Piezoelectric heat dissipation device
By setting a partition structure inside the cavity of the piezoelectric heat dissipation device, the problem of low compression ratio of piezoelectric jet devices is solved, jet efficiency is improved, mechanical strength is enhanced, and service life is extended.
Patent Information
- Application Number
- CN202410866267.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-28
- Publication Date
- 2025-12-30
AI Technical Summary
The low compression ratio of piezoelectric jet devices results in low synthesis jet efficiency.
A partition structure is provided inside the cavity of the piezoelectric heat dissipation device, forming first and second spaces between the partition structure and the top and bottom plates. A channel connecting the connecting hole and each space is provided in the partition structure to increase the compression ratio.
It improves the efficiency of the synthetic jet, avoids gas stagnation in the cavity edge area, enhances mechanical strength, and extends service life.
Smart Images

Figure CN121237752A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of display product manufacturing technology, and more particularly to a display device. Background Technology
[0002] As electronic devices evolve towards higher integration, miniaturization, and functionalization, internal heat is increasingly concentrated and heat flux density is constantly increasing, making them prone to thermal failure. To ensure the reliability and stability of electronic equipment, there is an urgent need to develop new, efficient heat dissipation technologies. Therefore, synthetic jet piezoelectric pumps are gaining increasing attention, requiring thinner and more efficient pumps to replace traditional fans for heat dissipation. The cavity of the jet device lacks internal spacers, and the circular piezoelectric oscillator exhibits maximum displacement at the center, gradually decreasing towards the edges. This characteristic prevents the piezoelectric oscillator from expelling gas from the edge regions during compression, resulting in a low compression ratio and consequently low synthetic jet efficiency. Summary of the Invention
[0003] To address the aforementioned technical problems, this invention provides a piezoelectric heat dissipation device that solves the problem of low synthetic jet efficiency caused by a low compression ratio.
[0004] To achieve the above objectives, the technical solution adopted in this embodiment of the invention is: a piezoelectric heat dissipation device, comprising a cavity and a first piezoelectric vibrator and a second piezoelectric vibrator located on opposite sides of the cavity:
[0005] The cavity includes a top plate and a bottom plate disposed opposite to each other, and a side plate located between the top plate and the bottom plate. Along the circumferential direction of the cavity, the side plate is provided with at least one communicating hole that communicates with the interior of the cavity.
[0006] The first piezoelectric vibrator is located on the side of the top plate away from the bottom plate, and the second piezoelectric vibrator is located on the side of the bottom plate away from the top plate;
[0007] When the first piezoelectric vibrator and the second piezoelectric vibrator are configured to be subjected to voltage, the first piezoelectric vibrator and the second piezoelectric vibrator vibrate, causing the top plate and the bottom plate to deform, thereby changing the internal volume of the cavity;
[0008] The cavity is provided with a partition structure, which is fixedly connected to the side plate. A first space is formed between the partition structure and the top plate, and a second space is formed between the partition structure and the bottom plate. The partition structure is provided with a first channel connecting each of the connecting holes and the first space, and a second channel connecting each of the connecting holes and the second space.
[0009] The partition structure includes a first surface facing the top plate, and when the top plate is not deformed, the distance between the first surface and the top plate gradually decreases from the center to the edge.
[0010] The partition structure includes a second surface facing the base plate, and when the base plate is not deformed, the distance between the second surface and the base plate gradually decreases from the center to the edge.
[0011] Optionally, in the vibration direction of the first piezoelectric vibrator, when the top plate does not deform, the distance between the top plate and the partition structure is greater than or equal to the maximum deformation distance of the top plate;
[0012] In the vibration direction of the second piezoelectric vibrator, when the base plate does not deform, the distance between the base plate and the partition structure is greater than or equal to the maximum deformation distance of the base plate.
[0013] Optionally, the shape of the first surface corresponds to the shape of the top plate when it is in its maximum deformation state;
[0014] The shape of the second surface corresponds to the shape of the base plate when it is in its maximum deformation state.
[0015] Optionally, the first channel includes a first sub-channel and a second sub-channel. The first surface is provided with an opening, and the first sub-channel is formed by extending from the opening toward the bottom plate. The end of the first sub-channel away from the top plate extends toward the connecting hole to form the second sub-channel. The included angle between the first sub-channel and the second sub-channel is greater than or equal to 90 degrees.
[0016] The second channel includes a third sub-channel and a fourth sub-channel. The second surface is provided with an opening, and the third sub-channel extends from the opening toward the top plate to form the third sub-channel. The end of the third sub-channel away from the bottom plate extends toward the connecting hole to form the fourth sub-channel. The included angle between the third sub-channel and the fourth sub-channel is greater than or equal to 90 degrees.
[0017] Optionally, the first sub-channel and the third sub-channel are arranged in parallel, and the orthographic projection of the first sub-channel on the base plate coincides with the orthographic projection of the third sub-channel on the base plate, and the second sub-channel is multiplexed as the fourth sub-channel.
[0018] Optionally, the first centerline of the first sub-channel extending along a first direction coincides with the centerline of the receiving cavity extending along a first direction, the first direction being parallel to the direction from the top plate to the bottom plate.
[0019] Optionally, when the top plate is not deformed, the second sub-channel is arranged parallel to the top plate.
[0020] Optionally, the first channel is a curved channel extending from the first surface to the connecting hole, or the first channel is a straight channel extending from the first surface to the connecting hole.
[0021] Optionally, in a direction parallel to the top plate, the first surface includes a first central region and a first peripheral region surrounding the first central region, and the opening of the first channel through the first surface is located in the first peripheral region.
[0022] In a direction parallel to the top plate, the second surface includes a second central region and a second peripheral region surrounding the second central region, and the opening of the second channel through the second surface is located in the second peripheral region.
[0023] Optionally, the first surface and the second surface are symmetrically arranged around the axial center line of the connecting hole, and the first channel and the second channel connected to the same connecting hole are symmetrically arranged around the axial center line of the connecting hole.
[0024] Optionally, the cavity has a cylindrical structure with a diameter of 19–21 mm and the connecting hole has a diameter of 0.1–0.3 mm.
[0025] Optionally, the first piezoelectric vibrator and the second piezoelectric vibrator have the same thickness, the thickness of the first piezoelectric vibrator is 0.15-0.35 mm, and the distance between the first piezoelectric vibrator and the second piezoelectric vibrator is 0.8-1.2 mm.
[0026] The beneficial effects of the present invention are: by setting the partition structure, the compression ratio of the cavity is increased, and the efficiency of the jet in the box is improved. Attached Figure Description
[0027] Figure 1 This is a schematic diagram showing the structure of the piezoelectric heat dissipation device in an embodiment of the present invention;
[0028] Figure 2 This is a schematic diagram showing the structure of the piezoelectric heat dissipation device in an embodiment of the present invention;
[0029] Figure 3 This is a schematic diagram showing the structure of the piezoelectric heat dissipation device in an embodiment of the present invention;
[0030] Figure 4 A schematic diagram showing the partition structure in an embodiment of the present invention;
[0031] Figure 5 A schematic diagram showing the partition structure in an embodiment of the present invention;
[0032] Figure 6 This is a simulated diagram showing that the diameter of the cavity is 16 mm and the fluid velocity at the connecting hole.
[0033] Figure 7 This is a simulated diagram showing that the diameter of the cavity is 20 mm and the fluid velocity at the connecting hole.
[0034] Figure 8 This is a simulated diagram showing that the diameter of the cavity is 24 mm and the fluid velocity at the connecting hole.
[0035] Figure 9 This is a schematic diagram simulating the fluid velocity when the diameter of the cavity is 20 mm and the diameter of the connecting hole is 0.2 mm.
[0036] Figure 10 This is a schematic diagram simulating the fluid velocity when the diameter of the cavity is 20 mm and the diameter of the connecting hole is 0.5 mm.
[0037] Figure 11 This is a schematic diagram simulating the fluid velocity when the diameter of the cavity is 20 mm and the diameter of the connecting hole is 0.8 mm.
[0038] Figure 12 This is a schematic diagram simulating the fluid velocity in a non-partitioned structure, where the cavity diameter is 20 mm and the connecting hole diameter is 0.5 mm. Detailed Implementation
[0039] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.
[0040] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.
[0041] refer to Figures 1-5 This embodiment provides a piezoelectric heat dissipation device, including a cavity 1 and a first piezoelectric vibrator 2 and a second piezoelectric vibrator 3 located on opposite sides of the cavity 1:
[0042] The cavity 1 includes a top plate 11 and a bottom plate 12 disposed opposite to each other, and a side plate located between the top plate 11 and the bottom plate 12. Along the circumferential direction of the cavity 1, the side plate is provided with at least one communicating hole 5 communicating with the interior of the cavity 1.
[0043] The first piezoelectric vibrator 2 is located on the side of the top plate 11 away from the bottom plate 12, and the second piezoelectric vibrator 3 is located on the side of the bottom plate 12 away from the top plate 11;
[0044] When the first piezoelectric vibrator 2 and the second piezoelectric vibrator 3 are configured to be subjected to voltage, the first piezoelectric vibrator 2 and the second piezoelectric vibrator 3 vibrate, causing the top plate 11 and the bottom plate 12 to deform, thereby changing the internal volume of the cavity 1.
[0045] The cavity 1 is provided with a partition structure 4, which is fixedly connected to the side plate. A first space is formed between the partition structure 4 and the top plate 11, and a second space is formed between the partition structure 4 and the bottom plate 12. The partition structure 4 is provided with a first channel 6 connecting each of the connecting holes 5 and the first space, and a second channel 7 connecting each of the connecting holes 5 and the second space.
[0046] The partition structure 4 includes a first surface 41 facing the top plate 11. When the top plate 11 is not deformed, the distance between the first surface 41 and the top plate 11 gradually decreases from the center to the edge.
[0047] The partition structure 4 includes a second surface 42 facing the base plate 12. When the base plate 12 is not deformed, the distance between the second surface 42 and the base plate 12 gradually decreases from the center to the edge.
[0048] Among numerous flow control technologies, synthetic jet flow, as an active control technique, has received widespread research and attention due to its advantages such as high control efficiency, simple structure, and ease of deployment. The principle of synthetic jet flow is to periodically blow fluid out and draw it into an excitation chamber, inducing the formation of a series of vortex rings or vortex pairs outside the orifice or slit. During the formation and downstream convection of the vortex rings or vortex pairs, they continuously entrain surrounding fluid through induction, thereby controlling the flow field.
[0049] In this embodiment, an alternating voltage is applied to the first piezoelectric vibrator 2 and the second piezoelectric vibrator 3. Due to the inverse piezoelectric effect, the first piezoelectric vibrator 2 and the second piezoelectric vibrator 3 vibrate, and the vibration directions of the first piezoelectric vibrator 2 and the second piezoelectric vibrator 3 are opposite (meaning they move towards or away from each other in the same direction), and the vibration frequencies are the same. The top plate 11 and the bottom plate 12 of the cavity 1 then generate periodic vibrations, converting the input electrical energy into the kinetic energy of the vibration of the top plate 11 and the bottom plate 12, thereby generating an unsteady jet at the connecting hole 5. When the first piezoelectric vibrator 2 and the second piezoelectric vibrator 3 move away from each other, the gas pressure in the cavity 1 decreases, and external gas enters the cavity 1 through the connecting hole 5; when the first piezoelectric vibrator 2 and the second piezoelectric vibrator 3 move towards each other, the gas inside the cavity 1 is compressed and ejected from the cavity 1 through the connecting hole 5. During the alternating intake and exhaust of gas, the airflow near the connecting hole 5 is subjected to strong shearing, resulting in flow separation at the edge of the connecting hole 5. This separation causes the exhaust fluid to rise and form vortex pairs. When the next intake process begins, the vortex pairs formed in the previous exhaust process and moving downstream are no longer near the outlet and are unaffected by the intake. In this continuous alternating exhaust / intake process, a series of downstream migrating vortex pairs are formed. Once formed, the vortices migrate downstream at a self-induced velocity. During this migration, the energy of the vortex pairs is continuously dissipated, their coherent structure gradually disappears, and the vortex pairs become blurred, eventually evolving into scattered turbulent flow until they merge with the surrounding gas. Periodic vibrations continuously generate vortex pairs and repeat the vortex pair development and evolution process, thus forming a synthetic jet.
[0050] From the top plate 11 to the bottom plate 12, the top plate 11 moves from its initial position towards the bottom plate 12 to its maximum downward displacement, then returns to its initial position, then moves away from the bottom plate 12 to its maximum displacement, and finally returns to its initial position. The bottom plate 12 moves synchronously with the top plate 11. This periodic movement continuously acts on the jet, forming a series of vortex rings that impact the target position, enhancing the convective heat transfer between the jet and the target position. The greater the displacement of the top plate 11 or the bottom plate 12, the greater the flow velocity entering or exiting the cavity 1. The center position of the first piezoelectric vibrator 2 or the second piezoelectric vibrator 3 has the largest displacement, and the displacement decreases as the distance from the center increases. This characteristic causes the first piezoelectric vibrator 2 or the second piezoelectric vibrator 3 to be unable to expel the gas in the edge region during compression, resulting in a low compression ratio and low synthesis jet efficiency.
[0051] In this embodiment, to address the aforementioned issues, a partition structure 4 is provided within the cavity 1. A first space is formed between the partition structure 4 and the top plate 11, and a second space is formed between the partition structure 4 and the bottom plate 12. A first channel 6 is provided within the partition structure 4, connecting each of the connecting holes 5 and the first space, and a second channel 7 is provided, connecting each of the connecting holes 5 and the second space. The partition structure 4 includes a first surface 41 facing the top plate 11. When the top plate 11 is not deformed, the distance between the first surface 41 and the top plate 11 gradually decreases from the center to the edge. The partition structure 4 also includes a second surface 42 facing the bottom plate 12. When the bottom plate 12 is not deformed, the distance between the second surface 42 and the bottom plate 12 gradually decreases from the center to the edge. In other words, from the top plate 11 to the bottom plate 12, the thickness of the partition structure 4 gradually increases from the center to the edge. The partition structure 4 fills the edge area of the cavity 1, preventing stagnant gas from occupying the space of the cavity 1 and consuming the kinetic energy of the first piezoelectric vibrator 2 or the second piezoelectric vibrator 3, and ensuring the displacement of the first piezoelectric vibrator 2 or the second piezoelectric vibrator 3 at its center position, thereby increasing the compression ratio and improving the efficiency of the synthetic jet.
[0052] In an exemplary embodiment, when the top plate 11 does not deform in the vibration direction of the first piezoelectric vibrator 2, the distance between the top plate 11 and the partition structure 4 is greater than or equal to the maximum deformation distance of the top plate 11.
[0053] In the vibration direction of the second piezoelectric vibrator 3, when the base plate 12 is not deformed, the distance between the base plate 12 and the partition structure 4 is greater than or equal to the maximum deformation distance of the base plate 12.
[0054] By adopting the above solution, the setting of the partition structure 4 is avoided from affecting the vibration of the first piezoelectric vibrator 2 and the second piezoelectric vibrator 3.
[0055] In an exemplary embodiment, the shape of the first surface 41 corresponds to the shape of the top plate 11 when it is in a state of maximum deformation;
[0056] The shape of the second surface 42 corresponds to the shape of the base plate 12 when it is in the maximum deformation state.
[0057] The shape of the first surface 41 of the partition structure 4 is determined by the shape of the top plate 11 at its maximum deformation. Figure 1 The dashed curve shown by reference numeral 100 represents the shape of the top plate when it is under maximum deformation. The shape of the second surface 42 of the partition structure 4 is determined by the shape of the bottom plate 12 when it is under maximum deformation. Figure 1 The dashed curve indicated by reference numeral 200 represents the shape of the base plate when it is under maximum deformation, that is, the shape of the partition structure 4 is set according to the maximum displacement compression of the top plate 11 and the base plate 12. In some embodiments, when the top plate 11 is under maximum compression, the top plate 11 is in contact with the first surface 41, but there is no pressure between the top plate 11 and the first surface 41. Similarly, when the base plate 12 is under maximum compression, the base plate 12 is in contact with the second surface 42, but there is no pressure between the base plate 12 and the second surface 42, so as to maximize the compression ratio.
[0058] For example, the first surface 41 can be a curved surface, or the first surface 41 can be an inclined surface; the second surface 42 can be a curved surface, or the second surface 42 can be an inclined surface.
[0059] For example, the shape of the partition structure 4 matches the shape of the cavity 1. For instance, if the cavity 1 is a cylindrical structure, the partition structure 4 is also a cylindrical structure.
[0060] In an exemplary embodiment, the connecting hole 5 can be one or more, depending on the required flow direction of the fluid in the actual use environment.
[0061] For example, when multiple connecting holes 5 are provided, the multiple connecting holes 5 are evenly arranged in the circumferential direction of the cavity 1.
[0062] In an exemplary embodiment, each of the connecting holes 5 connects the first channel 6 and the second channel 7 simultaneously. In the direction from the top plate 11 to the bottom plate 12, the connecting hole 5 is located at the center of the side plate of the cavity 1, and the axial center line of the connecting hole 5 is located at the center of the side plate, which facilitates the setting of the first channel 6 and the second channel 7.
[0063] For example, in the direction from the top plate 11 to the bottom plate 12, the distances from the first piezoelectric vibrator 2 and the second piezoelectric vibrator 3 to the connecting hole 5 are the same, and the first channel 6 and the second channel 7 are symmetrically arranged with respect to the axial center line of the connecting hole 5 to avoid generating turbulence.
[0064] In an exemplary embodiment, the first channel 6 includes a first sub-channel 61 and a second sub-channel 62. The first surface 41 is provided with an opening, and the first sub-channel 61 is formed by extending from the opening toward the bottom plate 12. The second sub-channel 62 is formed by extending from the end of the first sub-channel 61 away from the top plate 11 toward the connecting hole 5. The included angle between the first sub-channel 61 and the second sub-channel 62 is greater than or equal to 90 degrees.
[0065] The second channel 7 includes a third sub-channel 71 and a fourth sub-channel 72. The second surface 42 is provided with an opening, and the third sub-channel 71 is formed by extending from the opening toward the top plate 11. The end of the third sub-channel 71 away from the bottom plate 12 extends toward the connecting hole 5 to form the fourth sub-channel 72. The included angle between the third sub-channel 71 and the fourth sub-channel 72 is greater than or equal to 90 degrees.
[0066] In an exemplary embodiment, the first sub-channel 61 is arranged in parallel with the third sub-channel 71, and the orthographic projection of the first sub-channel 61 on the base plate 12 coincides with the orthographic projection of the third sub-channel 71 on the base plate 12, and the second sub-channel 62 is multiplexed as the fourth sub-channel 72.
[0067] In an exemplary embodiment, the first sub-channel 61 along the first direction (reference) Figure 1 The first center line extending in the X direction coincides with the center line extending in the first direction of the receiving cavity, which is parallel to the direction from the top plate 11 to the bottom plate 12.
[0068] In an exemplary embodiment, when the top plate 11 is not deformed, the second sub-channel 62 is arranged parallel to the top plate 11. That is, the second sub-channel 62 is a straight channel, which facilitates the smooth flow of fluid.
[0069] In an exemplary embodiment, the first channel 6 is a curved channel extending from the first surface 41 to the connecting hole 5, or the first channel 6 is a straight channel extending from the first surface 41 to the connecting hole 5.
[0070] In an exemplary embodiment, in a direction parallel to the top plate 11, the first surface 41 includes a first central region and a first peripheral region surrounding the first central region, and the opening of the first channel 6 penetrating the first surface 41 is located in the first peripheral region.
[0071] In a direction parallel to the top plate 11, the second surface 42 includes a second central region and a second peripheral region surrounding the second central region, and the opening of the second channel 7 through the second surface 42 is located in the second peripheral region.
[0072] By adopting the above solution, the center thickness of the partition structure 4 can be increased, thereby improving mechanical strength and extending service life.
[0073] In an exemplary embodiment, the first surface 41 and the second surface 42 are symmetrically arranged around the axial center line of the connecting hole 5, and the first channel 6 and the second channel 7 connected to the same connecting hole 5 are symmetrically arranged around the axial center line of the connecting hole 5.
[0074] In an exemplary embodiment, the cavity 1 is a cylindrical structure with a diameter of 19-21 mm and the diameter of the connecting hole 5 is 0.1-0.3 mm.
[0075] The cavity 1 is defined as cylindrical, and the first piezoelectric vibrator 2 and the second piezoelectric vibrator 3 are circular. The first piezoelectric vibrator 2 and the second piezoelectric vibrator 3 have the same structure. The diameter of the cavity 1 is defined as... (The thickness of the top plate, bottom plate, and side plates of the cavity is generally the same, 0.1-0.2 mm, and can be ignored here). The thickness of the first piezoelectric vibrator 2 and the thickness of the second piezoelectric vibrator 3 are both T1, the thickness of the cavity 1 is T2, and the diameter of the connecting hole 5 is...
[0076] set up The diameter is 5mm, and the simulated fluid velocity at the connecting hole 5 varies with... The size of (the diameter of the cavity 1) changes;
[0077] set up The fluid velocities at the connecting hole 5 were obtained as follows: 16mm, 20mm, and 24mm, respectively, with fluid velocities of 1mm / s, 300mm / s, and 120mm / s. (Simulation results are referenced.) Figure 6 , Figure 7 and Figure 8 .
[0078] The diameter of the cavity 1 was set to 20 mm. The effect of the size of the connecting hole 5 on the fluid velocity at the connecting hole 5 was simulated. Fluid velocities were simulated with diameters of 0.2 mm, 0.5 mm, and 0.8 mm, respectively. The simulation results are as follows: Figure 9 , Figure 10 and Figure 11 When the diameter of the connecting hole is 0.2 mm, the fluid velocity at the connecting hole is 500 mm / s; when the diameter of the connecting hole is 0.5 mm, the fluid velocity at the connecting hole is 300 mm / s; and when the diameter of the connecting hole is 0.8 mm, the fluid velocity at the connecting hole is 220 mm / s.
[0079] In summary, preferably, the diameter of the cavity 1 is... The diameter is 19–21 mm. To keep it as small as possible, the diameter of the connecting hole 5 can be controlled between 0.1 and 0.3 mm.
[0080] Simulations were performed on a synthetic jet device with a cavity diameter of 20 mm and a connecting hole diameter of 0.5 mm for a non-partitioned structure 4. The simulation results showed that the fluid velocity at the connecting hole 5 was less than 80 mm / s (reference). Figure 12 The fluid velocity at the connecting hole is much smaller than that obtained by simulation of the same size in this embodiment (in this embodiment, the heat dissipation device is equipped with the partition structure 4, and the fluid velocity at the connecting hole obtained by simulation of the same size is 300 mm / s, for reference). Figure 10 ).
[0081] In an exemplary embodiment, the first piezoelectric vibrator 2 and the second piezoelectric vibrator 3 have the same thickness, the thickness of the first piezoelectric vibrator 2 is 0.15-0.35 mm, and the distance between the first piezoelectric vibrator 2 and the second piezoelectric vibrator 3 is 0.8-1.2 mm.
[0082] In an exemplary embodiment, the first piezoelectric vibrator 2 and the second piezoelectric vibrator 3 are made of the same material. The material of the first piezoelectric vibrator 2 may be one or more of barium titanate (BaTiO3, BT), lead zirconium titanate (Pb(Zr0.53Ti0.47)O3, PZT), tourmaline, rode salt, tantalate, niobate, aluminum nitride (AlN), and gallium nitride (GaN).
[0083] The following points need to be explained:
[0084] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.
[0085] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.
[0086] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.
[0087] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.
Claims
1. A piezoelectric heat dissipating device, characterized by comprising: The cavity comprises a top plate and a bottom plate arranged oppositely, and a side plate arranged between the top plate and the bottom plate, and at least one communication hole is arranged on the side plate and communicates with the inside of the cavity along the circumferential direction of the cavity. The first piezoelectric vibrator is arranged on the side of the top plate away from the bottom plate, and the second piezoelectric vibrator is arranged on the side of the bottom plate away from the top plate. The first piezoelectric vibrator and the second piezoelectric vibrator are configured to generate vibration when a voltage is applied, drive the top plate and the bottom plate to deform, and change the volume of the inside of the cavity. The cavity is provided with a partition structure fixedly connected to the side plate, a first space is formed between the partition structure and the top plate, a second space is formed between the partition structure and the bottom plate, a first channel is arranged in the partition structure and communicates between each of the communication holes and the first space, and a second channel is arranged in the partition structure and communicates between each of the communication holes and the second space. The partition structure comprises a first surface arranged towards the top plate, and when the top plate does not deform, the distance between the first surface and the top plate gradually decreases from the center to the edge. The partition structure comprises a second surface arranged towards the bottom plate, and when the bottom plate does not deform, the distance between the second surface and the bottom plate gradually decreases from the center to the edge. In the vibration direction of the first piezoelectric vibrator, the distance between the top plate and the partition structure when the top plate does not deform is greater than or equal to the maximum deformation distance of the top plate.
2. The piezoelectric heat dissipating device according to claim 1, wherein In the vibration direction of the second piezoelectric vibrator, the distance between the bottom plate and the partition structure when the bottom plate does not deform is greater than or equal to the maximum deformation distance of the bottom plate. The shape of the first surface is consistent with the shape of the top plate in the maximum deformation state.
3. The piezoelectric heat dissipating device according to claim 2, wherein The shape of the second surface is consistent with the shape of the bottom plate in the maximum deformation state. The first channel comprises a first sub-channel and a second sub-channel, the first surface is provided with an opening, and the first sub-channel is formed by extending from the opening to the direction of the bottom plate, one end of the first sub-channel away from the top plate extends to the direction of the communication hole to form the second sub-channel, and the included angle between the first sub-channel and the second sub-channel is greater than or equal to 90 degrees.
4. The piezoelectric heat dissipating device according to claim 2, wherein The second channel comprises a third sub-channel and a fourth sub-channel, the second surface is provided with an opening, and the third sub-channel is formed by extending from the opening to the direction of the top plate, one end of the third sub-channel away from the bottom plate extends to the direction of the communication hole to form the fourth sub-channel, and the included angle between the third sub-channel and the fourth sub-channel is greater than or equal to 90 degrees. The first sub-channel and the third sub-channel are arranged in parallel, the orthographic projection of the first sub-channel on the bottom plate coincides with the orthographic projection of the third sub-channel on the bottom plate, and the second sub-channel is reused as the fourth sub-channel.
5. The piezoelectric heat dissipating device according to claim 4, wherein 6. The piezoelectric heat dissipating device according to claim 5, wherein The first center line of the first sub-channel extending in the first direction coincides with the center line of the cavity extending in the first direction, and the first direction is parallel to the direction from the top plate to the bottom plate.
7. The piezoelectric heat dissipating device according to claim 5, wherein The second sub-channel is parallel to the top plate when the top plate is not deformed.
8. The piezoelectric heat dissipating device according to claim 2, wherein The first channel is a curved channel extending from the first surface to the communication hole, or the first channel is a linear channel extending from the first surface to the communication hole.
9. The piezoelectric heat dissipating device according to claim 8, wherein In the direction parallel to the top plate, the first surface includes a first central region and a first peripheral region surrounding the first central region, and the opening of the first channel penetrating the first surface is located in the first peripheral region. In the direction parallel to the top plate, the second surface includes a second central region and a second peripheral region surrounding the second central region, and the opening of the second channel penetrating the second surface is located in the second peripheral region.
10. The piezoelectric heat dissipating device according to claim 2, wherein The first surface and the second surface are symmetrically arranged around the axial center line of the communication hole, and the first channel and the second channel connected to the same communication hole are symmetrically arranged around the axial center line of the communication hole.
11. The piezoelectric heat dissipating device according to claim 1, wherein The cavity is a cylindrical structure, the diameter of the cavity is 19-21mm, and the diameter of the communication hole is 0.1-0.3mm.
12. The piezoelectric heat dissipating device according to claim 1, wherein The thickness of the first piezoelectric vibrator and the second piezoelectric vibrator is the same, the thickness of the first piezoelectric vibrator is 0.15-0.35mm, and the distance between the first piezoelectric vibrator and the second piezoelectric vibrator is 0.8-1.2mm.