Cooling assembly for heat dissipation

Abstract

The invention relates to a cooling assembly for dissipating heat from an object to be cooled, comprising: an inlet (11) through which a cooling medium can be supplied to the cooling assembly (10); flow channels which are connected in parallel and through which a cooling medium supplied through the inlet (11) can flow; and an outlet (12) through which the cooling medium can be discharged from the cooling assembly (10), in particular after heat is absorbed from the object to be cooled. The invention is characterized in that the cooling arrangement (10) has at least one diverting device (20), which is arranged downstream of the flow channels connected in parallel, to which diverting device a cooling medium flowing through at least one of the flow channels connected in parallel in the main flow direction is conducted and from which diverting device the cooling medium is diverted transversely, in this way, the cooling medium continues to flow laterally downstream of the deflection device (20) offset from the main flow direction.

Description

Technical Field

[0001] The present invention relates to a cooling assembly for dissipating heat from an object to be cooled, the cooling assembly having: an inlet through which a cooling medium can be supplied to the cooling assembly; a parallel-connected flow channel through which the cooling medium supplied through the inlet can flow; and an outlet through which the cooling medium can be discharged from the cooling assembly, particularly after absorbing heat from the object to be cooled. Background Technology

[0002] Cooling components through which a cooling medium flows, or through which a cooling medium can flow, are used, for example, in power electronic components such as power electronic semiconductor modules, or high-performance chips. They must be particularly efficient, possessing high levels of performance, and typically feature a metal heat sink—that is, a heat sink made of metal or a metal alloy (possibly with a coating)—with a preferably horizontal or flat heat-absorbing side formed by a cooling surface. When using the cooling component, this heat-absorbing side is positioned as close as possible to the object to be cooled to optimize heat transfer—if necessary, by direct mounting or with the aid of an intermediate layer using a thermal interface material, particularly thermal paste—on the (e.g., equally flat) heat-dissipating side of the object to be cooled. The heat sink then absorbs waste heat from the object to be cooled, which is subsequently dissipated through the cooling medium. The cooling medium flows through the channels within the cooling component.

[0003] When cooling multiple high-performance chips arranged in a matrix, these chips are typically positioned on the cooling surface of a cooling assembly, with the cooling medium flowing parallel to the direction of flow along the rows of chips arranged sequentially. During this process, the cooling medium heats up, causing the cooling capacity to decrease along the flow direction without intervention. Furthermore, the varying heat input along the flow direction from the matrix of chips results in different degrees of temperature rise in the cooling medium. For example, the outer edges of the cooling assembly experience a smaller temperature rise compared to the inner edges; therefore, without intervention, further cooling performance at the inner edges will be significantly weaker than at the outer edges. Summary of the Invention

[0004] The objective of this invention is to further develop a cooling assembly of the type mentioned above, particularly by appropriately designing the cooling assembly to eliminate the aforementioned effects when necessary.

[0005] This task is accomplished by a cooling assembly having the features described in claim 1.

[0006] Therefore, the cooling assembly according to the invention is characterized in that the cooling assembly includes at least one deflection device arranged downstream of parallel connected flow channels, through which at least one of the parallel connected flow channels, flowing in the main flow direction, is guided to the deflection device, and the cooling medium is laterally deflected from the deflection device, such that the cooling medium continues to flow laterally downstream of the deflection device with an offset relative to the main flow direction.

[0007] Therefore, by using one or more such deflection devices, it is advantageous, for example, to redirect cooling medium, which is less heated by one or more objects to be cooled, located in one of the parallel flow channels, to a region of the cooling assembly where particularly strong heat input from other objects to be cooled can be anticipated during process progress, or, unrelated to the above, particularly strong heat input that needs to be cooled in this region, for example.

[0008] For example, if a cooling assembly comprises multiple cooling zones connected in series, each having parallel-connected flow channels aligned with each other, then without such a deflection device, the cooling medium flowing on the outer side of the first cooling zone and potentially heated less will also flow on the outer side of the second cooling zone, and will be reheated less than the cooling medium flowing on the inner side.

[0009] Furthermore, it can be configured such that the cooling medium flowing through at least one of the parallel-connected flow channels is guided within the cooling assembly, such that the cooling medium mixes with the cooling medium that is laterally diverted by a deflector. In other words, the cooling medium flowing through the flow channel that guides the cooling medium to the deflector, heated to a higher or lower degree, can then mix with a plurality of correspondingly less heated or strongly heated cooling media in another flow channel, in order to selectively change the temperature of the cooling medium. It can be configured such that the cooling medium flowing through the other parallel-connected flow channel is also guided to the deflector or another deflector, and then laterally diverted therefrom, allowing mixing to occur. Thus, for example, the deflector can redirect the cooling medium through two flow channels, causing the cooling media to flow toward each other.

[0010] Alternatively, the cooling medium flowing through the diverting device may be configured such that the flow channel and / or another flow channel is a heat dissipation channel of a heat dissipation structure, which forms part of a cooling assembly preferably as a metal radiator. The heat dissipation structure has multiple heat dissipation channels, and in particular, the heat dissipation channels of the heat dissipation structure are defined by adjacent heat sinks or heat sinks, which are spaced apart at equal intervals.

[0011] Alternatively, the flow path through which the cooling medium flowing towards the diversion device passes and / or the other flow path can be a side-flow channel, which is connected in parallel to a heat dissipation structure. This heat dissipation structure forms the heat dissipation channel of the entire or part of the radiator of the cooling assembly, and has multiple heat dissipation channels. Specifically, the heat dissipation channels of this heat dissipation structure are defined by adjacent heat sinks or heat sink columns, which are equally spaced. This can be a side-flow channel that reduces the flow resistance of the heat dissipation structure compared to a heat dissipation structure without such side-flow channels, and / or, where applicable, allows any particles in the cooling medium that cannot pass through these heat dissipation channels to pass through.

[0012] In addition, the following configuration can be provided: the cooling medium steering device includes a steering wall, which preferably extends obliquely relative to the main flow direction of the cooling medium, and the cooling medium impacts the steering wall and is laterally turned through the steering wall.

[0013] In addition, the following configuration can be used: parallel side flow channels extend in a plane that is parallel to and separated from the plane of the heat dissipation channel of the heat dissipation structure by a certain distance.

[0014] Furthermore, the following configuration is possible: the steering device is designed and arranged such that the cooling medium flowing through the sideflow channel is guided to the steering device and laterally turned by it, preferably further laterally inward. Specifically, this is achieved by a first steering wall that extends obliquely relative to the main flow direction within the sideflow channel. Additionally, the steering device can be designed and arranged such that the cooling medium flowing through the heat dissipation channel is guided to the steering device and laterally turned by it, preferably further laterally outward. Specifically, this is achieved by a second steering wall that extends obliquely relative to the main flow direction within the heat dissipation channel.

[0015] In addition, the following configuration can be provided: the steering device includes a partition wall having two opposing sides that separate the cooling medium flowing out from the side flow channel from the cooling medium flowing out from the heat dissipation channel. By designing and placing the partition wall in this way, the cooling medium flowing out from the side flow channel is guided along one side of the partition wall, while the cooling medium flowing out from the heat dissipation channel is guided along the opposite side of the partition wall.

[0016] In addition, the following configuration can be made: the steering device is a component separate from the radiator and the radiator's heat dissipation structure.

[0017] Furthermore, the cooling assembly can be configured as follows: It has multiple cooling zones connected in series and / or multiple parallel zones, such that cooling medium supplied through the inlet flows sequentially or parallel through these cooling zones, and each of these zones includes a heat dissipation structure having multiple heat dissipation channels. Specifically, the heat dissipation channels of the heat dissipation structure are defined by adjacent heat sinks or heat dissipation columns, which are equally spaced. Each cooling zone includes a side-flow channel connected in parallel to the heat dissipation channels, specifically for: reducing the flow resistance of the cooling zone in question compared to a cooling zone without such side-flow channels, and / or allowing any particles contained in the cooling medium that cannot pass through these heat dissipation channels to pass through.

[0018] Alternatively, the steering mechanism can be positioned between two consecutive, series-connected cooling zones.

[0019] The diversion device can also be arranged between two groups of consecutive, series-connected cooling zones. The cooling medium supplied to the diversion device from the structural flow channel of the innermost cooling zone in the upstream, parallel-connected cooling zone group is laterally diverted by the diversion device to the structural flow channel of the outermost cooling zone in the downstream, parallel-connected cooling zone group. Alternatively, the cooling medium supplied to the diversion device from the side flow channel of the outermost cooling zone in the upstream, parallel-connected cooling zone group is laterally diverted by the diversion device to the side flow channel of the innermost cooling zone in the downstream, parallel-connected cooling zone group.

[0020] In this context, the following configuration is also possible: the steering device laterally redirects the cooling medium supplied to the steering device from the structural flow channel of the upstream cooling region in the series-connected cooling regions to the side flow channel of the downstream cooling region, and / or the cooling medium supplied to the steering device from the side flow channel of the upstream cooling region in the series-connected cooling regions is laterally redirected by the steering device to the structural flow channel of the downstream cooling region.

[0021] In the case of a metal radiator, it may comprise or be formed of a component made of (where applicable, coated) metal or (where applicable, coated) metal alloy, which includes on one side a heat dissipation structure located in a portion of the material, the heat dissipation structure being opposite to the cooling surface of the cooling component, particularly a flat cooling surface, against which an object to be cooled may be placed to absorb heat from the cooling surface.

[0022] Regarding the cooling surface of the cooling assembly, it can be formed from the (outer) side of the radiator, or from the (outer) side of another cooling assembly body, preferably metal, in particular plate-shaped, which is thermally connected to the radiator. Attached Figure Description

[0023] Further features of the invention can be found in the appended claims, the following description of preferred embodiments, and the accompanying drawings.

[0024] The attached diagram shows: Figure 1 The cooling assembly according to the invention as viewed from a top-down and oblique angle; Figure 2 As shown in the first exploded view Figure 1 The cooling assembly according to the present invention; Figure 3 As shown in the second exploded diagram Figure 1 The cooling assembly according to the present invention; Figure 4 : As shown in the cross-sectional view Figure 1 The cooling assembly according to the present invention; Figure 5 : shown in the first longitudinal section view Figure 1 The cooling assembly according to the present invention; Figure 6 Viewed from a top-down perspective Figure 1 The cooling assembly according to the invention, wherein the (upper) housing portion is omitted; Figure 7 : As shown in the enlarged view Figure 1 Details of the cooling assembly according to the invention, namely, the steering device of the cooling assembly viewed from a top and oblique angle, the steering device in... Figure 2 and Figure 3 Visible in the middle; Figure 8 : Observed from an upward and oblique angle Figure 7 Cooling components. Detailed Implementation

[0025] The bottom side 13 of the cooling assembly 10 shown in the accompanying drawings may be provided with an object (not shown) to be cooled, so that heat can be dissipated from the object to the cooling assembly 10. This cooling assembly 10 is part of a higher-level cooling device in this invention, which is not shown in detail in other aspects.

[0026] This cooling device and its cooling component 10 can be used, for example, to cool multiple power electronic units or high-performance chips, such as power electronic semiconductor modules. Such power electronic components can be used in scenarios related to batteries in electric vehicles or rechargeable batteries. However, it should be understood that the type of component to be cooled is not critical.

[0027] This higher-level cooling device may include or be filled with a cooling medium, which is delivered by a pump through the cooling assembly 10, causing the cooling medium to flow through the cooling assembly 10 and absorb and dissipate heat from the object to be cooled during its flow. For this purpose, the pump can be connected to the inlet 11 and outlet 12 of the cooling assembly 10 via a media delivery pipe such as a hose.

[0028] Typically, the cooling medium is a coolant. However, it should be understood that using a gaseous medium as the cooling medium is also within the scope of this invention.

[0029] The cooling assembly 10 includes a heat sink 14 made of metal or a metal alloy.

[0030] In this invention, the radiator 14 is connected to a plurality of heat dissipation structures or heat sink structures in a manner such as, for example, a combination of materials or a homogeneous material, which are not explicitly shown in this invention (reference numeral 15 indicates the arrangement of these heat dissipation structures or heat sink structures). These heat dissipation structures or heat sink structures have a single thin-walled (material) heat sink and narrow flow channels defined by these structures. These flow channels are designed as heat dissipation channels through which the cooling medium flows during operation of the cooling device, thereby flowing from the direction of inlet 11 to the direction of outlet 12.

[0031] In other words, the heat sink 14 includes the heat dissipation structure described above, for example, which is formed by milling or other means.

[0032] In the lateral direction of the cooling assembly 10, the various heat dissipation structures are separated from each other by partition walls 18.

[0033] At the top, the radiator 14 is covered by a housing portion 17, which is made of metal, for example, and is sealed by a fluid seal.

[0034] In this invention, the bottom side of the heat sink 14 also forms the lower side or heat absorption side 13 of the cooling component 10. In the cooling mode, the component to be cooled is attached to the lower side or heat absorption side 13.

[0035] However, for example, the heat sink 14 can also be connected to another cooling component body, such as a plate-shaped metal, in a thermally conductive manner (directly or by means of thermal paste applied to the heat sink 14), such that the further cooling component body or its bottom side subsequently forms the heat-absorbing side 13 of the cooling component 10. This design is particularly practical, for example, by making the heat sink 14 a first (metal) material such as aluminum, which has a slightly lower thermal conductivity and certain manufacturing advantages, while the other cooling component body in contact with the object to be cooled is made of a second (metal) material such as copper, which has a higher thermal conductivity than aluminum.

[0036] In this invention, each heat dissipation structure is also part of a separate designated cooling region 16a, 16b, 16c or 16d through which the cooling medium flows.

[0037] As further shown in the accompanying drawings, the radiator 14 of the present invention comprises three substantially similar sections A, B and C in sequence along the flow direction or length direction of the cooling assembly 10, each section having four cooling regions 16a-16d, each of which is arranged sequentially or connected in series with respect to the medium flow formed from the inlet 11 to the outlet 12.

[0038] In other words, multiple cooling zones 16a-16d are directly connected in series across sections, allowing the medium to flow through these cooling zones sequentially.

[0039] For each segment A, B, and C, the corresponding cooling zones 16a-16d of segments A, B, and C are also connected in parallel, that is, the cooling medium flows through these cooling zones in parallel.

[0040] The individual heat sinks (not shown) of the heat dissipation structures (not shown) of cooling regions 16a-16d are typically very thin, and the heat dissipation channels they define are extremely narrow. However, these extremely narrow heat dissipation channels result in high pressure losses. This leads to unfavorable high flow resistance, especially considering the series connection of the individual cooling regions 16a-16d in the cooling assembly 10.

[0041] Therefore, each cooling region 16a-16d of the cooling assembly 10, i.e., the cooling assembly 10 of the present invention, includes another flow channel that extends parallel to and is spaced apart from the heat dissipation flow channel of the corresponding cooling region 16a-16d. This other flow channel is designed as a side flow channel 19, which is also connected in parallel to the corresponding heat dissipation flow channel of the corresponding cooling region 16a-16d. One of the purposes of the side flow channel 19 is to reduce the flow resistance of the corresponding cooling region 16a-16d.

[0042] In particular, from Figure 4As can be seen from the present invention, these side flow channels 19, which extend parallel to the main flow direction within the heat dissipation channel, also extend above the heat dissipation channel of the corresponding heat dissipation structure or the heat dissipation channel of the heat dissipation structure.

[0043] The side flow channel 19 is adjacent to the free end of the heat sink of the corresponding heat sink on the opening (lower) side of the heat sink structure, and in the present invention, when it is in fluid communication with the heat sink channel, it is adjacent to the bottom side of the corresponding opening on the opposite side of the heat sink channel of the heat sink structure.

[0044] Each side flow channel 19 of the cooling regions 16a-16d covers a plurality of heat dissipation channels of the heat dissipation structure of the respective cooling regions 16a-16d in a direction perpendicular to the main flow direction within the side flow channel 19. In this invention, at least 80% of the respective total number of heat dissipation channels covering their respective cooling regions 16a-16d.

[0045] At the top and sides, the side flow channel 19 and the heat dissipation channel that is ultimately connected in fluid communication with the side flow channel 19 (through the longitudinal side of the opening) are defined by the corresponding walls of the housing portion 17 adjacent to the external environment.

[0046] It has been shown that, compared to cooling regions 16a-16d without side flow channels 19, the flow resistance of each cooling region 16a-16d can be significantly reduced by connecting the side flow channels 19 in parallel with the heat dissipation channels of the respective cooling regions 16a-16d. In particular, as in the case of this invention, the cross-sectional area of ​​each side flow channel 19 is significantly larger than the cross-sectional area of ​​each individual heat dissipation channel of the respective heat dissipation structure of the respective cooling regions 16a-16d, or preferably even larger than the sum of the cross-sectional areas of the respective heat dissipation channels of the respective heat dissipation structures.

[0047] For example, if it is necessary to use the cooling assembly 10 to simultaneously cool multiple high-performance chips arranged in a matrix, the multiple high-performance chips can be arranged on the cooling surface formed by the bottom side 13 of the cooling assembly 10, so that the multiple high-performance chips are distributed below section AC, and the cooling medium in the cooling assembly 10 is guided sequentially along the chips in the flow direction. For example, in the first section A, the chip to be cooled can be assigned to one of the cooling regions 16a-16d, and in the second section B, a chip can be assigned to each of the cooling regions 16a-16d, and so on.

[0048] In this arrangement, the heat input through the chips located in the inner cooling regions (here, 16b and 16c) is generally greater than the heat input through the outer cooling regions (here, 16a and 16d). If no countermeasures are taken, this will subsequently lead to different degrees of heating of the cooling medium (weaker on the outer side than on the inner side), which in turn causes the cooling capacity of the inner cooling regions 16b and 16c to decrease segment by segment.

[0049] Therefore, according to the present invention, it is intended to counteract this effect. To this end, a deflection device 20 is provided between sections A and B or B and C or in the open space. In the present invention, these deflection devices 20 are spatially separated from each other. The deflection devices 20 deflect the cooling medium flowing out from the cooling zones 16a-16d of their respective preceding sections A or B laterally (horizontally or vertically), thereby affecting the temperature of the cooling medium and thus affecting the cooling capacity in the cooling zones 16a-16d of their respective subsequent sections B or C.

[0050] In this invention, for example, the deflection device 20 can further deflect the relatively colder cooling medium flowing out of the side flow channels 19 of the outer cooling regions 16a and 16d of sections A or B, respectively, further inward, so that the cooling medium subsequently flows more inward in the next sections B and C (and then in the cooling regions 16b and 16c), and contributes to stronger cooling performance there.

[0051] On the other hand, the more heated cooling medium flowing in the heat dissipation channels of the inner and middle cooling regions 16b and 16c of sections A and B below the side flow channel 19 is guided laterally outward by the deflection device 20 so that the cooling medium subsequently flows in the outer cooling regions 16a and 16d in the next sections B and C.

[0052] Therefore, the steering device 20 in this invention includes a horizontal partition wall 23 that substantially separates the cooling medium that is guided from the side flow channel 19 (arranged relatively above) to the steering device 20 from the cooling medium that is guided inside the heat dissipation channel (arranged relatively downstream).

[0053] Furthermore, in the respective side flow channels 19, or at the horizontal level, each of the steering devices 20 includes two vertical steering walls 22a and 22b, each of which extends obliquely relative to the flow direction in the side flow channels 19 and is obliquely opposite to each other. The cooling medium of the side flow channels 19 of the outer cooling regions 16a and 16d impacts these walls, and the cooling medium is further turned laterally (horizontally) inward through these walls in the manner described above.

[0054] In addition, in the respective heat dissipation channel area or horizontal, the deflection device 20 includes two vertical deflection walls 21a and 21b, each wall extending obliquely relative to the flow direction inside the heat dissipation channel and obliquely opposite to each other. The cooling medium of the heat dissipation channel of the inner cooling areas 16b and 16c impacts these walls respectively, and the cooling medium is further deflected laterally (horizontally) outward through these walls in the manner described above.

[0055] In this invention, the steering devices 20 are also designed as detachable independent components, but they can also be integrally formed with the radiator 14 or connected in a homogeneous material manner, or formed by the radiator 14.

[0056] It should also be understood that the steering device 20 can also be designed to optionally or additionally achieve vertical mixing of the cooling medium, that is, to achieve mixing of the cooling medium from the side flow channel 19 with the cooling medium from the heat dissipation channel.

[0057] This vertical mixing also improves the efficiency of the cooling assembly 10. This is because, compared to the heat dissipation channels of their respective heat dissipation structures, the side flow channel 19 is further away from the heat absorption side or bottom side 13 of the radiator 14 or cooling assembly 10. Therefore, the cooling medium in the heat dissipation channels is heated to a significantly higher degree by the waste heat of the object to be cooled than the cooling medium in the side flow channel 19. This mixing ensures that the cooling medium within the side flow channel 19 also functions effectively during the cooling process.

[0058] In addition to reducing flow resistance, the sideflow channel 19 serves another purpose. This is because it prevents particles in the cooling fluid from clogging the extremely narrow heat dissipation channel due to their size. This is because these particles can then flow along the significantly larger sideflow channel 19, thus being guided out of the cooling assembly 10 in this way.

[0059] To ensure that these particles are also guided to the side flow channel 19, control devices (not shown) can be provided to guide the particles to their respective side flow channels 19.

[0060] For example, these control devices may be flanks of the heat dissipation structures of the respective cooling zones 16a-16d, each of which has such a flank at its respective upstream end, the flank extending obliquely or at an angle relative to the main flow direction in the heat dissipation channel of the heat dissipation structure.

[0061] The inclined wing formed in this way ensures that when the cooling medium impacts the inclined wing, dirt particles or other material particles in the cooling medium that might otherwise clog the heat dissipation channel are redirected towards the side flow channel 19, and can then flow smoothly through the side flow channel 19 without any problems. The inclined wing of the heat dissipation structure can be formed by the corresponding inclined narrow side of each heat sink of the heat dissipation structure.

[0062] As described above, the sideflow channels must be large enough to allow particles (along with the cooling medium) that cannot pass through the heat dissipation channels to flow through them. These particles can be, for example, ≥ 0.3 mm in size. 2 Especially ≥ 0.3mm 2 And ≤ 1.2 mm 2 granules.

[0063] All features described above in the exemplary embodiments of the invention explained with reference to the accompanying drawings should be understood as examples only and not as limitations on the subject matter of the invention.

[0064] List of reference numerals in the attached diagram: AC: Section 10: Cooling components 11: Entrance 12: Exports 13: Bottom side of cooling assembly 14: Radiator 15: Location of heat dissipation structure 16a-d: Cooling area 17: Shell section 18: Partition wall used in heat dissipation structure 19: Sideflow channel 20: Steering mechanism 21a: Deflecting wall for heat dissipation structural flow 21b: Deflecting wall for heat dissipation structural flow 22a: Diverting wall for sideflow 22b: Diverting wall for sideflow 23: Steering mechanism partition wall

Claims

1. Cooling assembly for dissipating heat from an object to be cooled, the assembly having an inlet (11) through which a cooling medium can be supplied to the cooling assembly (10), flow channels through which the cooling medium supplied through the inlet (11) can flow in parallel, and an outlet (12) through which the cooling medium can be discharged from the cooling assembly (10), in particular after having absorbed heat from the object to be cooled, characterized in that The cooling assembly (10) comprises at least one turning device (20) arranged downstream of the flow channels connected in parallel, cooling medium flowing through at least one of these flow channels connected in parallel in the main flow direction being directed to the turning device (20) and being turned transversely by the turning device, so that the cooling medium continues to flow transversely offset to the main flow direction downstream of the turning device (20).

2. Cooling assembly according to claim 1, characterized in that Cooling medium flowing through at least one further flow channel connected in parallel is directed in the cooling assembly (10), in particular by being also directed to the turning device or a further turning device (20), so that it is turned transversely by the turning device or the further turning device, so that the cooling medium mixes with the cooling medium turned transversely by the turning device (20), so that mixing can occur.

3. Cooling assembly according to claim 1 or 2, characterized in that The flow channel and / or a further flow channel through which the cooling medium flowing to the turning device (20) flows is a heat dissipation flow channel of a heat dissipation structure forming part of a preferably metallic heat sink (14) of the cooling assembly (10), the heat dissipation structure comprising a plurality of heat dissipation flow channels, in particular the heat dissipation flow channels of the heat dissipation structure being delimited by adjacent heat fins or heat columns, in particular the heat fins or heat columns being equally spaced.

4. Cooling assembly according to claim 1, 2 or 3, characterized in that The flow channel and / or a further flow channel through which the cooling medium flowing to the turning device (20) flows is a side flow flow channel (19) connected in parallel to a heat dissipation structure forming heat dissipation flow channels of the heat sink (14) of the cooling assembly (10) as a whole or part thereof, the cooling assembly comprising a plurality of heat dissipation flow channels, in particular the heat dissipation flow channels of the heat dissipation structure being delimited by adjacent heat fins or heat columns, in particular the heat fins or heat columns being equally spaced, in particular such a side flow flow channel (19) serving to reduce the flow resistance of the heat dissipation structure compared to a heat dissipation structure without such a side flow flow channel (19) and / or, if applicable, to direct particles contained in the cooling medium that cannot pass through the heat dissipation flow channels.

5. Cooling assembly according to one or more of the preceding claims, characterized in that, The turning device (20) of the cooling medium comprises a turning wall, which preferably extends obliquely with respect to the main flow direction of the cooling medium, the cooling medium impinging on the turning wall and being turned transversely by the turning wall.

6. Cooling assembly according to one or more of the preceding claims, characterized in that, The side flow flow channels (19) connected in parallel extend in a plane that is parallel to and spaced apart from the plane in which the heat dissipation flow channels of the heat dissipation structure lie.

7. Cooling assembly according to one or more of the preceding claims, characterized in that The turning device (20) is designed and arranged such that cooling medium flowing through the side flow channel (19) is guided to the turning device (20) and turned laterally, preferably further laterally inwards, in particular by means of a first turning wall of the turning device, which extends obliquely to the main flow direction within the side flow channel (19); and such that cooling medium flowing through the heat sink flow channel is guided to the turning device (20) and turned laterally, preferably further laterally outwards, in particular by means of a second turning wall in the heat sink flow channel, which extends obliquely to the main flow direction within the heat sink flow channel.

8. Cooling assembly according to claims 6 and 7, characterized in that The turning device (20) has a partition wall having two opposite sides, which separate cooling medium flowing out of the side flow channel (19) from cooling medium flowing out of the heat sink flow channel, the partition wall being designed and placed such that cooling medium exiting from the side flow channel (19) is guided along one side of the partition wall and cooling medium flowing out of the heat sink flow channel is guided along the opposite other side of the partition wall.

9. Cooling assembly according to one or more of the preceding claims, characterized in that, The turning device (20) is a separate component from the heat sink (14) and the heat sink structure of the heat sink (14).

10. Cooling assembly according to one or more of the preceding claims, characterized in that, The cooling assembly (10) comprises a plurality of serially connected cooling regions and / or a plurality of parallel connected cooling regions, such that cooling medium supplied through the inlet (11) flows through the plurality of serially connected cooling regions and the plurality of parallel connected cooling regions in succession or in parallel, wherein each cooling region comprises a heat sink structure having a plurality of heat sink flow channels, in particular the heat sink flow channels of the heat sink structure being delimited by adjacent heat sink fins or heat sink columns, in particular the heat sink fins or heat sink columns being equally spaced, and wherein each of the cooling regions comprises a side flow channel (19) connected in parallel to the heat sink flow channels, in particular for reducing the flow resistance of the cooling region in question compared to a cooling region without such a side flow channel (19) and / or for guiding any particles contained in the cooling medium, which cannot pass through the heat sink flow channels, through, if applicable.

11. Cooling assembly according to claim 10, characterized in that The turning device (20) is arranged between two consecutive serially connected cooling regions.

12. The cooling assembly of claim 11, wherein, The diverting device (20) is arranged between two successive groups of cooling regions connected in parallel, and cooling medium supplied to the diverting device from a structural flow channel of a cooling region arranged more inward in the group of cooling regions connected in parallel upstream is diverted laterally by the diverting device (20) to a structural flow channel of a cooling region arranged more outward in the group of cooling regions connected in parallel downstream; and / or the diverting device (20) diverts cooling medium supplied to the diverting device from a side flow channel (19) of a cooling region arranged more outward in the group of cooling regions connected in parallel upstream to a side flow channel (19) of a cooling region arranged more inward in the group of cooling regions connected in parallel downstream.

13. Cooling assembly according to claim 11 or 12, characterized in that Cooling medium supplied to the diverting device from a structural flow channel of a cooling region arranged upstream in the group of cooling regions connected in parallel is diverted laterally by the diverting device (20) to a side flow channel (19) of a cooling region arranged downstream; and / or the diverting device (20) diverts cooling medium supplied to the diverting device from a side flow channel (19) of a cooling region arranged upstream in the group of cooling regions connected in parallel laterally by the diverting device (20) to a structural flow channel of a cooling region arranged downstream.

14. Cooling assembly according to one or more of the preceding claims, characterized in that, The metal heat sink (14) comprises or is formed from a component of metal or metal alloy, as the case can be with a coating, which on one side comprises the heat dissipation structure in a material portion, the heat dissipation structure facing away from a cooling surface, in particular a flat cooling surface, of the cooling assembly (10), against which a body to be cooled can be placed in order to absorb heat from the cooling surface.

15. Cooling assembly according to one or more of the preceding claims, characterized in that, The cooling surface of the cooling assembly (10) is formed by a (outer) side of the heat sink (14), or by a (outer) side of a further cooling assembly body, preferably of metal, in particular of plate shape, which is connected in a thermally conductive manner to the heat sink (14).

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