Novel silicon wafer laser cutting and conveying device
By preheating and cooling the wafers, combined with a support mechanism, the problem of wafer expansion caused by temperature differences during the dicing process was solved, thus improving dicing quality and precision.
Patent Information
- Application Number
- CN202511564801.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-30
- Publication Date
- 2026-01-23
AI Technical Summary
Existing wafer laser cutting and conveying devices suffer from wafer thermal expansion and contraction due to temperature differences during the cutting process, which affects the cutting quality.
Gas is discharged into the protective chamber through the first one-way valve inside the gas supply pipe to preheat the wafer, bringing its temperature close to that of the laser cutting station. The heat generated during cutting is conducted by inert gas for cooling, and the wafer is supported by the repulsive force between magnetic blocks and magnetic pillars and by a detection mechanism to prevent the wafer from expanding due to temperature differences during cutting.
It effectively avoids wafer expansion caused by temperature differences during the dicing process, improves dicing quality, and ensures dicing accuracy and reliability through inert gas protection and support mechanisms.
Smart Images
Figure CN121373871A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to a wafer conveying technology field, in particular to a novel silicon wafer laser cutting conveying device. BACKGROUND
[0002] A wafer is prepared by purifying, dissolving and distilling silicon dioxide into a silicon crystal rod, and then grinding, polishing and slicing the silicon crystal rod into a wafer by a wafer factory. The wafer can be used to process various circuit element structures and become an IC product with specific electrical properties. The wafer processing needs to divide the whole wafer into single chips according to the chip size. The current wafer laser cutting conveying device directly places the wafer on the cutting seat. Since the laser cutting generates a certain amount of residual heat, the temperature of the cutting table is relatively high. When the wafer is placed on the cutting seat, the wafer expands and shrinks due to the temperature difference, so that the volume of the wafer changes, thereby affecting the cutting quality of the wafer. SUMMARY
[0003] The novel silicon wafer laser cutting conveying device of the application utilizes the movement of the second movable disc to discharge the gas in the gas feeding pipe to the inside of the protection box through the first one-way valve in the gas feeding pipe, preheats the wafer, and makes the temperature of the wafer close to the temperature of the laser cutting seat, so that the wafer is not affected by the laser cutting quality due to the too large temperature difference when the wafer is transported to the laser cutting seat for cutting.
[0004] To achieve the above-mentioned purpose, the application provides the following technical scheme: a novel silicon wafer laser cutting conveying device, comprising a base, wherein the base is provided with a protection mechanism; The protection mechanism comprises a sliding adsorption plate sliding on the base, one side of the sliding adsorption plate is connected with a fixed plate, the base is fixed with a protection box, a reciprocating screw rod is rotatably arranged in the protection box, a second movable disc is movably arranged on one side of the reciprocating screw rod, an air suction cylinder is arranged outside the second movable disc, one end of the air suction cylinder is communicated with the protection box, and a cooling mechanism is further connected with one end of the air suction cylinder. The cooling mechanism comprises a gas inlet pipe communicated with the air suction cylinder, a gas storage cylinder is arranged in the base, a laser cutting seat is arranged on the base, a circulating pipe is arranged outside the laser cutting seat, one end of the gas inlet pipe is communicated with the gas storage cylinder through the circulating pipe, and a detection mechanism is further arranged on the base. The detection mechanism comprises a gas feeding box arranged on one side of the base, one side of the gas feeding box is communicated with a control pipe, a magnetic column is movably arranged in the control pipe, a pressing column is movably arranged in the control pipe, a magnetic block is arranged on the sliding adsorption plate, and the magnetic block and the magnetic column are repulsive to each other.
[0005] Preferably, the base is provided with a wafer storage disk, a protective rail is provided on one side of the base, an electric slide rail is fixed on the base, a slider is movable inside the electric slide rail, the slider is connected to a sliding adsorption plate through an electric push rod, a vacuum suction cup is provided at the bottom of the sliding adsorption plate, and a toothed rack is provided on one side of the fixed plate.
[0006] Preferably, one end of the reciprocating lead screw passes through the protective railing, the bottom of the reciprocating lead screw is connected to a movable column, the bottom of the movable column is connected to a gear, and the gear meshes with the rack.
[0007] Preferably, a first movable disc is mounted on the reciprocating lead screw, and the reciprocating lead screw is connected to the first movable disc via a ball nut pair. One side of the first movable disc is connected to a second movable disc.
[0008] Preferably, one side of the suction cylinder is connected to an air supply pipe, which is connected to a protective box. A first one-way valve is installed inside the air supply pipe. Another side of the suction cylinder is connected to an air inlet pipe, which is installed inside a second one-way valve.
[0009] Preferably, a first connecting pipe is connected to one side of the air supply box, a second connecting pipe is connected to one side of the first connecting pipe, a third connecting pipe is connected to one side of the second connecting pipe, a distribution pipe is connected to one side of the third connecting pipe, and multiple sets of nozzles are provided on the distribution pipe.
[0010] Preferably, one side of the second connecting pipe is connected to the control pipe, the control pipe is provided with a first exhaust pipe, the control pipe is provided with a first spring, one end of the first spring is connected to a magnetic column, the other end of the first spring is connected to the inner wall of the control pipe, and a protective pipe is provided on one side of the control pipe.
[0011] Preferably, a third exhaust pipe is provided inside the magnetic column, one side of which is connected to the protective pipe. A second exhaust pipe is also provided inside the magnetic column, which vertically penetrates the magnetic column.
[0012] Preferably, a fixing sleeve is also provided inside the control tube, a second spring is connected to one side of the fixing sleeve, and the second spring is connected to the extrusion column on one side. A detection column is provided inside the protection box.
[0013] Compared with the prior art, the beneficial effects of the present invention are: 1. When the second movable plate moves, the invention utilizes the first one-way valve inside the air supply pipe to discharge gas into the protective box, preheating the wafer and making the temperature of the wafer close to that of the laser cutting stand. This avoids the wafer from undergoing slight expansion due to excessive temperature difference when it is transported to the laser cutting stand for cutting, which would affect the quality of laser cutting of the wafer.
[0014] 2. This invention conducts heat from the laser cutting base to the inert gas inside the circulation pipe. The second movable disk moves to extract gas from the gas storage cylinder, thereby conducting heat generated by cutting on the laser cutting base. The inert gas inside the gas storage cylinder is transported inside the circulation pipe to cool the high temperature generated by laser cutting on the laser cutting base, thus avoiding the effects of prolonged high temperature on the laser cutting base.
[0015] 3. This invention utilizes the repulsive force generated when the magnetic block and magnetic column approach each other, causing the second exhaust pipe to connect with the first exhaust pipe. The gas in the gas supply box enters the first exhaust pipe through the first and second connecting pipes, and then enters the lower end of the fixed sleeve through the second exhaust pipe. At the same time, as the gas increases, the gas pressure pushes the extrusion column to move slowly. The two sets of extrusion columns move synchronously, working with the detection column to support the middle of the wafer. Simultaneously, the hot gas ejected from the gas supply pipe, under preheated conditions, performs a bending resistance test on the wafer, avoiding the difficulty in detecting wafer defects at room temperature, which could affect the dicing process. Attached Figure Description
[0016] Figure 1 This is one of the overall structural schematic diagrams of the present invention; Figure 2 This is a second schematic diagram of the overall structure of the present invention; Figure 3 This is a schematic diagram of the protective mechanism of the present invention; Figure 4 For the present invention Figure 3 Enlarged view of section A in the middle; Figure 5 This is a schematic diagram of a portion of the cooling mechanism of the present invention; Figure 6 This is a partial structural diagram of the detection mechanism of the present invention; Figure 7 For the present invention Figure 6 Enlarged view of section B.
[0017] In the diagram: 1. Base; 11. Wafer storage disk; 12. Laser cutting stand; 13. Protective rail; 2. Protective mechanism; 21. Electric slide rail; 22. Sliding suction plate; 23. Fixing plate; 24. Slider; 25. Rack; 26. Protective box; 27. Gear; 28. Movable column; 29. Reciprocating lead screw; 210. First movable disk; 211. Suction cylinder; 212. Second movable disk; 213. Air supply pipe; 214. Magnetic block; 3. Cooling mechanism; 31. 32. Intake pipe; 33. Circulation pipe; 4. Air storage tank; 5. Detection mechanism; 6. Air supply box; 7. First connecting pipe; 8. Second connecting pipe; 9. Third connecting pipe; 10. Distribution pipe; 11. Control pipe; 12. First exhaust pipe; 13. Magnetic column; 14. Second exhaust pipe; 15. Third exhaust pipe; 16. Protective pipe; 17. First spring; 28. Compression column; 19. Second spring; 20. Fixing sleeve; 10. Detection column. Detailed Implementation
[0018] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0019] Figures 1 to 7 As shown, the present invention provides a novel silicon wafer laser cutting and conveying device, including a base 1, on which a protective mechanism 2 is provided; The protection mechanism 2 includes a sliding adsorption plate 22 that slides on the base 1. A fixed plate 23 is connected to one side of the sliding adsorption plate 22. A protection box 26 is fixed on the base 1. A reciprocating screw 29 rotates inside the protection box 26. A second movable plate 212 moves on one side of the reciprocating screw 29. An air suction cylinder 211 is sleeved on the outside of the second movable plate 212. One end of the air suction cylinder 211 is connected to the protection box 26. The other end of the air suction cylinder 211 is also connected to a cooling mechanism 3. The cooling mechanism 3 includes an air inlet pipe 31 connected to the air intake 211, an air storage cylinder 33 is provided inside the base 1, a laser cutting seat 12 is provided on the base 1, a circulation pipe 32 is provided on the outside of the laser cutting seat 12, one end of the air inlet pipe 31 is connected to the air storage cylinder 33 through the circulation pipe 32, and a detection mechanism 4 is also provided on the base 1. The testing mechanism 4 includes an air supply box 41 disposed on one side of the base 1. A control tube 46 is connected to one side of the air supply box 41. A magnetic column 48 moves inside the control tube 46. A squeezing column 413 also moves inside the control tube 46. A magnetic block 214 is disposed on the sliding adsorption plate 22. The magnetic block 214 and the magnetic column 48 repel each other.
[0020] When transporting the wafer, the slider 24 moves inside the electric slide rail 21, which drives the sliding suction plate 22 to move. The movement of the sliding suction plate 22 drives the vacuum suction cup at the bottom of the sliding suction plate 22 to move. At the same time, the sliding suction plate 22 moves down through the electric push rod, thereby driving the vacuum suction cup to grab the wafer on the wafer storage disk 11. After grabbing, the slider 24 moves inside the electric slide rail 21, thereby driving the wafer to move.
[0021] When the sliding adsorption plate 22 moves, it drives the fixed plate 23 to move. The movement of the fixed plate 23 drives the rack 25 to move. When the rack 25 moves into the protective box 26, it meshes with the gear 27. The movement of the rack 25 drives the gear 27 to rotate. The rotation of the gear 27 drives the reciprocating screw 29 to rotate through the movable column 28. The rotation of the reciprocating screw 29 drives the first movable disc 210 to move through the ball nut pair. The first movable disc 210 moves back and forth along the thread on the reciprocating screw 29, while simultaneously driving the second movable disc 212 to move back and forth inside the air intake cylinder 211. When the second movable disc 212 moves back and forth inside the air intake cylinder 211, it passes through the air intake pipe 31 and the air intake pipe... The second one-way valve inside 31 extracts the gas from the gas storage cylinder 33. The gas inside the gas storage cylinder 33 enters the air inlet pipe 31 through the circulation pipe 32. At the same time, it conducts the heat generated during the laser cutting of the wafer. The heat on the laser cutting stand 12 is conducted to the inert gas inside the circulation pipe 32. The second movable disk 212 moves to extract the gas from the gas storage cylinder 33, thereby conducting the heat generated by the cutting on the laser cutting stand 12. The inert gas inside the gas storage cylinder 33 is transported in the circulation pipe 32 to cool the high temperature generated by the laser cutting stand 12, avoiding the effects of prolonged high temperature on the laser cutting stand 12.
[0022] Simultaneously, the extracted gas enters the suction cylinder 211. When the second movable plate 212 moves, the gas is discharged into the protective box 26 through the first one-way valve inside the air supply pipe 213, preheating the wafer and making the temperature of the wafer close to that of the laser cutting stand 12. This avoids the wafer from undergoing slight expansion due to excessive temperature difference when it is transported to the laser cutting stand 12 for cutting, thus affecting the quality of laser cutting of the wafer.
[0023] Meanwhile, during wafer transport, the inert gas in the gas supply box 41 continuously enters the distribution pipe 45 through the first connecting pipe 42 for discharge, continuously protecting the wafer surface with inert gas. At the same time, when the sliding adsorption plate 22 moves to the middle of the protective box 26, the magnetic block 214 approaches the magnetic column 48, thereby generating a repulsive force. The magnetic column 48 squeezes the first spring 412 and moves inside the control pipe 46, simultaneously connecting the second exhaust pipe 49 with the first exhaust pipe 47. The gas in the gas supply box 41 enters the first exhaust pipe 47 through the first connecting pipe 42 and the second connecting pipe 43, and enters the lower end of the fixed sleeve 415 through the second exhaust pipe 49. At the same time, when the gas increases, it pushes the extrusion column 413 to move slowly. The two sets of extrusion columns 413 move synchronously, using the detection column 416 to support the middle of the wafer. Simultaneously, with the hot gas sprayed from the gas supply pipe 213, the wafer is subjected to a bending resistance test under preheating conditions, avoiding the difficulty in detecting wafer defects at room temperature, which could affect the dicing process.
[0024] Simultaneously, after the test is completed, the sliding adsorption plate 22 continues to move inside the electric slide rail 21 via the slider 24, transporting the tested wafer to the laser cutting seat 12 for laser cutting. At the same time, the magnetic block 214 moves to the first spring 412 to squeeze the magnetic column 48 to reset. Meanwhile, the third exhaust pipe 410 is connected to the lower end of the fixed sleeve 415, and the gas at the lower end of the fixed sleeve 415 is discharged through the third exhaust pipe 410 and the protective pipe 411, thereby resetting the squeezing column 413 for the next test.
[0025] In an optional embodiment, a wafer storage disk 11 is provided on the base 1, and a protective rail 13 is also provided on one side of the base 1. An electric slide rail 21 is fixed on the base 1, and a slider 24 is movable inside the electric slide rail 21. The slider 24 is connected to the sliding adsorption plate 22 through an electric push rod. A vacuum suction cup is provided at the bottom of the sliding adsorption plate 22, and a rack 25 is provided on one side of the fixed plate 23.
[0026] It should be noted that when the slider 24 moves inside the electric slide rail 21, it drives the sliding adsorption plate 22 to move. The movement of the sliding adsorption plate 22 drives the vacuum suction cup at the bottom of the sliding adsorption plate 22 to move. At the same time, the sliding adsorption plate 22 moves down through the electric push rod, thereby driving the vacuum suction cup to grab the wafer on the wafer storage disk 11. When the sliding adsorption plate 22 moves, it drives the fixing plate 23 to move. The movement of the fixing plate 23 drives the rack 25 to move.
[0027] In an optional embodiment, one end of the reciprocating lead screw 29 passes through the protective railing 13, and a movable column 28 is connected to the bottom of the reciprocating lead screw 29. A gear 27 is connected to the bottom of the movable column 28, and the gear 27 meshes with the rack 25.
[0028] It should be noted that when the rack 25 moves into the protective box 26, the rack 25 meshes with the gear 27. The movement of the rack 25 drives the gear 27 to rotate, and the rotation of the gear 27 drives the reciprocating screw 29 to rotate through the movable column 28.
[0029] In an optional embodiment, a first movable disk 210 is movably mounted on the reciprocating screw 29, and the reciprocating screw 29 and the first movable disk 210 are connected by a ball nut pair, and one side of the first movable disk 210 is connected to a second movable disk 212.
[0030] It should be noted that the rotation of the reciprocating screw 29 drives the first movable disc 210 to move through the ball nut pair. The first movable disc 210 moves back and forth along the thread on the reciprocating screw 29, while simultaneously driving the second movable disc 212 to move back and forth inside the suction cylinder 211.
[0031] In an optional embodiment, an air supply pipe 213 is connected to one side of the air intake 211, and the air supply pipe 213 is connected to the protective box 26. A first one-way valve is provided inside the air supply pipe 213. An air inlet pipe 31 is also connected to one side of the air intake 211, and a second one-way valve is provided inside the air inlet pipe 31.
[0032] It should be noted that when the second movable disk 212 reciprocates inside the suction cylinder 211, it draws out the gas inside the gas storage cylinder 33 through the air inlet pipe 31 and the second one-way valve inside the air inlet pipe 31. The second movable disk 212 moves to draw out the gas inside the gas storage cylinder 33, thereby conducting the heat generated by cutting on the laser cutting seat 12. When the second movable disk 212 moves, it discharges the gas through the first one-way valve inside the air delivery pipe 213 into the protective box 26 to preheat the wafer.
[0033] In an optional embodiment, a first connecting pipe 42 is connected to one side of the air supply box 41, a second connecting pipe 43 is connected to one side of the first connecting pipe 42, a third connecting pipe 44 is connected to one side of the second connecting pipe 43, and a distribution pipe 45 is connected to one side of the third connecting pipe 44. Multiple sets of nozzles are provided on the distribution pipe 45.
[0034] It should be noted that during the wafer transportation process, the inert gas in the gas supply box 41 continuously enters the distribution pipe 45 through the first connecting pipe 42 for discharge, continuously protecting the surface of the wafer with inert gas.
[0035] In an optional embodiment, one side of the second connecting pipe 43 is connected to the control pipe 46, the control pipe 46 is provided with a first exhaust pipe 47, the control pipe 46 is provided with a first spring 412, one end of the first spring 412 is connected to the magnetic post 48, the other end of the first spring 412 is connected to the inner wall of the control pipe 46, and a protective pipe 411 is provided on one side of the control pipe 46.
[0036] It should be noted that when the sliding adsorption plate 22 moves to the middle of the protective box 26, the magnetic block 214 approaches the magnetic column 48, thereby generating a repulsive force. The magnetic column 48 squeezes the first spring 412 and moves inside the control tube 46.
[0037] In an optional embodiment, a third exhaust pipe 410 is provided inside the magnetic column 48, one side of which is connected to the protective pipe 411. A second exhaust pipe 49 is also provided inside the magnetic column 48, and the second exhaust pipe 49 penetrates the magnetic column 48 vertically.
[0038] It should be noted that the gas in the gas supply box 41 enters the interior of the first exhaust pipe 47 through the first connecting pipe 42 and the second connecting pipe 43, and enters the lower end of the fixed sleeve 415 through the second exhaust pipe 49.
[0039] In an optional embodiment, a fixing sleeve 415 is also provided inside the control tube 46, a second spring 414 is connected to one side of the fixing sleeve 415, and the second spring 414 is connected to the extrusion column 413 on one side. A detection column 416 is provided inside the protection box 26.
[0040] It should be noted that the gas in the gas supply box 41 enters the lower end of the fixing sleeve 415 inside the control tube 46. As the gas gradually increases, the gas pressure is greater than the elastic force of the second spring 414, thereby pushing the extrusion column 413 to move slowly. The two sets of extrusion columns 413 move synchronously, and the detection column 416 supports the middle part of the wafer to perform a bending resistance test on the wafer.
[0041] Working principle: When transporting wafers, the slider 24 moves inside the electric slide rail 21, which drives the sliding suction plate 22 to move. The movement of the sliding suction plate 22 drives the vacuum suction cup at the bottom of the sliding suction plate 22 to move. At the same time, the sliding suction plate 22 moves down through the electric push rod, thereby driving the vacuum suction cup to grab the wafer on the wafer storage disk 11. After grabbing, the slider 24 moves inside the electric slide rail 21, thereby driving the wafer to move.
[0042] When the sliding adsorption plate 22 moves, it drives the fixed plate 23 to move. The movement of the fixed plate 23 drives the rack 25 to move. When the rack 25 moves into the protective box 26, it meshes with the gear 27. The movement of the rack 25 drives the gear 27 to rotate. The rotation of the gear 27 drives the reciprocating screw 29 to rotate through the movable column 28. The rotation of the reciprocating screw 29 drives the first movable disc 210 to move through the ball nut pair. The first movable disc 210 moves back and forth along the thread on the reciprocating screw 29, while simultaneously driving the second movable disc 212 to move back and forth inside the suction cylinder 211. As the second movable disk 212 reciprocates inside the suction cylinder 211, it draws out the gas inside the gas storage cylinder 33 through the air inlet pipe 31 and the second one-way valve inside the air inlet pipe 31. The gas inside the gas storage cylinder 33 enters the air inlet pipe 31 through the circulation pipe 32, and at the same time conducts the heat generated during the laser cutting of the wafer. The heat on the laser cutting base 12 is conducted to the inert gas inside the circulation pipe 32. The second movable disk 212 moves to draw out the gas inside the gas storage cylinder 33, thereby conducting the heat generated by the cutting on the laser cutting base 12.
[0043] Simultaneously, the extracted gas enters the suction cylinder 211. When the second movable plate 212 moves, the gas is discharged into the protective box 26 through the first one-way valve inside the gas supply pipe 213, preheating the wafer so that the temperature of the wafer is close to the temperature of the laser cutting stand 12.
[0044] Meanwhile, during wafer transport, the inert gas in the gas supply box 41 continuously enters the distribution pipe 45 through the first connecting pipe 42 for discharge, continuously protecting the wafer surface with inert gas. At the same time, when the sliding adsorption plate 22 moves to the middle of the protective box 26, the magnetic block 214 approaches the magnetic column 48, thereby generating a repulsive force. The magnetic column 48 squeezes the first spring 412 and moves inside the control pipe 46, while simultaneously connecting the second exhaust pipe 49 with the first exhaust pipe 47. The gas in the gas supply box 41 enters the first exhaust pipe 47 through the first connecting pipe 42 and the second connecting pipe 43, and enters the lower end of the fixed sleeve 415 through the second exhaust pipe 49. At the same time, when the gas increases, it pushes the extrusion column 413 to move slowly. The two sets of extrusion columns 413 move synchronously, using the detection column 416 to support the middle of the wafer. Simultaneously, with the hot gas ejected from the gas supply pipe 213, the wafer is subjected to a bending resistance test under preheating conditions.
[0045] Simultaneously, after the test is completed, the sliding adsorption plate 22 continues to move inside the electric slide rail 21 via the slider 24, transporting the tested wafer to the laser cutting seat 12 for laser cutting. At the same time, the magnetic block 214 moves to the first spring 412 to squeeze the magnetic column 48 to reset. Meanwhile, the third exhaust pipe 410 is connected to the lower end of the fixed sleeve 415, and the gas at the lower end of the fixed sleeve 415 is discharged through the third exhaust pipe 410 and the protective pipe 411, thereby resetting the squeezing column 413.
[0046] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A novel silicon wafer laser cutting and conveying device, comprising a base (1), characterized in that, The base (1) is provided with a protective mechanism (2); The protective mechanism (2) includes a sliding adsorption plate (22) that slides on the base (1). A fixed plate (23) is connected to one side of the sliding adsorption plate (22). A protective box (26) is fixed on the base (1). A reciprocating screw (29) rotates inside the protective box (26). A second movable disc (212) moves on one side of the reciprocating screw (29). An air suction cylinder (211) is sleeved on the outside of the second movable disc (212). One end of the air suction cylinder (211) is connected to the protective box (26). A cooling mechanism (3) is also connected to one end of the air suction cylinder (211). The cooling mechanism (3) includes an air inlet pipe (31) connected to the air intake cylinder (211), an air storage cylinder (33) is provided inside the base (1), a laser cutting seat (12) is provided on the base (1), a circulation pipe (32) is provided on the outside of the laser cutting seat (12), one end of the air inlet pipe (31) is connected to the air storage cylinder (33) through the circulation pipe (32), and a detection mechanism (4) is also provided on the base (1). The detection mechanism (4) includes an air supply box (41) disposed on one side of the base (1), a control tube (46) connected to one side of the air supply box (41), a magnetic column (48) moving inside the control tube (46), a squeezing column (413) moving inside the control tube (46), and a magnetic block (214) disposed on the sliding adsorption plate (22), the magnetic block (214) and the magnetic column (48) repelling each other.
2. The novel silicon wafer laser cutting and conveying device according to claim 1, characterized in that, The base (1) is provided with a wafer storage disk (11), and a protective rail (13) is also provided on one side of the base (1). An electric slide rail (21) is fixed on the base (1). A slider (24) moves inside the electric slide rail (21). The slider (24) is connected to the sliding adsorption plate (22) through an electric push rod. A vacuum suction cup is provided at the bottom of the sliding adsorption plate (22). A rack (25) is provided on one side of the fixed plate (23).
3. The novel silicon wafer laser cutting and conveying device according to claim 1, characterized in that, One end of the reciprocating screw (29) passes through the guardrail (13), and the bottom of the reciprocating screw (29) is connected to a movable column (28). The bottom of the movable column (28) is connected to a gear (27), and the gear (27) meshes with the rack (25).
4. The novel silicon wafer laser cutting and conveying device according to claim 1, characterized in that, The reciprocating screw (29) has a first movable disc (210) that moves on it. The reciprocating screw (29) and the first movable disc (210) are connected by a ball nut pair. One side of the first movable disc (210) is connected to the second movable disc (212).
5. A novel silicon wafer laser cutting and conveying device according to claim 1, characterized in that, The suction cylinder (211) is connected to an air supply pipe (213) on one side, and the air supply pipe (213) is connected to the protective box (26). The air supply pipe (213) is equipped with a first one-way valve. The suction cylinder (211) is also connected to an air inlet pipe (31) on one side, and the air inlet pipe (31) is equipped with a second one-way valve.
6. A novel silicon wafer laser cutting and conveying device according to claim 1, characterized in that, The air supply box (41) is connected to a first connecting pipe (42) on one side, a second connecting pipe (43) is connected to one side of the first connecting pipe (42), a third connecting pipe (44) is connected to one side of the second connecting pipe (43), and a distribution pipe (45) is connected to one side of the third connecting pipe (44). Multiple sets of nozzles are provided on the distribution pipe (45).
7. A novel silicon wafer laser cutting and conveying device according to claim 6, characterized in that, The second connecting pipe (43) is connected to the control pipe (46) on one side. The control pipe (46) is provided with a first exhaust pipe (47) and a first spring (412) inside the control pipe (46). One end of the first spring (412) is connected to a magnetic column (48), and the other end of the first spring (412) is connected to the inner wall of the control pipe (46). A protective pipe (411) is provided on one side of the control pipe (46).
8. A novel silicon wafer laser cutting and conveying device according to claim 7, characterized in that, The magnetic column (48) is provided with a third exhaust pipe (410) inside, and one side of the third exhaust pipe (410) is connected to the protective pipe (411). The magnetic column (48) is also provided with a second exhaust pipe (49) inside, and the second exhaust pipe (49) penetrates the magnetic column (48) vertically.
9. A novel silicon wafer laser cutting and conveying device according to claim 1, characterized in that, The control tube (46) is also provided with a fixing sleeve (415), and a second spring (414) is connected to one side of the fixing sleeve (415). The second spring (414) is connected to the extrusion column (413) on one side. The protection box (26) is provided with a detection column (416).