Control method and device of CMP equipment, equipment, medium and product

Abstract

The invention provides a CMP equipment control method and device, equipment, a medium and a product, control parameters of a finishing arm and a grinding disc in the CMP equipment are determined, and non-uniform swing of the finishing arm is controlled to be coupled with rotation and translational motion of the grinding disc based on the control parameters, so that the grinding disc can be controlled to rotate. Therefore, the finishing head forms a complex composite motion trail on the grinding disc, it is ensured that the finishing head can cover each area on the surface of the grinding disc, and finishing blind areas and excessive finishing areas existing when the finishing head is used for finishing a polishing pad borne on the grinding disc are effectively eliminated. A highly consistent surface condition is provided for a subsequent wafer polishing process, and the global planarization effect of wafer processing is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, and in particular to a control method, device, equipment, medium and product of a CMP device. BACKGROUND

[0002] In wafer manufacturing, a chemical mechanical polishing (CMP) process realizes global planarization of a wafer surface through the cooperation of a polishing pad and a polishing pad. However, the polishing pad will have its removal rate reduced due to wafer debris, abrasive residue and surface glazing phenomenon in the long-term use process, thereby affecting the uniformity and efficiency of wafer polishing.

[0003] In the prior art, in order to maintain the performance of the polishing pad, a dressing head provided with a diamond is regularly used to dress the surface of the polishing pad to restore its roughness and removal capacity. The dressing of the polishing pad is usually realized by using a dressing arm with a fixed angle or uniform swing, cooperating with the continuous rotation of the polishing pad, to regularly dress the surface of the polishing pad.

[0004] The path repeatability directly leads to uneven distribution of the removal rate of the polishing pad surface, affecting the consistency of wafer polishing. Therefore, how to ensure the uniformity of the dressing head of the CMP device for dressing the polishing pad to improve the polishing quality of the wafer is a technical problem to be solved in the field. SUMMARY

[0005] The present application provides a control method, device, equipment, medium and product of a CMP device to improve the uniformity of the dressing head of the CMP device for dressing the polishing pad, thereby improving the polishing quality of the wafer.

[0006] The first aspect of the present application provides a control method of a CMP device, comprising: determining control parameters of a dressing arm and a polishing pad in the CMP device; controlling the motion of the dressing arm and the polishing pad based on the control parameters, so that a dressing head provided on the dressing arm performs dressing processing on the polishing pad carried on the polishing pad; wherein the control of the motion of the dressing arm and the polishing pad based on the control parameters comprises: controlling the dressing arm to move in a non-uniform swing manner, controlling the rotation motion of the polishing pad and controlling the translation motion of the polishing pad based on the control parameters, the non-uniform swing of the dressing arm, the rotation motion and the translation motion of the polishing pad are coupled with each other, so that the dressing head performs dressing processing on the polishing pad carried on the polishing pad in a non-periodic motion trajectory on the polishing pad.

[0007] The second aspect of the present application provides a control device of a CMP device, comprising: a determination module configured to determine control parameters of a trim arm and a polishing disc in the CMP device; and a control module configured to control movements of the trim arm and the polishing disc based on the control parameters, so that a trim head arranged on the trim arm performs a trim process on a polishing pad carried on the polishing disc; wherein the control of the movements of the trim arm and the polishing disc based on the control parameters comprises: controlling the trim arm to move in a non-uniform swing manner, controlling the polishing disc to rotate, and controlling the polishing disc to move in a translation manner based on the control parameters, and the non-uniform swing of the trim arm, the rotation of the polishing disc, and the translation movement of the polishing disc are coupled with each other, so that the trim head performs the trim process on the polishing pad carried on the polishing disc in a non-periodic movement track on the polishing disc.

[0008] The third aspect of the present application provides an electronic device, comprising: a processor, and a memory connected to the processor in communication; the memory stores computer execution instructions; and the processor executes the computer execution instructions stored in the memory to implement the method according to the first aspect of the present application.

[0009] The fourth aspect of the present application provides a computer readable storage medium, wherein the computer readable storage medium stores computer execution instructions, and the computer execution instructions are executed by a processor to implement the method according to the first aspect of the present application.

[0010] The fifth aspect of the present application provides a computer program product, comprising a computer program, wherein the computer program is executed by a processor to implement the method according to the first aspect of the present application.

[0011] In summary, the CMP device control method, device, equipment, medium and product provided by the present application determine control parameters of a trim arm and a polishing disc in a CMP device, and control the non-uniform swing of the trim arm and the rotation and translation movement of the polishing disc based on the control parameters, so that the trim head forms a complex composite movement track on the polishing disc, ensures the uniformity of the trim head for the polishing pad in the CMP device, ensures that the trim head can cover every area on the surface of the polishing disc, effectively eliminates the trim blind area and excessive trim area of the trim head for the polishing pad carried on the polishing disc during the trim process, provides a highly consistent surface condition for subsequent wafer polishing processes, and improves the global planarization effect of wafer processing. BRIEF DESCRIPTION OF DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced. Obviously, the accompanying drawings in the following description only only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained on the basis of these drawings without creative labor.

[0013] Figure 1 The structure schematic diagram of the CMP device provided by the present application is shown in the figure.

[0014] Figure 2 The structure schematic diagram of the control device of the CMP device provided by the present application is shown in the figure.

[0015] Figure 3 The flow schematic diagram of the control method of the CMP device provided by the present application is shown in the figure.

[0016] Figure 4 The schematic diagram of the first visual content provided by the present application is shown in the figure.

[0017] Figure 5 The schematic diagram of the second visual content provided by the present application is shown in the figure.

[0018] Figure 6 The schematic diagram of the third visual content provided by the present application is shown in the figure.

[0019] Figure 7 The schematic diagram of the fourth visual content provided by the present application is shown in the figure.

[0020] Figure 8 The schematic diagram of the fifth visual content provided by the present application is shown in the figure.

[0021] Figure 9 The flow schematic diagram of the control method of the CMP device provided by the present application is shown in the figure.

[0022] Figure 10 The schematic diagram of the sixth visual content provided by the present application is shown in the figure.

[0023] Figure 11 The schematic diagram of the seventh visual content provided by the present application is shown in the figure.

[0024] Figure 12 The schematic diagram of the first state of the trimming arm provided by the present application is shown in the figure.

[0025] Figure 13 The schematic diagram of the second state of the trimming arm provided by the present application is shown in the figure.

[0026] Figure 14 The schematic diagram of the third state of the trimming arm provided by the present application is shown in the figure.

[0027] Figure 15 A structural schematic diagram of an embodiment of a control device of a CMP device provided in the present application is shown in FIG. 1.

[0028] Figure 16 A structural schematic diagram of an embodiment of an electronic device provided in the present application is shown in FIG. 2. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application will be clearly and completely described in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0030] The terms "first", "second", "third", "fourth" and the like (if any) in the specification and claims of the present application and the above-described drawings are used to distinguish similar objects, and do not necessarily indicate a specific order or a chronological sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but can include other steps or units that are not clearly listed or inherent to the process, method, product or device.

[0031] In wafer manufacturing, a chemical mechanical polishing (CMP) process realizes global planarization of a wafer surface through the cooperation of a grinding disc and a polishing pad, and is a key step for realizing global planarization of a wafer, and plays a crucial role in improving chip manufacturing quality and yield. With the continuous reduction of the size of semiconductor devices and the significant improvement of the integration level, the planarization requirements of the wafer surface are increasingly stringent, and the performance optimization of the CMP process has become the focus of the industry. However, the polishing pad will have a decrease in removal rate due to wafer debris, abrasive residue and surface glazing phenomenon during long-term use, thereby affecting the uniformity and efficiency of wafer polishing.

[0032] Therefore, in order to restore the surface roughness and removal performance of the polishing pad, ensure the continuous and effective operation of the CMP process, the polishing pad needs to be trimmed regularly. For example, in order to maintain the performance of the polishing pad, a trimming head equipped with diamonds is used to trim the surface of the polishing pad regularly to restore its roughness and removal capacity. The trimming of the grinding disc is usually carried out by a trimming arm with a fixed angle or uniform swing, cooperating with the continuous rotation of the grinding disc, to realize regular trimming of the surface of the polishing pad.

[0033] In the prior art, the grinding disc usually adopts a simple motion mode, such as the trimming arm swings at a fixed angle or at a uniform speed within a certain angle range, while the grinding disc rotates continuously. This trimming method is prone to cause high path repeatability of the trimming head on the surface of the grinding disc, resulting in excessive trimming in some areas and insufficient trimming in other areas. The path repeatability directly leads to uneven distribution of the removal rate of the polishing pad surface, and the insufficiently trimmed areas may have debris and glaze layer, which affects the polishing quality of the subsequent wafer, and further affects the consistency of wafer polishing. In addition, the local excessive wear may shorten the service life of the expensive trimming head and the grinding pad. Therefore, how to ensure the uniformity during the trimming process of the wafer to improve the polishing quality of the wafer is a technical problem to be solved in the field.

[0034] Based on this, the present application provides a control method, device, equipment, medium and product of a CMP device to improve the polishing quality of the wafer by ensuring the uniformity during the trimming process of the wafer by the CMP device. The technical solutions of the present application will be described in detail in the following specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may

[0035] Figure 1 The CMP device provided by the present application is shown in the structural schematic diagram of the CMP device as Figure 1 The CMP device includes:

[0036] The grinding disc 1 is used to carry the polishing pad. In the example shown in Figure 1 The shape of the grinding disc 1 is a circular disc body, which can be used for grinding treatment of the wafer below the polishing head 10. Preferably, the disc body radius of the grinding disc 1 can be 255 mm.

[0037] The trimming head 6 is used to trim the polishing pad carried on the grinding disc 1. Preferably, diamonds are embedded on the trimming head 6, which can be used to trim the polishing pad on the surface of the grinding disc 1 when the diamonds contact the grinding disc 1. Preferably, the trimming action radius of the trimming head 6 can be 65 mm.

[0038] Trimming arm 4: a rigid arm, the first end of which is fixed through a fixed fulcrum 5, and the second end of which is used to set a trimming head 6. By driving the fixed fulcrum 5 at the first end to rotate, the trimming arm 4 can swing. Preferably, the arm length of the trimming arm 4 can be 446.33 mm. Preferably, the fixed fulcrum 5 includes the rotation hinge point of the trimming arm 4, the spatial position of which is fixed, and the distance range from the center origin position of the polishing disc 1 is 18.8 mm-440 mm.

[0039] Rotary drive structure 2: connected with the polishing disc 1, used to drive the polishing disc 1 to rotate in the plane where the diameter of the polishing disc 1 is located. Preferably, the rotary drive structure 2 includes a servo motor or the like, and the rotation speed of the polishing disc 1 can be N_rpm=30 rpm.

[0040] Translation drive structure 3: connected with the rotary drive structure 2, used to drive the rotary drive structure 2 to translate in the plane where the diameter of the polishing disc 1 is located, so as to make the polishing disc 1 translate in the plane where the diameter of the polishing disc 1 is located. Preferably, the translation drive structure 3 includes a servo motor and a screw slide.

[0041] It should be noted that, as shown in the CMP device shown in Figure 1 , the structure of the trimming arm 4 as a swing arm with a fixed fulcrum is taken as an example, and the trimming arm 4 can also be other structures, for example, the trimming arm 4 can be a serial mechanical arm or the like, and complex three-dimensional trimming trajectories can be realized through multi-joint motion, so as to further improve the coverage uniformity when the polishing disc 1 is trimmed.

[0042] Figure 2 The structure schematic diagram of a control device of a CMP device provided in the present application is shown in Figure 2 , and the control device 20 can be used to control the CMP device shown in Figure 1 . Specifically, as shown in Figure 2 , the control device 20 includes:

[0043] The main controller unit 200 is the core computing unit of the control device 20. Preferably, the main controller unit 200 can be an industrial PC or a PLC or the like. The main controller unit 200 can be used to generate control instructions for the polishing disc 1, the trimming arm 4 and the like in the CMP device.

[0044] The swing arm servo driver unit 201 can be used to receive the control instructions of the main controller unit 200, drive the trimming arm 4 to swing according to the control instructions, and accurately control the angular position, angular velocity and angular acceleration and the like of the trimming arm swing.

[0045] The rotary servo drive unit 202 can be used to receive the control instructions of the main controller unit 200, drive the polishing disc to rotate according to the control instructions, and control the rotation speed of the polishing disc and the like.

[0046] The translation servo driving unit 203 can be used to receive the control instruction of the main controller unit 200, and drive the translation driving structure 3 to make the polishing disc 1 move in translation according to the control instruction.

[0047] Figure 3 The flowchart of an embodiment of the control method of the CMP device provided in the present application is shown in Figure 3 The method shown in Figure 1 The method shown in Figure 3 The method shown in Figure 2 The control method provided in the embodiment includes the following steps:

[0048] S101: determining the control parameters of the conditioning arm 4 and the polishing disc 1 in the CMP device.

[0049] The control parameters include the swing arm amplitude of the conditioning arm 4, the angular velocity, the angular frequency, the translation period and other parameters of the polishing disc 1.

[0050] In an embodiment, the main controller unit 200 in the control device 20 can receive the control parameters through the human-machine interface (HMI), or the main controller unit 200 can also store the control parameters in advance, or the controller unit 200 can determine different control parameters according to the characteristics of the wafer to be polished.

[0051] In an embodiment, the main controller unit 200 can execute the step of determining the control parameters in S101 after receiving the conditioning instruction for conditioning the polishing disc 1, or the main controller unit 200 can execute the step of determining the control parameters in S101 after meeting the trigger condition for conditioning the polishing disc 1.

[0052] The control method provided in the embodiment can adopt a parameterized control mode, and by adjusting the swing arm amplitude, the motion frequency, the translation stroke and the period time and other parameters, it can easily adapt to polishing discs of different sizes, conditioning heads of different specifications and different process recipes, so that the control method provided in the present application has stronger flexibility and can be applied to more rich scenarios, which is more conducive to the application and promotion of the embodiments of the present application.

[0053] S102: controlling the motion of the conditioning arm 4 and the polishing disc 1 based on the control parameters determined in S101, so that the conditioning head 6 arranged on the conditioning arm 4 performs conditioning processing on the polishing pad carried on the polishing disc 1.

[0054] In the embodiment, the control device 20 controls the motion of the conditioning arm 4 and the polishing disc 1 specifically includes:

[0055] The trimming arm 4 is controlled to move in a non-uniform swinging manner, wherein the trimming arm 4 is controlled to move in the non-uniform swinging manner, and the trimming head 6 is driven to move in the non-uniform swinging manner relative to the polishing disc 1. In an embodiment, the main controller unit 200 in the control device 20 can generate control instructions according to the control parameters and send the control instructions to the swing arm servo driver unit 201, and the swing arm servo driver unit 201 controls the trimming arm 4 to swing and move in the non-uniform swinging manner.

[0056] The polishing disc 1 is controlled to move in a rotating manner, specifically, the polishing disc 1 is controlled to rotate in the plane where the diameter of the polishing disc 1 is located. In an embodiment, the main controller unit 200 in the control device 20 can generate control instructions according to the control parameters and send the control instructions to the rotating servo drive unit 202, and the rotating servo drive unit 202 controls the polishing disc 1 to move in the rotating manner.

[0057] The polishing disc 1 is controlled to move in a translating manner, specifically, the polishing disc 1 is controlled to translate in the plane where the diameter of the polishing disc 1 is located. In an embodiment, the main controller unit 200 in the control device 20 can generate control instructions according to the control parameters and send the control instructions to the translating servo drive unit 203, and the translating servo drive unit 203 controls the polishing disc 1 to move in the translating manner.

[0058] The non-uniform swinging of the trimming arm 4, the rotating movement of the polishing disc 1, and the translating movement of the polishing disc 1 are coupled with each other, so that the trimming head 6 moves on the polishing disc 1 in a non-periodic motion track, thereby performing the trimming process on the polishing pad carried on the polishing disc 1.

[0059] It can be seen that, in the control method of the CMP device provided in the present application, the simple periodic repeated motion of the trimming head 6 relative to the polishing disc 1 in the prior art is avoided, wherein the non-uniform swinging of the trimming arm 4 is coupled with the rotating and translating movements of the polishing disc 1, so that the trimming head 6 forms a complex composite motion track relative to the polishing disc 1, and the uniformity of the trimming head 6 for the polishing pad carried on the polishing disc 1 is ensured. This cooperative motion ensures that the trimming head 6 can cover every region on the surface of the polishing disc 1, effectively eliminates the trimming blind area and the excessive trimming area of the polishing pad carried on the polishing disc 1 during the trimming, and provides a highly consistent surface condition for the subsequent polishing process of the wafer, thereby improving the global planarization effect of the wafer processing.

[0060] When the dressing head 6 forms a more uniform dressing path on the grinding disc 1, the uniform dressing path avoids stress concentration and excessive wear of the local area of the dressing head, makes the wear of the dressing head 6 more uniform on the entire working surface, and avoids the local failure phenomenon such as grooving of the grinding disc 1. Therefore, the replacement cycle of the dressing head 6 is significantly prolonged, the consumption of spare parts and the maintenance frequency are reduced, and the production and operation cost is reduced. At the same time, the uniform dressing also prolongs the service life of the grinding disc 1 itself, bringing double economic benefits.

[0061] In an embodiment, the S102 provided by the above embodiment includes controlling the dressing arm to move in a non-uniform swing manner based on the control parameter, and specifically includes: controlling the angular velocity of the dressing arm to change non-uniformly based on the control parameter, so that the dressing arm moves in a non-uniform swing manner.

[0062] In the embodiment, the control parameter includes an angular frequency w_val. Then, the main controller unit 200 in the control device 20 can specifically substitute the angular frequency w_val into the formula of the angular velocity function, so as to determine the angular velocity function of the dressing arm 4, and then control the angular velocity of the dressing arm 4 to change non-uniformly according to the determined angular velocity function.

[0063] In an embodiment, the angular velocity function includes a sine modulation function that changes over time, for example, the sine modulation function can be expressed by the formula ω_arm(t)=k*A*ω_val*sin(ω_val(t-T_stationary)), where k is a modulation coefficient, A is a swing amplitude, and T_stationary is an initial stationary time length. Preferably, the angular displacement amplitude A can be 18 degrees, the angular frequency coefficient ω_val can be 2Π / 60 rad / s, the modulation coefficient k can be 0.5, and the total movement period T_total can be 80 seconds.

[0064] In an embodiment, the control parameter includes a translation period T_move, and the S102 provided by the above embodiment includes controlling the grinding disc 1 to rotate and move based on the control parameter, and specifically includes: determining a translation function of the grinding disc 1 according to the translation period, and then controlling the grinding disc 1 to rotate and move according to the determined translation function.

[0065] In an embodiment, the translation function includes a sine function that changes over time, for example, the sine function can be expressed by the formula D_x(t)=D_max*sin(πt / T_move), where D_max is a maximum displacement amount. Preferably, D_max can be 40 mm, and the translation period T_move can be 60 seconds.

[0066] In an embodiment, the control parameter comprises an angular velocity ω disk, preferably, the angular velocity ω disk can take (30*2*π) / 60 rad / s. Then the above embodiment provides the control of the rotating motion of the polishing disc 1 in S102 based on the control parameter, specifically comprising: controlling the rotating motion of the polishing disc 1 according to the angular velocity ω disk.

[0067] In an embodiment, the control device 20 can also obtain the motion parameters of the trimming arm 4 and the polishing disc 1 when controlling the trimming head 6 in the CMP device to perform the trimming process on the polishing disc 1, wherein the motion parameters comprise angle, position, speed, etc., and the control parameter is adjusted according to the motion parameters to ensure that the trimming head 6 moves on the polishing disc 1 in a non-periodic motion trajectory, thereby realizing the dynamic adjustment of the swing angle of the trimming arm 4 and the translation speed of the polishing disc 1, forming a closed-loop feedback system to reduce the influence of external environment, etc. on the motion deviation between the trimming arm 4 and the polishing disc 1, maintain the motion synchronization between the trimming arm 4 and the polishing disc 1, so that the parameters are self-adjusted to the optimal parameters, and then ensure the uniformity and stability of the coverage rate when trimming the polishing disc 1.

[0068] In an embodiment, the control device 20 further comprises an industrial camera, which can be used to collect images of the surface of the polishing disc 1 in real time and send them to the main controller unit 200 when the trimming head 6 in the CMP device performs the trimming process on the polishing pad carried on the polishing disc 1, so that the main controller unit 200 determines the state of the surface of the polishing disc 1 according to the images, and then determines the target motion path and pressure of the trimming head 6 according to the current state, and controls the motion of the trimming arm 4 and the polishing disc 1 based on the target motion path, realizing more automatic adaptive adjustment, especially suitable for the working condition that the polishing pad has uneven wear.

[0069] When the trimming head 6 is controlled based on the images collected by the industrial camera, the control device 20 can not control the motion of the trimming arm and the polishing disc based on the control parameter as shown in the method of Figure 1 , but control the motion of the trimming arm and the polishing disc based on the motion path determined by the images.

[0070] In an embodiment, the control device 20 as shown in Figure 2 further comprises:

[0071] The human-machine interface unit 206 is used to display system status, simulation results, etc., and allows operators to input parameters and control the start or stop of the trimming process. Specifically, the human-machine interface unit 206 can be used to preset and initialize all motion parameters to obtain the complete formula of the entire trimming process. Furthermore, the status and results of the entire process are uniformly provided by the human-machine interface unit 206, enabling operators to intuitively grasp the trimming progress, motion status, and process effects, and to perform effect evaluation after the coverage analysis unit is completed, providing decision support for subsequent process parameter optimization.

[0072] In one embodiment, the operator can also control the start and stop of the trimming operation through the human-machine interface unit 206. For example, when a pause is needed, the operator issues a command through the human-machine interface unit 206. The main controller unit 200 detects the signal change, immediately stops the motion output of each driver, and records the pause start time. In the paused state, the main controller unit 200 continuously accumulates the pause time. In the non-paused state, the main controller unit 200 dynamically refreshes the real-time angle of the trimming arm, the actual position of the grinding disc, and the remaining time for the trimming process. When switching between motion phases, such as from a stationary phase to a trimming motion phase, or from a translational phase to a stationary phase, the relevant motion parameters are automatically reset to ensure the independence of each motion phase.

[0073] The motion trajectory simulation unit 204 can be used to calculate the real-time motion trajectory of the dressing head 6 in the coordinate system where the grinding disc 1 is located, and the real-time motion trajectory can be visualized through the human-computer interaction interface unit 206.

[0074] The coverage analysis unit 205 is used to statistically analyze the real-time motion trajectory of the trimming head 6, calculate key performance indicators such as uniformity and coverage, and generate visualization content such as the coverage number distribution map, which is presented through the human-computer interaction interface unit 206.

[0075] In a specific implementation, such as Figure 2 When the control device 20 shown executes the control method, the human-machine interface unit 206 receives the input process parameters and inputs all parameter settings to the main controller unit 200.

[0076] The main controller unit 200 serves as the core of the system and outputs the calculated control commands to the swing arm servo driver unit 201, the rotary servo driver unit 202, and the translational servo driver unit 203, respectively.

[0077] The swing arm servo driver unit 201 receives angle or speed commands from the main controller unit 200, driving and controlling the trimming arm 4 to perform precise swinging motion. The real-time angular position of the trimming arm 4 is fed back to the swing arm servo driver unit 201 via an encoder, forming a position closed-loop control to ensure motion accuracy.

[0078] The rotation servo driver unit 202 receives constant rotation speed command from the main controller unit 200, drives the rotation driving structure 2 to rotate, and further drives the polishing pad 1 to rotate at constant rotation speed. The real-time rotation speed and position of the polishing pad 1 are fed back to the rotation servo driver unit 202, constituting a speed closed-loop control.

[0079] The translation servo driver unit 203 receives sinusoidal motion trajectory command from the main controller unit 200, drives the translation driving structure 3 to perform precise linear motion. The translation driving structure 3 drives the whole polishing pad module to perform translation motion. The real-time position of the translation driving structure 3 is fed back to the translation servo driver unit 203, constituting a position closed-loop control.

[0080] The main controller unit 200 receives feedback data from the swing arm servo driver unit 201, the rotation servo driver unit 202 and the translation servo driver unit 203 in real time, performs collaborative motion calculation and synchronization state monitoring, and ensures that the motion trajectory of the dressing head 6 relative to the polishing pad 1 meets the planning.

[0081] The motion trajectory simulation unit 207 obtains real-time motion data from the main controller unit 200, wherein the motion data includes dressing arm angle, polishing pad position and rotation angle, calculates the theoretical motion trajectory of the dressing head 6 in the polishing pad 1 coordinate system, and provides the trajectory data to the human-computer interaction interface unit 206 for real-time display.

[0082] After a dressing cycle is completed, the main controller unit 200 sends the whole cycle motion data to the coverage analysis unit 205. The coverage analysis unit 205 performs coverage statistics and uniformity calculation, and provides the analysis results to the human-computer interaction interface unit 206. Finally, the human-computer interaction interface unit 206 summarizes and displays the real-time trajectory from the motion trajectory simulation unit 204 and the dressing effect report from the coverage analysis unit 205, and outputs or displays all information to the operator. The operator completes the whole dressing control process by optimizing process parameters.

[0083] For example, Figure 4 The first visual content provided in the present application is shown in the schematic diagram, wherein the swing curve of the dressing arm 4 in the CMP device is shown. The upper gray line is used to indicate the rotation speed of the dressing arm 4, which can be the change of the rotation per minute (RPM) with time. The lower orange line is used to indicate the change of the position of the lower dressing head 6 driven by the dressing arm 4 with time.

[0084] Figure 5A second visualization content provided by the present application is shown in the figure, which shows the motion parameters of the trim arm 4 in the CMP device changing with time, wherein the motion parameters include the swing angle, angular velocity and angular acceleration, the swing angle is the blue curve in the figure, the unit is degree, the angular velocity is the red curve in the figure, the unit is rad / s, and the angular acceleration is the green curve in the figure, the unit is rad / s 2 .

[0085] Figure 6 A third visualization content provided by the present application is shown in the figure, which shows the cleaning times of the trim head 6 in the CMP device at different radius positions on the polishing disc 1, represented by a column chart.

[0086] Figure 7 A fourth visualization content provided by the present application is shown in the figure, which shows the cleaning times of the trim head 6 in the CMP device at different radius positions on the polishing disc 1, represented by a dot chart.

[0087] In Figure 6 and Figure 7 , the cleaning times of the trim head 6 at different radius positions on the polishing disc 1 are specifically shown at the radius positions of 0-250mm, and it can be seen that, through the control method provided by the present application, the running track of the trim head 6 on the polishing disc 1 is relatively uniform, so the cleaning times at different radius positions are relatively close.

[0088] Figure 8 A fifth visualization content provided by the present application is shown in the figure, which shows the motion track distribution diagram of the trim head 6 on the polishing disc 1, which can be analyzed within a period of 100 seconds, the coverage rate of the trim head 6 on the polishing disc 1 is 100%, the entire plane of the polishing disc 1 is covered, and the uniformity is 0.81, thereby effectively improving the global planarization effect of wafer processing.

[0089] In an embodiment, in the control method provided by the present application, the control device 20 controls the non-uniform swing of the trim arm 4, the rotational motion and translational motion of the polishing disc 1 when the trim arm 4 and the polishing disc 1 are moving based on the control parameters, and specifically includes:

[0090] Before the first target moment in the entire trim cycle of the trim process, the trim arm 4 is controlled to stop swinging; and after the first target moment in the entire trim cycle of the trim process, the trim arm 4 is controlled to move in a non-uniform swinging manner.

[0091] And before the second target moment in the entire trim cycle of the trim process, the polishing disc 1 is controlled to move in a translational motion; and after the second target moment in the entire trim cycle of the trim process, the polishing disc 1 is controlled to stop translating.

[0092] and, during the whole dressing cycle of the dressing process, the rotation movement of the polishing disc 1 is controlled.

[0093] The embodiment provides the stop and start of the swing movement of the dressing arm 4, the stop and start of the translation movement of the polishing disc 1, further makes the dressing head 4 form a more complex movement track on the polishing disc 1, and thus further improves the global planarization effect of subsequent wafer processing.

[0094] Exemplarily, the whole dressing cycle is 60 seconds, the first target time can be 20 seconds, and the second target time can be 50.8 seconds.

[0095] For example, Figure 9 The flowchart of another embodiment of the CMP device control method provided in the application is shown in the figure. Figure 9 As shown in the figure, when the control device 20 controls the movement of the dressing arm 4 and the polishing disc 1 based on the control parameter, the polishing pad carried on the polishing disc 1 is subjected to the dressing process, and it is assumed that the dressing cycle is 60 seconds.

[0096] Then, after the control device 20 determines the control parameter, if the current time t is less than the first target time 20 seconds, the control device 20 controls the dressing arm 4 to stop the swing state, and if the current time t is not less than the first target time 20 seconds, the control device 20 controls the dressing arm 4 to perform non-uniform speed movement and keep the position of the dressing head.

[0097] If the current time t is less than the second target time 50.8 seconds, the control device 20 controls the translation movement of the polishing disc 1, and if the current time t is not less than the second target time 50.8 seconds, the control device 20 controls the polishing disc 1 to stop the translation movement.

[0098] And during the whole dressing cycle of the dressing process, the control device 20 controls the rotation movement of the polishing disc 1, so that the non-uniform swing of the dressing arm 4, the rotation movement and the translation movement of the polishing disc 1 are coupled to form a composite movement, and the movement track simulation unit 204 can be used for track calculation, so that the movement state of the dressing head 6 relative to the dressing arm 4 is displayed in real time through the man-machine interactive interface unit 206.

[0099] If the current time t is greater than 60 seconds, after the whole dressing cycle is finished, the coverage analysis unit 205 can be used for coverage analysis, and the dressing result is displayed through the man-machine interactive interface unit 206.

[0100] Figure 10 The sixth visual content provided in the application is shown in the figure, which shows the dressing result based on the first target time and the second target time. Figure 9The control method shown controls the CMP device, and a schematic diagram of the motion parameters of the trim arm 4 in the CMP device changing over time is shown, wherein the motion parameters include the swing angle, the angular velocity and the angular acceleration, the swing angle is the blue curve in the figure, the unit is degree, and the swing angle range is between 100 degrees and 130 degrees, referring to the left side of the vertical coordinate position in the figure; the angular velocity is the red curve in the figure, the unit is rad / s, and the angular velocity range is between -0.015 rad / s and 0.015 rad / s, referring to the right side of the vertical coordinate position in the figure; the angular acceleration is the green curve in the figure, the unit is rad / s, and the angular acceleration range is between -0.015 rad / s and 0.015 rad / s, referring to the right side of the vertical coordinate position in the figure. 2 2 2

[0101] In combination with Figure 9 The control method shown, assuming that the initial angle of the trim arm 4 is 120 degrees and the stroke is 18 degrees, the trim arm 4 is in a state of stopping swinging before the first target time 20 seconds, and the trim arm 4 is in a non-uniform motion state after the first target time 20 seconds.

[0102] Figure 11 A schematic diagram of the seventh visualization content provided for the present application is shown, which shows the motion trajectory distribution of the trim head 6 on the plane where the grinding disc 1 is located based on the control method shown. Figure 9 The control method shown controls the CMP device, and a schematic diagram of the motion parameters of the trim arm 4 in the CMP device changing over time is shown, wherein the motion parameters include the swing angle, the angular velocity and the angular acceleration, the swing angle is the blue curve in the figure, the unit is degree, and the swing angle range is between 100 degrees and 130 degrees, referring to the left side of the vertical coordinate position in the figure; the angular velocity is the red curve in the figure, the unit is rad / s, and the angular velocity range is between -0.015 rad / s and 0.015 rad / s, referring to the right side of the vertical coordinate position in the figure; the angular acceleration is the green curve in the figure, the unit is rad / s, and the angular acceleration range is between -0.015 rad / s and 0.015 rad / s, referring to the right side of the vertical coordinate position in the figure.

[0103] Figure 12 A schematic diagram of the first state of the trim arm provided for the present application is shown, which shows the relative position diagram of the trim arm 4 moving to the center position relative to the grinding disc 1.

[0104] Figure 13 A schematic diagram of the second state of the trim arm provided for the present application is shown, which shows the relative position diagram of the trim arm 4 moving to the outer side position relative to the grinding disc 1.

[0105] Figure 14 A schematic diagram of the third state of the trim arm provided for the present application is shown, which shows the relative position diagram of the trim arm 4 moving to the inner side position relative to the grinding disc 1.

[0106] It should be noted that, Figure 12- Figure 14 ​​​The relative position between the dressing arm 4 and the polishing disc 1 shown is only an example, and the present application can also be applied to other CMP devices, and the present application does not limit the relative position between the dressing arm 4 and the polishing disc 1.

[0107] Further, in the foregoing embodiments of the present application, a method for controlling the relative movement of the dressing arm 4 and the polishing disc 1 is provided, and in actual process, when the dressing arm 4 and the polishing disc 1 move relatively in different ways, it can also affect the polishing process of the polishing disc 1 to the wafer in the CMP device, and affect the basic function of the CMP device. Therefore, in an embodiment of the present application, during the dressing process of the polishing pad on the polishing disc 1 in the CMP device, when the dressing head 6 moves to a distance less than a preset distance from the polishing head 10 under the relative movement between the dressing head 6 and the polishing disc 1, the control device 20 also controls the polishing head 10 to move a certain distance in the opposite direction of the dressing head 6, so as to increase the distance between the dressing head 6 and the polishing head 10, thereby preventing the dressing process of the dressing head 6 from affecting the normal polishing process of the wafer under the polishing head 10, and ensuring the normal polishing process of the wafer in the CMP device, and also taking into account the dressing process of the polishing pad carried on the polishing disc 1 in the present application. It can be understood that the preset distance and the certain distance can be set, and after the dressing head 6 moves for a certain time or the distance between the dressing head 6 and the polishing head 10 is greater than another preset distance, the control device 20 can also control the polishing head 10 to move back to the initial position to ensure the normal polishing process of the wafer. In a specific implementation, the CMP device can add a moving structure to the polishing head 10, which is called a polishing head arm, and the like, and the control device 20 can control the direction and distance of the movement of the polishing head 10 by controlling the rotation of the polishing head arm.

[0108] In the foregoing embodiments of the present application, the control method of the CMP device provided by the embodiments of the present application is introduced, and in order to realize the functions in the method provided by the embodiments of the present application, the control device as an execution subject can realize the above-mentioned functions by hardware structure and / or software module. Whether a certain function in the above-mentioned functions is executed by hardware structure, software module, or hardware structure plus software module depends on the specific application and design constraints of the technical solution.

[0109] For example, the control device can be a structure as shown in Figure 3 For example, the control device can be a structure as shown in Figure 15 The structure diagram of an embodiment of the control device of the CMP device provided by the present application is as shown in Figure 15The control device 1000 shown includes a determination module 1001 and a control module 1002. The determination module 1001 is configured to determine control parameters of a trim arm and a polishing pad in the CMP device; and the control module 1002 is configured to control the trim arm and the polishing pad to move based on the control parameters, so that a trim head arranged on the trim arm performs a trim process on a polishing pad carried on the polishing pad.

[0110] As Figure 15 The specific implementation and principles of the control device 1000 of the CMP device shown can refer to the corresponding control method of the CMP device described above, and the implementation and principles are the same, which will not be repeated here.

[0111] It should be understood that the division of each module of the above device is only a logical functional division, and all or part of the modules can be integrated into one physical entity, or can be physically separated. These modules can all be implemented in the form of software called by a processing element; all can be implemented in the form of hardware; or some modules can be implemented in the form of software called by a processing element, and some modules can be implemented in the form of hardware. For example, the module can be a separately arranged processing element, or can be integrated in a chip of the above device, in addition, the module can also be stored in the form of program code in the memory of the above device, and the function of the above determination module is called and executed by a processing element of the above device. The implementation of other modules is similar. In addition, all or part of the modules can be integrated together, or can be independently implemented. The processing element here can be an integrated circuit with signal processing capability. In the implementation process, each step of the above method or each module can be completed by the integrated logic circuit of hardware or the instruction of software in the processing element.

[0112] For example, the above modules can be one or more integrated circuits configured to implement the above method, such as one or more application specific integrated circuits (ASIC), or one or more digital signal processors (DSP), or one or more field programmable gate arrays (FPGA), etc. For another example, when a certain module above is implemented in the form of program code called by a processing element, the processing element can be a general purpose processor, such as a central processing unit (CPU) or other processor that can call program code. For another example, the modules can be integrated together to implement in the form of system-on-a-chip (SOC).

[0113] In the above embodiments, all or part of the embodiments can be implemented by software, hardware, firmware or any combination thereof. When implemented by software, all or part of the embodiments can be implemented in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions according to the embodiments of the present application are generated. The computer can be a general purpose computer, a special purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer readable storage medium or transmitted from one computer readable storage medium to another computer readable storage medium, for example, the computer instructions can be transmitted from one website, computer, server or data center to another website, computer, server or data center through wired (for example, coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (for example, infrared, wireless, microwave, etc.) mode. The computer readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server, data center, etc. containing one or more available media sets. The available media can be magnetic media (for example, floppy disk, hard disk, magnetic tape), optical media (for example, DVD), or semiconductor media (for example, solid state disk (SSD)) and the like.

[0114] For example, Figure 16 The structural schematic diagram of an embodiment of the electronic device provided in the present application is shown in FIG. 2. As shown in FIG. 2, the electronic device 2000 can be used to execute the control method of any CMP device according to the embodiments of the present application. Figure 16 The structural schematic diagram of an embodiment of the electronic device provided in the present application is shown in FIG. 2. As shown in FIG. 2, the electronic device 2000 can be used to execute the control method of any CMP device according to the embodiments of the present application.

[0115] In an embodiment, the control device 2000 shown in FIG. 2 includes one or more processors 2001 and a memory 2002. The memory 2002 is used to store computer executable instructions, and the processor 2001 can execute the computer executable instructions stored in the memory 2002. When the computer executable instructions are executed by the processor 2001, the processor 2001 implements the control method of any CMP device according to the foregoing embodiments of the present application. Figure 16 In an embodiment, the control device 2000 shown in FIG. 2 further includes a communication interface 2003, wherein the processor 2001 can communicate with other devices through the communication interface 2003, for example, the processor 2001 transmits and receives data through the communication interface 2003.

[0116] Figure 16 In an embodiment, the control device 2000 shown in FIG. 2 further includes a communication interface 2003, wherein the processor 2001 can communicate with other devices through the communication interface 2003, for example, the processor 2001 transmits and receives data through the communication interface 2003.

[0117] ​In the above embodiments, it should be understood that the processor can be a central processing unit (CPU), and can also be other general-purpose processors, digital signal processors (DSP), application specific integrated circuits (ASIC), etc. The general-purpose processor can be a microprocessor or can also be any conventional processor. The steps of the method disclosed in combination with the application can be directly embodied as hardware processor execution, or executed by a combination of hardware and software modules in the processor.

[0118] The memory can include a random access memory (RAM), and can also include a non-volatile memory (NVM), such as at least one disk memory.

[0119] The bus can be an industry standard architecture (ISA) bus, a peripheral component (PCI) bus, an extended industry standard architecture (EISA) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, the bus in the drawings of the present application does not limit to only one bus or one type of bus.

[0120] The embodiments of the present application also provide a chip for executing instructions, which is used to execute the control method of any one of the CMP devices as previously described in the present application.

[0121] The embodiments of the present application also provide a computer program product, which includes a computer program, and the computer program is executed to implement the control method of any one of the CMP devices as previously described in the present application.

[0122] The present application also provides a computer readable storage medium, which stores computer executable instructions, and the computer executable instructions are executed to implement the control method of any one of the CMP devices as previously described in the present application.

[0123] The above-mentioned readable storage medium can be realized by any type of volatile or nonvolatile storage devices or their combinations, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk or optical disk. The readable storage medium can be any available medium that can be accessed by a general or special purpose computer.

[0124] An exemplary readable storage medium is coupled to the processor, so that the processor can read information from the readable storage medium and write information to the readable storage medium. Of course, the readable storage medium can also be an integral part of the processor. The processor and the readable storage medium can be located in an application specific integrated circuit (ASIC). Of course, the processor and the readable storage medium can also exist as discrete components in the device.

[0125] The division of units is only a logical function division, and in actual implementation, there can be another division manner, for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units shown or discussed can be indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0126] The units described as separate components can or can not be physically separated, and the components shown as units can or can not be physical units, that is, they can be located in one place, or can be distributed on multiple network units. According to actual needs, part or all of the units can be selected to achieve the purpose of the embodiment scheme.

[0127] In addition, the functional units in each embodiment of the present application can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit.

[0128] If the functions are implemented in the form of software function units and sold or used as independent products, they can be stored in a computer readable storage medium. Based on this understanding, the technical solutions of the present application or the part of the present application that essentially contributes to the prior art or the part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the embodiments of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk or an optical disk, and various program code storage media.

[0129] Those of ordinary skill in the art can understand that all or part of the steps of the above-mentioned method embodiments can be completed by program instruction-related hardware. The aforementioned program can be stored in a computer readable storage medium. When the program is executed, the steps of the above-mentioned method embodiments are executed; and the aforementioned storage medium includes: a ROM, a RAM, a magnetic disk or an optical disk, and various program code storage media.

[0130] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the above embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the above embodiments, or make equivalent replacements for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A control method of a CMP apparatus, characterized by, The method comprises: determining control parameters of a trim arm and a polishing disc in the CMP device; controlling the trim arm and the polishing disc to move based on the control parameters, so that a trim head arranged on the trim arm performs a trim process on a polishing pad carried on the polishing disc; wherein the controlling the trim arm and the polishing disc to move based on the control parameters comprises: controlling the trim arm to move in a non-uniform swing manner, controlling the polishing disc to rotate, and controlling the polishing disc to translate, based on the control parameters, the non-uniform swing of the trim arm, the rotation of the polishing disc, and the translation of the polishing disc being coupled with each other, so that the trim head performs the trim process on the polishing pad carried on the polishing disc in a non-periodic motion trajectory on the polishing disc.

2. The method of claim 1, wherein, The controlling the trim arm to move in a non-uniform swing manner based on the control parameters comprises: controlling the angular velocity of the trim arm to change in a non-uniform manner based on the control parameters, so that the trim arm moves in a non-uniform swing manner.

3. The method of claim 2, wherein, The control parameters comprise an angular frequency, and the controlling the angular velocity of the trim arm to change in a non-uniform manner based on the control parameters comprises: determining an angular velocity function of the trim arm according to the angular frequency, the angular velocity function comprising a sine modulation function that changes with time; controlling the angular velocity of the trim arm to change in a non-uniform manner according to the angular velocity function.

4. The method of claim 3, wherein, The controlling the trim arm to move in a non-uniform swing manner comprises: controlling the trim arm to stop swinging before a first target time in an entire trim period of the trim process; controlling the trim arm to move in a non-uniform swing manner after the first target time in the entire trim period of the trim process.

5. The method of claim 1, wherein, The control parameters comprise a translation period, and the controlling the polishing disc to translate based on the control parameters comprises: determining a translation function of the polishing disc according to the translation period, the translation function comprising a sine function that changes with time; controlling the polishing disc to translate according to the translation function.

6. The method of claim 5, wherein, The controlling the polishing disc to translate comprises: controlling the polishing disc to translate before a second target time in the entire trim period of the trim process; controlling the polishing disc to stop translating after the second target time in the entire trim period of the trim process.

7. The method of claim 1, wherein, The control parameters comprise an angular velocity, and the controlling the polishing disc to rotate based on the control parameters comprises: controlling the polishing disc to rotate according to the angular velocity.

8. The method according to any one of claims 1 to 7, characterized in that, The method further comprises: acquiring motion parameters of the trim arm and the polishing disc during the trim process, and adjusting the control parameters according to the motion parameters, so as to ensure that the trim head performs the trim process on the polishing pad in a more uniform non-periodic motion trajectory on the polishing disc; and / or, acquiring an image of the polishing disc during the trim process, determining a target motion path of the trim head according to the image, and controlling the trim arm and the polishing disc to move based on the target motion path.

9. The method of claim 1, wherein, The method further comprises: In the dressing process, when the distance between the dressing head and the polishing head is less than a preset distance, the polishing head is controlled to move to increase the distance between the dressing head and the polishing head, so as to prevent the dressing process of the dressing head from affecting the polishing process of the wafer.

10. A control device of a CMP apparatus, characterized by, The method comprises the steps of: determining a control parameter of a dressing arm and a polishing disc in the CMP device; controlling the dressing arm and the polishing disc to move based on the control parameter, so that a dressing head arranged on the dressing arm performs a dressing process on a polishing pad carried on the polishing disc; wherein the control of the dressing arm and the polishing disc to move based on the control parameter comprises: controlling the dressing arm to move in a non-uniform swinging manner, controlling the polishing disc to rotate, and controlling the polishing disc to move in a translational manner based on the control parameter, and the non-uniform swinging of the dressing arm, the rotation of the polishing disc, and the translational movement of the polishing disc are coupled with each other, so that the dressing head performs the dressing process on the polishing pad carried on the polishing disc in a non-periodic motion track on the polishing disc.

11. An electronic device, comprising: The method comprises the steps of: a processor, and a memory connected to the processor in communication; the memory stores computer-executable instructions; the processor executes the computer-executable instructions stored in the memory to implement the method according to any one of claims 1-9.

12. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are executed by the processor to implement the method according to any one of claims 1-9.

13. A computer program product, characterised in that, The computer program is executed by the processor to implement the method according to any one of claims 1-9.

Images