High temperature gas negative pressure discharge cooling device

Abstract

The application belongs to the field of cooling devices, and particularly relates to a high-temperature gas negative pressure discharge cooling device. The cooling device comprises a cooling device body, a plurality of groups of heat exchange plates arranged in sequence along the airflow direction are arranged in the flow channel of the cooling device body, the plurality of groups of heat exchange plates are arranged in a gradual change mode of being sparse in front and dense in back and thick in front and thin in back along the airflow direction, at least one fluid passage is arranged in one or more heat exchange plates in the front section, one end of the fluid passage is an inlet facing the outside of the flow channel of the cooling device body, and the other end is an outlet facing the downstream of the flow channel, when high-temperature high-speed gas flows through the flow channel, the fluid passage uses the negative pressure in the flow channel to induce external gas or cooling medium, and the induced gas or cooling medium is sprayed into the downstream airflow through the outlet to enhance the heat exchange effect. The application realizes high-efficiency heat exchange under extremely low flow resistance by adopting the gradual change mode of heat exchange plate arrangement of being sparse in front and dense in back and thick in front and thin in back, and integrating the flow channel capable of inducing external gas in the front thick plate.

Description

TECHNICAL FIELD

[0001] The application belongs to the field of cooling devices, and particularly relates to a high-temperature gas negative pressure discharge cooling device. BACKGROUND

[0002] The cooling device is essentially a heat exchanger for heat exchange, and is widely used in the fields of aerospace and chemical industry. For a pre-cooling engine, the introduction of a high-performance pre-cooler can enable the engine to operate in a wide range of Mach numbers, and has the characteristics of low emission and high specific impulse.

[0003] According to whether there is a cooling medium, the pre-cooler can be divided into a heat sink type and a cold fluid cooling type. When cold fluid flows into the pre-cooler, a cold fluid channel must be provided inside the pre-cooler, and the advantage is that instant and long-time cooling can be achieved. The compact tube bundle heat exchanger used in the SABRE pre-cooling engine can cool the airflow from 1000 DEG C to -150 DEG C in no more than 0.05 seconds, and the cooling medium of the pre-cooler is helium, which is used to cool the high-temperature incoming flow. The pre-cooler has a very high heat exchange power-to-weight ratio and is considered a major breakthrough in the field of hypersonic pre-cooling engines. Some scholars have proposed a 3D-printed pre-cooler applied to a negative pressure high-temperature environment, which uses flat heat exchange plates to achieve heat exchange between cold fluid and hot fluid, and the heat exchange plates are provided with cold fluid micro-channels inside, and the heat exchange plates are provided with hot fluid channels between them. The scheme uses 3D printing to manufacture, and the production cost is extremely high, which is suitable for small-scale pre-coolers. Some scholars have proposed a heat sink type pre-cooler, which sprays liquid nitrogen on the heat exchange plates to achieve rapid cooling of the heat exchange plates, and the cooled heat exchange plates are used to cool the normal temperature air. Although the manufacturing cost of the pre-cooler with a cooling channel is reduced, the cooling medium is wasted, and the operation is very complicated.

[0004] At present, the cooling devices applied in various fields are in a normal pressure state, and the fluid density is high, so that the pressure loss of the hot fluid flowing through the cooling device is small and the heat exchange amount is large, such as the SABRE pre-cooler. Figure 1 The hot fluid of the SABRE pre-cooler is in an atmospheric pressure state, and the density is high, so that the flow rate is low, the pressure loss is small and can be ignored. Under the condition of negative pressure and high temperature, the density of the hot fluid of the cooling device is low. Taking nitrogen as an example, the density of nitrogen at 20 kPa is only 1 / 10 of that at normal pressure, so the flow rate can reach thousands of kilometers per second, and the pressure loss is extremely high. Therefore, it is necessary to design and manufacture the cooling device under the condition of negative pressure and high temperature, so as to realize high-efficiency and low-resistance heat exchange of the cooling device under the condition of negative pressure. SUMMARY

[0005] The technical problem solved by the present application is to provide a high-temperature gas negative pressure discharge cooling device. In view of the problem that the traditional cooling device cannot simultaneously control the pressure drop and heat exchange under the working condition of high-temperature, negative pressure and high-speed airflow, the present application adopts a gradually changing heat exchange plate layout of front sparse and rear dense, front thick and rear thin, and integrates a flow channel capable of injecting external gas in the front thick plate, thereby achieving the effective control of flow resistance while significantly enhancing the heat exchange capacity, so as to complete the efficient cooling of the ultra-high-temperature gas without additional power.

[0006] The present application provides a high-temperature gas negative pressure discharge cooling device, comprising a cooling device body, a plurality of groups of heat exchange plates arranged in the flow channel of the cooling device body in sequence along the airflow direction;

[0007] The plurality of groups of heat exchange plates are arranged in a gradually changing manner of front sparse and rear dense, front thick and rear thin along the airflow direction;

[0008] One or more heat exchange plates in the front section are provided with at least one fluid channel, one end of the fluid channel is an inlet towards the outside of the flow channel of the cooling device body, and the other end is an outlet towards the downstream of the flow channel;

[0009] When the high-temperature and high-speed gas flows through the flow channel, the fluid channel uses the negative pressure in the flow channel to inject external gas or cooling medium, and the injected gas or cooling medium is sprayed into the downstream airflow through the outlet to enhance the heat exchange effect.

[0010] Further, the heat exchange plates adjacent along the airflow direction are arranged in a staggered manner in the plane perpendicular to the airflow direction.

[0011] Further, the fluid channel in the one or more heat exchange plates in the front section has an inlet that is commonly connected to a gas collection cavity;

[0012] The gas collection cavity is provided with an inlet flow channel that is connected to the outside of the flow channel of the cooling device body.

[0013] Further, the inlet flow channel includes a first inlet flow channel and a second inlet flow channel;

[0014] The first inlet flow channel is provided with a first valve, and the second inlet flow channel is provided with a second valve and a fan;

[0015] By controlling the opening and closing states of the first valve and the second valve and the start and stop of the fan, the gas collection cavity can be selectively operated in a first mode or a second mode;

[0016] In the first mode, the first valve is opened, the fan is stopped, and the external gas is injected into the gas collection cavity through the first inlet flow channel;

[0017] In the second mode, the second valve is opened, and the fan is operated to actively send cooling gas into the gas collection cavity.

[0018] Further, the first inlet flow channel is detachably connected with a low-temperature cooling medium input device.

[0019] Further, the front edge of the heat exchange plate has a guide acute angle structure.

[0020] Further, the heat exchange plate is connected and supported by a plurality of fins.

[0021] The fins are connected and support a plurality of the heat exchange plates.

[0022] Further, the flow channel air inlet of the cooling device body is a diverging channel.

[0023] Further, a plurality of guide plates are arranged in the diverging channel.

[0024] The plate surface of the guide plate is arranged at an angle with the central axis of the diverging channel, for shunting and guiding the high-temperature gas entering the flow channel, to realize uniform distribution of the gas.

[0025] The beneficial effects of the present application are that, by adopting the gradually changing heat exchange plate arrangement of sparse in front and dense in back, thick in front and thin in back, and integrating the flow channel capable of ejecting external gas in the front thick plate, high-efficiency heat exchange under extremely low flow resistance is realized. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 The figure is a structural schematic diagram of the present application;

[0027] Figure 2 The figure is a top view of the present application;

[0028] Figure 3 The figure is Figure 2 the A-A direction sectional view;

[0029] Figure 4 The figure is Figure 3 the local enlarged view at D;

[0030] Figure 5 The figure is Figure 2 the B-B direction sectional view;

[0031] Figure 6 The figure is Figure 5 the E-E direction sectional view;

[0032] Figure 7 The figure is Figure 6 the local enlarged view at F;

[0033] Figure 8 The figure is Figure 2 the C-C direction sectional view.

[0034] In the figure, 1-cooling device body; 11-flow channel; 2-heat exchange plate; 21-fluid channel; 211-inlet; 212-outlet; 22-guide acute angle structure; 3-air collection chamber; 31-inlet flow channel; 311-first inlet flow channel; 312-second inlet flow channel; 4-first valve; 5-fan; 6-fins; 7-gradiently expanding channel; 8-guide plate; 9-second valve. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0036] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0037] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0038] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection, an electrical connection, a physical connection, or a wireless communication connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two elements or the interaction between two elements, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0039] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0040] like Figures 1-7 As shown, the present invention provides a high-temperature gas negative pressure emission cooling device, including a cooling device body 1, wherein a plurality of heat exchange plates 2 arranged sequentially along the airflow direction are provided in the flow channel 11 of the cooling device body 1.

[0041] The multiple heat exchange plates 2 are arranged in a gradually changing pattern along the airflow direction, with sparser plates at the front and denser plates at the back, and thicker plates at the front and thinner plates at the back. This structure can actively adapt to changes in airflow parameters under high temperature and negative pressure conditions: in the high temperature, low density, and high speed region near the inlet, a sparse and thick heat exchange plate layout is used to provide a larger flow cross-sectional area for the airflow, significantly reducing the flow resistance and pressure drop loss in this critical region; while in the low temperature, high density, and low speed region near the outlet, a dense and thin heat exchange plate layout is used to greatly increase the heat exchange area, thereby achieving efficient heat exchange in the section where the airflow velocity has naturally decreased.

[0042] At least one fluid channel 21 is provided in one or more heat exchange plates 2 located at the front end. One end of the fluid channel 21 is an inlet 211 facing the outside of the flow channel 11 of the cooling device body 1, and the other end is an outlet 212 facing the downstream of the flow channel 11.

[0043] When high-temperature, high-speed gas flows through the flow channel 11, the fluid channel 21 utilizes the negative pressure within the flow channel 11 to eject external gas or cooling medium. The ejected gas or cooling medium is then sprayed into the downstream airflow through the outlet 212 to enhance the heat exchange effect. This design utilizes the negative pressure effect generated by the high-speed mainstream itself as a power source, eliminating the need for additional pumps or fans 5 or other active power equipment, and can naturally eject external cold air or cooling medium into the hot airflow. This ejection and mixing cooling method is direct and efficient. Furthermore, since the fluid channel 21 is integrated inside the heat exchange plate 2, the layout of its inlet 211 and outlet 212 will not form any prominent obstacles in the flow channel 11. This avoids the additional flow resistance problems that would inevitably arise from directly installing cooling ducts or spray devices at the inlet, achieving the optimal balance between enhanced cooling effect and flow resistance control.

[0044] This device employs a gradually varying heat exchange plate layout ("sparser at the front, denser at the back; thicker at the front, thinner at the back") to balance low flow resistance and high heat exchange efficiency. Through the fluid channel 21 and ejector mechanism integrated into the thicker front heat exchange plate 2, the cooling effect is further enhanced by utilizing the system's own flow characteristics without requiring additional energy. This synergistic effect makes it particularly suitable for harsh operating conditions such as high temperature, negative pressure, and high flow rate. It can effectively cool ultra-high temperature gases to the target temperature while maintaining very low pressure loss, solving the problem of excessive pressure drop or insufficient cooling capacity in traditional cooling devices under such conditions.

[0045] In addition, this overall layout of "sparse in the front and dense in the back, thick in the front and thin in the back" not only achieves a balance between low flow resistance and high-efficiency heat exchange in terms of aerodynamics and thermodynamics, but also achieves optimized distribution of materials and strength in terms of structural design: the inlet section uses two heat exchange plate units with thick but few heat exchange plates to withstand the most severe working conditions, ensuring the stability of the overall structural foundation; the outlet section uses two heat exchange plate units with thin but many heat exchange plates to complete the refined final cooling, so that the weight and manufacturing cost of the entire device can be reasonably controlled, and ultimately ensures the consistency and reliability of the structural strength of the cooling device under high temperature and high speed impact.

[0046] In one embodiment, the heat exchange plates 2 adjacent to each other along the airflow direction are arranged in an alternating pattern on a plane perpendicular to the airflow direction.

[0047] In this embodiment, firstly, the arrangement breaks the straight flow state of the airflow within the flow channel 11, generating moderate disturbance to the airflow and increasing its turbulence. This effectively thins and breaks down the thermal boundary layer adhering to the surface of the heat exchange plate 2, significantly enhancing the convective heat transfer efficiency between the gas and solid phases. Secondly, this arrangement extends the actual flow path of the airflow, indirectly increasing the airflow heat transfer path, while promoting lateral mixing of the airflow. This is beneficial for the homogenization of the temperature field and avoids localized uneven cooling or thermal short-circuiting that may occur due to the direct alignment of the heat exchange plates 2.

[0048] In one embodiment, the fluid channels 21 located in the front section of one or more heat exchange plates 2 have their inlets 211 connected to a gas collection chamber 3.

[0049] The gas collecting chamber 3 is provided with an inlet flow channel 31 that communicates with the outside of the flow channel 11 of the cooling device body 1.

[0050] In this embodiment, an integrated design of the gas collection chamber 3 is adopted. First, it achieves a high degree of simplification and unification in structure, integrating the inlets 211 of multiple fluid channels 21 into a common cavity, avoiding the complex layout of setting external interfaces for each channel, greatly simplifying the external connection and internal flow channel structure of the cooling device body 1, and improving the overall compactness and reliability. Second, as a gas source distribution chamber, the gas collection chamber 3 can collect and initially equalize the introduced external gas or cooling medium, and then distribute it evenly to each fluid channel 21, effectively ensuring the consistency of the ejection flow rate of each channel, avoiding the problem of insufficient local cooling or reduced heat exchange efficiency caused by uneven flow in individual channels, thereby ensuring the uniformity of cooling enhancement and the predictability of the overall effect. In addition, the structure of the gas collection chamber 3 provides a centralized and convenient foundation for the installation and connection of subsequent additional functional modules (such as controllable valves, active fans 5, or cryogenic medium injection interfaces), greatly enhancing the flexibility and maintainability of system function expansion.

[0051] In one embodiment, the inlet channel 31 includes a first inlet channel 311 and a second inlet channel 312;

[0052] A first valve 4 is provided on the first inlet channel 311, and a second valve 9 and a fan 5 are provided on the second inlet channel 312;

[0053] By controlling the opening and closing states of the first valve 4 and the second valve 9, as well as the start and stop of the fan 5, the air collection chamber 3 can be selectively operated in a first mode or a second mode, wherein the first mode is a passive ejection mode and the second mode is an active cooling mode.

[0054] In the first mode, the first valve 4 is opened, the fan 5 stops running, and external gas is injected into the gas collection chamber 3 through the first inlet channel 311.

[0055] In the second mode, the second valve 9 is opened and the fan 5 is operated to actively send cooling gas into the gas collection chamber 3.

[0056] In this embodiment, in the first mode (passive ejection mode), the system operates solely based on the negative pressure effect generated by the high-speed flow of the main stream, achieving enhanced cooling with zero additional power consumption. This mode is particularly suitable for the cooling device during normal continuous operation, enabling continuous and stable improvement of heat exchange efficiency without increasing external energy consumption, demonstrating extremely high operational economy. In the second mode (active cooling mode), the cooling gas is forcibly delivered by activating fan 5, providing a coolant flow rate and velocity far exceeding the natural ejection capability. This mode is specifically designed for rapid performance recovery during working breaks or after task completion of the cooling device. It actively and powerfully dissipates heat from the high-temperature heat exchange plate 2, reducing its temperature to a level suitable for restarting operation in a very short time, thereby greatly shortening the device's cooling recovery cycle and improving its rapid response and reusability capabilities.

[0057] The two modes can be seamlessly switched by simply alternating between the first valve 4 and the second valve 9, enabling the same device to intelligently match the two drastically different operating conditions: optimal energy efficiency during operation and fastest recovery from shutdown. This not only optimizes the energy utilization efficiency of the entire work cycle but also significantly expands the device's application scenarios and task flexibility. From the perspective of system reliability and maintenance, the dual-channel structure also provides a certain degree of redundancy.

[0058] In one embodiment, the first inlet channel 311 is detachably connected to a cryogenic cooling medium input device.

[0059] In this embodiment, the original passive ejection first inlet channel 311 is upgraded to a reinforced interface that can connect to a stronger cold source without additional active power. When a cryogenic medium input device such as liquid nitrogen is connected, the system can directly inject the cryogenic medium into the gas collection chamber 3 using the first inlet channel 311 without starting any fans or pumps. Its cooling speed and magnitude far exceed those of simple air ejection or active air cooling, making it particularly suitable for specific application scenarios with strict limitations on noise, vibration, or power supply, but requiring extremely rapid thermal recovery.

[0060] In one embodiment, the leading edge of the heat exchange plate 2 has a sharp-angle structure 22.

[0061] In this embodiment, the sharp-angle structure 22 of the heat exchange plate 2 makes its leading edge sharp. This sharp leading edge guides the high-speed gas flow lines to smoothly cut through and conform to the surface of the heat exchange plate 2, effectively avoiding the severe fluid separation and eddy shedding that would inevitably occur at high speeds with a blunt-headed structure. This eliminates a major source of local flow resistance at its source, helping to maintain the smoothness and stability of the overall flow within the flow channel 11. Secondly, this smooth guiding effect significantly reduces the local pressure loss and aerodynamic noise in the leading edge region of the heat exchange plate 2, and retains more airflow energy in the mainstream, which helps to improve the pressure recovery performance of the entire cooling device. Furthermore, from a thermodynamic and structural perspective, the sharp-angle structure 22 reduces the stagnation area and heat flow accumulation effect at the leading edge, which helps to reduce the risk of local overheating at the leading edge. Combined with the ablation resistance of the thick front section of the heat exchange plate 2, this enhances the operational reliability of the device under extreme heat loads.

[0062] In one embodiment, fins 6 are also included;

[0063] The fins 6 connect to and support multiple heat exchange plates 2.

[0064] In this embodiment, the fin structure 6 serves as the core support and connecting frame for the heat exchange plate 2. Firstly, from a structural mechanics perspective, the fin 6 firmly connects multiple independent heat exchange plates 2 into a single unit, significantly enhancing the structural rigidity and integrity of the entire heat exchange plate array. Under the impact of high-speed, high-pressure pulsating airflow, this rigid support effectively suppresses the vibration and deformation of the heat exchange plates 2, ensuring the geometric stability of their spacing and arrangement. This guarantees the long-term maintenance of the designed flow channel 11 shape and avoids performance degradation or mechanical failure due to structural instability. Secondly, from a thermal management perspective, the fin 6, as a connector, establishes additional solid heat conduction paths between adjacent heat exchange plates 2, improving the heat exchange effect.

[0065] In one embodiment, the air inlet of the flow channel (11) of the cooling device body 1 is a gradually expanding channel 7.

[0066] In this embodiment, when high-speed gas enters the gradually expanding channel 7, the flow cross-sectional area gradually increases. According to fluid mechanics principles, the gas velocity will significantly decrease, the dynamic pressure will decrease accordingly, and the static pressure will recover to a certain extent. This process effectively reduces the direct impact velocity and dynamic head of the gas on the first row of heat exchange plates 2, thereby significantly reducing the local impact loss and flow separation risk at the inlet, creating a smoother and more uniform initial condition for the subsequent heat exchange process. Secondly, the reduction in velocity directly leads to a relative extension of the gas residence time in the heat exchange region, which provides a more sufficient time basis for heat exchange between the gas and solid phases, and is conducive to improving the efficiency of the first-stage heat exchange. This feature, along with the "sparse in the front and dense in the back" macroscopic layout of the heat exchanger plate array 2, forms a clever connection between the front and back: the gradually expanding channel is responsible for slowing down and homogenizing the high-speed incoming flow, while the sparse front heat exchanger plates 2 provide a large flow area at a lower flow rate (relative to the incoming flow). The two work together from the very front of the flow channel to systematically achieve the unified goal of low flow resistance and efficient heat exchange, which is an important inlet guarantee for the device to adapt to negative pressure and high-speed operating conditions.

[0067] In one embodiment, a plurality of guide vanes 8 are provided inside the gradually expanding channel 7;

[0068] The surface of the guide plate 8 is set at an angle to the central axis of the gradually expanding channel 7, which is used to divert and guide the high-temperature gas entering the flow channel 11 to achieve uniform gas distribution.

[0069] In this embodiment, the introduction of the guide plate 8 firstly solves the problems of airflow separation, uneven circumferential distribution, and excessively high central velocity that may occur due to sudden channel expansion. By using multiple guide plates 8 arranged at a specific angle, the high-speed incoming flow is orderly divided into several streams and guided and redistributed along a preset direction (angle direction). This forcibly transports the gas kinetic energy from the central region to the edge region of the channel, effectively filling the low-speed or backflow zones that may appear at the corners of the expanding channel, thereby achieving an unprecedentedly uniform distribution of velocity, flow rate, and temperature field at the inlet cross-section of the heat exchanger plate 2 array.

[0070] The above description is merely an embodiment and does not constitute any limitation on the present invention. Any person skilled in the art can make many possible variations, modifications, or alterations to the technical solutions of the present invention without departing from the scope of the present invention. Therefore, any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention, without departing from the scope of the present invention, should fall within the protection scope of the present invention.

Claims

1. A high-temperature gas negative pressure exhaust cooling device, characterized in that, Includes a cooling device body (1), wherein the flow channel (11) of the cooling device body (1) is provided with heat exchange plates (2) arranged in multiple stages along the airflow direction. The heat exchange plates (2) of the multi-stage heat exchange system are arranged in a gradually changing pattern along the airflow direction, with sparser plates at the front and denser plates at the back, and thicker plates at the front and thinner plates at the back. At least one fluid channel (21) is provided in one or more heat exchange plates (2) located at the front end. One end of the fluid channel (21) is an inlet (211) facing the outside of the flow channel (11) of the cooling device body (1), and the other end is an outlet (212) facing the downstream of the flow channel (11). When high-temperature and high-speed gas flows through the flow channel (11), the fluid channel (21) uses the negative pressure in the flow channel (11) to eject external gas or cooling medium. The ejected gas or cooling medium is then injected into the downstream airflow through the outlet (212) to enhance the heat exchange effect. The fluid channels (21) located in one or more heat exchange plates (2) at the front end have their inlets (211) connected to a gas collection chamber (3); the gas collection chamber (3) is provided with an inlet flow channel (31) connected to the outside of the flow channel (11) of the cooling device body (1); the inlet flow channel (31) includes a first inlet flow channel (311) and a second inlet flow channel (312); a first valve (4) is provided on the first inlet flow channel (311), and a second valve (9) and a fan (5) are provided on the second inlet flow channel (312); By controlling the opening and closing states of the first valve (4) and the second valve (9) and the start and stop of the fan (5), the gas collection chamber (3) can be selectively made to work in the first mode or the second mode. In the first mode, the first valve (4) is opened, the fan (5) stops running, and the external gas is injected into the gas collection chamber (3) through the first inlet channel (311). In the second mode, the second valve (9) is opened and the fan (5) is operated to actively send cooling gas into the gas collection chamber (3).

2. The high-temperature gas negative pressure exhaust cooling device as described in claim 1, characterized in that, The heat exchange plates (2) adjacent to each other along the airflow direction are arranged in an alternating pattern on a plane perpendicular to the airflow direction.

3. The high-temperature gas negative pressure exhaust cooling device as described in claim 1, characterized in that, The first inlet channel (311) is detachably connected to a low-temperature cooling medium input device.

4. The high-temperature gas negative pressure exhaust cooling device as described in claim 1, characterized in that, The leading edge of the heat exchange plate (2) has a sharp angle structure (22).

5. The high-temperature gas negative pressure exhaust cooling device as described in claim 1, characterized in that, It also includes fins (6); The fins (6) connect to and support the plurality of heat exchange plates (2).

6. The high-temperature gas negative pressure exhaust cooling device as described in claim 1, characterized in that, The air inlet of the flow channel (11) of the cooling device body (1) is a gradually expanding channel (7).

7. The high-temperature gas negative pressure exhaust cooling device as described in claim 6, characterized in that, The gradually expanding channel (7) is provided with several guide plates (8); The surface of the guide plate (8) is set at an angle to the central axis of the gradually expanding channel (7) to divert and guide the high-temperature gas entering the flow channel (11) so as to achieve uniform gas distribution.

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