located on the left side of the sleeve plate. When the sleeve plate moves horizontally a certain distance with the transverse rod, it can contact the force-bearing rod. When the force-bearing rod contacts the sleeve plate, it can squeeze the sleeve plate to drive the swing arm to swing around the transverse rod as the axis.

[0016] As a preferred embodiment of the present invention, each of the four corners of the top of the carrier plate is fixedly connected to a limiting plate, and the side of the limiting plate away from the carrier plate extends to the outside of the wafer filling box and is interlocked with the wafer filling box.

[0017] As a preferred embodiment of the present invention, the following steps are included: Preparation and Retrieval: Secure the wafer loading cassette inside the limiting plate on top of the support plate. Start the synchronous motor on top of the lifting platform, driving the screw to rotate, causing the support plate to descend vertically along the guide rod until the empty slot at the top of the wafer loading cassette is at the same precise horizontal level as the wafer delivered by the transport equipment. Simultaneously, the clamping structure above the conveyor belt is in standby mode; the push rod at the top of its extension frame is located on the inclined portion at the right end of the fork, keeping the jaws open. When the transport equipment delivers a processed wafer to the predetermined position directly below the jaws, the drive motor fixed to the vertical plate starts, driving the lead screw to rotate, moving the transverse rod and the entire clamping structure toward the wafer. During this process, the push rod slides from the inclined portion of the fork into the parallel portion, losing its outward pulling force, and the two extension frames move towards each other, causing the jaws to firmly clamp the wafer workpiece. Translation and Insertion: After clamping, the drive motor continues to operate, driving the lead screw to move the entire clamping structure and wafer horizontally, transferring them from above the transport equipment to the front of the wafer loading cassette, and precisely aligning the wafer with the target slot. In the final insertion stage, the drive motor makes a slight movement, pushing the structure forward, causing the push rod to contact and slide into the inclined part at the front of the fork again, forcing the extension frame to move in opposite directions, and the chuck opens, initially releasing the wafer into the slot entrance. At the same time, a sophisticated linkage mechanism is triggered: the sleeve at one end of the swing arm contacts the fixed force rod during movement, and after being obstructed, it forces the swing arm to swing gently, gently pushing the wafer completely into the bottom of the slot from the side; Reset and Cycle: After loading one wafer, the equipment automatically resets immediately. The drive motor reverses, driving the lead screw to move the empty clamping structure containing the released wafer back above the transport equipment, ready for the next operation. Simultaneously, the synchronous motor of the lifting platform restarts, driving the screw to rotate, causing the carrier plate carrying the wafer loading cassette to descend precisely by one slot spacing.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. This invention, through a fully automatic system consisting of a lifting platform, a transport device, and a clamping structure controlled by a transmission structure, fundamentally eliminates manual operation and solves the production bottleneck problem of low loading efficiency by utilizing mechanical automation. At the same time, it lays the structural foundation for achieving a pollution-free and low-damage loading process.

[0019] 2. This invention, through the combination of a support plate, guide rod, top cover and base, constitutes a stable and precisely guided vertical lifting platform. The guide rod ensures that the support plate and the wafer loading box on it can only move vertically, avoiding any horizontal deviation. This provides a crucial guarantee for the subsequent clamping structure to accurately align with each slot of the wafer box, realizing rapid and accurate positioning of slots of different heights.

[0020] 3. This invention provides a high-precision and stable driving method by using screws and synchronous motors. The synchronous motor can ensure that the screws on both sides rotate completely synchronously. The rotational motion of the motor is converted into the linear motion of the bearing plate through thread transmission. The control precision is extremely high, and it can easily achieve the precise descent of "one slot spacing", thereby ensuring the continuity of the production process and the repeatability of the positioning accuracy.

[0021] 4. By setting up a clamping structure, the present invention provides a robotic arm mechanism that can actively clamp and release wafers. The sliding extension frame on the transverse rod drives the claws to move towards each other, which can stably and evenly clamp the wafers, avoiding the risk of contamination and uneven force caused by direct contact with human hands. This structure provides a solution for the safe handling of wafers between transport equipment and wafer cassettes.

[0022] 5. The present invention drives the lead screw to rotate via a transmission motor, which in turn drives the threaded sleeve fixed to the transverse rod to move horizontally. This transmission method is stable, precise and controllable, and can ensure that the clamping structure reciprocates accurately between the material picking and unloading positions.

[0023] 6. This invention controls the opening and closing of the pawls through a shift fork mechanism, mechanically linking the clamping and releasing actions of the pawls with the horizontal movement of the transverse rod. The push rod slides within the fixed inclined plane of the shift fork, automatically converting the horizontal movement into the opening and closing actions of the pawls by utilizing the principle of the inclined plane.

[0024] 7. By setting a swing arm, the present invention can provide a gentle lateral push to the wafer, ensuring that it is fully inserted into the slot. By using automatic and force-controllable correction action, the success rate and reliability of loading are greatly improved.

[0025] 8. By setting up a force-bearing rod and a sleeve plate, the present invention enables the sleeve plate to strike the force-bearing rod during the final advancement of the clamping structure, forcing the swing rod to swing. This saves the operation steps of setting up additional drive equipment and greatly improves the stability and automation effect of the structure.

[0026] 9. This invention improves the stability of the wafer box on the carrier plate by adding a limiting plate structure. The limiting plates at the four corners are inserted into the outside of the wafer box to prevent it from shaking or shifting during frequent lifting and lowering movements, thus further ensuring the accuracy and safety of the entire loading process. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a top view of the structure of the present invention; Figure 3 This is a schematic diagram of the lifting support platform structure of the present invention; Figure 4 This is a top view of the clamping structure of the present invention; Figure 5 This is a schematic front view of the clamping structure of the present invention; Figure 6 This is a schematic diagram of the transmission structure of the present invention; Figure 7 This is a partial structural diagram of the present invention; Figure 8 For the present invention Figure 4 Enlarged structural diagram at point A in the middle.

[0028] In the diagram: 1. Lifting platform; 2. Wafer loading box; 3. Transport equipment; 4. Transmission structure; 5. Clamping structure; 6. Bearing plate; 7. Base; 8. Guide rod; 9. Top cover; 10. Lifting structure; 11. Screw; 12. Synchronous motor; 13. Limiting rod; 14. Vertical plate; 15. Support plate; 16. Horizontal movement rod; 17. Extension frame; 18. Claw; 19. Drive motor; 20. Lead screw; 21. Screw sleeve; 22. Shift fork; 23. Movable block; 24. Push rod; 25. Swing rod; 26. Transmission rod; 27. Sleeve plate; 28. Force-bearing rod; 29. ​​Limiting plate. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] like Figures 1 to 8 As shown, the present invention provides a high-cleanliness semiconductor wafer automatic loading device, including a lifting support platform 1; The surface of the lifting platform 1 carries the wafer loading box 2. A transport device 3 is provided on one side of the lifting platform 1. The transport device 3 can transport the processed wafer workpiece. A clamping structure 5 is provided on one side of the lifting platform 1 through the transmission structure 4. The transmission structure 4 can carry the clamping structure 5 to the top of the transport device 3 and clamp and transport the wafer workpiece transported on the surface of the transport device 3.

[0031] refer to Figure 2The lifting platform 1 includes a support plate 6, a wafer filling box 2 inserted into the top of the support plate 6, a base 7 at the bottom of the support plate 6, and guide rods 8 fixedly connected to both sides of the top of the base 7. The end of the guide rod 8 away from the base 7 passes through the support plate 6 and extends to the top of the support plate 6. A top cover 9 is fixedly connected to the top of the guide rod 8. The support plate 6 and the guide rod 8 are slidably connected. A lifting structure 10 is provided between the top cover 9 and the base 7. The lifting structure 10 can control the vertical lifting of the support plate 6 and make the insertion slot inside the wafer filling box 2 on its surface correspond to the transport equipment 3 in sequence. The clamping structure 5 is installed on one side of the top cover 9 through the transmission structure 4.

[0032] As a technical optimization of the present invention, a stable and precisely guided vertical lifting platform is formed by combining the support plate 6, guide rod 8, top cover 9 and base 7. The guide rod 8 ensures that the support plate 6 and the wafer loading box 2 on it can only move vertically, avoiding any horizontal deviation. This provides a crucial guarantee for the subsequent clamping structure 5 to accurately align with each slot of the wafer box, realizing the rapid and accurate positioning of slots of different heights.

[0033] refer to Figure 3 The lifting structure 10 includes a screw 11 that is movably connected between the top cover 9 and the base 7 via bearings. The screw 11 rotates in the same direction. The bearing plate 6 is sleeved on the surface of the screw 11 and threadedly connected to the screw 11. Synchronous motors 12 are fixedly connected to both sides of the top of the top cover 9. The output end of the synchronous motor 12 passes through the top cover 9 and is fixedly connected to the top of the screw 11. The synchronous motor 12 can drive the screw 11 to rotate and use the thread to push the bearing plate 6 to lift vertically.

[0034] As a technical optimization of the present invention, a high-precision and stable driving method is provided by using screw 11 and synchronous motor 12 for driving. Synchronous motor 12 can ensure that the screws 11 on both sides rotate completely synchronously. The rotational motion of the motor is converted into the linear motion of the bearing plate 6 through thread transmission. The control precision is extremely high, and it can easily achieve the precise descent of "one slot spacing", thereby ensuring the continuity of the production process and the repeatability of the positioning accuracy.

[0035] refer to Figure 7The clamping structure 5 includes limiting rods 13 at both ends of the front side of the top cover 9. Both ends of the limiting rods 13 are fixedly connected to upright plates 14. The upright plate 14 near the top cover 9 is fixedly connected to the top cover 9. A support plate 15 is slidably connected to the surface of the limiting rods 13. A transverse rod 16 is fixedly connected to the inner side of the support plate 15. An extension frame 17 is slidably connected to both sides of the surface of the transverse rod 16. The end of the extension frame 17 away from the transverse rod 16 extends to the top of the transport device 3. A jaw 18 is fixedly connected to the inner side of the extension frame 17. The jaw 18 is located on both sides of the wafer workpiece at the top of the transport device 3. The extension frame 17 can drive the jaw 18 to move towards each other on the surface of the transverse rod 16 and clamp the wafer workpiece after displacement to the inward side. The transmission structure 4 can drive the transverse rod 16 to move horizontally, so that the jaw 18 carrying the wafer workpiece moves back and forth between the transport device 3 and the wafer loading box 2.

[0036] As a technical optimization of the present invention, by setting the clamping structure 5, a robotic arm mechanism capable of actively clamping and releasing is provided. The sliding extension frame 17 on the transverse rod 16 drives the claws 18 to move towards each other, which can stably and evenly clamp the wafer, avoiding the risk of contamination and uneven force caused by direct contact with human hands. This structure provides a solution for the safe handling of wafers between the transport equipment 3 and the wafer box.

[0037] refer to Figure 6 The transmission structure 4 includes a transmission motor 19 fixedly connected to the right side of the vertical plate 14. The output end of the transmission motor 19 is fixedly connected to a lead screw 20. The end of the lead screw 20 away from the transmission motor 19 passes through the vertical plate 14 and is movably connected to the vertical plate 14 through a bearing. A threaded sleeve 21 is threaded onto the surface of the lead screw 20. The threaded sleeve 21 is sleeved on the surface of the transverse rod 16 and fixedly connected to the transverse rod 16. When the transmission motor 19 drives the lead screw 20 to rotate, the thread on the surface of the lead screw 20 can be used to control the threaded sleeve 21 to carry the transverse rod 16 to slide displacement on the surface of the limiting rod 13.

[0038] As a technical optimization of the present invention, the lead screw 20 is driven to rotate by the transmission motor 19, which drives the screw sleeve 21 fixed to the transverse rod 16 to move horizontally. This transmission method is stable, precise and controllable, and can ensure that the clamping structure 5 reciprocates accurately between the material picking and discharging positions.

[0039] refer to Figure 4A fork 22 is fixedly connected to the inner side of the upright plate 14. Both ends of the fork 22 are set to be inclined outward. The middle part of the fork 22 is set to be parallel to the limiting rod 13. A movable block 23 is fixedly connected to the top of the extension frame 17. The side of the movable block 23 away from the extension frame 17 extends to the bottom of the fork 22 and is fixedly connected to a push rod 24 located inside the fork 22. The push rod 24 is slidably connected to the fork 22. When the transmission structure 4 controls the extension frame 17 to move with the transverse rod 16, the push rod 24 at the top of the extension frame 17 slides inside the fork 22 and automatically controls the chuck 18 to open when it moves to the inclined part at both ends of the fork 22, so that the chuck 18 is disengaged from the clamping state of the wafer workpiece.

[0040] As a technical optimization of the present invention, the opening and closing of the pawl 18 is controlled by the fork 22 mechanism, and the clamping and releasing action of the pawl 18 is mechanically linked with the horizontal movement of the transverse rod 16. The push rod 24 slides in the inclined plane of the fixed fork 22, and the horizontal movement is automatically converted into the opening and closing action of the pawl 18 by utilizing the inclined plane principle.

[0041] refer to Figure 5 The inner side of the extension frame 17 is movably connected to a swing arm 25 sleeved on the surface of the transverse rod 16 via a bearing. The extension frame 17 can carry the swing arm 25 to synchronously adjust the spacing on the surface of the transverse rod 16 during sliding displacement. The side of the swing arm 25 away from the transverse rod 16 extends to the right side of the wafer workpiece. The swing arm 25 can swing around the transverse rod 16 as the axis and push the wafer workpiece inside the chuck 18 to move continuously to the left.

[0042] As a technical optimization of the present invention, by setting the swing arm 25, a gentle lateral push can be applied to the wafer to ensure that it is fully inserted into the slot. By using automatic and force-controllable correction action, the success rate and reliability of loading are greatly improved.

[0043] refer to Figure 5 Both ends of the left vertical plate 14 are fixedly connected to transmission rods 26 located on both sides of the lead screw 20. The end of the swing rod 25 near the transverse rod 16 is fixedly connected to a sleeve plate 27 sleeved on the surface of the transverse rod 16. The side of the transmission rod 26 away from the vertical plate 14 extends to the inside of the sleeve plate 27. The side of the transmission rod 26 away from the vertical plate 14 is fixedly connected to a force rod 28 located on the left side of the sleeve plate 27. When the sleeve plate 27 moves horizontally a certain distance with the transverse rod 16, it can contact the force rod 28. When the force rod 28 contacts the sleeve plate 27, it can squeeze the sleeve plate 27 to drive the swing rod 25 to swing around the transverse rod 16 as the axis.

[0044] As a technical optimization of the present invention, by setting the force-bearing rod 28 and the sleeve plate 27, the sleeve plate 27 can strike the force-bearing rod 28 during the final advancement of the clamping structure 5, forcing the swing rod 25 to swing, saving the operation steps of setting up additional drive equipment, and greatly improving the structural operation stability and automation effect.

[0045] refer to Figure 2 Each of the four corners of the top of the support plate 6 is fixedly connected to a limiting plate 29. The side of the limiting plate 29 away from the support plate 6 extends to the outside of the wafer filling box 2 and is interlocked with the wafer filling box 2.

[0046] As a technical optimization of the present invention, the stability of the wafer box on the carrier plate 6 is improved by adding a limiting plate 29 structure. The limiting plates 29 at the four corners are inserted into the outside of the wafer box to prevent it from shaking or shifting during frequent lifting and lowering movements, thereby further ensuring the accuracy and safety of the entire loading process.

[0047] refer to Figure 1 A method for using a high-cleanliness semiconductor wafer automated loading device includes the following steps: Preparation and Retrieval: The wafer loading cassette 2 is placed inside the limiting plate 29 on top of the support plate 6 for fixation. The synchronous motor 12 on top of the lifting support platform 1 is started, driving the screw 11 to rotate, causing the support plate 6 to descend vertically along the guide rod 8 until the empty slot at the top of the wafer loading cassette 2 is at the same precise horizontal height as the wafer delivered by the transport equipment 3. At the same time, the clamping structure 5 located above the conveyor belt is in standby mode; the push rod 24 at the top of its extension frame 17 is located at the inclined part of the right end of the shift fork 22, keeping the jaws 18 open. When the transport equipment 3 delivers a processed wafer to the predetermined position directly below the jaws 18, the drive motor 19 fixed to the vertical plate 14 is started, driving the lead screw 20 to rotate, which in turn moves the transverse rod 16 and the entire clamping structure 5 toward the wafer. During this process, the push rod 24 slides from the inclined part of the shift fork 22 into the parallel part, losing the outward pulling force, and the two extension frames 17 move toward each other, causing the jaws 18 to firmly clamp the wafer workpiece; Translation and Insertion: After clamping, the drive motor 19 continues to operate, driving the lead screw 20 to move the entire clamping structure 5 and the wafer horizontally, transferring them from above the transport device 3 to the front of the wafer loading cassette 2, and precisely aligning the wafer with the target slot. In the final insertion stage, the drive motor 19 makes a slight movement, pushing the structure forward, causing the push rod 24 to contact and slide into the inclined part at the front end of the fork 22 again, forcing the extension frame 17 to move in opposite directions, and the chuck 18 to open, initially releasing the wafer into the slot entrance. At the same time, a sophisticated linkage mechanism is triggered: the sleeve 27 at one end of the swing arm 25 contacts the fixed force rod 28 during movement, and after being blocked, it forces the swing arm 25 to swing gently, gently pushing the wafer completely into the bottom of the slot from the side; Reset and Cycle: After loading one wafer, the equipment immediately and automatically resets. The drive motor 19 reverses, driving the lead screw 20 to move the empty clamping structure 5, which has released the wafer, back above the transport equipment 3, ready for the next operation. At the same time, the synchronous motor 12 of the lifting platform 1 starts again, driving the screw 11 to rotate, so that the carrier plate 6 carrying the wafer loading box 2 descends precisely by one slot spacing.

[0048] The working principle and usage process of this invention are as follows: First, the wafer loading cassette 2 is inserted into the inner side of the limiting plate 29 on the top of the support plate 6. Then, the synchronous motor 12 on the top of the lifting support platform 1 is started, driving the screw 11 to rotate, so that the support plate 6 descends vertically along the guide rod 8. This ensures that the uppermost empty slot of the wafer loading cassette 2 placed on the top of the support plate 6 is at the same precise horizontal height as the wafer conveyed by the transport device 3. At the same time, the clamping structure 5 located above the transport device 3 is in place. This structure consists of a transverse rod 16, an extension frame 17 slidably connected to it, and a claw 18 fixed inside the extension frame 17. In the initial position, the push rod 24 on the top of the extension frame 17 is fixed on the upright plate 14. The inclined portion of the right end of the fixed-connection fork 22 keeps the chuck 18 in an open state, ready to grip the wafer. When a finished wafer is precisely transported by the transport device 3 to the predetermined position directly below the chuck 18, the transmission structure 4 is activated, and the transmission motor 19 fixed to the vertical plate 14 starts working, driving the lead screw 20 to rotate. The threaded sleeve 21, which is threaded to the lead screw 20, then drives the transverse rod 16 and the entire clamping structure 5 to move towards the transport device 3. During this movement, the push rod 24 fixed to the top of the extension frame 17 slides from the inclined portion of the fork 22 into its parallel middle portion. The push rod 24 loses its outward pulling force, and the two extension frames 17 on both sides move towards each other, causing the chuck 18 to steadily grip the wafer. Clamping the wafer workpiece, as the drive motor 19 continues to rotate, the drive screw 20 drives the screw sleeve 21, the transverse rod 16, and the clamped wafer to move horizontally, transferring them from above the transport device 3 to the right front of the wafer loading cassette 2, and precisely aligning the wafer with the current empty slot. In the final insertion and release phase, the push rod 24 contacts and slides into the inclined part at the front end of the shift fork 22, forcing the extension frames 17 on both sides to move in opposite directions. The chuck 18 then opens, releasing the wafer slightly into the slot entrance. At the same time, the swing rod 25 fixed to the extension frame 17, with its sleeve 27 at one end, contacts and impacts the force rod 28 fixed to the vertical plate 14 during the forward movement of the transverse rod 16. The obstructed sleeve 27 forces... The swing arm 25 is slightly oscillated around the connection point with the transverse rod 16, gently pushing the wafer completely into the bottom of the slot from the side, ensuring proper and thorough placement. After loading one wafer, the equipment immediately and automatically resets. The drive motor 19 drives the lead screw 20 to move the empty clamping structure 5 back above the transport equipment 3 to prepare for the next operation. At the same time, the synchronous motor 12 of the lifting platform 1 starts again, driving the screw 11 to rotate, so that the carrier plate 6 carries the wafer loading box 2 and precisely descends one slot's distance. The process is automatic and cyclical until all slots in the wafer loading box 2 are filled in sequence. No manual intervention is required throughout the process, achieving efficient and non-destructive automated production under high cleanliness.

[0049] In summary, this high-cleanliness semiconductor wafer automatic loading equipment, through a fully automatic system consisting of a lifting platform 1, a transport device 3, and a clamping structure 5 controlled by a transmission structure 4, fundamentally eliminates manual operation and solves the production bottleneck problem of low loading efficiency by utilizing mechanical automation. At the same time, it lays the structural foundation for achieving a pollution-free and low-damage loading process.

[0050] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0051] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-cleanliness semiconductor wafer automatic loading equipment, comprising a lifting bearing table (1); characterized in that The surface of the lifting bearing table (1) bears a wafer filling box (2), one side of the lifting bearing table (1) is provided with a conveying device (3), the conveying device (3) can convey the finished wafer workpiece, one side of the lifting bearing table (1) is provided with a clamping structure (5) through a transmission structure (4), the transmission structure (4) can carry the clamping structure (5) to displace to the top of the conveying device (3) and clamp and convey the wafer workpiece conveyed on the surface of the conveying device (3).

2. The high-cleanliness semiconductor wafer auto-loading apparatus according to claim 1, wherein: The lifting bearing table (1) comprises a bearing plate (6), the wafer filling box (2) is inserted on the top of the bearing plate (6), the bottom of the bearing plate (6) is provided with a base (7), both sides of the top of the base (7) are fixedly connected with guide rods (8), one end of the guide rod (8) away from the base (7) penetrates through the bearing plate (6) and extends to the top of the bearing plate (6), the top of the guide rod (8) is fixedly connected with a top cover (9), the bearing plate (6) and the guide rod (8) are slidingly connected, a lifting structure (10) is arranged between the top cover (9) and the base (7), the lifting structure (10) can control the vertical lifting of the bearing plate (6) and make the inserted slot in the wafer filling box (2) on the surface of the bearing plate (6) correspond to the conveying device (3) in turn, the clamping structure (5) is installed on one side of the top cover (9) through the transmission structure (4).

3. The high-cleanliness semiconductor wafer auto-loading apparatus according to claim 2, wherein: The lifting structure (10) comprises a screw rod (11) movably connected between the top cover (9) and the base (7) through bearings, the rotation directions of the screw rods (11) are the same, the bearing plate (6) is sleeved on the surface of the screw rod (11) and is threadedly connected with the screw rod (11), both sides of the top of the top cover (9) are fixedly connected with synchronous motors (12), the output ends of the synchronous motors (12) penetrate through the top cover (9) and are fixedly connected with the top ends of the screw rods (11), the synchronous motors (12) can drive the screw rods (11) to rotate and vertically lift the bearing plate (6) by utilizing threads.

4. The high-cleanliness semiconductor wafer auto-loading apparatus according to claim 3, wherein: The clamping structure (5) comprises limiting rods (13) arranged at both ends of the front side of the top cover (9), both ends of each limiting rod (13) is fixedly connected with a vertical plate (14), the vertical plate (14) near one end of the top cover (9) is fixedly connected with the top cover (9), the surface of the limiting rod (13) is slidably connected with a supporting plate (15), the inner side of the supporting plate (15) is fixedly connected with a horizontal moving rod (16), both sides of the surface of the horizontal moving rod (16) is slidably connected with an extension frame (17), one end of the extension frame (17) away from the horizontal moving rod (16) extends to the top of the conveying device (3), the inner side of the extension frame (17) is fixedly connected with a clamping jaw (18), the clamping jaw (18) is located at both sides of the wafer workpiece on the top of the conveying device (3), the extension frame (17) can drive the clamping jaw (18) to move towards each other on the surface of the horizontal moving rod (16) and clamp the wafer workpiece after moving inward, the transmission structure (4) can drive the horizontal moving rod (16) to move horizontally, so that the clamping jaw (18) carrying the wafer workpiece moves back and forth between the conveying device (3) and the wafer loading box (2).

5. The high-cleanliness semiconductor wafer auto-loading apparatus according to claim 4, wherein: The transmission structure (4) comprises a transmission motor (19) fixedly connected to the right side of the vertical plate (14), the output end of the transmission motor (19) is fixedly connected with a lead screw (20), one end of the lead screw (20) away from the transmission motor (19) penetrates through the vertical plate (14) and is movably connected with the vertical plate (14) through a bearing, the surface of the lead screw (20) is threadedly connected with a sleeve (21), the sleeve (21) is sleeved on the surface of the horizontal moving rod (16) and is fixedly connected with the horizontal moving rod (16), when the transmission motor (19) drives the lead screw (20) to rotate, the sleeve (21) carrying the horizontal moving rod (16) can be controlled to slide on the surface of the limiting rod (13) by the threads on the surface of the lead screw (20).

6. The high-cleanliness semiconductor wafer auto-loading apparatus according to claim 5, wherein: The inner side of the vertical plate (14) is fixedly connected with a fork (22), both ends of the fork (22) are arranged in an outwardly inclined manner, the middle part of the fork (22) is arranged in a mutually parallel state with the limiting rod (13), the top of the extension frame (17) is fixedly connected with a movable block (23), one side of the movable block (23) away from the extension frame (17) extends to the bottom of the fork (22) and is fixedly connected with a push rod (24) located in the fork (22), the push rod (24) is slidably connected with the fork (22), when the transmission structure (4) controls the extension frame (17) to displace along with the horizontal moving rod (16), the push rod (24) at the top of the extension frame (17) slides in the fork (22) and automatically controls the clamping jaw (18) to open when moving to the inclined parts at both ends of the fork (22), so that the clamping jaw (18) is released from the clamping state of the wafer workpiece.

7. The high-cleanliness semiconductor wafer auto-loading apparatus according to claim 6, wherein: The inner side of the extension frame (17) is movably connected with a swing lever (25) sleeved on the surface of the transverse moving rod (16) through a bearing, the extension frame (17) can carry the swing lever (25) to adjust the interval synchronously on the surface of the transverse moving rod (16) when sliding, the side away from the transverse moving rod (16) of the swing lever (25) extends to the right side of the wafer workpiece, and the swing lever (25) can swing around the transverse moving rod (16) and push the wafer workpiece on the inner side of the clamping jaw (18) to continuously move to the left side.

8. The high-cleanliness semiconductor wafer auto-loading apparatus according to claim 7, wherein: Both ends of the surface of the left vertical plate (14) are fixedly connected with transmission rods (26) located on both sides of the screw rod (20), one end of the swing lever (25) close to the transverse moving rod (16) is fixedly connected with a sleeve plate (27) sleeved on the surface of the transverse moving rod (16), the side away from the vertical plate (14) of the transmission rod (26) extends to the inner side of the sleeve plate (27), the side away from the vertical plate (14) of the transmission rod (26) is fixedly connected with a force receiving rod (28) located on the left side of the sleeve plate (27), the sleeve plate (27) can contact the force receiving rod (28) when moving horizontally with the transverse moving rod (16) for a distance, and the force receiving rod (28) can extrude the sleeve plate (27) to drive the swing lever (25) to swing around the transverse moving rod (16) when the sleeve plate (27) contacts the force receiving rod (28).

9. The high-cleanliness semiconductor wafer auto-loading apparatus according to claim 8, wherein: The four corners of the top of the bearing plate (6) are fixedly connected with limiting plates (29), and the side away from the bearing plate (6) of the limiting plate (29) extends to the outer side of the wafer loading box (2) and is inserted with the wafer loading box (2).

10. The method of claim 9, wherein the method further comprises: providing a high cleanliness semiconductor wafer automated loading apparatus; and loading the semiconductor wafer into the high cleanliness semiconductor wafer automated loading apparatus. The method comprises the following steps: Preparation and wafer taking: the wafer loading box (2) is arranged on the inner side of the limiting plate (29) on the top of the bearing plate (6) to be fixed. The synchronous motor (12) on the top of the lifting bearing table (1) is started, the screw rod (11) is driven to rotate, the bearing plate (6) moves vertically along the guide rod (8), and the wafer loading box (2) is lowered until the uppermost empty slot of the wafer loading box (2) is at the same accurate horizontal height as the wafer conveyed by the conveying device (3). At the same time, the clamping structure (5) above the conveying belt is in standby state; the push rod (24) on the top of the extension frame (17) is located on the inclined part at the right end of the fork (22), so that the clamping jaw (18) remains open. When the conveying device (3) sends a piece of finished wafer to the predetermined position directly below the clamping jaw (18), the transmission motor (19) fixed to the vertical plate (14) is started, the screw rod (20) is driven to rotate, the transverse moving rod (16) and the whole clamping structure (5) move towards the wafer. In this process, the push rod (24) slides from the inclined part of the fork (22) into the parallel part, loses the outward pushing force, the two extension frames (17) move towards each other, and the clamping jaw (18) stably clamps the wafer workpiece; Translation and insertion: After clamping is completed, the transmission motor (19) continues to work, driving the lead screw (20) to drive the entire clamping structure (5) and the wafer to move horizontally, transferring from above the transport device (3) to the front of the wafer loading box (2), and accurately aligning the wafer with the target slot. In the final insertion stage, the transmission motor (19) is slightly moved, pushing the structure forward, so that the push rod (24) contacts and slides into the inclined part at the front end of the fork (22), forcing the extension frame (17) to move away, and the claw (18) opens, releasing the wafer at the entrance of the slot. At the same time, a delicate linkage mechanism is triggered: the sleeve plate (27) at one end of the swing rod (25) contacts the fixed force rod (28) during movement, which is blocked and forces the swing rod (25) to swing slightly, gently pushing the wafer into the bottom of the slot from the side; Reset and cycle: After completing the loading of a wafer, the device automatically resets immediately. The transmission motor (19) reverses, driving the lead screw (20) to move the released wafer to the transport device (3) above, preparing for the next operation. At the same time, the synchronous motor (12) of the lifting carrier (1) is started again, driving the screw rod (11) to rotate, so that the carrier plate (6) carries the wafer loading box (2) to accurately descend by one slot interval.

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