Warpage glass product cutting method, device, medium and product using a dicing saw

Abstract

This invention relates to the field of grinding and cutting technology, and more particularly to a method, apparatus, medium, and product for cutting warped glass products using a dicing machine. The method includes obtaining cutting paths for the workpiece to be cut, each cutting path being parallel to two mutually perpendicular cutting directions; forming two grooves on the two cutting paths located at the center of the surface of the workpiece, with the grooves not penetrating the thickness of the workpiece; detecting the closing displacement of the two grooves respectively, and determining the absolute difference between them; comparing the absolute difference with a threshold to select a cutting method; by pre-forming non-penetrating trial grooves along two orthogonal cutting directions at the center of the workpiece, and analyzing the closing displacement formed by the inward offset of the groove openings, different suitable cutting methods can be selected to reduce the peak value of crack driving force and the lateral load of the cutting tool, thereby effectively suppressing edge chipping and cracking, improving the straightness and edge quality of the cut, while taking into account both efficiency and consistency.

Description

Technical Field

[0001] This invention relates to the field of grinding and cutting technology, and in particular to a method, apparatus, medium, and product for cutting warped glass products using a dicing machine. Background Technology

[0002] In the optical communication industry, dicing machines are commonly used to cut large quantities of various types of materials, transforming them from large-area materials into countless small particles. Brittle materials such as glass often accumulate in-plane residual stress and warp during forming, strengthening, coating, handling, and storage. For warped glass products, conventional dicing methods involve cutting the warped glass in one direction first, then cutting in the other directions sequentially. Based on the dicing mechanism of dicing machines, the grinding wheel achieves cutting by impacting the warped glass at high speed. Due to the internal stress in the warped glass, forceful impacts cause a rapid release of this stress. When dicing with a grinding wheel, problems such as large back-side chipping and through-cracks are prone to occur, posing significant challenges to particle forming and subsequent applications of this material.

[0003] To address the aforementioned technical problems, Chinese Patent Publication No. CN112318337A discloses a method for cutting warped glass using a dicing machine. The specific steps are as follows: Step 1: Adhere the warped glass to a single-sided adhesive film substrate, and then fix the film substrate to the ceramic working disc of the dicing machine; Step 2: Cut grooves sequentially according to the direction in which the warped glass needs to be cut; Step 3: Cut along the center line of the grooves to cut off the warped glass. This method effectively solves the problem of changing the cutting method to prevent cracks from forming during the cutting of warped glass, allowing for effective release of internal stress in the material before cutting and reducing cracking.

[0004] The above-mentioned methods use a fixed sequential cutting or empirical adjustment sequence, which lacks quantitative judgment on the differences in warping degree and directional residual stress. As a result, there is insufficient consistency among samples with different warping states, and the yield of high-warping glass cutting is low. Summary of the Invention

[0005] To address this, the present invention provides a method, apparatus, medium, and product for cutting warped glass products using a dicing machine, thereby solving the problem that existing technologies employ fixed sequential cutting or empirical sequential adjustments, lacking quantitative judgment of differences in warping degree and directional residual stress, resulting in insufficient consistency among samples with different warping states and a low yield rate for cutting high-warping glass.

[0006] To achieve the above objectives, in a first aspect, the present invention provides a method for cutting warped glass products using a dicing machine, the method comprising:

[0007] Obtain the cutting path for the workpiece to be cut, with each cutting path parallel to two mutually perpendicular cutting directions;

[0008] Two grooves are formed on the two cutting paths located at the center of the surface of the workpiece to be cut, and the grooves do not penetrate the thickness of the workpiece to be cut;

[0009] The displacement of the two grooves at their joints is measured separately to determine the absolute difference between them;

[0010] The absolute difference is compared with a threshold. If the absolute difference is greater than the threshold, the first method is selected; otherwise, the second method is selected.

[0011] The first method includes, in sequence: cutting a portion of the thickness of the cutting path along the cutting direction corresponding to the groove with a large displacement of the joint; cutting through the cutting path in another direction; and cutting through the cutting path in the direction corresponding to the groove with a large displacement of the joint.

[0012] The second method includes, in sequence: cutting through part of the cutting path along the cutting direction corresponding to the groove with a large amount of dislocation; cutting through all the cutting paths in another direction; and cutting through the remaining cutting paths in the direction corresponding to the groove with a large amount of dislocation.

[0013] The displacement of the joint is determined by the distance by which the groove shifts inward due to stress.

[0014] As a preferred technical solution for cutting warped glass products using a dicing machine, the determination of the joint displacement specifically includes:

[0015] After a single groove is formed, the movement distance of the two sides of the groove opening relative to the theoretical position toward the inside of the groove is detected, and the sum of the maximum movement distance of the two sides toward the inside of the groove is taken as the closing displacement.

[0016] As a preferred technical solution for cutting warped glass products using a dicing machine, when two grooves are formed on two cutting paths located at the center of the surface of the workpiece to be cut, the grooves formed on the cutting paths in both cutting directions do not intersect with the edge of the workpiece to be cut, the two grooves do not intersect, and the distance between the grooves is greater than a preset distance.

[0017] As a preferred technical solution for the method of cutting warped glass products using a dicing machine, when performing the second method, for the first partial cutting path, a step-by-step cutting with the same length is adopted so that the path spacing of each path in the partial cutting path is the same.

[0018] As a preferred technical solution for the cutting method of warped glass products using a dicing machine, if the first method is selected, the partial thickness is determined based on the joint displacement; if the second method is selected, the path spacing of the partial path is determined based on the joint displacement.

[0019] The thickness of the portion is positively correlated with the displacement of the joint, and the path spacing is negatively correlated with the displacement of the joint.

[0020] As a preferred technical solution for cutting warped glass products using a dicing machine, the workpiece to be cut is a circular workpiece or a rectangular workpiece, and the cutting path is evenly distributed in a mesh pattern.

[0021] As a preferred technical solution for cutting warped glass products using a dicing machine, when two grooves are formed on two cutting paths located at the center of the surface of the workpiece to be cut, the two grooves have the same depth depending on whether the workpiece to be cut is circular or square.

[0022] In response to the fact that the part to be cut is rectangular, the two grooves have different depths, and the depth of each groove is determined based on the size of the part to be cut.

[0023] To achieve the above objectives, a second aspect of the present invention provides a cutting apparatus for warped glass products using a dicing machine, applicable to the cutting method for warped glass products using a dicing machine described in any of the above-described embodiments, the apparatus comprising:

[0024] The dicing and cutting module is used to cut or groove the workpiece.

[0025] The detection module is used to detect the amount of displacement at the joint of the groove;

[0026] The control module is used to select a cutting method for the workpiece to be cut based on the detection results of the detection module.

[0027] To achieve the above objectives, a third aspect of the present invention provides a computer storage medium storing computer instructions for causing a processor to execute the method for cutting warped glass products using a dicing machine as described in any of the above embodiments.

[0028] To achieve the above objectives, a fourth aspect of the present invention provides a computer program product, including a computer program that, when executed by a processor, implements the method for cutting warped glass products using a dicing machine as described in any of the above embodiments.

[0029] Compared with existing technologies, the beneficial effects of this invention are as follows: by pre-forming non-through trial grooves along two orthogonal cutting directions at the center of the workpiece to be cut, and using the "joint displacement" formed by the inward offset of the groove opening as a sensitive indicator of residual stress release, the degree of imbalance in stress release in the two directions is first determined. Then, under a threshold determination, two cutting methods are adaptively selected, and the segment thickness or the selected path density is adjusted around the magnitude of the "joint displacement" within the selected methods. The principle is that the inward offset of the groove opening reflects the local stress redistribution induced by the groove. When the offset in a certain direction is significantly larger, it indicates that the imbalance of in-plane compressive stress or bending stiffness in that direction is more prominent. If cut directly, too much energy is easily released before the diversion structure is constrained, leading to crack instability. By first performing controlled partial thickness cutting or sparse path cutting in a more sensitive direction, pre-releasing and reshaping the overall constraints, then performing a complete cut in the orthogonal direction, and finally back-cutting the remaining segment, the peak crack driving force and lateral load of the tool can be reduced, thereby suppressing edge chipping and cracks, improving the straightness and edge quality of the cut, while taking into account both efficiency and consistency.

[0030] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the description, claims, and drawings. Attached Figure Description

[0031] The accompanying drawings are provided to further understand the technical solutions of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the technical solutions of the present invention, and do not constitute a limitation on the technical solutions of the present invention.

[0032] Figure 1 This is a flowchart illustrating a method for cutting warped glass products using a dicing machine, as described in an embodiment of the present invention.

[0033] Figures 2-a to 2-d This is a schematic diagram of the steps of the first method according to an embodiment of the present invention, wherein... Figure 2-a and Figure 2-d This is a side view of the part to be cut. Figure 2-b and Figure 2-c This is a top view of the part to be cut;

[0034] Figures 3-a to 3-c This is a schematic diagram of the steps of the second method according to an embodiment of the present invention;

[0035] Figure 4 This is a schematic diagram of the groove distribution according to an embodiment of the present invention;

[0036] Figure 5 This is a schematic diagram illustrating the determination of the joint displacement in an embodiment of the present invention;

[0037] Figure 6 This is a structural block diagram of a warped glass product cutting device using a dicing machine, according to an embodiment of the present invention.

[0038] In the diagram: 1. Groove; 2. First cutting direction; 3. Second cutting direction. Detailed Implementation

[0039] To make the objectives and advantages of the present invention clearer, the present invention will be further described below with reference to embodiments; it should be understood that the specific embodiments described herein are merely for explaining the present invention and are not intended to limit the present invention.

[0040] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0041] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0042] Please see Figure 1 As shown, this embodiment provides a method for cutting warped glass products using a dicing machine, including:

[0043] Step S1: Obtain the cutting path for the workpiece to be cut, with each cutting path parallel to two mutually perpendicular cutting directions;

[0044] Step S2: Two grooves are formed on the two cutting paths located at the center of the surface of the workpiece to be cut, and the grooves do not penetrate the thickness of the workpiece to be cut.

[0045] Step S3: Detect the displacement of the two grooves at their joints and determine the absolute difference between them (i.e., the absolute value of the difference).

[0046] Step S4: Compare the absolute difference with the threshold. If the absolute difference is greater than the threshold, select the first method; otherwise, select the second method.

[0047] See Figures 2-a to 2-d As shown, the first method includes the following in sequence: Figure 2-a and Figure 2-b Cut a portion of the thickness of the cutting path along the cutting direction corresponding to the groove with a large displacement at the joint. Figure 2-c Cut through the cutting path in another direction (i.e., cut through all cutting paths in another direction). Figure 2-d Cut through the groove in the direction corresponding to the groove with a large displacement at the joint;

[0048] See Figures 3-a to 3-c As shown, the second method includes the following steps in sequence: Figure 3-a Cut through a portion of the cutting path (a portion of the complete length of the cutting path) along the cutting direction corresponding to the groove with a large displacement at the joint. Figure 3-b Cut through all the cutting paths in the other direction; Figure 3-c The remaining cutting path is then cut through in the direction corresponding to the groove with a large displacement at the joint. In this embodiment, the part to be cut is either circular or rectangular, and the cutting paths are evenly distributed in a mesh pattern (e.g., Figure 2-c or Figure 3-c (The cutting path shown).

[0049] In the above embodiments, when the dislocation amounts in the two cutting directions are similar (i.e., the absolute difference is not greater than the threshold), it indicates weak anisotropy and relatively balanced energy release. In this case, the second method, a step-by-step or equal-density strategy with a more uniform spatial distribution, is beneficial for maintaining overall stability. However, when the dislocation amount in a certain direction is significantly larger (i.e., the absolute difference is greater than the threshold), it means that there is a higher release driving force or a lower effective constraint in that direction. If a full-thickness cut is performed directly, long-seam instability is likely to form before the overall constraint is diverted. Therefore, when the absolute difference exceeds the threshold, a limited-thickness pre-release is preferentially adopted in the more sensitive direction, followed by orthogonal through-cutting and back-cutting of the remaining segment, which can significantly reduce the peak energy release rate and internal stress load. Conversely, a balanced step-by-step strategy is adopted to maintain geometric accuracy and cut consistency.

[0050] See Figure 4As shown, when two grooves are formed on two cutting paths at the center of the surface of the workpiece to be cut, the grooves 1 formed on the cutting paths in the first cutting direction 2 and the second cutting direction 3 do not intersect with the edge of the workpiece. The two grooves do not intersect, and the distance L between the grooves is greater than a preset distance. The preset distance is determined according to the size of the workpiece to be cut, and in this embodiment it is 10mm. In the above embodiment, if the grooves intersect with the edge or cross each other, additional stress concentration will be generated at the groove end or intersection point, causing the local stress field to be distorted, resulting in the measured joint displacement not being able to truly reflect the stress state inside the material. Maintaining the distance between the grooves and with the edge allows the two grooves to be independent in terms of stress release. The above settings ensure that the grooves in the two directions only reflect the residual stress characteristics in their own direction, without being affected by the boundary or each other, providing an accurate basis for subsequent judgment of the stress difference between the two directions. The measurement results are stable and repeatable; the groove edges are less prone to cracking or misjudgment; stress judgment is more reliable, and the cutting strategy selection is more accurate.

[0051] See Figure 5 As shown, the determination of the joint displacement specifically includes:

[0052] After a single groove is formed, the movement distance of the two sides of the groove opening relative to the theoretical position (i.e., the position perpendicular to the horizontal plane under no internal stress) towards the inside of the groove is detected. The sum of the maximum movement distances L1 and L2 of the two sides towards the inside of the groove is taken as the closing displacement. Specifically, for a single groove, there may be cases where the movement distance of the two sides of the groove opening relative to the theoretical position towards the inside of the groove is uneven at various dimensions. Selecting the maximum movement distance at each dimension of the groove is representative. The threshold for the absolute difference of the closing displacement can be set according to the actual material and cutting requirements. In this embodiment, the following exemplary threshold setting process is given:

[0053] In this embodiment, the workpiece to be cut is made of glass, rectangular, with dimensions of 8 feet * 8 feet and a thickness of 0.22 mm. The particle size to be cut is 0.85 mm * 1.6 ± 0.1 mm. During cutting, the spindle speed of the abrasive wheel dicing machine is 27,000 rpm, and the feed rate is 5 mm / s. The threshold is set as T = γ * C, where C is the average absolute difference obtained after calibrating a warped workpiece of the same material and size after a finite number of grooving operations, and γ is the anisotropy sensitivity coefficient. Considering the required anisotropy sensitivity, it is selected within the range of 0.7 to 1.0. A smaller γ makes it easier to determine significant anisotropy and select the first method. A larger γ makes the system more conservative, only selecting the first method when the difference is very obvious. For scenarios with high stiffness or shallow grooves, a slightly smaller γ can be used to improve the distinguishability; for scenarios with low stiffness or deep grooves where the overall response is already sufficiently sensitive, γ can be appropriately increased. In this embodiment, γ is set to 0.9.

[0054] To ensure uniformity, when executing the second method, for the initial partial path cutting, a step-by-step cutting with the same timing is adopted to ensure that the path spacing of each path in the partial path is the same. Furthermore, if the second method is selected, the path spacing of the partial paths is determined based on the joint displacement, and the path spacing is negatively correlated with the joint displacement. In this embodiment, the initial number of paths in the corresponding direction for the first cut is 7 equally spaced paths. When the joint displacement m of the groove with a larger joint displacement is greater than the average joint displacement m0 ​​obtained after grooving a warped workpiece of the same material and size under the same conditions a limited number of times, the path spacing is set to twice the original spacing; when m is less than or equal to m0, the path spacing is set to three times the original spacing.

[0055] Specifically, if the first method is selected, part of the thickness is determined based on the mouth displacement, and this part of the thickness is positively correlated with the mouth displacement. In detail, when the first method is selected, the mouth displacement itself reflects the degree of stress concentration in the workpiece in that direction. After the groove is formed, its two sides converge inwards. The greater this convergence distance, the stronger the internal stress release driving force or the weaker the bending constraint in that direction. If a full-thickness cut is performed directly at this point, cracks are prone to rapidly propagate along high-energy paths before stress homogenization is complete, resulting in edge bursting, edge chipping, or through-cutting. Conversely, by limiting the initial cutting range of a portion of the thickness, the spatial scale of energy release can be artificially controlled, allowing the residual stress at both ends of the cut to gradually conduct and attenuate, avoiding instantaneous full-area release. The thickness of the initial cut is positively correlated with the displacement in that direction. A larger displacement indicates stronger internal stress requiring release and a higher degree of system imbalance. Therefore, the initial cut thickness should be appropriately increased to allow for a larger pre-release area and sufficient relief of local stress. Conversely, when the displacement is small, the stress difference is small. Using an excessively large initial cut thickness would lead to unnecessary cutting time and energy consumption, and may also cause premature stress dispersion in local areas, affecting subsequent cutting accuracy. For example, when the displacement m of a groove with a large displacement is greater than m0, the initial cut thickness is one-third of the workpiece thickness; when m is less than or equal to m0, the initial cut thickness is one-fifth of the workpiece thickness. Of course, other methods that satisfy the positive correlation and meet stress release requirements can also be used in practice.

[0056] Specifically, when two grooves are formed on two cutting paths located at the center of the surface of the workpiece to be cut, the two grooves have the same depth depending on whether the workpiece to be cut is circular or square.

[0057] Responding to the fact that the workpiece to be cut is rectangular, the two grooves have different depths, and each depth is determined based on the dimensions of the workpiece. It should be understood that different shapes of glass have different bending stiffness in two directions. The stiffness of a circle or square is similar in both directions, and comparable stress responses can be obtained using grooves of the same depth; the stiffness of a rectangular piece is lower in the long side direction, resulting in higher stress release sensitivity, therefore the groove depth should be adjusted to keep the responses in both directions comparable. The above arrangement ensures that the grooves in both directions have similar sensitivity when generating a closing displacement, thereby guaranteeing the comparability of stress difference judgment. To further ensure effectiveness, preferably, the two grooves are of the same length, formed simultaneously, and the groove is located on the side closer to the starting position of the cutting workpiece. Of course, the width of the groove should be sufficient to be covered by the cutting path. Exemplarily, the process of determining the groove depth includes:

[0058] Select the proportion f of the target average groove depth to the thickness (in this embodiment, it is selected from empirical data within the range of 15%–25%, and the selected value of f is 20% for example), and calculate the target average depth D, D=f×t, where t is the thickness of the part to be cut;

[0059] Determine the length ratio r = Lm / Ln, where Lm is the length of the longer side and Ln is the length of the shorter side;

[0060] The depth in the short side direction is D1 = (2 × D) / (1 + r), and the depth in the long side direction is D2 = r × D1. In practice, the groove depth should be limited to a reasonable upper and lower limit range while satisfying the positive correlation (it should not be too low to affect the reliability of measurement, and should not be too high to make the groove close to penetration or cause cracking). In this embodiment, the upper and lower limit range is 10% to 30% of the thickness t of the part to be cut.

[0061] Further, please refer to Figure 6 As shown, this application embodiment also provides a cutting device for warped glass products using a dicing machine, applied to the cutting method described in any of the above solutions, the device comprising:

[0062] The dicing and cutting module is used to cut or groove the workpiece to be cut; in this embodiment, the dicing and cutting module is configured as a single-axis grinding wheel dicing machine.

[0063] The detection module is used to detect the displacement of the groove. In this embodiment, the detection module is configured as a confocal laser scanning microscope, which is used to detect the workpiece after it has been formed into a groove and removed from the single-axis grinding wheel scribing machine.

[0064] The control module receives the detection results from the detection module and selects the cutting method for the workpiece based on the detection results.

[0065] Furthermore, embodiments of this application also provide a computer program product, including a computer program that, when executed by a processor, implements the method for cutting warped glass products using a dicing machine as described in any of the above-described schemes.

[0066] Furthermore, embodiments of this application also provide a computer storage medium storing computer instructions for causing a processor to execute any of the above-described schemes of the method for cutting warped glass products using a dicing machine.

[0067] The computer storage medium provided in this application may be, for example, a USB flash drive, but is not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices, or any combination thereof. More specific examples of computer-readable storage media may include, but are not limited to: electrical connections having one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this embodiment, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, system, or device. The program code contained on the computer-readable storage medium may be transmitted using any suitable medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination thereof.

[0068] The technical solution of the present invention has been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the scope of protection of the present invention.

[0069] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention; various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for cutting warped glass products using a dicing machine, characterized in that, include: Obtain the cutting path for the workpiece to be cut, with each cutting path parallel to two mutually perpendicular cutting directions; Two grooves are formed on the two cutting paths located at the center of the surface of the workpiece to be cut, and the grooves do not penetrate the thickness of the workpiece to be cut; The displacement of the two grooves at their joints is measured separately to determine the absolute difference between them; The absolute difference is compared with a threshold. If the absolute difference is greater than the threshold, the first method is selected; otherwise, the second method is selected. The first method includes, in sequence: cutting a portion of the thickness of the cutting path along the cutting direction corresponding to the groove with a large displacement of the joint; cutting through the cutting path in another direction; and cutting through the cutting path in the direction corresponding to the groove with a large displacement of the joint. The second method includes, in sequence: cutting through part of the cutting path along the cutting direction corresponding to the groove with a large amount of dislocation; cutting through all the cutting paths in another direction; and cutting through the remaining cutting paths in the direction corresponding to the groove with a large amount of dislocation. The displacement of the joint is determined by the distance the groove shifts inward due to stress. Specifically, the determination of the displacement includes: After a single groove is formed, the movement distance of the two sides of the groove opening relative to the theoretical position toward the inside of the groove is detected, and the sum of the maximum movement distance of the two sides toward the inside of the groove is taken as the closing displacement. The threshold is determined by the following formula: T=γ*C, where C is the average absolute difference obtained by calibrating a warped workpiece of the same material and size after a finite number of grooving operations, and γ is the anisotropic sensitivity coefficient, which is selected in the range of 0.7 to 1.

0.

2. The method for cutting warped glass products using a dicing machine according to claim 1, characterized in that, When two grooves are formed on two cutting paths located at the center of the surface of the workpiece to be cut, the grooves formed on the cutting paths in both cutting directions do not intersect with the edge of the workpiece to be cut, the two grooves do not intersect, and the distance between the grooves is greater than the preset distance.

3. The method for cutting warped glass products using a dicing machine according to claim 1, characterized in that, When performing the second method, for the first partial cutting path, a step-by-step cutting with the same length is adopted so that the path spacing of each path in the partial cutting path is the same.

4. The method for cutting warped glass products using a dicing machine according to claim 3, characterized in that, If the first method is selected, the partial thickness is determined based on the joint displacement; if the second method is selected, the path spacing of the partial path is determined based on the joint displacement. The thickness of the portion is positively correlated with the displacement of the joint, and the path spacing is negatively correlated with the displacement of the joint.

5. The method for cutting warped glass products using a dicing machine according to claim 2, characterized in that, The part to be cut is either circular or rectangular, and the cutting paths are evenly distributed in a mesh pattern.

6. The method for cutting warped glass products using a dicing machine according to claim 5, characterized in that, When two grooves are formed on two cutting paths located at the center of the surface of the workpiece to be cut, the depth of the two grooves is the same, depending on whether the workpiece to be cut is circular or square. In response to the fact that the part to be cut is rectangular, the two grooves have different depths, and the depth of each groove is determined based on the size of the part to be cut.

7. A cutting device for warped glass products using a dicing machine, characterized in that, The method for cutting warped glass products using a dicing machine according to any one of claims 1-6, the apparatus comprising: The dicing and cutting module is used to cut or groove the workpiece. The detection module is used to detect the amount of displacement at the joint of the groove; The control module is used to select a cutting method for the workpiece to be cut based on the detection results of the detection module.

8. A computer storage medium, characterized in that, The computer storage medium stores computer instructions for causing the processor to execute the method for cutting warped glass products using a dicing machine as described in any one of claims 1-6.

9. A computer program product comprising a computer program that, when executed by a processor, implements a method for cutting warped glass products using a dicing machine according to any one of claims 1-6.

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