Control method, device, equipment, medium and product of cmp equipment

Abstract

The application provides a control method, device, equipment, medium and product of a CMP device, control parameters of a trimming arm and a grinding disc in the CMP device are determined, and the non-uniform swinging of the trimming arm is coupled with the rotation and translation motion of the grinding disc based on the control parameters, so that the trimming head forms a complex composite motion track on the grinding disc, ensures that the trimming head can cover every area of the surface of the grinding disc, effectively eliminates the trimming blind area and excessive trimming area of the polishing pad carried on the grinding disc during trimming, provides a highly consistent surface condition for subsequent polishing process of a wafer, and improves the global planarization effect of wafer processing.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a control method, apparatus, equipment, medium, and product for CMP equipment. Background Technology

[0002] In wafer manufacturing, chemical mechanical polishing (CMP) achieves global planarization of the wafer surface through the synergistic action of the polishing pad and the grinding wheel. However, over long-term use, the polishing pad's removal rate decreases due to wafer debris, abrasive residue, and surface glazing, which in turn affects the uniformity and efficiency of wafer polishing.

[0003] In existing technologies, to maintain the performance of polishing pads, the surface of the polishing pads needs to be periodically dressed using a dressing head equipped with diamonds to restore its roughness and removal capacity. The dressing of the grinding disc usually uses a dressing arm with a fixed angle or a uniform oscillation speed, in conjunction with the continuous rotation of the grinding disc, to achieve regular dressing of the polishing pad surface.

[0004] Using existing technologies, path repeatability directly leads to uneven removal rate distribution on the polishing pad surface, affecting the consistency of wafer polishing. Therefore, ensuring the uniformity of polishing pad dressing by the dressing head in CMP equipment to improve wafer polishing quality is a technical problem that needs to be solved in this field. Summary of the Invention

[0005] This application provides a control method, apparatus, device, medium, and product for CMP equipment, which improves the uniformity of the dressing head's dressing of the polishing pad in CMP equipment, thereby improving the polishing quality of the wafer.

[0006] This application provides a control method for a CMP (Chemical Mechanical Polishing) device, comprising: determining control parameters for a dressing arm and a polishing disc in the CMP device; controlling the movement of the dressing arm and the polishing disc based on the control parameters, such that a dressing head disposed on the dressing arm performs dressing processing on a polishing pad carried on the polishing disc; wherein, controlling the movement of the dressing arm and the polishing disc based on the control parameters includes: controlling the dressing arm to move in a non-uniform oscillating manner, controlling the rotational movement of the polishing disc, and controlling the translational movement of the polishing disc based on the control parameters, wherein the non-uniform oscillation of the dressing arm, the rotational movement of the polishing disc, and the translational movement are coupled to each other, such that the dressing head performs dressing processing on the polishing pad carried on the polishing disc with a non-periodic motion trajectory.

[0007] A second aspect of this application provides a control device for a CMP (Continuous Polishing) equipment, comprising: a determining module for determining control parameters of a dressing arm and a polishing disc in the CMP equipment; and a control module for controlling the movement of the dressing arm and the polishing disc based on the control parameters, such that a dressing head disposed on the dressing arm performs dressing processing on a polishing pad carried on the polishing disc; wherein controlling the movement of the dressing arm and the polishing disc based on the control parameters includes: controlling the dressing arm to move in a non-uniform oscillating manner, controlling the rotational movement of the polishing disc, and controlling the translational movement of the polishing disc based on the control parameters, wherein the non-uniform oscillation of the dressing arm, the rotational movement of the polishing disc, and the translational movement are coupled to each other, such that the dressing head performs dressing processing on the polishing pad carried on the polishing disc with a non-periodic motion trajectory.

[0008] A third aspect of this application provides an electronic device comprising: a processor and a memory communicatively connected to the processor; the memory storing computer-executable instructions; and the processor executing the computer-executable instructions stored in the memory to implement the method described in the first aspect of this application.

[0009] A fourth aspect of this application provides a computer-readable storage medium storing computer-executable instructions that, when executed by a processor, are used to implement the method described in the first aspect of this application.

[0010] The fifth aspect of this application provides a computer program product, including a computer program that, when executed by a processor, implements the method described in the first aspect of this application.

[0011] In summary, the control method, apparatus, equipment, medium, and product for CMP equipment provided in this application determine the control parameters of the dressing arm and polishing pad in the CMP equipment. Based on the control parameters, the non-uniform oscillation of the dressing arm is coupled with the rotation and translation of the polishing pad, thereby enabling the dressing head to form a complex composite motion trajectory on the polishing pad. This ensures the uniformity of the dressing head's dressing of the polishing pad in the CMP equipment, ensuring that the dressing head can cover every area of ​​the polishing pad surface. It effectively eliminates the dressing blind spots and over-dressing areas that exist when the dressing head dresses the polishing pad on the polishing pad, providing highly consistent surface conditions for subsequent wafer polishing processes and improving the overall planarization effect of wafer processing. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 A schematic diagram of the CMP equipment provided in this application;

[0014] Figure 2 A schematic diagram of the structure of a control device for a CMP device provided in this application;

[0015] Figure 3 A flowchart illustrating an embodiment of the control method for a CMP device provided in this application;

[0016] Figure 4 A schematic diagram of the first type of visual content provided in this application;

[0017] Figure 5 A schematic diagram illustrating the second type of visualization content provided in this application;

[0018] Figure 6 A schematic diagram of the third type of visualization content provided in this application;

[0019] Figure 7 A schematic diagram illustrating the fourth type of visual content provided in this application;

[0020] Figure 8 A schematic diagram of the fifth type of visualization content provided in this application;

[0021] Figure 9 A flowchart illustrating another embodiment of the control method for the CMP equipment provided in this application;

[0022] Figure 10 A schematic diagram of the sixth type of visual content provided in this application;

[0023] Figure 11 A schematic diagram illustrating the seventh type of visualization content provided in this application;

[0024] Figure 12 A schematic diagram of the first state of the trimming arm provided in this application;

[0025] Figure 13 A schematic diagram of the second state of the trimming arm provided in this application;

[0026] Figure 14 A schematic diagram of the third state of the trimming arm provided in this application;

[0027] Figure 15 A schematic diagram of the structure of an embodiment of the control device for a CMP device provided in this application;

[0028] Figure 16 A schematic diagram of the structure of an embodiment of the electronic device provided in this application. Detailed Implementation

[0029] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0031] In wafer manufacturing, Chemical Mechanical Polishing (CMP) achieves global planarization of the wafer surface through the synergistic action of polishing pads and grinding discs. This is a crucial step in achieving global wafer planarization and plays a vital role in improving chip manufacturing quality and yield. With the continuous miniaturization of semiconductor devices and the significant increase in integration density, the requirements for wafer surface planarization are becoming increasingly stringent, making CMP process performance optimization a focus of industry attention. However, over long-term use, polishing pads experience a decrease in removal rate due to wafer debris, abrasive residue, and surface glazing, which in turn affects the uniformity and efficiency of wafer polishing.

[0032] Therefore, in order to restore the surface roughness and removal performance of the polishing pad and ensure the continued effectiveness of the CMP process, the polishing pad needs to be dressed periodically. For example, to maintain the performance of the polishing pad, the surface of the polishing pad is periodically dressed using a dressing head equipped with diamond to restore its roughness and removal capacity. The dressing of the grinding disc usually uses a dressing arm with a fixed angle or a uniform oscillation speed, combined with the continuous rotation of the grinding disc, to achieve regular dressing of the polishing pad surface.

[0033] In this process, the grinding disc typically employs a simple motion pattern, such as the dressing arm oscillating at a fixed angle or at a uniform speed within a certain angle range, while the grinding disc rotates continuously. This dressing method easily leads to excessive repetition of the dressing head's path on the grinding disc surface, resulting in over-dressing in some areas and under-dressing in others. This path repetition directly causes uneven removal rates on the polishing pad surface, and under-dressed areas may retain debris and enamel layers, affecting the subsequent wafer polishing quality and consequently the consistency of wafer polishing. Furthermore, excessive localized wear may shorten the lifespan of the expensive dressing head and grinding pad. Therefore, ensuring uniformity during wafer dressing to improve wafer polishing quality is a technical problem that needs to be solved in this field.

[0034] Based on this, this application provides a control method, apparatus, device, medium, and product for CMP equipment to improve the uniformity of wafer trimming during CMP equipment processing, thereby enhancing the polishing quality of the wafer. The technical solution of this application is described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments.

[0035] Figure 1 A schematic diagram of the CMP equipment provided in this application is shown below. Figure 1 The CMP equipment shown includes:

[0036] Grinding disc 1: Used to hold the polishing pad. Figure 1 The example shown has a circular disk shape, which can be used to grind the wafer below the polishing head 10. Preferably, the radius of the polishing disk 1 can be 255 mm.

[0037] Dressing head 6: Used to dress the polishing pad supported on the grinding disc 1. Preferably, the dressing head 6 is inlaid with diamond, which, when in contact with the grinding disc 1, can be used to dress the polishing pad on the surface of the grinding disc 1. Preferably, the dressing radius of the dressing head 6 can be 65mm.

[0038] Dressing arm 4: This is a rigid arm, with its first end fixed by a fixed fulcrum 5 and its second end used to mount the dressing head 6. By driving the fixed fulcrum 5 at the first end to rotate, the dressing arm 4 can swing. Preferably, the arm length of the dressing arm 4 can be 446.33 mm. Preferably, the fixed fulcrum 5 includes the rotational hinge point of the dressing arm 4, and its spatial position is fixed, with a distance from the center origin of the grinding disc 1 ranging from 18.8 mm to 440 mm.

[0039] Rotary drive structure 2: connected to the grinding disc 1, used to drive the grinding disc 1 to rotate in the plane containing its diameter. Preferably, the rotary drive structure 2 includes a servo motor, etc., and the rotation speed of the grinding disc 1 can be N_rpm = 30rpm.

[0040] Translation drive structure 3: connected to rotary drive structure 2, used to drive rotary drive structure 2 to translate within the plane containing the diameter of grinding disk 1, so that grinding disk 1 translates within the plane containing its diameter. Preferably, translation drive structure 3 includes a servo motor and a lead screw.

[0041] It should be noted that, as Figure 1 In the CMP equipment shown, the trimming arm 4 is a swing arm structure with a fixed fulcrum as an example. The trimming arm 4 can also be other structures, such as a series robotic arm, etc., which can realize complex three-dimensional trimming trajectories through multi-joint motion, thereby further improving the coverage uniformity when trimming the grinding disc 1.

[0042] Figure 2 This application provides a schematic diagram of the structure of a control device for a CMP device, as shown below. Figure 2 The control device 20 shown can be used to control, for example, Figure 1 The CMP equipment shown, specifically, is as follows: Figure 2 The control device 20 shown includes:

[0043] The main controller unit 200 is the core computing unit of the control device 20. Preferably, the main controller unit 200 can be an industrial PC or a PLC, etc. The main controller unit 200 can be used to generate control commands for the grinding disc 1, trimming arm 4, etc. in the CMP equipment.

[0044] The swing arm servo driver unit 201 can receive control commands from the main controller unit 200, drive the trimming arm 4 to swing according to the control commands, and precisely control the angular position, angular velocity and angular acceleration of the trimming arm swing.

[0045] The rotary servo drive unit 202 can be used to receive control commands from the main controller unit 200, drive the grinding disc to rotate according to the control commands, and control the rotation speed of the grinding disc, etc.

[0046] The translation servo drive unit 203 can be used to receive control commands from the main controller unit 200 and drive the translation drive structure 3 to make the grinding disc 1 translate according to the control commands.

[0047] Figure 3 A flowchart illustrating an embodiment of the control method for a CMP device provided in this application is shown below. Figure 3 The method shown can be used to control, for example Figure 1 The CMP equipment shown is as follows: Figure 3 The method shown can be derived from, for example Figure 2 The control device 20 shown executes the control method, specifically, the control method provided in this embodiment includes:

[0048] S101: Determine the control parameters of dressing arm 4 and grinding disc 1 in the CMP equipment.

[0049] The control parameters include the swing arm amplitude of the trimming arm 4, the angular velocity, angular frequency, and translation period of the grinding disc 1.

[0050] In one embodiment, the main controller unit 200 in the control device 20 can receive control parameters through a human-machine interface (HMI), or the main controller unit 200 can store control parameters in advance, or the controller unit 200 can determine different control parameters according to the characteristics of the wafer to be ground.

[0051] In one embodiment, the main controller unit 200 may execute the step of determining control parameters in S101 after receiving a trimming instruction to trim the grinding disc 1, or the main controller unit 200 may execute the step of determining control parameters in S101 after the triggering condition for trimming the grinding disc 1 is met.

[0052] The control method provided in this embodiment can adopt a parameterized control approach. By adjusting parameters such as swing arm amplitude, motion frequency, translation stroke, and cycle time, it can easily adapt to grinding discs of different sizes, dressing heads of different specifications, and different process formulas. This makes the control method provided in this application more flexible and applicable to a wider range of scenarios, which is more conducive to the application and promotion of the embodiments of this application.

[0053] S102: Based on the control parameters determined in S101, control the movement of the trimming arm 4 and the grinding disc 1 so that the trimming head 6 set on the trimming arm 4 trims the polishing pad carried on the grinding disc 1.

[0054] In this embodiment, the control device 20 controls the movement of the trimming arm 4 and the grinding disc 1, specifically including:

[0055] The trimming arm 4 is controlled to move in a non-uniform swinging manner, wherein when the trimming arm 4 moves in a non-uniform swinging manner, it drives the trimming head 6 to move in a non-uniform swinging manner relative to the grinding disc 1. In one embodiment, the main controller unit 200 in the control device 20 can generate control commands according to control parameters and send them to the swing arm servo driver unit 201, which controls the trimming arm 4 to swing in a non-uniform swinging manner.

[0056] The grinding disc 1 is controlled to rotate, specifically by rotating the grinding disc 1 in the plane containing its diameter. In one embodiment, the main controller unit 200 in the control device 20 can generate control commands based on control parameters and send them to the rotary servo drive unit 202, which then controls the rotation of the grinding disc 1.

[0057] The translational movement of the grinding disc 1 is controlled, specifically, the translation of the grinding disc 1 within the plane containing its diameter. In one embodiment, the main controller unit 200 in the control device 20 can generate control commands based on control parameters and send them to the translational servo drive unit 203, which then controls the translational movement of the grinding disc 1.

[0058] The non-uniform oscillation of the trimming arm 4, the rotation of the grinding disc 1, and the translation of the grinding disc 1 are coupled together, causing the trimming head 6 to move on the grinding disc 1 in a non-periodic motion trajectory, thereby trimming the polishing pad carried on the grinding disc 1.

[0059] As can be seen, the control method of the CMP equipment provided in this application avoids the simple periodic repetitive motion of the dressing head 6 relative to the polishing pad 1 in the prior art. Instead, by controlling the non-uniform oscillation of the dressing arm 4 and coupling it with the rotation and translation of the polishing pad 1, the dressing head 6 forms a complex composite motion trajectory relative to the polishing pad 1. This ensures the uniformity of the dressing head 6 in dressing the polishing pad on the polishing pad 1. This coordinated motion ensures that the dressing head 6 can cover every area of ​​the surface of the polishing pad 1, effectively eliminating the dressing blind spots and over-dressing areas that exist when the dressing head 6 dresses the polishing pad on the polishing pad 1. This provides highly consistent surface conditions for the subsequent wafer polishing process and improves the global planarization effect of wafer processing.

[0060] Furthermore, when the dressing head 6 forms a relatively uniform dressing path on the grinding disc 1, this uniform dressing path avoids stress concentration and excessive wear in localized areas of the dressing head, resulting in more even wear of the dressing head 6 across the entire working surface. This prevents localized failures such as groove formation on the grinding disc 1. Consequently, the replacement cycle of the dressing head 6 is significantly extended, reducing spare parts consumption and maintenance frequency, thereby lowering production and operating costs. Simultaneously, the uniform dressing also extends the service life of the grinding disc 1 itself, bringing dual economic benefits.

[0061] In one embodiment, the step S102 provided in the above embodiment, which controls the trimming arm to move in a non-uniform swing manner based on control parameters, specifically includes: controlling the angular velocity of the trimming arm to change non-uniformly based on control parameters, so that the trimming arm moves in a non-uniform swing manner.

[0062] In this embodiment, the control parameters include the angular frequency w_val. Specifically, the main controller unit 200 in the control device 20 can substitute the angular frequency w_val into the formula for the angular velocity function to determine the angular velocity function of the trimming arm 4, and then control the non-uniform change of the angular velocity of the trimming arm 4 according to the determined angular velocity function.

[0063] In one embodiment, the angular velocity function includes a time-varying sinusoidal modulation function. For example, the sinusoidal modulation function can be expressed by the formula ω_arm(t)=k*A*ω_val*sin(ω_val(t-T_stationary)), where k is the modulation coefficient, A is the oscillation amplitude, and T_stationary is the initial stationary duration. Preferably, the angular displacement amplitude A can be 18 degrees, the angular frequency coefficient ω_val can be 2π / 60 rad / s, the modulation coefficient k can be 0.5, and the total motion period T_total can be 80 seconds.

[0064] In one embodiment, the control parameters include the translation period T_move. Then, the control of the grinding disk 1 rotation based on the control parameters in S102 provided in the above embodiment specifically includes: determining the translation function of the grinding disk 1 according to the translation period, and then controlling the rotation of the grinding disk 1 according to the determined translation function.

[0065] In one embodiment, the translation function includes a time-varying sine function, for example, the sine function can be expressed by the formula D_x(t)=D_max*sin(πt / T_move), where D_max is the maximum displacement, preferably D_max can be 40mm, and the translation period T_move can be 60 seconds.

[0066] In one embodiment, the control parameter includes angular velocity ω_disk. Preferably, the angular velocity ω_disk can be (30*2*π) / 60 rad / s. Therefore, the control of the grinding disk 1's rotational motion based on the control parameter in S102 of the above embodiment specifically includes: controlling the grinding disk 1's rotational motion according to the angular velocity ω_disk.

[0067] In one embodiment, when the control device 20 controls the dressing head 6 in the CMP equipment to dress the grinding disc 1, it can also acquire the motion parameters of the dressing arm 4 and the grinding disc 1. The motion parameters include angle, position, speed, etc., and the control parameters are adjusted according to the motion parameters to ensure that the dressing head 6 moves more uniformly on the grinding disc 1 with a non-periodic motion trajectory. This achieves dynamic adjustment of the swing angle of the dressing arm 4 and the translation speed of the grinding disc 1, forming a closed-loop feedback system to reduce the influence of external environment on the motion deviation between the dressing arm 4 and the grinding disc 1, maintain the motion synchronization between the dressing arm 4 and the grinding disc 1, and make the parameters self-tuned to the optimal parameters, thereby ensuring the uniformity and coverage stability when dressing the grinding disc 1.

[0068] In one embodiment, the control device 20 also includes an industrial camera. The industrial camera can be used to acquire images of the surface of the grinding disc 1 in real time and send them to the main controller unit 200 when the dressing head 6 in the CMP equipment is dressing the polishing pad carried on the grinding disc 1. This allows the main controller unit 200 to determine the state of the surface of the grinding disc 1 based on the images, and then determine the target motion path and pressure of the dressing head 6 based on the current state. Based on the target motion path, the main controller unit 200 controls the movement of the dressing arm 4 and the grinding disc 1 to achieve more automated adaptive adjustment, which is especially suitable for working conditions where the polishing pad has uneven wear.

[0069] When controlling the trimming head 6 based on images captured by an industrial camera, the control device 20 may temporarily disregard the following procedure. Figure 1 The method shown controls the movement of the trimming arm and grinding disc based on control parameters, rather than based on the motion path determined by the image.

[0070] In one embodiment, such as Figure 2 The control device 20 shown also includes:

[0071] The human-machine interface unit 206 is used to display system status, simulation results, etc., and allows operators to input parameters and control the start or stop of the trimming process. Specifically, the human-machine interface unit 206 can be used to preset and initialize all motion parameters to obtain the complete formula of the entire trimming process. Furthermore, the status and results of the entire process are uniformly provided by the human-machine interface unit 206, enabling operators to intuitively grasp the trimming progress, motion status, and process effects, and to perform effect evaluation after the coverage analysis unit is completed, providing decision support for subsequent process parameter optimization.

[0072] In one embodiment, the operator can also control the start and stop of the trimming operation through the human-machine interface unit 206. For example, when a pause is needed, the operator issues a command through the human-machine interface unit 206. The main controller unit 200 detects the signal change, immediately stops the motion output of each driver, and records the pause start time. In the paused state, the main controller unit 200 continuously accumulates the pause time. In the non-paused state, the main controller unit 200 dynamically refreshes the real-time angle of the trimming arm, the actual position of the grinding disc, and the remaining time for the trimming process. When switching between motion phases, such as from a stationary phase to a trimming motion phase, or from a translational phase to a stationary phase, the relevant motion parameters are automatically reset to ensure the independence of each motion phase.

[0073] The motion trajectory simulation unit 204 can be used to calculate the real-time motion trajectory of the dressing head 6 in the coordinate system where the grinding disc 1 is located, and the real-time motion trajectory can be visualized through the human-computer interaction interface unit 206.

[0074] The coverage analysis unit 205 is used to statistically analyze the real-time motion trajectory of the trimming head 6, calculate key performance indicators such as uniformity and coverage, and generate visualization content such as the coverage number distribution map, which is presented through the human-computer interaction interface unit 206.

[0075] In a specific implementation, such as Figure 2 When the control device 20 shown executes the control method, the human-machine interface unit 206 receives the input process parameters and inputs all parameter settings to the main controller unit 200.

[0076] The main controller unit 200 serves as the core of the system and outputs the calculated control commands to the swing arm servo driver unit 201, the rotary servo driver unit 202, and the translational servo driver unit 203, respectively.

[0077] The swing arm servo driver unit 201 receives angle or speed commands from the main controller unit 200, driving and controlling the trimming arm 4 to perform precise swinging motion. The real-time angular position of the trimming arm 4 is fed back to the swing arm servo driver unit 201 via an encoder, forming a position closed-loop control to ensure motion accuracy.

[0078] The rotary servo drive unit 202 receives a constant speed command from the main controller unit 200, drives the rotary drive structure 2 to rotate, and in turn drives the grinding disc 1 to rotate at a constant speed. The real-time speed and position of the grinding disc 1 are fed back to the rotary servo drive unit 202 through an encoder, forming a speed closed-loop control.

[0079] The translation servo driver unit 203 receives sinusoidal motion trajectory commands from the main controller unit 200 and drives the translation drive structure 3 to perform precise linear motion. The translation drive structure 3 drives the entire grinding disc module to translate. The real-time position feedback of the translation drive structure 3 is fed back to the translation servo driver unit 203, forming a position closed-loop control.

[0080] The main controller unit 200 receives feedback data from the swing arm servo driver unit 201, the rotary servo driver unit 202, and the translational servo driver unit 203 in real time, performs coordinated motion calculations and synchronous status monitoring, and ensures that the motion trajectory of the trimming head 6 relative to the grinding disc 1 conforms to the plan.

[0081] The motion trajectory simulation unit 207 obtains real-time motion data from the main controller unit 200. The motion data includes the trimming arm angle, the grinding disc position and rotation angle. It calculates the theoretical motion trajectory of the trimming head 6 in the coordinate system of the grinding disc 1 and provides the trajectory data to the human-machine interface unit 206 for real-time display.

[0082] After a trimming cycle is completed, the motion data of the entire cycle from the main controller unit 200 is sent to the coverage analysis unit 205. The coverage analysis unit 205 performs coverage statistics and uniformity calculations, and provides the analysis results to the human-machine interface unit 206. Finally, the human-machine interface unit 206 summarizes and displays the real-time trajectory from the motion trajectory simulation unit 204 and the trimming effect report from the coverage analysis unit 205, outputting or displaying all information to the operator. The operator then completes the entire trimming control process by optimizing the process parameters.

[0083] For example, Figure 4 This is a schematic diagram of the first type of visualization provided in this application, showing the swing curve of the trimming arm 4 in a CMP device. The upper gray line indicates the rotational speed of the trimming arm 4, specifically the change in rotational speed (RPM) over time. The lower orange line indicates the change in the position of the trimming head 6 driven by the trimming arm 4 over time.

[0084] Figure 5The second type of visualization provided in this application is illustrated in the diagram, which shows the change of motion parameters of the trimming arm 4 in the CMP equipment over time. The motion parameters include swing angle, angular velocity, and angular acceleration. The swing angle is represented by the blue curve in the diagram, in degrees; the angular velocity is represented by the red curve in the diagram, in rad / s; and the angular acceleration is represented by the green curve in the diagram, in rad / s. 2 .

[0085] Figure 6 The diagram illustrates a third type of visualization provided in this application, showing the number of cleaning cycles performed by the dressing head 6 at different radii on the grinding disc 1 in a CMP device, represented by a bar chart.

[0086] Figure 7 The fourth type of visualization provided in this application is illustrated in a dot plot, showing the number of cleaning cycles of the dressing head 6 at different radii on the grinding disc 1 in the CMP equipment.

[0087] exist Figure 6 and Figure 7 The content shown specifically illustrates the number of cleaning cycles of the trimming head 6 at different radius positions on the grinding disc 1 within a radius range of 0-250mm. It can be seen that, through the control method provided in this application, the running trajectory of the trimming head 6 on the grinding disc 1 is relatively uniform, and therefore the number of cleaning cycles at different radius positions is relatively close.

[0088] Figure 8 The schematic diagram of the fifth type of visualization provided in this application shows the motion trajectory distribution of the trimming head 6 on the plane of the grinding disk 1 in the CMP equipment. It can be analyzed within a 100-second cycle. The coverage of the trimming head 6 on the plane of the grinding disk 1 is 100%, achieving coverage of the entire plane of the grinding disk 1, and the uniformity is 0.81, thereby effectively improving the global planarization effect of wafer processing.

[0089] In one embodiment, the control method provided in this application, when the control device 20 controls the movement of the trimming arm 4 and the grinding disc 1 based on control parameters, specifically includes the following aspects in controlling the non-uniform oscillation of the trimming arm, the rotational movement of the grinding disc, and the translational movement:

[0090] Before the first target moment in the entire trimming cycle, the trimming arm 4 is controlled to stop swinging; and after the first target moment in the entire trimming cycle, the trimming arm 4 is controlled to move in a non-uniform swinging manner.

[0091] Furthermore, before the second target time within the entire trimming cycle, the grinding disk 1 is controlled to translate; and after the second target time within the entire trimming cycle, the grinding disk 1 is controlled to stop translating.

[0092] Furthermore, the rotation of the grinding disc 1 is controlled throughout the entire finishing process.

[0093] This embodiment provides the stopping and starting of the swing motion of the trimming arm 4 and the stopping and starting of the translation motion of the grinding disk 1, which further enables the trimming head 4 to form a more complex motion trajectory on the grinding disk 1, thereby further improving the global planarization effect of subsequent wafer processing.

[0094] For example, if the entire repair cycle is 60 seconds, then the first target time can be 20 seconds and the second target time can be 50.8 seconds.

[0095] For example, Figure 9 A flowchart illustrating another embodiment of the control method for the CMP device provided in this application is shown below. Figure 9 As shown, when the control device 20 controls the movement of the trimming arm 4 and the grinding disc 1 based on the control parameters, the trimming process is performed on the polishing pad carried on the grinding disc 1, assuming the trimming cycle is 60 seconds.

[0096] After the control device 20 determines the control parameters, if the current time t is less than the first target time of 20 seconds, the control device 20 controls the trimming arm 4 to stop swinging. If the current time t is not less than the first target time of 20 seconds, the control device 20 controls the trimming arm 4 to perform non-uniform motion and maintain the position of the trimming head.

[0097] If the current time t is less than the second target time of 50.8 seconds, the control device 20 controls the grinding disc 1 to move in translation; if the current time t is not less than the second target time of 50.8 seconds, the control device 20 controls the grinding disc 1 to stop moving in translation.

[0098] Throughout the entire trimming cycle, the control device 20 controls the rotation of the grinding disc 1, causing the non-uniform oscillation of the trimming arm 4, the rotation of the grinding disc 1, and the translational motion to couple together to form a composite motion. The motion trajectory simulation unit 204 can be used to perform trajectory calculation, thereby displaying the motion state of the trimming head 6 relative to the trimming arm 4 in real time through the human-machine interface unit 206.

[0099] If the current time t is greater than 60 seconds, after the entire trimming cycle is completed, the coverage analysis unit 205 can be used to perform coverage analysis and display the trimming results through the human-computer interaction interface unit 206.

[0100] Figure 10 A schematic diagram of the sixth type of visualization content provided in this application is shown, wherein a diagram based on Figure 9The diagram illustrates the changes in motion parameters of the trimming arm 4 in the CMP equipment over time when controlled by the control method shown. The motion parameters include swing angle, angular velocity, and angular acceleration. The swing angle is represented by the blue curve in the diagram, in degrees. Referring to the left vertical axis, the swing angle ranges from 100 to 130 degrees. The angular velocity is represented by the red curve in the diagram, in rad / s. Referring to the right vertical axis, the angular velocity ranges from -0.015 rad / s to 0.015 rad / s. The angular acceleration is represented by the green curve in the diagram, in rad / s. 2 Referring to the vertical axis position on the right side of the diagram, the angular acceleration range is -0.015 rad / s². 2 -0.015 rad / s 2 between.

[0101] Combination Figure 9 The control method shown assumes that the initial angle of the trimming arm 4 is 120 degrees and the stroke is 18 degrees. Before the first target time of 20 seconds, the trimming arm 4 is in a stopped swinging state, while after the first target time of 20 seconds, the trimming arm 4 is in a non-uniform motion state.

[0102] Figure 11 A schematic diagram of the seventh type of visualization content provided in this application illustrates a method based on... Figure 9 When the control method shown controls the CMP equipment, the motion trajectory distribution of the trimming head 6 on the plane of the grinding disk 1 can be analyzed within an 80-second cycle. The coverage rate of the trimming head 6 on the plane of the grinding disk 1 is 99.8%, achieving a high coverage rate of the grinding disk 1, and the uniformity is 0.823, thereby effectively improving the global planarization effect of wafer processing.

[0103] Figure 12 This is a schematic diagram of the first state of the trimming arm provided in this application, showing a relative position diagram of the trimming arm 4 translated to the center position relative to the grinding disc 1.

[0104] Figure 13 This is a schematic diagram of the second state of the trimming arm provided in this application, showing a relative position diagram of the trimming arm 4 translated to the outer position relative to the grinding disc 1.

[0105] Figure 14 This is a schematic diagram of the third state of the trimming arm provided in this application, showing a relative position diagram of the trimming arm 4 being translated to the inner position relative to the grinding disc 1.

[0106] It should be noted that, Figures 12-14The relative position between the dressing arm 4 and the grinding disc 1 shown is only an example. This application can also be applied to other CMP equipment, and this application does not limit the relative position between the dressing arm 4 and the grinding disc 1.

[0107] Furthermore, in the foregoing embodiments of this application, a method for controlling the relative movement of the trimming arm 4 and the polishing disc 1 is provided. However, in actual practice, when the trimming arm 4 and the polishing disc 1 move relative to each other in different ways, it may affect the polishing process of the wafer by the polishing disc 1 in the CMP equipment, thus affecting the basic function of the CMP equipment. Therefore, in one embodiment of this application, during the trimming process of the polishing pad on the polishing disc 1 by the CMP equipment, when the trimming head 6 moves to a distance less than a preset distance from the polishing head 10 while the trimming arm 4 and the polishing disc 1 are moving relative to each other, the control device 20 also controls the polishing head 10 to move a certain distance in the opposite direction to the trimming head 6, so as to increase the distance between the trimming head 6 and the polishing head 10, thereby preventing the trimming process of the trimming head 6 from affecting the normal polishing process of the wafer below the polishing head 10. While ensuring the normal polishing process of the wafer by the CMP equipment, the trimming process of the polishing pad carried on the polishing disc 1 in this application is also taken into account. It is understood that both the preset distance and the certain distance of movement can be set. After the trimming head 6 has moved for a certain period of time, or after the trimming head 6 has moved to a distance greater than another preset distance from the polishing head 10, the control device 20 can also control the polishing head 10 to move back to its initial position to ensure normal polishing of the wafer. In a specific implementation, the CMP equipment can add a moving structure to the polishing head 10 that is the same as the trimming arm 4, called a polishing head arm, etc. The control device 20 can control the direction and distance of movement of the polishing head 10 by controlling the rotation of the polishing head arm.

[0108] In the foregoing embodiments of this application, a control method for a CMP device provided by the embodiments of this application has been described. To implement the functions of the methods provided by the embodiments of this application, the control device, as the execution subject, can implement the above functions through hardware structures and / or software modules. Whether a particular function is executed through hardware structures, software modules, or a combination of hardware structures and software modules depends on the specific application and design constraints of the technical solution.

[0109] For example, the control device can be such as Figure 3 The structure shown. For example, Figure 15 A schematic diagram of an embodiment of the control device for a CMP device provided in this application is shown below. Figure 15The control device 1000 shown includes a determining module 1001 and a control module 1002. The determining module 1001 is used to determine the control parameters of the dressing arm and the polishing disc in the CMP equipment; the control module 1002 is used to control the movement of the dressing arm and the polishing disc based on the control parameters, so that the dressing head on the dressing arm performs dressing processing on the polishing pad carried on the polishing disc.

[0110] like Figure 15 The specific implementation method and principle of the control device 1000 of the CMP equipment shown can be referred to the control method of the corresponding CMP equipment mentioned above. The implementation method and principle are the same and will not be repeated here.

[0111] It should be understood that the division of the various modules in the above device is merely a logical functional division. In actual implementation, they can be fully or partially integrated into a single physical entity, or they can be physically separated. Furthermore, these modules can be implemented entirely in software via processing element calls; they can be fully implemented in hardware; or some modules can be implemented by processing element calls to software, while others are implemented in hardware. For example, a module can be a separately established processing element, or it can be integrated into a chip within the above device. Alternatively, it can be stored as program code in the memory of the above device, and its functions can be called and executed by a processing element of the device. The implementation of other modules is similar. Moreover, these modules can be fully or partially integrated together, or they can be implemented independently. The processing element here can be an integrated circuit with signal processing capabilities. In the implementation process, each step of the above method or each of the above modules can be completed through integrated logic circuits in the hardware of the processor element or through software instructions.

[0112] For example, these modules can be one or more integrated circuits configured to implement the above methods, such as one or more application-specific integrated circuits (ASICs), one or more digital signal processors (DSPs), or one or more field-programmable gate arrays (FPGAs). As another example, when a module is implemented using processing element scheduler code, the processing element can be a general-purpose processor, such as a central processing unit (CPU) or other processor capable of calling program code. Furthermore, these modules can be integrated together to implement a system-on-a-chip (SOC).

[0113] In the above embodiments, implementation can be achieved, in whole or in part, through software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, as a computer program product. A computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the flow or function according to the embodiments of this application is generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid-state disk (SSD)).

[0114] For example, Figure 16 A schematic diagram of the structure of an embodiment of the electronic device provided in this application is shown below. Figure 16 The electronic device 2000 shown can be used to execute the control method of any CMP device of this application.

[0115] In one embodiment, such as Figure 16 The control device 2000 shown includes one or more processors 2001 and a memory 2002. The memory 2002 stores computer-executable instructions, and the processor 2001 can execute the computer-executable instructions stored in the memory 2002. When the computer-executable instructions are executed by the processor 2001, the processor 2001 implements the control method of any CMP device as described in the foregoing embodiments of this application.

[0116] In one embodiment, such as Figure 16 The control device 2000 shown also includes a communication interface 2003, through which the processor 2001 can communicate with other devices, such as sending and receiving data through the communication interface 2003.

[0117] In the above embodiments, it should be understood that the processor can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), etc. The general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in this invention can be directly implemented by a hardware processor, or implemented by a combination of hardware and software modules within the processor.

[0118] The memory may include random access memory (RAM) and may also include non-volatile memory (NVM), such as at least one disk storage device.

[0119] The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized as address buses, data buses, control buses, etc. For ease of illustration, the buses shown in the accompanying drawings are not limited to a single bus or a single type of bus.

[0120] This application also provides a chip for executing instructions, which is used to execute the control method of any of the CMP devices described above.

[0121] This application also provides a computer program product, including a computer program that, when executed, implements a control method for any of the CMP devices described above.

[0122] This application also provides a computer-readable storage medium storing computer-executable instructions, which, when executed, can be used to implement a control method for any of the CMP devices described above.

[0123] The aforementioned readable storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk. The readable storage medium can be any available medium accessible to a general-purpose or special-purpose computer.

[0124] An exemplary readable storage medium is coupled to a processor, enabling the processor to read information from and write information to the readable storage medium. Of course, the readable storage medium can also be a component of the processor. The processor and the readable storage medium can reside in an Application Specific Integrated Circuit (ASIC). Alternatively, the processor and the readable storage medium can exist as discrete components in the device.

[0125] The division of units is merely a logical functional division; in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0126] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0127] In addition, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0128] If a function is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0129] Those skilled in the art will understand that all or part of the steps of the above-described method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When executed, the program performs the steps of the above-described method embodiments; and the aforementioned storage medium includes various media capable of storing program code, such as ROM, RAM, magnetic disks, or optical disks.

[0130] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A control method for a CMP device, characterized in that, include: Determine the control parameters of the dressing arm and grinding disc in the CMP equipment; The movement of the trimming arm and the grinding disc is controlled based on the control parameters, so that the trimming head on the trimming arm trims the polishing pad carried on the grinding disc. The step of controlling the movement of the trimming arm and the polishing disc based on the control parameters includes: controlling the trimming arm to move in a non-uniform swing manner, controlling the rotation of the polishing disc, and controlling the translation of the polishing disc based on the control parameters. The non-uniform swing of the trimming arm, the rotation of the polishing disc, and the translation of the polishing disc are coupled to each other, so that the trimming head trims the polishing pad carried on the polishing disc with a non-periodic motion trajectory. The control parameters include angular frequency, and controlling the trimming arm to move in a non-uniform oscillating manner based on the control parameters includes: Based on the angular frequency, the angular velocity function of the trimming arm is determined. The angular velocity function includes a sinusoidal modulation function that varies with time. Based on the angular velocity function, the angular velocity of the trimming arm is controlled to change non-uniformly, so that the trimming arm moves in a non-uniform swinging manner. The control of the trimming arm to move in a non-uniform swing manner includes: controlling the trimming arm to stop swinging before a first target time within the entire trimming cycle of the trimming process; and controlling the trimming arm to move in a non-uniform swing manner after the first target time within the entire trimming cycle of the trimming process. The control parameters include a translation period. Therefore, controlling the translation movement of the grinding disc based on the control parameters includes: determining a translation function of the grinding disc according to the translation period, the translation function including a sine function that varies with time; and controlling the translation movement of the grinding disc according to the control parameters based on the translation function. The control of the translational movement of the grinding disc includes: controlling the translational movement of the grinding disc before the second target time within the entire trimming cycle of the trimming process; and controlling the grinding disc to stop translating after the second target time within the entire trimming cycle of the trimming process.

2. The method according to claim 1, characterized in that, The control parameters include angular velocity, so controlling the rotation of the grinding disc based on the control parameters includes: The grinding disc is rotated according to the angular velocity.

3. The method according to any one of claims 1-2, characterized in that, Also includes: During the trimming process, the motion parameters of the trimming arm and the grinding disc are acquired, and the control parameters are adjusted according to the motion parameters to ensure that the trimming head moves more evenly on the grinding disc in a non-periodic motion trajectory. And / or, during the trimming process, an image of the grinding disc is acquired, and based on the image, a target motion path of the trimming head is determined, and the movement of the trimming arm and the grinding disc is controlled based on the target motion path.

4. The method according to claim 1, characterized in that, Also includes: During the trimming process, when the distance between the trimming head and the polishing head is less than a preset distance, the polishing head is controlled to move to increase the distance between the trimming head and the polishing head, so as to prevent the trimming process of the trimming head from affecting the polishing process of the wafer.

5. A control device for CMP equipment, characterized in that, include: The determination module is used to determine the control parameters of the dressing arm and the grinding disc in the CMP equipment; A control module is used to control the movement of the trimming arm and the polishing disc based on the control parameters, so that the trimming head provided on the trimming arm trims the polishing pad carried on the polishing disc; wherein, controlling the movement of the trimming arm and the polishing disc based on the control parameters includes: controlling the trimming arm to move in a non-uniform oscillating manner, controlling the rotational movement of the polishing disc, and controlling the translational movement of the polishing disc based on the control parameters, wherein the non-uniform oscillation of the trimming arm, the rotational movement of the polishing disc, and the translational movement are coupled to each other, so that the trimming head trims the polishing pad carried on the polishing disc on the polishing disc with a non-periodic motion trajectory; The control parameters include angular frequency, and the control module is specifically used to: determine the angular velocity function of the trimming arm according to the angular frequency, the angular velocity function including a sinusoidal modulation function that varies with time, and control the angular velocity of the trimming arm to change non-uniformly according to the angular velocity function, so that the trimming arm moves in a non-uniform swinging manner. The control module is specifically used to: control the trimming arm to stop swinging before the first target time in the entire trimming cycle of the trimming process; and control the trimming arm to move in a non-uniform swinging manner after the first target time in the entire trimming cycle of the trimming process. The control parameters include a translation period, and the control module is specifically used to: determine the translation function of the grinding disc according to the translation period, wherein the translation function includes a sine function that varies with time; and control the translation movement of the grinding disc according to the control parameters based on the translation function. The control module is specifically used to: control the grinding disc to translate before the second target time within the entire trimming cycle of the trimming process; and control the grinding disc to stop translating after the second target time within the entire trimming cycle of the trimming process.

6. An electronic device, characterized in that, include: A processor, and a memory communicatively connected to the processor; The memory stores computer-executed instructions; The processor executes computer execution instructions stored in the memory to implement the method as described in any one of claims 1-4.

7. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, are used to implement the method as described in any one of claims 1-4.

8. A computer program product, characterized in that, Includes a computer program that, when executed by a processor, implements the method as described in any one of claims 1-4.

Images