LED lamp and heat dissipation device thereof

Abstract

The invention relates to an LED lamp and a heat dissipation device thereof. The LED lamp comprises at least one LED lamp bead arranged on the heat dissipation device. The radiating device comprises a circuit board and a radiator. The circuit board is provided with a first metal layer and a second metal layer which are located on two opposite sides respectively, the LED lamp beads are welded to the first metal layer, the second metal layer is welded to the radiator, and the circuit board is provided with a plurality of heat conduction holes so that heat energy generated by the LED lamp beads can be transmitted to the radiator through the heat conduction holes. In addition, part of the heat conduction holes are selectively filled with heat conduction material columns, so that heat energy generated by the LED lamp beads can be conducted to the radiator through the heat conduction material columns in the heat conduction holes.

Description

TECHNICAL FIELD

[0001] The present application relates to a lamp and a heat dissipation device thereof, in particular to a high-heat-dissipation light-emitting diode (LED) lamp and a heat dissipation device thereof. BACKGROUND

[0002] A light-emitting diode (LED) is a semiconductor component, and the light-emitting wavelength of the LED varies depending on the material used. Currently, the photoelectric conversion efficiency of a high-power LED is generally about 15% to 25% of the input power that becomes light, and the rest is converted into heat energy. Since the area of an LED chip is very small, the heat dissipation density per unit area of a high-power LED is very high, even more serious than general IC components, which also greatly increases the junction temperature of the LED chip, easily causing overheating problems. Excessive chip junction temperature will reduce the luminous intensity of the LED, also cause wavelength shift of the LED to affect quality, specifications, and greatly reduce the service life of the LED, so the heat dissipation design of the LED related product is very important.

[0003] The common soldering method for high-power LEDs is to first solder the LED on an aluminum substrate or a copper substrate, and then connect the aluminum substrate or the copper substrate to the heat sink with heat dissipation glue. However, this traditional connection method will pass through the insulating layer on the substrate, so that it cannot achieve good heat conduction and heat dissipation effect.

[0004] PCT patent No. WO2014166113A1 (patent name: high-heat-conduction LED soldering method) discloses a high-heat-conduction LED soldering method, which includes the following steps: soldering the electrode of the LED on the circuit board with high-temperature solder; and soldering the heat dissipation plate of the LED directly on the heat dissipation device with low-temperature solder. The heat dissipation plate of the LED directly contacts the heat dissipation device, so that the LED has good heat conduction and heat dissipation effect. However, the method disclosed in this patent greatly increases the difficulty and process cost of manufacturing the circuit board.

[0005] In addition, Taiwan patent No. TW201248947A (patent name: heat dissipation device for light-emitting diode device) discloses that a plurality of heat conduction lines are arranged on the circuit board, the heat conduction lines are connected to the heat conduction area of the LED, the circuit board and the heat dissipation plate are locked together by screws, and the screws are in contact with the heat dissipation lines of the LED. The heat conduction path of this patent is: LED heat conduction area, circuit board line, screw, and heat dissipation plate. However, this heat conduction method is limited by the small area of the heat dissipation line and the screw, so that the heat dissipation effect is limited. SUMMARY

[0006] Therefore, in order to solve the problem of LED specification, quality and short life caused by excessive heat generation, the present application provides an LED lamp and a heat dissipation device. The present application uses a material with high thermal conductivity such as solder or silver glue and a heat conduction hole to replace the traditional heat dissipation glue and screw, so that the solder / silver glue is directly connected to the heat sink to achieve effective heat dissipation. Compared with the prior art, the circuit board of the present application can achieve good heat dissipation effect with commercially available circuit boards, without complex circuit design and high process cost.

[0007] To achieve the foregoing object, the present application provides an LED lamp comprising at least one LED lamp bead; and a heat dissipation device, wherein the LED lamp bead is arranged on the heat dissipation device to remove a heat energy generated by the LED lamp bead through the heat dissipation device.

[0008] To achieve the foregoing object, the present application further provides a heat dissipation device suitable for removing a heat energy generated by at least one LED lamp bead, comprising: a circuit board having at least one first metal layer and at least one second metal layer located on two opposite sides, the circuit board having at least one heat conduction hole, wherein the first metal layer of the circuit board is connected to a heat dissipation base of the LED lamp bead through a first heat conduction material layer, so that the heat energy generated by the LED lamp bead is transmitted from the heat dissipation base to the second metal layer of the circuit board through the first heat conduction material layer, the first metal layer and the heat conduction hole; and a heat sink, wherein the second metal layer of the circuit board is connected to the heat sink through a second heat conduction material layer, so that the heat energy of the LED lamp bead is conducted from the second metal layer to the heat sink through the second heat conduction material layer.

[0009] Wherein the area of the second metal layer of the circuit board is at least greater than the area of the second metal layer of the circuit board connected to the heat sink through the second heat conduction material layer.

[0010] Wherein the position of the heat conduction hole formed on the circuit board is in the area where the heat dissipation base of the LED lamp bead is connected to the first metal layer of the circuit board through the first heat conduction material layer.

[0011] Wherein the heat conduction hole is filled with at least one heat conduction material column connecting the first heat conduction material layer and the second heat conduction material layer, so as to conduct the heat energy generated by the LED lamp bead from the first heat conduction material layer to the second heat conduction material layer through the heat conduction material column.

[0012] Wherein the material of the first heat conduction material layer, the second heat conduction material layer and / or the heat conduction material column is selected from a group consisting of solder and silver glue.

[0013] Wherein the material of the first heat conduction material layer, the second heat conduction material layer and / or the heat conduction material column is a heat-conducting adhesive.

[0014] The heat-conducting hole forms a third metal layer on the inner wall of the circuit board, connecting the first metal layer and the second metal layer. The heat generated by the LED bead is conducted from the heat dissipation base through the first thermally conductive material layer, the first metal layer, the heat-conducting hole, and the third metal layer in the heat-conducting hole to the second metal layer of the circuit board.

[0015] The circuit board is a copper foil circuit board, and the first metal layer and / or the second metal layer are copper foils respectively.

[0016] The radiator is made of pure copper.

[0017] The radiator can be a copper pillar heat sink, a water-cooled radiator, a fan-assisted copper pillar heat sink, or a fan-assisted water-cooled radiator.

[0018] The number of heat-conducting holes is multiple, and each of the multiple first heat-conducting holes is filled with a column of heat-conducting material, while the multiple second heat-conducting holes are hollow.

[0019] The first thermally conductive holes are formed on the circuit board in a region where the heat dissipation base of the LED bead is connected to the first metal layer of the circuit board via the first thermally conductive material layer, and the second thermally conductive holes are formed on the circuit board outside the region where the heat dissipation base of the LED bead is connected to the first metal layer of the circuit board via the first thermally conductive material layer.

[0020] The circuit board is either a double-layer board or a multi-layer board.

[0021] To achieve the aforementioned objective, the present invention further proposes a heat dissipation device suitable for removing heat generated by at least one LED chip, comprising: a copper foil circuit board having at least one first copper foil and at least one second copper foil located on two opposite sides, the LED chip being soldered to the first copper foil; and a heat sink being soldered to the second copper foil, the copper foil circuit board having at least one copper-plated heat-conducting hole, thereby allowing the heat generated by the LED chip to be transferred to the heat sink through the copper-plated heat-conducting hole.

[0022] The area of ​​the second copper foil is larger than the area of ​​the second copper foil that is soldered to the heat sink.

[0023] The number of the at least one copper-plated heat-conducting hole is multiple, and among the multiple copper-plated heat-conducting holes, only at least one first copper-plated heat-conducting hole located in the welding area between the heat sink and the second copper foil is filled with solder or silver paste.

[0024] Among the plurality of copper-plated heat-conducting holes, at least one of the second copper-plated heat-conducting holes located outside the welding area between the heat sink and the second copper foil is not filled with solder or silver paste.

[0025] As described above, the LED lamp and its heat dissipation device of the present invention have the following advantages:

[0026] (1) The present invention uses materials with high thermal conductivity, such as solder or silver paste, and is equipped with heat-conducting holes to replace traditional heat dissipation glue and screws, so that the solder / silver paste is directly connected to the heat sink to achieve effective heat dissipation, thereby improving the heat dissipation effect.

[0027] (2) Compared with the prior art, the circuit board of the present invention can achieve good heat dissipation effect with commercially available circuit boards, without the need for complex circuit design and excessively high process costs.

[0028] (3) The copper foil circuit board of the heat dissipation device of the present invention may have copper-plated heat conduction holes, some of which are filled with heat conduction material pillars to connect the LED beads and the heat sink, and some of which are not filled with heat conduction material pillars. In this way, the present invention can provide a first type of heat conduction path and a second type of heat conduction path, so that the LED lamp becomes a high heat dissipation LED lamp.

[0029] (4) The first type of heat conduction path provided by the present invention is in the following order: (a) heat dissipation base of LED lamp bead, (b) first thermally conductive material layer / first metal layer / third metal layer / thermally conductive material pillar below the heat dissipation base, (c) second thermally conductive material layer / second metal layer on the other side of the circuit board and (d) heat sink. The second type of heat conduction path is in the following order: (a) heat dissipation base, (b) first thermally conductive material layer / first metal layer below the heat dissipation base, (c) thermally conductive hole around the heat dissipation base / third metal layer in the thermally conductive hole, (d) second thermally conductive material layer / second metal layer on the other side of the circuit board and (e) heat sink.

[0030] (5) The heat dissipation device of the present invention allows the first thermally conductive material layer and the second thermally conductive material layer to be directly connected to the LED chip and the heat sink, respectively. Furthermore, the first thermally conductive material layer and the second thermally conductive material layer can be connected to each other via thermally conductive material pillars and / or the first metal layer, the second metal layer, and the third metal layer of the circuit board. The LED lamp of the present invention achieves effective heat dissipation and improves the heat dissipation effect by allowing the LED chip and the heat sink to be directly connected, for example, with solder / silver paste.

[0031] (6) The area of ​​the second metal layer of the circuit board is larger than the area of ​​the second metal layer of the circuit board connected to the heat sink through the second thermally conductive material layer, thereby improving the heat dissipation effect.

[0032] (7) The heat-conducting material pillars are located in the connection area between the LED beads and the circuit board (e.g., the soldering area) and in the connection area between the heat sink and the circuit board (e.g., the soldering area), thereby improving the heat dissipation effect.

[0033] (8) The LED lamp of the present invention can be a high-power LED lamp.

[0034] To enable you to have a better understanding of the technical features and effects of this invention, preferred embodiments and detailed descriptions are provided below. Attached Figure Description

[0035] Figure 1 This is a cross-sectional schematic diagram of the LED lamp beads of the LED lamp of the present invention disposed on the heat dissipation device.

[0036] Figure 2 This is a schematic diagram of the heat conduction of the LED beads of the LED lamp of the present invention disposed on the heat dissipation device.

[0037] Figure 3 This is a cross-sectional schematic diagram of the LED lamp beads of the LED lamp of the present invention disposed on a heat dissipation device, wherein the heat dissipation device has a water-cooled heat sink.

[0038] Figure 4 This is a three-dimensional schematic diagram of the LED lamp beads of the LED lamp of the present invention disposed on the heat dissipation device.

[0039] Figure 5 This is a three-dimensional schematic diagram of the heat dissipation device for the LED lamp of the present invention.

[0040] Explanation of reference numerals in the attached figures:

[0041] 10: LED lights

[0042] 20: LED beads

[0043] 22: LED Chip

[0044] 24: Cover

[0045] 26: Heat dissipation base

[0046] 30: Heat dissipation device

[0047] 40: Circuit board

[0048] 41: Substrate

[0049] 42: First metal layer

[0050] 43: Screw hole

[0051] 44: Second metal layer

[0052] 46: Heat conduction holes

[0053] 46a: First heat conduction hole

[0054] 46b: Second heat-conducting hole

[0055] 48: Third metal layer

[0056] 50: Thermally conductive material column

[0057] 60: Radiator

[0058] 62: Water cooling block

[0059] 64: Channel pipe

[0060] 66: Heat exchanger

[0061] 70: First thermally conductive material layer

[0062] 80: Second thermally conductive material layer

[0063] P1: Type I heat conduction path

[0064] P2: Type II heat conduction path Detailed Implementation

[0065] To facilitate understanding of the technical features, content, advantages, and effects of this invention, the invention is described in detail below with reference to accompanying drawings and embodiments. The drawings used are for illustrative purposes only and do not necessarily represent the actual scale and precise configuration of the invention. Therefore, the scale and configuration of the accompanying drawings should not be used to interpret or limit the scope of the invention in actual implementation. Furthermore, for ease of understanding, the same elements in the following embodiments are indicated by the same symbols.

[0066] Furthermore, unless otherwise specified, the terms used throughout this specification and claims generally have their ordinary meaning in the context of this art, the disclosure herein, and the specific content. Certain terms used to describe the invention will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing the invention.

[0067] The use of terms such as "first," "second," and "third" in this document does not specifically refer to any order or sequence, nor is it intended to limit the invention. Rather, it is merely used to distinguish components or operations described using the same technical terms.

[0068] Secondly, when this article uses terms such as "contains", "includes", "has", or "contains", these are all open-ended terms, meaning that they include but are not limited to.

[0069] Figure 1This is a cross-sectional schematic diagram of the LED lamp beads of the LED lamp of the present invention disposed on the heat dissipation device. Figure 2 This is a schematic diagram of the heat conduction of the LED beads of the LED lamp of the present invention disposed on the heat dissipation device. Figure 3 This is a cross-sectional schematic diagram of the LED lamp beads of the LED lamp of the present invention disposed on a heat dissipation device, wherein the heat dissipation device has a water-cooled heat sink. Figure 4 This is a three-dimensional schematic diagram of the LED lamp beads of the LED lamp of the present invention disposed on the heat dissipation device. Figure 5 This is a three-dimensional schematic diagram of the heat dissipation device for the LED lamp of the present invention.

[0070] Please see Figures 1 to 5 An LED lamp 10 according to the present invention includes LED beads 20 and a heat dissipation device 30, wherein the LED beads 20 are disposed on the heat dissipation device 30. The heat dissipation device 30 includes a circuit board 40 and a heat sink 60. The heat dissipation device 30 is suitable for dissipating the heat generated by at least one LED bead 20 to the external environment through the circuit board 40 and the heat sink 60, thereby making the LED lamp 10 a high heat dissipation LED lamp. The number of LED beads 20 can be one or more. For ease of explanation of the operation of the present invention, the present invention uses an LED bead 20 in which the LED chip 22 is disposed on a heat dissipation base 26 and covered by a cover 24 as an example, but it is not limited thereto. The LED beads 20 of the LED lamp 10 used in the present invention are not limited to a specific type, structure and circuit configuration. They can be appropriately modified or replaced according to actual needs, for example, omitting the cover 24 and / or the heat dissipation base 26 or replacing them with other structures, and can also selectively use commercially available LED beads 20 of various types, structures and circuit configurations.

[0071] The heat dissipation device 30 of the present invention has a circuit board 40 with at least one first metal layer 42 and at least one second metal layer 44 located on opposite sides, for example, the first metal layer 42 and the second metal layer 44 located on opposite sides of the substrate 41 of the circuit board 40. The circuit board 40 of the heat dissipation device 30 of the present invention has at least one heat-conducting hole 46, for example, one or more heat-conducting holes 46, which penetrate the substrate 41 and selectively penetrate the first metal layer 42 and the second metal layer 44. A third metal layer 48 may be selectively formed on the inner wall of the heat-conducting hole 46 to connect the first metal layer 42 and the second metal layer 44, thereby making the heat-conducting hole 46 a metal-plated heat-conducting hole. The circuit board 40 is, for example, a copper foil circuit board. The first metal layer 42 and / or the second metal layer 44 are, for example, copper foil, and the third metal layer 48 is copper foil, making the heat-conducting holes 46 copper-plated heat-conducting holes. The heat-conducting holes 46 can be selectively arranged in an array, but are not limited thereto. As long as the heat dissipation effect of the present invention can be achieved, any material or structure falls within the scope of protection claimed by the present invention. Furthermore, the circuit board 40, the first metal layer 42, the second metal layer 44, and the third metal layer 48 of the present invention are not limited to specific sizes or thicknesses. Similarly, the aperture of the heat-conducting holes 46 or the distance between two heat-conducting holes 46 is not particularly limited. As long as the heat dissipation effect of the present invention can be achieved, any size or aperture falls within the scope of protection claimed by the present invention.

[0072] The circuit board 40 of the heat dissipation device 30 of the present invention can be, for example, a commercially available printed circuit board, and can be, for example, a double-layer board or a multi-layer board. Therefore, the shape of the substrate 41 of the circuit board 40 can be changed accordingly depending on the shape of the circuit board 40. Taking a commercially available double-layer board as an example, two metal layers (e.g., copper foil) are covered on two opposite sides of the substrate 41. The substrate 41 is, for example, a dielectric material layer such as a fiberglass board, an epoxy resin board, or a composite board thereof. Taking a commercially available multi-layer board as an example, two metal layers (e.g., copper foil) are covered on two opposite sides of the substrate 41, and the substrate 41 includes multiple intermediate layers, such as the aforementioned stacked structure of multiple dielectric material layers and multiple metal layers, and has multiple metal-plated heat-conducting holes located between the same or different stacked layers. Since those skilled in the art should understand how commercially available circuit boards and / or commercially available LED beads are implemented to achieve the technical effects of the present invention based on the disclosure of the present invention, further details are omitted here. In addition, the circuit board 40 may optionally have other structures, such as screw holes 43, which may allow the circuit board 40 to be secured to other objects (not shown).

[0073] One feature of this invention is that at least one heat-conducting hole 46 is formed on the circuit board 40 to improve heat dissipation. In one embodiment, the heat-conducting hole 46 is formed on the circuit board 40 at, for example, the area where the heat dissipation base 26 of the LED bead 20 is connected to the first metal layer 42 of the circuit board 40 via the first thermally conductive material layer 70. For example, if the material of the first thermally conductive material layer 70 is solder, the location of the heat-conducting hole 46 of the circuit board 40 can be, for example, in the welding area between the LED bead 20 and the first metal layer 42, whereby the heat-conducting hole 46 in this welding area can be partially or completely covered with solder, and may even be connected, for example, to the second metal layer 44 located on the other side of the circuit board 40. Preferably, the heat-conducting hole 46 covered with solder is only located in the welding area between the LED bead 20 and the first metal layer 42, that is, the heat-conducting hole 46 outside the welding area is preferably not covered with solder, thereby avoiding conductivity.

[0074] The first metal layer 42 of the circuit board 40 of the heat dissipation device 30 of the present invention is connected to the heat dissipation base 26 of the LED chip 20 via a first thermally conductive material layer 70, so that the heat generated by the LED chip 20 can be dissipated along the heat dissipation base 26 of the LED chip 20. Figure 2 The second type of heat conduction path P2 shown here conducts heat from the heat sink 26 through the first thermally conductive material layer 70, the first metal layer 42, and the third metal layer 48 in the thermally conductive hole 46 to the second metal layer 44 of the circuit board 40. Specifically, the sequence of the second type of heat conduction path P2 provided by the present invention is as follows: (a) the heat sink 26 of the LED bead 20, (b) the first thermally conductive material layer 70 / first metal layer 42 below the heat sink 26, (c) the third metal layer 48 in the thermally conductive hole 46 around the heat sink 26, (d) the second thermally conductive material layer 80 / second metal layer 44 on the other side of the circuit board 40, and (e) the heat sink 60.

[0075] In this embodiment, at least one thermally conductive material pillar 50 is selectively filled in the aforementioned thermally conductive hole 46 to connect the first thermally conductive material layer 70 and the second thermally conductive material layer 80, for use along... Figure 2The first type of heat conduction path P1 shown conducts heat generated by the LED chip 20 from the first thermally conductive material layer 70 to the second thermally conductive material layer 80 via thermally conductive material pillars 50 (or, for example, via the first metal layer 42, thermally conductive material pillars 50 / third metal layer 48 and second metal layer 44). The thermally conductive material pillars 50 are located in the thermally conductive holes 46 (e.g., protruding further to the outside of one or both ends of the thermally conductive holes 46), and the thermally conductive holes 46 are formed on the circuit board 40, for example, in the region where the heat sink base 26 of the LED chip 20 connects to the first metal layer 42 of the circuit board 40 via the first thermally conductive material layer 70. For example, assuming the first thermally conductive material layer 70 is made of solder, the thermally conductive material pillars 50 formed in the thermally conductive holes 46 on the circuit board 40 are located in the welding region between the LED chip 20 and the first metal layer 42. The thermally conductive material pillar 50 is preferably positioned between the LED bead 20 and the heat sink 60, for example, on the soldering area between the heat sink base 26 of the LED bead 20 and the circuit board 40, and on the soldering area between the heat sink 60 and the circuit board 40. This allows the heat generated by the LED bead 20 to be directly conducted from the heat sink base 26 to the heat sink 60. Specifically, the sequence of the first type of heat conduction path P1 provided by the present invention is (a) the heat sink base 26 of the LED bead 20, (b) the first thermally conductive material layer 70 / first metal layer 42 / third metal layer 48 / thermally conductive material pillar 50 below the heat sink base 26, (c) the second thermally conductive material layer 80 / second metal layer 44 on the other side of the circuit board 40, and (d) the heat sink 60.

[0076] The number of heat-conducting holes 46 can be one or more, such as multiple first heat-conducting holes 46a and multiple second heat-conducting holes 46b. The number of thermally conductive material pillars 50 can be one or more, and for example, they are located in all or part of the heat-conducting holes 46. Taking multiple heat-conducting holes 46 and multiple thermally conductive material pillars 50 as an example, the thermally conductive material pillars 50 are preferably only filled in part of the heat-conducting holes 46 (e.g., first heat-conducting holes 46a), and the thermally conductive material pillars 50 are preferably only located in the welding area between the LED bead 20 and the first metal layer 42 to improve heat dissipation. The thermally conductive material pillars 50 are preferably not filled in the other part of the heat-conducting holes 46 (e.g., second heat-conducting holes 46b) to avoid conductivity. The first heat-conducting hole 46a is preferably located in the welding area between the heat sink 60 and the circuit board 40, and in the welding area between the heat sink base 26 and the circuit board 40. The second heat-conducting hole 46b is preferably located on the soldering area between the heat sink 60 and the circuit board 40, but outside the soldering area between the heat sink base 26 and the circuit board 40. In the LED lamp 10 of the present invention, the first heat-conducting hole 46a and the heat-conducting material pillar 50 are, for example, distributed below the heat sink base 26 of the LED lamp bead 20, and the second heat-conducting hole 46b is, for example, distributed around the heat sink base 26 of the LED lamp bead 20. The materials of the first heat-conducting material layer 70, the second heat-conducting material layer 80, and / or the heat-conducting material pillar 50 are, for example, thermally conductive adhesives, such as solder or silver paste, or other high thermal conductivity solders, but are not limited thereto. Silver paste may, for example, have high thermal conductivity.

[0077] The heat dissipation device 30 of the present invention further includes a heat sink 60, which is made of, for example, pure copper metal. The second metal layer 44 of the circuit board 40 is connected to the heat sink 60 via the aforementioned second thermally conductive material layer 80, thereby allowing the heat energy of the LED bead 20 to be conducted from the second metal layer 44 to the heat sink 60 along the aforementioned first type of heat conduction path P1 and / or second type of heat conduction path P2. Taking the second thermally conductive material layer 80 as an example, the second metal layer 44 of the circuit board 40 is soldered to the heat sink 60 via the second thermally conductive material layer 80. Preferably, the area of ​​the second metal layer 44 needs to be larger than the area of ​​the soldering area between the second metal layer 44 and the heat sink 60, for example, such as... Figures 1 to 3As shown, the second metal layer 44 protrudes beyond the aforementioned welding area. The LED lamp 10 of this invention allows the heat dissipation base 26 of the LED chip 20 and the heat sink 60 of the heat dissipation device 30 to be directly connected to the first thermally conductive material layer 70 and the second thermally conductive material layer 80, respectively. The first thermally conductive material layer 70 and the second thermally conductive material layer 80 can be connected to each other via the thermally conductive material pillar 50 and / or the first metal layer 42, the second metal layer 44, and the third metal layer 48 of the circuit board 40. In other words, the LED lamp 10 of this invention allows the LED chip 20 and the heat sink 60 of the heat dissipation device 30 to be directly connected via solder / silver paste (i.e., the first thermally conductive material layer 70, the second thermally conductive material layer 80, and the thermally conductive material pillar 50), which improves heat dissipation and achieves effective heat dissipation.

[0078] Another feature of this invention is that the circuit board 40 retains a large area of ​​second metal layer 44, wherein the area of ​​the second metal layer 44 of the circuit board 40 is at least larger than the area of ​​the heat sink 60 connected to the second metal layer 44 of the circuit board 40 via the second thermally conductive material layer 80. For example, if the material of the second thermally conductive material layer 80 is solder, the area of ​​the second metal layer 44 of the circuit board 40 is at least larger than the area of ​​the heat sink 60 soldered to the second metal layer 44 of the circuit board 40 via the second thermally conductive material layer 80 (i.e., the area of ​​the soldering area between the second metal layer 44 and the heat sink 60), thereby improving the heat dissipation effect.

[0079] The heat sink 60 may be made of, for example, pure copper, but is not limited to this. The heat sink 60 may be, for example, a copper pillar heat sink, a water-cooled heat sink, a fan-assisted copper pillar heat sink, or a fan-assisted water-cooled heat sink, etc., but is not limited to these. Taking a copper pillar heat sink 60 as an example, the heat sink 60 has multiple copper pillars, thereby allowing the heat generated by the LED chips 20 to be dissipated to the outside through the copper pillars. Taking a water-cooled heat sink 60 (such as...) Figure 3 Taking the water-cooled channel radiator shown as an example, the radiator 60 includes a water cooling head 62, two channel pipes 64, and a heat exchanger 66. The two channel pipes 64 are respectively connected to the heat exchanger 66. The flow direction of the aqueous solution is shown by the arrow. The aqueous solution can transfer the heat energy of the water cooling head 62 to the heat exchanger 66 through one of the two channel pipes 64. After cooling, the aqueous solution flows back to the water cooling head 62 through the other of the two channel pipes 64 for continued recycling. In addition, the radiator 60 of the present invention can also be optionally equipped with a fan (not shown) to form a fan-assisted copper pillar heat sink or a fan-assisted water-cooled radiator.

[0080] In another embodiment of the present invention, an LED lamp 10 and its heat dissipation device 30 are provided. LED beads 20 are disposed on the heat dissipation device 30, which is adapted to dissipate heat generated by at least one LED bead 20. This heat dissipation device 30 includes a copper foil circuit board (i.e., circuit board 40) and a heat sink 60. The copper foil circuit board has a first copper foil (i.e., a first metal layer 42) and a second copper foil (i.e., a second metal layer 44) located on opposite sides. The heat dissipation base 26 of the LED bead 20 is soldered to the first copper foil. At least one copper-plated thermally conductive hole (i.e., thermally conductive hole 46) is passed through the copper foil circuit board and is located at least in the soldering area between the heat dissipation base 26 and the first copper foil. Some of the copper-plated thermally conductive holes absorb solder (i.e., thermally conductive material pillars 50) and connect to the second copper foil on the other side of the copper foil circuit board. Furthermore, some of the copper-plated thermally conductive holes are located around the heat dissipation base 26 of the LED bead 20 and are not filled with solder to avoid conductivity. The second copper foil is connected to the heat sink 60 by solder or high thermal conductivity silver paste, so that the heat generated by the LED chip 20 can be transferred to the heat sink 60 through the copper-plated heat-conducting holes with and without solder adsorption. Figure 2 The first type of heat conduction path P1 and the second type of heat conduction path P2 are shown. Moreover, the area of ​​the second copper foil is preferably larger than the connection area (e.g., welding area) between the second copper foil and the heat sink 60.

[0081] In summary, the LED lamp and its heat dissipation device of the present invention have the following advantages:

[0082] (1) The present invention uses materials with high thermal conductivity, such as solder or silver paste, and is equipped with heat-conducting holes to replace traditional heat dissipation glue and screws, so that the solder / silver paste is directly connected to the heat sink to achieve effective heat dissipation, thereby improving the heat dissipation effect.

[0083] (2) Compared with the prior art, the circuit board of the present invention can achieve good heat dissipation effect with commercially available circuit boards, without the need for complex circuit design and excessively high process costs.

[0084] (3) The copper foil circuit board of the heat dissipation device of the present invention may have copper-plated heat conduction holes, some of which are filled with heat conduction material pillars to connect the LED beads and the heat sink, and some of which are not filled with heat conduction material pillars. In this way, the present invention can provide a first type of heat conduction path and a second type of heat conduction path, so that the LED lamp becomes a high heat dissipation LED lamp.

[0085] (4) The first type of heat conduction path provided by the present invention is in the following order: (a) heat dissipation base of LED lamp bead, (b) first thermally conductive material layer / first metal layer / third metal layer / thermally conductive material pillar below the heat dissipation base, (c) second thermally conductive material layer / second metal layer on the other side of the circuit board and (d) heat sink. The second type of heat conduction path is in the following order: (a) heat dissipation base, (b) first thermally conductive material layer / first metal layer below the heat dissipation base, (c) thermally conductive hole around the heat dissipation base / third metal layer in the thermally conductive hole, (d) second thermally conductive material layer / second metal layer on the other side of the circuit board and (e) heat sink.

[0086] (5) The heat dissipation device of the present invention allows the first thermally conductive material layer and the second thermally conductive material layer to be directly connected to the LED chip and the heat sink, respectively. Furthermore, the first thermally conductive material layer and the second thermally conductive material layer can be connected to each other via thermally conductive material pillars and / or the first metal layer, the second metal layer, and the third metal layer of the circuit board. The LED lamp of the present invention achieves effective heat dissipation and improves the heat dissipation effect by directly connecting the LED chip and the heat sink, for example, with solder / silver paste.

[0087] (6) The area of ​​the second metal layer of the circuit board is larger than the area of ​​the second metal layer of the circuit board connected to the heat sink through the second thermally conductive material layer, thereby improving the heat dissipation effect.

[0088] (7) The heat-conducting material pillars are located in the connection area between the LED beads and the circuit board (e.g., the soldering area) and in the connection area between the heat sink and the circuit board (e.g., the soldering area), thereby improving the heat dissipation effect.

[0089] (8) The LED lamp of the present invention can be a high-power LED lamp.

[0090] The above description is merely illustrative and not restrictive. Any equivalent modifications or alterations made without departing from the spirit and scope of this invention should be included in the appended claims.

Claims

1. A heat dissipation device, characterized in that, Applicable to dissipating heat generated by at least one LED chip, comprising at least: A circuit board having at least one first metal layer and at least one second metal layer located on opposite sides, the circuit board having at least one heat-conducting hole, wherein The first metal layer of the circuit board is connected to a heat sink base of the LED chip via a first thermally conductive material layer, so that the heat generated by the LED chip can be transferred from the heat sink base through the first thermally conductive material layer, the first metal layer and the thermally conductive hole to the second metal layer of the circuit board. as well as A heat sink, wherein the second metal layer of the circuit board is connected to the heat sink via a second thermally conductive material layer, so that the heat energy of the LED bead is conducted from the second metal layer to the heat sink via the second thermally conductive material layer.

2. The heat dissipation device as described in claim 1, characterized in that, The area of ​​one of the second metal layers of the circuit board is at least larger than the area of ​​one of the second metal layers of the circuit board to which the heat sink is connected via the second thermally conductive material layer.

3. The heat dissipation device as described in claim 1, characterized in that, The thermal hole is formed on the circuit board in the area where the heat dissipation base of the LED bead is connected to the first metal layer of the circuit board via the first thermally conductive material layer.

4. The heat dissipation device as described in claim 1 or 3, characterized in that, The heat-conducting hole is filled with at least one heat-conducting material pillar connecting the first heat-conducting material layer and the second heat-conducting material layer, so as to conduct the heat generated by the LED bead from the first heat-conducting material layer to the second heat-conducting material layer via the heat-conducting material pillar.

5. The heat dissipation device as described in claim 4, characterized in that, The materials of the first thermally conductive material layer, the second thermally conductive material layer, and / or the thermally conductive material pillar are respectively selected from a group consisting of solder and silver paste.

6. The heat dissipation device as described in claim 4, characterized in that, The first thermally conductive material layer, the second thermally conductive material layer, and / or the thermally conductive material column are all made of thermally conductive adhesives.

7. The heat dissipation device as described in claim 1, characterized in that, The heat-conducting hole forms a third metal layer on the inner wall of the circuit board, connecting the first metal layer and the second metal layer. The heat generated by the LED bead is conducted from the heat dissipation base through the first thermally conductive material layer, the first metal layer, the heat-conducting hole, and the third metal layer in the heat-conducting hole to the second metal layer of the circuit board.

8. The heat dissipation device as described in claim 1, characterized in that, The circuit board is a copper foil circuit board, and the first metal layer and / or the second metal layer are copper foils respectively.

9. The heat dissipation device as described in claim 1, characterized in that, The radiator is made of pure copper.

10. The heat dissipation device as described in claim 1, characterized in that, The radiator can be a copper pillar heat sink, a water-cooled radiator, a fan-assisted copper pillar heat sink, or a fan-assisted water-cooled radiator.

11. The heat dissipation device as described in claim 1, characterized in that, The number of the heat-conducting holes is multiple, and each of the multiple first heat-conducting holes is filled with a column of heat-conducting material, while the multiple second heat-conducting holes are hollow.

12. The heat dissipation device as described in claim 11, characterized in that, The first thermally conductive holes are formed on the circuit board in a region where the heat dissipation base of the LED bead is connected to the first metal layer of the circuit board via the first thermally conductive material layer, and the second thermally conductive holes are formed on the circuit board outside the region where the heat dissipation base of the LED bead is connected to the first metal layer of the circuit board via the first thermally conductive material layer.

13. The heat dissipation device as described in claim 1, characterized in that, The circuit board is either a double-layer board or a multi-layer board.

14. A heat dissipation device, characterized in that, Suitable for dissipating heat generated by at least one LED chip, including: A copper foil circuit board having at least one first copper foil and at least one second copper foil located on two opposite sides, wherein the LED bead is soldered to the first copper foil; and A heat sink is soldered to the second copper foil, and the copper foil circuit board has at least one copper-plated heat-conducting hole so that the heat generated by the LED bead can be transferred to the heat sink through the copper-plated heat-conducting hole.

15. The heat dissipation device as described in claim 14, characterized in that, The area of ​​the second copper foil is larger than the area of ​​the second copper foil welded to the radiator.

16. The heat dissipation device as described in claim 14, characterized in that, The number of the at least one copper-plated heat-conducting hole is multiple, and among the multiple copper-plated heat-conducting holes, only at least one first copper-plated heat-conducting hole located in the welding area between the heat sink and the second copper foil is filled with solder or silver paste.

17. The heat dissipation device as described in claim 16, characterized in that, Among the plurality of copper-plated heat-conducting holes, at least one of the second copper-plated heat-conducting holes located outside the welding area between the heat sink and the second copper foil is not filled with solder or silver paste.

18. An LED light, characterized in that, Include: At least one LED bead; and The heat dissipation device as described in any one of claims 1 to 17, wherein the LED bead is disposed on the heat dissipation device for dissipating heat generated by the LED bead through the heat dissipation device.

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