Rotating assembly and semiconductor process equipment

Abstract

The invention provides a rotating assembly and semiconductor process equipment, and the rotating assembly comprises a sleeve which is provided with a first step structure on the inner wall; the rotating shaft is arranged in the inner cavity of the sleeve and is provided with a second step structure; the pressing block structure is arranged on the second step structure and is connected with the sleeve; the first sealing structure is arranged in a first annular accommodating cavity between the sleeve and the rotating shaft; the first sealing structure comprises a first sealing ring and a second sealing ring; a first groove is formed in the side surface, deviating from the rotating shaft, of the first sealing ring; the second sealing ring surrounds the side face, away from the rotating shaft, of the first sealing ring and is located in the first groove. When the rotary assembly is applied to semiconductor process equipment for bearing wafers, the rotary arrangement of the bearing platform in a reaction chamber and the isolation of a vacuum environment and an external atmospheric environment can be realized, the use of magnetofluid is avoided, the cost is reduced, and the production efficiency is improved. And the risks of sealing failure and reaction chamber pollution caused by magnetic fluid leakage can be eliminated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, in particular to a rotating assembly and a semiconductor process equipment. BACKGROUND

[0002] In the manufacturing process of semiconductor, when a wafer is subjected to a process such as vapor deposition, a rotating assembly carrying the wafer needs to be rotated in a reaction chamber. Since the wafer is subjected to the process in a vacuum environment, the rotating assembly needs to include a dynamic sealing structure separating the vacuum environment and the atmospheric environment. However, the current dynamic sealing structure is generally a magnetic fluid structure, which not only has high cost, but also has the risk of magnetic fluid leakage leading to sealing failure and contamination of the reaction chamber. SUMMARY

[0003] Therefore, the present application provides a rotating assembly which can reduce cost and better achieve sealing. In addition, the present application also provides a semiconductor process equipment having the rotating assembly.

[0004] To achieve the above-mentioned purpose, the present application provides the following technical solutions: A rotating assembly, comprising: a sleeve; a rotating shaft arranged in an inner cavity of the sleeve; a pressing block structure, an inner wall of the sleeve is provided with a first step structure; the rotating shaft is provided with a second step structure; a first annular accommodating cavity is formed between the first step structure and the second step structure; the pressing block structure is arranged on the second step structure and connected with the sleeve; a first sealing structure arranged in the first annular accommodating cavity between the sleeve and the rotating shaft; the first sealing structure comprises a first sealing ring and a second sealing ring; the first sealing ring surrounds the rotating shaft, and a side surface of the first sealing ring away from the rotating shaft is provided with a first groove; the second sealing ring surrounds the side surface of the first sealing ring away from the rotating shaft and is located in the first groove; wherein the second step structure of the rotating shaft presses the first sealing structure through the pressing block structure, and the first sealing ring deforms in a radial direction of the rotating shaft.

[0005] Optionally, in the above-mentioned rotating assembly, a second groove is further arranged on a side surface of the first sealing ring in contact with the first step structure, or a surface of the first sealing ring in contact with the pressing block structure. The first sealing structure further comprises a third sealing ring, and the third sealing ring is located in the second groove.

[0006] Optionally, in the above-mentioned rotating assembly, a first channel is further included, and the first channel comprises a sleeve radial section and a rotating shaft radial section. The rotating assembly comprises two first sealing structures, namely a first upper sealing structure and a first lower sealing structure; the rotating assembly further comprises a support ring; an axial end surface of the support ring is provided with a protrusion relative to the outer side of the circumferential side wall and the inner side of the circumferential side wall; a plurality of through holes are arranged on the circumferential side wall of the support ring; the first upper sealing structure is located between the support ring and the first stepped structure; the first lower sealing structure is located between the support ring and the pressing block structure; The sleeve radial segment is in communication with the rotating shaft radial segment through the first annular accommodating cavity.

[0007] Optionally, in the rotating assembly described above, the second groove is lower near the support surface of the rotating shaft than away from the support surface of the rotating shaft.

[0008] Optionally, in the rotating assembly described above, the rotating assembly comprises a carrier; a support shaft of the carrier is connected with the rotating shaft; The first channel comprises a vacuum suction channel; the vacuum suction channel comprises a vacuum suction sleeve radial segment, a vacuum suction rotating shaft radial segment, a vacuum suction rotating shaft axial segment and a vacuum suction carrier axial segment; one end of the vacuum suction rotating shaft axial segment is in communication with the vacuum suction rotating shaft radial segment; the other end of the vacuum suction rotating shaft axial segment is in communication with the vacuum suction carrier axial segment; And / or, The first channel comprises a liquid inlet channel and a liquid outlet channel; the liquid inlet channel comprises a liquid inlet sleeve radial segment, a liquid inlet rotating shaft radial segment, a liquid inlet rotating shaft axial segment and a liquid inlet carrier axial segment; the liquid outlet channel comprises a liquid outlet sleeve radial segment, a liquid outlet rotating shaft radial segment, a liquid outlet rotating shaft axial segment and a liquid outlet carrier axial segment; One end of the liquid inlet rotating shaft axial segment is in communication with the liquid inlet rotating shaft radial segment; the other end of the liquid inlet rotating shaft axial segment is in communication with the liquid inlet carrier axial segment; one end of the liquid outlet rotating shaft axial segment is in communication with the liquid inlet rotating shaft radial segment; the other end of the liquid outlet rotating shaft axial segment is in communication with the liquid outlet carrier axial segment.

[0009] Optionally, in the rotating assembly described above, the rotating assembly further comprises a second channel; the second channel comprises a liquid inlet channel and a liquid outlet channel; The liquid inlet channel comprises a liquid inlet sleeve radial segment, a liquid inlet rotating shaft radial segment, a liquid inlet rotating shaft axial segment and a liquid inlet carrier axial segment; the liquid outlet channel comprises a liquid outlet sleeve radial segment, a liquid outlet rotating shaft radial segment, a liquid outlet rotating shaft axial segment and a liquid outlet carrier axial segment; one end of the liquid inlet rotating shaft axial segment is in communication with the liquid inlet rotating shaft radial segment; the other end of the liquid inlet rotating shaft axial segment is in communication with the liquid inlet carrier axial segment; one end of the liquid outlet rotating shaft axial segment is in communication with the liquid inlet rotating shaft radial segment; the other end of the liquid outlet rotating shaft axial segment is in communication with the liquid outlet carrier axial segment. The sleeve and / or the rotating shaft are provided with a third groove to form a second annular accommodating cavity between the sleeve and the rotating shaft; the radial section of the liquid inlet sleeve is connected to the radial section of the liquid inlet rotating shaft through the second annular accommodating cavity; the radial section of the liquid outlet sleeve is connected to the radial section of the liquid outlet rotating shaft through the second annular accommodating cavity. Along the axial direction of the rotating shaft, dynamic sealing assemblies or O-ring assemblies are provided on both sides of the second annular receiving cavity.

[0010] Optionally, in the above-described rotating assembly, the sleeve includes a first sleeve and a second sleeve; the rotating shaft includes a first rotating shaft and a second rotating shaft, the first rotating shaft being rotatably disposed in the first sleeve, and the second rotating shaft being rotatably disposed in the second sleeve and connected to the first rotating shaft; The sleeve radial section and the rotating shaft radial section of the first channel are respectively disposed on the first sleeve and the first rotating shaft; The rotating assembly includes a second channel, which includes an inlet channel and an outlet channel. The inlet channel includes a radial section of an inlet sleeve and a radial section of an inlet shaft. The outlet channel includes a radial section of an outlet sleeve and a radial section of an outlet shaft. The radial sections of the inlet sleeve and the outlet sleeve are disposed on the second sleeve, and the radial sections of the inlet shaft and the outlet shaft are disposed on the second shaft.

[0011] Optionally, in the above-described rotating assembly, the rotating assembly further includes a connecting pipe connected to the sleeve, the connecting pipe being used to connect the reaction chamber and the inner cavity of the sleeve; The sleeve has an air inlet that connects to the inner cavity of the sleeve for blowing gas into the inner cavity of the sleeve.

[0012] Optionally, in the above-described rotating assembly, the rotating assembly further includes a connecting pipe connected to the sleeve, the connecting pipe being used to connect the reaction chamber and the inner cavity of the sleeve; The connecting pipe is a flexible pipe or a telescopic pipe, and the sleeve is provided with a lifting drive assembly, which drives the sleeve to move closer to and away from the reaction chamber.

[0013] Optionally, in the above-mentioned rotating assembly, the rotating assembly includes a platform; the support shaft of the platform is connected to the first rotating shaft; a plurality of sealing rings are provided on the two end faces of the first rotating shaft that are respectively connected to the platform and the second rotating shaft, one of the plurality of sealing rings is used to seal the mating end face of the first rotating shaft and the platform, and the remaining sealing rings are respectively used to seal the mating interfaces of different channels.

[0014] A semiconductor process apparatus includes a reaction chamber and the aforementioned rotating assembly.

[0015] The rotating assembly provided in this application includes a sleeve and a rotating shaft disposed within the sleeve. The sleeve has a first stepped structure and a second stepped structure inside, forming a first annular receiving cavity between the two stepped structures. A first sealing structure is disposed within the first annular receiving cavity. This first sealing structure includes a first sealing ring surrounding the rotating shaft for contact with the rotating shaft, and a second sealing ring disposed within a first groove of the first sealing ring. The second sealing ring surrounds the first sealing ring for contact with the sleeve. Furthermore, a pressure block structure connected to the sleeve is disposed on the second stepped structure. This pressure block structure can limit the first sealing structure within the first annular receiving cavity and can achieve compression of the first sealing structure. Through compression, the first sealing structure deforms radially along the rotating shaft, thereby increasing the radial dimension of the first sealing structure and enabling a tighter contact with the sleeve and / or the rotating shaft. Thus, a good seal between the rotating shaft and the sleeve can be achieved after the rotating shaft is assembled into the sleeve. When this rotating component is used in semiconductor process equipment to support wafers, it enables the stage to rotate within the reaction chamber and isolates the vacuum environment from the external atmospheric environment, avoiding the use of magnetorheological fluids. This not only reduces costs but also eliminates the risk of seal failure and contamination of the reaction chamber caused by magnetorheological fluid leakage, thus achieving better sealing. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0017] Figure 1 This is a cross-sectional view showing the interaction between the rotating assembly and the reaction chamber provided in an embodiment of this application.

[0018] Figure 2 This is a cross-sectional view showing the fit between the first sleeve and the first rotating shaft.

[0019] Figure 3 This is a schematic diagram of the first sealing structure.

[0020] Figure 4 This is a top view of the first axis of rotation.

[0021] Figure 5 This is a top view showing the first sleeve and the first rotating shaft mating.

[0022] Figure 6 This is a schematic diagram of the structure of the first sleeve.

[0023] Figure 7 This is a schematic diagram of the support ring structure.

[0024] Figure 8 This is a schematic diagram of the structure in which the first upper sealing structure, the first lower sealing structure, and the support ring are fitted together.

[0025] Figure 9 This is a cross-sectional view from another angle showing the interaction between the rotating assembly and the reaction chamber provided in an embodiment of this application.

[0026] Figure 10 A cross-sectional view showing the fit between the second sleeve and the second rotating shaft.

[0027] Figure 11 A top sectional view showing the fit between the second sleeve and the second rotating shaft.

[0028] exist Figures 1-11 middle: 1-Sleeve, 2-Rotating shaft, 3-Pressure block structure, 4-First step structure, 5-Second step structure, 6-First sealing structure, 7-Support ring, 8-Platform, 9-Vacuum adsorption channel, 10-Liquid inlet channel, 11-Liquid outlet channel, 12-Third groove, 13-First dynamic sealing assembly, 14-Second dynamic sealing assembly, 15-O-ring assembly, 16-Dynamic sealing ring, 17-Static sealing ring, 18-First bearing, 19-Fixed component, 20-First retaining ring, 21-Connecting pipe, 22-Air inlet, 23-Lifting drive assembly, 24-Rotation drive assembly, 25-Second bearing, 26-Bearing cover plate, 27-Second retaining ring, 28-Fourth sealing ring, 29-Fifth sealing ring, 30-Sixth sealing ring, 31-Seventh sealing ring, 32-Thermocouple, 33-Rotating slip ring, 34-KF flange, 35-Reaction chamber, 36-Third retaining ring; 101 - First sleeve, 102 - Second sleeve; 201 - First rotating shaft, 202 - Second rotating shaft; 601-First sealing ring, 602-Second sealing ring, 603-First groove, 604-Second groove, 605-Third sealing ring, 606-First upper sealing structure, 607-First lower sealing structure; 701 - Ring body, 702 - Protrusion, 703 - Through hole; 801 - Platform section, 802 - Support shaft; 901 - Radial section of vacuum adsorption shaft; 902 - Radial section of vacuum adsorption sleeve; 1001 - Inlet radial section, 1002 - Diffusion section; 1101 - Outlet radial section; 2401 - Mounting component, 2402 - Drive motor, 2403 - Drive pulley, 2404 - Driven pulley, 2405 - Drive belt. Detailed Implementation

[0029] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0030] In semiconductor manufacturing, processes such as vapor deposition require a rotating assembly to rotate the wafer within a reaction chamber and control its temperature. However, the inventors discovered several defects in the rotating assembly, affecting wafer processing quality. These defects include: on one hand, a portion of the rotating assembly is located inside the reaction chamber for wafer placement, while the other portion is located outside (in the atmospheric environment) for easy driving and installation. Since the wafer processing requires a vacuum environment (i.e., the internal space of the reaction chamber or the space connected to it is in a vacuum state), the rotating assembly needs a dynamically sealed structure to isolate the vacuum and atmospheric environments. Current dynamically sealed structures are generally magnetohydrodynamic (MHD) structures, which are not only costly but also... Furthermore, there is a risk of magnetohydrodynamic leakage leading to seal failure and contamination of the reaction chamber. On the other hand, in some cases, the stage of the rotating assembly, which is used to directly contact the wafer, is merely a support component that provides a place for the wafer. It does not have the structure or function to limit or position the wafer. During the rotation of the wafer by the rotating assembly, the wafer may slide on the stage, which will affect the process quality. Moreover, the way the rotating assembly controls the temperature of the wafer placed on it is by setting a resistance wire in the stage. By switching the resistance wire on and off and controlling the current in the resistance wire, the temperature of the stage can be controlled, thereby controlling the temperature of the wafer placed on the stage. This temperature control structure is not only costly to produce and difficult to process, but it is also generally suitable for high-temperature (e.g., 300°C) process scenarios and cannot be used for low-temperature process scenarios (e.g., below 90°C).

[0031] In response to the above situation, such as Figures 1-11As shown, this application provides a rotating assembly that can be used as a carrier for substrates (e.g., wafers) in semiconductor process equipment such as vapor deposition equipment. It can support (or carry) and control the temperature of the wafer during the process. The main components of this rotating assembly include a sleeve 1, a rotating shaft 2, a pressure block structure 3, and a first sealing structure 6. The sleeve 1 is the base component for mounting the rotating shaft 2 and has an inner cavity (i.e., a cylindrical cavity). This inner cavity can communicate with the reaction chamber 35 of the semiconductor process equipment, so that the inner cavity of the sleeve 1 also becomes part of the reaction space for the wafer to undergo process steps. The rotating shaft 2 is rotatably disposed in the inner cavity of the sleeve 1 and connected to the stage 8 (described later) capable of carrying the wafer. This allows the stage 8 to rotate under the drive of the rotating shaft 2, thereby driving the wafer... The shaft rotates, and a first step structure 4 is provided on the inner wall of the sleeve 1. This first step structure 4 refers to the step surface formed on the inner wall of the sleeve 1. It is formed because the inner diameter of different parts of the axial direction of the sleeve 1 is different, and this step surface has an angle of, for example, 90° with the axial direction of the sleeve 1. At the same time, a second step structure 5 is provided on the shaft 2. This second step structure 5 refers to the step surface formed on the outer wall of the shaft 2. It is also formed because the inner diameter of different parts of the axial direction of the shaft 2 is different, and this step surface has an angle of, for example, 90° with the axial direction of the shaft 2. When the shaft 2 and the sleeve 1 are assembled, the second step structure 5 and the first step structure 4 are misaligned in the axial direction, so that the first step structure 4 and the second step structure 5 form a first annular receiving cavity between the shaft 2 and the sleeve 1.

[0032] The pressure block structure 3 is an annular structure, which is assembled in the first annular receiving cavity and connected to the inner wall of the sleeve 1. It is located at the position of the second step structure 5 after the rotating shaft 2 is assembled, so as to realize the setting on the second step structure 5. In the specific assembly process, the first sealing structure 6 is first installed into the sleeve 1 and the first sealing structure 6 is made to contact and cooperate with the step surface of the first step structure 4. Then the pressure block structure 3 is connected to the sleeve 1, so that the pressure block structure 3 cooperates with the first step structure 4 to realize the pre-positioning of the first sealing structure 6, so as to avoid the first sealing structure 6 from being misaligned before the rotating shaft 2 is installed into the sleeve 1. Then the rotating shaft 2 is inserted into the inner cavity of the sleeve 1. After the rotating shaft 2 is inserted, the second step structure 5 on the rotating shaft 2 not only forms the first annular receiving cavity with the first step structure 4 on the sleeve 1, but also abuts against the pressure block structure 3, so that the pressure block structure 3 presses the first sealing structure 6 to realize the positioning of the first sealing structure 6 in the first annular receiving cavity.

[0033] The first sealing structure 6 is also an annular structure, which is arranged around the outside of the assembled rotating shaft 2, that is, in the first annular receiving cavity between the sleeve 1 and the rotating shaft 2. This first sealing structure 6 includes a first sealing ring 601 and a second sealing ring 602. The first sealing ring 601 is arranged around the rotating shaft 2, that is, the first sealing ring 601 is a sealing ring that mates with the rotating shaft 2. After the rotating shaft 2 is assembled into the sleeve 1, the entire first sealing structure 6 is fixedly connected to the inner wall of the sleeve 1, while the inner wall of the first sealing ring 601 abuts against the outer wall of the rotating shaft 2, and dynamic friction occurs between it and the outer wall of the rotating shaft 2 during the rotation of the rotating shaft 2, so as to achieve a seal with the rotating shaft 2. Optionally, in order to reduce the dynamic friction, such as Figure 3As shown, the inner wall of the first sealing ring 601 can be an arc-shaped wall protruding towards the rotating shaft 2; and a first groove 603 is provided on the outer wall of the first sealing ring 601 (this outer wall is the side wall of the first sealing ring 601 facing away from the rotating shaft 2, which, along with the aforementioned arc-shaped inner wall, are the inner and outer side walls of the annular structure). This first groove 603 is an annular groove coaxial with the first sealing ring 601, and its opening faces the radially outward side of the first sealing ring 601. The second sealing ring 602 is disposed in the first groove 603, i.e., the second sealing ring 602... 02 surrounds the side wall of the first sealing ring 601 away from the rotating shaft 2. This second sealing ring 602 is used to abut against the inner wall of the sleeve 1 to achieve a static seal between it and the sleeve 1. To improve the static seal effect, the cross-sectional diameter of the second sealing ring 602 can be made larger than the depth of the first groove 603. This allows a part of the second sealing ring 602 to protrude outside the first groove 603 (i.e., the second sealing ring 602 has a part protruding from the groove), thereby allowing this part to abut against the inner wall of the sleeve 1 more fully. During the assembly of the rotating shaft 2 into the sleeve 1, as the rotating shaft 2 is inserted into the inner cavity, the stepped surface of the second stepped structure 5 on the rotating shaft 2 presses against the pressure block structure 3, and the pressure block structure 3 applies a clamping force to the first sealing structure 6, causing the first sealing ring 601 of the first sealing structure 6 to be compressed and deformed in the axial direction of the sleeve 1. That is, the axial dimension of the first sealing ring 601 decreases due to compression. As the axial dimension of the first sealing ring 601 decreases, the radial dimension of the first sealing ring 601 increases, which causes the second sealing ring 602 surrounding the outer wall of the first sealing ring 601 to move closer to the inner wall of the sleeve 1, so as to achieve a more complete contact with the sleeve 1, thereby better achieving a static seal between the first sealing structure 6 and the sleeve 1. At the same time, the increase in radial dimension also causes the inner wall of the first sealing ring 601 to move closer to the rotating shaft 2, so that the inner wall makes a tighter contact with the rotating shaft 2, thereby better achieving a seal between the first sealing structure 6 and the rotating shaft 2. This design can replace the magnetofluid structure in related technologies, not only reducing manufacturing costs but also eliminating the risk of seal failure due to magnetofluid leakage. It also avoids contamination of the reaction chamber 35 by leaked magnetofluid, achieving better sealing and isolation between the vacuum and atmospheric environments. Furthermore, this first sealing structure 6, which can be compressed and deformed during assembly, allows for greater machining and assembly errors compared to traditional O-rings. These errors can be compensated for by deformation, reducing the difficulty of assembling and maintaining the rotating components and facilitating their assembly. Additionally, its excellent compression deformation performance allows for more complete and tighter contact with the sleeve 1 and / or the rotating shaft 2 after assembly, increasing the contact area and improving the sealing effect.

[0034] In addition to the application scenarios of the support structure of semiconductor process equipment mentioned above, the rotating component provided in this application embodiment can also be applied to other scenarios, such as the stirring component of liquid stirring equipment.

[0035] In an optional embodiment, one or more first sealing structures 6 may be provided in the first annular cavity. When multiple first sealing structures 6 are provided in the annular cavity, different first sealing structures 6 may respectively contact and cooperate with the first step structure 4 and the pressure block structure 3.

[0036] Furthermore, such as Figure 3As shown, the first sealing structure 6 further includes a second groove 604 and a third sealing ring 605. When the first sealing structure 6 is assembled with the first stepped structure 4, the second groove 604 is disposed on the side surface of the first sealing ring 601 that contacts the first stepped structure 4; when the first sealing structure 6 is assembled with the pressure block structure 3, the second groove 604 is disposed on the side surface of the first sealing ring 601 that contacts the pressure block structure 3. The third sealing ring 605 is disposed within the second groove 604. In this structure, the second groove 604 is disposed on the axial end face of the first sealing ring 601, and is disposed on at least one axial end face of the first sealing ring 601. That is, on the axial surfaces of the first sealing ring 601, the second groove 604 can be disposed on only one surface and a third sealing ring 605 can be disposed within this second groove 604, or the second groove 604 can be disposed on both surfaces, and a third sealing ring 605 can be disposed in each second groove 604. The opening of the second groove 604 faces the axial direction of the first sealing ring 601. The third sealing ring 605 (and the aforementioned second sealing ring 602) is a highly elastic sealing ring, meaning that the third sealing ring 605 achieves its sealing function through elastic deformation. Its material is, for example, rubber. The second groove 604 is also an annular groove coaxially arranged with the first sealing ring 601. The third sealing ring 605 is fitted into the second groove 604, and the cross-sectional diameter of the third sealing ring 605 is greater than or equal to the depth of the second groove 604. This causes a portion of the third sealing ring 605 to protrude outside the second groove 604 or be flush with the axial end face. In this way, it can abut against the first step structure 4 or the pressure block structure 3 located on the axial side of the first sealing ring 601, and undergo elastic deformation under the clamping of the first sealing ring 601 and the first step structure 4, thereby achieving a seal between the two. In this structure, since the first sealing ring 601 needs to slide and rub against the rotating shaft 2, in order to extend the life of the first sealing ring 601, its elasticity is made lower than that of the second sealing ring 602 and the third sealing ring 605, but its wear resistance is higher than that of the second sealing ring 602 and the third sealing ring 605. For example, the first sealing ring 601 can be made of Peek (Polyether Ether Ketone), which not only supports and positions the sealed component (i.e., the rotating shaft 2), but also provides clamping force (or supporting force) to the second sealing ring 602 and the third sealing ring 605, so that the second sealing ring 602 and the third sealing ring 605 can achieve reasonable compression and clamping force in both the radial and axial directions, thereby achieving a good seal. Specifically, as shown in the figure... Figure 3As shown, in order to meet the different requirements of compression and clamping force in different directions (i.e., radial and axial), the cross-sectional diameters of the second sealing ring 602 and the third sealing ring 605 can be different. For example, the cross-sectional diameter of the third sealing ring 605 is larger than that of the second sealing ring 602, and the cross-sectional shape of the second groove 604 is set to be an arc shape that matches the cross-sectional shape of the third sealing ring 605, while the cross-sectional shape of the first groove 603 can be kept as a polygon.

[0037] Optional, such as Figure 3 As shown, the support surface of the second groove 604 near the rotating shaft 2 can also be made lower than the support surface away from the rotating shaft 2. Here, the support surface refers to the axial end face of the first sealing ring 601 where the groove of the second groove 604 is located. An axial cavity is formed on this end face, extending radially to the arc-shaped inner wall of the first sealing ring 601 but not to the outer wall. This makes the height of the support surface between the groove of the second groove 604 and the arc-shaped inner wall less than the height of the support surface between the groove and the outer wall. This allows residual gas in the second groove 604 to be discharged through the cavity when the first sealing ring 601 is compressed and deformed. (When the groove of the first groove 603 on the assembled first sealing structure 6 faces the internal reaction space, a small amount of residual gas is discharged into the reaction chamber 35 and drawn away by the exhaust system of the reaction chamber 35; when the groove of the first groove 603 on the assembled first sealing structure 6 faces the external atmospheric environment, the residual gas is directly discharged into the atmospheric environment.) This improves the sealing effect of the first sealing structure 6.

[0038] In optional embodiments, such as Figure 1 and Figure 9 As shown, the rotating assembly can also include a stage 8 and a first channel. The stage 8 is a component that carries and temperature-controls the wafer. It includes a platform portion 801 for forming a wafer placement position and a support shaft 802 supporting the platform portion 801. The support shaft 802 extends from the inside of the reaction chamber 35 to the outside of the reaction chamber 35. The temperature control structure (i.e., the liquid inlet channel 10 and liquid outlet channel 11 described later) extends from the support shaft 802 to the platform portion 801 to allow for temperature changes in the platform portion 801. Because the platform portion 801 has good thermal conductivity, it is placed on the platform portion 801. The wafer on the platform 801 will conduct heat with the platform section 801, thereby achieving temperature control of the wafer. The stage 8 can also rotate under the drive of the support shaft 802 to drive the wafer to rotate during the process, thereby improving the process quality (such as improving the uniformity of film thickness). The rotation of the stage 8 is achieved by the cooperation of the sleeve 1 and the rotating shaft 2. For ease of installation and maintenance, the sleeve 1 and the rotating shaft 2 are set outside the reaction chamber 35. In addition, in order to optimize the structure and improve the driving effect, the rotating shaft 2 can be coaxially connected with the support shaft 802.

[0039] Based on the above structure, the structure and function of the rotating component can be further optimized, such as... Figure 1 As shown, the first channel can include a vacuum adsorption channel 9 (i.e., an air extraction channel). This vacuum adsorption channel 9 extends sequentially from the platform portion 801 of the stage 8 to the support shaft 802, the rotating shaft 2, and the sleeve 1. By providing this vacuum adsorption channel 9 connected to the stage 8, the rotating assembly has a vacuum adsorption function (the air extraction path and direction of the vacuum adsorption channel 9 are as follows). Figure 1 As shown by the green arrow in the image, the vacuum adsorption channel 9 is located on the surface of the stage 8 used for placing the wafer. When the wafer is placed on the stage 8, the wafer covers the opening of the vacuum adsorption channel 9. In this way, the wafer can be adsorbed onto the stage 8 by evacuating air through the vacuum adsorption channel 9, thus achieving wafer positioning and preventing the wafer from sliding on the stage 8, thereby improving process quality.

[0040] In the optional structure, in addition to the vacuum adsorption stage axial section and the vacuum adsorption rotating shaft axial section respectively disposed on the stage 8 and the rotating shaft 2 and disposed along their axial direction, the vacuum adsorption rotating shaft axial section and the vacuum adsorption stage axial section also include a vacuum adsorption rotating shaft radial section 901 and a vacuum adsorption sleeve radial section 902 respectively extending radially on the rotating shaft 2 and the sleeve 1 to achieve radial air extraction. One end of the vacuum adsorption rotating shaft axial section is connected to the vacuum adsorption rotating shaft radial section 901, and the other end of the vacuum adsorption rotating shaft axial section is connected to the vacuum adsorption stage axial section.

[0041] And / or, in the case of sealing the first channel using the first sealing structure 6 described above, in an optional embodiment, the first channel may also include an inlet channel 10 and an outlet channel 11 (the structures of the inlet channel 10 and the outlet channel 11 can be found in...). Figure 1 , Figure 9 and Figure 10 However, the sealing method in this embodiment is different from... Figure 1 , Figure 9 and Figure 10(The structure shown is different), that is, an inlet channel 10 and an outlet channel 11 for guiding the heat exchange liquid are also provided on the platform 8, the rotating shaft 2, and the sleeve 1. In addition to the axial section of the inlet platform and the axial section of the inlet rotating shaft respectively axially arranged on the support shaft 802 and the rotating shaft 2, the inlet channel 10 also includes a radial section of the inlet rotating shaft and a radial section of the inlet sleeve respectively arranged on the rotating shaft 2 and the sleeve 1. One end of the axial section of the inlet rotating shaft is connected to the radial section of the inlet rotating shaft, and the other end of the axial section of the inlet platform is connected to the inlet platform. The axial section is connected; the liquid outlet channel 11 also includes an axial section of the liquid outlet platform and an axial section of the liquid outlet rotating shaft respectively axially arranged on the support shaft 802 and the rotating shaft 2, as well as a radial section of the liquid outlet rotating shaft and a radial section of the liquid outlet sleeve respectively arranged on the rotating shaft 2 and the sleeve 1. One end of the axial section of the liquid outlet rotating shaft is connected to the radial section of the liquid outlet inlet rotating shaft, and the other end of the axial section of the liquid outlet rotating shaft is connected to the axial section of the liquid outlet platform. Furthermore, the radial sections of the inlet rotating shaft and the inlet sleeve are axially offset from the radial sections of the liquid outlet and the liquid outlet sleeve. Furthermore, the liquid guiding structure also includes a diffusion section 1002 disposed in the platform 8 (specifically, the platform section 801). This diffusion section 1002 may be, for example, a spiral structure, a radial structure, or a concentric circle structure. By fully diffusing within the platform section 801, the heat exchange liquid introduced by the liquid inlet channel 10 (the heat exchange liquid flows sequentially through the radial section of the liquid inlet sleeve, the radial section of the liquid inlet shaft, the axial section of the liquid inlet shaft, and the axial section of the liquid inlet platform during introduction, and finally reaches the diffusion section 1002) can be widely distributed and flow within the platform section 801. This allows for efficient heat exchange with the platform section 801 and the wafer placed on it, thus replacing the resistance wire used in related technologies to heat or cool the wafer and achieve temperature control of the wafer (e.g., maintaining the wafer at a low temperature of 60°C to 70°C). The heat exchange liquid, after exchanging heat with the wafer, flows out of the stage 8 through the outlet channel 11 and sequentially flows through the axial section of the outlet stage, the axial section of the outlet shaft, the radial section of the outlet shaft, and the radial section of the outlet sleeve before exiting the rotating assembly (the flow path and direction of the heat exchange liquid can be found in [reference needed]). Figure 1 , Figure 9 and Figure 10 (See the blue arrow in the image). The heat exchange liquid is, for example, plasma water. By setting up this liquid-conducting structure, the heat exchange liquid can be used instead of the resistance wire to achieve temperature control of the stage 8 and the wafer, which not only reduces manufacturing difficulty but also lowers temperature control costs.

[0042] Based on the aforementioned first channel, the rotating assembly includes two first sealing structures 6 (when the first channel is a vacuum adsorption channel 9, see [reference]). Figure 2The two first sealing structures 6 are the first upper sealing structure 606 and the first lower sealing structure 607, which are respectively assembled and cooperated with the first step structure 4 and the pressure block structure 3. The rotating assembly also includes a support ring 7, with the first upper sealing structure 606 located between the support ring 7 and the first step structure 4, and the first lower sealing structure 607 located between the support ring 7 and the pressure block structure 3. Furthermore, the radial section of the sleeve (referring to the radial section of the vacuum adsorption sleeve 902, the radial section of the liquid inlet sleeve, and / or the radial section of the liquid outlet sleeve) is connected to the radial section of the rotating shaft (referring to the radial section of the vacuum adsorption rotating shaft 901, the radial section of the liquid inlet rotating shaft, and / or the radial section of the liquid outlet rotating shaft) through the first annular receiving cavity and the support ring 7.

[0043] In this structure, on the one hand, the vacuum adsorption channel 9, the liquid inlet channel 10, and the liquid outlet channel 11 all include radial sections on the rotating shaft 2 and the sleeve 1, enabling a vertical connection between the external suction pipe and the sleeve 1. This avoids placing the interface of the first channel at the axial end of the rotating assembly away from the stage 8, thus preventing the interfaces of multiple channels (referring to the vacuum adsorption channel 9, the liquid inlet channel 10, and the liquid outlet channel 11) from being located at the axial end, avoiding the centralized placement of interfaces and external pipes, and optimizing the pipe layout; on the other hand, the rotating assembly... The component includes a support ring 7 disposed within the first annular cavity. This support ring 7 serves to uniformly guide the flow of gas or liquid, thereby making the pumping, liquid inflow, and / or liquid outflow more uniform and improving the working performance of the rotating assembly. Furthermore, based on the support ring 7, multiple first sealing structures 6 are disposed between the rotating shaft 2 and the sleeve 1, with these first sealing structures 6 located at opposite axial ends of the support ring 7. Simultaneously, the second groove 604 and the third sealing ring 605 inside each first sealing structure 6 are positioned facing away from the support ring 7, i.e., the first upper sealing structure 606... The second groove 604 and the third sealing ring 605 abut against the stepped surface of the first stepped structure 4, so that the first upper sealing structure 606 is simultaneously sealed to the axial inner wall of the sleeve 1 and to the first stepped structure 4. This achieves a double seal for the first upper sealing structure 606, making its isolation from the vacuum and atmospheric environments more effective. Similarly, the second groove 604 and the third sealing ring 605 of the first lower sealing structure 607 abut against the pressure block structure 3, so that the first lower sealing structure 607 is simultaneously sealed to the axial inner wall of the sleeve 1 and to the pressure block structure 3. This achieves a double seal for the first lower sealing structure 607. Furthermore, by axially configuring multiple first sealing structures 6, multiple seals between the sleeve 1 and the rotating shaft 2 can be achieved, providing a more thorough and reliable isolation between the vacuum environment and the atmospheric environment. Simultaneously, this configuration better prevents the vacuum adsorption channel 9 from communicating with the reaction space at the support ring 7 location, ensuring that the extracted gas can only circulate within the vacuum adsorption channel 9. This maximizes the negative pressure at the wafer location, allowing for more robust wafer adsorption and improving the adsorption effect. Additionally, for example, the vacuum adsorption channel 9 can be formed by configuring a KF (Klein Flansche) flange on the circumferential sidewall of the sleeve 1, such as... Figure 6 As shown.

[0044] For example, such as Figure 7As shown, the support ring 7 includes a ring body 701 and a plurality of through holes 703 disposed on the ring body 701. At least one axial end face of the ring body 701 is provided with a protrusion 702 that protrudes radially outward and inward relative to the circumferential sidewall, so that the cross-sectional shape of the ring wall of the support ring 7 is I-shaped. By such a configuration, the radial area at both ends of the support ring 7 in the axial direction can be increased, thereby giving it a larger area to contact and cooperate with the first upper sealing structure 606 and the first lower sealing structure 607 respectively, so that the first sealing structure 6 can contact the support ring 7 more fully and improve the sealing effect. The through-hole 703 on the ring 701 connects the radial sections of the rotating shaft and the sleeve (specifically, the radial sections of the vacuum adsorption rotating shaft 901, vacuum adsorption sleeve 902, and the liquid inlet radial section 1001 and liquid outlet radial section 1101 described later). Since the rotating shaft 2 needs to rotate relative to the sleeve 1, the through-hole-shaped radial sections of the rotating shaft and sleeve cannot always maintain radial alignment and communication. Therefore, to avoid interruptions in air extraction and liquid delivery, a support ring 7 is provided between the radial sections of the rotating shaft and the sleeve. Because the support ring 7 has radially protruding protrusions 702 at both ends, the two protrusions 702 and the ring 701 form two groove-shaped spaces with concave cross-sections. These groove-shaped spaces are divided into... The grooves are arranged on the entire circumference of the support ring 7, so the radial section of the rotating shaft can always be connected to the groove on the inner side of the circumferential side wall of the ring body 701, and the radial section of the sleeve can always be connected to the groove on the outer side of the circumferential side wall of the ring body 701. By opening through holes 703 on the circumferential side wall of the ring body 701 to connect the grooves on the inner and outer sides, the radial section of the rotating shaft and the radial section of the sleeve can be kept connected during the rotation of the rotating shaft 2. Furthermore, the multiple through holes 703 on the ring body 701 are evenly distributed in the circumferential direction of the ring body 701, so that the support ring 7 has a gas uniformity or liquid uniformity, that is, gas or liquid can enter the radial section of the sleeve evenly from the radial section of the rotating shaft, thus improving the pumping effect.

[0045] In the above structure, when the first channel is a vacuum adsorption channel 9 or a liquid inlet channel 10 and a liquid outlet channel 11, it can be sealed using the first sealing structure 6 described above. Alternatively, as... Figure 1 , Figure 9 and Figure 10 As shown, when the first channel mentioned above is only the vacuum adsorption channel 9, the rotating assembly may also include a second channel, which is the liquid inlet channel 10 and the liquid outlet channel 11 mentioned above for guiding liquid.

[0046] like Figure 1 , Figure 9 and Figure 10As shown, when the second channel is the aforementioned inlet channel 10 and outlet channel 11 for guiding liquid, it is similar to the first annular receiving cavity and the support ring 7, as follows: Figure 10 As shown, the sleeve 1 and / or the rotating shaft 2 are provided with a third groove 12, forming a second annular receiving cavity between the sleeve 1 and the rotating shaft 2; the radial section of the inlet sleeve is connected to the radial section of the inlet rotating shaft through the second annular receiving cavity; the radial section of the outlet sleeve is connected to the radial section of the outlet rotating shaft through the second annular receiving cavity. This ensures that the radial sections of the inlet sleeve and the inlet rotating shaft are always connected, and the radial sections of the outlet sleeve and the outlet rotating shaft are always connected, preventing interruption of liquid flow.

[0047] In optional embodiments, such as Figure 1 , Figure 9 and Figure 10 As shown, when the second channel is the aforementioned inlet channel 10 and outlet channel 11 for guiding liquid, sealing components need to be provided on both sides of the second annular receiving cavity along the axial direction of the rotating shaft 2 to prevent inlet and outlet liquid leakage into the gap between the sleeve 1 and the rotating shaft 2, and to isolate the inlet and outlet liquids, thereby preventing the heat exchange liquid from mixing with the liquid flowing out of the platform 8 before entering the platform 8, which would affect the temperature control effect on the platform 8. This sealing component can be a dynamic sealing assembly or an O-ring assembly 15. Specifically, as shown... Figure 10 As shown, in the axial direction of the rotating shaft 2 and the sleeve 1, a first dynamic sealing assembly 13 is provided on the side of the inlet radial section 1001 (the inlet radial section 1001 is a general term for the inlet sleeve radial section and the inlet rotating shaft radial section) away from the outlet radial section 1101 (the outlet radial section 1101 is a general term for the outlet sleeve radial section and the outlet rotating shaft radial section), a second dynamic sealing assembly 14 is provided on the side of the outlet radial section 1101 away from the inlet radial section 1001, and an O-ring assembly 15 is provided between the inlet radial section 1001 and the outlet radial section 1101. In this structure, the first dynamic seal assembly 13 and the O-ring assembly 15 seal the location of the inlet radial section 1001 on both axial sides, ensuring that the inlet liquid can only fill the second annular cavity formed by the first dynamic seal assembly 13, the O-ring assembly 15, the sleeve 1, and the rotating shaft 2, thus preventing leakage into other parts of the sleeve 1's inner cavity. Similarly, the O-ring assembly 15 and the second dynamic seal assembly 14 seal the location of the outlet radial section 1101 on both axial sides, ensuring that the outlet liquid can only fill another second annular cavity formed by the O-ring assembly 15, the second dynamic seal assembly 14, the sleeve 1, and the rotating shaft 2, thus preventing leakage into other parts of the second sleeve 102's inner cavity. This ensures normal inlet and outlet liquid flow.

[0048] Optional, such as Figure 10As shown, both the first dynamic sealing assembly 13 and the second dynamic sealing assembly 14 include a dynamic sealing ring 16 and a static sealing ring 17 distributed axially. The static sealing ring 17 of the first dynamic sealing assembly 13 is positioned closer to the inlet radial section 1001 relative to the dynamic sealing ring 16, while the static sealing ring 17 of the second dynamic sealing assembly 14 is positioned closer to the outlet radial section 1101 relative to the dynamic sealing ring 16. Since the rotating shaft 2 needs to rotate relative to the sleeve 1, the first dynamic sealing assembly 13 and the second dynamic sealing assembly 14 are selected to seal the inlet radial section 1001 and the outlet radial section 1101 on both axial sides to better achieve the seal between the dynamic and static components. This allows the heat exchange liquid to form a liquid film between the dynamic sealing ring 16 and the static sealing ring 17, improving the sealing effect and better preventing leakage of inlet and outlet liquids from the sleeve 1, thus improving the performance of the rotating assembly. In specific configurations, the static sealing ring 17 of the two dynamic sealing components is positioned closer to the channel than the dynamic sealing ring 16. This ensures that the sealing ring in the dynamic sealing component that contacts the heat exchange liquid is statically positioned, thus improving the sealing of the heat exchange liquid and the formation of the liquid film, thereby further enhancing the performance of the rotating component. Furthermore, the O-ring assembly 15 located between the two channels only needs to prevent the inlet and outlet liquids from mixing. Its sealing requirements are lower than those of the first dynamic sealing component 13 and the second dynamic sealing component 14. Therefore, the O-ring assembly 15 can be a common sealing ring, or it can be a dynamic sealing component to further improve the sealing effect. Of course, the first dynamic sealing component 13 and the second dynamic sealing component 14 can also be replaced with the O-ring assembly 15. The selection of the dynamic sealing component and the O-ring assembly 15 can be determined based on the actual situation, such as the size of the installation space and the level of sealing requirements.

[0049] Specifically, such as Figure 10 As shown, the second dynamic sealing assembly 14 is positioned by a fixing member 19 located on the sleeve 1 on the side of the second dynamic sealing assembly 14 away from the first dynamic sealing assembly 13, and the fixing member 19 is fixed by a first retaining ring 20 located on the side of the second dynamic sealing assembly 14 away from the second dynamic sealing assembly 14.

[0050] In optional embodiments, for ease of assembly, maintenance, and replacement, such as Figure 1 , Figure 2 and Figure 9 , Figure 10As shown, the sleeve 1 includes a first sleeve 101 and a second sleeve 102. The second sleeve 102 is located on the side of the first sleeve 101 away from the stage 8. The rotating shaft 2 also includes a first rotating shaft 201 and a second rotating shaft 202. The first rotating shaft 201 is rotatably disposed in the first sleeve 101, and the second rotating shaft 202 is rotatably disposed in the second sleeve 102 and connected to the first rotating shaft 201. Furthermore, the radial section 902 of the vacuum adsorption sleeve and the radial section 901 of the vacuum adsorption channel 9 for guiding the gas are disposed on the first sleeve 101 and the first rotating shaft 201, while the radial sections 1001 and 1101 of the inlet channel 10 and the outlet channel 11 for guiding the liquid heat exchange liquid are disposed on the second sleeve 102 and the second rotating shaft 202.

[0051] Specifically, such as Figure 1 and Figure 2 As shown, the first rotating shaft 201 is rotatably mounted in the first sleeve 101 by setting a first bearing 18, which rotatably connects the first sleeve 101 and the first rotating shaft 201. Specifically, the first bearing 18 is placed in the inner cavity of the first sleeve 101, and the outer ring of the first bearing 18 is fixedly connected to the first sleeve 101. The first rotating shaft 201 passes through the inner ring of the first bearing 18 and is fixedly connected to the inner ring (for example, a second retaining ring 27 is fixedly mounted on the first rotating shaft 201, which positions the first bearing 18). Figure 2 As shown in the figure, in order to improve the stability and reliability of the relative rotation of the first sleeve 101 and the first rotating shaft 201, the first bearing 18 can be, for example, a crossed roller bearing. When the inner cavity of the first sleeve 101 is connected to the inner cavity of the reaction chamber 35 and becomes part of the reaction space, the inner cavity of the first sleeve 101 that is not occupied by the first rotating shaft 201 needs to be a vacuum environment during the process. Therefore, it is necessary to isolate this part of the inner cavity from the external atmospheric environment, that is, to seal the gap between the outer circumferential wall of the first rotating shaft 201 and the inner circumferential wall of the first sleeve 101. Therefore, a first annular accommodating cavity and a first sealing structure 6 located in the first annular accommodating cavity are provided in the gap between the first rotating shaft 201 and the first sleeve 101, so that the first sealing structure 6 can achieve the seal between the first rotating shaft 201 and the first sleeve 101, that is, make the first sealing structure 6 a component that isolates the vacuum environment and the atmospheric environment.

[0052] like Figure 10As shown, the engagement between the second rotating shaft 202 and the second sleeve 102 is similar to the engagement between the first rotating shaft 201 and the first sleeve 101. For example, a bearing (defined as the second bearing 25 for easy distinction) is also provided between the first rotating shaft 201 and the first sleeve 101. The second rotating shaft 202 is rotatably connected within the second sleeve 102 via the rotational connection of the second bearing 25. This second bearing 25 is, for example, a deep groove ball bearing, which can be positioned near the top end of the second sleeve 102 (this top end refers to the end of the second sleeve 102 closest to the first sleeve 101) and is connected via... The bearing cover plate 26 and the third retaining ring 36, respectively set at both ends of its axial direction, are used to position the second sleeve 102 and the second rotating shaft 202 (the bearing cover plate 26 is connected to the second sleeve 102 and the third retaining ring 36 is connected to the second rotating shaft 202); the end of the second rotating shaft 202 near the first rotating shaft 201 is fixedly connected to the first rotating shaft 201, for example, by a clamp connection, so that it rotates synchronously with the first rotating shaft 201 under the drive of the first rotating shaft 201. Optionally, in order to optimize the structure and improve the smoothness of rotation, the second rotating shaft 202 is coaxially connected with the first rotating shaft 201.

[0053] In optional embodiments, such as Figure 1 and Figure 9 As shown, a connecting pipe 21 is also provided between the first sleeve 101 and the reaction chamber 35. The connecting pipe 21 is sleeved on the outside of the support shaft 802 and has a gap between it and the support shaft 802. One end of the connecting pipe 21 is sealed to the reaction chamber 35, and this opening surrounds the through hole 703 on the reaction chamber 35 for the support shaft 802 to pass through. The other end of the connecting pipe 21 is sealed to the end of the first sleeve 101 (the connection method is, for example, a threaded seal connection). Through the connection of the connecting pipe 21, the first sleeve 101 can be connected to the reaction chamber 35. The inner cavity of the sleeve 101 becomes a part of the reaction space. That is, the space that forms a vacuum includes not only the internal space of the reaction chamber 35, but also the inner cavity of the connecting pipe 21 and the inner cavity of the first sleeve 101 that is not occupied by the first rotating shaft 201. Process gases and plasmas can be dispersed in these spaces. In order to maintain the vacuum, the first sealing structure 6 set in the inner cavity of the first sleeve 101 isolates the inner cavity of the first sleeve 101 from the atmospheric environment by sealing the connection between the first sleeve 101 and the first rotating shaft 201.

[0054] Based on the existing connecting pipe 21 that connects the first sleeve 101 and the reaction chamber 35, further improvements can be made to the rotating assembly, for example... Figure 1 , Figure 2 and Figure 6As shown, an air inlet 22 is provided on the first sleeve 101. This air inlet 22 connects to the inner cavity of the first sleeve 101, allowing gas to enter the reaction space from the outside of the first sleeve 101 through the air inlet 22. In other words, a purging channel is provided on the first sleeve 101, penetrating the sleeve wall to connect to the reaction space. By providing the purging channel, such as... Figure 1 , Figure 2 and Figure 9 As indicated by the red arrow, an inert gas (such as argon) can be blown into the reaction space to purge the inner cavity of the first sleeve 101. This prevents impurity particles generated during the process from accumulating in the inner cavity of the first sleeve 101, thus avoiding adverse effects on process quality and / or the sealing effect of the first sealing structure 6. This further improves the working performance of the rotating assembly. For example, the purging channel can also be formed by providing a KF flange 34 on the circumferential sidewall of the first sleeve 101, such as... Figure 6 As shown.

[0055] In the specific structure, the connecting pipe 21 can be a flexible pipe or a telescopic pipe, and the first sleeve 101 is provided with a lifting drive assembly 23, which drives the first sleeve 101 to move so that the first sleeve 101 moves closer to and further away from the reaction chamber 35. In some processes, the stage 8 may need to be raised and lowered to change the height of the wafer in the reaction chamber 35. To meet this requirement, the rotating assembly also includes a lifting drive assembly 23 capable of driving the first sleeve 101 (and components such as the first rotating shaft 201, the first sealing structure 6, and the support ring 7 disposed within the first sleeve 101) to reciprocate axially. (Since the rotating assembly in semiconductor process equipment is arranged so that its axis coincides with the vertical direction, reciprocating axial movement is equivalent to lifting movement.) Because the first sleeve 101 can move closer to and further away from the reaction chamber 35 under the drive of the lifting drive assembly 23, to avoid interference from the connecting pipe 21 between the first sleeve 101 and the reaction chamber 35, the connecting pipe 21 can change its length as the first sleeve 101 is raised and lowered. Therefore, the connecting pipe 21 is configured as a flexible pipe or a telescopic pipe. A flexible connecting pipe 21 is, for example, a corrugated pipe, and a telescopic connecting pipe 21 is, for example, a telescopic sleeve structure. Optionally, such as... Figure 1 and Figure 9As shown, the lifting drive assembly 23 may include a drive motor (which may include a reducer) and a lead screw and nut mechanism. The lead screw of the lead screw and nut mechanism rotates under the drive of the drive motor. The nut, which is sleeved on the lead screw and threaded onto it, moves along the length of the lead screw (this length direction is the axial direction of the rotating assembly) under the drive of the lead screw. The nut is connected to the first sleeve 101 so that the nut can drive the first sleeve 101 to move synchronously. To optimize the structure, the part where the nut connects to the first sleeve 101 can be opposite the KF flange 34 interface. Furthermore, the drive motor can also cooperate with a gear and rack mechanism, a cam mechanism, or a linkage mechanism to drive the first sleeve 101 to lift and lower.

[0056] As described above, the first rotating shaft 201 needs to rotate within the first sleeve 101 to drive the platform 8 to rotate. Therefore, a rotary drive assembly 24 can be configured to drive the first rotating shaft 201 to rotate. In specific configuration, such as... Figure 1 As shown, the end of the first rotating shaft 201 furthest from the stage 8 extends out of the first sleeve 101 and connects to the rotary drive assembly 24. Specifically, the rotary drive assembly 24 is positioned on the side of the first sleeve 101 furthest from the stage 8, and some components of the rotary drive assembly 24 are connected to the first sleeve 101. This arrangement not only enables the rotation of the first rotating shaft 201 but also optimizes the layout of the first sleeve 101, the first rotating shaft 201, and the rotary drive assembly 24. It avoids the rotary drive assembly 24 affecting or interfering with the arrangement of the vacuum adsorption channel 9 and the purging channel, resulting in a more standardized and rational layout of the rotary assembly.

[0057] Optional, such as Figure 1As shown, the rotary drive assembly 24 includes: a mounting member 2401 connected to the first sleeve 101; a drive motor 2402 mounted on the mounting member 2401; a drive wheel 2403 mounted on the output shaft of the drive motor 2402; a driven wheel 2404 fixedly mounted on the first rotating shaft 201; and a transmission belt 2405 mounted on the drive wheel 2403 and the driven wheel 2404, the transmission belt 2405 transmitting the power of the drive wheel 2403 to the driven wheel 2404. In this structure, the mounting component 2401 is used to mount the drive motor 2402. It is connected to the lower end of the first sleeve 101. The mounting component 2401 can also be set as a cover structure to provide a mounting position for the drive motor 2402 and to protect the drive motor 2402 and / or the drive wheel 2403. The drive wheel 2403, the driven wheel 2404 and the transmission belt 2405 form a belt drive mechanism. The power generated by the drive motor 2402 is transmitted to the drive wheel 2403, and the drive wheel 2403 transmits the power to the driven wheel 2404 through the transmission belt 2405. The driven wheel 2404 then drives the first rotating shaft 201 to rotate synchronously. The belt drive mechanism is chosen because it has a simple structure and small size, making it more suitable for installation in rotating components. Moreover, its transmission stability is good, which enables the stage 8 to drive the wafer to rotate more stably. In order to facilitate processing and assembly, the connection between the driven wheel 2404 and the first rotating shaft 201 and the connection between the driving wheel 2403 and the output shaft of the drive motor 2402 can be a threaded connection or a keyed connection, etc.

[0058] Alternatively, the drive motor 2402 can also drive the first rotating shaft 201 through a gear transmission mechanism or a chain transmission mechanism.

[0059] Based on the above-mentioned sealing components, such as Figure 2 , Figure 4 and Figure 5 As shown, multiple sealing rings can also be provided on both end faces of the first rotating shaft 201, which are respectively connected to the platform 8 and the second rotating shaft 202. These sealing rings are used to achieve a sealed connection between the first rotating shaft 201 and the platform 8, as well as a sealed connection between the various channel interfaces. For example Figure 2 and Figure 4As shown, the fourth sealing ring 28, which is the outermost and has the largest diameter among the multiple sealing rings, is used to seal the mating end faces of the support shaft 802 and the first rotating shaft 201 when they are connected. To improve the sealing effect (the fourth sealing ring 28 can improve the sealing performance of the air extraction channel interface), the diameter of the fourth sealing ring 28 can be made close to the diameter of the end faces of the support shaft 802 and the first rotating shaft 201. The sealing rings located inside the fourth sealing ring 28 include a fifth sealing ring 29 surrounding the interface of the air extraction channel, a sixth sealing ring 30 surrounding the interface of the liquid inlet channel 10, and a seventh sealing ring 31 surrounding the interface of the liquid outlet channel 11. This further improves the sealing performance of each channel and optimizes the working effect of each channel.

[0060] In addition, such as Figure 1 As shown, the rotating assembly provided in this embodiment of the application further includes a thermocouple 32 disposed inside the stage 8, the first rotating shaft 201, and the second rotating shaft 202. One end of the thermocouple 32 extends to the platform portion 801 of the stage 8 for detecting the temperature of the platform portion 801 (or wafer), while the other end of the thermocouple 32 extends out from the end of the second rotating shaft 202 away from the first rotating shaft 201. A rotating slip ring 33 is connected to this end of the first rotating shaft 201, and the rotating slip ring 33 includes a rotor and a stator rotatably connected. The rotor and the stator are always electrically connected, and both the rotor and the stator have terminal interfaces. The terminal interface on the rotor is electrically connected to the thermocouple 32 through wires, and the rotor rotates synchronously with the thermocouple 32. The terminal interface on the stator is electrically connected to the cables of the semiconductor process equipment. In this way, the rotating slip ring 33 can transmit the temperature signal measured by the thermocouple 32 to the control module of the semiconductor process equipment, realizing signal transmission between the rotating component and the stationary component.

[0061] In summary, the rotating assembly provided in this application integrates the functions of rotation, lifting, purging, vacuuming and adsorption, liquid temperature control and measurement, and its overall working process is as follows: Firstly, as Figure 1 and Figure 9 As shown by the red arrow, argon gas is blown into the first sleeve 101 through the purge channel. The argon gas flows from the first sleeve 101 through the connecting pipe 21 and into the reaction chamber 35, carrying the particles accumulated in the first sleeve 101 into the reaction chamber 35. The argon gas carrying the particles is then evacuated by a vacuum pump system (not shown in the figure) equipped in the reaction chamber 35. The heat exchange liquid (plasma water) is heated to 60°C~70°C by a chiller. Figure 9As shown by the blue arrow, the liquid enters the stage 8 through the inlet channel 10 to maintain the temperature of the stage 8 at 60°C~70°C. The heat exchange liquid flowing through the stage 8 exits the rotating assembly through the outlet channel 11 and returns to the cooler. Then, the lifting drive assembly 23 moves the first sleeve 101 to the process position. The wafer is then transferred into the reaction chamber 35 and placed on the stage 8, as shown... Figure 1 As shown by the green arrow, the wafer is evacuated through the vacuum adsorption channel 9 so that it is adsorbed onto the stage 8 under negative pressure, thereby achieving wafer positioning; finally, the first rotating shaft 201, the stage 8 and the second rotating shaft 202 are driven to rotate by the rotation drive assembly 24, and the process steps are performed while maintaining rotation.

[0062] Based on the above-described rotating component, this application embodiment also provides a semiconductor process apparatus, which includes a reaction chamber 35 and a rotating component. The reaction chamber 35 provides a vacuum environment and a plasma space, and the rotating component is the aforementioned rotating component.

[0063] Since this semiconductor process equipment includes the aforementioned rotating components, the beneficial effects of the rotating components on the semiconductor process equipment are described above and will not be repeated here.

[0064] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0065] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0066] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0067] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0068] It should be understood that the qualifiers “first,” “second,” “third,” “fourth,” “fifth,” and “sixth” used in the description of the embodiments of this application are only used to more clearly illustrate the technical solutions and are not intended to limit the scope of protection of this application.

[0069] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A rotating assembly, characterized in that, include: Sleeve; A rotating shaft is disposed within the inner cavity of the sleeve; The compression block structure includes a first stepped structure on the inner wall of the sleeve and a second stepped structure on the rotating shaft. A first annular receiving cavity is formed between the first stepped structure and the second stepped structure. The compression block structure is disposed on the second stepped structure and connected to the sleeve. A first sealing structure is provided in the first annular receiving cavity between the sleeve and the rotating shaft; the first sealing structure includes a first sealing ring and a second sealing ring; the first sealing ring surrounds the rotating shaft, and a first groove is provided on the side of the first sealing ring opposite to the rotating shaft; the second sealing ring surrounds the side of the first sealing ring opposite to the rotating shaft and is located in the first groove; The second step structure of the rotating shaft presses the first sealing structure together with the pressure block structure, and the first sealing ring deforms in the radial direction of the rotating shaft.

2. The rotating assembly according to claim 1, characterized in that, A second groove is also provided on the side surface of the first sealing ring that contacts the first stepped structure, or on the surface that contacts the pressure block structure. The first sealing structure also includes a third sealing ring, which is located in the second groove.

3. The rotating assembly according to claim 1, characterized in that, It also includes a first channel, which comprises a sleeve radial section and a shaft radial section; The rotating assembly includes two first sealing structures, namely a first upper sealing structure and a first lower sealing structure; the rotating assembly also includes a support ring; the axial end face of the support ring is provided with protrusions relative to the outer side and the inner side of the circumferential sidewall; the circumferential sidewall of the support ring is provided with a plurality of through holes; the first upper sealing structure is located between the support ring and the first stepped structure; the first lower sealing structure is located between the support ring and the pressure block structure; The radial section of the sleeve is connected to the radial section of the rotating shaft through the first annular receiving cavity.

4. The rotating assembly according to claim 2, characterized in that, The second groove is located near the support surface of the rotating shaft, which is lower than the support surface away from the rotating shaft.

5. The rotating assembly according to claim 3, characterized in that, The rotating assembly includes a platform; the support shaft of the platform is connected to the rotating shaft; The first channel includes a vacuum adsorption channel; the vacuum adsorption channel includes a radial section of a vacuum adsorption sleeve, a radial section of a vacuum adsorption shaft, an axial section of a vacuum adsorption shaft, and an axial section of a vacuum adsorption stage; one end of the axial section of the vacuum adsorption shaft is connected to the radial section of the vacuum adsorption shaft; the other end of the axial section of the vacuum adsorption shaft is connected to the axial section of the vacuum adsorption stage. And / or, The first channel includes an inlet channel and an outlet channel; the inlet channel includes a radial section of an inlet sleeve, a radial section of an inlet shaft, an axial section of an inlet shaft, and an axial section of an inlet platform; the outlet channel includes a radial section of an outlet sleeve, a radial section of an outlet shaft, an axial section of an outlet shaft, and an axial section of an outlet platform. One end of the axial section of the liquid inlet shaft is connected to the radial section of the liquid inlet shaft; the other end of the axial section of the liquid inlet shaft is connected to the axial section of the liquid inlet platform; one end of the axial section of the liquid outlet shaft is connected to the radial section of the liquid outlet and liquid inlet shafts; the other end of the axial section of the liquid outlet shaft is connected to the axial section of the liquid outlet platform.

6. The rotating assembly according to claim 3, characterized in that, It also includes a second channel, which includes an inlet channel and an outlet channel; The liquid inlet channel includes a radial section of an inlet sleeve, a radial section of an inlet rotating shaft, an axial section of an inlet rotating shaft, and an axial section of an inlet platform; the liquid outlet channel includes a radial section of an outlet sleeve, a radial section of an outlet rotating shaft, an axial section of an outlet rotating shaft, and an axial section of an outlet platform; one end of the axial section of the inlet rotating shaft is connected to the radial section of the inlet rotating shaft; the other end of the axial section of the inlet rotating shaft is connected to the axial section of the inlet platform; one end of the axial section of the outlet rotating shaft is connected to the radial section of the inlet rotating shaft; the other end of the axial section of the outlet rotating shaft is connected to the axial section of the outlet platform. The sleeve and / or the rotating shaft are provided with a third groove to form a second annular accommodating cavity between the sleeve and the rotating shaft; the radial section of the liquid inlet sleeve is connected to the radial section of the liquid inlet rotating shaft through the second annular accommodating cavity; the radial section of the liquid outlet sleeve is connected to the radial section of the liquid outlet rotating shaft through the second annular accommodating cavity. Along the axial direction of the rotating shaft, dynamic sealing assemblies or O-ring assemblies are provided on both sides of the second annular receiving cavity.

7. The rotating assembly according to claim 5 or 6, characterized in that, The sleeve includes a first sleeve and a second sleeve; the rotating shaft includes a first rotating shaft and a second rotating shaft, the first rotating shaft being rotatably disposed in the first sleeve, and the second rotating shaft being rotatably disposed in the second sleeve and connected to the first rotating shaft; The sleeve radial section and the rotating shaft radial section of the first channel are respectively disposed on the first sleeve and the first rotating shaft; The rotating assembly includes a second channel, which includes an inlet channel and an outlet channel. The inlet channel includes a radial section of an inlet sleeve and a radial section of an inlet shaft. The outlet channel includes a radial section of an outlet sleeve and a radial section of an outlet shaft. The radial sections of the inlet sleeve and the outlet sleeve are disposed on the second sleeve, and the radial sections of the inlet shaft and the outlet shaft are disposed on the second shaft.

8. The rotating assembly according to claim 3, characterized in that, The rotating assembly also includes a connecting pipe connected to the sleeve, the connecting pipe being used to connect the reaction chamber and the inner cavity of the sleeve; The sleeve has an air inlet that connects to the inner cavity of the sleeve for blowing gas into the inner cavity of the sleeve.

9. The rotating assembly according to claim 3, characterized in that, The rotating assembly also includes a connecting pipe connected to the sleeve, the connecting pipe being used to connect the reaction chamber and the inner cavity of the sleeve; The connecting pipe is a flexible pipe or a telescopic pipe, and the sleeve is provided with a lifting drive assembly, which drives the sleeve to move closer to and away from the reaction chamber.

10. The rotating assembly according to claim 7, characterized in that, The rotating assembly includes a platform; the support shaft of the platform is connected to the first rotating shaft; multiple sealing rings are provided on the two end faces of the first rotating shaft that are respectively connected to the platform and the second rotating shaft, one of the multiple sealing rings is used to seal the mating end face of the first rotating shaft and the platform, and the remaining sealing rings are used to seal the mating interfaces of different channels.

11. A semiconductor process apparatus, characterized in that, It includes a reaction chamber and a rotating assembly as described in any one of claims 1-10.

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