Loudspeaker and earphone

Abstract

The invention relates to a loudspeaker and an earphone. The loudspeaker comprises a magnetic circuit assembly; a voice coil assembly; the first vibrating diaphragm and the second vibrating diaphragm are arranged at an interval in the vibration direction; the voice coil assembly comprises a first voice coil connected with the first vibrating diaphragm and a second voice coil connected with the second vibrating diaphragm; the first voice coil and the second voice coil respectively drive the first vibrating diaphragm and the second vibrating diaphragm to synchronously vibrate in different directions; the magnetic circuit assembly comprises a magnetic conductive cover and an inner magnet, the magnetic conductive cover comprises a side wall and a bottom wall, the side wall comprises a folded structure, the folded structure comprises an inner side wall and an outer side wall which are arranged at an interval and an extension part connecting the inner side wall and the outer side wall, the bottom wall is connected with the inner side wall, and a first magnetic gap is formed between the inner side wall and the inner magnet; a second magnetic gap is formed between the inner side wall and the outer side wall, the first voice coil is at least partially located in the first magnetic gap, and the second voice coil is at least partially located in the second magnetic gap. The first vibrating diaphragm and the second vibrating diaphragm synchronously vibrate in different directions, so that the output capability of the loudspeaker is effectively improved, and the use effect of a specific scene is met.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This specification claims priority to Chinese application No. 202410966001.5, filed on July 17, 2024, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0002] The present specification relates to the field of acoustics, in particular to a loudspeaker and earphone. BACKGROUND

[0003] With the continuous improvement of people's living needs, consumers have increasingly high requirements for earphones. In addition to stable output performance, earphones are also required to shield environmental noise and perform normal listening in noisy or even high-noise environments. Therefore, the noise reduction performance of earphones has a great influence on the user's comfort.

[0004] Therefore, it is necessary to provide a loudspeaker and earphone to improve the noise reduction effect of acoustic devices. SUMMARY

[0005] The loudspeaker provided by the embodiment of the present specification comprises a magnetic circuit assembly, a voice coil assembly, a first diaphragm and a second diaphragm. The voice coil assembly is at least partially located in the magnetic gap of the magnetic circuit assembly. The first diaphragm and the second diaphragm are spaced apart in the vibration direction. The voice coil assembly comprises a first voice coil and a second voice coil arranged along the vibration direction. The first diaphragm is connected to the first voice coil, and the second diaphragm is connected to the second voice coil. The first voice coil and the second voice coil are configured to drive the first diaphragm and the second diaphragm to vibrate synchronously and in opposite directions, respectively. The magnetic circuit assembly comprises a magnetic yoke and an inner magnet. The magnetic yoke comprises a side wall and a bottom wall. The side wall comprises a folded structure. The folded structure comprises an inner side wall and an outer side wall spaced apart in the vertical direction of the vibration direction, and an extension connecting the inner side wall and the outer side wall. The bottom wall is connected to the inner side wall. The first magnetic gap is formed between the inner side wall and the inner magnet. The second magnetic gap is formed between the inner side wall and the outer side wall. The first voice coil is at least partially located in the first magnetic gap, and the second voice coil is at least partially located in the second magnetic gap. Through the cooperation of the magnetic circuit assembly and the voice coil assembly, the synchronous and opposite direction vibration of the first diaphragm and the second diaphragm is driven, which can effectively improve the sound output capability of the loudspeaker, thereby meeting the use effect of the earphone in a specific scene, for example, improving the active noise reduction effect in an open application scenario.

[0006] In some embodiments, the outer side wall comprises an outer magnet, the inner magnet and the inner side wall form the first magnetic gap, and the outer magnet and the inner side wall form the second magnetic gap. Through the above arrangement, the magnetic field strength near the second voice coil can be increased, thereby improving the driving force of the second voice coil, improving the driving force of the loudspeaker, improving the output of the loudspeaker, and improving the active noise reduction effect of the earphone on larger environmental noise.

[0007] In some embodiments, the polarization direction of the inner magnet is the same as the magnetization direction of the outer magnet, the loudspeaker comprises a long axis direction and a short axis direction, and the ratio of the thickness of the inner side wall to the size of the magnetic shield in the short axis direction or the long axis direction is 0.05-0.16. Through the above arrangement, while avoiding the size of the magnetic circuit assembly being too large, the magnetic field saturation of the inner side wall can be avoided as much as possible, thereby improving the magnetic field strength at the positions of the first voice coil and the second voice coil, and further improving the driving force of the loudspeaker, the output of the loudspeaker, and the active noise reduction effect of the earphone on larger environmental noise.

[0008] In some embodiments, the polarization direction of the inner magnet is opposite to the magnetization direction of the outer magnet, and the thickness of the inner side wall is less than or equal to 0.4mm. When the magnetization directions of the inner magnet and the outer magnet are opposite, the inner side wall of the magnetic shield has a magnetic field zero point, and the inner side wall does not conduct magnetism but mainly plays a connecting support role. At this time, the magnetic field can pass through the first magnetic gap and the second magnetic gap where the first voice coil and the second voice coil are located more. Through the above arrangement, the mass and size of the loudspeaker can be reduced, and the magnetic field strength at the positions of the voice coils can be enhanced.

[0009] In some embodiments, the inner side wall is hollow to reduce the magnetic field transmitted along the inner side wall and reduce the mass of the loudspeaker.

[0010] In some embodiments, the outer side wall comprises an outer magnet, the inner magnet and the outer magnet form the first magnetic gap, and the outer magnet and the outer side wall form the second magnetic gap. Through the above arrangement, the magnetic field saturation of the inner side wall can be avoided, the magnetic field strength at the positions of the first voice coil and the second voice coil can be ensured, and further the driving force of the loudspeaker can be improved, the output of the loudspeaker can be improved, and the active noise reduction effect of the earphone on larger environmental noise can be improved.

[0011] In some embodiments, the inner side wall comprises a first outer magnet, the outer side wall comprises a second outer magnet, the inner magnet and the first outer magnet form the first magnetic gap, and the first outer magnet and the second outer magnet form the second magnetic gap, thereby further improving the magnetic field strength at the positions of the first voice coil and the second voice coil, and further improving the driving force of the loudspeaker, the output of the loudspeaker, and the active noise reduction effect of the earphone on larger environmental noise.

[0012] In some embodiments, the loudspeaker includes a major axis direction and a minor axis direction. In the minor axis direction or the major axis direction, the ratio of the size of the inner magnet to the thickness of the outer magnet is between 1.7 and 33 to ensure the electromagnetic conversion efficiency of the loudspeaker, improve the driving force of the voice coil assembly, improve the output of the loudspeaker, improve the active noise cancellation effect of the headphones on large ambient noise, and at the same time avoid the headphones being too large.

[0013] In some embodiments, in the long axis direction, the ratio of the size of the inner magnet to the thickness of the outer magnet is 1.7-6.7; in the short axis direction, the ratio of the size of the inner magnet to the thickness of the outer magnet is 1.7-2.7. By designing within these ranges, the BL value of the speaker can be significantly improved, thereby enhancing the speaker's sound output performance and improving the headphone's active noise cancellation effect against significant ambient noise.

[0014] One embodiment of this specification also provides headphones, including a speaker as described in any of the preceding embodiments. The headphones further include: a first housing, with the speaker disposed within the first housing; a first diaphragm of the speaker forming a first acoustic cavity with an inner wall of the first housing; a second diaphragm of the speaker forming a second acoustic cavity with another inner wall of the first housing; and a third acoustic cavity formed between the first and second diaphragms. The speaker further includes a frame, located between the first and second diaphragms in the vibration direction; the frame has an opening acoustically communicating with the third acoustic cavity. The opening design on the frame can reduce the vibration resistance of the first and second diaphragms and enhance the gas exchange efficiency between the third acoustic cavity and the outside environment.

[0015] In some embodiments, the magnetic circuit assembly includes an outer magnet, which comprises multiple separately arranged sub-magnets. These sub-magnets are all disposed on the inner wall of the frame. The opening is staggered from the sub-magnets of the outer magnet to reduce manufacturing difficulty. Simultaneously, the staggered arrangement of the opening and the outer magnet prevents the opening from being blocked by the outer magnet, allowing for a larger usable area. This increases the resonant frequency of the third acoustic cavity, raises the second resonant frequency of the speaker output, and enables the headphones to have a flat output over a wider frequency range. It also ensures airflow between the third acoustic cavity and the outside environment, reducing the difficulty of gas exchange between the third acoustic cavity and the outside environment, reducing the difficulty of volume changes in the third acoustic cavity, and reducing the difficulty of synchronous, opposite-direction relative vibration of the first and second diaphragms, thus improving the headphone output.

[0016] In some embodiments, when worn, the first housing includes an inner side facing the external auditory canal, an outer side opposite to the inner side and away from the external auditory canal, an upper side facing the top of the user's skull, and a lower side opposite to the upper side and facing the bottom of the user's skull. The first housing is provided with a first pressure relief hole communicating with the first acoustic cavity, a second pressure relief hole communicating with the second acoustic cavity, and a sound outlet hole communicating with the third acoustic cavity. The sound outlet hole is located on the inner side of the first housing, and the first pressure relief hole and the second pressure relief hole are respectively located on the upper side and the lower side of the first housing.

[0017] In some embodiments, in the wearing state, the first housing further includes a front side facing behind the user's ear, and the sound outlet has an L-shaped structure, the L-shaped structure including a short side portion located on the front side of the first housing and a long side portion located on the inner side of the first housing. This configuration reduces the difficulty of gas exchange between the third acoustic cavity and the outside environment.

[0018] In some embodiments, the opening on the frame is acoustically connected to the sound outlet. On the plane where the port of the sound outlet is located, the orthographic projection of the opening and the orthographic projection of the sound outlet at least partially coincide, so that the opening can be at least partially directly opposite the third acoustic hole. This allows the third acoustic cavity to be directly connected to the outside world through the opening and the third acoustic hole, reducing the obstacles between the third acoustic cavity and the external environment, thereby reducing the difficulty of gas exchange between the third acoustic cavity and the outside world, reducing the difficulty of synchronous and opposite relative vibration of the first diaphragm and the second diaphragm, and improving the output of the headphones.

[0019] In some embodiments, a gap is provided between the front side of the first housing and the speaker, the gap serving as a sound guide channel. This sound guide channel is configured to guide the sound generated by the speaker on the front side to the sound outlet for output. The size of the sound guide channel is 0.5mm-2mm along its long axis. This configuration ensures the output sound pressure level of the headphones while maintaining a suitable resonant frequency of the third acoustic cavity, resulting in a flatter and more stable output across a wider frequency range. Attached Figure Description

[0020] This specification will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote the same structures, wherein:

[0021] Figure 1 These are schematic diagrams of the physiological structure of an exemplary ear provided in some embodiments of this application;

[0022] Figure 2These are schematic diagrams illustrating the wearing state of the headphones when worn in the ear, according to some embodiments of this specification;

[0023] Figure 3 These are exemplary module schematic diagrams of the sound-generating part according to some embodiments of this specification;

[0024] Figure 4 This is a schematic diagram of the internal structure of the sound-generating part according to some embodiments of this specification;

[0025] Figure 5 yes Figure 4 The diagram shows the frequency response curves of the first and second sound output holes of the earphone.

[0026] Figure 6 This is another exemplary structural schematic diagram of a loudspeaker according to some embodiments shown in this specification;

[0027] Figure 7 yes Figure 6 The diagram shows the internal structure of the loudspeaker.

[0028] Figure 8 This is a schematic diagram of the frequency response curves of the headphones corresponding to different pressure relief holes, as shown in some embodiments of this specification;

[0029] Figure 9 This is another structural schematic diagram of the headphones shown in some embodiments according to this specification;

[0030] Figures 10A-10D This is a schematic diagram showing the distribution of first and second pressure relief holes of different sizes according to some embodiments of this specification;

[0031] Figures 11A-11D yes Figures 10A-10D A schematic diagram of the corresponding headphone's frequency response curve;

[0032] Figure 12 This is a schematic diagram of the structure of the first housing according to some embodiments of this specification;

[0033] Figures 13A-13B This is a schematic diagram showing the different relative positions of the first pressure relief hole and the second pressure relief hole according to some embodiments of this specification;

[0034] Figure 14 This is a schematic diagram of different sizes of first and second pressure relief holes according to some embodiments of this specification;

[0035] Figures 15A-15B These are schematic diagrams of pressure relief orifices of different shapes as shown in some embodiments of this specification;

[0036] Figures 16A-16BThis is a schematic diagram showing different numbers of pressure relief holes according to some embodiments of this specification;

[0037] Figures 17A-17F This is a schematic diagram of pressure relief holes with different distributions and non-single centralized openings, as shown in some embodiments of this application;

[0038] Figure 18 This is a schematic diagram showing the relative positions of the first sound outlet and the tuning hole according to some embodiments of this specification;

[0039] Figures 19A-19G These are schematic diagrams illustrating different exemplary structures of a loudspeaker according to some embodiments of this specification;

[0040] Figure 20 This is another structural schematic diagram of a loudspeaker according to some embodiments shown in this specification;

[0041] Figure 21A This is a schematic diagram of the framework shown in some embodiments of this specification;

[0042] Figure 21B This is a schematic diagram showing the position of the frame and the external magnet according to some embodiments of this specification;

[0043] Figure 22 This is another cross-sectional structural schematic diagram of the sound-generating component shown in some embodiments of this specification;

[0044] Figure 23 This is an exploded view of the structure of a loudspeaker according to some embodiments of this specification. Detailed Implementation

[0045] To more clearly illustrate the technical solutions of the embodiments in this specification, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this specification. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0046] It should be understood that the terms “system,” “device,” “unit,” and / or “module” used herein are one way to distinguish different components, elements, parts, sections, or assemblies at different levels. However, if other terms can achieve the same purpose, they may be replaced by other expressions.

[0047] As indicated in this specification and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" do not specifically refer to the singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of expressly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0048] Flowcharts are used in this specification to illustrate the operations performed by the system according to embodiments of this specification. It should be understood that the preceding or following operations are not necessarily performed in exact order. Instead, the steps can be processed in reverse order or simultaneously. Furthermore, other operations can be added to these processes, or one or more steps can be removed from them.

[0049] Figure 1 This is a schematic diagram of the physiological structure of an exemplary ear provided in some embodiments of this application. Please refer to [link / reference]. Figure 1 The exemplary ear may include physiological parts such as the external auditory canal 11, the concha 12, the cymba conchae 13, the triangular fossa 14, the antihelix 15, the scaphoid fossa 16, the helix 17, the earlobe 18, and the crus of the helix 19. Although the external auditory canal 11 has a certain depth and extends to the tympanic membrane of the ear, unless otherwise specified, the external auditory canal 11 can be understood as its entrance away from the tympanic membrane (i.e., the ear hole or ear canal opening). Furthermore, the physiological parts such as the concha 12, the cymba conchae 13, and the triangular fossa 14 have a certain volume and depth in three-dimensional space, and the concha 12 is directly connected to the external auditory canal 11, that is, it can be simply regarded as the aforementioned ear hole being located at the bottom of the concha 12.

[0050] Since the external auditory canal 11, concha 12, cymba conchae 13, triangular fossa 14 and other physiological parts have a certain depth and volume in three-dimensional space, the headphones provided in some embodiments of this specification can achieve stable wearing of the headphones by means of one or more physiological parts of the ear.

[0051] For example, the headphones are worn by using other parts of the ear besides the external auditory canal 11 (such as the cymba conchae 13, triangular fossa 14, antihelix 15, scaphoid 16, helix 17, etc., or combinations thereof); for example, when worn, the entire or part of the headphone structure can contact the upper part of the external auditory canal 11 (such as one or more physiological parts such as the cymba conchae 13, triangular fossa 14, antihelix 15, scaphoid 16, helix 17, crus of helix 19, etc.); or, when worn, the entire or part of the headphone structure can be located at... Figure 1 The first region P1, enclosed by the dashed line, includes at least the auricular sac 13 and the triangular fossa 14, and may also be located in... Figure 1The second region P2, enclosed by the dotted line, at least includes the concha cavity 12, and may also be located on the anterior side of the helix crus 19 (i.e.: Figure 1 (Within the third region P3 enclosed by the dashed line).

[0052] By utilizing parts of the ear other than the external auditory canal 11, the headphones can be worn and sound can be transmitted. This not only "liberates the external auditory canal," reducing the impact of headphones on the user's ear health, but also effectively improves the user experience. For example, when a user wears headphones on the road, the headphones will not block the external auditory canal 11, allowing the user to receive both sound from the headphones and ambient sounds (such as horns, car bells, surrounding voices, traffic signals, etc.), thereby effectively reducing the occurrence of traffic accidents.

[0053] Due to individual differences among users, ears may vary in shape, size, and other dimensions. To facilitate description and understanding, and to minimize or even eliminate these individual differences, unless otherwise specified, this application primarily uses an ear model with a "standard" shape and size as a reference to describe the structure of the headphones in different embodiments and how they are worn on that ear model. For example, a simulator (such as GRAS 45BC KEMAR) containing a head and its (left and right) ears can be manufactured based on ANSI:S3.36, S3.25, and IEC:60318-7 standards as a reference for wearing headphones, thus representing the scenario of most users normally wearing headphones.

[0054] Therefore, descriptions such as "user wearing," "in wearing state," and "under wearing state" in this application can refer to the headphones described in this application being worn on the ears of the aforementioned simulator. Of course, considering the individual differences among different users, the structure, shape, size, thickness, etc. of one or more parts of the ear can be differentiated according to different ear shapes and sizes. These differentiated designs can be manifested in the characteristic parameters of one or more parts of the headphones having different ranges of values ​​to adapt to different ears.

[0055] It should be noted that in medicine, anatomy, and other fields, the human body can be defined by three basic planes: the sagittal plane, the coronal plane, and the horizontal plane; and three basic axes: the sagittal axis, the coronal axis, and the vertical axis. The sagittal plane is a section perpendicular to the ground along the anteroposterior direction of the body, dividing the body into left and right parts. The coronal plane is a section perpendicular to the ground along the left-right direction of the body, dividing the body into anterior and posterior parts. The horizontal plane is a section parallel to the ground along the vertical direction of the body, dividing the body into superior and inferior parts. Correspondingly, the sagittal axis is the axis along the anteroposterior direction of the body and perpendicular to the coronal plane; the coronal axis is the axis along the left-right direction of the body and perpendicular to the sagittal plane; and the vertical axis is the axis along the vertical direction of the body and perpendicular to the horizontal plane.

[0056] Furthermore, the "front side of the ear" mentioned in this application is a concept relative to "back side of the ear." The former refers to the side of the ear away from the head, while the latter refers to the side of the ear facing the head; both refer to the user's ear. Specifically, by observing the ear of the simulator along the direction of the human coronal axis, one can obtain... Figure 1 The diagram shows the front outline of the ear.

[0057] It should be noted that the above description of the ear is for illustrative purposes only and is not intended to limit the scope of this application. Those skilled in the art can make various changes and modifications based on the description in this application (for example, the structure of the earphone can partially or completely cover the external auditory canal 11), and these changes and modifications are still within the protection scope of this application.

[0058] As people's demands for quality of life continue to rise, consumers are also placing higher requirements on headphones. Besides stable output performance, they also need to be able to block out ambient noise for normal listening in noisy or even high-noise environments. For in-ear headphones, the sound outlet is located inside the user's ear canal, resulting in a louder sound. Simultaneously, some ambient noise is blocked outside the ear canal. In this case, the headphone's noise-canceling technology actively cancels out the ambient noise entering the ear canal. For open-back headphones, which do not fit inside the ear canal, the sound output is some distance from the ear canal and cannot form a closed sound transmission channel. More ambient noise enters the ear canal, significantly impacting the user's listening experience. Furthermore, the open structure and distance between the sound outlet and the ear canal opening of open-back headphones can also cause sound leakage into the surrounding environment, resulting in noticeable sound leakage. To improve the user experience of open-back headphones, such as enhancing active noise cancellation, sound output, and sound leakage reduction, it is necessary to balance miniaturization and lightweight design while providing higher output intensity, lower distortion, more stable amplitude and phase frequency response with less fluctuation, and flatter output across a wider frequency range to deliver higher sound output and / or meet the requirements for better noise cancellation.

[0059] This specification provides a pair of headphones that, in the context of open-back headphones, improve the headphone's sound production efficiency and enable the headphones to have a flatter output over a wider frequency range, thereby enhancing the sound output effect and / or active noise cancellation effect.

[0060] Figure 2 These are schematic diagrams illustrating the wearing state of the headphones when worn on the ear, according to some embodiments of this specification. Figure 3 This is an exemplary module schematic diagram of a sound-generating part according to some embodiments of this specification.

[0061] Please see Figure 2 and Figure 3 Some embodiments of this specification provide an open-back headphone (hereinafter referred to as the headphone), including a sound-emitting part 100 and an ear hook; wherein, the ear hook is configured to place the sound-emitting part 100 near the ear but without blocking the external auditory canal 11. It should be noted that, due to individual differences among different users, when the headphone is worn by different users, the sound-emitting part 100 may partially cover the external auditory canal 11, but the external auditory canal 11 is still not blocked. This will be described in detail below.

[0062] The sound-emitting part 100 includes a first housing 110, a sound-emitting component, and a microphone component 140, etc. The sound-emitting component is disposed inside the first housing 110 and may include a speaker 120. The speaker 120 can convert electrical signals into corresponding mechanical vibrations, thereby generating sound output (e.g., noise-canceling sound, audio played through headphones, etc.). For example, the sound generated by the speaker 120 may include noise-canceling sound. The noise-canceling sound output to the outside of the first housing 110 may have the same amplitude and opposite phase to the ambient noise near the external auditory canal 11, so as to eliminate the ambient noise near the external auditory canal 11 and achieve active noise cancellation. The sound generated by the speaker 120 may also include other sounds such as call sounds, played audio, and reminder sounds. After these sounds are output to the outside of the first housing 110, they can be guided to the external auditory canal 11 to ensure the user's listening effect.

[0063] In some embodiments, the sound-generating assembly further includes a limiting component 130, which is used to position and confine the speaker 120 inside the first housing 110. On the one hand, by fixing the speaker 120 inside the first housing 110 by the limiting component 130, it can be ensured that the sound generated by the speaker 120 is stably output to the outside of the first housing 110 through the acoustic holes provided in the first housing 110; on the other hand, by limiting the speaker 120 by the limiting component 130, it can be prevented that the speaker 120 shakes relative to the first housing 110 when vibrating, thereby ensuring the sound output performance of the sound-generating part 100.

[0064] The microphone assembly 140 can be used to collect sound signals, such as user voice and ambient sounds. For example, based on the ambient noise collected by the microphone assembly 140, the output of the speaker 120 can be adjusted so that the sound output by the speaker 120 includes a sound signal that cancels out the ambient noise, thereby achieving active noise cancellation of the headphones against ambient noise.

[0065] In some embodiments, the ear hook may include an ear hook housing and a battery assembly, a circuit board assembly, etc. disposed inside the ear hook housing. The battery assembly, speaker 120, and microphone assembly are structurally electrically connected to the circuit board assembly. The circuit board assembly can be understood as a collection of the headphone's main control board or motherboard and related components. The circuit board assembly plays a role in regulating and managing all or some of the functional components in the headphone; for example, it is used in the headphone to convert and process electrical signals to support the realization of various headphone functions (such as supporting the headphone to turn on and off, switch playback content, increase or decrease volume, etc.).

[0066] Please refer to Figure 2In some embodiments, the ear hook can be divided into two parts along its length: a battery section 200 and an adapter section 300, with the adapter section 300 connecting the battery section 200 and the sound-generating part 100. In the wearing state, a portion of the battery section 200 (e.g., the portion occupied by the battery assembly and circuit board assembly) hangs between the auricle and the head, while the other portion of the battery section 200 extends towards the side of the auricle away from the head and connects to the adapter section 300, placing the sound-generating part 100 near the external auditory canal 11 without obstructing it, thus making the earphone an open-back design. Furthermore, the battery assembly and circuit board assembly can be located in the battery section 200, and the adapter section 300 can include earphone buttons and an adapter plate for electrically connecting the circuit board assembly to the speaker 120 and microphone assembly 140, etc. In some embodiments, the battery assembly and circuit board assembly can be located at the end of the battery section 200 away from the adapter section 300 to balance the center of the earphone and improve wearing comfort.

[0067] In some embodiments, to improve the stability of the headphones while worn, the headphones may employ any one or a combination of the following methods: First, at least a portion of the ear hook is configured as a conformal structure (e.g., an arc-shaped hook) that conforms to at least one of the back of the ear and the head, thereby increasing the contact area between the ear hook and the ear or head, and thus increasing the resistance to the headphones falling off the ear. Second, at least a portion of the ear hook is configured as an elastic structure, such that the ear hook has a certain elastic deformation while worn, thereby increasing the pressure of the ear hook on the ear or head, and thus increasing the resistance to the headphones falling off the ear. Third, at least a portion of the ear hook is configured to rest against the head while worn, such that the ear hook forms a reaction force pressing against the ear, causing the sound-emitting part 100 to press against the front of the ear, thereby increasing the resistance to the headphones falling off the ear. Fourth, the sound-emitting part 100 and the ear hook are configured to clamp the physiological parts of the ear, such as the area where the helix 17 and the area where the concha 12 are located, respectively, from the front and back sides of the ear when worn, thereby increasing the resistance to the earphone falling off the ear. Fifth, the sound-emitting part 100 is configured to extend at least partially into the physiological parts of the ear, such as the concha 12, cymba concha 13, triangular fossa 14, and scaphoid 16, when worn, thereby increasing the resistance to the earphone falling off the ear.

[0068] In some embodiments, the headphones can be combined with products such as glasses, headphones, head-mounted displays, AR / VR helmets, etc.; for example, the ear hooks may be omitted or retained, and the sound-emitting part 100 may be worn near the user's ears by means of suspension, clamping, etc.

[0069] Figure 4 This is a schematic diagram of the internal structure of the sound-generating part according to some embodiments of this specification.

[0070] Please see Figure 2The sound-emitting part 100 may have a major axis direction and a minor axis direction that are perpendicular to the thickness direction and orthogonal to each other. The major axis direction can be defined as the direction with the maximum extension dimension in the shape of the two-dimensional projection surface of the sound-emitting part 100 (e.g., the projection of the sound-emitting part 100 onto the plane containing its outer surface or onto the sagittal plane). (e.g., when the projection shape is rectangular or approximately rectangular, the major axis direction is the length direction of the rectangle or approximately rectangular shape). The minor axis direction can be defined as the direction perpendicular to the major axis direction in the shape of the projection of the sound-emitting part 100 onto the sagittal plane (e.g., when the projection shape is rectangular or approximately rectangular, the minor axis direction is the width direction of the rectangle or approximately rectangular shape). The thickness direction can be defined as a direction perpendicular to the two-dimensional projection surface; for example, the thickness direction coincides with the direction of the coronal axis, both pointing towards the left and right sides of the body. In some embodiments, the thickness direction can also be defined as the direction in which the shell approaches or moves away from the ear when worn. In some embodiments, when the sound-emitting part 100 is tilted while in the wearing state, the major axis direction and the minor axis direction are still parallel or approximately parallel to the sagittal plane. The major axis direction may have a certain angle with the direction of the sagittal axis, that is, the major axis direction is also tilted accordingly. The minor axis direction may have a certain angle with the direction of the vertical axis, that is, the minor axis direction is also tilted. In some embodiments, the entire or part of the structure of the housing of the sound-emitting part 100 can extend into the concha cavity 12, that is, the projection of the housing of the sound-emitting part 100 on the sagittal plane overlaps with the projection of the concha cavity 12 on the sagittal plane. In some embodiments, the major axis direction and the minor axis direction of the speaker 120 are consistent with the major axis direction and the minor axis direction of the sound-emitting part 100.

[0071] Please refer to Figure 2 and Figure 4 In some embodiments, the first housing 110 of the sound-emitting part 100 may include multiple different housing walls such as an inner side 110a, an outer side 110b, an upper side 110c, a lower side 110d, and a front side 110e. Specifically, the inner side 110a is the housing side of the first housing 110 facing the ear (e.g., the external auditory canal 11) in the thickness direction when worn; the outer side 110b is the housing side of the first housing 110 away from the ear (e.g., the external auditory canal 11) in the thickness direction when worn; the upper side 110c is the housing side of the first housing 110 closer to the top of the head in the short axis direction when worn; the lower side 110d is the housing side of the first housing 110 away from the top of the head in the short axis direction when worn; and the front side 110e is the housing side of the first housing 110 facing the back of the ear in the long axis direction when worn. It is understood that these multiple different housing sides can collectively form a receiving cavity for the sound-emitting part 100, and the sound-emitting components (such as the speaker 120, etc.) are housed within this receiving cavity.

[0072] To effectively enhance the active noise cancellation performance of headphones in open-back applications, the headphones can be designed to have a relatively flat output across a wide frequency range. In some embodiments, the frequency response curve of the sound output from the headphones to the outside of the first housing 110 has a first resonant peak and a second resonant peak, where the peak resonant frequency of the first resonant peak is lower than the peak resonant frequency of the second resonant peak. In some embodiments, the first and second resonant peaks refer to two consecutive resonant peaks adjacent to each other on the frequency response curve, with a flat region between these two peaks. Within the frequency range corresponding to the flat region between the first and second resonant peaks, the headphones exhibit a higher active noise cancellation effect. Designing the first and second resonant peaks can influence the frequency range of the headphones' active noise cancellation; designing the flat region (e.g., its flatness, curve height, etc.) can influence the effectiveness of active noise cancellation. For example, the flatness of the flat region reflects the stability of the headphone's output sound; the more stable the headphone output, the easier it is to perform active noise cancellation, resulting in a better active noise cancellation effect. For example, the height of the curve in a flat area can reflect the volume of sound that the headphones can output. The louder the sound that the headphones can output, the more noise they can reduce, and the better the active noise cancellation effect.

[0073] To design the first resonance peak, the second resonance peak, and the flat region between them, please refer to... Figure 4 In some embodiments, the loudspeaker 120 may include a magnetic circuit assembly 122, a voice coil assembly 123, and a first diaphragm 121-1 and a second diaphragm 121-2. The voice coil assembly 123 drives the first diaphragm 121-1 and the second diaphragm 121-2 to vibrate synchronously in opposite directions. At least a portion of the voice coil assembly 123 is located within the magnetic gap of the magnetic circuit assembly 122. The first diaphragm 121-1 and the second diaphragm 121-2 are spaced apart in the vibration direction. The voice coil assembly 123 includes a first voice coil 123-1 and a second voice coil 123-2 disposed along the vibration direction, with the first diaphragm 121-1 connected to the first voice coil 123-1 and the second diaphragm 121-2 connected to the second voice coil 123-2. The first voice coil 123-1 and the second voice coil 123-2 are configured to drive the first diaphragm 121-1 and the second diaphragm 121-2 to vibrate synchronously in opposite directions, respectively. At this time, the first voice coil 123-1 and the second voice coil 123-2 are not directly connected, but can move relative to each other, so as to drive the first diaphragm 121-1 and the second diaphragm 121-2 to vibrate synchronously in opposite directions respectively.

[0074] A first diaphragm 121-1 and the inner wall of the first housing 110 are spaced apart and opposite each other in the vibration direction (i.e., the thickness direction) to form a first acoustic cavity 111-1. A second diaphragm 121-2 and the other inner wall of the first housing 110 are spaced apart and opposite each other in the vibration direction to form a second acoustic cavity 111-2. A third acoustic cavity 111-3 is formed between the first diaphragm 121-1 and the second diaphragm 121-2. The third acoustic cavity 111-3 serves as a common cavity between the first diaphragm 121-1 and the second diaphragm 121-2. A first acoustic hole is provided through the first housing 110, which acoustically communicates with the speaker 120 through the first acoustic cavity 111-1. A second acoustic hole is provided through the first housing 110, which acoustically communicates with the speaker 120 through the second acoustic cavity 111-2. A third acoustic hole is provided through the first housing 110, which acoustically communicates with the speaker 120 through the third acoustic cavity 111-3.

[0075] The connection configuration between the first acoustic cavity 111-1 and the first acoustic aperture can be approximately equivalent to a first Helmholtz resonator model. The connection configuration between the second acoustic cavity 111-2 and the second acoustic aperture can be approximately equivalent to a second Helmholtz resonator model. The connection configuration between the third acoustic cavity 111-3 and the third acoustic aperture can be approximately equivalent to a third Helmholtz resonator model. The first, second, and third acoustic apertures serve as the neck openings of their respective Helmholtz resonator models. When the speaker 120 vibrates and outputs sound, the first acoustic aperture outputs a first sound, the second acoustic aperture outputs a second sound, and the third acoustic aperture outputs a third sound. The superposition of the first, second, and third sounds constitutes the sound output by the headphones.

[0076] The first resonant peak and the flexibility of the first diaphragm 121-1 and the second diaphragm 121-2 in the vibration direction are related. The second resonant peak is related to the first acoustic cavity 111-1, the second acoustic cavity 111-2, and the third acoustic cavity 111-3. The flat region is related to the vibration of the first diaphragm 121-1 and the second diaphragm 121-2. Specifically, the flexibility of the first diaphragm 121-1 and the second diaphragm 121-2 in the vibration direction corresponds to their elastic coefficient K along the vibration direction. Under constant load, the smaller the value of K, the lower the frequency of the first resonant peak. The magnitude of the second resonant peak corresponds to the resonant frequency of the first Helmholtz resonator model (second Helmholtz resonator model), which depends on the configuration of the first acoustic cavity 111-1 (second acoustic cavity 111-2) and the first acoustic aperture (second acoustic aperture). The flatness of the flat region is related to the vibration consistency of the first diaphragm 121-1 and the second diaphragm 121-2, and the curve height of the flat region is related to the driving force of the first diaphragm 121-1 and the second diaphragm 121-2. In some embodiments, to improve the sound output effect and / or active noise cancellation effect of the headphones over a wider frequency range, the resonant frequencies of the first and second resonant peaks can be designed to increase the width of the flat region of the frequency response curve of the headphone output sound. For example, the first diaphragm 121-1 and the second diaphragm 121-2 can be designed (e.g., materials, structure) to reduce the resonant frequency of the first resonant peak. Alternatively, the first acoustic cavity 111-1 and the second acoustic cavity 111-2 can be designed to increase the resonant frequency of the second resonant peak. In some embodiments, the first and second sounds have opposite phases to the third acoustic sound, thus canceling each other out and improving the headphone's sound leakage reduction performance. By designing the first acoustic cavity 111-1 and the second acoustic cavity 111-2, the high-frequency resonant frequencies of the first and second sounds are enhanced, allowing the headphones to have a flatter output over a wider frequency range. Simultaneously, the third acoustic cavity 111-3 can be designed to enhance the high-frequency resonant frequency of the third sound, enabling the first and second sounds to have opposite phase with the third sound over a wider frequency range, resulting in better sound leakage reduction for the headphones over a wider frequency range. In some embodiments, designing the third acoustic cavity 111-3 can also enhance the vibration capabilities of the first diaphragm 121-1 and the second diaphragm 121-, improving the headphone output and enhancing the user's listening experience.

[0077] In some embodiments, for a speaker 120 whose first diaphragm 121-1 and second diaphragm 121-2 vibrate synchronously but in opposite directions, in order to make the frequency response curve of the sound output by the speaker 120 have a flatter region over a wider frequency range, the number, shape, size, and position of one or more acoustic structures (e.g., sound outlets, acoustic cavities) of the sound-emitting part 100 can be designed to increase the resonant frequency of the second resonant peak and optimize the frequency response curve of the sound output by the headphones (specifically, the first sound outlet 112-1). This allows the headphones to perform active noise cancellation over a wider frequency range and improves the sound output performance of the headphones. Simultaneously, the design of the acoustic structure corresponding to the third acoustic cavity 111-3 can also enhance the vibration capabilities of the first diaphragm 121-1 and the second diaphragm 121-2, improve the output performance of the headphones, and enhance the user's listening experience.

[0078] In some embodiments, such as Figure 4 As shown, the first acoustic hole acoustically connected to the first acoustic cavity 111-1 is the first sound outlet 112-1, the second acoustic hole acoustically connected to the second acoustic cavity 111-2 is the second sound outlet 112-2, and the third acoustic hole acoustically connected to the third acoustic cavity 111-3 is the pressure relief hole 113. In some embodiments, both the first sound outlet 112-1 and the second sound outlet 112-2 are oriented towards the user's ear canal (e.g., Figure 4 (As shown on the inner side of the first housing 110), the sound generated by the first diaphragm 121-1 is output through the first sound outlet 112-1 and directed to the user's ear canal, and the sound generated by the second diaphragm 121-2 is output through the second sound outlet 112-2 and directed to the user's ear canal, thereby increasing the headphone's output. When applied to open-back headphones, since the ambient noise received by the user's ear canal is relatively large, improving the headphone's output performance helps the headphones to actively cancel out larger ambient noise. The pressure relief hole 113 is located further away from the user's ear canal than the first sound outlet 112-1 and the second sound outlet 112-2 (e.g., Figure 4 The pressure relief hole 113 (shown on the outer side of the first housing 110) can be used to discharge the sound generated by the speaker 120 out of the first housing 110 and cancel out the sound leaked through the first sound outlet hole 112-1 and the second sound outlet hole 112-2 in the far field interference, so as to reduce the sound leakage of the headphones.

[0079] Figure 5 yes Figure 4 The diagram shows the frequency response curves of the first and second sound output holes of the headphones. Curve L... 161 The frequency response curve output from the first sound outlet 112-1 can be measured using a test microphone 2mm away from the first sound outlet 112-1 when the first diaphragm 121-1 is driven alone; curve L 162The frequency response curve output from the second sound outlet 112-2 can be measured using a test microphone 2mm away from the second sound outlet 112-2 when the second diaphragm 121-2 is driven alone. Figure 5 As shown, curve L 161 With curve L 162 The output sound pressure levels of the first diaphragm 121-1 and the second diaphragm 121-2 are close, and the vibration consistency between the first diaphragm 121-1 and the second diaphragm 121-2 is high. The distortion of the headphone output is low, and the active noise cancellation effect of the headphone is good.

[0080] Figure 6 This is another exemplary structural schematic diagram of a loudspeaker according to some embodiments shown in this specification. Figure 7 yes Figure 6 The diagram shows the internal structure of the loudspeaker. Figure 6 and Figure 7 As shown, in some embodiments, the first acoustic hole acoustically connected to the first acoustic cavity 111-1 is a first pressure relief hole 113-1, the second acoustic hole acoustically connected to the second acoustic cavity 111-2 is a second pressure relief hole 113-2, and the third acoustic hole acoustically connected to the third acoustic cavity 111-3 is a sound outlet hole 112. The sound outlet hole 112 is oriented towards the user's ear canal; for example, the sound outlet hole 112 can be located in... Figure 6 , Figure 7 The inner surface of the first housing 110 shown; the first pressure relief hole 113-1 and the second pressure relief hole 113-2 are located further away from the user's ear canal than the sound outlet hole 112. For example, the first pressure relief hole 113-1 can be located at... Figure 6 , Figure 7 The second pressure relief hole 113-2 can be provided on the upper side of the first housing 110 as shown. Figure 6 , Figure 7 The lower side of the first housing 110 is shown. The sound generated by the first diaphragm 121-1 and the second diaphragm 121-2 is output through the sound outlet 112 and directed to the user's ear canal, thereby increasing the headphone's output. When applied to open-back headphones, since the ambient noise received by the user's ear canal is relatively large, improving the headphone's output performance helps the headphones to actively cancel out larger ambient noises.

[0081] In some embodiments, to reduce the difficulty of gas exchange between the third acoustic cavity 111-3 and the outside environment, the sound outlet 112 can adopt an L-shaped structure. The L-shaped structure includes a short side portion located on the front side of the first housing 110 parallel to the minor axis direction, and a long side portion located on the inner side of the first housing 110 parallel to the major axis direction, such as... Figure 6 As shown.

[0082] Figure 8This is a schematic diagram of the frequency response curves of the headphones corresponding to different pressure relief holes, as shown in some embodiments of this specification. Figure 9 This is another structural schematic diagram of the headphones shown according to some embodiments of this specification.

[0083] In some embodiments, when worn, Figure 9 The front side of the first housing 110 shown may abut against the user's ear, in which case the front side of the first housing 110 may not output sound. In some embodiments, the sound outlet 112 is located on the inner side of the first housing 110, and a gap is provided between the front side of the first housing 110 and the speaker 120, which serves as a sound guide channel. The sound guide channel is configured to guide the sound generated by the speaker 120 on the front side to the sound outlet 112 for output. That is, compared to Figure 6 and Figure 7 , Figure 9 In the headphones shown, the sound generated by the speaker 120 at the short side of the sound outlet 112 is guided through a sound guide channel to the long side of the sound outlet 112 for output. For example, in Figure 9 In this configuration, the sound outlet 112 may only include the long side portion. The sound output by the speaker 120 at the short side portion of the sound outlet 112 can be guided to the long side output of the sound outlet 112 through the sound guide channel formed by the gap between the first housing 110 and the speaker 120. In some embodiments, the speaker 120 outputs sound through an opening 1251 on the short side portion of the frame 125. This opening 1251 can be connected to a sound guide channel such as a sound guide tube, thereby guiding the sound to the long side output of the sound outlet 112.

[0084] exist Figure 8 In the middle, curve L 191 yes Figure 4 The frequency response curve of the headphones shown is curve L. 192 yes Figure 7 The frequency response curve shown is located at the first pressure relief port 113-1 when the first diaphragm 121-1 is driven by the earphone alone. Curve L 193 yes Figure 7 The frequency response curve shown is located at the second pressure relief port 113-2 when the second diaphragm 121-2 is driven by the earphone alone. Curve L 194 yes Figure 9 The frequency response curve of the headphones is shown. Figure 8 As shown, curve L 192 With curve L 193 They are close and largely overlap, indicating Figure 7 The first diaphragm 121-1 and the second diaphragm 121-2 of the earphone shown have a high degree of vibration consistency.

[0085] In flat sections (e.g.) Figure 8As shown in the 200Hz-4kHz range, at the same frequency, curve L... 191 The corresponding output sound pressure level ratio curve L 192 The corresponding output sound pressure level is about 4dB higher, indicating that Figure 4 The output ratio of the headphones shown Figure 7 The output of the headphones shown is approximately 4 dB higher. In some embodiments, this may be due to the setting... Figure 7 The sound outlet 112 of the earphone shown is too long, resulting in a non-focused sound output.

[0086] In flat sections (e.g.) Figure 8 As shown in the 200Hz-4kHz range, at the same frequency, curve L... 194 The corresponding output sound pressure level ratio curve L 192 The corresponding output sound pressure level is about 3dB higher, indicating that the sound output from the front side of the first housing 110 is directed to the sound outlet 112 on the left side through the sound guide channel (e.g., Figure 9 As shown, this can make the sound output from the sound hole 112 more focused, thereby improving the output directivity of the headphones.

[0087] In some embodiments, the width of the sound guide channel can also affect the headphone's output, thereby affecting the headphone's active noise cancellation effect against larger ambient noises in an open-back design. For example, when the sound output from the speaker 120 at the short side of the sound outlet 112 is guided through the sound guide channel formed by the gap between the first housing 110 and the speaker 120 to the long side of the sound outlet 112, the gap between the first housing 110 and the speaker 120 serves as the sound guide channel, and the width of the gap between the short side of the first housing 110 and the short side of the speaker 120 is the width of the sound guide channel. If the width of the sound guide channel is too small, it will increase the difficulty of sound transmission, reduce the sound transmitted to the long side of the sound outlet 112, and affect the headphone's output sound pressure level; if the width of the sound guide channel is too large, it will result in the first housing 110 being too large or the volume of the third acoustic cavity 111-3 of the speaker 120 being too small, resulting in the resonant frequency of the third acoustic cavity 111-3 being too high. In some embodiments, to ensure the output sound pressure level of the headphones while maintaining a suitable resonant frequency of the third acoustic cavity 111-3, so that the headphones have a relatively flat and stable output over a wide frequency range, the width of the sound guide channel can be 0.5mm-2mm. In some embodiments, to achieve a higher output sound pressure level for the headphones, the width of the sound guide channel can be 1mm-1.5mm. In some embodiments, the width of the sound guide channel can be 1.3mm, so that the resonant frequency of the third acoustic cavity 111-3 is around 5.5kHz, allowing the headphones to have a relatively flat and stable output over a wide frequency range.

[0088] In some embodiments, the microphone assembly 140 may include a noise-canceling microphone, wherein the noise-canceling microphone may include a first microphone, which may be disposed on the first housing 110 near the user's ear canal to collect ambient noise near the user's ear canal; and the first microphone is disposed near the acoustic null point of the headphones to reduce the interference of the headphones' output on the first microphone and improve the accuracy of the first microphone in collecting ambient noise near the user's ear canal. In some embodiments, the noise-canceling microphone may further include a second microphone, which may be disposed near the sound outlet 112 to collect the sound signal including the noise-canceling signal output from the sound outlet 112 and monitor the effect of active noise cancellation. The first microphone may also be regarded as a feedforward microphone, which generates a primary noise signal based on the ambient noise collected by the first microphone for active noise cancellation; the second microphone may also be regarded as a feedback microphone, which generates a secondary noise signal based on the sound collected by the second microphone, and generates a noise-canceling signal based on the primary noise signal and the secondary noise signal to improve the active noise cancellation effect.

[0089] In some embodiments, when the first pressure relief hole 113-1 and the second pressure relief hole 113-2 are respectively provided on the upper and lower sides of the first housing 110 of the earphone, the acoustic zero-point region where the sound cancels out does not change much when the first pressure relief hole 113-1 and the second pressure relief hole 113-2 are directly opposite each other or misaligned. This is especially true in the longitudinal direction gradually moving away from the front side (i.e.,...). Figures 10A-10D In the left-right direction, when the first pressure relief hole 113-1 and the second pressure relief hole 113-2 are located in different positions, the acoustic zero-point region where sound cancels out does not change much. In summary, the first microphone can be located near the intersection of the right side and the front side of the first housing 110, so that the first microphone is located in the acoustic zero-point region of the first housing 110 near the user's ear canal.

[0090] In some embodiments, the microphone assembly 140 may further include a call microphone, which can be used to capture the user's voice. The call microphone may include a third microphone and a fourth microphone, wherein the third microphone is disposed on the first housing 110 in a region near the user's mouth (e.g., near the intersection of the front and outer sides), and the line connecting the fourth microphone and the third microphone points towards the user's mouth. In some embodiments, the fourth microphone may be disposed in a region near the acoustic null point of the earphone to reduce the sound captured by the fourth microphone from the sound outlet 112 and the pressure relief hole 113, and to minimize the echo during the call. In some embodiments, the third microphone and the first microphone may be the same microphone. In this case, the first microphone may serve as both a call microphone and a noise-canceling microphone, and the first microphone and the fourth microphone may cooperate to perform active noise cancellation during the user's call, while the second microphone may enhance the effect of active noise cancellation.

[0091] In some embodiments, by designing the first pressure relief hole 113-1 and the second pressure relief hole 113-2, the output of the headphones can also be adjusted, thereby adjusting the active noise reduction effect of the headphones on larger environmental noises under open-fitting conditions.

[0092] Figures 10A-10D This is a schematic diagram showing the distribution of first and second pressure relief holes of different sizes according to some embodiments of this specification. Figures 11A-11D yes Figures 10A-10D A schematic diagram of the corresponding headphone's frequency response curve. Among them, Figure 10A The dimensions of the first pressure relief hole 113-1 and the second pressure relief hole 113-2 shown are both relatively small; Figure 10B The first pressure relief hole 113-1 shown is smaller in size, while the second pressure relief hole 113-2 is larger in size; Figure 10C The first pressure relief hole 113-1 shown is larger in size, while the second pressure relief hole 113-2 is smaller in size; Figure 10D The dimensions of the first pressure relief hole 113-1 and the second pressure relief hole 113-2 shown are both relatively large. Figures 11A-11D In the middle, curve L 231 The frequency response curve at the pressure relief orifice is represented by curve L. 232 The frequency response curve at the sound hole is shown. The output sound pressure level at the pressure relief hole can be measured by a test microphone set at the equivalent pressure relief hole of both the first pressure relief hole 113-1 and the second pressure relief hole 113-2. The center of the equivalent pressure relief hole can be located at the midpoint of the line connecting the center of the first pressure relief hole 113-1 and the center of the second pressure relief hole 113-2.

[0093] Please refer to Figures 10A-11D As the total opening area of ​​the first pressure relief hole 113-1 and the second pressure relief hole 113-2 increases, curve L... 231 At higher frequencies (e.g., 6kHz-10kHz), the peak width increases, and the curve L... 232 Peak-valley fluctuations occur at high frequencies (e.g., 6kHz-10kHz); and when the dimensions of the first pressure relief orifice 113-1 and the second pressure relief orifice 113-2 are different, curve L... 231 Multiple peaks appear at high frequencies (e.g., 6kHz-10kHz), resulting in richer high-frequency vibration characteristics.

[0094] In some embodiments, the first pressure relief hole 113-1 and the second pressure relief hole 113-2 are in the vibration direction (i.e., Figures 10A-10D The headphone can be staggered in the vertical direction and the size can be different to improve the high-frequency vibration characteristics of the headphones, enhance the output performance of the headphones, and thus improve the active noise cancellation effect of the headphones in the case of large environmental noise in the open-fit style.

[0095] In some embodiments, the headphones may also include an EQ (Equalization) unit, which can be used to adjust the proportion of different frequencies in the sound output by the headphones. To improve the high-frequency output of the headphones, in some embodiments, the proportion of high-frequency components in the sound output by the headphones can be increased by adjusting the EQ, thereby compensating for the lack of high-frequency output, improving the output performance of the headphones, and thus improving the active noise cancellation effect of the headphones against larger ambient noise in open-back wearing conditions.

[0096] In some embodiments, to improve the high-frequency output of the headphones and thus enhance their active noise cancellation performance against significant ambient noise in open-back designs, the headphones may also include a high-frequency unit. The speaker 120 can function as a low-frequency unit, responsible for at least the mid-low frequency range (e.g., below 6kHz); the high-frequency unit can primarily handle the high-frequency range (e.g., 6kHz-10kHz). This high-frequency unit compensates for the headphones' lack of high-frequency response, thereby improving the headphones' output performance.

[0097] In some embodiments, the operating frequency band of the high-frequency unit can be greater than 7kHz, that is, the frequency of the signal input to the high-frequency unit can be greater than 7kHz, so as to reduce the overlap between the operating frequencies of the high-frequency unit and the speaker 120, so that the headphones can have a flatter frequency response curve in a wider frequency range in the mid-low frequency range (e.g., 200Hz-6kHz), improve the output performance of the headphones, and thus improve the active noise cancellation effect of the headphones on larger environmental noise in the open-fit mode.

[0098] Please refer to Figures 11A-11D curve L 231 In some embodiments, at high frequencies, the sound output from the pressure relief hole will resonate, interfering with the signal acquisition of the second microphone and affecting the active noise cancellation effect of the headphones.

[0099] In some embodiments, the acoustic impedance of the pressure relief holes (e.g., the first pressure relief hole 113-1, the second pressure relief hole 113-2, etc.) can be increased to reduce sound leakage from the pressure relief holes, especially to reduce the impact on the second microphone near the high-frequency resonant frequency. In some embodiments, an acoustic barrier mesh can be provided in the pressure relief holes (e.g., the first pressure relief hole 113-1, the second pressure relief hole 113-2, etc.) to increase the acoustic impedance of the pressure relief holes.

[0100] Figure 12 This is a schematic diagram of the structure of the first housing according to some embodiments of this specification. Please refer to... Figure 12In some embodiments, when the first pressure relief hole 113-1 and the second pressure relief hole 113-2 are respectively disposed on the upper side 110c and the lower side 110d of the first housing 110, the resonant frequency of the second resonant peak can be increased by designing the first Helmholtz resonant cavity model and the second Helmholtz resonant cavity model (e.g., the number, shape, size, and position of the sound outlet and acoustic cavity). This allows the frequency response curve of the sound output by the speaker 120 to have a flatter region in a larger frequency range, thereby optimizing the frequency response curve of the sound output by the headphones (specifically, the sound outlet 112). This enables the headphones to perform active noise cancellation in a wider frequency range and improves the sound output effect of the headphones.

[0101] As the size of the pressure relief holes (first pressure relief hole 113-1, second pressure relief hole 113-2, etc.) gradually decreases, the resonant peak of the sound-generating part 100 at high frequencies (e.g., above 4.5kHz) gradually shifts forward. To increase the resonant frequency of the second resonant peak of the headphones at high frequencies and to enable the headphones to have a flat output over a wider frequency range, the size of the pressure relief holes should not be too small. Based on this, in some embodiments, the first pressure relief hole 113-1 and the second pressure relief hole 113-2 can adopt a single-hole structure, and the ratio of the size of the first pressure relief hole 113-1 and / or the second pressure relief hole 113-2 to the corresponding size of the first housing 110 is not less than 0.3. For example, when the length of the first housing 110 and the pressure relief hole in the long axis direction is greater than their respective width in the short axis direction, the ratio of the long side dimension of the pressure relief hole to the long side dimension of the first housing 110 can be no less than 0.3; for example, the ratio of the length of the first pressure relief hole 113-1 in the long axis direction to the length of the inner sidewall in the long axis direction can be no less than 0.3, and the ratio of the length of the first pressure relief hole 113-1 in the long axis direction to the length of the outer sidewall in the long axis direction can be no less than 0.3. When the outline shape of the sound-emitting part 100 is a circular isocentric symmetrical geometry, the ratio of the radius of the pressure relief hole to the radius of the corresponding sidewall of the first housing 110 can be no less than 0.3. In this way, the resonant frequency of the corresponding acoustic cavity can be larger, ensuring that the second resonant peak of the sound output through the pressure relief hole shifts to the high frequency range, ultimately making the headphones have a flatter output over a wider frequency range, and improving the active noise cancellation effect of the headphones in open environments with large ambient noise.

[0102] Figures 13A-13B This is a schematic diagram showing the different relative positions of the first pressure relief hole and the second pressure relief hole according to some embodiments of this specification. Figure 13A The first pressure relief hole 113-1 and the second pressure relief hole 113-2 shown are arranged opposite to each other and are both located at the center of the corresponding surface; Figure 13B The first pressure relief hole 113-1 and the second pressure relief hole 113-2 shown are eccentrically arranged in the length direction.

[0103] In some embodiments, the misalignment of the first pressure relief hole 113-1 and the second pressure relief hole 113-2 causes the second resonant frequency of the headphones to shift forward, resulting in a narrower flat area for the headphones. To ensure that the second resonant peak of the sound output through the pressure relief hole shifts to higher frequencies, ultimately resulting in a flatter output across a wider frequency range and improved active noise cancellation in open-back environments, the first pressure relief hole 113-1 and the second pressure relief hole 113-2 can be single-hole structures, and the first pressure relief hole 113-1 and the second pressure relief hole 113-2 can be positioned directly opposite each other. Figure 13A As shown. That is, on a reference plane perpendicular to the vibration direction, the centroid of the projection of the second pressure relief hole 113-2 coincides with or approximately coincides with the centroid of the projection of the first pressure relief hole 113-1.

[0104] Due to limitations in the actual manufacturing process and the design requirements of the headphones' components or appearance, the sizes of the first pressure relief hole 113-1 and the second pressure relief hole 113-2 may differ. This may affect the output of the headphones, thereby affecting the near-field listening effect and the active noise cancellation effect against larger ambient noise in open environments.

[0105] Figure 14 This is a schematic diagram of different sizes of first and second pressure relief holes according to some embodiments of this specification.

[0106] In some embodiments, when the dimensions of the first pressure relief hole 113-1 and the second pressure relief hole 113-2 are different, the second resonant frequency of the headphones will shift forward, resulting in a narrower flat area for the headphones. To ensure that the second resonant peak of the sound output through the pressure relief hole shifts to higher frequencies, ultimately resulting in a flatter output across a wider frequency range and improved active noise cancellation in open environments, in some embodiments, the dimensions of the first pressure relief hole 113-1 and the second pressure relief hole 113-2 can be set to be the same (e.g., ...). Figure 13A As shown in the figure, this helps to ensure that the sound-emitting part 100 has a flat frequency response curve and a phase curve with small changes in a wider frequency range, thereby enhancing the effect of active noise cancellation of the headphones in a wider frequency range.

[0107] Figures 15A-15B These are schematic diagrams illustrating pressure relief orifices of different shapes according to some embodiments shown in this specification. Figure 15A The pressure relief hole shown is a single, centralized opening. Figure 15B The pressure relief hole shown is a single, non-centralized opening (e.g., annular opening).

[0108] In some embodiments, compared to, such as Figure 15A The pressure relief orifice shown is a single centralized opening type, using, as Figure 15BThe single, non-centralized opening type of the pressure relief orifice shown allows the peak resonant frequency of the second resonant peak of the sound output from the pressure relief orifice to be located in a higher frequency band. This is more conducive to the headphones having a flatter acoustic output over a wider frequency range, thus improving the active noise cancellation effect of the headphones. To ensure that the second resonant peak of the sound output through the pressure relief orifice shifts to a higher frequency band, ultimately resulting in a flatter output over a wider frequency range and improving the active noise cancellation effect of the headphones in open environments with greater ambient noise, in some embodiments, the first pressure relief orifice 113-1 and / or the second pressure relief orifice 113-2 can adopt the following... Figure 15B The single non-centralized opening shown.

[0109] Figures 16A-16B This is a schematic diagram showing different numbers of pressure relief holes according to some embodiments of this specification.

[0110] In some embodiments, given a fixed total opening area of ​​the pressure relief holes, the smaller the size of a single pressure relief hole and the greater the number of pressure relief holes, the more the second resonant peak of the output sound shifts towards the high-frequency range. In some embodiments, the pressure relief holes (e.g., the first pressure relief hole 113-1) can be adopted as follows: Figure 16A and Figure 16B The holes shown are not a single concentrated opening distribution, that is, the pressure relief holes are a multi-hole structure composed of multiple small holes arranged in an array; this can not only make the high frequency peak of the speaker 120 higher, but also greatly increase the effective area of ​​sound output, ensure the active noise reduction effect, and at the same time meet the appearance design requirements of the sound-generating part 100 or the headphones.

[0111] When the total area of ​​the pressure relief holes is fixed, if the size of a single pressure relief hole is too small, although the total number of pressure relief holes can be increased, thus increasing the high-frequency resonance peak, it will also increase the acoustic impedance of the pressure relief hole, thereby affecting the output sound pressure level. Therefore, to ensure the output sound pressure level of the headphones, the pressure relief holes (e.g., the first pressure relief hole 113-1) should be designed with... Figure 16A and Figure 16B When the porous structure shown is not a single centralized opening, that is, when the pressure relief hole is a porous structure composed of multiple small holes arranged in an array, the diameter of a single small hole can be no less than 0.2 mm.

[0112] Figures 17A-17F This is a schematic diagram of pressure relief orifices with different distributions and non-single concentrated openings, according to some embodiments of this application. Figure 17A The pressure relief holes, which are not single centralized openings, are distributed on one side of the shell sidewall corresponding to the first shell 110 in the long axis direction, and the corresponding opening ratio is 0.15. Figure 17B The pressure relief holes, which are not single centralized openings, are distributed in a ring on one side of the shell sidewall corresponding to the first shell 110 in the long axis direction, with a corresponding opening ratio of 0.15. Figure 17CThe pressure relief holes, which are not single centralized openings, are distributed in a ring on the entire surface of the corresponding side wall of the first housing 110, with a corresponding opening ratio of 0.15. Figure 17D The pressure relief holes, which are not single centralized openings, are distributed in a ring on one side of the shell sidewall of the first shell 110 in the long axis direction, and the corresponding shell sidewall is provided with a sound adjustment hole 113-3 on the other side in the long axis direction. The opening ratio of the pressure relief holes is 0.15, and the opening ratio of the sound adjustment hole 113-3 is 0.0375. Figure 17E The pressure relief holes, which are not single centralized openings, are distributed in the central area of ​​the shell sidewall corresponding to the first shell 110, with a corresponding opening ratio of 0.15. Figure 17F This indicates that the pressure relief holes, which are not a single concentrated opening, are distributed across the entire surface of the corresponding sidewall of the first housing 110, with a corresponding opening ratio of 0.30. In this case, the first pressure relief hole 113-1 and the second pressure relief hole 113-2 can be designed facing each other or staggered. The opening ratio is calculated as the ratio of the opening area of ​​the pressure relief hole to the area of ​​the corresponding sidewall of the first housing 110, for example, the ratio of the area of ​​the first pressure relief hole 113-1 to the area of ​​the inner wall surface.

[0113] In some embodiments, a lower aperture ratio of the pressure relief hole indicates a smaller total area of ​​the pressure relief hole, which leads to a lower resonant frequency of the second resonant peak of the sound output from the pressure relief hole, resulting in a narrower flat area of ​​the headphones and affecting the active noise cancellation effect of the headphones. When the pressure relief hole is a porous structure composed of multiple small holes arranged in an array (i.e., when the pressure relief hole adopts a non-single concentrated aperture structure), in order to make the headphones have a flatter output over a wider frequency range, the aperture ratio of the pressure relief hole can be no less than 0.1; it can also be understood that, on a reference plane perpendicular to the thickness direction (vibration direction), the area ratio of the projection of the first pressure relief hole 113-1 or the second pressure relief hole 113-2 in the projection of the corresponding side wall (e.g., the upper side wall or the lower side wall) of the first housing 110 is no less than 10%.

[0114] When worn, due to limitations such as the opening size of the first pressure relief hole 113-1 and the coverage area relative to the first acoustic cavity 111-1, some of the sound generated by the speaker 120 (specifically, the first diaphragm 121-1) in the first acoustic cavity 111-1 will be obstructed by the side wall of the first housing 110 (e.g., the part of the upper wall where the first pressure relief hole 113-1 is not opened) and cannot be directly output through the first pressure relief hole 113-1. As a result, a standing wave will be formed in the first acoustic cavity 111-1. This will cause the peak resonant frequency of the second resonant peak to shift forward (i.e., shift to the lower frequency band), affecting the effect of active noise cancellation of the headphones in a wider frequency range.

[0115] Therefore, in some embodiments, please refer to Figure 17D and Figure 18The inner wall of the first housing 110 may also be provided with a sound-tuning hole 113-3, which is connected to the first acoustic cavity 111-1. Based on the first pressure relief hole 113-1 and the connection between the sound-tuning hole 113-3 and the first acoustic cavity 111-1, the peak resonant frequency of the second resonant peak of the sound output to the outside of the first housing 110 through the sound-tuning hole 113-3 can be adjusted. For example, the peak resonant frequency of the second resonant peak is not less than 1kHz. At this time, the first pressure relief hole 113-1 can be a single-hole structure (e.g., a single concentrated opening structure) or a multi-hole structure (i.e., a non-single concentrated opening structure).

[0116] Specifically, most of the sound generated by the speaker 120 within the first acoustic cavity 111-1 is output through the first pressure relief port 113-1, while a small portion of the sound is output through the tuning port 113-3. This minimizes the formation of standing waves within the first acoustic cavity 111-1, allowing the peak resonant frequency of the second resonant peak of the frequency response curve of the sound output from the first pressure relief port 113-1 to shift as high as possible. This adjustment of the peak resonant frequency ultimately results in a flatter output across a wider frequency range for the headphones, facilitating active noise cancellation over a wider frequency range. Simultaneously, it also enhances the sound pressure level of the sound output from the first pressure relief port 113-1, ensuring a superior listening experience for the user.

[0117] Figure 18 This is a schematic diagram showing the relative positions of the first sound outlet and the tuning hole according to some embodiments of this specification.

[0118] Considering the different relative positions between the tuning port 113-3 and the first pressure relief port 113-1, it may affect the output of the speaker 120 or the position of the peak resonant frequency of the resonant peak. Please refer to... Figure 18 Taking the example where both the first pressure relief hole 113-1 and the sound tuning hole 113-3 adopt a porous structure, we define L1-X as the minimum distance between any two holes, L2-X as the minimum distance from the boundary of the first acoustic cavity 111-1 to any hole, and LM as the minimum distance between any two holes or the minimum distance from the boundary of the first acoustic cavity 111-1 to any hole. It should be noted that the minimum distance here refers to the distance between the outline edges of any hole, or the distance from the outline edge of any hole to the boundary of the acoustic cavity.

[0119] In some embodiments, as the LM increases, the corresponding high-frequency peak shifts forward, resulting in a narrower flat area of ​​the headphones and affecting the active noise cancellation effect. Simultaneously, an increase in LM means a corresponding decrease in the opening area of ​​the pressure relief hole, leading to a reduction in the sound pressure level of the output sound. To ensure a flatter output across a wider frequency range while maintaining the headphone's output sound pressure level, in some embodiments, the minimum distance between any two holes or the minimum distance from the boundary of the first acoustic cavity 111-1 to any hole can be set to no more than 14mm; this can also be understood as the minimum distance between the first pressure relief hole 113-1 and the tuning hole 113-3 being no more than 14mm, the minimum distance from the boundary of the first acoustic cavity 111-1 to the first pressure relief hole 113-1 being no more than 14mm, and the minimum distance from the boundary of the first acoustic cavity 111-1 to the tuning hole 113-3 being no more than 14mm. It can also be understood that when the first pressure relief hole 113-1 and / or the sound tuning hole 113-3 are a porous structure composed of multiple small holes arranged in an array, the minimum distance between any two adjacent small holes is no greater than 14mm.

[0120] In this way, the sound output from the first pressure relief port 113-1 can have a relatively flat phase curve at least in the frequency range below 1kHz, thereby ensuring that the headphones have a relatively flat output over a wider frequency range, which is beneficial for active noise cancellation in the headphones over a wider frequency range. In addition, as described in the aforementioned embodiments, the diameter of each small hole can be set to not less than 0.2mm.

[0121] In some embodiments, on a reference plane perpendicular to the thickness direction, the total projected area of ​​the first pressure relief hole 113-1 on the reference plane is defined as S1, the total projected area of ​​the sound tuning hole 113-3 on the reference plane is defined as S2, and the ratio of the total projected area S1 of the sound tuning hole 113-3 to the total projected area S1 of the first pressure relief hole 113-1 is defined as SS.

[0122] As SS gradually increases, the corresponding high-frequency peaks gradually shift to the back, and the sound pressure level of the output sound gradually decreases. The increase of SS means that the opening area of ​​the tuning hole 113-3 increases, which can effectively achieve the pressure relief effect, thereby causing the high-frequency peaks to shift to the back. However, due to the increase in the opening area of ​​the tuning hole 113-3, the sound leakage through the tuning hole 113-3 also increases, thereby reducing the sound pressure level of the sound output through the first pressure relief hole 113-1.

[0123] In some embodiments, to ensure a flatter output across a wider frequency range while maintaining the headphone's output sound pressure level, the ratio of the total area of ​​the tuning port 113-3 to the total area of ​​the first pressure relief port 113-1 can be set to less than 23%. By setting the ratio of the total area of ​​the tuning port 113-3 to the total area of ​​the first pressure relief port 113-1 to less than 23%, it is possible to effectively prevent excessive sound leakage from the tuning port 113-3 due to its excessively large opening or area, which would otherwise cause a decrease in the sound pressure level or volume of the first pressure relief port 113-1.

[0124] In some embodiments, please refer to Figure 18 When worn, the tuning port 113-3 is located further away from the external auditory canal 11 than the first pressure relief port 113-1. In open-back applications, the ambient noise received by the user's external auditory canal 11 is relatively large. Improving the output performance of the headphones helps the headphones actively reduce ambient noise. Therefore, by setting the tuning port 113-3 further away from the external auditory canal 11 than the first pressure relief port 113-1, near-field interference cancellation between the sound output through the tuning port 113-3 and the sound output through the first pressure relief port 113-1 can be minimized, ensuring the user's listening experience.

[0125] For example, on a reference plane perpendicular to the thickness direction, the length of the projection of the first acoustic cavity 111-1 along its major axis is not less than its width along its minor axis. For instance, the projected shape of the first acoustic cavity 111-1 could be a rectangle with a length greater than its width, or a square or circle with a length equal to its width. The projection of the first acoustic cavity 111-1 onto the reference plane (e.g., Figure 18 The area shown in the dashed box is divided into a first region and a second region along its length (e.g., Figure 18 The two regions separated by the dashed arrows (the first region in the long axis direction and the projection of the first acoustic cavity in the long axis direction can be set to less than 40%, for example, 38.3%). The projection of the tuning hole 113-3 on the reference plane is located in the first region, and the projection of the first pressure relief hole 113-1 on the reference plane is located in the second region.

[0126] Thus, by placing the tuning hole 113-3 and the first pressure relief hole 113-1 on the corresponding side (e.g., the upper side) of the first housing 110 in different areas corresponding to the first acoustic cavity 111-1, it is possible to ensure that the tuning hole 113-3 is located further away from the external auditory canal than the first pressure relief hole 113-1 when wearing the device; and it is also possible to distinguish between the tuning hole 113-3 and the first pressure relief hole 113-1 when the tuning hole 113-3 is an array of small holes or a large area of ​​concentrated openings and is close to the first pressure relief hole 113-1. For example, holes in the area from the boundary of the first acoustic cavity 111-1 to 38.3% of the diameter in the length or diameter direction of the first acoustic cavity 111-1 can be regarded as tuning holes 113-3.

[0127] It should be noted that, Figure 18 The dashed box in the figure represents the projected boundary of the first acoustic cavity 111-1 on the reference plane; Figure 18 The dashed arrows in the diagram represent the approximate boundary between the first and second regions in the projected shape of the first acoustic cavity 111-1, with the region to the left of the dashed arrow representing the first region and the region to the right of the dashed arrow representing the second region.

[0128] In some embodiments, by designing the magnetic circuit assembly 122 of the speaker 120, the driving force of the voice coil assembly 123 can be increased, thereby optimizing the output of the headphones.

[0129] Figures 19A-19G These are schematic diagrams illustrating different exemplary structures of a loudspeaker according to some embodiments of this specification.

[0130] Please refer to Figure 19A In some embodiments, the first diaphragm 121-1 is connected to the first voice coil 123-1, and the second diaphragm 121-2 is connected to the second voice coil 123-2. The first voice coil 123-1 and the second voice coil 123-2 drive the first diaphragm 121-1 and the second diaphragm 121-2 to vibrate synchronously in the same direction, respectively. The first diaphragm 121-1 and the second diaphragm 121-2 are not directly connected, nor are the first voice coil 123-1 and the second voice coil 123-2. The first voice coil 123-1 drives the first diaphragm 121-1 to vibrate independently, and the second voice coil 123-2 drives the second diaphragm 121-3 to vibrate independently, while the first diaphragm 121-1 and the second diaphragm 121-2 vibrate synchronously in opposite directions. This configuration simplifies the internal structure of the loudspeaker 120 and reduces manufacturing difficulty.

[0131] In some embodiments, in order to improve the output sound of the headphones, improve the listening effect of the headphones, and improve the active noise cancellation effect of the headphones against large ambient noise, the magnetic circuit component 122 can be designed to enhance the magnetic field strength of the magnetic circuit component 122 and increase the driving force of the voice coil component 123.

[0132] Please refer to Figure 19A In some embodiments, the magnetic circuit assembly 122 includes a magnetic shield 1221 and an inner magnet 1222. The inner magnet 1222 is disposed inside the magnetic shield 1221, and a first magnetic plate 1224 is provided on the side of the inner magnet 1222 facing away from the magnetic shield 1221. The magnetic shield 1221 may include a bottom wall 12211 and a side wall. The side wall may be a folded structure with an opening facing the bottom of the magnetic shield 1221. The folded structure includes an inner side wall 12212 and an outer side wall 12214 spaced apart in the direction perpendicular to the vibration direction, and an extension 12213 connecting the inner side wall 12212 and the outer side wall 12214. The bottom wall 12211 is disposed at the end of the inner side wall 12212 near the opening, and the inner magnet 1222 is disposed on the bottom wall 12211. The end of the inner wall 12212 away from the opening is connected to the end of the outer wall 12214 away from the opening via an extension 12213. A first magnetic gap is formed between the inner wall 12212 of the magnetic shield 1221 and the inner magnet 1222, and at least part of the first voice coil 123-1 is located within the first magnetic gap; a second magnetic gap is formed between the inner wall 12212 of the magnetic shield 1221 and the outer wall 12214, and at least part of the second voice coil 123-2 is located within the second magnetic gap.

[0133] Because the second voice coil 123-2 is far from the inner magnet 1222, the magnetic field strength near the second voice coil 123-2 is relatively small, and the second voice coil 123-2 may have insufficient driving force. In order to improve the driving force of the second voice coil 123-2, thereby improving the driving force of the speaker 120, improving the output of the speaker 120, and improving the active noise cancellation effect of the headphones to larger ambient noise, the magnetic circuit system 122 can be designed.

[0134] Please refer to Figure 19B In some embodiments, an outer magnet 1223 can be provided on the outer wall 12214 of the magnetic shield 1221 (i.e., the outer wall 12214 may include the outer magnet 1223) to increase the magnetic field strength near the second voice coil 123-2, thereby increasing the driving force of the second voice coil 123-2, increasing the driving force of the speaker 120, increasing the output of the speaker 120, and improving the active noise cancellation effect of the headphones on large ambient noise. At this time, a first magnetic gap is formed between the inner magnet 1222 and the inner wall 12212, and a second magnetic gap is formed between the outer magnet 1223 and the inner wall 12212. In some embodiments, the magnetization direction of the outer magnet 1223 may be the same as or opposite to the magnetization direction of the inner magnet 1222. For example, the N pole of the inner magnet 1222 may be located at the upper end, and the N pole of the outer magnet 1223 may be located at the upper end (e.g., Figure 19A(As shown). For example, the N pole of the inner magnet 1222 can be located at the upper end, and the N pole of the outer magnet 1223 can be located at the lower end (as shown). Figure 19G (As shown).

[0135] In some embodiments, when the magnetization directions of the inner magnet 1222 and the outer magnet 1223 are the same (e.g., the N poles are both located at...), Figure 19B When the upper end is shown, the inner wall 12212 of the magnetic shield 1221 is subjected to the combined action of the inner magnet 1222 and the outer magnet 1223, resulting in magnetic field saturation of the inner wall 12212. This limits the increase in magnetic field strength at the locations of the first voice coil 123-1 and the second voice coil 123-2, affecting the driving force of the first voice coil 123-1 and the second voice coil 123-2, and thus affecting the active noise cancellation effect of the headphones. In some embodiments, such as Figure 19C As shown, the size of the inner wall 12212 can be increased to avoid magnetic field saturation in the inner wall 12212 as much as possible, thereby increasing the magnetic field strength at the locations of the first voice coil 123-1 and the second voice coil 123-2, thereby increasing the driving force of the speaker 120, increasing the output of the speaker 120, and improving the active noise cancellation effect of the headphones for larger ambient noise. The magnetic circuit system 122 can be designed accordingly.

[0136] Please refer to Figure 19B and 19CIn some embodiments, to avoid the magnetic circuit assembly 122 becoming too large, the size of the inner magnet 1222 can be reduced while keeping the size of the magnetic circuit assembly 122 unchanged (i.e., the size of the magnetic shield 1221 unchanged), thereby increasing the size of the inner sidewall 12212. In some embodiments, the ratio of the thickness of the inner sidewall 12212 to the size of the magnetic shield 1221 in the short-axis or long-axis direction can be 0.05-0.16. In some embodiments, to further improve the driving force of the speaker 120, the ratio of the thickness of the inner sidewall 12212 to the size of the magnetic shield 1221 in the short-axis or long-axis direction can be 0.06-0.15. In some embodiments, while keeping the size of the magnetic circuit assembly 122 unchanged (i.e., the width of the magnetic shield 1221 unchanged), the thickness of the inner sidewall 12212 is negatively correlated with the size of the inner magnet 1222. For example, in either the minor or major axis direction, when the size of the magnetic shield 1221 is 16mm, the thickness of the inner sidewall 12212 can be 0.8mm-2.5mm; wherein, when the size of the inner magnet 1222 is greater than 4.7mm, the thickness of the inner sidewall 12212 can be 2mm-2.5mm; when the size of the inner magnet 1222 is greater than 5.7mm, the thickness of the inner sidewall 12212 can be 1.5mm-2.5mm; and when the size of the inner magnet 1222 is greater than 6.7mm, the thickness of the inner sidewall 12212 can be 1.2mm. The thickness of the inner wall 12212 can be 1.1mm-2.5mm when the radius of the inner magnet 1222 is greater than 7.7mm; when the radius of the inner magnet 1222 is greater than 8.7mm, the thickness of the inner wall 12212 can be 1mm-2mm; when the radius of the inner magnet 1222 is greater than 9.7mm, the thickness of the inner wall 12212 can be 0.8mm-1.6mm; when the radius of the inner magnet 1222 is greater than 10.7mm, the thickness of the inner wall 12212 can be 0.8mm-1.3mm.

[0137] It should be noted that the ratio of the dimensions of the inner sidewall 12212 to the dimensions of the magnetic shield 1221 refers to the ratio of the thickness of the inner sidewall 12212 along its long axis to the dimensions of the magnetic shield 1221 along its long axis, or the ratio of the thickness of the inner sidewall 12212 along its short axis to the dimensions of the magnetic shield 1221 along its short axis. When the magnetic shield 1221 has a "U"-shaped structure, and only includes sidewalls along its long or short axis, the ratio of the thickness of the inner sidewall 12212 to the dimensions of the magnetic shield 1221 refers to the ratio of the thickness of the inner sidewall 12212 in the corresponding direction to the dimensions of the magnetic shield 1221 in the corresponding direction.

[0138] In some embodiments, such as Figure 19DAs shown, the outer magnet 1223 can also be disposed on the inner sidewall 12212 (i.e., the inner sidewall 12212 may include the outer magnet 1223) to avoid magnetic field saturation on the inner sidewall 12212, ensuring the magnetic field strength at the locations of the first voice coil 123-1 and the second voice coil 123-2, thereby increasing the driving force of the speaker 120, increasing the output of the speaker 120, and improving the active noise cancellation effect of the headphones against larger ambient noise. In this case, a first magnetic gap is formed between the inner magnet 1222 and the outer magnet 1223, and a second magnetic gap is formed between the outer magnet 1223 and the outer sidewall 12214. In some embodiments, the magnetization direction of the outer magnet 1223 may be the same as or opposite to the magnetization direction of the inner magnet 1222.

[0139] In some embodiments, such as Figure 19E As shown, in order to further enhance the magnetic field strength at the locations of the first voice coil 123-1 and the second voice coil 123-2, thereby increasing the driving force of the speaker 120, improving the output of the speaker 120, and enhancing the active noise cancellation effect of the headphones against larger ambient noise, the inner wall 12212 of the magnetic shield 1221 can be provided with a first outer magnet 1223-1, and the outer wall 12214 of the magnetic shield 1221 can be provided with a second outer magnet 1223-2. That is, the inner wall 12212 can include the first outer magnet 1223-1, and the outer wall 12214 can include the second outer magnet 1223-2. At this time, a first magnetic gap is formed between the inner magnet 1222 and the first outer magnet 1223-1, and a second magnetic gap is formed between the first outer magnet 1223-1 and the second outer magnet 1223-2. In some embodiments, the magnetization directions of the inner magnet 1222, the first outer magnet 1223-1, and the second outer magnet 1223-2 may be the same or opposite. For example, the magnetization directions of the inner magnet 1222 and the first outer magnet 1223-1 can be the same, and the magnetization directions of the inner magnet 1222 and the second outer magnet 1223-2 can be the same; or, the magnetization directions of the inner magnet 1222 and the first outer magnet 1223-1 can be the same, and the magnetization directions of the inner magnet 1222 and the second outer magnet 1223-2 can be opposite; or, the magnetization directions of the inner magnet 1222 and the first outer magnet 1223-1 can be opposite, and the magnetization directions of the inner magnet 1222 and the second outer magnet 1223-2 can be the same; or, the magnetization directions of the inner magnet 1222 and the first outer magnet 1223-1 can be opposite, and the magnetization directions of the inner magnet 1222 and the second outer magnet 1223-2 can be opposite.

[0140] Please refer to Figure 19FWhen an outer magnet 1223 (i.e., the outer wall 12214 includes the outer magnet 1223) is provided on the outer wall 12214 of the magnetic shield 1221, and the magnetization directions of the inner magnet 1222 and the outer magnet 1223 are opposite (for example, the N pole of the inner magnet 1222 can be located at the upper end, and the N pole of the outer magnet 1223 can be located at the lower end), the inner wall 12212 of the magnetic shield 1221 has a magnetic field zero pole, and the inner wall 12212 is not responsible for magnetic conduction. At this time, the inner wall 12212 of the magnetic shield 1221 mainly plays a connecting and supporting role. In order to reduce the mass and size of the speaker 120, the thickness of the inner wall 12212 of the magnetic shield 1221 can be designed to be less than or equal to 0.4 mm. In some embodiments, such as Figure 19G As shown, in order to further reduce the mass and size of the speaker 120, the thickness of the inner wall 12212 of the magnetic shield 1221 can also be designed to be 0, that is, the inner wall 12212 structure is eliminated.

[0141] In some embodiments, in order to reduce the mass and size of the speaker 120, the inner sidewall 12214 may be perforated.

[0142] Since the outer magnet 1223 and the inner magnet 1222 need to be connected, the annular sidewall of the magnetic shield 1221 needs to retain at least a portion of the inner sidewall 12212 to connect the outer sidewall 12214 to the bottom wall 12211 of the magnetic shield 1221. Exemplarily, the outer sidewall 12214 of the long side of the magnetic shield 1221 can be connected to the bottom wall 12211 of the magnetic shield 1221 via the inner sidewall 12212, and the short side of the magnetic shield 1221 may not have an inner sidewall 12212. Here, the long side of the magnetic shield 1221 refers to the side parallel to the major axis, and the short side of the magnetic shield 1221 refers to the side parallel to the minor axis.

[0143] To improve the vibration consistency between the first diaphragm 121-1 and the second diaphragm 121-2, reduce headphone output distortion, and thus improve the output performance of the speaker 120 and the active noise cancellation effect of the headphones in open-back design, the driving forces of the first voice coil 123-1 and the second voice coil 123-2 can be close to or the same. In some embodiments, the dimensions of the inner magnet 1222 and the outer magnet 1223 can be designed to make the magnetic field strength near the first voice coil 123-1 and the second voice coil 123-2 similar, thereby improving the vibration consistency between the first diaphragm 121-1 and the second diaphragm 121-2, reducing headphone output distortion, and thus improving the active noise cancellation effect of the headphones.

[0144] Figure 20 This is another structural schematic diagram of a loudspeaker according to some embodiments of this specification.

[0145] Please refer to Figure 20The ratio of the size Wim of the inner magnet 1222 to the size Wom of the outer magnet 1223 is defined as Wim / Wom. The size refers to the dimensional parameter of the relevant component in the direction perpendicular to the vibration direction. For example, the thickness of the outer magnet 1223 refers to the distance between the outer and inner surfaces of the outer magnet 1223, and the size of the inner magnet 1222 refers to the cross-sectional dimensions of the inner magnet 1222. In some embodiments, when the ratio of the size of the inner magnet 1222 to the thickness of the outer magnet 1223 is too small, the size of the inner magnet 1222 is too small, which may result in a low magnetic field strength in the magnetic circuit assembly 122 and insufficient driving force in the voice coil assembly 123, affecting the output of the speaker 120. When the ratio of the size of the inner magnet 1222 to the thickness of the outer magnet 1223 is too large, the size of the inner magnet 1222 is too large, which will make the speaker 120 too large, affecting the wearing comfort of the headphones and reducing the user experience.

[0146] By designing the size ratio of the outer magnet 1223 and the inner magnet 1222, the electromagnetic conversion efficiency of the speaker 120 can be guaranteed, the driving force of the voice coil assembly 123 can be improved, the output of the speaker 120 can be increased, and the active noise cancellation effect of the headphones on large ambient noise can be improved, while avoiding the headphones being too large. For example, the ratio of the dimension of the inner magnet 1222 in the long axis direction to the thickness of the outer magnet 1223 in the long axis direction can be between 1.7 and 33; the ratio of the dimension of the inner magnet 1222 in the short axis direction to the thickness of the outer magnet 1223 in the short axis direction can also be between 1.7 and 33.

[0147] Furthermore, in some embodiments, the ratio of the dimension of the inner magnet 1222 in the long axis direction to the thickness of the outer magnet 1223 in the long axis direction may not exceed 6.7 (i.e., the ratio is 1.7-6.7), and the ratio of the dimension of the inner magnet 1222 in the short axis direction to the thickness of the outer magnet 1223 in the short axis direction may not exceed 2.7 (i.e., the ratio is 1.7-2.7). Through the above-described design, the BL value of the speaker 120 can be significantly improved, thereby enhancing the sound output performance of the speaker 120 and improving the active noise cancellation effect of the headphones against larger ambient noise.

[0148] For example, the speaker 120 has a circular outline, and the ratio of the size of the inner magnet 1222 in the radial direction (i.e., the direction corresponding to the major axis or the minor axis) to the thickness of the outer magnet 1223 in the radial direction is between 1.7 and 33.

[0149] It should be noted that the thickness of the outer magnet 1223 refers to the distance between the outer surface and the inner surface of the outer magnet 1223.

[0150] When the volume of the outer magnet 1223 is too small relative to the volume of the inner magnet 1222, the driving force of the second voice coil 123-2, which is closer to the outer magnet 1223 and farther from the inner magnet 1222, is smaller, while the driving force of the first voice coil 123-1, which is farther from the outer magnet 1223 and closer to the inner magnet 1222, is larger. This results in a large difference in driving force between the first voice coil 123-1 and the second voice coil 123-2. Similarly, when the volume of the outer magnet 1223 is too large relative to the volume of the inner magnet 1222, the driving force of the second voice coil 123-2, which is closer to the outer magnet 1223 and farther from the inner magnet 1222, is larger, while the driving force of the first voice coil 123-1, which is farther from the outer magnet 1223 and closer to the inner magnet 1222, is smaller. This also results in a large difference in driving force between the first voice coil 123-1 and the second voice coil 123-2. That is, when the volume difference between the outer magnet 1223 and the inner magnet 1222 is too large, it will result in a significant difference in driving force between the first voice coil 123-1 and the second voice coil 123-2, affecting the active noise cancellation effect of the headphones. In some embodiments, in order to improve the vibration consistency between the first diaphragm 121-1 and the second diaphragm 121-2, reduce the distortion of the headphone output, and improve the active noise cancellation effect of the headphones, the volume ratio of the outer magnet 1223 to the inner magnet 1222 can be 0.3-3. In some embodiments, in order to further improve the vibration consistency between the first diaphragm 121-1 and the second diaphragm 121-2, reduce the distortion of the headphone output, and improve the active noise cancellation effect of the headphones, the volume ratio of the outer magnet 1223 to the inner magnet 1222 can be 0.5-1.5.

[0151] In some embodiments, as the thickness of the magnetic shield 1221 or the first magnetic plate 1224 increases (i.e., the ratio of the magnet's size to the thickness of the magnetic shield 1221 decreases), the BL value of the speaker 120 gradually increases. However, when the thickness of the magnetic shield 1221 or the first magnetic plate 1224 increases to a certain value, excessively increasing the thickness of the magnetic shield 1221 or the first magnetic plate 1224 will cause the magnetic field lines to disperse and not be effectively concentrated near the voice coil assembly 123, resulting in a decrease in the magnetic field near the voice coil assembly 123. When the thickness of the magnetic shield 1221 or the first magnetic plate 1224 decreases (i.e., the ratio of the magnet's size to the thickness of the magnetic shield 1221 increases), the magnetic saturation of the magnetic shield 1221 or the first magnetic plate 1224 will decrease, reducing the magnetic permeability and thus reducing the magnetic field strength passing through the voice coil assembly 123.

[0152] In order to improve the electromagnetic conversion efficiency of the speaker 120, increase the output sound pressure level of the speaker 120, and improve the active noise cancellation performance of the headphones for larger ambient noise, in some embodiments, the ratio of the size of the inner magnet 1222 to the thickness of the magnetic shield 1221 (e.g., bottom wall 12211) or the first magnetic plate 1224 can be between 1 and 4, and the ratio of the thickness of the outer magnet 1223 to the thickness of the magnetic shield 1221 (e.g., side wall 12212) can be between 1 and 4.

[0153] In some embodiments, the first voice coil 123-1 and the second voice coil 123-2 may have an unequal diameter structure. For example, on a reference plane perpendicular to the vibration direction, there may be gaps between the orthographic projections of the first voice coil 123-1 and the second voice coil 123-2 in both the major and minor axis directions, and the orthographic projection of the first voice coil 123-1 may be located within or outside the orthographic projection of the second voice coil 123-2. That is, the annular orthographic projection of the first voice coil 123-1 may be located within or outside the annular orthographic projection of the second voice coil 123-2, thereby creating a gap between the first voice coil 123-1 and the second voice coil 123-2. This gap allows a clearance channel 123-3 to be formed between the first voice coil 123-1 and the second voice coil 123-2, enabling the magnetic circuit assembly 122 (e.g., the sidewall of the magnetic shield 1221) to pass through the voice coil assembly 123.

[0154] In some embodiments, the speaker 120 has a non-circular outline, such as a rectangle or an ellipse. In this case, the sidewalls of the first voice coil 123-1 and the second voice coil 123-2 parallel to the major axis can be defined as long sidewalls, and the sidewalls parallel to the minor axis can be defined as short sidewalls. The size of the short sidewall of the first voice coil 123-1 is smaller than the size of the short sidewall of the second voice coil 123-2, and the size of the long sidewall of the first voice coil 123-1 is smaller than the size of the long sidewall of the second voice coil 123-2. Alternatively, the size of the short sidewall of the first voice coil 123-1 is larger than the size of the short sidewall of the second voice coil 123-2, and the size of the long sidewall of the first voice coil 123-1 is larger than the size of the long sidewall of the second voice coil 123-2.

[0155] In some embodiments, the outline of the sound-emitting part 100 or the loudspeaker 120 is approximately circular; in this case, the orthographic projection of the first voice coil 123-1 on the reference plane is a first ring, the orthographic projection of the second voice coil 123-2 on the reference plane is a second ring, and the first ring and the second ring have different diameters. The first voice coil 123-1 and the second voice coil 123-2 are completely offset to form an obstacle avoidance channel 123-3.

[0156] By setting the first voice coil 123-1 and the second voice coil 123-2 with the above dimensions, the avoidance channel 123-3 formed between the first voice coil 123-1 and the second voice coil 123-2 can be utilized to provide an avoidance space for the magnetic circuit component 122 (such as the side wall of the magnetic shield 1221). It is equivalent to placing the voice coil component 123 within the same magnetic gap of the magnetic circuit component 123. This can not only enhance the structural stability of the magnetic circuit component 123 itself and provide support for the rapid assembly of the speaker 120, but also facilitate reducing the assembly difficulty and cost, and avoid the voice coil component 123 touching the magnetic circuit component 122 during movement, which may affect the sound output. At the same time, by adopting the above dimension setting, it is also possible to avoid leaving a gap for the magnetic circuit component 122 to pass through in the vibration direction between the first voice coil 123-1 and the second voice coil 123-2, thereby reducing the size of the speaker 120 in the vibration direction.

[0157] It should be noted that when the magnetic shield 1221 has a "ji" - shaped structure and only has side walls parallel to the long - axis direction (or only has side walls parallel to the short - axis direction), there may be a difference in the size of only the short - side side walls (or only the long - side side walls) between the first voice coil 123-1 and the second voice coil 123-2 accordingly, so as to form the corresponding avoidance channel 123-3.

[0158] Figure 21A is a schematic structural diagram of a frame shown in some embodiments of this specification. Figure 21B is a schematic diagram of the position of the frame and the external magnet shown in some embodiments of this specification.

[0159] Please refer to Figure 4 、 Figure 21A and Figure 21B In some embodiments, the speaker 120 may further include a frame 125. In the vibration direction, the frame 125 is located between the first diaphragm 121-1 and the second diaphragm 121-2. The frame 125 can provide an installation and fixing platform for each component of the speaker 120, and the speaker 120 can be connected to the first housing 110 through the frame 125.

[0160] Since the first diaphragm 121-1 and the second diaphragm 121-2 will simultaneously compress the air in the third acoustic cavity 111-3, in order to reduce the vibration resistance of the first diaphragm 121-1 and the second diaphragm 121-2 and enhance the gas exchange efficiency between the third acoustic cavity 111-3 and the outside, holes 1251 can be provided on the frame 125. The holes 1251 are connected to the third acoustic cavity 111-3 and are also connected to the third acoustic holes.

[0161] In some embodiments, by designing the third acoustic cavity 111-3, the resonant frequency of the third acoustic cavity 111-3 can be made larger, thereby making the peak resonant frequency of the second resonant peak larger. This allows the headphones to have a more stable sound output over a wider frequency range, providing support for active noise cancellation in a wider frequency range and improving the output performance of the headphones. Simultaneously, designing the third acoustic cavity 111-3 can also make the high-frequency resonant frequency of the third sound generated by the third acoustic cavity 111-3 larger. This allows the third sound to have an opposite phase to the first and second sounds over a wider frequency range, enabling the third sound to cancel out the first and second sounds over a wider frequency range, resulting in better sound leakage reduction in the headphones over a wider frequency range.

[0162] In some embodiments, the resonant frequency of the third acoustic cavity 111-3 can be greater than 4.5 kHz to make the peak resonant frequency of the second resonant peak larger, thereby enabling the headphones to have a more stable sound output over a wider frequency range, supporting active noise cancellation in a wider frequency band, and improving the output performance of the headphones. In some embodiments, to further enable the headphones to have a more stable sound output over a wider frequency range, the resonant frequency of the third acoustic cavity 111-3 can be greater than 5 kHz. In some embodiments, to further enable the headphones to have a more stable sound output over a wider frequency range, the resonant frequency of the third acoustic cavity 111-3 can be greater than 6 kHz.

[0163] Since the third acoustic aperture is connected to the third acoustic cavity 111-3 through the opening 1251, the area of ​​the opening 1251 also affects the third Helmholtz resonant cavity model. In some embodiments, in order to make the resonant frequency of the third acoustic cavity 111-3 greater than 6kHz, the number of openings 1251 on the frame 125 can be multiple to increase the total area of ​​the openings 1251.

[0164] In some embodiments, the external magnet 1223 may include a plurality of separately arranged sub-magnets, such as Figure 21B As shown, the multiple sub-magnets are of a separate structure. The multiple sub-magnets are disposed on the inner wall of the frame 125, and the frame 125 cooperates with the magnetic shield 1221 to fix the outer magnet 1223. The frame 125 can fix the outer magnet 1223, preventing it from falling off.

[0165] In some embodiments, to reduce manufacturing difficulty, the position of the opening 1251 on the frame 125 can be offset from the position of the external magnet 1223. Simultaneously, this offsetting arrangement of the opening 1251 and the external magnet 1223 also prevents the opening 1251 from being blocked by the external magnet 1223, allowing the opening 1251 to have a larger usable area. This increases the resonant frequency of the third acoustic cavity 111-3, raises the second resonant frequency of the sound output by the speaker 120, and enables the headphones to have a flat output over a wider frequency range. Simultaneously, it ensures airflow between the third acoustic cavity 111-3 and the outside environment, reducing the difficulty of air exchange between the third acoustic cavity 111-3 and the outside environment, reducing the difficulty of volume changes in the third acoustic cavity 111-3, and reducing the difficulty of synchronous, opposite-direction relative vibration of the first diaphragm 121-1 and the second diaphragm 121-2, thereby improving the headphone output.

[0166] In some embodiments, the opening 1251 may include a first opening 12511 disposed near a corner of the frame 125, such as... Figure 21A , Figure 21B As shown. In some embodiments, each of the four corners of the frame 125 can be provided with a first opening 12511, so that the opening 1251 has a larger area, thereby increasing the resonant frequency of the third acoustic cavity 111-3, enabling the headphones to have a flat output over a wider frequency range, while reducing the difficulty of gas exchange between the third acoustic cavity 111-3 and the outside world, reducing the difficulty of synchronous and opposite relative vibration of the first diaphragm 121-1 and the second diaphragm 121-2, and improving the output of the headphones.

[0167] In some embodiments, the opening 1251 may further include a second opening 12512. In the vibration direction, the size of the outer magnet 1223 is smaller than the size of the frame 125. In the vibration direction, the frame 125 includes a offset portion (e.g., the area near the upper and lower ends of the frame 125) that is offset from the outer magnet 1223, and the second opening 12512 is disposed in the offset portion. The provision of the second opening 12512 can further increase the total area of ​​the opening 1251 while ensuring that the opening 1251 is offset from the outer magnet 1223.

[0168] In some embodiments, in the third acoustic aperture (e.g., Figure 4 The pressure relief hole 113 shown is... Figure 6 , Figure 7On the plane where the port of the sound outlet 112) is located, the orthographic projection of the opening 1251 at least partially overlaps with the orthographic projection of the third acoustic hole, so that the opening 1251 can be at least partially directly opposite the third acoustic hole. This allows the third acoustic cavity 111-3 to directly communicate with the outside world through the opening 1251 and the third acoustic hole, reducing obstacles between the third acoustic cavity 111-3 and the external environment. This reduces the difficulty of gas exchange between the third acoustic cavity 111-3 and the outside world, and reduces the difficulty of synchronous, opposite-direction relative vibration of the first diaphragm 121-1 and the second diaphragm 121-2, thereby improving the headphone output. The plane where the port of the third acoustic hole is located can refer to the plane where the outer port of the third acoustic hole is located, or the plane where the inner port of the third acoustic hole is located. For example, the third acoustic hole is... Figure 4 The pressure relief hole 113 shown is located on the inner side of the first housing 110. Figure 7 When the sound outlet 112 is provided in the first housing 110, the plane containing the end face of the third acoustic hole can refer to the outer surface or inner surface of the inner side of the first housing 110. For example, the third acoustic hole is... Figure 6 When the L-shaped structure with sound outlet 112 is shown, on the plane (outer or inner surface of the inner side) where the port of the long side portion of the L-shaped structure is located, the orthographic projection of the long side portion of the L-shaped structure and the opening 1251 on the long side of the frame 125 parallel to the long axis direction at least partially coincides; on the plane (outer or inner surface of the front side) where the port of the short side portion of the L-shaped structure is located, the orthographic projection of the short side portion of the L-shaped structure and the opening 1251 on the short side of the frame 125 parallel to the short axis direction at least partially coincides.

[0169] In some embodiments, on the plane containing the port of the third acoustic aperture, the orthographic projection of the first opening 12511 at least partially coincides with the orthographic projection of the third acoustic aperture. In some embodiments, on the plane containing the port of the third acoustic aperture, the orthographic projection of the second opening 12512 at least partially coincides with the orthographic projection of the third acoustic aperture. In some embodiments, on the plane containing the port of the third acoustic aperture, the orthographic projections of both the first opening 12511 and the second opening 12512 at least partially coincide with the orthographic projection of the third acoustic aperture. The third acoustic aperture can be as follows: Figure 4 or Figure 7 The pressure relief hole 113 or sound outlet hole 112 shown is only provided on the inner side, and can also be as follows: Figure 6The L-shaped sound outlet 112 is shown. With the above arrangement, the total area of ​​the opening 1251 can be further increased while ensuring that the opening 1251 is offset from the external magnet 1223. In some embodiments, the projection of the opening 1251 along its long axis at least partially coincides with the projection of the third acoustic hole along its long axis, so that the opening 1251 can be at least partially directly opposite the third acoustic hole, thereby reducing the difficulty of gas exchange between the third acoustic cavity 111-3 and the outside world and improving the headphone output.

[0170] Figure 22 This is another cross-sectional structural schematic diagram of the sound-generating component shown in some embodiments of this specification. Figure 23 This is an exploded view of the structure of a loudspeaker according to some embodiments of this specification.

[0171] In some embodiments, please refer to Figures 22-23 The outer magnet 1223 may have a second magnetic guide plate 1225 at one end away from the extension 12213. The magnetic circuit assembly 122 also includes a bracket assembly, which may include a first bracket 122-4 and a second bracket 122-5; wherein, the first bracket 122-4 is connected around the outer periphery of the second magnetic guide plate 1225, and the second bracket 122-5 is connected around the outer periphery of the extension 12213. The first bracket 122-4 and the second magnetic guide plate 1225, as well as the second bracket 122-5 and the extension 12213, may be connected by injection molding, adhesive, bolts, snaps, etc.; the outer periphery of the first diaphragm 121-1 is fixed to the first bracket 122-4 (e.g., adhesive), and the outer periphery of the second diaphragm 121-2 is fixed to the second bracket 122-5 (e.g., adhesive).

[0172] On the one hand, by combining the first bracket 122-4, the second bracket 122-5, and the second magnetic plate 1225, the basket or the aforementioned frame 125 in some existing loudspeakers can be replaced, which allows the external magnet 1223 to have a larger volume size, enhances the magnetic flux, and thus enhances the driving force of the voice coil assembly 123; at the same time, it can also make the structure of the loudspeaker 120 more compact, reduce the assembly difficulty, and improve the assembly effect.

[0173] On the other hand, by means of the cooperation of the first bracket 122-4 and the second bracket 122-5, as well as the magnetic cover 1221 and the diaphragm, the internal space of the speaker 120 can be enclosed to form a relatively closed cavity (i.e., the common cavity 111-3). The first bracket 122-4 and the second bracket 122-5 can serve as structural connection carriers between the speaker 120 and the first housing 110 or between the speaker 120 and the limiting component 130, so as to securely confine the speaker 120 inside the first housing 110 and form a first acoustic cavity 111-1 and a second acoustic cavity 111-2 that are relatively independent of the common cavity 111-3.

[0174] In some embodiments, please refer to Figure 23 The first bracket 122-4 has a first receiving groove surrounding the second magnetic plate 1225, and the second bracket 122-5 has a second receiving groove surrounding the extension 12213; wherein, the outer periphery of the second magnetic plate 1225 is inserted into the first receiving groove, and the outer periphery of the extension 12213 is inserted into the second receiving groove; for example, the first bracket 122-4 can be integrally formed on the second magnetic plate 1225 by injection molding, die-cutting or other methods, and the first bracket 122-4 covers the outer periphery of the second magnetic plate 1225, at which time the first receiving groove is equivalent to being naturally formed in the first bracket 122-4.

[0175] Based on the set receiving groove, the structural connection area between the bracket and the corresponding magnetic plate is effectively increased, so that the bracket and the corresponding magnetic plate can be stably combined into one piece (for example, the bracket and the corresponding magnetic plate are integrally injection molded), which helps to reduce the number of parts of the speaker 120 and reduce the assembly difficulty of the speaker 120.

[0176] In some embodiments, please refer to Figure 23 The first support 122-4, the second magnetic plate 1225 and the first diaphragm 121-1 together form a first chamber 120a inside the speaker 120. The second support 122-5, the extension 12213 and the second diaphragm 121-2 together form a second chamber 120b inside the speaker 120. It can be understood that the first chamber 120a and the second chamber 120b are equivalent to part of the common cavity 111-3, and the two are located on both sides of the magnetic circuit assembly in the vibration direction.

[0177] At this time, please refer to Figure 23 The first bracket 122-4 and the second bracket 122-5 are each provided with a positioning structure 120c and a through hole structure 120d. For ease of distinction and description, the positioning structure 120c and the through hole structure 120d provided on the first bracket 122-4 are respectively defined as the first positioning structure and the first through hole structure, and the positioning structure 120c and the through hole structure 120d provided on the second bracket 122-5 are respectively defined as the second positioning structure and the second through hole structure.

[0178] The first positioning structure is located within the first chamber 120a and is primarily used to position and restrict the wire of the first voice coil 123-1 onto the first bracket 122-4 within the first chamber 120a. The first through-hole structure penetrates the side wall of the first bracket 122-4 (e.g., the side wall in the short axis direction) so that the wire of the first voice coil 123-1 can be led out from the interior of the speaker 120 to connect to a circuit board located around the speaker 120 (this circuit board enables electrical connection between the speaker 120 and the microphone assembly and the headphone circuit board assembly). Similarly, the second positioning structure is located within the second chamber 120b and is primarily used to position and restrict the wire of the second voice coil 123-2 onto the second bracket 122-5 within the second chamber 120b. The second through-hole structure penetrates the side wall of the second bracket 122-5 so that the wire of the second voice coil 123-2 can be led out from the interior of the speaker 120 and connected to the circuit board.

[0179] Therefore, through the cooperation between the corresponding chamber, support, positioning structure 120c, and through-hole structure 120d, the overall compactness of the loudspeaker 120 can be effectively enhanced, and the voice coil wire can be restricted to avoid interference with the diaphragm vibration. In specific implementation, the positioning structure 120c can be a mechanical structure such as a clip set on the corresponding support, or it can be a structure formed by fixing the voice coil wire with adhesive.

[0180] In some embodiments, please refer to Figure 23 The first support 122-4 and the second support 122-5 are separately arranged in the vibration direction, so that a receiving gap can be formed between them around the outer magnet 1223; and the circuit board can be housed and fixed in the receiving gap, for example, attached to the outer peripheral surface of the first outer magnet 122-11. As a result, the overall size of the speaker 120 can be effectively reduced, further enhancing the structural compactness of the speaker 120.

[0181] In some embodiments, please refer to Figure 23 One or both of the first support 122-4 and the second support 122-5 are provided with a pressure balancing channel 120e, which can pass through the corresponding support in a direction perpendicular to the vibration direction (e.g., the major axis direction, the minor axis direction, etc.). In some embodiments, since the support assembly replaces the frame 125, the arrangement of the pressure balancing channel 120e on the support assembly can be the same as the arrangement of the opening 1251 on the frame 125. The third acoustic cavity 111-3 is connected to the sound outlet 112 on the first housing 110 through the pressure balancing channel 120e. For example, the pressure balancing channel 120e is also offset from the external magnet 1223.

[0182] In some embodiments, the air pressure balance channel 120e can be covered with a mesh, a waterproof and breathable membrane, etc., to improve the waterproof performance of the speaker 120.

[0183] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0184] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0185] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0186] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are sometimes modified with the modifier "approximate." Unless otherwise stated, "approximate" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of range in some embodiments of this application are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

[0187] Finally, it should be understood that the embodiments described in this application are merely illustrative of the principles of the embodiments of this application. Other modifications may also fall within the scope of this application. Therefore, alternative configurations of the embodiments of this application are considered as examples and not limitations, and are regarded as consistent with the teachings of this application. Accordingly, the embodiments of this application are not limited to the embodiments explicitly described and illustrated in this application.

Claims

1. A loudspeaker, characterized in that, include: Magnetic circuit components; A voice coil assembly, at least a portion of which is located within the magnetic gap of the magnetic circuit assembly; A first diaphragm and a second diaphragm are arranged at a distance from each other in the vibration direction; The voice coil assembly includes a first voice coil and a second voice coil arranged along the vibration direction, the first diaphragm is connected to the first voice coil, and the second diaphragm is connected to the second voice coil; The first voice coil and the second voice coil are configured to drive the first diaphragm and the second diaphragm to vibrate synchronously in opposite directions, respectively. The magnetic circuit assembly includes a magnetic shield and an inner magnet. The magnetic shield includes a side wall and a bottom wall. The side wall includes a folded structure. The folded structure includes an inner side wall and an outer side wall spaced apart in a direction perpendicular to the vibration direction, and an extension connecting the inner side wall and the outer side wall. The bottom wall is connected to the inner side wall. A first magnetic gap is formed between the inner side wall and the inner magnet. A second magnetic gap is formed between the inner side wall and the outer side wall. The first voice coil is at least partially located within the first magnetic gap, and the second voice coil is at least partially located within the second magnetic gap.

2. The loudspeaker as claimed in claim 1, characterized in that, The outer sidewall includes an outer magnet, the inner magnet forms a first magnetic gap with the inner sidewall, and the outer magnet forms a second magnetic gap with the inner sidewall.

3. The loudspeaker as described in claim 2, characterized in that, The polarization direction of the inner magnet is the same as the magnetization direction of the outer magnet. The loudspeaker includes a major axis direction and a minor axis direction. In the minor axis direction or the major axis direction, the ratio of the thickness of the inner sidewall to the size of the magnetic shield is 0.05-0.

16.

4. The loudspeaker as claimed in claim 2, characterized in that, The polarization direction of the inner magnet is opposite to that of the outer magnet, and the thickness of the inner sidewall is less than or equal to 0.4 mm.

5. The loudspeaker as claimed in claim 4, characterized in that, The inner wall is hollowed out.

6. The loudspeaker as claimed in claim 1, characterized in that, The inner sidewall includes an outer magnet, the inner magnet and the outer magnet form a first magnetic gap, and the outer magnet and the outer sidewall form a second magnetic gap.

7. The loudspeaker as claimed in claim 1, characterized in that, The inner wall includes a first outer magnet, the outer wall includes a second outer magnet, the inner magnet and the first outer magnet form a first magnetic gap, and the first outer magnet and the second outer magnet form a second magnetic gap.

8. The loudspeaker as claimed in any one of claims 1-6, characterized in that, The loudspeaker includes a long axis direction and a short axis direction, wherein the ratio of the size of the inner magnet to the thickness of the outer magnet is between 1.7 and 33 in either the short axis direction or the long axis direction.

9. The loudspeaker as claimed in claim 8, characterized in that, In the long axis direction, the ratio of the size of the inner magnet to the thickness of the outer magnet is 1.7-6.7; in the short axis direction, the ratio of the size of the inner magnet to the thickness of the outer magnet is 1.7-2.

7.

10. An earphone, characterized in that, Including the speaker as described in any one of claims 1-9, the headphones further include: A first housing, wherein the speaker is disposed within the first housing; The first diaphragm of the loudspeaker forms a first acoustic cavity with the inner wall of the first housing, the second diaphragm of the loudspeaker forms a second acoustic cavity with the other inner wall of the first housing, and a third acoustic cavity is formed between the first diaphragm and the second diaphragm. The loudspeaker also includes a frame, which is located between the first diaphragm and the second diaphragm in the vibration direction; the frame has an opening that is acoustically connected to the third acoustic cavity.

11. The headphones as claimed in claim 10, characterized in that, The magnetic circuit assembly includes an outer magnet, which includes multiple sub-magnets arranged separately. The multiple sub-magnets of the outer magnet are all disposed on the inner wall of the frame, and the opening is offset from the sub-magnets of the outer magnet.

12. The headphones as claimed in claim 10, characterized in that, In the wearing state, the first housing includes an inner side facing the external auditory canal, an outer side opposite to the inner side and away from the external auditory canal, an upper side facing the top of the user's head, and a lower side opposite to the upper side and facing the bottom of the user's head. The first housing is provided with a first pressure relief hole communicating with the first acoustic cavity, a second pressure relief hole communicating with the second acoustic cavity, and a sound outlet hole communicating with the third acoustic cavity. The sound outlet is located on the inner side of the first housing, and the first pressure relief hole and the second pressure relief hole are respectively located on the upper side and the lower side of the first housing.

13. The headphones as described in claim 12, characterized in that, In the wearing state, the first housing also includes a front side facing behind the user's ear, and the sound outlet has an L-shaped structure, the L-shaped structure including a short side portion located on the front side of the first housing and a long side portion located on the inner side of the first housing.

14. The headphones as claimed in any one of claims 12, characterized in that, The opening on the frame is acoustically connected to the sound outlet, and on the plane where the port of the sound outlet is located, the orthographic projection of the opening and the orthographic projection of the sound outlet at least partially coincide.

15. The headphones as described in claim 13, characterized in that, A gap is provided between the front side of the first housing and the speaker, the gap serving as a sound guide channel, the sound guide channel being configured to guide the sound generated by the speaker on the front side to the sound outlet for output; wherein, in the long axis direction, the size of the sound guide channel is 0.5mm-2mm.

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