Multilayer composite circuit board structure with gradient heat dissipation performance

Abstract

The present application relates to the technical field of circuit board, especially to a multilayer composite circuit board structure with gradient heat dissipation performance, which comprises a circuit layer, a mounting groove is formed at the top end of the circuit layer, and a mounting plate is fixedly connected to the inner wall bottom of the mounting groove, the cooling assembly is arranged to make the heat dissipation effect of the chip bottom higher than that of other areas of the circuit layer, thereby realizing gradient heat dissipation, the guide assembly is arranged to guide the heat on the cylinder to the surroundings, when the chip needs to be replaced, the bottom plate can be removed from the bottom of the cylinder through the blocking assembly, so that the cylinder is separated from the mounting plate, the cooling effect of the mounting plate and the chip can be reduced, the solder ball can be melted by the hot air gun, thereby facilitating the chip removal, and the problem that the solder ball is difficult to melt due to the cooling structure when the chip is replaced is solved.

Description

Technical Field

[0001] This invention relates to the field of circuit board technology, and in particular to a multilayer composite circuit board structure with gradient heat dissipation performance. Background Technology

[0002] Circuit boards are the "skeleton and nerve center" of electronic devices, responsible for supporting electronic components and realizing electrical interconnection between components. The core function of circuit boards is to connect scattered electronic components through copper foil lines to form a complete circuit system, and they can be customized according to needs. Chips are components used to control electronic components.

[0003] In the prior art, when it is necessary to replace the BGA chip on the circuit board, since the BGA chip is usually soldered with solder balls, and there is usually a cooling structure under the BGA chip, when the BGA chip is removed by heating with a hot air gun, the cooling structure under the BGA chip will quickly conduct away the heat generated by the hot air gun, making it difficult to melt the solder balls and making it inconvenient to replace the chip. Therefore, this application proposes a multilayer composite circuit board structure with gradient heat dissipation performance. Summary of the Invention

[0004] The purpose of this invention is to address the problem in the prior art where the cooling structure makes it difficult to melt the solder balls when replacing chips, and to propose a multilayer composite circuit board structure with gradient heat dissipation performance.

[0005] The technical solution of the present invention is a multilayer composite circuit board structure with gradient heat dissipation performance, including a circuit layer, a mounting groove is provided at the top of the circuit layer, a mounting plate is fixedly connected to the bottom of the inner wall of the mounting groove, a plurality of round holes are provided at the top of the mounting plate, a chip is soldered to the top of the mounting plate, an insulating layer is installed at the bottom of the circuit layer, a bottom layer is installed at the bottom of the insulating layer, and a cooling component, a guiding component, a blocking component, and a fixing component are also included.

[0006] The cooling component is used to cool the bottom of the chip and the mounting plate. The cooling component includes a cylinder, which is disposed at the bottom of the mounting plate.

[0007] The guiding component is used to guide the heat off the cylinder;

[0008] The blocking assembly is used to temporarily disconnect the connection between the cylinder and the mounting plate. The blocking assembly includes a base plate disposed at the bottom of the cylinder.

[0009] The fixing component is used to fix the position of the base plate.

[0010] Optionally, the cooling component further includes a heat-conducting block, which is fixed to the inner wall of the cylinder. The heat-conducting block has multiple sets of air holes inside. Both the heat-conducting block and the cylinder are made of heat-conducting material. A first heat dissipation layer is fixed to the bottom of the circuit layer. Two sets of insulating layers are provided and are distributed vertically and horizontally. The upper set of insulating layers is fixed to the bottom of the first heat dissipation layer. A second heat dissipation layer is fixed between the two sets of insulating layers. A third heat dissipation layer is fixed to the bottom of the lower set of insulating layers. The bottom layer is fixed to the bottom of the third heat dissipation layer.

[0011] Optionally, the guiding assembly includes a side plate fixed to the outer wall of the cylinder. A first spring is fixed to the inner wall of the side plate, and a heat-conducting sheet is fixed to one end of the first spring. The heat-conducting sheet is sleeved on the outer wall of the side plate. Four sets of square grooves are formed on the inner walls of the first heat dissipation layer, the second heat dissipation layer, the third heat dissipation layer, the bottom layer, and the two sets of insulating layers. The side plate and the heat-conducting sheet are inserted into the inner wall of the square grooves.

[0012] Optionally, the guiding component further includes a side frame, which is fixed to one side of the circuit layer. A heat sink is fixed to the inner wall of the side frame. Multiple sets of fins are installed on one side of the heat sink. Multiple sets of through slots are opened on the side of the side frame near the circuit layer. A guide block is fixed to one side of the first heat sink, the second heat sink, and the third heat sink. The guide block is installed on the inner wall of the through slot, and one end of the guide block is in contact with the heat sink.

[0013] Optionally, the inner wall of the circuit layer is provided with an annular groove, and the inner wall of the annular groove is provided with a heat absorption plate. The heat absorption plate is sleeved on the outer wall of the cylinder and is located at the top of the side plate and the heat-conducting plate.

[0014] Optionally, the blocking assembly further includes a push block, which is fixed to the bottom of the base plate. A groove is provided at the bottom of the base plate, and the base plate is slidably connected to the inner wall of the groove. A circular groove is provided at the center of the base plate, and the diameter of the circular groove is the same as the diameter of the cylinder.

[0015] Optionally, a guide plate is fixed to the bottom of the bottom layer. Multiple sets of guide plates are provided and distributed in parallel at the bottom of the bottom layer. The guide plate is made of a heat-conducting material and is located at the bottom of the cylinder.

[0016] Optionally, the fixing component includes a locking block, which is slidably connected to the inner wall of the push block. One end of the locking block extending out of the push block is disposed on one side of a set of guide plates. A square plate is fixedly connected to one side of the locking block. Two sets of square plates and locking blocks are provided and symmetrically distributed inside the push block. A second spring is fixedly connected between the two sets of locking blocks. A bottom block is slidably connected to the bottom of the push block. A push plate is fixedly connected to the top of the bottom block. An inclined rod is provided at the top of the push plate and is disposed on both sides of the two sets of square plates.

[0017] Optionally, the top of the circuit layer has a mounting hole that penetrates the bottom layer, the first heat dissipation layer, the second heat dissipation layer, the third heat dissipation layer, and two sets of insulating layers. A sheath is fixed to the inner wall of the mounting hole, and a gasket is fixed to the outer wall of the sheath. The gasket is attached to one side of the circuit layer. A washer ring is fixed to the top of the sheath. A screw is inserted into the inner wall of the sheath. The washer ring is located at the bottom of one side of the screw, and a nut is threaded to the bottom of the screw.

[0018] Optionally, a corner protector is fixed to one side of the side frame, and the corner protector is located at the connection between the two sets of side frames. The corner protector is made of rubber.

[0019] Compared with the prior art, this application includes at least one of the following beneficial technical effects:

[0020] This invention achieves gradient heat dissipation by placing a cooling component at the bottom of the chip, which generates high heat, making the heat dissipation effect at the bottom of the chip higher than other areas of the circuit layer. By setting a guiding component, the heat on the cylinder can be guided to the surrounding area. When the chip needs to be replaced, the base plate can be removed from the bottom of the cylinder by the blocking component, so that the cylinder moves downward by gravity and is no longer in contact with the mounting plate. This reduces the cooling effect on the mounting plate and the chip, allowing the hot air gun to melt the solder balls, making it easier to remove the chip. After the new chip is soldered onto the mounting plate, the cylinder can be placed under the mounting plate again, and the position of the cylinder can be fixed by the base plate. This solves the problem that the cooling structure makes it difficult to melt the solder balls when replacing the chip. Attached Figure Description

[0021] Figure 1 A schematic diagram of the overall structure of a multilayer composite circuit board with gradient heat dissipation performance;

[0022] Figure 2 This is a schematic diagram of the first cross-sectional structure of a multilayer composite circuit board with gradient heat dissipation performance.

[0023] Figure 3 for Figure 2 An enlarged structural diagram at point A;

[0024] Figure 4 for Figure 3 An enlarged structural diagram at point B;

[0025] Figure 5 This is a schematic diagram showing the disassembly of the structure beneath the chip;

[0026] Figure 6 This is a schematic diagram of the disassembled structure of the side plate and heat-conducting plate;

[0027] Figure 7This is a schematic diagram of the overall second cross-sectional structure of a multilayer composite circuit board with gradient heat dissipation performance.

[0028] Figure 8 for Figure 7 An enlarged structural diagram at point C;

[0029] Figure 9 This is a schematic diagram of a square groove structure;

[0030] Figure 10 This is a schematic diagram of one side of the side frame structure;

[0031] Figure 11 This is a schematic diagram of the corner protector structure;

[0032] Figure 12 This is a schematic diagram of the cross-sectional structure of the push block;

[0033] Figure 13 This is a schematic diagram of the bottom layer and the guide plate structure.

[0034] Reference numerals: 1. Circuit layer; 2. Chip; 3. Bottom layer; 4. Insulating layer; 5. Mounting plate; 6. Cylinder; 7. Heat-conducting block; 8. Slide groove; 9. Base plate; 10. First heat dissipation layer; 11. Second heat dissipation layer; 12. Third heat dissipation layer; 13. Square groove; 14. Side plate; 15. First spring; 16. Heat-conducting sheet; 17. Annular groove; 18. Heat absorption plate; 19. Side frame; 20. Heat dissipation plate; 21. Push block; 22. Locking block; 23. Second spring; 24. Square plate; 25. Push plate; 26. Bottom block; 27. Guide plate; 28. Screw; 29. ​​Nut; 30. Washer ring; 31. Sheath; 32. Corner protector. Detailed Implementation

[0035] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0036] like Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, the multilayer composite circuit board structure with gradient heat dissipation proposed in this invention includes a circuit layer 1. The top of the circuit layer 1 is used to mount various electronic components. The top of the circuit layer 1 has a mounting groove. The bottom of the inner wall of the mounting groove is fixedly connected to a mounting plate 5. The mounting plate 5 is used to solder and fix a chip 2. The top of the mounting plate 5 has multiple sets of circular holes. The circular holes are used to remove heat from the bottom of the chip 2 through airflow. The chip 2 is soldered to the top of the mounting plate 5. An insulating layer 4 is installed at the bottom of the circuit layer 1. A bottom layer 3 is installed at the bottom of the insulating layer 4.

[0037] In this process, such as Figure 3 - Figure 10As shown, the cooling component of the circuit board structure is used to cool the bottom of the chip 2 and the mounting plate 5. The cooling component includes a cylinder 6, which is disposed at the bottom of the mounting plate 5. The cooling component also includes a heat-conducting block 7, which is fixed to the inner wall of the cylinder 6. When the cylinder 6 contacts the bottom of the mounting plate 5, the heat-conducting block 7 on the inner wall of the cylinder 6 will also be in close contact with the bottom of the mounting plate 5. Since both the cylinder 6 and the heat-conducting block 7 are made of thermally conductive materials, heat from the chip 2 and the mounting plate 5 can be conducted to the cylinder 6 and the heat-conducting block 7 through contact. The heat-conducting block 7 has multiple sets of air vents inside, which also allow airflow to pass through the heat-conducting block 7, thereby carrying away some heat and facilitating heat dissipation. Both the heat-conducting block 7 and the cylinder 6 are made of thermally conductive materials. A first heat dissipation layer 10 is fixed to the bottom of the circuit layer 1. The insulating layer 4 is provided in two sets, which are arranged in parallel vertically. The upper set of insulating layers 4 is fixed to the bottom of the first heat dissipation layer 10, and the second heat dissipation layer 11 is fixed between the two sets of insulating layers 4. The bottom of the lower set of insulating layers 4 is fixed to the bottom of the third heat dissipation layer 12, and the bottom layer 3 is fixed to the bottom of the third heat dissipation layer 12. By setting the first heat dissipation layer 10, the second heat dissipation layer 11, and the third heat dissipation layer 12 between the circuit layer 1, the bottom layer 3, and the two sets of insulating layers 4, the heat in different areas can be easily dissipated through the first heat dissipation layer 10, the second heat dissipation layer 11, and the third heat dissipation layer 12 when the circuit board generates heat. At the same time, since the first heat dissipation layer 10, the second heat dissipation layer 11, and the third heat dissipation layer 12 are in contact with the outer wall of the cylinder 6, they can also carry away some of the heat from the outer wall of the cylinder 6, further promoting heat dissipation.

[0038] It should be noted that, as Figure 4 , Figure 5 , Figure 6 , Figure 8 , Figure 9 and Figure 10As shown, the guiding assembly of the circuit board structure is used to guide the heat out of the cylinder 6. The guiding assembly includes a side plate 14, which is fixed to the outer wall of the cylinder 6. When the cylinder 6 is installed into the bottom of the mounting plate 5, the four sets of side plates 14 and heat-conducting plates 16 on the outer wall of the cylinder 6 will be inserted into the four sets of square slots 13. A first spring 15 is fixed to the inner wall of the side plate 14, and a heat-conducting plate 16 is fixed to one end of the first spring 15. The heat-conducting plate 16 is sleeved on the outer wall of the side plate 14. Since the first spring 15 is provided between the heat-conducting plate 16 and the side plate 14, the heat-conducting plate 16... When the heat-conducting plate 16 enters the square groove 13, it is pushed by the first spring 15, causing one side of the heat-conducting plate 16 to be tightly attached to the inner wall of the square groove 13. This keeps the heat-conducting plate in contact with the first heat dissipation layer 10, the second heat dissipation layer 11, and the third heat dissipation layer 12. The inner walls of the first heat dissipation layer 10, the second heat dissipation layer 11, the third heat dissipation layer 12, the bottom layer 3, and the two sets of insulating layers 4 are all provided with four sets of square grooves 13. The side plate 14 and the heat-conducting plate 16 are inserted into the inner wall of the square groove 13. Through the heat-conducting plate 16 and the side plate 14, the heat on the mounting cylinder can be further conducted to the first heat dissipation layer 10 and the second heat dissipation layer 11. The guide assembly also includes a side frame 19, which is fixed to one side of the circuit layer 1. A heat sink 20 is fixed to the inner wall of the side frame 19. By setting the side frame 19 on one side of the circuit layer 1, it is easy to install the heat sink 20 on the side of the circuit layer 1. At the same time, the setting of the side frame 19 also helps to stabilize the multiple layers of the circuit board. Multiple sets of fins are installed on one side of the heat sink 20. The multiple sets of fins on one side of the heat sink 20 can improve the effect of heat dissipation to the side. Multiple through slots are provided on the side frame 19 near the circuit layer 1. A guide block is fixed to one side of each of the first heat dissipation layer 10, the second heat dissipation layer 11, and the third heat dissipation layer 12. The guide block is installed on the inner wall of the through slot, and one end of the guide block is in contact with the heat sink 20. Since the first heat dissipation layer 10, the second heat dissipation layer 11, and the third heat dissipation layer 12 can be connected to the heat sink 20 through the guide block, the heat generated on the first heat dissipation layer 10, the second heat dissipation layer 11, and the third heat dissipation layer 12 can be conducted to the heat sink 20, and the heat can be dissipated by the advantage of the heat sink 20 being in direct contact with the air.

[0039] Furthermore, such as Figure 3 , Figure 4 and Figure 5As shown, the inner wall of the circuit layer 1 is provided with an annular groove 17. By providing the annular groove 17 on the circuit board, it is convenient to install the heat absorption plate 18. The inner wall of the annular groove 17 is provided with the heat absorption plate 18. The heat absorption plate 18 is sleeved on the outer wall of the cylinder 6. The heat absorption plate 18 is located at the top of the side plate 14 and the heat-conducting plate 16. When the cylinder 6 is installed at the bottom of the mounting plate 5, the heat absorption plate 18 can be pushed upward by the four sets of side plates 14 and heat-conducting plates 16 on the outer wall of the mounting plate 5, so that the top of the heat absorption plate 18 contacts the bottom of the mounting plate 5. Thus, the heat absorption plate 18 can increase the heat dissipation area for the chip 2 and the mounting plate 5. The blocking component of the circuit board structure is used to temporarily isolate the connection between the cylinder 6 and the mounting plate 5. The blocking component includes a base plate 9, which is located at the bottom of the cylinder 6. The blocking component also includes a push block 21. The bottom of the base plate 3 is fixed to the bottom of the base plate 9. The bottom of the base plate 3 is provided with a sliding groove 8. The base plate 9 is slidably connected to the inner wall of the sliding groove 8. A circular groove is provided at the center of the base plate 9. The diameter of the circular groove is the same as the diameter of the cylinder 6. When the chip 2 needs to be removed, the push block 21 can be pushed. When the push block 21 moves, it will drive the base plate 9 to move together, so that the base plate 9 slides in the sliding groove 8 until the base plate 9 is removed from the bottom of the cylinder 6. This releases the fixation on the bottom of the cylinder 6, allowing the cylinder 6 to move downward and disconnect from the mounting plate 5. When the cylinder 6 is removed from the bottom of the mounting plate 5, the bottom of the heat absorption plate 18 loses support. Under the influence of gravity, the heat absorption plate 18 moves downward to the annular groove 17, thereby separating the heat absorption plate 18 from the contact area with the mounting plate 5, so as to reduce the heat dissipation efficiency of the mounting plate 5 and facilitate the melting of the solder balls on the mounting plate 5.

[0040] Furthermore, such as Figure 13 As shown, a guide plate 27 is fixed to the bottom of the bottom layer 3. Multiple sets of guide plates 27 are provided and are distributed in parallel at the bottom of the bottom layer 3. By providing multiple sets of guide plates 27 at the bottom of the bottom layer 3, when hot air flows out of the round hole on the mounting plate 5 and the air hole on the heat-conducting block 7, the hot air can be guided to the surrounding area through the guide plates 27. The guide plates 27 are made of heat-conducting material. The guide plates 27 are located at the bottom of the cylinder 6. The heat-conducting material of the guide plates 27 can also be used to reduce the temperature of the hot air.

[0041] It should be noted that, as Figure 3 , Figure 11 , Figure 12As shown, the fixing component of the circuit board structure is used to fix the position of the base plate 9. The fixing component includes a locking block 22, which is slidably connected to the inner wall of the push block 21. One end of the locking block 22 extending out of the push block 21 is set on one side of a set of guide plates 27. After a new set of chips 2 is soldered, the cylinder 6 can be installed below the mounting plate 5, and the base plate 9 can be moved towards the cylinder 6 by the push block 21. A square plate 24 is fixed to one side of the locking block 22. There are two sets of square plates 24 and locking blocks 22, which are symmetrically distributed inside the push block 21. The two sets of square plates 24 and locking blocks 22 can be used to fix the position of the push block 21. A second spring 23 is fixed between the two sets of locking blocks 22. The second spring 23 is used to provide a restoring force for the two sets of locking blocks 22. A base block 26 is slidably connected to the bottom of the push block 21. A push plate 25 is fixed to the top of the base block 26. The top of the push plate 25 is set with An inclined rod is provided on both sides of the two sets of square plates 24. When the push block 21 moves to one side of a set of guide plates 27, it can press the bottom block 26, causing the bottom block 26 to move upward. When the bottom block 26 moves, it will drive the push plate 25 and the two sets of inclined rods to move together. When the two sets of inclined rods move upward, they can push the two sets of square plates 24 towards the center through their inclined points. When the square plates 24 move, they will drive the two sets of locking blocks 22 to move towards the center as well, and squeeze the second spring. 23, until the two sets of locking blocks 22 move into the inner wall of the push block 21, the push block 21 can pass through a set of guide plates 27. After passing through the guide plates 27, the bottom block 26 can be released, so that the push plate 25 and the inclined rod can move downward. At this time, the two sets of locking blocks 22 can be pushed by the second spring 23 until the two sets of locking blocks 22 extend out of the push block 21, so that the two sets of locking blocks 22 are locked on one side of the guide plate 27, so that the position of the bottom plate 9 can be fixed, and the bottom plate 9 is kept at the bottom of the cylinder 6.

[0042] As one implementation method, such as Figure 7 , Figure 8 , Figure 11As shown, a mounting hole is provided at the top of the circuit layer 1. The mounting hole penetrates the bottom layer 3, the first heat dissipation layer 10, the second heat dissipation layer 11, the third heat dissipation layer 12, and the two sets of insulating layers 4. A protective sleeve 31 is fixed to the inner wall of the mounting hole. By setting the protective sleeve 31 inside the mounting hole, the openings of the bottom layer 3, the first heat dissipation layer 10, the second heat dissipation layer 11, the third heat dissipation layer 12, and the two sets of insulating layers 4 can be protected, preventing the screws 28 from directly contacting the mounting holes and causing damage to the components. A gasket is fixed to the outer wall of the protective sleeve 31. The gasket is attached to one side of the circuit layer 1. By setting the gasket on the inner wall of the protective sleeve 31, when the bottom layer 3, the first heat dissipation layer 10, the second heat dissipation layer 11, the third heat dissipation layer 12, and the two sets of insulating layers 4 experience thermal expansion and contraction, it is convenient to use the flexible material gasket to support the bottom layer 3. The circuit board is protected by a first heat dissipation layer 10, a second heat dissipation layer 11, a third heat dissipation layer 12, and two sets of insulating layers 4 to prevent material damage caused by hard compression during expansion. A washer 30 is fixed to the top of the sheath 31, and a screw 28 is inserted into the inner wall of the sheath 31. The washer 30 is located at the bottom of one side of the screw 28, and a nut 29 is threaded to the bottom of the screw 28. The circuit board can be installed in a designated area through the cooperation of the screw 28 and the nut 29. A corner protector 32 is fixed to one side of the side frame 19. The corner protector 32 is located at the connection of the two sets of side frames 19. By setting the corner protector 32 at the connection of the two sets of side frames 19, the edge of the circuit board can be protected to prevent damage from bumps. The corner protector 32 is made of rubber, which is more conducive to fitting the connection of the side frame 19.

[0043] In this embodiment, to solve the problem of solder balls being difficult to melt due to the cooling structure when replacing chip 2, a mounting slot is provided. Chip 2 can be placed in the mounting slot and soldered onto the mounting plate 5. When the cylinder 6 contacts the bottom of the mounting plate 5, the heat-conducting block 7 on the inner wall of the cylinder 6 will also be in close contact with the bottom of the mounting plate 5. Since both the cylinder 6 and the heat-conducting block 7 are thermally conductive materials, by placing the cylinder 6 and the heat-conducting block 7 at the bottom of the chip 2, which generates a high amount of heat, the heat from the chip 2 and the mounting plate 5 can be conducted to the cylinder 6 and the heat-conducting block 7. Simultaneously, the multiple sets of air vents inside the heat-conducting block 7 allow airflow to pass through it, thereby carrying away some heat and further facilitating heat dissipation. This is achieved by using the circuit layer 1 and the bottom layer 3... A first heat dissipation layer 10, a second heat dissipation layer 11, and a third heat dissipation layer 12 are disposed between the two sets of insulating layers 4. When heat is generated on the circuit board, the heat can be dissipated in different areas through the first heat dissipation layer 10, the second heat dissipation layer 11, and the third heat dissipation layer 12. At the same time, since the first heat dissipation layer 10, the second heat dissipation layer 11, and the third heat dissipation layer 12 are in contact with the outer wall of the cylinder 6, they can also carry away some of the heat from the outer wall of the cylinder 6, further promoting heat dissipation. The cylinder 6 can be used to cool the area below the chip 2. Through the operation of the cooling component, the heat dissipation effect at the bottom of the chip 2 is higher than that in other areas of the circuit layer 1, thereby achieving gradient heat dissipation.

[0044] When the cylinder 6 is installed into the bottom of the mounting plate 5, the four sets of side plates 14 and the heat-conducting plates 16 on the outer wall of the cylinder 6 are inserted into the four sets of square slots 13. Since a first spring 15 is provided between the heat-conducting plate 16 and the side plate 14, when the heat-conducting plate 16 enters the square slot 13, it will be pushed by the first spring 15, so that one side of the heat-conducting plate 16 is tightly attached to the inner wall of the square slot 13. This keeps the heat-conducting plate in contact with the first heat dissipation layer 10, the second heat dissipation layer 11 and the third heat dissipation layer 12, which can further conduct the heat on the mounting cylinder to the first heat dissipation layer 10, the second heat dissipation layer 11 and the third heat dissipation layer 12, thereby improving the cooling efficiency of the chip 2 and the mounting plate 5. By providing a side frame 19 on one side of the circuit layer 1, it is convenient to install the heat sink 20 through the side frame 19. The side of the circuit layer 1, and the side frame 19, also help to stabilize the multiple layers of the circuit board. The multiple fins on one side of the heat sink 20 can improve the heat dissipation effect to the side. Since the first heat sink 10, the second heat sink 11 and the third heat sink 12 can be connected to the heat sink 20 through the guide block, the heat generated on the first heat sink 10, the second heat sink 11 and the third heat sink 12 can be conducted to the heat sink 20, and the heat can be dissipated by the advantage of the heat sink 20 being in direct contact with the air. By setting multiple guide plates 27 at the bottom of the bottom layer 3, when hot air flows out of the round hole on the mounting plate 5 and the air hole on the heat conduction block 7, the hot air can be guided to the surrounding area through the guide plates 27. At the same time, the guide plates 27 can also be used to reduce the temperature of the hot air.

[0045] By providing an annular groove 17 on the circuit board, the heat absorption plate 18 can be easily installed. When the cylinder 6 is installed at the bottom of the mounting plate 5, the heat absorption plate 18 can be lifted upward by the four sets of side plates 14 and heat-conducting plates 16 provided on the outer wall of the mounting plate 5, so that the top of the heat absorption plate 18 contacts the bottom of the mounting plate 5. This increases the heat dissipation area for the chip 2 and the mounting plate 5 through the heat absorption plate 18. When it is necessary to remove the chip 2, the push block 21 can be pushed. When the push block 21 moves, it will drive the base plate 9 to move together, so that the base plate 9 slides in the sliding groove 8 until the base plate 9 is removed from the bottom of the cylinder 6. The cylinder 6 is removed from the bottom of the mounting plate 5, thereby releasing the fixation on the bottom of the cylinder 6, allowing the cylinder 6 to move downward and detach from the contact with the mounting plate 5. This reduces the cooling effect on the mounting plate 5 and the chip 2, allowing the hot air gun to melt the solder balls, thus facilitating the removal of the chip 2. When the cylinder 6 is removed from the bottom of the mounting plate 5, the bottom of the heat absorption plate 18 loses its support, and under the influence of gravity, the heat absorption plate 18 moves downward towards the annular groove 17, thereby detaching the heat absorption plate 18 from the contact area with the mounting plate 5, so as to reduce the heat dissipation efficiency of the mounting plate 5 and facilitate the melting of the solder balls on the mounting plate 5.

[0046] After the new set of chips 2 is soldered, the cylinder 6 can be installed below the mounting plate 5, and the base plate 9 can be pushed to one side of the cylinder 6. When the push block 21 moves to one side of a set of guide plates 27, the base block 26 can be pressed to move the base block 26 upward. When the base block 26 moves, it will drive the push plate 25 and the two sets of inclined rods to move together. When the two sets of inclined rods move upward, they can push the two sets of square plates 24 to move towards the center through their inclined points. When the square plates 24 move, they will also drive the two sets of locking blocks 22 to move towards the center. The core moves and squeezes the second spring 23 until the two sets of locking blocks 22 move into the inner wall of the push block 21, allowing the push block 21 to pass through a set of guide plates 27. After passing through the guide plates 27, the bottom block 26 can be released, allowing the push plate 25 and the inclined rod to move downward. At this time, the two sets of locking blocks 22 can be pushed by the second spring 23 until the two sets of locking blocks 22 extend out of the push block 21, so that the two sets of locking blocks 22 are locked on one side of the guide plate 27, which can fix the position of the bottom plate 9 and keep the bottom plate 9 at the bottom of the cylinder 6.

[0047] By installing a protective sleeve 31 inside the mounting hole, the openings of the bottom layer 3, the first heat dissipation layer 10, the second heat dissipation layer 11, the third heat dissipation layer 12, and the two sets of insulating layers 4 can be protected, preventing the screws 28 from directly contacting the mounting holes and causing damage to the components. By installing a gasket on the inner wall of the protective sleeve 31, when the bottom layer 3, the first heat dissipation layer 10, the second heat dissipation layer 11, the third heat dissipation layer 12, and the two sets of insulating layers 4 undergo thermal expansion and contraction, it is convenient to protect the bottom layer 3, the first heat dissipation layer 10, the second heat dissipation layer 11, the third heat dissipation layer 12, and the two sets of insulating layers 4 with a flexible material gasket, preventing material damage caused by hard compression during expansion.

[0048] The above specific embodiments are merely several optional embodiments of the present invention. Based on the technical solutions of the present invention and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. A multilayer composite circuit board structure with gradient heat dissipation performance, comprising a circuit layer (1), wherein a mounting groove is provided at the top of the circuit layer (1), a mounting plate (5) is fixedly connected to the bottom of the inner wall of the mounting groove, a plurality of round holes are provided at the top of the mounting plate (5), a chip (2) is soldered to the top of the mounting plate (5), an insulating layer (4) is installed at the bottom of the circuit layer (1), and a bottom layer (3) is installed at the bottom of the insulating layer (4), characterized in that: It also includes cooling components, guiding components, blocking components, and fixing components; The cooling component is used to cool the bottom of the chip (2) and the mounting plate (5). The cooling component includes a cylinder (6) which is disposed at the bottom of the mounting plate (5). The guiding component is used to guide the heat off the cylinder (6); The blocking assembly is used to temporarily disconnect the connection between the cylinder (6) and the mounting plate (5). The blocking assembly includes a base plate (9) which is disposed at the bottom of the cylinder (6). The fixing component is used to fix the position of the base plate (9); The cooling component also includes a heat-conducting block (7), which is fixed to the inner wall of the cylinder (6). The heat-conducting block (7) has multiple sets of air holes inside. Both the heat-conducting block (7) and the cylinder (6) are made of heat-conducting materials. The bottom of the circuit layer (1) is fixed to a first heat dissipation layer (10). The insulation layer (4) is provided in two sets and is distributed in parallel vertically. The upper set of insulation layers (4) is fixed to the bottom of the first heat dissipation layer (10). The two sets of insulation layers (4) are fixed to a second heat dissipation layer (11). The bottom of the lower set of insulation layers (4) is fixed to a third heat dissipation layer (12). The bottom layer (3) is fixed to the bottom of the third heat dissipation layer (12). The blocking assembly also includes a push block (21), which is fixed to the bottom of the base plate (9). The bottom of the bottom layer (3) is provided with a sliding groove (8). The base plate (9) is slidably connected to the inner wall of the sliding groove (8). A circular groove is provided at the center of the base plate (9). The diameter of the circular groove is the same as the diameter of the cylinder (6).

2. The multilayer composite circuit board structure with gradient heat dissipation performance according to claim 1, characterized in that, The guiding assembly includes a side plate (14), which is fixed to the outer wall of the cylinder (6). A first spring (15) is fixed to the inner wall of the side plate (14). A heat-conducting plate (16) is fixed to one end of the first spring (15). The heat-conducting plate (16) is sleeved on the outer wall of the side plate (14). The inner walls of the first heat dissipation layer (10), the second heat dissipation layer (11), the third heat dissipation layer (12), the bottom layer (3), and the two sets of insulating layers (4) are all provided with four sets of square grooves (13). The side plate (14) and the heat-conducting plate (16) are inserted into the inner wall of the square grooves (13).

3. The multilayer composite circuit board structure with gradient heat dissipation performance according to claim 2, characterized in that, The guiding component also includes a side frame (19), which is fixed to one side of the circuit layer (1). A heat sink (20) is fixed to the inner wall of the side frame (19). Multiple sets of fins are installed on one side of the heat sink (20). Multiple sets of through slots are opened on the side of the side frame (19) near the circuit layer (1). A guide block is fixed to one side of the first heat sink layer (10), the second heat sink layer (11), and the third heat sink layer (12). The guide block is installed on the inner wall of the through slot. One end of the guide block is in contact with the heat sink (20).

4. The multilayer composite circuit board structure with gradient heat dissipation performance according to claim 3, characterized in that, The inner wall of the circuit layer (1) is provided with an annular groove (17), and the inner wall of the annular groove (17) is provided with a heat absorption plate (18). The heat absorption plate (18) is sleeved on the outer wall of the cylinder (6) and is located at the top of the side plate (14) and the heat-conducting plate (16).

5. The multilayer composite circuit board structure with gradient heat dissipation performance according to claim 4, characterized in that, The bottom of the bottom layer (3) is fixed with a guide plate (27). There are multiple sets of the guide plate (27) and they are distributed in parallel at the bottom of the bottom layer (3). The guide plate (27) is made of heat-conducting material and is located at the bottom of the cylinder (6).

6. The multilayer composite circuit board structure with gradient heat dissipation performance according to claim 5, characterized in that, The fixing component includes a locking block (22), which is slidably connected to the inner wall of the push block (21). One end of the locking block (22) extending out of the push block (21) is located on one side of a set of guide plates (27). A square plate (24) is fixedly connected to one side of the locking block (22). Two sets of square plates (24) and locking blocks (22) are provided and symmetrically distributed inside the push block (21). A second spring (23) is fixedly connected between the two sets of locking blocks (22). A bottom block (26) is slidably connected to the bottom of the push block (21). A push plate (25) is fixedly connected to the top of the bottom block (26). A diagonal rod is provided at the top of the push plate (25). The diagonal rod is located on both sides of the two sets of square plates (24).

7. The multilayer composite circuit board structure with gradient heat dissipation performance according to claim 6, characterized in that, The top of the circuit layer (1) is provided with an installation hole, which penetrates the bottom layer (3), the first heat dissipation layer (10), the second heat dissipation layer (11), the third heat dissipation layer (12) and two sets of insulation layers (4). A sleeve (31) is fixed to the inner wall of the installation hole, and a gasket is fixed to the outer wall of the sleeve (31). The gasket is attached to one side of the circuit layer (1). A washer ring (30) is fixed to the top of the sleeve (31). A screw (28) is inserted into the inner wall of the sleeve (31). The washer ring (30) is located at the bottom of one side of the screw (28). A nut (29) is threaded to the bottom of the screw (28).

8. The multilayer composite circuit board structure with gradient heat dissipation performance according to claim 7, characterized in that, A corner protector (32) is fixed to one side of the side frame (19). The corner protector (32) is located at the connection between the two sets of side frames (19). The corner protector (32) is made of rubber.

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