Air bath type high-temperature baking equipment

Abstract

The invention relates to the technical field of baking, in particular to air bath type high-temperature baking equipment. The device comprises a heating cavity which is provided with a product inlet and outlet; the valve is used for opening or closing the product inlet and outlet; the air supply assembly communicates with the heating cavity and is used for forming an airflow field in the heating cavity; the heating assembly is arranged in the heating cavity and used for heating a product; and the ejector pin is arranged in the heating cavity and is used for bearing a product. When the valve is opened, products can enter and exit the heating cavity from the product inlet and outlet, and when the valve is closed, a sealed environment can be formed in the heating cavity for high-temperature baking. The ejector pin is used for bearing the product, direct contact between the product and the heating assembly is avoided, an air flow field is formed in the heating cavity in cooperation with the air supply assembly, the product is heated in cooperation with the heating assembly, the product is evenly heated in an air bath heating mode, and the problem of uneven heating caused by local contact of the product can be effectively avoided; meanwhile, a structural foundation is laid for subsequent rapid cooling, and the product baking quality and the production efficiency are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of baking, and particularly relates to a high-temperature baking equipment of air bath type. BACKGROUND

[0002] Inkjet printing provides a promising method for the manufacture of OLED display panels. However, in the inkjet printing process, the baking and curing film forming process after the ink droplets are printed into the pixel groove is crucial. Each pixel groove on the substrate must be uniformly high-temperature baked and cured into a film, and uneven deposition of ink droplets will cause the problem of short OLED life, and the thinner area will generate higher current, thereby causing rapid aging.

[0003] Chinese invention patent 202411603727.9 discloses an OLED inkjet printing substrate vacuum high-temperature baking equipment and a baking method thereof, wherein the structure of the display panel baking equipment is provided, a plurality of heating pipes are embedded in the heating plate body, the temperature of the heating plate body is raised by heating the heating pipes, and the product is baked and treated. The limitations of this scheme mainly include: the manufacturing difficulty of the heating plate body is large, the surface of the heating plate body is uneven, when the product is placed on the heating plate body for heating, there will be a local part that cannot be in contact with the plate body, resulting in uneven heating of the product, and the heating is fast in the contact place and slow in the non-contact place; after the product is high-temperature baked, natural cooling is performed, and the production efficiency is low. It can be seen that the baking equipment in the prior art is prone to uneven baking problems, and it is necessary to propose a baking equipment that can well cope with the problem.

[0004] Therefore, the prior art still needs to be improved and developed. SUMMARY

[0005] In view of the above deficiencies of the prior art, the purpose of the present application is to provide a high-temperature baking equipment of air bath type, which aims to solve the problem of uneven baking of the existing baking equipment.

[0006] The technical scheme of the present application is as follows: The present application provides a high-temperature baking equipment of air bath type, which comprises: a heating cavity, a product inlet and outlet are formed on the heating cavity; a valve for opening or closing the product inlet and outlet; a gas supply assembly in communication with the heating cavity for forming an air flow field in the heating cavity; a heating assembly arranged in the heating cavity for heating the product; a thimble arranged in the heating cavity for carrying the substrate of the product.

[0007] As a further improvement of the above technical scheme, the gas supply assembly comprises: An air inlet pipe, an air outlet end of which communicates with the heating cavity; An air outlet pipe, an air inlet end of which communicates with the heating cavity; The air outlet end of the air inlet pipe and the air inlet end of the air outlet pipe are arranged on opposite sides in the heating cavity; and the air outlet end of the air outlet pipe is provided with a negative pressure device.

[0008] As a further improvement of the above technical solution, the heating assembly comprises: An infrared heating plate and a supporting column, the infrared heating plate is suspended in the heating cavity through the supporting column; The ejector pin is arranged on the infrared heating plate and located on a side opposite to the supporting column, and the height of the ejector pin corresponds to the air flow field.

[0009] As a further improvement of the above technical solution, the heating assembly further comprises: A mirror surface reflecting plate, which is located above the ejector pin and faces the infrared heating plate.

[0010] As a further improvement of the above technical solution, the air supply assembly further comprises: An air inlet disperser, which is arranged at the air outlet end of the air inlet pipe, and the air inlet pipe communicates with the heater through the air inlet disperser; An air outlet disperser, which is arranged at the air inlet end of the air outlet pipe, and the air outlet pipe communicates with the heating cavity through the air outlet disperser.

[0011] As a further improvement of the above technical solution, the dispersing ends of the air inlet disperser and the air outlet disperser both face the product.

[0012] As a further improvement of the above technical solution, the air inlet end of the air inlet pipe simultaneously communicates with a heating gas circuit and a refrigeration gas circuit, the heating gas circuit is provided with a gas heater, and the refrigeration gas circuit is provided with a gas refrigerator; The heating gas circuit, the refrigeration gas circuit and the air outlet pipe are all provided with control valves and mass flow controllers.

[0013] As a further improvement of the above technical solution, the air inlet pipe is provided with a gas storage cylinder corresponding to the air inlet disperser, which is located at the front end of the air inlet disperser.

[0014] As a further improvement of the above technical solution, an air inlet valve is arranged between the gas storage cylinder and the air inlet disperser.

[0015] As a further improvement of the above technical solution, the heating cavity is provided with an upper cavity cover which participates in forming the wall of the heating cavity; The upper cavity cover is connected with an opening cover supporting arm for opening or closing the heating cavity.

[0016] Beneficial effects: In this application, the valve is opened, and the product can enter and exit the heating cavity from the product inlet and outlet. When the valve is closed, a sealed environment can be formed in the heating cavity for high-temperature baking process. The product is carried by the ejector pin to avoid direct contact with the heating assembly. The air supply assembly forms an air flow field in the heating cavity, and the product is heated by the heating assembly. Through the form of air bath heating, the product is uniformly heated, which can effectively avoid the problem of uneven heating caused by local contact, and lay a structural foundation for subsequent rapid cooling, improve product baking quality and production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is one of the structural schematic diagrams of the air bath type high-temperature baking equipment of the present application.

[0018] Figure 2 It is the second structural schematic diagram of the air bath type high-temperature baking equipment of the present application.

[0019] Figure 3 It is a partial structural schematic diagram of the air bath type high-temperature baking equipment of the present application. Figure 2 Label area.

[0020] Figure 4 It is a cross-sectional structural schematic diagram of the air bath type high-temperature baking equipment of the present application.

[0021] Figure 5 It is a schematic diagram of the pipeline structure of the air bath type high-temperature baking equipment of the present application.

[0022] Figure 6 It is a heating structure schematic diagram of the air bath type high-temperature baking equipment of the present application (the hollow arrow in the figure indicates the direction of air flow, and the solid arrow indicates the heating direction of the infrared heating plate).

[0023] Label explanation: 100, heating cavity; 110, product inlet and outlet; 120, valve; 130, upper cavity cover; 131, cover opening arm; 200, air supply assembly; 210, air inlet pipeline; 211, air inlet disperser; 220, air outlet pipeline; 221, air outlet disperser; 222, negative pressure device; 230, heating gas circuit; 231, gas heater; 240, refrigeration gas circuit; 241, gas refrigerator; 250, control valve; 260, mass flow controller; 270, gas cylinder; 280, air inlet valve; 300, heating assembly; 310, infrared heating plate; 320, support column; 330, mirror surface reflecting plate; 400, ejector pin. DETAILED DESCRIPTION

[0024] The application provides a wind bath type high-temperature baking equipment. To make the purpose, technical scheme and effect of the application more clear and explicit, the application is further described in detail below. It should be understood that the specific embodiments described herein are only used to explain the application and not to limit the application.

[0025] With reference to Figures 1-6 The application provides a wind bath type high-temperature baking equipment, which comprises: A heating cavity 100, a product inlet and outlet 110 is formed on the heating cavity 100; A valve 120 for opening or closing the product inlet and outlet 110; A gas supply assembly 200 in communication with the heating cavity 100 for forming an air flow field in the heating cavity 100; A heating assembly 300 arranged in the heating cavity 100 for heating the product; A top pin 400 arranged in the heating cavity 100 for supporting the substrate of the product.

[0026] In the application, the components of the wind bath type high-temperature baking equipment can be arranged on a rack. Specifically, the top pin 400 can be vertically arranged in the heating cavity 100, and a plurality of top pins can be arranged according to the need, which supports the product through the end to reduce the contact area.

[0027] In the application, when the valve 120 is opened, the product can enter or exit the heating cavity 100 through the product inlet and outlet 110, and when the valve 120 is closed, a sealed environment can be formed in the heating cavity 100 for high-temperature baking process. The product is supported by the top pin 400 to avoid direct contact with the heating assembly 300, and the air flow field is formed in the heating cavity 100 by the gas supply assembly 200, combined with the heating of the product by the heating assembly 300, the product is uniformly heated in the form of wind bath heating, which can effectively avoid the problem of uneven heating of the product caused by local contact, and lay a structural foundation for subsequent rapid cooling, improve the product baking quality and production efficiency.

[0028] In one specific embodiment of the application, the gas supply assembly 200 comprises: An air inlet pipe 210, the air outlet end of the air inlet pipe 210 is in communication with the heating cavity 100; An air outlet pipe 220, the air inlet end of the air outlet pipe 220 is in communication with the heating cavity 100; The air outlet end of the air inlet pipe 210 and the air inlet end of the air outlet pipe 220 are arranged on opposite sides in the heating cavity 100; and the air outlet end of the air outlet pipe 220 is provided with a negative pressure device 222.

[0029] The negative pressure device 222 can be a device capable of providing negative pressure, such as an air extractor.

[0030] In the present application, the air inlet pipe 210 and the air outlet pipe 220 are arranged on opposite sides in the heating cavity 100, so that the gas can form a stable airflow field in the heating cavity 100, ensuring that the airflow uniformly covers and contacts the product surface, and also helps to maintain stable airflow and reduce turbulence, making the heating or cooling consistency of each area of the product stronger, further optimizing the temperature distribution uniformity, and ensuring the performance stability of the product after baking.

[0031] In one specific embodiment of the present application, the heating assembly 300 comprises: The infrared heating plate 310 is suspended in the heating cavity 100 by the support column 320. The top pin 400 is arranged on the infrared heating plate 310 and located on the side opposite to the support column 320, and the height corresponds to the airflow field.

[0032] The orientation of the top pin 400 corresponds to the placement of the product.

[0033] In the present application, the infrared heating plate 310 is suspended and installed in the heating cavity 100 by the support column 320, and the top pin 400 can be fixedly installed on the infrared heating plate 310. The display panel product (such as a glass substrate) to be high-temperature baked is placed on the top pin 400. The top pin 400 carries the product and corresponds to the height of the airflow field, which can ensure that a reasonable gap is formed between the product and the infrared heating plate 310. The infrared baking equipment radiated by the infrared heating plate 310 can also make the airflow flow smoothly around the product. The infrared heating plate 310 can simultaneously radiate and heat the airflow field. The product is high-temperature baked in the airflow field, ensuring the overall baking environment and realizing the synergistic effect of infrared radiation heating and airflow field, thereby improving the heating efficiency and uniformity.

[0034] The material of the top pin 400 can be PEEK or high-temperature ceramic material, which can ensure high-temperature resistance and prevent scratching the product.

[0035] In one specific embodiment of the present application, the heating assembly 300 further comprises: The mirror surface reflecting plate 330 is located above the top pin 400 and faces the infrared heating plate 310.

[0036] The mirror surface reflecting plate 330 and the top pin 400 form a space for placing the product therebetween.

[0037] In the present application, after the infrared radiation of the infrared heating plate 310 bakes the product, the infrared radiation reaches the mirror surface reflecting plate 330 and is reflected back to bake the product. A uniform infrared radiation field can be formed inside the heating cavity 100, fully utilizing the infrared energy, improving the energy utilization efficiency, and further strengthening the product heating uniformity to ensure the baking effect.

[0038] In one specific embodiment of the present application, the gas supply assembly 200 further comprises: an air inlet disperser 211 arranged at the air outlet end of the air inlet pipe 210, the air inlet pipe 210 being in communication with the heating cavity 100 through the air inlet disperser 211; an air outlet disperser 221 arranged at the air inlet end of the air outlet pipe 220, the air outlet pipe 220 being in communication with the heating cavity 100 through the air outlet disperser 221.

[0039] In the present application, the air inlet disperser 211 is arranged at the air outlet end thereof, and a plurality of tiny holes are distributed on the dispersing end of the air inlet disperser 211, so that the incoming gas can be uniformly dispersed, the impact of the gas on the product is reduced, and the uniform heating effect is ensured; the air outlet disperser 221 can smoothly guide the gas to be discharged, maintain the stability of the airflow field in the heating cavity 100, and the cooperation of the two can make the airflow flow more uniformly in the cavity, ensure that the heating or cooling effect of each part of the product is consistent, and improve the process reliability.

[0040] In one specific embodiment of the present application, the dispersing ends of the air inlet disperser 211 and the air outlet disperser 221 both face the product.

[0041] Among them, the dispersing holes on the dispersing ends of the air inlet disperser 211 and the air outlet disperser 221 can be correspondingly arranged.

[0042] In the present application, the dispersing ends of the air inlet disperser 211 and the air outlet disperser 221 face the product, and the gas used for heating or cooling is collected through the dispersing end of the air outlet disperser 221 after being dispersed into the heating cavity 100, so as to ensure the uniform flow degree of the airflow field, further improve the uniformity of the temperature change of the product, reduce the quality difference of the product caused by uneven airflow distribution, and ensure the consistency of batch production.

[0043] In one specific embodiment of the present application, the air inlet end of the air inlet pipe 210 is simultaneously communicated with a heating gas path 230 and a refrigeration gas path 240, the heating gas path 230 is provided with a gas heater 231, and the refrigeration gas path 240 is provided with a gas refrigerator 241. The heating gas path 230, the refrigeration gas path 240 and the air outlet pipe 220 are all provided with a control valve 250 and a mass flow controller 260.

[0044] Among them, the gas heater 231 can adopt an electric heating mode, and the gas refrigerator 241 can adopt a semiconductor refrigeration sheet, which is vibration-free and noise-free.

[0045] In the present application, the heating gas path 230 and the refrigeration gas path 240 are respectively provided with a gas heater 231 and a gas refrigerator 241, and the heating or cooling mode can be switched as needed to meet the continuous process requirements of baking and rapid cooling. The control valve 250 and the mass flow controller 260 can accurately control the on-off and flow of the gas, so that the temperature and flow rate of the airflow field in the cavity remain stable, ensuring the baking quality and rapid cooling, and greatly improving the production efficiency.

[0046] Specifically, by setting the control valve 250, when the product needs high-temperature baking, the control valve 250 of the heating gas path 230 is opened and the control valve 250 of the refrigeration gas path 240 is closed, the heating gas enters the cavity, forming a uniform hot airflow field, and the heat radiated by the infrared heating plate 310 can compensate for the temperature of the airflow field, ensuring that the temperature of the airflow field is at the set value. When the product needs rapid cooling after baking, the control valve 250 of the refrigeration gas path 240 is opened and the control valve 250 of the heating gas path 230 is closed, and the refrigeration gas enters the cavity, forming a cooling airflow field in the cavity, which can take away the heat of the high-temperature baked product, and the product can be rapidly cooled. It is easy to adjust according to the required process conditions.

[0047] Specifically, the mass flow controller 260 can control the flow of gas entering the cavity, and the flow of gas entering the cavity should form a dynamic balance with the flow of the negative pressure device 222 in the exhaust pipe 220, so the mass flow controller 260 is arranged at the heating gas path 230, the refrigeration gas path 240 and the exhaust pipe 220, so as to ensure the stability of the airflow field in the heating cavity 100.

[0048] In a specific embodiment of the present application, the gas inlet pipe 210 is provided with a gas storage bottle 270 corresponding to the gas inlet disperser 211, which is located at the front end of the gas inlet disperser 211.

[0049] Among them, the number of gas storage bottles 270 can be set to two corresponding to the heating gas path 230 and the refrigeration gas path 240, the number of gas inlet dispersers 211 is set to two corresponding to the number of gas storage bottles 270, and the number of exhaust dispersers 221 is also set corresponding to the number of gas inlet dispersers 211.

[0050] In the present application, the heating gas is opened or closed by the control valve 250, the heated gas enters the gas storage bottle 270, and the gas in the gas storage bottle 270 enters the gas inlet disperser 211. Specifically, multiple gas storage bottles 270 and corresponding gas inlet dispersers 211 can be arranged. By arranging the gas storage bottle 270, the airflow entering the cavity of the heating cavity 100 can be stabilized, and stable airflow can be ensured to enter the disperser and be output.

[0051] In a specific embodiment of the present application, a gas inlet valve 280 is arranged between the gas storage bottle 270 and the gas inlet disperser 211.

[0052] In the present application, by setting the air inlet valve 280, the timing and on-off state of the gas into the cavity can be flexibly controlled, cooperating with the control valve 250 and the mass flow controller 260, the precise regulation of the gas flow is realized, which is convenient for switching different working conditions such as heating and cooling according to the process requirements, and improves the flexibility and process adaptability of the equipment operation.

[0053] In one specific embodiment of the present application, the heating cavity 100 is provided with an upper cavity cover 130 participating in forming the body wall of the heating cavity 100. The upper cavity cover 130 is connected with a cover opening arm 131 for opening or closing the heating cavity 100.

[0054] Wherein, one end of the cover opening arm 131 can be connected with the upper cavity cover 130, and the other end is installed on the rack.

[0055] In the present application, the upper cavity cover 130 cooperates with the cover opening arm 131 to conveniently realize the opening and closing of the heating cavity 100, which is convenient for cleaning and equipment maintenance of the heating cavity 100, and forms a sealed environment during baking to ensure the stability of the temperature and airflow field in the cavity.

[0056] Through the air bath type high-temperature baking equipment provided by the present application, the heating gas flows horizontally, the infrared radiation is vertically radiated, the temperature of the horizontal airflow is compensated, and a uniform airflow field is formed. The product is heated by air bath in the uniform airflow field to ensure the uniformity of the overall baking of the product.

[0057] The working principle of the air bath type high-temperature baking equipment of the present application is as follows: The air bath type high-temperature baking equipment is installed on the rack as a whole, and when working, the upper cavity cover 130 of the heating cavity 100 is first opened by the cover opening arm 131, then the valve 120 at the product inlet and outlet 110 is opened, the display panel product to be high-temperature baked is placed on the thimble 400 in the heating cavity 100, then the valve 120 and the upper cavity cover 130 are closed, so that the heating cavity 100 forms a sealed environment, and enters the baking process.

[0058] The baking stage, first, the control valve 250 of the heating gas path 230 is opened, the gas is heated to the target temperature (such as 300℃) by the gas heater 231, and then flows through the gas storage bottle 270 to stabilize the gas flow, and then enters the gas inlet disperser 211 through the gas inlet valve 280 between the gas storage bottle 270 and the gas inlet disperser 211; at the same time, the mass flow controller 260 of the heating gas path 230 regulates the gas inlet flow, and the mass flow controller 260 of the exhaust pipeline 220 cooperates with the negative pressure device 222 to regulate the exhaust flow, so that the inlet and outlet gas flows form a dynamic balance. The heated gas is uniformly dispersed by the gas inlet disperser 211, and then flows from one side of the heating chamber 100 to the other side, passing through the product in the process; in this process, the infrared heating plate 310 suspendedly installed in the heating chamber 100 by the support column 320 radiates infrared rays, which directly act on the product on one hand, and the infrared rays are reflected by the mirror surface reflecting plate 330 above the product to act on the product again, forming a uniform infrared radiation field, and at the same time, the temperature of the transversely flowing heated gas is compensated, and finally a uniform hot gas flow field is formed in the heating chamber 100, and the product realizes uniform baking in the air bath type.

[0059] When the product baking is completed, the control valve 250 of the heating gas path 230 is closed, and the control valve 250 of the refrigeration gas path 240 is opened. The gas is cooled by the gas cooler 241, and then uniformly dispersed into the heating chamber 100 through the corresponding mass flow controller 260 to regulate the flow, the gas storage bottle 270 to stabilize the gas flow, and the gas inlet valve 280 to control the on-off. The refrigeration gas flows in the same direction as the heating gas in the heating chamber 100 to form a cooling gas flow field, quickly taking away the heat of the product to realize rapid cooling of the product. During the cooling process, the negative pressure device 222 and the mass flow controller 260 of the exhaust pipeline 220 continuously work to maintain the stability of the gas flow in the chamber.

[0060] During the whole working process, the outlet end of the gas inlet pipeline 210 and the inlet end of the exhaust pipeline 220 are located at opposite sides of the heating chamber 100, the gas inlet disperser 211 and the exhaust disperser 221 are respectively installed at the outlet end of the gas inlet pipeline 210 and the inlet end of the exhaust pipeline 220, which ensures that the gas flow can stably cover the surface of the product and reduce turbulence; and the infrared heating plate 310 cooperates with the thimble 400 to form a reasonable gap between the product and the infrared heating plate 310, which is convenient for infrared radiation and does not affect the flow of gas. Ultimately, through the synergistic effect of the transversely flowing gas and the vertically radiating infrared rays, the uniformity of product baking and the cooling efficiency are guaranteed, and the production quality and efficiency are improved.

[0061] It should be understood that the application of the present application is not limited to the above examples, and those skilled in the art can make improvements or changes according to the above description, and all these improvements and changes shall belong to the protection scope of the present application.

Claims

1. A hot air type high-temperature roasting apparatus, characterized by comprising: The utility model relates to a heating chamber (100) is provided with product import and export (110) on, valve (120) for opening or closing product import and export (110), gas supply component (200) with heating chamber (100) intercommunication, for forming gas flow field in heating chamber (100), heating component (300) are set up in heating chamber (100), for heating product, top pin (400) are set up in heating chamber (100), for carrying the substrate of product, gas supply component (200) includes: air inlet pipeline (210), air outlet end of air inlet pipeline (210) with heating chamber (100) intercommunication, exhaust pipeline (220), air inlet end of exhaust pipeline (220) with heating chamber (100) intercommunication, air outlet end of air inlet pipeline (210) and air inlet end of exhaust pipeline (220) are set up in the opposite sides in heating chamber (100), and air outlet end of exhaust pipeline (220) is provided with negative pressure device (222), heating component (300) includes: infrared heating plate (310) and support column (320), infrared heating plate (310) is suspended in heating chamber (100) through support column (320), top pin (400) are set up on infrared heating plate (310), are located with support column (320) opposite side, height corresponds with gas flow field, heating component (300) still includes: mirror surface reflection board (330) are located above top pin (400), face infrared heating plate (310). Gas supply component (200) still includes: air inlet disperser (211) are set up in air outlet end of air inlet pipeline (210), and air inlet pipeline (210) is communicated with heating chamber (100) through air inlet disperser (211), exhaust disperser (221) are set up in air inlet end of exhaust pipeline (220), and exhaust pipeline (220) is communicated with heating chamber (100) through exhaust disperser (221). The dispersing end of the air inlet disperser (211) and the exhaust disperser (221) faces the product. The air inlet pipeline (210) is connected with a heating gas circuit (230) and a refrigeration gas circuit (240) at the air inlet end, the heating gas circuit (230) is provided with a gas heater (231), and the refrigeration gas circuit (240) is provided with a gas refrigerator (241). The heating gas circuit (230), the refrigeration gas circuit (240), and the exhaust pipeline (220) are provided with a control valve (250) and a mass flow controller (260). The air inlet pipeline (210) is provided with a gas storage bottle (270) corresponding to the air inlet disperser (211) and located at the front end of the air inlet disperser (211). An air inlet valve (280) is arranged between the gas storage bottle (270) and the air inlet disperser (211). ​ ​ ​ ​ ​ ​ ​ ​ 2. The high temperature roasting apparatus of claim 1, wherein, ​ ​ ​ 3. The high temperature roasting apparatus of claim 2, wherein, ​ 4. The high temperature roasting apparatus of claim 3, wherein ​ ​ 5. The high temperature roasting apparatus of claim 4, wherein, ​ 6. The high temperature roasting apparatus of claim 5, wherein, ​ 7. A high temperature roasting apparatus of the air-bath type according to claim 6, characterised in that, The heating cavity (100) is provided with an upper cavity cover (130) participating in forming a body wall of the heating cavity (100); The upper cavity cover (130) is connected with a cover opening and closing arm (131) for opening or closing the heating cavity (100).

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