Heat dissipation method and system

Abstract

The application discloses a heat dissipation method and system, relates to the technical field of heat dissipation, and comprises the following steps: a standby heat dissipation controller can be responsible for managing a temperature sensor, and accordingly, the standby heat dissipation controller can first acquire a total heat dissipation strategy of the temperature sensor. After it is determined that the heat dissipation controller information sent by a main heat dissipation controller has not been received for a preset number of continuous periods in a current period, it is determined that the main heat dissipation controller is in an abnormal state, and then, a first heat dissipation mode with the largest heat dissipation intensity is determined as a target heat dissipation mode used in the current period. Finally, target heat dissipation parameters of the current period can be determined according to the real-time temperature value of the temperature sensor, the total heat dissipation strategy and the target heat dissipation mode, and the heat dissipation components are controlled to perform heat dissipation operation in the current period based on the target heat dissipation parameters. In this way, after the main heat dissipation controller is identified to be faulty, the stability of heat dissipation control and the heat dissipation demand of a target device can be ensured, and the over-temperature problem of the target device can be avoided.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to heat dissipation methods and systems. Background Technology

[0002] In the field of heat dissipation technology, both the main heat dissipation controller and the backup heat dissipation controller are connected to a selection circuit (e.g., a multiplexer). The selection circuit is connected to temperature sensors, and the backup heat dissipation controller is connected to the heat dissipation component. Generally, when the main heat dissipation controller is in a normal state, the backup heat dissipation controller can open the switch in the selection circuit corresponding to the main heat dissipation controller. This allows the main heat dissipation controller to obtain the real-time temperature values ​​detected by each temperature sensor through the selection circuit, calculate heat dissipation parameters based on the real-time temperature values, and send them to the backup heat dissipation controller. The backup heat dissipation controller then controls the heat dissipation component to perform heat dissipation operations based on the received heat dissipation parameters. Alternatively, when the backup heat dissipation controller detects that the main heat dissipation controller is in an abnormal state, it can close the switch in the selection circuit corresponding to the main heat dissipation controller. This allows the backup heat dissipation controller to obtain the real-time temperature values ​​detected by each temperature sensor through the selection circuit, calculate heat dissipation parameters based on the real-time temperature values, and then control the heat dissipation component to perform heat dissipation operations based on the heat dissipation parameters.

[0003] However, during each switching of the selection circuit, the backup thermal controller cannot obtain effective temperature data in a timely manner, resulting in temporary failure or instability of the thermal control, which in turn leads to overheating of the target equipment. Summary of the Invention

[0004] This application provides heat dissipation methods, systems, devices, electronic devices, storage media, and software products to solve the problem that when the main heat dissipation controller fails, the backup heat dissipation controller cannot obtain effective temperature data in a timely manner, leading to equipment overheating.

[0005] This application provides a heat dissipation method, including:

[0006] Obtain the overall heat dissipation strategy corresponding to at least one temperature sensor managed by the backup thermal controller;

[0007] If the main heat dissipation controller has not received heat dissipation control information from the main heat dissipation controller for a preset number of consecutive cycles, the main heat dissipation controller is determined to be in an abnormal state. The preset number of consecutive cycles includes the current cycle.

[0008] When the main heat dissipation controller is in an abnormal state, the first heat dissipation mode is determined as the target heat dissipation mode for the current cycle. The first heat dissipation mode is the heat dissipation mode with the highest heat dissipation intensity among a variety of preset heat dissipation modes.

[0009] After obtaining the real-time temperature values ​​corresponding to all temperature sensors in at least one temperature sensor, the target heat dissipation parameters for the current period are determined based on the real-time temperature values ​​corresponding to all temperature sensors in at least one temperature sensor, the overall heat dissipation strategy, and the target heat dissipation mode.

[0010] Based on the target heat dissipation parameters, control the heat dissipation components to perform heat dissipation operations for the current cycle.

[0011] This application provides a heat dissipation system, which includes a main heat dissipation controller, a backup heat dissipation controller, a temperature sensor, and heat dissipation components;

[0012] Temperature sensor, used to detect temperature values;

[0013] The main heat dissipation controller is used to transmit heat dissipation control information to the backup heat dissipation controller.

[0014] A heat dissipation controller is provided to execute the above-mentioned heat dissipation method;

[0015] Heat dissipation components are used to perform heat dissipation operations under the control of a backup heat dissipation controller.

[0016] This application also provides a heat dissipation device, including:

[0017] The acquisition module is used to acquire the total heat dissipation strategy corresponding to at least one temperature sensor managed by the backup heat dissipation controller.

[0018] The determination module is used to determine that the main heat dissipation controller is in an abnormal state after it has not received heat dissipation control information from the main heat dissipation controller for a consecutive preset number of cycles, wherein the consecutive preset number of cycles includes the current cycle; when the main heat dissipation controller is in an abnormal state, the first heat dissipation mode is determined as the target heat dissipation mode for the current cycle, wherein the first heat dissipation mode is the heat dissipation mode with the highest heat dissipation intensity among a number of preset heat dissipation modes; after obtaining the real-time temperature values ​​corresponding to all temperature sensors in at least one temperature sensor, the target heat dissipation parameters for the current cycle are determined based on the real-time temperature values ​​corresponding to all temperature sensors in at least one temperature sensor, the total heat dissipation strategy, and the target heat dissipation mode.

[0019] The control module is used to control the heat dissipation components to perform heat dissipation operations in the current cycle based on the target heat dissipation parameters.

[0020] This application also provides an electronic device, including: a memory for storing a computer program; and a processor for implementing the steps of any of the above-described heat dissipation methods when executing the computer program.

[0021] This application also provides a computer-readable storage medium storing a computer program, wherein the computer program, when executed by a processor, implements the steps of any of the above-described heat dissipation methods.

[0022] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of any of the above-described heat dissipation methods.

[0023] Through this application, the backup thermal controller can manage the temperature sensors. Accordingly, the backup thermal controller can first obtain the overall heat dissipation strategy corresponding to each temperature sensor. If, in the current cycle, no thermal controller information is received from the main thermal controller for a predetermined number of consecutive cycles, it can be determined that the main thermal controller is in an abnormal state. Therefore, the first thermal mode with the highest heat dissipation intensity can be determined as the target thermal mode for the current cycle. Finally, after obtaining the real-time temperature value detected by the temperature sensor, the target thermal parameters for the current cycle can be determined based on the real-time temperature value, the overall heat dissipation strategy, and the target thermal mode. Based on the target thermal parameters, the heat dissipation components are controlled to perform the heat dissipation operation for the current cycle. Thus, when a fault is detected in the main thermal controller, i.e., when the main thermal controller is determined to be in an abnormal state, the backup thermal controller can obtain the real-time temperature value detected by the temperature sensors it manages, without performing a link switching operation. This eliminates the problem of not being able to obtain effective temperature data in a timely manner. Furthermore, determining the target thermal parameters using the first thermal mode with the highest heat dissipation intensity ensures the stability of the thermal control and meets the heat dissipation requirements of the target device, preventing overheating issues. In addition, this solution eliminates the need for a multiplexer for link switching, saving hardware resources. Attached Figure Description

[0024] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the architecture of a first heat dissipation system provided in an embodiment of this application;

[0026] Figure 2 This is a schematic diagram of the architecture of a second heat dissipation system provided in an embodiment of this application;

[0027] Figure 3 A schematic flowchart illustrating a heat dissipation method provided in an embodiment of this application;

[0028] Figure 4This is a schematic diagram of the architecture of a third heat dissipation system provided in an embodiment of this application;

[0029] Figure 5 This is a schematic diagram of the architecture of the fourth heat dissipation system provided in the embodiments of this application;

[0030] Figure 6 A schematic flowchart illustrating another heat dissipation method provided in an embodiment of this application;

[0031] Figure 7 This is a schematic diagram of a heat dissipation device provided in an embodiment of this application;

[0032] Figure 8 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0033] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0034] It should be noted that, in the description of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this application are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0035] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0036] The heat dissipation method provided in this application can be implemented by a heat dissipation system, such as... Figure 1As shown, the cooling system may include a main thermal controller, a backup thermal controller, heat dissipation components, and temperature sensors. The main thermal controller can connect to the backup thermal controller via an I2C bus to transmit thermal controller information and heartbeat commands. The backup thermal controller can connect to the heat dissipation components to transmit fan control signals and speed feedback (Tach) signals; for example, the fan control signal can be a Pulse Width Modulation (PWM) signal. The backup thermal controller can connect to each temperature sensor via the I2C bus to obtain the temperature values ​​detected by each temperature sensor, such as initial temperature values ​​and real-time temperature values.

[0037] Temperature sensors can be used to detect temperature values ​​and can be set at specific locations on the target device. For example, the target device can be a server, and the temperature sensor can be set at the server's air inlet, air outlet, motherboard, etc.

[0038] The primary thermal controller can be used to transmit thermal control information to the backup thermal controller. For example, the primary thermal controller can be a Baseboard Management Controller (BMC).

[0039] A backup thermal controller can be used to control heat dissipation components to perform heat dissipation operations. For example, a backup thermal controller can be a complex programmable logic device (CPLD), a microcontroller unit (MCU), etc.

[0040] A heat dissipation component can be used to perform heat dissipation operations under the control of a heat dissipation controller. For example, a heat dissipation component can be a fan.

[0041] In some alternative implementations, the above-described heat dissipation system may further include at least one task component, a first memory, and a second memory, such as... Figure 2As shown. Task components can be managed by a main thermal controller. Accordingly, the main thermal controller can connect to each task component via an I2C bus to read real-time temperature values ​​from each task component. For example, a task component can be a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), etc. The main thermal controller can also connect to a first memory to read thermal configuration information matching the target device during the target device's initial power-on. A backup thermal controller can connect to a second memory to read the overall thermal strategy and configuration information of each temperature sensor during subsequent power-on processes of the target device.

[0042] The first memory can be used to store heat dissipation configuration information corresponding to different types of devices. The heat dissipation configuration information may include the overall heat dissipation strategy for each task component, as well as the overall heat dissipation strategy and configuration information for each temperature sensor. The configuration information may include the name, signal, topology information, and heat dissipation level of the temperature sensor. The second memory can be used to store the overall heat dissipation strategy and configuration information for each temperature sensor. Both the first and second memories can be flash memory; for example, the flash memory can be electrically erasable programmable read-only memory (EEPROM).

[0043] For example, the server model can be "AST2600" or "MAX31725", and the first memory can store the thermal configuration information for both server models. For the "AST2600" model server, temperature sensors can be installed at the server's air inlet and outlet. The configuration information for the air inlet temperature sensor can be "tmp112, I2C bus 1, address 5a", and the configuration information for the air outlet temperature sensor can be "tmp112, I2C bus 1, address 5b". For the "MAX31725" model server, temperature sensors can be installed at the server's air inlet and motherboard. The configuration information for the air inlet temperature sensor can be "tmp112, I2C bus 1, address 5a", and the configuration information for the motherboard temperature sensor can be "EMC1413, I2C bus 2, address 5c".

[0044] Embodiments of this application provide a heat dissipation method, which can be executed by the aforementioned backup heat dissipation controller, such as... Figure 3 As shown, the specific processing steps of the heat dissipation method may include:

[0045] Step S301: Obtain the overall heat dissipation strategy corresponding to at least one temperature sensor managed by the backup heat dissipation controller.

[0046] Specifically, in the aforementioned heat dissipation system, directly connecting all temperature sensors to the main heat dissipation controller would consume a significant amount of the main controller's pin resources. Furthermore, the main heat dissipation controller would require acquiring substantial amounts of real-time temperature data to calculate heat dissipation parameters, resulting in a high load. Therefore, to reduce the resource consumption and load on the main heat dissipation controller due to heat dissipation operations, the temperature sensors can be connected to a backup heat dissipation controller, which manages the temperature sensors. Moreover, since different locations within the target device have varying heat dissipation requirements, a separate overall heat dissipation strategy can be set for each temperature sensor to allow for flexible heat dissipation operations. Upon power-on, the backup heat dissipation controller can first read the overall heat dissipation strategy corresponding to at least one temperature sensor it manages from a first preset storage location. This first preset storage location can be either the main heat dissipation controller or a second memory.

[0047] Step S302: After determining that no heat dissipation control information has been received from the main heat dissipation controller for a preset number of consecutive cycles in the current cycle, it is determined that the main heat dissipation controller is in an abnormal state.

[0048] The preset number of consecutive cycles may include the current cycle.

[0049] Specifically, the main heat dissipation controller, as the primary heat dissipation controller, can periodically generate heat dissipation control information based on the temperature values ​​collected from the task components according to its own rules, and send it to the backup heat dissipation controller.

[0050] When the main cooling controller fails, the backup cooling controller cannot receive cooling control information from the main cooling controller. Accordingly, if the backup cooling controller fails to receive cooling control information from the main cooling controller for a preset number of consecutive cycles, it can be determined that the main cooling controller is in an abnormal state, i.e., it has failed.

[0051] Step S303: When the main heat dissipation controller is in an abnormal state, the first heat dissipation mode is determined as the target heat dissipation mode for the current cycle.

[0052] The first heat dissipation mode is the heat dissipation mode with the highest heat dissipation intensity among the preset heat dissipation modes.

[0053] Specifically, since the main heat dissipation controller is the main controller that performs heat dissipation operations, the heat dissipation control information it sends is of high importance. During the period when the main heat dissipation controller is in an abnormal state, some task components may be under high load. In order to avoid damage to such task components due to high temperature, the backup heat dissipation controller can select the first heat dissipation mode with the greatest heat dissipation intensity as the target heat dissipation mode for the current cycle, so as to ensure the heat dissipation effect even without the reference of heat dissipation control information.

[0054] Step S304: After obtaining the real-time temperature values ​​corresponding to all temperature sensors in at least one temperature sensor, determine the target heat dissipation parameters for the current period based on the real-time temperature values ​​corresponding to all temperature sensors in at least one temperature sensor, the overall heat dissipation strategy, and the target heat dissipation mode.

[0055] Specifically, in the current cycle, after the standby heat dissipation controller receives the real-time temperature values ​​detected by all temperature sensors, it can adopt the target heat dissipation mode, analyze the real-time temperature values ​​of all temperature sensors and the overall heat dissipation strategy, and determine the target heat dissipation parameters for the current cycle.

[0056] Step S305: Based on the target heat dissipation parameters, control the heat dissipation component to perform the heat dissipation operation of the current cycle.

[0057] When the heat dissipation component is a fan, the target heat dissipation parameter can be a parameter related to the fan speed, such as PWM parameter.

[0058] Specifically, the thermal controller can control the fan speed based on PWM parameters.

[0059] In the heat dissipation method of this application, a backup heat dissipation controller can manage temperature sensors. Accordingly, the backup heat dissipation controller can first obtain the overall heat dissipation strategy corresponding to each temperature sensor. After determining that no heat dissipation controller information has been received from the main heat dissipation controller for a preset number of consecutive cycles, it can be determined that the main heat dissipation controller is in an abnormal state. Then, the first heat dissipation mode with the highest heat dissipation intensity can be determined as the target heat dissipation mode for the current cycle. Finally, after obtaining the real-time temperature value detected by the temperature sensor, the target heat dissipation parameters for the current cycle can be determined based on the real-time temperature value detected by the temperature sensor, the overall heat dissipation strategy, and the target heat dissipation mode. Based on the target heat dissipation parameters, the heat dissipation components are controlled to perform the heat dissipation operation for the current cycle. Thus, when a fault is detected in the main heat dissipation controller, i.e., when the main heat dissipation controller is determined to be in an abnormal state, the backup heat dissipation controller can obtain the real-time temperature value detected by the temperature sensors it manages, without performing a link switching operation. There is no situation where effective temperature data cannot be obtained in a timely manner. Furthermore, determining the target heat dissipation parameters using the first heat dissipation mode with the highest heat dissipation intensity ensures the stability of the heat dissipation control and meets the heat dissipation requirements of the target device, preventing the target device from overheating. In addition, this solution does not require a multiplexer for link switching, saving hardware resources.

[0060] In some optional implementations, the overall heat dissipation strategy may include heat dissipation strategies corresponding to various heat dissipation modes. Accordingly, in step S304 above, the standby heat dissipation controller may use the following specific steps to determine the target heat dissipation parameters for the current period:

[0061] Step 1: Based on the target heat dissipation mode, determine the target heat dissipation strategy corresponding to the target heat dissipation mode from among the heat dissipation strategies corresponding to the various heat dissipation modes included in the overall heat dissipation strategy of the target temperature sensor.

[0062] Step 2: Determine the heat dissipation parameters corresponding to the target temperature sensor based on the real-time temperature value of the target temperature sensor and the target heat dissipation strategy.

[0063] Step 3: After determining the heat dissipation parameters corresponding to all temperature sensors in at least one temperature sensor, the largest heat dissipation parameter among the heat dissipation parameters corresponding to all temperature sensors in at least one temperature sensor is determined as the target heat dissipation parameter.

[0064] The target temperature sensor can be any temperature sensor in normal operation. The heat dissipation strategy in the first heat dissipation mode of the overall heat dissipation strategy can be a mapping table or a heat dissipation algorithm; for example, the mapping table can be a mapping table between temperature and heat dissipation parameters.

[0065] For example, the heat dissipation strategy for the temperature sensor at the air inlet in the first heat dissipation mode can be as follows:

[0066] "<20 degrees corresponds to 40% PWM, 20 degrees corresponds to 45% PWM, 25 degrees corresponds to 55% PWM, 30 degrees corresponds to 65% PWM, 35 degrees corresponds to 75% PWM, and 40 degrees corresponds to 80% PWM."

[0067] The heat dissipation algorithm can be a proportional-integral-derivative (PID) algorithm, where the proportional coefficient, integral coefficient, and derivative coefficient can be specified in advance by the technician. Alternatively, the proportional coefficient, integral coefficient, and derivative coefficient in the heat dissipation algorithm can be determined based on the real-time temperature value. For example, the heat dissipation controller can determine the heat dissipation algorithm coefficient group corresponding to the real-time temperature value based on the real-time temperature value in a pre-built mapping table of temperature values ​​and heat dissipation algorithm coefficient groups. This heat dissipation algorithm coefficient group includes the aforementioned proportional coefficient, integral coefficient, and derivative coefficient.

[0068] Specifically, for each temperature sensor, the backup heat dissipation controller can determine the target heat dissipation strategy corresponding to the target heat dissipation mode from among the heat dissipation strategies corresponding to the various heat dissipation modes included in the overall heat dissipation strategy of the temperature sensor.

[0069] Then, the backup heat dissipation controller can use the target heat dissipation strategy and the real-time temperature value detected by the target temperature sensor to determine the heat dissipation parameters corresponding to the target temperature sensor (for example, when the target heat dissipation strategy is the mapping table between the temperature value and the heat dissipation parameters mentioned above, the heat dissipation parameters corresponding to the real-time temperature value of the target temperature sensor can be directly determined in the mapping table based on the real-time temperature value of the target temperature sensor, and the heat dissipation parameters can be determined as the heat dissipation parameters of the target temperature sensor; or, when the target heat dissipation strategy is a heat dissipation algorithm, the real-time temperature value of the target temperature sensor can be input into the heat dissipation algorithm to obtain the heat dissipation parameters output by the heat dissipation algorithm, and then the heat dissipation parameters output by the heat dissipation algorithm can be determined as the heat dissipation parameters corresponding to the target temperature sensor).

[0070] After determining the heat dissipation parameters corresponding to all temperature sensors, the backup heat dissipation controller can determine the maximum heat dissipation parameter from the maximum heat dissipation parameters corresponding to all temperature sensors, and set the maximum heat dissipation parameter as the target heat dissipation parameter.

[0071] In this way, by setting heat dissipation strategies under different heat dissipation modes, the appropriate heat dissipation strategy can be flexibly selected based on the current target heat dissipation mode of the target device, and subsequent heat dissipation operations can be performed accordingly. Furthermore, after determining the heat dissipation parameters of all temperature sensors, the largest heat dissipation parameter is selected as the target heat dissipation parameter, prioritizing the highest demand, which can prevent any component from overheating due to insufficient heat dissipation.

[0072] In some optional implementations, the aforementioned heat dissipation control information may include the operating status of at least one task component managed by the main heat dissipation controller, and the heat dissipation parameters corresponding to the normal task components in the normal operating state. Accordingly, the backup heat dissipation controller may perform the following specific steps:

[0073] Step 1: After receiving the heat dissipation control information sent by the main heat dissipation controller in the current cycle, determine that the main heat dissipation controller is in normal condition.

[0074] Step 2: When the main heat dissipation controller is in normal condition and all task components in at least one task component are in normal condition, the second heat dissipation mode is determined as the target heat dissipation mode.

[0075] The second heat dissipation mode can be the heat dissipation mode with the lowest heat dissipation intensity among multiple heat dissipation modes.

[0076] Step 3: After obtaining the real-time temperature values ​​of all temperature sensors in at least one temperature sensor, determine the target heat dissipation parameters based on the heat dissipation parameters of the normal task components, the real-time temperature values ​​detected by all temperature sensors in at least one temperature sensor, the overall heat dissipation strategy, and the target heat dissipation mode.

[0077] Specifically, when the main heat dissipation controller is working normally, the backup heat dissipation controller can receive the heat dissipation control information sent by the main heat dissipation controller. Therefore, the backup heat dissipation controller can determine the working status of the main heat dissipation controller as normal.

[0078] When the main heat dissipation controller is determined to be in normal condition, the backup heat dissipation controller can further determine whether each task component is in normal condition based on the working status of each task component included in the heat dissipation control information. When it is determined that all task components are in normal condition, the second heat dissipation mode with the least heat dissipation intensity is determined as the target heat dissipation mode for the current cycle.

[0079] Finally, after obtaining the real-time temperature values ​​detected by all temperature sensors, the target heat dissipation mode can be adopted. By analyzing the heat dissipation parameters corresponding to the normal task components and the real-time temperature values ​​detected by all temperature sensors, the target heat dissipation parameters to be used in the current cycle can be determined.

[0080] For example, taking a target temperature sensor as an example, the backup thermal controller can determine the target thermal strategy that matches the target thermal mode from among the thermal strategies corresponding to the various thermal modes included in the overall thermal strategy for the target temperature sensor. The thermal strategy under the second thermal mode in the overall thermal strategy can be a mapping table between temperature values ​​and thermal parameters or a thermal algorithm. Accordingly, the backup thermal controller can directly determine the thermal parameters corresponding to the target temperature sensor in the target thermal strategy based on the real-time temperature value of the target temperature sensor. After determining the thermal parameters corresponding to all temperature sensors, the maximum thermal parameter can be determined from the thermal parameters of all temperature sensors and normally functioning components, and this maximum thermal parameter can be designated as the target thermal parameter.

[0081] Thus, abnormal task components, those in an abnormal operating state, are those unable to obtain temperature values ​​normally. The main thermal controller cannot determine the cooling parameters based on the temperature values ​​of these abnormal task components. Normal task components, those in a normal operating state, are those that can obtain temperature values ​​normally, and the main thermal controller can determine the cooling parameters based on their temperature values. Therefore, by combining the cooling parameters of all normal task components in normal states with the real-time temperature values ​​detected by the temperature sensors, the backup thermal controller can accurately determine the target cooling parameters for the current period through global consideration and execute cooling operations to meet the cooling needs of the target device. Furthermore, since all task components are in a normal state, it indicates that the target device is operating normally. In this case, selecting the cooling mode with the lowest heat dissipation intensity can meet the cooling needs of the target device, saving resources.

[0082] For example, in the second heat dissipation mode, the overall heat dissipation strategy for all task components and temperature sensors can be as follows:

[0083] The temperature sensor at the air inlet can use a linear algorithm (i.e., a mapping table), which means "<20 degrees corresponds to 20% PWM, 20 degrees corresponds to 25% PWM, 25 degrees corresponds to 35% PWM, 30 degrees corresponds to 40% PWM, 35 degrees corresponds to 45% PWM, and 40 degrees corresponds to 50% PWM".

[0084] The air outlet uses a PID algorithm. For example, when the temperature exceeds 35 degrees Celsius, the PID parameters used are P=0.8, I=0.2, and D=0.1.

[0085] The GPU uses a PID algorithm. When the temperature exceeds 60 degrees Celsius, the PID parameters are P=0.5, I=0.1, and D=0.05.

[0086] In some alternative implementations, the backup thermal controller may accordingly perform the following specific steps:

[0087] Step 1: After the main heat dissipation controller is in normal condition and at least one of the task components is in an abnormal working state, the third heat dissipation mode is determined as the target heat dissipation mode.

[0088] Step 2: Count the number of abnormal task components.

[0089] Step 3: Obtain the heat dissipation level corresponding to each component of the abnormal task.

[0090] Step 4: After obtaining the real-time temperature values ​​corresponding to all temperature sensors in at least one temperature sensor, determine the target heat dissipation parameters based on the heat dissipation parameters corresponding to normal task components, the number of abnormal task components, the heat dissipation level of abnormal task components, the target heat dissipation mode, and the real-time temperature values ​​detected by all temperature sensors in at least one temperature sensor.

[0091] The third cooling mode can be any of the various cooling modes other than the first and second cooling modes. The cooling level can be used to indicate the intensity of the cooling requirements of the task components.

[0092] Specifically, when the backup thermal controller determines that there are abnormal task components in an abnormal state based on the operating status of each task component included in the thermal control information, it can determine the thermal mode with an intermediate thermal intensity as the third thermal mode. Furthermore, among the task components managed by the main thermal controller, some or all task components may be abnormal. The number of abnormal task components is related to the thermal requirements of the target device; therefore, the backup thermal controller can count the number of abnormal task components for reference in subsequently determining the target thermal parameters. Moreover, the aforementioned thermal levels can indicate the personalized thermal requirements of task components; the backup thermal controller can first obtain the thermal levels of the abnormal task components (which can be pre-set by technicians). Finally, after the backup thermal controller obtains the real-time temperature values ​​detected by all temperature sensors, it can determine the target thermal parameters based on the thermal parameters corresponding to normal task components, the number of abnormal task components, the thermal levels of the abnormal task components, the target thermal mode, and the real-time temperature values ​​detected by at least one temperature sensor.

[0093] In this way, once an abnormal task component is detected, the system can immediately switch to a third cooling mode designed for abnormal situations. Furthermore, the more abnormal task components there are, the higher the risk to the target device and the greater the need for stronger cooling. The cooling level of the abnormal task component reflects its cooling intensity, and the temperature sensor reflects the cooling requirements of the target device. Therefore, the backup cooling controller determines the target cooling parameters through multi-dimensional information, accurately identifying these parameters. Based on these parameters, the cooling operation can then meet the cooling needs of the target device.

[0094] For example, in the second cooling mode, when the GPU is in an abnormal state, the overall cooling strategy for the temperature sensor at the air inlet can be as follows:

[0095] The temperature sensor at the air inlet uses a linear algorithm, that is, <20 degrees corresponds to 30% PWM, 20 degrees corresponds to 35% PWM, 25 degrees corresponds to 45% PWM, 30 degrees corresponds to 55% PWM, 35 degrees corresponds to 65% PWM, and 40 degrees corresponds to 80% PWM.

[0096] The overall heat dissipation strategy for the temperature sensor at the air outlet in the second heat dissipation mode can be consistent with the overall heat dissipation strategy in the first heat dissipation mode.

[0097] Based on the examples above, the overall heat dissipation strategy for the temperature sensor at the air inlet can be shown in Table 1.

[0098] Table 1

[0099]

[0100] In some optional implementations, the heat dissipation strategy in the third heat dissipation mode may include multiple sub-heat dissipation strategies corresponding to different heat dissipation levels. The sub-heat dissipation strategy may be a mapping table between temperature values ​​and heat dissipation parameters or a heat dissipation algorithm. Accordingly, in step three above, the standby heat dissipation controller may determine the target heat dissipation parameters using the following specific steps:

[0101] Step 1: Based on the target heat dissipation mode, determine the target sub-heat dissipation strategy corresponding to the target heat dissipation mode from the heat dissipation strategies corresponding to the various heat dissipation modes included in the overall heat dissipation strategy of the target temperature sensor.

[0102] Step 2: Based on the number of abnormal task components and / or the heat dissipation level of the abnormal task components, determine the target sub-heat dissipation strategy from the heat dissipation strategies corresponding to the multiple heat dissipation levels included in the target heat dissipation strategy.

[0103] Step 3: Determine the heat dissipation parameters corresponding to the target temperature sensor based on the real-time temperature value of the target temperature sensor and the target sub-heat dissipation strategy.

[0104] Step 4: Determine the maximum heat dissipation parameter among the heat dissipation parameters of all temperature sensors and normal task components in at least one temperature sensor as the target heat dissipation parameter.

[0105] Specifically, taking a target temperature sensor as an example, the backup thermal controller can select a target thermal management strategy that matches the target thermal management mode from among the various thermal management strategies corresponding to the overall thermal management strategy for the target temperature sensor. Furthermore, the backup thermal controller can analyze the number of abnormal task components and their thermal management levels, and then determine the target sub-thermal management strategy that best suits the current abnormal situation from among the sub-thermal management strategies corresponding to the various thermal management levels included in the target thermal management strategy.

[0106] For example, if the number of abnormal task components is greater than a first preset threshold, the sub-cooling strategy with the highest cooling level can be selected as the target sub-cooling strategy from the target cooling strategies. Alternatively, if the number of abnormal task components is less than or equal to the first preset threshold, if there is only one abnormal task component, the sub-cooling strategy matching the cooling level of the abnormal task component can be directly selected as the target sub-cooling strategy. If there are multiple abnormal task components, the highest first cooling level can be determined based on the cooling levels corresponding to the multiple abnormal task components, and then the sub-cooling strategy matching the first cooling level can be selected as the target sub-cooling strategy.

[0107] For example, the backup heat dissipation controller can also determine the maximum heat dissipation level from the heat dissipation levels corresponding to the abnormal task components without using the number of abnormal task components. Then, based on the maximum heat dissipation level, it can determine the sub-heat dissipation strategy corresponding to the maximum heat dissipation level from the sub-heat dissipation strategies of the various heat dissipation levels included in the target heat dissipation strategy, and determine the determined sub-heat dissipation strategy as the target sub-heat dissipation strategy.

[0108] Furthermore, the backup heat dissipation controller can determine the heat dissipation parameters of the target temperature sensor by using the target sub-heat dissipation strategy and the real-time temperature value of the target temperature sensor. For example, if the target sub-heat dissipation strategy is a mapping table between temperature values ​​and heat dissipation parameters, the heat dissipation parameters corresponding to the real-time temperature value of the target temperature sensor can be directly determined from this mapping table. If the target sub-heat dissipation strategy is a PID algorithm, the real-time temperature value of the target temperature sensor can be directly input into the PID algorithm to obtain the heat dissipation parameters output by the PID algorithm.

[0109] Finally, after determining the heat dissipation parameters of all temperature sensors in a similar manner, the maximum heat dissipation parameter can be determined from the heat dissipation parameters corresponding to all temperature sensors and normal operating components, and the determined maximum heat dissipation parameter is set as the target heat dissipation parameter.

[0110] In some alternative implementations, the backup thermal controller may also perform the following specific steps:

[0111] Step 1: If no heat dissipation control information is received in the current cycle, and the number of consecutive cycles in which no heat dissipation control information is received has not reached the preset number, then the second heat dissipation mode is determined as the target heat dissipation mode.

[0112] Step 2: Obtain the adjustment ratio coefficient corresponding to the number of consecutive cycles.

[0113] Step 3: After obtaining the real-time temperature values ​​corresponding to all temperature sensors in at least one temperature sensor, determine the target heat dissipation parameters for the current period based on the real-time temperature values ​​corresponding to all temperature sensors in at least one temperature sensor, the overall heat dissipation strategy, the target heat dissipation mode, and the adjustment ratio coefficient.

[0114] Specifically, if the strongest cooling mode is used to perform the cooling operation as soon as no cooling control information is received for even one cycle, it will lead to resource waste. Therefore, this solution can set a preset threshold number and a mapping table between the number of consecutive cycles and the adjustment ratio coefficient. Furthermore, if no cooling control information is received in the current cycle, and the number of consecutive cycles without receiving cooling control information has not reached the preset number, the second cooling mode with the lowest cooling intensity can be determined as the target cooling mode (i.e., the normal cooling mode). Moreover, based on the current number of consecutive cycles, the adjustment ratio coefficient corresponding to the current number of consecutive cycles can be determined from the mapping table between the number of consecutive cycles and the adjustment ratio coefficient. Finally, after obtaining the real-time temperature values ​​corresponding to all temperature sensors, the target cooling parameters for the current cycle are determined based on the real-time temperature values ​​of all temperature sensors, the overall cooling strategy, the target cooling mode, and the adjustment ratio coefficient.

[0115] For example, the first heat dissipation parameter can be determined based on the real-time temperature values ​​corresponding to all temperature sensors, the overall heat dissipation strategy, and the target heat dissipation mode (the specific processing can be referred to in step S304 above, which will not be repeated here). Then, based on the first heat dissipation parameter and the adjustment ratio coefficient, the target heat dissipation parameter for the current period can be determined. For example, the target heat dissipation parameter can be the product of the first heat dissipation parameter and (adjustment ratio coefficient + 1).

[0116] Thus, since the larger the number of consecutive cycles mentioned above, the greater the heat dissipation risk of the target device, the heat dissipation intensity can be gradually increased based on the number of consecutive cycles in which no heat dissipation control information is received. This can both avoid wasting resources and ensure that the target device can dissipate heat in a timely manner when a real fault occurs.

[0117] In some optional implementations, the backup heat dissipation controller can also determine whether the main heat dissipation controller is in an abnormal state based on the heartbeat command sent by the main heat dissipation controller. Specifically, it can be determined that the main heat dissipation controller is in an abnormal state after a preset number of consecutive cycles have not received a heartbeat command from the main heat dissipation controller in the current cycle, or it can be determined that the main heat dissipation controller is in a normal state after receiving a heartbeat command from the main heat dissipation controller in the current cycle.

[0118] For example, a cycle can be 1 second. If the backup thermal controller fails to receive any thermal control information or heartbeat command from the main thermal controller for 2 consecutive seconds, it can calculate the initial thermal parameters and then increase them by 5% (the adjustment ratio mentioned above). This means the product of the initial thermal parameters and 105% is used to determine the target thermal parameters. If the backup thermal controller fails to receive any thermal control information or heartbeat command from the main thermal controller for 3 consecutive seconds, it can calculate the initial thermal parameters and then increase them by 8%. This means the product of the initial thermal parameters and 108% is used to determine the target thermal parameters. If the backup thermal controller fails to receive any thermal control information or heartbeat command from the main thermal controller for 4 consecutive seconds, it can calculate the initial thermal parameters and then increase them by 10%. This means the product of the initial thermal parameters and 110% is used to determine the target thermal parameters. If the backup thermal controller fails to receive any thermal control information or heartbeat command from the main thermal controller for 5 consecutive seconds, it then determines that the main thermal controller is in an abnormal state. At this time, the backup heat dissipation controller can rely solely on the real-time temperature values ​​read by each temperature sensor to perform heat dissipation operations using the first heat dissipation mode with the highest heat dissipation intensity.

[0119] In some optional implementations, in step S301 above, the first preset storage location can be either the main thermal controller or a second memory connected to the backup thermal controller. Accordingly, the backup thermal controller can obtain the overall thermal strategy in the following two ways:

[0120] Scenario 1: After the target device is powered on for the first time, it receives the overall heat dissipation strategy corresponding to at least one temperature sensor sent by the main heat dissipation controller.

[0121] The overall heat dissipation strategy is obtained by the main heat dissipation controller from the first memory of the target device based on the type of the target device.

[0122] or,

[0123] In the second scenario, after the target device is powered on for the first time, the total heat dissipation strategy corresponding to at least one temperature sensor is read directly from the second memory connected to the backup thermal controller.

[0124] Specifically, since the overall heat dissipation strategy for each temperature sensor can be pre-configured in the first memory of the target device, upon the target device's initial power-on and startup of the main heat dissipation controller, the main heat dissipation controller can first read the target device's type (e.g., model number) from a preset storage location. Then, based on the target device's type, it can read the corresponding heat dissipation configuration information from the target device's first memory. This heat dissipation configuration information can include the overall heat dissipation strategy for each task component, the overall heat dissipation strategy for each temperature sensor, and configuration information. The overall heat dissipation strategy for each task component is used by the main heat dissipation controller, while the overall heat dissipation strategy and configuration information for each temperature sensor are used by the backup heat dissipation controller. Therefore, the main heat dissipation controller can send the overall heat dissipation strategy and configuration information for each temperature sensor to the backup heat dissipation controller, and the backup heat dissipation controller can receive the respective overall heat dissipation strategy and configuration information for each temperature sensor.

[0125] In addition, the backup thermal controller can store the overall heat dissipation strategy and configuration information for each temperature sensor in a second memory connected to itself. After the target device is powered on for the first time, the backup thermal controller can directly read the overall heat dissipation strategy and configuration information for each temperature sensor from the second memory, without needing to transmit it through the main thermal controller, thus saving transmission resources.

[0126] In this way, since related technologies require the development of separate heat dissipation control programs for different models of equipment, this solution only requires the development of one heat dissipation control program. After the target device is started, different heat dissipation configuration information (e.g., the overall heat dissipation strategy of the temperature sensor mentioned above) can be selected and enabled according to the identified target device model. This is more flexible and can shorten the development cycle.

[0127] In some optional implementations, before the backup thermal controller receives the overall cooling strategy corresponding to at least one temperature sensor from the main thermal controller, the backup thermal controller may also perform the following specific steps:

[0128] Step 1: A preset flag is detected in the second memory.

[0129] The preset flag is used to indicate the overall heat dissipation strategy for at least one temperature sensor corresponding to the type of the target device that is not stored in the second memory.

[0130] Step 2: Read the preset heat dissipation parameters from the second memory.

[0131] Step 3: Based on the preset heat dissipation parameters, control the heat dissipation components to perform the first initial heat dissipation operation.

[0132] Specifically, when the target device is powered on for the first time and the backup heat dissipation controller is started, the data stored in the second memory can be detected first. At this time, a preset flag can be detected in the second memory. The backup heat dissipation controller can directly read the preset heat dissipation parameters from the second memory. The preset heat dissipation parameters can be preset PWM parameters (for example, 80%). Based on the preset heat dissipation parameters, the heat dissipation components are controlled to perform the first initial heat dissipation operation.

[0133] For example, refer to Figure 4 The first memory stores the heat dissipation configuration information for servers A and B respectively. For server A, the main heat dissipation controller in server A can read the overall heat dissipation strategy and configuration information of server A's temperature sensor from server A and transmit it to the backup heat dissipation controller. The backup heat dissipation controller can store the overall heat dissipation strategy and configuration information of server A's temperature sensor in the second memory. Similarly, refer to... Figure 5 For server B, the main thermal controller in server B can read the overall thermal management strategy and configuration information of server B's temperature sensors from server B and transmit it to the backup thermal controller. The backup thermal controller can then store the overall thermal management strategy and configuration information of server B's temperature sensors in a second memory.

[0134] In some optional implementations, after storing the total heat dissipation strategy and configuration information corresponding to each temperature sensor into a second memory connected to itself, the backup heat dissipation controller can also clear the preset flag. In this way, after the target device is powered on for the first time and the backup heat dissipation controller starts, the backup heat dissipation controller can first detect the data stored in the second memory. At this time, it can be detected that there is no preset flag in the second memory, indicating that the second memory stores the total heat dissipation strategy of at least one temperature sensor corresponding to the type of the target device. The backup heat dissipation controller can directly read the total heat dissipation strategy of each temperature sensor from it.

[0135] In some alternative implementations, the backup thermal controller may also perform the following operations:

[0136] Step 1: After the target device is powered on for the first time and before the main heat dissipation controller is started, obtain the initial temperature values ​​detected by all temperature sensors in at least one temperature sensor.

[0137] Step 2: Determine the initial heat dissipation parameters based on the first heat dissipation mode, the total heat dissipation strategy corresponding to at least one temperature sensor and all temperature sensors respectively, and the initial temperature value.

[0138] Step 3: Based on the initial heat dissipation parameters, control the heat dissipation components to perform the second initial heat dissipation operation.

[0139] Specifically, before the target device is powered on for the first time and before the main heat dissipation controller is started, the backup heat dissipation controller has been successfully started and has obtained the initial temperature values ​​detected by each temperature sensor. The backup heat dissipation controller can determine the initial heat dissipation parameters according to the first heat dissipation mode, the total heat dissipation strategy corresponding to each temperature sensor and the initial temperature value (the specific processing can be referred to the specific processing of step S304 above, which will not be repeated here). Based on the initial heat dissipation parameters, the backup heat dissipation controller controls the heat dissipation component to perform the second initial heat dissipation operation.

[0140] In this way, even if the main thermal controller is not started, the backup thermal controller can still perform heat dissipation operations according to the overall heat dissipation strategy and initial temperature value of the temperature sensor, ensuring the heat dissipation requirements of the target device.

[0141] In some alternative implementations, the backup thermal controller may be unable to read the real-time temperature value from the temperature sensor due to an I2C bus error. In this case, the backup thermal controller can perform heat dissipation operations in several ways, including:

[0142] In scenario one, the main thermal controller is in normal condition, and based on the received thermal control information, it is determined that all task components are in normal condition.

[0143] The backup thermal controller can determine the third thermal mode as the target thermal mode for the current cycle, count the number of abnormal temperature sensors, and obtain the thermal level of the abnormal temperature sensors. Based on the thermal parameters corresponding to the normal task components, the number of abnormal temperature sensors, the thermal level of the abnormal temperature sensors, the target thermal mode, and the real-time temperature values ​​detected by the normal temperature sensors, the target thermal parameters are determined (the specific processing is similar to the process in step three above, which determines the target thermal parameters based on the thermal parameters corresponding to the normal task components, the number of abnormal task components, the thermal level of the abnormal task components, the target thermal mode, and the real-time temperature values ​​detected by all temperature sensors in at least one temperature sensor, and will not be repeated here).

[0144] Scenario 2: The main heat dissipation controller is in normal condition, and based on the received heat dissipation control information, it is determined that there is an abnormal task component.

[0145] The backup thermal controller can determine the third thermal mode as the target thermal mode for the current cycle, count the number of abnormal temperature sensors, and obtain the thermal level of the abnormal temperature sensors. It also counts the number of abnormal task components. Based on the thermal parameters corresponding to normal task components, the number of abnormal task components, the thermal level of abnormal task components, the number of abnormal temperature sensors, the thermal level of the abnormal temperature sensors, the target thermal mode, and the real-time temperature values ​​detected by the temperature sensors under normal conditions, the target thermal parameters are determined.

[0146] For example, the backup thermal controller can determine the total number of abnormal components by summing the number of abnormal task components and the number of abnormal temperature sensors. Then, for each normal temperature sensor, the thermal parameters corresponding to that normal temperature sensor can be calculated using a method similar to steps 2 to 4 described above. Specifically, if the total number is greater than a second preset threshold, the sub-thermal cooling strategy with the highest thermal level can be selected as the first sub-thermal cooling strategy from the total thermal cooling strategies for normal temperature sensors. Alternatively, if the total number is less than or equal to the second preset threshold, the highest second thermal cooling level can be determined based on the thermal cooling levels corresponding to the abnormal task components and abnormal temperature sensors, and then a sub-thermal cooling strategy matching the second thermal cooling level can be selected as the first sub-thermal cooling strategy. After determining the thermal parameters of all normal temperature sensors in a similar manner, the backup thermal controller can determine the maximum thermal parameter among the thermal parameters of all normal task components and all normal temperature sensors, and set this maximum thermal parameter as the target thermal parameter.

[0147] Scenario 3: The main heat dissipation controller is in an abnormal state.

[0148] If all temperature sensors are in an abnormal state, the preset heat dissipation parameters can be set as the target heat dissipation parameters. If there are normal temperature sensors in a normal state, the backup heat dissipation controller can set the first heat dissipation mode as the target heat dissipation mode, and determine the target heat dissipation parameters for the current period based on the real-time temperature values ​​corresponding to the normal temperature sensors, the overall heat dissipation strategy, and the target heat dissipation mode (for specific processing, please refer to the specific processing of step S304 above, which will not be repeated here).

[0149] In this way, the temperature sensors managed by the backup thermal controller can also use the corresponding heat dissipation mode to determine the target heat dissipation parameters under different conditions, which is more accurate and meets the heat dissipation requirements of the target equipment.

[0150] In some optional implementations, the main thermal controller can acquire the heat dissipation parameters of each task component calculated by itself in the current cycle. Furthermore, the main thermal controller can send a read request to the backup thermal controller, which can then send the real-time temperature values ​​and operating status of each temperature sensor read in the current cycle back to the main thermal controller. The main thermal controller can then send the received real-time temperature values ​​and operating status of each temperature sensor, as well as the heat dissipation parameters and operating status of each task component, to the client device. The client device, upon receiving these data, can display them, allowing technicians to monitor the heat dissipation of the target device in real time.

[0151] In some optional implementations, the main thermal controller can acquire the real-time temperature values ​​of each task component. For each task component, the thermal parameters of the task component can be determined based on the real-time temperature value and the overall thermal strategy. The overall thermal strategy of the task component can be a mapping table between temperature values ​​and thermal parameters or a thermal algorithm, and the thermal algorithm can be a PID algorithm.

[0152] Based on the specific processes of all the above embodiments, the following is given: Figure 6 The diagram illustrates the structure of the heat dissipation system and the task execution logic of each component. Specifically, during the aforementioned process, the backup heat dissipation controller can determine the target heat dissipation mode and target heat dissipation parameters based on the operating status of the main heat dissipation controller, the operating status of the task components included in the heat dissipation control information sent by the main heat dissipation controller when the main heat dissipation controller is in a normal operating state, the heat dissipation parameters of normal task components in a normal operating state, the operating status of the temperature sensor, the real-time temperature value of the normal temperature sensor in a normal operating state, and the overall heat dissipation strategy.

[0153] The following example illustrates the heat dissipation process described above.

[0154] The task component in the server is the GPU, and temperature sensors are located at the air inlet and outlet.

[0155] With the main thermal controller functioning normally, it reads the GPU's real-time temperature as 62 degrees Celsius, calculates a PWM of 50%, and sends this to the backup thermal controller. The backup thermal controller, confirming the main controller is functioning correctly, determines that a third cooling mode can be used. It reads the exhaust vent's temperature sensor as 36 degrees Celsius, calculates the PWM using a PID algorithm, and determines a PWM of 45%. It also reads the inlet vent's temperature sensor as 25 degrees Celsius, and uses a mapping table to determine the corresponding PWM of 35%. The backup thermal controller can then determine the maximum 50% of these three PWM values ​​as the target cooling parameter for the current period. The main thermal controller can periodically obtain the real-time temperature values ​​detected by the inlet and exhaust vent temperature sensors from the backup thermal controller via I2C, as well as directly read the GPU's real-time temperature value from the GPU, and update the web interface. For example, the GPU temperature might be 62 degrees Celsius, the inlet temperature 25 degrees Celsius, and the exhaust temperature 36 degrees Celsius.

[0156] When the main thermal controller malfunctions, the backup thermal controller relies on its own readings of the real-time temperatures at the air inlet and outlet (e.g., 25 degrees Celsius and 36 degrees Celsius, respectively) and adopts the first cooling mode. Accordingly, the backup thermal controller can determine that the PWM corresponding to the real-time temperature at the air inlet is 55%, and the PWM corresponding to the real-time temperature at the air outlet is 45%. The backup thermal controller can determine the maximum 55% of the three PWM values ​​as the target cooling parameter for the current cycle.

[0157] After the primary thermal controller restarts, the backup thermal controller can resume collaborative cooling, continuing to use the third cooling mode. After the GPU's temperature drops to 60 degrees Celsius following the first cooling mode, the primary thermal controller can recalculate the PWM to 45%. The temperature at the exhaust vent drops to 34 degrees Celsius, and the backup thermal controller recalculates the PWM to 40%. The temperature at the intake vent drops to 25 degrees Celsius, and the backup thermal controller recalculates the PWM to 35%. The backup thermal controller selects the highest 45% as the target cooling parameter for the current cycle.

[0158] Due to a loose I2C cable, the primary thermal controller was unable to read the real-time temperature value from the GPU, returning an "I2C NACK" error. The thermal control information sent by the primary thermal controller to the backup thermal controller indicated an abnormal GPU status and did not include a real-time temperature value. Upon receiving the thermal control information, the backup thermal controller determined the GPU to be an abnormal task and activated the second cooling mode. The backup thermal controller read a real-time temperature of 25 degrees Celsius from the inlet temperature sensor, determining the PWM value to be 35%. It also read a real-time temperature of 33 degrees Celsius from the outlet temperature sensor, again determining the PWM value to be 35%. Finally, the backup thermal controller determined the higher of these values ​​(35%) as the target cooling parameter for the current cycle.

[0159] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method.

[0160] Embodiments of this application also provide a heat dissipation device, such as... Figure 7 As shown, it includes:

[0161] The acquisition module 710 is used to acquire the total heat dissipation strategy corresponding to at least one temperature sensor managed by the backup heat dissipation controller.

[0162] The determination module 720 is used to determine that the main heat dissipation controller is in an abnormal state after it has not received heat dissipation control information from the main heat dissipation controller for a consecutive preset number of cycles, wherein the consecutive preset number of cycles includes the current cycle; when the main heat dissipation controller is in an abnormal state, the first heat dissipation mode is determined as the target heat dissipation mode for the current cycle, wherein the first heat dissipation mode is the heat dissipation mode with the highest heat dissipation intensity among a number of preset heat dissipation modes; after obtaining the real-time temperature values ​​corresponding to all temperature sensors in at least one temperature sensor, the target heat dissipation parameters for the current cycle are determined based on the real-time temperature values ​​corresponding to all temperature sensors in at least one temperature sensor, the total heat dissipation strategy, and the target heat dissipation mode.

[0163] The control module 730 is used to control the heat dissipation component to perform heat dissipation operations in the current cycle based on the target heat dissipation parameters.

[0164] In some optional implementations, the overall heat dissipation strategy includes heat dissipation strategies corresponding to various heat dissipation modes; the acquisition module 710 is specifically used for:

[0165] Based on the target heat dissipation mode, among the heat dissipation strategies corresponding to the various heat dissipation modes included in the total heat dissipation strategy of the target temperature sensor, the target heat dissipation strategy corresponding to the target heat dissipation mode is determined, wherein the target temperature sensor is any temperature sensor in a normal state.

[0166] Based on the real-time temperature value of the target temperature sensor and the target heat dissipation strategy, determine the heat dissipation parameters corresponding to the target temperature sensor.

[0167] After determining the heat dissipation parameters corresponding to all temperature sensors in at least one temperature sensor, the largest heat dissipation parameter among the heat dissipation parameters corresponding to all temperature sensors in at least one temperature sensor is determined as the target heat dissipation parameter.

[0168] In some optional implementations, the heat dissipation control information includes the operating status of at least one task component managed by the main heat dissipation controller, and the heat dissipation parameters corresponding to each normal task component in the normal operating state; the determining module 720 is further configured to:

[0169] After receiving the heat dissipation control information sent by the main heat dissipation controller in the current cycle, it is determined that the main heat dissipation controller is in normal condition;

[0170] When the main heat dissipation controller is in normal condition and all task components in at least one task component are in normal condition, the second heat dissipation mode is determined as the target heat dissipation mode, wherein the second heat dissipation mode is the heat dissipation mode with the lowest heat dissipation intensity among multiple heat dissipation modes.

[0171] After obtaining the real-time temperature values ​​corresponding to all temperature sensors in at least one temperature sensor, the target heat dissipation parameters are determined based on the heat dissipation parameters corresponding to the normal task components, the real-time temperature values ​​detected by all temperature sensors in at least one temperature sensor, the overall heat dissipation strategy, and the target heat dissipation mode.

[0172] In some alternative implementations, the determining module 720 is further configured to:

[0173] After the main heat dissipation controller is in normal condition and at least one of the task components is in an abnormal state, the third heat dissipation mode is determined as the target heat dissipation mode. The third heat dissipation mode is a heat dissipation mode other than the first heat dissipation mode and the second heat dissipation mode.

[0174] Count the number of abnormal task components;

[0175] Obtain the heat dissipation level corresponding to each component in the abnormal task;

[0176] After obtaining the real-time temperature values ​​corresponding to all temperature sensors in at least one temperature sensor, the target heat dissipation parameters are determined based on the heat dissipation parameters corresponding to normal task components, the number of abnormal task components, the heat dissipation level of abnormal task components, the target heat dissipation mode, and the real-time temperature values ​​detected by all temperature sensors in at least one temperature sensor.

[0177] In some optional implementations, the heat dissipation strategy in the third heat dissipation mode includes multiple sub-heat dissipation strategies corresponding to different heat dissipation levels; the determining module 720 is specifically used for:

[0178] Based on the target heat dissipation mode, among the heat dissipation strategies corresponding to the various heat dissipation modes included in the overall heat dissipation strategy of the target temperature sensor, the target heat dissipation strategy corresponding to the target heat dissipation mode is determined.

[0179] Based on the number of abnormal task components and / or the heat dissipation level of the abnormal task components, the target sub-heat dissipation strategy is determined from the sub-heat dissipation strategies corresponding to the multiple heat dissipation levels included in the target heat dissipation strategy.

[0180] Based on the real-time temperature value of the target temperature sensor and the target sub-heat dissipation strategy, determine the heat dissipation parameters corresponding to the target temperature sensor.

[0181] The maximum heat dissipation parameter among the heat dissipation parameters of all temperature sensors and normal operating components in at least one temperature sensor is determined as the target heat dissipation parameter.

[0182] In some alternative implementations, the determining module 720 is further configured to:

[0183] If no heat dissipation control information is received in the current cycle, and the number of consecutive cycles in which no heat dissipation control information is received has not reached the preset number, the second heat dissipation mode will be determined as the target heat dissipation mode.

[0184] Based on the number of consecutive cycles, obtain the adjustment ratio coefficient corresponding to the number of consecutive cycles;

[0185] After obtaining the real-time temperature values ​​corresponding to all temperature sensors in at least one temperature sensor, the target heat dissipation parameters for the current period are determined based on the real-time temperature values ​​corresponding to all temperature sensors in at least one temperature sensor, the overall heat dissipation strategy, the target heat dissipation mode, and the adjustment ratio coefficient.

[0186] In some optional implementations, the acquisition module 710 is specifically used for:

[0187] After the target device is powered on for the first time, it receives the total heat dissipation strategy corresponding to at least one temperature sensor sent by the main heat dissipation controller, wherein the total heat dissipation strategy is obtained by the main heat dissipation controller from the first memory of the target device based on the type of the target device;

[0188] or,

[0189] After the target device is powered on for the first time, the total heat dissipation strategy corresponding to at least one temperature sensor is read directly from the second memory connected to the backup thermal controller.

[0190] In some optional implementations, before receiving the overall heat dissipation strategy corresponding to at least one temperature sensor sent by the main heat dissipation controller, the control module 730 is further configured to:

[0191] A preset flag is detected in the second memory, wherein the preset flag is used to indicate that the total heat dissipation strategy of at least one temperature sensor corresponding to the type of the target device is not stored in the second memory;

[0192] Read preset heat dissipation parameters from the second memory;

[0193] Based on preset heat dissipation parameters, the heat dissipation components are controlled to perform the first initial heat dissipation operation.

[0194] In some alternative implementations, the control module 730 is further configured to:

[0195] After the target device is powered on for the first time and before the main heat dissipation controller is started, acquire the initial temperature values ​​detected by all temperature sensors in at least one temperature sensor.

[0196] The initial heat dissipation parameters are determined based on the first heat dissipation mode, the total heat dissipation strategy corresponding to at least one temperature sensor and all temperature sensors respectively, and the initial temperature value.

[0197] Based on the initial heat dissipation parameters, the heat dissipation components are controlled to perform a second initial heat dissipation operation.

[0198] For a description of the features in the embodiment corresponding to the heat dissipation device, please refer to the relevant description of the embodiment corresponding to the heat dissipation method, which will not be repeated here.

[0199] Embodiments of this application also provide an electronic device, such as... Figure 8 As shown, the device includes a memory 10 and a processor 20. The memory 10 stores a computer program, and the processor 20 is configured to run the computer program to perform the steps in any of the above-described heat dissipation method embodiments. The electronic device can be either the main heat dissipation controller or the backup heat dissipation controller described above.

[0200] Embodiments of this application also provide a computer-readable storage medium storing a computer program, wherein the computer program is configured to execute the steps in any of the above-described heat dissipation method embodiments when it is run.

[0201] In one exemplary embodiment, the aforementioned computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard disk, magnetic disk, or optical disk.

[0202] Embodiments of this application also provide a computer program product, which includes a computer program that, when executed by a processor, implements the steps in any of the above-described heat dissipation method embodiments.

[0203] Embodiments of this application also provide another computer program product, including a non-volatile computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps in any of the above-described heat dissipation method embodiments.

[0204] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0205] The above provides a detailed description of a heat dissipation method, system, apparatus, electronic device, storage medium, and program product provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A heat dissipation method, characterized in that, The heat dissipation method is executed by a backup heat dissipation controller, and the heat dissipation method includes: The overall heat dissipation strategy corresponding to at least one temperature sensor managed by the backup heat dissipation controller is obtained. The temperature sensor is set at the air inlet, air outlet and motherboard of the server. The overall heat dissipation strategy includes heat dissipation strategies corresponding to multiple heat dissipation modes. After the current cycle determines that no heat dissipation control information has been received from the main heat dissipation controller for a preset number of consecutive cycles, the main heat dissipation controller is determined to be in an abnormal state. The preset number of consecutive cycles includes the current cycle. The heat dissipation control information includes the working status of at least one task component managed by the main heat dissipation controller, and the heat dissipation parameters corresponding to the normal task components when the working status is normal. When the main heat dissipation controller is in the abnormal state, the first heat dissipation mode is determined as the target heat dissipation mode for the current period, wherein the first heat dissipation mode is the heat dissipation mode with the highest heat dissipation intensity among a variety of preset heat dissipation modes. After obtaining the real-time temperature values ​​corresponding to all temperature sensors in at least one of the temperature sensors, the target heat dissipation parameters for the current period are determined based on the real-time temperature values ​​corresponding to all temperature sensors in at least one of the temperature sensors, the overall heat dissipation strategy, and the target heat dissipation mode. After receiving the heat dissipation control information sent by the main heat dissipation controller in the current cycle, it is determined that the main heat dissipation controller is in a normal state; When the main heat dissipation controller is in the normal state, and all task components in at least one of the task components are normal task components, the second heat dissipation mode is determined as the target heat dissipation mode, wherein the second heat dissipation mode is the heat dissipation mode with the lowest heat dissipation intensity among the various heat dissipation modes. After obtaining the real-time temperature values ​​corresponding to all temperature sensors in at least one of the temperature sensors, the target heat dissipation parameters are determined based on the heat dissipation parameters corresponding to the normal task components, the real-time temperature values ​​detected by all temperature sensors in at least one of the temperature sensors, the total heat dissipation strategy, and the target heat dissipation mode. Based on the target heat dissipation parameters, the heat dissipation components are controlled to perform the heat dissipation operation of the current cycle.

2. The heat dissipation method according to claim 1, characterized in that, After obtaining the real-time temperature values ​​corresponding to all temperature sensors in at least one of the temperature sensors, the target heat dissipation parameters for the current period are determined based on the real-time temperature values ​​corresponding to all temperature sensors in at least one of the temperature sensors, the overall heat dissipation strategy, and the target heat dissipation mode, including: According to the target heat dissipation mode, among the heat dissipation strategies corresponding to the various heat dissipation modes included in the total heat dissipation strategy of the target temperature sensor, the target heat dissipation strategy corresponding to the target heat dissipation mode is determined, wherein the target temperature sensor is any temperature sensor in a normal state. Based on the real-time temperature value of the target temperature sensor and the target heat dissipation strategy, determine the heat dissipation parameters corresponding to the target temperature sensor; After determining the heat dissipation parameters corresponding to all temperature sensors in at least one of the temperature sensors, the largest heat dissipation parameter among the heat dissipation parameters corresponding to all temperature sensors in at least one of the temperature sensors is determined as the target heat dissipation parameter.

3. The heat dissipation method according to claim 2, characterized in that, The method further includes: After the main heat dissipation controller is in the normal state and at least one of the task components has an abnormal task component whose working state is in the abnormal state, the third heat dissipation mode is determined as the target heat dissipation mode, wherein the third heat dissipation mode is a heat dissipation mode other than the first heat dissipation mode and the second heat dissipation mode. Count the number of components involved in the abnormal task; Obtain the heat dissipation level corresponding to each of the abnormal task components; After obtaining the real-time temperature values ​​corresponding to all temperature sensors in at least one of the temperature sensors, the target heat dissipation parameters are determined based on the heat dissipation parameters corresponding to the normal task components, the number of abnormal task components, the heat dissipation level of the abnormal task components, the target heat dissipation mode, and the real-time temperature values ​​detected by all temperature sensors in at least one of the temperature sensors.

4. The heat dissipation method according to claim 3, characterized in that, The heat dissipation strategy in the third heat dissipation mode includes multiple sub-heat dissipation strategies corresponding to different heat dissipation levels. After obtaining the real-time temperature values ​​corresponding to all temperature sensors in at least one of the temperature sensors, the target heat dissipation parameters are determined based on the heat dissipation parameters corresponding to the normal task components, the number of abnormal task components, the heat dissipation level of the abnormal task components, the target heat dissipation mode, and the real-time temperature values ​​detected by all temperature sensors in at least one of the temperature sensors. This includes: Based on the target heat dissipation mode, among the heat dissipation strategies corresponding to the various heat dissipation modes included in the overall heat dissipation strategy of the target temperature sensor, the target heat dissipation strategy corresponding to the target heat dissipation mode is determined. Based on the number of abnormal task components and / or the heat dissipation level of the abnormal task components, a target sub-heat dissipation strategy is determined from the sub-heat dissipation strategies corresponding to the multiple heat dissipation levels included in the target heat dissipation strategy. Based on the real-time temperature value of the target temperature sensor and the target sub-heat dissipation strategy, determine the heat dissipation parameters corresponding to the target temperature sensor; The target heat dissipation parameter is determined as the largest heat dissipation parameter among the heat dissipation parameters of all temperature sensors and the normal functioning component, respectively, in at least one of the temperature sensors.

5. The heat dissipation method according to any one of claims 1 to 4, characterized in that, The method further includes: If the heat dissipation control information is not received in the current cycle, and the number of consecutive cycles in which the heat dissipation control information is not received has not reached the preset number, the second heat dissipation mode is determined as the target heat dissipation mode. Based on the number of consecutive cycles, obtain the adjustment ratio coefficient corresponding to the number of consecutive cycles; After obtaining the real-time temperature values ​​corresponding to all temperature sensors in at least one of the temperature sensors, the target heat dissipation parameters for the current period are determined based on the real-time temperature values ​​corresponding to all temperature sensors in at least one of the temperature sensors, the overall heat dissipation strategy, the target heat dissipation mode, and the adjustment ratio coefficient.

6. The heat dissipation method according to any one of claims 1 to 4, characterized in that, The step of obtaining the overall heat dissipation strategy corresponding to at least one temperature sensor managed by the backup heat dissipation controller includes: After the target device is powered on for the first time, it receives at least one total heat dissipation strategy corresponding to each of the temperature sensors sent by the main heat dissipation controller, wherein the total heat dissipation strategy is obtained by the main heat dissipation controller from the first memory of the target device based on the type of the target device; or, After the target device is powered on for the first time, the total heat dissipation strategy corresponding to at least one of the temperature sensors is read directly from the second memory connected to the backup heat dissipation controller.

7. The heat dissipation method according to claim 6, characterized in that, Before receiving the overall heat dissipation strategy corresponding to at least one of the temperature sensors sent by the main heat dissipation controller, the method further includes: A preset flag is detected in the second memory, wherein the preset flag is used to indicate that the total heat dissipation strategy of at least one temperature sensor corresponding to the type of the target device is not stored in the second memory; Read the preset heat dissipation parameters from the second memory; Based on the preset heat dissipation parameters, the heat dissipation component is controlled to perform a first initial heat dissipation operation.

8. The heat dissipation method according to claim 6, characterized in that, The method further includes: After the target device is powered on for the first time and before the main heat dissipation controller is started, the initial temperature values ​​detected by all temperature sensors in at least one of the temperature sensors are obtained respectively. The initial heat dissipation parameters are determined based on the first heat dissipation mode, the total heat dissipation strategy corresponding to at least one of the temperature sensors, and the initial temperature value. Based on the initial heat dissipation parameters, the heat dissipation component is controlled to perform a second initial heat dissipation operation.

9. A heat dissipation system, characterized in that, The heat dissipation system includes a main heat dissipation controller, a backup heat dissipation controller, a temperature sensor, and heat dissipation components; The temperature sensor is used to detect temperature values; The main heat dissipation controller is used to transmit heat dissipation control information to the backup heat dissipation controller; The backup heat dissipation controller is used to perform the heat dissipation method as described in any one of claims 1 to 8; The heat dissipation component is used to perform heat dissipation operations under the control of the backup heat dissipation controller.

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