Wafer encapsulation wet process equipment vertical rotation mechanism
By designing a vertical rotation mechanism for wet wafer packaging equipment, the problem of uneven operation in the static state of the wafer was solved, and uniform rotation of the wafer was achieved, improving the efficiency of operations such as electroplating, developing, etching and resist removal.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU HAOSHEN INTELLIGENT TECH CO LTD
- Filing Date
- 2025-04-16
- Publication Date
- 2026-06-02
AI Technical Summary
In existing wafer packaging wet process equipment, the static state of the wafer during vertical operation leads to poor uniformity in operations such as electroplating, developing, etching, and resist removal. Furthermore, when the equipment stability deteriorates, it can easily cause repetitive product defects.
Design a vertical rotation mechanism for a wet wafer packaging equipment. The mechanism consists of a bottom grooved wheel and a side grooved wheel on the hanger, which together drive the wafer to rotate via a drive motor, ensuring uniformity and stability.
It achieves uniform rotation of wafers, improves the uniformity of operations such as electroplating, developing, etching and resist removal, and reduces product defect rate.
Smart Images

Figure CN224319835U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to wet processing equipment for wafer packaging, specifically to a vertical rotation mechanism for wet processing equipment for wafer packaging. Background Technology
[0002] During wet processing of wafer packaging, there are usually two ways to place the wafer depending on the different process requirements: one is horizontal, where the wafer surface is parallel to the liquid surface, and the other is vertical, where the wafer surface is perpendicular to the liquid surface at 90°.
[0003] Currently, vertical processing is the primary method because it offers several advantages, such as thorough chemical circulation and exchange on the wafer surface, and easy removal of byproducts. Its main disadvantage is poorer process uniformity; for example, there is a concentration gradient of the chemical solution between the upper and lower parts of the wafer, leading to differences in etching rate and electroplating deposition efficiency. Vertical processing units are further categorized into single-wafer and multi-wafer types based on the number of wafers processed in a single batch.
[0004] Currently, wafers are processed vertically. Single wafers are mounted on racks and then sealed or secured using other methods. Multiple wafers are placed vertically within a wafer carrier, where they are all stationary. This stationary state can negatively impact the uniformity of electroplating, developing, etching, and resist removal processes due to the wafer's placement. Specifically:
[0005] During electroplating, due to system errors from long-term operation, mechanical wear, improper installation, etc., the center plane of the wafer may not be parallel to the center plane of the anode plate, the uniform flow honeycomb plate, and the electric field line shielding edge. If not properly adjusted, the electroplating uniformity will deteriorate and will always be biased to one side.
[0006] Furthermore, if the components are not positioned correctly during development, desizing, and cleaning, uneven development, incomplete desizing, and inadequate cleaning will occur.
[0007] The main cause of the above problems is that the wafers remain stationary in the chemical solution. Once the equipment stability deteriorates, it will cause repetitive product defects. Utility Model Content
[0008] The purpose of this invention is to provide a vertical rotation mechanism for a wafer packaging wet process equipment to solve the above-mentioned problems.
[0009] To achieve the above objectives, this utility model provides the following technical solution: a vertical rotation mechanism for a wafer packaging wet process equipment, including a hanger, which has a bottom grooved wheel and two oppositely distributed side grooved wheels rotatably arranged on its front side, and the two side grooved wheels and the bottom grooved wheel together form a support mechanism to support the placed wafer.
[0010] It also includes a drive motor for driving any of the bottom wheel or side wheel drives;
[0011] The mounting fixture has a circular hole, the diameter of which is larger than the diameter of the wafer.
[0012] Preferably, there are two bottom grooved wheels, and their axes are on the same horizontal plane.
[0013] Preferably, a drive shaft mounting bracket is fixedly installed on the hanger, and ceramic bearings are fixedly installed in the ports at both ends of the drive shaft mounting bracket;
[0014] It also includes a shaft core, which is fixedly mounted on the inner ring of the ceramic bearing, while a bottom groove wheel is inserted into the shaft core, and a first positioning screw, which is threaded through the side wall of the bottom groove wheel, passes through a through hole opened in the shaft core.
[0015] Preferably, a transmission gear is inserted into the other end of the shaft core, and a second positioning screw threaded to the side wall of the transmission gear passes through a through hole opened on the shaft core;
[0016] A rotating gear is fixedly installed on the output end of the drive motor fixedly mounted on the hanger, and the rotating gear meshes with the transmission gears on both sides.
[0017] Preferably, gaskets are provided on the port sections at both ends of the drive shaft fixing seat.
[0018] In the above technical solution, the vertical rotation mechanism of the wafer packaging wet process equipment provided by this utility model has the following beneficial effects: the wafer is inserted between two side wing groove wheels, and then supported by the bottom groove wheel, thereby realizing the suspension of the wafer. At this time, the bottom groove wheel or the side wing groove wheel can be driven by the drive motor to make the wafer rotate at a predetermined speed, which facilitates subsequent operations such as electroplating, developing, etching, and resist removal. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.
[0020] Figure 1 This is a schematic diagram of the front view structure provided for an embodiment of the present utility model;
[0021] Figure 2 This is a schematic diagram of the rear view structure provided for an embodiment of the present utility model;
[0022] Figure 3 This is a schematic diagram of the relevant structure of the drive shaft fixing seat provided in the embodiment of this utility model;
[0023] Figure 4 Provided for the embodiments of this utility model Figure 4 Cross-sectional structural diagram.
[0024] Explanation of reference numerals in the attached figures:
[0025] 1. Hanger; 11. Round hole; 2. Bottom grooved wheel; 3. Side grooved wheel; 4. Drive shaft fixing seat; 41. Ceramic bearing; 5. Shaft core; 51. First positioning screw; 52. Second positioning screw; 6. Drive gear; 7. Rotary gear; 8. Washer. Detailed Implementation
[0026] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.
[0027] like Figure 1-4 As shown, a vertical rotation mechanism for a wafer packaging wet process includes a hanger 1, which has a bottom grooved wheel 2 and two oppositely distributed side grooved wheels 3 rotatably arranged on its front side. The two side grooved wheels 3 and the bottom grooved wheel 2 together form a support mechanism to support the placed wafer.
[0028] It also includes a drive motor, which is used to drive either the bottom groove wheel 2 or the side wing groove wheel 3.
[0029] The mounting bracket 1 has a circular hole 11, the diameter of which is larger than the diameter of the wafer.
[0030] In the above technology, the wafer is inserted between the two side grooved rollers 3 and then supported by the bottom grooved roller 2 to suspend the wafer. At this time, the bottom grooved roller 2 or the side grooved rollers 3 can be driven by the drive motor to keep the wafer rotating at a predetermined speed, which facilitates subsequent operations such as electroplating, developing, etching, and resist removal.
[0031] As a further embodiment of this utility model, the number of bottom grooved wheels 2 is two, and the axes of the two wheels are on the same horizontal plane.
[0032] As a further embodiment of this utility model, a drive shaft fixing seat 4 is fixedly installed on the hanger 1, and ceramic bearings 41 are fixedly installed in the ports at both ends of the drive shaft fixing seat 4. Furthermore, this embodiment also includes a shaft core 5, which is fixedly installed on the inner ring of the ceramic bearings 41, and a bottom grooved wheel 2 is inserted into the shaft core 5, with a first positioning screw 51 threaded through the side wall of the bottom grooved wheel 2 passing through a through hole in the shaft core 5. A drive gear 6 is inserted into the other end of the shaft core 5, and a second positioning screw 52 threaded through the side wall of the drive gear 6 passes through a through hole in the shaft core 5. A rotating gear 7 is fixedly installed on the output end of the drive motor fixedly installed on the hanger 1, and the rotating gear 7 meshes with the drive gears 6 on both sides.
[0033] The drive shaft mounting base 4 is directly welded to the hanger 1. The drive motor drives the rotating gear 7 to rotate, which in turn drives the drive gears 6 on both sides to rotate, thereby causing the bottom grooved wheel 2 to rotate synchronously, thus driving the wafer to rotate.
[0034] Furthermore, a shim 8 is inserted into the shaft core 5, and the shim is located between the drive shaft fixing seat 4 and the bottom groove wheel 2 and drive gear 6 to prevent premature wear and increase service life. This is located below the wafer.
[0035] Both the bottom groove wheel 2 and the side groove wheel 3 are made of hard rubber, so they have better friction when in contact with the wafer, resulting in smoother and more stable rotation without jamming.
[0036] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.
Claims
1. A vertical rotation mechanism for a wafer packaging wet process equipment, characterized in that, The device includes a mounting bracket (1), which has a bottom grooved wheel (2) and two oppositely distributed side grooved wheels (3) on its front side. The two side grooved wheels (3) and the bottom grooved wheel (2) together form a support mechanism to support the placed wafer. It also includes a drive motor for driving any of the bottom groove wheel (2) or side groove wheel (3); The mounting bracket (1) has a circular hole (11) with a diameter larger than that of the wafer. The number of bottom grooved wheels (2) is two, and their axes are on the same horizontal plane; A drive shaft mounting base (4) is fixedly installed on the hanger (1), and ceramic bearings (41) are fixedly installed in the ports at both ends of the drive shaft mounting base (4). It also includes a shaft core (5), which is fixedly installed on the inner ring of the ceramic bearing (41), while the bottom groove wheel (2) is inserted into the shaft core (5), and the first positioning screw (51) connected by the thread on the side wall of the bottom groove wheel (2) passes through the through hole opened on the shaft core (5); The other end of the shaft core (5) is connected to a transmission gear (6), and the second positioning screw (52) threaded to the side wall of the transmission gear (6) passes through the through hole opened on the shaft core (5). A rotating gear (7) is fixedly installed on the output end of the drive motor fixedly mounted on the hanger (1), and the rotating gear (7) meshes with the transmission gears (6) on both sides. Gaskets (8) are respectively provided on the port sections at both ends of the drive shaft fixing seat (4).