Monocrystalline silicon wafer processing clamp

Abstract

The invention discloses a monocrystalline silicon wafer processing clamp, and relates to the technical field of monocrystalline silicon processing, and the monocrystalline silicon wafer processing clamp comprises a mounting ring sleeve, a driving gear ring, a first-stage clamp assembly, a guide piece, a second-stage clamp assembly and a driving unit. The mounting ring sleeve serves as a bearing base body, the top of the mounting ring sleeve is provided with a driving gear ring, a first-stage clamp assembly is mounted on an inner ring, the outer wall of the mounting ring sleeve is fixedly connected with a guide part, a second-stage clamp assembly is mounted in the guide part, and the mounting ring sleeve is arranged in the driving unit to link two-stage clamps. For silicon wafers with different thicknesses, a thin silicon wafer drives a driving gear ring through a driving motor I, and a silicon wafer clamping plate is pushed by an inclined push head to be clamped; and the thick silicon wafer is linked with the driving ring through the driving motor II, and is clamped by the silicon wafer holding arm after being matched with the centering holding arm for centering. The clamp integrates a graded clamping structure and a precise guiding structure, has a protective design, is high in adaptability and precise in clamping, can avoid silicon wafer damage, is adaptive to automatic processing, and improves the processing efficiency and the qualified rate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of single crystal silicon processing, in particular to a single crystal silicon wafer processing clamp. BACKGROUND

[0002] As the core substrate of the semiconductor, photovoltaic and other industries, the single crystal silicon wafer needs to be accurately positioned and stably clamped during processing to ensure the processing precision of subsequent processes such as cutting, grinding and coating.

[0003] The existing single crystal silicon wafer processing clamp is mainly divided into two types: single mechanical clamping type and vacuum adsorption type. The mechanical clamping type mainly adopts a fixed clamping structure, which can only adapt to silicon wafers of a specific thickness, has a narrow adaptation range, and improper clamping force control can easily cause the edge of the silicon wafer to crack and the surface to be scratched. Although the vacuum adsorption type can reduce mechanical damage, it has high requirements for the flatness of the silicon wafer, and the adsorption stability is insufficient for thick silicon wafers, which can easily slip and is difficult to achieve concentric centering positioning.

[0004] Therefore, the existing clamps generally have the problems of dispersed structure and uncoordinated driving. When switching between different specifications of silicon wafers, the clamps need to be replaced or a large number of parameters need to be adjusted, which is tedious and cannot meet the efficient processing needs of the automatic production line.

[0005] Therefore, the present application provides a single crystal silicon wafer processing clamp to solve one or more of the above problems. SUMMARY

[0006] (I) Technical problems to be solved In view of the deficiencies of the prior art, the present application provides a single crystal silicon wafer processing clamp to solve the problems raised in the background art.

[0007] (II) Technical solutions To achieve the above purpose, the present application is realized by the following technical solutions, including a mounting ring, the top of the mounting ring is provided with a driving gear ring, a plurality of groups of first clamp assemblies are installed around the inner circle of the driving gear ring, a plurality of groups of guide pieces are fixedly installed around the outer wall of the mounting ring, and a second clamp assembly is installed in each group of guide pieces. The driving unit installed in the mounting ring drives the second clamp assembly to clamp the single crystal silicon wafer.

[0008] Preferably, the driving motor one is installed in the mounting ring, the output shaft of the driving motor one extends out of the top housing of the mounting ring and is fixedly sleeved with a driving gear one, the driving gear one is engaged with the driving gear ring, and the inner circle wall of the driving gear ring extends in the direction of the first clamp assembly to form a bevel push head.

[0009] Preferably, the first-level clamp assembly comprises a first-level clamp base, the first-level clamp base is mounted on the top of the mounting ring through a plurality of groups of bolts, a guide groove one is formed on the top of the first-level clamp base, and two groups of avoidance grooves one are symmetrically arranged on the two sides of the guide groove one, and the bolts are mounted in the avoidance grooves one.

[0010] Preferably, the limiting rod one is fixedly arranged in the guide groove one, the guide sliding block one is movably sleeved on the outer wall of the limiting rod one, the guide sliding block one is slidably connected with the inner wall of the guide groove one, and the reset spring is sleeved on the outer wall of the limiting rod one, and the two ends of the reset spring are fixedly connected with the inner wall of the guide groove one and the guide sliding block one respectively.

[0011] Preferably, the silicon wafer clamping plate is fixedly connected with the guide sliding block one and slidably connected with the surface of the first-level clamp base, the silicon wafer clamping plate extends in the direction of the inner wall of the inner ring of the driving gear ring to form an arc-shaped protrusion, the arc-shaped protrusion abuts against the inclined pushing head, two groups of vacuum chuck bases are symmetrically arranged on the top of the silicon wafer clamping plate, and a plurality of groups of suction holes are arranged on the top of the vacuum chuck base.

[0012] Preferably, the driving unit comprises a driving motor two, the driving motor two is fixedly arranged on the bottom center of the inner wall of the mounting ring, the driving ring is movably sleeved on the outer wall of the output shaft of the driving motor two, the fixed plate one is mounted on the top center of the inner wall of the mounting ring through the fixed rod one, and the mounting ring is connected with the guide piece, and the avoidance groove two is formed on the connection position of the mounting ring and the guide piece.

[0013] Preferably, a limiting groove is formed on the guide piece, one end of the limiting rod two is fixedly connected with the inner wall of the limiting groove, the other end of the limiting rod two extends into the mounting ring and is fixedly connected with the fixed plate one, the guide sliding block two is movably arranged in the limiting groove, and the guide sliding block two is slidably sleeved on the outer wall of the limiting rod two, one end of the first connecting rod is rotatably connected with the bottom of the guide sliding block two, and the other end of the first connecting rod extends into the mounting ring through the avoidance groove two and is rotatably connected with the driving ring.

[0014] Preferably, the second-level clamp assembly comprises a support frame, the support frame is connected with the guide sliding block two through the fixed rod two, the fixed rod two is symmetrically provided with a driving shaft one and a driving shaft two on the two sides, the driving shaft one and the driving shaft two are rotatably connected with the top of the guide sliding block two, the top of the driving shaft one and the top of the driving shaft two are movably extended into the support frame, and the outer walls of the extended ends are movably sleeved with the driving gear three and the driving gear two respectively.

[0015] Preferably, the outer wall of each group of driving shaft one is movably sleeved with the same centering arm, and the end of the centering arm is movably provided with a centering roller, the outer wall of each group of driving shaft two is movably sleeved with the same silicon wafer clamping arm, two groups of avoidance grooves three are formed on the silicon wafer clamping arm, and an elastic pressing strip is arranged in the avoidance groove three close to the end of the silicon wafer clamping arm.

[0016] Preferably, the electric push rod fixed end is fixedly connected with the outer wall of the support frame, the electric push rod output end is fixedly connected with the second fixed plate, the top of the second fixed plate is fixedly provided with a U-shaped driving part, and two groups of driving racks are symmetrically and fixedly arranged at the two ends of the U-shaped head of the U-shaped driving part.

[0017] Compared with the prior art, the application has the following beneficial effects: 1. Strong adaptability, covering multiple specifications of silicon wafers: through the hierarchical design of "primary clamp assembly + secondary clamp assembly", thin (such as monocrystalline silicon wafer P1) and thick (such as monocrystalline silicon wafer P2) monocrystalline silicon wafers can be adaptively matched, solving the limitation of traditional clamps that can only clamp silicon wafers of a single thickness, and expanding the application range of the clamp.

[0018] 2. Structural integration and high stability: the driving unit is built-in and installed inside the mounting ring 1, and each clamp assembly is modularly arranged around the mounting ring 1 module, which not only reduces the occupation of external space, but also ensures the accuracy of the movement trajectory of each component during clamping through the limiting action of the guide 8 of the mounting ring 1, thereby avoiding clamping deviation caused by loose structure.

[0019] 3. Protecting the silicon wafer and reducing the risk of damage: the overall architecture provides a basis for the "anti-scratching and anti-deviation" design in subsequent embodiments 2 and 3 - the reset spring 14, the cover structure of the primary clamp assembly, the centering roller 34, the elastic pressing strip 32 and other protection components of the secondary clamp assembly, which are all assembled based on the architecture of embodiment 1, thereby avoiding problems such as scratching of the outer wall of the silicon wafer and edge cracking during clamping from the source.

[0020] 4. Convenient operation and adaptation to automatic processing: the driving unit centrally controls two types of clamp assemblies, so that clamping switching of silicon wafers of different thicknesses can be completed without replacing the clamp, and the clamp can be quickly integrated into an automatic processing production line to improve processing efficiency; at the same time, the modular design facilitates subsequent maintenance and component replacement, thereby reducing the use cost.

[0021] 5. Precise clamping to ensure processing accuracy: through the meshing transmission of the driving gear ring 2 and the primary clamp assembly and the linkage of the driving ring 21 and the secondary clamp assembly, the synchronous action of multiple clamp components is ensured, concentric centering clamping of the silicon wafer is realized, a precise positioning basis is provided for subsequent cutting, grinding and other processing procedures, and the processing qualification rate of monocrystalline silicon wafers is improved. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is a top view structure diagram of the application Figure 1 ; Figure 2 is a structure diagram of the primary clamp assembly of the application Figure 3The schematic diagram of the top structure of the application Figure 2 ; Figure 4 The schematic diagram of the driving unit part structure of the application Figure 5 The schematic diagram of the secondary clamp assembly part structure of the application Figure 1 ; Figure 6 The schematic diagram of the secondary clamp assembly part structure of the application Figure 2 ; Figure 7 The schematic diagram of the primary clamp assembly use principle of the application Figure 8 The schematic diagram of the secondary clamp assembly use principle of the application Figure 9 The schematic diagram of the crystal silicon wafer thickness grading

[0023] In the figure: 1, mounting ring; 2, driving gear ring; 3, inclined push head; 4, driving gear one; 5, driving motor one; 6, primary clamp assembly; 7, secondary clamp assembly; 8, guide; 9, primary clamp base; 10, guide groove one; 11, avoiding groove one; 12, bolt; 13, limiting rod one; 14, reset spring; 15, guide sliding block one; 16, silicon wafer clamping plate; 17, arc convex; 18, vacuum chuck base; 19, adsorption hole; 20, driving motor two; 21, driving ring; 22, limiting rod two; 23, limiting groove; 24, guide sliding block two; 25, first connecting rod; 26, avoiding groove two; 27, support frame; 28, driving shaft one; 29, driving shaft two; 30, silicon wafer arm; 31, avoiding groove three; 32, elastic pressing strip; 33, centering arm; 34, centering roller; 35, U-shaped driving part; 36, fixed plate two; 37, driving rack; 38, electric push rod; 39, driving gear two; 40, driving gear three; 41, fixed plate one; 42, fixed rod one; 43, fixed rod two; P1, single crystal silicon wafer one; P2, single crystal silicon wafer two. DETAILED DESCRIPTION

[0024] In the present application, the description such as "first", "second" and the like is only for the purpose of description, and is not intended to particularly indicate the order or sequence, nor to limit the present application, which is merely to distinguish the protective assembly or operation described by the same technical terms, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In addition, the technical solutions and technical features of each embodiment can be combined with each other, but it must be based on the realization of the ordinary skilled in the art, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor within the protection scope required by the present application.

[0025] Embodiment 1: refer to Figure 1 The application provides a technical means, which comprises a mounting ring 1, a driving gear ring 2 is arranged at the top of the mounting ring 1, a plurality of groups of first clamp assemblies 6 are arranged around the inner ring of the driving gear ring 2, a plurality of groups of guide members 8 are fixedly arranged on the outer wall of the mounting ring 1, and a second clamp assembly 7 is arranged in each group of guide members 8, and the second clamp assembly 7 is driven by a driving unit arranged in the mounting ring 1 to clamp the monocrystalline silicon wafer.

[0026] The working principle of the above scheme is that the integrated design is used to construct the overall framework of “graded clamping + unified driving”, thereby providing a structural basis for accurate clamping of monocrystalline silicon wafers with different thicknesses. The core logic is that the mounting ring 1 is used as an overall bearing matrix, the driving gear ring 2, the first clamp assembly 6, the guide member 8 and the second clamp assembly 7 are formed into a modular assembly, and the driving unit (including the core components such as the first driving motor 5 and the second driving motor 20) is arranged in the mounting ring 1, so that power is concentrated and output and coordinated control is realized.

[0027] When the monocrystalline silicon wafer needs to be clamped for processing, according to the actual thickness of the silicon wafer (referring to the thickness standard shown in Figure 9 , the first clamp assembly 6 or the second clamp assembly 7 is selected to be started, for the thin monocrystalline silicon wafer, the first clamp assembly 6 is driven by the first driving motor 5 in the driving unit to drive the driving gear ring 2, so that the clamping is completed; for the thick monocrystalline silicon wafer, the second clamp assembly 7 is driven by the second driving motor 20 in the driving unit to drive the driving ring 21, and the guide limiting action of the guide member 8 is matched, so that the centering and clamping integrated operation is completed. In the whole structure, the driving gear ring 2 provides circumferential driving power for the first clamp assembly 6, and the guide member 8 provides radial movement guide for the second clamp assembly 7, so that the two types of clamp assemblies work independently and do not interfere with each other under the control of the driving unit, and the adaptive clamping of monocrystalline silicon wafers with different specifications is realized.

[0028] The above scheme has the following beneficial effects: 1. Strong adaptability, covering multiple specifications of silicon wafers: through the graded design of “first clamp assembly + second clamp assembly”, thin (such as monocrystalline silicon wafer P1) and thick (such as monocrystalline silicon wafer P2) monocrystalline silicon wafers can be adaptively matched, thereby solving the limitation that the traditional clamp can only clamp a single thickness of silicon wafer and expanding the application range of the clamp.

[0029] 2. Structural integration, high stability: the driving unit is arranged in the mounting ring 1, and the clamp assemblies are arranged in a modular manner around the mounting ring 1, so that the external space occupation is reduced, and the movement trajectory of each component in the clamping process is accurate through the limiting action of the guide member 8 of the unified bearing of the mounting ring 1, thereby avoiding the clamping deviation caused by loose structure.

[0030] 3. Protect silicon wafers and reduce damage risk: The overall architecture provides the basis for the "anti-scratch and anti-displacement" design in subsequent embodiments 2 and 3. The reset spring 14 and cover structure of the primary clamping assembly, and the centering roller 34 and elastic pressure strip 32 of the secondary clamping assembly are all assembled based on the architecture of embodiment 1, which avoids problems such as scratches on the outer wall of the silicon wafer and edge cracks during clamping from the source.

[0031] 4. Easy to operate and adaptable to automated processing: The drive unit centrally controls two types of clamping components, which can switch between clamping silicon wafers of different thicknesses without changing the clamps. Combined with the loading and unloading process of the robotic arm, it can be quickly integrated into the automated processing production line to improve processing efficiency. At the same time, the modular design facilitates subsequent maintenance and component replacement, reducing the cost of use.

[0032] 5. Precise clamping ensures processing accuracy: Through the meshing transmission between the drive gear ring 2 and the first-level clamping assembly, and the linkage between the drive ring 21 and the second-level clamping assembly, multiple clamping components are ensured to move synchronously, achieving concentric clamping of the silicon wafer. This provides a precise positioning basis for subsequent cutting, grinding and other processing steps, improving the processing qualification rate of monocrystalline silicon wafers.

[0033] Example 2: Based on Example 1, please refer to... Figure 1 , Figure 2 , Figure 3 , Figure 7 as well as Figure 9 The primary clamping assembly 6 includes a primary clamping base 9, which is installed on the top of the mounting ring 1 by several sets of bolts 12. The top of the primary clamping base 9 is provided with a guide groove 10 and two sets of clearance grooves 11, and the two sets of clearance grooves 11 are symmetrically arranged on both sides of the guide groove 10. The bolts 12 are installed in the clearance grooves 11.

[0034] Furthermore, the limiting rod 13 is fixedly installed inside the guide groove 10, the guide slider 15 is movably sleeved on the outer wall of the limiting rod 13, and the guide slider 15 is slidably connected to the inner wall of the guide groove 10. The reset spring 14 is sleeved on the outer wall of the limiting rod 13, and both ends of the reset spring 14 are fixedly connected to the inner wall of the guide groove 10 and the guide slider 15, respectively.

[0035] Furthermore, the bottom of the silicon wafer clamp 16 is fixedly connected to the guide slider 15 and slidably connected to the surface of the primary clamp base 9. The silicon wafer clamp 16 extends towards the outer wall of the inner ring of the drive gear ring 2 to form an arc-shaped protrusion 17. The arc-shaped protrusion 17 abuts against the inclined push head 3. Two sets of vacuum suction cup bases 18 are symmetrically fixed on the top of the silicon wafer clamp 16, and the top of the vacuum suction cup base 18 is provided with several sets of adsorption holes 19.

[0036] Furthermore, the drive motor 5 is installed inside the mounting ring 1, and the output shaft of the drive motor 5 extends out of the top housing of the mounting ring 1 and is fixedly sleeved with the drive gear 4. The drive gear 4 meshes with the drive gear ring 2, and the inner ring wall of the drive gear ring 2 extends toward the first-stage clamp assembly 6 to form the inclined push head 3.

[0037] Preferably, both the guide groove 10 and the clearance groove 11 are provided with a cover at the top.

[0038] The working principle and beneficial effects of the above scheme are as follows: Due to the inconsistent thickness of monocrystalline silicon wafers, such as Figure 7 The image shows the application of thinner single-crystal silicon wafers (thickness standard reference). Figure 9 When clamping (as shown), the thinner monocrystalline silicon wafer P1 needs to be placed directly onto the annular surface formed by the tops of several sets of primary clamping bases 9 using a robotic arm. At this time, simply start the drive motor 5 to drive the drive gear 4 to rotate. The drive gear 4 drives the drive gear ring 2 to rotate. Since the inclined push head 3 set on the inner wall of the drive gear ring 2 will squeeze the arc-shaped protrusion 17, it will push the silicon wafer clamping plate 16 to move on the surface of the primary clamping base 9. At this time, the cooperation between the guide slider 15 and the limiting rod 13 plays a guiding and limiting role, preventing the silicon wafer clamping plate 16 from shifting and damaging the outer wall of the monocrystalline silicon wafer P1. Until the several sets of silicon wafer clamping plates 16 move to just abut against the outer wall of the monocrystalline silicon wafer P1, the monocrystalline silicon wafer P1 is clamped. Then, turn off the drive motor 5, and the monocrystalline silicon wafer can be operated on for the next step.

[0039] The top of both the guide groove 10 and the clearance groove 11 is equipped with a cover, and the cover is kept horizontal with the surface of the first-stage clamp base 9 after installation to avoid scratching the monocrystalline silicon wafer and to prevent the internal components from being exposed. When it is necessary to release the monocrystalline silicon wafer P1, simply start the drive motor 5 to drive the drive gear 4 to reverse, and the inclined push head 3 will no longer squeeze the arc protrusion 17. Then, under the action of the reset spring 14, the silicon wafer clamp 16 will be reset.

[0040] Example 3: Based on any one of Examples 1-2, please refer to... Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 8 as well as Figure 9 The drive unit includes a second drive motor 20, which is fixedly located at the bottom center of the inner wall of the mounting ring 1, and the drive ring 21 is fixedly sleeved on the outer wall of the output shaft of the second drive motor 20. The first fixing plate 41 is installed at the top center of the inner wall of the mounting ring 1 through the first fixing rod 42. The mounting ring 1 and the guide member 8 are provided with a relief groove 26.

[0041] Furthermore, a limiting groove 23 is provided on the guide member 8, one end of the limiting rod 22 is fixedly connected to the inner wall of the limiting groove 23, and the other end of the limiting rod 22 extends into the mounting ring 1 and is fixedly connected to the fixing plate 41. The guide slider 24 is movably disposed in the limiting groove 23, and the guide slider 24 is slidably sleeved on the outer wall of the limiting rod 22. One end of the first connecting rod 25 is rotatably connected to the bottom of the guide slider 24, and the other end of the first connecting rod 25 passes through the clearance groove 26 and extends into the mounting ring 1 to be rotatably connected to the drive ring 21.

[0042] Furthermore, the secondary clamping assembly 7 includes a support frame 27, which is connected to the guide slider 24 via a fixing rod 23. A drive shaft 1 28 and a drive shaft 29 are symmetrically arranged on both sides of the fixing rod 23. The bottoms of drive shaft 1 28 and drive shaft 29 are rotatably connected to the top of the guide slider 24. The tops of drive shaft 1 28 and drive shaft 29 extend movably into the support frame 27, and drive gear 30 and drive gear 2 39 are respectively fixedly sleeved on the outer walls of their extended ends. Furthermore, the outer walls of each set of drive shaft 1 28 are fixedly sleeved with the same centering arm 33, and a centering roller 34 is movably installed at the end of the centering arm 33. The outer walls of each set of drive shaft 2 29 are fixedly sleeved with the same silicon wafer arm 30, and two sets of clearance grooves 31 are provided on the silicon wafer arm 30. An elastic pressure strip 32 is provided in the clearance groove 31 near the end of the silicon wafer arm 30.

[0043] Furthermore, the fixed end of the electric actuator 38 is fixedly connected to the outer wall of the support frame 27, and the output end of the electric actuator 38 is fixedly connected to the second fixed plate 36. The top of the second fixed plate 36 is fixedly provided with a U-shaped drive component 35, and two sets of drive racks 37 are symmetrically fixed at both ends of the U-shaped head of the U-shaped drive component 35. Each set of drive racks 37 extends movably into the support frame 27 and meshes with the second drive gear 39 and the third drive gear 40.

[0044] Preferably, a vacuum generator is installed inside the vacuum suction cup base 18 for use with the suction hole 19.

[0045] Preferably, the drive ring 21 has a bottom plate and an opening at the top.

[0046] The working principle and beneficial effects of the above scheme are as follows: Due to the inconsistent thickness of monocrystalline silicon wafers, such as Figure 8 The image shows the thickness of a single-crystal silicon wafer (thickness standard reference). Figure 9When clamping (as shown), the thicker monocrystalline silicon wafer 2P2 needs to be placed directly onto the top of several sets of vacuum suction cup bases 18 using a robotic arm. The vacuum generator inside is then activated to suction the monocrystalline silicon wafer 2P2 through the suction holes 19, preventing it from falling. Subsequently, the drive motor 20 is activated, causing the drive ring 21 to rotate. As the drive ring 21 rotates, it pulls the first connecting rod 25 connected to it, causing it to deflect within the clearance groove 26. This causes the guide slider 24 to move along the limiting rod 22 towards the drive ring 21. This continues until the guide slider 24, with its top centering arm 33, contacts the outer wall of the monocrystalline silicon wafer 2P2. At this point, the suction holes 19 no longer suction the monocrystalline silicon wafer 2P2, and the multiple sets of centering rollers 34 can push the monocrystalline silicon wafer 2P2 without damage until its center coincides with the center of the mounting ring 1. Then, the drive motor 20 is turned off. Simultaneously, the electric actuator 38 is activated. The electric actuator 38 drives the U-shaped drive component 35 to move through the fixed plate 2 36, thereby enabling the drive rack 37 to drive the drive gear 2 39 and the drive gear 3 40 to rotate synchronously in opposite directions. At this time, the drive gear 3 40 drives the centering arm 33 to move away from the outer wall of the monocrystalline silicon wafer 2 P2 through the drive shaft 1 28, while the drive gear 2 39 drives the silicon wafer arm 30 to move closer to the outer wall of the monocrystalline silicon wafer 2 P2 through the drive shaft 2 29. The setting of the clearance groove 3 31 can provide clearance space for the reverse rotation of the centering arm 33, avoiding interference between the silicon wafer arm 30 and the centering arm 33 during the movement. Until the multiple sets of silicon wafer arms 30 clamp the monocrystalline silicon wafer 2 P2, the elastic pressure strip 32 plays an auxiliary fixing role. In the above way, the monocrystalline silicon wafer 1 P1 is clamped, and the next operation of the monocrystalline silicon wafer can be carried out.

[0047] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A single-crystal silicon wafer processing fixture, characterized in that, The device includes a mounting ring (1), a drive gear ring (2) on the top of the mounting ring (1), several sets of primary clamping assemblies (6) are installed around the inner ring of the drive gear ring (2), and several sets of guide members (8) are fixed around the outer wall of the mounting ring (1). Each set of guide members (8) is equipped with a secondary clamping assembly (7). The secondary clamping assembly (7) is driven by the drive unit installed in the mounting ring (1) to clamp the single crystal silicon wafer.

2. The single-crystal silicon wafer processing fixture according to claim 1, characterized in that, The drive motor (5) is installed inside the mounting ring (1), and the output shaft of the drive motor (5) extends out of the top housing of the mounting ring (1) and is fixedly fitted with the drive gear (4). The drive gear (4) meshes with the drive gear ring (2), and the inner wall of the drive gear ring (2) extends toward the first-stage clamp assembly (6) to form an inclined push head (3).

3. A single-crystal silicon wafer processing fixture according to claim 2, characterized in that, The primary clamp assembly (6) includes a primary clamp base (9), which is installed on the top of the mounting ring (1) by several sets of bolts (12). The primary clamp base (9) has a guide groove (10) and two sets of clearance grooves (11) on its top, and the two sets of clearance grooves (11) are symmetrically arranged on both sides of the guide groove (10). The bolts (12) are installed in the clearance grooves (11).

4. A single-crystal silicon wafer processing fixture according to claim 3, characterized in that, The limiting rod (13) is fixedly installed in the guide groove (10). The guide slider (15) is movably sleeved on the outer wall of the limiting rod (13), and the guide slider (15) is slidably connected to the inner wall of the guide groove (10). The reset spring (14) is sleeved on the outer wall of the limiting rod (13), and the two ends of the reset spring (14) are fixedly connected to the inner wall of the guide groove (10) and the guide slider (15) respectively.

5. A single-crystal silicon wafer processing fixture according to claim 4, characterized in that, The bottom of the silicon wafer clamp (16) is fixedly connected to the guide slider (15) and slidably connected to the surface of the first-stage clamp base (9). The silicon wafer clamp (16) extends towards the outer wall of the inner ring of the drive gear ring (2) to form an arc-shaped protrusion (17). The arc-shaped protrusion (17) abuts against the inclined push head (3). Two sets of vacuum suction cup bases (18) are symmetrically fixed on the top of the silicon wafer clamp (16), and several sets of suction holes (19) are provided on the top of the vacuum suction cup bases (18).

6. A single-crystal silicon wafer processing fixture according to claim 1, characterized in that, The drive unit includes a second drive motor (20), which is fixedly located at the bottom center of the inner wall of the mounting ring (1), and the drive ring (21) is fixedly sleeved on the outer wall of the output shaft of the second drive motor (20). The first fixing plate (41) is installed at the top center of the inner wall of the mounting ring (1) through the first fixing rod (42). The second clearance groove (26) is provided at the connection between the mounting ring (1) and the guide (8).

7. A single-crystal silicon wafer processing fixture according to claim 6, characterized in that, A limiting groove (23) is provided on the guide member (8). One end of the limiting rod (22) is fixedly connected to the inner wall of the limiting groove (23). The other end of the limiting rod (22) extends into the mounting ring (1) and is fixedly connected to the fixing plate (41). The guide slider (24) is movably disposed in the limiting groove (23) and slides on the outer wall of the limiting rod (22). One end of the first connecting rod (25) is rotatably connected to the bottom of the guide slider (24). The other end of the first connecting rod (25) passes through the clearance groove (26) and extends into the mounting ring (1) to be rotatably connected to the drive ring (21).

8. A single-crystal silicon wafer processing fixture according to claim 7, characterized in that, The secondary clamp assembly (7) includes a support frame (27), which is connected to the guide slider (24) via a fixed rod (43). The fixed rod (43) has a drive shaft (28) and a drive shaft (29) symmetrically arranged on both sides. The bottom of the drive shaft (28) and the drive shaft (29) are rotatably connected to the top of the guide slider (24). The tops of the drive shaft (28) and the drive shaft (29) extend into the support frame (27), and the outer walls of the extended ends are respectively fixedly sleeved with drive gear (40) and drive gear (39).

9. A single-crystal silicon wafer processing fixture according to claim 8, characterized in that, Each set of drive shaft one (28) has the same centering arm (33) fixedly sleeved on its outer wall, and the centering arm (33) has a centering roller (34) movably installed at its end. Each set of drive shaft two (29) has the same silicon wafer arm (30) fixedly sleeved on its outer wall, and the silicon wafer arm (30) has two sets of clearance grooves three (31) opened on its surface. The clearance groove three (31) near the end of the silicon wafer arm (30) is provided with an elastic pressure strip (32).

10. A single-crystal silicon wafer processing fixture according to claim 8, characterized in that, The fixed end of the electric actuator (38) is fixedly connected to the outer wall of the support frame (27), and the output end of the electric actuator (38) is fixedly connected to the second fixed plate (36). The top of the second fixed plate (36) is fixedly provided with a U-shaped drive component (35), and two sets of drive racks (37) are symmetrically fixed at both ends of the U-shaped head of the U-shaped drive component (35). Each set of drive racks (37) extends movably into the support frame (27) and meshes with the second drive gear (39) and the third drive gear (40).

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