An electrochemical gradient-filled micropore conduction device and method

Abstract

This invention relates to the field of electronic manufacturing technology, and more particularly to a micropore conduction device and method using electrochemical gradient filling. The technical solution includes a main body of the device and a PLC control system that controls the operation of each component within the main body. The main body contains a circuit board substrate. The circuit board substrate is moved and its angle adjusted via a multi-axis workpiece adjustment platform located within the main body. An industrial camera for position and shape acquisition is mounted on the top of the circuit board substrate. A support recess fixedly connected to the main body is located below the multi-axis workpiece adjustment platform. Below the support recess is a manifold for mounting multiple sets of negative pressure adsorption components. This invention features targeted nozzle diversion, negative pressure adsorption channel circulation, and ultrasonic unit defoaming, fully leveraging the advantages of circuit board processing equipment in electric field gradient control, electrolyte renewal, and bubble removal to ensure the quality and efficiency of micropore conduction.

Description

Technical Field

[0001] This invention relates to the technical field of electronic manufacturing, and in particular to an electrochemical gradient-filled micropore conductive device and method. Background Technology

[0002] With the rapid development of high-density interconnect circuit boards, advanced packaging, and other electronic fields, microvias, as the core structure for interlayer electrical conduction, directly determine the performance and reliability of electronic devices through their filling quality and efficiency. Currently, the industry mainly uses electrochemical gradient filling technology to achieve microvia conduction, that is, by controlling the electric field and ion migration, metal ions (such as Cu) are allowed to pass through the microvia. 2+ Directional deposition within the pores forms a continuous conductive structure.

[0003] However, existing electrochemical filling equipment suffers from insufficient flow field control precision in practical applications. It often employs unidirectional spraying or static immersion methods, failing to create a directional flow field for micropores. This leads to excessive deposition at the pore opening and delayed ion replenishment at the pore bottom, resulting in a filling rate of only 0.5 μm / min and a void ratio as high as 30%. Furthermore, it has weak bubble handling capabilities; 2-5 μm hydrogen bubbles generated by the electrochemical reaction easily become trapped within the pores, forming inclusion defects and affecting conductivity stability. These problems impact the quality and efficiency of micropore filling, making it difficult to meet the electronics industry's demands for high-precision, high-reliability conductive structures. Therefore, this invention proposes an electrochemical gradient filling micropore conductive device that combines precise flow field control and efficient bubble handling. Summary of the Invention

[0004] The purpose of this invention is to address the problem of insufficient flow field control precision in the practical application of micro-hole filling equipment for circuit boards in the background art, and to propose an electrochemical gradient filling micro-hole conduction device and method.

[0005] On one hand, the present invention proposes an electrochemical gradient-filled micropore conductive device, including a device body and a PLC control system for controlling the operation of each component in the entire device body. The device body is used to prevent circuit board substrates from moving. The circuit board substrates are moved and their angles are adjusted by a multi-axis workpiece adjustment platform set in the device body. An industrial camera for position and shape acquisition is also set on the top of the circuit board substrates. A support recess fixedly connected to the device body is set below the multi-axis workpiece adjustment platform. A manifold for installing multiple sets of negative pressure adsorption components is set below the support recess. A circulation pump set for accelerating electrolyte renewal is set between the manifold and the electrolyte storage tank.

[0006] Above the circuit board substrate, there is a targeted flow guide nozzle for micro-orifice spraying. The targeted flow guide nozzle has a flow cavity inside. At the bottom of the flow cavity, there is a set of central spray holes and at least six sets of side oblique spray holes arranged in a ring around the central spray holes. There are three sets of guide vanes in the flow cavity, namely, a first-stage guide vane, a second-stage guide vane, and a third-stage guide vane arranged from top to bottom. The next-stage guide vane diverts 30% of the electrolyte from the previous stage. The main electrolyte of the guide vane is sprayed from the central spray hole, and the side electrolyte is sprayed from the side oblique spray holes.

[0007] The negative pressure adsorption assembly circulates and guides the electrolyte used for cleaning. The negative pressure adsorption assembly includes a negative pressure adsorption head installed to adsorb corresponding to the micropores, an adsorption guide tube for guiding and circulating the electrolyte, and a flow control valve.

[0008] Optionally, the central injection hole is positioned directly opposite the center of the micro-hole, and multiple sets of side oblique injection holes are tilted at 15° toward the axis of the central injection hole to ensure that the electric field gradient acts in the depth direction of the hole to achieve the construction of the targeted flow field.

[0009] Optionally, multiple micro ultrasonic vibration units are also provided along the outer periphery of the central jet hole. Each micro ultrasonic vibration unit is equipped with an ion concentration monitoring module. The micro ultrasonic vibration unit performs ultrasonic ablation on the electrolyte of the jet, breaking the bubbles into microbubbles of 0.1-0.3μm. The microbubbles are discharged with the negative pressure adsorption component.

[0010] Optionally, the first-stage guide vane consists of a first-stage guide inner cylinder and a first-stage guide shroud; the second-stage guide vane consists of a second-stage guide inner cylinder and a second-stage guide shroud; and the third-stage guide vane consists of a third-stage guide inner cylinder and a third-stage guide shroud.

[0011] Furthermore, both the first-stage and second-stage guide vanes are connected to a fixing rod that is fixedly connected to the inner wall of the flow cavity.

[0012] A three-stage deflector is positioned on top of the central injection port.

[0013] Optionally, the diameter of the secondary guide inner cylinder is smaller than the inner diameter of the primary guide inner cylinder, and the outer arc surface of the maximum diameter of the tertiary guide shroud is the inner side of multiple sets of side oblique spray holes, which is used to divide the electrolyte flow.

[0014] Optionally, the support recess has multiple sets of connecting holes that communicate with the top of the manifold. The adsorption guide tube is fixedly connected to the inner wall of the connecting hole through a limiting ring. The outer ring of the limiting ring is fixedly connected to the inner wall of the connecting hole. The inner ring diameter of the limiting ring is slightly larger than the outer diameter of the adsorption guide tube, which is used to block and limit the negative pressure adsorption head above the support recess.

[0015] Optionally, the negative pressure adsorption head includes a funnel-shaped adsorption chamber and a sealing gasket fixedly connected to the top of the adsorption chamber, and a filter element is detachably installed on the inner wall of the adsorption chamber.

[0016] The inner wall of the adsorption chamber is provided with an annular mounting groove, the top of the mounting groove is provided with a mounting slot for mounting the filter element, and the two sides of the filter element are provided with fixing blocks that are adapted to the size of the mounting slot and rotatably mounted with the inner wall of the mounting groove.

[0017] The filter element also has a rotating protrusion at the top center for rotating it.

[0018] Optionally, a substrate clamping fixture for clamping and limiting the circuit board substrate is installed above the multi-axis workpiece adjustment platform. Two sets of clamping drive cylinders that drive the relative movement of the two sets of clamping claws are provided above the substrate clamping fixture. Multiple strip slots are opened on the substrate clamping fixture.

[0019] Optionally, an industrial camera for acquiring image information of circuit board substrates is also installed inside the main body of the equipment;

[0020] The top of the targeted flow nozzle is equipped with a nozzle positioning slide for adjusting its jet position. The nozzle positioning slide includes a horizontal drive motor and a vertical drive motor.

[0021] A main liquid supply pipeline is provided between the electrolyte storage tank and the targeted flow nozzle. A pretreatment liquid storage tank is also provided on one side of the electrolyte storage tank. A delivery pipe is provided between the pretreatment liquid storage tank and the main liquid supply pipeline.

[0022] The circulating pump set includes a circulating centrifugal pump and a feed pipe connected to the electrolyte storage tank.

[0023] On the other hand, the present invention also proposes a method of using an electrochemically gradient-filled micropore conductive device, comprising the following steps:

[0024] Step 1: Device initialization and parameter matching:

[0025] 1.1 Workstation and workpiece positioning: Start the PLC control system, adjust the targeted flow nozzle to the preset workstation through the nozzle positioning slide, and the multi-axis workpiece adjustment platform drives the substrate clamping fixture to clamp the workpiece circuit board substrate onto the support recess. The industrial camera collects micro-hole information to ensure that the center spray hole of the targeted flow nozzle is aligned with the hole center and the side oblique spray hole is aligned with the hole opening, thus completing the precise alignment.

[0026] 1.2 Functional Component Start-up and Parameter Setting: Set the flow splitting ratio of the guide vanes inside the targeted flow nozzle, start the ultrasonic unit around the central injection hole, activate the ion monitoring module, and set Cu... 2+ Threshold, complete the configuration of processing parameters;

[0027] Step 2, Workpiece pretreatment and targeted flow field construction:

[0028] 2.1 Workpiece cleaning and activation: Pretreatment liquid is sprayed onto the circuit board substrate through the pretreatment liquid storage tank. After the industrial camera confirms that the surface is clean, the supply is stopped to prepare for subsequent filling.

[0029] 2.2 Targeted Flow Field and Two-Way Circulation Construction: Start the electrolyte storage tank and target flow nozzle to supply electrolyte. The electrolyte is guided by the blades to form a targeted flow field with 70% mainstream vertical spray and 30% side oblique spray. Combined with the flow control valve, the negative pressure adsorption head is driven to adsorb under negative pressure, thus constructing a two-way circulation of adsorption after spraying, which accelerates the renewal of electrolyte in the hole. The electrolyte is then processed by the circulation pump group and recycled.

[0030] Step 3: Electrochemical gradient filling and dynamic control:

[0031] 3.1 Gradient Filling and Bubble Treatment: Applying pulsed current to the driving electrochemical deposition module, Cu 2+ Gradient deposition is performed within micropores, and ultrasonic units break up 2-5μm bubbles into microbubbles, which are then discharged under negative pressure through the adsorption guide tube to avoid inclusion defects.

[0032] 3.2 Electrolyte concentration stability control: The ion monitoring module monitors Cu in real time. 2+ When the concentration is below 15 g / L, the PLC control system triggers feeding to control the concentration at 15 ± 1 g / L, ensuring filling efficiency.

[0033] 3.3 Post-filling parameter adjustment: When the industrial camera detects that the micropores are filled to 80%, reduce the flow rate of the targeted flow nozzle and the ultrasonic power, maintain the flow control valve to prevent deformation of the metal layer inside the pores, and continuously remove residual liquid bubbles;

[0034] Step 4, Filling Completion and Post-Processing:

[0035] 4.1 Processing Termination and Component Shutdown: Confirm Cu 2+ Once the concentration is stable and the micropores are free of defects, the equipment is turned off and the filling process is complete.

[0036] 4.2 Workpiece post-processing and cycle shutdown: The multi-axis workpiece adjustment platform moves the workpiece circuit board substrate to the post-processing station.

[0037] Compared with the prior art, the present invention has the following beneficial technical effects:

[0038] This invention constructs a targeted flow field through the guide vanes of a targeted flow nozzle. Combined with the precise flow distribution achieved by the three-stage guide vanes within the nozzle (first, second, and third stages), 70% of the electrolyte is sprayed vertically from the central injection hole to the bottom of the hole, and 30% is sprayed at a 15° angle from the side injection holes to surround the orifice, thus creating a targeted flow field. Simultaneously, the flow control valve of the negative pressure adsorption component drives the bucket-shaped adsorption chamber of the negative pressure adsorption head to implement negative pressure adsorption, forming a bidirectional circulation of spraying from the targeted flow nozzle and adsorption by the negative pressure adsorption component, ensuring that the Cu at the bottom of the orifice... 2+ Real-time replenishment reduced the void ratio from the traditional 30% to below 0.5%;

[0039] By linking the micro ultrasonic vibration unit around the central jet hole with the negative pressure flow channel adsorption guide tube, the bubbles are broken into microbubbles and then quickly discharged through the adsorption guide tube, reducing the defect rate and significantly improving the reliability of the conductive structure.

[0040] The negative pressure adsorption head of this invention is fixed by a limiting ring and a connecting hole. Its filter element can be rotated by a rotating protrusion to allow the fixing block to disengage from the mounting slot, enabling quick disassembly and cleaning, and shortening maintenance time. The targeted flow guide nozzle integrates flow guide blades, spraying, ultrasonic vibration, and monitoring functions, reducing the dispersed layout of components. At the same time, the circulating centrifugal pump feed pipe of the circulating pump group and the adsorption guide pipe of the electrolyte storage tank form an electrolyte recycling system, which reduces the space occupation of the equipment, reduces electrolyte waste, and saves operating costs.

[0041] In summary, this invention closely integrates the various components of the device, possessing the functions of targeted nozzle diversion, negative pressure adsorption channel circulation, and ultrasonic unit defoaming. It fully leverages the advantages of circuit board processing equipment in electric field gradient control, electrolyte renewal, and bubble removal, ensuring the quality and efficiency of micropore conductivity. Attached Figure Description

[0042] Figure 1 This is a schematic diagram of the structure of a micro-hole conductive device;

[0043] Figure 2 for Figure 1 A frontal view diagram;

[0044] Figure 3 This is a schematic diagram of the circulation of the spray liquid.

[0045] Figure 4 A schematic diagram of the structure of the adjustment platform for supporting the recessed stage and multi-axis workpiece;

[0046] Figure 5 This is a schematic diagram of the negative pressure adsorption component.

[0047] Figure 6 for Figure 5 A schematic diagram of the exploded structure;

[0048] Figure 7 This is a schematic diagram of the structure of a targeted flow guide nozzle;

[0049] Figure 8 for Figure 7 A schematic diagram of the cross-sectional structure;

[0050] Figure 9 This is a schematic diagram of the guide vane structure proposed in this invention.

[0051] Figure label:

[0052] 1. Circuit board substrate; 10. Multi-axis workpiece adjustment platform; 11. Substrate clamping fixture; 12. Clamping drive cylinder; 13. Clamping claws;

[0053] 100. Equipment body; 101. Support recess; 1011. Connecting hole; 102. Manifold;

[0054] 20. Industrial cameras;

[0055] 200. PLC control system;

[0056] 30. Electrolyte storage tank; 31. Main electrolyte supply pipeline;

[0057] 40. Targeted flow guide nozzle; 41. Central spray hole; 42. Side oblique spray hole; 43. First-stage guide vane; 44. Second-stage guide vane; 45. Third-stage guide vane; 431. First-stage guide inner cylinder; 432. First-stage guide shroud; 441. Second-stage guide inner cylinder; 442. Second-stage guide shroud; 451. Third-stage guide inner cylinder; 452. Third-stage guide shroud; 46. Fixing rod;

[0058] 50. Nozzle positioning slide; 51. Horizontal drive motor; 52. Vertical drive motor;

[0059] 60. Negative pressure adsorption assembly; 61. Negative pressure adsorption head; 611. Adsorption chamber; 612. Sealing gasket; 613. Filter element; 614. Mounting groove; 615. Mounting slot; 616. Fixing block; 617. Rotating protrusion; 62. Adsorption guide tube; 63. Flow control valve;

[0060] 70. Circulating pump set; 71. Circulating centrifugal pump; 72. Feed pipe;

[0061] 80. Pretreatment liquid storage tank; 81. Delivery pipe. Detailed Implementation

[0062] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0063] like Figures 1-3As shown, the present invention proposes an electrochemical gradient-filled microvia conduction device, including a main body 100 and a PLC control system 200 that controls the operation of each component in the main body 100. The PLC control system 200 has a touch screen and a parameter storage module. The frame of the main body 100 is made of stainless steel 304, and the inner wall is coated with an acid and alkali resistant anti-corrosion coating. It also includes a circuit board substrate 1 placed in the main body 100 for blind hole conduction processing. The circuit board substrate 1 is connected to a multi-axis workpiece adjustment platform 10 within the main body 100, which is a multi-axis electric slide with a positioning accuracy of ±0.01mm. It supports X / Y / Z three-axis movement and ±15° angle adjustment, realizing position movement and angle adjustment. Figure 4 As shown, a substrate clamping fixture 11 for clamping and limiting the circuit board substrate 1 is installed above the multi-axis workpiece adjustment platform 10. Two sets of clamping drive cylinders 12 are positioned above the substrate clamping fixture 11 to drive the relative movement of the two sets of clamping claws 13. The clamping claws 13 are made of polyurethane to avoid scratching the substrate surface. The substrate clamping fixture 11 has multiple strip-shaped slots. These slots facilitate the adsorption and installation of the circuit board substrate 1 after adjustment with the negative pressure adsorption head 61, avoiding obstruction of the micropores on the circuit board substrate 1. Figure 1 As shown, the main body 100 of the equipment also houses an industrial camera 20 for acquiring image information of the circuit board substrate 1. The industrial camera 20 is a 2-megapixel industrial CCD camera with an 8mm fixed-focus lens and a shooting frame rate of 30fps; (Refer to...) Figure 2 As shown, the top of the targeted flow nozzle 40 is provided with a nozzle positioning slide 50 for adjusting the position of its jet flow. The nozzle positioning slide 50 includes a horizontal drive motor 51 and a vertical drive motor 52.

[0064] Further integration Figure 3 As shown, an industrial camera 20 for position and shape acquisition is also provided on the top of the circuit board substrate 1. The industrial camera 20 is mounted inside the main body 100 of the device via a bracket, and is used to vertically align the lens with the circuit board substrate 1 to achieve precise image acquisition; then combined with Figure 3 and Figure 4 As shown, a support recess 101 fixedly connected to the main body 100 is provided below the multi-axis workpiece adjustment platform 10. A manifold 102 for installing multiple sets of negative pressure adsorption components 60 is provided below the support recess 101. Multiple connecting holes 1011 connected to the top of the manifold 102 are provided on the support recess 101. The adsorption guide tube 62 is fixedly connected to the inner wall of the connecting hole 1011 through a limiting ring. The outer ring of the limiting ring is fixedly connected to the inner wall of the connecting hole 1011. The inner ring diameter of the limiting ring is slightly larger than the outer diameter of the adsorption guide tube 62, which is used to block and limit the negative pressure adsorption head 61 above the support recess 101 to prevent the negative pressure adsorption head 61 from falling into the manifold 102.

[0065] Specifically, in combination Figure 5 and Figure 6 As shown, the negative pressure adsorption head 61 includes a funnel-shaped adsorption chamber 611 and a sealing gasket 612 fixedly connected to the top of the adsorption chamber 611. The adsorption chamber 611 is made of polytetrafluoroethylene propylene, with a funnel opening diameter of 25 mm and a funnel depth of 18 mm. The sealing gasket 612 is made of fluororubber and is used for sealing connection with the lower surface of the support recess 101. A filter element 613 is detachably installed on the inner wall of the adsorption chamber 611. The filter element 613 has a pore size of 5 μm and is made of PP cotton, used to intercept impurities in the electrolyte. Figure 6 In the adsorption chamber 611, an annular mounting groove 614 is provided on the inner wall. The top of the mounting groove 614 is provided with a mounting slot 615 for mounting the filter element 613. Fixing blocks 616 are provided on both sides of the filter element 613, which are adapted to the size of the mounting slot 615 and are rotatably mounted to the inner wall of the mounting groove 614. A rotating protrusion 617 for rotating the filter element 613 is also provided at the center of the top.

[0066] Combination Figure 2 As shown, a circulation pump group 70 for accelerating electrolyte renewal is provided between the manifold 102 and the electrolyte storage tank 30. The circulation pump group 70 includes a circulation centrifugal pump 71 and a feed pipe 72 connected to the electrolyte storage tank 30. The circulation centrifugal pump 71 is a corrosion-resistant centrifugal pump with a flow rate of 0.8 L / min and a head of 7 m. The feed pipe 72 is a feed pipe and is also provided with a liquid replenishment connector, which is not shown in the figure. The feed pipe 72 has a diameter of 10 mm and is equipped with a solenoid valve control switch at the end. A pretreatment liquid storage tank 80 with a volume of 20-30 L is also provided on one side of the electrolyte storage tank 30 for storing pickling activation liquid. A delivery pipe 81 is provided between the pretreatment liquid storage tank 80 and the main supply liquid pipe 31. A target for microporous spraying is also provided above the circuit board substrate 1. A main liquid supply pipe 31 is provided between the flow guide nozzle 40, the electrolyte storage tank 30, and the targeted flow guide nozzle 40. The targeted flow guide nozzle 40 has a flow cavity inside. At the bottom of the flow cavity is a set of central injection holes 41 and at least six sets of side oblique injection holes 42 arranged in a ring around the central injection holes 41. The central injection holes 41 are directly opposite the center of the micropore. The multiple sets of side oblique injection holes 42 are inclined at 15° towards the axis of the central injection holes 41 to ensure that the electric field gradient acts in the depth direction of the pore to achieve the construction of the targeted flow field. Multiple micro-ultrasonic vibration units, at least six sets, are also arranged along the outer periphery of the central injection holes 41 in a ring-shaped uniform distribution. Each set of micro-ultrasonic vibration units carries and is equipped with an ion concentration monitoring module. The ion concentration monitoring module is a Cu... 2+ The sensor has a detection accuracy of ±0.01g / L and a range of 0-50g / L; the miniature ultrasonic vibration unit performs ultrasonic ablation on the electrolyte in the jet, breaking the bubbles into 0.1μm microbubbles, which are then discharged with the negative pressure adsorption component 60.

[0067] Furthermore, recombining Figure 6 as well as Figure 4 As shown, the negative pressure adsorption assembly 60 circulates the electrolyte used for cleaning. The negative pressure adsorption assembly 60 includes a negative pressure adsorption head 61 installed to adsorb corresponding to the micropores, an adsorption guide tube 62 for guiding and circulating the electrolyte, and a flow control valve 63.

[0068] Reference Figure 8 and Figure 9 As shown, the flow cavity is equipped with three sets of guide vanes, namely, a first-stage guide vane 43, a second-stage guide vane 44, and a third-stage guide vane 45 arranged from top to bottom. All three sets of vanes are made of polytetrafluoroethylene (PTFE). The next-stage guide vane diverts 30% of the electrolyte from the previous stage. The main electrolyte of the guide vane is sprayed from the central injection hole 41, and the side electrolyte is sprayed from the side oblique injection hole 42. The first-stage guide vane 43 consists of a first-stage guide inner cylinder 431 and a first-stage guide shroud 432, and the second-stage guide vane 44 consists of a second-stage guide inner cylinder 441 and a second-stage guide shroud 442. The diameter of the first-stage guide inner cylinder 441 is smaller than the inner diameter of the first-stage guide inner cylinder 431. The third-stage guide vane 45 is composed of the third-stage guide inner cylinder 451 and the third-stage guide shroud 452. The outer arc surface of the third-stage guide shroud 452 with the maximum diameter is the inner side of multiple sets of side oblique spray holes 42, which is used to divide the electrolyte flow. The sides of the first-stage guide vane 43 and the second-stage guide vane 44 are all connected to the fixing rods 46 that are fixedly connected to the inner wall of the flow cavity. The third-stage guide shroud 452 is placed on top of the central spray hole 41, with a distance of 2-3 mm between it and the inlet end of the central spray hole 41, to ensure that the mainstream electrolyte enters stably.

[0069] This embodiment also proposes a method for using the microporous conductive device filled with electrochemical gradient described above, the method including the following steps:

[0070] Step 1: Device initialization and parameter matching:

[0071] 1.1 Workstation and workpiece positioning: Start the PLC control system 200, and adjust the target flow nozzle 40 to the preset workstation through the horizontal drive motor 51 and the vertical drive motor 52 of the nozzle positioning slide 50. The multi-axis workpiece adjustment platform 10 drives the substrate clamping fixture 11 to clamp the workpiece circuit board substrate 1 onto the support recess 101. The industrial camera 20 collects micro-hole information to ensure that the center spray hole 41 of the target flow nozzle 40 is aligned with the hole center and the side oblique spray hole 42 is aligned with the hole opening, thus completing the precise alignment.

[0072] 1.2 Functional Component Start-up and Parameter Setting: Set the flow splitting ratio of the inner guide vanes of the targeted flow guide nozzle 40, start the ultrasonic unit around the central injection hole 41, activate the ion monitoring module and set Cu 2+ Threshold, complete the configuration of processing parameters;

[0073] Set the negative pressure adsorption flow rate of flow control valve 63 to 0.8 L / min, start the circulating centrifugal pump 71 of circulating pump group 70, so that the electrolyte in the manifold 102 is circulated and transported to the electrolyte storage tank 30 by the circulating centrifugal pump 71, and the electrolyte storage tank 30 is established to transfer the electrolyte to the targeted flow guide nozzle 40 for spraying, and the electrolyte is guided to the manifold 102 by negative pressure through the adsorption guide pipe 62. The basic circulation of the electrolyte is completed by the circulating centrifugal pump 71 to transport the electrolyte upward to the electrolyte storage tank 30, and the air in the flow channel is discharged.

[0074] Step 2, Workpiece pretreatment and targeted flow field construction:

[0075] 2.1 Workpiece Cleaning and Activation: Pretreatment liquid is sprayed onto the circuit board substrate 1 through the pretreatment liquid storage tank 80. The pretreatment liquid storage tank 80 and the delivery pipe 81 are started. The pretreatment liquid, such as pickling activation liquid, in the pretreatment liquid storage tank 80 is delivered to the targeted flow nozzle 40 through the main liquid supply pipe 31 via the delivery pipe 81. The liquid is sprayed onto the surface of the workpiece circuit board substrate 1 through the oblique spray holes 42 on the side of the central spray hole 41 to remove impurities and oxide layers from the inner walls of the micropores. The industrial camera 20 monitors the cleanliness of the workpiece surface in real time. After confirming that the workpiece is clean, the pretreatment liquid storage tank 80 and the delivery pipe 81 are closed to stop the supply of pretreatment liquid. The electrolyte storage tank 30 is then switched to supply electrolyte to the targeted flow nozzle 40.

[0076] 2.2 Targeted Flow Field and Two-Way Circulation Construction: The electrolyte storage tank 30 and targeted flow nozzle 40 are activated to supply electrolyte. The electrolyte is guided by blades to form a targeted flow field consisting of 70% mainstream vertical spray and 30% side oblique spray. By vertically spraying 70% of the electrolyte into the bottom of the micropores through the central spray hole 41 and obliquely spraying 30% at a 15° angle around the orifice through the side oblique spray holes 42, a targeted flow field is constructed, avoiding impact dead zones and completing the bottom deposition of the micropores. Combined with the drive of the flow control valve 63, the negative pressure adsorption head 61 generates negative pressure adsorption, constructing a two-way circulation of adsorption after spraying, accelerating the flow of electrolyte within the pores, and ensuring the deposition of Cu at the bottom of the pores. 2+ Continuous replenishment accelerates the renewal of electrolyte within the pores;

[0077] Step 3: Electrochemical gradient filling and dynamic control:

[0078] 3.1 Gradient Filling and Bubble Treatment: The micro-ultrasonic vibration unit around the central injection hole 41 is activated, and the power of the ultrasonic generator is controlled at 35kHz, 5W. The hydrogen bubbles generated by the electrochemical reaction are broken into 0.1μm microbubbles. These microbubbles, along with the electrolyte, enter the manifold 102 through the adsorption guide pipe 62, and are then transported to the electrolyte storage tank 30 by the circulating centrifugal pump 71 of the circulating pump group 70. During this process, the filter element 613 filters impurities in the electrolyte. If the ion concentration monitoring module detects Cu in the electrolyte storage tank 30... 2+When the concentration is insufficient, the PLC control system 200 triggers the feeding mechanism, replenishing the electrolyte storage tank 30 with a high-concentration copper sulfate solution through the feeding pipe 72 to maintain the Cu concentration. 2+ The concentration was stabilized at 15±1 g / L; the electrochemical deposition module applied a pulsed current between the workpiece circuit board substrate 1 and the targeted flow nozzle 40 to deposit Cu 2+ Gradient deposition within micropores;

[0079] 3.2 Electrolyte concentration stability control: The ion monitoring module monitors Cu in real time. 2+ When the concentration is below 15 g / L, the PLC control system triggers the feeding function to control the concentration at 15 ± 1 g / L and ensure filling efficiency.

[0080] 3.3 Post-filling parameter adjustment: When the industrial camera 20 detects that the micropores are filled to 80%, the PLC control system 200 reduces the flow rate and ultrasonic power of the targeted flow nozzle 40, while the flow control valve 63 keeps the adsorption flow rate constant to avoid deformation of the metal layer inside the pores and to continuously remove residual liquid bubbles.

[0081] Step 4, Filling Completion and Post-Processing:

[0082] The industrial camera 20 confirmed that the micropores were free of voids or inclusions, and the ion concentration monitoring module displayed Cu. 2+ After the concentration stabilizes, the electrochemical deposition module, the electrolyte supply of the targeted flow nozzle 40, and the ultrasonic vibration unit are turned off; the multi-axis workpiece adjustment platform 10 moves the workpiece circuit board substrate 1 to the post-processing station; the flow control valve 63 and the circulating centrifugal pump 71 of the circulating pump group 70 are turned off; the fixed block 616 is disengaged from the mounting slot 615 by rotating the rotating protrusion 617 to clean impurities; deionized water is introduced into the adsorption guide pipe 62 and the manifold 102; after the circulating centrifugal pump 71 is started to flush the flow channel, the filter element 613 is reset, and the main body of the equipment 100 is turned off.

[0083] The above specific embodiments are merely optional embodiments of the present invention. Based on the technical solutions of the present invention and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. An electrochemical gradient filling micro-porous through device, comprising a device main body (100) and a PLC control system (200) for controlling the operation of each component in the entire device main body (100), a circuit board substrate (1) is placed in the device main body (100), the position of the circuit board substrate (1) is moved and the angle is adjusted through a multi-axis workpiece adjusting platform (10) arranged in the device main body (100), and an industrial camera (20) for position and shape collection is further arranged on the top of the circuit board substrate (1), characterized in that: The multi-axis workpiece adjusting platform (10) is provided below with a support recess (101) fixedly connected with the equipment main body (100), and below the support recess (101) is provided with a collecting groove (102) for installing multiple sets of negative pressure adsorption assemblies (60), and between the collecting groove (102) and the electrolyte storage tank (30) is provided with a circulating pump set (70) for accelerating electrolyte updating; ​ The circuit board substrate (1) is further provided above with a target flow guide nozzle (40) for micro-hole spraying, the inside of the target flow guide nozzle (40) is provided with a flow passage cavity, the bottom of the flow passage cavity is provided with a group of central injection holes (41) and at least six groups of side inclined injection holes (42) arranged in a ring outside the central injection holes (41), and three groups of flow guide vanes are arranged in the flow passage cavity, namely a first-level flow guide vane (43), a second-level flow guide vane (44) and a third-level flow guide vane (45) arranged in sequence from top to bottom, the next level flow guide vane shunts 30% of the electrolyte of the previous level, the main flow of the flow guide vane is injected from the central injection hole (41), and the side flow is injected from the side inclined injection hole (42); The negative pressure adsorption assembly (60) circulates and guides the electrolyte used for cleaning, and the negative pressure adsorption assembly (60) comprises a negative pressure adsorption head (61) corresponding to the micro-hole and mounted by adsorption, and an adsorption flow guide pipe (62) and a flow control valve (63) for electrolyte circulation and guidance.

2. An electrochemically gradient-filled, microporous, conductive device according to claim 1, wherein, The central injection hole (41) is arranged opposite the center of the micro-hole, and the multiple groups of side inclined injection holes (42) are arranged at an angle of 15° to the central injection hole (41) axis position, so as to ensure that the electric field gradient acts on the hole depth direction to realize the construction of the target flow field.

3. An electrochemically gradient-filled, microporous, conductive device according to claim 2, wherein, A plurality of micro ultrasonic vibration units are further arranged along the outer periphery of the central injection hole (41), each group of micro ultrasonic vibration units carries an ion concentration monitoring module, the micro ultrasonic vibration unit implements ultrasonic crushing on the electrolyte of the injection flow, so that the bubbles are crushed into micro-bubbles of 0.1-0.3μm, and the micro-bubbles are discharged with the negative pressure adsorption assembly (60).

4. An electrochemically gradient-filled, microporous, conductive device according to claim 3, wherein, The first-level flow guide vane (43) is composed of a first-level flow guide inner cylinder (431) and a first-level flow guide cover (432), the second-level flow guide vane (44) is composed of a second-level flow guide inner cylinder (441) and a second-level flow guide cover (442), and the third-level flow guide vane (45) is composed of a third-level flow guide inner cylinder (451) and a third-level flow guide cover (452); The side surfaces of the first-level flow guide vane (43) and the second-level flow guide vane (44) are both connected with a fixed rod (46) fixedly connected with the inner wall of the flow passage cavity; The third-level flow guide cover (452) is arranged on the top of the central injection hole (41).

5. An electrochemically gradient-filled, microporous, conductive device according to claim 4, wherein, The pipe diameter of the second-level flow guide inner cylinder (441) is smaller than the inner diameter of the first-level flow guide inner cylinder (431), and the maximum diameter of the outer arc surface of the third-level flow guide cover (452) is the inner side of the multiple groups of side inclined injection holes (42), for partitioning the flow of the electrolyte.

6. An electrochemically gradient-filled, microporous, conductive device according to claim 1, wherein, A plurality of groups of communication holes (1011) are formed in the support recess (101) and are in communication with the top of the flow collection groove (102), the adsorption flow guide pipe (62) is fixedly connected with the inner wall of the communication hole (1011) through a limiting ring, the outer ring of the limiting ring is fixedly connected with the inner wall of the communication hole (1011), the inner ring of the limiting ring has a larger diameter than the outer diameter of the adsorption flow guide pipe (62), and the negative pressure adsorption head (61) is limited above the support recess (101).

7. An electrochemically gradient-filled, microporous, conductive device according to claim 1, wherein, The negative pressure adsorption head (61) comprises a bucket-shaped adsorption cavity (611) and a sealing washer (612) fixedly connected to the top of the adsorption cavity (611), and a filter core (613) is detachably installed on the inner wall of the adsorption cavity (611). An annular mounting groove (614) is formed in the inner wall of the adsorption cavity (611), a mounting clamping groove (615) for clamping the filter core (613) is formed in the top of the mounting groove (614), and a fixing block (616) is rotatably installed on the inner wall of the mounting groove (614) and has a size suitable for the filter core (613). A rotating protrusion (617) is further arranged at the top center of the filter core (613) and is used for rotating the filter core (613).

8. An electrochemically gradient-filled, microporous, conductive device according to claim 1, wherein, A substrate clamping clamp (11) for clamping and limiting the circuit board substrate (1) is installed above the multi-axis workpiece adjusting platform (10), a clamping drive cylinder (12) for driving two groups of clamping jaws (13) to move relative to each other is arranged above the substrate clamping clamp (11), and a plurality of strip-shaped notches are formed in the substrate clamping clamp (11).

9. An electrochemically gradient-filled, microporous, conductive device according to claim 1, wherein, An industrial camera (20) for collecting image information of the circuit board substrate (1) is further installed in the equipment main body (100). A target flow guide nozzle (40) is arranged on the top of the target flow guide nozzle (40) and is used for adjusting the position of the spray flow of the target flow guide nozzle (40), the target flow guide nozzle (40) comprises a transverse drive motor (51) and a longitudinal drive motor (52). A main liquid supply pipeline (31) is arranged between the electrolyte storage tank (30) and the target flow guide nozzle (40), a pretreatment liquid storage tank (80) is further arranged on one side of the electrolyte storage tank (30), and a conveying pipe (81) is arranged between the pretreatment liquid storage tank (80) and the main liquid supply pipeline (31). The circulating pump group (70) comprises a circulating centrifugal pump (71) and a replenishment pipe (72) in communication with the electrolyte storage tank (30).

10. A method of using an electrochemically gradient-filled microporous conductive device according to any one of claims 1-9, characterized in that, The method comprises the following steps: Step 1: Adjust the target flow guide nozzle (40) to a preset station through the nozzle positioning sliding table (50), drive the substrate clamping clamp (11) to clamp the workpiece circuit board substrate (1) on the support recess (101) through the multi-axis workpiece adjusting platform (10), collect the micropore information through the industrial camera (20), and ensure that the center spray hole (41) of the target flow guide nozzle (40) is aligned with the hole center and the side inclined spray hole (42) is aligned with the hole opening, and complete the precise alignment; Step 2, set the split ratio of the target guide vane in the guide nozzle (40), start the outer peripheral ultrasonic unit of the center injection hole (41), activate the ion monitoring module and set the Cu 2+ threshold value, complete the processing parameter configuration; Step 3: Spray the pretreatment liquid to the circuit board substrate (1) through the pretreatment liquid storage tank (80), stop the supply after confirming that the surface is clean through the industrial camera (20), and prepare for subsequent filling. Step 4, start the electrolyte storage tank (30) and target flow guide nozzle (40) liquid supply, electrolyte through the blade flow guide to form a 70% main flow vertical spray plus 30% side branch oblique spray target flow field, combined with the drive of the flow control valve (63) to make the negative pressure adsorption head (61) negative pressure adsorption, to build a two-way circulation after spraying and adsorption, accelerate the electrolyte update in the hole, and recycle the electrolyte after treatment by the circulating pump group (70); Step 5, drive the electrochemical deposition module to apply pulse current, Cu 2+ Intracellular gradient deposition, ultrasonic unit breaks 2-5 μm bubbles into microbubbles, and removes them with the negative pressure of the adsorption flow guide pipe (62); Step 6, the ion monitoring module monitors Cu in real time 2+ When the concentration is lower than 15 g / L, the PLC control system (200) triggers the feeding to control the concentration at 15±1 g / L, ensuring the filling efficiency. When the industrial camera (20) monitors that the micropore is filled to 80%, the flow of the target flow guide nozzle (40) and the ultrasonic power are reduced, the flow control valve (63) remains adsorbed to avoid deformation of the metal layer in the hole, and residual liquid bubbles are continuously discharged. Step 7, confirm Cu 2+ After the concentration is stable and the micropores are defect-free, the equipment is closed to end the filling, and the multi-axis workpiece adjustment platform (10) moves the workpiece circuit board substrate (1) to the post-processing station.

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