Loading device for wafer boxes and loading method thereof

Abstract

The application relates to a feeding device for wafer boxes and a feeding method thereof. The feeding device comprises a frame body provided with a conveying port; a rotating driving assembly is connected to the frame body at a position close to the conveying port; a turnover structure is rotatably connected to the rotating driving assembly and located at the conveying port; the turnover structure comprises a bearing assembly and a locking piece; the locking piece is used for locking the wafer box to the bearing assembly; the turnover structure rotates together with the wafer box under the driving action of the rotating driving assembly; when the turnover structure is in a first state, the bearing assembly is matched with the conveying port and forms a closed space with the frame body, and one side of the bearing assembly is located outside the frame body and used for abutting against the wafer box; the mushroom head of the wafer box is located at the upper end face thereof; when the turnover structure is in a second state, the mushroom head of the wafer box faces the interior of the frame body and is matched with the position of the conveying port. The feeding device can shorten the movement path of the mechanical hand, reduce the floor area of the equipment, and improve the processing efficiency.

Description

Wafer cassette loading device and loading method Technical Field

[0001] This application relates to the field of wafer cell processing technology, and in particular to a wafer cell loading device and loading method thereof. Background Technology

[0002] FOUP (Front Opening Unified Pod) serves as a "protective shell" and "transport carrier" for silicon wafers in the ultra-clean environment of semiconductor factories, ensuring that the wafers are not contaminated or damaged during the manufacturing process.

[0003] However, in this field, due to the high cost of workshop construction, the floor space of the equipment is directly related to the cost. In existing technologies, loading and unloading stations are typically set up at the transport port. The loading station is located outside the equipment, and the unloading station is located inside. An overhead crane places the wafer cassette with its mushroom-shaped end facing upwards at the loading station. The drive mechanism then moves the wafer cassette from the loading station to the unloading station inside the equipment. A robotic arm then grasps the mushroom-shaped end of the wafer cassette and processes it. The problems with this wafer cassette loading method are: the presence of the unloading station results in a large overall equipment width, i.e., a large floor space; furthermore, because the robotic arm needs to grasp the mushroom-shaped end of the wafer cassette, the robotic arm's movement path is long, and the equipment needs to reserve sufficient width for this movement path, which also contributes to the overall large equipment width, large floor space, and high cost. Summary of the Invention

[0004] In view of this, the present application provides a loading device and method for wafer cassettes to solve at least one problem existing in the background art.

[0005] In a first aspect, embodiments of this application provide a loading device for a wafer cassette, the loading device comprising:

[0006] The frame is equipped with a transport port;

[0007] A rotation drive assembly is connected to the frame near the transport port.

[0008] A flip structure is rotatably connected to the rotation drive assembly and located at the transport port. The flip structure includes a support assembly and a locking member. The locking member is connected to the support assembly and is used to lock the wafer cassette to the support assembly. The flip structure rotates together with the wafer cassette under the driving action of the rotation drive assembly.

[0009] When the flipping structure is in the first state, the carrier component is adapted to the transport port and forms a closed space with the frame. The wafer box is fixed to the carrier component with the mushroom head facing upward by the locking member.

[0010] When the flipping structure is in the second state, the transport port is open, the wafer cassette is fixed to the carrier assembly by the locking member with the mushroom head facing the inside of the feeding device, and the wafer cassette is located inside the transport port. The second state is the state after the flipping structure has rotated a preset angle from the first state.

[0011] In conjunction with the first aspect of this application, in an alternative embodiment, when the flipping structure is in the second state, at least a portion of the supporting component is located outside the frame.

[0012] In conjunction with a first aspect of this application, in an alternative embodiment, the rotation drive assembly includes:

[0013] Drive components;

[0014] The slide rail and the drive component are both connected to the frame;

[0015] The slider is slidably connected to the slide rail. Under the driving action of the driving member, the slider reciprocates along the slide rail. The slider is rotatably connected to the bearing assembly. The slider moves along the slide rail to drive the bearing assembly to rotate.

[0016] A connecting rod, one end of which is rotatably connected to the frame and the other end of which is rotatably connected to the load-bearing component.

[0017] In conjunction with the first aspect of this application, in an alternative embodiment, the slider is connected to the side end of the support assembly near the mushroom head, such that the support assembly is rotated toward the interior of the frame under the driving action of the drive member.

[0018] In conjunction with the first aspect of this application, in an optional embodiment, the feeding device further includes a first lifting structure, the first lifting structure comprising:

[0019] The first lifting drive is connected to the frame;

[0020] A lifting component is connected to the first lifting drive and located at the transport port. The lifting component moves up and down under the action of the first lifting drive to avoid the rotating wafer cassette or to close the transport port with the carrying component.

[0021] In conjunction with the first aspect of this application, in an optional embodiment, the wafer cassette includes a detachably connected cover and a housing, the cover being located at the middle position of the housing; the loading device further includes:

[0022] The housing is connected to the side of the support assembly away from the wafer cassette;

[0023] An unlocking component, connected to the carrier component, is used to unlock or lock the box and the cover;

[0024] A second lifting structure is connected to the housing and is used to drive the box to move when the flipping structure is in the second state, so as to disengage it from the cover.

[0025] A detection component is used to detect whether there are foreign objects on the cover through the gap between the box and the cover.

[0026] In conjunction with the first aspect of this application, in an optional embodiment, the supporting component includes a movable member and a fixed member, the movable member and the fixed member being detachably connected, and the movable member being positioned corresponding to the box body;

[0027] The second lifting structure includes:

[0028] The second lifting drive is connected to the housing;

[0029] A lifting bracket is movably connected to the second lifting drive and to the movable component. The movable component and the lifting bracket move relative to the fixed component under the action of the second lifting drive to separate the box body from the cover body.

[0030] In conjunction with the first aspect of this application, in an optional embodiment, the second lifting structure further includes:

[0031] Guide component, connected to the second lifting drive;

[0032] The movable component is adapted to the guide component and connected to the lifting bracket. The guide component reciprocates under the action of the second lifting drive, so that the movable component reciprocates under the action of the guide component.

[0033] In conjunction with the first aspect of this application, in an optional embodiment, the guide member moves along a first direction under the action of the second lifting drive, and the lifting bracket follows the moving member to move along a second direction, the second direction being the height direction of the frame, and the first direction being perpendicular to the second direction.

[0034] Secondly, embodiments of this application provide a loading method for a wafer cassette loading apparatus as described in any of the first aspects; the loading method includes:

[0035] Get the current position status of the wafer cassette;

[0036] Confirm whether the current position of the wafer cassette is that the wafer cassette is connected to the carrier assembly, and the current position is that the mushroom head of the wafer cassette is located on its upper end face;

[0037] If so, the rotating drive component is used to drive the carrier component to rotate by a preset angle so that the mushroom head of the wafer cassette faces the inside of the frame and is opposite to the position of the transport port.

[0038] The wafer cassette loading device provided in this application embodiment enables the wafer cassette to adjust its orientation under the action of the rotation drive component through a flipping structure. This allows the wafer cassette to flip from mushroom head upwards to mushroom head inwards before being grasped by a robotic arm. As a result, there is no need to set up a separate unloading station, reducing the width occupied by the unloading station on the equipment, i.e., reducing the equipment's floor space. Furthermore, since the robotic arm directly grasps the inward-facing mushroom head, the movement path of the robotic arm is short, so the equipment does not need to reserve the width required for the robotic arm to grasp the wafer cassette, further reducing the overall floor space of the equipment and lowering costs.

[0039] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0040] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0041] Figure 1 is a three-dimensional structural diagram of the processing equipment for a wafer cassette provided in an embodiment of this application;

[0042] Figure 2 is a top view of the processing equipment for a wafer cassette provided in an embodiment of this application;

[0043] Figure 3 is an enlarged view of point A in Figure 1;

[0044] Figure 4 is a schematic diagram of the structure of the flipping structure in the wafer cassette loading device provided in the embodiment of this application when it is in the first state;

[0045] Figure 5 is a schematic diagram of the structure of the flipping structure in the wafer cassette loading device provided in the embodiment of this application when it is in the second state;

[0046] Figure 6 is an exploded view of the structure of the wafer cassette in the first state of the flipping structure in the wafer cassette loading device provided in the embodiment of this application.

[0047] Figure 7 is a schematic diagram of the structure of the flipping structure in the wafer cassette loading device provided in the embodiment of this application when it is in the second state at another angle;

[0048] Figure 8 is a schematic diagram of the structure of the flipping structure in the wafer cassette loading device provided in the embodiment of this application when it is in the first state at another angle;

[0049] Figure 9 is a cross-sectional view of the flipping structure in the wafer cassette loading device provided in the embodiment of this application when it is in the second state;

[0050] Figure 10 is a cross-sectional view from another angle of the flipping structure in the wafer cassette loading device provided in the embodiment of this application when it is in the second state;

[0051] Figure 11 is a cross-sectional view from another angle of the flipping structure in the wafer cassette loading device provided in the embodiment of this application when it is in the second state;

[0052] Figure 12 is a schematic flowchart of the feeding method of the feeding device for wafer cassette provided in the embodiments of this application.

[0053] Figure label:

[0054] 100. Processing equipment; a. Wafer box; a1. Mushroom head; a2. Cover; a3. Box body;

[0055] 10. Frame; 11. Transport port;

[0056] 20. Rotation drive assembly; 21. Drive component; 22. Slide rail; 23. Slider; 24. Linkage component;

[0057] 30. Flip-over structure; 31. Load-bearing component; 311. Moving part; 312. Fixing part; 32. Locking part;

[0058] 40. Transfer structure; 51. Lifting component; 60. Shell;

[0059] 70. Unlocking component; 71. Unlocking drive component; 80. Second lifting structure; 81. Second lifting drive; 82. Lifting bracket; 821. Connecting rod; 822. Frame; 83. Guide component; 831. Guide groove; 84. Moving component; 841. Guide column; 90. Robotic arm. Detailed Implementation

[0060] To make the technical solution and beneficial effects of the present invention more apparent and understandable, a detailed description is provided below by listing specific embodiments. The accompanying drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features; unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application pertains.

[0061] In the description of this invention, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "height," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the purpose of simplifying the description of this invention and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. That is, they should not be construed as limiting this invention.

[0062] In this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating the relative importance of the indicated features or the number of indicated technical features. Therefore, a feature specified as "first" or "second" can explicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc.; "several" means at least one, such as one, two, three, etc., unless otherwise explicitly specified.

[0063] In this invention, unless otherwise explicitly defined, the terms "installation," "connection," "linking," "fixing," and "setting," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can also refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0064] In this invention, unless otherwise explicitly defined, the terms "above," "on top of," "over," "above," "below," "below," "below," or "below" for "first feature above second feature" can refer to the first and second features being in direct contact, or to the first and second features being in indirect contact through an intermediate medium. Furthermore, "above," "over," and "below" for "first feature above second feature" can mean the first feature is directly above or diagonally above the second feature, or simply indicates that the horizontal height of the first feature is higher than the horizontal height of the second feature. Similarly, "below," "below," and "below" for "first feature below second feature" can mean the first feature is directly below or diagonally below the second feature, or simply indicates that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0065] Please refer to Figures 1 and 2. This application embodiment provides a processing device 100 for wafer cassettes. The processing device 100 includes a frame 10 with an enclosed space, a cleaning device, a drying device, a robotic arm 90, and a loading device.

[0066] The frame 10 has a transport port 11, which includes a loading port and a unloading port. The loading port is used for the wafer cassette to enter the processing equipment, and the unloading port is used for the processed wafer cassette to exit. In this embodiment, the specific number and location of the loading and unloading ports, as well as the transport and cleaning sequence of the wafer cassette, are not specifically limited.

[0067] In this embodiment, the loading device is located at the transport port 11. The loading device is used to move the wafer cassette a from outside the frame 10 to the transport port 11, so that it can be picked up by the robot arm 90 located inside the frame 10 and moved to the cleaning device and drying device for cleaning and drying. After the cleaning and drying process is completed, the wafer is unloaded from the unloading port.

[0068] Specifically, please refer to Figures 1 to 7. The feeding device includes a rotation drive assembly 20 and a tilting structure 30. The rotation drive assembly 20 is connected to the frame 10 near the transport port 11. The flip structure 30 is rotatably connected to the rotation drive assembly 20 and located at the transport port 11. The flip structure 30 includes a support assembly 31 and a locking member 32. The locking member 32 is connected to the support assembly 31 and is used to lock the wafer cassette a to the support assembly 31. The flip structure 30 rotates together with the wafer cassette a under the driving action of the rotation drive assembly 20. When the flip structure 30 is in the first state, the support assembly 31 is adapted to the transport port 11 and forms a closed space with the frame 10. One side of the support assembly 31 is located outside the frame 10 to dock with the wafer cassette a. The mushroom head a1 of the wafer cassette a is located on its upper end face. The first state is the state of the flip structure 30 before rotation. When the flip structure 30 is in the second state, the mushroom head a1 of the wafer cassette a faces the inside of the frame 10 and corresponds to the position of the transport port 11. The second state is the state of the flip structure 30 after rotating from the first state by a preset angle.

[0069] The wafer cassette a located on the left side of the transport port 11 in Figure 1 is in the first state. Figure 4 also shows a schematic diagram of the wafer cassette a in the first state, that is, the mushroom head a1 of the wafer cassette a is located on its upper end face. The wafer cassette a located at the unloading port in Figure 1 is in the second state. Figure 7 also shows a schematic diagram of the wafer cassette a in the second state, that is, the mushroom head a1 of the wafer cassette a faces the inside of the frame 10.

[0070] In this embodiment, the transport port 11 can be configured as a rectangular opening, a circular opening, or other shaped opening, and its size should meet the entry and exit requirements of the wafer cassette a. The rotation drive assembly 20 can achieve power output by means of motor drive, hydraulic drive, or pneumatic drive. The load-bearing assembly 31 in the flipping structure 30 can be designed as a flat plate structure, a tray structure, or a clamping structure.

[0071] In this embodiment, the transport port 11 on the frame 10 provides a channel for the positioning and entry / exit of the wafer cassette a, while ensuring the stability of the overall device structure and forming a closed environment. A rotation drive assembly 20 is connected to the frame 10 near the transport port 11, serving as a power source to drive the flip structure 30 to perform a rotational action. The flip structure 30 is rotatably connected to the rotation drive assembly 20 and located at the transport port 11. It includes a support assembly 31 and a locking member 32. The support assembly 31 supports the wafer cassette a, while the locking member 32 fixes the wafer cassette a to the support assembly 31, preventing displacement during rotation. Under the action of the rotation drive assembly 20, the flip structure 30 drives the wafer cassette a to rotate as a whole, thereby achieving adjustment of the orientation of the wafer cassette a.

[0072] When the flipping structure 30 is in the first state, the supporting component 31 is adapted to the transport port 11 and together with the frame 10 forms a closed space. One side of the supporting component 31 is located outside the frame 10, facilitating docking with the wafer cassette a. At this time, the mushroom head a1 of the wafer cassette a is located on its upper surface, meeting the initial placement requirements. Furthermore, when the flipping structure 30 rotates from the first state to the second state by a preset angle, the mushroom head a1 of the wafer cassette a faces inward towards the frame 10 and corresponds to the position of the transport port 11. Thus, the robot arm 90 can directly grasp the mushroom head a1 of the wafer cassette a without making long-distance movements, significantly shortening the movement path of the robot arm 90.

[0073] This embodiment of the application, through the setting of the flip structure 30, enables the wafer cassette a to adjust its orientation under the action of the rotation drive component 20, thereby directly turning the mushroom head a1 of the wafer cassette a into the frame 10, avoiding the problem of the robot arm 90 moving long distances to grasp. As a result, the movement path of the robot arm 90 is shortened, the footprint of the equipment is reduced, and processing efficiency is improved. This embodiment of the application can achieve orientation change of the wafer cassette a through a simple rotation action, solving the problems of increased equipment cost and reduced efficiency caused by the excessively long detour path of the robot arm 90 in the prior art.

[0074] In an alternative embodiment, referring to Figures 1 and 5, when the flip structure 30 is in the second state, at least a portion of the structure of the carrier component 31 is located outside the frame 10. In practical applications, most of the structure of the carrier component 31 is located outside the frame 10; similarly, most of the structure of the wafer cassette a is also located outside the frame 10. Figure 5 shows that most of the structure of the wafer cassette a is located outside the frame 10.

[0075] This can be understood as follows: when most of the structure of the supporting component 31 is located outside the frame 10, a small part of the structure of the supporting component 31 is located inside the frame 10, thereby increasing the utilization rate of the internal space of the frame 10 and further improving the space utilization rate of the entire device.

[0076] In an optional embodiment, referring to Figures 4, 5, and 6, the rotation drive assembly 20 includes a drive member 21, a slide rail 22, and a slider 23. The slide rail 22 and the drive member 21 are both connected to the frame 10. The slider 23 is slidably connected to the slide rail 22 and reciprocates along the slide rail 22 under the driving action of the drive member 21. The slider 23 is rotatably connected to the support assembly 31, and the movement of the slider 23 along the slide rail 22 drives the support assembly 31 to rotate.

[0077] In this embodiment, the driving component 21 refers to the core component that provides driving force. It can be implemented using common driving devices such as motors, hydraulic cylinders, or pneumatic cylinders, providing a stable and controllable power source for the reciprocating motion of the slider 23. The slide rail 22 is a guide component fixed on the frame 10. It is essentially a linear guide structure, which can be implemented in the form of ball bearing guides or sliding guides, providing a precise linear guide reference for the movement of the slider 23. The slider 23 is a moving component that cooperates with the slide rail 22. It achieves reciprocating motion on the slide rail 22 through a sliding connection, and at the same time forms a rotatable connection with the bearing component 31. This smoothly converts the linear displacement of the slider 23 into the rotational motion of the bearing component 31, thereby avoiding the impact and energy loss that may occur from direct drive.

[0078] In this embodiment, the driving component 21 provides a stable driving force, causing the slider 23 to reciprocate along the slide rail 22. The sliding connection between the slider 23 and the slide rail 22 ensures the accuracy of the motion trajectory, while the rotatable connection between the slider 23 and the support component 31 achieves an efficient conversion from linear motion to rotational motion. This embodiment utilizes simple mechanical principles to replace complex rotating mechanisms, which not only simplifies the overall structure but also significantly improves the smoothness of the motion and the positioning accuracy. In addition, the movement of the slider 23 along the slide rail 22 directly drives the support component 31 to rotate, ensuring that the rotation angle can accurately match the preset requirements, such as 90 degrees. This allows the wafer cassette a to reliably switch from the first state where the mushroom head a1 is located on the upper surface to the second state where the mushroom head a1 faces inward. This effectively shortens the gripping path of the robot arm, reduces the equipment footprint, and improves the overall processing efficiency.

[0079] In an optional embodiment, the rotation drive assembly 20 further includes a connecting rod 24, one end of which is rotatably connected to the frame 10 and the other end of which is rotatably connected to the load-bearing assembly 31.

[0080] In this embodiment, the connecting rod 24 refers to a rigid or semi-rigid connecting component, which can be implemented using metal rods, composite material rods, or mechanical connection structures with similar functions. In practical applications, one end of the connecting rod 24 is connected to the frame 10 via a hinge, bearing connection, or other rotatable connection method to ensure that it can rotate flexibly within a certain range. The other end of the connecting rod 24 is also connected to the bearing assembly 31 via a similar rotatable connection method, thereby providing additional support and force transmission path when the slider 23 drives the bearing assembly 31 to rotate. This optimizes the force transmission process, reduces vibration and stress concentration problems caused by a single slider 23 connection, and improves the stability of the rotation of the bearing assembly 31.

[0081] This embodiment optimizes the rotation process of the bearing assembly 31 by introducing a connecting rod. One end of the connecting rod 24 is connected to the frame 10, providing an additional fixed fulcrum for the entire rotation mechanism, thereby effectively limiting the lateral displacement that may occur in the bearing assembly 31 during rotation. When the slider 23 moves along the slide rail 22, the connecting rod 24 converts the linear motion of the slider 23 into the smooth rotation of the bearing assembly 31 through the lever principle, which can significantly reduce the impact and stress concentration that may occur during direct drive. In addition, the setting of the connecting rod 24 also optimizes the force transmission path according to the relative positional relationship between the frame 10 and the bearing assembly 31, so that the wafer cassette a can maintain higher stability during the rotation of the preset angle, thereby ensuring that the mushroom head a1 can be accurately aligned with the transport port 11, which not only improves the reliability of the loading operation, but also lays a solid foundation for subsequent processing steps.

[0082] In an alternative embodiment, referring to Figures 4 and 5, the slider 23 is connected to the side end of the support assembly 31 near the mushroom head a1, so that the support assembly 31 is rotated toward the inside of the frame 10 under the driving action of the drive member 21.

[0083] Figure 4 shows a schematic diagram of the support assembly 31 in its first state. As shown in Figure 4, the slider 23 is connected to the side end of the support assembly 31 near the mushroom head a1, so that when the support assembly 31 is driven downward by the drive member 21, it can rotate inward toward the frame 10, that is, rotate counterclockwise, thus preventing the support assembly 31 from rotating clockwise. In addition, the slider 23 being connected at this position also allows most of the structure of the support assembly 31 to be located outside the frame 10 when it is in the second state, thereby allowing more usable space inside the frame 10 and improving the utilization rate of the internal space of the frame 10.

[0084] In an optional embodiment, referring to Figures 1 and 3, the loading device further includes a transfer structure 40, which is connected to the outside of the frame 10 and corresponds to the transport port 11. The transfer structure 40 is used to transfer the wafer cassette a to a position that is compatible with the carrier assembly 31, so that the locking member 32 locks the wafer cassette a onto the carrier assembly 31.

[0085] The transfer structure 40 in this embodiment refers to an automated device capable of precisely docking the wafer cassette a with the carrier component 31 outside the frame 10. It can be implemented using a robotic arm, a conveyor belt, or a slide rail type 22 push-pull mechanism. The robotic arm can achieve transfer operations along complex paths through multi-degree-of-freedom motion; the conveyor belt is suitable for linear transfer paths and has high transmission efficiency; the slide rail type 22 push-pull mechanism achieves precise positioning through linear drive and is suitable for scenarios requiring high positional accuracy. These implementation methods ensure that the wafer cassette a can be accurately transferred onto the carrier component 31, thus providing a reliable basis for subsequent locking operations. Specific structures and implementation processes of the transfer structure 40 can be found in the applicant's published patent documents and will not be elaborated here.

[0086] This embodiment of the application connects the transfer structure 40 to the outside of the frame 10 and corresponds to the position of the transport port 11, making full use of the transport port 11 as a positioning reference, thereby simplifying the transfer path and improving transfer efficiency. This design not only avoids interference with the ultra-clean environment inside the frame 10, but also significantly reduces the exposure time of the wafer cassette a during the transfer process. During the process of transferring the wafer cassette a to be adapted to the carrier component 31, the transfer structure 40 ensures that the wafer cassette a can be seamlessly connected to the carrier component 31 by precisely matching the geometry and size of the carrier component 31. This process provides an accurate locking position for the locking member 32, effectively avoiding locking failure caused by positional deviation. In addition, the locking member 32 locks the wafer cassette a immediately after the transfer is completed to prevent displacement during subsequent rotation, thereby ensuring the safety and continuity of the entire loading process.

[0087] In an optional embodiment, referring to Figures 1 and 3, the feeding device further includes a first lifting structure, which includes a first lifting drive (not shown in the figures) and a lifting member 51. The first lifting drive is connected to the frame 10; the lifting member 51 is connected to the first lifting drive and is located at the transport port 11. The lifting member 51 moves up and down under the action of the first lifting drive to avoid the rotating wafer cassette a or to close the transport port 11 with the carrier component 31.

[0088] The first lifting drive in this embodiment refers to a device capable of providing stable driving force, which can be implemented using an electric push rod, a hydraulic cylinder, or a pneumatic actuator, providing precise power support for the movement of the lifting component 51. The lifting component 51 can be understood as a movable mechanical part, which can be in the form of a plate, baffle, or slider 23, etc., and can dynamically adjust its position according to the rotation state of the wafer cassette a, thereby avoiding mechanical interference and ensuring environmental sealing.

[0089] This embodiment of the application achieves intelligent management of the status of the transport port 11 through the linkage design of the first lifting drive and the lifting component 51. The first lifting drive is fixedly installed on the frame 10 to ensure the stability of the entire lifting system; the lifting component 51 is precisely arranged in the area of ​​the transport port 11 and completes the lifting action by receiving the control signal of the first lifting drive. When the wafer cassette a needs to rotate, the lifting component 51 descends according to the instruction of the first lifting drive, actively making enough space to prevent the wafer cassette a from colliding with the frame 10; after the wafer cassette a completes its rotation, the lifting component 51 rises and works with the bearing component 31 to form a sealed barrier, effectively blocking external contaminants from entering the transport port 11. This design based on real-time response not only solves the spatial conflict problem that may be caused during the rotation of the wafer cassette a, but also significantly improves the continuous stability of the ultra-clean environment. In addition, the overall cooperation of the first lifting structure with the frame 10, the bearing component 31 and the wafer cassette a further optimizes the smoothness and reliability of the equipment operation, thereby strengthening the environmental control capability while ensuring operational efficiency.

[0090] In an optional embodiment, referring to Figures 4, 5, and 6, the wafer cassette a includes a detachably connected cover a2 and a cassette a3, with the cover a2 located at the middle position of the cassette a3; the loading device also includes a housing 60 connected to the support assembly 31 on the side away from the wafer cassette a; an unlocking assembly 70 connected to the support assembly 31 for unlocking or locking the cassette a3 and the cover a2; a second lifting structure 80 connected to the housing 60 for driving the cassette a3 to move so that it detaches from the cover a2; and a detection assembly (not shown) for detecting whether there are foreign objects on the cover a2 through the gap between the cassette a3 and the cover a2.

[0091] In this embodiment, the housing 60 refers to a rigid support structure, which can be implemented using a metal frame, composite material plates, or other structures with high strength and stability, and can provide a stable installation reference for the unlocking component 70 and the second lifting structure 80.

[0092] The unlocking component 70 can be understood as a mechanical actuator, specifically a pneumatic latch, an electromagnetic lock, or a motor-driven rotary latch, capable of automatically unlocking or locking the box a3 and the cover a2. Figure 8 shows that the unlocking drive 71 of the unlocking component 70 is cylinder-driven.

[0093] The second lifting structure 80 refers to a drive mechanism capable of generating linear motion, which can be implemented by an electric push rod, hydraulic cylinder or screw transmission mechanism, and can precisely control the lifting action of the box a3 to complete the separation operation.

[0094] In addition, the detection component can be an infrared beam sensor to confirm whether there are foreign objects inside wafer cassette a before cleaning and drying. These foreign objects can be wafers or wafer fragments. After wafer cassette a rotates, cover a2 is located below cassette a3. The remaining wafers or wafer fragments inside wafer cassette a are held on cover a2 by their own gravity. Therefore, the detection component detects the presence of foreign objects on cover a2 through the gap between cover a2 and cassette a3, thus confirming the presence of foreign objects inside wafer cassette a.

[0095] In this embodiment, the housing 60 is fixed to the side of the supporting component 31 away from the wafer cassette a, providing a stable mounting platform for the unlocking component 70 and the second lifting structure 80, ensuring that the position of the wafer cassette a remains unchanged during operation. The unlocking component 70 acts directly on the connection between the cassette a3 and the cover a2, allowing for in-situ operation even when the supporting component 31 has locked the wafer cassette a. The second lifting structure 80, relying on the fixed position of the housing 60, drives the cassette a3 to move smoothly, enabling the cassette a3 to precisely detach from the cover a2, allowing the detection component to perform detection from the gap between the cover a2 and the cassette a3. The detection component utilizes the natural gap formed when the cassette a3 and the cover a2 separates for non-contact detection, enabling real-time monitoring of the surface condition of the cover a2 without additional space or physical contact, simplifying the equipment structure and significantly improving operational efficiency.

[0096] In an optional embodiment, referring to Figures 8 to 11, the supporting component 31 includes a movable member 311 and a fixed member 312. The movable member 311 and the fixed member 312 are detachably connected. For example, the movable member 311 overlaps the fixed member 312, and the movable member 311 is positioned corresponding to the box body a3. The second lifting structure 80 includes a second lifting drive 81 and a lifting bracket 82. The second lifting drive 81 is connected to the housing 60, and the lifting bracket 82 is movably connected to the second lifting drive 81 and connected to the movable member 311. Under the action of the second lifting drive 81, the movable member 311 and the lifting bracket 82 move relative to the fixed member 312 to separate the box body a3 from the cover body a2.

[0097] In this embodiment, the movable component 311 can be a ring-shaped tray, providing independent support for the box a3 when it is separated from the cover a2. The fixing component 312 can be a support plate, used to install the unlocking component 70 and the locking component 32, and also to provide support for the cover a2. The second lifting drive 81 is a component that provides power for the separation of the box a3 from the cover a2. It can be implemented using a cylinder, a lead screw transmission mechanism, or a linear motor, and can complete the lifting action of the box a3 through a stable driving force. The lifting bracket 82 is an intermediate component connecting the second lifting drive 81 and the movable component 311. It can be implemented using a rigid connecting rod or a frame structure, and can directly transmit the power of the second lifting drive 81 to the movable component 311, thereby ensuring the stability of the lifting process.

[0098] In this embodiment, the movable component 311 and the fixed component 312 are arranged according to the structure of the box body a3 and the cover body a2. The cover body a2 is connected to the middle position of the box body a3, and the movable component 311, which supports the box body a3, is also located at the edge of the fixed component 312. For example, the movable component 311 overlaps the periphery of the fixed component 312. When the movable component 311 is lifted by the lifting bracket 82, the movable component 311 lifts the box body a3, thereby separating it from the cover body a2.

[0099] In one optional embodiment, the lifting support 82 includes a frame 822 and a plurality of connecting rods 821, one end of which is connected to the frame 822 and the other end of which is connected to the movable component 311. The plurality of connecting rods 821 are connected at different positions on the frame 822 to achieve stable support for the movable component 311 and smooth lifting during the lifting process.

[0100] Furthermore, the connecting rod 821 passes through the fixed member 312 and connects to the movable member 311 to improve the compactness of the second lifting structure 80. Driven by the second lifting drive 81, the movable member 311 rises and falls together with the connecting rod 821 and the frame 822. The multiple connecting rods 821 connected to different positions on the movable member 311 improve its stability during the lifting process, ensuring the stability of the relative position between the movable member 311 and the box a3, thus guaranteeing the smooth locking of the box a3 and the cover a2.

[0101] In an optional embodiment, the locking member 32 is a suction cup connected to the fixing member 312, protruding from the surface of the fixing member 312. The suction cup is used to achieve a fixed connection between the wafer cassette a and the carrier component 31. Additionally, the unlocking component 70 is also connected to the fixing member 312 and protrudes from the surface of the fixing member 312, enabling the unlocking or locking of the cassette a3 and the cover a2. The movable member 311 overlaps the fixing member 312 and forms a protruding structure on its surface. This can be understood as the movable member 311 overlapping the surface of the fixing member 312, causing a recessed structure to be formed in the corresponding area of ​​the fixing member 312 and the cover a2. Both the locking member 32 and the unlocking component 70 are located within the recessed structure to ensure the fixed connection between the wafer cassette a and the carrier component 31, while simultaneously allowing the cassette a3 to overlap the surface of the movable member 311. The height of the movable part 311 protruding from the surface of the fixed part 312 can be set according to the height of the locking part 32 and the unlocking component 70 protruding from the surface of the fixed part 312. This application embodiment does not make specific limitations.

[0102] In an optional embodiment, the second lifting structure 80 further includes a guide 83 and a moving member 84. The guide 83 is connected to the second lifting drive 81, and the moving member 84 is adapted to the guide 83 and connected to the lifting bracket 82. The guide 83 moves back and forth under the action of the second lifting drive 81, so that the motion sensor moves back and forth under the action of the guide 83.

[0103] In this embodiment, the movable component 84 achieves lifting and lowering motion under the action of the guide component 83. The moving speed and lifting height of the movable component 84 can be achieved by configuring the guide component 83, and can be configured according to actual needs. This embodiment does not impose specific limitations on these settings.

[0104] Specifically, the guide member 83 is a guide groove 831, and the moving member 84 is a guide post 841 inserted into the guide groove 831. When the guide member 83 moves, the guide post 841 moves up and down within the guide groove 831. The insertion and engagement of the guide post 841 and the guide groove 831 adopts a simple sliding contact method, achieving low-friction movement without additional lubrication. When the guide groove 831 moves along the first direction, the guide post 841 moves up and down within the guide groove 831. This direct transmission conversion method not only simplifies the overall structure but also improves the reliability and maintenance convenience of the system.

[0105] In an optional embodiment, the guide member 83 moves along a first direction (i.e., the X-axis direction in the coordinate system shown in FIG11) under the action of the second lifting drive 81, and the lifting bracket 82 follows the moving member 84 to move along a second direction (i.e., the Z-axis direction in the coordinate system shown in FIG11). The second direction is the height direction of the frame 10, and the first direction is perpendicular to the second direction.

[0106] In this embodiment, the guide member 83 is driven to move along the first direction by the second lifting drive 81, which optimizes the spatial layout and greatly reduces the valuable space occupied in the height direction (i.e., the second direction) of the frame 10. By utilizing the transmission cooperation between the moving member 84 and the guide member 83, the motion accuracy of the guide member 83 is transmitted to the lifting bracket 82 and the movable member 311. While ensuring the lifting of the movable member 311, the second lifting structure 80 avoids occupying too much space in the second direction, thus solving the problem of limited space in the height direction of the frame 10.

[0107] In an alternative embodiment, the flip structure 30 rotates 90 degrees from the first state to the second state.

[0108] This embodiment of the application sets a preset angle of 90°, enabling the flipping structure 30 to precisely rotate the wafer cassette a from its initial horizontal position to a vertical position. During this process, the supporting component 31 drives the wafer cassette a to rotate from a first state to a second state, wherein the mushroom head a1 smoothly transitions from a horizontal orientation to a vertical orientation towards the interior of the frame 10. Since the 90° rotation angle matches the geometric layout of the wafer cassette a and the equipment space constraints, the mushroom head a1 can be directly and completely aligned with the transport port 11 after rotation. This angle selection not only simplifies the rotation control logic but also optimizes the utilization of the internal space of the equipment, providing a fundamental guarantee for the robot arm 90 to grasp the mushroom head a1 using the shortest straight path. Simultaneously, this angle setting forms an adaptive relationship with components such as the rotation drive component 20 and the flipping structure 30, jointly ensuring the stability and positioning accuracy of the wafer cassette a during rotation, thereby effectively shortening the loading cycle and improving operational efficiency.

[0109] This application embodiment also provides a feeding method for a wafer cassette feeding device, please refer to Figure 12, including the following steps:

[0110] S1. Obtain the current position status of the wafer cassette.

[0111] S2. Confirm whether the current position of the wafer cassette is that the wafer cassette is connected to the carrier component, and the current position is that the mushroom head of the wafer cassette is located on its upper surface.

[0112] S3. If so, use the rotation drive component to drive the carrier to rotate by a preset angle so that the mushroom head of the wafer box faces the inside of the frame and is opposite to the position of the transport port.

[0113] This application embodiment optimizes the wafer cassette orientation adjustment process by combining the rotation drive component and the flipping structure in a specific manner. This allows the wafer cassette's mushroom-shaped head to directly face the inside of the frame and be aligned with the transport port, significantly shortening the movement path of the robotic arm when grasping the wafer cassette's mushroom-shaped head. This design not only reduces the equipment's footprint but also effectively lowers equipment costs and improves processing efficiency.

[0114] In an optional embodiment, the step S3 is followed by the step:

[0115] The wafer cassette body and cover are unlocked using the unlocking components.

[0116] The box is lifted using a second lifting structure to separate it from the lid.

[0117] The detection components are used to inspect the gap between the box and the lid to confirm whether there are any foreign objects on the lid.

[0118] This application embodiment achieves a complete functional flow through the orderly coordination of several key steps. First, the unlocking component unlocks the wafer cassette's housing and cover. This process requires ensuring a smooth and precise unlocking action to avoid damage to the wafer cassette structure. Subsequently, the second lifting structure begins operation, precisely controlling the lifting stroke to create a suitable gap between the housing and cover. This gap must meet the detection requirements while preventing excessive separation that could affect the integrity of the wafer cassette. Finally, the detection component performs non-contact scanning detection on the cover surface through the formed gap to determine whether a wafer or wafer fragments are present inside the wafer cassette.

[0119] This embodiment of the application, through the close integration of three steps—unlocking, lifting, and detection—can confirm the presence of foreign objects inside the wafer cassette, thus providing a safety guarantee for subsequent cleaning and drying of the wafer cassette. Simultaneously, these steps are organically combined with the aforementioned carrier rotation scheme, optimizing the overall process flow while ensuring detection effectiveness, and significantly improving the working efficiency and reliability of the wafer cassette processing equipment.

[0120] In an optional embodiment, after detecting the gap between the box and the cover using the detection components, the following steps are further included:

[0121] The box and lid are locked together using the unlocking mechanism.

[0122] Once the presence of foreign objects is confirmed, the wafer cassette will be unloaded.

[0123] Once it is confirmed that there are no foreign objects, a robotic arm is used to grab the mushroom-shaped head on the wafer cassette and move it into the frame.

[0124] In practical applications, the unlocking component receives command signals from the control system to complete the locking action, ensuring a tight connection between the housing and the cover. Unloading refers to the process of removing defective wafer cassettes from the processing flow, which can be achieved by setting up a dedicated unloading channel or using the existing loading channel for reverse transport. A robotic arm is an automated operating device with multi-degree-of-freedom motion capabilities, which can be implemented using articulated robotic arms or multi-axis linkage robotic arms, among other structural forms.

[0125] In this embodiment, after the detection component completes the gap detection, the system automatically triggers the corresponding processing flow based on the detection result: when a foreign object is detected, the unlocking component first locks the box and the cover, and then starts the unloading program to remove the defective wafer box from the processing flow in a timely manner; when no foreign object is detected, the unlocking component also locks the box and the cover, keeping the wafer box in a completely sealed state. At this time, the robot can directly grab the mushroom head located inside the frame for transfer. This processing mechanism makes full use of the preset state of the flipping structure so that the mushroom head faces the inside of the frame, avoiding additional rotation or long-distance movement of the robot and significantly shortening the movement path.

[0126] It should be understood that the above embodiments are exemplary and are not intended to encompass all possible implementations. Various modifications and changes can be made to the above embodiments without departing from the scope of this disclosure. Similarly, the various technical features of the above embodiments can be arbitrarily combined to form other embodiments of this application that may not be explicitly described. Therefore, the above embodiments only illustrate several implementations of this application and do not limit the scope of protection of this patent application.

Claims

1. A feeding device for a wafer cassette, characterized in that, The feeding device includes: a frame (10) with a transport port (11); a rotation drive assembly (20) connected to the frame (10) near the transport port (11); and a flip structure (30) rotatably connected to the rotation drive assembly (20) and located at the transport port (11). The flip structure (30) includes a support assembly (31) and a locking member (32). The locking member (32) is connected to the support assembly (31) and is used to lock the wafer cassette (a) to the support assembly (31). The flip structure (30) rotates together with the wafer cassette (a) under the driving action of the rotation drive assembly (20). When the flip structure... (30) In the first state, the carrier component (31) is adapted to the transport port (11) and forms a closed space with the frame (10). The wafer box (a) is fixed on the carrier component (31) with the mushroom head (a1) facing upward by the locking member (32). When the flip structure (30) is in the second state, the transport port (11) is opened. The wafer box (a) is fixed on the carrier component (31) with the mushroom head (a1) facing the inside of the feeding device by the locking member. The wafer box (a) is located inside the transport port (11). The second state is the state after the flip structure (30) rotates from the first state by a preset angle.

2. The feeding device for a wafer cassette according to claim 1, characterized in that, When the flip structure (30) is in the second state, at least part of the structure of the support component (31) is located outside the frame (10).

3. The feeding device for a wafer cassette according to claim 1, characterized in that, The rotation drive assembly (20) includes: a drive member (21); a slide rail (22), both of which are connected to the frame (10); a slider (23), which is slidably connected to the slide rail (22), and the slider (23) reciprocates along the direction of the slide rail (22) under the driving action of the drive member (21), and the slider (23) is rotatably connected to the bearing assembly (31), and the slider (23) moves along the direction of the slide rail (22) to drive the bearing assembly (31) to rotate; and a connecting rod (24), one end of which is rotatably connected to the frame (10), and the other end of which is rotatably connected to the bearing assembly (31).

4. The wafer cassette loading device according to claim 3, characterized in that, The slider (23) is connected to the side end of the support assembly (31) near the mushroom head (a1) so that the support assembly (31) is rotated toward the inside of the frame (10) under the driving action of the drive member (21).

5. The feeding device for a wafer cassette according to claim 1, characterized in that, The feeding device further includes a first lifting structure, which includes: a first lifting drive connected to the frame (10); and a lifting component (51) connected to the first lifting drive and located at the transport port (11). The lifting component (51) moves up and down under the action of the first lifting drive to avoid the rotating wafer cassette (a) or to close the transport port (11) with the carrier component (31).

6. The feeding device for a wafer cassette according to claim 1, characterized in that, The wafer cassette (a) includes a detachably connected cover (a2) and a cassette (a3); the loading device further includes: a housing (60) connected to the side of the support assembly (31) away from the wafer cassette (a); an unlocking assembly (70) connected to the support assembly (31) for unlocking or locking the cassette (a3) ​​and the cover (a2); a second lifting structure (80) connected to the housing (60) for driving the cassette (a3) ​​to move when the flipping structure is in the second state, so as to detach it from the cover (a2); and a detection assembly for detecting whether there are foreign objects on the cover (a2) through the gap between the cassette (a3) ​​and the cover (a2).

7. The wafer cassette loading device according to claim 6, characterized in that, The supporting component (31) includes a movable part (311) and a fixed part (312). The movable part (311) and the fixed part (312) are detachably connected. The movable part (311) is positioned corresponding to the box body (a3). The second lifting structure (80) includes: a second lifting drive (81), connected to the housing (60); The lifting bracket (82) is movably connected to the second lifting drive (81) and connected to the movable part (311). The movable part (311) and the lifting bracket (82) move relative to the fixed part (312) under the action of the second lifting drive (81) to separate the box body (a3) ​​from the cover body (a2).

8. The feeding device for a wafer cassette according to claim 7, characterized in that, The second lifting structure (80) further includes: a guide (83) connected to the second lifting drive (81); and a moving part (84) adapted to the guide (83) and connected to the lifting bracket (82). The guide (83) moves back and forth under the action of the second lifting drive (81), so that the moving part (84) moves back and forth under the action of the guide (83).

9. The feeding device for a wafer cassette according to claim 8, characterized in that, The guide member (83) moves along the first direction under the action of the second lifting drive (81), and the lifting bracket (82) moves along the second direction following the moving member (84). The second direction is the height direction of the frame (10), and the first direction is perpendicular to the second direction.

10. A loading method for a wafer cassette loading apparatus as described in any one of claims 1 to 9, characterized in that, The feeding method includes: obtaining the current position status of the wafer box; confirming whether the current position status of the wafer box (a) is that the wafer box (a) is connected to the carrier component (31), and the current position status is that the mushroom head (a1) of the wafer box (a) is located on its upper surface; if so, using the rotation drive component (20) to drive the carrier component (31) to rotate by a preset angle so that the mushroom head (a1) of the wafer box (a) faces the inside of the frame (10) and is opposite to the position of the transport port (11).

Images