Resin composition

Abstract

The present invention addresses the problem of providing a resin composition that provides a cured product exhibiting excellent dielectric properties and excellent adhesion. [Solution] A resin composition containing (1A) a polymer having a structural unit represented by formula (A-1) and a structural unit represented by formula (A-2), (B) an epoxy resin, and (C) an inorganic filler. (In formula (A-1) and formula (A-2), R1 each independently represents a monovalent organic group having an atom selected from the group consisting of a carbon atom, a hydrogen atom, an oxygen atom, a nitrogen atom, a silicon atom, and a sulfur atom as a constituent atom, R1 has a molecular weight of 250 or more, R1 does not have an ethylenically unsaturated group, and R1 does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. Each A independently represents a divalent organic group having a bisphenol skeleton that may be hydrogenated. )

Description

Technical Field

[0001] This invention relates to resin compositions. Furthermore, this invention relates to resin sheets, printed wiring boards, and semiconductor devices obtained using the resin compositions, as well as methods for manufacturing the resin compositions. Background Technology

[0002] As a manufacturing technology for printed wiring boards, a manufacturing method utilizing alternating layers of insulating and conductor layers in a stacking manner is known. Examples of insulating materials for printed wiring boards that can be used in such insulating layers include, for instance, the resin composition disclosed in Patent Document 1.

[0003] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2018-53092 Summary of the Invention

[0004] The technical problem that the invention aims to solve As an insulating material for printed wiring boards, cured resin compositions in which various polymers are added to a curable resin and an inorganic filler are sometimes used. However, the inventors have found that such resin compositions sometimes suffer from problems such as an increase in dielectric constant and dielectric loss tangent, and a decrease in the adhesion between the insulating layer and the conductor layer (copper foil) due to heating during curing.

[0005] The present invention was made in view of the above-mentioned problems, and its object is to provide a resin composition that produces a cured product exhibiting excellent dielectric properties and excellent adhesion.

[0006] Methods for solving technical problems The inventors conducted in-depth research and found that the above-mentioned problems could be solved by using a resin composition containing a polymer, epoxy resin and inorganic filler material with a specific structure, thereby completing the present invention.

[0007] That is, the present invention includes the following contents. [1] A resin composition comprising: (1A) Polymers having structural units shown in formula (A-1) and formula (A-2) below, (B) Epoxy resin, and (C) Inorganic filler materials [Chemical Formula 1] (In equations (A-1) and (A-2), R) 1Each is independently a monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 1 The molecular weight is above 250, R 1 It does not have an olefinic unsaturated group, R 1 It does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. A independently represents a divalent organic group having an optionally hydrogenated bisphenol skeleton. [2] According to the resin composition of [1], wherein component (1A) is a polymer having structural units shown in the following formula (A-3), [Chemical Formula 2] (In formula (A-3), R) 1 Each is independently a monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 1 The molecular weight is above 250, R 1 It does not have an olefinic unsaturated group, R 1 It does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. A independently represents a divalent organic group having an optionally hydrogenated bisphenol skeleton. [3] The resin composition according to [1] or [2], wherein, in formula (A-1), R 1 Each is an independent monovalent organic group that does not have reactive substituents. [4] The resin composition according to any one of [1] to [3], wherein, in formula (A-1), R 1 Each is an independent monovalent organic group that does not contain either a triazine skeleton or an optionally hydrogenated bisphenol skeleton. [5] The resin composition according to any one of [1] to [4], wherein, in formula (A-1), R 1 Each is an independent monovalent organic group selected from saturated aliphatic groups, aromatic groups, and combinations of saturated aliphatic groups and aromatic groups. [6] The resin composition according to any one of [1] to [5], wherein, in formula (A-1), R 1 Each is an independent monovalent organic group selected from substituted amino and substituted oxygen groups. [7] The resin composition according to any one of [1] to [6], wherein in formula (A-2), A is each independently a divalent organic group whose constituent atoms are selected from carbon atoms, hydrogen atoms, oxygen atoms, nitrogen atoms, fluorine atoms and silicon atoms. [8] The resin composition according to any one of [1] to [7], wherein, in formula (A-2), A is a divalent organic group having a bisphenol skeleton. [9] The resin composition according to any one of [1] to [8], wherein, in formula (A-2), A is a divalent organic group represented by the following formula (A-4), [Chemical Formula 3] (In formula (A-4), ring Ar) 1 Each can be independently represented as an aromatic carbon ring with 6 to 10 carbon atoms, which may be optionally substituented. X 1 * indicates a single bond, or a divalent group consisting of 1 to 200 atoms selected from carbon, hydrogen, oxygen, nitrogen, fluorine, silicon, and sulfur. * indicates a linking bond.

[10] According to the resin composition of [9], wherein, in formula (A-4), the cyclic Ar 1 It is an aromatic carbon ring with 6 to 10 carbon atoms, optionally having substituents selected from alkyl and aryl groups having 1 to 10 carbon atoms.

[11] The resin composition according to [9] or

[10] , wherein, in formula (A-4), X 1 It can be an alkylene group having 1 to 20 carbon atoms, an aryl group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms formed by a combination of them, which may have oxygen atoms.

[12] The resin composition according to any one of [1] to

[11] , wherein, in formula (A-2), A is a divalent organic group represented by the following formula (A-5), [Chemical Formula 4] (In formula (A-5), ring Ar) 2 Each independently represents an aromatic carbon ring with 6 to 10 carbon atoms, optionally containing substituents. X 2 R represents a divalent group consisting of 1 to 200 constituent atoms selected from carbon, hydrogen, and oxygen atoms. 4 Each of these can independently represent an alkylene group having 1 to 20 carbon atoms, an aryl group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms formed by combinations thereof. R 5 and R 6 Each independently represents an alkyl group having 1 to 20 carbon atoms or an aryl group having 1 to 20 carbon atoms; additionally, R 5 and R 6 They can be connected to form a loop. * indicates a connecting key.

[13] According to the resin composition of

[12] , wherein, in formula (A-5), X 2 It is an oxygen atom, an alkylene group having 1 to 50 carbon atoms, an aryl group having 1 to 20 carbon atoms with an alkyl group having 1 to 6 carbon atoms as a substituent, or a divalent group having 2 to 60 carbon atoms formed by a combination of the above.

[14] The resin composition according to

[12] or

[13] , wherein, in formula (A-5), X 2 It is a divalent group with 6 to 100 carbon atoms having an aromatic hydrocarbon ring.

[15] The resin composition according to any one of [1] to

[14] , wherein component (1A) further has a structural unit represented by the following formula (A-6), [Chemical Formula 5] (In formula (A-6), R) 2 Each is independently a monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 2 The molecular weight is less than 250, R 2 It does not have an olefinic unsaturated group, R 2 It does not contain at least one of a triazine backbone and an optionally hydrogenated bisphenol backbone.

[16] The resin composition according to any one of [2] to

[15] , wherein component (1A) further has a structural unit shown in the following formula (A-7), [Chemical Formula 6] (In formula (A-7), R) 2 Each is independently a monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 2 The molecular weight is less than 250, R 2 It does not have an olefinic unsaturated group, R 2 It does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. A independently represents a divalent organic group having an optionally hydrogenated bisphenol skeleton.

[17] The resin composition according to

[15] or

[16] , wherein, in formula (A-6), R 2 It is an aryloxy group.

[18] The resin composition according to any one of

[15] to

[17] , wherein, in formula (A-6), R 2 It is a naphthoxy group.

[19] The resin composition according to any one of

[15] to

[18] , wherein the number of repetitions of the structural unit shown in formula (A-1) in component (1A) is set to N1, the number of repetitions of the structural unit shown in formula (A-2) is set to N2, the number of repetitions of the structural unit shown in formula (A-6) is set to N6, and the number of repetitions of the other structural units is set to N0 when other structural units are present, the ratio α defined by the following formula (1) is 0.9 to 1. [Mathematical Expression 1]

[20] The resin composition according to any one of

[15] to

[19] , wherein when the number of repetitions of the structural unit shown in formula (A-1) in component (1A) is set to N1 and the number of repetitions of the structural unit shown in formula (A-6) is set to N6, the ratio of N6 to N1 (N6 / N1) is 0.1 to 20.

[21] The resin composition according to any one of [1] to

[20] , wherein the (1A) component has two or more structural units of formula (A-2) with different A values, wherein the two or more A values ​​include divalent groups of formula (A-4) and divalent groups of formula (A-5). [Chemical Formula 7] (In equations (A-4) and (A-5), ring Ar) 1 and ring Ar 2 Each independently represents an aromatic carbon ring with 6 to 10 carbon atoms, optionally containing substituents. X 1 X represents an alkylene group having 1 to 20 carbon atoms, an aryl group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms formed by combinations thereof, which may contain oxygen atoms. 2 R represents an oxygen atom, an alkylene group having 1 to 50 carbon atoms, an aryl group having 1 to 20 carbon atoms with an alkyl group having 1 to 6 carbon atoms as a substituent, or a divalent group having 2 to 60 carbon atoms formed by combinations thereof. 4 Each of these can independently represent an alkylene group having 1 to 20 carbon atoms, an aryl group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms formed by combinations thereof. R 5 and R 6 Each independently represents an alkyl group having 1 to 20 carbon atoms or an aryl group having 1 to 20 carbon atoms; additionally, R 5 and R 6 They can be connected to form a loop. * indicates a connecting key.

[22] According to the resin composition of

[21] , when the number of divalent groups represented by formula (A-5) in component (1A) is set to M5 and the number of divalent groups represented by formula (A-4) is set to M4, the ratio of M5 to M4 (M5 / M4) is 0.05 to 5.

[23] The resin composition according to any one of [1] to

[22] , wherein component (1A) is a polymer having the structure shown in formula (A-8) below, [Chemical Formula 8] (In equation (A-8), n1 represents an integer greater than or equal to 1, and n2 represents an integer greater than or equal to 0. R) 1 R 2 R and R are each independently a monovalent organic group whose constituent atoms are selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 1 The molecular weight is above 250, R 2 The molecular weight is less than 250, R 1 R 2 R does not have an olefinic unsaturated group, R 1 R 2 R does not contain at least one of a triazine skeleton or an optionally hydrogenated bisphenol skeleton. A independently represents a divalent organic group having an optionally hydrogenated bisphenol skeleton.

[24] The resin composition according to

[23] , wherein in formula (A-8), n1+n2 is 1 to 110.

[25] The resin composition according to any one of [1] to

[24] , wherein the weight average molecular weight of component (1A) is 1,000 to 50,000.

[26] The resin composition according to any one of [1] to

[25] , wherein it further contains (D) a curing agent.

[27] The resin composition according to

[26] , wherein component (D) comprises an active ester curing agent.

[28] The resin composition according to any one of [1] to

[27] further comprises (E) a curing accelerator.

[29] The resin composition according to any one of [1] to

[28] , wherein it further contains (F) free radical polymeric resin.

[30] The resin composition according to any one of [1] to

[29] , wherein it further contains a (G) free radical polymerization initiator.

[31] The resin composition according to any one of [1] to

[30] , wherein when the non-volatile component in the resin composition is set to 100% by mass, the content of component (1A) is 1 to 30% by mass.

[32] The resin composition according to any one of [1] to

[31] , wherein when the non-volatile component in the resin composition is set to 100% by mass, the content of component (C) is 50 to 75% by mass.

[33] The resin composition according to any one of [1] to

[32] , wherein the mass ratio of component (1A) to component (C) [(1A) component / (C) component] is 0.01 to 1.

[34] A resin composition comprising: (2A) A polymer formed by reacting cyanuric chloride, optionally hydrogenated bisphenols, a compound represented by the following formula (X-1), and a monophenol; (B) Epoxy resin; and (C) Inorganic filler materials [Chemical Formula 9] (In formula (X-1), R) 1 It is a monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 1 The molecular weight is above 250, R 1 It does not have an olefinic unsaturated group, R 1 It does not contain at least one of a triazine backbone and an optionally hydrogenated bisphenol backbone.

[35] A method for manufacturing a resin composition, the method comprising: (1) A step of reacting cyanuryl chloride, optionally a hydrogenated bisphenol, a compound represented by formula (X-1) below, and a monophenol to obtain a polymer; and (2) The process of mixing the polymer, epoxy resin and inorganic filler material obtained in step (1), [Chemical Formula 10] (In formula (X-1), R) 1 It is a monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 1 The molecular weight is above 250, R 1 It does not have an olefinic unsaturated group, R 1 It does not contain at least one of a triazine backbone and an optionally hydrogenated bisphenol backbone.

[36] A resin sheet comprising: a support body and a resin composition layer disposed on the support body comprising any one of the resin compositions described in [1] to

[34] .

[37] A printed wiring board comprising an insulating layer formed by curing a resin composition according to any one of [1] to

[34] .

[38] A semiconductor device comprising the printed wiring board described in

[37] . The effects of the invention

[0008] According to the present invention, a resin composition that produces a cured product exhibiting excellent dielectric properties and excellent adhesion, a resin sheet obtained using the resin composition, a printed wiring board and a semiconductor device, and a method for manufacturing the resin composition can be provided. Detailed Implementation

[0009] The present invention will be described in detail below with reference to the embodiments and examples shown. However, the present invention is not limited to the embodiments and examples listed below, and can be implemented in any way without departing from the scope of the claims and their equivalents.

[0010] [Explanation of Terminology] In the following description, unless otherwise specified, the descriptions of numerical ranges as "above XX and below YY" or "XX to YY" refer to numerical ranges that include both the lower and upper limits as endpoints. When numerical ranges are described in stages, the upper and lower limits of each numerical range can be combined arbitrarily.

[0011] In the following explanation, unless otherwise specified, “dielectric constant” refers to “relative dielectric constant”.

[0012] In the following description, the term "optionally having substituents" used with respect to compounds or groups, unless otherwise specified, refers to both the case where the hydrogen atoms of the compound or group are not substituted by substituents and the case where some or all of the hydrogen atoms of the compound or group are substituted by substituents. Furthermore, when the number of constituent atoms and carbon atoms of the compound or group are stated, unless otherwise specified, the number of constituent atoms and carbon atoms do not include the number of constituent atoms and carbon atoms of substituents.

[0013] In the following description, the term "organic group" refers to a group containing at least a carbon atom as a skeleton atom, and can be linear, branched, or cyclic. In this specification, unless otherwise specified, the number of skeleton atoms in an organic group is preferably 1 to 3000, more preferably 1 to 1000, even more preferably 1 to 100, even more preferably 1 to 50, and particularly preferably 1 to 30 or 1 to 20. Examples of organic groups include those containing one or more skeleton atoms selected from carbon, oxygen, nitrogen, and sulfur (containing at least a carbon atom).

[0014] In the following description, an aromatic ring refers to a ring that follows Hückel's rule, where the number of electrons in the π-electron system of the ring is 4r+2 (r is a natural number). This includes monocyclic aromatic rings and fused aromatic rings formed by the fusion of two or more monocyclic aromatic rings. Unless otherwise specified, monocyclic aromatic rings are preferred. The aromatic ring can be an aromatic carbon ring having only carbon atoms as cyclic atoms, or an aromatic heterocycle having, in addition to carbon atoms, heteroatoms such as oxygen, nitrogen, and sulfur atoms as cyclic atoms. Unless otherwise specified, aromatic carbon rings are preferred. Unless otherwise specified, the number of carbon atoms in the aromatic ring is preferably 3 or more, more preferably 4 or more or 5 or more, further preferably 6 or more, with an upper limit preferably 24 or less, more preferably 18 or less or 14 or less, and further preferably 10 or less. This number of carbon atoms does not include the number of substituents.

[0015] Examples of monocyclic aromatic rings include benzene rings, furan rings, thiophene rings, pyrrole rings, pyrazole rings, oxazole rings, isoxazole rings, furazine rings, thiazole rings, isothiazole rings, thiadiazole rings, imidazole rings, triazole rings, tetraazole rings, pyridine rings, pyridazine rings, pyrimidine rings, and pyridazine rings. Examples of fused aromatic rings, formed by the fusion of two or more monocyclic aromatic rings, include naphthyl rings, anthracene rings, phenanthrene rings, benzofuran rings, isobenzofuran rings, indole rings, isoindole rings, benzothiophene rings, benzimidazole rings, indazole rings, benzoxazole rings, benzoisoxazole rings, benzothiazole rings, quinoline rings, isoquinoline rings, quinoxaline rings, acridine rings, quinazoline rings, terpinen rings, phthalazine rings, pyridothiazole rings, benzotriazole rings, imidazole-pyridine rings, triazole-pyridine rings, and purine rings. Unless otherwise specified, the aromatic ring is preferably a benzene ring or a naphthalene ring, and more preferably a benzene ring.

[0016] In the following description, structural formulas are sometimes used to describe the polymers of the present invention. Specifically, the following formulas (XA-1) to (XA-4) refer to polymers of the present invention having repeating units X. A The polymer. Here, X AWhen two or more structures can be used, the copolymerization of these two or more structures is also included in formulas (XA-1) to (XA-4). There are no restrictions on the form of copolymerization; examples include random copolymerization, alternating copolymerization, block copolymerization, graft copolymerization, and ordered copolymerization. Furthermore, when described as "having structural units" or "having a structure," unless otherwise specified, this also includes structures other than those with explicitly shown repeating units X, without impairing the effects of the invention. A In addition to other structural units, it also has other structural unit methods. [Chemical Formula 11] (where X) A X represents a repeating unit. E1 and X E2 This indicates the terminal group. n indicates the repetition number.

[0017] Repeating unit X A Contains two types of repeating units X A1 and X A2 In some cases, X is sometimes specified. A1 and X A2 And it is expressed in any of the following forms (XA-5) to (XA-8). In this case, for X A1 and X A2 There are no restrictions on the form and order of copolymerization, and examples include random copolymerization, alternating copolymerization, block copolymerization, graft copolymerization, and ordered copolymerization. For instance, "a polymer having the structure shown in formula (XA-9)" refers to "a polymer or a mixture thereof having a structure selected from formulas (XA-9-1) to (XA-9-6)". In the usual cases of n1 and n2, polymers having the structure shown in formula (XA-5) can be considered. n1+n2 C n1 This is the order of combination (where "C" is the combination symbol). [Chemical Formula 12] (where X) A1 and X A2 X represents two types of repeating units. E1 and X E2 This indicates the terminal group. n1 and n2 represent the repetition number. [Chemical Formula 13] X E1 -X A1 -X A1 -X A2 -X A2 -X E2(XA-9-1) X E1 -X A2 -X A1 -X A1 -X A2 -X E2 (XA-9-4) X E1 -X A1 -X A2 -X A1 -X A2 -X E2 (XA-9-2) X E1 -X A2 -X A1 -X A2 -X A1 -X E2 (XA-9-5) X E1 -X A1 -X A2 -X A2 -X A1 -X E2 (XA-9-3) X E1 -X A2 -X A2 -X A1 -X A1 -X E2 (XA-9-6) (where X) A1 and X A2 X represents two types of repeating units. E1 and X E2 (This indicates a terminal group.)

[0018] Furthermore, when the polymer of the present invention is represented in the form of formula (XA-9), there are sometimes examples where a portion of its structure is represented in the form of the following formula (XA-10). As an example based on the form of formula (XA-10), as described above, "polymer having the structure shown in formula (XA-9)" refers to "polymer or mixture thereof having a structure selected from formulas (XA-9-1) to (XA-9-6)", and is not limited to those having "-X". A2 -X A1 -X A1 -X E2 The order of combination of "". [Chemical Formula 14] (where X) A1 and X A2 X represents two types of repeating units. E2 (This indicates a terminal group.)

[0019] The polymer of this invention comprises two difunctional monomers X B With X C condensation polymer (X) B Between, X C There was no response between them, but X B With X C (reaction), presence of X B1 and X B2 These two are X B There exists X C1 and X C2 These two are X C In this case, the polymer exhibits any of formulas (XBC-1) to (XBC-4), but sometimes simplifies and exhibits any of formulas (XBC-5) to (XBC-8). In this case, as long as X... B With X C Alternating combinations, then -X B1 -X C1 -、-X B1 -X C2 -、-X B2 -X C1 -and-X B2 -X C2 There are no restrictions on the form and order of copolymerization, including random copolymerization, alternating copolymerization, block copolymerization, graft copolymerization, and ordered copolymerization. For example, "polymers having the structure shown in formula (XBC-9)" refers to "polymers or mixtures thereof having structures selected from formulas (XBC-9-1) to (XBC-9-9)". In general, n b1 n b2 n c1 and n c2 In this case, the binding sequence in the polymer shown in formula (XBC-5) can be considered as follows: nb1+nb2 C nb1×nc1+nc2 C nc1 Thus (where "C" is a combination symbol). [Chemical Formula 15] (where X) B1 X B2 X C1 and X C2 X represents four types of repeating units. E1 and X E2 Indicates the terminal group. n 11 n 12 n 21 and n 22 Indicates the number of repetitions. [Chemical Formula 16] (where X) B1 X B2 X C1 and X C2 X represents four types of repeating units. E1 and X E2 Indicates the terminal group. n b1 n b2 n c1 and n c2 Indicates the number of repetitions. [Chemical Formula 17] X E1 -X B1 -X C1 -X B1 -X C2 -X B2 -X C2 -X E2 (XBC-9-1) X E1 -X B1 -X C2 -X B1 -X C1 -X B2 -X C2 -X E2 (XBC-9-2) X E1 -X B1 -X C2 -X B1 -X C2 -X B2 -X C1 -X E2 (XBC-9-3) X E1 -X B1 -X C1 -X B2 -X C2 -X B1 -X C2 -X E2 (XBC-9-4) X E1 -X B1 -X C2 -X B2 -X C1 -X B1 -X C2 -X E2 (XBC-9-5) X E1 -X B1 -XC2 -X B2 -X C2 -X B1 -X C1 -X E2 (XBC-9-6) X E1 -X B2 -X C1 -X B1 -X C2 -X B1 -X C2 -X E2 (XBC-9-7) X E1 -X B2 -X C2 -X B1 -X C1 -X B1 -X C2 -X E2 (XBC-9-8) X E1 -X B2 -X C2 -X B1 -X C2 -X B1 -X C1 -X E2 (XBC-9-9) (where X) B1 X B2 X C1 and X C2 X represents four types of repeating units. E1 and X E2 (This indicates a terminal group.)

[0020] In the following description, components (1A) and (2A) are sometimes collectively referred to as "component (A)". Additionally, the resin composition of the first embodiment and the resin composition of the second embodiment are sometimes collectively referred to as "resin composition".

[0021] [Resin Composition of the First Embodiment] The resin composition of the first embodiment of the present invention contains (1A) a polymer having a first specific structure, (B) an epoxy resin, and (C) an inorganic filler. The first specific structure will be described later. By combining components (1A) to (C) and including them in the resin composition, a cured product exhibiting excellent dielectric properties and excellent adhesion can be obtained. In this invention, "adhesion" refers to the adhesion between the insulating layer and the conductor layer formed by the cured product of the resin composition of the present invention. The inventors have confirmed that the adhesion is particularly excellent when the conductor layer is copper. Examples of adhesion between the insulating layer and copper include "substrate adhesion" and "plating adhesion." "Substrate adhesion" refers to the adhesion between the insulating layer and the conductor layer (copper) when the insulating layer and the conductor layer (copper) are bonded by lamination. "Plating adhesion" refers to the adhesion between the insulating layer and the conductor layer (copper) when the conductor layer (copper) is formed on the insulating layer by plating. In one embodiment of the present invention, both "substrate adhesion" and "plating adhesion" can be achieved. In the resin composition of the first embodiment, any other optional components may be further included in combination with components (1A) to (C). Examples of optional components include (D) curing agent, (E) curing accelerator, (F) free radical polymerizable resin, (G) free radical polymerization initiator, (H) organic solvent, and (I) other additives. Hereinafter, each component included in the resin composition of the first embodiment will be described in detail.

[0022] <(1A) Polymers having a first specific structure> The resin composition of the first embodiment of the present invention contains a polymer (a polymer having a first specific structure) having structural units shown in formula (A-1) and structural units shown in formula (A-2). The optionally hydrogenated bisphenol backbone shown in formula (A-2) is a rigid backbone; therefore, it is believed that by giving component (1A) the structural unit shown in formula (A-2), thermal stability can be improved, and thermal oxidative degradation caused by heating during the curing of the resin composition can be suppressed. Furthermore, it is believed that by giving component (1A) the rigid backbone shown in formula (A-2), it is less susceptible to the influence of molecular motion caused by high frequencies, and a cured product exhibiting excellent dielectric properties can be obtained. The structural unit shown in formula (A-1) is preferably combined with the structural unit shown in formula (A-2), and the structural unit shown in formula (A-2) is preferably combined with the structural unit shown in formula (A-1). Component (1A) can be used alone or in combination of two or more. [Chemical Formula 18] (In equations (A-1) and (A-2), R) 1Each is an independent monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms. 1 The molecular weight is above 250, R 1 It does not have an olefinic unsaturated group, R 1 It does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. A independently represents a divalent organic group having an optionally hydrogenated bisphenol skeleton.

[0023] In equation (A-1), R 1 Each is an independent monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms. 1 The molecular weight is above 250, R 1 It does not have an olefinic unsaturated group, R 1 It does not contain at least one of a triazine backbone and an optional hydrogenated bisphenol backbone.

[0024] By R 1 The molecular weight is set to be above 250, and R is made 1 It lacks olefinic unsaturated groups, thereby enabling a reduction in the dielectric constant and dielectric loss tangent of the cured resin composition. 1 A molecular weight of 250 or higher means R 1 Large volume, due to the presence of large-volume substituents, increases the free volume, thus presuming a decrease in the dielectric constant. Additionally, by making R... 1 It does not have olefinic unsaturated groups, so even after curing, the substituent R 1 It also does not crosslink, therefore it is presumed that the degrees of freedom of molecular motion can be maintained, resulting in a decrease in the dielectric loss tangent. Furthermore, maintaining the degrees of freedom of molecular motion and increasing the free volume is also presumed to be the main reason for the decrease in dielectric constant. In one embodiment, R... 1 The molecular weight is preferably 300 or more, more preferably 400 or more or 500 or more, even more preferably 600 or more or 700 or more, and particularly preferably 800 or more or 850 or more. 1 There is no particular upper limit to the molecular weight; it can be set to below 10,000, 9,000, 8,000, 7,000, 6,000, 5,000, 4,000, 3,000, 2,000, 1,500, 1,200, etc. Additionally, in another embodiment, R... 1 Preferably, it is a monovalent organic group without reactive substituents. R 1 It does not have reactive substituents and has a molecular weight of 250 or higher, which means that R 1 Its low polarity can further reduce the dielectric loss tangent of the cured material.

[0025] R 1 It does not contain at least one of a triazine backbone and an optionally hydrogenated bisphenol backbone, which means that formula (A-1) represents a straight-chain structure. R 1 Preferably, it contains no monovalent organic groups that are free of either a triazine backbone or an optionally hydrogenated bisphenol backbone.

[0026] R 1 The constituent atoms are selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, preferably from carbon, hydrogen, oxygen, nitrogen, and silicon atoms. By making R... 1 The presence of oxygen or nitrogen atoms can further improve the adhesion between the cured material (insulating layer) and the conductor layer.

[0027] R 1 The number of constituent atoms is preferably 1 to 200. R 1 The lower limit of the number of constituent atoms is more preferably 5 or more, 10 or more, or 15 or more, further preferably 20 or more, or 25 or more, and particularly preferably 30 or more, or 35 or more. Additionally, in one embodiment, it may be set to 40 or more, 50 or more, 60 or more, 70 or more, 80 or more, 90 or more, 100 or more, 110 or more, or 120 or more. 1 The upper limit of the number of constituent atoms is more preferably 180 or less or 160 or less, further preferably 150 or less or 140 or less, and particularly preferably 130 or less or 125 or less.

[0028] R 1 The preferred number of carbon atoms is 1 to 50. R 1 The lower limit for the number of carbon atoms is more preferably 2 or more, 4 or more, 6 or more, or 8 or more, further preferably 10 or more or 12 or more, and particularly preferably 14 or more, 16 or more, or 18 or more. Additionally, in one embodiment, it may be set to 20 or more, 22 or more, 24 or more, 26 or more, 28 or more, 30 or more, etc. 1 The upper limit of the number of carbon atoms is more preferably 48 or less, 46 or less, or 44 or less, further preferably 42 or less, 40 or less, or 38 or less, and particularly preferably 36 or less, 34 or less, or 32 or less.

[0029] In equation (A-1), R 1Each of the following is preferably a monovalent organic group selected independently from saturated aliphatic groups, aromatic groups, and combinations of saturated aliphatic groups and aromatic groups. Aromatic groups also include aryloxy groups, arylamino groups, arylthio groups, etc., with oxygen atoms, nitrogen atoms, sulfur atoms, etc., bonded to the aromatic ring. As an aromatic group, an aromatic carbocyclic group is preferred. An aromatic carbocyclic group refers to an aromatic group whose backbone atom on the aromatic ring is a carbon atom. That is, in one embodiment, R... 1 More preferably, each is a monovalent organic group selected from saturated aliphatic groups, aromatic carbocyclic groups, and combinations of saturated aliphatic groups and aromatic carbocyclic groups.

[0030] In equation (A-1), R 1 Each of the groups is preferably a monovalent organic group selected from substituted amino and substituted oxygen groups, more preferably a substituted amino group. A "substituted amino" group is a group in which one or two hydrogen atoms of an amino group (-NH2) are replaced by a substituent. A "substituted oxygen" group is a group in which the hydrogen atoms of a hydroxyl group (-OH) are replaced by a substituent.

[0031] Examples of substituted amino groups include "alkylamino" where at least one substituent is an alkyl group and "arylamino" where at least one substituent is an aryl group; alkylamino is preferred. Examples of substituted oxygen groups include "alkoxy" where the substituent is an alkyl group and "aryloxy" where the substituent is an aryl group; aryloxy is preferred. The alkyl and aryl groups may further have substituents.

[0032] Examples of substituted amino groups include "monosubstituted amino groups" where one hydrogen atom of the amino group (-NH2) is replaced by a substituent, and "disubstituted amino groups" where two hydrogen atoms of the amino group (-NH2) are replaced by substituents. Monosubstituted amino groups are preferred. As a monosubstituted amino group, a monoalkyl amino group with an alkyl substituent is preferred. That is, in one embodiment, R... 1 Preferably, it is a monoalkylamino group.

[0033] In one implementation, in equation (A-1), R 1 Each of the components is preferably a monovalent organic group having a silsesquioxane structure. Examples of silsesquioxane structures include random structures, trapezoidal structures with a trapezoidal framework, and cage-like structures, with random or cage-like structures being preferred, and cage-like structures being more preferred.

[0034] Random structures refer to structures where the arrangement of silsesquioxane structures is irregular and incomplete. A representative example of a random structure is the structure shown in equation (B-3). A representative example of a trapezoidal structure is the structure shown in equation (B-4). Cage structures include fully condensed cage structures and incompletely condensed cage structures. A fully condensed cage structure refers to a structure containing multiple ring structures composed of silsesquioxane structures, which can form a closed space or, after a reaction, can form a closed space. An incompletely condensed cage structure refers to a fully condensed cage structure where at least one part is not closed. Representative examples of fully condensed cage structures include the T8 structure with 8 silicon atoms shown in equation (B-5), the T10 structure with 10 silicon atoms shown in equation (B-6), and the T12 structure with 12 silicon atoms shown in equation (B-7). A representative example of an incompletely condensed cage structure is the structure shown in equation (B-8). [Chemical Formula 19] (In equations (B-3) to (B-8), R) b Each of these groups independently represents an alkyl, amino, hydroxyl, glycidyl, epoxy, thiol, alkoxy, (meth)acryloyl, or a combination thereof.

[0035] In equations (B-3) to (B-8), R b Each independently represents an alkyl, amino, hydroxyl, glycidyl, epoxy, thiol, alkoxy, (meth)acryloyl, or a combination thereof. Multiple Rs b They can be the same or different.

[0036] As R b The alkyl group represented can be straight-chain, branched, or cyclic. Preferably, it is an alkyl group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 4 carbon atoms, and even more preferably an alkyl group having 3 or 4 carbon atoms. Examples of alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, isopentyl, hexyl, cyclopentyl, and cyclohexyl, with methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, or tert-butyl being more preferred, n-propyl, isopropyl, n-butyl, or isobutyl, and even more preferably n-propyl or isobutyl.

[0037] As R b The alkoxy group represented is preferably an alkoxy group with 1 to 6 carbon atoms, more preferably an alkoxy group with 1 to 3 carbon atoms, and even more preferably a methoxy or ethoxy group.

[0038] As R bThe term "their combination" can be exemplified by structures such as those shown below. [Chemical Formula 20] (In the formula, * represents a connector.)

[0039] R 1 For example, when the organophosphate group has any sesquioxane structure shown in formulas (B-3) to (B-8) above, the substituent R in formulas (B-3) to (B-8) can be removed. b The monovalent group following one hydrogen atom in the figure is designated as R. 1 .

[0040] The identification of whether a silsesquioxane structure possesses a random, trapezoidal, or cage-like structure can be performed using known methods. For example, the method described in Japanese Patent Application Publication No. 2022-3126 can be used for this identification.

[0041] As R 1 Monosubstituted amino groups in amines can be exemplified by the monovalent group obtained by removing one hydrogen atom from the amino group of a primary amine. As a group satisfying R... 1 Specific examples of monosubstituted amino groups under certain conditions include, for example, the monovalent groups shown in formulas (Y-1-1) to (Y-1-9) below, preferably the monovalent group shown in formula (Y-1-1) or the monovalent group shown in formula (Y-1-5), and more preferably the monovalent group shown in formula (Y-1-1). The monovalent groups shown in formulas (Y-1-1) to (Y-1-5) are also equivalent to monoalkylamino groups, and the monovalent groups shown in formulas (Y-1-6) to (Y-1-9) are also equivalent to monoarylamino groups. [Chemical Formula 21] (In the formula, * represents a connector.)

[0042] As R 1 Disubstituted amino groups in amines can be exemplified by monovalent groups obtained by removing one hydrogen atom from the amino group of a secondary amine. As a result of satisfying R... 1 Specific examples of disubstituted amino groups under certain conditions include, for example, the monovalent groups shown in formulas (Y-2-1) to (Y-2-29). The monovalent groups shown in formulas (Y-2-2) to (Y-2-7) and (Y-2-29) are also equivalent to alkylamino groups, and the monovalent groups shown in formulas (Y-2-8) to (Y-2-29) are also equivalent to arylamino groups. [Chemical Formula 22] (In the formula, * represents a connector.)

[0043] As R 1 Examples of substituted oxygen groups include monovalent groups obtained by removing one hydrogen atom from the hydroxyl group of phenols and monovalent groups obtained by removing one hydrogen atom from the hydroxyl group of alcohols, with the latter being preferred. A monovalent group obtained by removing one hydrogen atom from the hydroxyl group of phenols is equivalent to an aryloxy group. A monovalent group obtained by removing one hydrogen atom from the hydroxyl group of alcohols is equivalent to an alkoxy group, and examples include monovalent groups obtained by removing one hydrogen atom from the hydroxyl group of primary alcohols, secondary alcohols, and tertiary alcohols, with the former being preferred. Specific examples of substituted oxygen groups include monovalent groups shown in formulas (Y-3-1) to (Y-3-23) below. The monovalent groups shown in formulas (Y-3-1) to (Y-3-10) are also equivalent to aryloxy groups, and the monovalent groups shown in formulas (Y-3-11) to (Y-3-23) are also equivalent to alkoxy groups. [Chemical Formula 23] (In the formula, * represents a connector.)

[0044] In formula (A-2), each A independently represents a divalent organic group having an optionally hydrogenated bisphenol skeleton. The optionally hydrogenated bisphenol skeleton is a rigid skeleton, and by giving component (1A) the optionally hydrogenated bisphenol skeleton of formula (A-2), the dielectric loss tangent at high frequencies of the cured product can be reduced. In this invention, "bisphenol" means "a compound having two hydroxyl aryl groups in the molecule," and "bisphenol skeleton" means "the skeleton obtained by removing the two hydroxyl groups from bisphenol." "Optionally hydrogenated bisphenol skeleton" includes "hydrogenated bisphenol skeleton" and "unhydrogenated bisphenol skeleton." In this specification, when referred to only as "bisphenol skeleton," it means "unhydrogenated bisphenol skeleton" unless otherwise specified. In one embodiment, A is preferably a divalent organic group having a bisphenol skeleton.

[0045] Examples of bisphenols in the bisphenol skeleton include bisphenol A, bisphenol AP, bisphenol AF, bisphenol B, bisphenol BP, bisphenol C, bisphenol C2, bisphenol E, bisphenol F, bisphenol G, bisphenol M, bisphenol S, bisphenol P, bisphenol PH, bisphenol TMC, bisphenol Z, bisnaphthol, biphenol, bixylenol, and binaphthol. Biphenol A, bisphenol F, bisphenol AF, bisphenol TMC, or biphenol are preferred, bisphenol A or bisphenol TMC are more preferred, and bisphenol TMC is even more preferred.

[0046] In one embodiment, in formula (A-2), A is preferably a divalent organic group consisting of atoms selected from carbon, hydrogen, oxygen, nitrogen, fluorine, silicon, sulfur, and chlorine atoms as constituent atoms; more preferably, a divalent organic group consisting of atoms selected from carbon, hydrogen, oxygen, nitrogen, fluorine, silicon, and chlorine atoms as constituent atoms; even more preferably, a divalent organic group consisting of atoms selected from carbon, hydrogen, oxygen, nitrogen, fluorine, and silicon atoms as constituent atoms; even more preferably, a divalent organic group consisting of atoms selected from carbon, hydrogen, oxygen, and nitrogen atoms as constituent atoms; even more preferably, a divalent organic group consisting of atoms selected from carbon, hydrogen, and oxygen atoms as constituent atoms; and particularly preferably, a divalent organic group consisting of carbon and hydrogen atoms as constituent atoms.

[0047] In one embodiment, in formula (A-2), the lower limit of the number of constituent atoms of A is preferably 20 or more, more preferably 25 or more or 30 or more, further preferably 35 or more or 40 or more, and particularly preferably 45 or more or 50 or more. Alternatively, in one embodiment, it can be set to 60 or more, 70 or more, 80 or more, 90 or more, 100 or more, etc. The upper limit of the number of constituent atoms of A is preferably 300 or less or 250 or less, more preferably 200 or less or 180 or less, further preferably 160 or less or 140 or less, and particularly preferably 120 or less or 110 or less.

[0048] In one embodiment, in formula (A-2), the number of carbon atoms in A is preferably 12 to 100. The lower limit of the number of carbon atoms in A is more preferably 14 or more or 16 or more, further preferably 18 or more or 20 or more, and particularly preferably 22 or more. Alternatively, in one embodiment, it can be set to 25 or more, 28 or more, 30 or more, 35 or more, 40 or more, 45 or more, etc. The upper limit of the number of carbon atoms in A is more preferably 90 or less or 80 or less, further preferably 70 or less or 60 or less, and particularly preferably 50 or less.

[0049] In one embodiment, in formula (A-2), A is preferably a divalent organic group as shown in formula (A-4). [Chemical Formula 24] (In equation (A-4), ring Ar) 1 Each independently represents an aromatic carbon ring with 6 to 10 carbon atoms, optionally containing substituents. X 1 * Indicates a single bond, or a divalent group consisting of 1 to 200 atoms selected from carbon, hydrogen, oxygen, nitrogen, fluorine, silicon, and sulfur. * Indicates a linking bond.

[0050] In equation (A-4), ring Ar 1 Each independently represents an aromatic carbon ring with 6 to 10 carbon atoms, optionally having substituents. In one embodiment, the cyclic Ar... 1 Each of the components is preferably an aromatic carbon ring with 6 to 10 carbon atoms and having substituents. Examples of aromatic carbon rings with 6 to 10 carbon atoms include benzene rings and naphthalene rings, with benzene rings being preferred.

[0051] As a ring of Ar 1 The aromatic carbon ring having 6 to 10 carbon atoms may optionally contain substituents, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, isobutyl, tert-butyl, cyclopentyl, cyclohexyl, etc., which are straight-chain, branched, or cyclic alkyl groups having 1 to 10 carbon atoms; halogen atoms such as fluorine, chlorine, bromine, iodine, etc.; alkoxy groups having 1 to 10 carbon atoms such as methoxy, ethoxy, propoxy, tert-butoxy, phenoxy, etc.; hydroxyl; trifluoromethyl, etc., which are halogen-substituted alkyl groups; cycloalkyloxy groups; aryl; arylalkyl; monovalent heterocyclic groups; alkylidene groups; amino; silyl; acyl; acyloxy; carboxyl; sulfonyl; cyano; nitro; mercapto; oxo, etc. The above substituents may optionally further contain substituents (hereinafter sometimes referred to as "secondary substituents"). Substituents may be present alone or in combination of two or more.

[0052] In one implementation, ring Ar 1 Preferably, it is an aromatic carbon ring having 6 to 10 carbon atoms, optionally having substituents selected from alkyl groups having 1 to 10 carbon atoms and aryl groups having 1 to 10 carbon atoms; more preferably, it is an aromatic carbon ring having 6 to 10 carbon atoms, optionally having substituents selected from alkyl groups having 1 to 10 carbon atoms; and even more preferably, it is an aromatic carbon ring having 6 to 10 carbon atoms, optionally having substituents selected from alkyl groups having 1 to 10 carbon atoms.

[0053] As a ring of Ar 1 The alkyl substituent is a chain (straight-chain or branched) alkyl or a cyclic alkyl. The number of carbon atoms in the alkyl group is preferably 1 to 10 or 1 to 6, more preferably 1 to 5, further preferably 1 to 3, and particularly preferably 1. Examples of chain alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, isopentyl, hexyl, 2-ethylhexyl, octyl, decyl, etc., preferably methyl, ethyl, n-propyl, isopropyl, or tert-butyl, more preferably methyl or ethyl, and further preferably methyl. Examples of cyclic alkyl groups include cyclopentyl, cyclohexyl, cyclooctyl, etc., preferably cyclohexyl.

[0054] An aryl group is obtained by removing one hydrogen atom from the aromatic ring of an aromatic compound. As a cyclic Ar group... 1The aryl group of the substituent preferably has 1 to 10 carbon atoms, more preferably 3 to 10, even more preferably 5 to 10, and particularly preferably 6 to 10. Examples of aryl groups include phenyl, naphthyl, thiophene, pyrrole, furanyl, furyl, pyridyl, pyridazinyl, pyrimidinyl, pyrazinyl, triazinyl, pyrrolidinyl, piperidinyl, quinolinyl, isoquinolinyl, benzotriazolyl, etc., preferably phenyl, naphthyl, or benzotriazolyl, preferably phenyl or naphthyl, and even more preferably phenyl.

[0055] In equation (A-4), X 1 A divalent group that represents a single bond or has 1 to 200 constituent atoms selected from carbon, hydrogen, oxygen, nitrogen, fluorine, silicon, and sulfur atoms.

[0056] X 1 The constituent atoms of the divalent groups are preferably atoms selected from carbon atoms, hydrogen atoms, oxygen atoms, nitrogen atoms, fluorine atoms and silicon atoms, more preferably atoms selected from carbon atoms, hydrogen atoms, oxygen atoms, nitrogen atoms and silicon atoms, even more preferably atoms selected from carbon atoms, hydrogen atoms, oxygen atoms and nitrogen atoms, even more preferably atoms selected from carbon atoms, hydrogen atoms and oxygen atoms, and particularly preferably carbon atoms and hydrogen atoms.

[0057] In one implementation, X 1 The lower limit of the number of divalent atoms constituting the divalent group is preferably 1 or more, 2 or more, or 3 or more, more preferably 4 or more or 5 or more, further preferably 6 or more or 7 or more, and particularly preferably 8 or more. Alternatively, in one embodiment, it can be set to 10 or more, 12 or more, 14 or more, 16 or more, 18 or more, 20 or more, 22 or more, 24 or more, etc. 1 The upper limit of the number of constituent atoms of the divalent group is preferably 200 or less, 160 or less, 140 or less, 120 or less, 100 or less, 90 or less, or 80 or less, more preferably 70 or less or 60 or less, further preferably 50 or less or 40 or less, and particularly preferably 30 or less or 28 or less.

[0058] X 1 The number of carbon atoms in the divalent group is preferably 1 to 100. 1 The lower limit of the number of carbon atoms in the divalent group is more preferably 2 or more or 3 or more, further preferably 4 or more or 5 or more, and particularly preferably 6 or more, 7 or more or 8 or more. X 2 The upper limit of the number of carbon atoms in the divalent group is more preferably 80 or less or 60 or less, further preferably 50 or less or 40 or less, and particularly preferably 35 or less, 30 or less, 25 or less, 20 or less, 15 or less or 10 or less.

[0059] In one implementation, in equation (A-4), X 1 Preferably, it is an alkylene group having 1 to 20 carbon atoms, an aryl group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms formed by combinations thereof. "Optionally having an oxygen atom, alkylene group" includes "alkylene group without an oxygen atom" and "oxy-alkylene group". In this invention, when only "alkylene group" is used, unless otherwise specified, it refers to "alkylene group without an oxygen atom". Furthermore, "combinations thereof" can be combinations of two or more. Additionally, "combinations thereof" includes combinations of two or more of "optionally having an oxygen atom, alkylene group having 1 to 20 carbon atoms", combinations of two or more of "aryl group having 1 to 20 carbon atoms", and combinations of two or more of both "optionally having an oxygen atom, alkylene group having 1 to 20 carbon atoms" and "aryl group having 1 to 20 carbon atoms". In one embodiment, X 1 Preferably, it is an alkylene group having 1 to 20 carbon atoms, an aryl group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms formed by a combination thereof, and more preferably, it is an alkylene group having 1 to 20 carbon atoms.

[0060] X 1 The lower limit of the number of carbon atoms in the alkylene group is preferably 1 or more or 2 or more, more preferably 3 or more or 4 or more, further preferably 5 or more or 6 or more, and particularly preferably 7 or more or 8 or more. The upper limit of the number of carbon atoms in the alkylene group is preferably 20 or less, more preferably 18 or less, further preferably 16 or less or 14 or less, and particularly preferably 12 or less or 10 or less. Examples of alkylene compounds include methylene, ethylene, ethoxylide, 1,2-propylene, 1,3-propylene, 1,1-propylidene, 2,2-propylidene, 2,2-butylidene, 3-methyl-2,2-butylidene, 1,1-cyclopentadiene, 1,1-cyclohexylidene, and 3,3,5-trimethyl-1,1-cyclohexylidene. Methylene, 2,2-propylidene, or 3,3,5-trimethyl-1,1-cyclohexylidene are preferred, 2,2-propylidene or 3,3,5-trimethyl-1,1-cyclohexylidene are more preferred, and 3,3,5-trimethyl-1,1-cyclohexylidene is even more preferred.

[0061] As X 1 Specific examples of alkylene oxides in this formula can be given by groups such as those shown below. In the formula, "*" indicates a connecting bond, and a represents an integer from 1 to 20. [Chemical Formula 25]

[0062] X 1The arylene group preferably has 1 to 20 carbon atoms. The lower limit of the number of carbon atoms in the arylene group is more preferably 3 or more or 4 or more, further preferably 5 or more, and particularly preferably 6 or more. The upper limit of the number of carbon atoms in the arylene group is more preferably 16 or less or 12 or less, further preferably 10 or less. Examples of arylene groups include phenylene, naphthylene, biphenylene (-C6H4-C6H4-), thiopheneylene, pyrrolylene, furanylene, furanylene, pyridinylene, pyridazinylene, pyrimidinylene, triazinylene, pyrrolylalkylene, piperidinylene, quinolinylene, isoquinolinylene, etc., preferably phenylene, naphthylene, or biphenylene, more preferably phenylene or naphthylene, and even more preferably phenylene.

[0063] X 1 The lower limit of the number of carbon atoms in the divalent group formed by the combination of an alkylene group having 1 to 20 carbon atoms (optionally having oxygen atoms) and an aryl group having 1 to 20 carbon atoms is 2 or more, preferably 3 or more, 4 or more, or 5 or more, more preferably 6 or more, and particularly preferably 7 or more. The upper limit is preferably 30 or less, more preferably 25 or less, further preferably 20 or less, and particularly preferably 15 or less or 12 or less. Examples of divalent groups formed by the combination of an alkylene group having 1 to 20 carbon atoms (optionally having oxygen atoms) and an aryl group having 1 to 20 carbon atoms include the groups shown below. [Chemical Formula 26] (In the formula, * represents a connector.)

[0064] As X 1 When the two connecting bonds of the divalent group in a given structure can take up multiple sites, the connecting bonds can be in any position. Alternatively, X can be removed. 1 The structure is formed by hydrogen atoms in the substituents, creating a linking bond. For example, in X... 1 In the case of hexanediol, it can be any of 1,2-hexanediol, 1,3-hexanediol, 1,4-hexanediol, 1,5-hexanediol, 1,6-hexanediol (hexamethylene), 2,3-hexanediol, 2,4-hexanediol, 2,5-hexanediol, 3,4-hexanediol, etc. Additionally, for example, in X... 1 If it is phenylene, it can be any one of 1,2-phenylene, 1,3-phenylene, or 1,4-phenylene.

[0065] As a specific example of A shown in the above formula (A-4), examples include divalent organic groups shown in formulas (A-4-1) to (A-4-39), preferably divalent organic groups shown in formula (A-4-1), formula (A-4-26), formula (A-4-27), formula (A-4-28), or formula (A-4-39), more preferably divalent organic groups shown in formula (A-4-27) or formula (A-4-28), and even more preferably divalent organic groups shown in formula (A-4-28). [Chemical Formula 27] (In the formula, * represents a connector.)

[0066] In one embodiment, in formula (A-2), A is preferably a divalent organic group as shown in formula (A-5). [Chemical Formula 28] (In equation (A-5), ring Ar) 2 Each independently represents an aromatic carbon ring with 6 to 10 carbon atoms, optionally containing substituents. X 2 R represents a divalent group consisting of 1 to 200 constituent atoms selected from carbon, hydrogen, and oxygen atoms. 4 Each of these can independently represent an alkylene group having 1 to 20 carbon atoms, an aryl group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms formed by combinations thereof. R 5 and R 6 Each can independently represent an alkyl group having 1 to 20 carbon atoms, or an aryl group having 1 to 20 carbon atoms. Additionally, R... 5 and R 6 They can be connected to form a loop. * indicates a connecting key.

[0067] In equation (A-5), ring Ar 2 Each independently represents an aromatic carbon ring with 6 to 10 carbon atoms, optionally having substituents, and is related to the ring Ar in formula (A-4). 1 same.

[0068] In equation (A-5), X 2 It refers to a divalent group consisting of 1 to 200 constituent atoms selected from carbon, hydrogen, and oxygen atoms.

[0069] X 2 The divalent groups in X are preferably composed of carbon and hydrogen atoms. 2The lower limit of the number of constituent atoms is preferably 1 or more, 2 or more, or 3 or more, more preferably 4 or more or 5 or more, further preferably 6 or more or 7 or more, and particularly preferably 8 or more or 9 or more. Additionally, in one embodiment, it can be set to 10 or more, 15 or more, 20 or more, 25 or more, 30 or more, 35 or more, 40 or more, etc. 2 The upper limit of the number of constituent atoms is preferably 200 or less, 180 or less, or 160 or less, more preferably 140 or less, or 120 or less, even more preferably 100 or less, or 80 or less, and particularly preferably 60 or less, 50 or less, or 45 or less.

[0070] X 2 The number of carbon atoms in the divalent group is preferably 1 to 100. 2 The lower limit for the number of carbon atoms in the divalent group is preferably 2 or more or 3 or more, more preferably 4 or more or 5 or more. Alternatively, in one embodiment, it may be set to 6 or more, 8 or more, 10 or more, 12 or more, 14 or more, 16 or more, 18 or more, etc. 2 The upper limit of the number of carbon atoms in the divalent group is more preferably 80 or less or 60 or less, further preferably 50 or less or 40 or less, and particularly preferably 35 or less, 30 or less, 25 or less or 20 or less.

[0071] In one implementation, in equation (A-5), X 2 Preferably, the oxygen atom, an alkylene group having 1 to 50 carbon atoms, an aryl group having 1 to 20 carbon atoms with an alkyl group having 1 to 6 carbon atoms as a substituent, or a divalent group having 2 to 60 carbon atoms formed by combinations thereof. "Combinations thereof" can be combinations of two or more. Furthermore, "combinations thereof" can be combinations of two or more of the same kind among "oxygen atom," "alkylene group having 1 to 50 carbon atoms," and "aryl group having 1 to 20 carbon atoms with an alkyl group having 1 to 6 carbon atoms as a substituent," or combinations of two or more different kinds. In one embodiment, X 2 Preferably, it is an alkylene group having 1 to 50 carbon atoms, an aryl group having 1 to 20 carbon atoms with an alkyl group having 1 to 6 carbon atoms as a substituent, or a divalent group having 2 to 60 carbon atoms formed by a combination of the above. More preferably, it is a divalent group having 2 to 60 carbon atoms formed by a combination of an alkylene group having 1 to 50 carbon atoms and an aryl group having 1 to 20 carbon atoms with an alkyl group having 1 to 6 carbon atoms as a substituent.

[0072] X 2The alkylene group preferably has 1 to 50 or 1 to 40 carbon atoms, more preferably 1 to 30 or 1 to 20, even more preferably 1 to 10 or 1 to 6, and particularly preferably 1 to 5. Examples of alkylene groups include methylene, ethylene, ethoxylide, 1,2-propylene, 1,3-propylene, 1,4-butylene, 1,6-hexylene, 2,2,4-trimethyl-1,6-hexylene, 1,1-propylidene, 2,2-propylidene, and alkylene groups having a carbon skeleton derived from a dimer acid, with methylene or 2,2-propylidene being preferred.

[0073] The carbon skeleton derived from dimer acids refers to the carbon skeleton obtained by removing the two terminal carboxyl groups (-COOH) of the dimer acid, or by replacing the two terminal carboxyl groups (-COOH) with methylene groups (-CH2-). Dimer acids are known compounds obtained by dimerizing unsaturated fatty acids (preferably unsaturated fatty acids with 11 to 22 carbon atoms, more preferably unsaturated fatty acids with 14 to 20 carbon atoms, and particularly preferably unsaturated fatty acids with 18 carbon atoms), and their industrial manufacturing process is almost standardized in the industry. For dimer acids, it is easy to obtain substances with 36 carbon atoms as the main component, obtained by dimerizing particularly inexpensive and readily available 18-carbon unsaturated fatty acids such as oleic acid and linoleic acid. In addition, depending on the manufacturing method, degree of purification, etc., dimer acids sometimes contain arbitrary amounts of monomeric acids, trimer acids, other polymeric fatty acids, etc. In addition, double bonds remain after the polymerization reaction of unsaturated fatty acids, but in this specification, hydrides that further undergo hydrogenation reactions to reduce the degree of unsaturation are also included in dimer acids.

[0074] X 2 The lower limit of the number of carbon atoms in the arylene group is preferably 3 or more or 4 or more, more preferably 5 or more, and even more preferably 6 or more. The upper limit of the number of carbon atoms in the arylene group is more preferably 16 or less or 12 or less, and even more preferably 10 or less or 8 or less. Examples of arylene groups include phenylene, naphthylene, biphenylene (-C6H4-C6H4-), thiophene, pyrrolylene, furanyl, furanyl, pyridinyl, pyridazinyl, pyrimidinyl, pyrazinyl, triazinyl, pyrrolylalkyl, piperidinyl, quinolinyl, isoquinolinyl, etc., preferably phenylene, naphthylene, or biphenylene, more preferably phenylene or naphthylene, and even more preferably phenylene.

[0075] As X 2The alkyl substituent in the arylene group is a chain (straight-chain or branched) alkyl or a cyclic alkyl. The alkyl group preferably has 1 to 6 carbon atoms, more preferably 1 to 5, further preferably 1 to 3, and particularly preferably 1 or 2. Examples of chain alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, isopentyl, and hexyl, with methyl, ethyl, n-propyl, or isopropyl being preferred, more preferably methyl or ethyl, and further preferably methyl. Examples of cyclic alkyl groups include cyclopentyl and cyclohexyl.

[0076] X 2 The lower limit of the number of carbon atoms in the divalent group formed by the combination of an oxygen atom, an alkylene group having 1 to 50 carbon atoms, and an aryl group having 1 to 20 carbon atoms as a substituent (optionally having 1 to 6 carbon atoms) is 2 or more, preferably 3 or more, 4 or more, or 5 or more, more preferably 6 or more, or 7 or more, further preferably 8 or more, 10 or more, 12 or more, or 14 or more, and particularly preferably 16 or more, or 18 or more. The upper limit is preferably 60 or less, 50 or less, 45 or less, or 40 or less, more preferably 35 or less, or 30 or less, further preferably 28 or less, or 25 or less, and particularly preferably 22 or less, or 20 or less. Examples of divalent groups formed by the combination of an alkylene group having 1 to 50 carbon atoms and an aryl group having 1 to 20 carbon atoms as a substituent (optionally having 1 to 6 carbon atoms) are the groups shown below. [Chemical Formula 29] (In the formula, * represents a connector.)

[0077] In one implementation, in equation (A-5), X 2 Preferably, it is a divalent group having 6 to 100 carbon atoms in an aromatic hydrocarbon ring. The aromatic hydrocarbon ring is preferably a benzene ring or a naphthalene ring, more preferably a benzene ring.

[0078] In one implementation, in equation (A-5), X 2 Preferably, it is a divalent group having a trimethylindene skeleton, preferably a divalent group shown in the following formula (A-9). [Chemical Formula 30] (In equation (A-9), R) a1 and R a2 Each substituent can be represented independently. a1 Represents a positive integer. n a2 Each of the n integers from 0 to 4 can be represented independently. a3 Each element independently represents an integer from 0 to 3. * represents a concatenation key. In a given number of R... a1In the case of multiple Rs, they can be the same or different. a2 In this case, they can be the same or different.

[0079] In equation (A-9), R a1 Indicates a substituent. As a result of R a1 The substituents indicated are preferably alkyl groups having 1 to 10 carbon atoms, alkyloxy groups having 1 to 10 carbon atoms, alkylthio groups having 1 to 10 carbon atoms, aryl groups having 6 to 10 carbon atoms, aryloxy groups having 6 to 10 carbon atoms, arylthio groups having 6 to 10 carbon atoms, cycloalkyl groups having 3 to 10 carbon atoms, halogen atoms, nitro groups, hydroxyl groups, or mercapto groups. The hydrogen atoms of each substituent may optionally be further substituted with halogen atoms.

[0080] Among them, R a1 More preferably, it is one or more groups selected from alkyl groups having 1 to 4 carbon atoms, cycloalkyl groups having 3 to 6 carbon atoms, and aryl groups having 6 to 10 carbon atoms; even more preferably, it is an alkyl group having 1 to 4 carbon atoms.

[0081] In equation (A-9), R a2 Indicates a substituent. As a result of R a2 The substituents indicated are preferably alkyl groups having 1 to 10 carbon atoms, alkyloxy groups having 1 to 10 carbon atoms, alkylthio groups having 1 to 10 carbon atoms, aryl groups having 6 to 10 carbon atoms, aryloxy groups having 6 to 10 carbon atoms, arylthio groups having 6 to 10 carbon atoms, cycloalkyl groups having 3 to 10 carbon atoms, halogen atoms, hydroxyl groups, or mercapto groups. The hydrogen atoms of each substituent may optionally be further substituted with halogen atoms.

[0082] Among them, R a2 More preferably, it is one or more groups selected from alkyl groups having 1 to 4 carbon atoms, cycloalkyl groups having 3 to 6 carbon atoms, and aryl groups having 6 to 10 carbon atoms.

[0083] In equation (A-9), n a1 Represents a positive integer. n a1 Preferably, it is 1 or more, more preferably 10 or less, and even more preferably 8 or less.

[0084] In equation (A-9), n a2 Each of the n integers from 0 to 4 can be represented independently. a2 Preferably 2 or 3, more preferably 2. Multiple n a2 They can be different, but it is preferable that they are the same. a2 When the value is 2 or higher, multiple R a1 They can be the same or different.

[0085] In equation (A-9), n a3 Represents integers from 0 to 3.a3 When there are multiple n, they can be different, but it is preferable that they are the same as each other. a3 The preferred value is 0.

[0086] As shown in the above formula (A-9), X 2 Specific examples can be given, such as the following examples. [Chemical Formula 31] (In the formula, * represents a connector.)

[0087] As X 2 When the two connecting bonds of the divalent group in a given structure can take up multiple sites, the connecting bonds can be in any position. Alternatively, X can be removed. 2 The structure is formed by hydrogen atoms in the substituents, creating a linking bond. For example, in X... 2 In the case of hexanediol, it can be any of 1,2-hexanediol, 1,3-hexanediol, 1,4-hexanediol, 1,5-hexanediol, 1,6-hexanediol (hexamethylene), 2,3-hexanediol, 2,4-hexanediol, 2,5-hexanediol, 3,4-hexanediol, etc. Additionally, for example, in X... 2 If it is phenylene, it can be any one of 1,2-phenylene, 1,3-phenylene, or 1,4-phenylene.

[0088] In equation (A-5), R 4 Each of these groups independently represents an alkylene group having 1 to 20 carbon atoms, an aryl group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms formed by combinations thereof. "Combinations thereof" can be combinations of two groups or combinations of three or more groups. Furthermore, "combinations thereof" includes combinations of two or more "alkylene groups having 1 to 20 carbon atoms," combinations of two or more "aryl groups having 1 to 20 carbon atoms," and combinations of two or more groups containing both "alkylene groups having 1 to 20 carbon atoms" and "aryl groups having 1 to 20 carbon atoms." In one embodiment, R... 4 Each of the components is preferably an alkylene group having 1 to 20 carbon atoms or an aryl group having 1 to 20 carbon atoms, and more preferably an alkylene group having 1 to 20 carbon atoms.

[0089] R 4The alkylene group is a chain-like (straight-chain or branched) alkylene group or a cyclic alkylene group. The number of carbon atoms in the alkylene group is preferably 1 to 20. The lower limit of the number of carbon atoms in the alkylene group is more preferably 2 or more. The upper limit of the number of carbon atoms in the alkylene group is more preferably 18 or less or 16 or less, further preferably 14 or less or 12 or less, and particularly preferably 10 or less, 8 or less, 6 or less, 4 or less, or 3 or less. Examples of chain-like alkylene groups include methylene, ethylene, propylene, butylene, isobutylene, pentylene, hexylene, heptylene, octylene, nonylene, and decylene, with methylene, ethylene, propylene, or butylene being preferred, and ethylene being more preferred. Examples of cyclic alkylene groups include cyclopropylene, cyclobutylene, cyclopentylene, cyclohexylene, decahydronaphthylene, norbornene, dicyclopentylene, and adamantylene, with cyclohexylene being preferred.

[0090] R 4 The arylene group is a group obtained by removing two hydrogen atoms from the aromatic ring of an aromatic compound. The number of carbon atoms in the arylene group is preferably 1 to 20. The lower limit of the number of carbon atoms in the arylene group is preferably 3 or more or 4 or more, more preferably 5 or more, and even more preferably 6 or more. The upper limit of the number of carbon atoms in the arylene group is more preferably 16 or less or 12 or less, and even more preferably 10 or less or 8 or less. Examples of arylene groups include, for example, phenylene, naphthylene, biphenylene (-C6H4-C6H4-), thiopheneyl, pyrrolylene, furanyl, furanyl, pyridinyl, pyridinyl, pyrimidinyl, pyrazinyl, triazinyl, pyrrolylalkyl, piperidinyl, quinolinyl, isoquinolinyl, etc., preferably phenylene, naphthylene, or biphenylene, more preferably phenylene or naphthylene, and even more preferably phenylene.

[0091] R 4 The lower limit of the number of carbon atoms in the divalent group formed by the combination of an alkylene group having 1 to 20 carbon atoms and an arylene group having 1 to 20 carbon atoms is 2 or more, preferably 3 or more, 4 or more, or 5 or more, more preferably 6 or more, and particularly preferably 7 or more. The upper limit is preferably 30 or less, more preferably 25 or less, further preferably 20 or less, and particularly preferably 15 or less or 12 or less. Examples of divalent groups formed by the combination of an alkylene group having 1 to 20 carbon atoms and an arylene group having 1 to 20 carbon atoms include the groups shown below. [Chemical Formula 32] (In the formula, * represents a connector.)

[0092] As R 4 When the two connecting bonds of a divalent group in R can take up multiple sites, the connecting bonds can be in any position. For example, in R 4In the case of hexanediol, it can be any of 1,2-hexanediol, 1,3-hexanediol, 1,4-hexanediol, 1,5-hexanediol, 1,6-hexanediol (hexamethylene), 2,3-hexanediol, 2,4-hexanediol, 2,5-hexanediol, 3,4-hexanediol, etc. Additionally, for example, in R... 4 If it is phenylene, it can be any one of 1,2-phenylene, 1,3-phenylene, or 1,4-phenylene.

[0093] Among them, as R 4 Preferably, it is ethylene, phenylene, or xylene, and more preferably ethylene.

[0094] In equation (A-5), R 5 and R 6 Each of the above can independently represent an alkyl group having 1 to 20 carbon atoms, or an aryl group having 1 to 20 carbon atoms. In one embodiment, R 5 and R 6 Alkyl groups having 1 to 20 carbon atoms are preferred individually.

[0095] R 5 and R 6 The alkyl group is a chain (straight-chain or branched) alkyl group or a cyclic alkyl group. The number of carbon atoms in the alkyl group is preferably 1 to 20 or 1 to 10, more preferably 1 to 6, further preferably 1 to 5 or 1 to 3, and particularly preferably 1 or 2. Examples of chain alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, isopentyl, hexyl, 2-ethylhexyl, octyl, decyl, etc., preferably methyl, ethyl, n-propyl, or isopropyl, more preferably methyl or ethyl, and further preferably ethyl. Examples of cyclic alkyl groups include cyclopentyl, cyclohexyl, cyclooctyl, etc.

[0096] R 5 and R 6 The aryl group preferably has 1 to 20 or 1 to 10 carbon atoms, more preferably 3 to 10, further preferably 5 to 10, and particularly preferably 6 to 10. Examples of aryl groups include phenyl, naphthyl, thiophene, pyrrole, furanyl, furanyl, pyridinyl, pyridazinyl, pyrimidinyl, pyrazinyl, triazinyl, pyrrolidinyl, piperidinyl, quinolinyl, isoquinolinyl, etc., preferably phenyl or naphthyl, and more preferably phenyl.

[0097] In equation (A-5), R 5 and R 6They can be linked to form a ring, preferably linked to form a ring. Examples of the formed ring include 5-membered rings, 6-membered rings, and 7-membered rings, with 6-membered rings being preferred. In the case of forming a ring, it is sufficient to form a structure in which one hydrogen atom is removed from the above-mentioned "alkyl group having 1 to 20 carbon atoms or aryl group having 1 to 20 carbon atoms" to form a divalent group, and then bonded to the two nitrogen atoms in formula (A-5).

[0098] In one embodiment, in formula (A-2), A is preferably a divalent organic group as shown in formula (A-10). That is, in the divalent organic group shown in formula (A-5) above, R 5 and R 6 A suitable embodiment in the case where the linkage forms a ring is a divalent organic group as shown in the following formula (A-10). [Chemical Formula 33] (In equation (A-10), ring Ar) 2 Each independently represents an aromatic carbon ring with 6 to 10 carbon atoms, optionally containing substituents. X 2 This indicates a divalent group consisting of 1 to 200 atoms selected from carbon, hydrogen, and oxygen atoms. * indicates a linking bond.

[0099] In equation (A-10), ring Ar 2 Each independently represents an aromatic carbon ring with 6 to 10 carbon atoms, optionally having substituents, which, along with the ring Ar in formula (A-5), represents an aromatic carbon ring. 2 same.

[0100] In equation (A-10), X 2 This refers to a divalent group consisting of 1 to 200 constituent atoms selected from carbon, hydrogen, and oxygen atoms, which, together with X in formula (A-5), represents a divalent group. 2 same.

[0101] As a specific example of A shown in formula (A-5) above, examples include divalent organic groups shown in formulas (A-5-1) to (A-5-17) below, preferably divalent organic groups shown in formula (A-5-1) or formula (A-5-3), and more preferably divalent organic groups shown in formula (A-5-3). The divalent organic groups shown in formulas (A-5-1) to (A-5-13) below are also specific examples of the divalent organic groups shown in formula (A-10). Furthermore, the divalent organic groups shown in formulas (A-5-1) to (A-5-13) and (A-5-16) are equivalent to R in formula (A-5). 5 and R 6 A concrete example of a loop formed by connecting links. [Chemical Formula 34] (In the formula, * indicates a connecting bond.) [Chemical Formula 35] (In the formula, * represents a connector.) [Chemical Formula 36] (In the formula, * represents a connector.)

[0102] In one embodiment, component (1A) preferably has two or more structural units of formula (A-2) with different A values, and more preferably the two or more A values ​​include divalent groups of formula (A-4) and divalent groups of formula (A-5).

[0103] When the number of divalent groups shown in formula (A-5) in component (1A) is set to M5 and the number of divalent groups shown in formula (A-4) is set to M4, the ratio of M5 to M4 (M5 / M4) is preferably 0.05 to 5. By making the ratio (M5 / M4) within the above range, the dielectric loss tangent of the cured material can be further reduced, and the adhesion between the cured material (insulating layer) and the conductor layer can be further improved. The lower limit of the ratio (M5 / M4) is more preferably 0.08 or more or 0.1 or more, more preferably 0.12 or more or 0.15 or more, and particularly preferably 0.18 or more, 0.2 or more, 0.25 or more, or 0.3 or more. The upper limit of the ratio (M5 / M4) is more preferably 4 or less or 3 or less, more preferably 2 or less or 1 or less, and particularly preferably 0.8 or less, 0.6 or less, 0.5 or less, or 0.4 or less.

[0104] (1A) The component preferably has, in addition to the structural units shown in formula (A-1) and formula (A-2) above, the structural unit shown in formula (A-6) below. The structural unit shown in formula (A-6) is preferably combined with the structural unit shown in formula (A-2). In one embodiment, the structural unit shown in formula (A-2) is preferably combined with the structural unit shown in formula (A-6). [Chemical Formula 37] (In equation (A-6), R) 2 Each is an independent monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms. 2 The molecular weight is less than 250, R 2 It does not have an olefinic unsaturated group, R 2It does not contain at least one of a triazine backbone and an optionally hydrogenated bisphenol backbone.

[0105] In equation (A-6), R 2 Each is an independent monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms. 2 The molecular weight is less than 250, R 2 It does not have an olefinic unsaturated group, R 2 It does not contain at least one of a triazine backbone and an optional hydrogenated bisphenol backbone.

[0106] In one implementation, R 2 The molecular weight is preferably 240 or less or 230 or less, more preferably 220 or less or 210 or less, even more preferably 200 or less, 190 or less or 180 or less, and particularly preferably 170 or less, 160 or less or 150 or less.

[0107] R 2 It does not contain at least one of a triazine backbone and an optionally hydrogenated bisphenol backbone, which means that formula (A-6) represents a linear structure. R 2 Preferably, it is free of monovalent organic groups, including both the triazine skeleton and the optionally hydrogenated bisphenol skeleton.

[0108] R 2 The constituent atoms are selected from carbon atoms, hydrogen atoms, oxygen atoms, nitrogen atoms, silicon atoms, and sulfur atoms; more preferably, they are selected from carbon atoms, hydrogen atoms, oxygen atoms, nitrogen atoms, and silicon atoms; even more preferably, they are selected from carbon atoms, hydrogen atoms, oxygen atoms, and nitrogen atoms; and particularly preferably, they are selected from carbon atoms, hydrogen atoms, and oxygen atoms. By making R... 2 The presence of oxygen or nitrogen atoms can further improve the adhesion between the cured material (insulating layer) and the conductor layer.

[0109] R 2 The preferred number of constituent atoms is 1 to 50. R 2 The lower limit of the number of constituent atoms is more preferably 2 or more, 4 or more, 6 or more, or 8 or more, further preferably 10 or more or 12 or more, and particularly preferably 14 or more or 16 or more. 2 The upper limit of the number of constituent atoms is more preferably 48 or less or 46 or less, further preferably 44 or less or 42 or less, and particularly preferably 40 or less or 38 or less. In addition, in one embodiment, it may be set to 35 or less, 30 or less, 25 or less, 20 or less, etc.

[0110] R 2 The preferred number of carbon atoms is 1 to 20. R 2The lower limit for the number of carbon atoms is more preferably 2 or more or 3 or more, further preferably 4 or more or 5 or more, and particularly preferably 6 or more, 7 or more, 8 or more or 9 or more. 2 The upper limit of the number of carbon atoms is more preferably 18 or less, further preferably 16 or less, and particularly preferably 14 or less or 12 or less.

[0111] In equation (A-6), R 2 Each and every one of these groups is preferably a monovalent organic group selected from saturated aliphatic groups, aromatic groups, and combinations of saturated aliphatic groups and aromatic groups. Aromatic groups further include aryloxy groups, arylamino groups, and arylthio groups, which are formed by bonding oxygen atoms, nitrogen atoms, sulfur atoms, etc., to the aromatic ring. As an aromatic group, an aromatic carbocyclic group is preferred. An aromatic carbocyclic group refers to an aromatic group whose backbone atom on the aromatic ring is a carbon atom. That is, in one embodiment, R... 2 More preferably, each is a monovalent organic group selected independently from saturated aliphatic groups, aromatic carbocyclic groups, and combinations of saturated aliphatic groups and aromatic carbocyclic groups.

[0112] In equation (A-6), R 2 Each of the groups is preferably a monovalent organic group selected from substituted amino and substituted oxygen groups, more preferably a substituted oxygen group. A "substituted amino" group is a group in which one or two hydrogen atoms of an amino group (-NH2) are replaced by a substituent. A "substituted oxygen" group is a group in which the hydrogen atoms of a hydroxyl group (-OH) are replaced by a substituent.

[0113] Examples of substituted amino groups include "alkylamino" (where at least one substituent is alkyl) and "arylamino" (where at least one substituent is aryl), with alkylamino being preferred. Examples of substituted oxygen groups include "alkoxy" (where the substituent is alkyl) and "aryloxy" (where the substituent is aryl), with aryloxy being preferred. Examples of aryloxy groups include phenoxy or naphthoxy. Examples of naphthoxy groups include 1-naphthoxy and 2-naphthoxy, with 1-naphthoxy being preferred. The alkyl and aryl groups may further have substituents.

[0114] Examples of substituted amino groups include "monosubstituted amino groups" where one hydrogen atom of the amino group (-NH2) is replaced by a substituent, and "disubstituted amino groups" where two hydrogen atoms of the amino group (-NH2) are replaced by substituents. Monosubstituted amino groups are preferred. As a monosubstituted amino group, a monoalkyl amino group with an alkyl substituent is preferred. As R 2 Monosubstituted amino groups can be exemplified by the monovalent groups obtained by removing one hydrogen atom from the amino group of a primary amine.

[0115] That is, in one implementation, R 2Preferably, it is aryloxy or monoalkylamino, more preferably aryloxy, further preferably phenoxy or naphthoxy, and particularly preferably naphthoxy.

[0116] As R 2 Specific examples include monovalent groups represented by formulas (Y-4-1) to (Y-4-37), preferably monovalent groups represented by formulas (Y-4-9), (Y-4-10), (Y-4-11), or (Y-4-12), more preferably monovalent groups represented by formulas (Y-4-9) or (Y-4-12), and even more preferably monovalent groups represented by formulas (Y-4-9). The monovalent groups represented by formulas (Y-4-1) to (Y-4-10) and (Y-4-16) to (Y-4-37) are also equivalent to aryloxy groups. The monovalent groups represented by formulas (Y-4-11) to (Y-4-13) are also equivalent to monoalkylamino groups. [Chemical Formula 38] (In the formula, * represents a connector.)

[0117] When the number of repetitions of the structural unit shown in formula (A-1) in component (1A) is set to N1, the number of repetitions of the structural unit shown in formula (A-2) is set to N2, the number of repetitions of the structural unit shown in formula (A-6) is set to N6, and the number of repetitions of other structural units is set to N0 when other structural units are present, the ratio α defined by the following formula (1) is preferably 0.9 to 1. The lower limit of α is more preferably 0.91 or more, 0.92 or more, or 0.93 or more, further preferably 0.94 or more, 0.95 or more, or 0.96 or more, and particularly preferably 0.97 or more, 0.98 or more, or 0.99 or more. [Mathematical Expression 2]

[0118] In one embodiment, when the number of repetitions of the structural unit shown in formula (A-1) in component (1A) is set to N1 and the number of repetitions of the structural unit shown in formula (A-6) is set to N6, the ratio of N6 to N1 (N6 / N1) is preferably 0.1 to 20. The lower limit of the ratio (N6 / N1) is preferably 0.2 or more or 0.4 or more, more preferably 0.6 or more or 0.8 or more, further preferably 1 or more or 1.2 or more, and particularly preferably 1.4 or more, 1.6 or more or 1.8 or more. The upper limit of the ratio (N6 / N1) is preferably 18 or less or 16 or less, more preferably 14 or less or 12 or less, further preferably 10 or less or 8 or less, and particularly preferably 6 or less, 4 or less, 3 or less or 2.5 or less.

[0119] In one embodiment, component (1A) is preferably a polymer having the structural unit shown in the following formula (A-3). [Chemical Formula 39] (In equation (A-3), R) 1 Each is an independent monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms. 1 The molecular weight is above 250, R 1 It does not have an olefinic unsaturated group, R 1 It does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. A independently represents a divalent organic group having an optionally hydrogenated bisphenol skeleton.

[0120] In equation (A-3), R 1 Each is an independent monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms. 1 The molecular weight is above 250, R 1 It does not have an olefinic unsaturated group, R 1 It does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. R in formula (A-3) 1 R in equation (A-1) 1 same.

[0121] In formula (A-3), A independently represents a divalent organic group having an optional hydrogenated bisphenol skeleton, which is the same as A in formula (A-2).

[0122] In one embodiment, component (1A) preferably has, in addition to having the structural unit shown in formula (A-3) above, the structural unit shown in formula (A-7) below. [Chemical Formula 40] (In equation (A-7), R) 2 Each is an independent monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms. 2 The molecular weight is less than 250, R 2 It does not have an olefinic unsaturated group, R 2 It does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. A independently represents a divalent organic group having an optionally hydrogenated bisphenol skeleton.

[0123] In equation (A-7), R 2Each is an independent monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms. 2 The molecular weight is less than 250, R 2 It does not have an olefinic unsaturated group, R 2 It does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. R in formula (A-7) 2 R in equation (A-6) 2 same.

[0124] In formula (A-7), each A independently represents a divalent organic group having an optional hydrogenated bisphenol skeleton, which is the same as A in formula (A-2).

[0125] In one embodiment, component (1A) is preferably a polymer having the structure shown in formula (A-8). [Chemical Formula 41] (In equation (A-8), n1 represents an integer greater than or equal to 1, and n2 represents an integer greater than or equal to 0. R) 1 R 2 R and R are each independently monovalent organic groups composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms. 1 The molecular weight is above 250, R 2 The molecular weight is less than 250, R 1 R 2 R does not have an olefinic unsaturated group, R 1 R 2 R does not contain at least one of a triazine skeleton or an optionally hydrogenated bisphenol skeleton. A independently represents a divalent organic group having an optionally hydrogenated bisphenol skeleton.

[0126] In formula (A-8), n1 represents an integer greater than or equal to 1. The upper limit of n1 is preferably 110 or less, 100 or less, 90 or less, 80 or less, 70 or less, 60 or less, 50 or less, or 40 or less, more preferably 35 or less or 30 or less, further preferably 25 or less or 20 or less, and particularly preferably 15 or less or 10 or less.

[0127] In formula (A-8), n2 represents an integer greater than or equal to 0. The lower limit of n2 is preferably greater than or equal to 1. The upper limit of n2 is preferably less than or equal to 110, less than or equal to 100, less than or equal to 90, less than or equal to 80, less than or equal to 70, less than or equal to 60, less than or equal to 50, or less than or equal to 40, more preferably less than or equal to 35 or less, even more preferably less than or equal to 25 or less, or particularly preferably less than or equal to 15 or less.

[0128] The sum of n1 and n2 (n1+n2) is preferably 1 to 110. The upper limit of n1+n2 is more preferably 100 or less, 90 or less, 80 or less, 70 or less, 60 or less, 50 or less, 40 or less, 35 or less, or 30 or less, further preferably 25 or less or 20 or less, and particularly preferably 15 or less or 10 or less.

[0129] In equation (A-8), R 1 R 2 R and R are each independently monovalent organic groups composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms. 1 The molecular weight is above 250, R 2 The molecular weight is less than 250, R 1 R 2 R does not have an olefinic unsaturated group, R 1 R 2 R is free from at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. R in formula (A-8) 1 R in equation (A-1) 1 Same. R in equation (A-8) 2 R in equation (A-6) 2 The same. The preferred form of R in equation (A-8) is to combine R from equation (A-1). 1 The preferred method is the same as R in equation (A-6) 2 The preferred method is that R can be either a molecular weight of 250 or higher, or a molecular weight of less than 250. In formula (A-8), by giving the terminal portion R, n1 and n2 in formula (A-8) can be adjusted to an appropriate range.

[0130] Specific examples of component (1A) include polymers such as those shown in formulas (A-8-1) to (A-8-4) below. [Chemical Formula 42] [Chemical Formula 43] [Chemical Formula 44] [Chemical Formula 45]

[0131] (1A) The weight-average molecular weight of component (MA) is preferably 1,000 to 50,000. The lower limit of MA is more preferably 1,200 or more, further preferably 1,400 or more, 1,500 or more, or 2,000 or more, and even more preferably 2,500 or more, 3,000 or more, 3,500 or more, or 4,000 or more. The upper limit of MA is more preferably 45,000 or less, 40,000 or less, 35,000 or less, 30,000 or less, 25,000 or less, 20,000 or less, 15,000 or less, or 12,000 or less, and even more preferably 10,000 or less or 9,000 or less. In one embodiment, it may be set to 7,500 or less or 6,000 or less. The weight-average molecular weight of the resin can be determined by gel permeation chromatography (GPC) as a value converted from polystyrene.

[0132] When the non-volatile component in the resin composition is set to 100% by mass, from the viewpoint of significantly obtaining the effects of the present invention, the content of component (1A) in the resin composition is preferably 1% by mass or more, more preferably 3% by mass or more or 5% by mass or more, further preferably 6% by mass or more, 8% by mass or more or 10% by mass or more, and particularly preferably 12% by mass or more or 14% by mass or more. The upper limit is preferably 30% by mass or less or 28% by mass or less, more preferably 26% by mass or less or 24% by mass or less, further preferably 22% by mass or less or 20% by mass or less, and particularly preferably 18% by mass or less. In one embodiment, when the non-volatile component in the resin composition is set to 100% by mass, the content of component (1A) is preferably 1 to 30% by mass. In the present invention, the term "non-volatile component" in relation to the resin composition refers to the component constituting the resin composition other than the organic solvent described later.

[0133] When the resin component in the resin composition is set to 100% by mass, from the viewpoint of significantly obtaining the effects of the present invention, the content of component (1A) in the resin composition is preferably 2% by mass or more or 5% by mass or more, more preferably 10% by mass or more, 15% by mass or more or 20% by mass or more, further preferably 25% by mass or more, 30% by mass or more or 35% by mass or more, particularly preferably 40% by mass or more, 45% by mass or more or 50% by mass or more. The upper limit is preferably 90% by mass or less, more preferably 85% by mass or less or 80% by mass or less, further preferably 75% by mass or less or 70% by mass or less, particularly preferably 65% ​​by mass or less or 60% by mass or less. In the present invention, the term "resin component" in relation to the resin composition refers to the component remaining after removing the inorganic filler material from the non-volatile components constituting the resin composition.

[0134] <(1A) Method for manufacturing a polymer having a first specific structure> There are no restrictions on the method of manufacturing component (1A). Component (1A) can be obtained, for example, by reacting cyanuric chloride, optionally hydrogenated bisphenols, the compound shown in formula (X-1) below, and monophenols. [Chemical Formula 46] (In equation (X-1), R) 1 It is a monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms. 1 The molecular weight is above 250, R 1 It does not have an olefinic unsaturated group, R 1 It does not contain at least one of a triazine backbone and an optionally hydrogenated bisphenol backbone.

[0135] Cyanuryl chloride is a compound represented by the following formula (X-4). [Chemical Formula 47]

[0136] In equation (X-1), R 1 It is a monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms. 1 The molecular weight is above 250, R 1 It does not have an olefinic unsaturated group, R 1 It does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. R in formula (X-1) 1 R in equation (A-1) 1 same.

[0137] Specific examples of compounds represented by formula (X-1) include compounds represented by formula (X-1-1) and formula (X-1-2). The compound represented by formula (X-1-1) can be synthesized, for example, by reacting cyanuric chloride with the compound represented by formula (X-9). The compound represented by formula (X-1-2) can be synthesized, for example, by reacting cyanuric chloride with triphenylmethane. Specifically, it can be synthesized using the methods described in "ACS Chemical Biology, 2017, 12(10), pp. 2552-2528", "Chemistry of Materials, 2018, 30(7), pp. 2424-2435", and "Journal of Peptide Science, 2008, 14(5), pp. 596-609". [Chemical Formula 48] [Chemical Formula 49]

[0138] Examples of optional hydrogenated bisphenols include hydrogenated bisphenols and non-hydrogenated bisphenols, with non-hydrogenated bisphenols being preferred (hereinafter referred to as "bisphenols"). Optional hydrogenated bisphenols are preferably compounds represented by the following formula (X-2). [Chemical Formula 50] (In formula (X-2), A represents a divalent organic group having an optionally hydrogenated bisphenol skeleton.)

[0139] In formula (X-2), A represents a divalent organic group having an optionally hydrogenated bisphenol skeleton, which is the same as A in formula (A-2).

[0140] In formula (X-2), if A is a divalent organic group as shown in formula (A-10) above, that is, if the hydrogenated bisphenol is optionally a compound as shown in formula (X-6) below, the compound can be synthesized by reacting 1-(hydroxyaryl)piperazine (a compound as shown in formula (X-7) below) with bismaleimide (a compound as shown in formula (X-8) below). Specifically, it can be synthesized using the manufacturing method described in "International Journal of Polymeric Materials and PolymericBiomaterials, 2013, 62(8), pp455-461". [Chemical Formula 51] (In equations (X-6), (X-7), and (X-8), the ring Ar 2 Each independently represents an aromatic carbon ring with 6 to 10 carbon atoms, optionally containing substituents. X 2 This indicates a divalent group consisting of 1 to 200 atoms selected from carbon, hydrogen, and oxygen atoms. * indicates a linking bond.

[0141] In one embodiment of the manufacture of component (1A), it is preferable to use two or more optional hydrogenated bisphenols of formula (X-2) with different A values, and more preferably, the two or more A values ​​include divalent groups of formula (A-4) and divalent groups of formula (A-5).

[0142] Monophenols preferably use atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon and sulfur as constituent atoms, more preferably use atoms selected from carbon, hydrogen, oxygen, nitrogen and silicon as constituent atoms, even more preferably use atoms selected from carbon, hydrogen and oxygen and nitrogen as constituent atoms, and particularly preferably use atoms selected from carbon, hydrogen and oxygen as constituent atoms.

[0143] The molecular weight of monophenols is preferably less than 250, less than 250, less than 240, or less than 230, more preferably less than 220 or less than 210, further preferably less than 200, less than 190, or less than 180, and particularly preferably less than 170, less than 160, or less than 150.

[0144] Monophenols preferably do not have olefinic unsaturated groups, and more preferably do not have reactive substituents.

[0145] The monophenols preferably have 6 to 20 carbon atoms. The lower limit for the number of carbon atoms in monophenols is more preferably 7 or more, further preferably 8 or more, and particularly preferably 9 or more. The upper limit for the number of carbon atoms in monophenols is more preferably 18 or less, further preferably 16 or less, and particularly preferably 14 or less or 12 or less.

[0146] The number of constituent atoms of monophenols is preferably 13 to 50. The lower limit of the number of constituent atoms of monophenols is more preferably 14 or more, further preferably 15 or more, and particularly preferably 16 or more. The upper limit of the number of constituent atoms of monophenols is more preferably 48 or less or 46 or less, further preferably 44 or less or 42 or less, and particularly preferably 40 or less, 38 or less, 35 or less, 30 or less, 25 or less, or 20 or less.

[0147] Examples of monophenols include phenols and naphthols, which may optionally have substituents. In one embodiment, naphthol is preferred as a monophenol. Examples of naphthols include 1-naphthol and 2-naphthol, with 1-naphthol being preferred.

[0148] The reaction of cyanuryl chloride, optionally hydrogenated bisphenols, compounds shown in formula (X-1) above, and monophenols can be carried out in a solvent-free system or in an organic solvent system. Examples of organic solvents used in the reaction include: ether solvents such as diethyl ether, tetrahydrofuran (THF), and dibutyl ether; ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; acetate solvents such as ethyl acetate, butyl acetate, cellulose acetate solvents (cellulose solvent acetate ester), propylene glycol monomethyl ether acetate, and carbitol acetate; carbitol solvents such as cellulose solvents and butyl carbitol; aromatic hydrocarbon solvents such as toluene and xylene; and amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methyl-2-pyrrolidone. One organic solvent can be used alone, or two or more can be used in combination.

[0149] In the above reactions, bases can also be used. Examples of bases include alkali metal hydroxides such as sodium hydroxide (caustic soda) and potassium hydroxide; alkali metal carbonates such as sodium carbonate and potassium carbonate; alkali metal bicarbonates such as sodium bicarbonate and potassium bicarbonate; and tertiary amines such as triethylamine, pyridine, and N,N-dimethyl-4-aminopyridine (DMAP). A base can be used alone or in combination of two or more.

[0150] The reaction temperature for the above reaction is preferably 10°C or higher, more preferably 15°C or higher, even more preferably 20°C or higher, 25°C or higher, or 30°C or higher, and particularly preferably 35°C or higher, 40°C or higher, or 45°C or higher. The upper limit of the reaction temperature is preferably 100°C or lower or 90°C or lower, more preferably 80°C or lower or 70°C or lower, and even more preferably 60°C or lower.

[0151] The reaction time for the above-mentioned reaction is preferably 0.1 hours, 0.3 hours, or 0.5 hours or more, more preferably 1 hour or 2 hours or more, further preferably 3 hours or 4 hours or more, and particularly preferably 5 hours or 6 hours or more. The upper limit of the reaction time is preferably 48 hours or less, 40 hours or less, 32 hours or less, 24 hours or less, or 20 hours or less, more preferably 16 hours or less or 12 hours or less, and further preferably 10 hours or less.

[0152] After the above reaction, the obtained polymer can be purified. For example, after the above reaction, in order to remove the salt as a byproduct and the excess starting material from the system, purification steps such as washing with water and fine filtration can be performed. Specifically, after the reaction, the amount of water required to dissolve the salt as a byproduct is added, the mixture is allowed to stand and separated, and the aqueous layer is discarded. At this time, an organic solvent for extraction, such as ethyl acetate, can be added. Then, an acid is added as needed for neutralization, and the mixture is repeatedly washed with water. Then, after a dehydration step using a reagent or azeotropic distillation, fine filtration is performed to remove impurities and purify the polymer. If necessary, the organic solvent is removed by distillation, thereby obtaining the polymer. The organic solvent can be used directly as an organic solvent in the resin composition without complete removal. Alternatively, a solvent with low solubility in the polymer (a poor solvent) can be added to precipitate the polymer, and the resulting solid is filtered for purification. The solid obtained by filtration is preferably dried under reduced pressure to evaporate the solvent.

[0153] <(B) Epoxy Resin> The resin composition of the first embodiment of the present invention contains (B) an epoxy resin. The epoxy resin is a curable resin having an epoxy equivalent of 5000 g / eq. or less and having epoxy groups. (B) The epoxy resin can be used alone or in combination of two or more.

[0154] (B) There is no particular limitation on the type of epoxy resin as long as it has one or more (preferably two or more) epoxy groups in one molecule. Examples of epoxy resins (B) include, for example, xylenol-type epoxy resin, bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, bisphenol S-type epoxy resin, bisphenol AF-type epoxy resin, dicyclopentadiene-type epoxy resin, triphenol-type epoxy resin, naphthol phenolic varnish-type epoxy resin, phenol phenolic varnish-type epoxy resin, tert-butylcatechol-type epoxy resin, naphthol-type epoxy resin, anthracene-type epoxy resin, glycidylamine-type epoxy resin, glycidyl ester-type epoxy resin, cresol phenolic varnish-type epoxy resin, phenol aralkyl-type epoxy resin, biphenyl-type epoxy resin, biphenyl aralkyl-type epoxy resin, linear aliphatic epoxy resin, and epoxy resins containing butadiene. The epoxy resins include alicyclic epoxy resins, heterocyclic epoxy resins, spirocyclic epoxy resins, cyclohexane-type epoxy resins, cyclohexanediol-type epoxy resins, naphthyl ether-type epoxy resins, trimethylolpropionic acid epoxy resins, tetraphenylethane-type epoxy resins, isocyanurate-type epoxy resins, phenolphthalimidine-type epoxy resins, Glycirol-type epoxy resins, epoxy resins containing an olefinic skeleton, epoxy resins containing a fluorene skeleton, and halogenated epoxy resins, preferably bisphenol A-type epoxy resins, naphthalene-type epoxy resins, or biphenyl-type epoxy resins, more preferably naphthalene-type epoxy resins or biphenyl-type epoxy resins. (B) One type of epoxy resin may be used alone, or two or more types may be used in combination. In one embodiment, component (B) preferably includes an epoxy resin having an aromatic skeleton.

[0155] In the resin composition of the present invention, component (B) preferably includes an epoxy resin having two or more epoxy groups per molecule. From the viewpoint of significantly obtaining the desired effects of the present invention, the proportion of epoxy resin having two or more epoxy groups per molecule is preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass or more, relative to 100% by mass of epoxy resin (B).

[0156] (B) Epoxy resins include epoxy resins that are liquid at 20°C (hereinafter sometimes referred to as "liquid epoxy resins") and epoxy resins that are solid at 20°C (hereinafter sometimes referred to as "solid epoxy resins"). In the resin composition of the present invention, component (B) may contain only liquid epoxy resin, only solid epoxy resin, or a combination of both. In one embodiment, the resin composition of the present invention preferably contains a combination of liquid epoxy resin and solid epoxy resin.

[0157] As a liquid epoxy resin, it is preferred to be a liquid epoxy resin having two or more epoxy groups in one molecule.

[0158] Examples of liquid epoxy resins include: Glycirol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, phenolic varnish type epoxy resin, alicyclic epoxy resin with ester skeleton, cyclohexanediol type epoxy resin, cyclic aliphatic glycidyl ether, epoxy resin with butadiene structure, dicyclopentadiene type epoxy resin, epoxy resin containing oxidized olefin skeleton, epoxy resin containing fluorene structure, etc., preferably bisphenol A type epoxy resin or naphthalene type epoxy resin, more preferably naphthalene type epoxy resin.

[0159] Specific examples of liquid epoxy resins include: Nagase ChemteX's "EX-992L", Mitsubishi Chemical's "YX7400", DIC's "HP4032", "HP4032D", and "HP4032SS" (naphthalene-type epoxy resin); and Mitsubishi Chemical's "828US", "jER828EL", "828EL", "825", and "EPIKOTE". 828EL, DIC's "850S" (bisphenol A type epoxy resin); Mitsubishi Chemical's "jER807" and "1750" (bisphenol F type epoxy resin); Mitsubishi Chemical's "jER152" (phenolic varnish type epoxy resin); Mitsubishi Chemical's "630," "630LSD," and "604" (glycidylamine type epoxy resin); ADEKA's "ED-523T" (glycirol type epoxy resin); ADEKA's "EP-3950L" and "EP-3980S" (glycidylamine type epoxy resin); ADEKA's "EP-4088S" (dicyclopentadiene type epoxy resin); Nippon Steel Chemical Materials Co., Ltd.'s "ZX-1059" (a mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin); Nagase The following epoxy resins are available: ChemteX's "EX-721" (glycidyl ester type epoxy resin); Nagase ChemteX's "EX-991L" (epoxy resin containing an olefinic skeleton); Daicel's "CELLOXIDE 2021P" (alicyclic epoxy resin with an ester skeleton); Daicel's "PB-3600"; Nippon Soda's "JP-100" and "JP-200" (epoxy resins with butadiene structures); Nippon Steel Chemical Materials' "ZX1658" and "ZX1658GS" (liquid 1,4-glycidylcyclohexane type epoxy resin); Osaka Gas Chemical's "EG-280" (epoxy resin containing a fluorene structure); and Nagase ChemteX's "EX-201" (resorcinol type epoxy resin). These can be used individually or in combination.

[0160] As a solid epoxy resin, it is preferable to be a solid epoxy resin having two or more epoxy groups in one molecule, and more preferably an aromatic solid epoxy resin having three or more epoxy groups in one molecule.

[0161] Examples of solid epoxy resins include xylenol-type epoxy resins, naphthalene-type epoxy resins, naphthalene-type tetrafunctional epoxy resins, naphthol phenolic varnish-type epoxy resins, cresol phenolic varnish-type epoxy resins, dicyclopentadiene-type epoxy resins, triphenol-type epoxy resins, naphthol-type epoxy resins, biphenyl-type epoxy resins, biphenyl aralkyl-type epoxy resins, naphthylene ether-type epoxy resins, anthracene-type epoxy resins, bisphenol A-type epoxy resins, bisphenol AF-type epoxy resins, phenol aralkyl-type epoxy resins, tetraphenylethane-type epoxy resins, phenol benzopyrrolidone-type epoxy resins, and epoxy resins containing fluorene structures. Preferably, biphenyl aralkyl-type epoxy resins or biphenyl-type epoxy resins are used, and more preferably, biphenyl-type epoxy resins are used.

[0162] Specific examples of solid epoxy resins include: DIC's "HP4032H" (naphthalene-type epoxy resin); DIC's "HP-4700" and "HP-4710" (naphthalene-type tetrafunctional epoxy resins); DIC's "N-690" and "N-695" (cresol phenolic varnish type epoxy resins); DIC's "HP-7200," "HP-7200HH," "HP-7200H," and "HP-7200L" (dicyclopentadiene type epoxy resins); and DIC's "EXA-7311" and "EXA-7311"... -G3, EXA-7311-G4, EXA-7311-G4S, HP6000, HP-6000L (naphthyl ether type epoxy resin); EPPN-502H (triphenol type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; NC-7000L (naphthol phenolic varnish type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; NC-3000, NC-3000L, NC-3000FH, NC-3100 (biphenyl type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; NC-3000H (biphenyl aryl alkyl) manufactured by Nippon Kayaku Co., Ltd. Epoxy resins of various types include: Nippon Steel Chemical Materials Co., Ltd.'s "ESN475V" and "ESN4100V" (naphthalene-type epoxy resin); Nippon Steel Chemical Materials Co., Ltd.'s "ESN485" (naphthol-type epoxy resin); Nippon Steel Chemical Materials Co., Ltd.'s "ESN375" (dihydroxynaphthalene-type epoxy resin); Mitsubishi Chemical Corporation's "YX4000H", "YX4000", "YX4000HK", and "YL7890" (bi-xylenol-type epoxy resin); Mitsubishi Chemical Corporation's "YL6121" (biphenyl-type epoxy resin); and Mitsubishi Chemical Corporation's "YX8800" (anthracene-type epoxy resin). Resins; Mitsubishi Chemical's "YX7700" (phenolic aralkyl type epoxy resin); Osaka Gas Chemical's "PG-100" and "CG-500"; Mitsubishi Chemical's "YL7760" (bisphenol AF type epoxy resin); Mitsubishi Chemical's "YL7800" (fluorene-containing epoxy resin); Mitsubishi Chemical's "jER1010" (bisphenol A type epoxy resin); Mitsubishi Chemical's "jER1031S" (tetraphenylethane type epoxy resin); Nippon Kayaku Co., Ltd.'s "WHR991S" (phenolic benzopyrrolidone type epoxy resin), etc. These can be used individually or in combination.

[0163] (B) The epoxy equivalent of the epoxy resin is preferably 50 to 5000 g / eq. The lower limit of the epoxy equivalent is more preferably 60 g / eq. or more, further preferably 80 g / eq. or more, and particularly preferably 110 g / eq. or more. The upper limit of the epoxy equivalent is preferably 3000 g / eq. or less, more preferably 2000 g / eq. or less, further preferably 1000 g / eq. or less, and particularly preferably 500 g / eq. or less, 400 g / eq. or less, or 300 g / eq. or less. The epoxy equivalent is the mass of epoxy resin containing 1 equivalent of epoxy groups, which can be determined according to JIS K7236.

[0164] (B) The weight-average molecular weight (Mw) of the epoxy resin is preferably 100 to 5000, more preferably 250 to 3000, and even more preferably 400 to 1500. The weight-average molecular weight (Mw) of the epoxy resin can be determined using the GPC method as a value converted from polystyrene.

[0165] When the non-volatile component in the resin composition is set to 100% by mass, from the viewpoint of significantly obtaining the effects of the present invention, the content of component (B) in the resin composition is preferably 1% by mass or more, more preferably 2% by mass or more or 3% by mass or more, further preferably 4% by mass or more or 5% by mass or more, and particularly preferably 6% by mass or more. In one embodiment, it may be set to 7% by mass or more, 8% by mass or more, etc. The upper limit is preferably 50% by mass or less, more preferably 40% by mass or less or 30% by mass or less, further preferably 25% by mass or less or 20% by mass or less, and particularly preferably 15% by mass or less, 12% by mass or less, or 11% by mass or less. In another embodiment, it may be set to 10% by mass or less, 9% by mass or less, etc.

[0166] When the resin component in the resin composition is set to 100% by mass, from the viewpoint of significantly obtaining the effects of the present invention, the content of component (B) in the resin composition is preferably 2.5% by mass or more or 5% by mass or more, more preferably 7.5% by mass or more or 10% by mass or more, further preferably 12.5% ​​by mass or more or 15% by mass or more, particularly preferably 17.5% by mass or more, 20% by mass or more, or 22% by mass or more. The upper limit is preferably 70% by mass or less or 60% by mass or less, more preferably 50% by mass or less or 45% by mass or less, further preferably 40% by mass or less or 35% by mass or less, particularly preferably 30% by mass or less or 28% by mass or less.

[0167] When the non-volatile component in the resin composition is set to 100% by mass, from the viewpoint of significantly obtaining the effects of the present invention, the total content of component (1A) and component (B) is preferably 2.5% by mass or more or 5% by mass or more, more preferably 7.5% by mass or more or 10% by mass or more, further preferably 12.5% ​​by mass or more or 15% by mass or more, particularly preferably 17.5% by mass or more, 20% by mass or more, or 22.5% by mass or more. The upper limit is preferably 75% by mass or less or 70% by mass or less, more preferably 60% by mass or less or 50% by mass or less, further preferably 45% by mass or less or 40% by mass or less, particularly preferably 35% by mass or less, 30% by mass or less, or 25% by mass or less.

[0168] From the viewpoint of achieving significant effects of the present invention, the mass ratio of component (B) to component (IA) [component (B) / (IA)] is preferably 0.001 or more, more preferably 0.02 or more or 0.05 or more, even more preferably 0.08 or more or 0.1 or more, and particularly preferably 0.2 or more or 0.3 or more. The upper limit is preferably 100 or less or 80 or less, more preferably 50 or less, 30 or less or 20 or less, even more preferably 10 or less, 8 or less or 5 or less, and particularly preferably 4 or less, 3 or less or 2 or less.

[0169] <(C) Inorganic filler materials> The resin composition of the first embodiment of the present invention contains an inorganic filler (C). By containing an inorganic filler (C) in the resin composition, the dielectric loss tangent of the cured product can be further reduced.

[0170] Inorganic compounds can be used as the inorganic filler material (C). Examples of inorganic fillers (C) include silicon dioxide, alumina, aluminum silicate, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconium phosphate, and zirconium tungstate phosphate. Among these, silicon dioxide is preferred. Examples of silicon dioxide include amorphous silicon dioxide, fused silicon dioxide, crystalline silicon dioxide, synthetic silicon dioxide, and hollow silicon dioxide. Furthermore, spherical silicon dioxide is preferred as the shape of the silicon dioxide. (C) Inorganic filler materials can be used alone or in combination of two or more in any ratio.

[0171] Commercially available products as (C) inorganic filler materials include: "SP60-05" and "SP507-05" manufactured by Nippon Steel Chemical Materials Co., Ltd.; "YC100C", "YA050C", "YA050C-MJE", "YA010C", "SC2500SQ", "SO-C4", "SO-C2", "SO-C1", "SC2300-SVJ", "SC2050-SXF", and "180nmSX-C1" manufactured by Admatechs Co., Ltd.; "UFP-30", "DAW-03", and "FB-105FD" manufactured by Denka Co., Ltd.; "Silfil NSS-3N", "Silfil NSS-4N", and "Silfil NSS-5N" manufactured by Tokuyama Co., Ltd.; and "CellSpheres" and "MGH-005" manufactured by Pacific Cement Co., Ltd.

[0172] From the viewpoint that the surface of the cured material (insulating layer) has low roughness and is easy to form fine wiring, the average particle size of (C) the inorganic filler material is preferably 10 μm or less, more preferably 5 μm or less, further preferably 2 μm or less, even more preferably 1 μm or less, and particularly preferably 0.7 μm or less or 0.6 μm or less. The lower limit of the average particle size of (C) the inorganic filler material is not particularly limited, but is preferably 0.01 μm or more, more preferably 0.05 μm or more, further preferably 0.1 μm or more, and particularly preferably 0.15 μm or more, 0.2 μm or more, 0.3 μm or more, or 0.4 μm or more. The average particle size of (C) the inorganic filler material can be determined by laser diffraction-scattering based on the Mie scattering theory. Specifically, the particle size distribution of the inorganic filler material can be prepared using a laser diffraction-scattering particle size distribution measuring device with a volume reference, and the median diameter can be used as the average particle size for measurement. The sample to be measured can be prepared by weighing 100 mg of inorganic filler material and 10 g of methyl ethyl ketone into a vial and dispersing it ultrasonically for 10 minutes. The light source wavelength used in the laser diffraction particle size distribution measuring device can be set to blue or red, and the measurement is performed in a flow cell. Examples of laser diffraction particle size distribution measuring devices include the "LA-960" manufactured by Horiba Manufacturing Co., Ltd.

[0173] (C) The specific surface area of ​​the inorganic filler material is not particularly limited, but is preferably 0.1 m². 2 / g or more, preferably 0.5m 2 / g or more, further preferably 1m 2 / g or more or 3m 2 / g or more. (C) There is no particular limit to the upper limit of the specific surface area of ​​the inorganic filler material, but it is preferably 100m². 2 / g or less, preferably 70m 2 / g or less, more preferably 50m 2 / g or less, especially preferably 40m 2 / g or less, 30m 2 / g or less, 20m 2 / g or less or 10m 2 / g or less. The specific surface area of ​​inorganic fillers can be calculated using the BET method, using a specific surface area measuring device (Macsorb HM-1210 manufactured by Mountech), where nitrogen gas is adsorbed onto the sample surface, and the BET multi-point method is used.

[0174] (C) The inorganic filler material is preferably surface-treated with a surface treatment agent. Surface treatment improves the moisture resistance and dispersibility of the (C) inorganic filler material. Examples of surface treatment agents include vinyl silane coupling agents such as vinyltrimethoxysilane and vinyltriethoxysilane; epoxy silane coupling agents such as 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-epoxypropoxypropylmethyldimethoxysilane, 3-epoxypropoxypropyltrimethoxysilane, 3-epoxypropoxypropylmethyldiethoxysilane, and 3-epoxypropoxypropyltriethoxysilane; styrene-based silane coupling agents such as p-styrenetrimethoxysilane; and 3-methacryloyl... Methacrylic acid-based silane coupling agents for hydroxypropylmethyldimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, 3-methacryloyloxypropylmethyldiethoxysilane, 3-methacryloyloxypropyltriethoxysilane, etc.; acrylic acid-based silane coupling agents for 3-acryloyloxypropyltrimethoxysilane, etc.; N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminoethyl... Amino silane coupling agents such as tri(trimethoxysilylpropyl)isocyanurate, 3-triethoxysilyl-N-(1,3-dimethyl-butylene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, N-phenyl-8-aminooctyltrimethoxysilane, and N-(vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane; isocyanurate silane coupling agents such as tri(trimethoxysilylpropyl)isocyanurate; ureoyl silane coupling agents such as 3-ureopropyltrialkoxysilane; 3-mercaptopropyl... The surface treatment agent includes mercapto-based silane coupling agents such as methyldimethoxysilane and 3-mercaptopropyltrimethoxysilane; isocyanate-based silane coupling agents such as 3-isocyanatopropyltriethoxysilane; anhydride-based silane coupling agents such as 3-trimethoxysilylpropylsuccinic anhydride; sulfide-based silane coupling agents such as bis(triethoxysilylpropyl)tetrasulfide; and other silane coupling agents, as well as non-silane coupling-alkoxysilane compounds such as methyltrimethoxysilane and phenyltrimethoxysilane, organosilazane compounds, titanate-based coupling agents, etc. Furthermore, a single surface treatment agent can be used alone, or two or more can be used in any ratio. In one embodiment, (C) the inorganic filler material is preferably surface-treated with an amino-based silane coupling agent, and more preferably with N-phenyl-3-aminopropyltrimethoxysilane.

[0175] From the viewpoint of improving the dispersibility of inorganic filler materials, the degree of surface treatment by surface treatment agent is preferably within a specified range. Specifically, 100 parts by mass of inorganic filler material is preferably surface treated with 0.2 parts by mass to 5 parts by mass of surface treatment agent, preferably with 0.2 parts by mass to 3 parts by mass of surface treatment agent, and preferably with 0.3 parts by mass to 2 parts by mass of surface treatment agent.

[0176] The degree of surface treatment by the surface treatment agent can be evaluated by the carbon content per unit surface area of ​​the inorganic filler. From the viewpoint of improving the dispersibility of the inorganic filler, the preferred carbon content per unit surface area of ​​the inorganic filler is 0.02 mg / m². 2 The above, more preferably 0.1 mg / m 2 The above is further preferred to be 0.2 mg / m². 2 The above. The preferred upper limit is 1.0 mg / m². 2 The following is more preferably 0.8 mg / m 2 The following is a further preferred dosage: 0.5 mg / m² 2 the following.

[0177] (C) The carbon content per unit surface area of ​​the inorganic filler material can be determined after cleaning the surface-treated inorganic filler material with a solvent (e.g., methyl ethyl ketone (MEK)). Specifically, sufficient MEK as a solvent is added to the surface-treated inorganic filler material, and ultrasonic cleaning is performed at 25°C for 5 minutes. After removing the supernatant and drying the solid components, the carbon content per unit surface area of ​​the inorganic filler material can be determined using a carbon analyzer. A carbon analyzer such as the "EMIA-320V" manufactured by Horiba Corporation can be used.

[0178] From the viewpoint of further reducing the dielectric loss tangent of the cured product, when the non-volatile component in the resin composition is set to 100% by mass, the content of component (C) in the resin composition is preferably 30% by mass or more or 40% by mass or more, more preferably 45% by mass or more or 50% by mass or more, further preferably 52% by mass or more or 54% by mass or more, particularly preferably 56% by mass or more, 58% by mass or more, or 60% by mass or more. From the viewpoint of further improving the adhesion between the cured product (insulating layer) and the conductor layer, the upper limit is preferably 90% by mass or less, more preferably 85% by mass or less, further preferably 80% by mass or less or 75% by mass or less, particularly preferably 72% by mass or less. In one embodiment, when the non-volatile component in the resin composition is set to 100% by mass, the content of component (C) is preferably 50 to 75% by mass.

[0179] From the viewpoint of achieving significant effects of the present invention, when the non-volatile component in the resin composition is set to 100% by mass, the total content of component (1A), component (B), and component (C) in the resin composition is preferably 40% by mass or more, more preferably 50% by mass or more or 60% by mass or more, further preferably 70% by mass or more or 75% by mass or more, and particularly preferably 80% by mass or more, 85% by mass or more, or 90% by mass or more. There is no particular limitation on the upper limit; it can also be 100% by mass, and can be set to 99% by mass or less, 98% by mass or less, 96% by mass or less, 95% by mass or less, etc.

[0180] From the viewpoint of further improving the adhesion between the cured material (insulating layer) and the conductor layer, the mass ratio of component (1A) to component (C) [(1A) component / (C) component] is preferably 0.001 or more, more preferably 0.02 or more or 0.05 or more, and even more preferably 0.08 or more. From the viewpoint of further reducing the dielectric loss tangent of the cured material, the upper limit is preferably 10 or less or 8 or less, more preferably 5 or less or 3 or less, even more preferably 2 or less, 1 or less or 0.8 or less, and particularly preferably 0.6 or less. In one embodiment, the mass ratio [(1A) component / (C) component] is preferably 0.01 to 1.

[0181] From the viewpoint of further improving the adhesion between the cured material (insulating layer) and the conductor layer, the mass ratio of component (B) to component (C) [(B) component / (C) component] is preferably 0.001 or more, more preferably 0.005 or more or 0.008 or more, even more preferably 0.01 or more or 0.02 or more, and particularly preferably 0.05 or more, 0.08 or more, or 0.09 or more. The upper limit is preferably 20 or less or 15 or less, more preferably 10 or less, 8 or less, or 5 or less, even more preferably 2 or less, 1 or less, or 0.8 or less, and particularly preferably 0.5 or less, 0.4 or less, or 0.3 or less.

[0182] <(D) Curing Agent> In the resin composition of the first embodiment of the present invention, (D) curing agent may be included as an optional component, and (D) curing agent is preferred. The (D) curing agent has the function of reacting with (B) epoxy resin to cure the resin composition. One type of (D) curing agent may be used alone, or two or more types may be used in combination.

[0183] The resin composition of the first embodiment of the present invention can be cured by the reaction between the epoxy groups of the epoxy resin (B) even when containing component (1A), epoxy resin (B), and component (C). However, by containing curing agent (D), the curing reaction can be carried out more efficiently, resulting in a cured product exhibiting superior dielectric properties and superior adhesion. That is, in one embodiment, curing agent (D) preferably comprises an epoxy resin curing agent, and curing agent (D) is more preferably an epoxy resin curing agent.

[0184] The reactive base equivalent of (D) curing agent is preferably 50 g / eq. to 3000 g / eq., more preferably 100 g / eq. to 1000 g / eq., even more preferably 100 g / eq. to 500 g / eq., and particularly preferably 100 g / eq. to 300 g / eq. The reactive base equivalent is the mass of (D) curing agent per 1 equivalent of reactive base.

[0185] Examples of curing agents (D) include reactive ester-based curing agents, carbodiimide-based curing agents, phenol-based curing agents, naphthol-based curing agents, acid anhydride-based curing agents, amine-based curing agents, benzoxazine-based curing agents, cyanate ester-based curing agents, and thiol-based curing agents. From the viewpoint of significantly achieving the effects of the present invention, it is preferable that the curing agent (D) comprises one or more selected from phenol-based curing agents, reactive ester-based curing agents, and carbodiimide-based curing agents; more preferably, it comprises one or more selected from reactive ester-based curing agents and carbodiimide-based curing agents; even more preferably, it comprises a reactive ester-based curing agent; and particularly preferably, it comprises both a reactive ester-based curing agent and a carbodiimide-based curing agent.

[0186] There are no particular limitations on the use of reactive ester-based curing agents; compounds having one or more reactive ester groups per molecule can be used. Among these, compounds having two or more highly reactive ester groups per molecule, such as phenol esters, thiophenol esters, N-hydroxyamine esters, and heterocyclic hydroxyl esters, are preferred. This reactive ester compound is preferably a compound obtained through a condensation reaction of a carboxylic acid compound and / or a thiocarboxylic acid compound with a hydroxyl compound and / or a thiol compound. Particularly from the viewpoint of improved heat resistance, reactive ester compounds obtained from carboxylic acid compounds and hydroxyl compounds are preferred, and reactive ester compounds obtained from carboxylic acid compounds and phenolic compounds and / or naphthol compounds are more preferred.

[0187] Examples of carboxylic acid compounds include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid.

[0188] Examples of phenolic and / or naphthol compounds include, for example: hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalein, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthol, 1,6-dihydroxynaphthol, 2,6-dihydroxynaphthol, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucinol, pyroglucinol, dicyclopentadiene-type diphenol compounds, and linear phenolic resins. Here, "dicyclopentadiene-type diphenol compounds" refers to diphenol compounds obtained by condensing one molecule of dicyclopentadiene with two molecules of phenol.

[0189] Specifically, the preferred active ester-based curing agent is a dicyclopentadiene-type active ester compound, a naphthalene-type active ester compound containing a naphthalene structure, an active ester compound containing an acetylated derivative of a linear phenolic resin, or an active ester compound containing a benzoyl derivative of a linear phenolic resin. More preferably, it is selected from at least one of a dicyclopentadiene-type active ester compound and a naphthalene-type active ester compound. As a dicyclopentadiene-type active ester compound, an active ester compound containing a dicyclopentadiene-type diphenol structure is preferred.

[0190] Commercially available reactive ester curing agents include reactive ester compounds containing a dicyclopentadiene-type diphenol structure such as "EXB9451", "EXB9460", "EXB9460S", "HPC-8000L-65TM", "HPC-8000-65T", "EXB-8000H", and "EXB-8000L-65TM" (manufactured by DIC); and reactive ester compounds containing a naphthalene structure such as "EXB-9416-70BK", "EXB-8100L-65T", "HPC-8150-62T", "EXB-8150L-65T", and "EXB-8100L-65T". Examples of active ester compounds include "EXB-8" (manufactured by DIC Corporation); examples of phosphorus-containing active ester compounds include "EXB9401" (manufactured by DIC Corporation); examples of active ester compounds that are acetylated derivatives of linear phenolic resins include "DC808" (manufactured by Mitsubishi Chemical Corporation); examples of active ester compounds that are benzoyl derivatives of linear phenolic resins include "YLH1026", "YLH1030", "YLH1048" (manufactured by Mitsubishi Chemical Corporation), and "EXB-8500-65T" (manufactured by DIC Corporation); examples of active ester compounds containing styrene and naphthalene structures include "PC1300-02-65T" and "PC1300-02-65MA" (manufactured by Air Water Corporation).

[0191] Carbodiimide-based curing agents are compounds having one carbodiimide group (-N=C=N-) in one molecule, and preferably compounds having two or more carbodiimide groups in one molecule. Examples of carbodiimide-based curing agents include: aliphatic dicarbodiimides such as tetramethylene-bis(tert-butylcarbodiimide) and cyclohexane-bis(methylene-tert-butylcarbodiimide); aromatic dicarbodiimides such as phenylene-bis(xylylcarbodiimide); aliphatic polycarbodiimides such as polyhexamethylenecarbodiimide, polytrimethylhexamethylenecarbodiimide, polycyclohexylenecarbodiimide, poly(methylene biscyclohexylenecarbodiimide), and poly(isophoronecarbodiimide); and poly(phenylenecarbodiimide), poly(phenylenecarbodiimide), etc. Aromatic polycarbodiimides such as naphthylcarbodiimide, poly(tolylcarbodiimide), poly(methyldiisopropylphenylcarbodiimide), poly(triethylphenylcarbodiimide), poly(diethylphenylcarbodiimide), poly(triisopropylphenylcarbodiimide), poly(diisopropylphenylcarbodiimide), poly(xylylcarbodiimide), poly(tetramethylxylylcarbodiimide), poly(methylenediphenylcarbodiimide), and poly[methylenebis(methylphenyl)carbodiimide] are used. These can be used alone or in combination of two or more.

[0192] Commercially available carbodiimide-based curing agents include, for example, CARBODILITE V-03 (carbodiimide equivalent: 216 g / eq.), CARBODILITE V-05 (carbodiimide equivalent: 262 g / eq.), CARBODILITE V-07 (carbodiimide equivalent: 200 g / eq.), and CARBODILITE V-09 (carbodiimide equivalent: 200 g / eq.) manufactured by Nisshinbo Chemical Co., Ltd.; and Stabaxol P (carbodiimide equivalent: 302 g / eq.) manufactured by Lanxess Co., Ltd.

[0193] From the viewpoint of heat resistance and water resistance, phenolic curing agents or naphthol curing agents with a phenolic structure are preferred as curing agents. Furthermore, from the viewpoint of further improving the adhesion strength with the conductor layer, nitrogen-containing phenolic curing agents or nitrogen-containing naphthol curing agents are preferred, and phenolic curing agents or naphthol curing agents containing a triazine skeleton are more preferred. Among these, linear phenolic resins containing a triazine skeleton are preferred from the viewpoint of highly satisfying heat resistance, water resistance, and adhesion strength with the conductor layer. They can be used alone or in combination of two or more.

[0194] Specific examples of phenol-based and naphthol-based curing agents include: "MEH-7700", "MEH-7810", and "MEH-7851" manufactured by Meiwa Chemical Co., Ltd.; "NHN", "CBN", and "GPH" manufactured by Nippon Kayaku Co., Ltd.; "SN170", "SN180", "SN190", "SN475", "SN485", "SN495", "SN-495V", "SN375", and "SN395" manufactured by Nippon Steel Chemical Materials Co., Ltd.; and "TD-2090", "LA-7052", "LA-7054", "LA-1356", "LA-3018-50P", and "EXB-9500" manufactured by DIC Co., Ltd.

[0195] As an anhydride-based curing agent, examples include curing agents having one or more anhydride groups per molecule, preferably curing agents having two or more anhydride groups per molecule. Specific examples of anhydride-based curing agents include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride, dodecenylsuccinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trimellitic anhydride, and pyromellitic anhydride. Polymer anhydrides such as benzophenone tetracarboxylic dianhydride, biphenyl tetracarboxylic dianhydride, naphthalene tetracarboxylic dianhydride, oxydiphthalic dianhydride, 3,3'-4,4'-diphenylsulfone tetracarboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-C]furan-1,3-dione, ethylene glycol bis(triphenylamine), and styrene-maleic acid resin copolymerized with styrene and maleic acid are examples. They can be used individually or in combination of two or more.

[0196] Commercially available anhydride-based curing agents include: "HNA-100", "MH-700", "MTA-15", "DDSA", and "OSA" manufactured by New Japan Rika Co., Ltd.; "YH-306" and "YH-307" manufactured by Mitsubishi Chemical Co., Ltd.; "HN-2200" and "HN-5500" manufactured by Resonac Co., Ltd.; and "EF-30", "EF-40", "EF-60", and "EF-80" manufactured by Cray Valley Co., Ltd. These can be used individually or in combination of two or more.

[0197] Examples of amine-based curing agents include those having one or more, preferably two or more, amino groups within one molecule. The amino groups in the amine-based curing agent are preferably primary or secondary amino groups, more preferably primary amino groups. Examples of amine-based curing agents include aliphatic amines, polyether amines, alicyclic amines, and aromatic amines, among which aromatic amines are preferred from the viewpoint of achieving the desired effect of the present invention. The amine-based curing agent is preferably a primary or secondary amine, more preferably a primary amine.

[0198] Specific examples of amine-based curing agents include 4,4'-methylenebis(2,6-dimethylaniline), 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, m-phenylenediamine, m-phenylenediamine, diethyltoluenediamine, 4,4'-diaminodiphenyl ether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, and 2,2-bis(3-amino-4-hydroxy) 2,2-bis(4-aminophenyl)propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanediamine, 2,2-bis(4-aminophenyl)propane, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)sulfone, bis(4-(3-aminophenoxy)phenyl)sulfone, etc. Amine-based curing agents can be commercially available, such as SEIKA ACURE-S, KAYABOND C-200S, KAYABOND C-100, KAYAHARD AA, KAYAHARD AB, KAYAHARD AS, Epicure W, and DTDA. These can be used individually or in combination.

[0199] Specific examples of benzoxazine-based curing agents include "JBZ-OP100D" and "ODA-BOZ" manufactured by JFE Chemicals; "HFB2006M" manufactured by Showa Polymers; and "Pd" and "Fa" manufactured by Shikoku Chemical Industry Co., Ltd. These can be used individually or in combination of two or more.

[0200] Examples of difunctional cyanate ester resins that can be used as cyanate ester curing agents include bisphenol A dicyanate, polyphenol cyanate, oligomeric (3-methylene-1,5-phenylene cyanate), 4,4'-methylenebis(2,6-dimethylphenyl cyanate), 4,4'-ethoxydiphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate)phenylpropane, 1,1-bis(4-cyanoxyphenylmethane), bis(4-cyanoxy-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanoxyphenyl-1-(methylethoxy))benzene, bis(4-cyanoxyphenyl) sulfide, and bis(4-cyanoxyphenyl) ether; multifunctional cyanate ester resins derived from phenolic varnish resins and cresol varnish resins; and prepolymers obtained by partially triazinizing these cyanate ester resins. Commercially available cyanate ester-based curing agents include Arxada's "PT-30", "PT-60" (linear phenolic resin-type multifunctional cyanate ester resin), "ULL-950S" (multifunctional cyanate ester resin), "BA-230", and "BA-230S75" (prepolymers of bisphenol A dicyanate partially or entirely triazinized to form trimers). These can be used individually or in combination.

[0201] Examples of thiol-based curing agents include trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetra(3-mercaptobutyrate), and tris(3-mercaptopropyl)isocyanurate. They can be used individually or in combination of two or more.

[0202] The ratio of epoxy resin to curing agent, expressed as the ratio of [total number of epoxy groups in the epoxy resin] to [total number of active groups in the curing agent], is preferably in the range of 1:0.01 to 1:10, more preferably 1:0.3 to 1:5, and even more preferably 1:0.5 to 1:3. Here, "number of epoxy groups in the epoxy resin" refers to the sum of all values ​​obtained by dividing the mass of the non-volatile component of the epoxy resin present in the resin composition by the epoxy equivalent. Similarly, "number of active groups in the curing agent" refers to the sum of all values ​​obtained by dividing the mass of the non-volatile component of the curing agent present in the resin composition by the active group equivalent. By setting the ratio of the curing agent to the epoxy resin within the aforementioned range, the effects of the present invention can be significantly obtained.

[0203] In the case where the resin composition of the first embodiment of the present invention contains a (D) curing agent, from the viewpoint of significantly obtaining the effects of the present invention, when the non-volatile component in the resin composition is set to 100% by mass, the content of the (D) curing agent in the resin composition is preferably 1% by mass or more, more preferably 2% by mass or more, further preferably 3% by mass or more or 4% by mass or more, and particularly preferably 5% by mass or more or 6% by mass or more. In another embodiment, it may be set to 7% by mass or more, 8% by mass or more, 9% by mass or more, etc. The upper limit is preferably 30% by mass or less, more preferably 25% by mass or less, further preferably 20% by mass or less or 18% by mass or less, and particularly preferably 16% by mass or less or 14% by mass or less. In another embodiment, it may be set to 12% by mass or less, 10% by mass or less, etc.

[0204] In the case where the resin composition of the first embodiment of the present invention contains a (D) curing agent, from the viewpoint of significantly obtaining the effects of the present invention, when the resin component in the resin composition is set to 100% by mass, the content of the (D) curing agent in the resin composition is preferably 2.5% by mass or more or 5% by mass or more, more preferably 7.5% by mass or more or 10% by mass or more, further preferably 12.5% ​​by mass or more or 15% by mass or more, particularly preferably 17.5% by mass or more or 20% by mass or more. In another embodiment, it may be set to 22.5% by mass or more, 25% by mass or more, 27.5% by mass or more, 30% by mass or more, etc. The upper limit is preferably 70% by mass or less, more preferably 60% by mass or less, further preferably 50% by mass or less or 45% by mass or less, particularly preferably 40% by mass or less or 36% by mass or less. In another embodiment, it may be set to 34% by mass or less, 32% by mass or less, etc.

[0205] In the case where the resin composition of the first embodiment of the present invention contains curing agent (D), from the viewpoint of significantly obtaining the effects of the present invention, the mass ratio of component (D) to component (IA) [(D) component / (IA) component] is preferably 0.001 or more, more preferably 0.01 or more or 0.05 or more, further preferably 0.08 or more or 0.1 or more, and particularly preferably 0.2 or more or 0.3 or more. The upper limit is preferably 100 or less or 80 or less, more preferably 50 or less or 20 or less, further preferably 15 or less, 10 or less or 8 or less, and particularly preferably 5 or less, 4 or less or 3 or less.

[0206] In the case where the resin composition of the first embodiment of the present invention contains curing agent (D), from the viewpoint of significantly obtaining the effects of the present invention, the mass ratio of component (D) to component (B) [component (D) / component (B)] is preferably 0.01 or more or 0.02 or more, more preferably 0.05 or more or 0.08 or more, further preferably 0.1 or more or 0.2 or more, and particularly preferably 0.5 or more or 0.8 or more. The upper limit is preferably 100 or less or 80 or less, more preferably 50 or less or 20 or less, further preferably 15 or less, 10 or less or 8 or less, and particularly preferably 5 or less, 3 or less or 2 or less.

[0207] In the case where the resin composition of the first embodiment of the present invention contains curing agent (D), from the viewpoint of significantly obtaining the effects of the present invention, the mass ratio of component (D) to component (C) [component (D) / component (C)] is preferably 0.001 or more or 0.002 or more, more preferably 0.005 or more or 0.008 or more, further preferably 0.01 or more or 0.02 or more, and particularly preferably 0.05 or more or 0.08 or more. The upper limit is preferably 20 or less or 15 or less, more preferably 10 or less, 8 or less or 5 or less, further preferably 2 or less, 1 or less or 0.8 or less, and particularly preferably 0.5 or less, 0.4 or less or 0.3 or less.

[0208] <(E) Curing Accelerator> In the resin composition of the first embodiment of the present invention, (E) curing accelerator may be included as an optional component, and (E) curing accelerator is preferred. The (E) curing accelerator functions as a curing catalyst that promotes the curing of (B) epoxy resin and / or (D) curing agent.

[0209] Examples of (E) curing accelerators include phosphorus-based curing accelerators, urea-based curing accelerators, guanidine-based curing accelerators, imidazole-based curing accelerators, metal-based curing accelerators, and amine-based curing accelerators. The (E) curing accelerator preferably includes an amine-based curing accelerator or an imidazole-based curing accelerator, and more preferably includes an imidazole-based curing accelerator. One type of (E) curing accelerator can be used alone, or two or more types can be used in combination.

[0210] Examples of amine-based curing accelerators include trialkylamines such as triethylamine and tributylamine, pyridines such as 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, and 1,8-diazabicyclo(5,4,0)-undecene, with pyridines being preferred, and 4-dimethylaminopyridine being more preferred. They can be used individually or in combination of two or more.

[0211] As an amine-based curing accelerator, commercially available products can be used, such as "MY-25" manufactured by Ajinomoto Fine Technology Co., Ltd., and "DMAP" manufactured by Kwangyoung Chemical Industry Co., Ltd.

[0212] Examples of phosphorus-based curing accelerators include aliphatic phosphonium salts such as tetrabutylphosphonium bromide, tetrabutylphosphonium chloride, tetrabutylphosphonium acetate, tetrabutylphosphonium decanoate, tetrabutylphosphonium laurate, bis(tetrabutylphosphonium)phenylpyridine tetraphosphate, tetrabutylphosphonium hydrogen hexahydrophthalate, tetrabutylphosphonium 2,6-bis[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenolate, and di-tert-butylmethylphosphonium tetraphenylborate; methyltriphenylphosphonium bromide, ethyltriphenylphosphonium bromide, propyltriphenylphosphonium bromide, butyltriphenylphosphonium bromide, benzyltriphenylphosphonium chloride, tetraphenylphosphonium bromide, and p-tolyltriphenylphosphonium tetrap-p-phosphonium. Aromatic phosphonium salts of tolylborates, tetraphenylphosphonium tetraphenylborates, tetraphenylphosphonium tetrap-tolylborates, triphenylethylphosphonium tetraphenylborates, tri(3-methylphenyl)ethylphosphonium tetraphenylborates, tri(2-methoxyphenyl)ethylphosphonium tetraphenylborates, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate, etc.; aromatic phosphine-borane complexes of triphenylphosphine-triphenylborane, etc.; aromatic phosphine-quinone addition reactants of triphenylphosphine-p-benzoquinone addition reactants, etc.; tributylphosphine, tri-tert-butylphosphine, trioctylphosphine, di-tert-butyl(2- Aliphatic phosphines such as butylene(3-methyl-2-butenyl)phosphine, di-tert-butyl(3-methyl-2-butenyl)phosphine, and tricyclohexylphosphine; dibutylphenylphosphine, di-tert-butylphenylphosphine, methyldiphenylphosphine, ethyldiphenylphosphine, butyldiphenylphosphine, diphenylcyclohexylphosphine, triphenylphosphine, tri-o-tolylphosphine, tri-m-tolylphosphine, tri-p-tolylphosphine, tri(4-ethylphenyl)phosphine, tri(4-propylphenyl)phosphine, tri(4-isopropylphenyl)phosphine, tri(4-butylphenyl)phosphine, tri(4-tert-butylphenyl)phosphine, tri(2,4-dimethylphenyl)phosphine, tri(2,5-dimethylphenyl)phosphine, tri(2,6-dimethylphenyl)phosphine, etc. Aromatic phosphines, including phenylphosphine, tris(3,5-dimethylphenyl)phosphine, tris(2,4,6-trimethylphenyl)phosphine, tris(2,6-dimethyl-4-ethoxyphenyl)phosphine, tris(2-methoxyphenyl)phosphine, tris(4-methoxyphenyl)phosphine, tris(4-ethoxyphenyl)phosphine, tris(4-tert-butoxyphenyl)phosphine, diphenyl-2-pyridylphosphine, 1,2-bis(diphenylphosphino)ethane, 1,3-bis(diphenylphosphino)propane, 1,4-bis(diphenylphosphino)butane, 1,2-bis(diphenylphosphino)acetylene, and 2,2'-bis(diphenylphosphino)diphenyl ether, etc. They can be used alone or in combination of two or more.

[0213] Examples of urea-based curing accelerators include, for instance, 1,1-dimethylurea; aliphatic dimethylureas such as 1,1,3-trimethylurea, 3-ethyl-1,1-dimethylurea, 3-cyclohexyl-1,1-dimethylurea, and 3-cyclooctyl-1,1-dimethylurea; and 3-phenyl-1,1-dimethylurea, 3-(4-chlorophenyl)-1,1-dimethylurea, 3-(3,4-dichlorophenyl)-1,1-dimethylurea, 3-(3-chloro-4-methylphenyl)-1,1-dimethylurea, 3-(2-methylphenyl)-1,1-dimethylurea, 3-(4-methylphenyl)-1,1-dimethylurea, and 3-(3,4-dimethylphenyl)-1,1-dimethylurea. Aromatic dimethylureas such as dimethylurea, 3-(4-isopropylphenyl)-1,1-dimethylurea, 3-(4-methoxyphenyl)-1,1-dimethylurea, 3-(4-nitrophenyl)-1,1-dimethylurea, 3-[4-(4-methoxyphenoxy)phenyl]-1,1-dimethylurea, 3-[4-(4-chlorophenoxy)phenyl]-1,1-dimethylurea, 3-[3-(trifluoromethyl)phenyl]-1,1-dimethylurea, N,N-(1,4-phenylene)bis(N',N'-dimethylurea), N,N-(4-methyl-1,3-phenylene)bis(N',N'-dimethylurea)[toluenebisdimethylurea], etc. These can be used alone or in combination of two or more.

[0214] Examples of guanidine-based curing accelerators include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-methyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene, 1-methylbiguanidine, 1-ethylbiguanidine, 1-n-butylbiguanidine, 1-n-octadecylbiguanidine, 1,1-dimethylbiguanidine, 1,1-diethylbiguanidine, 1-cyclohexylbiguanidine, 1-allylbiguanidine, 1-phenylbiguanidine, and 1-(o-tolyl)biguanidine. They can be used alone or in combination of two or more.

[0215] Examples of imidazole-based curing accelerators include 2-methylimidazolium, 2-undecylimidazolium, 2-heptadecylimidazolium, 1,2-dimethylimidazolium, 2-ethyl-4-methylimidazolium, 2-phenylimidazolium, 2-phenyl-4-methylimidazolium, 1-benzyl-2-methylimidazolium, 1-benzyl-2-phenylimidazolium, 1-cyanoethyl-2-methylimidazolium, 1-cyanoethyl-2-undecylimidazolium, 1-cyanoethyl-2-ethyl-4-methylimidazolium, 1-cyanoethyl-2-phenylimidazolium, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-triazine, 2,4-diamino-6- [2'-Undecylimidazolyl-(1')]-ethyl-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-triazine isocyanuric acid adduct, 2-phenylimidazolyl isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazolium, 2-phenyl-4-methyl-5-hydroxymethylimidazolium, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazoline and other imidazole compounds and adducts of imidazole compounds with epoxy resins, preferably 1-benzyl-2-phenylimidazolium.

[0216] Commercially available imidazole-based curing accelerators include, for example, those manufactured by Shikoku Chemical Industry Co., Ltd. such as "1B2PZ", "2E4MZ", "2MZA-PW", "2MZ-OK", "2MA-OK", "2MA-OK-PW", "2P4MZ", "2PHZ", "2PHZ-PW", "Cl1Z", "Cl1Z-CN", "Cl1Z-CNS", and "C11Z-A"; and "P200-H50" manufactured by Mitsubishi Chemical Co., Ltd. These can be used individually or in combination of two or more.

[0217] Examples of organometallic curing accelerators include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include: cobalt(II) acetylacetonate, cobalt(III) acetylacetonate, copper(II) acetylacetonate, zinc(II) acetylacetonate, iron(III) acetylacetonate, nickel(II) acetylacetonate, and manganese(II) acetylacetonate. Examples of organometallic salts include zinc octoate, tin octoate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate. These can be used individually or in combination of two or more.

[0218] When the resin composition of the first embodiment of the present invention contains a (E) curing accelerator, from the viewpoint of significantly obtaining the effects of the present invention, when the non-volatile component in the resin composition is set to 100% by mass, the content of the (E) component in the resin composition is preferably 0.001% by mass or more, more preferably 0.002% by mass or more, further preferably 0.005% by mass or more or 0.008% by mass or more, particularly preferably 0.01% by mass or more or 0.02% by mass or more. The upper limit is preferably 5% by mass or less, more preferably 2% by mass or less or 1% by mass or less, further preferably 0.8% by mass or less or 0.5% by mass or less, particularly preferably 0.2% by mass or less or 0.15% by mass or less.

[0219] In the case where the resin composition of the first embodiment of the present invention contains a (E) curing accelerator, from the viewpoint of significantly obtaining the effects of the present invention, when the resin component in the resin composition is set to 100% by mass, the content of the (E) component in the resin composition is preferably 0.001% by mass or more or 0.002% by mass or more, more preferably 0.005% by mass or more or 0.008% by mass or more, further preferably 0.01% by mass or more or 0.02% by mass or more, particularly preferably 0.03% by mass or more, 0.04% by mass or more, or 0.05% by mass or more. The upper limit is preferably 10% by mass or less or 8% by mass or less, more preferably 5% by mass or less or 2% by mass or less, further preferably 1% by mass or less, 0.8% by mass or less or 0.6% by mass or less, particularly preferably 0.5% by mass or less, 0.4% by mass or less or 0.3% by mass or less.

[0220] In the case where the resin composition of the first embodiment of the present invention contains a curing accelerator (E), from the viewpoint of significantly obtaining the effects of the present invention, the mass ratio of component (E) to component (IA) [component (E) / component (IA)] is preferably 0.0001 or more, more preferably 0.0002 or more or 0.0005 or more, further preferably 0.0008 or more or 0.001 or more, and particularly preferably 0.002 or more or 0.003 or more. The upper limit is preferably 1 or less or 0.5 or less, more preferably 0.1 or less or 0.08 or less, further preferably 0.05 or less, 0.02 or less or 0.01 or less, and particularly preferably 0.008 or less, 0.006 or less or 0.005 or less.

[0221] In the case where the resin composition of the first embodiment of the present invention contains a curing accelerator (E), from the viewpoint of significantly obtaining the effects of the present invention, the mass ratio of component (E) to component (B) [(E) component / (B) component] is preferably 0.0001 or more, more preferably 0.0002 or more or 0.0005 or more, further preferably 0.0008 or more or 0.001 or more, and particularly preferably 0.0015 or more or 0.002 or more. The upper limit is preferably 1 or less or 0.8 or less, more preferably 0.5 or less or 0.2 or less, further preferably 0.1 or less or 0.08 or less, and particularly preferably 0.05 or less or 0.02 or less.

[0222] In the case where the resin composition of the first embodiment of the present invention contains a curing accelerator (E), from the viewpoint of significantly obtaining the effects of the present invention, the mass ratio of component (E) to component (C) [(E) component / (C) component] is preferably 1 × 10⁻⁶. -5 The above is preferred to be 2×10 -5 Above or 5×10 -5 The above is further optimized to 8×10 -5 Above or 1×10 -4 The above is particularly preferred, with 2×10 -4 Above or 4×10 -4 That's all. The upper limit is preferably 1×10. -1 Below or 8×10 -2 The following is more preferably 5×10 -2 Below or 2×10 -2 Hereinafter, 1×10 is further preferred. -2 Below or 8×10 -3 The following is particularly preferred: 5×10 -3 Below or 3×10 -3 the following.

[0223] In the case where the resin composition of the first embodiment of the present invention contains a curing agent (D) and a curing accelerator (E), from the viewpoint of significantly obtaining the effects of the present invention, the mass ratio of component (E) to component (D) [component (E) / component (D)] is preferably 0.0001 or more, more preferably 0.0002 or more, further preferably 0.0005 or more or 0.0008 or more, and particularly preferably 0.001 or more or 0.0015 or more. The upper limit is preferably 1 or less or 0.8 or less, more preferably 0.5 or less or 0.2 or less, further preferably 0.1 or less or 0.08 or less, and particularly preferably 0.05 or less or 0.02 or less.

[0224] <(F) Free Radical Polymer Resins> In the resin composition of the first embodiment of the present invention, (F) radical polymeric resin may be included as an optional component. From the viewpoint of further reducing the dielectric constant and dielectric loss tangent of the cured product, it is preferable to include (F) radical polymeric resin. By including (F) radical polymeric resin in the resin composition, the crosslinking density of the cured product can be further increased. One (F) component may be used alone, or two or more components may be used in combination.

[0225] (F) The free radical polymerizable resin may have olefinically unsaturated bonds. (F) The free radical polymerizable resin may optionally have free radical polymerizable groups such as vinyl, allyl, 3-cyclohexenyl, 3-cyclopentenyl, p-vinylphenyl, m-vinylphenyl, o-vinylphenyl, etc., unsaturated hydrocarbon groups; acryloyl, methacryloyl, maleimide (2,5-dihydro-2,5-dioxo-1H-pyrrole-1-yl), etc., α,β-unsaturated carbonyl groups, etc. (F) The free radical polymerizable resin preferably has two or more free radical polymerizable groups.

[0226] Examples of (F) radical polymer resins include (meth)acrylic acid radical polymer resins, styrene radical polymer resins, allyl radical polymer resins, and maleimide radical polymer resins. "(meth)acrylic acid radical polymer resins" refers to resins containing acryloyl and / or methacryloyl groups.

[0227] (Meth)acrylic acid-based free radical polymer resins are, for example, compounds having one or more, preferably two or more, acryloyl groups and / or methacryloyl groups. Examples of low molecular weight (molecular weight less than 1000) aliphatic (meth)acrylate compounds include cyclohexane-1,4-diethanol di(meth)acrylate, cyclohexane-1,3-diethanol di(meth)acrylate, tricyclodecane-diethanol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, glycerol tri(meth)acrylate, and pentaerythritol tetra(meth)acrylate; dioxanediol di(meth)acrylate, 3,6-dioxane-1,8-... Octyl glycol di(meth)acrylate, 3,6,9-trioxaundecane-1,11-diol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, 9,9-bis[4-(2-acryloyloxyethoxy)phenyl]fluorene, ethoxylated bisphenol A di(meth)acrylate, propoxylated bisphenol A di(meth)acrylate, and other low molecular weight (molecular weight less than 1000) ether-containing (meth)acrylate compounds; tri(3-hydroxypropyl)isocyanurate tri(meth)acrylate, tri(2-hydroxyethyl)isocyanurate tri(meth)acrylate, ethoxylated isocyanuric acid tri(meth)acrylate, and other low molecular weight (molecular weight less than 1000) isocyanurate-containing (meth)acrylate compounds; (meth)acrylate-modified polyphenylene ether resin and other high molecular weight (molecular weight greater than 1000) acrylate compounds, etc. Among them, the (meth)acrylic acid-based free radical polymer resin is preferably a low molecular weight (molecular weight less than 1000) ether-containing (meth)acrylic acid ester compound, more preferably dioxanediol di(meth)acrylic acid ester, and even more preferably dioxanediol diacrylate.

[0228] Commercially available (meth)acrylic acid-based free radical polymer resins include, for example, "A-DOG" (dioxanediol diacrylate) manufactured by Shin-Nakamura Chemical Industry Co., Ltd., "DCP-A" (tricyclodecanediethanol diacrylate) and "DCP" (tricyclodecanediethanol dimethacrylate) manufactured by Kyoeisha Chemical Co., Ltd., "KAYARADR-684" (tricyclodecanediethanol diacrylate) and "KAYARAD R-604" (dioxanediol diacrylate) manufactured by Nippon Kayaku Co., Ltd., and "SA-9000" and "SA-9000-111" (methacrylic acid modified polyphenylene ether) manufactured by SABIC.

[0229] Styrene-based free radical polymeric resins can be, for example, compounds having one or more, preferably two or more, vinyl groups directly bonded to aromatic carbon atoms. Examples of styrene-based free radical polymeric resins include low molecular weight (molecular weight less than 1000) styrene compounds such as divinylbenzene, 2,4-divinyltoluene, 2,6-divinylnaphthalene, 1,4-divinylnaphthalene, 4,4'-divinylbiphenyl, 1,2-bis(4-vinylphenyl)ethane, 2,2-bis(4-vinylphenyl)propane, and bis(4-vinylphenyl) ether; and high molecular weight (molecular weight 1000 or more) styrene compounds such as vinylbenzyl-modified polyphenylene ether resins and styrene-divinylbenzene copolymers. Among these, high molecular weight (molecular weight 1000 or more) styrene-based free radical polymeric resins are preferred, and vinylbenzyl-modified polyphenylene ether resins are more preferably used.

[0230] Commercially available styrene-based free radical polymer resins include, for example, "ODV-XET(X03)", "ODV-XET(X04)", and "ODV-XET(X05)" (styrene-divinylbenzene copolymer) manufactured by Nippon Steel Chemical Materials Co., Ltd., and "OPE-2St", "OPE-2St 1200", and "OPE-2St 2200" (vinyl benzyl modified polyphenylene ether resin) manufactured by Mitsubishi Gas Chemical Co., Ltd.

[0231] Allyl-based free radical polymeric resins are, for example, compounds having one or more, preferably two or more, allyl groups. Examples of allyl-based free radical polymeric resins include aromatic carboxylic acid allyl ester compounds such as diallyl diphenate, trimellitic acid triallyl ester, phthalate diallyl ester, isophthalate diallyl ester, terephthalate diallyl ester, 2,6-naphthalenedicarboxylate diallyl ester, and 2,3-naphthalenedicarboxylate; isocyanurate allyl ester compounds such as 1,3,5-triallyl isocyanurate and 1,3-diallyl-5-glycidyl isocyanurate; and 2,2-bis[3-ene Aromatic allyl compounds containing epoxy groups, such as propyl-4-(glycidoxy)phenyl]propane; aromatic allyl compounds containing benzoxazine, such as bis[3-allyl-4-(3,4-dihydro-2H-1,3-benzoxazine-3-yl)phenyl]methane; aromatic allyl compounds containing ethers, such as 1,3,5-triallyl ether benzene; allyl silane compounds, such as diallyl diphenylsilane; resins of the following formula (F-1) obtained by reacting o-allylphenol, dicyclopentadiene / phenol copolymer resin, and isophthaloyl chloride, etc. [Chemical Formula 52] (In formula (F-1), the wavy line represents the structure obtained by the reaction of isophthaloyl chloride, phenol, and / or o-allylphenol via addition polymerization.)

[0232] Among them, the allyl-based free radical polymer resin is preferably an aromatic carboxylic acid allyl ester compound or the resin shown in the above formula (F-1), and more preferably diallyl biphenyl ester or the resin shown in the above formula (F-1).

[0233] Commercially available allyl-based free radical polymer resins include, for example: TAIC (1,3,5-triallyl isocyanurate) manufactured by Nippon Chemical Co., Ltd.; DAD (dallyl biphenylate) manufactured by Nisshoku Techno Fine Chemical Co., Ltd.; TRIAM-705 (triallyl trimellitate) manufactured by Fujifilm and Hikari Pure Chemical Industries Co., Ltd.; and Nisshoku Techno Fine Chemical Co., Ltd. Products manufactured under the trade name "DAND" (2,3-naphthoic acid diallyl ester) by Chemical Co., Ltd., "ALP-d" (bis[3-allyl-4-(3,4-dihydro-2H-1,3-benzoxazin-3-yl)phenyl]methane) by Shikoku Chemical Co., Ltd., "RE-810NM" (2,2-bis[3-allyl-4-(glycidoxy)phenyl]propane) by Nippon Kayaku Co., Ltd., and "DA-MGIC" (1,3-diallyl-5-glycidyl isocyanurate) by Shikoku Chemical Co., Ltd., etc.

[0234] Maleimide-based free radical polymer resins can be, for example, compounds having one or more, preferably two or more, maleimide groups. Maleimide-based free radical polymer resins can be aliphatic maleimide compounds containing an aliphatic amine skeleton, or aromatic maleimide compounds containing an aromatic amine skeleton. Commercially available maleimide-based free radical polymerizable compounds include, for example, Shin-Etsu Chemical Co., Ltd.'s "SLK-2600", Designer Molecules Inc.'s "BMI-1500", "BMI-1700", "BMI-3000J", "BMI-689", "BMI-2500" (maleimide compounds containing a dimeric diamine structure), Designer Molecules Inc.'s "BMI-6100" (aromatic maleimide compounds), Nippon Kayaku Co., Ltd.'s "MIR-5000-60T" and "MIR-3000-70MT" (biphenyl aryl maleimide compounds), KI Chemical Co., Ltd.'s "BMI-70" and "BMI-80", and Daiwa Chemical Industry Co., Ltd.'s "BMI-2300" and "BMI-TMH". Alternatively, the maleimide resin (a maleimide compound containing an indane ring skeleton) disclosed in Japanese Invention Association Publication No. 2020-500211 can also be used as a maleimide-based free radical polymer resin.

[0235] (F) The olefin unsaturated bond equivalent of the free radical polymeric resin is preferably 20 g / eq. to 3000 g / eq., more preferably 50 g / eq. to 2500 g / eq., even more preferably 70 g / eq. to 2000 g / eq., and particularly preferably 90 g / eq. to 1500 g / eq. The olefin unsaturated bond equivalent represents the mass of the free radical polymeric resin per 1 olefin unsaturated bond.

[0236] (F) The weight-average molecular weight (Mw) of the free radical polymeric resin is preferably 40,000 or less, more preferably 10,000 or less, even more preferably 5,000 or less, and particularly preferably 3,000 or less. The lower limit is not particularly limited; for example, it can be set to 150 or more.

[0237] In the case where the resin composition of the first embodiment of the present invention contains a (F) radical polymeric resin, from the viewpoint of significantly obtaining the effects of the present invention, when the non-volatile component in the resin composition is set to 100% by mass, the content of the (F) component in the resin composition is preferably 0.1% by mass or more or 1% by mass or more, more preferably 2% by mass or more or 3% by mass or more, further preferably 4% by mass or more or 5% by mass or more, particularly preferably 6% by mass or more, 7% by mass or more, or 7.5% by mass or more. In another embodiment, it may be set to 8% by mass or more, 9% by mass or more, 10% by mass or more, etc. The upper limit is preferably 30% by mass or less, more preferably 25% by mass or less, further preferably 20% by mass or less or 18% by mass or less, particularly preferably 15% by mass or less or 12% by mass or less. In another embodiment, it may be set to 11% by mass or less, etc.

[0238] In the case where the resin composition of the first embodiment of the present invention contains a (F) radical polymeric resin, from the viewpoint of significantly obtaining the effects of the present invention, when the resin component in the resin composition is set to 100% by mass, the content of the (F) component in the resin composition is preferably 0.1% by mass or more or 1% by mass or more, more preferably 2.5% by mass or more or 5% by mass or more, further preferably 7.5% by mass or more, 10% by mass or more or 12.5% ​​by mass or more, particularly preferably 15% by mass or more, 17.5% by mass or more or 20% by mass or more. In addition, in one embodiment, it may be set to 22.5% by mass or more, 25% by mass or more, etc. The upper limit is preferably 60% by mass or less, more preferably 55% by mass or less or 50% by mass or less, further preferably 45% by mass or less or 40% by mass or less, particularly preferably 35% by mass or less or 30% by mass or less. In addition, in one embodiment, it may be set to 28% by mass or less, 26% by mass or less, etc.

[0239] In the case where the resin composition of the first embodiment of the present invention contains a (F) radical polymeric resin, from the viewpoint of significantly obtaining the effects of the present invention, the mass ratio of the (F) component to the (IA) component [(F) component / (IA) component] is preferably 0.01 or more or 0.05 or more, more preferably 0.1 or more or 0.2 or more, further preferably 0.5 or more or 0.8 or more, and particularly preferably 1 or more or 1.2 or more. In another embodiment, it may be set to 1.4 or more, 1.6 or more, etc. The upper limit is preferably 100 or less or 80 or less, more preferably 50 or less or 20 or less, further preferably 15 or less, 10 or less or 8 or less, and particularly preferably 5 or less, 3 or less, 2 or less or 1.8 or less.

[0240] In the case where the resin composition of the first embodiment of the present invention contains a (F) radical polymeric resin, from the viewpoint of significantly obtaining the effects of the present invention, the mass ratio of component (F) to component (B) [(F) component / (B) component] is preferably 0.01 or more or 0.02 or more, more preferably 0.05 or more or 0.08 or more, further preferably 0.1 or more or 0.2 or more, and particularly preferably 0.5 or more or 0.7 or more. In another embodiment, it may be set to 0.8 or more, 0.9 or more, etc. The upper limit is preferably 100 or less or 80 or less, more preferably 50 or less or 20 or less, further preferably 15 or less, 10 or less or 8 or less, and particularly preferably 5 or less, 3 or less, 2 or less, 1.5 or less or 1.2 or less.

[0241] In the case where the resin composition of the first embodiment of the present invention contains a (F) radical polymeric resin, from the viewpoint of significantly obtaining the effects of the present invention, the mass ratio of (F) component to (C) component [(F) component / (C) component] is preferably 0.001 or more or 0.002 or more, more preferably 0.005 or more or 0.008 or more, further preferably 0.01 or more, 0.02 or more or 0.05 or more, and particularly preferably 0.08 or more, 0.1 or more or 0.12 or more. In one embodiment, it may be set to 0.14 or more, 0.16 or more, etc. The upper limit is preferably 20 or less or 15 or less, more preferably 10 or less, 8 or less or 5 or less, further preferably 2 or less, 1 or less or 0.8 or less, and particularly preferably 0.5 or less, 0.3 or less or 0.2 or less. In one embodiment, it may be set to 0.18 or less, etc.

[0242] In the case where the resin composition of the first embodiment of the present invention contains a (D) curing agent and a (F) free radical polymeric resin, from the viewpoint of significantly obtaining the effects of the present invention, the mass ratio of component (F) to component (D) [(F) component / (D) component] is preferably 0.01 or more or 0.02 or more, more preferably 0.05 or more or 0.08 or more, further preferably 0.1 or more or 0.2 or more, and particularly preferably 0.4 or more or 0.5 or more. In another embodiment, it may be set to 0.6 or more, 0.7 or more, 0.8 or more, etc. The upper limit is preferably 50 or less or 20 or less, more preferably 15 or less or 10 or less, further preferably 8 or less or 5 or less, and particularly preferably 3 or less, 2 or less or 1 or less.

[0243] In the case where the resin composition of the first embodiment of the present invention contains (E) a curing accelerator and (F) a free radical polymeric resin, from the viewpoint of significantly obtaining the effects of the present invention, the mass ratio of component (E) to component (F) [(E) component / (F) component] is preferably 0.0001 or more, more preferably 0.0002 or more or 0.0005 or more, further preferably 0.0008 or more or 0.001 or more, and particularly preferably 0.0015 or more or 0.002 or more. The upper limit is preferably 1 or less or 0.5 or less, more preferably 0.1 or less or 0.08 or less, further preferably 0.05 or less or 0.02 or less, and particularly preferably 0.01 or less, 0.008 or less, 0.005 or less, or 0.004 or less.

[0244] <(G) Free radical polymerization initiator> In the resin composition of the first embodiment of the present invention, a (G) radical polymerization initiator may be included as an optional component. If the resin composition contains a (F) radical polymeric resin, it is preferable to also include a (G) radical polymerization initiator. In the case where the resin composition of the first embodiment of the present invention contains a (F) radical polymeric resin, even without the (G) radical polymerization initiator, the (F) radical polymeric resin can be polymerized and cured by thermal free radicals generated by heating, etc. However, by including the (G) radical polymerization initiator, the polymerization reaction can be carried out more efficiently, resulting in a cured product exhibiting superior dielectric properties and superior adhesion. One (G) radical polymerization initiator may be used alone, or two or more may be used in combination.

[0245] From the viewpoint of producing cured products exhibiting superior dielectric properties, the temperature at which the (G) free radical polymerization initiator has a 1-hour half-life is preferably 100°C or higher, more preferably 110°C or higher, and even more preferably 120°C or higher. The upper limit is preferably 250°C or lower, more preferably 200°C or lower, and even more preferably 180°C or lower. The 1-hour half-life represents the time taken until the amount of polymerization initiator becomes half, which is 1 hour, and the temperature at which the 1-hour half-life is obtained represents the decomposition temperature of the free radical polymerization initiator.

[0246] As free radical polymerization initiators, compounds capable of generating free radicals by heating can be used. Examples of such compounds include peroxide-based free radical polymerization initiators, azo compound-based free radical polymerization initiators, persulfate compound-based free radical polymerization initiators, and redox-based free radical polymerization initiators.

[0247] Examples of peroxide-based free radical polymerization initiators include 1,1,3,3-tetramethylbutyl hydroperoxide and p-Menthane hydroperoxide. Hydrogen peroxide compounds including hydroperoxide, diisopropylbenzene hydroperoxide, isopropylbenzene hydroperoxide, tert-butyl hydroperoxide, etc.; dialkyl peroxide compounds including tert-butyl isopropylbenzene peroxide, di-tert-butyl peroxide, di-tert-hexyl peroxide, di-tert-pentyl peroxide, dicumyl peroxide, 1,4-bis(1-tert-butylperoxy-1-methylethyl)benzene (also known as α,α'-di(tert-butylperoxy)diisopropylbenzene), 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, 2,5-dimethyl-2,5-di(benzoylperoxy)hexane, 2,2-di(tert-butylperoxy)butane, di(2-tert-butylperoxyisopropyl)benzene, 2,5-dimethyl-2,5-di(tert-butylperoxy)hexyne-3, 2,3-dimethyl-2,3-diphenylbutane, etc. Compounds; peroxide diacyl compounds such as dilauroyl peroxide, didecanoyl peroxide, dicyclohexyl peroxide dicarbonate, and bis(4-tert-butylcyclohexyl) peroxide dicarbonate; peroxide ester compounds such as tert-butyl peroxyacetate, tert-butyl peroxybenzoate, tert-hexyl peroxybenzoate, tert-butyl peroxyisopropyl monocarbonate, tert-butyl peroxy-2-ethylhexanoate, tert-butyl peroxyneodecanate, tert-hexyl peroxyisopropyl monocarbonate, tert-butyl peroxylaurate, 2-ethylperoxyhexanoate (1,1-dimethylpropyl) ester, tert-butyl peroxyhexanoate (also known as tert-butyl peroxy-2-ethylhexanoate), tert-butyl peroxyhexanoate, tert-butyl peroxy-2-ethylhexanoate, tert-butyl peroxymaleic acid, and n-butyl 4,4-di(tert-butylperoxy)valerate, etc.

[0248] As a peroxide-based free radical polymerization initiator, it is preferably any one of hydrogen peroxide compound and dialkyl peroxide compound, more preferably dialkyl peroxide compound, further preferably di-tert-pentyl peroxide, di-tert-hexyl peroxide or dicumyl peroxide, and particularly preferably di-tert-pentyl peroxide or di-tert-hexyl peroxide.

[0249] Examples of azo compound-based free radical polymerization initiators include 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-methylbutyronitrile), 2,2'-azobis(2-methylpropionitrile), 2,2'-azobis(2,4-dimethylpentanitrile), 2,2'-azobis(2,4,4-trimethylpentane), 2,2'-azobis(2-methylpropane), 1,1'-azobis(cyclohexanecarboxynitrile), and dimethyl 2,2'-azobisisobutyrate, with 2,2'-azobisisobutyronitrile being the most preferred.

[0250] Examples of persulfate compounds that serve as initiators for free radical polymerization include potassium persulfate.

[0251] Commercially available free radical polymerization initiators can be used. Examples of commercially available free radical polymerization initiators include Nippon Oil Co., Ltd.'s "PERHEXYL I", "PERBUTYL 355", "PERBUTYL L", "PERBUTYL O", "PERBUTYL ND", "PERBUTYL I", "PERBUTYL E", "PERHEXYL Z", "PERHEXA 25Z", "PERBUTYL A", "PERHEXA 22", "PERBUTYL Z", "PERHEXA V", "PERBUTYL P", "PERCUMYL D", "PERHEXYL D", "PERHEXA 25B", "PERBUTYL C", "PERBUTYL D", "PERMENTA H", "PERHEXYNE 25B", "PERCUMYL D", "PERCUMYL P", "PEROCTA H", "PERCUMYL H", "PERBUTYL H", and "NOFMER BC"; Arkema Co., Ltd.'s "luperox DTA"; and others.

[0252] In the case where the resin composition of the first embodiment of the present invention contains a (G) free radical polymerization initiator, from the viewpoint of significantly obtaining the effects of the present invention, when the non-volatile component in the resin composition is set to 100% by mass, the content of the (G) component in the resin composition is preferably 0.0001% by mass or more or 0.0002% by mass or more, more preferably 0.0005% by mass or more or 0.0008% by mass or more, further preferably 0.001% by mass or more, 0.002% by mass or more or 0.005% by mass or more, particularly preferably 0.008% by mass or more, 0.01% by mass or more or 0.02% by mass or more. The upper limit is preferably 5% by mass or less or 2% by mass or less, more preferably 1% by mass or less, 0.8% by mass or less or 0.5% by mass or less, further preferably 0.2% by mass or less, 0.1% by mass or less or 0.08% by mass or less, particularly preferably 0.06% by mass or less, 0.05% by mass or less or 0.04% by mass or less.

[0253] In the case where the resin composition of the first embodiment of the present invention contains a (G) free radical polymerization initiator, from the viewpoint of significantly obtaining the effects of the present invention, when the resin component in the resin composition is set to 100% by mass, the content of the (G) component in the resin composition is preferably 0.0001% by mass or more or 0.0005% by mass or more, more preferably 0.001% by mass or more or 0.002% by mass or more, further preferably 0.005% by mass or more, 0.008% by mass or more or 0.01% by mass or more, particularly preferably 0.02% by mass or more, 0.04% by mass or more or 0.05% by mass or more. The upper limit is preferably 10% by mass or less or 5% by mass or less, more preferably 2% by mass or less or 1% by mass or less, further preferably 0.8% by mass or less or 0.5% by mass or less, particularly preferably 0.2% by mass or less, 0.1% by mass or less or 0.08% by mass or less.

[0254] In the case where the resin composition of the first embodiment of the present invention contains a (G) radical polymerization initiator, from the viewpoint of significantly obtaining the effects of the present invention, the mass ratio of component (G) to component (IA) [(G) component / (IA) component] is preferably 0.0001 or more, more preferably 0.0002 or more or 0.0005 or more, further preferably 0.0008 or more or 0.001 or more, and particularly preferably 0.002 or more or 0.003 or more. The upper limit is preferably 1 or less or 0.5 or less, more preferably 0.1 or less or 0.08 or less, further preferably 0.05 or less, 0.02 or less or 0.01 or less, and particularly preferably 0.008 or less, 0.006 or less or 0.005 or less.

[0255] When the resin composition of the first embodiment of the present invention contains a (G) radical polymerization initiator, from the viewpoint of significantly obtaining the effects of the present invention, the mass ratio of component (G) to component (B) [(G) component / (B) component] is preferably 0.0001 or more, more preferably 0.0002 or more or 0.0005 or more, further preferably 0.0008 or more or 0.001 or more, and particularly preferably 0.0015 or more or 0.002 or more. The upper limit is preferably 1 or less or 0.5 or less, more preferably 0.1 or less or 0.08 or less, further preferably 0.05 or less, 0.02 or less or 0.01 or less, and particularly preferably 0.008 or less, 0.005 or less or 0.003 or less.

[0256] In the case where the resin composition of the first embodiment of the present invention contains a (G) radical polymerization initiator, from the viewpoint of significantly obtaining the effects of the present invention, the mass ratio of (G) component to (C) component [(G) component / (C) component] is preferably 1×10⁻⁶. -5 The above is preferred to be 2×10 -5 Above or 5×10 -5 The above is further optimized to 8×10 -5 Above or 1×10 -4 The above is particularly preferred, with 2×10 -4 Above or 4×10 -4 That's all. The upper limit is preferably 1×10. -1 Below or 5×10 -2 Hereinafter, 1×10 is more preferred. -2 Below or 8×10 -3 The following is a further preferred option: 5×10 -3 Below or 2×10 -3 The following is particularly preferred: 1×10 -3 Below, 8×10 -4 Below or 5×10 -4 the following.

[0257] In the case where the resin composition of the first embodiment of the present invention contains a (D) curing agent and a (G) free radical polymerization initiator, from the viewpoint of significantly obtaining the effects of the present invention, the mass ratio of component (G) to component (D) [(G) component / (D) component] is preferably 0.0001 or more, more preferably 0.0002 or more, further preferably 0.0005 or more or 0.0008 or more, and particularly preferably 0.001 or more or 0.0015 or more. The upper limit is preferably 1 or less or 0.5 or less, more preferably 0.1 or less or 0.08 or less, further preferably 0.05 or less, 0.02 or less or 0.01 or less, and particularly preferably 0.008 or less, 0.005 or less or 0.003 or less.

[0258] In the case where the resin composition of the first embodiment of the present invention contains a (E) curing accelerator and a (G) free radical polymerization initiator, from the viewpoint of significantly obtaining the effects of the present invention, the mass ratio of the (G) component to the (E) component [(G) component / (E) component] is preferably 0.01 or more or 0.02 or more, more preferably 0.05 or more or 0.08 or more, further preferably 0.1 or more or 0.2 or more, and particularly preferably 0.5 or more or 0.8 or more. The upper limit is preferably 100 or less or 80 or less, more preferably 50 or less or 20 or less, further preferably 10 or less, 8 or less or 5 or less, and particularly preferably 2 or less, 1.5 or less or 1.2 or less.

[0259] In the case where the resin composition of the first embodiment of the present invention contains a (F) radical polymeric resin and a (G) radical polymerization initiator, from the viewpoint of significantly obtaining the effects of the present invention, the mass ratio of component (G) to component (F) [(G) component / (F) component] is preferably 0.0001 or more, more preferably 0.0002 or more or 0.0005 or more, further preferably 0.0008 or more or 0.001 or more, and particularly preferably 0.0015 or more or 0.002 or more. The upper limit is preferably 1 or less or 0.5 or less, more preferably 0.1 or less or 0.08 or less, further preferably 0.05 or less or 0.02 or less, and particularly preferably 0.01 or less, 0.008 or less, 0.005 or less, or 0.004 or less.

[0260] <(H) organic solvent> In the resin composition of the first embodiment of the present invention, an (H) organic solvent may be included as an optional component, and it is preferred to include an (H) organic solvent. By including an (H) organic solvent in the resin composition, a resin composition varnish with an appropriate viscosity can be obtained. One (H) organic solvent may be used alone, or two or more may be used in combination.

[0261] Examples of (H) organic solvents include organic solvents composed of atoms selected from carbon, oxygen, nitrogen, phosphorus, sulfur, halogen, and hydrogen atoms. From a safety point of view, (H) organic solvents are preferably organic solvents composed of atoms selected from carbon, oxygen, and hydrogen atoms, and more preferably organic solvents composed of carbon, oxygen, and hydrogen atoms.

[0262] Examples of (H) organic solvents include glycol-based organic solvents, glycol ether-based organic solvents, glycol ether ester-based organic solvents, ketone-based organic solvents, ester-based organic solvents, ether-based organic solvents, alcohol-based organic solvents, aliphatic hydrocarbon-based organic solvents, aromatic organic solvents, nitrogen-based organic solvents, sulfur-based organic solvents, and halogen-based organic solvents. Examples of nitrogen-based organic solvents include amide-based organic solvents, urea-based organic solvents, and nitrile-based organic solvents. From a safety perspective, ester-based organic solvents, ketone-based organic solvents, glycol-based organic solvents, glycol ether-based organic solvents, glycol ether ester-based organic solvents, or aromatic organic solvents are preferred as (H) organic solvents. More preferably, ester-based organic solvents, glycol ether ester-based organic solvents, ketone-based organic solvents, or aromatic organic solvents are also preferred. Ketone-based organic solvents or aromatic organic solvents are even more preferred, and ketone-based organic solvents are particularly preferred.

[0263] Examples of diol-based organic solvents include ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, and trimethylene glycol.

[0264] Examples of glycol ether-based organic solvents include ethylene glycol monomethyl ether (also known as methyl cellosolve), ethylene glycol monoethyl ether (also known as cellosolve), ethylene glycol monopropyl ether (also known as propyl cellosolve), ethylene glycol monobutyl ether (also known as butyl cellosolve), ethylene glycol monoisobutyl ether (also known as isobutyl cellosolve), ethylene glycol monotert-butyl ether (also known as tert-butyl cellosolve), and ethylene glycol monohexyl ether; diethylene glycol monomethyl ether (also known as methyl carbitol) Carbitol derivatives include: diethylene glycol monoethyl ether (also known as carbitol), diethylene glycol monopropyl ether (also known as propyl carbitol), and diethylene glycol monobutyl ether (DB) (also known as butyl carbitol); propylene glycol ether derivatives include: propylene glycol monomethyl ether (PGM), propylene glycol monoethyl ether, propylene glycol monopropyl ether, and propylene glycol monobutyl ether; and dipropylene glycol ether derivatives include: dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, and dipropylene glycol monobutyl ether.

[0265] Examples of glycol ether ester-based organic solvents include: ethylene glycol monomethyl ether acetate (also known as methyl cellosolve acetate), ethylene glycol monoethyl ether acetate (also known as cellosolve acetate), ethylene glycol monobutyl ether acetate (also known as butyl cellosolve acetate), and other cellosolve esters; carbitol esters such as diethylene glycol monoethyl ether acetate (EDGAc) (also known as carbitol acetate) and diethylene glycol monobutyl ether acetate (also known as butyl carbitol acetate); propylene glycol ether esters such as propylene glycol monomethyl ether acetate (PGMEAc) and propylene glycol monoethyl ether acetate; and dipropylene glycol ether esters such as dipropylene glycol monomethyl ether acetate, preferably carbitol esters, and more preferably diethylene glycol monoethyl ether acetate.

[0266] Examples of ketone-based organic solvents include aliphatic acyclic ketones such as acetone, methyl ethyl ketone (MEK), diethyl ketone, 2-pentanone, methyl isobutyl ketone, 2-hexanone, 2-heptanone (MAK), and diisobutyl ketone; aliphatic cyclic ketones such as cyclopentanone, cyclohexanone (Anone), and 2-methylcyclohexanone; and aromatic ketones such as acetophenone, with methyl ethyl ketone (MEK) or cyclohexanone being preferred. The lower limit of the number of carbon atoms in the ketone-based organic solvent is preferably 2 or more, more preferably 3 or more, and even more preferably 4 or more. The upper limit of the number of carbon atoms in the ketone-based organic solvent is preferably 10 or less, more preferably 8 or less, and even more preferably 6 or less.

[0267] Ester-based organic solvents are organic solvents with ester structures that do not belong to the glycol ether ester system. Examples include alkyl esters of fatty acids such as methyl acetate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, sec-butyl acetate, tert-butyl acetate, n-pentyl acetate, isopentyl acetate, ethyl propionate, propyl propionate, and isopropyl propionate; alkyl esters of hydroxy acids such as methyl lactate, ethyl lactate, and butyl lactate; alkyl esters of keto acids such as methyl acetoacetate and ethyl acetoacetate; lactones such as γ-butyrolactone and α-acetyl-γ-butyrolactone; and aromatic esters such as methyl benzoate and ethyl benzoate. Lactones are preferred as ester-based organic solvents. Furthermore, the number of carbon atoms in ester-based organic solvents is preferably 3 to 9.

[0268] Ether-based organic solvents are organic solvents with ether structures that do not belong to the glycol ether system or the glycol ether ester system. Examples include aliphatic noncyclic ethers such as dimethyl ether, diethyl ether, methyl ethyl ether, diisopropyl ether, dibutyl ether, methyl tert-butyl ether, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, and triethylene glycol dimethyl ether; aliphatic cyclic ethers such as tetrahydrofuran, 1,4-dioxane, and 1,3-dioxolane; and aromatic ethers such as anisole and phenethyl ether. The preferred number of carbon atoms in ether-based organic solvents is 2 to 9.

[0269] Alcohol-based organic solvents are organic solvents with an alcohol structure that do not belong to the diol-based or diol ether-based organic solvents. Examples include aliphatic noncyclic alcohols such as methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, sec-butanol, tert-butanol, n-pentanol, isopentanol, sec-pentanol, tert-pentanol, neopentanol, n-hexanol, n-heptanol, isoheptanol, n-octanol, and 2-ethylhexanol; aliphatic cyclic alcohols such as cyclohexanol; and aromatic alcohols such as benzyl alcohol and phenethyl alcohol.

[0270] Examples of aliphatic hydrocarbon organic solvents include n-pentane, n-hexane, 2-methylpentane (also known as isohexane), n-heptane, n-octane, cyclopentane, cyclohexane, methylcyclohexane, ethylcyclohexane, and naphthane. The preferred number of carbon atoms in aliphatic hydrocarbon organic solvents is 5 to 10.

[0271] Examples of aromatic organic solvents include benzene, toluene, o-xylene, m-xylene, p-xylene, and ethylbenzene. 6-8 Aromatic hydrocarbons; C9 aromatic hydrocarbons including 1,2,3-trimethylbenzene, 1,3,5-trimethylbenzene (also known as trimethylbenzene), 1,2,4-trimethylbenzene, 4-ethyltoluene, 3-ethyltoluene, 2-ethyltoluene, etc.; C9 aromatic hydrocarbons including 1,2-diethylbenzene, 1,3-diethylbenzene, 1,4-diethylbenzene, 3-ethyl-o-xylene, 4-ethyl-o-xylene, 2-ethyl-p-xylene, 1,2,3,5-tetramethylbenzene, tetrahydronaphthalene, etc. 10 Aromatic hydrocarbons; aromatic heterocyclic compounds such as pyridine, furan, and thiophene, preferably toluene. The aromatic organic solvent preferably has 6 to 10 carbon atoms.

[0272] Examples of amide-based organic solvents include aliphatic acyclic amides such as N,N-dimethylacetamide and N,N-dimethylformamide; lactams such as N-methyl-2-pyrrolidone and N-cyclohexyl-2-pyrrolidone; and phosphoramides such as hexamethylphosphoramide. The preferred number of carbon atoms in amide-based organic solvents is 2 to 10.

[0273] Examples of urea-based organic solvents include tetramethylurea and 1,3-dimethyl-2-imidazolinone.

[0274] Examples of nitrile organic solvents include acetonitrile, propionitrile, and benzonitrile. The preferred number of carbon atoms in nitrile organic solvents is 2 to 10.

[0275] Examples of sulfur-based organic solvents include dimethyl sulfoxide.

[0276] Examples of halogenated organic solvents include chloroform, dichloromethane, carbon tetrachloride, and 1,2-dichloroethane. The preferred number of carbon atoms in halogenated organic solvents is 1 to 10.

[0277] The organic solvent used in (H) is preferably γ-butyrolactone, methyl ethyl ketone (MEK), cyclopentanone, cyclohexanone, propylene glycol, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, or toluene, more preferably methyl ethyl ketone (MEK), cyclohexanone, diethylene glycol monoethyl ether acetate, γ-butyrolactone, or toluene, even more preferably methyl ethyl ketone (MEK), cyclohexanone, or toluene, and particularly preferably methyl ethyl ketone (MEK) or cyclohexanone.

[0278] When the resin composition of the first embodiment of the present invention contains an (H) organic solvent, when all components in the resin composition are set to 100% by mass, the content of the (H) component in the resin composition is preferably 1% by mass or more or 2% by mass or more, more preferably 5% by mass or more or 8% by mass or more, further preferably 10% by mass or more or 12% by mass or more, and particularly preferably 15% by mass or more. The upper limit is preferably 50% by mass or less, more preferably 45% by mass or less or 40% by mass or less, further preferably 35% by mass or less or 30% by mass or less, and particularly preferably 25% by mass or less or 20% by mass or less.

[0279] <(I) Other Additives> In the resin composition of the first embodiment of the present invention, other additives may be further included as optional components to the extent that they do not impede the purpose of the present invention. Examples of such additives include: thermoplastic resins such as phenoxy resins; organic fillers such as rubber particles; organometallic compounds such as organocopper compounds, organozinc compounds, and organocobalt compounds; colorants such as phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, crystal violet, titanium dioxide, and carbon black; polymerization inhibitors such as hydroquinone, catechol, pyrogallol, and phenothiazine; leveling agents such as silicone-based leveling agents and acrylic polymer-based leveling agents; thickeners such as Benton and montmorillonite; defoamers such as silicone-based defoamers, acrylic-based defoamers, fluorine-based defoamers, and vinyl resin-based defoamers; ultraviolet absorbers such as benzotriazole-based ultraviolet absorbers; adhesion enhancers such as ureasilanes; triazole-based adhesion enhancers, tetraazole-based adhesion enhancers, etc. Adhesion enhancers such as triazine-based adhesion enhancers; antioxidants such as hindered phenolic antioxidants; fluorescent whitening agents such as stilbene derivatives; surfactants such as fluorine-based and organosilicon-based surfactants; flame retardants such as phosphorus-based flame retardants (e.g., phosphate ester compounds, phosphazene compounds, phosphonic acid compounds, red phosphorus), nitrogen-based flame retardants (e.g., melamine sulfate), halogen-based flame retardants, and inorganic flame retardants (e.g., antimony trioxide); dispersants such as phosphate ester-based dispersants, polyoxyethylene-based dispersants, acetylene-based dispersants, organosilicon-based dispersants, anionic dispersants, and cationic dispersants; stabilizers such as borate ester stabilizers, titanate ester stabilizers, aluminate ester stabilizers, zirconate ester stabilizers, isocyanate stabilizers, carboxylic acid stabilizers, and carboxylic anhydride stabilizers. These additives can be used alone or in combination of two or more. The content of the additives can be determined according to the desired properties of the resin composition. Furthermore, the aforementioned components (1A) to (H) may also function as thermoplastic resins, organic fillers, organometallic compounds, colorants, polymerization inhibitors, leveling agents, thickeners, defoamers, ultraviolet absorbers, adhesion enhancers, bonding agents, antioxidants, fluorescent whitening agents, flame retardants, dispersants, and stabilizers. In this case, the component is not component (I), but is considered as a component of components (1A) to (H).

[0280] [Resin Composition of the Second Embodiment] The resin composition of the second embodiment of the present invention contains (2A) a polymer having a second specific structure, (B) an epoxy resin, and (C) an inorganic filler. The second specific structure will be described later. By combining components (2A) to (C) and including them in the resin composition, a cured product exhibiting excellent dielectric properties and excellent adhesion can be obtained. In the resin composition of the second embodiment, any other components may be further included in combination with components (2A) to (C). Examples of such arbitrary components include (D) a curing agent, (E) a curing accelerator, (F) a free radical polymeric resin, (G) a free radical polymerization initiator, (H) an organic solvent, and (I) other additives. Hereinafter, the components contained in the resin composition of the second embodiment will be described.

[0281] <(2A) Polymers with a second specific structure> The resin composition of the second embodiment of the present invention contains (2A) a polymer (polymer having a second specific structure) formed by reacting cyanuric chloride, optionally hydrogenated bisphenols, a compound represented by formula (X-1) below, and a monophenol. Since the optionally hydrogenated bisphenols have a rigid backbone, it is believed that by giving component (2A) a backbone derived from the optionally hydrogenated bisphenols, thermal stability can be improved and thermal oxidative degradation caused by heating during the curing of the resin composition can be suppressed. Furthermore, it is believed that by giving component (2A) a rigid backbone derived from the optionally hydrogenated bisphenols, a cured product that is less susceptible to the effects of molecular motion caused by high frequencies and exhibits excellent dielectric properties can be obtained. Component (2A) can be used alone or in combination of two or more. [Chemical Formula 53] (In equation (X-1), R) 1 It is a monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms. 1 The molecular weight is above 250, R 1 It does not have an olefinic unsaturated group, R 1 It does not contain at least one of a triazine backbone and an optionally hydrogenated bisphenol backbone.

[0282] In equation (X-1), R 1 It is a monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms. 1 The molecular weight is above 250, R 1 It does not have an olefinic unsaturated group, R 1 It does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. R in formula (X-1) 1R in equation (A-1) 1 same.

[0283] The optional hydrogenated bisphenols involved in component (2A) are the same as the optional hydrogenated bisphenols described in the section on <(1A) Method for manufacturing polymer having a first specific structure> in component (1A) above.

[0284] The monophenols involved in component (2A) are the same as those described in the column <(1A) Method for manufacturing polymer having a first specific structure> in component (1A) above.

[0285] <(2A) Method for manufacturing polymers having a second specific structure> (2A) The preparation method of the polymer having the second specific structure is the same as the preparation method of the polymer having the first specific structure described in (1A).

[0286] <(B) Epoxy Resin> The resin composition of the second embodiment of the present invention contains (B) epoxy resin. The (B) epoxy resin involved in the second embodiment is the same as the (B) epoxy resin involved in the first embodiment.

[0287] <(C) Inorganic filler materials> The resin composition of the second embodiment of the present invention contains (C) inorganic filler. The (C) inorganic filler in the second embodiment is the same as the (C) inorganic filler in the first embodiment.

[0288] <(D) Curing Agent> The resin composition of the second embodiment of the present invention may also contain (D) curing agent, preferably containing (D) curing agent. The (D) curing agent involved in the second embodiment is the same as the (D) curing agent involved in the first embodiment.

[0289] <(E) Curing Accelerator> The resin composition of the second embodiment of the present invention may also contain an (E) curing accelerator, preferably an (E) curing accelerator. The (E) curing accelerator involved in the second embodiment is the same as the (E) curing accelerator involved in the first embodiment.

[0290] <(F) Free Radical Polymer Resins> The resin composition of the second embodiment of the present invention may also contain (F) radical polymeric resin. The (F) radical polymeric resin involved in the second embodiment is the same as the (F) radical polymeric resin involved in the first embodiment.

[0291] <(G) Free radical polymerization initiator> The resin composition of the second embodiment of the present invention may also contain a (G) radical polymerization initiator. The (G) radical polymerization initiator involved in the second embodiment is the same as the (G) radical polymerization initiator involved in the first embodiment.

[0292] <(H) organic solvent> The resin composition of the second embodiment of the present invention may also contain an (H) organic solvent, preferably an (H) organic solvent. The (H) organic solvent involved in the second embodiment is the same as the (H) organic solvent involved in the first embodiment.

[0293] <(I) Other Additives> The resin composition of the second embodiment of the present invention may also contain (I) other additives. The (I) other additives involved in the second embodiment are the same as the (I) other additives involved in the first embodiment.

[0294] [Method for manufacturing the resin composition] The method for manufacturing the resin composition of the present invention comprises: (1) The step of reacting cyanuryl chloride, optionally hydrogenated bisphenols, a compound represented by formula (X-1) below, and a monophenol to obtain a polymer, and (2) The process of mixing the polymer, epoxy resin and inorganic filler material obtained in step (1). [Chemical Formula 54] (In equation (X-1), R) 1 It is a monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms. 1 The molecular weight is above 250, R 1 It does not have an olefinic unsaturated group, R 1 It does not contain at least one of a triazine backbone and an optionally hydrogenated bisphenol backbone.

[0295] <Process (1)> In step (1), a polymer is obtained by reacting cyanuric chloride, optionally hydrogenated bisphenols, the compound shown in formula (X-1) above, and monophenols.

[0296] In equation (X-1), R 1 It is a monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms. 1 The molecular weight is above 250, R 1 It does not have an olefinic unsaturated group, R 1It does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. R in formula (X-1) 1 R in equation (A-1) 1 same.

[0297] The optional hydrogenated bisphenol involved in step (1) is the same as the optional hydrogenated bisphenol described in the column <(1A) Method for manufacturing polymer having a first specific structure> of the above-mentioned component (1A).

[0298] The monophenols involved in process (1) are the same as those described in the column <(1A) Method for manufacturing polymers having a first specific structure> in the above-mentioned component (1A).

[0299] The solvent, alkali used, reaction temperature, reaction time, purification, etc. in step (1) are the same as those described in the column <(1A) Manufacturing method of polymer having a first specific structure> in the above (1A) component.

[0300] <Process (2)> In step (2), the polymer, epoxy resin, and inorganic filler obtained in step (1) are mixed. The mixing can be carried out by mixing equipment such as a three-roll mill, ball mill, bead mill, sand mill, or stirring equipment such as a high-speed mixer, planetary mixer, or high-speed rotary mixer, as needed. In step (2), the above-mentioned components (D) to (I) can also be added and mixed as needed.

[0301] As a component of the resin composition of the present invention, when using a substance diluted with a solvent, a solid resin obtained by removing the solvent can be used, or the substance diluted with a solvent can be used directly. The solvent portion can also be used as an (H) organic solvent.

[0302] <Properties and Uses of Resin Compositions> In one embodiment, the cured resin composition of the present invention exhibits a low dielectric constant (Dk). For example, when measured at 5.8 GHz and 23°C as described in the section "Experimental Example 1: Determination of Dielectric Properties (Dielectric Constant, Dielectric Loss Tangent)" described later, the dielectric constant (Dk) of the cured resin composition of the present invention is preferably 3.5 or less, 3.4 or less, 3.3 or less, 3.2 or less, 3.15 or less, 3.1 or less, 3.05 or less, or 3.0 or less. The lower limit is not particularly limited and can be set to 1.0 or more, 1.1 or more, or 1.5 or more, etc.

[0303] In one embodiment, the cured resin composition of the present invention exhibits a low dielectric loss tangent (Df). For example, when measured at 5.8 GHz and 23°C as described in the section "Experimental Example 1: Determination of Dielectric Properties (Dielectric Constant, Dielectric Loss Tangent)" described later, the dielectric loss tangent (Df) of the cured resin composition of the present invention is preferably 0.010 or less, 0.008 or less, 0.006 or less, 0.005 or less, 0.004 or less, 0.0035 or less, 0.003 or less, 0.0028 or less, 0.0027 or less, 0.0026 or less, 0.0025 or less, 0.0024 or less, 0.0023 or less, 0.0022 or less, or 0.0021 or less. The lower limit is not particularly limited, but may be 0.0001 or more, or 0.001 or more, etc.

[0304] In one embodiment, the cured resin composition of the present invention exhibits excellent substrate adhesion (high copper foil peel strength). For example, when the test is conducted as described in the section "Test Example 2: Determination of Substrate Adhesion (Copper Foil Peel Strength)" described later, the load used for measuring the copper foil peel strength is preferably 0.3 kgf / cm or more, 0.35 kgf / cm or more, 0.4 kgf / cm or more, 0.45 kgf / cm or more, 0.5 kgf / cm or more, or 0.55 kgf / cm or more. There is no particular upper limit, but it can be set to 10 kgf / cm or less, 1 kgf / cm or less, etc.

[0305] In one embodiment, the cured resin composition of the present invention exhibits excellent plating adhesion (high peel strength between the insulating layer and the plated conductor layer). For example, when the test is conducted as described in the section "Test Example 3: Determination of Peel Strength of Plated Conductor Layer" below, the load used to measure the peel strength between the insulating layer and the plated conductor layer is preferably 0.2 kgf / cm or more, 0.25 kgf / cm or more, 0.3 kgf / cm or more, 0.32 kgf / cm or more, 0.34 kgf / cm or more, 0.36 kgf / cm or more, 0.38 kgf / cm or more, 0.4 kgf / cm or more, 0.42 kgf / cm or more, or 0.44 kgf / cm or more. There is no particular upper limit, but it can be set to 10 kgf / cm or less, 1 kgf / cm or less, etc.

[0306] Using the resin composition of the present invention, a cured product with excellent dielectric properties and adhesion can be obtained. Therefore, the resin composition of the present invention is suitable for use as a resin composition for insulating purposes. Specifically, it is suitable for use as a resin composition for forming an insulating layer (a resin composition for forming an insulating layer for forming a conductor layer), wherein the insulating layer is a layer for forming a conductor layer (including a redistribution layer), and the conductor layer is formed on the insulating layer.

[0307] In addition, in the multilayer printed wiring board described later, a resin composition suitable for forming an insulating layer of the multilayer printed wiring board (resin composition for forming an insulating layer of a multilayer printed wiring board) and a resin composition suitable for forming an interlayer insulating layer of the printed wiring board (resin composition for forming an interlayer insulating layer of a printed wiring board) can be used.

[0308] Furthermore, for example, when manufacturing a semiconductor chip package through the following processes (1) to (6), the resin composition of the present invention can also be used as a resin composition for forming a rewiring layer (resin composition for forming a rewiring layer) as an insulating layer for forming a rewiring layer, and as a resin composition for sealing a semiconductor chip (resin composition for sealing a semiconductor chip). During the manufacturing of the semiconductor chip package, a rewiring layer may also be further formed on the sealing layer. (1) The process of laminating a temporary fixing film on a substrate; (2) The process of temporarily fixing the semiconductor chip onto the temporary fixing film. (3) The process of forming a sealing layer on a semiconductor chip. (4) The process of peeling the substrate and temporary fixing film from the semiconductor chip. (5) The process of forming a rewiring layer as an insulating layer on the surface of a semiconductor chip where the substrate and temporary fixing film have been stripped, and... (6) The process of forming a redistribution layer as a conductor layer on the redistribution forming layer.

[0309] [Resin Sheets] The resin sheet of the present invention includes a support and a resin composition layer comprising the resin composition of the present invention disposed on the support.

[0310] From the viewpoint of achieving thinner printed wiring boards and that the cured resin composition, even in the form of a thin film, can provide a cured product with excellent insulation properties, the thickness of the resin composition layer is preferably 50 μm or less, more preferably 40 μm or less, and even more preferably 30 μm or less. There is no particular limitation on the lower limit of the resin composition layer thickness; it can typically be set to 5 μm or more.

[0311] Examples of supports include films containing plastic materials, metal foils, and release paper, with films and metal foils containing plastic materials being preferred.

[0312] When using a film containing plastic materials as a support, examples of plastic materials include: polyesters such as polyethylene terephthalate (hereinafter sometimes abbreviated as "PET") and polyethylene naphthalate (hereinafter sometimes abbreviated as "PEN"), acrylic polymers such as polycarbonate (hereinafter sometimes abbreviated as "PC") and polymethyl methacrylate (PMMA), cyclic polyolefins, triacetyl cellulose (TAC), polyether sulfide (PES), polyether ketone, and polyimide. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred, and inexpensive polyethylene terephthalate is particularly preferred.

[0313] When using metal foil as a support, examples of metal foil include copper foil and aluminum foil, with copper foil being preferred. As copper foil, foil containing a single metal such as copper can be used, or foil containing an alloy of copper with other metals (such as tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) can be used.

[0314] For the support, matte finish, corona treatment, and antistatic treatment can be applied to the surface that bonds with the resin composition layer.

[0315] Furthermore, as a support, a support with a release layer can be used on the surface that bonds to the resin composition layer. Examples of release agents for the release layer of a support with a release layer include, for example, one or more release agents selected from alkyd resins, polyolefin resins, polyurethane resins, and silicone resins. Commercially available release agents include "SK-1," "AL-5," and "AL-7" manufactured by Lintec Corporation. Additionally, commercially available products can be used as supports with release layers, such as "Purex" manufactured by Toyobo Corporation and "Unipeel" manufactured by Unitech Corporation, which are PET films having a release layer with an alkyd resin-based release agent or a polyolefin resin-based release agent as the main component.

[0316] The thickness of the support is not particularly limited, but it is preferably in the range of 5 μm to 75 μm, and more preferably in the range of 10 μm to 60 μm. It should be noted that when using a support with a release layer, it is preferable that the overall thickness of the support with the release layer is within the above-mentioned range.

[0317] In one embodiment, the resin sheet may further contain other layers as needed. Examples of such other layers include, for instance, a protective film, selected according to the support, provided on the side of the resin composition layer that is not bonded to the support (i.e., the side opposite to the support). The thickness of the protective film is not particularly limited, for example, from 1 μm to 40 μm. By laminating the protective film, it is possible to suppress the adhesion of debris or other contaminants to the surface of the resin composition layer, or to prevent damage.

[0318] Resin sheets can be manufactured, for example, by directly coating a liquid (varnish-like) resin composition onto a support using a die coater or similar machine, or by preparing a resin varnish by dissolving the resin composition in an organic solvent and coating the resin varnish onto a support using a die coater or similar machine, and then drying it to form a resin composition layer.

[0319] Examples of organic solvents include ketones such as acetone, methyl ethyl ketone (MEK), and cyclohexanone; acetates such as ethyl acetate, butyl acetate, acetic acid solvents (solvent acetate), propylene glycol monomethyl ether acetate, and carbitol acetate; carbitols such as solvents and butyl carbitol; aromatic hydrocarbons such as toluene and xylene; and amide solvents such as dimethylformamide, dimethylacetamide (DMAc), and N-methylpyrrolidone. Organic solvents can be used alone or in combination of two or more.

[0320] Drying can be carried out by known methods such as heating or hot air blowing. There are no particular limitations on the drying conditions; drying is carried out in a manner that ensures the content of organic solvent in the resin composition layer is 10% by mass or less, preferably 5% by mass or less. The drying method also varies depending on the boiling point of the organic solvent in the resin varnish. For example, when using a resin varnish containing 30% to 60% by mass of organic solvent, the resin composition layer can be formed by drying at 50°C to 150°C for 3 to 10 minutes.

[0321] Resin sheets can be rolled into rolls for storage. If the resin sheet has a protective film, it can be used by peeling off the protective film.

[0322] Printed wiring board The printed wiring board of the present invention comprises an insulating layer formed using a cured product of the resin composition of the present invention.

[0323] Printed wiring boards can be manufactured, for example, using the resin sheet described above through a method comprising the steps (I) and (II) below: (I) A process of laminating a resin composition layer of a resin sheet onto an inner substrate by bonding it to the inner substrate. (II) The process of heat curing the resin composition layer to form an insulating layer.

[0324] The "inner layer substrate" used in step (I) refers to a component that becomes the substrate of a printed wiring board, such as a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, or a thermosetting polyphenylene ether substrate. Furthermore, this substrate may have a conductor layer on one or both sides, and this conductor layer may be patterned. An inner layer substrate with a conductor layer (circuit) formed on one or both sides of the substrate is sometimes called an "inner layer circuit substrate." Additionally, intermediate components for which insulating layers and / or conductor layers are to be further formed during the manufacture of a printed wiring board are also included in the "inner layer substrate" as described in this invention. In the case where the printed wiring board is a component-integrated circuit board, an inner layer substrate with the component integrated can be used.

[0325] The lamination of the inner substrate and the resin sheet can be achieved, for example, by heating and pressing the resin sheet onto the inner substrate from the support side. Examples of components for heating and pressing the resin sheet onto the inner substrate (hereinafter also referred to as "heat-pressing components") include, for example, heated metal plates (SUS end plates (mirror plates)) or metal rollers (SUS rollers). It should be noted that it is preferable not to press the heat-pressing component directly onto the resin sheet, but rather to press it through an elastic material such as heat-resistant rubber, so that the resin sheet fully follows the surface irregularities of the inner substrate.

[0326] The lamination of the inner substrate and the resin sheet can be performed by vacuum lamination. In vacuum lamination, the heating and pressing temperature is preferably in the range of 60°C to 160°C, more preferably 80°C to 140°C; the heating and pressing pressure is preferably in the range of 0.098 MPa to 1.77 MPa, more preferably 0.29 MPa to 1.47 MPa; and the heating and pressing time is preferably in the range of 20 seconds to 400 seconds, more preferably 30 seconds to 300 seconds. Lamination is preferably performed under reduced pressure conditions of 26.7 hPa or less.

[0327] Lamination can be performed using commercially available vacuum laminators. Examples of commercially available vacuum laminators include the vacuum pressure laminator manufactured by Meiki Manufacturing Co., Ltd., the vacuum dressing device manufactured by Nikko-Materials Co., Ltd., and the intermittent vacuum pressure laminator.

[0328] After lamination, the laminated resin sheets can be smoothed under normal pressure (atmospheric pressure), for example, by pressing the heated bonding member from the support side. The pressing conditions for smoothing can be the same as the heating and pressing conditions for lamination described above. Smoothing can be performed using a commercially available laminator. It should be noted that lamination and smoothing can also be performed continuously using the aforementioned commercially available vacuum laminator.

[0329] The support can be removed between process (I) and process (II), or it can be removed after process (II).

[0330] In step (II), the resin composition layer is thermocured to form an insulating layer. The thermocuring conditions for the resin composition layer are not particularly limited, and the conditions typically used when forming an insulating layer for a printed wiring board can be used.

[0331] For example, the thermosetting conditions of the resin composition layer vary depending on the type of resin composition, but the curing temperature is preferably 120°C to 240°C, more preferably 150°C to 220°C, and even more preferably 170°C to 210°C. The curing time can preferably be set to 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, and even more preferably 15 minutes to 100 minutes.

[0332] The resin composition layer can be preheated at a temperature lower than the curing temperature before thermal curing. For example, the resin composition layer can be preheated for 5 minutes or more (preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and even more preferably 15 minutes to 100 minutes) at a temperature of 50°C or higher and lower than 120°C (preferably 60°C or higher and lower than 115°C, more preferably 70°C or higher and lower than 110°C) before thermal curing.

[0333] During the manufacture of a printed wiring board, steps (III) of opening holes in the insulating layer, (IV) of roughening the insulating layer, and (V) of forming a conductor layer may be further performed. These steps (III) and (V) may be performed according to various methods known to those skilled in the art in the manufacture of printed wiring boards. It should be noted that if the support is removed after step (II), the removal of the support may be performed between steps (II) and (III), between steps (III) and (IV), or between steps (IV) and (V). In addition, as needed, the formation of the insulating layer and conductor layer in steps (II) to (V) may be repeated to form a multilayer wiring board.

[0334] Process (III) is the process of creating openings in the insulating layer, thereby forming through holes, vias, and other holes in the insulating layer. Process (III) can be performed using tools such as drills, lasers, or plasma, depending on the composition of the resin composition used to form the insulating layer. The size and shape of the holes can be appropriately determined according to the design of the printed circuit board.

[0335] Step (IV) is a roughening process for the insulating layer. Typically, this step (IV) also includes the removal of contaminants. The roughening process and conditions are not particularly limited, and known steps and conditions commonly used in forming the insulating layer of a printed wiring board can be employed. For example, the insulating layer can be roughened sequentially by a swelling treatment using a swelling solution, a roughening treatment using an oxidizing agent, and a neutralization treatment using a neutralizing solution. The swelling solution used in the roughening treatment is not particularly limited, and examples include alkaline solutions and surfactant solutions; alkaline solutions are preferred, and sodium hydroxide solutions and potassium hydroxide solutions are more preferred. Commercially available swelling solutions include, for example, "Swelling Dip Securiganth SBU" and "Swelling Dip Securiganth P" manufactured by ATOTECH JAPAN. The swelling treatment using a swelling solution is not particularly limited; for example, it can be performed by immersing the insulating layer in a swelling solution at 30°C to 90°C for 1 to 20 minutes. From the viewpoint of suppressing the swelling of the resin in the insulating layer to a moderate level, it is preferable to immerse the insulating layer in a swelling solution at 40°C to 80°C for 5 to 15 minutes. The oxidant used in the roughening treatment is not particularly limited, and examples include alkaline permanganate solutions obtained by dissolving potassium permanganate or sodium permanganate in an aqueous solution of sodium hydroxide. Roughening treatment using an oxidant such as an alkaline permanganate solution is preferably performed by immersing the insulating layer in an oxidant solution heated to 60°C to 100°C for 10 to 30 minutes. Furthermore, the concentration of permanganate in the alkaline permanganate solution is preferably 5% to 10% by mass. Commercially available oxidants include, for example, alkaline permanganate solutions such as "ConcentrateCompact P," "Concentrate Compact CP," and "Dosing solution Securiganth P" manufactured by Ammet Japan Co., Ltd. Furthermore, the neutralizing solution used in the roughening treatment is preferably an acidic aqueous solution, and commercially available products include, for example, "Reduction solution Securiganth P" manufactured by Ammet Japan Co., Ltd. Treatment using the neutralizing solution can be performed by immersing the roughened surface treated with the oxidant in a neutralizing solution at 30°C to 80°C for 1 to 30 minutes. From an operability perspective, it is preferable to immerse the roughened object treated with the oxidant in a neutralizing solution at 40°C to 70°C for 5 to 20 minutes.

[0336] In one embodiment, the arithmetic mean roughness (Ra) of the surface of the roughened insulating layer is preferably 300 nm or less, more preferably 250 nm or less, and even more preferably 200 nm or less. There is no particular limitation on the lower limit, but it is preferably 30 nm or more, more preferably 40 nm or more, and even more preferably 50 nm or more. The arithmetic mean roughness (Ra) of the insulating layer surface can be measured using a non-contact surface roughness meter.

[0337] Step (V) is the step of forming a conductor layer, which is formed on the insulating layer. The conductor material used for the conductor layer is not particularly limited. In suitable embodiments, the conductor layer comprises one or more metals selected from gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. The conductor layer can be a single metal layer or an alloy layer. Examples of alloy layers include layers formed from alloys of two or more metals selected from the above-mentioned metals (e.g., nickel-chromium alloys, copper-nickel alloys, and copper-titanium alloys). From the viewpoints of versatility, cost, and ease of pattern formation, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of nickel-chromium, copper-nickel, or copper-titanium alloys, is preferred. More preferably, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of nickel-chromium alloys, is even more preferred. A single metal layer of copper is even more preferred.

[0338] The conductor layer can be a single-layer structure, or a multi-layer structure consisting of two or more single-metal layers or alloy layers containing different types of metals or alloys. When the conductor layer is a multi-layer structure, the layer in contact with the insulating layer is preferably a single-metal layer of chromium, zinc, or titanium, or an alloy layer of nickel-chromium alloy.

[0339] The thickness of the conductor layer depends on the desired printed wiring board design, but is generally 3μm to 35μm, preferably 5μm to 30μm.

[0340] In one embodiment, the conductor layer can be formed by plating. For example, the surface of the insulating layer can be plated using conventionally known techniques such as semi-additive or fully additive methods to form a conductor layer with the desired wiring pattern. From the viewpoint of ease of manufacturing, formation by semi-additive methods is preferred. An example of forming a conductor layer by a semi-additive method is shown below.

[0341] First, a seed layer is formed on the surface of an insulating layer using electroless plating. Next, a mask pattern is formed on the formed seed layer, exposing a portion of the seed layer corresponding to the desired wiring pattern. After a metal layer is formed on the exposed seed layer using electrolytic plating, the mask pattern is removed. Then, the unwanted seed layer is removed using etching or the like, forming a conductor layer with the desired wiring pattern.

[0342] [Semiconductor Devices] The semiconductor device of the present invention includes the printed wiring board of the present invention. The semiconductor device of the present invention can be manufactured using the printed wiring board of the present invention.

[0343] Examples of semiconductor devices include various semiconductor devices used in electrical products (such as computers, mobile phones, digital cameras, and televisions) and vehicles (such as motorcycles, automobiles, trams, ships, and aircraft).

[0344] The semiconductor device of the present invention can be manufactured by mounting a component (semiconductor chip) on a conductive portion of a printed wiring board. A "conductive portion" refers to a "part of the printed wiring board that transmits electrical signals," and its location can be on the surface or in a buried portion. Furthermore, there is no particular limitation on the semiconductor chip as long as it is a circuit element made of semiconductor material.

[0345] There are no particular limitations on the mounting methods for semiconductor chips during semiconductor device manufacturing, as long as the semiconductor chip can effectively perform its function. Specifically, examples include wire bonding mounting methods, flip chip mounting methods, bumpless layer-based (BBUL) mounting methods, anisotropic conductive film (ACF) mounting methods, and non-conductive film (NCF) mounting methods. Here, "bumpless layer-based (BBUL) mounting method" refers to: "a mounting method in which the semiconductor chip is directly embedded in a recess of a printed circuit board, connecting the semiconductor chip to the wiring on the printed circuit board." Example

[0346] The present invention will now be specifically described through examples. The present invention is not limited to these examples. It should be noted that, in the following text, "parts" and "%" to indicate quantities refer to "parts by mass" and "% by mass," respectively, unless otherwise explicitly stated. Additionally, "M" refers to "mol / L."

[0347] <Synthesis Example 1: Synthesis of Polymer A> Dissolve 0.74 g of cyanuric chloride in 100 ml of THF. Add 3.56 g of 4,4'-(3,3,5-trimethylcyclohexylene)bis[2-methylphenol], 2.05 g of the compound shown in formula (X-1-1), and 0.58 g of 1-naphthol, and heat to 50 °C. Add 7.5 ml of 2M sodium hydroxide aqueous solution and stir at 50 °C for 8 hours. Add 42 ml of water and 1M hydrochloric acid to adjust the pH to 3.7, and remove the organic solvent by distillation under reduced pressure. Add 100 ml of ethyl acetate and extract to separate the layers. Wash the organic layer with 50 ml of water, dehydrate with anhydrous magnesium sulfate, and then remove the organic solvent by distillation under reduced pressure. Add 70 ml of methanol to precipitate the solid. After separating the obtained solid, it was dried under reduced pressure at 50°C to obtain 2.94 g of the target polymer A (yield 61%) (N6 / N1 = 2.0, M5 / M4 = 0, weight average molecular weight Mw = 4237). [Chemical Formula 55] [Chemical Formula 56] (Polymer A) [Chemical Formula 57]

[0348] <Synthesis Example 2: Synthesis of Polymer B> Dissolve 0.65 g of cyanuric chloride in 100 ml of THF. Add 2.34 g of 4,4'-(3,3,5-trimethylcyclohexylene)bis[2-methylphenol], 1.79 g of the compound shown in formula (X-1-1), 1.84 g of maleimide-modified bisphenol shown in formula (X-5), and 0.51 g of 1-naphthol, and heat to 50 °C. Add 7.5 ml of 2M sodium hydroxide aqueous solution and stir at 50 °C for 8 hours. Add 42 ml of water and 1M hydrochloric acid to adjust the pH to 3.6, and remove the organic solvent by distillation under reduced pressure. Add 100 ml of ethyl acetate for extraction and layering. Wash the organic layer with 50 ml of water, dehydrate with anhydrous magnesium sulfate, and then remove the organic solvent by distillation under reduced pressure. Add 70 ml of methanol to precipitate the solid. After separating the obtained solid, it was dried under reduced pressure at 50°C to obtain 3.43 g of the target polymer B (yield 64%) (N6 / N1 = 2.0, M5 / M4 = 0.33, weight average molecular weight Mw = 8266). [Chemical Formula 58] [Chemical Formula 59] (Polymer B) [Chemical Formula 60] (Example of a partial structure of polymer B)

[0349] <Synthesis Example 3: Synthesis of Polymer C> Dissolve 0.74 g of cyanuric chloride in 100 ml of THF. Add 1.60 g of 4,4'-(3,3,5-trimethylcyclohexylene)bis[2-methylphenol], 2.05 g of the compound shown in formula (X-1-1), 1.66 g of maleimide-modified bisphenol shown in formula (X-6), and 0.58 g of 1-naphthol, and heat to 50 °C. Add 8.0 ml of 2M sodium hydroxide aqueous solution and stir at 50 °C for 8 hours. Add 42 ml of water and 1M hydrochloric acid to adjust the pH to 3.6, and remove the organic solvent by distillation under reduced pressure. Add 100 ml of ethyl acetate and extract to separate the layers. Wash the organic layer with 50 ml of water, dehydrate with anhydrous magnesium sulfate, and then remove the organic solvent by distillation under reduced pressure. Add 70 ml of methanol to precipitate the solid. After separating the obtained solid, it was dried under reduced pressure at 50°C to obtain 4.38 g of the target polymer C (yield 72%) (N6 / N1 = 2.0, M5 / M4 = 0.33, weight average molecular weight Mw = 8194). [Chemical Formula 61] [Chemical Formula 62] (Polymer C) [Chemical Formula 63] (Example of a partial structure of polymer C)

[0350] <Synthetic Example 4: Synthesis of Polymer D> 0.74 g of cyanuric chloride was dissolved in 100 ml of THF. Then, 2.14 g of 4,4'-(3,3,5-trimethylcyclohexylene)bis[2-methylphenol], 1.63 g of the compound shown in formula (X-1-2), 1.68 g of maleimide-modified bisphenol shown in formula (X-5), and 0.58 g of 1-naphthol were added, and the mixture was heated to 50 °C. 10.0 ml of 2M sodium hydroxide aqueous solution was added, and the mixture was stirred at 50 °C for 8 hours. 40 ml of water and 1M hydrochloric acid were added to adjust the pH to 3.7, and the organic solvent was removed by distillation under reduced pressure. 100 ml of ethyl acetate was added, and the mixture was extracted and separated. The organic layer was washed with 50 ml of water, dehydrated with anhydrous magnesium sulfate, and then the organic solvent was removed by distillation under reduced pressure. 70 ml of methanol was added to precipitate the solid. After separating the obtained solid, it was dried under reduced pressure at 50°C to obtain 2.94 g of the target polymer D (yield 49%) (N6 / N1 = 1.0, M5 / M4 = 0.33, weight average molecular weight Mw = 4124). [Chemical Formula 64] [Chemical Formula 65] (Polymer D) [Chemical Formula 66] (Example of a partial structure of polymer D)

[0351] <Comparative Synthesis Example 1: Synthesis of Polymer E> 2.65 g of 9,9-bis(4-hydroxy-3-methylphenyl)fluorene and acetone were added to a reaction vessel and dissolved. Then, 0.922 g of cyanuric chloride, 0.301 g of di-terminated amine-modified silicone oil (Shin-Etsu Chemical Industry Co., Ltd., "KF-8010"), and 0.553 g of 3-aminopropyltriethoxysilane (Shin-Etsu Chemical Industry Co., Ltd., "KBE-903") were added, and the reaction was carried out at 50°C overnight. Then, ethyl acetate was added for extraction, and insoluble matter was removed by filtration. Next, the filtrate was washed with water, dehydrated using anhydrous magnesium sulfate, and the solvent was concentrated and removed by distillation. The residue was crystallized in methanol to obtain polymer E with a hyperbranched structure. The weight-average molecular weight of polymer E was determined to be 8800. Furthermore, the glass transition temperature of polymer E was determined to be 92°C. [Chemical Formula 67]

[0352] <Synthetic Example 5: Synthesis of Maleimide Resin F> A maleimide resin F [Mw / Mn = 1.81, t” = 1.47 (mainly 1, 2 or 3)] (non-volatile component rate 62% by mass) was obtained by synthesizing using the method described in Synthesis Example 1 of Japan Invention Association Publication No. 2020-500211. [Chemical Formula 68]

[0353] <Synthesis Example 6: Synthesis of Vinyl Resin G> In a reaction vessel, 89 parts by mass of o-allylphenol, 110 parts by mass of dicyclopentadiene-phenol copolymer resin (softening point 85℃, hydroxyl equivalent approximately 165 g / eq.), and 1000 parts by mass of toluene were charged and dissolved while the vessel was purged with nitrogen under reduced pressure. Next, 135 parts by mass of isophthaloyl chloride were added and dissolved. Then, 0.5 parts by mass of tetrabutylammonium bromide were added, and while the vessel was purged with nitrogen, 309 parts by mass of a 20% sodium hydroxide aqueous solution were added dropwise over 3 hours. The temperature of the system was maintained below 60℃. The mixture was then stirred for 1 hour to allow the reaction to proceed. After the reaction was complete, the reactants were separated and the aqueous layer was removed. This process was repeated until the pH of the aqueous layer reached 7. Toluene and other components were then removed by distillation under reduced pressure to obtain vinyl resin G. Vinyl resin G is represented by the following formula, where s represents an integer greater than or equal to 0 or 1, and the average value of r calculated based on the charge ratio is 1. In addition, the wavy line is a structure obtained by reacting isophthaloyl chloride, phenol, and / or o-allylphenol with an addition polymerization resin. [Chemical Formula 69]

[0354] <Synthesis Example 7: Synthesis of Active Ester Compound H> In a flask equipped with a thermometer, dropping funnel, condenser, fractionating tube, and stirrer, 320 g (2.0 mol) of 2,7-dihydroxynaphthalene, 184 g (1.7 mol) of benzyl alcohol, and 5.0 g of p-toluenesulfonic acid monohydrate were added. The mixture was stirred while being purged with nitrogen at room temperature. Then, the temperature was raised to 150 °C, and the generated water was distilled off the system while stirring for 4 hours. After the reaction was complete, 900 g of methyl isobutyl ketone and 5.4 g of 20% sodium hydroxide aqueous solution were added for neutralization. The aqueous layer was then removed by separation, and the organic layer was washed three times with 280 g of water. Methyl isobutyl ketone was removed under reduced pressure to obtain 460 g of benzyl-modified naphthalene compound H'. The obtained benzyl-modified naphthalene compound H' was a black solid with a hydroxyl equivalent of 180 g / eq.

[0355] In a flask equipped with a thermometer, dropping funnel, condenser, fractionating tube, and stirrer, 203.0 g of isophthaloyl chloride (2.0 mol of acyl chloride group) and 1400 g of toluene were added. The system was purged with nitrogen under reduced pressure to dissolve the chloride. Next, 113.9 g (0.67 mol) of o-phenylphenol and 240 g of benzyl-modified naphthalene compound H' (1.33 mol of phenolic hydroxyl group) were added. The system was purged with nitrogen under reduced pressure to dissolve the naphthalene. Then, 0.70 g of tetrabutylammonium bromide was dissolved. While purging with nitrogen and maintaining the system temperature below 60°C, 400 g of a 20% sodium hydroxide aqueous solution was added dropwise over 3 hours. The reaction was then continued under these conditions with stirring for 1 hour.

[0356] After the reaction was complete, the mixture was allowed to stand and separated, removing the aqueous layer. Then, water was added to the toluene layer containing the dissolved product, and the mixture was stirred for 15 minutes. The mixture was allowed to stand and separated, removing the aqueous layer. This process was repeated until the pH of the aqueous layer reached 7. The water was then removed using a decanter, yielding an active ester compound H in a toluene solution containing 62% by mass of non-volatile components. The active ester equivalent of the obtained active ester compound H was 238 g / eq. The active ester compound H has the structure shown in the following formula (where n is mainly composed of compounds of integers from 0 to 5 and m is from 0 to 15).

[0357] [Chemical Formula 70]

[0358] [Examples 1-8, Comparative Examples 1-5] <Preparation of Resin Compositions> Weigh each component according to the mass fractions recorded in Table 1, and then mix 15 parts of MEK (methyl ethyl ketone) and 15 parts of cyclohexanone, and disperse them evenly using a high-speed rotary mixer to obtain a resin composition (resin varnish).

[0359] <Production of Resin Sheets> As a support, a polyethylene terephthalate film (LUMIRROR R80, Toray Industries, Ltd., 38 μm thick, softening point 130°C) that has been molded with an alkyd resin-based release agent (AL-5, manufactured by Lintec Corporation) was prepared.

[0360] The resin compositions obtained in Examples 1-8 and Comparative Examples 1-5 were uniformly coated onto the support using an orifice-type coating machine, so that the thickness of the dried resin composition layer was 40 μm. The layers were dried at 70°C to 95°C for 3 minutes, thereby forming a resin composition layer on the support.

[0361] Next, a rough surface of a polypropylene film (OjiF-Tex "ALPHAN MA-411", 15 μm thick) serving as a protective film is laminated onto the surface of the resin composition layer that is not bonded to the support. This yields a resin sheet having a support, a resin composition layer, and a protective film in sequence.

[0362] <Experimental Example 1: Determination of Dielectric Properties (Dielectric Constant, Dielectric Loss Tangent)> The protective film was peeled off from the resin sheets prepared in the examples and comparative examples, and the resin composition layer was heat-cured at 200°C for 90 minutes. The support was then peeled off. The resulting cured material was cut into test pieces with a width of 2 mm and a length of 80 mm to prepare test pieces for evaluation.

[0363] For each test piece, the dielectric constant and dielectric loss tangent were measured using an Agilent Technologies HP8362B resonant cavity perturbation method at a measurement frequency of 5.8 GHz and a measurement temperature of 23 °C. Measurements were performed on three test pieces, and the average values ​​were calculated. The dielectric constant and dielectric loss tangent were evaluated according to the following evaluation criteria. • Dielectric constant ○: Dielectric constant below 3.1 ×: Dielectric constant greater than 3.1 • Dielectric loss tangent ○: Dielectric loss tangent is below 0.003 ×: Dielectric loss tangent greater than 0.003

[0364] <Experimental Example 2: Determination of Substrate Adhesion (Copper Foil Peel Strength)> (1) Substrate treatment of copper foil The copper surface was roughened by etching the glossy surface of Mitsui Metals & Minerals' "3EC-III" (electrolytic copper foil, 35μm) to 1μm using MEC's ​​"CZ8101" etching machine, followed by a rust-preventive treatment (CL8300). This copper foil is referred to as CZ-treated copper foil. It is then heat-treated in an oven at 130°C for 30 minutes. This yields the CZ-treated copper foil.

[0365] (2) Preparation of inner layer substrate Using MEC's ​​"CZ8101" tool, a double-sided copper-clad laminate (copper foil thickness 18μm, substrate thickness 0.4mm, Panasonic "R1515A") with inner layer circuitry formed on glass cloth substrate was etched to a thickness of 1μm on both sides to roughen the copper surface. Then, it was heat-treated in an oven at 130°C for 30 minutes. This yielded the inner layer substrate.

[0366] (3) Lamination of resin composition layers The protective film was peeled off from the resin sheets prepared in the examples and comparative examples, exposing the resin composition layer. Using an intermittent vacuum pressure laminator (Nikko-Materials, 2-stage stacking laminator "CVP700"), lamination was performed on both sides of the inner layer substrate to bring the resin composition layer into contact with the inner layer substrate. Lamination was performed as follows: a 30-second depressurization was applied, the pressure was adjusted to below 13 hPa, and then pressing was performed at 120°C and 0.74 MPa for 30 seconds. Next, hot pressing was performed at 100°C and 0.5 MPa for 60 seconds. Under the same conditions as above, the treated surface of the CZ copper foil was laminated onto the resin composition layer. Then, the resin composition layer was cured at 200°C for 90 minutes to form an insulating layer, thereby producing an evaluation substrate.

[0367] (4) Determination of copper foil peel strength (substrate adhesion) The prepared evaluation substrate was cut into 150×30mm pieces. A 10mm wide and 100mm long slit was made in the copper foil portion of each piece using a cutter. One end of the copper foil was peeled off and held in place with a clamp. The peel strength was determined by measuring the load (kgf / cm) when the foil was torn 35mm vertically at a speed of 50mm / min at room temperature. The tensile strength was measured using a tensile testing machine (TSE Corporation "AC-50C-SL"). The measurement was performed according to Japanese Industrial Standard (JIS C6481). The substrate adhesion was evaluated according to the following evaluation criteria. ○: The measured load value is above 0.45 kgf / cm². ×: The measured load value is less than 0.45 kgf / cm².

[0368] <Example 3: Determination of peel strength of plated conductor layer> (1) Preparation of inner layer substrate Using MEC's ​​"CZ8101" tool, a double-sided copper-clad laminate (copper foil thickness 18μm, substrate thickness 0.8mm, Panasonic "R1515A") with inner layer circuitry formed on glass cloth substrate was etched to a thickness of 1μm on both sides to roughen the copper surface. Then, it was heat-treated in an oven at 130°C for 30 minutes. This yielded the inner layer substrate.

[0369] (2) Lamination of resin sheets The resin sheets manufactured in the examples and comparative examples were laminated onto both sides of the inner layer substrate using an intermittent vacuum pressure laminator (Nikko-Materials' CVP700, a two-stage stacking laminator), so that the resin composition layer was in contact with the inner layer substrate. Lamination was performed as follows: after a 30-second decompression to bring the pressure below 13 hPa, pressing was performed at 100°C and a pressure of 0.74 MPa for 30 seconds. Next, hot pressing was performed at 100°C and a pressure of 0.5 MPa for 60 seconds.

[0370] (3) Curing of resin sheets The resin sheet laminated to the inner substrate is heated under curing conditions of 100°C for 30 minutes and then 180°C for 30 minutes to thermally cure the resin composition layer and form an insulating layer, thereby obtaining a substrate for evaluating copper-plated adhesion.

[0371] (4) Roughening treatment The substrate was immersed in a swelling solution (Swelling Dip Securiganth P, manufactured by Amtec Japan, containing diethylene glycol monobutyl ether) at 60°C for 10 minutes. Next, the substrate was immersed in a roughening solution (Concentrate Compact P, an aqueous solution of KMnO4: 60 g / L and NaOH: 40 g / L, manufactured by Amtec Japan) at 80°C for 20 minutes. Then, the substrate was immersed in a neutralization solution (Reduction solution Securiganth P, manufactured by Amtec Japan) at 40°C for 5 minutes. Finally, the substrate was dried at 80°C for 30 minutes to obtain a roughened copper plating adhesion evaluation substrate.

[0372] (5) Plating using a semi-additive process The roughened copper-plated bonding evaluation substrate was immersed in an electroless plating solution containing palladium chloride (PdCl2) at 40°C for 5 minutes, followed by immersion in an electroless copper plating solution at 25°C for 20 minutes. Then, the roughened substrate was annealed at 150°C for 30 minutes. A resist layer was formed on the annealed roughened substrate, and an etched pattern was formed. Next, copper sulfate electrolytic plating was performed to form a conductor layer with a thickness of 25 μm on the surface of the insulating layer. Finally, an annealing treatment was performed at 180°C for 30 minutes to obtain a copper-plated bonding evaluation substrate with a conductor layer on the insulating layer.

[0373] (6) Evaluation of the adhesion to the plated conductor layer The peel strength between the insulation layer and the plated conductor layer was measured according to Japanese Industrial Standard (JIS C6481). Specifically, the copper-plated adhesion evaluation substrate obtained above was cut into small pieces with a width of 30 mm and a length of 100 mm. On the conductor layer of the obtained small pieces, a rectangular section surrounding a 10 mm wide portion was cut using a cutter. One end of this rectangular section was peeled off and held in a clamp (TSE AUTO COM type testing machine "AC-50C-SL"), and at room temperature, the load (kgf / cm) when peeling 35 mm vertically at a speed of 50 mm / min was measured to determine the peel strength (plating peel strength). The plating adhesion was evaluated according to the following evaluation criteria. ○: The measured load value is above 0.35 kgf / cm². ×: The measured load value is less than 0.35 kgf / cm².

[0374] The results of Examples 1-8 and Comparative Examples 1-5 are shown in Table 1. [Table 1]

[0375] It should be noted that the details of each component listed in Table 1 are as follows. <Polymer> • Polymers A to E: Synthesis Examples 1 to 4, and polymers synthesized in Comparative Synthesis Example 1 YX7553BH30: Phenoxy resin (manufactured by Mitsubishi Chemical Corporation, a 1:1 solution of MEK and cyclohexanone with a non-volatile content of 30% by mass)

[0376] <(B) Epoxy Resin> HP4032SS: Naphthalene-type epoxy resin (manufactured by DIC, epoxy equivalent approximately 144 g / eq.) NC-3000L: Biphenyl-type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent approximately 269 g / eq.)

[0377] <(C) Inorganic filler materials> • SO-C2: Spherical silica (manufactured by Yaduma, "SO-C2", average particle size 0.5 μm, specific surface area 5.8 m²) 2 / g) Materials surface-treated with a silane coupling agent (N-phenyl-3-aminopropyltrimethoxysilane, Shin-Etsu Chemical Industry Co., Ltd. "KBM-573")

[0378] <(D) Curing Agent> • Active ester compound H: The active ester compound synthesized in Synthesis Example 7 V-03: Carbodiimide-based curing agent (manufactured by Nisshinbo Chemical Co., Ltd., toluene solution with an active group equivalent of approximately 216 g / eq. and a non-volatile component content of 50%)

[0379] <(E) Curing Accelerator> ·1B2PZ: Imidazole-based curing accelerator (1-benzyl-2-phenylimidazolium, manufactured by Shikoku Chemical Industry Co., Ltd.)

[0380] <(F) Free Radical Polymer Resins> • OPE-2St: Vinyl benzyl modified polyphenylene ether resin (manufactured by Mitsubishi Gas Chemical Co., Ltd., toluene solution with 65% non-volatile components) MIR-3000-70MT: Aromatic maleimide resin (manufactured by Nippon Kayaku Co., Ltd., a MEK / toluene mixed solution with 70% non-volatile components). • BMI-689: Aliphatic maleimide resin (manufactured by Designer Molecules Inc., containing an N-alkyl bismaleimide with a dimeric diamine backbone) • Maleimide resin F: The maleimide resin synthesized in Synthesis Example 5 • DAD: diallyl biphenylate (manufactured by Nisshoku Techno Fine Chemical Co., Ltd.) • A-DOG: Dioxanediol diacrylate (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) • Vinyl resin G: The vinyl resin synthesized in Synthesis Example 6

[0381] <(G) Free radical polymerization initiator> • Luperox DTA: Di-tert-pentyl peroxide (manufactured by Arkema) ·PERHEXYL D: Di-tert-hexyl peroxide (manufactured by Nippon Oil Company)

[0382] As shown in Table 1, in Examples 1 to 8, which contain component (A), epoxy resin, and inorganic filler material having the structure specified in this application, cured products exhibiting excellent dielectric properties and excellent substrate adhesion and plating adhesion can be obtained.

Claims

1. A resin composition comprising: (1A) Polymers having structural units shown in formula (A-1) and formula (A-2) below, (B) Epoxy resin, and (C) Inorganic filler materials In equations (A-1) and (A-2), R 1 Each is independently a monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 1 The molecular weight is above 250, R 1 It does not have an olefinic unsaturated group, R 1 It does not contain at least one of a triazine backbone and an optionally hydrogenated bisphenol backbone. A represents a divalent organic group having an optional hydrogenated bisphenol skeleton.

2. The resin composition according to claim 1, wherein, (1A) The component is a polymer having the structural units shown in the following formula (A-3), In equation (A-3), R 1 Each is independently a monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 1 The molecular weight is above 250, R 1 It does not have an olefinic unsaturated group, R 1 It does not contain at least one of a triazine backbone and an optionally hydrogenated bisphenol backbone. A represents a divalent organic group having an optional hydrogenated bisphenol skeleton.

3. The resin composition according to claim 1, wherein, In equation (A-1), R 1 Each is an independent monovalent organic group that does not have reactive substituents.

4. The resin composition according to claim 1, wherein, In equation (A-1), R 1 Each is an independent monovalent organic group that does not contain either a triazine skeleton or an optionally hydrogenated bisphenol skeleton.

5. The resin composition according to claim 1, wherein, In equation (A-1), R 1 Each is an independent monovalent organic group selected from saturated aliphatic groups, aromatic groups, and combinations of saturated aliphatic groups and aromatic groups.

6. The resin composition according to claim 1, wherein, In equation (A-1), R 1 Each is an independent monovalent organic group selected from substituted amino and substituted oxygen groups.

7. The resin composition according to claim 1, wherein, In formula (A-2), each A is an independent divalent organic group whose constituent atoms are selected from carbon, hydrogen, oxygen, nitrogen, fluorine and silicon atoms.

8. The resin composition according to claim 1, wherein, In formula (A-2), A is a divalent organic group with a bisphenol skeleton.

9. The resin composition according to claim 1, wherein, In formula (A-2), A is a divalent organic group as shown in formula (A-4) below. In equation (A-4), Ring Ar 1 Each independently represents an aromatic carbon ring with 6 to 10 carbon atoms, optionally containing substituents. X 1 A divalent group representing a single bond, or a group consisting of 1 to 200 atoms selected from carbon, hydrogen, oxygen, nitrogen, fluorine, silicon, and sulfur atoms. * indicates a connection key.

10. The resin composition according to claim 9, wherein, In equation (A-4), ring Ar 1 It is an aromatic carbon ring with 6 to 10 carbon atoms, optionally having substituents selected from alkyl and aryl groups having 1 to 10 carbon atoms.

11. The resin composition according to claim 9, wherein, In equation (A-4), X 1 It can be an alkylene group having 1 to 20 carbon atoms, an aryl group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms formed by a combination of them, which may have oxygen atoms.

12. The resin composition according to claim 1, wherein, In formula (A-2), A is a divalent organic group as shown in formula (A-5) below. In formula (A-5), Ring Ar 2 Each independently represents an aromatic carbon ring with 6 to 10 carbon atoms, optionally containing substituents. X 2 This indicates a divalent group consisting of 1 to 200 constituent atoms selected from carbon, hydrogen, and oxygen atoms. R 4 Each can independently represent an alkylene group having 1 to 20 carbon atoms, an aryl group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms formed by combinations thereof. R 5 and R 6 Each independently represents an alkyl group having 1 to 20 carbon atoms or an aryl group having 1 to 20 carbon atoms; additionally, R 5 and R 6 They can be connected to form a ring. * indicates a connection key.

13. The resin composition according to claim 12, wherein, In equation (A-5), X 2 It is an oxygen atom, an alkylene group having 1 to 50 carbon atoms, an aryl group having 1 to 20 carbon atoms with an alkyl group having 1 to 6 carbon atoms as a substituent, or a divalent group having 2 to 60 carbon atoms formed by a combination of the above.

14. The resin composition according to claim 12, wherein, In equation (A-5), X 2 It is a divalent group with 6 to 100 carbon atoms having an aromatic hydrocarbon ring.

15. The resin composition according to claim 1, wherein, (1A) component further has the structural unit shown in the following formula (A-6), In equation (A-6), R 2 Each is independently a monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 2 The molecular weight is less than 250, R 2 It does not have an olefinic unsaturated group, R 2 It does not contain at least one of a triazine backbone and an optional hydrogenated bisphenol backbone.

16. The resin composition according to claim 2, wherein, (1A) component further has the structural unit shown in the following formula (A-7), In formula (A-7), R 2 Each is independently a monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 2 The molecular weight is less than 250, R 2 It does not have an olefinic unsaturated group, R 2 It does not contain at least one of a triazine backbone and an optionally hydrogenated bisphenol backbone. A represents a divalent organic group having an optional hydrogenated bisphenol skeleton.

17. The resin composition according to claim 15, wherein, In equation (A-6), R 2 It is an aryloxy group.

18. The resin composition according to claim 15, wherein, In equation (A-6), R 2 It is a naphthoxy group.

19. The resin composition according to claim 15, wherein, When the number of repetitions of the structural unit shown in equation (A-1) in component (1A) is set to N1, the number of repetitions of the structural unit shown in equation (A-2) is set to N2, the number of repetitions of the structural unit shown in equation (A-6) is set to N6, and the number of repetitions of other structural units is set to N0 when there are other structural units, the proportion α defined by the following equation (1) is 0.9 to 1. [Mathematical Expression 1] 20. The resin composition according to claim 15, wherein, When the number of repetitions of the structural unit shown in formula (A-1) in component (1A) is set to N1 and the number of repetitions of the structural unit shown in formula (A-6) is set to N6, the ratio of N6 to N1 (N6 / N1) is 0.1 to 20.

21. The resin composition according to claim 1, wherein, (1A) Component has two or more structural units of formula (A-2) with different A values, wherein the two or more A values ​​include divalent groups of formula (A-4) and divalent groups of formula (A-5). In equations (A-4) and (A-5), Ring Ar 1 and ring Ar 2 Each independently represents an aromatic carbon ring with 6 to 10 carbon atoms, optionally containing substituents. X 1 This indicates an alkylene group having 1 to 20 carbon atoms, an aryl group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms formed by combinations thereof, which may contain oxygen atoms. X 2 The group represents an oxygen atom, an alkylene group having 1 to 50 carbon atoms, an aryl group having 1 to 20 carbon atoms with an alkyl group having 1 to 6 carbon atoms as a substituent, or a divalent group having 2 to 60 carbon atoms formed by combinations thereof. R 4 Each can independently represent an alkylene group having 1 to 20 carbon atoms, an aryl group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms formed by combinations thereof. R 5 and R 6 Each independently represents an alkyl group having 1 to 20 carbon atoms or an aryl group having 1 to 20 carbon atoms; additionally, R 5 and R 6 They can be connected to form a ring. * indicates a connection key.

22. The resin composition according to claim 21, wherein, When the number of divalent groups shown in formula (A-5) in component (1A) is set to M5 and the number of divalent groups shown in formula (A-4) is set to M4, the ratio of M5 to M4 (M5 / M4) is 0.05 to 5.

23. The resin composition according to claim 1, wherein, (1A) is a polymer having the structure shown in formula (A-8) below. In formula (A-8), n1 represents an integer greater than or equal to 1, and n2 represents an integer greater than or equal to 0. R 1 R 2 R and R are each independently a monovalent organic group whose constituent atoms are selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 1 The molecular weight is above 250, R 2 The molecular weight is less than 250, R 1 R 2 R does not have an olefinic unsaturated group, R 1 R 2 R contains at least one of a triazine backbone and an optionally hydrogenated bisphenol backbone. A represents a divalent organic group having an optional hydrogenated bisphenol skeleton.

24. The resin composition according to claim 23, wherein, In equation (A-8), n1+n2 ranges from 1 to 110.

25. The resin composition according to claim 1, wherein, (1A) The weight-average molecular weight of the component is 1,000 to 50,000.

26. The resin composition according to claim 1, wherein, It further contains (D) curing agent.

27. The resin composition according to claim 26, wherein, (D) Component contains an active ester-based curing agent.

28. The resin composition according to claim 1, wherein, It further contains (E) curing accelerator.

29. The resin composition according to claim 1, wherein, Further containing (F) free radical polymeric resins.

30. The resin composition according to claim 1, wherein, It further contains (G) radical polymerization initiators.

31. The resin composition according to claim 1, wherein, When the non-volatile component in the resin composition is set to 100% by mass, the content of component (1A) is 1 to 30% by mass.

32. The resin composition according to claim 1, wherein, When the non-volatile component in the resin composition is set to 100% by mass, the content of component (C) is 50-75% by mass.

33. The resin composition according to claim 1, wherein, The mass ratio of component (1A) to component (C) [component (1A) / component (C)] is 0.01 to 1.

34. A resin composition comprising: (2A) A polymer formed by reacting cyanuric chloride, optionally hydrogenated bisphenols, a compound represented by the following formula (X-1), and a monophenol; (B) Epoxy resin; and (C) Inorganic filler materials In equation (X-1), R 1 It is a monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 1 The molecular weight is above 250, R 1 It does not have an olefinic unsaturated group, R 1 It does not contain at least one of a triazine backbone and an optional hydrogenated bisphenol backbone.

35. A method for manufacturing a resin composition, the method comprising: (1) A step of reacting cyanuryl chloride, optionally a hydrogenated bisphenol, a compound represented by formula (X-1) below, and a monophenol to obtain a polymer; and (2) The process of mixing the polymer, epoxy resin and inorganic filler material obtained in step (1), In equation (X-1), R 1 It is a monovalent organic group composed of atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 1 The molecular weight is above 250, R 1 It does not have an olefinic unsaturated group, R 1 It does not contain at least one of a triazine backbone and an optional hydrogenated bisphenol backbone.

36. A resin sheet comprising: Support body, and A resin composition layer comprising the resin composition according to any one of claims 1 to 34 is disposed on the support.

37. A printed wiring board comprising an insulating layer formed using a cured resin composition according to any one of claims 1 to 34.

38. A semiconductor device comprising the printed wiring board of claim 37.

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