Analysis System and Method for Automatic AVI Receiving and Transfer of Circuit Boards

Abstract

This invention discloses an analysis system and method for automated AVI (Automatic Material Handling) transfer of printed circuit boards (PCBs), relating to the field of automated material handling and transfer technology. It includes an operation data extraction module, a target demand PCB summarization module, a target transfer stage analysis module, an optimal optimization stage analysis module, and a recommended transfer sequence response module. The operation data extraction module extracts operation data for various types of PCBs executing the automated material handling and transfer process. The target demand PCB summarization module summarizes various PCBs from the historical records of equipment with the same downstream process as target demand PCBs. The target transfer stage analysis module returns the stages in the automated material handling and transfer process that capture and record response demand characteristics as target transfer stages, using response demand features as capture items. The optimal optimization stage analysis module analyzes and outputs the optimal optimization stage for the corresponding type of PCB. The recommended transfer sequence response module analyzes the recommended transfer sequence under mixed-line production, including the PCBs under investigation.

Description

Technical Field

[0001] This invention relates to the field of automatic material receiving and transfer technology, specifically to an analysis system and method for automatic material receiving and transfer of AVI circuit boards. Background Technology

[0002] In the PCB manufacturing process, the AVI (Automatic Material Handling and Transfer) system serves as a crucial link connecting post-processing of PCBs with downstream processes such as reflow soldering, manual inspection, and assembly. Its performance directly impacts overall production efficiency and product yield. Currently, mixed-line production of various PCB types with significant differences in size, precision, and rigidity has become the mainstream model in the industry, and a large number of different PCB types need to be connected to the same downstream process equipment to reduce equipment investment costs. However, existing technologies have significant shortcomings in addressing such scenarios.

[0003] First, the control parameter adjustments in automated material receiving and transfer processes rely heavily on manual experience or the characteristics of individual boards, failing to establish an effective correlation with the actual processing needs of downstream processes and historical fault data. This results in a lack of targeted parameter settings in the transfer process, often leading to downstream process failures caused by improper transfer parameters, such as excessively high circuit board temperatures affecting reflow soldering quality and chaotic batch sorting increasing the workload of manual re-inspection. Second, for the differentiated needs of different types of circuit boards in the same downstream process, existing technologies cannot accurately identify the key optimization links in the transfer process. Either a uniform adjustment logic is applied to all circuit boards, resulting in insufficient adaptability, or parameters are blindly modified in multiple links, which not only easily damages circuit boards but also creates parameter redundancy, reducing transfer efficiency. Third, when switching production between multiple types of circuit boards, the lack of a scientific transfer sequence planning mechanism leads to time-consuming parameter adjustments, chaotic switching logic, frequent process interruptions, and a serious slowdown in the overall production cycle.

[0004] Existing technologies lack a systematic analysis framework encompassing "historical data extraction, fault correlation analysis, optimization process screening, and transfer sequence adaptation." When faced with mixed-line requirements for new circuit board types, extensive manual debugging is necessary, resulting in poor adaptability and scalability, failing to meet the flexible production needs of modern multi-variety, small-batch manufacturing. These issues collectively lead to poor integration between the AVI automated material receiving and transfer process for circuit boards and downstream processes, making it difficult to guarantee the stability, efficiency, and product yield of mixed-line production. This has become a significant bottleneck restricting the intelligent upgrading of circuit board manufacturing. Summary of the Invention

[0005] The purpose of this invention is to provide an analysis system and method for automatic AVI material collection and transfer of circuit boards, so as to solve the problems raised in the prior art.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] An analysis method for automatic AVI material receiving and transfer of circuit boards, the method comprising the following specific steps:

[0008] Step S100: Extract the operation data of various circuit boards in the history of the AVI automatic material receiving and transfer process. The operation data includes the transfer links in the automatic material receiving and transfer process, the control parameters recorded in the transfer links, and the downstream processes connected after the transfer. Based on the equipment of the downstream processes, the various circuit boards in the history records corresponding to the equipment of the same downstream processes are summarized into the target demand circuit boards.

[0009] Step S200: Retrieve fault events of the target circuit board during downstream process equipment processing, analyze the response demand characteristics based on the fault events, and return the link in the AVI automatic material receiving and transfer process that captures and records the response demand characteristics as the target transfer link, with the response demand characteristics as the capture item.

[0010] Step S300: Store the target transfer links independently as a set of target transfer links for each type of circuit board in the target demand circuit board; analyze and output the optimal link for each type of circuit board for each target transfer link set;

[0011] Step S400: Compare the optimal optimization steps for various types of circuit boards in the target demand circuit board. When there are different optimal optimization steps, mark and record the circuit board types corresponding to different optimal optimization steps as circuit boards to be investigated. Based on the operation data of the circuit boards to be investigated, analyze the recommended transfer sequence under mixed-line production including the circuit boards to be investigated.

[0012] Furthermore, step S200 includes the following:

[0013] Step S210: Extract the fault features from the fault event records, generate corresponding fault feature sets according to the various types of circuit boards of the target requirement circuit boards, calculate the intersection of the fault feature sets corresponding to various types of circuit boards, and mark the output fault features as response requirement features; if there are no response requirement features, mark each type of circuit board in the same type of target requirement circuit board as a separate type of target requirement circuit board, and mark the fault features recorded by the circuit board as the corresponding response requirement features.

[0014] Step S220: Extract the fault parameters from the response demand feature record, and use the fault parameters as the capture quantity in the capture item to find the corresponding type of circuit board record in the AVI automatic material receiving and transfer process. The step with the capture quantity record is the target transfer step.

[0015] By using downstream process equipment as the starting point to initially classify different types of circuit boards, it is possible to quickly limit the types of circuit boards that meet similar processing procedures, thereby reserving optional types when there is mixed production of circuit boards; and by analyzing the target transfer link, it is possible to quickly identify the transfer process link that generates data correlation with the downstream process, thereby realizing collaborative analysis at the data level to meet the data needs of the downstream process.

[0016] Furthermore, the analysis and output of the optimal optimization steps for the corresponding type of circuit board includes the following steps:

[0017] Step S310: Extract the number of target transfer links recorded in the target transfer link set. When the number of target transfer links is one, output the target transfer link as the optimal optimization link for the corresponding type of circuit board. When the number of target transfer links is greater than one, implement control monitoring for each target transfer link in the same target transfer link set based on the control variable method, and record one automatic material receiving transfer as one monitoring event. Take any target transfer link as a monitoring item and the remaining transfer links as control items. Perform optimization adjustment on the corresponding fault parameters for the monitoring items, and maintain the recorded parameters in the original normal processing event for the control items. Optimization adjustment refers to adjusting the fault parameters to achieve optimization that meets the requirements of the corresponding downstream process. A normal processing event refers to an event in which no abnormality occurs when the automatic material receiving transfer is completed and the downstream process is processed.

[0018] Step S320: For each different monitoring item, generate several sets of corresponding monitoring events, extract the failure rate P of the downstream process response recorded in the monitoring events, P=Q1 / Q0, where Q0 represents the total number of monitoring event records, and Q1 represents the number of monitoring events that respond to the corresponding faults and anomalies in the downstream process.

[0019] Step S330: Sort the different monitoring items in ascending order according to the corresponding calculated failure rate values, and select the target transfer link corresponding to the monitoring item ranked first as the best optimization link for the circuit board type.

[0020] The purpose of analyzing the optimal process is to make more precise selections in the automatic transfer process for processes where there are multiple points where fault parameters can be adjusted, so as to maximize the orderly and safe operation of downstream processes and ensure the reasonable and efficient connection between the automatic material receiving and transfer process and downstream processes.

[0021] Furthermore, step S400 includes the following specific steps:

[0022] Step S410: When the optimal optimization steps in the same target requirement circuit board are all different, all types of circuit boards in the same target requirement circuit board are marked as circuit boards to be examined; when the number of identical optimal optimization steps in the same target requirement circuit board is greater than one and less than N, N is the total number of circuit board types contained in the same target requirement circuit board; output any identical optimal optimization step and the circuit boards corresponding to the remaining different optimal optimization steps as circuit boards to be examined; the types of circuit boards to be examined in the same target requirement circuit board are all different.

[0023] Step S420: Arrange and combine the optimal optimization links corresponding to the circuit board under investigation to generate all types of switching response sequence chains; extract the switching response time T from the optimal optimization link a to the optimal optimization link b in each type of switching response sequence chain. ab Optimal optimization step 'a' refers to the step on the circuit board that executes the automatic material receiving and transfer process first, and optimal optimization step 'b' refers to the step on another circuit board that is adjacent to it and undergoes mixed-line production after optimal optimization step 'a' has completed the transfer process; the switching response time T ab This refers to the maximum time taken for the optimal optimization step a to adjust its parameters to meet the production requirements of the corresponding circuit board after the optimal optimization step a completes the material collection and transfer of the corresponding circuit board, as well as the maximum time taken for the optimal optimization step b itself to adjust its parameters to meet the required production requirements.

[0024] This reduces the scope of mixed-line production allocation and can effectively improve mixed-line production efficiency and reduce the probability of failures and anomalies.

[0025] Step S430: Using the formula: L=∑T ab Calculate the sum L of the durations of all adjacent switching responses in each switching response sequence chain; select the switching response sequence chain corresponding to the minimum value Lmin to generate the corresponding circuit board execution chain, and use the circuit board execution chain as the recommended transfer sequence for the circuit board under mixed-line production.

[0026] Step 440: Obtain the type of circuit board being transferred in real time. When transferring different types of circuit boards belonging to the same target requirement circuit board to process, if the type of the newly added circuit board is the same as the type of the real-time circuit board or the number of types of the newly added circuit board is one, execute the adjacent sequential automatic material receiving and transfer process; if the type of the newly added circuit board is different from the type of the real-time circuit board and the number of types of the newly added circuit board is greater than one, extract the recommended transfer order recorded in the real-time circuit board type record and respond accordingly.

[0027] The shorter the total switching time required, the higher the efficiency of production processing according to the corresponding transfer sequence during mixed-line production. It also ensures that different types of circuit boards can effectively respond to the parameter adjustment process when facing the needs of downstream processes.

[0028] An analysis system for automatic AVI material receiving and transfer of circuit boards includes an operation data extraction module, a target demand circuit board summarization module, a target transfer process analysis module, an optimal optimization process analysis module, and a recommended transfer sequence response module.

[0029] The operation data extraction module is used to extract historical operation data of various circuit boards executing the AVI automatic material receiving and transfer process.

[0030] The target demand circuit board summarization module is used to summarize various circuit boards in the historical records of equipment with the same downstream process into target demand circuit boards.

[0031] The target transfer stage analysis module is used to capture and record the stages in the AVI automatic material receiving and transfer process that capture the response demand characteristics as the target transfer stages, based on the response demand characteristics as the capture items.

[0032] The optimal optimization step analysis module is used to analyze and output the optimal optimization step for each target transfer step set and the corresponding type of circuit board.

[0033] The recommended transfer sequence response module is used to analyze the recommended transfer sequence under mixed-line production of the circuit board under investigation based on the operation data of the circuit board under investigation.

[0034] Furthermore, the target transfer process analysis module includes a response demand feature extraction unit and a target transfer process determination unit;

[0035] The response requirement feature extraction unit is used to extract the fault features of the fault event records, generate corresponding fault feature sets according to the various types of circuit boards of the target requirement circuit board, calculate the intersection of the fault feature sets corresponding to various types of circuit boards, and mark the output fault features as response requirement features; if no response requirement features exist, each type of circuit board in the same type of target requirement circuit board is independently marked as a type of target requirement circuit board, and the fault features recorded by the circuit board are marked as the corresponding response requirement features.

[0036] The target transfer stage determination unit is used to extract fault parameters from the response demand feature record. Using the fault parameters as the capture quantity in the capture item, the corresponding type of circuit board record is searched. The stage in the AVI automatic material receiving and transfer process where there is a capture quantity record is the target transfer stage.

[0037] Furthermore, the optimal optimization analysis module includes a target transfer step quantity analysis unit, an adjustment monitoring unit, a failure rate calculation unit, and a sorting and selection unit;

[0038] The target transfer link quantity analysis unit is used to determine the number of target transfer links in the target transfer link set;

[0039] The adjustment monitoring unit is used to implement control monitoring for each target transfer link in the same target transfer link set based on the control variable method and record one automatic material receiving transfer as one monitoring event. Any target transfer link is taken as a monitoring item, and the remaining transfer links are taken as control items. The corresponding fault parameters are optimized and adjusted for the monitoring items.

[0040] The failure rate calculation unit is used to generate several sets of monitoring events for each different monitoring item, and extract the failure rate of the downstream process response recorded in the monitoring events;

[0041] The sorting and selection unit is used to sort different monitoring items in ascending order according to the corresponding calculated failure rate values, and select the target transfer link corresponding to the first ranked monitoring item as the best optimization link for the circuit board type.

[0042] Furthermore, the recommended transfer sequence response module includes a circuit board determination unit, a switching response sequence chain output unit, a switching response duration sum analysis unit, and a mixed-line response unit;

[0043] The circuit board to be examined determination unit is used to determine the circuit boards to be examined among the circuit boards with the same target requirement based on the best optimization process;

[0044] The switching response sequence chain output unit is used to arrange and combine the best optimization links corresponding to the circuit board under test to generate all types of switching response sequence chains.

[0045] The handover response duration summation analysis unit is used to calculate the sum of the durations of all adjacent handover responses in each handover response sequence chain;

[0046] The mixed-line response unit is used to select the switching response sequence chain corresponding to the minimum value to generate the corresponding circuit board execution chain, and use the circuit board execution chain as the recommended transfer order of the circuit board under mixed-line production; and make recommendations during real-time response.

[0047] Compared with the prior art, the beneficial effects of the present invention are:

[0048] This invention addresses many shortcomings of existing technologies by constructing a systematic analysis framework centered on downstream process requirements and supported by data-driven approaches, resulting in multi-dimensional and in-depth technological improvements. Firstly, using downstream process equipment as a classification benchmark, this invention deeply correlates historical operational data with downstream failure events. Through failure characteristic analysis, it accurately captures key parameters affecting downstream processing, ensuring that optimization of the transfer process is aligned with actual production needs. This establishes a collaborative relationship between the transfer process and downstream processes from the root, effectively reducing the failure rate of downstream processes and ensuring the smooth continuity of the upstream and downstream production chain.

[0049] Secondly, in response to the differentiated needs of different types of circuit boards under the same downstream process, this invention distinguishes common and individual needs through fault feature intersection analysis, and then monitors and screens multi-objective transfer links by combining the control variable method, so as to accurately determine the optimal optimization link for each type of circuit board. This not only avoids the problem of insufficient adaptability of uniform adjustment, but also eliminates the waste of resources and the risk of board damage caused by blind adjustment of multiple links, and takes into account both the universality and particularity of mixed line production.

[0050] Furthermore, by generating a switching response sequence chain and calculating the total switching time of adjacent optimization steps, this invention can select the optimal circuit board transfer sequence, minimize parameter adjustment time, reduce process interruption frequency, and significantly improve the overall cycle time of mixed production of multiple types of circuit boards under the same downstream process, meeting the needs of efficient continuous production. At the same time, the systematic analysis mechanism established by this invention has strong scalability and dynamic response capabilities. When faced with new circuit board types, it can quickly adapt based on historical data reuse and real-time response logic without reconstructing the entire process, greatly reducing system upgrade and maintenance costs.

[0051] The entire solution replaces traditional experience-based operations with full-process data-driven approaches, ensuring that adjustments to transfer parameters, optimization of process selection, and production sequence planning are all based on scientific principles. This effectively reduces issues such as board damage and process disruption, improves the stability of automated material collection and transfer, and thus guarantees the processing quality of downstream processes, comprehensively improving product yield. Finally, the "data extraction-analysis-optimization-application-feedback" closed-loop system formed by this invention can continuously optimize decision-making logic through iterative historical data over long-term use, ensuring that the system always adapts to changes in production needs. This provides strong support for the intelligent and flexible upgrading of PCB production, significantly enhancing the production competitiveness of enterprises. Attached Figure Description

[0052] Figure 1 This is a schematic diagram of the analysis method for automatic material collection and transfer of AVI circuit boards according to the present invention. Detailed Implementation

[0053] Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0054] Example: Figure 1 As shown, this invention provides an analysis method for automatic AVI (Automatic Take-up and Transfer) of PCBs, the method comprising the following specific steps:

[0055] Step S100: Extract the operation data of various circuit boards in the history of the AVI automatic material receiving and transfer process. The operation data includes the transfer links in the automatic material receiving and transfer process, the control parameters recorded in the transfer links, and the downstream processes connected after the transfer. Based on the equipment of the downstream processes, the various circuit boards in the history records corresponding to the equipment of the same downstream processes are summarized into the target demand circuit boards. Various circuit boards refer to circuit boards that have different dimensions, precision and rigidity / flexibility. When the above three indicators are the same, they are considered as one type of circuit board.

[0056] Step S200: Retrieve fault events of the target circuit board during downstream process equipment processing, analyze the response demand characteristics based on the fault events, and return the link in the AVI automatic material receiving and transfer process that captures and records the response demand characteristics as the target transfer link, with the response demand characteristics as the capture item.

[0057] Step S300: Store the target transfer links independently as a set of target transfer links for each type of circuit board in the target demand circuit board; analyze and output the optimal link for each type of circuit board for each target transfer link set;

[0058] Step S400: Compare the optimal optimization steps for various types of circuit boards in the target demand circuit board. When there are different optimal optimization steps, mark and record the circuit board types corresponding to different optimal optimization steps as circuit boards to be investigated. Based on the operation data of the circuit boards to be investigated, analyze the recommended transfer sequence under mixed-line production including the circuit boards to be investigated.

[0059] Step S200 includes the following:

[0060] Step S210: Extract the fault features from the fault event records, generate corresponding fault feature sets according to the various types of circuit boards of the target requirement circuit boards, calculate the intersection of the fault feature sets corresponding to various types of circuit boards, and mark the output fault features as response requirement features; if there are no response requirement features, mark each type of circuit board in the same type of target requirement circuit board as a separate type of target requirement circuit board, and mark the fault features recorded by the circuit board as the corresponding response requirement features.

[0061] Step S220: Extract the fault parameters from the response demand feature record, and use the fault parameters as the capture quantity in the capture item to find the corresponding type of circuit board record in the AVI automatic material receiving and transfer process. The step with the capture quantity record is the target transfer step.

[0062] As shown in the embodiment: when the downstream process equipment is a reflow oven, and the fault characteristic present in circuit boards a, b, and c during the reflow soldering process is excessive temperature, then the fault parameter is temperature. In this application, the operational requirements corresponding to the downstream process equipment can all be reflected in the automatic transfer process. If the downstream is manual re-inspection, the system divides the pallet area according to the "re-inspection batch" in the AGV transfer stage and affixes a QR code with batch information to the pallet; if the downstream is an assembly line, the system arranges the circuit boards according to the "board ID order" in the board alignment stage to ensure that the assembly sequence is directly matched after AGV transfer.

[0063] By using downstream process equipment as the starting point to initially classify different types of circuit boards, it is possible to quickly limit the types of circuit boards that meet similar processing procedures, thereby reserving optional types when there is mixed production of circuit boards; and by analyzing the target transfer link, it is possible to quickly identify the transfer process link that generates data correlation with the downstream process, thereby realizing collaborative analysis at the data level to meet the data needs of the downstream process.

[0064] The analysis and output of the optimal optimization steps for the corresponding type of circuit board includes the following steps:

[0065] Step S310: Extract the number of target transfer links recorded in the target transfer link set. When the number of target transfer links is one, output the target transfer link as the optimal optimization link for the corresponding type of circuit board. When the number of target transfer links is greater than one, implement control monitoring for each target transfer link in the same target transfer link set based on the control variable method and record one automatic material receiving transfer as one monitoring event. Take any target transfer link as a monitoring item and the remaining transfer links as control items. Perform corresponding fault parameter optimization adjustment for the monitoring items, and maintain the recorded parameters in the original normal processing event for the control items. Optimization adjustment refers to adjusting the fault parameters to achieve optimization to meet the requirements of the corresponding downstream process. Normal processing event refers to the event that no abnormality occurs when the downstream process is processed after the automatic material receiving transfer is completed. For example, when the downstream process is reflow soldering, temperature parameter adjustment is required. A cooling channel can be added to the conveying link in the automatic material transfer process for temperature control and monitoring of temperature data. Adding a cooling channel for temperature control and monitoring of temperature data is the optimization adjustment of the corresponding temperature parameter.

[0066] Step S320: For each different monitoring item, generate several sets of corresponding monitoring events, extract the failure rate P of the downstream process response recorded in the monitoring events, P=Q1 / Q0, where Q0 represents the total number of monitoring event records, and Q1 represents the number of monitoring events that respond to the corresponding faults and anomalies in the downstream process.

[0067] Step S330: Sort the different monitoring items in ascending order according to the corresponding calculated failure rate values, and select the target transfer link corresponding to the monitoring item ranked first as the best optimization link for the circuit board type.

[0068] The purpose of analyzing the optimal process is to make more precise selections in the automatic transfer process for processes where there are multiple points where fault parameters can be adjusted, so as to maximize the orderly and safe operation of downstream processes and ensure the reasonable and efficient connection between the automatic material receiving and transfer process and downstream processes.

[0069] Step S400 includes the following specific steps:

[0070] Step S410: When the optimal optimization steps in the same target requirement circuit board are all different, all types of circuit boards in the same target requirement circuit board are marked as circuit boards to be examined; when the number of the same optimal optimization steps in the same target requirement circuit board is greater than one and less than N, N is the total number of circuit board types contained in the same target requirement circuit board; output any circuit board with the same optimal optimization step and the circuit boards corresponding to the remaining different optimal optimization steps as circuit boards to be examined; the types of circuit boards to be examined in the same target requirement circuit board are all different; only one of the same steps is selected as the analysis object because when considering mixed production, if circuit boards with the same optimal optimization steps are sorted for production, they will definitely be arranged for adjacent production, so that when adjusting fault parameters, it is not necessary to switch to other steps, thereby improving the efficiency of production transfer;

[0071] Step S420: Arrange and combine the optimal optimization links corresponding to the circuit board under investigation to generate all types of switching response sequence chains; extract the switching response time T from the optimal optimization link a to the optimal optimization link b in each type of switching response sequence chain. ab Optimal optimization step 'a' refers to the step on the circuit board that executes the automatic material receiving and transfer process first, and optimal optimization step 'b' refers to the step on another circuit board that is adjacent to it and undergoes mixed-line production after optimal optimization step 'a' has completed the transfer process; the switching response time T ab This refers to the maximum time taken for the optimal optimization step a to adjust its parameters to meet the production requirements of the corresponding circuit board after the optimal optimization step a completes the material collection and transfer of the corresponding circuit board, as well as the maximum time taken for the optimal optimization step b itself to adjust its parameters to meet the required production requirements.

[0072] Since the two automatic material receiving and transfer processes are on the same production line, the required downstream process equipment is the same, so mixed-line production can be carried out. The background of mixed-line production mentioned in this application is that circuit board types with the same downstream process equipment requirements can be mixed-line produced. This reduces the scope of mixed-line production allocation and can effectively improve the efficiency of mixed-line production and reduce the probability of failure and abnormality.

[0073] Step S430: Using the formula: L=∑Tab Calculate the sum L of the durations of all adjacent switching responses in each switching response sequence chain; select the switching response sequence chain corresponding to the minimum value Lmin to generate the corresponding circuit board execution chain, and use the circuit board execution chain as the recommended transfer sequence for the circuit board under mixed-line production.

[0074] Step 440: Obtain the type of circuit board being transferred in real time. When transferring different types of circuit boards belonging to the same target requirement circuit board to process, if the type of the newly added circuit board is the same as the type of the real-time circuit board or the number of types of the newly added circuit board is one, execute the adjacent sequential automatic material receiving and transfer process; if the type of the newly added circuit board is different from the type of the real-time circuit board and the number of types of the newly added circuit board is greater than one, extract the recommended transfer order recorded in the real-time circuit board type record and respond accordingly.

[0075] As shown in the example: there are circuit boards a, v, and c; the corresponding optimal optimization steps are step 1, step 2, and step 3, respectively;

[0076] The following switching response sequence chain can then be generated based on the optimal optimization steps:

[0077] Step 1 → Step 2 → Step 3; Step 1 → Step 3 → Step 2;

[0078] Step 2 → Step 1 → Step 3; Step 2 → Step 3 → Step 1;

[0079] Step 3 → Step 1 → Step 2; Step 3 → Step 2 → Step 1;

[0080] Based on the above switching response sequence chain, calculate the switching response time for each case. For example, the time required for switching from stage 1 to stage 2 is L = ∑T ab =T 12 +T 23 .

[0081] The shorter the total switching time required, the higher the efficiency of production processing according to the corresponding transfer sequence during mixed-line production. It also ensures that different types of circuit boards can effectively respond to the parameter adjustment process when facing the needs of downstream processes.

[0082] An analysis system for automatic AVI material receiving and transfer of circuit boards includes an operation data extraction module, a target demand circuit board summarization module, a target transfer process analysis module, an optimal optimization process analysis module, and a recommended transfer sequence response module.

[0083] The operation data extraction module is used to extract historical operation data of various circuit boards executing the AVI automatic material receiving and transfer process.

[0084] The target demand circuit board summarization module is used to summarize various circuit boards in the historical records of equipment with the same downstream process into target demand circuit boards.

[0085] The target transfer stage analysis module is used to capture and record the stages in the AVI automatic material receiving and transfer process that capture the response demand characteristics as the target transfer stages, based on the response demand characteristics as the capture items.

[0086] The optimal optimization step analysis module is used to analyze and output the optimal optimization step for each target transfer step set and the corresponding type of circuit board.

[0087] The recommended transfer sequence response module is used to analyze the recommended transfer sequence under mixed-line production of the circuit board under investigation based on the operation data of the circuit board under investigation.

[0088] The target transfer process analysis module includes a response demand feature extraction unit and a target transfer process determination unit;

[0089] The response requirement feature extraction unit is used to extract the fault features of the fault event records, generate corresponding fault feature sets according to the various types of circuit boards of the target requirement circuit board, calculate the intersection of the fault feature sets corresponding to various types of circuit boards, and mark the output fault features as response requirement features; if no response requirement features exist, each type of circuit board in the same type of target requirement circuit board is independently marked as a type of target requirement circuit board, and the fault features recorded by the circuit board are marked as the corresponding response requirement features.

[0090] The target transfer stage determination unit is used to extract fault parameters from the response demand feature record. Using the fault parameters as the capture quantity in the capture item, the corresponding type of circuit board record is searched. The stage in the AVI automatic material receiving and transfer process where there is a capture quantity record is the target transfer stage.

[0091] The optimal optimization analysis module includes a target transfer step quantity analysis unit, an adjustment monitoring unit, a failure rate calculation unit, and a sorting and selection unit;

[0092] The target transfer link quantity analysis unit is used to determine the number of target transfer links in the target transfer link set;

[0093] The adjustment monitoring unit is used to implement control monitoring for each target transfer link in the same target transfer link set based on the control variable method and record one automatic material receiving transfer as one monitoring event. Any target transfer link is taken as a monitoring item, and the remaining transfer links are taken as control items. The corresponding fault parameters are optimized and adjusted for the monitoring items.

[0094] The failure rate calculation unit is used to generate several sets of monitoring events for each different monitoring item, and extract the failure rate of the downstream process response recorded in the monitoring events;

[0095] The sorting and selection unit is used to sort different monitoring items in ascending order according to the corresponding calculated failure rate values, and select the target transfer link corresponding to the first ranked monitoring item as the best optimization link for the circuit board type.

[0096] The recommended transfer sequence response module includes a circuit board determination unit, a switching response sequence output unit, a switching response duration sum analysis unit, and a mixed-line response unit.

[0097] The circuit board to be examined determination unit is used to determine the circuit boards to be examined among the circuit boards with the same target requirement based on the best optimization process;

[0098] The switching response sequence chain output unit is used to arrange and combine the best optimization links corresponding to the circuit board under test to generate all types of switching response sequence chains.

[0099] The handover response duration summation analysis unit is used to calculate the sum of the durations of all adjacent handover responses in each handover response sequence chain;

[0100] The mixed-line response unit is used to select the switching response sequence chain corresponding to the minimum value to generate the corresponding circuit board execution chain, and use the circuit board execution chain as the recommended transfer order of the circuit board under mixed-line production; and make recommendations during real-time response.

[0101] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An analysis method for automatic material collection and transfer of AVI circuit boards, characterized in that: The method includes the following specific steps: Step S100: Extract the operation data of various circuit boards in the history of the AVI automatic material receiving and transfer process. The operation data includes the transfer links in the automatic material receiving and transfer process, the control parameters recorded in the transfer links, and the downstream processes connected after the transfer. Based on the equipment of the downstream processes, the various circuit boards in the history records corresponding to the equipment of the same downstream processes are summarized into the target demand circuit boards. Step S200: Retrieve fault events of the target circuit board during downstream process equipment processing, analyze the response demand characteristics based on the fault events, and return the link in the AVI automatic material receiving and transfer process that captures and records the response demand characteristics as the target transfer link, with the response demand characteristics as the capture item. Step S300: Store the target transfer links as a set of target transfer links by independently storing various types of circuit boards in the target demand circuit board; For each target transfer step set analysis, the optimal optimization step for the corresponding type of circuit board is output; Step S400: Compare the optimal optimization steps for various types of circuit boards in the target demand circuit board. When there are different optimal optimization steps, mark and record the circuit board types corresponding to different optimal optimization steps as circuit boards to be investigated. Based on the operation data of the circuit boards to be investigated, analyze the recommended transfer sequence under mixed-line production including the circuit boards to be investigated. Step S400 includes the following specific steps: Step S410: When the optimal optimization steps in the same target requirement circuit board are all different, all types of circuit boards in the same target requirement circuit board are marked as circuit boards to be examined; when the number of identical optimal optimization steps in the same target requirement circuit board is greater than one and less than N, N is the total number of circuit board types contained in the same target requirement circuit board; output any identical optimal optimization step and the circuit boards corresponding to the remaining different optimal optimization steps as circuit boards to be examined; the types of circuit boards to be examined in the same target requirement circuit board are all different. Step S420: Arrange and combine the optimal optimization links corresponding to the circuit board under investigation to generate all types of switching response sequence chains; Extract the switching response time T from the optimal optimization step a to the optimal optimization step b in each type of switching response sequence chain. ab The optimal optimization step 'a' refers to the step in the circuit board that first executes the automatic material receiving and transfer process, and the optimal optimization step 'b' refers to the step in another circuit board that is adjacent to the one undergoing mixed-line production after the transfer process is completed in optimal optimization step 'a'; the switching response time T ab This refers to the maximum time taken for the optimal optimization step a to adjust its parameters to meet the production requirements of the corresponding circuit board after the optimal optimization step a completes the material collection and transfer of the corresponding circuit board, as well as the maximum time taken for the optimal optimization step b itself to adjust its parameters to meet the required production requirements. Step S430: Using the formula: L=∑T ab Calculate the sum L of the durations of all adjacent switching responses in each switching response sequence chain; select the switching response sequence chain corresponding to the minimum value Lmin to generate the corresponding circuit board execution chain, and use the circuit board execution chain as the recommended transfer sequence for the circuit board under mixed-line production. Step 440: Obtain the type of circuit board being transferred in real time. When transferring different types of circuit boards belonging to the same target requirement circuit board to process, if the type of the newly added circuit board is the same as the type of the real-time circuit board or the number of types of the newly added circuit board is one, execute the adjacent sequential automatic material receiving and transfer process; if the type of the newly added circuit board is different from the type of the real-time circuit board and the number of types of the newly added circuit board is greater than one, extract the recommended transfer order recorded in the real-time circuit board type record and respond accordingly.

2. The analysis method for automatic AVI material collection and transfer of circuit boards according to claim 1, characterized in that: Step S200 includes the following: Step S210: Extract the fault features from the fault event records, generate corresponding fault feature sets according to the various types of circuit boards of the target requirement circuit board, calculate the intersection of the fault feature sets corresponding to various types of circuit boards, and mark the output fault features as response requirement features; if there are no response requirement features, mark each type of circuit board in the same type of target requirement circuit board as a separate type of target requirement circuit board, and mark the fault features recorded by the circuit board as the corresponding response requirement features; Step S220: Extract the fault parameters from the response demand feature record, and use the fault parameters as the capture quantity in the capture item to find the corresponding type of circuit board record in the AVI automatic material receiving and transfer process. The step with the capture quantity record is the target transfer step.

3. The analysis method for automatic AVI material collection and transfer of circuit boards according to claim 2, characterized in that: The optimal optimization process for the corresponding type of circuit board, as described in the analysis output, includes the following steps: Step S310: Extract the number of target transfer links recorded in the target transfer link set. When the number of target transfer links is one, output the target transfer link as the optimal optimization link for the corresponding type of circuit board. When the number of target transfer links is greater than one, implement control monitoring for each target transfer link in the same target transfer link set based on the control variable method, and record one automatic material receiving transfer as one monitoring event. Take any target transfer link as a monitoring item and the remaining transfer links as control items. Perform optimization adjustment on the corresponding fault parameters for the monitoring items, and maintain the recorded parameters in the original normal processing event for the control items. The optimization adjustment refers to adjusting the fault parameters to achieve optimization that meets the requirements of the corresponding downstream process. The normal processing event refers to the event in which no abnormality occurs when the automatic material receiving transfer is completed and the downstream process is processed. Step S320: For each different monitoring item, generate several sets of corresponding monitoring events, extract the failure rate P of the downstream process response recorded in the monitoring events, P=Q1 / Q0, where Q0 represents the total number of monitoring event records, and Q1 represents the number of monitoring events that respond to the corresponding faults and anomalies in the downstream process. Step S330: Sort the different monitoring items in ascending order according to the corresponding calculated failure rate values, and select the target transfer link corresponding to the monitoring item ranked first as the best optimization link for the circuit board type.

4. An analysis system for automatic AVI (Automatic Take-up and Transfer) of PCBs, using the analysis method for automatic AVI (Automatic Take-up and Transfer) of PCBs as described in any one of claims 1-3, characterized in that: The system includes an operation data extraction module, a target requirement circuit board summarization module, a target transfer process analysis module, an optimal optimization process analysis module, and a recommended transfer order response module. The operation data extraction module is used to extract historical operation data of various circuit boards executing the AVI automatic material receiving and transfer process. The target demand circuit board summarization module is used to summarize various circuit boards in the historical records of equipment with the same downstream process as target demand circuit boards. The target transfer link analysis module is used to return the link in the AVI automatic material receiving and transfer process that captures and records the response demand characteristics as the target transfer link, with the response demand characteristics as the capture item; The optimal optimization step analysis module is used to analyze and output the optimal optimization step for each target transfer step set and the corresponding type of circuit board. The recommended transfer order response module is used to analyze the recommended transfer order under mixed-line production of the circuit board under investigation based on the operation data of the circuit board under investigation.

5. The analysis system for automatic AVI material collection and transfer of circuit boards according to claim 4, characterized in that: The target transfer link analysis module includes a response demand feature extraction unit and a target transfer link determination unit; The response requirement feature extraction unit is used to extract the fault features of the fault event records, generate corresponding fault feature sets according to the various types of circuit boards of the target requirement circuit board, perform intersection calculation on the fault feature sets corresponding to various types of circuit boards, and mark the output fault features as response requirement features; if there are no response requirement features, then each type of circuit board in the same type of target requirement circuit board is independently marked as a type of target requirement circuit board, and the fault features recorded by the circuit board are marked as the corresponding response requirement features. The target transfer stage determination unit is used to extract fault parameters from the response demand feature record, and to find the corresponding type of circuit board record in the AVI automatic material receiving and transfer process with the fault parameters as the capture quantity in the capture item. The stage with the capture quantity record is the target transfer stage.

6. The analysis system for automatic AVI material collection and transfer of circuit boards according to claim 5, characterized in that: The optimal optimization analysis module includes a target transfer step quantity analysis unit, an adjustment monitoring unit, a failure rate calculation unit, and a sorting and selection unit. The target transfer link quantity analysis unit is used to determine the number of target transfer links in the target transfer link set; The adjustment monitoring unit is used to implement control monitoring for each target transfer link in the same target transfer link set based on the control variable method and record one automatic material receiving transfer as one monitoring event. Any target transfer link is taken as a monitoring item, and the remaining transfer links are taken as control items. The corresponding fault parameters are optimized and adjusted for the monitoring items. The failure rate calculation unit is used to generate several sets of monitoring events for each different monitoring item, and extract the failure rate of the downstream process response recorded in the monitoring events. The sorting and selection unit is used to sort different monitoring items in ascending order according to the corresponding calculated failure rate values, and select the target transfer link corresponding to the first ranked monitoring item as the best optimization link for the circuit board type.

7. The analysis system for automatic AVI material collection and transfer of circuit boards according to claim 6, characterized in that: The recommended transfer order response module includes a circuit board determination unit, a switching response order chain output unit, a switching response duration sum analysis unit, and a mixed-line response unit. The circuit board determination unit is used to determine the circuit boards to be examined among the circuit boards with the same target requirement based on the best optimization process. The switching response sequence chain output unit is used to arrange and combine the best optimization links corresponding to the circuit board under investigation to generate all types of switching response sequence chains. The handover response duration sum analysis unit is used to calculate the sum of the durations of all adjacent handover responses in each handover response sequence chain; The mixed-line response unit is used to select the switching response sequence chain corresponding to the minimum value to generate the corresponding circuit board execution chain, and use the circuit board execution chain as the recommended transfer order of the circuit board to be examined under mixed-line production; and make recommendations during real-time response.

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