Segmented multi-blade spiral milling cutter for milling semiconductor material and processing method of segmented multi-blade spiral milling cutter

Abstract

The invention provides a sectional type multi-blade spiral milling cutter for milling a semiconductor material and a machining method, and relates to the field of spiral milling cutters. The machining method comprises the steps that according to cutter bar outer diameter parameters of a target sectional type multi-blade spiral milling cutter, the outer diameter of a cutter bar base material is milled, and a first cutter bar is obtained; milling one end of the first cutter bar to obtain a second cutter bar; according to the preset number of the tool bits, the second tool bar is subjected to groove milling treatment, and a third tool bar is obtained; according to the preset number of the tool bits and the initial parameters of the tool bits, the tool bit base material is subjected to segmented cutting treatment, and the tool bits in the target shape are obtained; a tool bit in the target shape is welded in the mounting groove, and a first sectional type multi-blade spiral milling cutter is obtained; and according to the first preset front angle, laser cutting treatment is conducted on the first sectional type multi-blade spiral milling cutter, and the target sectional type multi-blade spiral milling cutter is obtained. According to the scheme, the service life of the spiral milling cutter is prolonged, the machining efficiency is improved, and the machining quality of silicon carbide semiconductor materials is guaranteed.

Description

Technical Field

[0001] This invention relates to the field of spiral end mills, and in particular to a segmented multi-blade spiral end mill for milling semiconductor materials and a machining method thereof. Background Technology

[0002] Silicon carbide (SiC), an important semiconductor and structural material, possesses extremely high hardness and wear resistance, with a Mohs hardness of 9.5, second only to diamond. Current milling operations for SiC and other semiconductor and structural materials primarily utilize long-blade helical end mills. However, due to the unique properties of SiC, the cutting edge of long-blade helical end mills experiences uneven stress during machining, generating radial shear forces. This uneven stress leads to severe tool wear, significantly reducing tool life and reliability. Furthermore, the structure of long-blade helical end mills limits the rake angle to a range of 5 to 10 degrees when machining silicon carbide semiconductors and structural materials. When the rake angle is less than 5 degrees, tool breakage is likely, severely impacting machining efficiency. Additionally, due to the high brittleness of SiC, excessively large rake angles can easily cause microcracks and edge chipping during machining, affecting part reliability. Therefore, there is an urgent need to develop a helical end mill that can reduce tool wear, improve machining efficiency for SiC, and simultaneously ensure machining quality. Summary of the Invention

[0003] This invention provides a segmented multi-blade spiral end mill and a machining method for milling semiconductor materials, which solves the problems of short tool life, low machining efficiency and poor product quality of existing long-blade spiral end mills when machining silicon carbide semiconductor materials.

[0004] To solve the above-mentioned technical problems, the technical solution of the present invention is as follows: This invention provides a method for machining a segmented multi-flute helical milling cutter for milling semiconductor materials, comprising: Obtain the head substrate and shank substrate of a target segmented multi-flute spiral milling cutter for milling semiconductor materials; Based on the outer diameter parameters of the tool holder of the target segmented multi-blade spiral end mill, the outer diameter of the tool holder substrate is milled to obtain the first tool holder; One end of the first tool holder is milled to obtain a second tool holder; wherein, one end of the second tool holder is formed with a plurality of spiral clearance grooves, and each spiral clearance groove is formed with a mounting surface; Based on the preset number of cutter heads of the target segmented multi-blade spiral end mill, the second cutter bar is milled to obtain the third cutter bar; wherein, a preset number of mounting slots are opened on each mounting surface of the third cutter bar; Based on the preset number of cutter heads of the target segmented multi-blade spiral end mill and the initial parameters of the first segmented multi-blade spiral end mill cutter head, the cutter head substrate is segmented and cut to obtain a preset number of cutter heads of the target shape. The cutter head of the target shape is welded into the mounting groove to obtain the first segmented multi-blade spiral end mill; Based on the first preset rake angle of the target segmented multi-blade spiral milling cutter head, the first segmented multi-blade spiral milling cutter is subjected to laser cutting to obtain the target segmented multi-blade spiral milling cutter; wherein, the value range of the first preset rake angle is 0 to -3 degrees.

[0005] Optionally, one end of the first tool holder is milled to obtain a second tool holder, including: According to the preset machining parameters of the spiral clearance groove, one end of the first tool holder is milled to obtain the first machining tool holder; wherein, the preset machining parameters include the number of spiral clearance grooves, the machining length, and the depth of the spiral clearance groove; The target radial width of the mounting surface is determined based on the outer diameter of the first tool holder; wherein the target radial width of the mounting surface is one-sixth of the outer diameter of the first tool holder; Based on the preset included angle between the spiral end face of the spiral clearance groove and the mounting surface, and the target radial width of the mounting surface, the mounting surface is milled on one side of each spiral clearance groove to obtain the second tool holder.

[0006] Optionally, based on a preset number of cutter heads of the target segmented multi-flute helical end mill, the second cutter bar is milled to obtain a third cutter bar, including: Obtain the preset thickness parameters of the target segmented multi-blade spiral end mill head; Determine the machining depth parameters of the mounting groove based on the preset thickness parameters of the cutter head; Based on the first preset distance between two adjacent mounting slots, with the mounting surface as a reference and the machining depth parameter of the mounting slot as a fixed value, a preset number of mounting slots are opened on each mounting surface.

[0007] Optionally, the cutter head of the target shape is welded into the mounting groove to obtain a first segmented multi-flute helical end mill, comprising: Based on a preset initial distance value between the cutter head of the target shape and the outer edge of the mounting surface, the cutter head of the target shape is welded into the mounting groove to obtain a first segmented multi-blade spiral end mill; wherein, the preset initial distance value is 1 mm to 2 mm greater than the preset target distance value, and the preset target distance value is a distance of 0.5 mm to 2 mm.

[0008] Optionally, based on the first preset rake angle of the target segmented multi-flute spiral end mill head, the first segmented multi-flute spiral end mill is subjected to laser cutting to obtain the target segmented multi-flute spiral end mill, including: According to the preset target distance value, the cutting head of the first segmented multi-blade spiral milling cutter is subjected to laser cutting to obtain the second segmented multi-blade spiral milling cutter. Based on the rake face thickness parameter of each cutter head of the second segmented multi-blade spiral end mill and the first preset rake angle of the target segmented multi-blade spiral end mill cutter head, determine the rake face cutting amount of each cutter head of the second segmented multi-blade spiral end mill and the flank face cutting amount of each cutter head of the second segmented multi-blade spiral end mill. Based on the cutting amount of the rake face and the cutting amount of the flank face of each cutter head, the second segmented multi-blade spiral end mill is subjected to laser cutting to obtain the third segmented multi-blade spiral end mill. Based on the preset cutting edge length and preset cutting edge width, the front and rear cutting edges of the third segmented multi-blade spiral end mill are laser-cut to obtain the target segmented multi-blade spiral end mill.

[0009] Optionally, based on the rake face thickness parameter of each cutter head of the second segmented multi-flute helical end mill and the first preset rake angle of the target segmented multi-flute helical end mill, the rake face cutting amount of each cutter head of the second segmented multi-flute helical end mill and the flank face cutting amount of each cutter head of the second segmented multi-flute helical end mill are determined, including: Based on the first preset rake angle of the target segmented multi-blade spiral end mill head and the cutting direction of the second segmented multi-blade spiral end mill head, determine the first cutting line of each cutter head of the second segmented multi-blade spiral end mill; Based on the first cutting line, determine the rake face cutting amount of each cutter head of the second segmented multi-blade spiral end mill; Based on the first preset rake angle of the target segmented multi-flute spiral end mill head, the back face cutting width h of each cutter head of the second segmented multi-flute spiral end mill is determined by the formula h=b×tan(90°-|γ|-β); where γ is the first preset rake angle; b is the effective cutting width, taken as 1.2 mm; β is the wedge angle of the cutter head, β=a+c×HV, where a is 70 degrees, c is 0.003; and HV is the material hardness. The amount of material removed from the back face of each cutter head of the second segmented multi-flute spiral end mill is determined based on the cutting width of the back face of each cutter head.

[0010] The present invention also provides a segmented multi-flute helical end mill for milling semiconductor materials, wherein the segmented multi-flute helical end mill is manufactured by the method described above, and the segmented multi-flute helical end mill comprises: A tool holder, one end of which is provided with a plurality of spiral clearance grooves integrally formed with the tool holder, and each spiral clearance groove has a mounting surface on its end face; Each of the spiral clearance grooves has multiple mounting grooves arranged evenly from top to bottom on its mounting surface. Each mounting slot is equipped with a cutting head, which is fixedly connected to the mounting slot.

[0011] Optionally, the mounting slot includes: A first mounting groove is provided on each mounting surface and near the cutting end face of the tool holder, and a plurality of second mounting grooves are located below the first mounting groove and are arranged evenly on the mounting surface in sequence. The cutting head includes: a first cutting head disposed in each first mounting slot and fixedly connected to the first mounting slot; A second cutting head is disposed in each second mounting slot and is fixedly connected to the second mounting slot.

[0012] Optionally, the first cutting head is provided with a first cutting edge; the second cutting head is provided with a second cutting edge; wherein, the first cutting edge is higher than the cutting end face of the tool holder by a predetermined distance, and the second cutting edges of the plurality of second cutting heads are arranged in a spiral shape with the first cutting edge.

[0013] Optionally, the rake angle of both the first and second cutters is in the range of 0 degrees to -3 degrees; the clearance angle of both the first and second cutters is in the range of 6 degrees to 12 degrees.

[0014] The above-described solution of the present invention has at least the following beneficial effects: The present invention describes a method for machining a segmented multi-flute spiral end mill for semiconductor material milling. This method involves obtaining a cutter head substrate and a cutter shank substrate for a target segmented multi-flute spiral end mill used for semiconductor material milling; milling the outer diameter of the cutter shank substrate according to the outer diameter parameters of the cutter shank of the target segmented multi-flute spiral end mill to obtain a first cutter shank; milling one end of the first cutter shank to obtain a second cutter shank; wherein, one end of the second cutter shank has multiple spiral clearance grooves, and each spiral clearance groove has a mounting surface; and milling the second cutter shank according to a preset number of cutter heads of the target segmented multi-flute spiral end mill to obtain a third cutter shank. In this process, each mounting surface of the third tool holder has a preset number of mounting slots. Based on the preset number of cutter heads of the target segmented multi-blade spiral end mill and the initial parameters of the first segmented multi-blade spiral end mill cutter head, the cutter head substrate is segmented and cut to obtain a preset number of target-shaped cutter heads. The target-shaped cutter heads are welded into the mounting slots to obtain the first segmented multi-blade spiral end mill. Based on the first preset rake angle of the target segmented multi-blade spiral end mill cutter head, the first segmented multi-blade spiral end mill is laser-cut to obtain the target segmented multi-blade spiral end mill. The first preset rake angle ranges from 0 to -3 degrees. This improves the service life and processing efficiency of spiral end mills when machining silicon carbide semiconductor materials, while ensuring the processing quality of silicon carbide semiconductor materials. Attached Figure Description

[0015] Figure 1 This is a schematic flowchart of the processing method of the segmented multi-blade spiral milling cutter for milling semiconductor materials according to the present invention; Figure 2 This is a perspective view of the segmented multi-blade spiral milling cutter for milling semiconductor materials according to the present invention; Figure 3 This is a perspective view of the segmented multi-blade spiral milling cutter for milling semiconductor materials according to the present invention after the cutter head has been removed; Figure 4 This is a perspective view of the segmented multi-blade spiral milling cutter for milling semiconductor materials according to the present invention after removing a single second cutter head; Figure 5 This is a top view of the segmented multi-blade spiral milling cutter for milling semiconductor materials according to the present invention; Figure 6 This is a schematic diagram of the front and rear angles of the first cutting head of the segmented multi-blade spiral milling cutter for milling semiconductor materials according to the present invention; Explanation of reference numerals in the attached figures: 1. Tool holder; 11. Cutting end face; 21. First mounting groove; 22. Second mounting groove; 31. First tool head; 311. First cutting edge; 312. Rake face; 313. Front face; 32. Second tool head; 321. Second cutting edge; 4. Mounting surface; 41. First spiral clearance groove; 42. Second spiral clearance groove; 43. Third spiral clearance groove. Detailed Implementation

[0016] Exemplary embodiments of the invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0017] like Figure 1 As shown, an embodiment of the present invention proposes a machining method for a segmented multi-flute helical milling cutter for milling semiconductor materials, comprising: Step 11: Obtain the head substrate and shank substrate of the target segmented multi-blade spiral milling cutter for milling semiconductor materials; Step 12: Based on the outer diameter parameters of the target segmented multi-blade spiral end mill, the outer diameter of the tool holder substrate is milled to obtain the first tool holder; Step 13: Mill one end of the first tool bar to obtain the second tool bar; wherein, one end of the second tool bar is formed with multiple spiral clearance grooves, and each spiral clearance groove is formed with a mounting surface; Step 14: According to the preset number of cutter heads of the target segmented multi-blade spiral end mill, the second cutter bar is milled to obtain the third cutter bar; wherein, a preset number of mounting slots are opened on each mounting surface of the third cutter bar; Step 15: According to the preset number of cutter heads of the target segmented multi-blade spiral end mill and the initial parameters of the first segmented multi-blade spiral end mill cutter head, the cutter head substrate is segmented and cut to obtain the preset number of cutter heads of the target shape. Step 16: Weld the cutter head of the target shape into the mounting groove to obtain the first segmented multi-blade spiral end mill; Step 17: Perform laser cutting on the first segmented multi-blade spiral milling cutter according to the first preset rake angle of the target segmented multi-blade spiral milling cutter head to obtain the target segmented multi-blade spiral milling cutter; wherein, the value range of the first preset rake angle is 0 to -3 degrees.

[0018] In this embodiment, the specific materials of the cutter head substrate and the cutter shank substrate can be selected according to requirements. In one optional embodiment, the cutter shank substrate is made of diamond material and the cutter shank substrate is made of tungsten steel material, with a cylindrical structure. Step 12 specifically involves obtaining the outer diameter of the cutter shank substrate; determining the outer diameter cutting amount of the cutter shank substrate based on the difference between the outer diameter of the cutter shank substrate and the outer diameter parameter of the target segmented multi-blade spiral end mill; milling the outer diameter of the cutter shank substrate according to the outer diameter cutting amount, thereby cutting the outer diameter of the cutter shank substrate to the same parameter as the outer diameter of the target segmented multi-blade spiral end mill, thus obtaining the first cutter shank. The outer diameter of the first tool holder is the same as the outer diameter parameter of the tool holder of the target segmented multi-blade spiral end mill; then, based on the first tool holder with the determined outer diameter, subsequent machining is performed; in step 17, the value range of the first preset rake angle is 0 degrees to -3 degrees; the value range of the first preset clearance angle of the target segmented multi-blade spiral end mill is 6 degrees to 12 degrees; the machining method of the segmented multi-blade spiral end mill for semiconductor material milling described in this embodiment is mainly used to process segmented multi-blade spiral end mills that can stably cut semiconductor materials. Each cutting head of the processed segmented multi-blade spiral end mill is a single-piece design, and multiple cutting heads are arranged in a spiral structure; The single-piece design of the cutting head effectively solves the problems of uneven radial shear force on the cutting head and tail during machining caused by the excessive length of the integral arc-shaped cutting insert in traditional long-bladed spiral end mills. This uneven radial shear force leads to cutting head damage, short lifespan, and chipping when the cutting head is used at a negative rake angle, making it unsuitable for machining silicon carbide semiconductor materials. The segmented multi-bladed spiral end mill machining method for semiconductor materials divides the entire arc-shaped cutting insert into multiple independent cutting heads. This ensures that the radial shear force on the cutting head and tail of each cutting head is similar during the cutting process, thereby reducing the rapid tool damage caused by excessive radial shear force differences and improving tool performance. Service life; simultaneously, based on the similarity of the shearing forces in the radial direction at both ends, the segmented multi-blade spiral end mill can extend the service life of the cutter head within the range of 0 to -3 degrees in the rake angle and 6 to 12 degrees in the clearance angle, ensuring the stability of the cutter head during machining and preventing chipping when the cutter head is in a negative angle state; in this embodiment, the machining method of the segmented multi-blade spiral end mill for milling semiconductor materials, through the design of multiple single cutter heads, a first preset rake angle, and a first preset clearance angle, effectively improves the service life and machining efficiency of the spiral end mill when machining silicon carbide semiconductor materials, while ensuring the machining quality of silicon carbide semiconductor materials.

[0019] In this embodiment, the specific structure of the segmented multi-flute helical end mill produced by the semiconductor material milling method is as follows: Figure 2As shown, the segmented multi-blade spiral end mill includes: a tool holder 1, one end of which is provided with a plurality of spiral clearance grooves integrally formed with the tool holder 1, each spiral clearance groove having a mounting surface 4 on its end face; each spiral clearance groove has a plurality of mounting slots arranged evenly from top to bottom on its mounting surface 4; each mounting slot has a cutter head fixedly connected to the mounting slot.

[0020] In an optional embodiment of the present invention, step 13 involves milling one end of the first tool holder to obtain a second tool holder; wherein one end of the second tool holder is formed with a plurality of spiral clearance grooves, and each spiral clearance groove has a mounting surface formed therein, including: Step 131: According to the preset machining parameters of the spiral clearance groove, one end of the first tool holder is milled to obtain the first machining tool holder; wherein, the preset machining parameters include the number of spiral clearance grooves, the machining length, and the depth of the spiral clearance groove; Step 132: Determine the target radial width of the mounting surface based on the outer diameter of the first tool holder; wherein the target radial width of the mounting surface is one-sixth of the outer diameter of the first tool holder; Step 133: Based on the preset included angle between the spiral end face of the spiral clearance groove and the mounting surface and the target radial width of the mounting surface, the mounting surface is milled on one side of each spiral clearance groove to obtain the second tool holder.

[0021] In this embodiment, the target radial width of the mounting surface is the distance from the outer side of the mounting surface to the end face of the spiral clearance groove; the depth parameter of the spiral clearance groove can be set according to the size and requirements of the tool holder's outer diameter. In an optional embodiment, the value range of the depth parameter is greater than one-sixth of the tool holder's outer diameter and less than one-fifth of the tool holder's outer diameter; the number parameter of the spiral clearance groove is 3; the machining length parameter is half the length of the first tool holder; the preset included angle between the spiral end face of the spiral clearance groove and the mounting surface is in the range of 90 degrees to 110 degrees; step 133 specifically involves machining an inclined mounting surface on one side of the spiral end face of the spiral clearance groove according to the preset included angle to obtain the second machining tool holder; then, based on the difference between the target radial width of the mounting surface and the radial width of the mounting surface of the second machining tool holder, determining the radial cutting amount of the mounting surface of the second machining tool holder; and cutting the outer side of the mounting surface of the second machining tool holder according to the radial cutting amount of the mounting surface of the second machining tool holder until the target radial width is reached to obtain the second tool holder.

[0022] In an optional embodiment of the present invention, step 14 involves milling grooves on the second cutter bar according to a preset number of cutter heads of the target segmented multi-blade helical end mill, to obtain a third cutter bar; wherein each mounting surface of the third cutter bar is provided with a preset number of mounting grooves, including: Step 141: Obtain the preset thickness parameters of the target segmented multi-blade spiral end mill head; Step 142: Determine the machining depth parameters of the mounting groove based on the preset thickness parameters of the cutting head; Step 143: Based on the first preset distance value between two adjacent mounting slots, with the mounting surface as the reference and the machining depth parameter of the mounting slot as a fixed value, a preset number of mounting slots are opened on each mounting surface.

[0023] In this embodiment, the preset thickness parameter of the target segmented multi-blade spiral milling cutter head can be set according to requirements; step 142 can be that the machining depth parameter of the mounting groove is 0.01 mm to 0.1 mm greater than the thickness of the corresponding mounted cutter head; step 143 can be that, with the mounting surface as a reference, a mounting groove is opened at intervals of a first preset distance value along the mounting surface downwards, and the depth of each mounting groove is equal to the machining depth parameter of the mounting groove; the value of the first preset distance value ranges from 1 mm to 2 mm.

[0024] In an optional embodiment of the present invention, step 15, based on the preset number of cutter heads of the target segmented multi-flute spiral end mill and the initial parameters of the first segmented multi-flute spiral end mill cutter head, involves segmenting the cutter head substrate to obtain a preset number of cutter heads of the target shape, including: Step 151: Cut the substrate of the cutter head of the preset length into the preset number of initial cutter heads according to the preset number of cutter heads of the target segmented multi-blade spiral end mill; Step 152: Based on the initial parameters of each cutter head, perform finishing processing on the initial cutter head to obtain a cutter head of the target shape; wherein, the initial parameters of the cutter head include: the shape of the cutter head and the initial length, initial width, and initial thickness parameters of the cutter head; wherein, the initial length is greater than the length of the cutter head of the target segmented multi-flute spiral end mill, and the initial width and initial thickness parameters can both be the same as the width and thickness of the cutter head of the target segmented multi-flute spiral end mill, wherein, the width of the cutter head of the target segmented multi-flute spiral end mill is less than the width of the mounting slot to ensure that it can be installed into the mounting slot.

[0025] In an optional embodiment of the present invention, step 16 involves welding the target-shaped cutting head into the mounting groove to obtain a first segmented multi-flute helical end mill, comprising: Based on a preset initial distance value between the cutter head of the target shape and the outer edge of the mounting surface, the cutter head of the target shape is welded into the mounting groove to obtain a first segmented multi-blade spiral end mill; wherein, the preset initial distance value is 1 mm to 2 mm greater than the preset target distance value, and the preset target distance value is a distance of 0.5 mm to 2 mm.

[0026] In this embodiment, the design of the preset initial distance value being 0.5 mm to 1 mm greater than the preset target distance value is to enable the overall cutting of the cutter head after welding, thereby reducing welding errors and ensuring that the distance between the cutting edge of each cutter head and the outer edge of the mounting surface is the same.

[0027] In an optional embodiment of the present invention, step 17, performing laser cutting on the first segmented multi-blade spiral milling cutter according to the first preset rake angle of the target segmented multi-blade spiral milling cutter head to obtain the target segmented multi-blade spiral milling cutter, includes: Step 171: According to the preset target distance value, perform laser cutting on the cutting head of the first segmented multi-blade spiral end mill to obtain the second segmented multi-blade spiral end mill; Step 172: Based on the rake face thickness parameter of each cutter head of the second segmented multi-blade spiral end mill and the first preset rake angle of the target segmented multi-blade spiral end mill, determine the rake face cutting amount of each cutter head of the second segmented multi-blade spiral end mill and the flank face cutting amount of each cutter head of the second segmented multi-blade spiral end mill. Step 173: Based on the cutting amount of the rake face and the cutting amount of the flank face of each cutter head, perform laser cutting on the second segmented multi-blade spiral end mill to obtain the third segmented multi-blade spiral end mill. Step 174: According to the preset cutting length and preset cutting width, the front and rear cutting faces of the third segmented multi-blade spiral end mill are laser-cut to obtain the target segmented multi-blade spiral end mill.

[0028] In this embodiment, the first preset rear angle is the angle between the rear face of the target segmented multi-flute spiral end mill head and the cutting direction; the first preset front angle is the angle between the transverse normal of the cutting edge of the segmented multi-flute spiral end mill head and the front face, wherein the transverse normal of the cutting edge of the segmented multi-flute spiral end mill head is perpendicular to the cutting direction normal of the segmented multi-flute spiral end mill, and the cutting edge of the segmented multi-flute spiral end mill head refers to the angle between the front face and the rear face of the end mill head.

[0029] In this embodiment, step 171 can specifically involve a laser cutting device using the spiral angle of the spiral clearance groove as the cutting path and a preset target distance value as the cutting distance to cut each cutter head of the first segmented multi-blade spiral end mill, so that the cutting edge of each cutter head of the first segmented multi-blade spiral end mill is at a preset target distance value from the outer edge of the mounting surface, thereby eliminating welding errors during the welding process; in this embodiment, step 173 is mainly used to determine the rake angle and clearance angle of the segmented multi-blade spiral end mill. In a preferred embodiment, the rake angle range of the obtained third segmented multi-blade spiral end mill is 0 degrees to -3 degrees, and the clearance angle range is 6 degrees to 12 degrees; the preset cutting length mentioned in step 174 refers to the length of the cutting edge along the front face direction; the cutting width is the length of the cutting edge along the rear face direction.

[0030] In an optional embodiment of the present invention, step 172, determining the rake face cutting amount and the flank face cutting amount of each cutter head of the second segmented multi-flute spiral end mill based on the rake face thickness parameter of each cutter head of the second segmented multi-flute spiral end mill and the first preset rake angle of the target segmented multi-flute spiral end mill head, includes: Step 1721: Determine the first cutting line of each cutter head of the second segmented multi-blade spiral end mill based on the first preset rake angle of the target segmented multi-blade spiral end mill head and the cutting direction of the second segmented multi-blade spiral end mill head. Step 1722: Determine the cutting amount of the rake face of each cutting edge of the second segmented multi-blade spiral end mill based on the first cutting line; Step 1723: Based on the first preset rake angle of the target segmented multi-flute spiral end mill head, determine the back face cutting width h of each cutter head of the second segmented multi-flute spiral end mill using the formula h=b×tan(90°-|γ|-β); where γ is the first preset rake angle; b is the effective cutting width, taken as 1.2 mm; β is the wedge angle of the cutter head, β=a+c×HV, a is 70 degrees, c is 0.003; HV is the material hardness; Step 1724: Determine the back face cutting amount of each cutter head of the second segmented multi-blade spiral end mill based on the back face cutting width of each cutter head.

[0031] In this embodiment, step 1721 can specifically be as follows: Based on the cutting direction of the second segmented multi-blade spiral end mill head, determine the transverse normal of the cutting edge of the second segmented multi-blade spiral end mill; taking the cutting edge of the second segmented multi-blade spiral end mill as the origin and the transverse normal as the first boundary, mark a second boundary on the rake face of the second segmented multi-blade spiral end mill, the angle between the second boundary and the first boundary satisfying a first preset rake angle value, and output the second boundary as the first cutting line; step 1722 can specifically be as follows: Using a laser device, directly mark the first cutting line on the rake face of each cutter head of the second segmented multi-blade spiral end mill, and determine the portion exceeding the first cutting line as the rake face cutting amount, that is, retain the portion between the first cutting line and the transverse normal of the cutting edge of the second segmented multi-blade spiral end mill, and output the portion exceeding the first cutting line. The line portion is cut off, and the first cutting line after the cut-off becomes the new rake face; in step 1723, the hardness HV of the silicon carbide semiconductor material is taken as 3000; the design of the specific parameter value of the clearance angle α=90°-|γ|-β by determining the first preset rake angle can effectively ensure the strength of the tool; in a preferred embodiment, the clearance face cutting amount can also be directly determined by selecting the first preset clearance angle, the value range of the first preset clearance angle is 6 degrees to 12 degrees; after the first preset clearance angle is determined, the clearance face cutting width is directly determined by the formula h=b×tan(α), and then the clearance face cutting amount of each cutter head of the second segmented multi-blade spiral milling cutter is determined according to the clearance face cutting width; by directly selecting the clearance angle, free cutting can be achieved, and the cutting angle can be adjusted in real time according to the cutting situation.

[0032] like Figures 2 to 6 As shown, embodiments of the present invention also propose a segmented multi-flute helical end mill for milling semiconductor materials, comprising: The tool holder 1 has a plurality of spiral clearance grooves integrally formed with the tool holder 1 at one end, and each spiral clearance groove has a mounting surface 4 on its end face; Each of the spiral clearance grooves has a plurality of mounting grooves arranged evenly from top to bottom on its mounting surface 4. Each mounting slot is equipped with a cutting head, which is fixedly connected to the mounting slot.

[0033] In an optional embodiment of the present invention, the depth of each of the mounting slots is 0.01 mm to 0.1 mm greater than the thickness of the corresponding mounted blade.

[0034] In an optional embodiment of the present invention, the distance between two adjacent mounting slots is 1 mm to 2 mm.

[0035] In an optional embodiment of the present invention, the width of the mounting surface 4 is one-sixth of the outer diameter of the tool holder 1.

[0036] In an optional embodiment of the present invention, the radial direction of the cutter head is 0.5 mm to 2 mm above the outer diameter of the cutter shank 1 or 0.5 mm to 2 mm above the outer edge of the mounting surface 4.

[0037] In this embodiment, the cutter head is welded and fixed to the mounting groove; the spiral clearance groove includes a first spiral clearance groove 41, a second spiral clearance groove 42, and a third spiral clearance groove 43; the first spiral clearance groove 41, the second spiral clearance groove 42, and the third spiral clearance groove 43 are equally distributed at one end of the cutter bar 1; the specific length of the spiral clearance groove can be set according to requirements; through the design of three spiral clearance grooves and segmented cutter heads, the cutting edge of the segmented multi-blade spiral end mill is spiral-shaped, and the cutter heads on the three spiral clearance grooves form three segmented arcs connected end to end, such as... Figure 5 As shown, this design can effectively improve processing efficiency; In this embodiment, the segmented multi-blade spiral end mill is mainly used for processing silicon carbide semiconductor materials. By adopting a multi-segment sheet cutter head splicing design, a single cutter head can be cut from small sheets, thereby reducing the cost of using large-area sheets and having the advantage of low cost. At the same time, by dividing the entire arc-shaped insert into individual inserts, the problem of uneven radial shear force on the front and rear of the insert during processing, which leads to insert damage and short life, can be effectively solved by traditional long-blade spiral end mills. By dividing the entire arc-shaped insert into multiple independent cutter heads, the radial shear force on the front and rear of each cutter head is similar during the cutting process, thereby reducing the rapid tool damage caused by excessive radial shear force differences and improving tool life. In addition, since each cutter head is an individual unit, when a single cutter head is damaged, it can be directly replaced for repair without replacing the entire tool, thereby further reducing production and maintenance costs and improving the service life and reliability of the segmented multi-blade spiral end mill.

[0038] In a preferred embodiment, the angle between the mounting surface 4 and the spiral end face of the corresponding spiral clearance groove is 90 degrees to 110 degrees.

[0039] In an optional embodiment of the present invention, the mounting slot includes: A first mounting groove 21 is provided on each mounting surface 4 and near the cutting end face 11 of the tool holder 1, and a plurality of second mounting grooves 22 are located below the first mounting groove 21 and are arranged in sequence and evenly on the mounting surface 4. The cutting head includes: a first cutting head 31 disposed in each first mounting slot 21 and fixedly connected to the first mounting slot 21; A second cutting head 32 is disposed in each second mounting slot 22 and is fixedly connected to the second mounting slot 22.

[0040] In an optional embodiment of the present invention, the rake angle of the first cutter head 31 and the second cutter head 32 is both in the range of 0 degrees to -3 degrees; the clearance angle of the first cutter head 31 and the second cutter head 32 is both in the range of 6 degrees to 12 degrees.

[0041] In this embodiment, as Figure 6 As shown, taking the first cutting head 31 as an example, the rear angle of the first cutting head 31 is the angle between the rear cutting face 312 of the first cutting head 31 and the cutting direction a1; the front angle of the first cutting head 31 is the angle between the transverse normal a2 of the first cutting edge 311 of the first cutting head 31 and the front cutting face 313 of the first cutting head 31, wherein the transverse normal a2 is perpendicular to the normal of the cutting direction a1, and the first cutting edge 311 refers to the angle between the front cutting face 313 and the rear cutting face 312 of the first cutting head 31.

[0042] In an optional embodiment of the present invention, the first cutting head 31 is provided with a first cutting edge 311; the second cutting head 32 is provided with a second cutting edge 321; wherein, the first cutting edge 311 is higher than the cutting end face 11 of the tool holder 1 by a second preset distance, and the second cutting edges 321 of the plurality of second cutting heads 32 are arranged in a spiral shape with the first cutting edge 311.

[0043] In this embodiment, the second preset distance ranges from 0.5 mm to 2 mm. The spiral design and segmented independent design of the cutting edge enable the segmented multi-blade spiral end mill to operate stably in scenarios with negative rake angles during the processing of silicon semiconductor materials, expanding the usable range of both the clearance angle and the rake angle. Specifically, the clearance angle is adjustable from 6 degrees to 12 degrees, and the rake angle is adjustable from 0 degrees to -3 degrees. Silicon carbide semiconductor materials themselves have extremely high strength and hardness, resulting in significant impact on the cutting edge. The negative rake angle provides substantial cutting edge strength and a larger heat dissipation volume, preventing chipping and rapid wear. When cutting brittle materials, fragmented chips are generated, and the cutting force is concentrated near the cutting edge, resulting in a large impact force. The negative rake angle can also effectively protect the tool tip. Furthermore, the compressive stress state generated by the negative rake angle is conducive to the fracture and removal of brittle materials, thereby ensuring that cracks and surface and subsurface damage are less likely to occur during the processing of silicon carbide semiconductor materials, further improving the processing quality of silicon carbide semiconductor materials.

[0044] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A method for machining a segmented multi-flute helical end mill for milling semiconductor materials, characterized in that, include: Obtain the head substrate and shank substrate of a target segmented multi-flute spiral milling cutter for milling semiconductor materials; Based on the outer diameter parameters of the tool holder of the target segmented multi-blade spiral end mill, the outer diameter of the tool holder substrate is milled to obtain the first tool holder; One end of the first tool holder is milled to obtain a second tool holder; wherein, one end of the second tool holder is formed with a plurality of spiral clearance grooves, and each spiral clearance groove is formed with a mounting surface; Based on the preset number of cutter heads of the target segmented multi-blade spiral end mill, the second cutter bar is milled to obtain the third cutter bar; wherein, a preset number of mounting slots are opened on each mounting surface of the third cutter bar; Based on the preset number of cutter heads of the target segmented multi-blade spiral end mill and the initial parameters of the first segmented multi-blade spiral end mill cutter head, the cutter head substrate is segmented and cut to obtain a preset number of cutter heads of the target shape. The cutter head of the target shape is welded into the mounting groove to obtain the first segmented multi-blade spiral end mill; Based on the first preset rake angle of the target segmented multi-blade spiral milling cutter head, the first segmented multi-blade spiral milling cutter is subjected to laser cutting to obtain the target segmented multi-blade spiral milling cutter; wherein, the value range of the first preset rake angle is 0 to -3 degrees.

2. The machining method of a segmented multi-blade helical milling cutter for milling semiconductor materials according to claim 1, characterized in that, A second tool holder is obtained by milling one end of the first tool holder, comprising: According to the preset machining parameters of the spiral clearance groove, one end of the first tool holder is milled to obtain the first machining tool holder; wherein, the preset machining parameters include the number of spiral clearance grooves, the machining length, and the depth of the spiral clearance groove; The target radial width of the mounting surface is determined based on the outer diameter of the first tool holder; wherein the target radial width of the mounting surface is one-sixth of the outer diameter of the first tool holder; Based on the preset included angle between the spiral end face of the spiral clearance groove and the mounting surface, and the target radial width of the mounting surface, the mounting surface is milled on one side of each spiral clearance groove to obtain the second tool holder.

3. The machining method of the segmented multi-flute helical end mill for milling semiconductor materials according to claim 1, characterized in that, Based on the preset number of cutter heads of the target segmented multi-blade helical end mill, the second cutter bar is milled to obtain the third cutter bar, which includes: Obtain the preset thickness parameters of the target segmented multi-blade spiral end mill head; Determine the machining depth parameters of the mounting groove based on the preset thickness parameters of the cutter head; Based on the first preset distance between two adjacent mounting slots, with the mounting surface as a reference and the machining depth parameter of the mounting slot as a fixed value, a preset number of mounting slots are opened on each mounting surface.

4. The machining method of a segmented multi-blade helical end mill for milling semiconductor materials according to claim 1, characterized in that, The cutter head of the target shape is welded into the mounting groove to obtain a first segmented multi-flute helical end mill, comprising: Based on a preset initial distance value between the cutter head of the target shape and the outer edge of the mounting surface, the cutter head of the target shape is welded into the mounting groove to obtain a first segmented multi-blade spiral end mill; wherein, the preset initial distance value is 1 mm to 2 mm greater than the preset target distance value, and the preset target distance value is a distance of 0.5 mm to 2 mm.

5. The machining method of a segmented multi-flute helical end mill for milling semiconductor materials according to claim 4, characterized in that, Based on the first preset rake angle of the target segmented multi-flute spiral end mill head, the first segmented multi-flute spiral end mill is subjected to laser cutting to obtain the target segmented multi-flute spiral end mill, including: According to the preset target distance value, the cutting head of the first segmented multi-blade spiral milling cutter is subjected to laser cutting to obtain the second segmented multi-blade spiral milling cutter. Based on the rake face thickness parameter of each cutter head of the second segmented multi-blade spiral end mill and the first preset rake angle of the target segmented multi-blade spiral end mill cutter head, determine the rake face cutting amount of each cutter head of the second segmented multi-blade spiral end mill and the flank face cutting amount of each cutter head of the second segmented multi-blade spiral end mill. Based on the cutting amount of the rake face and the cutting amount of the flank face of each cutter head, the second segmented multi-blade spiral end mill is subjected to laser cutting to obtain the third segmented multi-blade spiral end mill. Based on the preset cutting edge length and preset cutting edge width, the front and rear cutting edges of the third segmented multi-blade spiral end mill are laser-cut to obtain the target segmented multi-blade spiral end mill.

6. The machining method of a segmented multi-bladed spiral milling cutter for milling semiconductor materials according to claim 5, characterized in that, Based on the rake face thickness parameters of each cutter head of the second segmented multi-flute spiral end mill and the first preset rake angle of the target segmented multi-flute spiral end mill cutter head, determine the rake face cutting amount and the flank face cutting amount of each cutter head of the second segmented multi-flute spiral end mill, including: Based on the first preset rake angle of the target segmented multi-blade spiral end mill head and the cutting direction of the second segmented multi-blade spiral end mill head, determine the first cutting line of each cutter head of the second segmented multi-blade spiral end mill; Based on the first cutting line, determine the rake face cutting amount of each cutter head of the second segmented multi-blade spiral end mill; Based on the first preset rake angle of the target segmented multi-flute spiral end mill head, the back face cutting width h of each cutter head of the second segmented multi-flute spiral end mill is determined by the formula h=b×tan(90°-|γ|-β); where γ is the first preset rake angle; b is the effective cutting width, taken as 1.2 mm; β is the wedge angle of the cutter head, β=a+c×HV, where a is 70 degrees, c is 0.003; and HV is the material hardness. The amount of material removed from the back face of each cutter head of the second segmented multi-flute spiral end mill is determined based on the cutting width of the back face of each cutter head.

7. A segmented multi-blade spiral end mill for milling semiconductor materials, characterized in that, The segmented multi-blade helical end mill is manufactured by the method described in any one of claims 1 to 6, wherein the segmented multi-blade helical end mill comprises: The tool holder (1) has a plurality of spiral clearance grooves integrally formed with the tool holder (1) at one end, and each spiral clearance groove has a mounting surface (4) on its end face. Each of the spiral clearance grooves has multiple mounting grooves arranged evenly from top to bottom on its mounting surface (4). Each mounting slot is equipped with a cutting head, which is fixedly connected to the mounting slot.

8. The segmented multi-blade helical end mill for milling semiconductor materials according to claim 7, characterized in that, The mounting slot includes: A first mounting groove (21) is provided on each mounting surface (4) and near the cutting end face (11) of the tool holder (1), and a plurality of second mounting grooves (22) are provided below the first mounting groove (21) and are arranged in a uniform manner on the mounting surface (4). The cutting head includes: a first cutting head (31) disposed in each first mounting slot (21) and fixedly connected to the first mounting slot (21); A second cutting head (32) is disposed in each second mounting slot (22) and is fixedly connected to the second mounting slot (22).

9. The segmented multi-flute spiral milling cutter for milling semiconductor materials according to claim 8, characterized in that, The first cutting head (31) is provided with a first cutting edge (311); the second cutting head (32) is provided with a second cutting edge (321); wherein the first cutting edge (311) is higher than the cutting end face (11) of the tool holder (1) by a predetermined distance, and the second cutting edges (321) of the plurality of second cutting heads (32) are arranged in a spiral shape with the first cutting edge (311).

10. The segmented multi-blade helical end mill for milling semiconductor materials according to claim 8, characterized in that, The front angle of the first cutter head (31) and the second cutter head (32) is in the range of 0 degrees to -3 degrees; the rear angle of the first cutter head (31) and the second cutter head (32) is in the range of 6 degrees to 12 degrees.

Images