Wafer chuck and semiconductor apparatus

Abstract

The wafer chuck and the semiconductor device of the present application comprise a rotating driving assembly, a flange, a lifting stop assembly, a chuck assembly, a monitoring assembly, a chuck head assembly and a conductive ring, which can meet the clamping, releasing and rotating operations of the wafer, and can monitor the state of the wafer in real time through the corresponding setting of the swing lever and the Hall sensor, and can provide an electrostatic discharge path for the wafer by setting the chuck head, the chuck, the chuck bottom plate, the rotating flange, the rotating shaft, the upper conductive ring and the lower conductive ring as conductors and electrically connecting and grounding them. The wafer chuck and the semiconductor device of the present application can monitor the state of the wafer without introducing complex equipment, and can effectively remove the static electricity of the wafer, thereby reducing the production cost, and can monitor the wafer in real time and remove the static electricity, thereby improving the production efficiency and the production yield.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor equipment and relates to a wafer chuck and semiconductor equipment. Background Technology

[0002] A wafer chuck, also known as a wafer holder, is a key device used in semiconductor manufacturing to hold and position wafers. It uses clamping force to hold the wafer in place, ensuring stability and precision during the manufacturing process.

[0003] In semiconductor device manufacturing, wafers are typically rotated, such as during cleaning and spin-drying processes. During wafer rotation, a wafer chuck rotates to drive the wafer's rotation. For example, in a wafer cleaning process, the wafer is held in a chuck, and its rotation causes the wafer on the chuck to rotate as well, ensuring the cleaning solution is evenly sprayed onto the wafer surface and improving the uniformity of solution distribution.

[0004] When performing a wafer cleaning process, monitoring the wafer's clamping status and removing static electricity are crucial to prevent wafer breakage due to tilting during high-speed rotation, and to prevent damage to the delicate circuitry on the wafer due to excessive static electricity.

[0005] Therefore, it is necessary to propose a wafer chuck and semiconductor device. Summary of the Invention

[0006] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide a wafer chuck and semiconductor device to solve the problems of monitoring the clamping state of wafers and removing static electricity from wafers in the prior art.

[0007] To achieve the above and other related objectives, the present invention provides a wafer chuck, the wafer chuck comprising:

[0008] A rotary drive assembly, comprising a rotary drive component and a rotating shaft, wherein the rotary drive component drives the rotating shaft to rotate.

[0009] The flange includes an upper fixed flange, a lower fixed flange, and a rotating flange. The upper fixed flange is fixed to the upper end of the rotating drive assembly, the lower fixed flange is fixed to the lower end of the rotating drive assembly, and the rotating flange is disposed above the upper fixed flange and fixed to the rotating shaft, and the rotating flange is driven to rotate through the rotating shaft.

[0010] A lifting stop assembly is fixed to the upper fixed flange. The lifting stop assembly includes a stop rod and a lifting drive component, which drives the stop rod to move up and down.

[0011] A chuck assembly includes a chuck base plate, a chuck, a telescopic traction member, and a chuck top plate. The chuck base plate is fixed to the rotating flange and rotates via the rotating flange. The chuck top plate is fixed to the chuck base plate. The chuck is located between the chuck base plate and the chuck top plate and is movably connected to the chuck base plate. One end of the telescopic traction member is connected to the chuck base plate, and the other end is connected to the chuck. The chuck base plate has a chuck base plate receiving groove corresponding to the stop rod, and the chuck has a chuck limiting groove corresponding to the stop rod. Based on the chuck base plate receiving groove and the chuck limiting groove, the chuck is limited by the lifting and lowering movement of the stop rod.

[0012] A chuck assembly, comprising a chuck head and a swing arm, wherein the chuck head is disposed on the top plate of the chuck and is correspondingly disposed with the chuck, and the chuck head is driven to rotate by the chuck head to carry and clamp the wafer, and the swing arm is fixed to the chuck head and rotates synchronously with the chuck head;

[0013] A monitoring component is fixed to the upper fixed flange. The monitoring component includes a Hall sensor, and the Hall sensor is correspondingly arranged with the swing arm. The position of the swing arm is obtained through the Hall sensor to monitor the clamping state of the wafer located on the card head.

[0014] A conductive ring, comprising an upper conductive ring and a lower conductive ring, wherein the upper conductive ring is fixed on the rotating shaft and is driven to rotate by the rotating shaft, and the lower conductive ring is fixed on the lower fixed flange, and the upper conductive ring and the lower conductive ring are in contact.

[0015] The chuck head, chuck, chuck base plate, rotating flange, rotating shaft, upper conductive ring and lower conductive ring are all conductors and are electrically connected and grounded.

[0016] Optionally, the rotating shaft and the lower fixed flange have a receiving cavity for accommodating the upper conductive ring and the lower conductive ring, and the wafer chuck further includes a back suction assembly, which is connected to the receiving cavity, and the back suction assembly includes a vacuum generator.

[0017] Optionally, the Hall sensor communicates with the rotary drive assembly, and controls the operation of the rotary drive assembly through the Hall sensor.

[0018] Optionally, it also includes an alarm, which communicates with the Hall sensor.

[0019] Optionally, the Hall sensor includes at least one clamping position Hall sensor, and the clamping position Hall sensor monitors the clamping state of the wafer in real time.

[0020] Optionally, the Hall sensor further includes an initial position Hall sensor and / or a placement position Hall sensor.

[0021] Optionally, the chuck drives the chuck head to rotate in a manner that includes gear transmission or linkage transmission.

[0022] Optionally, the surface of the upper conductive ring or the lower conductive ring is provided with a DLC coating.

[0023] Optionally, the telescopic traction element includes a spring or a cylinder.

[0024] The present invention also provides a semiconductor device, the semiconductor device comprising any of the wafer chucks described above.

[0025] As described above, the wafer chuck and semiconductor device of the present invention include a rotary drive assembly, a flange, a lifting stop assembly, a chuck assembly, a monitoring assembly, a chuck head assembly, and a conductive ring. This structure not only satisfies the clamping, releasing, and rotating operations of the wafer, but also monitors the wafer's status in real time through correspondingly set swing arms and Hall sensors. Furthermore, by setting the chuck head, chuck, chuck base plate, rotary flange, rotating shaft, upper conductive ring, and lower conductive ring as conductors and electrically connected and grounded, an electrostatic discharge path can be provided for the wafer.

[0026] The wafer chuck and semiconductor equipment of the present invention can monitor the state of the wafer without introducing complex equipment, and can effectively remove static electricity from the wafer, thereby reducing production costs and enabling real-time monitoring, thereby improving production efficiency and yield. Attached Figure Description

[0027] Figure 1 The diagram shown is a three-dimensional structural schematic of a wafer chuck in an embodiment of the present invention.

[0028] Figure 2 The diagram shown is a cross-sectional view of the wafer chuck in an embodiment of the present invention.

[0029] Figure 3 The diagram shown is a structural schematic of the monitoring component and the lifting stop component in an embodiment of the present invention.

[0030] Figure 4 The diagram shown is a top view of the chuck assembly after removing the chuck top plate in an embodiment of the present invention.

[0031] Figure 5 Displayed as Figure 4 A schematic diagram of the structure viewed from below.

[0032] Figure 6 The diagram shown is a structural schematic of the card head assembly in an embodiment of the present invention.

[0033] Figure 7 Displayed as Figure 2 A schematic diagram of the structure of region A in the middle.

[0034] Figure 8 Displayed as Figure 2 A schematic diagram of the structure of region B in the middle.

[0035] Figure 9 Displayed as Figure 4 A schematic diagram of another transmission structure in region C.

[0036] Explanation of reference numerals in the attached figures

[0037] 100 Rotary drive component 101 pivot 200 flange 201 Upper fixed flange 202 Lower fixed flange 203 Rotary flange 300 Lifting stop assembly 301 Stop bar 302 Lifting drive components 303 Stop sleeve 400 Chuck assembly 401 Chuck base plate 411 Chuck base plate receiving slot 412 rocker arm receiving slot 402 Chuck top plate 403 Chuck 413 Chuck limit slot 423 Chuck gear 433 chuck slot 404 Telescopic traction component 500 Monitoring components 501 Initial position Hall sensor 502 Clamping position Hall sensor 503 Placement Hall sensor 504 Sensor mounting block 505 Sensor bracket 600 Card Header Component 601 Card Header 611 chuck gear 612 Transmission rod 613 chuck spindle 614 support platform 615 Claw 616 Card head roller 602 rocker arm 700 conductive ring 701 Upper conductive ring 702 Lower conductive ring 800 Back-suction components 801 intake manifold 802 vacuum generator 803 exhaust pipe 804 Inhalation tube 900 wafer Detailed Implementation

[0038] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0039] Please see Figures 1-9 It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0040] This embodiment provides a wafer chuck, the wafer chuck comprising:

[0041] A rotary drive assembly 100 includes a rotary drive component (not shown) and a rotating shaft 101, wherein the rotary drive component drives the rotating shaft 101 to rotate.

[0042] Flange 200 includes an upper fixed flange 201, a lower fixed flange 202, and a rotating flange 203. The upper fixed flange 201 is fixed to the upper end of the rotating drive assembly 100, the lower fixed flange 202 is fixed to the lower end of the rotating drive assembly 100, and the rotating flange 203 is disposed above the upper fixed flange 201 and fixed to the rotating shaft 101, and the rotating flange 203 is driven to rotate by the rotating shaft 101.

[0043] A lifting stop assembly 300 is fixed to the upper fixed flange 201. The lifting stop assembly 300 includes a stop rod 301 and a lifting drive component 302, which drives the stop rod 301 to move up and down.

[0044] A chuck assembly 400 includes a chuck base plate 401, a chuck 403, a telescopic traction member 404, and a chuck top plate 402. The chuck base plate 401 is fixed to the rotating flange 203, and the rotating flange 203 drives the chuck base plate 401 to rotate. The chuck top plate 402 is fixed to the chuck base plate 401. The chuck 403 is located between the chuck base plate 401 and the chuck top plate 402, and the chuck 403 is movably connected to the chuck base plate 401. One end of the telescopic traction member 404 is connected to the chuck base plate 401, and the other end of the telescopic traction member 404 is connected to the chuck 403. The chuck base plate 401 is provided with a chuck base plate receiving groove 411 corresponding to the stop rod 301, and the chuck 403 is provided with a chuck limiting groove 413 corresponding to the stop rod 301. Based on the setting of the chuck base plate receiving groove 411 and the chuck limiting groove 413, the chuck 403 is limited by the lifting and lowering movement of the stop rod 301.

[0045] The chuck assembly 600 includes a chuck 601 and a lever 602. The chuck 601 is disposed on the chuck top plate 402 and is correspondingly disposed on the chuck 403. The chuck 601 is driven to rotate by the chuck 403 to carry and clamp the wafer 900. The lever 602 is fixed on the chuck 601 and rotates synchronously with the chuck 601.

[0046] The monitoring component 500 is fixed to the upper fixed flange 201. The monitoring component 500 includes a Hall sensor, and the Hall sensor is correspondingly arranged with the swing arm 602. The position of the swing arm 602 is obtained through the Hall sensor to monitor the clamping state of the wafer 900 located on the clamping head 601.

[0047] A conductive ring 700 includes an upper conductive ring 701 and a lower conductive ring 702. The upper conductive ring 701 is fixed on the rotating shaft 101 and is driven to rotate by the rotating shaft 101. The lower conductive ring 702 is fixed on the lower fixed flange 202, and the upper conductive ring 701 and the lower conductive ring 702 are in contact.

[0048] The chuck head 601, the chuck 403, the chuck base plate 401, the rotating flange 203, the rotating shaft 101, the upper conductive ring 701, and the lower conductive ring 702 are all conductors and are electrically connected and grounded.

[0049] See Figures 1-3 In this embodiment, the rotating shaft 101 is located at the center of the rotary drive assembly 100. The rotating drive component can drive the rotating shaft 101 to rotate, thereby providing the power required for rotation. The rotary drive assembly 100 may be, for example, a motor.

[0050] In this embodiment, the rotation drive component 100 can serve as the rotation power component for the wafer 900 in the processing technology, and can also serve as the drive component for clamping and releasing the wafer 900, thereby enabling the simultaneous clamping and release operations of each of the clamping head components 600.

[0051] The transmission method of the rotary drive assembly 100 may include bearing transmission, gear transmission, belt transmission, chain transmission, hydraulic transmission or pneumatic transmission, etc., and can be selected according to the specific needs.

[0052] The upper fixed flange 201 can be fixed to the upper end of the rotary drive assembly 100 by means of bolts, and the lower fixed flange 202 can be fixed to the lower end of the rotary drive assembly 100 by means of bolts. The upper fixed flange 201 provides a mounting position for the lifting stop assembly 300 and the monitoring assembly 500, and the lower fixed flange 202 provides a mounting position for the lower conductive ring 702. The rotary flange 203 can be fixed to the rotating shaft 101 by means of bolts, so that the rotation of the rotating shaft 101 can drive the rotary flange 203 to rotate synchronously.

[0053] See Figure 3 In this embodiment, the lifting stop assembly 300 includes a stop rod 301, a lifting drive component 302, and a stop sleeve 303. The stop sleeve 303 can be fixed to the upper fixed flange 201 by means of bolts. The lifting drive component 302 can be a stop cylinder, but is not limited to it. The stop cylinder can be connected and fixed to the stop sleeve 303 by means of bolts. The stop rod 301 can be fixed to the stop cylinder by means of bolts. The stop rod 301 and the stop sleeve 303 can be connected by means of pins to ensure that the stop rod 301 can slide and extend within the stop sleeve 303 under the drive of the stop cylinder, so as to realize the lifting and lowering operation of the stop rod 301 to limit the chuck 403.

[0054] See Figure 1 , Figure 2 , Figure 4 and Figure 5 In this embodiment, the chuck 403 drives the chuck head 601 to rotate via gear transmission, but it is not limited to this method. Figure 9 In another embodiment, the chuck 403 can drive the chuck head 601 to rotate by means of linkage transmission, which will not be described here.

[0055] Among them, see Figure 1 , Figure 2 , Figure 4 and Figure 5 In this embodiment, the chuck assembly 400 includes a chuck base plate 401, a chuck 403, a telescopic traction member 404, and a chuck top plate 402. The chuck base plate 401 can be fixed to the rotating flange 203 by means of a pin connection, so that the rotation of the rotating flange 203 drives the chuck base plate 401 to rotate synchronously. The chuck top plate 402 can be fixed to the chuck base plate 401 by means of bolt connection. The chuck 403 is disposed between the chuck base plate 401 and the chuck top plate 402, and the chuck 403 is movably connected to the chuck base plate 401. For example, the chuck 403 can be movably connected to the chuck base plate 401 by means of a bearing, so as to ensure that the chuck 403 and the chuck base plate 401 can generate relative rotational movement.

[0056] See Figure 5 The chuck base plate 401 is provided with a chuck base plate receiving groove 411 corresponding to the stop rod 301, and the chuck 403 is provided with a chuck limiting groove 413 corresponding to the stop rod 301. Based on the setting of the chuck base plate receiving groove 411 and the chuck limiting groove 413, the chuck 403 can be limited by the lifting and lowering movement of the stop rod 301.

[0057] In this embodiment, the chuck base plate 401 is also provided with a swing arm receiving groove 412 to accommodate the swing arm 602, so that the swing arm 602 can be set in correspondence with the Hall sensor.

[0058] See Figure 6In this embodiment, the chuck assembly 600 includes a chuck 601 and a swing arm 602. The chuck 601 includes a chuck gear 611, a transmission rod 612, a chuck shaft 613, a support platform 614, and chuck claws 615. The chuck gear 611 and the chuck shaft 613 are respectively disposed at opposite ends of the transmission rod 612. The support platform 614 and the chuck claws 615 are located at the end of the chuck shaft 613 away from the transmission rod 612. The support platform 614 and the chuck claws 615 are located above the chuck top plate 402. The support platform 614 is used to support the wafer 900, and the chuck claws 615 are disposed on the side of the support platform 614 to clamp the wafer 900. The chuck gear 611, the transmission rod 612, and the swing arm 602 are located between the chuck top plate 402 and the chuck bottom plate 401. The rocker arm 602 can be fixed to the chuck gear 423 by means of bolts, so that the rocker arm 602 and the chuck gear 423 rotate synchronously. (See also...) Figure 5 and 7 As shown in the figure, the end of the swing arm 602 is disposed in the swing arm receiving groove 412 so that the Hall sensor can obtain the position of the swing arm 602.

[0059] In this embodiment, N clamping head assemblies 600 are included, wherein preferably 3 ≤ N, such as N being 3, 4, 5, 6, etc., and preferably the N clamping head assemblies 600 are evenly distributed along the circumference, so that the wafer 900 clamped by the clamping head assembly 600 is subjected to uniform force, thereby avoiding the risk of the wafer 900 breaking due to uneven force. The specific value of N is not excessively limited here.

[0060] Wherein, as needed, the jaw 615 may include a jaw with a slot at its end or a jaw with a plate at its end, so as to limit the wafer 900 by means of the slot or plate. In this embodiment, a slot-type jaw with a relatively simple structure is used, but the types of jaws 615 are not limited to this.

[0061] In this embodiment, the support platform 614 is preferably conical. The inclined conical surface of the support platform 614 can contact the edge of the wafer 900, so that the wafer 900 can be supported by the multiple support platforms 614, making the wafer 900 suspend. The inclined conical surface can avoid friction on the back of the wafer 900 when each support platform 614 rotates, thereby avoiding damage to the back of the wafer 900.

[0062] See Figure 4 and Figure 6When the chuck gear 611 rotates under the meshing action of the chuck gear 423, the transmission rod 612 rotates and swings, so that the chuck shaft 613 connected to the other end of the transmission rod 612, the support platform 614 located at the end of the chuck shaft 613, and the chuck jaw 615 rotate synchronously, thereby achieving the clamping and release of the wafer 900 located on the support platform 614 through the rotation of the chuck jaw 615.

[0063] See Figure 3 In this embodiment, the monitoring component 500 includes a sensor bracket 505, a sensor mounting block 504, and the Hall sensor. The sensor bracket 505 can be fixed to the upper fixing flange 201 by means of bolts, the sensor mounting block 504 can be fixed to the sensor bracket 505 by means of bolts, and the Hall sensor can be fixed to the sensor mounting block 504 by means of means of pin hole engagement.

[0064] It should be noted that the pendulum 602 is a pendulum with a magnet at its end, and the Hall sensor is positioned corresponding to the position of the pendulum 602. Through the cooperation of the Hall sensor and the pendulum 602, the mechanical deflection of the pendulum 602 can be converted into an electrical signal by utilizing the "non-contact magnetic field measurement" characteristic of the Hall element, so as to monitor the state of the wafer 900.

[0065] like Figure 3 In this embodiment, three Hall sensors are included: one clamping position Hall sensor 502, one initial position Hall sensor 501, and one placement position Hall sensor 503. However, it is not limited to this. For example, only one clamping position Hall sensor 502 may be provided to monitor the clamping status of the wafer 900.

[0066] In this embodiment, the telescopic traction member 404 is a spring, but the type of telescopic traction member 404 is not limited to this, such as a cylinder, etc., and no excessive limitation is made here.

[0067] The following describes the operation process of the aforementioned wafer chuck, specifically including:

[0068] When the wafer 900 is not clamped, the spring remains in the reset state, and at this time the lever 602 is located directly above the initial position Hall sensor 501.

[0069] When the wafer 900 needs to be loaded or released, the rotating shaft 101 drives the chuck 403 to rotate at a set angle and maintain the angle. The stop cylinder pushes the stop rod 301 upward. At this time, the stop rod 301 can pass through the chuck base plate receiving groove 411 and then insert into the chuck limiting groove 413, thereby preventing the rotation of the chuck 403. Then, the rotating shaft 101 rotates clockwise, thereby driving the chuck base plate 401 and the chuck top plate 402 to rotate clockwise synchronously. The chuck 403, located between the chuck base plate 401 and the chuck top plate 402, is blocked by the stop rod 301, thus keeping the chuck 403 in place. When stationary and the spring is in a stretched state, an offset angle will be generated between the chuck top plate 402 and the chuck 403. The chuck head gear 611 will rotate along the chuck gear 423 under the drive of the chuck top plate 402. As a result, the support platform 614 and the chuck claw 615 located above the chuck top plate 402 will swing clockwise. The swing rod 602 will also swing clockwise in the swing rod receiving groove 412. When the swing rod 602 swings directly above the placement position Hall sensor 503, the rotating shaft 101 stops rotating, and the opening and closing size of the chuck claw 615 is just enough for the wafer 900 to be put in or taken out.

[0070] When the wafer 900 needs to be clamped, after the wafer 900 is placed in, the rotating shaft 101 rotates counterclockwise, and the chuck 615 clamps the wafer 900. At this time, the swing arm 602 is positioned directly above the clamping position Hall sensor 502. The stop rod 301 is pulled back downwards under the drive of the stop cylinder. According to process requirements, the rotating shaft 101 starts to rotate at high speed. Driven by the rotating shaft 101, the chuck assembly 400 and the chuck head assembly 600 clamping the wafer 900 operate synchronously. If the wafer 900 tilts or breaks during clamping or rotation, the angle of the chuck head 601 will change, causing the swing arm 602 to deflect. Each time the swing arm 602 rotates above the clamping position Hall sensor 502 with the chuck assembly 400, it will deviate from the clamping position Hall sensor 502, causing the maximum output current signal of the Hall sensor to change.

[0071] Therefore, in this embodiment, the wafer chuck can achieve real-time monitoring of the wafer 900 at the clamping position through the setting of the clamping position Hall sensor 502, and by combining the setting of the initial position Hall sensor 501 and the placement position Hall sensor 503, it can achieve monitoring of the entire process of the wafer 900 from loading to unloading.

[0072] Furthermore, preferably, the Hall sensor communicates with the rotary drive assembly 100 to control the operation of the rotary drive assembly 100. For example, when the maximum current signal output by the clamping position Hall sensor 502 changes, i.e., when the signal is abnormal, the clamping position Hall sensor 502 can send a signal to the rotary drive assembly 100 to stop the rotation of the shaft 101.

[0073] Furthermore, it may also include an alarm (not shown) that communicates with the Hall sensor, so that when the wafer 900 experiences a positional anomaly, the Hall sensor can send a signal to the alarm to promptly remind staff to take action.

[0074] See Figure 8 In this embodiment, the upper conductive ring 701 can be fixed on the rotating shaft 101 by means of bolts, so that the upper conductive ring 701 can be driven to rotate by the rotating shaft 101. The lower conductive ring 702 can be fixed on the lower fixed flange 202 by means of bolts, and the upper conductive ring 701 and the lower conductive ring 702 are in contact.

[0075] See Figure 2 In this embodiment, the chuck head 601, the chuck 403, the chuck base plate 401, the rotating flange 203, the rotating shaft 101, the upper conductive ring 701, and the lower conductive ring 702 are all configured as conductors and electrically connected and grounded. For example, by grounding the lower conductive ring 702, a structure can be formed as follows: Figure 2 The red dashed line indicates the electrostatic discharge path, which releases static electricity on the wafer 900, thereby preventing the breakdown of the precision circuits on the wafer 900 due to electrostatic problems.

[0076] Because the upper conductive ring 701 rotates with the rotating shaft 101, while the lower conductive ring 702 remains stationary due to being fixed to the lower fixed flange 202, and because the upper conductive ring 701 and the lower conductive ring 702 are in contact, friction will occur between them, leading to dust and other contamination issues. (See reference...) Figure 2In this embodiment, a receiving cavity capable of accommodating the upper conductive ring 701 and the lower conductive ring 702 is provided between the rotating shaft 101 and the lower fixed flange 202. The wafer chuck is also provided with a back suction assembly 800, which is connected to the receiving cavity. The back suction assembly 800 may include an inlet pipe 801, a vacuum generator 802, an exhaust pipe 803, and a suction pipe 804. The inlet pipe 801 can be fixed to the inlet of the vacuum generator 802 via a threaded connection, etc. The exhaust pipe 803 can be fixed to the exhaust port of the vacuum generator 802 via a threaded connection, etc. One end of the suction pipe 804 can be fixed to the vacuum generator 802 via a threaded connection, etc., and the other end of the suction pipe 804 can be fixed to the lower fixed flange 202 via a threaded connection, etc., to communicate with the receiving cavity. Therefore, by configuring the back-suction assembly 800, a vacuum can be generated through the high-speed flow of compressed air, thereby forming a vacuum as described above. Figure 2 The green lines indicate the airflow path, which can effectively eliminate contaminants such as particles generated by the relative sliding between the upper conductive ring 701 and the lower conductive ring 702, thus avoiding contamination of the wafer 900 and the equipment.

[0077] Furthermore, to improve the wear resistance between the upper conductive ring 701 and the lower conductive ring 702 and reduce the probability of generating contaminants such as particles, it is preferable to provide a DLC (Diamond-Like Carbon) coating with high hardness and low coefficient of friction on the surface of the upper conductive ring 701 or the lower conductive ring 702.

[0078] See Figure 9 In another embodiment, the chuck 403 can drive the chuck head 601 to rotate using a linkage transmission, which can... Figure 4 The chuck 403 shown with the chuck gear 423 is replaced with a chuck having a chuck slot 433, while... Figure 6 The chuck 601 with the chuck gear 611 is replaced with a chuck with a chuck roller 616, and the chuck roller 616 is correspondingly set with the chuck groove 433 so that the chuck groove 433 can lock the chuck roller 616, so that the chuck 403 drives the chuck 601 to rotate through the linkage transmission.

[0079] This embodiment also provides a semiconductor device, which includes any of the wafer chucks described above. The type of semiconductor device is not excessively limited here, and may include, for example, a single-sided wafer cleaning device or a double-sided wafer cleaning device.

[0080] In summary, the wafer chuck and semiconductor device of the present invention include a rotary drive assembly, a flange, a lifting stop assembly, a chuck assembly, a monitoring assembly, a chuck head assembly, and a conductive ring. This structure not only satisfies the clamping, releasing, and rotating operations of the wafer, but also monitors the wafer's status in real time through correspondingly set swing arms and Hall sensors. Furthermore, by setting the chuck head, chuck, chuck base plate, rotary flange, rotating shaft, upper conductive ring, and lower conductive ring as conductors and electrically connected and grounded, an electrostatic discharge path can be provided for the wafer.

[0081] The wafer chuck and semiconductor equipment of the present invention can monitor the state of the wafer without introducing complex equipment, and can effectively remove static electricity from the wafer, thereby reducing production costs. Furthermore, it can perform real-time monitoring and static electricity removal on the wafer, thereby improving production efficiency and yield.

[0082] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A wafer chuck, characterized by, The wafer chuck comprises: a rotating driving assembly, which comprises a rotating driving member and a rotating shaft, and the rotating shaft is driven to rotate by the rotating driving member; a flange, which comprises an upper fixed flange, a lower fixed flange and a rotating flange, the upper fixed flange is fixed to the upper end of the rotating driving assembly, the lower fixed flange is fixed to the lower end of the rotating driving assembly, and the rotating flange is arranged above the upper fixed flange and is fixed to the rotating shaft, and the rotating flange is driven to rotate by the rotating shaft; a lifting and stopping assembly, which is fixed to the upper fixed flange, and comprises a stopping rod and a lifting driving member, and the stopping rod is driven to lift by the lifting driving member; a chuck assembly, which comprises a chuck bottom plate, a chuck, a telescopic traction member and a chuck top plate, the chuck bottom plate is fixed to the rotating flange, and the chuck bottom plate is driven to rotate by the rotating flange, the chuck top plate is fixed to the chuck bottom plate, the chuck is located between the chuck bottom plate and the chuck top plate, and the chuck is movably connected to the chuck bottom plate, one end of the telescopic traction member is connected to the chuck bottom plate, the other end of the telescopic traction member is connected to the chuck, and the chuck bottom plate is provided with a chuck bottom plate accommodating groove corresponding to the stopping rod, the chuck is provided with a chuck limiting groove corresponding to the stopping rod, and the chuck is limited by the lifting operation of the stopping rod based on the chuck bottom plate accommodating groove and the chuck limiting groove; a chuck head assembly, which comprises a chuck head and a swing rod, the chuck head is arranged on the chuck top plate and corresponds to the chuck, and the chuck head is driven to rotate by the chuck to carry and clamp a wafer, and the swing rod is fixed to the chuck head and rotates synchronously with the chuck head; a monitoring assembly, which is fixed to the upper fixed flange, and comprises a Hall sensor, and the Hall sensor corresponds to the swing rod, and the position of the swing rod is acquired by the Hall sensor to monitor the clamping state of the wafer on the chuck head; a conductive ring, which comprises an upper conductive ring and a lower conductive ring, the upper conductive ring is fixed to the rotating shaft and is driven to rotate by the rotating shaft, and the lower conductive ring is fixed to the lower fixed flange, and the upper conductive ring is in contact with the lower conductive ring; wherein the chuck head, the chuck, the chuck bottom plate, the rotating flange, the rotating shaft, the upper conductive ring and the lower conductive ring are all conductors and are electrically connected and grounded.

2. The wafer chuck of claim 1, wherein: The rotating shaft and the lower fixed flange have an accommodating cavity for accommodating the upper conductive ring and the lower conductive ring, and the wafer chuck further comprises a back suction assembly, which is in communication with the accommodating cavity, and the back suction assembly comprises a vacuum generator.

3. The wafer chuck of claim 1, wherein: The Hall sensor communicates with the rotating driving assembly, and the operation of the rotating driving assembly is controlled by the Hall sensor.

4. The wafer chuck of claim 1, wherein: An alarm is further included, and the alarm communicates with the Hall sensor.

5. The wafer chuck of claim 1, wherein: The Hall sensor at least comprises one clamping position Hall sensor, and the monitoring of the clamping state of the wafer by the clamping position Hall sensor comprises real-time monitoring.

6. The wafer chuck of claim 5 wherein: The Hall sensor further comprises one initial position Hall sensor and / or one placement position Hall sensor.

7. The wafer chuck of claim 1, wherein: The chuck drives the chuck head to rotate in a gear transmission or a connecting rod transmission.

8. The wafer chuck of claim 1, wherein: The surface of the upper conductive ring or the lower conductive ring is provided with a DLC coating.

9. The wafer chuck of claim 1, wherein: The telescopic traction member comprises a spring or an air cylinder.

10. A semiconductor device, characterized by: The semiconductor device comprises the wafer chuck of any one of claims 1-9.

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