A method and system for predicting the thickness of a thin layer based on a genetic method and a medium
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- FURUISHENG (CHENGDU) TECH CO LTD
- Filing Date
- 2025-10-22
- Publication Date
- 2026-06-26
AI Technical Summary
Existing technologies suffer from insufficient resolution, reliance on insufficient well data, and difficulty in accurately depicting the spatial distribution characteristics of thin strata in complex geological regions when identifying and predicting deep and thin strata. This leads to discrepancies between the interpretation results and the actual geological conditions, affecting exploration and development and drilling tracking decisions.
A thin-layer stratum thickness prediction method based on genetic analysis is adopted. By analyzing the main controlling factors of stratum distribution, delineating tectonic boundaries, restoring stratigraphic geological models and iterative data models, and combining well inclination calculations, a stratum thickness prediction model is established. This reduces the dependence on seismic data and well network density, and uses sedimentological principles for quantitative prediction.
It improves the accuracy and reliability of thin-layer formation thickness prediction, reduces the requirements for seismic data quality, has a wider range of applications, can guide well location tracking and well location deployment, reduces calibration and rock physics analysis steps, and improves the simplicity and timeliness of operation.
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