Water vapor cooling device, compression equipment and cooling method

Abstract

The water vapor cooling device, the compression equipment and the cooling method are used for a water vapor compressor, a water vapor exhaust pipeline is arranged at an outlet of the water vapor compressor, the water vapor cooling device comprises a cooling medium supply assembly and a cooling assembly, and the cooling medium supply assembly is used for providing a cooling medium; the cooling assembly is connected with the water vapor exhaust pipeline and comprises a liquid storage cavity, multiple spray pipes and an adjusting mechanism, the cooling medium supply assembly communicates with the liquid storage cavity, the multiple spray pipes are arranged at intervals, each spray pipe communicates with the liquid storage cavity, and each spray pipe is provided with a nozzle; the adjusting mechanism is arranged in the liquid storage cavity, and the adjusting mechanism is configured to be switched among different working positions according to the flow of the cooling medium so as to selectively communicate the liquid storage cavity with one or more of the spray pipes. The water vapor cooling device is simple in structure, the spraying amount can be adjusted only by changing the flow of cooling water, cooperation of other variables is not needed, and the response speed can be increased.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of water vapor compression equipment, and more particularly to a water vapor cooling device, a compression equipment and a cooling method. BACKGROUND

[0002] In industrial production, a centrifugal water vapor compressor can effectively improve steam quality, convert low-quality steam into high-quality steam for re-injection into industrial production, thereby improving steam utilization. In a multi-stage centrifugal compressor, the impeller of the first-stage centrifugal compressor does work on the steam, and the steam pressure and temperature at the outlet of the first-stage centrifugal compressor increase greatly, which requires higher material. Meanwhile, the higher the steam temperature, the worse the heat exchange effect, and it is difficult to compress. Therefore, in actual use, the inter-stage steam is usually subjected to cooling treatment.

[0003] There are usually two solutions for cooling the inter-stage steam. The first solution is to cool the steam by heat dissipation fins. The steam exchanges heat with the external working medium through the heat dissipation fins arranged outside the pipeline to be cooled. This solution adopts indirect heat exchange, and the cooling speed is slow and the cooling rate is uncontrollable. The second solution is to directly spray water on the water vapor in the pipeline to cool it. This solution has a faster heat exchange speed than the heat dissipation fins, and can fully utilize the heat of the water vapor to achieve better heat exchange effect. However, the control of the water spraying amount and the particle size of the water has always been a difficulty in the water spraying cooling solution. Too high water spraying amount will cause a large amount of steam condensation in the pipeline and compressor surge. Too large particle size will cause incomplete evaporation of the liquid droplets, which will enter the next stage of the compressor and corrode the compressor blades to reduce their service life.

[0004] Patent No. CN120140275A proposes a spraying solution which uses a rotatable valve core to adjust the spraying amount by adjusting the opening degree of the valve and the matching degree of the valve core. However, the mechanical structure is complex, and the processing and maintenance costs are high. Meanwhile, the control response is complex, and the opening degree of the valve and the rotation degree of the valve core need to be adjusted comprehensively, which has a certain hysteresis.

[0005] Therefore, how to simplify the structure of the cooling device and improve the response speed has become a technical problem to be solved by those skilled in the art. SUMMARY

[0006] In view of the above, the purpose of the present application is to provide a water vapor cooling device to simplify the structure and improve the response speed.

[0007] Another core of the present application is to provide a water vapor compression equipment comprising the above water vapor cooling device.

[0008] Still another core of the present application is to provide a water vapor cooling method using the above water vapor compression equipment.

[0009] To achieve the above object, the present application provides the following technical scheme:

[0010] A water vapor cooling device for a water vapor compressor, the outlet of the water vapor compressor being provided with a water vapor exhaust pipeline, the water vapor cooling device comprising:

[0011] A cooling medium supply assembly for supplying a cooling medium to the water vapor exhaust pipeline;

[0012] A cooling assembly connected to the water vapor exhaust pipeline, the cooling assembly comprising a liquid storage cavity, a plurality of nozzles arranged at intervals, and an adjusting mechanism, the cooling medium supply assembly being in communication with the liquid storage cavity, each nozzle being in communication with the liquid storage cavity and being provided with a nozzle, each nozzle being located on the water vapor exhaust pipeline to spray water vapor; the adjusting mechanism being arranged in the liquid storage cavity and being configured to switch between different working positions according to the flow rate of the cooling medium to selectively connect the liquid storage cavity to one or more of the nozzles.

[0013] Optionally, in the water vapor cooling device, the liquid storage cavity is provided with a cooling medium inlet, the adjusting mechanism comprises a sliding block structure and an elastic return member, the sliding block structure being in sliding cooperation with the liquid storage cavity and abutting against the wall surface of the liquid storage cavity to divide the liquid storage cavity into a first cavity and a second cavity; one end of the elastic return member being connected to the sliding block structure and the other end being connected to the wall surface of the liquid storage cavity away from the cooling medium inlet.

[0014] The cooling medium supply assembly comprises a cooling water pump and an adjusting valve, the adjusting valve being located downstream of the cooling water pump.

[0015] Optionally, in the water vapor cooling device, the second cavity is provided with a communication hole in communication with the water vapor exhaust pipeline, the communication hole being arranged on the side away from the cooling medium inlet.

[0016] Optionally, in the water vapor cooling device, the adjusting mechanism comprises a limiting member, the limiting member being arranged in the liquid storage cavity and being located on the side close to the cooling medium inlet.

[0017] Optionally, in the water vapor cooling device, the sliding block structure comprises a sliding block and a first sealing member, the first sealing member being sleeved on the sliding block, the thickness of the first sealing member being smaller than the thickness of the limiting member.

[0018] Optionally, in the water vapor cooling device, each nozzle is arranged at intervals along the axial direction of the liquid storage cavity, and any two adjacent nozzles are arranged staggered along the circumferential direction of the liquid storage cavity.

[0019] Optionally, in the water vapor cooling device, the liquid storage cavity is formed by a first shell and a second shell, the first shell and the second shell being detachably connected, and the second shell being detachably connected to the water vapor exhaust pipeline.

[0020] The cooling medium inlet is arranged in the first shell, and the nozzle is arranged in the second shell.

[0021] Optionally, in the water vapor cooling device, a second sealing member is arranged between the first shell and the second shell and between the second shell and the water vapor exhaust pipeline.

[0022] A water vapor compression device, comprising a water vapor compressor and the water vapor cooling device, wherein the water vapor compressor comprises at least one;

[0023] When the water vapor compressor comprises one, the cooling medium supply assembly and the cooling assembly are arranged in the water vapor exhaust pipeline of the water vapor compressor or in the inlet pipeline of the water vapor compressor; when the water vapor compressor comprises multiple, the water vapor exhaust pipeline is connected to any two adjacent water vapor compressors, and the cooling medium supply assembly and the cooling assembly are arranged between any two adjacent water vapor compressors.

[0024] Optionally, in the water vapor compression device, the water vapor compression device comprises a detection assembly and a control assembly, the detection assembly comprises a first temperature measuring element, a second temperature measuring element and a flow measuring element arranged in the water vapor exhaust pipeline, the first temperature measuring element and the flow measuring element are arranged upstream of the cooling assembly, and the second temperature measuring element is arranged downstream of the cooling assembly.

[0025] The first temperature measuring element, the second temperature measuring element, the flow measuring element, the cooling water pump of the cooling medium supply assembly and the adjusting valve of the cooling medium supply assembly are connected to the control assembly.

[0026] A water vapor cooling method, using the water vapor compression device, comprising the steps of:

[0027] Obtaining a first temperature of water vapor, the first temperature of water vapor upstream of the cooling assembly is obtained by the first temperature measuring element.

[0028] Comparing the first temperature of water vapor with a target temperature and determining whether a threshold is exceeded.

[0029] If the difference between the first temperature of water vapor and the target temperature is outside the threshold, starting the water vapor cooling device to spray and cool the water vapor.

[0030] Obtaining a second temperature of water vapor, the second temperature of water vapor downstream of the cooling assembly is obtained by the second temperature measuring element after the water vapor cooling device is started for a preset time.

[0031] Comparing the second temperature of water vapor with the target temperature and generating an adjusting signal of the adjusting valve, and adjusting the opening of the adjusting valve according to the adjusting signal.

[0032] Optionally, in the water vapor cooling method, the second temperature of the water vapor is compared with the target temperature, and the adjusting signal of the adjusting valve is generated; when the second temperature of the water vapor is less than the target temperature, the opening of the adjusting valve is reduced; when the second temperature of the water vapor is greater than the target temperature, the opening of the adjusting valve is increased.

[0033] As can be seen from the above solutions, the water vapor cooling device disclosed by the application can switch the adjusting mechanism between different working positions by changing the flow of the cooling water, so as to change the number of the spray pipes communicated with the liquid storage cavity, and further change the spraying amount of the cooling water, thereby realizing the adjustment of the spraying amount of the cooling water; the structure is simple and convenient to process, and the spraying amount can be adjusted only by changing the flow of the cooling water, and the spraying cooling of the water vapor can be realized only by adjusting a single variable without the cooperation of other variables, so that the response speed can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only constitute some embodiments of the application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0035] Figure 1 Structure diagram of the water vapor compression device disclosed by the embodiments of the application;

[0036] Figure 2 Structure diagram of the water vapor cooling device disclosed by the embodiments of the application Figure 1 ;

[0037] Figure 3 Structure diagram of the water vapor cooling device disclosed by the embodiments of the application Figure 2 ;

[0038] Figure 4 Structure diagram of the cooling assembly disclosed by the embodiments of the application;

[0039] Figure 5 Structure diagram of the second shell disclosed by the embodiments of the application Figure 1 ;

[0040] Figure 6 Structure diagram of the second shell disclosed by the embodiments of the application Figure 2 ;

[0041] Figure 7 Flow chart of the water vapor cooling method disclosed by the embodiments of the application.

[0042] In the drawings: 100 is a water vapor compressor, and 110 is a water vapor exhaust pipeline.

[0043] 200 is a cooling medium supply assembly, 210 is a cooling water pump, and 220 is a regulating valve;

[0044] 300 is a cooling assembly, 310 is a liquid storage cavity, 3101 is a first shell, 3102 is a second shell, 3103 is a second sealing element, 311 is a communication hole, 312 is a cooling medium inlet, 313 is a first cavity, 314 is a second cavity, 320 is a spray pipe, 321 is a first spray pipe, 322 is a second spray pipe, 330 is a regulating mechanism, 331 is a sliding block structure, 3311 is a sliding block, 33111 is a sliding part, 33112 is a connecting part, 3312 is a first sealing element, 332 is an elastic reset element, 333 is a limiting element, and 340 is a nozzle.

[0045] 400 is a detection assembly, 410 is a first temperature measuring element, 420 is a second temperature measuring element, and 430 is a flow measuring element. DETAILED DESCRIPTION

[0046] The core of the present application is to disclose a water vapor cooling device to simplify the structure and improve the response speed.

[0047] Another core of the present application is to disclose a water vapor compression device comprising the above-mentioned water vapor cooling device.

[0048] Still another core of the present application is to disclose a water vapor cooling method using the above-mentioned water vapor compression device.

[0049] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor are within the scope of protection of the present application.

[0050] As shown in Figure 2 and Figure 4 The present application discloses a water vapor cooling device for a water vapor compressor 100, which comprises a cooling medium supply assembly 200 and a cooling assembly 300.

[0051] As shown in Figure 1As shown, the outlet of the water vapor compressor 100 is provided with a water vapor exhaust pipeline 110, water vapor enters the water vapor compressor 100, the impeller of the water vapor compressor 100 works on the water vapor, and the water vapor is discharged from the water vapor exhaust pipeline 110 after the pressure and temperature of the water vapor are increased. The water vapor cooling device disclosed in the present application is in communication with the water vapor exhaust pipeline 110 and reduces the temperature of the water vapor discharged from the water vapor compressor 100. The water vapor after the temperature reduction treatment can enter the next stage water vapor compressor 100 for continuous compression or can be directly used in industrial applications. The actual requirements can be determined specifically. The core of the present application is to reduce the temperature of the water vapor discharged from the water vapor exhaust pipeline 110, and the structure of the water vapor compressor 100 is not improved, so the specific structure and working principle of the water vapor compressor 100 will not be described here.

[0052] Specifically, the cooling medium supply assembly 200 is used to provide cooling medium to the water vapor exhaust pipeline 110. The cooling medium is preferably cooling water, and the high-purity demineralized water is preferred.

[0053] As shown in Figure 2 The cooling assembly 300 is connected with the water vapor exhaust pipeline 110, and the cooling assembly 300 includes a liquid storage cavity 310, a plurality of spray pipes 320 arranged at intervals, and an adjusting mechanism 330. The cooling medium supply assembly 200 is in communication with the liquid storage cavity 310. Each spray pipe 320 is in communication with the liquid storage cavity 310, and each spray pipe 320 is provided with a spray nozzle 340. For each spray pipe 320, one, two or more spray nozzles 340 can be provided, and the specific number can be determined according to actual requirements. Each spray nozzle 340 is located in the water vapor exhaust pipeline 110 to spray the water vapor in the water vapor exhaust pipeline 110. The adjusting mechanism 330 is arranged in the liquid storage cavity 310, and the adjusting mechanism 330 is configured to be able to switch between different working positions according to the flow of the cooling medium, so as to selectively connect the liquid storage cavity 310 with one or more of the spray pipes 320.

[0054] It should be noted that when the adjusting mechanism 330 is in the initial working position, the liquid storage cavity 310 is not in communication with each spray pipe 320.

[0055] When the difference between the temperature of the water vapor discharged from the water vapor exhaust pipeline 110 and the target temperature is outside the threshold value, the water vapor needs to be sprayed and cooled. The cooling medium supply assembly 200 and the cooling assembly 300 are started, the amount of cooling water is a preset value at this time, the adjusting mechanism 330 is switched to one of the working positions, the liquid storage cavity 310 is in communication with part of the spray pipes 320, the cooling water is atomized by the spray nozzles 340, and is directly sprayed to the water vapor to spray and cool the water vapor.

[0056] When the temperature difference between the water vapor downstream of the temperature-reducing assembly 300 and the target temperature is outside the threshold value, and the temperature of the water vapor is greater than the target temperature, the flow of the cooling water can be increased, the adjusting mechanism 330 is switched to another working position to increase the number of the spray pipes 320 in communication with the liquid storage cavity 310, so as to increase the spraying amount of the cooling water; when the temperature difference between the water vapor downstream of the temperature-reducing assembly 300 and the target temperature is outside the threshold value, and the temperature of the water vapor is less than the target temperature, the flow of the cooling water is reduced, the adjusting mechanism 330 is switched to another working position to reduce the number of the spray pipes 320 in communication with the liquid storage cavity 310, so as to reduce the spraying amount of the cooling water.

[0057] The water vapor temperature-reducing device disclosed in the embodiments of the present application can switch the adjusting mechanism 330 between different working positions by changing the flow of the cooling water, so as to change the number of the spray pipes 320 in communication with the liquid storage cavity 310, and then change the spraying amount of the cooling water, thereby realizing the adjustment of the spraying amount of the cooling water; the structure is simple and convenient to process, and the adjustment of the spraying amount can be realized only by changing the flow of the cooling water, and the temperature reduction of the water vapor can be realized only by adjusting a single variable, without the cooperation of other variables, so that the response speed can be improved.

[0058] Further, as shown in Figure 2 and Figure 4 in some specific embodiments, the liquid storage cavity 310 is provided with a cooling medium inlet 312, and the cooling medium inlet 312 is preferably arranged at the top of the liquid storage cavity 310, and the spray pipe 320 is preferably arranged at the bottom of the liquid storage cavity 310. The adjusting mechanism 330 includes a sliding block structure 331 and an elastic reset member 332, the sliding block structure 331 is in sliding cooperation with the liquid storage cavity 310, and the sliding block structure 331 is in abutment with the wall surface of the liquid storage cavity 310; one end of the elastic reset member 332 is connected with the sliding block structure 331, and the other end is connected with the wall surface of the liquid storage cavity 310. Specifically, the elastic reset member 332 is arranged along the axial direction of the liquid storage cavity 310, and the sliding block structure 331 is in abutment with the wall surface of the liquid storage cavity 310 around, so that the sliding block structure 331 divides the liquid storage cavity 310 into a first cavity 313 and a second cavity 314, and the left side of the sliding block structure 331 is taken as the first cavity 313, and the right side of the sliding block structure 331 is taken as the second cavity 314 in the following description. The shape and size of the sliding block structure 331 are adapted to the shape and size of the liquid storage cavity 310.

[0059] As shown in Figure 2 , the first cavity 313 and the second cavity 314 are divided by the sliding block structure 331, and the first cavity 313 and the second cavity 314 are not in communication, so as to block the cooling medium entering the first cavity 313 from the cooling medium inlet 312 from entering the second cavity 314, thereby changing the number of the spray pipes 320 in communication with the liquid storage cavity 310 by moving the sliding block structure 331, and then changing the spraying amount.

[0060] The cooling medium supply assembly 200 comprises a cooling water pump 210 and an adjusting valve 220, which is located downstream of the cooling water pump 210. The cooling water pump 210 can be a conventional device. The flow rate of the cooling water can be adjusted by changing the frequency of the cooling water pump 210 and / or the opening degree of the adjusting valve 220, preferably by adjusting the opening degree of the adjusting valve 220. The adjusting valve 220 is preferably an electrically operated adjusting valve, which can adjust the opening degree of the valve according to the adjusting command. By changing the opening degree of the adjusting valve 220, the mass flow rate of the cooling water is changed, thereby changing the movement state of the slider structure 331, and further changing the number of the spray pipes 320 in communication with the liquid storage cavity 310, and changing the number of the nozzles 340 participating in the spraying. The opening degree of the adjusting valve 220 is the only input variable, and only the opening degree of the adjusting valve 220 needs to be adjusted, which can improve the response speed.

[0061] As shown in Figure 2 and Figure 5 The second cavity 314 is provided with a communication hole 311 in communication with the water vapor exhaust pipe 110, which is located away from the cooling medium inlet 312. The communication hole 311 is located at the rightmost side of all the spray pipes 320, that is, after each spray pipe 320 is in communication with the liquid storage cavity 310, the slider structure 331 continues to move to the right. When the slider structure 331 moves beyond the preset displacement, the first cavity 313 is in communication with the water vapor exhaust pipe 110 through the communication hole 311, and the overpressure cooling water directly enters the water vapor exhaust pipe 110 through the communication hole 311. At this time, the communication hole 311 can play a role in pressure relief, which can reduce the risk of structural damage of the cooling assembly 300.

[0062] In actual application, the adjusting valve 220 is opened, and the cooling water pump 210 provides power. The cooling water enters the first cavity 313 from the cooling medium inlet 312. Due to the arrangement of the communication hole 311, the medium in the second cavity 314 is water vapor. The force analysis of the slider structure 331 is as shown in Figure 3As shown, the pressure acting on the slider structure 331 includes the pressure P1 of the cooling water, the pressure P0 of the elastic return member 332 acting on the slider structure 331 (the elastic return member 332 is in a pre-compressed state), the friction P2 acting on the slider structure 331, and the pressure P3 of the water vapor in the second cavity 314 on the right side of the slider structure 331 acting on the slider structure 331. At this time, P1 < P0 + P2 + P3, the slider structure 331 is in the initial working position, and no nozzle 320 is in communication with the first cavity 313. The cooling medium supply assembly 200 continues to inject cooling medium into the first cavity 313. Hereinafter, the cooling medium is taken as an example of cooling water. As the flow of the cooling water increases, when P1 > P0 + P2 + P3, the slider structure 331 moves to the right. When the slider structure 331 is in the first working position, one of the nozzles 320 close to the cooling medium inlet 312 is in communication with the first cavity 313, and the cooling water enters the nozzle 320 and is sprayed from the nozzle 340 of the nozzle 320. Due to the pressure difference between the cooling water pressure and the water vapor pressure in the water vapor exhaust pipeline 110 (the cooling water pressure is higher than the water vapor pressure), the cooling water is atomized and sprayed into the water vapor exhaust pipeline 110 under the driving of the pressure difference, mixed with the water vapor in the pipeline, and achieves the water spray cooling function.

[0063] As the cooling water is injected, the slider structure 331 continues to move to the right until the amount of injected cooling water is the same as the flow of cooling water through the nozzle 340, and the slider structure 331 no longer moves. It should be noted that the specific number of nozzles 320 and nozzles 340 can be set according to the flow of cooling water.

[0064] On the other hand, the arrangement of the communication hole 311 can ensure the atomization effect of the nozzle 340. For one of the nozzles 340, the outside of the nozzle 340 is subjected to the pressure P4 of the water vapor. Due to the arrangement of the communication hole 311, the medium in the second cavity 314 is water vapor, so P4 = P3. The inside of the nozzle 340 is subjected to the pressure of the cooling water. When the slider structure 331 no longer moves, the nozzle 340 is subjected to the pressure P1 of the cooling water, P1 = P0 + P2 + P3. For the nozzle 340, the pressure difference between the inside and the outside is P0 + P2. At this time, as long as P0 + P2 is greater than the atomization pressure difference required by the nozzle 340, the spraying requirement can be met. Further, as long as P0 is greater than the atomization pressure difference required by the nozzle 340, the atomization requirement of the nozzle 340 can be met. Therefore, in actual application, the pre-tightening force of the elastic return member 332 is not less than the spraying pressure difference of the nozzle 340. In actual application, the pre-tightening force of the elastic return member 332 can be set to be greater than or equal to the atomization pressure difference required by the nozzle 340. Specifically, the atomization pressure difference of the nozzle 340 can be determined according to the particle size of the droplets and the type of the nozzle 340.

[0065] Further, as shown in Figure 2 In order to limit the sliding block structure 331, the adjusting mechanism 330 comprises a limiting piece 333, which is arranged in the liquid storage cavity 310 and located at the side close to the cooling medium inlet 312. The limiting piece 333 can be a limiting block, and preferably comprises a plurality of limiting blocks arranged at intervals along the circumference of the liquid storage cavity 310. The limiting piece 333 can also be a limiting baffle, and preferably comprises a through hole to allow the cooling water to pass through the limiting baffle. The limiting piece 333 can prevent the sliding block structure 331 from continuing to move to the left, block the cooling medium inlet 312, and affect the entry of the cooling water into the liquid storage cavity 310. At the same time, the limiting piece 333 can keep the elastic return piece 332 in a pre-tightening state. Further, in order to improve the sealing effect, the width of the sliding block structure 331 is preferably greater than the diameter of the spray pipe 320.

[0066] Further, in order to improve the sealing effect, in some specific embodiments, as shown in Figure 2 and Figure 4 The sliding block structure 331 comprises a sliding block 3311 and a first sealing piece 3312, and the first sealing piece 3312 is sleeved on the sliding block 3311. The thickness of the first sealing piece 3312 is less than the thickness of the limiting piece 333. Specifically, as shown in Figure 2 The sliding block 3311 preferably comprises a sliding part 33111 and a connecting part 33112, and the connecting part 33112 protrudes from the sliding part 33111 to facilitate connection with the elastic return piece 332. Specifically, the sliding block 3311 can be a one-piece structure or a split structure. When it is a split structure, the sliding part 33111 and the connecting part 33112 can be detachably connected or non-detachably connected. The detachable connection modes include but are not limited to bolt connection and clamping connection, and the non-detachable connection mode includes but is not limited to welding connection.

[0067] The first sealing piece 3312 is preferably a sealing ring, and more preferably a rubber sealing ring. The first sealing piece 3312 is sleeved on the outside of the sliding part 33111 to play a sealing role and prevent the cooling water in the first cavity 313 from leaking into the second cavity 314. When the sliding block structure 331 is in the initial position, the sliding block structure 331 is in contact with the limiting piece 333, the thickness of the first sealing piece 3312 is less than the thickness of the limiting piece 333, the first sealing piece 3312 bears the extrusion stress from the limiting piece 333, the risk of damage to the first sealing piece 3312 due to excessive extrusion is reduced, the service life of the first sealing piece 3312 is prolonged, and the sealing performance and long-term reliability of the cooling assembly 300 are ensured.

[0068] Further, as shown in Figure 5As shown, to reduce spray disturbance between adjacent nozzles 340 and promote droplet evaporation, the nozzles 320 are spaced apart along the axial direction of the liquid storage chamber 310, and any two adjacent nozzles 320 are staggered along the circumference of the liquid storage chamber 310. In other words, the nozzles 320 are staggered along the axial direction of the liquid storage chamber 310. Preferably, the distance between two adjacent nozzles 320 along the axial direction of the liquid storage chamber 310 is ≥ 3 times the diameter of the nozzle 340. To illustrate the distance D between two adjacent nozzles 320, let... Figure 5 Taking the first nozzle 321 on the left and the second nozzle 322 adjacent to it as examples, the connection point between the axis of the first nozzle 321 and the bottom surface of the steam exhaust pipe 110 is point A, and the connection point between the axis of the second nozzle 322 and the bottom surface of the steam exhaust pipe 110 is point B. A perpendicular line is drawn from point A to the axis L of the steam exhaust pipe 110, with the foot of the perpendicular being A'. A perpendicular line is also drawn from point B to the axis L of the steam exhaust pipe 110, with the foot of the perpendicular being B'. The distance D is then the straight-line distance between A' and B'. Those skilled in the art should understand that the attached diagram is only a simplified schematic diagram and is not drawn to scale, nor does it represent actual dimensions and proportions. However, the geometric definition of distance D described above is unique and definite. Along the circumference of the liquid storage chamber 310, the angle between the extensions of the axes of two adjacent nozzles 320 is ≥30°, i.e. Figure 6 The angle α shown is ≥30°. It should be noted that the diameters of each nozzle 320 and each nozzle 340 are preferably the same.

[0069] Furthermore, such as Figure 4 As shown, in some specific embodiments, the liquid storage chamber 310 is formed by a first housing 3101 and a second housing 3102. The first housing 3101 and the second housing 3102 are detachably connected, and the specific connection methods include, but are not limited to, bolt and nut connection, snap-fit ​​connection, and flange connection. The second housing 3102 is detachably connected to the steam exhaust pipe 110, and the specific connection methods include, but are not limited to, bolt and nut connection, snap-fit ​​connection, and flange connection. The cooling medium inlet 312 is located in the first housing 3101, and the nozzle 320 is located in the second housing 3102. To ensure the sealing performance of the liquid storage chamber 310, a second sealing element 3103 is provided between the first housing 3101 and the second housing 3102, and between the second housing 3102 and the steam exhaust pipe 110. The second sealing element 3103 is preferably a rubber gasket, but it can be made of metal or high-temperature resistant rubber.

[0070] Furthermore, this application also discloses a steam compression device. Specifically, the steam compression device includes a steam compressor 100 and the aforementioned steam cooling device. At least one steam compressor 100 is included. When only one steam compressor 100 is included, the cooling medium supply component 200 and the cooling component 300 are disposed on the steam exhaust pipe 110 of the steam compressor 100 or on the inlet pipe of the steam compressor 100. The specific placement can be determined according to actual cooling requirements. When multiple steam compressors 100 are included, the steam exhaust pipe 110 connects any two adjacent steam compressors 100, and the cooling medium supply component 200 and the cooling component 300 are disposed between any two adjacent steam compressors 100. Figure 1 As shown in the figure, two steam compressors 100 are used as an example for illustration. The steam flows from left to right. For ease of explanation, the steam compressor 100 on the left is called the first steam compressor 100, and the steam compressor 100 on the right is called the second steam compressor 100. The cooling component 300 cools the steam that has passed through the first steam compressor 100. After the steam is cooled, it enters the second steam compressor 100 for further compression.

[0071] Furthermore, the water vapor compression device disclosed in this application includes a detection component 400 and a control component, specifically, as shown in the example below. Figure 1 As shown, the detection component 400 includes a first temperature measuring element 410, a second temperature measuring element 420, and a flow measuring element 430 disposed in the steam exhaust pipe 110. The first temperature measuring element 410 and the flow measuring element 430 are both disposed upstream of the cooling component 300 and are used to measure the temperature and flow rate of the steam discharged from the steam exhaust pipe 110 of the first steam compressor 100. The second temperature measuring element 420 is disposed downstream of the cooling component 300 and is used to measure the temperature of the steam after cooling by the cooling component 300 and before it enters the second steam compressor 100. The first temperature measuring element 410, the second temperature measuring element 420, the flow measuring element 430, the cooling water pump 210 of the cooling medium supply component 200, and the regulating valve 220 of the cooling medium supply component 200 are all connected to the control component. The control component can compare the temperature of the water vapor measured by the first temperature measuring element 410 with the target temperature, control the start and stop of the cooling water pump 210, compare the temperature of the water vapor measured by the second temperature measuring element 420 with the target temperature, generate a regulation signal for the regulating valve 220, and adjust the opening of the regulating valve 220 according to the regulation signal so that the temperature of the water vapor entering the second water vapor compressor 100 meets the target temperature.

[0072] Further, the application also discloses a water vapor cooling method, which adopts the water vapor compression device. Figure 7 As shown in the figure, the method comprises the steps of:

[0073] Step S1, acquiring a first temperature of water vapor;

[0074] The first temperature of water vapor upstream of the cooling assembly 300 is acquired by the first temperature measuring element 410.

[0075] Step S2, comparing the first temperature of water vapor with a target temperature and judging whether a threshold is exceeded;

[0076] If the difference between the first temperature of water vapor and the target temperature is outside the threshold, a water vapor cooling device is started to spray and cool the water vapor.

[0077] Step S3, acquiring a second temperature of water vapor;

[0078] After the water vapor cooling device is started for a preset time, the second temperature of water vapor downstream of the cooling assembly 300 is acquired by the second temperature measuring element 420.

[0079] Step S4, comparing the second temperature of water vapor with the target temperature and generating an adjusting signal of the adjusting valve 220, and adjusting the opening degree of the adjusting valve 220 according to the adjusting signal.

[0080] Specifically, the first enthalpy value h1 of water vapor can be calculated according to the first temperature, the target enthalpy value ht of water vapor can be calculated according to the target temperature, the second enthalpy value h2 of water vapor can be calculated according to the second temperature, the required cooling water flow mw can be calculated according to the flow m1 of water vapor at the outlet of the first water vapor compressor 100, and according to the enthalpy value hw of cooling water, specifically, mw = m1 x (h1-ht) / (ht-hw), and the opening degree of the adjusting valve 220 can be adjusted according to the cooling water flow. It should be noted that the cooling medium supply assembly 200 comprises a cooling water flow measuring element for measuring the cooling water flow.

[0081] When the second temperature of water vapor is less than the target temperature, the opening degree of the adjusting valve 220 is reduced; when the second temperature of water vapor is greater than the target temperature, the opening degree of the adjusting valve 220 is increased.

[0082] In some other specific embodiments, the water vapor exhaust pipeline 110 is provided with a first pressure measuring element and a second pressure measuring element, the first pressure measuring element is located upstream of the cooling assembly 300, and the second pressure measuring element is located downstream of the cooling assembly 300, and is used for measuring the pressure of water vapor.

[0083] It should be noted that each of the embodiments in the specification focuses on the difference from other embodiments, and the same and similar parts between each embodiment can be referred to each other.

[0084] In the description of the embodiments of the present application, it should be noted that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0085] In addition, the terms "first", "second", "third" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance.

[0086] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "connected" and "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0087] The principles and implementation modes of the present application are described by applying specific examples in this paper, and the above description of the embodiments is only for the purpose of helping to understand the core idea of the present application. It should be noted that for ordinary skilled in the art, without departing from the principles of the present application, the present application can be improved and modified in several ways, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A steam cooling device for a steam compressor (100), wherein the outlet of the steam compressor (100) is provided with a steam exhaust pipe (110), characterized in that, The steam cooling device includes: A cooling medium supply assembly (200) is used to supply cooling medium to the steam exhaust pipe (110); A cooling component (300) is connected to the steam exhaust pipe (110). The cooling component (300) includes a liquid storage chamber (310), a nozzle (320), and an adjustment mechanism (330). A cooling medium supply component (200) is connected to the liquid storage chamber (310). The nozzle (320) includes multiple nozzles spaced apart. Each nozzle (320) is connected to the liquid storage chamber (310). Each nozzle (320) is provided with a nozzle (340). Each nozzle (340) is located in the steam exhaust pipe (110) to spray steam. The adjustment mechanism (330) is located in the liquid storage chamber (310). The adjustment mechanism (330) is configured to switch between different working positions according to the flow rate of the cooling medium to selectively connect the liquid storage chamber (310) to one or more of the nozzles (320).

2. The steam cooling device as described in claim 1, characterized in that, The liquid storage chamber (310) is provided with a cooling medium inlet (312). The adjustment mechanism (330) includes a slider structure (331) and an elastic reset member (332). The slider structure (331) slides with the liquid storage chamber (310) and abuts against the wall of the liquid storage chamber (310) to divide the liquid storage chamber (310) into a first cavity (313) and a second cavity (314). One end of the elastic reset member (332) is connected to the slider structure (331), and the other end is connected to the wall of the liquid storage chamber (310) away from the cooling medium inlet (312). The cooling medium supply assembly (200) includes a cooling water pump (210) and a regulating valve (220) located downstream of the cooling water pump (210).

3. The steam cooling device as described in claim 2, characterized in that, The second cavity (314) is provided with a connecting hole (311) that communicates with the steam exhaust pipe (110), and the connecting hole (311) is located on the side away from the cooling medium inlet (312).

4. The steam cooling device as described in claim 3, characterized in that, The adjustment mechanism (330) includes a limiting member (333), which is disposed in the liquid storage chamber (310) and located on the side close to the cooling medium inlet (312).

5. The steam cooling device as described in claim 4, characterized in that, The slider structure (331) includes a slider (3311) and a first seal (3312), the first seal (3312) being sleeved on the slider (3311), and the thickness of the first seal (3312) being less than the thickness of the limiting member (333).

6. The steam cooling device as described in claim 1, characterized in that, Each of the nozzles (320) is spaced apart along the axial direction of the liquid storage chamber (310), and any two adjacent nozzles (320) are staggered along the circumference of the liquid storage chamber (310).

7. The steam cooling device as described in claim 2, characterized in that, The liquid storage chamber (310) is formed by a first shell (3101) and a second shell (3102), the first shell (3101) and the second shell (3102) are detachably connected, and the second shell (3102) is detachably connected to the water vapor exhaust pipe (110); The cooling medium inlet (312) is located in the first housing (3101), and the nozzle (320) is located in the second housing (3102).

8. The steam cooling device as described in claim 7, characterized in that, A second sealing element (3103) is provided between the first housing (3101) and the second housing (3102), and between the second housing (3102) and the water vapor exhaust pipe (110).

9. A steam compression device, characterized in that, The steam compression device includes a steam compressor (100) and a steam cooling device as described in any one of claims 1-8, wherein the steam compressor (100) includes at least one unit; When the steam compressor (100) comprises one, the cooling medium supply assembly (200) and the cooling assembly (300) are disposed in the steam exhaust pipe (110) of the steam compressor (100) or in the inlet pipe of the steam compressor (100); when the steam compressor (100) comprises multiple, the steam exhaust pipe (110) connects any two adjacent steam compressors (100), and the cooling medium supply assembly (200) and the cooling assembly (300) are disposed between any two adjacent steam compressors (100).

10. The steam compression device as described in claim 9, characterized in that, The steam compression device includes a detection component (400) and a control component. The detection component (400) includes a first temperature measuring element (410), a second temperature measuring element (420), and a flow measuring element (430) disposed on the steam exhaust pipe (110). The first temperature measuring element (410) and the flow measuring element (430) are both disposed upstream of the cooling component (300), and the second temperature measuring element (420) is disposed downstream of the cooling component (300). The first temperature measuring element (410), the second temperature measuring element (420), the flow measuring element (430), the cooling water pump (210) of the cooling medium supply assembly (200), and the regulating valve (220) of the cooling medium supply assembly (200) are all connected to the control assembly.

11. A method for cooling water vapor, using the water vapor compression device as described in claim 10, characterized in that, Including the following steps: The first temperature of the water vapor is obtained by means of the first temperature measuring element (410) to obtain the first temperature of the water vapor located upstream of the cooling assembly (300); Compare the initial temperature of the water vapor with the target temperature and determine whether it exceeds the threshold. If the difference between the first temperature of the water vapor and the target temperature is outside the threshold, the water vapor cooling device is activated to spray and cool the water vapor. The second temperature of the water vapor is obtained by means of the second temperature measuring element (420) after the water vapor cooling device has been started for a preset time. The second temperature of the water vapor is compared with the target temperature, and an adjustment signal is generated for the regulating valve (220). The opening degree of the regulating valve (220) is adjusted according to the adjustment signal.

12. The water vapor cooling method as described in claim 11, characterized in that, In the step of comparing the second temperature of water vapor with the target temperature and generating a regulating signal for the regulating valve (220), when the second temperature of water vapor is less than the target temperature, the opening of the regulating valve (220) is reduced; when the second temperature of water vapor is greater than the target temperature, the opening of the regulating valve (220) is increased.

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