Manufacturing method of epoxy resin, glass fiber reinforced laminated board and manufacturing method of glass fiber reinforced laminated board

Abstract

The invention discloses an epoxy resin preparation method, which comprises: weighing a first epoxy resin raw material, a second epoxy resin raw material, a strong polar solvent, a weak polar solvent, a catalyst, a coupling agent, a filler and a curing agent according to a formula, stirring the strong polar solvent at a preset first temperature, adding the curing agent, and uniformly stirring to obtain a first solution; stirring the first solution, sequentially and slowly adding a weak polar solvent and a first epoxy resin raw material, and uniformly stirring to obtain a second solution; stirring the second solution at a preset second temperature, sequentially and slowly adding a second epoxy resin raw material, a catalyst, a coupling agent and a filler, and uniformly stirring to obtain a third solution; dispersing the third solution at high speed for a preset time period to obtain epoxy resin. The epoxy resin and glass fiber reinforced laminated board is prepared from the resin raw materials with the molecular weight ranges of 800-1500 and 100-800, so that the preparation cost of the epoxy resin and glass fiber reinforced laminated board is reduced, and the performance of the prepared product is optimized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of polymer-based composite materials, and in particular to a manufacturing method of epoxy resin and a glass fiber reinforced laminate and a manufacturing method thereof. BACKGROUND

[0002] F-grade insulation composite materials (usually made of glass fiber cloth reinforced organic polymers, with excellent mechanical strength and electrical properties, including epoxy resin-based glass fiber reinforced laminates meeting NEMAG11 standards) have become key materials for strategic industries such as aerospace, high-end equipment manufacturing, new energy, electronics and electrical equipment due to their excellent designability, excellent insulation performance, high specific strength, high specific modulus and corrosion resistance.

[0003] There are two major problems with F-grade insulation composite materials on the market today: the temperature resistance level of some products basically meets the standard requirements, but the overall performance is difficult to meet the actual application requirements, which is manifested in insufficient interlaminar bonding strength, poor machining performance, and defects such as delamination and cracking during processing, resulting in high product scrap rate; the cost of core raw materials is high, directly pushing up the overall product cost, and the manufacturing cycle is long, the energy consumption is high, and the equipment occupation time is long. The above problems together cause the industry dilemma of "not dare to use and not affordable". SUMMARY

[0004] The main purpose of the present application is to solve the technical problems as described in the background.

[0005] To achieve the above-mentioned purpose, in a first aspect, the present application provides a manufacturing method of epoxy resin, comprising: According to the formula, the first epoxy resin raw material, the second epoxy resin raw material, the strong polar solvent, the weak polar solvent, the catalyst, the coupling agent, the filler and the curing agent are weighed, the strong polar solvent is stirred at a preset first temperature, the curing agent is added and stirred uniformly to obtain a first solution; Stir the first solution, slowly add the weak polar solvent and the first epoxy resin raw material in turn, and stir uniformly to obtain a second solution; Stir the second solution at a preset second temperature, slowly add the second epoxy resin raw material, the catalyst, the coupling agent and the filler in turn, and stir uniformly to obtain a third solution; After high-speed dispersion of the third solution for a preset period of time, an epoxy resin is obtained.

[0006] In one of the embodiments, the formula includes the following components by weight: 28-35 parts of a first epoxy resin raw material with a molecular weight range of 800-1500, 65-72 parts of a second epoxy resin raw material with a molecular weight range of 100-800, 25 parts of a strong polar solvent, 30 parts of a weak polar solvent, 0.3-0.7 parts of a catalyst, 0.1-0.3 parts of a coupling agent, 50-100 parts of a filler, and 3-10 parts of a curing agent.

[0007] In one of the embodiments, the preset first temperature is 30℃±2, and the preset second temperature is 35℃±2.

[0008] In one of the embodiments, the step of obtaining the epoxy resin by high-speed dispersing the third solution for a preset period of time can be replaced by: high-speed dispersing the third solution for a preset period of time, and maintaining the temperature at a second preset temperature by passing water during the dispersing process to obtain the epoxy resin.

[0009] In one of the embodiments, after the step of obtaining the first solution by stirring the strong polar solvent at a preset first temperature and adding the curing agent to stir uniformly, the method further includes: sampling the first solution to obtain a sample, irradiating the sample with strong light, and obtaining a test result of the sample.

[0010] In one of the embodiments, the preset period of time is 60 minutes.

[0011] In a second aspect, the present application further provides a glass fiber reinforced laminated board, which is based on an epoxy resin and uses a glass fiber cloth as a reinforcing material, and the epoxy resin is made according to the method for making the epoxy resin of any one of the first aspect.

[0012] In a third aspect, the present application further provides a method for making the glass fiber reinforced laminated board according to the second aspect, which includes: immersing the glass fiber cloth in the epoxy resin for infiltration treatment, and then performing baking treatment to obtain a semi-finished product pp; cutting the semi-finished product according to a preset size, then arranging the cut semi-finished product according to a preset plate thickness configuration and performing hot pressing to obtain a laminated board blank; removing burrs of the laminated board blank to obtain the glass fiber reinforced laminated board.

[0013] In one of the embodiments, the step of removing the burrs of the laminated board blank to obtain the glass fiber reinforced laminated board can be replaced by: processing the laminated board blank according to a preset shape to obtain the glass fiber reinforced laminated board.

[0014] The epoxy resin is prepared by mixing the resin with a molecular weight of 800-1500 and the resin with a molecular weight of 100-800, and the two resin raw materials can be selected from domestic resins, so that the interlayer bonding performance of the prepared glass fiber reinforced laminated board is excellent, similar to the A-level and B-level (Tg 100-130 DEG C) products (the A-level product and the B-level product refer to the electrical insulation materials classified according to the "heat resistance level", the core difference lies in that the maximum long-term allowable working temperature is different, and both are lower than the F-level (G11 composite material) aimed at by the present application), the machining performance is good, and the machining process such as turning, milling, drilling and grinding can be borne, the fatal defect of the existing product is overcome, at the same time, by using domestic materials, the cost is low, the source is wide, and the goods supply is sufficient, so that the batch safe production is ensured, the material and product cost is reduced, the energy consumption and machine time occupation are greatly reduced by nearly 60%, the electric energy consumption is saved by 65% per machine, and the machine time occupation is shortened by 6 hours. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced below, and it should be understood that the following drawings only show some embodiments of the present application, and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0016] Figure 1 The flowchart of the preparation method of the epoxy resin in an embodiment of the present application is shown in the figure. Figure 2 The flowchart of the preparation method of the glass fiber reinforced laminated board in an embodiment of the present application is shown in the figure. Figure 3 The dielectric loss-temperature spectrum of the glass fiber reinforced laminated board in an embodiment of the present application is shown in the figure. Figure 4 The dielectric loss-temperature spectrum of the glass fiber reinforced laminated board in an embodiment of the present application is shown in the figure. Figure 5 The dielectric loss-temperature spectrum of the glass fiber reinforced laminated board in an embodiment of the present application is shown in the figure. Figure 6 The dielectric loss-temperature spectrum of the glass fiber reinforced laminated board in an embodiment of the present application is shown in the figure. DETAILED DESCRIPTION

[0017] For a better understanding of the above technical solutions, the exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure can be more thoroughly understood and the scope of the present disclosure can be accurately conveyed to those skilled in the art.

[0018] It should be understood that the specific embodiments described herein are merely intended to explain the present application and not to limit the present application.

[0019] It should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the coordinate system shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0020] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixing" and the like should be understood broadly, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0021] In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0022] In a first aspect, with reference to Figure 1 The present application provides a method for manufacturing an epoxy resin, comprising: S110, according to the formula, the first epoxy resin raw material, the second epoxy resin raw material, the strong polar solvent, the weak polar solvent, the catalyst, the coupling agent, the filler and the curing agent are weighed, the strong polar solvent is stirred at a preset first temperature, the curing agent is added and stirred uniformly to obtain a first solution; The formula includes the following weight components: 28-35 parts of a first epoxy resin raw material with a molecular weight range of 800-1500, 65-72 parts of a second epoxy resin raw material with a molecular weight range of 100-800, 25 parts of a strong polar solvent, 30 parts of a weak polar solvent, 0.3-0.7 parts of a catalyst, 0.1-0.3 parts of a coupling agent, 50-100 parts of a filler, and 3-10 parts of a curing agent. The preset first temperature is 30℃±2, the preset second temperature is 35℃±2, and the uniform stirring time is usually set to 120min. The stirring time is set according to the formula requirements and is not limited here. For example, the first epoxy resin raw material includes NPES304, NPES909H, and NPES909, or a composite of two or more resins, the second epoxy resin raw material includes NPPN631, NPPN638, NPEL115, and NPEL128S, or a composite of two or more, the strong polar solvent is ethylene glycol monomethyl ether, furan, or dimethylformamide, etc., the weak polar solvent is toluene, butanone, acetone, ethylene glycol dimethyl ether, ethyl acetate, butyl acetate, or propyl acetate, etc., the catalyst is a tertiary amine catalyst, such as dimethylbenzylamine, 2-methylimidazole, ethylimidazole, methylethylimidazole, or boron trifluoride ethylamine, etc., the coupling agent is KH550, KH560, KH570, or KH792, etc., and the filler is a metal / ceramic oxide, such as calcium carbonate, silicon oxide, aluminum oxide, or magnesium oxide.

[0023] Specifically, the first epoxy resin raw material with a molecular weight range of 800-1500 is weighed in an amount of 28-35 parts, the second epoxy resin raw material with a molecular weight range of 100-800 is weighed in an amount of 65-72 parts, the strong polar solvent is 25 parts, the weak polar solvent is 30 parts, the catalyst is 0.3-0.7 parts, the coupling agent is 0.1-0.3 parts, the filler is 50-100 parts, and the curing agent is 3-10 parts. The strong polar solvent is stirred, and the curing agent is slowly added while the temperature is controlled at 30℃±2. After stirring for 120min, a first solution is obtained.

[0024] S120, the first solution is stirred, the weak polar solvent and the first epoxy resin raw material are slowly added in sequence, and a second solution is obtained after stirring uniformly. The uniform stirring time is usually set to 60min, and after the first epoxy resin raw material is added, the temperature is raised to the preset second temperature (35℃±2) and then stirred uniformly.

[0025] Specifically, the first solution is stirred, and then weak polar solvent is added and stirred for 30 min until uniform, and then the first epoxy resin raw material is slowly added, and the temperature is controlled at 35℃±2 after addition, and then the solution is stirred for 60 min to obtain a second solution.

[0026] S130, stirring the second solution at a preset second temperature, and then slowly adding the second epoxy resin raw material, the catalyst, the coupling agent and the filler in sequence, and then stirring until uniform to obtain a third solution. Specifically, the second solution is stirred, and then the second epoxy resin raw material is slowly added and the temperature is controlled at 35℃±2, and then the catalyst and the coupling agent are added under stirring, and then the solution is stirred for 120 min until all materials are dissolved to form a uniform transparent solution, and then the filler is slowly added under stirring, and then the solution is stirred for another 120 min to obtain a third solution. During the addition of the filler, pigments can be added simultaneously to obtain a third solution with a desired color.

[0027] S140, high-speed dispersion of the third solution for a preset period of time to obtain an epoxy resin.

[0028] The preset period of time is 60 min, and the obtained epoxy resin is in a solution state.

[0029] The step (S140) can be replaced by: high-speed dispersion of the third solution for a preset period of time, and water is passed through the temperature maintaining layer of the high-speed dispersion machine to maintain the temperature at a second preset temperature to obtain an epoxy resin.

[0030] Specifically, the third solution is transferred to a high-speed dispersion machine, the dispersion machine has a rotation speed of 800-1000 rpm, and the high-speed dispersion is performed for 60 min while the temperature is controlled at 35℃±2, and the epoxy resin is obtained. The temperature is controlled by passing water through the interlayer of the high-speed dispersion machine, which can uniformly and stably cool down compared with other cooling methods, and effectively control the reaction rate and heat release.

[0031] In the embodiment, the molecular weight of the first epoxy resin raw material ranges from 800 to 1500, the molecular weight of the second epoxy resin raw material ranges from 100 to 800, the bonding effect of the prepared epoxy resin is excellent, the low-molecular-weight epoxy resin raw material can improve the crosslinking density of the system, compress the molecular chain movement space, and directly ensure that the glass transition temperature (Tg) of the final resin is greater than or equal to 156.3°C, which is higher than the standard requirement that Tg is greater than or equal to 155°C; the high-molecular-weight epoxy resin raw material can retain the toughness of the epoxy resin, avoid material embrittlement caused by excessively high crosslinking density, and effectively solve the technical pain points of traditional high-heat-resistant resin "embrittlement and easy cracking" in normal temperature environment; the epoxy resin prepared by the formula can be used for a long time at about 150°C (which cannot be achieved and compared by A / B two-stage materials). The retention rate of mechanical properties such as tensile strength and bending strength of the epoxy resin at 155°C is greater than 70%, which is suitable for harsh scenes such as high-voltage electrical appliances and high-temperature environment structural parts. In addition, the coupling agent in the formula can strengthen the interfacial bonding force between the organic matter (epoxy resin) and the inorganic matter (filler / glass cloth), improve the wettability of the resin to the glass cloth and the interlayer adhesion, so that the subsequent laminated board can withstand processing such as milling, drilling and grinding, and avoid layering and scrapping during processing. The filler can reduce the cost of the system while adjusting the rigidity and dimensional stability of the resin, avoiding warping deformation caused by solidification shrinkage. Importantly, the above-mentioned materials are all domestic conventional chemical raw materials, which are widely available and abundant in supply, do not need to rely on high-priced imported resins or special additives, and can significantly reduce the cost of materials.

[0032] In one embodiment, after the step of stirring the strong polar solvent at a preset first temperature, adding the curing agent and stirring uniformly to obtain a first solution, further comprising: Sampling the first solution to obtain a sample, irradiating the sample with strong light, and obtaining a test result of the sample.

[0033] The transparent container includes a glass test tube, and the test result includes "uniform and transparent, no visible light scattering" and other phenomena. When the test result is "uniform and transparent, no visible light scattering", it proves that the first solution is qualified and the next step can be performed.

[0034] In the embodiment, the core component of the first solution is "strong polar solvent + curing agent", and the curing agent is a key component for subsequent cross-linking and curing of the epoxy resin. If the curing agent is not completely dissolved in the strong polar solvent, there are small particles or local concentration is uneven, it will directly cause the "cross-linking uneven" problem in the subsequent steps (adding first / second epoxy resin raw materials, additives, fillers), which will cause fatal performance defects of the subsequent glass fiber reinforced laminated board. The "strong light irradiation" can directly determine that the curing agent has been completely dissolved and there are no undissolved particles, which ensures the uniformity of the subsequent resin cross-linking reaction from the source, lays the foundation for the final product to meet the standards (Tg≥155℃, good machining performance, and overall performance meets the standards). At the same time, checking after this step can avoid batch differences, reduce the risk of chain failure, and reduce the consumption of invalid materials.

[0035] In addition, it should be understood that the strong polar solvent is used to dissolve the curing agent, and the addition of the weak polar solvent changes the solubility of the first solution. It should be noted that too much weak polar solvent can cause the curing agent to precipitate and crystallize. The catalyst is used to promote the reaction between the curing agent and the epoxy resin, making the epoxy resin change from thermoplastic to thermosetting. The coupling agent is used to modify the glass fiber cloth in the subsequent process (specifically, it builds an "organic-inorganic" interface bridge on the surface of the glass fiber cloth to form a transition layer), making the glass fiber cloth and the produced epoxy resin more closely combined.

[0036] In the embodiment, the core component of the first solution is "strong polar solvent + curing agent", and the curing agent is a key component for subsequent cross-linking and curing of the epoxy resin. If the curing agent is not completely dissolved in the strong polar solvent, there are small particles or local concentration is uneven, it will directly cause the "cross-linking uneven" problem in the subsequent steps (adding first / second epoxy resin raw materials, additives, fillers), which will cause fatal performance defects of the subsequent glass fiber reinforced laminated board. The "strong light irradiation" can directly determine that the curing agent has been completely dissolved and there are no undissolved particles, which ensures the uniformity of the subsequent resin cross-linking reaction from the source, lays the foundation for the final product to meet the standards (Tg≥155℃, good machining performance, and overall performance meets the standards). At the same time, checking after this step can avoid batch differences, reduce the risk of chain failure, and reduce the consumption of invalid materials.

[0037] In the embodiment, the core component of the first solution is "strong polar solvent + curing agent", and the curing agent is a key component for subsequent cross-linking and curing of the epoxy resin. If the curing agent is not completely dissolved in the strong polar solvent, there are small particles or local concentration is uneven, it will directly cause the "cross-linking uneven" problem in the subsequent steps (adding first / second epoxy resin raw materials, additives, fillers), which will cause fatal performance defects of the subsequent glass fiber reinforced laminated board. The "strong light irradiation" can directly determine that the curing agent has been completely dissolved and there are no undissolved particles, which ensures the uniformity of the subsequent resin cross-linking reaction from the source, lays the foundation for the final product to meet the standards (Tg≥155℃, good machining performance, and overall performance meets the standards). At the same time, checking after this step can avoid batch differences, reduce the risk of chain failure, and reduce the consumption of invalid materials.

[0038] In the embodiment, the core component of the first solution is "strong polar solvent + curing agent", and the curing agent is a key component for subsequent cross-linking and curing of the epoxy resin. If the curing agent is not completely dissolved in the strong polar solvent, there are small particles or local concentration is uneven, it will directly cause the "cross-linking uneven" problem in the subsequent steps (adding first / second epoxy resin raw materials, additives, fillers), which will cause fatal performance defects of the subsequent glass fiber reinforced laminated board. The "strong light irradiation" can directly determine that the curing agent has been completely dissolved and there are no undissolved particles, which ensures the uniformity of the subsequent resin cross-linking reaction from the source, lays the foundation for the final product to meet the standards (Tg≥155℃, good machining performance, and overall performance meets the standards). At the same time, checking after this step can avoid batch differences, reduce the risk of chain failure, and reduce the consumption of invalid materials. S210, placing the glass fiber cloth in the epoxy resin for soaking treatment, and then performing baking treatment to obtain a semi-finished product; In this step, one of the core links of "resin-reinforced material combination", can remove the volatile components such as solvents in the glass cloth / epoxy resin system, avoid the formation of bubbles, affect the crosslinking reaction of epoxy resin and curing agent (epoxy resin starts to change from thermoplastic to thermoset) and the chemical reaction of glass fiber cloth and coupling agent, give the semi-finished product certain mechanical strength and stiffness, avoid resin flowing or edge damage during subsequent cutting and stacking, baking process makes the semi-finished product PP epoxy resin and curing agent have a certain degree of reaction, a certain degree of crosslinking is generated, to prevent the resin from flowing due to hot pressing in the subsequent pressing process, also provides process feasibility for cutting, the reaction process accounts for 30-60% of the total reaction process, does not affect the depth of crosslinking in the subsequent hot pressing stage, reduces the deformation during hot pressing; After baking, the epoxy resin will reach a semi-cured state, and the semi-finished product is a semi-cured prepreg.

[0039] S220, according to the preset size, cutting the semi-finished product, then according to the preset plate thickness configuration, cutting the semi-finished product of corresponding layers and hot pressing to obtain a laminated plate blank; Specifically, according to the width and thickness of the glass fiber reinforced laminated plate to be made, the semi-finished product of the preset width is obtained by cutting, then the corresponding number of semi-finished products (corresponding to the thickness of the semi-finished product) is weighed, and then stacked, laid and loaded into the press for hot pressing. During the hot pressing process, the following procedures are followed: first stage, 130°C, 10MPa, 20min (hot pressing at 130°C and 10MPa for 20min); second stage, 150°C, 20MPa, 15min; third stage, 170°C, 35MPa, 15min; fourth stage, 170°C, 50MPa, 10min; fifth stage, 170°C, 50MPa, 240min; sixth stage, 50°C, 50MPa, 60min.

[0040] Based on the preset width of the finished product, the pre-cured finished product is cut to ensure the accuracy of the size and the flatness of the edge of the single semi-finished product; during the hot pressing process, the glass fiber cloth and the epoxy resin react completely, this process is precisely controlled by temperature, pressure and time in stages, which promotes the complete crosslinking of the epoxy resin and realizes the synergistic optimization of resin curing and interlayer bonding, which not only guarantees the core performance of the glass fiber reinforced laminated plate such as heat resistance and mechanical strength, but also solves the problems of processing deformation and interlayer defects.

[0041] S230, removing the burrs of the laminated plate blank to obtain a glass fiber reinforced laminated plate.

[0042] The blank edge can be milled by a vertical numerical control edge milling machine, and the edge milling amount is controlled to just remove the burr and keep the preset size, which can improve the appearance quality of the product, avoid the burr affecting the subsequent assembly and processing, directly adapt to various application scenarios, and reduce the secondary processing cost.

[0043] In addition, the step of removing the burr of the laminated plate blank to obtain the glass fiber reinforced laminated plate can be replaced by: According to the preset shape, the laminated plate blank is processed to obtain the glass fiber reinforced laminated plate.

[0044] According to the processing frame, the processing frame needs to be removed after processing, and according to the preset shape, the laminated plate blank can be accurately processed according to the application scene requirement, the overall system integration is improved, and the on-site secondary processing requirement is reduced.

[0045] In this embodiment, through the whole process optimization of glue dipping uniformity control, lamination pressure precision control and burr finishing, the performance of the glass fiber reinforced laminated plate is finally up to standard, the processing is adapted, the batch is stable, and the cost is controllable, which functions as described in the first aspect, which will not be repeated here.

[0046] Example 1: The formula of the epoxy resin is: the component of the first epoxy resin raw material is 28, the component of the second epoxy resin raw material is 72, the component of the curing agent is 6.3, the component of the filler is 65, the component of the catalyst is 0.3, the component of the coupling agent is 0.3, the component of the strong polar solvent is 25, and the component of the weak polar solvent is 30.

[0047] The Tg value of the glass fiber reinforced laminated plate with the epoxy resin made of the formula as the matrix is shown in the table as follows: Figure 3 The sampled sample flatness is good, and the carving is normal.

[0048] It should be noted that the Tg value is the glass transition temperature, which is the core performance index of the high polymer material, that is, the critical temperature of the material from “glass state” to “high elastic state”, and the Figures 3-6 The vertical coordinate represents the dielectric loss tangent tan theta, which reflects the energy loss degree of the material under the alternating current electric field (the larger the value, the more serious the heating), and the horizontal coordinate represents the test temperature temp (℃), which represents the environment temperature of the material.

[0049] Example 2: The formula of the epoxy resin is: the component of the first epoxy resin raw material is 30, the component of the second epoxy resin raw material is 70, the component of the curing agent is 6, the component of the filler is 65, the component of the catalyst is 0.3, the component of the coupling agent is 0.3, the component of the strong polar solvent is 25, and the component of the weak polar solvent is 30.

[0050] The Tg value of the glass fiber reinforced laminated board with epoxy resin as the matrix made by the formula is shown in Table 1, and the sampled sample has good flatness and no abnormal engraving. Figure 4

[0051] The sample in this example was detected (detection standard: GB / T 1303.2-2009), and the detection results are shown in Table 1: Table 1

[0052] In Table 1, the height of the test sample of "vertical layer compression strength" is (3.94-3.99) mm; the thickness of the test sample of "vertical layer electrical strength" is (0.95-0.97) mm; the size of the test sample of "parallel layer breakdown voltage" is (100.02-100.22) mm (length) x (24.95-25.19) mm (width) x (3.98-4.03) mm (thickness), and the electrode spacing is (24.95-25.19) mm; the size of the test sample of "water absorption" is (50.01-50.09) mm x (49.97-50.22) mm x (3.90-4.00) mm.

[0053] In combination with Figure 4 and Table 1, it can be concluded that the glass fiber reinforced laminated board has four core advantages of "high mechanical strength, excellent insulation performance, strong heat stability, and low moisture absorption", which fully meets the harsh scene requirements of F-class insulation (155℃ long-term use) and high-voltage electrical equipment, high-temperature environment structural parts, etc.

[0054] Example 3: The formula of the epoxy resin is: the component of the first epoxy resin raw material is 32, the component of the second epoxy resin raw material is 68, the component of the curing agent is 6.1, the component of the filler is 65, the component of the catalyst is 0.3, the component of the coupling agent is 0.2, the component of the strong polar solvent is 25, and the component of the weak polar solvent is 30.

[0055] The Tg value of the glass fiber reinforced laminated board with epoxy resin as the matrix made by the formula is shown in Table 1, and the sampled sample has good flatness and no abnormal engraving. Figure 5

[0056] Example 4: The formula of the epoxy resin is: the component of the first epoxy resin raw material is 35, the component of the second epoxy resin raw material is 65, the component of the curing agent is 5.8, the component of the filler is 65, the component of the catalyst is 0.3, the component of the coupling agent is 0.2, the component of the strong polar solvent is 25, and the component of the weak polar solvent is 30. ​​

[0057] The Tg value of the glass fiber reinforced laminate made of the epoxy resin is shown in the following table. Figure 6 As shown in the table, the flatness of the sample is good, and the engraving is normal.

[0058] As shown above, when the amount of the first epoxy resin raw material is increased, the Tg value of the glass fiber reinforced laminate is reduced; when the amount of the first epoxy resin raw material is reduced, the Tg value of the glass fiber reinforced laminate is increased within a certain range, but the corresponding sample is warped due to curing shrinkage, the flatness is poor, and the comprehensive performance is gradually deteriorated.

[0059] The above is only the preferred embodiment of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent flow transformation made by using the content of the specification and drawings, or directly or indirectly applied to other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A method of producing an epoxy resin, characterized by, The method for manufacturing the epoxy resin comprises the following steps: The first epoxy resin raw material, the second epoxy resin raw material, the strong polar solvent, the weak polar solvent, the catalyst, the coupling agent, the filler and the curing agent are weighed according to the formula, the strong polar solvent is stirred at a preset first temperature, the curing agent is added and stirred uniformly to obtain a first solution; The first solution is stirred, the weak polar solvent and the first epoxy resin raw material are slowly added in sequence, and the second solution is obtained after uniform stirring; The second solution is stirred at a preset second temperature, the second epoxy resin raw material, the catalyst, the coupling agent and the filler are slowly added in sequence, and the third solution is obtained after uniform stirring; The third solution is high-speed dispersed for a preset period of time to obtain the epoxy resin.

2. The method for preparing epoxy resin as described in claim 1, characterized in that, The formula comprises the following components by weight: the first epoxy resin raw material with a component range of 800-1500, 28-35 parts; the second epoxy resin raw material with a molecular weight range of 100-800, 65-72 parts; the strong polar solvent, 25 parts; the weak polar solvent, 30 parts; the catalyst, 0.3-0.7 parts; the coupling agent, 0.1-0.3 parts; the filler, 50-100 parts; and the curing agent, 3-10 parts.

3. The method for preparing epoxy resin as described in claim 1, characterized in that, The preset first temperature is 30℃±2, and the preset second temperature is 35℃±2.

4. The method for preparing epoxy resin as described in claim 2, characterized in that, The step of high-speed dispersing the third solution for a preset period of time to obtain the epoxy resin can be replaced by: The third solution is high-speed dispersed for a preset period of time, and water is supplied during the dispersion process to maintain the temperature at a second preset temperature to obtain the epoxy resin.

5. The method for preparing epoxy resin as described in claim 1, characterized in that, After the step of stirring the strong polar solvent at a preset first temperature and adding the curing agent to stir uniformly to obtain the first solution, the following step is further included: The first solution is sampled to obtain a sample, the sample is irradiated with strong light, and the test result of the sample is obtained.

6. The method for preparing epoxy resin as described in claim 1, characterized in that, The preset period of time is 60 minutes.

7. A glass fiber reinforced laminate panel, characterized by The glass fiber reinforced laminated board uses the epoxy resin as a matrix and glass fiber cloth as a reinforcing material, and the epoxy resin is manufactured according to the method for manufacturing the epoxy resin according to any one of claims 1-6.

8. A method of making a glass fiber reinforced laminate as recited in claim 7 wherein, The method for manufacturing the glass fiber reinforced laminated board comprises the following steps: The glass fiber cloth is immersed in the epoxy resin for treatment, and then baked to obtain a semi-finished product; The semi-finished product is cut according to a preset size, and then the cut semi-finished product is configured with a corresponding number of layers according to a preset plate thickness and is hot-pressed to obtain a laminated board blank; The burrs of the laminated board blank are removed to obtain the glass fiber reinforced laminated board.

9. The method of making a glass fiber reinforced laminate of claim 8, wherein, The step of removing the burrs of the laminated board blank to obtain the glass fiber reinforced laminated board can be replaced by: The laminated board blank is processed according to a preset shape to obtain the glass fiber reinforced laminated board.

Images