Satellite-borne array type load detector and heat dissipation design method and heat dissipation structure thereof

Abstract

This invention provides a heat dissipation design method for a spaceborne array-type payload detector, comprising: calculating the heat transfer capacity of the internal heat-conducting structure for each detector unit in the spaceborne array-type payload detector, obtaining the location of the heat dissipation surface of the housing, and designing a heat dissipation path as: detector chip - heat-conducting structure - detector housing; based on the location of the heat dissipation surface of the housing of each detector unit, iteratively calculating the self-adjustment capability of the detector heat dissipation surface, and obtaining the heat conduction connection method between adjacent detector units in the detector array, and obtaining the final temperature of the heat dissipation surface of the housing; obtaining the temperature of the detector chip according to the heat transfer capacity and the final temperature of the heat dissipation surface of the housing, thus completing the heat dissipation design of the spaceborne array-type payload detector. It also provides a spaceborne array-type payload detector and its heat dissipation structure implemented based on this method. This invention enables each detector in the payload array to effectively dissipate heat without increasing the additional mass of the heat dissipation structure, significantly reducing temperature control power consumption.

Description

Technical Field

[0001] This invention relates to the field of spacecraft thermal control technology, and in particular to spaceborne array-type payload detectors and their heat dissipation design methods and heat dissipation structures. Background Technology

[0002] Spaceborne detectors are the core sensing units in payloads that convert optical signals into electrical signals, and their performance directly determines the detection quality and information acquisition capability. Array-based detector payloads have become a mainstream design due to their advantages such as scalability, ease of assembly, and ease of adjustment. Examples include the wide-field X-ray telescope on the Tianguan satellite, the high, medium, and low-energy detector payloads on the HXMT satellite, the energy spectrum measurement focusing telescope array and polarization measurement focusing telescope array payloads of the Enhanced X-ray Timing and Polarization Space Observatory, and the transit telescope on the ET satellite—all of which employ array-based detector payload designs.

[0003] The above design scheme, since there is sufficient space for the design and layout of the payload, adopts a traditional heat dissipation design approach for each detector:

[0004] (1) Heat is conducted to the outside of the detector housing by setting a heat-conducting structure on the back of the detector chip;

[0005] (2) Heat is conducted to the heat dissipation surface at the far end through heat conduction tape, channel heat pipe, etc.;

[0006] (3) The heat dissipation surface dissipates heat into the spatial background through thermal radiation;

[0007] (4) Heat dissipation of the detector is achieved through the heat transfer path of detector chip-heat conduction structure-heat pipe-heat dissipation surface. Depending on the requirements of some detectors, a cooler will be added to the heat transfer path to achieve lower temperature control of the detector.

[0008] (5) Temperature control of the detector chip is achieved by controlling the temperature of the heat pipe or heat dissipation surface.

[0009] Based on the above traditional detector heat dissipation design ideas, the weight of heat conduction structure, heat pipe, heat dissipation surface and other structural accessories accounts for about 10-20% of the total weight of the load.

[0010] With the development of space science exploration, on the one hand, in order to meet the needs of the next generation of broader exploration areas, it is necessary to continue to increase the number of detectors on the basis of the existing array scale; on the other hand, in order to meet the needs of longer and more stable exploration, satellites will fly to Lagrange points or even deeper space to conduct observations, which puts great constraints on payload weight and temperature control power consumption, making it necessary to make the payload lightweight and integrated design.

[0011] Using traditional heat dissipation design methods for array detectors has the following shortcomings:

[0012] (1) Based on the traditional detector heat dissipation design concept, heat pipes, heat conduction surfaces and other structural accessories will significantly increase the load weight; as mentioned above, the traditional detector heat dissipation system accounts for about 10-20% of the total load weight.

[0013] (2) The increase in the number of array detectors will lead to a more complex number and structure of heat pipes, which will increase the difficulty of the process and implementation. At the same time, the complex heat transfer path of the heat pipes will affect the heat dissipation performance of the detectors.

[0014] (3) The detector temperature is significantly related to the fixed position of the heat dissipation surface and the heat flow input, which causes repeated fluctuations in the heat transfer path, which will affect the temperature control effect of the detector.

[0015] (4) Due to the homogeneous design concept, the heat pipes and heat dissipation surfaces of each detection unit are relatively independent, which cannot form a system-level heat transfer and dissipation, resulting in a large overall temperature control power consumption of the load.

[0016] (5) The heat pipes and heat dissipation surfaces installed in each detection unit deteriorate the mechanical response of the system, posing a risk to the normal operation of the detector;

[0017] Therefore, it is evident that the heat dissipation methods of array-type spaceborne detectors cannot meet the development needs of space science exploration, and there is still considerable room for optimization. Currently, no descriptions or reports of technologies similar to this invention have been found, nor have similar domestic or international materials been collected. Summary of the Invention

[0018] To address the aforementioned shortcomings in the prior art, this invention provides a spaceborne array-type payload detector and its heat dissipation design method and structure, enabling the design and computational analysis of thermal control for array-type optical payload detectors.

[0019] According to one aspect of the present invention, a heat dissipation design method for a spaceborne array-type payload detector is provided, comprising:

[0020] For each detector unit in a spaceborne array-type payload detector, the heat transfer capacity of its internal heat-conducting structure is calculated, the location of the heat dissipation surface of the housing is obtained, and the heat dissipation path is designed; wherein, the heat dissipation path is: detector chip - heat-conducting structure - detector housing.

[0021] Based on the location of the heat dissipation surface of each detector unit, the corresponding detector heat dissipation surface self-adjustment capability is iteratively calculated. The total heat dissipation capacity of the array and the total heat load are kept within the allowable range. The thermal conduction connection method between adjacent detector units in the detector array is obtained by using deficit and surplus logic, and finally the temperature of the heat dissipation surface of the casing is obtained.

[0022] Based on the heat transfer capacity and the temperature of the heat dissipation surface of the casing, the temperature of the detector chip is obtained, and the heat dissipation design of the spaceborne array-type payload detector is completed.

[0023] Preferably, the step of calculating the heat transfer capacity of the internal heat-conducting structure of each detector unit in the spaceborne array-type payload detector, obtaining the location of the heat dissipation surface of the casing, and designing the heat dissipation path includes:

[0024] The heat transfer capacity of the internal heat-conducting structure of the detector is calculated to determine the specific location of the heat dissipation surface of the detector housing.

[0025] Inside the detector, the detector chip is thermally mounted to the heat-conducting structure, and according to the location of the heat dissipation surface, the heat-conducting structure is thermally mounted to multiple heat dissipation surfaces of the detector housing to form a heat dissipation path.

[0026] The surface of the heat-conducting structure is covered with multiple layers of heat insulation components to prevent radiative heat exchange between the heat-conducting structure and the internal environment of the detector.

[0027] A heat dissipation coating is applied to the outside of the detector housing to radiate heat generated by the detector chip outwards.

[0028] Preferably, the calculation of the heat transfer capacity of the internal heat-conducting structure of the detector to determine the specific location of the heat dissipation surface of the detector housing includes:

[0029] A calculation model for the heat transfer capacity of the internal thermal conductive structure of the detector was established, and the following results were obtained:

[0030]

[0031] In the formula: The heat transfer required from the detector chip of detector unit i to the heat dissipation surface of the detector housing; This refers to the number of contacts between the heat-conducting structure and the heat dissipation surface of the detector housing, i.e., the number of heat conduction and heat transfer paths between the heat-conducting structure and the detector housing. Let J be the heat transfer cross section on the heat transfer path j where the heat-conducting structure of detector unit i is located. Let be the heat transfer coefficient of the thermally conductive structural material of detector unit i; is the length of the heat conduction path j on which the heat conduction structure of detector unit i is located; The temperature is the temperature at the center of the thermally conductive structure of detector unit i, i.e., the temperature of the detector chip. The temperature of each heat dissipation surface of the detector housing in contact with the heat-conducting structure;

[0032] Based on the heat transfer capacity calculation model of the heat-conducting structure inside the detector, the number j of contacts between the heat-conducting structure and the heat dissipation surface of the detector housing is calculated through the geometric and physical property parameters of the heat-conducting structure, thereby determining the specific heat dissipation location of the detector housing.

[0033] Preferably, the process of iteratively calculating the autonomous adjustment capability of the heat dissipation surface of the detector based on the location of the heat dissipation surface of each detector unit, ensuring that the total heat dissipation capacity and total heat load of the array are balanced within an allowable range, and using deficit and surplus logic to obtain the thermal conduction connection method between adjacent detector units in the detector array, ultimately obtaining the temperature of the heat dissipation surface of the housing, includes:

[0034] Based on the radiative heat transfer coefficient of each detector unit's heat dissipation surface to space and the external heat flow, the heat dissipation capacity and heat load of each detector unit are calculated to obtain the total heat dissipation capacity and total heat load of the array. These two values ​​are then compared. When the total heat dissipation capacity is less than the total heat load, the spacing between the detector units in the array is increased, and the radiative heat transfer coefficient of each detector unit's heat dissipation surface to space and the external heat flow are recalculated. Through this iterative calculation, the total heat dissipation capacity and total heat load of the array are kept within an acceptable range.

[0035] Based on the heat dissipation capacity and heat load of each detector unit, define whether the detector unit belongs to heat dissipation deficit or heat dissipation surplus, and sort the deficit and surplus in descending order respectively.

[0036] For each detector unit defined as having a heat dissipation deficit, find the nearest detector unit defined as having a heat dissipation surplus; determine whether the heat dissipation surplus is greater than the heat dissipation deficit. If the determination is true, connect the two detector units thermally; if the determination is false, sequentially select other detector units with heat dissipation surplus that are closest to the detector unit with the heat dissipation deficit and borrow their surplus heat dissipation until the heat dissipation deficit is zero. Then connect the detector unit with the heat dissipation deficit to these detector units with heat dissipation surplus.

[0037] Check the heat dissipation deficit of the detector units in the array. If there is still a heat dissipation deficit, continue to distribute the heat dissipation surplus and heat dissipation deficit until all the heat dissipation deficit detector units in the array are distributed by thermally conducting with the heat dissipation surplus detector units.

[0038] The temperature of the heat dissipation surface of the casing is obtained based on the final optimized state.

[0039] Preferably, during the initial iteration calculation, all effective areas on the heat dissipation surface of the detector housing are used as heat dissipation surfaces. Based on updates to the position of each detector unit within the array and the total size of the heat dissipation surface, the radiative heat transfer coefficient and external heat flow of each detector unit's heat dissipation surface to space are continuously iterated, including:

[0040] In the first iteration of the calculation, all areas on the heat dissipation surface of the detector housing are assumed to be heat dissipation surfaces.

[0041] Continuously update the total heat dissipation area Ar of each detector unit i i And, in conjunction with the location of detector unit i in the array, the radiative heat transfer coefficient REF of its heat dissipation surface to space is calculated using the Monte Carlo method. i Where i∈[1,n], and n is the number of detector units;

[0042] Calculate the external heat flow Q of detector unit i wi for:

[0043] Q wi =Ar i *(q si *α+q ei *ε)

[0044] In the formula, q si q represents the average incident heat flux reflected by the sun and the earth's albedo. ei ε is the average incident infrared heat flux of Earth, α is the solar absorptivity of the heat dissipation coating on the detector casing, and ε is the infrared emissivity.

[0045] Preferably, the heat dissipation capacity and heat load of each detector unit are calculated based on the radiative heat transfer coefficient of each detector unit's heat dissipation surface facing space and the external heat flow, to obtain the total heat dissipation capacity and total heat load of the array. These two values ​​are then compared. When the total heat dissipation capacity cannot meet the total heat load, the spacing between the detector units in the array is increased, and the radiative heat transfer coefficient of each detector unit's heat dissipation surface facing space and the external heat flow are recalculated. Through this iterative calculation, the total heat dissipation capacity and total heat load of the array are kept within acceptable limits, including:

[0046] Based on the radiative heat transfer coefficient of each detector unit's heat dissipation surface to space and the external heat flow, the heat dissipation capacity and heat load of each detector unit are calculated to obtain the total heat dissipation capacity and total heat load of the array, including:

[0047] Calculate the thermal load L of detector unit i i and heat dissipation capacity C i ,get:

[0048] L i =Q wi +Q ni +Q ri

[0049] C i =REF i * Ar i *σ*ε*(Twi 4 -T s 4 )

[0050] In the formula: Q wi For the external heat flow of detector unit i, Q ni Q is the internal heat source of detector unit i. ri REF represents the minimum thermal power consumption within detector unit i. i For the radiative heat transfer coefficient of the heat dissipation surface in space, Ar i Let σ be the total heat dissipation area, and σ be the Boltzmann constant, σ = 5.67 × 10⁻⁶. -8 W / (m 2 ·K 4 ), where ε is the infrared emissivity, and T wi T is the temperature of the heat dissipation surface of detector unit i. s The ambient temperature of the space or background;

[0051] The thermal load L for each detector unit i and heat dissipation capacity C i Sum the results to obtain the total heat load and total heat dissipation capacity of the array.

[0052] Determine whether the following relationship holds true:

[0053]

[0054] If the judgment is not valid, it means that the total heat dissipation capacity of the array cannot meet the total heat load, and the spacing between each detector element needs to be increased to increase the radiative heat transfer coefficient REF of each detector element. i This increases the array's total heat dissipation capacity, while simultaneously incrementing the iteration count by 1 and recalculating the radiative heat transfer coefficient REF. i and external heat flow Q wi ;

[0055] If the judgment is true, it means that the total heat dissipation capacity of the array meets the total heat load;

[0056] Introducing a heat dissipation threshold S, and iteratively calculating the autonomous adjustment capability of the corresponding detector heat dissipation surface, the total array heat dissipation capacity is kept equal to the total heat load within the heat dissipation threshold S. Then:

[0057] .

[0058] Preferably, the step of defining whether a detector unit is in a heat dissipation deficit or surplus based on the heat dissipation capacity and heat load of each detector unit, and sorting the deficit and surplus amounts in descending order respectively, includes:

[0059] Once the array's total heat dissipation capacity meets the total heat load, proceed to the next step:

[0060] Current iteration count ≥ Maximum iteration count X

[0061] If the determination regarding the number of iterations is invalid, then the difference between the total heat dissipation capacity and the total heat load is used to determine the degree to which the total heat dissipation capacity exceeds the total heat load, based on the heat dissipation threshold S.

[0062]

[0063] If the degree judgment is invalid, the radiation heat transfer coefficient REF of each detector unit is statistically obtained. i The numerical value is used as a weighting parameter to reduce the heat dissipation area of ​​each detector unit in the current iteration calculation, while the iteration count is incremented by 1, and then the radiation heat transfer coefficient REF is calculated again. i and external heat flow Q wi Calculation;

[0064] If the degree judgment is valid, then the heat dissipation capacity C of each detector unit i is determined. i and heat load L i Size determination task;

[0065] If the judgment regarding the number of iterations is true, then the heat dissipation capacity C of each detector unit i is calculated. i and heat load L i Size judgment:

[0066] If C i ≤L i Then the detector unit i is classified as having a heat dissipation deficit of L. i -C i And sort the heat dissipation deficit values ​​of each detector unit in descending order;

[0067] If C i >L i Then the detector unit i is classified as having a heat dissipation surplus of C. i -L i Then, the heat dissipation surplus values ​​of each detector unit are sorted in descending order.

[0068] Preferably, the statistical analysis yields the radiation heat transfer coefficient REF for each detector unit. i The numerical values ​​are used as weighting parameters to reduce the heat dissipation area of ​​each detector unit in the current iteration calculation, including:

[0069] Based on the ratio of the current total heat dissipation surplus to the total heat dissipation capacity of the array, and setting the maximum system base reduction ratio RA, the actual base reduction ratio reduction_ratio is obtained:

[0070] reduction_ratio = min(RA, current total heat dissipation surplus / total heat dissipation capacity);

[0071] Based on the radiation heat transfer coefficient REF of each detection unit i The reduced additional weight (refi_weight) for each detector unit is obtained as follows:

[0072] refi_weight =REF i / Array of all current REF i The average value;

[0073] Calculate the area adjustment factor (reduction_factors) for each detector element:

[0074] reduction_factors = reduction_ratio * refi_weight;

[0075] Based on the total heat dissipation area Ar of each detector unit in the previous iteration i Adjust the heat dissipation area Ar of the current iteration i _new, we get:

[0076] Ar i _new = Ar i * (1 - reduction_factors).

[0077] According to a second aspect of the present invention, a heat dissipation structure for a spaceborne array-type payload detector is provided, comprising a heat dissipation path inside each detector unit in the array and a thermally conductive connection method between each detector unit, wherein the heat dissipation path inside each detector unit and the thermally conductive connection method between each detector unit are constructed using the heat dissipation design method described in any one of the above-mentioned inventions.

[0078] According to a third aspect of the present invention, a spaceborne array payload detector is provided, wherein the heat dissipation structure of the spaceborne array payload detector is constructed using the heat dissipation design method described in any one of the above-mentioned inventions.

[0079] By adopting the above technical solution, the present invention has at least one of the following beneficial effects compared with the prior art:

[0080] Compared to the traditional heat dissipation path of "detector chip-thermal conductive structure-heat pipe-heat dissipation surface", this invention proposes a heat dissipation path of "detector chip-thermal conductive structure-detector housing", which reduces the heat transfer path and heat pack, making the internal heat dissipation of the detector more efficient and achieving a lightweight heat dissipation design.

[0081] This invention utilizes a heat dissipation allocation method that balances heat dissipation deficit and surplus within the system, taking into account the overall heat dissipation within the system. This avoids the homogenized design scheme for each detector in the array-type payload that is the traditional design approach, and the mass of the heat dissipation structure does not increase significantly. This improves the mechanical environment and achieves an integrated mechanical and thermal design.

[0082] This invention forms an optimal heat dissipation network within the system, increasing the system's thermal stability and improving its resistance to external thermal disturbances. After forming the heat dissipation network, the system's temperature control power consumption can be significantly reduced compared to traditional design approaches.

[0083] The present invention provides a detector heat dissipation surface calculation process with self-adjusting features, which shortens the optimization process of heat dissipation schemes for array detectors and saves scheme design time; the resulting optimized scheme can significantly reduce development costs compared with traditional schemes. Attached Figure Description

[0084] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0085] Figure 1 This is a schematic diagram of the heat dissipation structure of the detector chip-thermal conductive structure-detector housing in a preferred embodiment of the present invention.

[0086] Figure 2 This is a flowchart illustrating the calculation process for the autonomous adjustment of the heat dissipation surface of the detector within the system in a preferred embodiment of the present invention.

[0087] Figure 3 This is an iterative curve of the total system heat load and total heat dissipation capacity in a specific application example of the present invention.

[0088] Figure 4 This is a diagram showing the final heat dissipation area distribution of each detector in the system after iterative adjustments in a specific application example of the present invention.

[0089] Figure 5 This is a diagram showing the final thermal connection layout of each detector in the system after iterative adjustments in a specific application example of the present invention. Detailed Implementation

[0090] The embodiments of the present invention are described in detail below: These embodiments are implemented based on the technical solution of the present invention, and provide detailed implementation methods and specific operation processes. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention.

[0091] Traditional detector cooling designs significantly increase payload weight due to heat pipes, heat-conducting surfaces, and other structural accessories. Increasing the number of array detectors complicates the number and layout of heat pipes, raising manufacturing and implementation difficulties. The complex heat transfer paths of the heat pipes also negatively impact detector cooling performance. Detector temperature is highly correlated with the fixed location of the heat dissipation surface and the heat flow input, leading to repeated fluctuations in heat along the heat transfer path and affecting temperature control. The relatively independent heat pipes and heat dissipation surfaces of each detector unit prevent system-wide heat transfer and dissipation, resulting in high overall payload temperature control power consumption. Furthermore, the heat pipes and heat dissipation surfaces installed in each detector unit degrade system mechanical response, posing risks to normal detector operation. Therefore, existing array-type spaceborne detector cooling methods cannot meet the evolving needs of space science exploration.

[0092] To address the aforementioned shortcomings, one embodiment of the present invention provides a heat dissipation structure design method for a spaceborne array-type payload detector. This method aims to provide a heat dissipation design scheme for spaceborne probe payloads with array characteristics, without relying on traditional heat dissipation design ideas, enabling each detector in the payload array to effectively dissipate heat without significantly increasing the additional mass brought by the heat dissipation structure, significantly reducing temperature control power consumption, and achieving lightweight heat dissipation and mechanical-thermal integration.

[0093] Specifically, the heat dissipation design method for the spaceborne array-type payload detector provided in this embodiment may include:

[0094] S1. For each detector unit in the spaceborne array-type payload detector, calculate the heat transfer capacity of its internal heat-conducting structure, obtain the location of the heat dissipation surface of the housing, and design the heat dissipation path; wherein, the heat dissipation path is: detector chip - heat-conducting structure - detector housing.

[0095] S2, based on the location of the heat dissipation surface of each detector unit, iteratively calculates the corresponding detector heat dissipation surface self-adjustment capability, balances the total heat dissipation capability and total heat load of the array within the allowable range, and uses deficit and surplus logic to obtain the thermal connection method between adjacent detector units in the detector array, so that the heat dissipation capability and heat load of each detector unit reach a balance, and finally obtains the temperature of the heat dissipation surface of the casing.

[0096] S3. Based on the heat transfer capacity and the temperature of the heat dissipation surface of the housing, the temperature of the detector chip is obtained, and the heat dissipation design of the spaceborne array-type payload detector is completed.

[0097] In some preferred embodiments, S1 above, which calculates the heat transfer capacity of the internal heat-conducting structure for each detector unit in the spaceborne array-type payload detector, obtains the location of the heat dissipation surface of the casing, and designs the heat dissipation path, may further include:

[0098] S11, calculate the heat transfer capacity of the internal heat-conducting structure of the detector to determine the specific heat dissipation location of the detector housing.

[0099] S12, inside the detector, the detector chip and the heat-conducting structure are thermally connected and installed, and according to the heat dissipation location, the heat-conducting structure is thermally connected and installed between multiple heat dissipation surfaces of the detector housing to form a heat dissipation path.

[0100] S13, with multiple layers of thermal insulation components wrapped around the surface of the thermally conductive structure to prevent radiative heat exchange between the thermally conductive structure and the internal environment of the detector.

[0101] S14, a heat dissipation coating is applied to the outside of the detector housing to radiate heat generated by the detector chip outward through the heat dissipation surface.

[0102] In some preferred embodiments, S11, which calculates the heat transfer capacity of the heat-conducting structure inside the detector and determines the specific heat dissipation location of the detector housing, may further include:

[0103] S111, Establish a calculation model for the heat transfer capacity of the internal heat-conducting structure of the detector, and obtain:

[0104]

[0105] In the formula: The heat transfer required from the detector chip of detector unit i to the heat dissipation surface of the detector housing is expressed in W. The number of contacts between the heat-conducting structure and the heat dissipation surface of the detector housing, i.e., the number of heat conduction and heat transfer paths between the heat-conducting structure and the detector housing, ranging from 1 to m; The heat transfer cross section is located on the heat transfer path j of the heat conduction structure of detector unit i, in meters. 2 ; is the heat transfer coefficient of the thermally conductive structural material of detector unit i, with units of W / (m·K). is the length of the heat conduction path j where the heat conduction structure of detector unit i is located, in meters; The temperature at the center of the heat-conducting structure of detector unit i, i.e., the temperature of the detector chip, is expressed in K. The temperature of each heat dissipation surface of the detector housing in contact with the heat-conducting structure is expressed in K. Under normal circumstances, due to the good thermal conductivity of the detector housing, the temperature difference between each heat dissipation surface is small.

[0106] S112, based on the heat transfer capacity calculation model of the heat-conducting structure inside the detector, calculates the number j of contacts between the heat-conducting structure and the heat dissipation surface of the detector housing through the geometric and physical property parameters of the heat-conducting structure, thereby determining the specific heat dissipation location of the detector housing.

[0107] In some preferred embodiments, S2 above, based on the location of the heat dissipation surface of each detector unit's housing, iteratively calculates the corresponding detector heat dissipation surface's self-adjustment capability, ensuring that the total heat dissipation capability and total heat load of the array are balanced within an allowable range, and uses deficit and surplus logic to obtain the thermal connection method between adjacent detector units in the detector array, so that the heat dissipation capability and heat load of each detector unit are balanced, ultimately obtaining the housing heat dissipation surface temperature, may further include:

[0108] S21, based on the radiative heat transfer coefficient of each detector unit's heat dissipation surface to space and the external heat flow, calculate the heat dissipation capacity and heat load of each detector unit to obtain the total heat dissipation capacity and total heat load of the array, and compare these two values. When the total heat dissipation capacity is less than the total heat load, increase the spacing between the detector units in the array, and recalculate the radiative heat transfer coefficient of each detector unit's heat dissipation surface to space and the external heat flow. Through this iterative calculation, the total heat dissipation capacity and total heat load of the array are kept within an acceptable range.

[0109] S22, based on the heat dissipation capacity and heat load of each detector unit, define whether the detector unit belongs to heat dissipation deficit or heat dissipation surplus, and sort the deficit and surplus in descending order respectively.

[0110] S23, calculate the center coordinates of each detector unit. For each detector unit defined as having a heat dissipation deficit, find the detector unit that is closest in distance and defined as having a heat dissipation surplus. Determine whether the heat dissipation surplus is greater than the heat dissipation deficit. If the determination is true, connect the two detector units thermally so that the detector unit with the heat dissipation deficit can use the detector unit with the heat dissipation surplus for heat dissipation. If the determination is not true, select other detector units with heat dissipation surplus that are closest in distance to the detector unit with the heat dissipation deficit and use their surplus heat dissipation until the heat dissipation deficit is zero. Then connect the detector unit with the heat dissipation deficit to these detector units with heat dissipation surplus.

[0111] S24, check the heat dissipation deficit of the detector units in the array. If there is still a heat dissipation deficit, continue to distribute the heat dissipation surplus until all the detector units with heat dissipation deficits in the array complete the distribution of all the deficit heat through thermal connection with the detector units with heat dissipation surplus, so that the array reaches a balanced state and obtains the thermal connection method between the detector units, so that the heat dissipation capacity and heat load of each detector unit reach a balance.

[0112] S25, based on the final optimized state, obtains the temperature of the heat dissipation surface of the casing.

[0113] Furthermore, the above S2 may further include: assuming that during the first iteration calculation, all effective areas on the heat dissipation surface of the detector housing are used as heat dissipation surfaces, and based on the update of the position of each detector unit in the array and the size of the heat dissipation surface, the radiation heat transfer coefficient and external heat flow of each detector unit's heat dissipation surface to space are continuously iterated.

[0114] In some preferred embodiments, in S21 above, assuming that during the initial iteration calculation, all effective areas on the heat dissipation surface of the detector housing are used as heat dissipation surfaces, and the radiation heat transfer coefficient and external heat flow of each detector unit's heat dissipation surface to space are continuously iterated based on the updated position of each detector unit in the array and the total size of the heat dissipation surface, the calculation may further include:

[0115] S211, In the first iteration calculation, assume that all the areas on the heat dissipation surface of the detector housing are considered as heat dissipation surfaces;

[0116] S212 continuously updates the total heat dissipation area Ar of each detector unit i. i And, in conjunction with the location of detector unit i in the array, the radiative heat transfer coefficient REF of its heat dissipation surface to space is calculated using the Monte Carlo method. i Where, i∈[1,n], and n is the number of detector units;

[0117] Calculate the external heat flow Q of detector unit i wi for:

[0118] Q wi =Ar i *(q si *α+q ei *ε)

[0119] In the formula, q si q represents the average incident heat flux reflected by the sun and the earth's albedo. ei ε is the average incident infrared heat flux of Earth, α is the solar absorptivity of the heat dissipation coating on the detector casing, and ε is the infrared emissivity.

[0120] In some preferred embodiments, S22 above, based on the radiative heat transfer coefficient of each detector unit's heat dissipation surface facing the space and the external heat flow, calculates the heat dissipation capacity and heat load of each detector unit to obtain the total heat dissipation capacity and total heat load of the array, and compares these two values. When the total heat dissipation capacity cannot meet the total heat load, the spacing between the detector units in the array is increased, and the radiative heat transfer coefficient of each detector unit's heat dissipation surface facing the space and the external heat flow are recalculated. Through this iterative calculation, the total heat dissipation capacity and total heat load of the array are kept within an acceptable range. The calculation may further include:

[0121] S221, based on the radiative heat transfer coefficient of each detector unit's heat dissipation surface to space and the external heat flow, calculates the heat dissipation capacity and heat load of each detector unit to obtain the total heat dissipation capacity and total heat load of the array, including:

[0122] Calculate the thermal load L of detector unit i i and heat dissipation capacity C i ,get:

[0123] L i =Q wi +Q ni + Q ri

[0124] C i =REF i * Ar i *σ*ε*(T wi 4 -T s 4 )

[0125] In the formula: Q wi For the external heat flow of detector unit i, Q ni Q is the internal heat source of detector unit i. ri REF represents the minimum thermal power consumption within detector unit i. i For the radiative heat transfer coefficient of the heat dissipation surface in space, Ar i Let σ be the total heat dissipation area, and σ be the Boltzmann constant, σ = 5.67 × 10⁻⁶. -8 W / (m 2 ·K 4 ), where ε is the infrared emissivity, and T wi T is the temperature of the heat dissipation surface of detector unit i. s The ambient temperature of the space or background;

[0126] The thermal load L for each detector unit i and heat dissipation capacity C i Sum the results to obtain the total heat load and total heat dissipation capacity of the array.

[0127] S222, determine whether the following relationship holds true:

[0128]

[0129] If the judgment is not valid, it means that the total heat dissipation capacity of the array cannot meet the total heat load, and the spacing between each detector element needs to be increased to increase the REF of each detector element. i This increases the array's total heat dissipation capacity, while simultaneously incrementing the iteration count by 1 and recalculating REF. i And Q wi ;

[0130] If the judgment is true, it means that the total heat dissipation capacity of the array meets the total heat load;

[0131] Introducing a heat dissipation threshold S, and iteratively calculating the autonomous adjustment capability of the corresponding detector heat dissipation surface, the total array heat dissipation capacity is kept equal to the total heat load within the heat dissipation threshold S. Then:

[0132]

[0133] The introduced heat dissipation threshold S is related to the array's active temperature control power consumption and the system's heat transfer efficiency, and is selected within the range of the array's maximum active temperature control power consumption. The active temperature control power consumption value is constrained by spacecraft mission requirements and energy and control requirements. The system heat transfer efficiency is a parameter introduced to account for the potential impact of material properties and engineering implementation effects on the heat transfer structure between the internal heat-conducting structure of the detector and the array detector. Furthermore, S should be a positive value; generally, the heat dissipation threshold S should be between 20% and 60% of the array's maximum active temperature control power consumption.

[0134] In some preferred embodiments, S23 above, which defines whether a detector unit is in a heat dissipation deficit or surplus based on the heat dissipation capacity and heat load of each detector unit, and sorts the deficit and surplus amounts in descending order respectively, may further include:

[0135] S231, when the total heat dissipation capacity of the array meets the total heat load, proceed to the next step:

[0136] Current iteration count ≥ Maximum iteration count X

[0137] If the determination regarding the number of iterations is invalid, then based on the introduced heat dissipation threshold S, the difference between the total heat dissipation capacity and the total heat load is used to determine the degree to which the total heat dissipation capacity exceeds the total heat load, i.e.:

[0138]

[0139] If the degree judgment is invalid, meaning the current total heat dissipation capacity exceeds the total heat load by a greater degree than the heat dissipation threshold S, it indicates that the total heat dissipation capacity has a significant advantage over the total heat load, and the array's active temperature control power consumption is insufficient to offset the excess heat dissipation, resulting in the array's temperature being too low and deviating from the temperature control target. Therefore, if this degree judgment is invalid, it is necessary to calculate the REF of each detector. i The numerical value is used as a weighting parameter to reduce the heat dissipation area of ​​each detector in the current iteration calculation, while the iteration count is incremented by 1, and then the process returns to step 2 to perform REF again. i and Q wi Calculation;

[0140] If the degree judgment is valid, meaning the current total heat dissipation capacity is less than or equal to the total heat load by a factor of less than or equal to the heat dissipation threshold S, it indicates that the current total heat dissipation capacity is slightly higher than the total heat load, but still within the controllable range of the array's active temperature control power consumption. Therefore, the C-value of each detector unit i can be determined. i and L i Size determination task;

[0141] If the judgment regarding the number of iterations is true, then proceed with the C iteration for each detector unit i. i and L i Size judgment:

[0142] If C i ≤L i Then the detector unit i is classified as having a heat dissipation deficit of L. i -C i And sort the heat dissipation deficit values ​​of each detector unit in descending order;

[0143] If C i >L i Then the detector unit i is classified as having a heat dissipation surplus of C. i -L i Then, the heat dissipation surplus values ​​of each detector unit are sorted in descending order.

[0144] In some preferred embodiments, S231 above, which uses the REFi values ​​of each detector as weighting parameters to reduce the heat dissipation area of ​​each detector in the current iteration calculation, may further include:

[0145] Based on the ratio of the current total system heat dissipation surplus to the total heat dissipation capacity, and setting the maximum system base reduction ratio RA, the actual base reduction ratio reduction_ratio is obtained:

[0146] reduction_ratio = min(RA, current total heat dissipation surplus / total heat dissipation capacity);

[0147] in:

[0148] The maximum reduction ratio RA is set according to the optimization iteration situation, and is generally set to 5%~15%. It is related to the number of iterations. RA needs to be adjusted according to the amount set for the number of iterations. When the number of iterations is large, RA can be reduced, and when the number of iterations is small, RA can be increased.

[0149] The actual reduction ratio is derived from the minimum value of RA and the current total heat dissipation surplus / total heat dissipation capacity, representing the proportion by which the heat dissipation surface area should be reduced at the actual system level.

[0150] Based on the radiation heat transfer coefficient REF of each detection unit iThe system reduces the additional refi_weight for each detector unit:

[0151] refi_weight =REF i / All REFs in the system i The average value;

[0152] The system reduces the additional refi_weight based on the actual REF of each detector unit. i With average REF i The proportions are derived to represent REF i Weight in the system average REFi;

[0153] Calculate the area adjustment factor (reduction_factors) for each detector element:

[0154] reduction_factors = reduction_ratio * refi_weight;

[0155] Based on the total heat dissipation area Ar of each detector unit in the previous iteration i Adjust the heat dissipation area Ar of the current iteration i _new, we get:

[0156] Ar i _new = Ar i * (1 - reduction_factors).

[0157] In some preferred embodiments, in S24 above, the center coordinates of each detector unit are calculated. For each detector unit defined as having a heat dissipation deficit, the nearest detector unit defined as having a heat dissipation surplus is found. It is determined whether the heat dissipation surplus is greater than the heat dissipation deficit. If the determination is true, the two detector units are thermally connected, so that the detector unit with the heat dissipation deficit uses the detector unit with the heat dissipation surplus for heat dissipation. If the determination is not true, other detector units with heat dissipation surplus that are closest to the detector unit with the heat dissipation deficit are selected in sequence, and their surplus heat dissipation is used until the heat dissipation deficit is zero. Then, the detector unit with the heat dissipation deficit is thermally connected to these detector units with heat dissipation surplus. This may further include:

[0158] S241, Based on the input parameters, calculate the center coordinates of each detector unit i. For each detector unit defined as having a heat dissipation deficit, find the nearest detector unit that is defined as having a heat dissipation surplus, and then make the following judgment:

[0159] Heat dissipation surplus ≥ heat dissipation deficit

[0160] If the judgment is correct, then the detector unit corresponding to the heat dissipation deficit will be thermally connected to the detector unit corresponding to the heat dissipation surplus, so that the detector with the heat dissipation deficit can use the detector with the heat dissipation surplus for heat dissipation:

[0161] If the judgment is not valid, select the nearest heat dissipation surplus detector in terms of distance from the heat dissipation deficit detector, and borrow the surplus heat dissipation of the heat dissipation surplus detector until the heat dissipation deficit is zero. Then, make a thermally conductive connection between the heat dissipation deficit detector and these heat dissipation surplus detectors.

[0162] Based on the above calculation results, update the heat dissipation surplus, heat dissipation deficit, and heat dissipation area Ar of detector unit i in the array. i Information such as the wiring connections between detector units.

[0163] In some preferred embodiments, S25 above checks the heat dissipation deficit of the detector units in the array. If there is still a heat dissipation deficit, the heat dissipation surplus-heat dissipation deficit allocation continues until all heat dissipation deficit detector units in the array are thermally connected to heat dissipation surplus detector units to complete the distribution of all deficit heat, so that the array reaches a balanced state, and the thermal connection method between the detector units is obtained. It may further include:

[0164] Based on the current allocation method, check if there are any heat dissipation deficit detectors in the array. If so, continue with step S24 for calculation. If not, it means that all heat dissipation deficit detectors in the array have completed the distribution of all deficit heat through thermally conductive connections with heat dissipation surplus detectors, and the array has reached a balanced state. At this time, output the heat dissipation area Ar of each detector unit. i Information such as the thermal connection method between detector units was collected, and then the design process was completed.

[0165] Based on the heat dissipation design method provided in the above embodiments of the present invention, an embodiment of the present invention also provides a heat dissipation structure for a spaceborne array-type payload detector.

[0166] Specifically, the heat dissipation structure for a spaceborne array-type payload detector provided in this embodiment includes a heat dissipation path inside each detector unit in the array and a thermally conductive connection method between each detector unit. The heat dissipation path inside each detector unit and the thermally conductive connection method between each detector unit are constructed using the heat dissipation design method of any of the above embodiments of the present invention.

[0167] Based on the heat dissipation design method provided in the above embodiments of the present invention, an embodiment of the present invention also provides a spaceborne array-type payload detector.

[0168] Specifically, the heat dissipation structure of the spaceborne array-type payload detector provided in this embodiment is constructed using the heat dissipation design method of any of the above embodiments of the present invention.

[0169] The heat dissipation design method for a spaceborne array-type payload detector provided in the above embodiments of the present invention mainly includes the following two parts:

[0170] I. Heat dissipation structure design inside a single detector:

[0171] 1. Compared with the traditional heat dissipation path of "detector chip-thermal conductive structure-heat pipe-heat dissipation surface", a heat dissipation path of "detector chip-thermal conductive structure-detector housing" is proposed, which reduces the heat transfer path and heat pack, making the internal heat dissipation of the detector more efficient.

[0172] 2. Thermal design was carried out on the internal heat conduction structure of the detector and the external heat dissipation surface of the detector housing;

[0173] 3. A formula for calculating the heat transfer capacity of the internal heat-conducting structure of the detector is proposed. Using this formula, the number of contacts between the heat-conducting structure and the heat dissipation surface of the detector housing can be calculated based on the geometric and physical property parameters of the heat-conducting structure, thereby determining the specific heat dissipation location of the detector housing.

[0174] Inside the detector, a heat dissipation path is designed: detector chip - thermally conductive structure - heat dissipation surface, thereby obtaining the heat transfer capacity inside the detector. The formula for calculating the heat transfer capacity is as follows:

[0175]

[0176] Using this formula, the number j of contacts between the heat-conducting structure and the heat dissipation surface of the detector housing can be calculated based on the geometric and physical property parameters of the heat-conducting structure, thereby determining the specific heat dissipation location of the detector housing.

[0177] Conventional heat-conducting structures are connected to the detector housing, typically with only one interface. However, given the characteristics of payload array detectors, a single interface cannot meet the varying heat dissipation requirements of the detector units. This invention addresses this deficiency by employing a multi-interface heat-conducting structure with geometric features of the internal heat-conducting structure. This allows the array detector to have heat dissipation surfaces facing different directions. The multi-interface heat-conducting structure design enables heat inside the detector to be conducted to the corresponding heat dissipation surfaces through different heat transfer paths.

[0178] II. The heat dissipation structure design between detectors adopts a calculation process for autonomous adjustment of the detector's heat dissipation surface:

[0179] 1. In the first iteration calculation, it is assumed that all the effective area on the casing is used as a heat dissipation surface. Then, based on the updated position of each detector array and the size of the heat dissipation surface, the radiation heat transfer coefficient and external heat flow of each detector's heat dissipation surface to space are continuously iterated.

[0180] 2. Calculate the heat dissipation capacity and heat load of each detector to statistically analyze the total heat dissipation capacity and total heat load of the system, and compare these two system values. If the total heat dissipation capacity of the system is less than the total heat load, it is necessary to continue to increase the spacing between the detectors in the system to increase the total heat dissipation capacity of the system, and recalculate the radiation heat transfer coefficient and external heat flow of each detector's heat dissipation surface to space.

[0181] 3. A heat dissipation threshold is set, which is related to factors such as the system's active temperature control power consumption and system heat transfer efficiency. Generally, the heat dissipation threshold should be between 20% and 60% of the system's maximum active temperature control power consumption. The difference between the system's total heat dissipation capacity and the system's total heat load, i.e., the heat dissipation threshold, is used to determine the degree to which the system's total heat dissipation capacity exceeds the system's total heat load.

[0182] 4. Based on the heat dissipation capacity and heat load of each detector, define whether it belongs to "heat dissipation deficit" or "heat dissipation surplus", and sort the deficit and surplus in descending order;

[0183] 5. Based on the input parameters, calculate the center coordinates of each detector. For each detector defined as having a heat dissipation deficit, find the nearest detector defined as having a heat dissipation surplus. Determine if the heat dissipation surplus is greater than the heat dissipation deficit. If the determination is true, connect the two detectors with heat dissipation deficit and heat dissipation surplus through thermal conduction, allowing the detector with heat dissipation deficit to use the detector with heat dissipation surplus for heat dissipation. If the determination is not true, sequentially select the nearest detector with heat dissipation surplus from the detector with heat dissipation deficit and use its surplus heat dissipation until the heat dissipation deficit is zero. Then, connect the detector with heat dissipation deficit to these detectors with heat dissipation surplus through thermal conduction.

[0184] 6. Check the heat dissipation deficit of the detectors in the system. If there is still a heat dissipation deficit in the system, continue to distribute the heat dissipation surplus and deficit until all detectors with heat dissipation deficits in the system have completed the distribution of all deficit heat through thermal connection with detectors with heat dissipation surplus, so that the system reaches a balanced state.

[0185] The heat dissipation structure design between detectors achieved autonomous heat dissipation regulation of the system, resulting in an optimized temperature of the heat dissipation surface of each detector's casing. Furthermore, the temperature of the heat dissipation surface of the casing is obtained. The process is as follows:

[0186] (1) Adjusting the distance between each detector will affect REF iAdjusting the heat dissipation surface area will affect Ar. i According to C i The formula can be used to derive C i Things will change.

[0187] (2) Adjusting the distance between each detector will affect the external heat flow Q of detector unit i. wi According to L i The formula can be used to derive L i Things will change.

[0188] (3) Based on the autonomous adjustments made in the first two steps, the total C of the system will be obtained. i And total L i It remains flat within the allowable range (heat dissipation threshold S).

[0189] (4) After the system reaches a break-even state, each detector in the system is connected using "deficit" and "surplus" logic, thereby realizing the C of each detector. i and L i To reach a certain level of equilibrium.

[0190] (5) Based on the final optimized state, through C i The formula yields the temperature of the heat dissipation surface. This completes the process of optimizing the temperature of the heat dissipation surface of the chassis.

[0191] get Then, through 1 and known physical property parameters ( , , This allows us to obtain the core temperature parameter – the temperature of the detector chip. This parameter is a core target that the entire array's detection payload needs to monitor during its on-orbit flight. The technical solution provided by the above embodiments of the present invention will be further described in detail below with reference to a specific application example and accompanying drawings.

[0192] In this specific application example, the internal heat dissipation structure design of the detector adopts a "detector chip - thermally conductive structure - detector housing" heat dissipation path, compared to the traditional "detector chip - thermally conductive structure - heat pipe - heat dissipation surface" heat dissipation path. This reduces the number of heat transfer paths and heat exchangers, making the internal heat dissipation of the detector more efficient. The specific design is as follows:

[0193] (1) Inside the detector, the detector chip and the heat-conducting structure are thermally conductively mounted;

[0194] (2) Thermally conductive installation is carried out between the thermally conductive structure and multiple heat dissipation surfaces of the shell;

[0195] (3) The surface of the heat-conducting structure is covered with multiple layers of heat insulation components to prevent radiative heat exchange between the heat-conducting structure and the internal environment of the detector;

[0196] (4) A heat dissipation coating is provided on the outside of the detector housing to radiate the heat generated by the detector chip to the outside through the heat dissipation surface;

[0197] (5) The heat dissipation location of the heat dissipation surface is determined by the heat transfer capacity of the internal heat-conducting structure of the detector, and is calculated using the following formula:

[0198]

[0199] In the formula:

[0200] The heat dissipation required by the detector chip of detector unit i, in W;

[0201] This represents the number of contacts between the heat-conducting structure and the heat dissipation surface of the detector housing, i.e., the number of heat conduction and heat transfer paths between the heat-conducting structure and the detector housing, ranging from 1 to m.

[0202] It is the heat transfer cross section along path j where the thermally conductive structure of detector i is located, in meters. 2 ;

[0203] The heat transfer coefficient of the internal thermal conductive material of detector i is expressed in W / (m·K).

[0204] The length of heat transfer path j, in meters, represents the length of the internal heat-conducting structure of detector i.

[0205] The temperature at the center of the thermally conductive structure of detector i, i.e., the temperature of the detector chip, is expressed in K.

[0206] The temperature of each heat dissipation surface of the housing in contact with the heat-conducting structure is represented by K. Under normal circumstances, due to the good thermal conductivity of the detector housing, the temperature difference between each heat dissipation surface is small.

[0207] Using this formula, the number j of contacts between the heat-conducting structure and the heat dissipation surface of the detector housing can be calculated based on the geometric and physical property parameters of the heat-conducting structure, thereby determining the specific heat dissipation location of the detector housing.

[0208] Based on the descriptions in (1)-(5), the schematic diagram of the heat dissipation structure of the detector chip-thermal conductive structure-detector housing is as follows: Figure 1 As shown.

[0209] In this specific application example, the design of the inter-detector heat dissipation structure employs a computational process that allows for the autonomous adjustment of the detector's heat dissipation surface. The specific design is as follows:

[0210] Step 1, the calculation process begins, read the input parameters:

[0211] (1) The dimensions and coordinate parameters of each detector i in the system;

[0212] (2) The internal heat source Q of detector i ni (W);

[0213] (3) Solar absorptivity α and infrared emissivity ε of the heat dissipation coating on the detector housing;

[0214] (4) Average incident heat flux q from solar and Earth albedo si (W / m) 2 Earth's average infrared incident heat flux q ei (W / m) 2 );

[0215] (5) Temperature T of the heat dissipation surface of detector i i (K), ambient temperature (T) s (K);

[0216] (6) Heat dissipation area Ar of each detector i (m) 2 Ar i The initial value is the maximum effective heat dissipation area of ​​each detector;

[0217] (7) Heat dissipation capacity C i (W) minus heat load L i The heat dissipation threshold S(W)

[0218] (8) The maximum number of iterations for adjusting the heat dissipation surface, X, is initially 1 and increases by 1 with each iteration;

[0219] (9) The spacing adjustment value dert_L between detectors in the array is used after each iteration when the conclusion that "the spacing between each detector needs to be increased" is obtained;

[0220] Step 2: In the initial iteration, it is assumed that all side surfaces of the casing are used as heat dissipation surfaces. The total heat dissipation area for each probe module i is Ar. i Based on the location of the detector array and the radiative heat transfer coefficient REF of the heat dissipation surface to space. i (i∈[1,n] where n is the number of detectors);

[0221] Step 3, the external heat flow Q of each probe wi (W), it is composed of q si and q ei It consists of two parts, and the calculation formula is as follows:

[0222] Q wi =Ar i *(qsi *α+q ei *ε)

[0223] Step 4: Calculate the heat load L of each detector i. i (W) by Q wi and Q ni It consists of two parts, with a heat dissipation capacity of C. i (W) represents the amount of heat radiation exchanged by the housing of detector i towards space or the background, calculated using the following formula:

[0224] L i =Q wi +Q ni +Q ri

[0225] C i =REF i * Ar i *σ*ε*(T i 4 -T s 4 ),

[0226] In the formula: σ is the Boltzmann constant, σ = 5.67 × 10 -8 W / (m 2 ·K 4 )

[0227] Step 5, for all detectors i, C i With L i Perform summation and determine whether the following relationship holds:

[0228]

[0229] (1) If the judgment is not true, it means that the total heat dissipation capacity of the system cannot meet the total heat load of the system, and it is necessary to increase the spacing between each detector to increase the REF of each detector. i This increases the system's overall heat dissipation capacity. Simultaneously, the iteration count is incremented by 1. From a computational perspective, this requires updating the input parameters and recalculating REF. i And Q wi .

[0230] (2) If the judgment is true, it means that the total heat dissipation capacity of the system meets the total heat load of the system, and the next judgment can be made.

[0231] Step 6: Based on the fact that the judgment in step 5 is true, continue to make judgments:

[0232] Current iteration count ≥ Maximum iteration count X

[0233] (1) If the judgment regarding the number of iterations is invalid, a heat dissipation threshold S is introduced. S should be a positive value, which is related to factors such as the active temperature control power consumption and the system's heat transfer efficiency. Generally, S should be between 20% and 60% of the system's maximum active temperature control power consumption. The difference between the system's total heat dissipation capacity and the system's total heat load is used to determine the degree to which the system's total heat dissipation capacity exceeds the system's total heat load.

[0234]

[0235] a. If the judgment is invalid, meaning the current total system heat dissipation capacity exceeds the system's total heat load heat dissipation threshold S, it indicates that the system's total heat dissipation capacity has a significant advantage over the system's total heat load, and the system's active temperature control power consumption is insufficient to offset the excess heat dissipation. This will lead to a lower system temperature and deviation from the temperature control target. If this judgment is invalid, it is necessary to calculate the REF of each detector. i The numerical value is used as a weighting parameter to reduce the heat dissipation area of ​​each detector in the current iteration calculation, while the iteration count is incremented by 1, and then the process returns to step 2 to perform REF again. i and Q wi Calculation;

[0236] b. If the judgment is valid, i.e. the difference is less than the heat dissipation threshold S, it indicates that the current total heat dissipation capacity of the system is slightly higher than the total heat load of the system, but is still within the controllable range of the system's active temperature control power consumption. Then, the C-value of each detector i can be determined. i and L i Size determination task;

[0237] (1) If the judgment regarding the number of iterations is true, then perform C for each detector i. i and L i Size judgment:

[0238] a. If C i ≤L i This is classified as a heat dissipation deficit = L i -C i And sort the heat dissipation deficit values ​​of each detector in descending order;

[0239] b. If C i >L i Then it is classified as heat dissipation surplus = C i -L i Then, the heat dissipation surplus values ​​of each detector are sorted in descending order.

[0240] Step 7: Based on the input parameters from Step 1, calculate the center coordinates of each detector i. For each detector defined as having a heat dissipation deficit, find the detector that is closest in distance and defined as having a heat dissipation surplus, and then make the following judgment:

[0241] Heat dissipation surplus ≥ heat dissipation deficit

[0242] (2) If the judgment is true, then connect the two detectors, the one with the heat dissipation deficit and the one with the heat dissipation surplus, in a thermally conductive connection so that the detector with the heat dissipation deficit can use the detector with the heat dissipation surplus for heat dissipation:

[0243] (3) If the judgment is not valid, select the heat dissipation surplus detector closest to the heat dissipation deficit detector in turn, and borrow its surplus heat dissipation until the heat dissipation deficit is zero. Then, make a heat conduction connection between the heat dissipation deficit detector and these heat dissipation surplus detectors.

[0244] Step 8: Based on the calculations in Step 7, update the system's heat dissipation surplus, heat dissipation deficit, and detector heat dissipation area Ar. i Information such as the connection method between detectors.

[0245] Step 9: Based on the current allocation method, check if there are any heat dissipation deficit detectors in the system. If so, continue with step 7 for calculation. If not, it means that all heat dissipation deficit detectors in the system have completed the distribution of all deficit heat through thermally conductive connections with heat dissipation surplus detectors, and the system has reached a balanced state. At this time, output the heat dissipation area Ar of each detector. i Information such as the thermal connection method between detectors is collected, and then the calculation process ends.

[0246] In summary, steps 1-9 outline the calculation process for the autonomous adjustment of the detector's heat dissipation surface within the system, as follows: Figure 2 As shown.

[0247] Based on the above steps, a spaceborne array payload is set up, and its layout and parameter settings are as follows:

[0248] (1) The spaceborne array payload consists of a two-dimensional array of identical detection modules. Each detection module consists of an optical component and a detector. The optical component is a cylinder and the detector is a cuboid.

[0249] (2) Set the number of detectors in the X and Y directions to 5 each, that is, the array has 25 detector modules. The distance between the centers of the detectors in the X and Y directions is 150mm. Use this value as the initial value for calculation and set the calculation step size for increasing the distance to 15mm. The optical detection direction is +Z. The -Z direction of the system is a base plate that can enclose the size range of all detection modules. It is used to simulate the load-bearing surface of the satellite payload. Each module is well insulated from the base plate.

[0250] (3) Each detector housing is 100mm long and wide and 70mm high. The four sides of the detector housing, namely the outer surfaces in the ±X and ±Y directions, are initially set as heat dissipation surfaces. The diameter of the optical component is 100mm and the height is 350mm. It is assumed that the thermal insulation between the detector and the optical component is good.

[0251] (4) The base plate +Z surface is covered with heat insulation material, and the -Z surface has no radiation characteristics; the outer surface of the optical components is covered with heat insulation material, and the part of the optical components in contact with the detector +Z surface has no radiation characteristics. The remaining outer surface outside the contact area of ​​the +Z surface is covered with heat insulation material; the four sides of the detector housing are initially provided with heat dissipation coating, and the infrared emissivity of the coating is 0.8; the inner surfaces of the detector and optical path components are not provided with radiation characteristics; the surface properties of the heat insulation material mentioned above have an infrared emissivity of 0.7; the Monte Carlo method is used to calculate the radiation heat transfer coefficient REFi of each detector heat dissipation surface in space within the spaceborne array payload;

[0252] (5) The detector housing is made of metal with good thermal conductivity. The temperature of the four heat dissipation surfaces of each detector is set to be equal, and the temperature parameter is set to 273K to dissipate heat from the 4K deep space background. Each detector has the same heat dissipation power consumption, with a long-term power consumption of 3W. The heat is conducted to the heat dissipation surface of the housing through the internal heat conduction structure of the detector. The absorption of external heat flow by the heat dissipation surface of the detector in the payload array has four inputs depending on the location:

[0253] a. The average heat flux absorbed by the detector at the center of the array is 0W;

[0254] b. The eight detectors located near the center of the array each absorb 1W of heat flux;

[0255] c. The outermost ring of the array, excluding the four corners, contains 12 detectors, each absorbing 1.5W of heat flux;

[0256] d. The detectors at the four corners of the outermost ring of the array each absorb 3W of heat flux;

[0257] (6) The REFi of the detector is iteratively adjusted by setting the gap between the detectors or the detector area, so as to ensure that the detectors in the system have sufficient heat dissipation capacity or stable system energy balance; the maximum number of iterations is set to 10; the heat dissipation threshold is 5W; when the heat dissipation deficit detector and the heat dissipation surplus detector are thermally connected, it is assumed that there is no heat transfer loss between them.

[0258] The calculation results are as follows Figures 3-5 As shown. Wherein:

[0259] like Figure 3 The figure shown is an iterative curve of the system's total heat load versus total heat dissipation capacity. From... Figure 3 As can be seen, the spacing between the detectors was automatically adjusted during the first four iterations, and the total heat load and total iteration capacity of the system reached the heat dissipation threshold S during the last four iterations, and the system reached a heat dissipation balance state.

[0260] like Figure 4 The image shows the final heat dissipation area distribution of each detector in the system after iterative adjustments. From... Figure 4As can be seen from the calculation of the detector heat dissipation surface autonomous adjustment process, the heat dissipation surface of each detector unit in the 5*5 array payload exhibits a regular distribution, with the area of ​​the detector heat dissipation surface decreasing step by step from the center of the array outwards. The calculation results are in line with expectations.

[0261] like Figure 5 The diagram shown is the final thermal connection layout of each detector in the system after iterative adjustments. Figure 5 As can be seen from the calculation of the detector's heat dissipation surface autonomous adjustment process, the thermal conductivity connections between the detector units in the 5x5 array payload exhibit a regularity: the central detector in the array has three thermal conductivity connections with adjacent detectors due to its relatively small radiation heat transfer coefficient to space; six of the eight detectors surrounding the central unit have direct or indirect thermal conductivity connections with the outermost detectors in the array; and there are four thermal conductivity connections between the outermost detectors. Overall, the thermal conductivity connection method conforms to the calculation logic of the detector's heat dissipation surface autonomous adjustment process, the autonomous adjustment process is effective and obvious, and the calculation results meet expectations.

[0262] As can be seen from the implementation of the technical solutions provided in the above embodiments of the present invention, the present invention utilizes a heat dissipation scheme of detector chip-thermal conductive structure-detector housing, reducing heat transfer paths and heat groups, making heat dissipation inside the detector more efficient; it uses a heat dissipation deficit-heat dissipation surplus distribution method within the system to reduce system weight and improve the mechanical environment; it forms an optimal heat dissipation network within the system, increasing the system's thermal stability, improving the system's resistance to external thermal disturbances, and significantly reducing the system's temperature control power consumption; it improves the efficiency of optimizing the heat dissipation scheme for spaceborne array-type payloads, saving design time and development costs. The efficient heat dissipation scheme within the detector, system thermal lightweighting and mechanical-thermal integrated design, system internal thermal network stability, and system heat dissipation optimization proposed in this invention have had a positive impact on the fields of next-generation deep space exploration spaceborne array-type payloads and satellite thermal control technology, promoting the development and progress of related technologies.

[0263] Any matters not covered in the above embodiments of the present invention are well-known in the art.

[0264] The specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art can make various modifications or variations within the scope of the claims, which do not affect the essence of the present invention.

Claims

1. A heat dissipation design method for a spaceborne array-type payload detector, characterized in that, include: For each detector unit in a spaceborne array-type payload detector, the heat transfer capacity of its internal heat-conducting structure is calculated, the location of the heat dissipation surface of the housing is obtained, and the heat dissipation path is designed; wherein, the heat dissipation path is: detector chip - heat-conducting structure - detector housing. Based on the location of the heat dissipation surface of each detector unit's housing, the corresponding autonomous adjustment capability of the detector's heat dissipation surface is iteratively calculated. This ensures that the total heat dissipation capacity and total heat load of the array are balanced within allowable limits. Deficit and surplus logic is used to obtain the thermal conductivity connection method between adjacent detector units in the detector array, ultimately yielding the housing heat dissipation surface temperature. The process of iteratively calculating the autonomous adjustment capability of the detector's heat dissipation surface based on the location of the heat dissipation surface of each detector unit's housing, ensuring that the total heat dissipation capacity and total heat load of the array are balanced within allowable limits, and using deficit and surplus logic to obtain the thermal conductivity connection method between adjacent detector units in the detector array, ultimately yielding the housing heat dissipation surface temperature, includes: - Based on the radiative heat transfer coefficient of each detector unit's heat dissipation surface to space and the external heat flow, the heat dissipation capacity and heat load of each detector unit are calculated to obtain the total heat dissipation capacity and total heat load of the array. These two values ​​are then compared. When the total heat dissipation capacity is less than the total heat load, the spacing between the detector units in the array is increased, and the radiative heat transfer coefficient of each detector unit's heat dissipation surface to space and the external heat flow are recalculated. Through this iterative calculation, the total heat dissipation capacity and total heat load of the array are kept within an acceptable range. - Based on the heat dissipation capacity and heat load of each detector unit, define whether the detector unit belongs to heat dissipation deficit or heat dissipation surplus, and sort the deficit and surplus in descending order respectively. - For each detector unit defined as having a heat dissipation deficit, find the nearest detector unit defined as having a heat dissipation surplus; determine whether the heat dissipation surplus is greater than the heat dissipation deficit. If the determination is true, connect the two detector units thermally; if the determination is not true, select the other detector units with heat dissipation surplus that are closest to the detector unit with the heat dissipation deficit in sequence, and borrow their surplus heat dissipation until the heat dissipation deficit is zero. Then connect the detector unit with the heat dissipation deficit to these detector units with heat dissipation surplus. - Check the heat dissipation deficit of the detector units in the array. If there is still a heat dissipation deficit, continue to distribute the heat dissipation surplus and heat dissipation deficit until all the heat dissipation deficit detector units in the array are distributed by thermally conducting with the heat dissipation surplus detector units. - Obtain the temperature of the heat dissipation surface of the chassis based on the final optimized state; Based on the heat transfer capacity and the temperature of the heat dissipation surface of the casing, the temperature of the detector chip is obtained, and the heat dissipation design of the spaceborne array-type payload detector is completed.

2. The heat dissipation design method for a spaceborne array-type payload detector according to claim 1, characterized in that, For each detector unit in a spaceborne array-type payload detector, the heat transfer capacity of its internal heat-conducting structure is calculated, the location of the heat dissipation surface of the casing is obtained, and the heat dissipation path is designed, including: The heat transfer capacity of the internal heat-conducting structure of the detector is calculated to determine the specific location of the heat dissipation surface of the detector housing. Inside the detector, the detector chip is thermally mounted to the heat-conducting structure, and according to the location of the heat dissipation surface, the heat-conducting structure is thermally mounted to multiple heat dissipation surfaces of the detector housing to form a heat dissipation path. The surface of the heat-conducting structure is covered with multiple layers of heat insulation components to prevent radiative heat exchange between the heat-conducting structure and the internal environment of the detector. A heat dissipation coating is applied to the outside of the detector housing to radiate heat generated by the detector chip outwards.

3. The heat dissipation design method for a spaceborne array-type payload detector according to claim 2, characterized in that, The calculation of the heat transfer capacity of the internal heat-conducting structure of the detector to determine the specific location of the heat dissipation surface of the detector housing includes: A calculation model for the heat transfer capacity of the internal thermal conductive structure of the detector was established, and the following results were obtained: In the formula: The heat transfer required from the detector chip of detector unit i to the heat dissipation surface of the detector housing; This refers to the number of contacts between the heat-conducting structure and the heat dissipation surface of the detector housing, i.e., the number of heat conduction and heat transfer paths between the heat-conducting structure and the detector housing. Let J be the heat transfer cross section on the heat transfer path j where the heat-conducting structure of detector unit i is located. Let be the heat transfer coefficient of the thermally conductive structural material of detector unit i; is the length of the heat conduction path j on which the heat conduction structure of detector unit i is located; The temperature is the temperature at the center of the thermally conductive structure of detector unit i, i.e., the temperature of the detector chip. The temperature of each heat dissipation surface of the detector housing in contact with the heat-conducting structure; Based on the heat transfer capacity calculation model of the heat-conducting structure inside the detector, the number j of contacts between the heat-conducting structure and the heat dissipation surface of the detector housing is calculated through the geometric and physical property parameters of the heat-conducting structure, thereby determining the specific heat dissipation location of the detector housing.

4. The heat dissipation design method for a spaceborne array-type payload detector according to claim 1, characterized in that, In the initial iteration, all effective areas on the detector housing's heat dissipation surface are used as heat dissipation surfaces. Based on updates to the array position of each detector element and the total size of the heat dissipation surface, the radiative heat transfer coefficient and external heat flow of each detector element's heat dissipation surface to space are iteratively calculated, including: In the first iteration of the calculation, all areas on the heat dissipation surface of the detector housing are assumed to be heat dissipation surfaces. Continuously update the total heat dissipation area Ar of each detector unit i i And, in conjunction with the location of detector unit i in the array, the Monte Carlo method is used to calculate the radiation heat transfer coefficient REF of its heat dissipation surface to space. i Where i∈[1,n], and n is the number of detector units; Calculate the external heat flow Q of detector unit i wi for: In the formula, q si q represents the average incident heat flux reflected by the sun and the earth's albedo. ei ε is the average incident infrared heat flux of Earth, α is the solar absorptivity of the heat dissipation coating on the detector casing, and ε is the infrared emissivity.

5. The heat dissipation design method for a spaceborne array-type payload detector according to claim 1, characterized in that, The heat dissipation capacity and heat load of each detector unit are calculated based on the radiation heat transfer coefficient of each detector unit's heat dissipation surface to space and the external heat flow, so as to obtain the total heat dissipation capacity and total heat load of the array. The two values ​​are compared. When the total heat dissipation capacity cannot meet the total heat load, the spacing between each detector unit in the array is increased, and the radiation heat transfer coefficient of each detector unit's heat dissipation surface to space and the external heat flow are recalculated. Through this iterative calculation, the total heat dissipation capacity of the array is kept in balance with the total heat load within acceptable limits, including: Based on the radiative heat transfer coefficient of each detector unit's heat dissipation surface to space and the external heat flow, the heat dissipation capacity and heat load of each detector unit are calculated to obtain the total heat dissipation capacity and total heat load of the array, including: Calculate the thermal load L of detector unit i i and heat dissipation capacity C i ,get: In the formula: Q wi For the external heat flow of detector unit i, Q ni Q is the internal heat source of detector unit i. ri REF represents the minimum thermal power consumption within detector unit i. i For the radiative heat transfer coefficient of the heat dissipation surface in space, Ar i Let σ be the total heat dissipation area, and σ be the Boltzmann constant, σ = 5.67 × 10⁻⁶. -8 W / (m 2 ·K 4 ), where ε is the infrared emissivity, and T wi T is the temperature of the heat dissipation surface of detector unit i. s The ambient temperature of the space or background; The thermal load L for each detector unit i and heat dissipation capacity C i Sum the results to obtain the total heat load and total heat dissipation capacity of the array. Determine whether the following relationship holds true: If the judgment is not valid, it means that the total heat dissipation capacity of the array cannot meet the total heat load, and the spacing between each detector element needs to be increased to increase the radiative heat transfer coefficient REF of each detector element. i This increases the array's total heat dissipation capacity, while simultaneously incrementing the iteration count by 1 and recalculating the radiative heat transfer coefficient REF. i and external heat flow Q wi ; If the judgment is true, it means that the total heat dissipation capacity of the array meets the total heat load; Introducing a heat dissipation threshold S, and iteratively calculating the autonomous adjustment capability of the corresponding detector heat dissipation surface, the total array heat dissipation capacity is kept equal to the total heat load within the heat dissipation threshold S. Then: 。 6. The heat dissipation design method for a spaceborne array-type payload detector according to claim 1, characterized in that, The process of defining whether a detector unit is in a heat dissipation deficit or surplus based on its heat dissipation capacity and heat load, and then sorting the deficit and surplus amounts in descending order, includes: Once the array's total heat dissipation capacity meets the total heat load, proceed to the next step: Current iteration count ≥ Maximum iteration count X If the determination regarding the number of iterations is invalid, then the difference between the total heat dissipation capacity and the total heat load is used to determine the degree to which the total heat dissipation capacity exceeds the total heat load, based on the heat dissipation threshold S. If the degree judgment is invalid, the radiation heat transfer coefficient REF of each detector unit is statistically obtained. i The numerical value is used as a weighting parameter to reduce the heat dissipation area of ​​each detector unit in the current iteration calculation, while the iteration count is incremented by 1, and then the radiation heat transfer coefficient REF is calculated again. i and external heat flow Q wi Calculation; If the degree judgment is valid, then the heat dissipation capacity C of each detector unit i is determined. i and heat load L i Size determination task; If the judgment regarding the number of iterations is true, then the heat dissipation capacity C of each detector unit i is calculated. i and heat load L i Size judgment: If C i ≤L i Then the detector unit i is classified as having a heat dissipation deficit of L. i -C i And sort the heat dissipation deficit values ​​of each detector unit in descending order; If C i >L i Then the detector unit i is classified as having a heat dissipation surplus of C. i -L i Then, the heat dissipation surplus values ​​of each detector unit are sorted in descending order.

7. The heat dissipation design method for a spaceborne array-type payload detector according to claim 6, characterized in that, The statistics yielded the radiation heat transfer coefficient REF for each detector unit. i The numerical values ​​are used as weighting parameters to reduce the heat dissipation area of ​​each detector unit in the current iteration calculation, including: Based on the ratio of the current total heat dissipation surplus to the total heat dissipation capacity of the array, and setting the maximum system base reduction ratio RA, the actual base reduction ratio reduction_ratio is obtained: reduction_ratio = min(RA, current total heat dissipation surplus / total heat dissipation capacity); Based on the radiation heat transfer coefficient REF of each detection unit i The reduction in additional weight for each detector unit is obtained as refi_weight: refi_weight =REF i / Array of all current REF i The average value; Calculate the area adjustment factor (reduction_factors) for each detector element: Based on the total heat dissipation area Ar of each detector unit in the previous iteration i Adjust the heat dissipation area Ar of the current iteration i _new, we get:

8. A heat dissipation structure for a spaceborne array-type payload detector, characterized in that, The heat dissipation path inside each detector unit in the array and the thermally conductive connection method between each detector unit are constructed using the heat dissipation design method described in any one of claims 1-7.

9. A spaceborne array-type payload detector, characterized in that, The heat dissipation structure of the spaceborne array-type payload detector is constructed using the heat dissipation design method described in any one of claims 1-7.

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