Resin composition, prepreg and product thereof

Abstract

The invention discloses a resin composition, a prepreg and a product thereof, and the resin composition comprises the following components: (A) PTFE resin; (B) thermoplastic resin, the main chain of the thermoplastic resin comprises 15-40% of specific chemical bonds, and the bond angle of the specific chemical bonds is greater than or equal to 110 degrees; and (C) an inorganic filler. According to the scheme, the thermoplastic resin is added into the PTFE resin containing the inorganic filler, and the main chain of the thermoplastic resin is limited to contain 15-40% of chemical bonds with specific bond angles, so that the flowability of the resin composition is improved, the cream layer thickness uniformity of the prepreg prepared from the resin composition is good, and the cream layer thickness uniformity of the prepreg is improved. And the thickness range, the dielectric range and the heat conduction range of the circuit substrate are small.

Description

Technical Field

[0001] This invention belongs to the field of electronic materials technology, and particularly relates to a resin composition, a prepreg, and products thereof. Background Technology

[0002] With the rapid development of 5G communication, artificial intelligence, and high-performance computing, polytetrafluoroethylene (PTFE) resin, with its extremely low dielectric constant (Dk) and dielectric loss (Df), is frequently used in the fabrication of circuit boards. However, PTFE maintains extremely high viscosity and lacks fluidity in its molten state. This characteristic makes it difficult to achieve uniform leveling during the prepreg fabrication process, resulting in uneven filler distribution within the prepreg. Consequently, prepregs made from traditional PTFE resin exhibit poor consistency in the thickness of the cream layer, leading to uneven distribution of the dielectric constant across the entire circuit board and a decrease in thermal conductivity. Furthermore, the stability of the thermal conductivity is difficult to guarantee.

[0003] Therefore, existing resin compositions have high viscosity and poor flowability in the molten state, resulting in poor uniformity of the cream layer thickness in the prepreg produced, and large differences in the thickness, dielectric difference, and thermal conductivity of the circuit board. Summary of the Invention

[0004] To solve the above-mentioned technical problems, the purpose of this invention is to provide a resin composition, a prepreg and its products. This invention improves the fluidity of the resin composition by designing the composition, improves the uniformity of the cream layer thickness of the prepared prepreg, and reduces the thickness difference, dielectric difference and thermal conductivity difference of the circuit board.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A resin composition comprising the following components:

[0007] (A) PTFE resin;

[0008] (B) A thermoplastic resin, wherein the main chain of the thermoplastic resin contains 15%-40% specific chemical bonds, wherein the bond angle of the specific chemical bonds is ≥110°;

[0009] (C) Inorganic fillers.

[0010] Preferably, with 100 parts by weight of component (A), 20-40 parts by weight of component (B) and 170-220 parts by weight of component (C).

[0011] Preferably, the main chain and / or side groups of the thermoplastic resin contain specific functional groups, which are selected from one or both of aromatic rings and sulfone groups.

[0012] Preferably, the thermoplastic resin is selected from one or more of polyphenylene sulfone resin, bisphenol A type polysulfone resin, polyether sulfone resin, polyarylsulfone resin and methylphenyl hydrogen-containing silicone resin.

[0013] Preferably, the number average molecular weight of the thermoplastic resin is 5000~8000 g / mol.

[0014] Preferably, the inorganic filler satisfies at least one of the following conditions:

[0015] (1) The particle size of the inorganic filler is ≤10μm;

[0016] (2) The inorganic filler has a spherical morphology;

[0017] (3) The inorganic filler is selected from one or more of silicon dioxide, aluminum oxide, titanium dioxide and silicon nitride.

[0018] Preferably, the melt viscosity of the resin composition is 800-1500 Pa·s.

[0019] A semi-cured sheet includes a reinforcing material layer and cream layers respectively disposed on both sides of the reinforcing material layer, the cream layers being formed by coating with a resin composition as described above.

[0020] Preferably, the cream layer satisfies at least one of the following conditions:

[0021] (1) The median thickness of the cream layer is 65-75 μm;

[0022] (2) The thickness difference of the cream layer is ≤8μm;

[0023] (3) The difference between the median thicknesses of the two cream layers is ≤4μm.

[0024] An article made from a prepreg as described above, the article comprising a circuit board and a printed circuit board.

[0025] The present invention, by adopting the above technical solution, has the following beneficial effects:

[0026] This invention improves the fluidity of the resin composition by adding a specific thermoplastic resin to PTFE resin containing inorganic fillers and limiting the main chain of the thermoplastic resin to contain chemical bonds with a specific bond angle of 15%-40%. The prepreg prepared from this resin composition has excellent uniformity in the thickness of the cream layer, and small thickness difference, dielectric difference, and thermal conductivity difference of the circuit board. Furthermore, by further limiting the median thickness, thickness difference, and difference between the median thicknesses of the cream layers in the prepreg, the remaining properties and thickness of the circuit board are further guaranteed to meet the standards, and the thickness difference, dielectric difference, and thermal conductivity difference of the circuit board are further reduced. Detailed Implementation

[0027] The embodiments of this application are described in detail below. The described embodiments are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0028] In this invention, except for the components specifically described for synthesis, all other components and reagents involved are conventional commercially available products or can be obtained through conventional technical means in the art. Unless otherwise stated, the materials, methods, and embodiments of this invention are exemplary only and not limiting.

[0029] A resin composition comprising the following components:

[0030] (A) PTFE resin;

[0031] (B) A thermoplastic resin, wherein the main chain of the thermoplastic resin contains 15%-40% specific chemical bonds, wherein the bond angle of the specific chemical bonds is ≥110°;

[0032] (C) Inorganic fillers.

[0033] In this scheme, a specific thermoplastic resin is added to PTFE resin containing inorganic fillers, and the main chain of the thermoplastic resin is limited to contain chemical bonds with a bond angle ≥110°. Chemical bonds with a bond angle ≥110° have a higher degree of rotational freedom, which can increase the flexibility of the molecular chain and thus improve the flowability of the resin composition. In this scheme, the proportion of chemical bonds with bond angles ≥110° is 15%-40% of the total chemical bonds, for example, it can be 15%, 20%, 25%, 30%, 35%, or 40%. If the proportion of chemical bonds with bond angles ≥110° is too low, the flowability of the resin composition cannot be improved, affecting the uniformity of the cream layer thickness of the prepreg and the thickness difference, dielectric difference, and thermal conductivity difference of the circuit board. If the proportion of chemical bonds with bond angles ≥110° is too high, the resin composition has excessive flowability in the molten state, which easily leads to thinner side thickness of the prepreg, resulting in poor uniformity of the cream layer thickness and increased thickness difference, dielectric difference, and thermal conductivity difference of the circuit board. The chemical bonds with bond angles ≥110° can be one or more of the following: carbon-nitrogen bonds, carbon-oxygen bonds, silicon-oxygen bonds, carbon-carbon double bonds, etc., or other chemical bonds that meet the requirement of bond angles ≥110°.

[0034] Furthermore, in this scheme, with 100 parts by weight of component (A), 20-40 parts by weight of component (B), and 170-220 parts by weight of component (C).

[0035] In this invention, with 100 parts by weight of component (A), 20-40 parts by weight of component (B), and 170-220 parts by weight of component (C), for example, the weight of component (B) can be 20, 25, 30, 35, or 40 parts, and the weight of component (C) can be 170, 180, 190, 200, 210, or 220 parts. By limiting the weight of components (B) and (C), the heat resistance, thickness variation, dielectric variation, and thermal conductivity variation of the circuit board made from this resin composition can be balanced.

[0036] Furthermore, in this scheme, the melt viscosity of the resin composition is preferably 800-1500 Pa·s, thereby improving the uniformity of the cream layer thickness of the prepreg and reducing the thickness difference, dielectric difference and thermal conductivity difference of the circuit board. On this basis, in order to ensure the heat resistance of the circuit board, the melt viscosity of the resin composition is preferably 1000-1200 Pa·s.

[0037] In this invention, the main chain and / or side groups of the thermoplastic resin contain specific functional groups, which are selected from one or both of aromatic rings and sulfone groups. When the thermoplastic resin contains aromatic rings, the rigid planar structure of the aromatic rings can effectively restrict the movement of molecular chains, thereby significantly improving the heat resistance of the thermoplastic resin, adapting to the sintering temperature of PTFE resin, and further reducing the dielectric and thermal conductivity differences of the circuit board made of the resin composition. When the thermoplastic resin contains sulfone groups, the sulfone groups can form hydrogen bonds with the hydroxyl groups on the filler surface, thereby improving the dispersibility of the filler and further reducing the dielectric and thermal conductivity differences of the circuit board made of the resin composition. For example, the thermoplastic resin is selected from one or more of polyphenylene sulfone resin, bisphenol A type polysulfone resin, polyethersulfone resin, polyarylsulfone resin, and methylphenyl hydrogen-containing silicone resin.

[0038] In this invention, the number-average molecular weight of the thermoplastic resin is 5000~8000 g / mol, which further increases the fluidity of the resin composition, thereby improving the uniformity of the cream layer thickness of the prepared prepreg. For example, the number-average molecular weight of the thermoplastic resin can be 5000 g / mol, 6000 g / mol, 7000 g / mol, or 8000 g / mol, etc.

[0039] In this invention, the inorganic filler satisfies at least one of the following conditions:

[0040] (1) The particle size of the inorganic filler is ≤10μm; more preferably, the particle size of the inorganic filler is ≥3μm;

[0041] (2) The inorganic filler has a spherical morphology;

[0042] (3) The inorganic filler is selected from one or more of silicon dioxide, aluminum oxide, titanium dioxide and silicon nitride.

[0043] When the particle size of inorganic fillers is greater than 10μm, it can lead to uneven dispersion of the prepreg, causing protrusions in the cream layer and affecting the uniformity of the cream layer thickness. For example, the particle size of inorganic fillers can be 1μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, or 10μm, etc. In this way, the inorganic fillers are evenly dispersed in the resin composition, resulting in good uniformity of the cream layer thickness in the prepreg.

[0044] The inorganic filler is preferably spherical. The spherical structure can improve the dispersibility of the inorganic filler, and the resulting prepreg has low porosity, thereby improving the thickness uniformity of the prepreg cream layer and reducing the thickness difference, dielectric difference and thermal conductivity difference of the circuit board.

[0045] In this invention, the resin composition may also include solvents and other additives, as long as they do not impair the inherent properties of the resin composition, and can be used alone or in combination according to actual processability, efficiency and other actual conditions.

[0046] This invention also discloses a prepreg, comprising a reinforcing material layer and cream layers respectively disposed on both sides of the reinforcing material layer, wherein the cream layers are formed by coating or impregnating with the resin composition described above. Preferably, the reinforcing material layer is an electronic-grade fiberglass cloth layer, specifically comprising electronic-grade fiberglass cloth and a resin composition coated or impregnated within the electronic-grade fiberglass cloth. The median thickness of the cream layer is 65-75 μm; for example, the median thickness of the cream layer can be 65 μm, 67 μm, 69 μm, 71 μm, 73 μm, or 75 μm, etc. This configuration can also reduce the thickness difference, dielectric difference, and thermal conductivity difference of the circuit board.

[0047] In this invention, the thickness difference of the cream layer is ≤8μm. For example, the thickness difference of the cream layer can be 0μm, 1μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, or 8μm, thereby improving the uniformity of the cream layer thickness of the prepreg and reducing the thickness difference, dielectric difference, and thermal conductivity difference of the circuit board. In this invention, the difference between the median thicknesses of the cream layers located on both sides of the reinforcing material layer is ≤4μm, thereby ensuring the uniformity of the cream layer thickness on both sides of the prepreg and reducing the thickness difference, dielectric difference, and thermal conductivity difference of the circuit board.

[0048] This invention also provides a circuit board made using the aforementioned prepreg, comprising an insulating layer and a conductive layer disposed on at least one surface of the insulating layer. The insulating layer is formed by pressing one or more laminated prepregs as described above, and the conductive layer can be copper foil, aluminum foil, nickel foil, silver foil, or their alloy foil, etc. This application does not limit the type of material, but copper foil is preferred. Specifically, the printed circuit board is made using the circuit board described above. Specifically, the printed circuit board is mainly made from the circuit board through processes such as drilling, hole preparation, micro-etching, pre-immersion, activation, acceleration, chemical copper plating, and copper thickening.

[0049] The effects of the technical solution of this application will be further illustrated below through several specific application examples.

[0050] Example 1:

[0051] A resin composition comprising the following components:

[0052] PTFE resin: 100 parts by weight;

[0053] Polyethersulfone resin (containing 30% chemical bonds with a bond angle of 110°, Mn=7000): 30 parts by weight;

[0054] Inorganic filler: 190 parts by weight;

[0055] The inorganic filler is a mixture of 95 parts by weight of spherical silica with a particle size of 5 μm and 95 parts by weight of spherical alumina with a particle size of 5 μm.

[0056] Preparation method of resin composition: The above PTFE resin and thermoplastic resin are mixed in xylene solvent in proportion and dispersed evenly. Then, filler and 0.5 parts by weight of coupling agent KH550 are added according to the weight. After being dispersed evenly, the resin composition is obtained. The melt viscosity of the resin composition is 1010 Pa·s.

[0057] The above resin composition was uniformly coated onto electronic-grade fiberglass cloth, dried, and then sintered at 382℃ for 5 min to prepare a prepreg with a median cream layer thickness of 70.5 μm, a cream layer thickness range of 5.3 μm, and a thickness range between the two cream layers of 3.3 μm. Five prepregs were stacked on top of each other with copper foil and pressed to obtain a circuit board.

[0058] Example 2:

[0059] A resin composition comprising the following components:

[0060] PTFE resin: 100 parts by weight;

[0061] Polyethersulfone resin (containing 30% chemical bonds with a bond angle of 110°, Mn=7000): 25 parts by weight;

[0062] Inorganic filler: 195 parts by weight;

[0063] The inorganic filler is spherical alumina with a particle size of 5 μm.

[0064] The resin composition was prepared using the same method as in Example 1. The melt viscosity of the resin composition was tested to be 1050 Pa·s.

[0065] The above resin composition was uniformly coated onto electronic-grade fiberglass cloth, dried, and then sintered at 382°C for 5 minutes to prepare a prepreg with a median cream layer thickness of 70.8 μm, a cream layer thickness range of 5.5 μm, and a thickness range between the two cream layers of 3.3 μm. Five prepregs were stacked on top of each other with copper foil and pressed to obtain a circuit board.

[0066] Example 3:

[0067] A resin composition comprising the following components:

[0068] PTFE resin: 100 parts by weight;

[0069] Polyphenyl sulfone resin (containing 40% chemical bonds with a bond angle of 110°, Mn=7400): 30 parts by weight;

[0070] Inorganic filler: 190 parts by weight;

[0071] The inorganic filler is a mixture of 95 parts by weight of spherical silica with a particle size of 5 μm and 95 parts by weight of spherical alumina with a particle size of 5 μm.

[0072] The resin composition was prepared using the same method as in Example 1. The melt viscosity of the resin composition was tested to be 1120 Pa·s.

[0073] The above resin composition was uniformly coated onto electronic-grade fiberglass cloth, dried, and then sintered at 382℃ for 5 min to prepare a prepreg with a median cream layer thickness of 71.1 μm, a cream layer thickness range of 5.9 μm, and a thickness range between the two cream layers of 3.4 μm. Five prepregs were stacked on top of each other with copper foil and pressed to obtain a circuit board.

[0074] Example 4:

[0075] A resin composition comprising the following components:

[0076] PTFE resin: 100 parts by weight;

[0077] Polyetheretherketone resin (containing 37% chemical bonds with a bond angle of 110°, Mn=7500): 30 parts by weight;

[0078] Inorganic filler: 190 parts by weight;

[0079] The inorganic filler is a mixture of 95 parts by weight of spherical silica with a particle size of 5 μm and 95 parts by weight of spherical alumina with a particle size of 5 μm.

[0080] The resin composition was prepared using the same method as in Example 1. The melt viscosity of the resin composition was tested to be 1460 Pa·s.

[0081] The above resin composition was uniformly coated onto electronic-grade fiberglass cloth, dried, and then sintered at 382°C for 5 minutes to prepare a prepreg with a median cream layer thickness of 69.5 μm, a cream layer thickness range of 7.7 μm, and a thickness range between the two cream layers of 3.7 μm. Five prepregs were stacked on top of each other with copper foil and pressed to obtain a circuit board.

[0082] Example 5:

[0083] A resin composition comprising the following components:

[0084] PTFE resin: 100 parts by weight;

[0085] Sulfone-containing aliphatic polymer resin (containing 16% chemical bonds with a bond angle of 120°, Mn=7300): 30 parts by weight;

[0086] Inorganic filler: 190 parts by weight;

[0087] The inorganic filler is a mixture of 95 parts by weight of spherical silica with a particle size of 5 μm and 95 parts by weight of spherical alumina with a particle size of 5 μm.

[0088] The resin composition was prepared using the same method as in Example 1. The melt viscosity of the resin composition was tested to be 1270 Pa·s.

[0089] The above resin composition was uniformly coated onto electronic-grade fiberglass cloth, dried, and then sintered at 382℃ for 5 min to prepare a prepreg with a median cream layer thickness of 70.8 μm, a cream layer thickness range of 6.3 μm, and a thickness range between the two cream layers of 3.4 μm. Five prepregs were stacked on top of each other with copper foil and pressed to obtain a circuit board.

[0090] Example 6:

[0091] A resin composition comprising the following components:

[0092] PTFE resin: 100 parts by weight;

[0093] Polyacetylene resin (containing 20% ​​chemical bonds with a bond angle of 120°, Mn=7100): 30 parts by weight;

[0094] Inorganic filler: 190 parts by weight;

[0095] The inorganic filler is a mixture of 95 parts by weight of spherical silica with a particle size of 5 μm and 95 parts by weight of spherical alumina with a particle size of 5 μm.

[0096] The resin composition was prepared using the same method as in Example 1. The melt viscosity of the resin composition was tested to be 1510 Pa·s.

[0097] The above resin composition was uniformly coated onto electronic-grade fiberglass cloth, dried, and then sintered at 382℃ for 5 min to prepare a prepreg with a median cream layer thickness of 69.4 μm, a cream layer thickness range of 5.9 μm, and a two-cream layer thickness range of 3.2 μm. Five prepregs were stacked on top of each other with copper foil and pressed to obtain a circuit board.

[0098] Example 7:

[0099] A resin composition comprising the following components:

[0100] PTFE resin: 100 parts by weight;

[0101] Polyethersulfone resin (containing 30% chemical bonds with a bond angle of 110°, Mn=4500): 30 parts by weight;

[0102] Inorganic filler: 190 parts by weight;

[0103] The inorganic filler is a mixture of 95 parts by weight of spherical silica with a particle size of 5 μm and 95 parts by weight of spherical alumina with a particle size of 5 μm.

[0104] The resin composition was prepared using the same method as in Example 1. The melt viscosity of the resin composition was tested to be 840 Pa·s.

[0105] The above resin composition was uniformly coated onto electronic-grade fiberglass cloth, dried, and then sintered at 382°C for 5 minutes to prepare a prepreg with a median cream layer thickness of 70.2 μm, a cream layer thickness range of 7.3 μm, and a thickness range between the two cream layers of 3.6 μm. Five prepregs were stacked on top of each other with copper foil and pressed to obtain a circuit board.

[0106] Example 8:

[0107] A resin composition comprising the following components:

[0108] PTFE resin: 100 parts by weight;

[0109] Polyethersulfone resin (containing 30% chemical bonds with a bond angle of 110°, Mn=9000): 30 parts by weight;

[0110] Inorganic filler: 190 parts by weight;

[0111] The inorganic filler is a mixture of 95 parts by weight of spherical silica with a particle size of 5 μm and 95 parts by weight of spherical alumina with a particle size of 5 μm.

[0112] The resin composition was prepared using the same method as in Example 1. The melt viscosity of the resin composition was tested to be 1300 Pa·s.

[0113] The above resin composition was uniformly coated onto electronic-grade fiberglass cloth, dried, and then sintered at 382℃ for 5 min to prepare a prepreg with a median cream layer thickness of 70.6 μm, a cream layer thickness range of 6.7 μm, and a thickness range between the two cream layers of 3.6 μm. Five prepregs were stacked on top of each other with copper foil and pressed to obtain a circuit board.

[0114] Example 9:

[0115] A resin composition comprising the following components:

[0116] PTFE resin: 100 parts by weight;

[0117] Polyethersulfone resin (containing 30% chemical bonds with a bond angle of 110°, Mn=7000): 30 parts by weight;

[0118] Inorganic filler: 190 parts by weight;

[0119] The inorganic filler is a mixture of 95 parts by weight of spherical silica with a particle size of 15 μm and 95 parts by weight of spherical alumina with a particle size of 15 μm.

[0120] The resin composition was prepared using the same method as in Example 1. The melt viscosity of the resin composition was tested to be 1360 Pa·s.

[0121] The above resin composition was uniformly coated onto electronic-grade fiberglass cloth, dried, and then sintered at 382°C for 5 minutes to prepare a prepreg with a median cream layer thickness of 70.3 μm, a cream layer thickness range of 7.2 μm, and a thickness range between the two cream layers of 3.6 μm. Five prepregs were stacked on top of each other with copper foil and pressed to obtain a circuit board.

[0122] Example 10:

[0123] A resin composition comprising the following components:

[0124] PTFE resin: 100 parts by weight;

[0125] Polyethersulfone resin (containing 30% chemical bonds with a bond angle of 110°, Mn=7000): 30 parts by weight;

[0126] Inorganic filler: 190 parts by weight;

[0127] The inorganic filler is angular silicon nitride with a particle size of 7 μm.

[0128] The resin composition was prepared using the same method as in Example 1. The melt viscosity of the resin composition was tested to be 1320 Pa·s.

[0129] The above resin composition was uniformly coated onto electronic-grade fiberglass cloth, dried, and then sintered at 382℃ for 5 min to prepare a prepreg with a median cream layer thickness of 70.9 μm, a cream layer thickness range of 7.5 μm, and a thickness range between the two cream layers of 3.8 μm. Five prepregs were stacked on top of each other with copper foil and pressed to obtain a circuit board.

[0130] Example 11:

[0131] A resin composition comprising the following components:

[0132] PTFE resin: 100 parts by weight;

[0133] Polyethersulfone resin (containing 30% chemical bonds with a bond angle of 110°, Mn=7000): 30 parts by weight;

[0134] Inorganic filler: 190 parts by weight;

[0135] The inorganic filler is a mixture of 95 parts by weight of spherical silica with a particle size of 5 μm and 95 parts by weight of spherical alumina with a particle size of 5 μm.

[0136] The resin composition was prepared using the same method as in Example 1. The melt viscosity of the resin composition was tested to be 1010 Pa·s.

[0137] The above resin composition was uniformly coated onto electronic-grade fiberglass cloth, dried, and then sintered at 382°C for 5 minutes to prepare a prepreg with a median cream layer thickness of 80.5 μm, a cream layer thickness range of 7.9 μm, and a thickness range between the two cream layers of 3.9 μm. Five prepregs were stacked on top of each other with copper foil and pressed to obtain a circuit board.

[0138] Example 12:

[0139] A resin composition comprising the following components:

[0140] PTFE resin: 100 parts by weight;

[0141] Polyethersulfone resin (containing 30% chemical bonds with a bond angle of 110°, Mn=7000): 30 parts by weight;

[0142] Inorganic filler: 220 parts by weight;

[0143] The inorganic filler is composed of 110 parts by weight of angular silicon nitride with a particle size of 7 μm and 110 parts by weight of spherical alumina with a particle size of 5 μm.

[0144] The resin composition was prepared using the same method as in Example 1. The melt viscosity of the resin composition was tested to be 1490 Pa·s.

[0145] The above resin composition was uniformly coated onto electronic-grade fiberglass cloth, dried, and then sintered at 382℃ for 5 min to prepare a prepreg with a median cream layer thickness of 75.0 μm, a cream layer thickness range of 8.5 μm, and a thickness range between the two cream layers of 4.0 μm. Five prepregs were stacked on top of each other with copper foil and pressed to obtain a circuit board.

[0146] Example 13:

[0147] A resin composition comprising the following components:

[0148] PTFE resin: 100 parts by weight;

[0149] Polyethersulfone resin (containing 30% chemical bonds with a bond angle of 110°, Mn=7000): 30 parts by weight;

[0150] Inorganic filler: 190 parts by weight;

[0151] The inorganic filler is a mixture of 95 parts by weight of spherical silica with a particle size of 5 μm and 95 parts by weight of spherical alumina with a particle size of 5 μm.

[0152] The resin composition was prepared using the same method as in Example 1. The melt viscosity of the resin composition was tested to be 1010 Pa·s.

[0153] The above resin composition was uniformly coated onto electronic-grade fiberglass cloth, dried, and then sintered at 382℃ for 5 min to prepare a prepreg with a median cream layer thickness of 70.1 μm, a cream layer thickness range of 6.2 μm, and a thickness range between the two cream layers of 5.6 μm. Five prepregs were stacked on top of each other with copper foil and pressed to obtain a circuit board.

[0154] Example 14:

[0155] A resin composition comprising the following components:

[0156] PTFE resin: 100 parts by weight;

[0157] Polyethersulfone resin (containing 30% chemical bonds with a bond angle of 110°, Mn=7000): 18 parts by weight;

[0158] Inorganic filler: 190 parts by weight;

[0159] The inorganic filler is a mixture of 95 parts by weight of spherical silica with a particle size of 5 μm and 95 parts by weight of spherical alumina with a particle size of 5 μm.

[0160] The resin composition was prepared using the same method as in Example 1. The melt viscosity of the resin composition was tested to be 1300 Pa·s.

[0161] The above resin composition was uniformly coated onto electronic-grade fiberglass cloth, dried, and then sintered at 382℃ for 5 min to prepare a prepreg with a median cream layer thickness of 71.2 μm, a cream layer thickness range of 6.6 μm, and a thickness range between the two cream layers of 3.6 μm. Five prepregs were stacked on top of each other with copper foil and pressed to obtain a circuit board.

[0162] Example 15:

[0163] A resin composition comprising the following components:

[0164] PTFE resin: 100 parts by weight;

[0165] Polyethersulfone resin (containing 30% chemical bonds with a bond angle of 110°, Mn=7000): 45 parts by weight;

[0166] Inorganic filler: 190 parts by weight;

[0167] The inorganic filler is a mixture of 95 parts by weight of spherical silica with a particle size of 5 μm and 95 parts by weight of spherical alumina with a particle size of 5 μm.

[0168] The resin composition was prepared using the same method as in Example 1. The melt viscosity of the resin composition was tested to be 950 Pa·s.

[0169] The above resin composition was uniformly coated onto electronic-grade fiberglass cloth, dried, and then sintered at 382℃ for 5 min to prepare a prepreg with a median cream layer thickness of 70.9 μm, a cream layer thickness range of 6.4 μm, and a two-cream layer thickness range of 3.4 μm. Five prepregs were stacked on top of each other with copper foil and pressed to obtain a circuit board.

[0170] Example 16:

[0171] A resin composition comprising the following components:

[0172] PTFE resin: 100 parts by weight;

[0173] Polyethersulfone resin (containing 30% chemical bonds with a bond angle of 110°, Mn=7000): 30 parts by weight;

[0174] Inorganic filler: 150 parts by weight;

[0175] The inorganic filler is composed of 75 parts by weight of spherical silica with a particle size of 5 μm and 75 parts by weight of spherical alumina with a particle size of 5 μm.

[0176] The resin composition was prepared using the same method as in Example 1. The melt viscosity of the resin composition was tested to be 910 Pa·s.

[0177] The above resin composition was uniformly coated onto electronic-grade fiberglass cloth, dried, and then sintered at 382℃ for 5 min to prepare a prepreg with a median cream layer thickness of 71.1 μm, a cream layer thickness range of 6.6 μm, and a thickness range between the two cream layers of 3.7 μm. Five prepregs were stacked on top of each other with copper foil and pressed to obtain a circuit board.

[0178] Example 17:

[0179] A resin composition comprising the following components:

[0180] PTFE resin: 100 parts by weight;

[0181] Polyethersulfone resin (containing 30% chemical bonds with a bond angle of 110°, Mn=7000): 30 parts by weight;

[0182] Inorganic filler: 240 parts by weight;

[0183] The inorganic filler is composed of 120 parts by weight of spherical silica with a particle size of 5 μm and 120 parts by weight of spherical alumina with a particle size of 5 μm.

[0184] The resin composition was prepared using the same method as in Example 1. The melt viscosity of the resin composition was tested to be 1360 Pa·s.

[0185] The above resin composition was uniformly coated onto electronic-grade fiberglass cloth, dried, and then sintered at 382℃ for 5 min to prepare a prepreg with a median cream layer thickness of 72.5 μm, a cream layer thickness range of 6.9 μm, and a thickness range between the two cream layers of 3.8 μm. Five prepregs were stacked on top of each other with copper foil and pressed to obtain a circuit board.

[0186] Comparative Example 1:

[0187] A resin composition comprising the following components:

[0188] PTFE resin: 140 parts by weight;

[0189] Inorganic filler: 190 parts by weight;

[0190] The inorganic filler is a mixture of 95 parts by weight of spherical silica with a particle size of 5 μm and 95 parts by weight of spherical alumina with a particle size of 5 μm.

[0191] The resin composition was prepared using the same method as in Example 1. The melt viscosity of the resin composition was tested to be 1650 Pa·s.

[0192] The above resin composition was uniformly coated onto electronic-grade fiberglass cloth, dried, and then sintered at 382℃ for 5 min to prepare a prepreg with a median cream layer thickness of 70.6 μm, a cream layer thickness range of 6.3 μm, and a thickness range between the two cream layers of 3.2 μm. Five prepregs were stacked on top of each other with copper foil and pressed to obtain a circuit board.

[0193] Comparative Example 2:

[0194] A resin composition comprising the following components:

[0195] PTFE resin: 100 parts by weight;

[0196] Polyethylene resin (with a maximum chemical bond angle of 109° and Mn=6500): 30 parts by weight;

[0197] Inorganic filler: 190 parts by weight;

[0198] The inorganic filler is a mixture of 95 parts by weight of spherical silica with a particle size of 5 μm and 95 parts by weight of spherical alumina with a particle size of 5 μm.

[0199] The resin composition was prepared using the same method as in Example 1. The melt viscosity of the resin composition was tested to be 1600 Pa·s.

[0200] The above resin composition was uniformly coated onto electronic-grade fiberglass cloth, dried, and then sintered at 382℃ for 5 min to prepare a prepreg with a median cream layer thickness of 69.8 μm, a cream layer thickness range of 6.2 μm, and a thickness range between the two cream layers of 3.1 μm. Five prepregs were stacked on top of each other with copper foil and pressed to obtain a circuit board.

[0201] Comparative Example 3:

[0202] A resin composition comprising the following components:

[0203] PTFE resin: 100 parts by weight;

[0204] Polycarbonate resin (containing 60% chemical bonds with a bond angle of 120°, Mn=7300): 30 parts by weight;

[0205] Inorganic filler: 190 parts by weight;

[0206] The inorganic filler is a mixture of 95 parts by weight of spherical silica with a particle size of 5 μm and 95 parts by weight of spherical alumina with a particle size of 5 μm.

[0207] The resin composition was prepared using the same method as in Example 1. The melt viscosity of the resin composition was tested to be 1590 Pa·s.

[0208] The above resin composition was uniformly coated onto electronic-grade fiberglass cloth, dried, and then sintered at 382°C for 5 minutes to prepare a prepreg with a median cream layer thickness of 71.3 μm, a cream layer thickness range of 6.4 μm, and a thickness range between the two cream layers of 3.5 μm. Five prepregs were stacked on top of each other with copper foil and pressed to obtain a circuit board.

[0209] The circuit boards prepared in Examples 1-17 and Comparative Examples 1-3 were subjected to performance tests, and the test methods are as follows:

[0210] Thickness range: Take 9 random points on the board and measure the thickness with a micrometer. After the test is completed, take the performance range of the 9 points as the thickness range.

[0211] Dielectric difference: Take 9 random points on the board and measure the dielectric properties according to the IPC-TM-650 2.5.5.5 method. After the test is completed, take the performance range of the 9 points as the dielectric difference.

[0212] Thermal conductivity range: Take 9 random points on the plate and measure the thermal conductivity according to the ASTM-D5470 method. After the test, take the performance range of the 9 points as the thermal conductivity range.

[0213] Heat resistance: The average value of the temperature at which the weight loss is 5% was obtained by testing the sheet material according to IPC-TM650.2.4.24.6.

[0214] The performance test results of the circuit board are shown in Tables 1 and 2 below:

[0215] Table 1: Performance test results of the circuit boards prepared in Examples 1-17 and Comparative Examples 1-3

[0216] Group Thickness range (μm) Dielectric difference (@10GHz) Extremely poor thermal conductivity (W / (m·K)) Example 1 10 0.04 0.05 Example 2 10 0.05 0.06 Example 3 11 0.06 0.07 Example 4 16 0.11 0.09 Example 5 11 0.09 0.10 Example 6 19 0.13 0.11 Example 7 13 0.08 0.09 Example 8 14 0.09 0.10 Example 9 14 0.10 0.11 Example 10 12 0.09 0.09 Example 11 12 0.07 0.09 Example 12 15 0.11 0.12 Example 13 11 0.08 0.09 Example 14 15 0.12 0.12 Example 15 9 0.10 0.11 Example 16 10 0.03 0.05 Example 17 12 0.11 0.12 Comparative Example 1 25 0.15 0.14 Comparative Example 2 24 0.16 0.16 Comparative Example 3 15 0.18 0.18

[0217] As can be seen from the test results obtained in Table 1 above, the thickness difference of the circuit substrates prepared in each embodiment of this application is all less than 20 μm, the dielectric difference is all less than 0.13, and the thermal conductivity difference is all less than 0.12 W / (m·K). The thickness difference, dielectric difference and thermal conductivity difference of the circuit substrates have all decreased.

[0218] As can be seen from Example 1 and Comparative Examples 1-3, adding thermoplastic resin and inorganic filler to PTEF resin, and limiting the main chain of thermoplastic resin to contain 15%-40% specific chemical bonds with bond angles ≥110°, can reduce the melt viscosity of the resin composition and reduce the thickness difference, dielectric difference and thermal conductivity difference of the circuit board.

[0219] The test results of Examples 1 and 4-17 show that although the proportions of the components in the resin composition, the type and number-average molecular weight of the thermoplastic resin, the selection of inorganic fillers, the melt viscosity of the resin composition, and the median thickness, thickness range, and range of the median thickness of the prepreg layers are not within the preferred range, although this causes at least one performance indicator of the circuit board's thickness range, dielectric difference, and thermal conductivity difference to deteriorate, the overall performance is still better than the resin composition containing only PTFE resin and inorganic fillers currently used in Comparative Example 1. The circuit boards prepared in Examples 1-3 that meet the preferred range of the present invention, compared with Comparative Example 1, show a reduction of more than 50% in thickness range, more than 75% in dielectric difference, and more than 60% in thermal conductivity difference, significantly reducing the thickness range, dielectric difference, and thermal conductivity difference of the circuit board.

[0220] Based on the above, in order to further balance the heat resistance of the circuit board, the present invention also tested the heat resistance of the circuit boards prepared in Examples 1 and 14-17. The specific test results are shown in Table 2 below.

[0221] Table 2: Test results of the heat resistance of the circuit boards prepared in Examples 1 and 14-17

[0222] Group Heat resistance (°C) Example 1 530 Example 14 524 Example 15 513 Example 16 509 Example 17 545

[0223] The test results obtained from Table 2 above, combined with the test results in Table 1, show that compared with Example 1, the amount of thermoplastic resin used in Example 14 was too low. This not only increased the thickness difference, dielectric difference, and heat resistance difference of the circuit board, but also reduced the heat resistance of the circuit board. This is mainly because the amount of thermoplastic resin used was too low, which could not improve the flowability of the resin composition. In Example 15, the amount of thermoplastic resin used was too high. Although the thickness difference of the circuit board was small, the dielectric difference, heat resistance difference, and heat resistance of the circuit board were all deteriorated. In Example 16, the amount of inorganic filler used was too low. Although the thickness difference, dielectric difference, and heat resistance difference of the circuit board were small, the heat resistance of the circuit board was significantly reduced. In Example 17, the amount of inorganic filler used was too high. Although the heat resistance of the circuit board was significantly increased, it easily led to insufficient filling, increased the melt viscosity of the resin composition, and significantly increased the thickness difference, dielectric difference, and thermal conductivity difference of the circuit board. Therefore, to balance the thickness difference, dielectric difference, thermal conductivity difference, and heat resistance of the circuit board, the preferred weight percentages of the thermoplastic resin are 20-40 parts, and the inorganic filler is 170-220 parts, based on 100 parts by weight of the PTFE resin. Although embodiments of the present invention have been shown and described above, it is understood that these embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions, alterations, deletions of features, additions, or recombinations of features to the above embodiments within the scope of the present invention without departing from the principles and spirit of the invention. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the innovative principles of the present invention still fall within the scope of the present invention.

Claims

1. A resin composition, characterized by comprising: The resin composition comprises the following components: (A) a PTFE resin; (B) a thermoplastic resin comprising 15-40% of specific chemical bonds with a bond angle ≥ 110° in the main chain of the thermoplastic resin; (C) an inorganic filler.

2. The resin composition according to claim 1, characterized by The weight part of the component (B) is 20-40 parts, and the weight part of the component (C) is 170-220 parts, based on 100 parts of the weight part of the component (A).

3. The resin composition according to claim 1, wherein The main chain and / or side group of the thermoplastic resin contains a specific functional group selected from one or both of an aromatic ring and a sulfone group.

4. The resin composition according to claim 3, wherein The thermoplastic resin is selected from one or more of a polyphenylene sulfone resin, a bisphenol A type polysulfone resin, a polyether sulfone resin, a polyaryl sulfone resin, and a methyl phenyl hydrogen-containing silicon resin.

5. The resin composition according to claim 1, wherein The number average molecular weight of the thermoplastic resin is 5000-8000 g / mol.

6. The resin composition according to claim 1, wherein The inorganic filler satisfies at least one of the following conditions: (1) the particle size of the inorganic filler is not greater than 10 μm; (2) the morphology of the inorganic filler is spherical; (3) the inorganic filler is one or more selected from silica, alumina, titanium dioxide, and silicon nitride.

7. The resin composition according to claim 1, wherein The melt viscosity of the resin composition is 800-1500 pa·s.

8. A prepreg, characterized by, The article comprises a layer of reinforcing material and butter layers respectively arranged on both sides of the layer of reinforcing material, the butter layers being formed by coating with the resin composition according to any one of claims 1-7.

9. The prepreg according to claim 8, wherein The butter layers satisfy at least one of the following conditions: (1) the thickness median of the butter layer is 65-75 μm; (2) the thickness range of the butter layer is ≤ 8 μm; (3) the difference between the thickness medians of the two butter layers is ≤ 4 μm.

10. An article made from the prepreg according to claim 9, characterized in that, The article comprises a circuit board, a printed circuit board.