Module installation scheme evaluation method and device, equipment and medium

Abstract

The invention relates to the technical field of finite element simulation, and discloses a module installation scheme evaluation method and device, equipment and a medium, a finite element model of a to-be-installed module is obtained, the to-be-installed module comprises a guide pin structure which can be influenced by the installation process, and the to-be-installed module corresponds to multiple candidate installation schemes; according to the installation steps of any candidate installation scheme, step-by-step load application is carried out on the finite element model, after all the installation steps are completed, load stress analysis is carried out on the guide pin structure, and the load stress state of the guide pin structure is obtained; according to the load stress state of the guide pin structure, safety analysis is conducted on the guide pin structure, and the structure safety coefficient of any candidate installation scheme is obtained; and selecting a target installation scheme from the plurality of candidate installation schemes according to the structure safety coefficient. The beneficial effects are that simulation is carried out on the installation process of the module, so that the stress condition of the guide pin structure in the installation process of the module is effectively determined, and comprehensive strength analysis is carried out on the guide pin structure.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of finite element simulation, and in particular to a module installation scheme evaluation method and device, equipment and a medium. BACKGROUND

[0002] Various power electronic devices are provided in a vehicle, including frequency converters, inverters, and new energy vehicle electric drive systems, etc. These devices contain functional modules for realizing different functions, such as insulated gate bipolar transistors (IGBT) as core power switching devices, etc. In actual scenarios, the functional modules in the power electronic devices work in complex and harsh environments, usually accompanied by environmental conditions such as high voltage, large current, temperature cycling, or mechanical vibration. The above environmental conditions will affect the guide pin structure in the functional module, causing problems such as plastic deformation, fracture, or weld cracking of the guide pin structure, resulting in failure of the power electronic device. Therefore, the structural strength of the guide pin structure directly affects the reliability of the power electronic device and determines whether the power electronic device can work normally.

[0003] In related technologies, the comprehensiveness of the technical scheme for strength analysis of the guide pin structure still needs to be improved. SUMMARY

[0004] The present application provides a module installation scheme evaluation method, device, equipment and medium, which gradually applies load to the finite element model of the to-be-installed module according to the installation steps, to simulate and simulate the installation process of the module, thereby effectively determining the stress condition of the guide pin structure in the module installation process, and then comprehensively analyzing the strength of the guide pin structure.

[0005] In order to achieve the above purpose, the main technical scheme adopted by the present application includes: In a first aspect, the present application provides a module installation scheme evaluation method, which includes: Obtaining a finite element model of a to-be-installed module; wherein the to-be-installed module contains a guide pin structure that will be affected by the installation process, and the to-be-installed module corresponds to a plurality of candidate installation schemes; According to the installation steps of any candidate installation scheme, gradually applying load to the finite element model, and after completing all installation steps, performing load stress analysis on the guide pin structure to obtain the load stress state of the guide pin structure; According to the load stress state, performing safety analysis on the guide pin structure to obtain the structural safety factor of the any candidate installation scheme; According to the structural safety factor, selecting a target installation scheme from the plurality of candidate installation schemes for installing the to-be-installed module.

[0006] The module installation scheme evaluation method provided in the embodiments of the present application is used for a to-be-installed module containing a guide needle structure, a finite element model of the to-be-installed module and the guide needle structure is obtained, and the finite element model is subjected to step-by-step load application according to installation steps of a candidate installation scheme; after all the installation steps are completed, load stress analysis is performed on the guide needle structure in the finite element model, the load stress state of the guide needle structure is obtained, and the load stress state is taken as a data basis for strength analysis of the guide needle structure, a target installation scheme meeting safety requirements is selected from the candidate installation scheme, and the target installation scheme is used for installation of the to-be-installed module. Compared with related technologies, the present application considers the influence of the module installation process on the strength of the guide needle, step-by-step load application of the installation steps of the candidate installation scheme and the order thereof to the finite element model is performed to simulate the actual installation process of the to-be-installed module, the degree of influence of the installation process on the guide needle structure is obtained, thereby comprehensive strength analysis of the guide needle structure is performed, the accuracy of the analysis result is improved, and the design efficiency of the process scheme is also improved.

[0007] Optionally, the step-by-step load application of the finite element model according to the installation steps of any candidate installation scheme, the load stress analysis of the guide needle structure after all the installation steps are completed, and the load stress state of the guide needle structure include: generating a plurality of installation load steps corresponding to the installation steps and the order thereof of the any candidate installation scheme; applying installation load to the finite element model based on an initial installation step in the plurality of installation load steps, to obtain a partial installation model; taking the partial installation model as the finite element model, taking a next installation step of the initial installation step in the installation order as the initial installation step, and repeating the process of the installation load application until all the installation steps of the any candidate installation scheme are completed, to obtain an installed model; performing load stress analysis on the guide needle structure in the installed model, to obtain the load stress state of the guide needle structure.

[0008] Optionally, the load stress analysis of the guide needle structure in the installed model, to obtain the load stress state of the guide needle structure, includes: performing stress analysis on the guide needle structure in the extension direction of the guide needle structure, to obtain an axial load of the guide needle structure; performing stress analysis on the guide needle structure in the vertical direction of the guide needle structure, to obtain a transverse load of the guide needle structure; and obtaining the load stress state of the guide needle structure according to the axial load and the transverse load.

[0009] Optionally, the plurality of candidate installation schemes respectively correspond to respective installation tolerances; the method further comprises: according to the installation tolerance corresponding to any candidate installation scheme, tolerance setting is performed on the finite element model to obtain a tolerance model corresponding to the installation tolerance; According to the installation steps of any candidate installation scheme, step-by-step load application is performed on the tolerance model, and load stress analysis is performed on the guide pin structure in the tolerance model after all installation steps are completed to obtain the load stress state of the guide pin structure under the installation tolerance.

[0010] Optionally, the load stress state includes axial load borne by the guide pin structure in the extension direction and transverse load borne by the guide pin structure in the vertical direction; the safety analysis of the guide pin structure according to the load stress state to obtain the structural safety factor of any candidate installation scheme comprises: According to the axial load and the limit load of the guide pin structure in the extension direction, axial safety analysis is performed on the guide pin structure to obtain the axial safety factor of the guide pin structure; According to the transverse load and the limit load of the guide pin structure in the vertical direction, transverse safety analysis is performed on the guide pin structure to obtain the transverse safety factor of the guide pin structure; According to the axial safety factor and the transverse safety factor, the structural safety factor of any candidate installation scheme is obtained.

[0011] Optionally, the selection of a target installation scheme from the plurality of candidate installation schemes according to the structural safety factor comprises: According to a preset safety threshold, safety screening is performed on the structural safety factors of all candidate installation schemes to obtain a safety screening scheme; according to the axial safety factor of each safety screening scheme, axial safety evaluation is performed on the safety screening scheme to obtain an axial optimal scheme; According to the transverse safety factor of each safety screening scheme, transverse safety evaluation is performed on the safety screening scheme to obtain a transverse optimal scheme; When the axial optimal scheme and the transverse optimal scheme are the same safety screening scheme, the same safety screening scheme is taken as the target installation scheme.

[0012] Optionally, when the axial optimal scheme and the transverse optimal scheme are different safety screening schemes, the method further comprises: According to the axial safety factor of each safety screening scheme, axial risk evaluation is performed on the safety screening scheme to obtain an axial risk scheme; According to the transverse safety factor of each safety screening scheme, transverse risk evaluation is performed on the safety screening scheme to obtain a transverse risk scheme; According to the axial safety factor and the lateral safety factor of the axial risk scheme and the lateral risk scheme respectively, the axial risk scheme and the lateral risk scheme are subjected to safety optimization evaluation, to obtain a target installation scheme.

[0013] In a second aspect, the embodiments of the present application provide a module installation scheme evaluation device, the device comprises: A model acquisition module is configured to acquire a finite element model of a module to be installed, wherein the module to be installed comprises a guide pin structure that will be affected by an installation process, and the module to be installed corresponds to a plurality of candidate installation schemes; A step analysis module is configured to apply a step-by-step load to the finite element model according to an installation step of any candidate installation scheme, and perform load stress analysis on the guide pin structure after all installation steps are completed, to obtain a load stress state of the guide pin structure; A safety analysis module is configured to perform safety analysis on the guide pin structure according to the load stress state, to obtain a structure safety factor of the any candidate installation scheme; A scheme selection module is configured to select a target installation scheme from the plurality of candidate installation schemes according to the structure safety factor, to be used for installing the module to be installed.

[0014] In a third aspect, the embodiments of the present application provide a computer device, comprising a memory and a processor, which are in communication connection with each other, and the memory stores computer instructions, and the processor executes the computer instructions to perform the method of any one of the above embodiments.

[0015] In a fourth aspect, the embodiments of the present application provide a computer readable storage medium, which stores computer instructions, and the computer instructions are used to make a computer execute the method of any one of the above embodiments.

[0016] In a fifth aspect, the embodiments of the present application provide a computer program product, which comprises computer instructions, and the computer instructions are used to make a computer execute the method of any one of the above embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the description of the specific embodiments or the prior art. Obviously, the drawings described below are some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creative labor.

[0018] Figure 1A step diagram of a module installation scheme evaluation method provided by an embodiment of the present application; Figure 2a A schematic diagram of a module to be installed in an embodiment of the present application after installation is completed; Figure 2b A schematic diagram of an IGBT installation support in an embodiment of the present application; Figure 2c A schematic diagram of an IGBT assembly in an embodiment of the present application; Figure 2d A schematic diagram of an IGBT assembly installed on an IGBT installation support in an embodiment of the present application; Figure 2e A schematic diagram of a PCBA board in an embodiment of the present application; Figure 2f A schematic diagram of a finite element model in an embodiment of the present application; Figure 3 A step diagram of step-by-step load application in an embodiment of the present application; Figure 4a A schematic diagram of an IGBT assembly and a PCBA board aligned through a guide pin structure in an embodiment of the present application; Figure 4b A schematic diagram of bolt distribution on a PCBA board in an embodiment of the present application; Figure 5 A step diagram of load stress analysis on a guide pin structure in an embodiment of the present application; Figure 6a A stress cloud diagram of a guide pin structure in an extension direction in an embodiment of the present application; Figure 6b A first stress cloud diagram of a guide pin structure in a vertical direction in an embodiment of the present application; Figure 6c A second stress cloud diagram of a guide pin structure in a vertical direction in an embodiment of the present application; Figure 7 A step diagram of obtaining a load stress state for an installation tolerance in an embodiment of the present application; Figure 8 A step diagram of obtaining a structure safety coefficient in an embodiment of the present application; Figure 9 A step diagram of selecting a target installation scheme in an embodiment of the present application; Figure 10 A step diagram of selecting a target installation scheme in an embodiment of the present application; Figure 11 A module diagram of a module installation scheme evaluation device provided by an embodiment of the present application; Figure 12 A structural schematic diagram of a computer device provided by an embodiment of the present application.

[0019] Wherein, the reference signs of the drawings of the specification are as follows: 1. IGBT mounting bracket, 124. Board-bracket mounting hole, 1241. Cumulative tolerance surface, 131~138. Assembly mounting hole, 141~145. Bracket fixing hole, 2. IGBT assembly, 21. Guide pin structure, 23. Guide pin root feature hole, 3. PCBA board, 324. Board mounting hole, 33. Board guide pin hole, 4. Electronic component, 5. Mounting bolt, 511~518. Board-assembly bolt, 521~525. Board-bracket bolt, 531~538. Assembly-bracket bolt. DETAILED DESCRIPTION

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0021] Various power electronic devices are provided in a vehicle, including a frequency converter, an inverter, and a new energy vehicle electric drive system, etc. These devices contain functional modules for realizing different functions, such as an insulated gate bipolar transistor (IGBT) as a core power switching device, etc. In actual scenarios, the functional modules in the power electronic devices work in complex and harsh environments, usually accompanied by environmental conditions such as high voltage, large current, temperature cycling, or mechanical vibration. The above environmental conditions will affect the guide pin structure in the functional module, causing problems such as plastic deformation, fracture, or weld cracking of the guide pin structure, leading to failure of the power electronic device. Therefore, the structural strength of the guide pin structure directly affects the reliability of the power electronic device and determines whether the power electronic device can work normally. In related technologies, the comprehensiveness of the technical solution for strength analysis of the guide pin structure still needs to be improved.

[0022] Based on the above problems, the present application provides a module installation scheme evaluation method, device, equipment and medium, obtaining a finite element model of a to-be-installed module, the to-be-installed module containing a guide pin structure that will be affected by the installation process, the to-be-installed module corresponding to a plurality of candidate installation schemes; according to the installation steps of any candidate installation scheme, gradually applying load to the finite element model, and after completing all installation steps, performing load stress analysis on the guide pin structure to obtain the load stress state of the guide pin structure; according to the load stress state of the guide pin structure, performing safety analysis on the guide pin structure to obtain a structure safety coefficient of any candidate installation scheme; and selecting a target installation scheme from the plurality of candidate installation schemes according to the structure safety coefficient.

[0023] The module installation scheme evaluation method provided in the application is used for a to-be-installed module containing a guide pin structure, acquires a finite element model of the to-be-installed module and the guide pin structure, and gradually applies load to the finite element model according to installation steps of a candidate installation scheme; after all the installation steps are completed, load stress analysis is performed on the guide pin structure in the finite element model, the load stress state of the guide pin structure is obtained, and the load stress state is taken as a data basis for strength analysis of the guide pin structure, a target installation scheme meeting safety requirements is selected from the candidate installation scheme, and the to-be-installed module is installed by using the target installation scheme.

[0024] Compared with the related art, the application considers the influence of the module installation process on the strength of the guide pin, gradually applies load caused by the installation steps to the to-be-installed module to the finite element model according to the installation steps and the order of the candidate installation scheme, simulates the actual installation process of the to-be-installed module, obtains the degree of influence of the guide pin structure caused by the installation process, and comprehensively analyzes the strength of the guide pin structure, thereby improving the accuracy of the analysis result and improving the design efficiency of the process scheme.

[0025] The module installation scheme evaluation method provided in the specification can be applied to safety evaluation of an installation scheme of a functional module in a power electronic device, to determine an optimal target installation scheme. The functional module can be an IGBT module, and the power electronic device can be a frequency converter, an inverter, and a new energy automobile electric drive system. It can be understood that, after adaptive modification, the module installation scheme evaluation method provided in the specification can also be applied to evaluation of installation schemes of other devices or other modules, such as a power module, a power supply module, or a communication module.

[0026] According to an embodiment of the application, a module installation scheme evaluation method is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and although a logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0027] In this embodiment, a module installation scheme evaluation method is provided, which can be used for safety evaluation of the installation scheme of the functional module described above. Referring to Figure 1 The method comprises the following steps: S100. Acquire a finite element model of a to-be-installed module; wherein the to-be-installed module contains a guide pin structure that will be affected by an installation process, and the to-be-installed module corresponds to a plurality of candidate installation schemes.

[0028] S200. According to the installation steps of any candidate installation scheme, gradually apply load to the finite element model, and after all the installation steps are completed, perform load stress analysis on the guide pin structure to obtain the load stress state of the guide pin structure.

[0029] S300. Perform a safety analysis on the guide pin structure based on the load stress state to obtain the structural safety factor of any candidate installation scheme.

[0030] S400. Based on the structural safety factor, select the target installation scheme from multiple candidate installation schemes for installation of the module to be installed.

[0031] Specifically, the module to be installed may include multiple mounting components. Some mounting components may have guide pin structures, and other mounting components may have guide pin holes that match these structures. Each mounting component in the module is modeled in 3D, resulting in a separate 3D model for each component, including the guide pin structure and guide pin holes. Based on the guide pin structures and holes in the 3D models, all 3D models are aligned and assembled to ensure that the relative relationships between each model meet the module assembly requirements, resulting in an assembled model of the module to be installed. The assembled model is then meshed, and the guide pin structures within the assembled model are meshed separately according to preset meshing requirements, resulting in a finite element model of the module to be installed.

[0032] It is understandable that candidate installation schemes may include multiple installation steps. Different candidate installation schemes may have the same installation steps or different installation steps, and the installation order of the same installation steps may differ across candidate installation schemes. The module to be installed can be installed and fixed based on the candidate installation schemes to ensure a stable connection between the installation components. However, the installation process of each candidate installation scheme will affect the structural strength of the guide pin structure to some extent. Therefore, a safety assessment of all candidate installation schemes is required to select a target installation scheme from multiple candidate schemes for installation of the module to be installed. The target installation scheme contains installation steps and an installation order that have the least impact on the structural strength of the guide pin structure in the module to be installed.

[0033] For example, refer to Figure 2a As shown, the module to be installed can be an IGBT module. IGBT modules are used as core power switching devices in power electronic equipment. The pin structure 21 contained in the IGBT module undertakes key functions such as high current transmission, mechanical fixation, and heat dissipation during operation. The IGBT module includes an IGBT mounting bracket 1, an IGBT assembly 2, and a PCBA board 3. Various electronic components 4 are mounted on the PCBA board 3. The IGBT mounting bracket 1, the IGBT assembly 2, and the PCBA board 3 are fixedly connected by mounting bolts 5.

[0034] Reference Figure 2bAs shown, the IGBT mounting bracket 1 is used to provide support for the IGBT module and connection with the controller, so that the IGBT module can be controlled by the controller. The IGBT mounting bracket 1 is provided with assembly mounting holes 131-138 and bracket fixing holes 141-145, wherein the assembly mounting holes 131-138 are used to mount the IGBT assembly 2 on the IGBT mounting bracket 1 by mounting bolts 5, and the bracket fixing holes 141-145 are used to bolt connect the IGBT module with the controller box by mounting bolts 5, so as to fix the IGBT module on the controller box. The IGBT mounting bracket 1 is also provided with a plate-bracket mounting hole 124 for providing fixed support for the PCBA board 3 by mounting bolts 5, and a cumulative tolerance surface 1241 between the IGBT mounting bracket 1 and the PCBA board 3 is formed at the plate-bracket mounting hole 124. It can be understood that the IGBT mounting bracket 1 can also be provided with a plurality of mounting holes similar to the plate-bracket mounting hole 124 for providing fixed support for the PCBA board 3.

[0035] Referring to Figure 2c As shown, the IGBT assembly 2 is the core component of the IGBT module, which includes IGBT transistors and corresponding functional elements to realize power conversion and switching functions. The IGBT assembly 2 can contain a plurality of guide pin structures 21 for power input, control signal or heat dissipation, and the root of the guide pin structure 21 is provided with a guide pin root feature hole 23 for positioning the guide pin structure 21. It can be understood that the number of guide pin structures 21 on the IGBT assembly 2 can be multiple. Referring to Figure 2d As shown, the IGBT mounting bracket 1 and the IGBT assembly 2 are aligned and assembled, and the assembly-bracket bolts 531-538 are respectively passed through each assembly mounting hole 131-138 to fix the IGBT assembly 2 on the IGBT mounting bracket 1.

[0036] Referring to Figure 2e As shown, the PCBA board 3 is used to provide electrical connection and signal processing for the IGBT module, so that the IGBT module can work normally. The PCBA board 3 is provided with a plate mounting hole 324 and a plate guide pin hole 33, wherein the plate mounting hole 324 corresponds to the plate-bracket mounting hole 124, and is used to connect and fix the PCBA board 3 with the IGBT mounting bracket 1; the plate guide pin hole 33 matches the guide pin structure 21 on the IGBT assembly 2, and is used to pass through the guide pin structure 21 during assembly. It can be understood that the PCBA board 3 can also be provided with a plurality of feature holes similar to the plate mounting hole 324 for connecting and fixing the PCBA board 3 with the IGBT mounting bracket 1, and guide pin holes similar to the plate guide pin hole 33 for passing through the guide pin structure 21, and the plate guide pin hole 33 and the guide pin structure 21 can be interference connected.

[0037] Referring to Figure 2fAs shown, the IGBT mounting bracket 1, the IGBT assembly 2 and the PCBA board 3 are aligned and assembled according to the module assembly requirements, and the plurality of plate-assembly bolts 511-518 are respectively passed through each assembly mounting hole 131-138, and the plurality of plate-bracket bolts 521-525 are respectively passed through each plate-bracket mounting hole 124, and the plate-assembly bolts 511-518 and the plate-bracket bolts 521-525 are in a loosened state, thereby obtaining an assembly model of the to-be-mounted module.

[0038] Three-dimensional mesh generation is performed on the assembly model, and the mesh type can be C3D10M. No three-dimensional mesh is generated at the guide pin structure 21. For the guide pin structure 21, a typical rigid bar (rbe2) unit is respectively established for the guide pin root feature hole 23 on the IGBT assembly 2 and the plate guide pin hole 33 on the PCBA board 3, and a 3-layer beam unit is established for the guide pin structure 21, the cross-sectional shape of the beam unit is rectangular, the width is the same as the actual width of the guide pin structure 21, and is set to 2 mm. The two ends of the beam unit are respectively connected to the coupling points of the typical rigid bar units to complete one-dimensional modeling of the guide pin structure 21. Similarly, a typical rigid bar unit is respectively established for the plate-bracket mounting hole 124 on the IGBT mounting bracket 1 and the plate mounting hole 324 on the PCBA board 3, and a 3-layer beam unit is established for the plate-bracket bolts 521-525, the cross-sectional shape of the beam unit is circular, the circular diameter is the same as the actual diameter of the plate-bracket bolts 521-525, and is set to 5 mm. The two ends of the beam unit are respectively connected to the coupling center points of the typical rigid bar units to complete one-dimensional modeling of the plate-bracket bolts 521-525.

[0039] Finally, a typical rigid bar unit is respectively established for the bracket fixing hole 141-145, a contact pair is respectively set for the flange surface of the mounting bolt 5 and the mounting surface of the IGBT mounting bracket 1, the IGBT assembly 2 and the PCBA board 3, and a contact pair is set for the matching position between the IGBT mounting bracket 1, the IGBT assembly 2 and the PCBA board 3, and material property settings are performed on all units, thereby obtaining a finite element model of the to-be-mounted module.

[0040] Further, for any candidate installation scheme of the plurality of candidate installation schemes, according to the installation steps and the order thereof included in the any candidate installation scheme, the load caused by each installation step to the to-be-installed module is gradually applied to the finite element model in the corresponding order to simulate the actual installation process of the to-be-installed module in the finite element model. It can be understood that each installation step of the any candidate installation scheme will affect the guide needle structure in the to-be-installed module, and therefore there is a certain degree of load accumulation in the guide needle structure each time the load is applied, indicating the impact caused by the installation process. After all the installation steps are completed, the load stress analysis is performed on the guide needle structure in the finite element model to obtain the load stress state of the guide needle structure. It should be noted that the load stress state of the guide needle structure can be the stress conditions of the guide needle structure in different directions, indicating the overall impact of the installation process of the any candidate installation scheme on the guide needle structure.

[0041] Further, the safety analysis is performed on the guide needle structure according to the load stress state of the guide needle structure, the structural safety risk of the guide needle structure in different directions is evaluated, and the structural safety coefficient of the guide needle structure under the any candidate installation scheme is obtained as the structural safety coefficient corresponding to the any candidate installation scheme. According to the structural safety coefficient of each candidate installation scheme, the candidate installation schemes are screened among all the candidate installation schemes, and the candidate installation scheme with the smallest impact on the structural strength of the guide needle structure is selected as the target installation scheme for installing the to-be-installed module.

[0042] The module installation scheme evaluation method provided by the embodiment is used for the to-be-installed module including the guide needle structure, the finite element model of the to-be-installed module and the guide needle structure is obtained, the finite element model is gradually loaded according to the installation steps of the candidate installation scheme; after all the installation steps are completed, the load stress analysis is performed on the guide needle structure in the finite element model to obtain the load stress state of the guide needle structure, and the load stress state is taken as the data basis for the strength analysis of the guide needle structure, and the target installation scheme meeting the safety requirement is selected from the candidate installation schemes to install the to-be-installed module.

[0043] Compared with the related art, the application considers the impact of the module installation process on the guide needle strength, gradually applies the load caused by the installation steps to the to-be-installed module to the finite element model according to the installation steps and the order thereof in the candidate installation scheme to simulate the actual installation process of the to-be-installed module, obtains the degree of influence of the guide needle structure caused by the installation process, and therefore comprehensively analyzes the strength of the guide needle structure, improves the accuracy of the analysis result, and improves the design efficiency of the process scheme.

[0044] Reference Figure 3As shown, as an embodiment of the present application, according to the installation steps of any candidate installation scheme, the finite element model is subjected to step-by-step load application, and after all installation steps are completed, load stress analysis is performed on the guide pin structure to obtain the load stress state of the guide pin structure, including: S210. According to the installation steps and their order of any candidate installation scheme, a plurality of installation load steps corresponding thereto are generated.

[0045] S220. Based on the initial installation step in the plurality of installation load steps, installation load is applied to the finite element model to obtain a partially installed model.

[0046] S230. The partially installed model is taken as the finite element model, and the next installation step of the initial installation step in the installation order is taken as the initial installation step, and the above installation load application process is repeated until all installation steps of any candidate installation scheme are completed, to obtain an installed model.

[0047] S240. Load stress analysis is performed on the guide pin structure in the installed model to obtain the load stress state of the guide pin structure.

[0048] Specifically, for any candidate installation scheme, the load caused by any installation step in the actual installation process on the to-be-installed module is quantified, and an installation load step corresponding to each installation step is generated. In some embodiments, in the case where the installation step is tightening the bolt, the installation load step can include the pre-tightening force value applied to the to-be-installed module by each installation step. The installation load step can also include a gravity acceleration analysis step for simulating the load caused by gravity on the to-be-installed module.

[0049] Further, the initial installation step corresponding to the first installation step in any candidate installation scheme is selected, and the finite element model is subjected to installation load application according to the load setting of the initial installation step to simulate the first installation step in the any candidate installation scheme, to obtain a partially installed model corresponding to the to-be-installed module after the first installation step is completed.

[0050] Further, the second installation step in the any candidate installation scheme is continued on the basis of the partially installed model, at which time the partially installed model can be taken as the finite element model, the installation load step corresponding to the second installation step is taken as the initial installation step, and the above installation load application process is repeated, so that the load caused by the second installation step on the to-be-installed module is applied to the finite element model. On this basis, the installation load steps corresponding to all installation steps after the second installation step can be sequentially taken as the initial installation step in order, and the finite element model is subjected to load application step by step until all installation steps of the any candidate installation scheme are completed, thereby simulating the complete installation process of the any candidate installation scheme to obtain an installed model.

[0051] Exemplarily, referring to Figure 4a As shown in the finite element model of the to-be-installed module, the IGBT assembly 2 and the PCBA board 3 are aligned through the guide pin structure 21 on the IGBT assembly 2 and the board guide pin hole 33 on the PCBA board 3, and the guide pin structure 21 and the board guide pin hole 33 can be interference connected. Referring to Figure 4b As shown in the finite element model of the to-be-installed module, the IGBT assembly 2 and the PCBA board 3 are aligned through the guide pin structure 21 on the IGBT assembly 2 and the board guide pin hole 33 on the PCBA board 3, and the guide pin structure 21 and the board guide pin hole 33 can be interference connected. Referring to

[0052] Further, the guide pin structure in the installed model is subjected to load stress analysis to obtain the load stress state of the guide pin structure, which serves as the data basis for the strength analysis of the guide pin structure. It can be understood that the load caused by each installation step on the guide pin structure in the to-be-installed module is accumulated in the finite element model. After all installation steps are completed, the guide pin structure in the finite element model is subjected to load stress analysis to determine the overall influence of the any candidate installation scheme on the guide pin structure, thereby comprehensively analyzing the strength of the guide pin structure and improving the accuracy of the analysis result.

[0053] Referring to Figure 5 As an embodiment of the present application, the guide pin structure in the installed model is subjected to load stress analysis to obtain the load stress state of the guide pin structure, including: S242. The guide pin structure is subjected to stress analysis in the extension direction of the guide pin structure to obtain the axial load of the guide pin structure.

[0054] S244. The guide pin structure is subjected to stress analysis in the vertical direction of the guide pin structure to obtain the lateral load of the guide pin structure.

[0055] S246. The load stress state of the guide pin structure is obtained according to the axial load and the lateral load.

[0056] Specifically, for the installed model, the result file of the finite element analysis is extracted to obtain multiple load components of the needle guide structure in different directions, so as to perform multi-directional load stress analysis on the needle guide structure. It should be noted that the different directions of the needle guide structure can include the extension direction and the vertical direction of the needle guide structure, the vertical direction can include two mutually perpendicular directions, and the extension direction is perpendicular to any vertical direction. The stress analysis is performed on the needle guide structure in the extension direction to determine the stress condition of the needle guide structure in the extension direction, and the axial load of the needle guide structure is obtained. The stress analysis is performed on the needle guide structure in the vertical direction to determine the stress condition of the needle guide structure in the vertical direction, and the transverse load of the needle guide structure is obtained. According to the axial load and the transverse load of the needle guide structure, the overall load of the needle guide structure in multiple directions is determined, and the load stress state of the needle guide structure is obtained.

[0057] Exemplarily, referring to FIG. 6, Figure 6a , Figure 6a shows the axial load of each needle guide structure 21 on the IGBT assembly 2 in the extension direction, which can be the pulling force of the needle guide structure 21 in the extension direction. The darker the color of the needle guide structure 21, the greater the pulling force it receives. It can be seen that the pulling force of the needle guide structure 21 in the extension direction is at a low level, and only one needle guide structure 21 receives a large load in the extension direction. Similarly, referring to FIG. 7, Figure 6b to Figure 6c , Figure 6b shows the transverse load of each needle guide structure 21 on the IGBT assembly 2 in the first vertical direction, Figure 6c shows the transverse load of each needle guide structure 21 on the IGBT assembly 2 in the second vertical direction, and the first vertical direction and the second vertical direction are perpendicular to each other. The transverse load can be the shear force of the needle guide structure 21 in the vertical direction. It can be seen that the needle guide structure 21 generally receives a large shear force in the first vertical direction and the second vertical direction, and some needle guide structures 21 receive a low shear force in the second vertical direction. It can be understood that the shear forces of the needle guide structure 21 in the first vertical direction and the second vertical direction can be combined into a shear resultant force in the vertical direction to describe the total transverse load of the needle guide structure 21 in the vertical direction. Exemplarily, the relationship between the transverse load and the shear forces of the needle guide structure 21 in the first vertical direction and the second vertical direction can be expressed as: wherein F sn is the transverse load; SF2 is the shear force of the needle guide structure 21 in the first vertical direction; and SF3 is the shear force of the needle guide structure 21 in the second vertical direction.

[0058] It can be understood that in the load stress analysis of the guide pin structure, the load of the guide pin structure is analyzed from multiple directions of the extension direction and the vertical direction, the stress conditions of the guide pin structure under different conditions are fully evaluated, the comprehensiveness of the analysis process is improved, the load stress state obtained is closer to the actual load of the guide pin structure, and then the accuracy of the analysis result is improved.

[0059] Referring to Figure 7 As an embodiment of the present application, a plurality of candidate installation schemes correspond to respective installation tolerances; the method further comprises: S250. According to the installation tolerance corresponding to any candidate installation scheme, tolerance setting is performed on the finite element model to obtain a tolerance model corresponding to the installation tolerance; S260. According to the installation steps of any candidate installation scheme, step-by-step load application is performed on the tolerance model, and load stress analysis is performed on the guide pin structure in the tolerance model after all installation steps are completed to obtain the load stress state of the guide pin structure under the installation tolerance.

[0060] Specifically, different candidate installation schemes can correspond to different installation tolerances in addition to the installation steps and sequences, and each installation step in the same candidate installation scheme can correspond to the same or different installation tolerances, and the installation tolerance will affect the size of the influence on the guide pin structure during installation. For any candidate installation scheme, before step-by-step load application is performed on the finite element model, tolerance setting is performed on the finite element model according to the installation tolerance corresponding to the any candidate installation scheme to obtain a finite element model corresponding to the installation tolerance as a tolerance model.

[0061] Further, according to the installation steps of the any candidate installation scheme, step-by-step load application is performed on the tolerance model to simulate the actual installation process of the any candidate installation scheme. After all installation steps are completed, load stress analysis is performed on the guide pin structure in the tolerance model to obtain the load stress state of the guide pin structure under the installation tolerance.

[0062] It can be understood that by simulating candidate installation schemes corresponding to different installation tolerances, safety analysis of the guide pin structure is performed according to the load stress state of the guide pin structure under different installation tolerances, and the optimal tolerance for installing the to-be-installed module can be determined. In addition to the sequence of installation steps, the influence of the installation tolerance on the structural strength of the guide pin structure is considered in the embodiment, which further improves the comprehensiveness of the analysis process, makes the obtained load stress state closer to the actual load of the guide pin structure, and further improves the accuracy of the analysis result.

[0063] Referring to Figure 8As shown, as an embodiment of the present application, the load stress state includes the axial load of the guide pin structure in the extension direction and the lateral load of the guide pin structure in the vertical direction; according to the load stress state, the safety analysis of the guide pin structure is performed to obtain the structural safety factor of any candidate installation scheme, including: S310. According to the axial load and the limit load of the guide pin structure in the extension direction, the axial safety analysis of the guide pin structure is performed to obtain the axial safety factor of the guide pin structure.

[0064] S320. According to the lateral load and the limit load of the guide pin structure in the vertical direction, the lateral safety analysis of the guide pin structure is performed to obtain the lateral safety factor of the guide pin structure.

[0065] S330. According to the axial safety factor and the lateral safety factor, the structural safety factor of any candidate installation scheme is obtained.

[0066] Specifically, the limit load of the guide pin structure in the extension direction and the vertical direction can be obtained by actually measuring the guide pin structure, for example, by using a force meter of an instrument such as a spring dynamometer to test the actual load of the guide pin structure, to determine the maximum load that the guide pin structure can withstand before breaking, as the limit load of the guide pin structure. In some embodiments, when the limit load of the guide pin structure in the extension direction is actually measured, the measurement direction needs to be coaxial with the extension direction of the guide pin structure. When the limit load of the guide pin structure in the vertical direction is actually measured, the measurement direction needs to be perpendicular to the guide pin structure. The circumferential angle of the guide pin structure in the vertical direction can be divided into multiple phases to measure multiple sets of load data, and the multiple sets of load data are averaged to obtain the limit load of the guide pin structure in the vertical direction. For example, the circumferential angle of the guide pin structure in the vertical direction can be divided into 12 phases, and multiple measurements are performed every 30 degrees to obtain 10 sets of data, thereby obtaining 120 sets of data for determining the limit load of the guide pin structure in the vertical direction.

[0067] Further, in the extension direction of the guide pin structure, the axial safety factor of the guide pin structure is obtained by proportional calculation according to the axial load and the limit load of the guide pin structure in the extension direction. In the vertical direction of the guide pin structure, the lateral safety factor of the guide pin structure is obtained by proportional calculation according to the lateral load and the limit load of the guide pin structure in the vertical direction. For example, the axial safety factor of the guide pin structure can be represented as: S factor1 = F a / F xn Wherein, S factor1 is the axial safety factor; F α is the limit load of the guide pin structure in the extension direction; F xnFor axial loads. The lateral safety factor of the guide pin structure can be expressed as: S factor2 =F t / F sn Among them, S factor2 F is the lateral safety factor. t F represents the ultimate load on the guide pin structure in the vertical direction. sn It is a lateral load. Understandably, both the axial and lateral safety factors should be greater than 1, indicating that the load in the corresponding direction is less than the ultimate load in that direction. If the safety factor in either direction is less than 1, it means that the load in that direction is greater than the ultimate load in that direction, at which point the guide pin structure has already broken, posing a safety risk.

[0068] Reference Figure 9 As shown, in one embodiment of this application, a target installation scheme is selected from multiple candidate installation schemes based on a structural safety factor, including: S410. Based on the preset safety threshold, the structural safety coefficient of all candidate installation schemes is used for safety screening to obtain a safety screening scheme.

[0069] S420. Based on the axial safety factor of each safety screening scheme, perform an axial safety assessment on the safety screening scheme to obtain the optimal axial scheme.

[0070] S430. Based on the horizontal security coefficients of each security screening scheme, perform a horizontal security assessment on the security screening schemes to obtain the horizontally optimal scheme.

[0071] S440. When the axial optimal solution and the lateral optimal solution are the same safety screening solution, the same safety screening solution shall be used as the target installation solution.

[0072] Specifically, the preset safety threshold can be determined by engineers based on their engineering experience and a comprehensive evaluation of the material of the guide pin structure and the type of load it is subjected to. When the structural safety factor is lower than the preset safety threshold, it indicates that the safety of the candidate installation scheme does not meet the preset requirements, and the candidate safety scheme is eliminated. Candidate installation schemes whose structural safety factors meet the preset safety threshold are selected as safety screening schemes. In some embodiments, if the structural safety factors of all candidate installation schemes do not meet the preset safety threshold, the candidate installation schemes need to be improved and the installation schemes redesigned.

[0073] Further, according to the axial safety factors of the safety screening schemes, the safety of all the safety screening schemes in the extension direction of the guide pin structure is evaluated, and the safety screening scheme with the highest axial safety factor is taken as the axial optimal scheme, indicating that the safety screening scheme has the highest safety in the extension direction of the guide pin structure. Similarly, according to the lateral safety factors of the safety screening schemes, the safety of all the safety screening schemes in the vertical direction of the guide pin structure is evaluated, and the safety screening scheme with the highest lateral safety factor is taken as the lateral optimal scheme, indicating that the safety screening scheme has the highest safety in the vertical direction of the guide pin structure.

[0074] Further, if the axial optimal scheme and the lateral optimal scheme are the same safety screening scheme, indicating that the safety screening scheme has the highest safety in the extension direction and the vertical direction of the guide pin structure, the safety screening scheme is taken as the target installation scheme for installing the to-be-installed module to maximize the safety of the guide pin structure.

[0075] Referring to Figure 10 As an embodiment of the present application, when the axial optimal scheme and the lateral optimal scheme are different safety screening schemes, the method further includes: S450. According to the axial safety factors of the safety screening schemes, the safety screening schemes are axially risk-evaluated to obtain an axial risk scheme.

[0076] S460. According to the lateral safety factors of the safety screening schemes, the safety screening schemes are laterally risk-evaluated to obtain a lateral risk scheme.

[0077] S470. According to the axial safety factors and the lateral safety factors of the axial risk scheme and the lateral risk scheme, the axial risk scheme and the lateral risk scheme are safety-optimized evaluated to obtain a target installation scheme.

[0078] Specifically, when the axial optimal scheme and the lateral optimal scheme are different safety screening schemes, it indicates that there is no safety screening scheme that can simultaneously achieve the highest safety in the extension direction and the vertical direction of the guide pin structure. At this time, the target installation scheme can be determined by determining a way with relatively lower risk in the extension direction and the vertical direction of the guide pin structure.

[0079] Further, according to the axial safety factor of the safety screening scheme, the risk of all safety screening schemes in the extension direction of the guide pin structure is evaluated, and the safety screening scheme with the lowest axial safety factor is taken as the axial risk scheme, indicating that the safety screening scheme has the highest risk in the extension direction of the guide pin structure. Similarly, according to the lateral safety factor of the safety screening scheme, the risk of all safety screening schemes in the vertical direction of the guide pin structure is evaluated, and the safety screening scheme with the lowest lateral safety factor is taken as the lateral risk scheme, indicating that the safety screening scheme has the highest risk in the vertical direction of the guide pin structure.

[0080] Further, according to the axial safety factor and the lateral safety factor of the axial risk scheme and the axial safety factor and the lateral safety factor of the lateral risk scheme, the maximum value of the above safety factors is extracted, the maximum value in the above safety factors is determined, and the risk scheme containing the maximum value is taken as the target installation scheme, so as to balance the safety and risk of the guide pin structure in different directions, maximize the influence of the guide pin structure in the installation process, and ensure the safety of the guide pin structure.

[0081] Correspondingly, please refer to Figure 11 The embodiment of the present application provides a module installation scheme evaluation device, which comprises: a model acquisition module 1110, which is used to acquire a finite element model of a to-be-installed module; wherein the to-be-installed module comprises a guide pin structure which will be affected by an installation process, and the to-be-installed module corresponds to a plurality of candidate installation schemes.

[0082] A step analysis module 1120 is configured to perform step-by-step load application on the finite element model according to the installation steps of any candidate installation scheme, perform load stress analysis on the guide pin structure after all installation steps are completed, and obtain a load stress state of the guide pin structure.

[0083] A safety analysis module 1130 is configured to perform safety analysis on the guide pin structure according to the load stress state, and obtain a structure safety factor of any candidate installation scheme.

[0084] A scheme selection module 1140 is configured to select a target installation scheme from the plurality of candidate installation schemes according to the structure safety factor, so as to install the to-be-installed module.

[0085] In some optional embodiments, the step analysis module 1120 comprises: A load step generation unit is configured to generate a plurality of installation load steps corresponding to the installation steps and the sequence of any candidate installation scheme.

[0086] An installation load application unit is configured to perform installation load application on the finite element model based on an initial installation step in the plurality of installation load steps, and obtain a partial installation model.

[0087] a step cycle unit configured to repeat the process of applying installation load to the partial installation model as the finite element model and taking the next installation step in the installation sequence as the initial installation step until all installation steps of any candidate installation scheme are completed, to obtain a post-installation model.

[0088] a load stress analysis unit configured to perform load stress analysis on the guide pin structure in the post-installation model to obtain a load stress state of the guide pin structure.

[0089] In some optional embodiments, the load stress analysis unit comprises: an axial stress analysis sub-unit configured to perform stress analysis on the guide pin structure in the extension direction of the guide pin structure to obtain an axial load of the guide pin structure.

[0090] a transverse stress analysis sub-unit configured to perform stress analysis on the guide pin structure in the vertical direction of the guide pin structure to obtain a transverse load of the guide pin structure.

[0091] a global stress analysis sub-unit configured to obtain the load stress state of the guide pin structure according to the axial load and the transverse load.

[0092] In some optional embodiments, the step analysis module 1120 further comprises: a model tolerance setting unit configured to set a tolerance for the finite element model according to the installation tolerance corresponding to any candidate installation scheme to obtain a tolerance model corresponding to the installation tolerance; a tolerance load analysis unit configured to apply installation load to the tolerance model step by step according to the installation steps of any candidate installation scheme, and perform load stress analysis on the guide pin structure in the tolerance model after all installation steps are completed to obtain the load stress state of the guide pin structure under the installation tolerance.

[0093] In some optional embodiments, the safety analysis module 1130 comprises: an axial coefficient calculation unit configured to perform axial safety analysis on the guide pin structure according to the axial load and the limit load of the guide pin structure in the extension direction to obtain an axial safety coefficient of the guide pin structure.

[0094] a transverse coefficient calculation unit configured to perform transverse safety analysis on the guide pin structure according to the transverse load and the limit load of the guide pin structure in the vertical direction to obtain a transverse safety coefficient of the guide pin structure.

[0095] a global coefficient calculation unit configured to obtain a structure safety coefficient of any candidate installation scheme according to the axial safety coefficient and the transverse safety coefficient.

[0096] In some optional embodiments, the scheme selection module 1140 comprises: The security screening unit is configured to screen the structural safety factors of all candidate installation schemes according to a preset security threshold to obtain security screening schemes.

[0097] The axial safety evaluation unit is configured to evaluate the security screening schemes according to the respective axial safety factors of the security screening schemes to obtain axial optimal schemes.

[0098] The lateral safety evaluation unit is configured to evaluate the security screening schemes according to the respective lateral safety factors of the security screening schemes to obtain lateral optimal schemes.

[0099] The scheme determination unit is configured to determine the same security screening scheme as the target installation scheme when the axial optimal scheme and the lateral optimal scheme are the same security screening scheme.

[0100] In some optional embodiments, the scheme selection module 1140 further includes: The axial risk evaluation unit is configured to evaluate the security screening schemes according to the respective axial safety factors of the security screening schemes to obtain axial risk schemes.

[0101] The lateral risk evaluation unit is configured to evaluate the security screening schemes according to the respective lateral safety factors of the security screening schemes to obtain lateral risk schemes.

[0102] The security optimization evaluation unit is configured to evaluate the axial risk schemes and the lateral risk schemes according to the respective axial safety factors and the lateral safety factors of the axial risk schemes and the lateral risk schemes to obtain the target installation scheme.

[0103] Further function descriptions of the above-mentioned modules and units are the same as those of the corresponding embodiments, and will not be described here.

[0104] The scheme installation scheme evaluation device in the embodiment is presented in the form of a functional unit. The unit herein refers to an ASIC (Application Specific Integrated Circuit) circuit, a processor and a memory executing one or more software or fixed programs, and / or other devices that can provide the above functions.

[0105] Please refer to Figure 12 , Figure 12is a structural schematic diagram of a computer device provided by an embodiment of the present application. As shown in the figure, the computer device comprises one or more processors 10, a memory 20, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. Various components are communicatively connected to each other by different buses, and can be installed on a common mainboard or in other manners as needed. The processor can process instructions executed in the computer device, including instructions stored in the memory or on the memory to display graphical information of a GUI on an external input / output device such as a display device coupled to the interface. In some optional embodiments, multiple processors and / or multiple buses can be used together with multiple memories and multiple memory banks, if needed. Also, multiple computer devices can be connected, each providing part of the necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Figure 12 The processor 10 is taken as an example in the embodiment.

[0106] The processor 10 can be a central processor, a network processor, or a combination thereof. The processor 10 can further include a hardware chip. The hardware chip can be an application specific integrated circuit, a programmable logic device, or a combination thereof. The programmable logic device can be a complex programmable logic device, a field programmable logic device, a general array logic, or any combination thereof.

[0107] The memory 20 stores instructions executable by the at least one processor 10, so that the at least one processor 10 executes the method shown in the above embodiment.

[0108] The memory 20 can include a program storage area and a data storage area. The program storage area can store an operating system and application programs required by at least one function; the data storage area can store data created according to the use of the computer device, and the like. In addition, the memory 20 can include a high-speed random access memory, and can also include a non-transitory memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transitory solid-state memory device. In some optional embodiments, the memory 20 can optionally include a memory remotely arranged with respect to the processor 10, which can be connected to the computer device through a network. Examples of the network include but are not limited to the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof.

[0109] The memory 20 can include a volatile memory, such as a random access memory; the memory can also include a non-volatile memory, such as a flash memory, a hard disk, or a solid-state disk; and the memory 20 can further include a combination of the above kinds of memories.

[0110] The computer device also includes a communication interface 30 for the computer device to communicate with other devices or communication networks.

[0111] The embodiments of the present application further provide a computer readable storage medium, and the method according to the embodiments of the present application can be implemented in hardware, firmware, or recorded in a storage medium, or be implemented as computer code to be originally stored in a remote storage medium or a non-transitory machine readable storage medium and stored in a local storage medium through network downloading, so that the method described herein can be processed by such software on a storage medium using a general computer, a special processor, or programmable or special hardware. The storage medium can be a magnetic disk, an optical disk, a read-only memory, a random access memory, a flash memory, a hard disk, or a solid state disk, etc. Further, the storage medium can also include a combination of the above-mentioned memories. It can be understood that the computer, the processor, the microprocessor controller, or the programmable hardware includes a storage component that can store or receive software or computer code, and when the software or computer code is accessed and executed by the computer, the processor, or the hardware, the method shown in the above embodiments is implemented.

[0112] The embodiments of the present application provide a computer program product, which includes computer instructions stored in a computer readable storage medium. The processor of the computer device reads the computer instructions from the computer readable storage medium, and the processor executes the computer instructions, so that the computer device executes the method of any of the embodiments of the present application.

[0113] Although the embodiments of the present application are described with reference to the drawings, various modifications and changes can be made by those skilled in the art without departing from the spirit and scope of the present application, and such modifications and changes fall within the scope defined by the appended claims.

[0114] The system, device, module or unit illustrated in the above embodiments can be specifically implemented by a computer chip or entity, or by a product with certain function. A typical implementation device is a computer. Specifically, the computer can be, for example, a personal computer, a laptop computer, a cellular phone, a camera phone, a smart phone, a personal digital assistant, a media player, a navigation device, an email device, a game console, a tablet computer, a wearable device, or a combination of any of these devices.

[0115] For the convenience of description, the above device is described as various units divided by functions. Of course, the functions of each unit can be implemented in the same or more software and / or hardware when implementing the present application.

[0116] Those skilled in the art will appreciate that embodiments of the application can be readily used as a method, a system or a computer program product. Accordingly, the application can take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the application can take the form of a computer program product on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROMs, optical storage devices, etc.) embodying computer-readable program code.

[0117] The application is described in relation to flow diagrams and / or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the application. It is understood that each block of the flow diagrams and / or block diagrams, and combinations of blocks in the flow diagrams and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flow diagrams and / or block diagrams block or blocks. Figure 1 The flow diagrams and / or block diagrams in the various figures present means for performing the specified functions with the flow diagrams and / or block diagrams, combinations of means for performing the specified functions with the flow diagrams and / or block diagrams, and combinations of means for performing the specified functions with the flow diagrams and / or block diagrams. Figure 1 The flow diagrams and / or block diagrams in the various figures present means for performing the specified functions with the flow diagrams and / or block diagrams, combinations of means for performing the specified functions with the flow diagrams and / or block diagrams, and combinations of means for performing the specified functions with the flow diagrams and / or block diagrams.

[0118] These computer program instructions can also be stored in a computer- readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instructions which implement the flow diagrams and / or block diagrams. Figure 1 The flow diagrams and / or block diagrams in the various figures present means for performing the specified functions with the flow diagrams and / or block diagrams, combinations of means for performing the specified functions with the flow diagrams and / or block diagrams, and combinations of means for performing the specified functions with the flow diagrams and / or block diagrams. Figure 1 The flow diagrams and / or block diagrams in the various figures present means for performing the specified functions with the flow diagrams and / or block diagrams, combinations of means for performing the specified functions with the flow diagrams and / or block diagrams, and combinations of means for performing the specified functions with the flow diagrams and / or block diagrams.

[0119] These computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the flow diagrams and / or block diagrams. Figure 1 The flow diagrams and / or block diagrams in the various figures present means for performing the specified functions with the flow diagrams and / or block diagrams, combinations of means for performing the specified functions with the flow diagrams and / or block diagrams, and combinations of means for performing the specified functions with the flow diagrams and / or block diagrams. Figure 1 The flow diagrams and / or block diagrams in the various figures present means for performing the specified functions with the flow diagrams and / or block diagrams, combinations of means for performing the specified functions with the flow diagrams and / or block diagrams, and combinations of means for performing the specified functions with the flow diagrams and / or block diagrams.

[0120] It should also be noted that the terms "comprises" and / or "comprising", or "includes" and / or "including" when used in this specification, specify the presence of stated features, integers, steps, operations, elements, or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof. In the context of the specification, the term "and / or" means "and" or "or", and the term "or" means "and" or "or". In the context of the specification, the term "exemplary" means "example" or "an example of".

[0121] Each of the embodiments in the specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other. Each of the embodiments focuses on the difference from other embodiments. In particular, for the system embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the part of the method embodiments.

[0122] The above only describes the embodiments of the present application and is not intended to limit the present application. Those skilled in the art can make various modifications and changes to the present application. Any modification, equivalent replacement, improvement, etc. within the spirit and principle of the present application shall be included in the scope of the claims of the present application.

[0123] Although the embodiments of the present application are described in conjunction with the drawings, those skilled in the art can make various modifications and changes without departing from the spirit and scope of the present application, and such modifications and changes fall within the scope defined by the appended claims.

Claims

1. A method for evaluating module installation schemes, characterized in that, The method comprises: acquiring a finite element model of a module to be installed; wherein the module to be installed contains a guide pin structure that will be affected by the installation process, and the module to be installed corresponds to a plurality of candidate installation schemes; according to the installation steps of any candidate installation scheme, performing step-by-step load application on the finite element model, and after completing all installation steps, performing load stress analysis on the guide pin structure to obtain the load stress state of the guide pin structure; according to the load stress state, performing safety analysis on the guide pin structure to obtain the structural safety factor of the any candidate installation scheme; according to the structural safety factor, selecting a target installation scheme from the plurality of candidate installation schemes for installing the module to be installed.

2. The method of claim 1, wherein, The method according to the installation steps of any candidate installation scheme, performing step-by-step load application on the finite element model, and after completing all installation steps, performing load stress analysis on the guide pin structure to obtain the load stress state of the guide pin structure, comprises: according to the installation steps and their order of the any candidate installation scheme, generating a plurality of corresponding installation load steps; based on an initial installation step in the plurality of installation load steps, performing installation load application on the finite element model to obtain a partial installation model; taking the partial installation model as a finite element model, taking a next installation step of the initial installation step in the installation order as the initial installation step, repeating the above installation load application process until all installation steps of the any candidate installation scheme are completed, and obtaining an installed model; performing load stress analysis on the guide pin structure in the installed model to obtain the load stress state of the guide pin structure.

3. The method of claim 2, wherein, The method of performing load stress analysis on the guide pin structure in the installed model to obtain the load stress state of the guide pin structure comprises: performing stress analysis on the guide pin structure in the extension direction of the guide pin structure to obtain the axial load of the guide pin structure; performing stress analysis on the guide pin structure in the vertical direction of the guide pin structure to obtain the lateral load of the guide pin structure; and obtaining the load stress state of the guide pin structure according to the axial load and the lateral load.

4. The method of claim 1, wherein, The plurality of candidate installation schemes correspond to respective installation tolerances; the method further comprises: according to the installation tolerance corresponding to the any candidate installation scheme, performing tolerance setting on the finite element model to obtain a tolerance model corresponding to the installation tolerance; according to the installation steps of the any candidate installation scheme, performing step-by-step load application on the tolerance model, and after completing all installation steps, performing load stress analysis on the guide pin structure in the tolerance model to obtain the load stress state of the guide pin structure under the installation tolerance.

5. The method of claim 1, wherein, The load stress state includes an axial load borne by the guide pin structure in an extension direction and a lateral load borne by the guide pin structure in a vertical direction; the safety analysis of the guide pin structure according to the load stress state to obtain the structural safety factor of any candidate installation scheme includes: axial safety analysis of the guide pin structure according to the axial load and a limit load of the guide pin structure in the extension direction to obtain an axial safety factor of the guide pin structure; lateral safety analysis of the guide pin structure according to the lateral load and a limit load of the guide pin structure in the vertical direction to obtain a lateral safety factor of the guide pin structure; the structural safety factor of any candidate installation scheme is obtained according to the axial safety factor and the lateral safety factor.

6. The method of claim 5, wherein, The selection of the target installation scheme from the multiple candidate installation schemes according to the structural safety factor includes: safety screening of the structural safety factors of all candidate installation schemes according to a preset safety threshold to obtain safety screening schemes; axial safety evaluation of the safety screening schemes according to respective axial safety factors of the safety screening schemes to obtain an axial optimal scheme; lateral safety evaluation of the safety screening schemes according to respective lateral safety factors of the safety screening schemes to obtain a lateral optimal scheme; when the axial optimal scheme and the lateral optimal scheme are the same safety screening scheme, the same safety screening scheme is taken as the target installation scheme.

7. The method of claim 6, wherein, when the axial optimal scheme and the lateral optimal scheme are different safety screening schemes, the method further includes: axial risk evaluation of the safety screening schemes according to respective axial safety factors of the safety screening schemes to obtain an axial risk scheme; lateral risk evaluation of the safety screening schemes according to respective lateral safety factors of the safety screening schemes to obtain a lateral risk scheme; safety optimization evaluation of the axial risk scheme and the lateral risk scheme according to respective axial safety factors and lateral safety factors of the axial risk scheme and the lateral risk scheme to obtain the target installation scheme.

8. A modular installation scheme evaluation device, characterized by The device includes: a model acquisition module configured to acquire a finite element model of a to-be-installed module; the to-be-installed module includes a guide pin structure that will be affected by an installation process, and the to-be-installed module corresponds to multiple candidate installation schemes; a step analysis module configured to perform step-by-step load application on the finite element model according to installation steps of any candidate installation scheme, and perform load stress analysis on the guide pin structure after all installation steps are completed to obtain a load stress state of the guide pin structure; a safety analysis module configured to perform safety analysis of the guide pin structure according to the load stress state to obtain a structural safety factor of the any candidate installation scheme; a scheme selection module configured to select a target installation scheme from the multiple candidate installation schemes according to the structural safety factor, so as to install the to-be-installed module.

9. A computer device, comprising: includes: A memory and a processor, which are connected in communication with each other, the memory storing computer instructions, and the processor executing the computer instructions to perform the method of any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer readable storage medium stores computer instructions for causing a computer to perform the method of any one of claims 1 to 7.

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