Heat dissipation shell structure of computer equipment

Abstract

The invention discloses a heat dissipation shell structure of computer equipment, and relates to the technical field of computer heat dissipation, the heat dissipation shell structure comprises a case, a composite heat dissipation mechanism is arranged in the case, and an access structure is arranged in the composite heat dissipation mechanism; the composite heat dissipation mechanism comprises a front filter screen and a rear filter screen, the front filter screen and the rear filter screen are located on the front side and the rear side of the machine box respectively and fixedly connected, an air channel is formed between the front filter screen and the rear filter screen, and air opening fins are fixedly connected to the inner walls of the front side and the rear side of the air channel. A cooling fan is installed on the side, close to the front filter screen or the rear filter screen, of each air port fin, a radiator is fixedly connected to the middle of the inner wall of the air duct, a copper sheet is slidably connected to the side face of the radiator, and a conduction plate is fixedly connected to the side, away from the radiator, of the copper sheet. The overall heat dissipation efficiency is enhanced, the internal temperature of the case is effectively controlled, the system working stability is improved, and the assembly service life is prolonged.

Description

Technical Field

[0001] This invention relates to the field of computer heat dissipation technology, specifically to a heat dissipation housing structure for computer equipment. Background Technology

[0002] As computer performance improves, the heat generated by internal components such as processors increases daily. Traditional single air-cooling methods can no longer meet the demand for efficient heat dissipation. Especially under high-load operation, overheating can easily lead to system black screen, crashes, or even data loss. Existing heat dissipation structures have problems such as limited heat dissipation efficiency, inability to intelligently allocate airflow, dust accumulation affecting heat dissipation, and poor environmental adaptability. Therefore, there is an urgent need for a heat dissipation shell structure that can integrate efficient composite heat dissipation, intelligent airflow adjustment, self-cleaning, and modular multi-functionality to improve system reliability.

[0003] Patent CN220872960U discloses a heat dissipation casing structure for a computer device, including a chassis. A first exhaust vent and a second exhaust vent are located on the right side of the chassis. A first exhaust fan and a second exhaust fan are installed on the inner walls of the first and second exhaust vents. A CPU heatsink is mounted on the surface of the motherboard, with threaded holes at its four corners. A cooling fan is mounted on top of the motherboard, and aluminum alloy fins are fixedly connected to the cooling fan via an outer frame. The aluminum alloy fins are mounted on the top of copper pipes, and a heat-absorbing copper block is fixedly connected to the bottom of the copper pipes. This patent achieves closer thermal contact by attaching the CPU heatsink to the heat-absorbing copper block and applying thermal grease at the contact point. This means that heat can be transferred more effectively from the CPU heatsink to the heat-absorbing copper block, and then the heat-absorbing copper block transfers the heat to the aluminum alloy fins through the copper pipes. The cooling fan then removes the heat. However, this patent also suffers from the problem that the single heat dissipation method leads to decreased heat dissipation performance over prolonged use. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a heat dissipation housing structure for computer devices, solving the problems mentioned in the background section.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a heat dissipation housing structure for a computer device, comprising a chassis, wherein a composite heat dissipation mechanism is provided inside the chassis, and a passage structure is provided inside the composite heat dissipation mechanism; The composite heat dissipation mechanism includes a front filter screen and a rear filter screen. The front filter screen and the rear filter screen are respectively fixedly connected to the front and rear sides of the chassis. A air duct is provided between the front filter screen and the rear filter screen. Inner walls of both the front and rear sides of the air duct are fixedly connected with air vent fins. A heat dissipation fan is installed on one side of each air vent fin close to the front filter screen or the rear filter screen. A radiator is fixedly connected to the middle of the inner wall of the air duct. A copper sheet is slidably connected to the side of the radiator. A conduction plate is fixedly connected to the side of the copper sheet away from the radiator. A hot pressing plate is fixedly connected to the side of the conduction plate. Two screw rods are rotatably connected to the side of the conduction plate away from the hot pressing plate. A wind groove is formed in the front half of the radiator, and a fan blade shaft bracket is fixedly connected in the wind groove. A peristaltic handle is rotatably connected to the side of the fan blade shaft bracket. A peristaltic wheel is rotatably connected to the side of the peristaltic handle.

[0006] According to the above technical solution, a support edge strip is fixedly connected to the bottom surface of the chassis, a front cover plate is fixedly connected to the front side surface of the chassis, an air flow guiding mechanism is arranged on the side surface of the composite heat dissipation mechanism, and an external heat dissipation mechanism is arranged on the bottom surface of the chassis.

[0007] According to the above technical solution, the air duct is fixedly connected to the inner wall of the chassis. The screw rod penetrates through the outer wall of the air duct from the inner wall of the air duct, and the screw rod is threadedly connected to the air duct.

[0008] According to the above technical solution, the passage structure includes a hose. Two ends of the hose are respectively fixedly connected with a multi-row copper pipe and a return bend pipe. The multi-row copper pipe is formed by connecting a plurality of "Ji"-shaped copper pipes end to end. A contact pipe is arranged at a position where the multi-row copper pipe is in sliding contact with the hot pressing plate. An inflow pipe is fixedly connected to one end of the return bend pipe away from the hose. An outflow pipe is fixedly connected to one end of the multi-row copper pipe away from the hose.

[0009] According to the above technical solution, the contact pipe is part of the split copper pipe structure. The bend pipe is fixedly connected to the rear air vent fins, the bend of the inflow pipe is fixedly connected to the front air vent fins, and the split copper pipes are fixedly connected to the heat sink. When the internal components of the chassis start working, the air vent fins on both sides of the air duct start working through the cooling fan. During this process, the cooling fan located at the rear of the chassis draws air into the air duct. The airflow passes through the heat sink and carries away the heat generated by the internal components during operation. The heat from the components is transferred to the heat conduction plate through the contact heat plate. The heat conduction plate conducts heat through the contact copper sheet with the fins inside the heat sink. The airflow in the air duct carries away the heat and discharges it through the front air vent fins and the front filter. At the same time, the airflow drives the internal blades of the heat sink to rotate, causing the blades to connect in a worm gear pattern. The rotating handle causes the peristaltic wheel to squeeze the liquid inside the hose, causing it to flow slowly. The liquid then flows out of the hose and towards the distributed copper tubes. As it passes through the contact tubes of the distributed copper tubes, it absorbs the heat conducted from the hot platen. The liquid then flows back into the hose through the distributed copper tubes. The liquid in the hose flows into the inlet tube through the connected hoses. Heat is conducted through the liquid flow and comes into contact with the metal to dissipate heat. The airflow inside the chassis is guided to enter the air duct from the side and then discharged by the front cooling fan for combined heat dissipation, improving the cooling effect. In addition, rotating the screw causes the screw to be threaded into the air duct, which pushes the conductive plate and the distributed copper tubes to slide. The conductive plate also causes the hot plate to move closer to the processor's outer frame in the component, simplifying the fixing steps of the traditional heat dissipation mechanism.

[0010] According to the above technical solution, the airflow guiding mechanism includes two cylindrical sections, which are fixedly connected to the upper and lower sides of the air duct respectively. A copper strip is fixedly connected to the end of each cylindrical section away from the air duct. A reciprocating plate is slidably connected inside the cylindrical section. A curved rod is fixedly connected to the side of the reciprocating plate away from the copper strip. A linkage cable is fixedly connected to the end of the curved rod away from the reciprocating plate. A horizontal bar is fixedly connected to the end of the linkage cable away from the curved rod. A vertical rod is fixedly connected between the upper and lower horizontal bars. Two edge strips are fixedly connected to the side of the air duct. Multiple air grid plates are hinged between the two edge strips. Multiple push strips are fixedly connected to the side of the vertical rod. An elastic concave strip extends outward from the edge of each push strip. A circular filter screen is fixedly connected to the side of the fan blade shaft frame. A fan blade is fixedly connected to the axial end of the peristaltic handle. A storage groove is fixedly connected to the bottom edge of the air duct.

[0011] According to the above technical solution, a thin rod is fixedly connected between the two vertical rods. The vertical rod is slidably connected to the edge strip. A side groove is opened on the side of the air duct, and the side groove is slidably connected to the thin rod. An alloy wire is installed inside the column, and the two ends of the alloy wire are fixedly connected to the copper strip and the reciprocating plate, respectively. The alloy wire is made of nickel-titanium alloy. The internal space of the chassis is divided into upper and lower parts through the air duct inside the chassis. When the components inside the chassis start to work, the air duct connected by the edge strip is in a closed state. After the components inside the chassis work for a period of time, the temperature around the processor in the upper part of the chassis rises. The temperature rise causes the copper strip, which is also located in the upper part, to absorb heat and transfer it to the column. The alloy wire in contact with the copper strip completely contracts after the temperature reaches 40 to 50 degrees Celsius. The upward pull of the alloy wire is caused by the contraction of the alloy wire. The reciprocating plate and the crank rod cause the linkage cable connected to the end of the crank rod to pull the horizontal bar upward. The horizontal bar moves upward, causing the vertical rod to slide upward. The thin rod connected to the vertical rod pushes the connection between the side groove of one end of the air grille and the edge strip of the air grille to flip. After the air grille flips, it faces the upper half of the chassis. When the temperature of the lower half of the chassis rises, the same column cylinder and copper strip at the bottom of the air duct, according to the same principle, cause the air grille to deflect downward, improving the airflow efficiency of the lower half of the chassis. The constant temperature air from the outside enters the interior through the ventilation slots on the upper and lower sides of the chassis. The ventilation openings on the upper and lower sides of the chassis filter the dust from the outside through the filter screen, while the dust inside the chassis is filtered through the round filter screen. The vertical rod moves up and down slowly, causing the pusher to move. The pusher sticks fit the round filter screen through the elastic concave strip to prevent the dust from being scraped off, and the scraped dust falls into the collection slot.

[0012] According to the above technical solution, the external heat dissipation mechanism includes two limiting edge strips, each of which is fixedly connected to the side of each supporting edge strip. A liquid-passing plate is slidably connected between the two limiting edge strips. The liquid-passing plate has multiple "S"-shaped retention grooves connected end to end inside. A flow-guiding groove is connected to the end of the retention groove. A return flow groove is connected to the end of the flow-guiding groove away from the retention groove. Multiple equidistant ventilation grooves are provided inside the return flow groove. A return flow groove is provided at the end of the return flow groove away from the flow-guiding groove. A partition block is provided at the connection between the return flow groove and the retention groove.

[0013] According to the above technical solution, the return channel is connected to the outflow pipe, the retention channel is connected to the inflow pipe, and the partition block is fixedly connected to the liquid flow plate. The heat source liquid flowing out of the inflow pipe enters the liquid flow plate and flows along the retention channel within the liquid flow plate. The liquid flows through the retention channel to the guide channel, then through the guide channel into the return channel, and then through the return channel back to the return channel. During use, before the outside air enters the bottom of the chassis, it needs to pass through the ventilation channel on the liquid flow plate to enter the chassis. The air passing through the ventilation channel can also carry away some of the heat, while the retention channel will transfer the heat source through the surface of the liquid flow plate. For upward transfer, in colder environments, the liquid-cooling plate can be pulled out along the limiting strip and placed at the bottom of the mouse to act as a heat source for hand heating. In hot environments, the liquid-cooling plate can also be pulled out as an external heat dissipation structure, keeping it away from the bottom of the chassis to promote heat dissipation of the liquid inside the plate by the ambient temperature. When performing calculations that generate a lot of heat, the liquid-cooling plate can be soaked or blown on to provide emergency treatment, reducing the probability of system black screens and crashes caused by low heat dissipation efficiency inside the chassis, and avoiding loss of calculation data during such processes.

[0014] This invention provides a heat dissipation housing structure for computer devices. It offers the following advantages: This invention, by setting up a composite heat dissipation mechanism and a passage structure, guides the airflow inside the chassis to enter the air duct from the side and be discharged by the front cooling fan for composite heat dissipation. It integrates two methods: active air cooling and passive liquid circulation cooling. The cooling fan forms an efficient air duct to directly dissipate heat, while the airflow-driven peristaltic mechanism promotes the flow of liquid in the hose, absorbing heat from the hot plate area at the contact tube, thus achieving gas-liquid composite heat dissipation. This enhances the overall heat dissipation efficiency, effectively controls the internal temperature of the chassis, and improves the system's operational stability and component lifespan. This invention, through the installation of an airflow guiding mechanism and temperature-sensing adaptive airflow adjustment, ensures that airflow resources are preferentially guided to the areas most in need of heat dissipation, thereby improving heat dissipation efficiency. At the same time, constant-temperature outside air enters through ventilation slots with filters on the upper and lower sides of the chassis, effectively filtering dust. Dust inside the chassis is filtered through a circular filter, and the vertical movement of the rod drives the push bar, which uses elastic concave strips to continuously scrape the surface of the circular filter, shoveling the accumulated dust into the collection slot, thus realizing the self-cleaning function of the filter. This prevents airflow blockage and heat dissipation performance degradation caused by dust accumulation. Overall, this structure realizes intelligent directional distribution of heat dissipation airflow and automated maintenance of the dust removal system, jointly ensuring long-term stable and efficient heat dissipation and clean operation inside the chassis. This invention, by incorporating an external heat dissipation mechanism, also possesses high environmental adaptability and versatility. In cold environments, the liquid-cooling plate can be pulled out along the limiting edge and placed at the bottom of the mouse to act as a hand heating source, improving user comfort. In hot environments, the liquid-cooling plate can also be pulled out as an external heat dissipation structure, moving it away from the bottom of the chassis to increase the contact area with the ambient air and promote liquid heat dissipation. During computational tasks that generate a lot of heat, emergency forced cooling can also be performed by immersing or blowing air onto the liquid-cooling plate, thereby effectively reducing the risk of overheating due to insufficient internal heat dissipation efficiency of the chassis, which could lead to system black screens, crashes, and loss of computational data, thus improving system reliability and data security. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the front of the overall chassis of the present invention; Figure 2 This is a rear three-dimensional structural diagram of the overall chassis of the present invention; Figure 3 This is a schematic diagram showing the overall structural distribution of the present invention. Figure 4 This is a schematic diagram of the overall composite heat dissipation mechanism of the present invention; Figure 5 This is a schematic diagram of the overall pathway structure of the present invention; Figure 6 This invention as a whole Figure 5 A magnified structural diagram of A in the middle; Figure 7 This is a schematic diagram of the overall wind grating connection structure of the present invention; Figure 8 This is a schematic diagram of the overall peristaltic handle connection structure of the present invention; Figure 9 This is a schematic diagram of the overall external heat dissipation mechanism of the present invention; Figure 10 This is a schematic diagram of the internal structure of the overall liquid-passing plate of the present invention.

[0016] In the diagram: 1. Chassis; 2. Support strip; 3. Front cover; 4. Composite heat dissipation mechanism; 41. Front filter; 42. Rear filter; 43. Cooling fan; 44. Vent fins; 45. Air duct; 46. Heat sink; 47. Screw; 48. Conductive plate; 49. Copper sheet; 410. Hot press plate; 411. Fan blade shaft bracket; 412. Peristaltic handle; 413. Peristaltic wheel; 5. Airflow guiding mechanism; 51. Column; 52. Copper strip; 53. Reciprocating plate; 54. Crank rod; 55. Linkage cable; 56. Crossbar; 57. Edge. 58. Vertical bar; 59. Wind grille; 510. Push bar; 511. Elastic concave bar; 512. Round filter screen; 513. Fan blade; 514. Storage slot; 6. External heat dissipation mechanism; 61. Limiting edge bar; 62. Liquid passage plate; 63. Ventilation slot; 64. Divider block; 65. Retention slot; 66. Drainage slot; 67. Recirculation slot; 68. Return slot; 7. Passage structure; 71. Inflow pipe; 72. Back bend pipe; 73. Flexible hose; 74. Dividing copper pipe; 75. Contact pipe; 76. Outflow pipe; 8. Alloy wire. Detailed Implementation

[0017] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0018] Please see Figure 1-10 An embodiment of the present invention is: a heat dissipation housing structure for a computer device, including a chassis 1, a composite heat dissipation mechanism 4 disposed inside the chassis 1, and a passage structure 7 disposed inside the composite heat dissipation mechanism 4. The composite heat dissipation mechanism 4 includes a front filter 41 and a rear filter 42, which are fixedly connected to the front and rear sides of the chassis 1, respectively. An air duct 45 is provided between the front filter 41 and the rear filter 42. Air vent fins 44 are fixedly connected to the inner walls of both the front and rear sides of the air duct 45. A cooling fan 43 is installed on the side of each air vent fin 44 near the front filter 41 or the rear filter 42. A heat sink 46 is fixedly connected to the middle of the inner wall of the air duct 45. The side of the heat sink 46... A copper sheet 49 is slidably connected. A conductive plate 48 is fixedly connected to the side of the copper sheet 49 away from the heat sink 46. A hot plate 410 is fixedly connected to the side of the conductive plate 48. Two screws 47 are rotatably connected to the side of the conductive plate 48 away from the hot plate 410. A wind duct is opened in the front half of the heat sink 46, and a fan blade shaft bracket 411 is fixedly connected in the wind duct. A peristaltic handle 412 is rotatably connected to the side of the fan blade shaft bracket 411, and a peristaltic wheel 413 is rotatably connected to the side of the peristaltic handle 412.

[0019] The bottom surface of the chassis 1 is fixedly connected with a supporting edge strip 2, the front side surface of the chassis 1 is fixedly connected with a front cover plate 3, an air flow guiding mechanism 5 is arranged on the side surface of the composite heat dissipation mechanism 4, and an external heat dissipation mechanism 6 is arranged on the bottom surface of the chassis 1.

[0020] The air duct 45 is fixedly connected with the inner wall of the chassis 1, the screw rod 47 penetrates through the outer wall of the air duct 45 from the inner wall of the air duct 45, and the screw rod 47 is threadedly connected with the air duct 45.

[0021] The passage structure 7 includes a hose 73. Both ends of the hose 73 are respectively fixedly connected with a row - divided copper pipe 74 and a return pipe 72. The row - divided copper pipe 74 is formed by connecting a plurality of "J" - shaped copper pipes end to end. A contact pipe 75 is arranged at the position where the row - divided copper pipe 74 is in sliding contact with the hot pressing plate 410. One end of the return pipe 72 far from the hose 73 is fixedly connected with an inflow pipe 71, and one end of the row - divided copper pipe 74 far from the hose 73 is fixedly connected with an outflow pipe 76.

[0022] The contact pipe 75 is part of the structure of the branch copper pipe 74. The return bend pipe 72 is fixedly connected to the rear air vent fin 44, and the bend of the inflow pipe 71 is fixedly connected to the front air vent fin 44. The branch copper pipe 74 is fixedly connected to the heat sink 46. When the internal components of the chassis 1 start working, the air vent fins 44 on both sides of the air duct 45 start working through the cooling fan 43. During this process, the cooling fan 43 located at the rear of the chassis 1 draws air into the air duct 45. The airflow passes through the heat sink 46 and carries away the heat generated by the components inside the chassis 1 during operation. The heat from the components is transferred to the heat exchanger through the contact heat plate 410. The guide plate 48 conducts heat, and the conduction plate 48 contacts the fins inside the radiator 46 through the copper sheet 49 to conduct heat. Meanwhile, the airflow in the air duct 45 carries away the heat and discharges it through the front air vent fins 44 and the front filter 41. At the same time, the airflow drives the blades inside the radiator 46 to rotate, causing the peristaltic handle 412 connected to the blades to rotate. The rotation of the peristaltic handle 412 drives the connected peristaltic wheel 413 to squeeze the liquid in the hose 73, causing the liquid in the hose 73 to flow slowly. The liquid in the outlet pipe 76 flows to the branch copper pipe 74 under the peristaltic action of the hose 73. When it flows through the contact pipe 75 of the branch copper pipe 74, it is contacted... The liquid inside pipe 75 absorbs the heat conducted from the hot press plate 410, and then flows into the flexible tube 73 through the branch copper pipe 74. The liquid in the flexible tube 73 flows into the inflow pipe 71 through the connected flexible tube 73. Heat is conducted through the liquid flow and contact with the metal to dissipate heat in conjunction with the airflow. The air inside the chassis 1 is guided to enter the air duct 45 from the side and is discharged by the front cooling fan 43 for combined heat dissipation, which improves the heat dissipation effect. In addition, by rotating the screw 47, the screw 47 is threadedly connected to the air duct 45, which pushes the conduction plate 48 and the branch copper pipe 74 to slide, and the conduction plate 48 moves the hot press plate 410 closer to the component for processing. The outer frame fits snugly, simplifying the traditional steps of fixing the heat dissipation mechanism. By guiding the airflow inside the chassis 1 into the air duct 45 from the side and then being discharged by the front cooling fan 43, a composite heat dissipation is achieved. This combines active air cooling and passive liquid circulation cooling. The cooling fan 43 forms an efficient air duct 45 to directly dissipate heat, while the airflow-driven peristaltic mechanism causes the liquid in the hose 73 to flow, absorbing the heat in the area of ​​the hot plate 410 at the contact tube 75. This achieves gas-liquid composite heat dissipation, enhances the overall heat dissipation efficiency, effectively controls the internal temperature of the chassis 1, and improves the system's operational stability and component lifespan.

[0023] The airflow guiding mechanism 5 includes two cylindrical sections 51, which are fixedly connected to the upper and lower sides of the air duct 45, respectively. A copper strip 52 is fixedly connected to the end of each cylindrical section 51 furthest from the air duct 45. A reciprocating plate 53 is slidably connected inside the cylindrical section 51. A curved rod 54 is fixedly connected to the side of the reciprocating plate 53 furthest from the copper strip 52. A linkage cable 55 is fixedly connected to the end of the curved rod 54 furthest from the reciprocating plate 53. A horizontal bar 56 is fixedly connected to the end of the linkage cable 55 furthest from the curved rod 54. The two horizontal bars 56 are located at the top and bottom. A vertical rod 58 is fixedly connected between the two parts. Two edge strips 57 are fixedly connected to the side of the air duct 45. Multiple air grid plates 59 are hinged between the two edge strips 57. Multiple push strips 510 are fixedly connected to the side of the vertical rod 58. An elastic concave strip 511 extends outward from the edge of each push strip 510. A round filter screen 512 is fixedly connected to the side of the fan blade shaft bracket 411. A fan blade 513 is fixedly connected to the end of the shaft of the peristaltic handle 412. A storage groove 514 is fixedly connected to the bottom edge of the air duct 45.

[0024] A thin rod is fixedly connected between two vertical rods 58. The vertical rods 58 are slidably connected to the edge strip 57. The side of the air vent plate 59 has a side groove, which is slidably connected to the thin rod. An alloy wire 8 is installed inside the column cylinder 51, and the two ends of the alloy wire 8 are fixedly connected to the copper strip 52 and the reciprocating plate 53, respectively. The alloy wire 8 is made of nickel-titanium alloy. The air duct 45 inside the chassis 1 divides the internal space of the chassis 1 into upper and lower parts. When the components inside the chassis 1 start working, the air vent plate 59 connected by the edge strip 57 is in a closed state. After the components inside the chassis 1 have been working for a period of time, the temperature around the processor located in the upper part of the chassis 1 rises. The temperature rise causes the air vent plate 59 to be closed. Similarly, the copper strip 52, located in the upper part, absorbs heat and transfers it into the column cylinder 51. The alloy wire 8, which is in contact with the copper strip 52, fully contracts when the temperature reaches 40 to 50 degrees Celsius. The contraction of the alloy wire 8 pulls the reciprocating plate 53 and the crank rod 54 upward, causing the linkage cable 55 connected to the end of the crank rod 54 to pull the horizontal bar 56 upward. The upward movement of the horizontal bar 56 causes the vertical rod 58 to slide upward. The thin rod connected to the vertical rod 58 pushes the connection between the side groove of one end of the air grating plate 59 and the force-bearing edge strip 57 and the air grating plate 59 to flip, so that the air grating plate 59 flips and faces the upper part of the casing 1. When the temperature of the lower part of the casing 1 rises, the same column cylinder 51, copper strip 52, etc. at the bottom of the air duct 45 are connected to the air duct. Following the same principle, the air grille 59 is deflected downwards to improve airflow efficiency in the lower half of the chassis 1. Outside constant-temperature air enters the chassis 1 through ventilation slots on the upper and lower sides. External dust is filtered through filters at the ventilation openings on the upper and lower sides of the chassis 1, while dust inside the chassis 1 is filtered through a circular filter 512. The vertical rod 58 moves slowly up and down, driving the pusher 510 to move. The pusher 510, through the elastic concave strip 511, adheres to the circular filter 512 to prevent dust from being scraped off, and allows the scraped dust to fall into the collection slot 514. The temperature-sensing adaptive air duct 45 ensures that airflow resources are preferentially guided to the areas most in need of heat dissipation. This design improves heat dissipation efficiency. Meanwhile, ambient air at a constant temperature enters through ventilation slots with filters on the top and bottom sides of the chassis 1, effectively filtering dust. Dust inside the chassis 1 is filtered through a circular filter 512. The vertical rod 58 moves up and down, driving the pusher 510. The elastic concave strip 511 continuously scrapes the surface of the circular filter 512, shoveling the accumulated dust into the collection slot 514. This achieves the self-cleaning function of the filter, preventing airflow blockage and reduced heat dissipation performance caused by dust accumulation. Overall, this structure realizes intelligent directional distribution of heat dissipation airflow and automated maintenance of the dust removal system, jointly ensuring long-term stable and efficient heat dissipation and clean operation inside the chassis 1.

[0025] The external heat dissipation mechanism 6 includes two limiting side strips 61, each of which is fixedly connected to the side of each supporting side strip 2. A liquid-passing plate 62 is slidably connected between the two limiting side strips 61. The liquid-passing plate 62 has multiple "S"-shaped retention grooves 65 connected end to end inside. A flow-guiding groove 66 is connected to the end of the retention groove 65. A return flow groove 67 is connected to the end of the flow-guiding groove 66 away from the retention groove 65. Multiple equidistant ventilation grooves 63 are provided inside the return flow groove 67. A return flow groove 68 is provided at the end of the return flow groove 67 away from the flow-guiding groove 66. A partition block 64 is provided at the connection between the return flow groove 68 and the retention groove 65.

[0026] The return channel 68 is connected to the outflow pipe 76, the retention channel 65 is connected to the inflow pipe 71, and the separator block 64 is fixedly connected to the liquid flow plate 62. The heat source liquid flowing out of the inflow pipe 71 enters the liquid flow plate 62 and flows along the retention channel 65 in the liquid flow plate 62. The liquid flows through the retention channel 65 to the guide channel 66, then through the guide channel 66 into the return channel 67, and then through the return channel 67 back to the return channel 68. During use, before the outside air enters the bottom of the casing 1, it must pass through the liquid flow plate 62. Air enters the chassis 1 through the air vent 63, and the air passing through the vent 63 can also carry away some of the heat. The retention vent 65 will transfer the heat source upward through the surface of the liquid flow plate 62. In a relatively cold environment, the liquid flow plate 62 can be pulled out along the limiting strip 61 and placed at the bottom of the mouse to act as a hand heating source. In a hot environment, the liquid flow plate 62 can also be pulled out as an external heat dissipation structure, keeping the liquid flow plate 62 away from the bottom of the chassis 1 to promote the temperature of the room environment on the liquid flow plate 62. For heat dissipation of the internal liquid, during computationally demanding tasks, the liquid-cooling plate 62 can be soaked or blown by air to provide emergency cooling, reducing the probability of system black screens and crashes caused by low heat dissipation efficiency inside the chassis 1. This also prevents the loss of computational data during such processes. This structure also has high environmental adaptability and versatility. In cold environments, the liquid-cooling plate 62 can be pulled out along the limiting strip 61 and placed at the bottom of the mouse to act as a hand heating source, improving user comfort. In hot environments, the liquid-cooling plate 62 can also be pulled out as an external heat dissipation structure, placed away from the bottom of the chassis 1, to increase the contact area with the ambient air and promote liquid heat dissipation. During computationally demanding tasks, the liquid-cooling plate 62 can also be soaked or blown by air for emergency forced cooling, effectively reducing the risk of system black screens, crashes, and data loss caused by insufficient heat dissipation efficiency inside the chassis 1, thus improving system reliability and data security.

[0027] Working principle: When the internal components of chassis 1 start working, the air vent fins 44 on both sides of the air duct 45 start working through the cooling fan 43. During this process, the cooling fan 43 located at the rear of chassis 1 draws air into the air duct 45. The airflow passes through the heatsink 46 and carries away the heat generated by the components inside chassis 1 during operation. The heat from the components is transferred to the heat conduction plate 48 through the contact heat plate 410. The heat conduction plate 48 conducts heat through the contact copper sheet 49 with the fins inside the heatsink 46. The airflow in the air duct 45 carries away the heat through the front air vent fins. The plate 44 expels heat from the front filter 41. Simultaneously, the airflow drives the internal blades of the radiator 46 to rotate, causing the peristaltic handle 412 connected to the blades to rotate. The rotation of the peristaltic handle 412 drives the connected peristaltic wheel 413 to squeeze the liquid in the hose 73, causing the liquid in the hose 73 to flow slowly. The liquid in the outlet pipe 76 flows to the branch copper pipe 74 under the peristaltic action of the hose 73. When flowing through the contact pipe 75 of the branch copper pipe 74, the liquid in the contact pipe 75 absorbs the heat conducted at the hot plate 410, and then flows into the hose 73 through the branch copper pipe 74. Liquid flows through the connected hose 73 into the inlet pipe 71. The liquid conducts heat through the flow and contacts the metal to dissipate heat in conjunction with the airflow. By guiding the airflow inside the chassis 1 from the side into the air duct 45 and being discharged by the front cooling fan 43, a combined heat dissipation is achieved, improving the heat dissipation effect. In addition, by rotating the screw 47, the screw 47 is threadedly connected to the air duct 45, which pushes the conduction plate 48 and the distributed copper pipe 74 to slide. The conduction plate 48 also drives the heat pressure plate 410 to come close to the processor's outer frame in the component, simplifying the fixing steps of the traditional heat dissipation mechanism. By guiding the airflow inside the chassis 1 from the side into the air duct 45 and being discharged by the front cooling fan 43, a combined heat dissipation is achieved. This combines active air cooling and passive liquid circulation cooling. The cooling fan 43 forms an efficient air duct 45 to directly dissipate heat. At the same time, the peristaltic mechanism driven by the airflow causes the liquid in the hose 73 to flow, absorbing the heat in the area of ​​the heat pressure plate 410 at the contact pipe 75, realizing gas-liquid combined heat dissipation, enhancing the overall heat dissipation efficiency, effectively controlling the internal temperature of the chassis 1, and improving the system's working stability and component lifespan. The internal space of chassis 1 is divided into upper and lower parts by the built-in air duct 45. When the components inside chassis 1 start working, the air grille 59 connected by the edge strip 57 is in a closed state. After the components inside chassis 1 have been working for a period of time, the temperature around the processor located in the upper part of chassis 1 rises. The increased temperature causes the copper strip 52, which is also located in the upper part, to absorb heat and transfer it into the cylinder 51. The alloy wire 8 in contact with the copper strip 52 fully contracts after the temperature reaches forty to fifty degrees Celsius. The contraction of the alloy wire 8 pulls the reciprocating plate 53 and the crank 54 upward. The linkage cable 55 connected to the end of the crank rod 54 pulls the horizontal bar 56 upward. The upward movement of the horizontal bar 56 causes the vertical rod 58 to slide upward. The thin rod connected to the vertical rod 58 pushes the connection between the side groove of one end of the air grille 59 and the force-bearing edge strip 57 and the air grille 59 to flip. After the air grille 59 is flipped, it faces the upper half of the chassis 1. When the temperature of the lower half of the chassis 1 rises, the same column cylinder 51 and copper strip 52 at the bottom of the air duct 45, according to the same principle, cause the air grille 59 to deflect downward, improving the airflow efficiency of the lower half of the chassis 1. Meanwhile, the constant temperature air from outside passes through the upper and lower sides of the chassis 1. Dust enters the chassis 1 through ventilation slots. External dust is filtered by filters at the top and bottom vents on both sides of the chassis 1, while internal dust is filtered by round filters 512. The vertical rod 58 moves slowly up and down, driving the pusher 510 to conform to the round filters 512 via elastic grooves 511, preventing dust from being scraped off and allowing the scraped dust to fall into the collection slot 514. Temperature-sensing adaptive airflow 45 ensures that airflow is prioritized for areas requiring the most heat dissipation, improving cooling efficiency. Simultaneously, constant-temperature external air is drawn through the top and bottom vents on both sides of the chassis 1. The ventilation slot with a filter screen enters and effectively filters the dust, while the dust inside the chassis 1 is filtered through the round filter screen 512. The vertical rod 58 moves up and down to drive the push bar 510, and the elastic concave strip 511 continuously scrapes the surface of the round filter screen 512, shoveling the accumulated dust into the collection groove 514. This realizes the self-cleaning function of the filter screen and prevents airflow blockage and heat dissipation performance degradation caused by dust accumulation. Overall, this structure realizes intelligent directional distribution of heat dissipation airflow and automated maintenance of the dust removal system, which together ensures long-term stable and efficient heat dissipation and clean operation inside the chassis 1. The heat source liquid flowing out of the inlet pipe 71 enters the liquid flow plate 62 and flows along the retention groove 65 within the liquid flow plate 62. The liquid flows through the retention groove 65 to the guide groove 66, then through the guide groove 66 into the return flow groove 67, and then through the return flow groove 67 back to the return flow groove 68. During use, before the outside air enters the bottom of the chassis 1, it needs to pass through the ventilation groove 63 on the liquid flow plate 62 to enter the interior of the chassis 1. The air passing through the ventilation groove 63 can also carry away some of the heat, while the retention groove 65 will transfer the heat source upward through the surface of the liquid flow plate 62. In a relatively cold operating environment, the liquid flow plate 62 can be pulled out along the limiting edge strip 61 and placed at the bottom of the mouse to act as a hand heating heat source. In a hot environment, the liquid flow plate 62 can also be pulled out as an external heat dissipation structure, keeping the liquid flow plate 62 away from the bottom of the chassis 1 to promote the dissipation of the liquid inside the liquid flow plate 62 by the ambient temperature. When performing calculations that generate a lot of heat, the liquid flow plate 62 can be used to transfer heat upward through the liquid flow plate 62. Immersing the liquid-cooling plate 62 or blowing it with air can provide emergency cooling, reducing the probability of system black screens and crashes caused by low heat dissipation efficiency inside the chassis 1 leading to overheating and data loss. This structure also features high environmental adaptability and versatility. In cold environments, the liquid-cooling plate 62 can be pulled out along the limiting strip 61 and placed at the bottom of the mouse to act as a hand heating source, improving user comfort. In hot environments, the liquid-cooling plate 62 can also be pulled out as an external heat dissipation structure, away from the bottom of the chassis 1, to increase the contact area with the ambient air and promote liquid cooling. During computational tasks with high heat generation, emergency forced cooling can be performed by immersing or blowing the liquid-cooling plate 62, effectively reducing the risk of system black screens, crashes, and data loss caused by insufficient heat dissipation efficiency inside the chassis 1, thus improving system reliability and data security.

[0028] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A heat dissipation housing structure of a computer device, comprising a case (1), characterized in that: The inside of the case (1) is provided with a composite heat dissipation mechanism (4), and the inside of the composite heat dissipation mechanism (4) is provided with a channel structure (7); The composite heat dissipation mechanism (4) comprises a front filter screen (41) and a rear filter screen (42), the front filter screen (41) and the rear filter screen (42) are fixedly connected to the front and rear sides of the case (1) respectively, a air duct (45) is arranged between the front filter screen (41) and the rear filter screen (42), air outlet fins (44) are fixedly connected to the inner walls of the front and rear sides of the air duct (45), a heat dissipation fan (43) is arranged on the side of each air outlet fin (44) close to the front filter screen (41) or the rear filter screen (42), a radiator (46) is fixedly connected to the middle of the inner wall of the air duct (45), a copper sheet (49) is slidably connected to the side of the radiator (46), a conduction plate (48) is fixedly connected to the side of the copper sheet (49) away from the radiator (46), a thermal compression plate (410) is fixedly connected to the side of the conduction plate (48) away from the thermal compression plate (410), and two screw rods (47) are rotatably connected to the side of the conduction plate (48) away from the thermal compression plate (410); a wind groove is formed in the front half of the radiator (46), a fan shaft support (411) is fixedly connected in the wind groove, a peristaltic handle (412) is rotatably connected to the side of the fan shaft support (411), and a peristaltic wheel (413) is rotatably connected to the side of the peristaltic handle (412).

2. The heat dissipation shell structure of a computer device according to claim 1, characterized in that: The bottom surface of the case (1) is fixedly connected with a bracing strip (2), the front side of the case (1) is fixedly connected with a front cover plate (3), the side of the composite heat dissipation mechanism (4) is provided with an airflow guiding mechanism (5), and the bottom surface of the case (1) is provided with an external heat dissipation mechanism (6).

3. The heat dissipation shell structure of a computer device according to claim 2, characterized in that: The air duct (45) is fixedly connected with the inner wall of the case (1), and the screw rod (47) penetrates through the inner wall of the air duct (45) and is threadedly connected with the outer wall of the air duct (45).

4. The heat dissipation shell structure of a computer device according to claim 3, characterized in that: The channel structure (7) comprises a hose (73), and the two ends of the hose (73) are fixedly connected with a split copper pipe (74) and a return bend pipe (72) respectively; the split copper pipe (74) is formed by a plurality of "U"-shaped copper pipes connected end to end; a contact pipe (75) is arranged at the position where the split copper pipe (74) is in sliding contact with the thermal compression plate (410); the end of the return bend pipe (72) away from the hose (73) is fixedly connected with an inflow pipe (71); and the end of the split copper pipe (74) away from the hose (73) is fixedly connected with an outflow pipe (76).

5. The heat dissipation shell structure of a computer device according to claim 4, characterized in that: The contact pipe (75) is part of the split copper pipe (74) structure, the return bend pipe (72) is fixedly connected with the front air outlet fin (44), the inflow pipe (71) is fixedly connected with the front air outlet fin (44) at the bending position, and the split copper pipe (74) is fixedly connected with the radiator (46).

6. The heat dissipation shell structure of a computer device according to claim 5, characterized in that: The airflow guiding mechanism (5) comprises two cylinders (51), the two cylinders (51) are fixedly connected to the upper and lower sides of the air duct (45) respectively, one end of each cylinder (51) away from the air duct (45) is fixedly connected with a copper strip (52), the inside of the cylinder (51) is slidably connected with a reciprocating piece (53), one side of the reciprocating piece (53) away from the copper strip (52) is fixedly connected with a curved rod (54), one end of the curved rod (54) away from the reciprocating piece (53) is fixedly connected with a linkage cable (55), one end of the linkage cable (55) away from the curved rod (54) is fixedly connected with a horizontal strip (56), the horizontal strips (56) between the upper and lower sides are fixedly connected with a vertical rod (58), the side of the air duct (45) is fixedly connected with two mouth edge strips (57), a plurality of air grating plates (59) are hingedly connected between the two mouth edge strips (57), the side of the vertical rod (58) is fixedly connected with a plurality of push strips (510), the edge of each push strip (510) extends outwardly to an elastic concave strip (511), the side of the fan blade shaft frame (411) is fixedly connected with a circular filter screen (512), the shaft end of the peristaltic handle (412) is fixedly connected with a fan blade (513), and the bottom edge of the air duct (45) is fixedly connected with a receiving groove (514).

7. The heat dissipation shell structure of a computer device according to claim 6, characterized in that: Two vertical rods (58) are fixedly connected with a thin rod, the vertical rod (58) is slidably connected with the mouth edge strip (57), the side of the air grating plate (59) is provided with a side groove, and the side groove is slidably connected with the thin rod, the inside of the cylinder (51) is provided with an alloy wire (8), and the two ends of the alloy wire (8) are fixedly connected with the copper strip (52) and the reciprocating piece (53), and the alloy wire (8) is made of nickel-titanium alloy material.

8. The heat dissipation shell structure of a computer device according to claim 7, characterized in that: The external heat dissipation mechanism (6) comprises two limiting edge strips (61), each limiting edge strip (61) is fixedly connected to the side of each supporting edge strip (2), and the two limiting edge strips (61) are slidably connected with a liquid passing plate (62), a plurality of "S"-shaped retention grooves (65) connected in head-to-tail mode are formed in the inside of the liquid passing plate (62), a drainage groove (66) is connected and arranged at the end of the retention groove (65), a reflow groove (67) is communicatively arranged at one end of the drainage groove (66) away from the retention groove (65), a plurality of air passing grooves (63) distributed at equal intervals are arranged in the inside of the reflow groove (67), a backflow groove (68) is arranged at one end of the reflow groove (67) away from the drainage groove (66), and a partition block (64) is arranged at the connection position of the backflow groove (68) and the retention groove (65).

9. The heat dissipation shell structure of a computer device according to claim 8, characterized in that: The backflow groove (68) is in communication with the outflow pipe (76), the retention groove (65) is in communication with the inflow pipe (71), and the partition block (64) is fixedly connected with the liquid passing plate (62).

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