A side-standing wafer loading device and die bonder

Abstract

The application discloses a side-standing wafer loading device and a die bonder, and relates to the technical field of die bonder, in particular to a side-standing wafer loading device and a die bonder. The side-standing wafer loading device comprises a thimble assembly, a wafer ring holding assembly and an adapter assembly. The wafer ring holding assembly comprises a vertically arranged wafer ring holding seat, a wafer base and a wafer ring rotating driving element. The wafer ring holding seat is used for mounting a wafer ring and is rotationally connected to the wafer base. The thimble assembly comprises a thimble, a thimble X-axis module and a thimble YZ-axis platform. The thimble X-axis module is used for driving the thimble to approach or move away from the wafer ring holding seat along the X-axis direction, so as to lift a wafer in the wafer ring mounted on the wafer ring holding seat. The adapter assembly comprises an adapter arm and an adapter rotating module. The end of the adapter arm is provided with a suction nozzle. In the application, the wafer ring is vertically placed, and the electrode surface of the wafer can be away from the thimble, so that the thimble can prevent the electrode of the wafer from being damaged.

Description

Technical Field

[0001] This invention relates to the field of die bonding technology, specifically to a side-mounted wafer loading device and a die bonding machine. Background Technology

[0002] A die bonder is a mechanical device for fixing crystals and semiconductor packaging. It can transfer and bond wafers from the blue film onto a substrate to complete chip mounting. It is widely used in the production of products such as LED direct-view displays, discrete semiconductor devices, DIP and SOP.

[0003] Existing die bonders typically use a bonding head to pick up a flat wafer from a supply position and move it to a bonding position on the substrate for precise wafer mounting. The wafer is generally attached to a blue film, which is supported by a wafer ring. The wafer has a front and a back side; the back side usually has electrodes for connection to the substrate. When the bonding head picks up the wafer, it first uses pins in its ejector pin structure to lift the wafer from the blue film, facilitating wafer pickup. To improve mounting efficiency, both the wafer ring at the supply position and the substrate at the bonding position are placed horizontally. The bonding head's swing arm rotates horizontally and, in conjunction with a pressing mechanism, completes wafer pickup, transfer, and mounting.

[0004] However, in the above method, when the pin in the ejector pin structure lifts the wafer in the wafer, since the wafer ring is placed horizontally and the back side of the wafer is facing down, the pressure generated when the ejector pin lifts the blue film acts on the back side of the wafer, which may damage the electrodes of the wafer and cause losses. Summary of the Invention

[0005] In order to overcome the shortcomings of the prior art, the present invention provides a side-mounted wafer loading device and a die bonder to solve the problem that the ejector pins in the prior art will damage the electrodes of the wafer.

[0006] The technical solution adopted by this invention to solve its technical problem is:

[0007] A side-mounted wafer loading device includes a pin assembly, a wafer ring holding assembly, a wafer ZY axis platform, and a transfer assembly. The wafer ring holding assembly includes a vertically arranged wafer ring holding seat, a wafer base, and a wafer ring rotation drive. The wafer ring holding seat is used to mount the wafer ring and is rotatably connected to the wafer base. The wafer ring rotation drive is used to drive the wafer ring holding seat to rotate.

[0008] The wafer ZY axis platform is used to drive the wafer ring holding assembly to move along the Y-axis and Z-axis directions;

[0009] The ejector pin assembly includes an ejector pin and an ejector pin X-axis module. The ejector pin X-axis module is used to drive the ejector pin to move closer to / away from the wafer ring holder along the X-axis direction in order to lift the wafer in the wafer ring mounted on the wafer ring holder.

[0010] The adapter assembly includes an adapter arm and an adapter rotation module. The adapter arm is provided with a suction nozzle at its end. The adapter rotation module is used to drive the adapter arm to rotate. When the adapter arm is rotated to a horizontal position, the suction nozzle is used to pick up the wafer on the wafer ring holder. When the adapter arm is rotated upward to a vertical position, the electrodes of the wafer on the suction nozzle face downward.

[0011] As a further improvement to the above technical solution, the wafer ring holder includes a wafer ring base, a wafer synchronization ring, and a baffle arranged coaxially. The wafer synchronization ring is connected between the wafer ring base and the baffle. The wafer ring base is rotatably connected to the wafer base. The wafer synchronization ring is connected to the wafer ring rotation drive. The baffle is provided with a stop block and a latching claw. When the latching claw is in the open state, it is used to install or remove the wafer ring. When the latching claw is in the closed state, it is used to press the wafer ring against the stop block.

[0012] As a further improvement to the above technical solution, a pneumatic wafer clamp is provided on the wafer base. When the drive end of the pneumatic wafer clamp extends, it is used to drive the opening claw to open. The opening claw is connected to an elastic element, which is used to provide an elastic force to drive the opening claw to close.

[0013] As a further improvement to the above technical solution, the wafer base is provided with a plurality of slot guide roller bearings arranged in a ring, and the wafer ring seat is connected between the plurality of slot guide roller bearings so that the wafer ring seat can rotate relative to the wafer base.

[0014] As a further improvement to the above technical solution, the wafer ring rotation drive includes an open-loop motor mounted on the wafer base, the main shaft of the open-loop motor is provided with a pulley, and a synchronous belt is wound between the pulley and the wafer synchronous ring.

[0015] As a further improvement to the above technical solution, the ejector pin assembly also includes an ejector pin YZ axis platform, which is used to drive the ejector pin to move along the Y-axis and Z-axis directions.

[0016] As a further improvement to the above technical solution, the ejector pin assembly includes an ejector pin cap, the ejector pin passes through a receiving hole provided inside the ejector pin cap, and the ejector pin X-axis module is used to drive the ejector pin to move relative to the ejector pin cap.

[0017] As a further improvement to the above technical solution, the adapter assembly also includes an adapter X-axis module, and the adapter rotary module is connected to the drive end of the adapter X-axis module.

[0018] As a further improvement to the above technical solution, an adapter camera is also included, wherein the lens of the adapter camera is horizontally oriented toward the wafer ring holder.

[0019] The present invention also provides the following technical solution: a die bonder, including a die bonder stage, a bonding head assembly, a hopper assembly, and a side-mounted wafer loading device, wherein the hopper assembly is used to provide a wafer ring and load wafers onto the side-mounted wafer loading device, and the bonding head assembly is used to transfer wafers on the adapter arm to the die bonder stage.

[0020] The beneficial effects of this invention are as follows: Since the wafer ring holder is vertically positioned, the wafer ring is in a side-standing posture. The ejector pin is on the left side of the wafer ring, and the adapter arm is on the right side of the wafer ring. Rotating the adapter arm 90° can change the wafer from a vertical state to a horizontal state, with the wafer's electrodes facing down. This allows the wafer to be transferred to the die bonding stage for die bonding. Since the wafer's electrodes face down in the horizontal state (i.e., the wafer's electrodes face right in the vertical state), meaning the wafer's electrode surface is away from the ejector pin when it is on the blue film, the ejector pin's force is applied to the front side (sapphire surface) of the wafer when it is lifted by the ejector pin for the nozzle on the adapter arm to pick up. This avoids the ejector pin damaging the wafer's electrodes. Attached Figure Description

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0022] Figure 1 This is an assembly diagram of a die bonder according to an embodiment of the present invention;

[0023] Figure 2 This is an exploded view of the structure of a side-mounted wafer loading device according to an embodiment of the present invention;

[0024] Figure 3 yes Figure 2 A schematic diagram of the structure of the wafer ring holding assembly;

[0025] Figure 4 yes Figure 2 Detailed structural diagram of the wafer ring retainer assembly;

[0026] Figure 5 yes Figure 2 Schematic diagram of the center pin assembly;

[0027] Figure 6 yes Figure 5 Mid-section view;

[0028] Figure 7 yes Figure 2Schematic diagram of the intermediate transfer component;

[0029] Figure 8 This is a schematic diagram of wafer loading according to an embodiment of the present invention.

[0030] Reference numerals: 100, die bonding stage; 200, die bonding assembly; 300, side-mounted wafer loading device; 310, wafer ring holding assembly; 311, wafer base; 3111, wafer base support ring; 3112, slot guide roller bearing; 312, wafer ring holder; 3121, wafer ring holder; 3122, wafer synchronization ring; 3123, baffle; 3124, stop block; 313, wafer ring rotation drive; 3131, open-loop motor; 3132, pulley; 3133, timing belt; 3134, tension wheel; 314, opening claw; 3141, holding section; 3142, rotating shaft; 3143, drive section 3144, Elastic component; 315, Pneumatic wafer clamp; 3151, Cylinder; 3152, Cylinder top block; 3153, Opening roller; 320, Ejector pin assembly; 321, Ejector pin base; 322, Ejector pin YZ axis platform; 323, Ejector pin X axis base; 324, Ejector pin cap; 325, Ejector pin; 326, Ejector pin shaft; 327, Voice coil motor; 330, Wafer ZY axis platform; 340, Adapter assembly; 341, Adapter arm; 342, Nozzle; 343, Adapter motor; 344, Adapter base; 345, Adapter X axis module; 350, Adapter camera; 400, Material box assembly; 500, Wafer ring. Detailed Implementation

[0031] The following will clearly and completely describe the concept, specific structure, and technical effects of the present invention in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are all within the scope of protection of the present invention. Furthermore, all connections / linkages involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. For example, fixed connections / fixed installations can use screw connections, bolt connections, pin connections, key connections, adhesive connections, mortise and tenon connections, welding, riveting, etc., as needed. Detachable connections can use screw connections, bolt connections, threaded connections, snap-fit ​​connections, mortise and tenon connections, Velcro connections, etc., as needed. The various technical features in this invention can be combined interactively without contradicting each other.

[0032] Reference Figure 1 and Figure 8An embodiment of the present invention provides a die bonder, including a die bonder stage 100, a die bonder assembly 200, a die cassette assembly 400, and a side-mounted wafer loading device 300. The die cassette assembly 400 is used to provide a wafer ring 500 and load it onto the side-mounted wafer loading device 300. The side-mounted wafer loading device 300 is used to load wafers into the wafer ring 500. The die bonder assembly 200 is used to transfer the wafers provided by the side-mounted wafer loading device 300 to the die bonder stage 100, thereby completing the die bonder operation.

[0033] Reference Figures 2-8 The embodiments of the present invention will describe the above-mentioned side-mounted wafer loading device 300. Specifically, the side-mounted wafer loading device 300 includes a wafer ring holding assembly 310, a pin assembly 320, a wafer ZY axis platform 330, an adapter camera 350, and an adapter assembly 340. The pin assembly 320, the wafer ring holding assembly 310, and the adapter assembly 340 are arranged horizontally along the X-axis. The pin assembly 320 is located to the left of the wafer ring holding assembly 310, and the adapter assembly 340 is located to the right of the wafer ring holding assembly 310. The wafer ring holding assembly 310 is used to fix the wafer ring 500 and make the wafer ring 500 stand in a side-standing position (vertical state). The wafer ZY axis platform 330 drives the wafer ring 500 to move to adjust the wafer loading position. The ejector assembly 320 lifts the wafer at the loading position. The adapter assembly 340 picks up the lifted wafer and transfers it to the adapter position, so that the bonding assembly 200 can pick up the wafer. Then the bonding assembly 200 transfers the wafer to the die bonding stage 100. The lens of the adapter camera 350 is set horizontally towards the wafer ring holding base 312 to take pictures of the loading position. The image taken by the adapter camera 350 is used to feed back to the control system, thereby adjusting the position of the wafer to achieve precise loading.

[0034] In this embodiment, refer to Figure 3 and Figure 4The wafer ring holding assembly 310 includes a vertically arranged wafer ring holding seat 312, a wafer base 311, and a wafer ring rotation drive 313. The wafer ring holding seat 312 includes a wafer synchronization ring 3122, an annular wafer ring seat 3121, and an annular baffle 3123. The wafer synchronization ring 3122, the wafer ring seat 3121, and the baffle 3123 are coaxially arranged, and the wafer synchronization ring 3122 is fixedly connected between the wafer ring seat 3121 and the baffle 3123. The baffle 3123 is provided with a stop block 3124 and a latching claw 314. The stop block 3124 and the latching claw 314 are respectively located on both sides of the baffle 3123. The latching claw 314 is rotatably connected to the baffle 3123 through a rotating shaft 3142. When the latching claw 314 is rotated to the open state, it is convenient to install the wafer ring 500. When the latching claw 314 is rotated to the closed state, it is used to press the wafer ring 500 against the stop block 3124, thereby completing the installation and fixation of the wafer ring 500. The opening claw 314 is connected to an elastic element 3144, which provides an elastic force to drive the opening claw 314 to close. The elastic element 3144 includes a fixed block and a torsion spring. The main body of the torsion spring is mounted on the fixed block, and the two ends of the torsion spring are respectively connected to the opening claw 314 and the fixed block, so that when the opening claw 314 rotates, it has an elastic force to generate a tendency to drive the opening claw 314 to move back.

[0035] Furthermore, the latching claw 314 is divided into a holding section 3141 and a driving section 3143 on both sides of the rotating shaft 3142. When an external force is applied to the driving section 3143, it drives the holding section 3141 to rotate. A pneumatic wafer clamp 315 is provided on the wafer base 311. The pneumatic wafer clamp 315 includes a cylinder 3151 mounted on the wafer base 311, a cylinder top block 3152 mounted on the piston rod of the cylinder 3151, and an opening roller 3153 mounted on the cylinder top block 3152. When the cylinder 3151 extends, it drives the opening roller 3153 to push the drive section 3143 of the opening claw 314 pneumatically, thereby driving the holding section 3141 to rotate outward. The torsion spring deforms and generates elastic force. At this time, the opening claw 314 is in the open state, which facilitates the installation or removal of the wafer ring 500. When the cylinder 3151 retracts, the thrust of the opening roller 3153 on the drive section 3143 disappears. Under the action of the elastic force of the torsion spring, the holding section 3141 is driven to rotate back, thereby pressing the wafer ring 500.

[0036] In this embodiment, the wafer ring holder 312 is rotatably connected to the wafer base 311, and the wafer ring rotation drive 313 is used to drive the wafer ring holder 312 to rotate, thereby adjusting the wafer's orientation (direction). Specifically, refer to... Figure 4The wafer base 311 is integrally formed with a wafer base support ring 3111. Multiple W-shaped grooved guide roller bearings 3112 are arranged annularly on the wafer base support ring 3111. The wafer ring seat 3121 is connected between the multiple grooved guide roller bearings 3112, allowing the wafer ring seat 3121 to rotate relative to the wafer base 311. The wafer ring rotation drive component 313 includes an open-loop motor 3131 mounted on the wafer base 311. The open-loop motor 3131 has a pulley 3132 on its main shaft. A synchronous belt 3133 is wound between the pulley 3132 and the wafer synchronization ring 3122. A tensioning wheel 3134 is provided on the wafer base 311 to adjust the tension of the synchronous belt 3133. The open-loop motor 3131 drives the synchronous belt 3133 to rotate, thereby driving the wafer synchronization ring 3122 to rotate, and then driving the wafer ring 500 to rotate, so as to adjust the posture of the wafer in the wafer ring 500.

[0037] In this embodiment, the wafer ZY-axis platform 330 is used to drive the wafer ring holding assembly 310 to move along the Y-axis and Z-axis directions, thereby adjusting the position of the wafer on the vertical plane. Specifically, the wafer ZY-axis platform 330 includes a wafer Y-axis module and a wafer Z-axis module. The wafer Z-axis module is connected to the driving end of the wafer Y-axis module, and the wafer base 311 is connected to the driving end of the wafer Z-axis module.

[0038] In this implementation, refer to Figure 5 and Figure 6 The ejector pin assembly 320 includes an ejector pin 325, an ejector pin cap 324, an ejector pin X-axis module, an ejector pin X-axis base 323, an ejector pin base 321, and an ejector pin YZ-axis platform 322. The ejector pin YZ-axis platform 322 is mounted on the ejector pin base 321. The ejector pin X-axis base 323 is located at the driving end of the ejector pin YZ-axis platform 322. The ejector pin cap 324 is located on the ejector pin X-axis base 323. The ejector pin 325 passes through a receiving hole arranged along the X-axis direction inside the ejector pin cap 324. The ejector pin X-axis module includes a voice coil motor 327, which is mounted on the ejector pin X-axis module. The voice coil motor 327 is connected to the ejector pin 325 through an ejector pin shaft 326 to drive the ejector pin 325 to move relative to the ejector pin cap 324, thereby lifting the wafer on the blue film after the ejector pin cap 324 picks up the blue film.

[0039] Furthermore, the ejector pin 325ZY axis platform includes an ejector pin Y-axis module and an ejector pin Z-axis module. The ejector pin Z-axis module is connected to the drive end of the ejector pin Y-axis module, and the ejector pin base 321 is connected to the drive end of the ejector pin Z-axis module. The ejector pin 325 is driven to move along the Y-axis and Z-axis directions respectively by the ejector pin Y-axis module and the ejector pin Z-axis module, so as to adjust the ejector pin 325 to move to the loading position, thereby lifting the chip at the loading position for easy chip picking by the adapter component 340.

[0040] In this embodiment, refer to Figure 7 The adapter assembly 340 includes an adapter arm 341 and an adapter rotation module. The adapter rotation module includes an adapter base 344 and an adapter motor 343. The adapter motor 343 is mounted on the adapter base 344. The adapter arm 341 is L-shaped, with one end fixedly connected to the spindle of the adapter motor 343 and the other end equipped with a suction nozzle 342 (a ceramic spring suction nozzle 342 connected to a vacuum valve). The adapter motor 343 drives the adapter arm 341 to rotate. (Refer to...) Figure 8 When the adapter arm 341 rotates to the left to a horizontal position, the suction nozzle 342 is in the loading position. After the ejector pin 325 lifts the wafer, the suction nozzle 342 sucks up the wafer under negative pressure. Then, the adapter motor 343 drives the adapter arm 341 to rotate upward by 90°, so that the adapter arm 341 rotates to a vertical position. The suction nozzle 342 carries the wafer to the adapter position, which makes it easy for the bonding assembly 200 to take away the wafer. Then, the adapter motor 343 drives the adapter arm 341 to rotate to the left again by 90°, so that the next wafer can be picked up.

[0041] Furthermore, the adapter assembly 340 also includes an adapter X-axis module 345. The adapter base 344 is connected to the drive end of the adapter X-axis module 345. The adapter X-axis module 345 can drive the adapter base 344 to move, thereby adjusting the position of the suction nozzle 342 in the X-axis direction to ensure that the suction nozzle 342 is located at the loading position and the transfer position after rotation, so as to accurately pick up and transfer the wafer. When there is an error between the distance between the loading position and the transfer position and the length of the adapter arm 341, the adapter X-axis module 345 drives the suction nozzle 342 to move to the loading position or the transfer position when picking up or transferring the wafer.

[0042] The die bonding stage 100, die bonding assembly 200, and die box assembly 400 are not innovative features of this invention; their specific structures are existing technologies. Furthermore, the control logic of the control system for controlling each module, motor, and camera in this invention is a conventional technical means in the industrial field, and will not be described in detail in this embodiment.

[0043] The above is a detailed description of the preferred embodiments of the present invention. However, the present invention is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A side-mounted wafer loading device, characterized in that: The device includes a pin assembly, a wafer ring holding assembly, a wafer ZY axis platform, and a transition assembly. The wafer ring holding assembly includes a vertically arranged wafer ring holding seat, a wafer base, and a wafer ring rotation drive. The wafer ring holding seat is used to mount the wafer ring and is rotatably connected to the wafer base. The wafer ring rotation drive is used to drive the wafer ring holding seat to rotate. The wafer ring holder includes a wafer ring holder, a wafer synchronization ring, and a baffle arranged coaxially. The wafer synchronization ring is connected between the wafer ring holder and the baffle. The wafer ring holder is rotatably connected to the wafer base. The wafer synchronization ring is connected to the wafer ring rotation drive. The baffle is provided with a stop block and a latching claw. When the opening claw is in the open state, it is used to install or remove the wafer ring; when the opening claw is in the closed state, it is used to press the wafer ring against the stop block. The wafer base is provided with a pneumatic wafer clamp. When the drive end of the pneumatic wafer clamp extends, it is used to drive the opening claw to open. The opening claw is connected to an elastic element, which is used to provide an elastic force to drive the opening claw to close. The wafer ZY axis platform is used to drive the wafer ring holding assembly to move along the Y-axis and Z-axis directions; The ejector pin assembly includes an ejector pin and an ejector pin X-axis module. The ejector pin X-axis module is used to drive the ejector pin to move closer to / away from the wafer ring holder along the X-axis direction in order to lift the wafer in the wafer ring mounted on the wafer ring holder. The adapter assembly includes an adapter arm and an adapter rotation module. The adapter arm is provided with a suction nozzle at its end. The adapter rotation module is used to drive the adapter arm to rotate. When the adapter arm is rotated to a horizontal position, the suction nozzle is used to pick up the wafer on the wafer ring holder. When the adapter arm is rotated upward to a vertical position, the electrodes of the wafer on the suction nozzle face downward.

2. The side-mounted wafer loading device according to claim 1, characterized in that: The wafer base is provided with a plurality of slotted guide roller bearings arranged in a ring, and the wafer ring seat is connected between the plurality of slotted guide roller bearings so that the wafer ring seat can rotate relative to the wafer base.

3. The side-mounted wafer loading device according to claim 2, characterized in that: The wafer ring rotation drive includes an open-loop motor mounted on a wafer base. The main shaft of the open-loop motor is equipped with a pulley, and a synchronous belt is wound between the pulley and the wafer synchronization ring.

4. The side-mounted wafer loading device according to claim 1, characterized in that: The ejector pin assembly also includes an ejector pin YZ axis platform, which is used to drive the ejector pin to move along the Y-axis and Z-axis directions.

5. The side-mounted wafer loading device according to claim 4, characterized in that: The ejector pin assembly includes an ejector pin cap, and the ejector pin passes through a receiving hole provided inside the ejector pin cap. The ejector pin X-axis module is used to drive the ejector pin to move relative to the ejector pin cap.

6. The side-mounted wafer loading device according to claim 1, characterized in that: The adapter assembly also includes an adapter X-axis module, which is connected to the drive end of the adapter X-axis module.

7. The side-mounted wafer loading device according to claim 1, characterized in that: It also includes an adapter camera, the lens of which is positioned horizontally toward the wafer ring holder.

8. A die bonder, characterized in that: The device includes a die bonding stage, a bonding head assembly, a cassette assembly, and a side-mounted wafer loading device as described in any one of claims 1-7, wherein the cassette assembly is used to provide a wafer ring and load wafers onto the side-mounted wafer loading device, and the bonding head assembly is used to transfer wafers on the adapter arm to the die bonding stage.

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