Optimized circuit board

Abstract

An optimized circuit board is mainly characterized in that a net-shaped retaining film is formed on a printed circuit of the optimized circuit board, the net-shaped retaining film comprises a plurality of annular frames and a plurality of connecting parts, and each annular frame surrounds a welding pad opposite to the annular frame and covers a part of a wire connected with the welding pad opposite to the annular frame. In addition, the adjacent annular frames are connected with each other through one connecting part.

Description

TECHNICAL FIELD

[0001] The present application relates to the repair of a circuit board, and in particular to an optimized circuit board that reduces the probability of solder pads being torn off during repair. BACKGROUND

[0002] Electronic products have at least one circuit board inside. Some high-priced electronic products, such as computer motherboards, display cards, etc., usually have high-priced electronic components such as CPUs, GPUs, and memories. These components may need to be repaired and replaced due to defects or external forces (e.g., falling). However, during disassembly, the solder pads on the circuit board are often torn off together with the electronic components. Solder pads are connected to the circuit board, and once torn off, they cannot be restored. This results in the new electronic components being unable to be welded back to their original positions, causing the entire circuit board to be scrapped, which is a waste.

[0003] Therefore, how to solve the above problems to improve the repair rate of the circuit board is an urgent matter. SUMMARY

[0004] The present application provides an optimized circuit board that reduces the probability of solder pads being torn off during repair, greatly improves the repair rate of the circuit board, and solves the above problems of the prior art.

[0005] In more detail, the optimized circuit board of the present application includes a substrate, a printed circuit formed on the substrate, a protective film covering the substrate and the printed circuit, and a mesh protective film stacked on the protective film. The printed circuit includes a plurality of solder pads and a plurality of conductive lines extending outward from the solder pads. The protective film has a plurality of window holes corresponding to the solder pads, so that each solder pad is exposed from each window hole. The mesh protective film includes a plurality of annular frames and a plurality of connecting portions. The annular frames correspond to the solder pads, so that each solder pad is exposed from a through hole of each annular frame. The adjacent annular frames are connected to each other by a connecting portion, and each annular frame covers the part where each conductive line connects each solder pad.

[0006] In an embodiment, the inner diameter of each window hole of the protective film is greater than the outer diameter of the solder pad corresponding to it, so that an annular exposed area is formed between each window hole and the solder pad corresponding to it. The substrate forms an annular exposed surface opposite the annular exposed areas. The outer ring of each annular frame of the mesh protective film is stacked on the protective film, and the inner ring of each annular frame is stacked on each annular exposed surface of the substrate.

[0007] In an embodiment, an annular gap is maintained between the outer periphery of each solder pad and the inner ring of the annular frame corresponding to it.

[0008] In one embodiment, the outer periphery of each of the solder pads of the present invention is covered by the inner circumference of the annular frame opposite to it.

[0009] In one embodiment, the inner diameter of each window of the protective film of the present invention is smaller than the outer diameter of the opposite solder pad, so that an outer periphery of each solder pad is covered by the protective film, and each annular frame of the mesh protective film is stacked on the protective film.

[0010] In one embodiment, the outer periphery of each of the solder pads of the present invention is further covered by the annular frame opposite it.

[0011] In one embodiment, one or more of the connecting portions of the mesh protective film of the present invention respectively cover one or more of the conductors.

[0012] In one embodiment, the substrate of the present invention has one or more layers of internal printed circuitry.

[0013] The present invention also provides an optimized method for manufacturing a circuit board, comprising: providing a substrate; forming a printed circuit on the substrate, the printed circuit including a plurality of solder pads and a plurality of wires extending outward from the solder pads respectively; forming a protective film as described above on the substrate and the printed circuit; and forming a mesh-like protective film as described above on the protective film.

[0014] In one embodiment, the manufacturing method of the present invention further includes: increasing the adhesive content between the substrate and the printed circuit; and increasing the area of ​​the solder pads when forming the printed circuit. Attached Figure Description

[0015] Figure 1 This diagram shows a top view of a first embodiment of the optimized circuit board of the present invention, which mainly discloses a mesh-like protective film.

[0016] Figure 2 This diagram shows a top view of a solder pad of the first embodiment of the present invention (the mesh protective film is omitted).

[0017] Figure 3 This shows a top view of the solder pad according to the first embodiment of the present invention.

[0018] Figure 4 This shows a cross-sectional schematic diagram of the solder pad according to the first embodiment of the present invention.

[0019] Figure 5 A top view schematic diagram showing a solder pad of a second embodiment of the optimized circuit board of the present invention.

[0020] Figure 6 This shows a cross-sectional schematic diagram of the solder pad according to the second embodiment of the present invention.

[0021] Figure 7 Fig. 3 shows a top view of a solder pad of a third embodiment of the optimized circuit board of the present application.

[0022] Figure 8 Fig. 4 shows a cross-sectional view of the solder pad of the third embodiment of the optimized circuit board of the present application.

[0023] Legend of reference numerals:

[0024] substrate 1

[0025] annular exposed surface 11

[0026] printed circuit 2

[0027] conductive wire 22

[0028] solder pad 21

[0029] portion 211

[0030] annular exposed area 20

[0031] annular gap 20a

[0032] protective film 3

[0033] window 31

[0034] mesh protective film 4

[0035] annular frame 41

[0036] through hole 411

[0037] outer annular rim 412

[0038] inner annular rim 413

[0039] connecting portion 42, 42a to 42c DETAILED DESCRIPTION

[0040] Figure 1 Fig. 1 shows a first embodiment of the optimized circuit board of the present application, which comprises a substrate 1, a printed circuit 2 formed on a surface (e.g. an upper surface) of the substrate 1, a protective film 3 covering the substrate 1 and the printed circuit 2, and a mesh protective film 4 laminated on the protective film 3.

[0041] The optimized circuit board of the present application can be a single-sided printed circuit board, a double-sided printed circuit board or a multi-layer printed circuit board. Therefore, the optimized circuit board of the present application can comprise other printed circuits in addition to the printed circuit 2, such as one or more internal printed circuits located inside the substrate 1, and / or another printed circuit formed on another surface (e.g. a lower surface) of the substrate 1. Preferably, the optimized circuit board of the present application is a display card or a computer motherboard, but is not limited thereto.

[0042] The printed circuit 2 includes a plurality of pads 21 and a plurality of conductive lines 22 extending outwardly from the pads 21. The pads 21 are used to solder one or more electronic components. For example, a GPU and / or a memory on the display card.

[0043] The protective film 3 covers the substrate 1 and the printed circuit 2, and as shown in Figure 2 each aperture 31 of the protective film 3 is opposite to each pad 21, so that each pad 21 is exposed from each aperture 31. Generally, the pads 21 are located in an important area for receiving the GPU or the memory, and the mesh protective film 4 only needs to be arranged in the important area, and the remaining area can not be arranged.

[0044] As shown in Figure 1 , the mesh protective film 4 includes a plurality of annular frames 41 and a plurality of connecting portions 42. Adjacent annular frames 41 are connected to each other by one connecting portion 42. The annular frames 41 are opposite to the pads 21, so that, as shown in Figure 3 , each pad 21 is exposed from a through hole 411 of each annular frame 41. Each annular frame 41 covers the part 211 of each conductive line 22 connecting each pad 21. Preferably, one or more of the connecting portions 42 of the mesh protective film 4 respectively span and cover one or more conductive lines 22. For example, one connecting portion 42a spans and covers one conductive line 22, and another connecting portion 42b spans and covers two conductive lines 22. Of course, some connecting portions 42 can not intersect with any conductive line 22, such as connecting portion 42c.

[0045] As generally known, the substrate 1 at least includes an insulating base material, a copper foil for forming the printed circuit 2, and an adhesive for bonding the two together. Generally, the insulating base material is a layer of glass fiber non-woven cloth, and the adhesive is a layer of epoxy resin, but not limited thereto. The glass fiber non-woven cloth is pre-impregnated with epoxy resin material to form a bonding sheet, and then the bonding sheet is laminated with the copper foil to form a copper foil substrate (CCL). Then, the copper foil on the copper foil substrate is etched to form the printed circuit 2 by an etching process, and a solder resist ink commonly known as green paint is applied to the printed circuit 2 to form the protective film 3. The optimized circuit board manufacturing method of the present application is added after the above steps, and an additional step of "forming a mesh protective film 4 on the protective film 3" is added. The main component of the protective film 3 is epoxy resin. The material of the mesh protective film 4 can also be selected from epoxy resin or other types of insulating materials.

[0046] In the first embodiment, as shown in Figure 2 and Figure 4As shown, the inner diameter of each of the window holes 31 of the protective film 3 is larger than the outer diameter of the pad 21 opposite to it, so that each of the window holes 31 and the pad 21 opposite to it forms an annular exposed area 20, and the substrate 1 opposite to the annular exposed areas 20 forms an annular exposed surface 11, respectively. As shown, Figure 3 and Figure 4 As shown, the outer ring 412 of each of the annular frames 41 of the reticular protective film 4 is overlaid on the protective film 3, and the inner ring 413 of each of the annular frames 41 is overlaid on each of the annular exposed surfaces 11 of the substrate 1, respectively. Preferably, an annular gap 20a is maintained between the outer periphery of each of the pads 21 and the inner ring 413 of the annular frame 41 opposite to it. In this case, each of the annular frames 41 presses the wire 2 connected to the corresponding pad 21, and thus provides a protective effect, so that the pad 21 is not easily pulled off from the substrate 1 by the electronic component removed in the maintenance stage.

[0047] In a second embodiment, as shown, Figure 5 and Figure 6 As shown, the outer periphery of each of the pads 21 is also covered by the inner ring 413 of the annular frame 41 opposite to it, and the rest is the same as described above. In this case, each of the annular frames 41 presses the wire 2 connected to the corresponding pad 21 at the same time, and thus provides a better protective effect.

[0048] In a third embodiment, as shown, Figure 7 and Figure 8 As shown, the inner diameter of each of the window holes 31 of the protective film 3 is smaller than the outer diameter of the pad 21 opposite to it, so that the outer periphery of each of the pads 21 is covered by the protective film 3, and each of the annular frames 41 of the reticular protective film 4 is overlaid on the protective film 3. Preferably, the outer periphery of each of the pads 41 is also covered by the annular frame 42 opposite to it. In this case, each of the annular frames 41 also presses the wire 2 connected to the corresponding pad 21 at the same time, and thus provides a good protective effect.

[0049] As can be seen from the above description, the optimized circuit board of the present application uses the reticular protective film 4 to press the pad 21 and / or the wire 22, so that the pad 21 is not easily pulled off from the substrate 1 by the electronic component removed, and thus the probability of the pad 21 being pulled off and separated from the substrate 1 is reduced, and the repair rate is improved. Furthermore, the optimized circuit board of the present application can increase the content of the adhesive between the substrate 1 and the printed wire 2, and / or increase the area of the pad 21, so as to increase the bonding force between the pad 21 and the substrate 1, and thus the pad 21 is more difficult to be pulled off.

Claims

1. An optimized circuit board, comprising: One substrate; A printed circuit is formed on the substrate and includes multiple solder pads and multiple wires extending outward from the multiple solder pads respectively; A protective film covers the substrate and the printed circuit, and has a plurality of windows that are respectively opposite to the plurality of solder pads, so that each solder pad is exposed from each of the windows; and A mesh-like protective film is stacked on top of the protective film and includes multiple annular frames and multiple connecting portions. The multiple annular frames are respectively opposite to the multiple solder pads, so that each solder pad is exposed from a through hole in each annular frame. Adjacent annular frames are connected to each other through a connecting portion. Each annular frame covers the part of each wire that connects to each solder pad.

2. The optimized circuit board as claimed in claim 1, wherein the inner diameter of each of the windows in the protective film is larger than the outer diameter of the solder pad opposite it, so that an annular exposure area is formed between each window and the solder pad opposite it, and the substrate forms an annular exposure surface at each of the plurality of annular exposure areas, an outer ring of each annular frame of the mesh protective film is stacked around the protective film, and an inner ring of each annular frame is stacked around each annular exposure surface of the substrate.

3. The optimized circuit board of claim 2, wherein an annular gap is maintained between an outer periphery of each of the solder pads and the inner circumference of the annular frame opposite to it.

4. The optimized circuit board of claim 3, wherein the outer periphery of each of the solder pads is covered by the inner circumference of the annular frame opposite to it.

5. The optimized circuit board of claim 1, wherein the inner diameter of each of the windows of the protective film is smaller than the outer diameter of the solder pad opposite it, such that an outer periphery of each solder pad is covered by the protective film, and each of the annular frames of the mesh protective film overlaps the protective film.

6. The optimized circuit board of claim 5, wherein the outer periphery of each of the solder pads is further covered by the annular frame opposite it.

7. The optimized circuit board as claimed in claim 1, wherein one or more of the plurality of connecting portions of the mesh protective film respectively cover one or more of the conductors.

8. The optimized circuit board of claim 1, wherein the substrate has one or more layers of internal printed circuitry.

9. A method for manufacturing an optimized circuit board, comprising: Provide a substrate; A printed circuit is formed on the substrate, the printed circuit including a plurality of solder pads and a plurality of wires extending outward from the plurality of solder pads respectively; A protective film as described in any one of claims 1 to 7 is formed on the substrate and the printed circuit. and A mesh-like protective film as described in any one of claims 1 to 7 is formed on the protective film.

10. The manufacturing method as claimed in claim 9, comprising: Increase the adhesive content between the substrate and the printed circuit; and Increase the area of ​​the multiple solder pads when forming the printed circuit.

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