Low-temperature satellite communication terminal equipment and development method thereof

Abstract

The invention relates to the technical field of satellite communication, and discloses low-temperature satellite communication terminal equipment and a development method thereof.The equipment comprises a high-temperature operation module, a temperature sensitive module, a cooperative thermal management system and a dual-mode antenna assembly, the thermal management system comprises a refrigeration sheet connected with the two modules and a resistance wire arranged on the sensitive module; the method comprises the steps that during low-temperature starting, a central processing unit controls a refrigeration sheet to pump waste heat of a high-temperature operation module, and a resistance wire is started to cooperatively heat a temperature sensitive module to a working threshold value; starting a communication unit to establish a wireless local area network, and converging local monitoring data; in an independent time slice, stopping the wireless local area network, and transmitting satellite uplink data through the phased-array antenna; during transmission, the annular isolation cavity and the antenna ground plane form a cut-off resonant cavity, leaked satellite signals are attenuated, and radio frequency isolation is achieved. The problems of difficult starting in a low-temperature environment and electromagnetic interference of dual-mode communication are solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of satellite communication, in particular to a low-temperature satellite communication terminal device and a development method thereof. BACKGROUND

[0002] The satellite communication terminal device is a key node for realizing data backhaul in remote areas, and has been widely used in the fields of power grid monitoring, environmental exploration, etc. These application scenarios are often in high latitude or high altitude areas, and the environmental conditions are harsh, especially in winter, facing extreme low temperature challenges. The existing satellite terminal device is designed, and the core electronic components sensitive to temperature inside, such as clock unit and data storage unit, will have a sharp decline in performance at low temperature or even cannot start normally, resulting in failure of the device at the critical moment, which seriously affects its environmental adaptability and working reliability.

[0003] In addition, in order to improve the flexibility and efficiency of data acquisition, modern satellite terminal devices tend to be integrated and multifunctional, and need to integrate short-distance communication function in the device itself, which can first gather the data of surrounding monitoring points, and then report uniformly through satellite link. However, the integration of high-power satellite uplink transmitting antenna and low-power local wireless communication antenna in the compact single device shell will cause serious electromagnetic compatibility problem. The high-power radio frequency signal generated during satellite uplink transmission is easy to leak and interfere with the low-power local communication receiving link, resulting in data reception interruption or error code. This internal electromagnetic interference problem limits the improvement of device function integration, and also makes it difficult to ensure the link quality when multiple communication modes coexist. SUMMARY

[0004] In view of the deficiencies of the prior art, the present application provides a low-temperature satellite communication terminal device and a development method thereof, which solves the problems of reduced operation reliability of the existing satellite communication terminal due to the fact that the working temperature of the core components does not meet the requirements in low-temperature environment, and serious radio frequency interference between the satellite uplink antenna and the wireless local area network antenna integrated in the compact structure.

[0005] To achieve the above purpose, the first aspect of the present application provides a low-temperature satellite communication terminal device, comprising: a shell, an antenna top cover is fixedly connected to the outer side of the shell, a dual-mode antenna assembly is arranged in the shell, a high-temperature running module is fixedly connected in the shell, a heat-conducting gasket is fixedly connected to the outer side of the high-temperature running module, a temperature-sensitive module is fixedly connected in the shell for accommodating temperature-sensitive components, a heat exchange bridge is arranged between the high-temperature running module and the temperature-sensitive module, and a plurality of refrigeration fins are fixedly connected to the top of the heat exchange bridge. The cooling fin performs active heat pumping between the high-temperature operating module and the temperature-sensitive module based on the Peltier effect through an applied current. When the temperature-sensitive module needs to be warmed up, the cooling fin actively transfers the heat generated by the high-temperature operating module to the temperature-sensitive module. The heat transferred to the temperature-sensitive module may be characterized by the following formula: ; wherein, represents the total heat transferred to the temperature-sensitive module side by the cooling fin; represents the Seebeck coefficient of the cooling fin; represents the driving current applied to the cooling fin; represents the thermodynamic temperature of the side of the cooling fin in contact with the temperature-sensitive module; represents the heat generated by the Peltier effect, which is the net heat pumped from the cold end to the hot end of the cooling fin; represents the internal resistance of the cooling fin; represents the overall thermal conductivity of the cooling fin; represents the heat generated by the Joule effect, which is generated due to the existence of the internal resistance of the cooling fin when the current flows through represents half of the total heat flowing to the hot end; represents the thermodynamic temperature of the side of the cooling fin in contact with the high-temperature operating module; represents the heat loss generated by the heat conduction effect, which is the heat conducted back from the hot end to the cold end due to the temperature difference between the hot end and the cold end.

[0006] The dual-mode antenna assembly comprises a ring-shaped isolation cavity, a plurality of slot antennas are fixedly connected outside the ring-shaped isolation cavity, an antenna ground plane is fixedly connected to the top of the ring-shaped isolation cavity, and a phased array antenna is fixedly connected to the top of the antenna ground plane. The antenna ground plane and the ring-shaped isolation cavity jointly form a closed ring-shaped resonant cavity. The geometric size of the closed ring-shaped resonant cavity is set to make it present a high attenuation characteristic to the operating frequency of the phased array antenna, thereby forming a waveguide attenuator working in a cutoff state. For electromagnetic waves with a frequency lower than the cutoff frequency, the attenuation amount may be characterized by the following formula: ; wherein, is a constant for converting the natural attenuation amount in units of Nepers (Nepers) into the engineering attenuation amount in units of decibels (dB); represents the total attenuation amount of the closed ring-shaped resonant cavity to the leaked satellite signal, in units of decibels (dB); effective length of the propagation path of the leaked satellite signal in the cavity; propagation speed of the electromagnetic wave in the medium inside the cavity; effective electrical length of the normalized propagation path, representing the effective length of the leaked satellite signal in the cavity that experiences attenuation; cut-off frequency of the closed ring resonant cavity, which is determined by the geometric size of the cavity; frequency of the high-frequency satellite signal emitted by the phased array antenna. By multiplying the frequency of the satellite signal by the normalized propagation path length, the effective attenuation of the satellite signal is achieved; frequency attenuation factor, which determines the magnitude of the attenuation. When the signal frequency of the phased array antenna is lower than the cut-off frequency of the closed ring resonant cavity , the term is a real number, indicating that the signal enters the attenuation mode.

[0007] Preferably, the temperature-sensitive module includes a data storage unit, a clock unit is arranged outside the data storage unit, a communication unit is arranged outside the data storage unit, a temperature sensor is arranged outside the data storage unit, and a battery pack is fixedly connected to the bottom of the temperature-sensitive module. The radio frequency output of the communication unit is connected to the ring isolation cavity.

[0008] Preferably, the high-temperature operation module includes a central processing unit and a radio frequency power output unit, the central processing unit is used for performing overall operation of the satellite communication terminal device, and the radio frequency power output unit is used for driving emission of the satellite signal. A plurality of heat dissipation fins are fixedly connected to the outside of the shell to form a preferential heat dissipation area, and the high-temperature operation module is tightly attached to the preferential heat dissipation area through the heat-conducting gasket.

[0009] Preferably, a plurality of resistance wires are fixedly connected in the side wall of the temperature-sensitive module for overall temperature preservation of the temperature-sensitive module.

[0010] Preferably, the ring isolation cavity is fixedly connected inside the shell, and the ring isolation cavity is used for receiving signals of the communication unit and radiating through the slot antenna.

[0011] Preferably, an interface operation panel is arranged on the outside of the shell, and handles are fixedly connected to both sides of the shell.

[0012] The second aspect of the present application provides a development method of a low-temperature type satellite communication terminal device, which is applied to the low-temperature type satellite communication terminal device described above and includes the following steps: ​S1, monitoring the internal temperature of the temperature sensitive module in real time through a temperature sensor, and starting the heating of the temperature sensitive module by the resistance wire when the internal temperature is lower than a preset working temperature, so that the satellite communication terminal device is in a runnable state; S2, after the satellite communication terminal device is in the runnable state, establishing a wireless local area network through the annular isolation cavity and the slot antenna, receiving and converging the monitoring data from the power grid monitoring device, and storing the monitoring data in a data storage unit; S3, adopting a time division duplex mode, and allocating an independent satellite uplink transmission time slice for the satellite uplink transmission after the monitoring data convergence is completed; S4, during the satellite uplink transmission time slice, transmitting the monitoring data stored in the data storage unit to the monitoring center through the phased array antenna uplink transmission, and utilizing the closed annular resonant cavity to attenuate the high-frequency satellite signals leaked by the phased array antenna, so as to realize the physical radio frequency isolation.

[0013] Preferably, in step S1, the step of heating the temperature sensitive module further comprises: actively pumping the heat between the high-temperature running module and the temperature sensitive module through the refrigeration sheet, and cooperatively regulating the temperature of the temperature sensitive module.

[0014] Preferably, in step S4, the geometric size of the closed annular resonant cavity is designed to present high impedance and high attenuation characteristics to the high-frequency satellite signals, so as to complete the band elimination filter effect.

[0015] Preferably, in step S3, the time division duplex mode is used to determine that the wireless local area network data receiving time slice for receiving the monitoring data and the satellite uplink transmission time slice do not overlap in time.

[0016] The application provides a low-temperature satellite communication terminal device and a development method thereof. 1. The application realizes the double temperature protection of the core temperature sensitive components by heating the temperature sensitive module through the resistance wire and actively pumping the heat generated by the high-temperature running module to the temperature sensitive module through the refrigeration sheet. This cooperative heating method not only responds quickly, but also effectively utilizes the waste heat generated by the device itself, thereby improving the running stability and environmental adaptability of the terminal device in the severe cold and low temperature environment.

[0017] 2、The application ingeniously uses the cut-off attenuation characteristic of the resonant cavity to high frequency satellite signals by setting the antenna ground plane and the ring-shaped isolation cavity as a whole, which together form a closed ring-shaped resonant cavity and is physically placed between the phased array antenna and the slot antenna.

[0018] 3、The application allocates time slices for the data reception of the wireless local area network and the satellite uplink transmission by adopting the time division duplex mode, which avoids the synchronization conflict of the transmitting and receiving signals, further enhances the electromagnetic compatibility of the equipment by the physical isolation of the closed ring-shaped resonant cavity, realizes the accommodation of the two sets of antenna systems in the compact physical space, and ensures the integrity and efficiency of the data link. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 is a perspective view of the application; Figure 2 is a structure schematic view of the fin of the application; Figure 3 is a sectional view schematic view of the casing of the application; Figure 4 is a structure schematic view of the phased array antenna of the application; Figure 5 is a structure schematic view of the ring-shaped isolation cavity of the application; Figure 6 is a schematic view of the heat exchange bridge of the application; Figure 7 is a sectional view schematic view of the high temperature operation module of the application; Figure 8 is a structure schematic view of the refrigeration fin of the application; Figure 9 is a structure schematic view of the temperature sensor of the application; Figure 10 is a structure schematic view of the battery pack of the application; Figure 11 is a flow chart of the low temperature type satellite communication terminal equipment development method in the embodiment of the application.

[0020] Wherein, 1, the shell; 2, antenna top cover;3, antenna ground plane;4, slot antenna;5, annular isolation cavity;6, high temperature operation module;7, heat-conducting gasket;8, central processing unit;9, radio frequency power output unit;10, heat exchange bridge;11, refrigeration piece;12, temperature sensitive module;13, data storage unit;14, clock unit;15, communication unit;16, battery pack;17, heat sink;18, handle;19, interface operation panel;20, phased array antenna;21, resistance wire;22, temperature sensor. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the specification of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0022] Refer to the accompanying drawings Figure 1 - the accompanying drawings Figure 10 The present application provides a low-temperature satellite communication terminal device, which includes an external shell 1, internal functional modules and components distributed on the inside and outside in physical structure.

[0023] The satellite communication terminal device includes a shell 1, the outer side of which is fixedly connected with an antenna top cover 2, and the inside of which is provided with a dual-mode antenna assembly, and the inside of the shell 1 is fixedly connected with a high-temperature operation module 6, the outer side of which is fixedly connected with a heat-conducting gasket 7, and the inside of the shell 1 is fixedly connected with a temperature sensitive module 12 for accommodating temperature sensitive components, and a heat exchange bridge 10 is arranged between the high-temperature operation module 6 and the temperature sensitive module 12, the top of the heat exchange bridge 10 is fixedly connected with a plurality of refrigeration pieces 11 for actively pumping heat between the high-temperature operation module 6 and the temperature sensitive module 12.

[0024] Specifically, the shell 1 serves as an external protective carrier of the satellite communication terminal device as a whole, can provide physical protection for all internal functional modules, isolate external environmental interference such as low temperature, dust and impact, and ensure stable operation of internal components; the antenna top cover 2 directly protects the dual-mode antenna assembly, prevents external foreign matter and water vapor from entering the antenna area, avoids damage to the antenna due to environmental factors, ensures the signal transmission and reception function of the antenna, cooperates with the shell 1 to form a relatively closed space, assists in maintaining the internal temperature environment of the device, reduces the direct impact of external low temperature on the internal temperature sensitive module 12, and creates favorable conditions for stable operation of the thermal management system; the dual-mode antenna assembly is used to realize two completely different communication modes; the high-temperature operating module 6 is the main heat generating module of the satellite communication terminal device; the heat-conducting gasket 7 is used to reduce thermal resistance, so that the excess heat generated by the high-temperature operating module 6 can be efficiently conducted to the heat sink 17, avoiding overheating of the high-temperature operating module 6 due to heat accumulation; the temperature sensitive module 12 is a special containing structure for temperature sensitive components, which concentrates the temperature sensitive components to form a relatively independent temperature control area, facilitates accurate temperature regulation by the thermal management system resistance wire 21 and cooling fin 11, and avoids damage to individual components due to temperature fluctuations; the heat exchange bridge 10 physically connects the high-temperature operating module 6 and the temperature sensitive module 12, builds a controlled heat transfer channel between the two, provides a fixed installation carrier for the cooling fin 11, ensures that the cooling fin 11 can stably contact the two modules, and realizes accurate heat pumping; the cooling fin 11 is based on the Peltier effect, actively pumps heat between the high-temperature operating module 6 and the temperature sensitive module 12 by applying a driving current, realizes waste heat recovery, and reduces the additional energy consumption of the device.

[0025] The interface operation panel 19 is arranged on the outer side of the shell 1, and the shell 1 is fixedly connected with the handle 18 on both sides.

[0026] Specifically, the interface operation panel 19 integrates various interfaces and operation controls of the device, provides a convenient device connection and operation channel for the staff, facilitates external power supply, device parameter debugging, data reading, etc., and improves the operability and maintenance convenience of the device; the handle 18 provides a convenient carrying and moving structure for the device, facilitates the staff to transfer the device at power grid monitoring points in different working scenes such as outdoor low temperature environment, reduces the difficulty of carrying the device, and improves the portability and use flexibility of the device.

[0027] Referring to the accompanying drawings Figure 1 - the accompanying drawings Figure 5 The dual-mode antenna assembly is physically arranged in a vertical stacking layout and is fixed to the inner side of the antenna top cover 2; the phased array antenna 20 is located at the uppermost part of the dual-mode antenna assembly and is used to transmit high-frequency uplink signals to the satellite; the antenna ground plane 3 is arranged directly below the phased array antenna 20 and serves as a ground plane for its radiation performance; the annular isolation chamber 5 is located below the antenna ground plane 3.

[0028] In this embodiment, the antenna ground plane 3 serves as a metallic roof of the annular isolation cavity 5, and together they form a closed annular resonant cavity; the outer sidewall of the annular isolation cavity 5 is provided with a plurality of slot antennas 4.

[0029] The dual-mode antenna assembly realizes two functions in structure: First, the dual-mode antenna assembly is used as a wireless local area network antenna, the radio frequency output port of the communication unit 15 inside the temperature-sensitive module 12 is connected to the feed point of the annular isolation cavity 5 through a radio frequency cable. The annular isolation cavity 5 at this time serves as a feed network, coupling the wireless local area network signal (for example, working in the 2.4GHz or 5GHz frequency band) to the plurality of slot antennas 4 on its outer wall, and radiating through the slot antennas 4 to the space around the device to establish a wireless local area network connection.

[0030] Second, the dual-mode antenna assembly is used as a radio frequency isolation structure. The high-frequency satellite signal (for example, working in the Ku or Ka frequency band, whose frequency is ) transmitted by the phased array antenna 20 has high power, and part of the leakage signal will inevitably propagate downward through the antenna ground plane 3, causing interference to sensitive electronic devices such as the communication unit 15 located below.

[0031] In this embodiment, the closed annular resonant cavity formed by the antenna ground plane 3 and the annular isolation cavity 5 is precisely designed in terms of its geometric dimensions such as inner diameter, outer diameter and height, so that it serves as a cutoff waveguide attenuator for the high-frequency satellite signal . The annular isolation cavity exhibits high attenuation characteristics for electromagnetic waves below its cutoff frequency , and the amount of attenuation can be characterized by the following formula: ; wherein is a constant used to convert the natural attenuation in units of Nepers to the engineering attenuation in units of decibels (dB); represents the total attenuation of the closed annular resonant cavity to the leaked satellite signal, in units of decibels (dB); represents the effective length of the propagation path of the leaked satellite signal in the cavity; represents the propagation speed of the electromagnetic wave in the medium inside the cavity; is the normalized propagation path length, representing the effective electrical length of the leaked satellite signal experiencing attenuation in the cavity; represents the cutoff frequency of the closed annular resonant cavity, which is determined by the geometric dimensions of the cavity; represents the frequency of the high-frequency satellite signal transmitted by the phased array antenna 20. By designing to be greater than This achieves effective attenuation of satellite signals; The frequency attenuation factor determines the magnitude of the attenuation. When the frequency of the high-frequency satellite signal from the phased array antenna 20... Below the cutoff frequency of the closed ring resonator When this value is real, it indicates that the signal has entered attenuation mode.

[0032] In this embodiment, by selecting the geometric dimensions of the annular isolation cavity 5, the cutoff frequency of the closed annular resonant cavity is adjusted. Designed to be higher than the frequency of high-frequency satellite signals from the phased array antenna 20 Therefore, when the frequency of the leaked high-frequency satellite signal... When it enters a closed ring resonant cavity, it is in a cutoff state and cannot propagate effectively within the closed ring resonant cavity. Instead, it will propagate along the effective length of the leakage path. Rapid decay.

[0033] This design creates a physical radio frequency barrier between the high-power radiation area of ​​the phased array antenna 20 and the sensitive receiving area of ​​the communication unit 15, achieving highly efficient radio frequency isolation.

[0034] In a specific implementation, the antenna ground plane 3 and the annular isolation cavity 5 are integrally formed from conductive metal materials, such as aluminum alloy or copper, to ensure good conductivity and structural stability. The dimensions (length and width) of the slot antenna 4 are precisely calculated based on the operating center frequency of the wireless LAN to obtain optimal radiation efficiency; the phased array antenna 20 can be a microstrip patch antenna array.

[0035] See attached document Figure 1 - Appendix Figure 10 In this embodiment, the collaborative thermal management system is used to regulate the temperature of the high-temperature operation module 6 and the temperature-sensitive module 12. The high-temperature operation module 6 and the temperature-sensitive module 12 are separated inside the housing 1 to achieve basic thermal isolation.

[0036] The heat exchange bridge 10 is physically connected between the high-temperature operation module 6 and the temperature-sensitive module 12, serving as a controlled heat transfer channel between the two. Multiple cooling plates 11 are fixedly connected to the top of the heat exchange bridge 10, with the cold end of the cooling plate 11 contacting the high-temperature operation module 6 and the hot end contacting the temperature-sensitive module 12.

[0037] Cooler 11 is based on the Peltier effect, through the driving current applied to it. Active heat pumping is performed between the high-temperature operating module 6 and the temperature-sensitive module 12. In a low-temperature environment, when the temperature-sensitive module 12 needs to be warmed up, the cooling fin 11 is activated to actively transfer the heat generated by the high-temperature operating module 6 to the temperature-sensitive module 12, and the heat transferred to the temperature-sensitive module 12 It can be characterized by the following formula: ; Wherein, represents the total heat transferred to the side of the temperature-sensitive module 12 by the cooling fin 11; represents the Seebeck coefficient of the cooling fin 11; represents the driving current applied to the cooling fin 11; represents the thermodynamic temperature of the side of the cooling fin 11 in contact with the temperature-sensitive module 12; is the heat generated by the Peltier effect, representing the net heat pumped from the cold end to the hot end of the cooling fin 11; represents the internal resistance of the cooling fin 11; represents the overall thermal conductivity of the cooling fin 11; is the heat generated by the Joule effect, representing the heat generated when the current flows through the cooling fin 11 due to the existence of internal resistance Half of the total heat flows to the hot end; represents the thermodynamic temperature of the side of the cooling fin 11 in contact with the high-temperature operating module 6; is the heat loss generated by the heat conduction effect, representing the heat conducted back from the hot end to the cold end due to the temperature difference between the hot end and the cold end.

[0038] At the same time, a plurality of resistance wires 21 are fixedly connected in the side wall of the temperature-sensitive module 12. The resistance wires 21 act as a direct heat source and generate Joule heat by applying current when starting at low temperature, thereby overall heating and rapidly heating the temperature-sensitive module 12. The heating action of the resistance wires 21 is coordinated with the heat pumping action of the cooling fin 11, and together the internal temperature of the temperature-sensitive module 12 is rapidly raised and maintained within the preset working temperature range.

[0039] For the excess heat generated by the high-temperature operating module 6, a plurality of heat dissipation fins 17 are fixedly connected to the outside of the casing 1 to form a preferential heat dissipation area. The high-temperature operating module 6 is tightly attached to the preferential heat dissipation area through the heat-conducting gasket 7, which is used to fill the small gaps in the contact interface and reduce the thermal resistance, so that the heat of the high-temperature operating module 6 can be efficiently conducted to the heat dissipation fins 17 and dissipated to the external environment.

[0040] Referring to the accompanying Figure 3 , the internal electronic module in this embodiment is physically divided into two independent parts, the high-temperature operating module 6 and the temperature-sensitive module 12.

[0041] Referring to the drawings Figure 3 , the drawings Figure 6 , and the drawings Figure 7 , the high-temperature operating module 6 encapsulates components that generate the majority of heat during device operation and are not sensitive to low temperatures. The high-temperature operating module 6 includes a central processing unit 8 and a radio frequency power output unit 9. The central processing unit 8 is used to perform overall operations of the terminal device, including data processing, state monitoring, and control instruction issuing to each functional unit of the device. The radio frequency power output unit 9 is connected to the central processing unit 8, receives uplink data signals sent by the central processing unit 8, and feeds the amplified power of the central processing unit 8 to the phased array antenna 20 to complete satellite signal transmission.

[0042] Referring to the drawings Figure 3 , the drawings Figure 6 , the drawings Figure 9 , and the drawings Figure 10 , the temperature-sensitive module 12 is in a box structure and is used to accommodate components whose performance parameters have high requirements on operating temperature. The temperature-sensitive module 12 is fixedly connected with a data storage unit 13, a clock unit 14, a communication unit 15, a battery pack 16, and a temperature sensor 22 inside.

[0043] The battery pack 16 is fixed at the bottom of the temperature-sensitive module 12 and provides operating power required by the entire terminal device. The clock unit 14 provides a high-precision time reference signal for the central processing unit 8, so as to ensure synchronization of internal processing procedures of the device. The data storage unit 13 is connected to the central processing unit 8 and is used to buffer monitoring data aggregated by the wireless local area network.

[0044] The communication unit 15 is a wireless local area network transceiver unit, a data port of which is connected to the central processing unit 8, and a radio frequency output port of which is connected to a feed point of the annular isolation cavity 5 through a coaxial cable. The communication unit 15 is responsible for establishing a wireless local area network link to receive external monitoring data under the control of the central processing unit 8. The temperature sensor 22 is arranged inside the temperature-sensitive module 12 and is used to sense the temperature inside the module in real time and feed temperature data to the central processing unit 8, so as to constitute a closed-loop control input of the thermal management system.

[0045] In a specific implementation, the clock unit 14 is a temperature-compensated crystal oscillator (TCXO) to provide a high-stability clock reference in a wide temperature range. The data storage unit 13 is an industrial-grade NAND flash chip. The central processing unit 8 can communicate data with the data storage unit 13, the communication unit 15, and other peripherals through a serial peripheral interface (SPI) bus or a universal asynchronous receiver-transmitter (UART) interface.

[0046] Referring to the drawings Figure 11The application provides a development method of a low-temperature satellite communication terminal device. The initialization and environment self-adaption stage of the development method is S1 step.

[0047] In the embodiment, when the low-temperature satellite communication terminal device is powered on in a low-temperature environment, the central processor 8 in the high-temperature running module 6 first starts running and immediately acquires real-time internal temperature data from the temperature sensor 22 inside the temperature-sensitive module 12.

[0048] The central processor 8 compares the real-time internal temperature with a preset working temperature threshold of the temperature-sensitive module 12 (for example, the minimum stable running temperature of the clock unit 14 or the data storage unit 13).

[0049] When the central processor 8 determines that the real-time internal temperature is lower than the preset working temperature threshold, the device is in a non-operable state. At this time, the central processor 8 immediately starts a cooperative heating program to heat the temperature-sensitive module 12 and ensure that the satellite communication terminal device enters an operable state.

[0050] The cooperative heating program includes two parallel heating actions. First, the central processor 8 outputs a control signal to make current pass through a plurality of resistance wires 21 fixedly connected to the side wall of the temperature-sensitive module 12. The resistance wires 21 generate heat due to the Joule effect and directly heat the temperature-sensitive module 12 from the inside.

[0051] Second, the central processor 8 outputs a driving current to a plurality of refrigerating fins 11 fixed to the heat exchange bridge 10. The refrigerating fins 11 are activated to actively pump heat between the high-temperature running module 6 and the temperature-sensitive module 12.

[0052] Specifically, the cold end of the refrigerating fin 11 absorbs heat from the high-temperature running module 6 side, the heat is generated by the central processor 8 itself, and the heat is pumped to the hot end of the refrigerating fin 11 through the Peltier effect and released to the temperature-sensitive module 12 side. This process realizes the recycling of waste heat of the high-temperature running module 6.

[0053] During the entire heating process, the central processor 8 continuously monitors the internal temperature of the temperature-sensitive module 12 through the temperature sensor 22 to form a closed-loop control system. When the internal temperature reaches the preset working temperature threshold, the central processor 8 stops or reduces the heating power of the resistance wires 21 and the refrigerating fins 11 to maintain the temperature-sensitive module 12 in an operable temperature range. At this time, the initialization and environment self-adaption stage is completed.

[0054] Referring to the accompanying drawings Figure 11 ​After the initialization and environment self-adaptation stage is completed, the satellite communication terminal device is in a runnable state. At this time, the central processor 8 starts to execute the program of the local data aggregation stage, i.e., the S2 step.

[0055] The central processor 8 sends a control instruction to the communication unit 15 inside the temperature-sensitive module 12 to start the wireless local area network function. After receiving the control instruction, the communication unit 15 generates a specific frequency band (for example, a 2.4 GHz radio frequency signal).

[0056] The radio frequency signal is fed from the radio frequency output port of the communication unit 15 to the feed point of the annular isolation cavity 5 through a radio frequency cable. The annular isolation cavity 5 serves as a feed network to uniformly distribute and couple the radio frequency signal to the plurality of slot antennas 4 arranged on the outer side wall thereof.

[0057] The slot antennas 4 radiate the received radio frequency signal to the space around the device, thereby establishing a wireless local area network. The terminal device receives monitoring data transmitted by one or more power grid monitoring devices from the outside through the wireless local area network.

[0058] The received monitoring data is demodulated and preliminarily processed by the communication unit 15, and then transmitted to the central processor 8 through the internal data bus. The central processor 8 formats the received data and stores it in the data storage unit 13 in a predetermined order and format. The data aggregation process continues until all the predetermined monitoring data is received and stored.

[0059] Referring to FIG. 4, the satellite communication terminal device according to the present embodiment is in a runnable state after the initialization and environment self-adaptation stage is completed. Figure 11 After the local data aggregation stage is completed, the monitoring data stored in the data storage unit 13 is ready. At this time, the central processor 8 starts to execute the program of the data uplink transmission and isolation stage, i.e., the S3 step and the S4 step.

[0060] In a specific implementation, the time division duplex working time sequence can be configured as follows: for example, 10 minutes as a working period, the first 9 minutes of the period as the local data aggregation stage with the wireless local area network turned on, and the last 1 minute as the data uplink transmission stage with the wireless local area network turned off and the satellite uplink transmission turned on.

[0061] According to the time division duplex working mode adopted in the present embodiment, the central processor 8 first allocates a satellite uplink transmission time slice independent of and not overlapping with the aforementioned wireless local area network data reception time slice in time to the satellite uplink transmission. This isolates the two different communication modes in the time dimension. Before entering the satellite uplink transmission time slice, the central processor 8 sends an instruction to the communication unit 15 to stop the transceiving activity of the wireless local area network and enter the standby state.

[0062] During the satellite uplink time slot, the central processor 8 reads the collected monitoring data from the data storage unit 13 and modulates it into an uplink baseband signal conforming to the satellite communication protocol. The uplink baseband signal is transmitted to the radio frequency power output unit 9 in the high-temperature operating module 6. The radio frequency power output unit 9 up-converts and power amplifies the uplink baseband signal to generate a high-power high-frequency satellite signal with a frequency of .

[0063] The high-power high-frequency satellite signal is fed to the phased array antenna 20 and is directionally transmitted by the phased array antenna 20 towards the monitoring center.

[0064] At the same time when the phased array antenna 20 emits the high-power signal, part of the leaked signal will inevitably propagate downward. This part of the leaked signal will enter the closed annular resonant cavity formed by the antenna ground plane 3 and the annular isolation cavity 5, which is designed to exhibit high impedance and high attenuation characteristics to the high-frequency satellite signal.

[0065] Since the geometric size of the closed annular resonant cavity is designed to make its cutoff frequency higher than the frequency of the high-frequency satellite signal , the leaked satellite signal is in a cutoff state in the closed annular resonant cavity and cannot effectively propagate and will be rapidly attenuated along the propagation path .

[0066] Through the band-stop filter effect of this physical structure, the leaked high-frequency satellite signal is sufficiently attenuated before reaching the temperature-sensitive module 12 below, thereby achieving physical radio frequency isolation of the communication unit 15 and other sensitive components, ensuring the overall electromagnetic compatibility of the device.

Claims

1. A cryogenic satellite communication terminal device, characterized in that, include: A housing (1) is provided with an antenna top cover (2) fixedly connected to the outside of the housing (1). A dual-mode antenna assembly is provided inside the housing (1). A high-temperature operation module (6) is fixedly connected inside the housing (1). A thermal pad (7) is fixedly connected to the outside of the high-temperature operation module (6). A temperature-sensitive module (12) is fixedly connected inside the housing (1) to accommodate temperature-sensitive components. A heat exchange bridge (10) is provided between the high-temperature operation module (6) and the temperature-sensitive module (12). A plurality of cooling plates (11) are fixedly connected to the top of the heat exchange bridge (10) to perform active heat pumping between the high-temperature operation module (6) and the temperature-sensitive module (12). The dual-mode antenna assembly includes a ring-shaped isolation cavity (5), with multiple slot antennas (4) fixedly connected to the outside of the ring-shaped isolation cavity (5). An antenna ground plane (3) is fixedly connected to the top of the ring-shaped isolation cavity (5), and a phased array antenna (20) is fixedly connected to the top of the antenna ground plane (3). The antenna ground plane (3) and the ring-shaped isolation cavity (5) together form a closed ring resonant cavity.

2. The cryogenic satellite communication terminal equipment according to claim 1, characterized in that, The temperature-sensitive module (12) includes a data storage unit (13), a clock unit (14) is provided on the outside of the data storage unit (13), a communication unit (15) is provided on the outside of the data storage unit (13), a temperature sensor (22) is provided on the outside of the data storage unit (13), a battery pack (16) is fixedly connected to the bottom of the temperature-sensitive module (12), and the radio frequency output of the communication unit (15) is connected to the annular isolation cavity (5).

3. The cryogenic satellite communication terminal equipment according to claim 1, characterized in that, The high-temperature operation module (6) includes a central processing unit (8) and a radio frequency power output unit (9). The central processing unit (8) is used to perform overall calculations of the satellite communication terminal equipment, and the radio frequency power output unit (9) is used to drive the transmission of satellite signals. Multiple heat sinks (17) are fixedly connected to the outside of the housing (1) to form a priority heat dissipation area. The high-temperature operation module (6) and the priority heat dissipation area are tightly attached to each other through the thermal pad (7).

4. The cryogenic satellite communication terminal equipment according to claim 1, characterized in that, Multiple resistance wires (21) are fixedly connected to the inner side wall of the temperature-sensitive module (12) for overall heat preservation of the temperature-sensitive module (12).

5. A cryogenic satellite communication terminal device according to claim 2, characterized in that, The annular isolation cavity (5) is fixedly connected inside the housing (1). The annular isolation cavity (5) is used to receive the signal from the communication unit (15) and radiate it through the slot antenna (4).

6. A cryogenic satellite communication terminal device according to claim 1, characterized in that, An interface control panel (19) is provided on the outside of the housing (1), and handles (18) are fixedly connected to both sides of the housing (1).

7. A method for developing a cryogenic satellite communication terminal device, characterized in that, The application of a cryogenic satellite communication terminal device according to any one of claims 1-6 includes the following steps: S1. Real-time monitoring of the internal temperature of the temperature-sensitive module (12) sensed by the temperature sensor (22). When the internal temperature is lower than the preset operating temperature, the resistance wire (21) is activated to heat the temperature-sensitive module (12) to ensure that the satellite communication terminal equipment is in an operational state. S2. After the satellite communication terminal equipment is in an operational state, a wireless local area network is established through the ring isolation cavity (5) and the slot antenna (4) to receive and aggregate monitoring data from the power grid monitoring equipment and store the monitoring data in the data storage unit (13). S3. Using time-division duplex mode, after the monitoring data is aggregated, an independent satellite uplink launch time slice is allocated for satellite uplink launch; S4. During the satellite uplink transmission time slot, the monitoring data stored in the data storage unit (13) is transmitted uplink to the monitoring center via the phased array antenna (20), and the high-frequency satellite signal leaked by the phased array antenna (20) is attenuated by the closed ring resonant cavity.

8. The development method of a cryogenic satellite communication terminal device according to claim 7, characterized in that, In step S1, the step of heating the temperature-sensitive module (12) further includes: Active heat pumping is performed between the high-temperature operation module (6) and the temperature-sensitive module (12) via the cooling plate (11) to coordinately regulate the temperature of the temperature-sensitive module (12).

9. The development method of a cryogenic satellite communication terminal device according to claim 7, characterized in that, In step S4, the geometry of the closed ring resonant cavity is designed to present high impedance and high attenuation characteristics to the high-frequency satellite signal, thus achieving the band-stop filter effect.

10. The development method of a cryogenic satellite communication terminal device according to claim 7, characterized in that, In step S3, the time-division duplex mode is used to determine that the wireless local area network data reception time slice for receiving the monitoring data does not overlap with the satellite uplink transmission time slice in time.

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