boost inductor

By designing a housing cavity and heat dissipation structure in the boost inductor, the problem of heat dissipation and heat distribution when multiple inductor units are connected in parallel or series is solved, achieving efficient and uniform heat dissipation and ensuring stable operation under high power density applications.

CN121306726BActive Publication Date: 2026-07-24HUIZHOU MAGNETIC POLE NEW ENERGY TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HUIZHOU MAGNETIC POLE NEW ENERGY TECH CO LTD
Filing Date
2025-10-30
Publication Date
2026-07-24

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    Figure CN121306726B_ABST
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Abstract

The application discloses a boost inductor, which comprises a shell, a plurality of inductor units and a filling structure, the plurality of inductor units are accommodated in the shell, and the filling structure is filled in the gap between the plurality of inductor units and the shell; the shell is provided with a plurality of accommodation cavities and a plurality of heat dissipation structures, the plurality of accommodation cavities are sequentially arranged along the length extension direction of the shell; each heat dissipation structure is arranged on the cavity wall of the corresponding accommodation cavity; each inductor unit is accommodated in the corresponding accommodation cavity; the filling structure is filled in the gap between the plurality of inductor units and the plurality of accommodation cavities; each heat dissipation structure comprises a first heat dissipation unit and a second heat dissipation unit, the first heat dissipation unit is arranged on the outer surface of the bottom wall of the corresponding accommodation cavity; and the second heat dissipation unit is arranged on the surface of the bottom wall of the corresponding accommodation cavity. The heat generated by the operation of the inductor units of the boost inductor is transmitted to the cavity wall of the accommodation cavity through the filling structure, is dissipated to the outside by the heat dissipation structure, and the thermal resistance is effectively reduced.
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