Intelligent instrument manufacturing device based on high precision

Abstract

The invention relates to the technical field of instrument and meter manufacturing, and particularly discloses a high-precision intelligent instrument and meter manufacturing device which comprises a mounting table, two sets of first linear guide rails and two sets of second linear guide rails are arranged on the mounting table, a first transverse frame is arranged on the first linear guide rails, and a second transverse frame is arranged on the second linear guide rails. The first transverse frame is higher than the second transverse frame, a detection table is arranged between the two sets of second linear guide rails, a circuit board containing groove is formed in the detection table, a first detection mechanism is arranged on the first transverse frame, and a second detection mechanism is arranged on the second transverse frame. The first detection mechanism can accurately identify and classify complex defects such as pseudo soldering, cold soldering and bridging by fusing 3D morphology and high-definition optical characteristics, and can effectively distinguish dangerous electrical bridging and harmless soldering flux residues, so that the misjudgment rate is reduced to be extremely low; and the second detection mechanism can accurately position deep defects such as layering, cavities, via hole fracture and the like.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of instrument manufacturing, in particular to a high-precision intelligent instrument manufacturing device. BACKGROUND

[0002] An intelligent instrument is a core component in high-end fields such as industrial automation, precision measurement and aerospace, and the internal core is a circuit board carrying various electronic components; the manufacturing quality of the circuit board directly determines the reliability, stability and precision of the whole instrument, and any tiny welding defects (such as virtual welding and bridging) or internal laminated damage may cause signal transmission abnormalities or functional failure, so the circuit board must be strictly detected before assembly to screen out unqualified products and ensure excellent performance of the final product.

[0003] In the prior art, the detection of the circuit board mainly depends on the combination of an automatic optical detection device and an online testing device; the automatic optical detection device acquires a circuit board image through a high-resolution camera and compares the image with a standard image to identify appearance defects such as component omission, polarity reversal and the like; the online testing device physically contacts a test point on the circuit board through a probe clamp named "needle bed" and applies an electrical signal to verify circuit connectivity and component functional parameters, so as to determine whether there are open circuit, short circuit or component failure and the like.

[0004] For the related technology in the above, the automatic optical detection can only observe the two-dimensional features on the surface and cannot identify hidden defects such as virtual welding and pores inside the welding points, and the online testing can detect electrical performance but cannot locate the position and nature of the physical defects; more importantly, neither of them can effectively detect deep defects such as internal wiring breakage and interlayer micro short circuit of the circuit board, and these "invisible" defects will become potential fault points, which seriously affect the quality and service life of the high-reliability intelligent instrument, so improvement is needed. SUMMARY

[0005] In order to solve the above-mentioned problems, the application provides a high-precision intelligent instrument manufacturing device.

[0006] The high-precision intelligent instrument manufacturing device provided by the application adopts the following technical scheme: The application discloses a high-precision-based intelligent instrument manufacturing device, which comprises a mounting table, two groups of first linear guides and two groups of second linear guides are arranged on the mounting table, the first linear guides and the second linear guides are parallel to each other, the two groups of second linear guides are arranged between the two groups of first linear guides, a first cross frame is arranged on sliding seats of the two groups of first linear guides, a second cross frame is arranged on sliding seats of the two groups of second linear guides, the first cross frame is arranged higher than the second cross frame, a detection table is arranged between the two groups of second linear guides, a circuit board placing groove is arranged on the detection table, a first detection mechanism for detecting the quality of solder joints on the circuit board is arranged on the first cross frame, and a second detection mechanism for detecting internal invisible defects of the circuit board is arranged on the second cross frame.

[0007] By adopting the technical scheme, the first detection mechanism can accurately identify and classify complex defects such as virtual welding, cold welding and bridging by fusing 3D topography and high-definition optical features, can effectively distinguish dangerous electrical bridging from harmless flux residues, and can reduce the misjudgment rate to a very low level; the second detection mechanism can accurately locate deep defects such as delamination, cavity and via fracture by cooperatively analyzing the electrical and thermal characteristics of the circuit board, can early warn potential leakage channels formed due to damp and carbonization before insulation completely fails, and can further judge the nature of defects such as distinguishing damp and carbonization, so as to realize the evaluation and prediction of long-term reliability of products and change post-detection into pre-prevention.

[0008] The device further comprises two groups of parallel first cross frames and second cross frames arranged at different heights and respectively carrying the first detection mechanism and the second detection mechanism, so that synchronous or sequential detection of the quality of solder joints and internal invisible defects of the circuit board is realized, and the detection efficiency is greatly improved; the detection table is arranged between the second linear guides and is provided with the circuit board placing groove, so that stable positioning of the circuit board during detection is ensured, and measurement errors caused by displacement are reduced; the first cross frame is arranged higher than the second cross frame, so that interference of the two detection mechanisms in space is avoided, and the independence and smoothness of respective detection paths are ensured.

[0009] Optionally, the first detection assembly comprises a third linear guide, a first lifting cylinder, a second lifting cylinder, a solder joint shape detection assembly and a solder joint color detection assembly, the third linear guide is arranged on the first cross frame along the length direction of the first cross frame, the first lifting cylinder and the second lifting cylinder are arranged on two sliding seats of the third linear guide in a spaced mode, the solder joint shape detection assembly is arranged on the extension end of the first lifting cylinder and is used for detecting the topography of the solder joint, and the solder joint color detection assembly is arranged on the extension end of the second lifting cylinder and is used for detecting the color and texture of the solder joint.

[0010] By adopting the technical scheme, the first detection mechanism realizes the cooperative movement of the solder shape detection assembly and the solder color detection assembly in the horizontal direction through the third linear guide rail, covering the entire circuit board; the first lifting cylinder and the second lifting cylinder enable the solder shape detection assembly and the solder color detection assembly to be independently and accurately positioned in the vertical direction, adapting to different heights and types of solder points; the solder shape detection and color detection are separated and arranged in parallel, allowing simultaneous multi-dimensional data acquisition and analysis of the physical appearance (such as shape, height, and contour) and surface optical properties (such as color, gloss, and oxidation) of the solder points. This cooperative detection mode significantly improves the recognition accuracy and comprehensiveness of various defects such as virtual welding, cold welding, insufficient or excessive solder, and oxidation discoloration.

[0011] Optionally, the solder shape detection assembly comprises a first lifting plate, a first drive motor, a first mounting plate, a second mounting plate, a light-shield cylinder, a ring-shaped light source, and a three-dimensional scanner. The first lifting plate is vertically fixed on the extension end of the first lifting cylinder. The first mounting plate and the second mounting plate are arranged on the side wall of the first lifting plate in a spaced manner and are perpendicular to the first lifting plate. The first mounting plate is arranged above the second mounting plate. The first drive motor is arranged on the first mounting plate. The light-shield cylinder is arranged below the second mounting plate and is fixedly connected with the output shaft of the first drive motor. The ring-shaped light source is fixedly arranged on the inner wall of the light-shield cylinder. The three-dimensional scanner is fixedly embedded in the end of the light-shield cylinder away from the first drive motor.

[0012] By adopting the technical scheme, the first lifting cylinder drives the entire solder shape detection assembly to lift, realizing accurate adjustment of the detection distance. The first drive motor drives the light-shield cylinder and the internal components to rotate, enabling the three-dimensional scanner to obtain three-dimensional appearance data of the solder point from multiple angles, reducing the detection dead angle. The ring-shaped light source provides uniform and shadow-free illumination, effectively highlighting the contour features of the solder point. The light-shield cylinder isolates the environmental light interference, creating a stable optical environment for the three-dimensional scanner. The three-dimensional scanner is embedded in the end, which can accurately reconstruct the three-dimensional model of the solder point and accurately measure its volume, height, and curvature, thereby reliably detecting the shape defects such as solder bridging, tip pulling, and poor wetting.

[0013] Optionally, the solder joint color detection assembly comprises a second lifting plate, a second drive motor, a third mounting plate, a rotating cylinder, a mounting cylinder, a polarizer, a filter, a direct light source, an RGB camera and a switching structure, the second lifting plate is vertically fixed on the telescopic end of the second lifting cylinder, the third mounting plate is arranged on the side wall of the second lifting plate and perpendicular to the second lifting plate, the second drive motor is arranged on the third mounting plate, the rotating cylinder is arranged on the output shaft of the second drive motor, the mounting cylinder is arranged in the rotating cylinder and fixedly connected with the inner wall of the mounting cylinder away from the second drive motor, the polarizer and the filter are both arranged with multiple groups and spaced apart upward and downward in the mounting cylinder, the direct light source is arranged in the mounting cylinder and above the polarizer and the filter, the RGB camera is arranged on the side wall of the mounting cylinder for photographing the irradiated solder joint, and the switching structure is arranged in the mounting cylinder for switching the polarizer and the filter respectively, and the light emitted by the direct light source is irradiated on the solder joint through the polarizer and the filter.

[0014] By adopting the above technical scheme, the second lifting cylinder realizes accurate focusing of the solder joint color detection assembly in the vertical direction; the second drive motor can drive the whole optical head to rotate to adjust the shooting angle; the multiple groups of built-in polarizers and filters are flexibly combined through the switching structure, which can effectively eliminate the reflection and glare on the surface of the solder joint, filter the light of specific wave bands, highlight the real color and texture details of the solder joint; the direct light source provides stable illumination, and the RGB camera captures high-fidelity color images under the optimized lighting conditions; the assembly can sensitively detect color abnormalities caused by overheating, oxidation or pollution by analyzing the color saturation, hue consistency and texture uniformity of the solder joint, realize non-destructive evaluation of the process quality and material state of the solder joint.

[0015] Optionally, the switching structure comprises a third driving motor, a polarization disc, a filter disc, a first ratchet wheel, a first pawl, a second ratchet wheel, a second pawl and a limiting piece, the third driving motor is arranged above the mounting cylinder, the polarization disc and the filter disc are both rotationally arranged in the mounting cylinder, and the polarization disc is arranged above the filter disc, a plurality of polarization plates are arranged on the polarization disc in a circumferential direction of the center of the polarization disc, a plurality of filter plates are arranged on the filter disc in a circumferential direction of the center of the filter disc, the first ratchet wheel is fixedly arranged in the middle of the polarization disc, the first pawl is arranged on the output shaft of the third driving motor, when the third driving motor rotates forward, the first ratchet wheel and the first pawl are engaged with each other, the second ratchet wheel is fixedly arranged in the middle of the filter disc, the second pawl is arranged on the output shaft of the third driving motor, when the third driving motor reversely rotates, the second ratchet wheel and the second pawl are engaged with each other, the limiting piece is provided in multiple groups and is arranged on the side wall of the polarization disc and the filter disc respectively, for keeping the filter disc fixed when the polarization disc is rotated, and for keeping the polarization disc fixed when the filter disc is rotated.

[0016] By adopting the above technical scheme, the switching structure utilizes a single third driving motor to cooperate with a ratchet wheel and pawl mechanism to achieve separate driving of the polarization disc and the filter disc: when the motor rotates forward, the polarization disc is driven to switch the polarization plates through the first ratchet wheel and the first pawl; when the motor reverses, the filter disc is driven to switch the filter plates through the second ratchet wheel and the second pawl. The arrangement of the limiting piece ensures that when one of the discs is switched, the other disc can remain stable and immobile, preventing unintended element switching and ensuring the accuracy and repeatability of optical condition changes, so that the solder color detection can be quickly and reliably performed under multiple preset optical modes.

[0017] Optionally, the limiting piece comprises a top bead and a spring, a plurality of springs are arranged in the side wall of the polarization disc and the filter disc, and a plurality of top beads are arranged at the end of the plurality of springs, a plurality of arc-shaped limiting grooves are formed in the side wall of the mounting cylinder, and the spring pushes the top bead into the arc-shaped limiting groove.

[0018] By adopting the above technical scheme, the limiting piece adopts a mechanical structure of a top bead and a spring, and the spring force of the spring always presses the top bead into the arc-shaped limiting groove of the inner wall of the mounting cylinder. When the polarization disc or the filter disc needs to be rotated, the spring force needs to be overcome to make the top bead slide through the limiting groove; when rotated to a specified position, the top bead is clamped into the next limiting groove under the action of the spring, a clear positioning feeling is generated and the position of the disc is locked. Stable damping and accurate indexing positioning are provided, effectively preventing the free rotation or drift of the disc body in the non-driving state, ensuring the position accuracy and stability of the polarization plates and the filter plates during work, and further ensuring the constancy and reliability of the detection illumination conditions.

[0019] Optionally, the second detection component mechanism comprises a fourth linear guide rail, a microwave electric field sensor and a high-speed infrared thermal imager, the fourth linear guide rail is arranged on the second cross frame in parallel to the length direction of the second cross frame, the microwave electric field sensor and the high-speed infrared thermal imager are arranged on the sliding seat of the fourth linear guide rail in a spaced manner, the microwave electric field sensor is used to generate a dielectric constant distribution map or an electric field intensity distribution map of the powered circuit board, and the high-speed infrared thermal imager is used to generate a phase map and an amplitude map of the powered circuit board.

[0020] By adopting the above technical scheme, the second detection mechanism enables the microwave electric field sensor and the high-speed infrared thermal imager to scan above the circuit board through the fourth linear guide rail, thereby realizing comprehensive exploration of internal defects of the circuit board. The microwave electric field sensor can non-contactly find internal physical defects such as delamination, cracks and cavities by detecting changes in the dielectric constant distribution or the electric field intensity distribution of the powered circuit board; and the high-speed infrared thermal imager can sensitively identify thermal abnormalities such as overheating points, thermal short circuits, poor connections or component faults by capturing the thermal field distribution (the phase map and the amplitude map) of the powered circuit board. The two kinds of technologies complement each other, and the invisible hidden defects invisible to the naked eye are detected in two dimensions of electromagnetism and thermodynamics, thereby greatly improving the accuracy and reliability of internal quality evaluation of the circuit board.

[0021] Optionally, a first connecting rod is fixedly arranged on the side wall of the rotating cylinder, a second connecting rod is fixedly arranged on the side wall of the mounting cylinder, the first connecting rod is arranged above the second connecting rod, an electric telescopic rod is rotationally arranged at one end of the first connecting rod away from the rotating cylinder, a rotating plate is rotationally arranged at the end of the second connecting rod away from the rotating cylinder, one end of the rotating plate is rotationally connected with the telescopic end of the electric telescopic rod, and a reflecting sheet is arranged on the side of the rotating plate close to the mounting cylinder.

[0022] By adopting the above technical scheme, the adjustable reflecting structure composed of the first connecting rod, the second connecting rod, the electric telescopic rod, the rotating plate and the reflecting sheet can flexibly change the light path of the auxiliary lighting. The telescopic rod of the electric telescopic rod can accurately control the inclination angle of the rotating plate, thereby adjusting the orientation of the reflecting sheet and reflecting part of the light of the direct light source to a specific area of the welding point, such as the side surface or the recess. This effectively makes up for the shadow or uneven illumination that may be caused by the direct light, provides a more uniform, three-dimensional and suitable lighting environment for the RGB camera, and helps to detect welding points with complex structure, hidden position or mirror reflection characteristics, thereby improving the clarity, contrast and color authenticity of the collected images.

[0023] In summary, the present application has at least one of the following beneficial technical effects: 1. The first lifting cylinder drives the entire solder joint morphology detection assembly to lift, realizing precise adjustment of the detection distance; the first drive motor drives the light-shielding cylinder and the internal components to rotate, enabling the three-dimensional scanner to obtain three-dimensional morphology data of the solder joint from multiple angles, reducing detection dead angles; the ring-shaped light source provides uniform and shadow-free illumination, effectively highlighting the profile features of the solder joint, and the light-shielding cylinder isolates environmental light interference, creating a stable optical environment for the three-dimensional scanner; the three-dimensional scanner is embedded at the end, which can accurately reconstruct the three-dimensional model of the solder joint, accurately measure its volume, height, curvature and other morphology parameters, and thus reliably detect defects such as solder joint bridging, tip pulling and poor wetting; 2. The second lifting cylinder realizes precise focusing of the solder joint color detection assembly in the vertical direction; the second drive motor can drive the entire optical head to rotate, adjusting the shooting angle; the built-in multiple polarizing plates and filters are flexibly combined through a switching structure, which can effectively eliminate the reflection and glare on the surface of the solder joint, and filter specific waveband light, thus highlighting the true color and texture details of the solder joint; the direct light source provides stable illumination, and the RGB camera captures high-fidelity color images under optimized lighting conditions; this assembly can sensitively detect color abnormalities caused by overheating, oxidation or contamination by analyzing the color saturation, hue consistency and texture uniformity of the solder joint, achieving non-destructive evaluation of the solder joint process quality and material state; 3. The second detection mechanism enables the microwave electric field sensor and high-speed infrared thermal imager to scan above the circuit board through the fourth linear guide rail, realizing comprehensive exploration of internal defects. The microwave electric field sensor can non-contact detect internal physical defects such as delamination, cracks and cavities by detecting changes in the dielectric constant distribution or electric field intensity distribution of the circuit board after power-on; the high-speed infrared thermal imager can sensitively identify thermal anomalies such as overheating points, thermal shorts, poor connections or component failures by capturing the thermal field distribution (phase and amplitude) of the circuit board during power-on. The two technologies complement each other, providing in-depth detection of invisible defects from the dimensions of electromagnetism and thermodynamics, greatly improving the accuracy and reliability of internal quality evaluation of the circuit board; 4. The adjustable reflector system composed of the first connecting rod, the second connecting rod, the electric telescopic rod, the rotating plate and the reflector can flexibly change the light path of the auxiliary illumination. The extension and retraction of the electric telescopic rod can accurately control the inclination angle of the rotating plate, thereby adjusting the orientation of the reflector, reflecting part of the light from the direct light source to specific areas of the solder joint, such as the side or recess. This effectively compensates for the shadows or uneven illumination that may be caused by direct light, providing a more uniform, three-dimensional and suitable lighting environment for the RGB camera, which helps to detect complex-structured, position-hidden or mirror-reflecting solder joints, and improves the clarity, contrast and color authenticity of the collected images. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative effort.

[0025] Figure 1 is a schematic diagram of the overall structure of the embodiment of the present application; Figure 2 is a schematic diagram of the cross-sectional structure of the weld point morphology detection assembly; Figure 3 is a schematic diagram of the cross-sectional structure of the weld point color detection assembly; Figure 4 is a schematic diagram of the cross-sectional structure of the limiting piece; Figure 5 is a schematic diagram of the A part of Figure 1 is an enlarged schematic diagram of the A part of Figure 6 is an enlarged schematic diagram of the B part of Figure 1 .

[0026] Reference signs: 1, mounting table; 11, first linear guide rail; 111, first cross frame; 12, second linear guide rail; 121, second cross frame; 13, detection table; 14, circuit board placing groove; 2, first detection mechanism; 21, third linear guide rail; 22, first lifting cylinder; 23, second lifting cylinder; 24, weld point morphology detection assembly; 241, first lifting plate; 242, first driving motor; 243, first mounting plate; 244, second mounting plate; 245, light shielding cylinder; 246, annular light source; 247, three-dimensional scanner; 25, weld point color detection assembly; 251, second lifting plate; 252, second driving motor; 253, third mounting plate; 254, rotating cylinder; 255, mounting cylinder; 256, polarizer; 257, filter; 258, direct light source; 259, RGB camera; 3, switching structure; 31, third driving motor; 32, polarizing disc; 33, filter disc; 34, first ratchet wheel; 35, first pawl; 36, second ratchet wheel; 37, second pawl; 38, limiting piece; 381, top bead; 382 spring; 4, second detection mechanism; 41, fourth linear guide rail; 42, microwave electric field sensor; 43, high-speed infrared thermal imager; 5, first connecting rod; 6, second connecting rod; 7, electric telescopic rod; 8, rotating plate. DETAILED DESCRIPTION

[0027] The present application will be further described below in combination with the drawings. Figures 1-6 The present application will be further described below in combination with the drawings.

[0028] The embodiment of the present application discloses a high-precision-based intelligent instrument manufacturing device, which is described with reference to Figure 1The application discloses a high-precision-based intelligent instrument manufacturing device, which comprises a mounting table 1, two groups of first linear guides 11 and two groups of second linear guides 12 are fixedly installed on the mounting table 1 by bolts, the first linear guides 11 and the second linear guides 12 are parallel to each other, the two groups of second linear guides 12 are arranged between the two groups of first linear guides 11, a first cross frame 111 is welded and installed on a sliding seat of the two groups of first linear guides 11, a second cross frame 121 is welded and installed on a sliding seat of the two groups of second linear guides 12, the first cross frame 111 is arranged higher than the second cross frame 121, a detection table 13 is arranged between the two groups of second linear guides 12, a circuit board placing groove 14 is arranged on the detection table 13, a first detection mechanism 2 is arranged on the first cross frame 111, and a second detection mechanism 4 is arranged on the second cross frame 121.

[0029] The first detection mechanism 2 in the application can accurately identify and classify complex defects such as virtual welding, cold welding and bridging by fusing 3D topography and high-definition optical characteristics, and can effectively distinguish dangerous electrical bridging from harmless flux residues, so that the misjudgment rate is reduced to a very low level; the second detection mechanism 4 can accurately locate deep defects such as delamination, cavity and via fracture by synergistically analyzing the electrical and thermal characteristics of the circuit board, and can early warn potential leakage channels formed due to damp and carbonization before insulation completely fails. In addition, the nature of defects such as damp and carbonization can be deeply judged, so that the long-term reliability of products can be evaluated and predicted, and post-detection can be changed into pre-prevention.

[0030] The device also comprises two groups of parallel first cross frames 111 and second cross frames 121 arranged at different heights, and the first detection mechanism 2 and the second detection mechanism 4 are respectively arranged on the first cross frames 111 and the second cross frames 121, so that the quality of the circuit board welding points and internal invisible defects can be synchronously or sequentially detected, and the detection efficiency is greatly improved; the detection table 13 is arranged between the second linear guides 12 and is provided with the circuit board placing groove 14, so that the stable positioning of the circuit board during the detection process is ensured, and the measurement error caused by displacement is reduced; the first cross frames 111 are arranged higher than the second cross frames 121, so that the interference of the two detection mechanisms in space is avoided, and the independence and smoothness of the respective detection paths are ensured.

[0031] Refer to Figure 1 , Figure 2 and Figure 3The first detection assembly in the embodiment comprises a third linear guide rail 21, a first lifting cylinder 22, a second lifting cylinder 23, a weld point shape detection assembly 24, and a weld point color detection assembly 25. The third linear guide rail 21 is bolted and fixedly installed on the first cross frame 111 along the length direction of the first cross frame 111. The first lifting cylinder 22 and the second lifting cylinder 23 are bolted and fixedly installed on the two sliding seats of the third linear guide rail 21 at intervals. The weld point shape detection assembly 24 is installed on the telescopic end of the first lifting cylinder 22 and is used for detecting the appearance of the weld point. The weld point color detection assembly 25 is arranged on the telescopic end of the second lifting cylinder 23 and is used for detecting the color and texture of the weld point.

[0032] The first detection mechanism 2 realizes the cooperative movement of the weld point shape detection assembly 24 and the weld point color detection assembly 25 in the horizontal direction through the third linear guide rail 21, covering the whole area of the circuit board. The first lifting cylinder 22 and the second lifting cylinder 23 enable the weld point shape detection assembly 24 and the weld point color detection assembly 25 to be independently and accurately positioned in the vertical direction, adapting to weld points of different heights and types. The weld point shape detection and color detection are separated and arranged in parallel, allowing the physical appearance (such as shape, height, and contour) and the surface optical properties (such as color, gloss, and oxidation) of the weld point to be simultaneously collected and analyzed in multiple dimensions. This cooperative detection mode significantly improves the recognition accuracy and comprehensiveness of various defects such as fake welding, cold welding, insufficient or excessive solder, and oxidation discoloration.

[0033] Referring to Figure 1 and Figure 2 In order to detect the shape of the weld point, the weld point shape detection assembly 24 in the embodiment comprises a first lifting plate 241, a first driving motor 242, a first mounting plate 243, a second mounting plate 244, a light shielding cylinder 245, a ring-shaped light source 246, and a three-dimensional scanner 247. The first lifting plate 241 is vertically welded and fixedly installed on the telescopic end of the first lifting cylinder 22. The first mounting plate 243 and the second mounting plate 244 are welded and installed on the side wall of the first lifting plate 241 at intervals and are both perpendicular to the first lifting plate 241. The first mounting plate 243 is installed above the second mounting plate 244. The first driving motor 242 is bolted and fixedly installed on the first mounting plate 243. The light shielding cylinder 245 is installed below the second mounting plate 244 and is bolted and fixedly connected with the output shaft of the first driving motor 242. The ring-shaped light source 246 is fixedly installed on the inner wall of the light shielding cylinder. The three-dimensional scanner 247 is fixedly and inlaidly installed at the end of the light shielding cylinder 245 away from the first driving motor 242.

[0034] The first lifting cylinder 22 drives the whole welding point morphology detection assembly 24 to lift, so as to accurately adjust the detection distance; the first driving motor 242 drives the light shielding cylinder 245 and the internal components to rotate, so that the three-dimensional scanner 247 can obtain three-dimensional morphology data of the welding point from multiple angles, thereby reducing the detection dead angle; the annular light source 246 provides uniform and shadow-free illumination, effectively highlights the contour features of the welding point, and the light shielding cylinder 245 isolates the environmental light interference, thereby creating a stable optical environment for the three-dimensional scanner 247; the three-dimensional scanner 247 is embedded in the end portion, can accurately reconstruct the three-dimensional model of the welding point, accurately measure the volume, height, curvature and other morphology parameters of the welding point, and reliably detect the morphology defects such as welding point bridging, sharp pulling and poor wetting.

[0035] With reference to Figure 1 and Figure 3 The welding point color detection assembly 25 in the embodiment includes a second lifting plate 251, a second driving motor 252, a third mounting plate 253, a rotating cylinder 254, a mounting cylinder 255, a polarizer 256, a filter 257, a direct light source 258, an RGB camera 259 and a switching structure 3. The second lifting plate 251 is vertically welded and mounted on the telescopic end of the second lifting cylinder 23. The third mounting plate 253 is bolted and fixedly mounted on the side wall of the second lifting plate 251 and is perpendicular to the second lifting plate 251. The second driving motor 252 is bolted and fixedly mounted on the third mounting plate 253. The rotating cylinder 254 is bolted and fixedly mounted on the output shaft of the second driving motor 252. The mounting cylinder 255 is fixedly mounted in the rotating cylinder 254 and is bolted and fixedly connected with the inner wall of the mounting cylinder 255 away from the second driving motor 252. The polarizer 256 and the filter 257 are both installed with multiple groups and are installed in the mounting cylinder 255 in an upper and lower interval. The direct light source 258 is fixedly mounted in the mounting cylinder 255 and is located above the polarizer 256 and the filter 257. The RGB camera 259 is bolted and fixedly mounted on the side wall of the mounting cylinder 255 and is used for taking pictures of the irradiated welding point. The switching structure 3 is installed in the mounting cylinder 255 and is used for switching the polarizer 256 and the filter 257 respectively. The light emitted by the direct light source 258 is irradiated on the welding point through the polarizer 256 and the filter 257.

[0036] The second lifting cylinder 23 realizes accurate focusing of the solder color detection assembly 25 in the vertical direction; the second driving motor 252 can drive the entire optical head to rotate to adjust the shooting angle; the built-in multiple sets of polarizing plates 256 and filters 257 are flexibly combined through the switching structure 3, which can effectively eliminate the reflection and glare on the surface of the solder joint, and filter the light of a specific wave band, thereby highlighting the true color and texture details of the solder joint; the direct light source 258 provides stable illumination, and the RGB camera 259 captures high-fidelity color images under optimized lighting conditions; this assembly can sensitively detect color abnormalities caused by overheating, oxidation or contamination by analyzing the color saturation, hue consistency and texture uniformity of the solder joint, and realize non-destructive evaluation of the process quality and material state of the solder joint.

[0037] With reference to Figure 3 and Figure 4 Different colors of different solders may affect the detection structure, so the solder switching structure 3 in the embodiment includes a third driving motor 31, a polarization disc 32, a filter disc 33, a first ratchet wheel 34, a first pawl 35, a second ratchet wheel 36, a second pawl 37 and a limiting piece 38. The third driving motor 31 is arranged above the mounting cylinder 255, the polarization disc 32 and the filter disc 33 are both rotationally mounted in the mounting cylinder 255, and the polarization disc 32 is mounted above the filter disc 33. Multiple sets of polarizing plates 256 are installed on the polarization disc 32 in a circumferential direction around the center of the polarization disc 32, and multiple sets of filters 257 are installed on the filter disc 33 in a circumferential direction around the center of the filter disc 33. The first ratchet wheel 34 is fixedly welded and installed in the middle of the polarization disc 32, the first pawl 35 is rotationally installed on the output shaft of the third driving motor 31, and when the third driving motor 31 rotates forward, the first ratchet wheel 34 and the first pawl 35 are engaged with each other. The second ratchet wheel 36 is fixedly welded and installed in the middle of the filter disc 33, the second pawl 37 is rotationally installed on the output shaft of the third driving motor 31, and when the third driving motor 31 reverses, the second ratchet wheel 36 and the second pawl 37 are engaged with each other. The limiting piece 38 is provided in multiple sets and is respectively installed on the side walls of the polarization disc 32 and the filter disc 33, for keeping the filter disc 33 fixed when the polarization disc 32 is rotated, and for keeping the polarization disc 32 fixed when the filter disc 33 is rotated.

[0038] With reference to Figure 3 and Figure 4, the switching structure 3 uses a single third driving motor 31 to cooperate with a ratchet and pawl mechanism to achieve separate driving of the polarization disc 32 and the filter disc 33. When the motor is rotated forward, the polarization disc 32 is driven to switch the polarizer 256 through the first ratchet 34 and the first pawl 35. When the motor is rotated reversely, the filter disc 33 is driven to switch the filter 257 through the second ratchet 36 and the second pawl 37. The setting of the limiting part 38 ensures that when one of the discs is switched, the other disc can remain stable and immobile, preventing unintended switching of components and ensuring the accuracy and repeatability of changes in optical conditions, so that the solder color detection can be quickly and reliably performed under various preset optical modes.

[0039] With reference to Figure 4 The limiting part 38 in the embodiment includes a top bead 381 and a spring 382. Multiple sets of the spring 382 are arranged in the side walls of the polarization disc 32 and the filter disc 33, and multiple sets of the top bead 381 are arranged at the ends of the multiple sets of the spring 382. Multiple arc-shaped limiting grooves are formed in the side wall of the mounting cylinder 255, and the spring 382 pushes the top bead 381 into the arc-shaped limiting groove. In the embodiment, the number of the arc-shaped limiting grooves is the same as the number of the filter and the polarizer.

[0040] The limiting part 38 adopts the mechanical structure of the top bead 381 and the spring 382, and the spring 382 always pushes the top bead 381 into the arc-shaped limiting groove in the inner wall of the mounting cylinder 255 by the elastic force. When the polarization disc 32 or the filter disc 33 needs to be rotated, the force of the spring 382 needs to be overcome to make the top bead 381 slide through the limiting groove. When it is rotated to the specified position, the top bead 381 is clamped into the next limiting groove under the action of the spring 382, producing a clear positioning feeling and locking the position of the disc. Stable damping and accurate indexing positioning are provided, effectively preventing the free rotation or drift of the disc body in the non-driving state, ensuring the position accuracy and stability of the polarizer 256 and the filter 257 during work, and further ensuring the constancy and reliability of the detection light conditions.

[0041] With reference to Figure 5 The second detection assembly mechanism in the embodiment includes a fourth linear guide rail 41, a microwave electric field sensor 42, and a high-speed infrared thermal imager 43. The fourth linear guide rail 41 is arranged on the second cross frame 121 parallel to the length direction of the second cross frame 121. The microwave electric field sensor 42 and the high-speed infrared thermal imager 43 are arranged on the sliding seat of the fourth linear guide rail 41 in a spaced manner. The microwave electric field sensor 42 is used to generate a dielectric constant distribution map or an electric field intensity distribution map of the energized circuit board. The high-speed infrared thermal imager 43 is used to generate a phase map and an amplitude map of the energized circuit board.

[0042] The second detection mechanism 4 enables the microwave electric field sensor 42 and the high-speed infrared thermal imager 43 to scan above the circuit board through the fourth linear guide rail 41, so as to realize comprehensive exploration of internal defects of the circuit board. The microwave electric field sensor 42 can non-contact detect internal physical defects such as delamination, cracks and cavities by detecting the dielectric constant distribution or the electric field intensity distribution change of the circuit board after power-on; the high-speed infrared thermal imager 43 can sensitively identify thermal abnormalities such as overheating points, thermal short circuits, poor connections or component faults by capturing the thermal field distribution (phase diagram and amplitude diagram) of the circuit board during power-on work. The two kinds of technologies complement each other, and the invisible hidden defects invisible to the naked eye are detected from two dimensions of electromagnetism and thermodynamics, so that the accuracy and reliability of internal quality evaluation of the circuit board are greatly improved.

[0043] Referring to Figure 6 In order to further improve the shooting effect of the RGB camera 259, the first connecting rod 5 is fixedly arranged on the side wall of the rotating cylinder 254, the second connecting rod 6 is fixedly arranged on the side wall of the mounting cylinder 255, the first connecting rod 5 is arranged above the second connecting rod 6, the end of the first connecting rod 5 away from the rotating cylinder 254 is rotationally arranged with the electric telescopic rod 7, the end of the second connecting rod 6 away from the rotating cylinder 254 is rotationally arranged with the rotating plate 8, one end of the rotating plate 8 is rotationally connected with the telescopic end of the electric telescopic rod 7, and the side of the rotating plate 8 close to the mounting cylinder 255 is provided with a reflecting sheet.

[0044] The adjustable reflecting structure composed of the first connecting rod 5, the second connecting rod 6, the electric telescopic rod 7, the rotating plate 8 and the reflecting sheet can flexibly change the light path of the auxiliary lighting. The telescopic rod 7 can accurately control the inclination angle of the rotating plate 8, so as to adjust the direction of the reflecting sheet and reflect part of the light of the direct light source 258 to a specific area of the welding point, such as the side surface or the recess. This effectively makes up for the shadow or uneven illumination that may be caused by direct light, provides a more uniform, three-dimensional and suitable lighting environment for the RGB camera 259, helps to detect the welding points with complex structure, hidden position or mirror reflection characteristics, and improves the clarity, contrast and color authenticity of the collected images.

[0045] The implementation principle of the embodiment of the intelligent instrument manufacturing device based on high precision is as follows: For hidden defects such as internal virtual welding and pores of the welding point, the three-dimensional scanner 247 and the RGB camera 259 work cooperatively to realize accurate identification. The three-dimensional scanner 247 rotates at multiple angles under the annular light source 246, reconstructs the three-dimensional morphology of the welding point, and judges virtual welding and bridging through profile anomaly; the RGB camera 259 eliminates reflection through the combination of the polarizer 256 and the filter 257, captures the color and texture changes of the welding point, and identifies defects such as oxidation and cold welding.

[0046] For the deep defects such as the internal wiring fracture of the circuit board, the interlayer micro short circuit, a microwave electric field sensor 42 and a high-speed infrared thermal imager 43 are adopted for synchronous scanning analysis. The microwave sensor locates the layering and the cavity by detecting the dielectric constant distribution change; the infrared thermal imager identifies the electric leakage channel and the potential carbonization area by collecting the thermal field phase diagram.

[0047] Unless otherwise defined, technical terms or scientific terms used in the present application shall be understood as having the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terms "first", "second", "third" and the like used in the specification and claims of the present application do not denote any order, quantity or importance, but are used to distinguish different components. The terms "one" or "a" or the like do not denote a quantity limitation, but mean that there is at least one. The terms "including", "containing" and the like mean that the elements or objects before the "including" or "containing" cover the elements or objects listed after the "including" or "containing" and their equivalents, and do not exclude other elements or objects. The terms "upper", "lower", "left", "right" and the like are only used to represent relative positional relationships, and when the absolute positions of the described objects are changed, the relative positional relationships may also be changed accordingly.

[0048] The above are optional embodiments of the present application, and do not limit the protection scope of the present application, therefore: any equivalent changes made according to the structure, shape, principle of the present application shall be covered within the protection scope of the present application.

Claims

1. A high-precision-based intelligent instrument manufacturing device, comprising a mounting table (1), characterized in that: The mounting table (1) is provided with two groups of first linear guides (11) and two groups of second linear guides (12), the first linear guides (11) and the second linear guides (12) are parallel to each other, the two groups of second linear guides (12) are arranged between the two groups of first linear guides (11), the sliding seats of the two groups of first linear guides (11) are provided with first cross frames (111), the sliding seats of the two groups of second linear guides (12) are provided with second cross frames (121), the first cross frames (111) are arranged higher than the second cross frames (121), a detection table (13) is arranged between the two groups of second linear guides (12), the detection table (13) is provided with a circuit board placing groove (14), the first cross frames (111) are provided with a first detection mechanism (2) for detecting the quality of solder joints on the circuit board, and the second cross frames (121) are provided with a second detection mechanism (4) for detecting internal invisible defects of the circuit board.

2. A high precision based smart instrumentation manufacturing device as claimed in claim 1, wherein: The first detection assembly comprises a third linear guide (21), a first lifting cylinder (22), a second lifting cylinder (23), a solder joint shape detection assembly (24) and a solder joint color detection assembly (25), the third linear guide (21) is arranged on the first cross frame (111) along the length direction of the first cross frame (111), the first lifting cylinder (22) and the second lifting cylinder (23) are arranged on the two sliding seats of the third linear guide (21) in a spaced manner, the solder joint shape detection assembly (24) is arranged on the telescopic end of the first lifting cylinder (22) and is used for detecting the appearance of the solder joint, and the solder joint color detection assembly (25) is arranged on the telescopic end of the second lifting cylinder (23) and is used for detecting the color and texture of the solder joint.

3. A high precision based smart instrumentation manufacturing device as claimed in claim 2, wherein: The solder joint shape detection assembly (24) comprises a first lifting plate (241), a first driving motor (242), a first mounting plate (243), a second mounting plate (244), a light shielding cylinder (245), an annular light source (246) and a three-dimensional scanner (247), the first lifting plate (241) is vertically fixedly arranged on the telescopic end of the first lifting cylinder (22), the first mounting plate (243) and the second mounting plate (244) are arranged on the side wall of the first lifting plate (241) in a spaced manner and are perpendicular to the first lifting plate (241), the first mounting plate (243) is arranged above the second mounting plate (244), the first driving motor (242) is arranged on the first mounting plate (243), the light shielding cylinder (245) is arranged below the second mounting plate (244) and is fixedly connected with the output shaft of the first driving motor (242), the annular light source (246) is fixedly arranged on the inner wall of the light shielding cylinder (245), and the three-dimensional scanner (247) is fixedly embedded on the end of the light shielding cylinder (245) away from the first driving motor (242).

4. A high precision based smart instrumentation manufacturing device as claimed in claim 2, wherein: The welding spot color detection assembly (25) comprises a second lifting plate (251), a second drive motor (252), a third mounting plate (253), a rotating cylinder (254), a mounting cylinder (255), a polarizer (256), a filter (257), a direct light source (258), an RGB camera (259) and a switching structure (3), the second lifting plate (251) is vertically fixed on the telescopic end of the second lifting cylinder (23), the third mounting plate (253) is arranged on the side wall of the second lifting plate (251) and perpendicular to the second lifting plate (251), the second drive motor (252) is arranged on the third mounting plate (253), the rotating cylinder (254) is arranged on the output shaft of the second drive motor (252), the mounting cylinder (255) is arranged in the rotating cylinder (254) and fixedly connected with the inner wall of the mounting cylinder (255) away from the second drive motor (252), the polarizer (256) and the filter (257) are both arranged with multiple groups and arranged in the mounting cylinder (255) in an up-down interval, the direct light source (258) is arranged in the mounting cylinder (255) and above the polarizer (256) and the filter (257), the RGB camera (259) is arranged on the side wall of the mounting cylinder (255) and used for photographing the irradiated welding spot, the switching structure (3) is arranged in the mounting cylinder (255) and used for switching the polarizer (256) and the filter (257) respectively, and the light emitted by the direct light source (258) is irradiated on the welding spot through the polarizer (256) and the filter (257).

5. A high precision based smart instrumentation device manufacturing apparatus as claimed in claim 4, wherein: The switching structure (3) comprises a third driving motor (31), a polarization disc (32), a filter disc (33), a first ratchet wheel (34), a first pawl (35), a second ratchet wheel (36), a second pawl (37) and a limiting piece (38), the third driving motor (31) is arranged above the mounting cylinder (255), the polarization disc (32) and the filter disc (33) are both rotationally arranged in the mounting cylinder (255), and the polarization disc (32) is arranged above the filter disc (33), a plurality of groups of polarization plates (256) are arranged on the polarization disc (32) in a circumferential direction of the center of the polarization disc (32), a plurality of groups of filter plates (257) are arranged on the filter disc (33) in a circumferential direction of the center of the filter disc (33), the first ratchet wheel (34) is fixedly arranged in the middle of the polarization disc (32), the first pawl (35) is arranged on the output shaft of the third driving motor (31), when the third driving motor (31) rotates forward, the first ratchet wheel (34) and the first pawl (35) are engaged with each other, the second ratchet wheel (36) is fixedly arranged in the middle of the filter disc (33), the second pawl (37) is arranged on the output shaft of the third driving motor (31), when the third driving motor (31) rotates reversely, the second ratchet wheel (36) and the second pawl (37) are engaged with each other, the limiting piece (38) is arranged in a plurality of groups and arranged on the side walls of the polarization disc (32) and the filter disc (33) respectively, for keeping the filter disc (33) fixed when the polarization disc (32) is rotated, and for keeping the polarization disc (32) fixed when the filter disc (33) is rotated.

6. A high precision based smart instrumentation device manufacturing apparatus as claimed in claim 5, wherein: The limiting piece (38) comprises a top bead (381) and a spring (382), a plurality of groups of the spring (382) are arranged in the side walls of the polarization disc (32) and the filter disc (33), a plurality of groups of the top bead (381) are arranged at the ends of a plurality of groups of the spring (382), a plurality of arc-shaped limiting grooves are formed in the side wall of the mounting cylinder (255), and the spring (382) tops the top bead (381) into the arc-shaped limiting groove.

7. A high precision based smart instrumentation device manufacturing apparatus as claimed in claim 1, wherein: The second detection assembly mechanism comprises a fourth linear guide rail (41), a microwave electric field sensor (42) and a high-speed infrared thermal imager (43), the fourth linear guide rail (41) is arranged on the second cross frame (121) in parallel to the length direction of the second cross frame (121), the microwave electric field sensor (42) and the high-speed infrared thermal imager (43) are arranged on the sliding seat of the fourth linear guide rail (41) at intervals, the microwave electric field sensor (42) is used to generate a dielectric constant distribution map or an electric field intensity distribution map of a power-on circuit board, and the high-speed infrared thermal imager (43) is used to generate a phase diagram and an amplitude diagram of the power-on circuit board.

8. A high precision based smart instrumentation device manufacturing apparatus as claimed in claim 4, wherein: The side wall of the rotating cylinder (254) is fixedly provided with a first connecting rod (5), the side wall of the mounting cylinder (255) is fixedly provided with a second connecting rod (6), the first connecting rod (5) is arranged above the second connecting rod (6), the end of the first connecting rod (5) away from the rotating cylinder (254) is rotatably provided with an electric telescopic rod (7), the end of the second connecting rod (6) away from the rotating cylinder (254) is rotatably provided with a rotating plate (8), one end of the rotating plate (8) is rotatably connected with the telescopic end of the electric telescopic rod (7), and one side of the rotating plate (8) close to the mounting cylinder (255) is provided with a reflecting sheet.

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