Double-outlet air outlet heat dissipation device

Abstract

The application provides a double-outlet heat dissipation device, which comprises a tray, at least one heat dissipation pipe and at least two heat dissipation fin groups; the at least one main body part corresponding to the at least one heat dissipation pipe is arranged on the first end face of the tray; the second end face of the tray is used for contacting a target heat source; the first branch pipe is bent and extended from the first end of the at least one main body part with a first preset arc, the first branch pipe extends to the at least two heat dissipation fin groups and contacts the at least two heat dissipation fin groups; the second branch pipe is bent and extended from the second end of the at least one main body part with a second preset arc or a third preset arc, the second branch pipe extends to the at least two heat dissipation fin groups and contacts the at least two heat dissipation fin groups. In this way, the heat dissipation efficiency is improved through the fixedly-bent heat dissipation pipe and the double outlets.

Description

Technical Field

[0001] This application belongs to the technical field of heat dissipation devices for semiconductor devices, and specifically relates to a dual-outlet heat dissipation device. Background Technology

[0002] Currently, with the high integration of electronic products and their increasingly smaller sizes, numerous problems have arisen. Overheating leading to component failure is one such issue, particularly for the CPU (Central Processing Unit), which requires constant heat dissipation during operation; poor heat dissipation can easily affect its performance. To achieve CPU cooling, heatsinks are typically installed at the CPU, and with the miniaturization of computers, efficient heatsinks are even more crucial.

[0003] In existing solutions, large single-exhaust fans are generally quite thick, and when paired with 3-4 straight copper heat pipes or large-area VC copper plates, the overall heat dissipation module is quite thick, which restricts the miniaturization of electronic products. Reducing the fan thickness or the number of copper heat pipes would decrease the heat dissipation efficiency, making it impossible to meet the heat dissipation requirements of electronic products. Summary of the Invention

[0004] This application provides a dual-outlet heat dissipation device, which aims to improve heat dissipation efficiency by using heat dissipation pipes with fixed bends and dual outlets.

[0005] In a first aspect, this application provides a dual-outlet heat dissipation device, including a tray, at least one heat dissipation pipe, and at least two heat dissipation fin groups; at least one main body portion corresponding to the at least one heat dissipation pipe is disposed on the first end face of the tray; the second end face of the tray is used to contact a target heat source;

[0006] A first branch pipe extends from the first end of the at least one main body portion by bending at a first preset arc, and the first branch pipe extends to the at least two heat dissipation fin groups and contacts the at least two heat dissipation fin groups.

[0007] A second branch pipe extends from the second end of the at least one main body portion by bending at a second preset arc or a third preset arc, and the second branch pipe extends to the at least two heat dissipation fin groups and contacts the at least two heat dissipation fin groups.

[0008] In conjunction with the first aspect, in one possible embodiment, the system further includes a fan, the fan comprising at least one air inlet and at least two air outlets; the at least two air outlets are connected to the at least two heat dissipation fin groups; a first space is formed between the at least two heat dissipation fin groups, and the fan is housed within the first space; when the fan is housed within the first space, the surface of the fan is within the first space or flush with the at least two heat dissipation fin groups.

[0009] In conjunction with the first aspect, in one possible embodiment, the heat dissipation fin assembly includes a plurality of fins arranged sequentially at a preset angle, a first opening in the gap between every two adjacent fins is connected to the air outlet of the fan, and a second opening in the gap between every two adjacent fins is used to connect to the air outlet of the housing.

[0010] In conjunction with the first aspect, in one possible embodiment, the tray includes a tray body, on which a first receiving cavity is provided, the bottom end face of the first receiving cavity being a first end face, and the outer wall of the bottom end face of the first receiving cavity being a second end face; at least one main body portion of the at least one heat dissipation pipe is received in the first receiving cavity; a first support plate extends from a first side plate of the tray body, and a second support plate extends from a second side plate of the tray body; the first support plate extends to the first branch pipe and, together with the heat dissipation fin assembly, clamps the first branch pipe; the first support plate is connected to a first outer cavity wall away from the bottom end face of the first receiving cavity, and the second support plate is connected to a second outer cavity wall away from the bottom end face of the first receiving cavity.

[0011] In conjunction with the first aspect, in one possible embodiment, a first cover plate is further included. The first cover plate includes a cover plate body, a third support plate extending from a third side of the cover plate body, and a fourth support plate extending from a fourth side of the cover plate body. The first cover plate is used to cover the first receiving cavity and, together with the tray, clamps the at least one heat dissipation pipe in the first receiving cavity. When the first cover plate is covering the first receiving cavity, the third support plate is fixed to the first support plate, and the fourth support plate is fixed to the second support plate.

[0012] In conjunction with the first aspect, in one possible embodiment, a first fixing part is provided between the first support plate and the first side plate, a second fixing part is provided between the second support plate and the second side plate, a third fixing part is provided between the third support plate and the third side plate, and a fourth fixing part is provided between the fourth support plate and the fourth side plate; the first fixing part and the third fixing part are combined, and the second fixing part and the fourth fixing part are combined, to fix the tray and the first cover plate to each other.

[0013] In conjunction with the first aspect, in one possible embodiment, a third fixing member is further included, the third fixing member being connected to one or more heat dissipation fin assemblies; the third fixing member is provided with a first connecting portion, and the fan is provided with a second connecting portion; and the first connecting portion is used to engage with the second connecting portion to fix the first cover plate to the fan; or, the first cover plate is provided with a first connecting portion, and the fan is provided with a second connecting portion; the first connecting portion is used to engage with the second connecting portion to fix the first cover plate to the fan.

[0014] In conjunction with the first aspect, in one possible embodiment, a third fixing member is further included, the third fixing member being connected to one or more heat dissipation fin assemblies; the third fixing member is provided with a first connecting portion, and the fan is provided with a second connecting portion; and the first connecting portion is used to engage with the second connecting portion to fix the third fixing member to the fan; or, the third fixing member is provided with a first connecting portion, the fan is provided with a second connecting portion, and the tray is provided with a third connecting portion; and both the first connecting portion and the third connecting portion are used to engage with the second connecting portion to fix the third fixing member to the fan; or, the fan is provided with a second connecting portion, and the tray is provided with a third connecting portion; and both the first connecting portion and the third connecting portion are used to engage with the second connecting portion to fix the third fixing member to the fan; or, the first cover plate is provided with a first connecting portion, and the fan is provided with a second connecting portion; the first connecting portion is used to engage with the second connecting portion to fix the first cover plate to the fan.

[0015] In conjunction with the first aspect, in one possible embodiment, a first ramp is provided at the first connection between the at least one first branch pipe and the at least one main body, and a second ramp is provided at the second connection between the at least one second branch pipe and the at least one main body; the first ramp and the second ramp are used to support the at least one main body so that the at least one main body is isolated from the fan.

[0016] In conjunction with the first aspect, in one possible embodiment, the first support plate is provided with a first platform at the end away from the first side plate, the first platform being used to contact the first branch pipe; or, the second support plate is provided with a second platform at the end away from the second side plate, the second platform being used to contact the first branch pipe.

[0017] As can be seen, the dual-outlet heat dissipation device in this application includes a tray, at least one heat dissipation pipe, and at least two heat dissipation fin groups. At least one main body portion corresponding to the at least one heat dissipation pipe is disposed on the first end face of the tray. The second end face of the tray is used to contact the target heat source. A first branch pipe extends from the first end of each of the at least one main body portion by bending at a first preset arc, and the first branch pipe extends to and contacts the at least two heat dissipation fin groups. A second branch pipe extends from the second end of each of the at least one main body portion by bending at a second preset arc or a third preset arc, and the second branch pipe extends to and contacts the at least two heat dissipation fin groups. Thus, the heat dissipation efficiency is improved by using a regularly bent heat dissipation pipe and dual outlets. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the first type of dual-outlet heat dissipation device provided in the embodiments of this application;

[0020] Figure 2 This is a schematic diagram of the structure of the second type of dual-outlet heat dissipation device provided in the embodiments of this application;

[0021] Figure 3 This is a schematic diagram of the structure of the third type of dual-outlet heat dissipation device provided in the embodiments of this application;

[0022] Figure 4 This is a schematic diagram of the structure of the tray provided in the embodiments of this application;

[0023] Figure 5 This is a schematic diagram of the structure of the fourth type of dual-outlet heat dissipation device provided in the embodiments of this application;

[0024] Figure 6 This is a schematic diagram of the fifth type of dual-outlet heat dissipation device provided in the embodiments of this application;

[0025] Figure 7 This is a schematic diagram of the structure of the heat dissipation pipe, tray, first fixing member, and second fixing member provided in the embodiments of this application;

[0026] Figure 8 This is a schematic diagram of the structure of the first and second fasteners provided in the embodiments of this application;

[0027] Figure 9 This is a schematic diagram of the structure of the first cover plate and tray provided in the embodiments of this application;

[0028] Figure 10 This is a cross-sectional schematic diagram of the first cover plate and tray provided in the embodiments of this application. Detailed Implementation

[0029] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0030] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, systems, products, or apparatuses.

[0031] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0032] Currently, with the increasing integration of electronic products and their shrinking size, numerous problems have arisen. Overheating leading to component failure is one such issue, particularly for CPUs, which require constant heat dissipation during operation; poor heat dissipation can easily impact performance. To achieve CPU cooling, heatsinks are typically installed, and with the miniaturization of computers, efficient heatsinks are even more crucial. Existing solutions generally employ large, single-exhaust fans with significant thickness, coupled with 3-4 straight copper heat pipes or large-area VC copper plates, resulting in a substantial overall heatsink module thickness that hinders the reduction in electronic product size. Reducing the fan thickness or the number of copper heat pipes would decrease cooling efficiency, failing to meet the cooling requirements of electronic products.

[0033] To address the aforementioned problems, this application provides a dual-outlet heat dissipation device. This dual-outlet heat dissipation device can be applied to heat dissipation scenarios for semiconductor devices. The dual-outlet heat dissipation device of this application includes a tray, at least one heat dissipation pipe, and at least two heat dissipation fin groups. At least one main body portion corresponding to the at least one heat dissipation pipe is disposed on a first end face of the tray. The second end face of the tray is used to contact a target heat source. A first branch pipe extends from the first end of each of the at least one main body portion by bending at a first preset arc, and the first branch pipe extends to and contacts the at least two heat dissipation fin groups. A second branch pipe extends from the second end of each of the at least one main body portion by bending at a second preset arc or a third preset arc, and the second branch pipe extends to and contacts the at least two heat dissipation fin groups. Thus, the heat dissipation efficiency is improved by using a heat dissipation pipe with fixed, regular bends and dual outlets. This solution is applicable to various scenarios, including but not limited to the application scenarios mentioned above.

[0034] The specific structure will be described in detail below.

[0035] Please see Figures 1-8 This application also provides a dual-outlet heat dissipation device, including a tray, at least one heat dissipation pipe, and at least two heat dissipation fin groups; at least one main body part corresponding to the at least one heat dissipation pipe is disposed on the first end face 22 of the tray; the second end face 23 of the tray is used to contact the target heat source;

[0036] A first branch pipe 16 extends from the first end of the at least one main body portion by bending at a first preset arc, and the first branch pipe 16 extends to the at least two heat dissipation fin groups and contacts the at least two heat dissipation fin groups.

[0037] A second branch pipe 17 extends from the second end of the at least one main body portion by bending at a second preset arc or a third preset arc, and the second branch pipe 17 extends to the at least two heat dissipation fin groups and contacts the at least two heat dissipation fin groups.

[0038] In practice, the dual-outlet heat dissipation device in this embodiment can be applied to the heat dissipation of various semiconductor devices. Semiconductor devices can be chips such as CPUs, MCUs, and GPUs, or other heat-generating devices; no single limitation is made here. It is understood that to dissipate heat from semiconductor devices, the dual-outlet heat dissipation device needs to be installed in electronic devices requiring small size and high heat dissipation efficiency, such as laptops and miniPCs.

[0039] In this embodiment, the dual-outlet heat dissipation device contacts the semiconductor device (i.e., the target heat source) that needs heat dissipation via a tray, thereby transferring the heat from the semiconductor device to the tray, and then from the tray to the main body of the heat pipe. The main body extends from a first end with a first preset curvature, forming a first branch pipe 16 that contacts the heat dissipation fin assembly, and from a second end with a second preset curvature or a third preset curvature, extends a second branch pipe 17 that also contacts the heat dissipation fin assembly. This bending and extension increases the length of the heat pipe, thereby increasing the contact area between the heat pipe and the heat dissipation fin assembly and accelerating the heat transfer rate.

[0040] Meanwhile, this embodiment provides at least two heat dissipation fin groups, which are in contact with the first branch pipe 16 and the second branch pipe 17 respectively. While increasing the contact area between the heat dissipation pipe and the heat dissipation fin group, the design of multiple heat dissipation fin groups can disperse the heat transferred to the heat dissipation fin group and increase the contact with the air, thereby further improving the heat dissipation efficiency.

[0041] Optionally, the first preset curvature can be a U-shaped tube formed by a 180-degree semi-circular bend from the first end of the main body towards the heat dissipation fin assembly; the second preset curvature can be an L-shaped tube formed by a 90-degree bend from the second end of the main body towards the heat dissipation fin assembly in a first direction; and the third preset curvature can be an L-shaped tube formed by a 90-degree bend from the second end of the main body towards the heat dissipation fin assembly in a second direction, where the first and second directions are opposite. It is understood that the first, second, and third preset curvatures can also be other curvatures, which can be adjusted according to the number and position of the heat dissipation fin assembly, and are not limited to a single type.

[0042] The following is an introduction and explanation using two heat pipes and two heat dissipation fin assemblies as an example.

[0043] Please see Figure 3 and Figure 4 The two heat pipes are designated as heat pipe 1 and heat pipe 2, respectively; please refer to both. Figure 1 and Figure 2 The two heat dissipation fin groups are designated as the first heat dissipation fin group 31 and the second heat dissipation fin group 32, respectively. The first heat dissipation pipe includes a first main body 14, and the second heat dissipation pipe includes a second main body 15. Both the first main body 14 and the second main body 15 are disposed on the first end face 22 of the tray. The first heat dissipation fin group 31 and the second heat dissipation fin group 32 are arranged adjacent to each other, forming a 90-degree angle between the two heat dissipation fin groups, and their positional relationship is like that of two adjacent sides of a rectangle.

[0044] Based on the positional relationship between the first heat dissipation fin group 31 and the second heat dissipation fin group 32, both the first main body portion 14 and the second main body portion 15 extend a first branch pipe 16 from their first ends, which is bent at the same 180-degree arc (i.e., the first preset arc) to form a U-shaped pipe. The first straight edge of the U-shaped pipe is the first main body portion 14 and the second main body portion 15, while the second straight edge of the U-shaped pipe contacts the first heat dissipation fin group 31. Simultaneously, the first main body portion 14 is bent at a 90-degree arc from its second end toward the first direction to form a first type L-shaped pipe, and the second main body portion 15 is bent at a 90-degree arc from its second end toward the second direction to form a second type L-shaped pipe. At this point, the first type L-shaped pipe, the second type L-shaped pipe, the first main body portion 14, and the second main body portion 15 form a Y-shaped structure. Thus, the two heat dissipation pipes form a U-shaped plus Y-shaped irregular heat dissipation pipe structure. By employing a "Y-shaped branching and U-shaped extension" layout with dual heat pipes, the contact length between a single heat pipe and fin 33 is doubled, effectively achieving the heat transfer efficiency of four ordinary heat pipes and improving heat dissipation efficiency. This not only solves the space occupation problem of multiple heat pipes but also breaks through the cost barrier of "high performance must rely on multiple heat pipes and VC boards," representing a structural breakthrough in small-space heat dissipation. Furthermore, the combination of two heat dissipation fin groups further enhances heat dissipation efficiency.

[0045] As can be seen, in this embodiment, by using heat pipes with fixed regular bends, the industry's inherent understanding that "the number of heat pipes determines the heat dissipation capacity" is broken, and at the same time, the heat dissipation efficiency is further improved by combining at least two heat dissipation fin groups.

[0046] In one possible embodiment, two heat pipes, each 2-4 mm thick (preferably 3 mm thick) and 10-15 mm wide (preferably 8 mm or 12 mm wide), are used to form a "Y plus U" structure. The main body of the heat pipes is placed on a tray (closely attached to the heat source to quickly absorb CPU heat). The tray can be a 1 mm thick CPU copper substrate. The first and second branches extend to the two sets of heat dissipation fins with a preset curvature and contact the two sets of heat dissipation fins. Through the cycle of "heat absorption phase change and heat release condensation" of the working fluid inside the heat pipes, the heat is efficiently conducted to the fins 33. The bifurcated layout of the dual heat pipes (i.e., Y-shaped and U-shaped) is equivalent to the contact area of ​​four single heat pipes, achieving the effect of "high conductivity with fewer heat pipes".

[0047] Option 1

[0048] In one possible embodiment, the system further includes a fan, the fan having at least one air inlet and at least two air outlets; the at least two air outlets being connected to the at least two heat dissipation fin groups; a first space being formed between the at least two heat dissipation fin groups, the fan being housed within the first space; when the fan is housed within the first space, the surface of the fan is within the first space or flush with the at least two heat dissipation fin groups.

[0049] For specific implementation details, please refer to [link / reference]. Figure 1 and Figure 2 At least two heat dissipation fin groups form the first space. To improve space utilization, the shape of this first space is designed to fit the fan 40. When the fan 40 is housed in the first space, the thickness of the dual-outlet heat dissipation device is equal to the thickness of a single heat dissipation fin group plus the thickness of the heat pipe and the tray. The fan 40 does not increase the thickness of the dual-outlet heat dissipation device. In this way, while increasing the heat dissipation efficiency by adding the fan 40, the thickness of the dual-outlet heat dissipation device can be maintained without increasing the thickness, which is beneficial for the miniaturization of electronic devices.

[0050] Optionally, the fan 40 can be a centrifugal fan, with preferred dimensions of length (60-100mm, preferably 82mm), width (60-100mm, preferably 80mm), and height (5-20mm, preferably 10mm). The thickness of the heatsink fin assembly can also be set to 10-30mm, preferably 15mm, or slightly greater than 15mm. The fan 40 is flush with or lower than the 15mm high heatsink fin assembly, without occupying additional height, achieving a compact integrated structure of "fan 40 and fins 33". It is understood that the dimensions in this embodiment are not unique and can be adjusted according to the dimensions of the corresponding electronic device; they are not limited to a single dimension here.

[0051] Optionally, the fan 40 is positioned above the heat pipe. Vertically, the fan 40 has an air inlet on its first side closest to the heat pipe and a sealed second side away from the heat pipe. The fan 40 draws air vertically from the heat pipe towards itself. The fan 40 includes at least two air outlets, which can be located on its sides (i.e., perpendicular to the horizontal direction). When the fan 40 draws air in through the air inlet, the air is blocked by the second side and exits through the two horizontal air outlets. Each air outlet is connected to one of two heat sink fin assemblies. Therefore, after the air exits through the outlets, it passes through the heat sink fin assemblies, exchanges heat with them, and is finally exhausted from the electronic device's exhaust port, thus completing the heat dissipation of the semiconductor devices in the electronic device.

[0052] Optionally, the dual-outlet fan 40 has an airflow of 0-10.3 CFM and a wind pressure of 0-9.45 mmH2O. The high wind pressure characteristic of the centrifugal fan can overcome the airflow resistance in small spaces, forcing airflow to quickly penetrate the gaps between the fins 33, thus solving the problem of "airflow attenuation in small spaces". The rated noise of the fan 40 is only 238-42 dB, which is inherently low-noise; the dual-outlet design divides the airflow into two paths, avoiding the concentrated impact of airflow on the fins 33 when using a single outlet, and reducing airflow impact noise. It is understood that the parameters of the fan 40 in this embodiment are not unique parameters and can be adjusted according to the needs of the corresponding electronic equipment, and are not limited to uniqueness here.

[0053] In one possible embodiment, the heat dissipation fin assembly includes a plurality of fins 33 arranged sequentially at a preset angle, a first opening in the gap between every two adjacent fins 33 is connected to the air outlet of the fan, and a second opening in the gap between every two adjacent fins 33 is used to connect to the air outlet of the housing.

[0054] In practice, the heat dissipation fin assembly has multiple fins 33 arranged at a preset angle. When air from the outlet blows towards the heat dissipation fin assembly, the air passes through the gaps between any two adjacent fins 33, exchanging heat with the fins and carrying away the heat from them. The preset angle arrangement avoids direct airflow and reduces airflow speed, preventing the hot air from significantly affecting the user.

[0055] Optionally, the heat dissipation fin assembly includes a top plate and a bottom plate, with multiple fins 33 disposed between the top plate and the bottom plate.

[0056] Optionally, in this embodiment, the preset angle can be 0 degrees, that is, the fin angle 33 is parallel to the fan outlet. It is understood that the preset angle can also be other angles, and is not limited to a single angle here.

[0057] Optionally, the fins 33 are made of copper. The size of a single heat dissipation fin group can be 73.96×24.2×10mm, the thickness of a single fin 33 is 0-0.3mm, preferably 0.2mm, the spacing between adjacent fins 33 can be 1-1.5mm, preferably 1.17mm, and the number of fins 33 in each heat dissipation fin group can be between 50-80, with 63 fins preferred in this embodiment. The total area of ​​each heat dissipation fin group is 30,000 square meters. 2 -70000mm 2 In this embodiment, the area is preferably 36142 mm², and the surface is treated with anti-oxidation, corresponding to the two air outlets of the fan.

[0058] In one possible embodiment, please refer to Figure 2 and Figure 4The tray includes a tray body 21, on which a first receiving cavity is provided. The bottom end face of the first receiving cavity is the first end face 22, and the outer wall of the bottom end face of the first receiving cavity is the second end face 23. At least one main body portion of the at least one heat dissipation pipe is received in the first receiving cavity. A first support plate extends from the first side plate 25 of the tray body 21, and a second support plate extends from the second side plate 26 of the tray body 21. The first support plate extends to the first branch pipe and clamps the first branch pipe together with the heat dissipation fin assembly. The first support plate is connected to the first outer cavity wall away from the bottom end face of the first receiving cavity, and the second support plate is connected to the second outer cavity wall away from the bottom end face of the first receiving cavity.

[0059] In a specific implementation, a first receiving cavity is provided in the tray body 21. The first receiving cavity is groove-shaped, and one of the opposite groove walls is open, so that the main body of the heat dissipation pipe can be received in the first receiving cavity. The remaining three groove walls restrict the main body of the heat dissipation pipe to prevent displacement of the heat dissipation pipe.

[0060] Simultaneously, the tray body 21 extends a first support plate 211 and a second support plate 212 from the top of the two sides (first side plate and second side plate) of the first receiving cavity toward the outside of the first receiving cavity. The dimensions of the first support plate 211 and the second support plate 212 can be different or the same. Depending on the position of the heat dissipation fin assembly, the size of the first support plate 211 and / or the second support plate 212 can be adjusted so that the first support plate 211 and / or the second support plate 212 can extend to the corresponding heat dissipation fin assembly position to clamp the corresponding branch pipe (first branch pipe 16 or second branch pipe 17) together with the heat dissipation fin assembly.

[0061] In one example, when two heat dissipation fin groups are set, if the two heat dissipation fin groups are set on opposite sides of the first space, the first support plate 211 and the second support plate 212 can be set to have the same size and extend to the heat dissipation fin groups on opposite sides respectively, and contact the two heat dissipation fin groups.

[0062] In another example, when two heat dissipation fin groups are set, if the two heat dissipation fin groups are set on the adjacent side of the first space, the first support plate 211 and the second support plate 212 can be set to different sizes. For example, the first support plate 211 extends to the first heat dissipation fin group and extends to the heat dissipation fin group on the side respectively. Since the second heat dissipation fin group is set on the adjacent side, the second support plate 212 is set to a shorter size and no extension operation is required.

[0063] Optionally, since the tray is supported by the first support plate 211 and the second support plate 212, the first accommodating cavity serves to isolate the heat pipe, heat sink fin assembly and fan 40 from the semiconductor device being cooled, providing structural support for the heat sink fin assembly and reducing the reverse conduction of heat from the heat sink fin assembly to the heat pipe area, thus ensuring unidirectional heat transfer.

[0064] In one possible embodiment, the fan and the heat sink assembly can be combined in various ways to secure the fan to the heat sink assembly.

[0065] Please see Figures 1 to 4 The following examples illustrate several ways to fix a fan.

[0066] Example 1

[0067] The dual-outlet heat dissipation device also includes a third fixing member 90, which is connected to one or more heat dissipation fin assemblies. The third fixing member 90 is provided with a first connecting portion 64, and the fan is provided with a second connecting portion 41; and the first connecting portion 64 is used to engage with the second connecting portion 41 to fix the third fixing member to the fan.

[0068] In a specific implementation, the third fixing member 90 can be in the form of a sheet. One end of the third fixing member 90 can be welded to at least one heat dissipation fin assembly to fix the third fixing member 90 to the heat dissipation fin assembly. The third fixing member 90 is provided with a first connecting part 64, and one or more first connecting parts 64 can be provided. The fan is provided with one or more second connecting parts 41 corresponding to one or more first connecting parts 64. In this way, when the fan is placed in the first space, the first connecting parts 64 and the second connecting parts 41 can be combined with each other to fix the fan to the third fixing member 90. This makes the fan, the third fixing member 90 and the heat dissipation fin assembly connected as a whole, improving the structural stability and reliability of the dual-outlet heat dissipation device.

[0069] Example 2

[0070] The dual-outlet heat dissipation device also includes a third fixing member 90, on which a first connecting part 64 is provided, on the fan a second connecting part 41 is provided, and on the tray a third connecting part 218 is provided; and the first connecting part 64 and the third connecting part 218 are both used to engage with the second connecting part 41 to fix the third fixing member to the fan.

[0071] In specific implementation, compared with Example 1, Example 2 also provides a third connecting part 218 on the first support plate. When the fan is set in the first space, it is connected to the first connecting part 64 and the third connecting part 218 through the second connecting part 41 on the fan, thereby fixing the fan to the first support plate and the third fixing part 90, thus integrating the various components of the dual-outlet heat dissipation device into one, improving the structural stability and reliability of the dual-outlet heat dissipation device.

[0072] Example 3

[0073] The fan is provided with a second connecting part 41, and the tray is provided with a third connecting part 218; and the first connecting part 64 and the third connecting part 218 are both used to connect with the second connecting part 41 to fix the third fixing member to the fan.

[0074] In a specific implementation, in Example 3, a third connecting part 218 can be provided only on the first support plate of the tray, and a second connecting part 41 can be provided on the fan. When the fan is placed in the first space, the second connecting part 41 on the fan is combined with the third connecting part 218, thereby fixing the fan to the first support plate and the third fixing member 90, thus making the fan and the tray an integral unit, improving the structural stability and reliability of the dual-outlet heat dissipation device.

[0075] It is understandable that the fan can be fixed in other ways, depending on the specific circumstances, and no single method is specified here.

[0076] In one possible embodiment, a first fixing member 83 and a second fixing member 84 are also included. The first fixing member 83 is disposed on the first support plate, and the second fixing member 84 is disposed on the second support plate. Both the first fixing member 83 and the second fixing member 84 are used to engage with the target device to fix the heat dissipation device on the target device.

[0077] In a specific implementation, a fifth fixing part is provided on the first support plate, a sixth fixing part is provided on the second support plate, a seventh fixing part can be provided on the first fixing member 83, and an eighth fixing part can be provided on the second fixing member 84; by combining the fifth fixing part with the seventh fixing part, and by combining the sixth fixing part with the eighth fixing part, the first fixing member 83 and the second fixing member 84 can be fixed on the first support plate and the second support plate respectively.

[0078] Specifically, the fifth and sixth fixing parts can be protrusions, and the seventh and eighth fixing parts can be grooves or through holes. The protrusions are combined with the grooves or through holes to fix the first fixing member 83 and the second fixing member 84 to the first support plate and the second support plate, respectively.

[0079] It is understandable that the fifth, sixth, seventh, and eighth fixing parts can also be other structures, such as welded structures, adhesive structures, riveted structures, mortise and tenon structures, etc., as long as they can meet the fixing requirements of the first fixing member 83 and the second fixing member 84. There is no unique limitation here.

[0080] Option 2

[0081] In one possible embodiment, please refer to Figures 5 to 10 For details, please refer to Figure 6 The dual-outlet cooling device also includes a fan 40, which includes at least one air inlet and at least two air outlets; the at least two air outlets are connected to the at least two heat dissipation fin groups; a first space is formed between the at least two heat dissipation fin groups, and the fan 40 is housed in the first space; when the fan 40 is housed in the first space, the surface of the fan 40 is within the first space or flush with the at least two heat dissipation fin groups.

[0082] In practice, at least two heat dissipation fin groups constitute the first space. To improve space utilization, the shape of this first space is designed to fit the fan 40. When the fan 40 is housed in the first space, the thickness of the dual-outlet heat dissipation device is equal to the thickness of a single heat dissipation fin group plus the thickness of the heat pipe and the tray. The fan 40 does not increase the thickness of the dual-outlet heat dissipation device. In this way, while increasing the heat dissipation efficiency by adding the fan 40, the thickness of the dual-outlet heat dissipation device can be maintained without increasing the thickness, which is beneficial for the miniaturization of electronic devices.

[0083] Optionally, the fan 40 can be a centrifugal fan, with preferred dimensions of 100mm in length, 94mm in width, and 15mm in height. The thickness of the heatsink fin assembly can also be set to 15mm, or slightly greater than 15mm. The fan 40 is flush with or lower than the 15mm high heatsink fin assembly, without occupying additional height, achieving a compact integrated structure of the fan 40 and fins 33. It is understood that the dimensions in this embodiment are not unique and can be adjusted according to the dimensions of the corresponding electronic device; therefore, they are not considered unique.

[0084] Optionally, the fan 40 is positioned above the heat pipe. Vertically, the fan 40 has an air inlet on its first side closest to the heat pipe and a sealed second side away from the heat pipe. The fan 40 draws air vertically from the heat pipe towards itself. The fan 40 includes at least two air outlets, which can be located on its sides (i.e., perpendicular to the horizontal direction). When the fan 40 draws air in through the air inlet, the air is blocked by the second side and exits through the two horizontal air outlets. Each air outlet is connected to one of two heat sink fin assemblies. Therefore, after the air exits through the outlets, it passes through the heat sink fin assemblies, exchanges heat with them, and is finally exhausted from the electronic device's exhaust port, thus completing the heat dissipation of the semiconductor devices in the electronic device.

[0085] Optionally, the dual-outlet fan 40 has an airflow of 10.3 CFM and a wind pressure of 9.45 mmH2O. The high wind pressure characteristic of the centrifugal fan can overcome the airflow resistance in small spaces, forcing airflow to quickly penetrate the gaps between the fins 33, thus solving the problem of "airflow attenuation in small spaces". The fan 40 has a rated noise of only 28 dB (maximum 30 dB), which is inherently low-noise; the dual-outlet design divides the airflow into two paths, avoiding the concentrated impact of airflow on the fins 33 when using a single outlet, and reducing airflow impact noise. It is understood that the parameters of the fan 40 in this embodiment are not unique parameters and can be adjusted according to the needs of the corresponding electronic equipment, and are not limited to uniqueness here.

[0086] In one possible embodiment, please refer to Figure 5 and Figure 6 The heat dissipation fin assembly includes a plurality of fins 33 arranged sequentially at a preset angle. The first opening of the gap between every two adjacent fins 33 is connected to the air outlet of the fan 40, and the second opening of the gap between every two adjacent fins 33 is used to connect to the air outlet of the housing.

[0087] In practice, the heat dissipation fin assembly has multiple fins 33 arranged at a preset angle. When air from the outlet blows towards the heat dissipation fin assembly, the air passes through the gaps between any two adjacent fins 33, exchanging heat with the fins and carrying away the heat from them. The preset angle arrangement avoids direct airflow and reduces airflow speed, preventing the hot air from significantly affecting the user.

[0088] Optionally, the heat dissipation fin assembly includes a top plate and a bottom plate, with multiple fins 33 disposed between the top plate and the bottom plate.

[0089] In one example, multiple fins 33 can be movably connected to the top and bottom clamps, allowing the fins 33 to be horizontally adjusted between the top and bottom clamps. This enables the dual-outlet heat dissipation device to adapt to the air outlets of various electronic devices. For instance, after the dual-outlet heat dissipation device is installed in an electronic device, if it is found that the fins 33 are not aligned with the air outlet of the electronic device (e.g., horizontal misalignment), the angle of the fins 33 can be adjusted so that the airflow is directed towards the air outlet, thereby preventing hot air from blowing onto the electronic device casing, which would cause hot air recirculation and increase heat accumulation.

[0090] Optionally, the fins 33 are made of AL1050 aluminum alloy with Ni alloy, and each heat dissipation fin group contains 73 0.2mm fins 33. The fin spacing of the fins 33 is 1.2mm (total area of ​​a single group is 67484mm²). The reasonable spacing of the fins 33 reduces the frictional resistance when the airflow passes through, and reduces turbulence noise.

[0091] Optionally, the inclined fins 33 provide a smooth airflow transition: both sets of fins 33 are inclined at 73 degrees, creating a "no-turn" path for airflow from the fan 40 outlet to the fins 33 and then to the housing outlet, avoiding vortex noise caused by sudden changes in airflow direction, and further controlling the overall noise level below 42dB. Setting the fins 33 to an incline of 73 degrees not only ensures smooth airflow transmission from the fan 40 outlet to the fins 33 and the electronic device outlet, but also allows the housing outlet to be centrally located (improving the product's aesthetics); traditional solutions often neglect the compatibility between the fin angle and the housing, frequently leading to the contradiction of "efficient airflow but cluttered appearance," while this solution achieves a balance between the two.

[0092] Optionally, the fin 33 can use aluminum fins instead of traditional copper fins. The "73-fin high-density layout plus a large heat dissipation area of ​​67484mm²" makes up for the shortcoming that aluminum has a lower thermal conductivity than copper (the cost of aluminum fins is more than 40% lower than that of copper fins), and the lightweight aluminum material improves the portability of the body.

[0093] Optionally, the fins 33 are tilted at 73 degrees and aligned with the air outlets on both sides of the housing. The dual air outlets of the fan 40 are precisely connected to the inlets of the two sets of fins 33, forming a "no misalignment" air duct. After the airflow is sent out by the fan 40, it directly enters the fins 33 to absorb heat and then is smoothly discharged along the tilt angle, increasing the air volume utilization rate to over 90% and avoiding the turbulent heat accumulation of traditional solutions.

[0094] In one possible embodiment, the tray includes a tray body 21, on which a first receiving cavity is provided. The bottom end face of the first receiving cavity is a first end face 22, and the outer wall of the bottom end face of the first receiving cavity is a second end face 23. At least one main body portion of the at least one heat dissipation pipe is received in the first receiving cavity. A first support plate 211 extends from a first side plate 25 of the tray body, and a second support plate 212 extends from a second side plate 26 of the tray body. The first support plate 211 extends to the first branch pipe 16 and, together with the heat dissipation fin assembly, clamps the first branch pipe 16. The first support plate 211 is connected to a first outer cavity wall away from the bottom end face of the first receiving cavity, and the second support plate 212 is connected to a second outer cavity wall away from the bottom end face of the first receiving cavity.

[0095] In a specific implementation, a first receiving cavity is provided in the tray body 21. The first receiving cavity is groove-shaped, and one of the opposite groove walls is open, so that the main body of the heat dissipation pipe can be received in the first receiving cavity. The remaining three groove walls restrict the main body of the heat dissipation pipe to prevent displacement of the heat dissipation pipe.

[0096] Meanwhile, the tray body 21 extends a first support plate 211 and a second support plate 212 from the top of the two sides of the first receiving cavity toward the outside of the first receiving cavity, respectively. The dimensions of the first support plate 211 and the second support plate 212 can be different or the same. Depending on the position of the heat dissipation fin assembly, the size of the first support plate 211 and / or the second support plate 212 can be adjusted so that the first support plate 211 and / or the second support plate 212 can extend to the corresponding heat dissipation fin assembly position to clamp the corresponding branch pipe (first branch pipe 16 or second branch pipe 17) together with the heat dissipation fin assembly.

[0097] Optionally, since the tray is supported by the first support plate 211 and the second support plate 212, the first accommodating cavity serves to isolate the heat pipe, heat sink fin assembly and fan 40 from the semiconductor device being cooled, providing structural support for the fins 33 and reducing the reverse conduction of heat from the fins 33 to the heat pipe area, thus ensuring unidirectional heat transfer.

[0098] In one possible embodiment, a first platform 215 is provided at the end of the first support plate 211 away from the first side plate 25, and the first platform 215 is used to contact the first branch pipe 16; or, a second platform is provided at the end of the second support plate 212 away from the second side plate 26, and the second platform is used to contact the first branch pipe 16. Providing an extended platform on the first support plate 211 to contact the first branch pipe 16 supports the first branch pipe 16 and also serves to even out heat distribution.

[0099] In one possible embodiment, the second support plate 212 is further provided with a first step, and a third platform 217 extends from the first step. The third platform 217 is used to contact the southbridge chip, thereby transferring the heat on the southbridge chip to the third platform 217, and then from the third platform 217 to the second support plate 212. After passing through the second support plate 212, the heat is transferred to the second branch pipe 17 and the heat sink fin assembly, and finally the fan 40 performs heat exchange to complete the heat dissipation of the southbridge chip.

[0100] In one possible embodiment, the dual-outlet heat dissipation device further includes a first cover plate, the first cover plate including a cover plate body 61, a third support plate 65 extending from a third side of the cover plate body 61, and a fourth support plate 66 extending from a fourth side of the cover plate body 61; the first cover plate is used to cover the first receiving cavity, and together with the tray, clamps the at least one heat dissipation pipe in the first receiving cavity; when the first cover plate is covering the first receiving cavity, the third support plate 65 is fixed to the first support plate 211, and the fourth support plate 66 is fixed to the second support plate 212.

[0101] In specific implementation, the first cover plate is used to block the side openings of the first receiving cavity, so that the first receiving cavity becomes a penetrating cavity with only two opposing openings and four sealed sides, thereby clamping the main body of the heat dissipation pipe between the tray and the first cover plate, preventing the heat dissipation pipe from shifting. The first cover plate includes a third support plate 65 and a fourth support plate 66. The third support plate 65 is fixedly connected to the first support plate 211, and the fourth support plate 66 is fixedly connected to the second support plate 212, thus fixing the first cover plate and the tray together and achieving clamping of the heat dissipation pipe.

[0102] For details, please refer to Figure 9 and Figure 10 A first fixing part 213 is provided between the first support plate 211 and the first side plate 25; a second fixing part 214 is provided between the second support plate 212 and the second side plate 26; a first concave part 651 is provided between the third support plate 65 and the third side plate, recessing inwards until contacting the first support plate; a third fixing part 67 is provided on the first concave part 651; a second concave part 661 is provided between the fourth support plate 66 and the fourth side plate, recessing inwards until contacting the second support plate; a fourth fixing part 68 is provided on the second concave part 661; the first fixing part 213 and the third fixing part 67 are combined, and the second fixing part 214 and the fourth fixing part 68 are combined, so as to fix the tray and the first cover plate to each other.

[0103] In a specific implementation, the first fixing part 213, the second fixing part 214, the third fixing part 67, and the fourth fixing part 68 can all be configured as through holes, and fixed by screws passing through two corresponding through holes. For example, the first support plate 211 and the third support plate 65 are fixed by screws passing through the first fixing part 213 and the third fixing part 67; the second support plate 212 and the fourth support plate 66 are fixed by screws passing through the second fixing part 214 and the fourth fixing part 68, thus achieving the fixation between the first cover plate and the tray.

[0104] It is understandable that the first fixing part 213, the second fixing part 214, the third fixing part 67 and the fourth fixing part 68 can be connected by other fixing methods besides screws, such as glue bonding, metal welding, mortise and tenon structure snap-fit, etc., which are not limited here.

[0105] In one possible embodiment, please refer to Figure 9 and Figure 10 The fourth support plate 66 has a fifth step formed by downwardly recessing vertically towards the plane of the second support plate. A thirteenth fixing part 69 is provided on this fifth step. This thirteenth fixing part 69 is used to engage with a corresponding thirteenth connecting part on the electronic device, thereby fixing the first cover plate to the electronic device. Optionally, the thirteenth connecting part can be provided on the housing of the electronic device or on the circuit board within the electronic device.

[0106] In one possible embodiment, the first cover plate is provided with a first connecting portion 64, and the fan 40 is provided with a second connecting portion 41; the first connecting portion 64 is used to engage with the second connecting portion 41 to fix the first cover plate to the fan 40.

[0107] In the specific implementation, since the first cover plate is adjacent to the fan 40 in terms of structural position, a corresponding first joint 64 can be provided on the first cover plate to be combined with the second joint 41 on the fan 40, thereby fixing the fan 40 on the first cover plate. Since the first cover plate and the tray are fixed to each other, and the heat pipe is clamped between the first cover plate and the tray, the first cover plate, heat pipe, tray and fan 40 form a detachable integrated structure, which enhances the reliability between the individual components.

[0108] In one possible embodiment, please refer to Figure 7 and Figure 8 The dual-outlet heat dissipation device also includes a first fixing member 83 and a second fixing member 84. The first fixing member is disposed between the first support plate and the third support plate 65, and the second fixing member is disposed between the second support plate and the fourth support plate.

[0109] Please refer to the following for details. Figure 10 A ninth fixing part 81 is provided between the first support plate 211 and the third support plate 65, and a tenth fixing part 82 is provided between the second support plate 212 and the fourth support plate 66. The ninth fixing part 81 is located on the first support plate 211 and the second support plate 212 near the first fixing part 213 and the third fixing part 67. The first fixing member 83 is located in the ninth fixing part 81. The tenth fixing part 82 is located on the second support plate 212 and the fourth support plate 66 near the second fixing part 214 and the fourth fixing part 68. The second fixing member 84 is located in the tenth fixing part 82. The first fixing member 83 and the second fixing member 84 are both used to combine with the target device to fix the heat dissipation device on the target device.

[0110] In specific implementation, utilizing the clamping state between the first cover plate and the tray, a ninth fixing part 81 is provided between the first support plate 211 and the third support plate 65, and a tenth fixing part 82 is provided between the second support plate 212 and the fourth support plate 66. Additional components, namely a first fixing member 83 and a second fixing member 84, are provided, and the first fixing member 83 and the second fixing member 84 are clamped by the ninth fixing part 81 and the tenth fixing part 82 to hold the first fixing member 83 and the second fixing member 84 between the first cover plate and the tray. The first fixing member 83 is provided with at least one eleventh fixing part 831, the second fixing member 84 is provided with a twelfth fixing part 841, and the electronic device is provided with corresponding fourth and fifth connecting parts. The eleventh fixing part 831 and the twelfth fixing part 841 are respectively connected to the fourth and fifth connecting parts, so that the integrated structure formed by the first cover plate, heat sink, tray, and fan 40 is fixed in the electronic device.

[0111] The first fixing member 83 has a first step 832 at its first end and a second step 833 at its second end. The second fixing member 84 has a third step 842 at its first end and a fourth step 843 at its second end. The first step 832 and the second step 833 form a first groove 834 on the first fixing member 83, which engages with the ninth fixing part 81, allowing the first fixing member 83 to be fitted onto the first support plate 211. The third step 842 and the fourth step 843 form a second groove 844 on the second fixing member 84, which engages with the tenth fixing part 82, allowing the second fixing member 84 to be fitted onto the second support plate 212.

[0112] As can be seen, in this embodiment, the dual-outlet heat dissipation device is fixed in the electronic device by setting corresponding fasteners, which improves the reliability of the dual-outlet heat dissipation device. Furthermore, since the first fastener 83 and the second fastener 84 are both individual parts, their positions can be adjusted according to the positions of the fourth and fifth joints of electronic devices of different specifications. This allows the dual-outlet heat dissipation device to be adapted to electronic devices of different specifications, improving its versatility.

[0113] In one possible embodiment, a first ramp 27 is provided at the first connection between the at least one first branch pipe 16 and the at least one main body, and a second ramp 28 is provided at the second connection between the at least one second branch pipe 17 and the at least one main body; the first ramp 27 and the second ramp 28 are used to support the at least one main body so that the at least one main body is isolated from the fan 40.

[0114] In specific implementation, by setting a first ramp 27 and a second ramp 28 on the main body, a certain height difference exists between the main body and the first branch pipe 16 and the second branch pipe 17. When the first branch pipe 16 and the second branch pipe 17 come into contact with the heat dissipation fin assembly, a certain distance can be maintained between the main body and the plane where the heat dissipation fin assembly is located. The fan 40 is flush with or lower than the heat dissipation fin assembly. Therefore, the main body is isolated from the fan 40, which is conducive to air circulation and avoids affecting the speed of the fan 40, ensuring that the original suction and exhaust strength of the fan 40 can be fully utilized.

[0115] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can easily conceive of variations or substitutions without departing from the spirit and scope of the present invention, and various modifications and alterations can be made, including combinations of the different functions and implementation steps described above, as well as software and hardware implementation methods, all of which are within the protection scope of the present invention.

Claims

1. A dual-outlet heat dissipation device, characterized in that, It includes a tray, a first cover plate, a first fixing member, a second fixing member, a fan, at least two heat dissipation pipes, and at least two heat dissipation fin groups; the tray includes a tray body, the tray body is provided with a first receiving cavity, the bottom end face of the first receiving cavity is a first end face, the outer wall of the bottom end face of the first receiving cavity is a second end face, and the second end face is used to contact the target heat source; The at least two main bodies corresponding to the at least two heat dissipation pipes are all housed in the first accommodating cavity; the first end of the main body of each heat dissipation pipe is bent at a first preset arc and extends out to form a first branch pipe, forming a U-shaped structure; the second end of the main body of each heat dissipation pipe is bent at a second preset arc or a third preset arc and extends out to form a second branch pipe, together forming a Y-shaped forking structure; the first branch pipe and the second branch pipe extend to the at least two heat dissipation fin groups respectively and contact the at least two heat dissipation fin groups. The first side plate of the tray body extends into a first support plate, and the second side plate of the tray body extends into a second support plate; the first cover plate covers the first accommodating cavity, the third side of the first cover plate extends into a third support plate, and the fourth side of the first cover plate extends into a fourth support plate. The third support plate is fixed to the first support plate, and the fourth support plate is fixed to the second support plate, together clamping the main body of the two heat dissipation pipes in the first accommodating cavity. The first fixing member is clamped between the first support plate and the third support plate, and the second fixing member is clamped between the second support plate and the fourth support plate. The first fixing member and the second fixing member are used to combine with the target device to fix the heat dissipation device. The first support plate and the second support plate extend to the first branch pipe and the second branch pipe respectively, and together with the heat dissipation fin group, clamp the first branch pipe and the second branch pipe. The fan includes at least one air inlet and at least two air outlets; the at least two air outlets are connected to the at least two heat dissipation fin groups; a first space is formed between the at least two heat dissipation fin groups, and the fan is housed within the first space; when the fan is housed within the first space, the surface of the fan is within the first space or flush with the at least two heat dissipation fin groups.

2. The dual-outlet heat dissipation device according to claim 1, characterized in that, The heat dissipation fin assembly includes multiple fins arranged sequentially at a preset angle. The first opening of the gap between every two adjacent fins is connected to the air outlet of the fan, and the second opening of the gap between every two adjacent fins is used to connect to the air outlet of the housing.

3. The dual-outlet heat dissipation device according to claim 1, characterized in that, The first support plate is connected to the first outer cavity wall away from the bottom end face of the first accommodating cavity, and the second support plate is connected to the second outer cavity wall away from the bottom end face of the first accommodating cavity.

4. The dual-outlet heat dissipation device according to claim 3, characterized in that, The first cover plate includes a cover plate body, a third support plate extending from a third side of the cover plate body, and a fourth support plate extending from a fourth side of the cover plate body.

5. The dual-outlet heat dissipation device according to claim 4, characterized in that, The first support plate is provided with a first fixing part, the second support plate is provided with a second fixing part, the third support plate is provided with a third fixing part between the third side and the third side, and the fourth support plate is provided with a fourth fixing part between the fourth side. The first fixing part is combined with the third fixing part, and the second fixing part is combined with the fourth fixing part to fix the tray and the first cover plate to each other.

6. The dual-outlet heat dissipation device according to claim 5, characterized in that, It also includes a third fixing member and a fan, the third fixing member being connected to one or more heat dissipation fin assemblies; the third fixing member having a first connecting portion, and the fan having a second connecting portion; and the first connecting portion being used to engage with the second connecting portion to fix the third fixing member to the fan; or, The third fixing member is provided with a first connecting portion, the fan is provided with a second connecting portion, and the tray is provided with a third connecting portion; and both the first connecting portion and the third connecting portion are used to engage with the second connecting portion to fix the third fixing member to the fan; or, The fan is provided with a second connecting portion, and the tray is provided with a third connecting portion; and both the first connecting portion and the third connecting portion are used to engage with the second connecting portion to fix the third fixing member to the fan; or, The third fixing member is provided with the first connecting portion, and the fan is provided with the second connecting portion; the first connecting portion is used to engage with the second connecting portion to fix the third fixing member to the fan.

7. The dual-outlet heat dissipation device according to claim 4, characterized in that, The first fixing member is disposed between the first support plate and the third support plate, and the second fixing member is disposed between the second support plate and the fourth support plate; or, the first fixing member is disposed on the first support plate, and the second fixing member is disposed on the second support plate. Both the first and second fasteners are used to engage with the target device to fix the heat dissipation device onto the target device.

8. The dual-outlet heat dissipation device according to any one of claims 2-7, characterized in that, A first slope is provided at the first connection between the at least one first branch pipe and the at least one main body, and a second slope is provided at the second connection between the at least one second branch pipe and the at least one main body; The first ramp and the second ramp are used to support the at least one main body portion so that the at least one main body portion is isolated from the fan.

9. The dual-outlet heat dissipation device according to any one of claims 3-7, characterized in that, A first platform is provided at the end of the first support plate away from the first side plate, and the first platform is used to contact the first branch pipe; or... The second support plate has a second platform at the end away from the second side plate, and the second platform is used to contact the first branch pipe.

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