Circuit board processing equipment and method
By integrating circuit board processing equipment and utilizing the multi-dimensional linkage design of feeding linear slide, servo electric cylinder and rotary servo motor, the problems of poor connection between multiple processes and insufficient positioning accuracy in circuit board processing have been solved. This has enabled efficient and accurate double-sided mounting and stable transfer throughout the process, improving processing quality and automation level.
Patent Information
- Application Number
- CN202511843355.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-09
- Publication Date
- 2026-01-23
AI Technical Summary
Existing circuit board processing equipment suffers from problems such as poor connection between multiple processes, insufficient positioning accuracy, and low efficiency in double-sided processing. It is particularly prone to damage and reduced accuracy on ultra-thin PCBs or flexible circuit boards.
The integrated circuit board processing equipment utilizes a multi-dimensional linkage design of a linear slide for feeding components, a servo cylinder, and a rotary servo motor to achieve stable transfer and precise positioning of circuit boards between various processes. Combined with vacuum adsorption and ultrasonic cleaning, it ensures surface cleanliness and placement accuracy.
It achieves stable transfer throughout the entire circuit board processing process, avoids secondary pollution and damage, improves the accuracy and efficiency of double-sided mounting, adapts to the stable clamping of circuit boards of different sizes, reduces the waste of chemical reagents, and improves the level of automation.
Smart Images
Figure CN121397993A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of circuit board processing, in particular to a circuit board processing device and method. BACKGROUND
[0002] With the rapid development of electronic devices towards miniaturization and high density, the requirements for the precision, efficiency and reliability of the patch processing of circuit boards (PCB) continue to improve, and surface mount technology (SMT) has become the core process of electronic manufacturing.
[0003] In the current circuit board processing process, there are generally problems such as poor connection of multiple processes, insufficient positioning accuracy, and low efficiency of double-sided processing: on the one hand, the pretreatment and patch processing of the circuit board are mostly completed by independent devices, and the circuit board is easily contaminated during transportation between processes, and manual or simple mechanical transportation increases the risk of damage to the board, especially for ultra-thin PCBs or flexible circuit boards, the traditional clamping method is easy to cause the board to deform; on the other hand, the clamping and positioning mechanism of the existing processing equipment mostly uses single-sided mechanical clamping or single suction method, which is difficult to adapt to circuit boards of different sizes and thicknesses, and when implementing double-sided patching, the circuit board needs to be clamped and positioned repeatedly, which not only prolongs the processing cycle, but also easily causes the positioning reference to deviate, resulting in a decrease in double-sided patching precision.
[0004] Therefore, we propose a circuit board processing device. SUMMARY
[0005] In view of the shortcomings of the prior art, the present application provides a circuit board processing device and method to solve the above technical defects.
[0006] To achieve the above purpose, the present application is realized by the following technical scheme: a circuit board processing device, comprising a processing rack and a board conveying frame, a board conveying frame is fixedly arranged on the front surface of the top of the processing rack, a pretreatment tank is arranged on the left side of the inside of the processing rack, and a processing support frame is further arranged on the right side of the top of the processing rack, a sliding drive frame is fixedly arranged on the right side of the processing rack, and a patch machine is slidingly arranged on the top of the sliding drive frame, a feeding linear slide is fixedly arranged on the back side of the top of the processing rack, and an auxiliary processing unit is slidingly arranged on the top of the feeding linear slide; the auxiliary processing unit comprises a fixed plate and a rotating frame; a liquid guide frame is further fixedly arranged below the inside of the pretreatment tank, and the top of the liquid guide frame is arranged in an inclined manner, a plurality of board placing frames are fixedly arranged on the low side of the top of the liquid guide frame, and an ultrasonic vibrator is arranged in each of the plurality of board placing frames.
[0007] Preferably, the top of the feeding linear slide is provided with two feeding sliding blocks, and the interiors of the two feeding sliding blocks are rotatably provided with adjusting servo cylinders one, and the interiors of the two feeding sliding blocks are fixedly provided with rotating servo motors one, and the output shafts of the two rotating servo motors one are fixedly connected with the sides of the two adjusting servo cylinders one.
[0008] Preferably, the driving shafts of the two adjusting servo cylinders one are fixedly provided with connecting frames one, and the interiors of the two connecting frames one are rotatably provided with adjusting servo cylinders two, and the sides of the two connecting frames one are fixedly provided with rotating servo motors two, and the output shafts of the two rotating servo motors two are fixedly connected with the sides of the two adjusting servo cylinders two.
[0009] Preferably, the interiors of the two connecting frames one are rotatably provided with adjusting servo cylinders two, and the driving shafts of the two adjusting servo cylinders two are fixedly provided with connecting frames two, and the sides of the two connecting frames two are provided with fixed plates, the back surfaces of the fixed plates are fixedly provided with connecting blocks, the interiors of the two connecting blocks are rotatably connected with the sides of the two connecting frames two, the sides of the two connecting frames two are fixedly provided with rotating servo cylinders three, and the output shafts of the two rotating servo cylinders three are fixedly connected with the sides of the two connecting blocks.
[0010] Preferably, the front surface of the fixed plate is rotatably provided with a rotating frame, the back surface of the fixed plate is fixedly provided with a rotating servo cylinder three, and the output shaft of the rotating servo cylinder three is fixedly connected with the interior of the rotating frame; the upper surface of the front surface of the rotating frame is fixedly provided with an adjusting linear slide one, and the two sides of the front surface of the adjusting linear slide one are slidably provided with adjusting frames; the front and back surfaces of the interiors of the two adjusting frames are fixedly provided with lifting servo cylinders, and the driving shaft bottoms of the two lifting servo cylinders are extended to the lower surfaces of the adjusting frames, and the lower surfaces of the adjusting frames are movably provided with positioning adsorption frames one, and the driving shaft bottoms of the two lifting servo cylinders are fixedly connected with the top of the positioning adsorption frame one.
[0011] Preferably, the lower surface of the front surface of the rotating frame is also fixedly provided with an adjusting linear slide two, and the two sides of the front surface of the adjusting linear slide two are slidably provided with adjusting sliding blocks, the bottoms of the two adjusting sliding blocks are fixedly provided with adjusting servo motors, and the output shaft bottoms of the two adjusting servo motors are fixedly provided with positioning adsorption frames two.
[0012] Preferably, the opposite sides of the positioning adsorption frame one and the positioning adsorption frame two are provided with annular rubber rings, the middle parts of the opposite sides of the positioning adsorption frame one and the positioning adsorption frame two are also provided with adsorption flow channels, the interiors of the positioning adsorption frame one and the positioning adsorption frame two are provided with vacuum pumps, and the outputs of the two vacuum pumps are in communication with the interiors of the two adsorption flow channels.
[0013] Preferably, the low side of the top of the liquid guide frame is also provided with a liquid collecting groove, the lower part of the inside of the processing rack is fixedly provided with a cleaning liquid collecting box, and the inside of the cleaning liquid collecting box is in communication with the inside of the liquid collecting groove through a pumping pump; one side of the inside of the pretreatment tank is also slidably provided with a partition frame, one side of the inside of the processing rack is fixedly provided with a partition control servo cylinder, and the driving end of the partition control servo cylinder is fixedly connected with one side of the partition frame; the partition frame adopts a "T" shaped structure, and the two vertical surfaces of the front side of the partition frame are provided with a plurality of cleaning liquid nozzles, and the lower part of the inside of the processing rack is fixedly provided with a cleaning liquid storage tank, and the inside of the cleaning liquid storage tank is in communication with the inside of the partition frame through a cleaning liquid conduit.
[0014] Preferably, the top of the partition frame is inclined, and the low side of the top of the partition frame is provided with a receiving groove, the bottom of the receiving groove extends through to the lower part of the inside of the pretreatment tank, and the inside of the receiving groove is provided with an automatic control valve; the back of the inside of the pretreatment tank and above the partition frame is fixedly provided with a blowing frame, the back of the processing rack is fixedly provided with a hot air blower, and the air outlet end of the hot air blower is in communication with the inside of the blowing frame; the two sides of the upper part of the inside of the pretreatment tank are slidably provided with closing plates, the two sides of the inside of the processing rack are fixedly provided with closing servo cylinders, and the driving ends of the two closing servo cylinders are respectively fixedly connected with one side of the two closing plates; the opposite sides of the two closing plates are provided with grooves matched with the fixed plates.
[0015] Preferably, the processing method of the circuit board processing equipment is applied to the circuit board processing equipment, and includes the following steps: Step one, conveying the circuit board through the plate conveying frame, and fixing the circuit board by the positioning and adsorbing frame one and the positioning and adsorbing frame two of the auxiliary processing unit; Step two, moving the circuit board to the pretreatment tank, spraying cleaning liquid through the cleaning liquid nozzle, cooperating with the ultrasonic cleaner to ultrasonic clean, and then drying through the blowing frame and the hot air blower; Step three, moving the pretreated circuit board to the processing support frame, adjusting and controlling the posture of the circuit board by the auxiliary processing unit, and completing the unilateral SMD component mounting by the slide of the slide drive frame of the chip mounter; Step four, introducing cooling air into the cooling flow channel through the cooling fan to cool and solidify the circuit board after the chip mounting; Step five, rotating the circuit board by 180° by the rotating frame to turn over, repeating step three and step four to complete the other side chip mounting; finally, releasing the adsorption and moving the circuit board to the discharging position to complete the collection.
[0016] Compared with the prior art, the following beneficial effects are achieved: 1、The present application integrates the processes of loading clamping, pretreatment, patch processing, cooling and solidification, and discharging in the same processing rack, and realizes the stable transfer of the circuit board between each process by means of auxiliary processing units, avoiding the secondary pollution and transfer damage of the board caused by the independent processes of traditional equipment. In the pretreatment process, the cooperative design of the partition frame and the closed plate enables cleaning and drying to be completed in the same tank structure, and the efficient cleaning of the ultrasonic vibrator and the uniform water removal of the hot air drying ensure the cleanliness of the circuit board surface while greatly shortening the pretreatment period, providing a foundation guarantee for the subsequent patch quality.
[0017] In the present application, the cooperation of the ring-shaped rubber ring sealing and vacuum adsorption of the positioning adsorption frame one and the positioning adsorption frame two can realize stable clamping of circuit boards of different sizes and thicknesses, and avoid scratching the surface of the board by mechanical clamping, especially suitable for processing of ultra-thin PCB and FPC; the multi-dimensional linkage design of the adjusting servo cylinder and the rotating servo motor can flexibly adjust and control the posture of the circuit board, ensuring the accurate alignment of the pads and the placement machine during patching. For the demand of double-sided patching, the rotating frame can drive the circuit board to realize stable overturning by 180°, without releasing the clamping and positioning throughout the process, completely solving the problems of low efficiency and poor precision caused by repeated positioning during double-sided processing of traditional equipment, and effectively improving the consistency of double-sided patching.
[0018] In the present application, the cooperation of the distributed cooling flow channel in the processing support frame and the cooling fan enables the cooling air to uniformly act on the contact surface of the circuit board and the support frame, realizing rapid and uniform solidification of the solder paste and avoiding solder defects caused by uneven local cooling; the combination design of the inclined liquid guide frame and the liquid collection tank in the pretreatment tank ensures that the cleaning waste liquid can be completely recovered, and the sealing effect of the partition frame reduces the waste of chemical reagents and environmental impact. In the overall structure, the function modules are cooperatively controlled by mechanisms such as the feeding linear slide and the servo cylinder, which not only ensures the processing quality of single process, but also improves the automation level of the whole process, and can adapt to the processing needs of circuit boards in different fields such as consumer electronics and industrial control, having strong practicality and promotional value.
[0019] Other features and advantages of the present application will be set forth in the following description, and in part will become apparent to those skilled in the art from the description, or can be learned by practice of the application, and the purposes and other advantages of the present application can be achieved and obtained by the structures indicated in the specification and drawings. BRIEF DESCRIPTION OF DRAWINGS
[0020] Figure 1 is a schematic view of the circuit board processing equipment structure of the embodiment of the present application; Figure 2 is a schematic view of the processing rack and processing support frame structure of the embodiment of the present application; Figure 3Schematic view of the processing support frame and cooling fan structure of the embodiment of the present application; Figure 4 Schematic view of the auxiliary processing unit structure of the embodiment of the present application; Figure 5 Schematic view of the fixed plate and rotating frame structure of the embodiment of the present application; Figure 6 Schematic view of the positioning adsorption frame one and positioning adsorption frame two structure of the embodiment of the present application; Figure 7 Schematic view of the pretreatment tank and plate placement rack structure of the embodiment of the present application; Figure 8 Schematic view of the internal structure of the pretreatment tank of the embodiment of the present application; Figure 9 Schematic view of the separation rack and cleaning liquid spray head structure of the embodiment of the present application.
[0021] In the figure, 1, processing frame; 2, plate conveying rack; 3, pretreatment tank; 4, sliding drive frame; 5, chip mounter; 6, processing support frame; 7, feeding linear slide table; 8, auxiliary processing unit; 9, closing plate; 10, closing servo cylinder; 11, feeding sliding block; 12, adjusting servo cylinder one; 13, rotating servo motor one; 14, connecting frame one; 15, rotating servo motor two; 16, adjusting servo cylinder two; 17, connecting frame two; 18, rotating servo cylinder three; 19, fixed plate; 20, connecting block; 21, rotating servo motor three; 22, rotating frame; 23, adjusting linear slide table one; 24, adjusting linear slide table two; 25, adjusting frame; 26, lifting servo cylinder; 27, positioning adsorption frame one; 28, adjusting sliding block; 29, adjusting servo motor; 30, positioning adsorption frame two; 31, liquid guide rack; 32, liquid collection tank; 33, cleaning liquid collection box; 34, cleaning liquid storage box; 35, plate placement rack; 36, separation rack; 37, cleaning liquid spray head; 38, separation control servo cylinder; 39, receiving tank; 40, blowing rack; 41, hot air blower; 42, cooling fan; 43, cooling flow channel. DETAILED DESCRIPTION
[0022] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.
[0023] Embodiment 1 Please refer to Figures 1 to 9As shown, the circuit board processing equipment comprises a processing rack 1 and a plate conveying frame 2, the plate conveying frame 2 is fixedly arranged on the front of the top of the processing rack 1, and the inside of the plate conveying frame 2 is provided with a transmission belt for conveying the circuit board; the left side of the inside of the processing rack 1 is provided with a pretreatment groove 3, and the right side of the top of the processing rack 1 is further provided with a processing support frame 6, the right side of the processing rack 1 is fixedly provided with a sliding drive frame 4, and the top of the sliding drive frame 4 is slidingly provided with a chip mounter 5; by placing the circuit board above the processing support frame 6, the chip mounter 5 is used to automatically mount the SMD components on the pads of the circuit board through the solder paste.
[0024] Further, the inside of the processing support frame 6 is provided with a plurality of cooling flow channels 43, the lower part of the inside of the processing rack 1 is fixedly provided with a cooling fan 42, and the air outlet end of the cooling fan 42 is in communication with one side of the inside of the plurality of cooling flow channels 43, and the other side of the processing support frame 6 is further provided with an air outlet pipe, and the inside of the air outlet pipe is in communication with the other side of the inside of the plurality of cooling flow channels 43; after the circuit board is mounted, the cooling fan 42 is used to introduce cooling control into the inside of the cooling flow channel 43, so as to cool and solidify the side of the circuit board in contact with the top end of the processing support frame 6.
[0025] Specifically, the rear side of the top of the processing rack 1 is fixedly provided with a feeding linear slide 7, and the top of the feeding linear slide 7 is slidingly provided with an auxiliary processing unit 8; the circuit board on the plate conveying frame 2 is automatically clamped and positioned by the auxiliary processing unit 8, and the orientation of the circuit board is flexibly adjusted before mounting the circuit board; when the circuit board is mounted, the auxiliary processing unit 8 is used to automatically flip the circuit board, so as to solve the problem that the circuit board needs to be repeatedly clamped and positioned when the two end faces of the circuit board are mounted, and the processing efficiency of the circuit board is effectively improved.
[0026] Further, the auxiliary processing unit 8 comprises a fixed plate 19 and a rotating frame 22, the top of the feeding linear slide 7 is slidably provided with two feeding sliding blocks 11, and the interiors of the two feeding sliding blocks 11 are rotatably provided with adjusting servo cylinders one 12, the interiors of the two feeding sliding blocks 11 are fixedly provided with rotating servo motors one 13, and one ends of the output shafts of the two rotating servo motors one 13 are fixedly connected with one sides of the two adjusting servo cylinders one 12 respectively; one ends of the drive shafts of the two adjusting servo cylinders one 12 are fixedly provided with connecting frames one 14, the interiors of the two connecting frames one 14 are rotatably provided with adjusting servo cylinders two 16, one sides of the two connecting frames one 14 are fixedly provided with rotating servo motors two 15, and one ends of the output shafts of the two rotating servo motors two 15 are fixedly connected with one sides of the two adjusting servo cylinders two 16 respectively; the interiors of the two connecting frames one 14 are rotatably provided with adjusting servo cylinders two 16, one ends of the drive shafts of the two adjusting servo cylinders two 16 are fixedly provided with connecting frames two 17, and one side of the two connecting frames two 17 is provided with the fixed plate 19, the back of the fixed plate 19 is fixedly provided with connecting blocks 20 on both sides, one sides of the two connecting blocks 20 are rotatably connected with the interiors of the two connecting frames two 17 respectively, one sides of the two connecting frames two 17 are fixedly provided with rotating servo cylinders three 18, and one ends of the output shafts of the two rotating servo cylinders three 18 are fixedly connected with one sides of the two connecting blocks 20 respectively.
[0027] It should be noted that the adjusting servo cylinders one 12 rotatably arranged in the feeding sliding blocks 11, the adjusting servo cylinders two 16 rotatably arranged in the connecting frames one 14 and the connecting blocks 20 rotatably arranged in the connecting frames two 17 realize flexible adjustment of the fixed plate 19 in multiple directions, thereby effectively improving the processing flexibility of the circuit board.
[0028] Further, the front of the fixed plate 19 is rotatably provided with the rotating frame 22, the back of the fixed plate 19 is fixedly provided with the rotating servo cylinders three 18, and one end of the output shaft of the rotating servo cylinders three 18 is fixedly connected with the interior of the rotating frame 22; the upper front of the rotating frame 22 is fixedly provided with an adjusting linear slide one 23, and both sides of the front of the adjusting linear slide one 23 are slidably provided with adjusting frames 25; the front and back of the interiors of the two adjusting frames 25 are fixedly provided with lifting servo cylinders 26, and the bottom ends of the drive shafts of the two lifting servo cylinders 26 extend to the lower of the adjusting frames 25, a positioning suction frame one 27 is movably arranged below the adjusting frames 25, and the bottom ends of the drive shafts of the two lifting servo cylinders 26 are fixedly connected with the top of the positioning suction frame one 27; the lower front of the rotating frame 22 is also fixedly provided with an adjusting linear slide two 24, and both sides of the front of the adjusting linear slide two 24 are slidably provided with adjusting sliding blocks 28, the bottoms of the two adjusting sliding blocks 28 are fixedly provided with adjusting servo motors 29, and the bottom ends of the output shafts of the two adjusting servo motors 29 are fixedly provided with positioning suction frames two 30.
[0029] Further, the opposite side of the positioning suction holder one 27 and the positioning suction holder two 30 is provided with an annular rubber ring, and the middle part of the opposite side of the positioning suction holder one 27 and the positioning suction holder two 30 is further provided with a suction flow channel, and the inside of the positioning suction holder one 27 and the positioning suction holder two 30 is provided with a vacuum pump, and the output ends of the two vacuum pumps are respectively communicated with the inside of the two suction flow channels.
[0030] It should be noted that when the circuit board is loaded for processing, the driving end of the adjusting servo cylinder one 12 and the adjusting servo cylinder two 16 is used to control the fixed plate 19 to move close to one side of the plate conveying frame 2, so that the two adjusting frames 25 on the front of the rotating frame 22 are respectively located on both sides of the circuit board, and the distance between the two adjusting frames 25 and the two positioning suction holders two 30 is adjusted according to the size specification of the circuit board, so that the two adjusting frames 25 and the two positioning suction holders two 30 are respectively located on both sides of the upper end face of the circuit board; the driving end of the lifting servo cylinder 26 in the two adjusting frames 25 is used to control the positioning suction holder one 27 to move downward, at this time the adjusting servo motor 29 at the bottom of the sliding block 28 is used to control the positioning suction holder two 30 to rotate by ninety degrees, so that the positioning suction holder two 30 and the positioning suction holder one 27 are perpendicular to each other; the driving end of the lifting servo cylinder 26 in the adjusting frame 25 is used to control the positioning suction holder one 27 to move downward, until the lower end face of the positioning suction holder one 27 contacts with the upper end face of the circuit board, the suction flow channel at the bottom of the positioning suction holder one 27 is used to adsorb and position the upper end face of the circuit board, and the driving end of the lifting servo cylinder 26 is controlled to reset, so as to drive the circuit board to lift to the upper side of the positioning suction holder two 30, the output shaft of the adjusting servo motor 29 is used to control the positioning suction holder two 30 to rotate by ninety degrees in the opposite direction, so as to move the positioning suction holder two 30 to the lower side of the positioning suction holder one 27, and finally the driving end of the lifting servo cylinder 26 is used to control the positioning suction holder one 27 to move downward, so that the lower end face of the circuit board contacts with the top of the positioning suction holder two 30, and the suction flow channel at the top of the positioning suction holder two 30 is used to adsorb and position the lower end face of the circuit board, and the positioning suction holder one 27 on the upper side is used to adsorb and position the upper end face of the circuit board, so as to ensure the stability of the clamping and positioning of the circuit board; after the single-sided patch processing of the circuit board is completed, the adjusting servo cylinder one 12 and the adjusting servo cylinder two 16 are controlled to rotate upward, so as to provide sufficient space for the turning of the circuit board, and the output shaft of the rotating servo cylinder three 18 is used to control the rotating frame 22 to rotate by one hundred and eighty degrees on the front of the fixed plate 19, so as to turn the clamped circuit board, and the clamping and positioning of the upper and lower end faces of the circuit board will not be offset during the turning process.
[0031] Example 2 Specifically, the lower part of the inside of the pretreatment tank 3 is also fixedly provided with a liquid guide frame 31, and the top of the liquid guide frame 31 is inclinedly arranged. The low side of the top of the liquid guide frame 31 is also fixedly provided with a plurality of plate placing frames 35, and the inside of each plate placing frame 35 is provided with an ultrasonic vibrator. The low side of the top of the liquid guide frame 31 is also provided with a liquid collecting tank 32. The lower part of the inside of the processing rack 1 is fixedly provided with a cleaning liquid collecting box 33, and the inside of the cleaning liquid collecting box 33 is in communication with the inside of the liquid collecting tank 32 through a pumping pump. The inside of each plate placing frame 35 is provided with a plate placing groove, and the inside of the plate placing groove is provided with a rubber pad.
[0032] Further, one side of the inside of the pretreatment tank 3 is also slidably provided with a partition frame 36. One side of the inside of the processing rack 1 is fixedly provided with a partition control servo cylinder 38, and the driving end of the partition control servo cylinder 38 is fixedly connected with one side of the partition frame 36. The partition frame 36 adopts a "T" shaped structure, and the two vertical surfaces of the front side of the partition frame 36 are both provided with a plurality of cleaning liquid nozzles 37. The lower part of the inside of the processing rack 1 is fixedly provided with a cleaning liquid storage tank 34, and the inside of the cleaning liquid storage tank 34 is in communication with the inside of the partition frame 36 through a cleaning liquid conduit. The inside of the partition frame 36 is provided with a flow guide channel, and the inside of the flow guide channel is in communication with the inside of the plurality of cleaning liquid nozzles 37. The inside of the cleaning liquid storage tank 34 is provided with a liquid sending pump, one end of the liquid sending pump is in communication with the inside of the flow guide channel through the cleaning liquid conduit.
[0033] It should be noted that when the circuit board is pretreated before processing, the circuit board is placed in the inside of the plate placing frame 35, the clamping and positioning of the circuit board is released, the fixed plate 19 and the rotating frame 22 are withdrawn from the lower part of the inside of the pretreatment tank 3, the driving end of the partition control servo cylinder 38 controls the partition frame 36 to close the lower part of the inside of the pretreatment tank 3, the plurality of cleaning liquid nozzles 37 on one side of the partition frame 36 spray cleaning liquid to the surface of the circuit board, the circuit board is immersed in the cleaning liquid, and the ultrasonic vibrator arranged in the inside of the plate placing frame 35 performs ultrasonic cleaning on the surface of the circuit board. The ultrasonic vibrator and the transducer are used in cooperation to complete the ultrasonic cleaning of the circuit board. After the ultrasonic cleaning of the circuit board is completed, the cleaning waste liquid is sent into the inside of the cleaning liquid collecting box 33 through the liquid collecting tank 32 for storage.
[0034] Further, the top of the partition frame 36 is inclinedly arranged, and the low side of the top of the partition frame 36 is provided with a receiving groove 39, the bottom of the receiving groove 39 extends through to the lower part of the inside of the pretreatment tank 3, and the inside of the receiving groove 39 is provided with an automatic control valve. The back of the inside of the pretreatment tank 3 and above the partition frame 36 is fixedly provided with a blowing frame 40. The back of the processing rack 1 is fixedly provided with a hot air machine 41, and the air outlet end of the hot air machine 41 is in communication with the inside of the blowing frame 40.
[0035] Further, the upper part of the inside of the pre-treatment tank 3 is slidably provided with a closing plate 9, and the inside of the processing rack 1 is fixedly provided with a closing servo cylinder 10 on both sides, and the driving end of the closing servo cylinder 10 on both sides is fixedly connected with one side of the closing plate 9; and the opposite side of the two closing plates 9 is provided with a groove matched with the fixed plate 19.
[0036] It should be noted that after the ultrasonic cleaning of the circuit board is completed, the two sides of the circuit board are clamped and positioned by the positioning suction frame one 27 and the positioning suction frame two 30, and the circuit board is lifted to the upper side of the partition frame 36, at this time the driving end of the closing servo cylinder 10 on both sides drives the closing plate 9 on both sides to seal and connect with the two sides of the fixed plate 19, at this time the rotating frame 22 is below the closing plate 9, and the driving end of the rotating servo cylinder three 18 controls the rotating frame 22 to rotate, and the hot air blower 41 cooperates with the air blowing frame 40 to dry the surface of the circuit board, realizing automatic drying treatment after cleaning of the circuit board.
[0037] Embodiment 3 Specifically, the processing method of the circuit board processing equipment is also disclosed in the embodiment, which is applied to the circuit board processing equipment in the above embodiment, and specifically includes the following steps: Step one, start the transmission belt of the board conveying frame 2, convey the circuit board to be processed to the preset clamping position; start the feeding linear slide 7, drive the two feeding sliding blocks 11 to move to one side of the board conveying frame 2, so that the auxiliary processing unit 8 is close to the circuit board; according to the size specification of the circuit board, adjust the distance between the two adjusting frames 25 by adjusting the linear slide one 23, and adjust the distance between the two adjusting sliding blocks 28 by adjusting the linear slide two 24, so that the positioning suction frame one 27 and the positioning suction frame two 30 are respectively aligned with the two sides of the upper end surface of the circuit board; start the lifting servo cylinder 26 in the adjusting frame 25, drive the positioning suction frame one 27 to move downward until the lower end surface thereof contacts with the upper end surface of the circuit board; at the same time, start the adjusting servo motor 29 at the bottom of the adjusting sliding block 28, control the positioning suction frame two 30 to rotate 90°, so that it is perpendicular to the positioning suction frame one 27; start the vacuum pump in the positioning suction frame one 27, and vacuum suction and position the upper end surface of the circuit board through the suction flow channel at the bottom thereof; then control the driving end of the lifting servo cylinder 26 to reset, drive the circuit board to lift to the upper side of the positioning suction frame two 30; start the adjusting servo motor 29, control the positioning suction frame two 30 to reversely rotate 90°, so that it is transferred to the lower side of the positioning suction frame one 27; control the positioning suction frame one 27 to move downward again by the lifting servo cylinder 26, so that the lower end surface of the circuit board contacts with the top of the positioning suction frame two 30, start the vacuum pump in the positioning suction frame two 30, and vacuum suction and position the lower end surface of the circuit board through the suction flow channel at the top thereof, so as to realize clamping and fixing of the circuit board on both sides.
[0038] Step two, start the linear slide table 7, drive the auxiliary processing unit 8 carrying the clamped circuit board to move above the pretreatment tank 3; start the adjusting servo cylinder one 12 and the adjusting servo cylinder two 16, drive the fixed plate 19 and the rotating frame 22 to move downward, put the circuit board into the board placing groove of the board placing frame 35 inside the pretreatment tank 3; turn off the vacuum pump of the positioning adsorption frame one 27 and the positioning adsorption frame two 30, release the clamping of the circuit board, start the adjusting servo cylinder one 12 and the adjusting servo cylinder two 16, make the fixed plate 19 and the rotating frame 22 exit from the inside of the pretreatment tank 3; start the separation control servo cylinder 38, drive the separation frame 36 to move inside the pretreatment tank 3, close the lower part inside the pretreatment tank 3; start the liquid pump inside the cleaning liquid storage tank 34, the cleaning liquid enters the flow guide channel inside the separation frame 36 through the cleaning liquid conduit, then sprays the cleaning liquid to the surface of the circuit board through the cleaning liquid spray head 37, so that the circuit board is completely immersed in the cleaning liquid; start the ultrasonic vibrator inside the board placing frame 35, cooperate with the transducer to clean the surface of the circuit board by ultrasonic, remove the contaminants such as oil stains, oxide layer and dust; during the cleaning process, the waste liquid flows into the liquid collecting tank 32 along the inclined liquid guide frame 31, start the pumping pump to send the waste liquid in the liquid collecting tank 32 into the cleaning liquid collecting tank 33 for storage; after the ultrasonic cleaning is completed, start the auxiliary processing unit 8 to clamp the circuit board again, start the adjusting servo cylinder one 12 and the adjusting servo cylinder two 16 to lift the circuit board above the separation frame 36; start the two closing servo cylinders 10 on both sides to drive the two closing plates 9 to move to the middle, through the groove on one side of the closing plate 9 and the sealing clamping of the fixed plate 19, form a closed drying space; start the air heater 41, the hot air blows to the surface of the circuit board through the air blowing frame 40; at the same time, start the rotating servo cylinder three 18 to drive the rotating frame 22 to rotate slowly, realize the uniform drying of the surface of the circuit board; after drying, start the closing servo cylinder 10 to drive the closing plate 9 to reset and release the closed state.
[0039] Step three, start the linear slide table 7, drive the auxiliary processing unit 8 carrying the dried circuit board to move above the processing support frame 6; through the coordinated action of the adjusting servo cylinder one 12, the rotating servo motor one 13, the adjusting servo cylinder two 16, the rotating servo motor two 15 and the rotating servo cylinder three 18, the posture of the fixed plate 19 and the rotating frame 22 is adjusted and controlled in multiple directions, so that the circuit board is accurately attached to the top of the processing support frame 6, and the pad of the circuit board is aligned with the patch path of the chip mounter 5; start the sliding drive frame 4 to drive the chip mounter 5 to slide along the top of the sliding drive frame 4, according to the preset program, the chip mounter 5 picks up the SMD component from the feeding system and accurately mounts it on the corresponding pad of the circuit board; during the single-sided patching process, the auxiliary processing unit 8 continuously maintains the double-sided vacuum adsorption positioning of the circuit board to avoid displacement of the circuit board.
[0040] Step four, after the completion of single-sided patching, start the cooling fan 42 inside the processing rack 1, the cooling wind is sent into the cooling flow channel 43 inside the processing support frame 6 through the outlet end of the cooling fan 42; the cooling wind flows along the cooling flow channel 43, cools the side of the circuit board in contact with the processing support frame 6, at the same time, the heat is conducted to the other side through the circuit board, realizing the rapid solidification of the solder paste; the cooled hot air is discharged through the air outlet pipe on the other side of the processing support frame 6, and the cooling process continues until the solder paste is completely solidified; Step five, after the completion of cooling and solidification, start the adjusting servo cylinder one 12 and the adjusting servo cylinder two 16, drive the fixed plate 19 and the rotating frame 22 to rotate upward to provide sufficient space for the circuit board to turn over; start the rotating servo cylinder three 18, the output shaft of which drives the rotating frame 22 to rotate 180° on the front surface of the fixed plate 19, driving the clamped circuit board to turn over synchronously; during the turning over process, the positioning suction frame one 27 and the positioning suction frame two 30 continuously maintain vacuum adsorption, ensuring that the circuit board clamping and positioning are not deviated; after the turning over is completed, the circuit board posture is adjusted again through the adjusting servo cylinder one 12, the rotating servo motor one 13 and other structures, so that the other side of the circuit board is accurately attached to the top of the processing support frame 6; repeat steps three and four, start the patching machine 5 to complete the SMD component mounting on the other side of the circuit board, and then realize the cooling and solidification of the solder paste on the other side through the cooling flow channel 43 and the cooling fan 42; after the double-sided patching and cooling and solidification are completed, start the feeding linear slide 7 to drive the auxiliary processing unit 8 to carry the processed circuit board to the preset discharging position.
[0041] Meanwhile, the contents not described in detail in the specification all belong to the prior art known to those skilled in the art.
[0042] It should be noted that, in this paper, relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment.
[0043] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to the embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A circuit board processing equipment, comprising a processing frame (1) and a board conveyor (2), wherein the board conveyor (2) is fixedly disposed on the front of the top of the processing frame (1), a pre-processing groove (3) is disposed on the left side inside the processing frame (1), and a processing support frame (6) is disposed on the right side of the top of the processing frame (1), a sliding drive frame (4) is fixedly disposed on the right side of the processing frame (1), and a chip mounter (5) is slidably disposed on the top of the sliding drive frame (4), characterized in that: A linear slide (7) for feeding parts is fixedly installed on the rear side of the top of the processing frame (1), and an auxiliary processing unit (8) is slidably installed on the top of the linear slide (7); the auxiliary processing unit (8) includes a fixed plate (19) and a rotating frame (22); a liquid guide frame (31) is also fixedly installed at the bottom inside the pretreatment tank (3), and the top of the liquid guide frame (31) is inclined. Several plate placement frames (35) are also fixedly installed on the lower side of the top of the liquid guide frame (31), and each of the several plate placement frames (35) is equipped with an ultrasonic transducer.
2. The circuit board processing equipment according to claim 1, characterized in that: The top of the linear slide table (7) has two sliding blocks (11) for feeding parts, and each of the two sliding blocks (11) has a rotatable adjustment servo cylinder (12) inside. Each of the two sliding blocks (11) has a fixed rotary servo motor (13) inside, and one end of the output shaft of each of the two rotary servo motors (13) is fixedly connected to one side of each of the two adjustment servo cylinders (12).
3. The circuit board processing equipment according to claim 2, characterized in that: One end of the drive shaft of each of the two regulating servo electric cylinders (12) is fixedly provided with a connecting frame (14), and the two connecting frames (14) are rotatably provided with a regulating servo electric cylinder (16). One side of each of the two connecting frames (14) is fixedly provided with a rotary servo motor (15), and one end of the output shaft of each of the two rotary servo motors (15) is fixedly connected to one side of each of the two regulating servo electric cylinders (16).
4. The circuit board processing equipment according to claim 3, characterized in that: The two connecting frames (14) are each rotatably equipped with an adjusting servo cylinder (16), and the driving shaft of the two adjusting servo cylinders (16) is fixedly equipped with a connecting frame (17) at one end. A fixing plate (19) is provided on one side of the two connecting frames (17), and connecting blocks (20) are fixedly provided on both sides of the back of the fixing plate (19). One side of the two connecting blocks (20) is rotatably connected to the interior of the two connecting frames (17). A rotating servo cylinder (18) is fixedly provided on one side of the two connecting frames (17), and one end of the output shaft of the two rotating servo cylinders (18) is fixedly connected to one side of the two connecting blocks (20).
5. The circuit board processing equipment according to claim 4, characterized in that: A rotating frame (22) is rotatably mounted on the front of the fixed plate (19), and a rotating servo cylinder three (18) is fixedly mounted on the back of the fixed plate (19). One end of the output shaft of the rotating servo cylinder three (18) is fixedly connected to the interior of the rotating frame (22). An adjusting linear slide table one (23) is fixedly mounted on the upper front of the rotating frame (22), and adjusting frames (25) are slidably mounted on both sides of the front of the adjusting linear slide table one (23). Lifting servo cylinders (26) are fixedly mounted on the front and rear sides of the two adjusting frames (25), and the bottom ends of the drive shafts of the two lifting servo cylinders (26) extend to the bottom of the adjusting frame (25). A positioning suction frame one (27) is movably mounted below the adjusting frame (25), and the bottom ends of the drive shafts of the two lifting servo cylinders (26) are fixedly connected to the top of the positioning suction frame one (27).
6. The circuit board processing equipment according to claim 5, characterized in that: An adjustment linear slide table (24) is fixedly installed on the lower front side of the rotating frame (22), and adjustment sliding blocks (28) are slidably installed on both sides of the front side of the adjustment linear slide table (24). An adjustment servo motor (29) is fixedly installed at the bottom of the two adjustment sliding blocks (28), and a positioning suction frame (30) is fixedly installed at the bottom of the output shaft of the two adjustment servo motors (29).
7. The circuit board processing equipment according to claim 6, characterized in that: An annular rubber ring is provided on one side of each of the positioning adsorption racks 1 (27) and 2 (30). An adsorption channel is also provided in the middle of the opposite side of each of the positioning adsorption racks 1 (27) and 2 (30). A vacuum pump is provided inside each of the positioning adsorption racks 1 (27) and 2 (30), and the output ends of the two vacuum pumps are respectively connected to the inside of the two adsorption channels.
8. The circuit board processing equipment according to claim 1, characterized in that: A liquid collection tank (32) is provided on the lower side of the top of the liquid guide frame (31). A cleaning fluid collection tank (33) is fixedly provided inside the lower part of the processing frame (1). The interior of the cleaning fluid collection tank (33) is connected to the interior of the liquid collection tank (32) through a pump. A partition frame (36) is slidably provided on one side of the interior of the pretreatment tank (3). A partition control servo cylinder (38) is fixedly provided on one side of the interior of the processing frame (1). The drive end of the partition control servo cylinder (38) is fixedly connected to one side of the partition frame (36). The partition frame (36) adopts a "T" shaped structure. Several cleaning fluid nozzles (37) are provided on the two vertical surfaces on the front side of the partition frame (36). A cleaning fluid storage tank (34) is fixedly provided inside the lower part of the interior of the processing frame (1). The interior of the cleaning fluid storage tank (34) is connected to the interior of the partition frame (36) through a cleaning fluid conduit.
9. The circuit board processing equipment according to claim 8, characterized in that: The top of the separator (36) is inclined, and a receiving groove (39) is provided on the lower side of the top of the separator (36). The bottom of the receiving groove (39) extends through to the lower part of the pretreatment tank (3), and an automatic control valve is provided inside the receiving groove (39). A blower (40) is fixedly provided on the back of the pretreatment tank (3) and above the separator (36). A hot air blower (41) is fixedly provided on the back of the processing frame (1), and the air outlet of the hot air blower (41) is connected to the inside of the blower (40). A sealing plate (9) is slidably provided on both sides of the upper part of the pretreatment tank (3). A sealing servo cylinder (10) is fixedly provided on both sides of the processing frame (1), and the drive ends of the sealing servo cylinders (10) on both sides are fixedly connected to one side of the two sealing plates (9). A groove that cooperates with the fixed plate (19) is provided on the opposite side of the two sealing plates (9).
10. A processing method for a circuit board processing equipment, applied to the circuit board processing equipment according to any one of claims 1-9, characterized in that: Includes the following steps: Step 1: The circuit board is transported by the board conveyor (2), and the positioning adsorption frame 1 (27) and positioning adsorption frame 2 (30) of the auxiliary processing unit (8) vacuum adsorb and fix the circuit board on both sides. Step 2: Transfer the circuit board to the pretreatment tank (3), spray cleaning fluid through the cleaning fluid nozzle (37), perform ultrasonic cleaning with the ultrasonic transducer, and then dry it with hot air through the blower (40) and hot air blower (41). Step 3: Transfer the pre-processed circuit board to the processing support frame (6), the auxiliary processing unit (8) adjusts the posture and positioning of the circuit board, and the pick and place machine (5) slides along the sliding drive frame (4) to complete the single-sided SMD component placement. Step 4: Cooling fan (42) introduces cooling air into cooling channel (43) to cool and solidify the board after mounting; Step 5: Rotate the rack (22) to rotate the circuit board 180° and flip it over. Repeat steps 3 and 4 to complete the patching on the other side. Finally, release the adsorption and transfer the circuit board to the unloading position to complete the collection.