Display panel, manufacturing method of display panel and manufacturing method of light-emitting device

Abstract

The invention provides a display panel, a manufacturing method of the display panel and a manufacturing method of a light-emitting device, and relates to the technical field of display equipment manufacturing, the display panel comprises a target substrate and a light-emitting device, the target substrate comprises a first surface and a second surface which are oppositely arranged, and the first surface comprises a plurality of bonding contacts; a pin of the light-emitting device is electrically connected with the bonding contact, and a magnetic layer is arranged on the side, close to the target substrate, of the light-emitting device, so that in the transferring process of the light-emitting device, the light-emitting device can be attracted to the light-emitting device bonding area of the target substrate through mutual cooperation of the magnetic layer and the magnetic control device. The condition of deviation when the light-emitting device is transferred to the target substrate can be effectively avoided, the transfer yield is improved, and bonding failure of the light-emitting device is avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display device manufacturing, in particular to a display panel, a manufacturing method of the display panel and a manufacturing method of a light emitting device. BACKGROUND

[0002] With the development of display device manufacturing technology, mini light emitting devices (Mini LED) and micro light emitting devices (Micro-LED) are widely used because of their advantages in brightness, resolution, contrast, energy consumption, service life, response speed and thermal stability.

[0003] However, the current Mini LED or Micro-LED has the problem of bonding failure in the transfer process. SUMMARY

[0004] In order to overcome the above-mentioned deficiencies in the prior art, the purpose of the present application is to provide a display panel, comprising:

[0005] A target substrate, the target substrate comprises a first surface and a second surface arranged oppositely, and the first surface comprises a plurality of bonding contacts;

[0006] A light emitting device, the pin of the light emitting device is electrically connected with the bonding contact, and the side of the light emitting device close to the target substrate is provided with a magnetic layer.

[0007] In a possible implementation manner, the pin of the light emitting device close to the target substrate is provided with the magnetic layer.

[0008] In a possible implementation manner, the material of the magnetic layer comprises nickel and / or cobalt.

[0009] Another purpose of the present application is to provide a manufacturing method of a display panel, the method comprising:

[0010] Providing a transfer substrate, the transfer substrate is provided with a light emitting device on one side, and the light emitting device is provided with a magnetic layer away from the transfer substrate;

[0011] Providing a target substrate, the target substrate comprises a first surface and a second surface arranged oppositely, and the first surface comprises a plurality of light emitting device bonding areas;

[0012] Providing a magnetic control device on the second surface of the target substrate, the magnetic control device comprises a plurality of electromagnetic adsorption components, and the positions of the plurality of electromagnetic adsorption components correspond to the plurality of light emitting device bonding areas respectively;

[0013] In the case that the magnetic field is generated by the electromagnetic adsorption assembly, the light emitting device on the transfer substrate is transferred to the target substrate, so that the light emitting device is adsorbed to the light emitting device bonding area.

[0014] In a possible implementation, the step of transferring the light emitting device on the transfer substrate to the target substrate in the case that the magnetic field is generated by the electromagnetic adsorption assembly comprises:

[0015] In the case that the magnetic field is generated by the electromagnetic adsorption assembly, the light emitting device on the transfer substrate is adsorbed to the target substrate, so that the pin of the light emitting device is in contact with the light emitting device bonding area.

[0016] The pin of the light emitting device and the light emitting device bonding area are alloy bonded to realize the electrical connection between the pin of the light emitting device and the light emitting device bonding area.

[0017] In a possible implementation, the light emitting device bonding area comprises two bonding contacts corresponding to the pins of the light emitting device respectively, and the bonding contacts correspond to the electromagnetic adsorption assembly.

[0018] The step of adsorbing the light emitting device on the transfer substrate to the target substrate in the case that the magnetic field is generated by the electromagnetic adsorption assembly, so that the pin of the light emitting device is in contact with the light emitting device bonding area, comprises:

[0019] In the case that the magnetic field is generated by the electromagnetic adsorption assembly, the light emitting device on the transfer substrate corresponding to the bonding contact is adsorbed to the target substrate, so that the pin of the light emitting device is in contact with the bonding contact.

[0020] In a possible implementation, the step of alloy bonding the pin of the light emitting device and the light emitting device bonding area comprises:

[0021] The transfer substrate is removed.

[0022] The target substrate is irradiated by laser from the side of the target substrate away from the second surface, and the pin of the light emitting device and the light emitting device bonding area are alloy bonded under high temperature conditions.

[0023] In a possible implementation, after the step of adsorbing the light emitting device on the transfer substrate to the target substrate, the method further comprises:

[0024] The transfer substrate is removed while the electromagnetic adsorption is maintained.

[0025] In a possible implementation, the transfer substrate is provided with a photosensitive adhesive layer on a side close to the light emitting device;

[0026] The step of transferring the light emitting device on the transfer substrate to the target substrate comprises:

[0027] The light emitting device is separated from the transfer substrate by irradiating the photosensitive adhesive layer with a laser.

[0028] Another object of the present application is to provide a method for manufacturing a light emitting device, the method comprising:

[0029] A substrate is provided;

[0030] An N-type gallium nitride layer, a multi-quantum well layer and a P-type gallium nitride layer are sequentially formed on a side of the substrate;

[0031] The P-type gallium nitride layer and the multi-quantum well layer of the edge region of the light emitting device are removed until the N-type gallium nitride layer is exposed, forming an N-type region;

[0032] A conductive layer is formed on the N-type region and the surface of the P-type gallium nitride layer;

[0033] A magnetic layer is formed on a side of the conductive layer away from the substrate;

[0034] The magnetic layer, the conductive layer, the P-type gallium nitride layer and the multi-quantum well layer are etched to form a P-type electrode and an N-type electrode, respectively.

[0035] Compared with the prior art, the present application has the following beneficial effects:

[0036] The present application provides a display panel, a method for manufacturing a display panel and a method for manufacturing a light emitting device. By providing a magnetic layer on a side of the light emitting device away from the transfer substrate and a magnetic control device on a second surface of the target substrate, the light emitting device can be attracted to the light emitting device bonding area of the target substrate through the cooperation of the magnetic layer and the magnetic control device. In this way, the deviation of the light emitting device when being transferred to the target substrate can be effectively avoided, the transfer yield can be improved, and the bonding failure of the light emitting device can be avoided. BRIEF DESCRIPTION OF DRAWINGS

[0037] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0038] Figure 1Fig. 1 is a schematic diagram of a transfer process of a light emitting device in the prior art;

[0039] Figure 2 Fig. 2 is a schematic diagram of another transfer process of a light emitting device in the prior art;

[0040] Figure 3 Fig. 3 is a schematic diagram of a structure of a display panel provided by an embodiment of the present application;

[0041] Figure 4 Fig. 4 is a schematic diagram of a magnetic control device provided by an embodiment of the present application;

[0042] Figure 5 Fig. 5 is a schematic diagram of a manufacturing method of a display panel provided by an embodiment of the present application;

[0043] Figure 6 Fig. 6 is a schematic diagram of a transfer process of a light emitting device provided by an embodiment of the present application;

[0044] Figure 7 Fig. 7 is a schematic diagram of another magnetic control device provided by an embodiment of the present application;

[0045] Figure 8 Fig. 8 is a schematic diagram of another magnetic control device provided by an embodiment of the present application;

[0046] Figure 9 Fig. 9 is a schematic diagram of a sub-step of step S140 provided by an embodiment of the present application;

[0047] Figure 10 Fig. 10 is a schematic diagram of a sub-step of step S142 provided by an embodiment of the present application;

[0048] Figure 11 Fig. 11 is a schematic diagram of another transfer process of a light emitting device provided by an embodiment of the present application;

[0049] Figure 12 Fig. 12 is a schematic diagram of another transfer process of a light emitting device provided by an embodiment of the present application;

[0050] Figure 13 Fig. 13 is a schematic diagram of a manufacturing method of a light emitting device provided by an embodiment of the present application;

[0051] Figure 14 Fig. 14 is a schematic diagram of a structure of a light emitting device provided by an embodiment of the present application.

[0052] Icon: 100 - target substrate; 110 - light emitting device bonding area; 111 - bonding contact; 200 - light emitting device; 210 - magnetic layer; 300 - transfer substrate; 310 - photosensitive adhesive layer; 400 - magnetic control device; 410 - electromagnetic adsorption assembly; 220 - substrate; 230 - N-type gallium nitride layer; 240 - multiple quantum well layer; 250 - P-type gallium nitride layer; 260 - conductive layer. DETAILED DESCRIPTION

[0053] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the following will be combined with the accompanying drawings for the embodiments of the present application to make a clear and complete description of the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations.

[0054] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative labor are within the scope of protection of the present application.

[0055] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0056] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present application is usually placed, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", and the like are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0057] It should be noted that the different features in the embodiments of the present application can be combined with each other without conflict.

[0058] The inventor has found that, please refer to Figure 1In the transfer process of the Mini LED or the Micro-LED, the transfer substrate 300' can be used to batch pick up the Mini LED or the Micro-LED located on the temporary substrate and accurately transfer the Mini LED or the Micro-LED to the target substrate 100'. Generally, the Mini LED or the Micro-LED can be transferred according to the viscosity gap between the temporary substrate, the transfer substrate 300' and the target substrate 100'. However, in the process of moving the Mini LED or the Micro-LED from the transfer substrate 300' to the target substrate 100', due to the unevenness of the transfer substrate 300' or the surface of the target substrate 100', the Mini LED or the Micro-LED may not be able to be bonded to the target substrate 100', thereby reducing the transfer rate and causing partial bonding failure of the Mini LED or the Micro-LED.

[0059] In addition, please refer to Figure 2 In the transfer process, there may be precision errors, causing the bonded Mini LED or Micro-LED to be offset, the electrode and the pad not to be in contact, and thus affecting the light emitting effect of the Mini LED or the Micro-LED.

[0060] Therefore, the present embodiment provides a solution to solve the above problems, which will be described in detail below.

[0061] Please refer to Figure 3 , Figure 3 A possible structure schematic diagram of the display panel provided by the present embodiment can include a target substrate 100 and a light emitting device 200.

[0062] The target substrate 100 can include a first surface and a second surface arranged opposite to each other, and the first surface can include a plurality of bonding contacts 111. The pins of the light emitting device 200 can be electrically connected to the bonding contacts 111, and the light emitting device 200 is provided with a magnetic layer 210 on the side close to the target substrate 100.

[0063] Please refer to Figure 4 The second surface of the target substrate 100 is provided with a magnetic control device 400, and the magnetic control device 400 can include a plurality of electromagnetic adsorption components 410. The plurality of electromagnetic adsorption components 410 can adsorb the light emitting device 200 provided with the magnetic layer 210 under the condition of being powered on, so that the pins of the light emitting device 200 are in contact with the bonding contacts 111, and the offset is avoided.

[0064] The bonding contact 111 can include a solder and a pad, the pad is located on the first surface of the target substrate 100, and the solder is located on the side of the pad away from the target substrate 100. The pad can be used to fix the light emitting device 200 on the target substrate 100, and the solder can be used to connect the pad and the light emitting device 200 and protect the light emitting device 200 during welding. The material of the pad can include titanium, aluminum, copper, etc., and the material of the solder can include tin, indium, nickel, etc.

[0065] The light emitting device 200 can include a Micro LED or Mini LED chip. In the embodiment, the size or shape of the light emitting device 200 is not specifically limited.

[0066] Optionally, the number of light emitting devices 200 can be one or multiple. When the number of light emitting devices 200 is multiple, the multiple light emitting devices 200 can be distributed in an array on the target substrate 100. The multiple light emitting devices 200 can include light emitting devices 200 of multiple colors, and adjacent light emitting devices 200 of different colors can constitute a pixel. For example, one red light emitting device 200, one green light emitting device 200, and one blue light emitting device 200 can constitute a pixel.

[0067] In the above design, by arranging the magnetic layer 210 on the side of the light emitting device 200 close to the target substrate 100, the light emitting device 200 can be adsorbed to the corresponding bonding contact 111 position under the action of electromagnetic force, effectively avoiding the situation that the light emitting device 200 deviates when being transferred to the target substrate 100, improving the transfer yield, and avoiding bonding failure of the light emitting device 200.

[0068] In a possible implementation, please refer to Figure 3 again, the pin of the light emitting device 200 is provided with a magnetic layer 210 on the side close to the target substrate 100.

[0069] In the embodiment, since the light emitting device 200 usually has two pins, the two pins of the light emitting device 200 can be provided with a magnetic layer 210.

[0070] The positions of the multiple electromagnetic adsorption assemblies 410 on the second surface of the target substrate 100 can correspond to the multiple bonding contacts 111 respectively, and one electromagnetic adsorption assembly 410 can be used to adsorb the pin in the corresponding position to avoid deviation of the light emitting device 200.

[0071] The electromagnetic adsorption assembly 410 can include a magnetic component and an electromagnetic coil, the electromagnetic coil can be wound around the magnetic component, so as to generate a magnetic field of the electromagnetic adsorption assembly 410 under the condition of power supply. Specifically, the electromagnetic coil can be wound around the magnetic component counterclockwise, so that the magnetic field generated by the electromagnetic adsorption assembly 410 is vertically upward.

[0072] The magnetic component can be a magnet, and the magnetic field of the magnet and the electromagnetic induction magnetic field can be superimposed to effectively increase the magnetic strength.

[0073] In a possible implementation, the material of the magnetic layer 210 can include but is not limited to a magnetic material such as nickel, cobalt, etc. Thus, under the action of the electromagnetic force, the electromagnetic adsorption assembly 410 can generate a magnetic adsorption effect on the magnetic layer 210, so that the pins of the light emitting device 200 are in contact with the bonding contact 111, and the situation that the light emitting device 200 is deviated when being transferred to the target substrate 100 is avoided.

[0074] The embodiment also provides a manufacturing method of the display panel, please refer to Figure 5 The manufacturing method of the display panel can include the following steps.

[0075] In step S110, a transfer substrate 300 is provided, one side of the transfer substrate 300 is provided with a light emitting device 200, and the light emitting device 200 is provided with a magnetic layer 210 away from one side of the transfer substrate 300.

[0076] In the embodiment, please refer to Figure 6 One side of the transfer substrate 300 can be provided with a plurality of light emitting devices 200, and the plurality of light emitting devices 200 can include light emitting devices 200 of multiple colors, and each light emitting device 200 is provided with a magnetic layer 210 away from one side of the transfer substrate 300.

[0077] It should be noted that the plurality of light emitting devices 200 provided on one side of the transfer substrate 300 can also include light emitting devices 200 of the same color, so that when the light emitting device 200 is transferred, it is not necessary to prepare a temporary substrate composed of light emitting devices 200 of multiple colors in advance, and light emitting devices 200 of different colors can be sequentially transferred to the target substrate 100, which is beneficial to save the manufacturing time and manufacturing cost of the temporary substrate.

[0078] In step S120, a target substrate 100 is provided, the target substrate 100 includes oppositely arranged first and second surfaces, and the first surface includes a plurality of light emitting device bonding regions 110.

[0079] In the embodiment, please refer to Figure 6, the target substrate 100 can be located on the side of the transfer substrate 300 provided with the light emitting device 200, and the position of the light emitting device bonding area 110 of the target substrate 100 corresponds to the position of the light emitting device 200 provided on the transfer substrate 300.

[0080] In step S130, a magnetic control device 400 is provided on the second surface of the target substrate 100, and the magnetic control device 400 includes a plurality of electromagnetic adsorption components 410, and the positions of the plurality of electromagnetic adsorption components 410 correspond to the positions of the plurality of light emitting device bonding areas 110, respectively.

[0081] In this embodiment, please refer to Figure 6 , the target substrate 100 is provided with a magnetic control device 400 on the side away from the light emitting device bonding area 110, and the magnetic control device 400 can include a plurality of electromagnetic adsorption components 410, and the plurality of electromagnetic adsorption components 410 can generate magnetism for adsorbing the light emitting device 200.

[0082] In step S140, the light emitting device 200 on the transfer substrate 300 is transferred to the target substrate 100 under the condition that the electromagnetic adsorption components 410 generate magnetism, so that the light emitting device 200 is adsorbed to the light emitting device bonding area 110.

[0083] In this embodiment, please refer to Figure 7 , the magnetic control device 400 can further include a driving power source, and the driving power source can be connected with the plurality of electromagnetic adsorption components 410, when the driving power source is turned on, the plurality of electromagnetic adsorption components 410 can generate magnetism and adsorb the light emitting device 200, so that the light emitting device 200 is adsorbed to the corresponding light emitting device bonding area 110.

[0084] It should be noted that, please refer to Figure 8 , the magnetic control device 400 can further include a switching device, and the plurality of electromagnetic adsorption components 410 can be connected with the driving power source through the switching device, when the light emitting device 200 on the transfer substrate 300 is transferred to the target substrate 100, the corresponding electromagnetic adsorption component 410 can be connected with the driving power source through the switching device, so as to complete the transfer of the corresponding switching device.

[0085] In the above design, by providing the magnetic layer 210 on the side of the light emitting device 200 away from the transfer substrate 300 and providing the magnetic control device 400 on the second surface of the target substrate 100, the light emitting device 200 can be attracted to the light emitting device bonding area 110 of the target substrate 100 through the cooperation of the magnetic layer 210 and the magnetic control device 400, so that the deviation of the light emitting device 200 during the transfer to the target substrate 100 can be effectively avoided, the transfer yield can be improved, and the bonding failure of the light emitting device 200 can be avoided.

[0086] In a possible implementation, referring to Figure 9 , step S140 can include the following sub-steps.

[0087] Step S141, in the case that the magneticity is generated by the electromagnetic adsorption assembly 410, adsorbing the light emitting device 200 on the transfer substrate 300 to the target substrate 100, so that the pins of the light emitting device 200 are in contact with the light emitting device bonding area 110.

[0088] In the embodiment, when the driving power is turned on, the electromagnetic adsorption assembly 410 can generate magneticity and adsorb the light emitting device 200 to the light emitting device bonding area 110 of the target substrate 100, so as to avoid the deviation of the light emitting device 200.

[0089] Step S142, alloy bonding the pins of the light emitting device 200 and the light emitting device bonding area 110, so as to realize the electrical connection between the pins of the light emitting device 200 and the light emitting device bonding area 110.

[0090] In the embodiment, after the light emitting device 200 is adsorbed to the light emitting device bonding area 110 of the target substrate 100, the pins of the light emitting device 200 and the light emitting device bonding area 110 can be alloy bonded, so as to complete the bonding of the light emitting device 200.

[0091] In a possible implementation, referring to Figure 7 , the light emitting device bonding area 110 can include two bonding contacts 111 corresponding to the pins of the light emitting device 200 respectively, and the bonding contacts 111 correspond to the electromagnetic adsorption assembly 410.

[0092] In the case that the magneticity is generated by the electromagnetic adsorption assembly 410, when the light emitting device 200 on the transfer substrate 300 is adsorbed to the target substrate 100, so that the pins of the light emitting device 200 are in contact with the light emitting device bonding area 110, the light emitting device 200 on the transfer substrate 300 corresponding to the bonding contacts 111 can be adsorbed to the target substrate 100, so that the pins of the light emitting device 200 are in contact with the bonding contacts 111.

[0093] In the embodiment, the two pins of the light emitting device 200 are both provided with the magnetic layer 210, when the electromagnetic adsorption assembly 410 generates magneticity, the pins of the light emitting device 200 can be adsorbed to the center position of the corresponding bonding contacts 111 by generating adsorption force to the magnetic layer 210 of the light emitting device 200.

[0094] In a possible implementation, referring to Figure 10In the alloy bonding of the pins of the light emitting device 200 and the light emitting device bonding area 110, step S142 can include the following sub-steps.

[0095] Step S142a, removing the transfer substrate 300.

[0096] Step S142b, irradiating the target substrate 100 with laser from the side of the target substrate 100 away from the second surface, and alloy bonding the pins of the light emitting device 200 and the light emitting device bonding area 110 under high temperature condition.

[0097] In the embodiment, the transfer substrate 300 can be removed first to avoid the transfer substrate 300 from blocking the laser from irradiating the light emitting device 200 on the target substrate 100. Then the light emitting device 200 is irradiated with the laser emitted from the laser to increase the instantaneous temperature to 220-250℃, so that the pins of the light emitting device 200 and the solder of the bonding contact 111 form an alloy, thereby realizing the electrical connection between the light emitting device 200 and the bonding contact 111. The laser can be arranged on the side of the target substrate 100 away from the second surface.

[0098] In a possible implementation, after the light emitting device 200 on the transfer substrate 300 is adsorbed to the target substrate 100, the transfer substrate 300 can be removed while the electromagnetic adsorption is maintained.

[0099] In the embodiment, please refer to Figure 11 The laser can be arranged on the side of the transfer substrate 300 away from the target substrate 100. When the light emitting device 200 on the transfer substrate 300 is adsorbed to the light emitting device bonding area 110 on the target substrate 100 under the action of the electromagnetic force, the temporary substrate can be moved so that the laser emitted from the laser can completely irradiate the light emitting device 200 on the target substrate 100 to realize the alloy bonding between the light emitting device 200 and the bonding contact 111.

[0100] In a possible implementation, please refer to Figure 12 The side of the transfer substrate 300 close to the light emitting device 200 is provided with a photosensitive adhesive layer 310.

[0101] When the light emitting device 200 on the transfer substrate 300 is transferred to the target substrate 100, the photosensitive adhesive layer 310 can be irradiated with laser to separate the light emitting device 200 from the transfer substrate 300.

[0102] In the embodiment, the light emitting device 200 and the transfer substrate 300 can be connected through the photosensitive adhesive layer 310. When the laser emitted by the laser irradiates the photosensitive adhesive layer 310, the photosensitive adhesive layer 310 can react to generate gas, so as to separate the light emitting device 200 from the transfer substrate 300, and generate a thrust of the light emitting device 200 away from the transfer substrate 300. After the light emitting device 200 is separated from the transfer substrate 300, the driving power supply can be turned on, and the light emitting device 200 on the transfer substrate 300 is adsorbed to the target substrate 100 through the electromagnetic adsorption assembly 410.

[0103] It should be noted that the laser for irradiating the photosensitive adhesive layer 310 and the laser for irradiating the light emitting device 200 on the target substrate 100 can be the same laser. The laser can be arranged above the target substrate 100 and the transfer substrate 300.

[0104] The embodiment also provides a manufacturing method of a light emitting device. Please refer to Figure 13 The manufacturing method of the light emitting device can include the following steps.

[0105] In step S210, a substrate 220 is provided.

[0106] In step S220, an N-type gallium nitride layer 230, a multi-quantum well layer 240 and a P-type gallium nitride layer 250 are sequentially formed on one side of the substrate 220.

[0107] In the embodiment, the photosensitive adhesive layer, the N-type gallium nitride layer 230, the multi-quantum well layer 240 and the P-type gallium nitride layer 250 can be sequentially formed on one side of the substrate 220.

[0108] In step S230, the P-type gallium nitride layer 250 and the multi-quantum well layer 240 of the edge region of the light emitting device 200 are removed until the N-type gallium nitride layer 230 is exposed, to form an N-type region.

[0109] In step S240, a conductive layer 260 is formed on the surface of the N-type region and the P-type gallium nitride layer 250.

[0110] In step S250, a magnetic layer 210 is formed on the side of the conductive layer 260 away from the substrate 220.

[0111] In step S260, the magnetic layer 210, the conductive layer 260, the P-type gallium nitride layer 250 and the multi-quantum well layer 240 are etched to form a P-type electrode and an N-type electrode, respectively.

[0112] In the embodiment, please refer to Figure 14The P-type electrode and the N-type electrode are provided with the magnetic layer 210 away from the side of the substrate 220, so that the electromagnetic adsorption assembly 410 can generate magnetic adsorption on the magnetic layer 210 under the action of the electromagnetic force, thereby facilitating the transfer of the light emitting device 200.

[0113] In summary, the embodiments of the present application provide a display panel, a manufacturing method of the display panel, and a manufacturing method of a light emitting device. By arranging a magnetic layer on the side of the light emitting device away from the transfer substrate and arranging a magnetic control device on the second surface of the target substrate, the light emitting device can be attracted to the light emitting device bonding area of the target substrate by the cooperation of the magnetic layer and the magnetic control device. In this way, the deviation of the light emitting device when being transferred to the target substrate can be effectively avoided, the transfer yield can be improved, and the bonding failure of the light emitting device can be avoided.

[0114] The technical features of the above-described embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-described embodiments are not described, but as long as the combinations of the technical features do not exist, they should be considered as the scope of the present application.

[0115] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the patent. It should be pointed out that for ordinary skilled persons in the art, some modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A display panel, characterized in that, include: A target substrate, the target substrate including a first surface and a second surface disposed opposite to each other, the first surface including a plurality of bonding contacts; A light-emitting device, wherein the pins of the light-emitting device are electrically connected to the bonding contacts, and a magnetic layer is provided on the side of the light-emitting device near the target substrate.

2. The display panel according to claim 1, characterized in that, The magnetic layer is provided on the side of the light-emitting device near the target substrate.

3. The display panel according to claim 1, characterized in that, The material of the magnetic layer includes nickel and / or cobalt.

4. A method for manufacturing a display panel, characterized in that, The method includes: A transfer substrate is provided, wherein a light-emitting device is disposed on one side of the transfer substrate, and a magnetic layer is disposed on the side of the light-emitting device away from the transfer substrate; A target substrate is provided, the target substrate including a first side and a second side disposed opposite to each other, the first side including a plurality of light-emitting device bonding areas; A magnetic control device is provided on the second side of the target substrate. The magnetic control device includes multiple electromagnetic adsorption components, and the positions of the multiple electromagnetic adsorption components correspond to the bonding areas of the multiple light-emitting devices, respectively. When the electromagnetic adsorption component generates magnetism, the light-emitting device on the transfer substrate is transferred to the target substrate, so that the light-emitting device is adsorbed to the light-emitting device bonding area.

5. The method for manufacturing a display panel according to claim 4, characterized in that, The step of transferring the light-emitting device on the transfer substrate to the target substrate when magnetism is generated by the electromagnetic adsorption component includes: When the electromagnetic adsorption component generates magnetism, the light-emitting device on the transfer substrate is adsorbed onto the target substrate, so that the pins of the light-emitting device are in contact with the bonding area of ​​the light-emitting device. Alloy bonding is performed on the pins of the light-emitting device and the bonding area of ​​the light-emitting device to achieve electrical connection between the pins of the light-emitting device and the bonding area of ​​the light-emitting device.

6. The method for manufacturing a display panel according to claim 5, characterized in that, The bonding area of ​​the light-emitting device includes two bonding contacts that correspond to the pins of the light-emitting device, and the bonding contacts correspond to the electromagnetic adsorption component. The step of attracting the light-emitting device on the transfer substrate to the target substrate, thereby making the pins of the light-emitting device contact the bonding area of ​​the light-emitting device, when the electromagnetic adsorption component generates magnetism, includes: When the electromagnetic adsorption component generates magnetism, the light-emitting device corresponding to the bonding contact on the transfer substrate is adsorbed onto the target substrate, so that the pin of the light-emitting device contacts the bonding contact.

7. The method for manufacturing a display panel according to claim 5, characterized in that, The step of alloy bonding the pins of the light-emitting device and the bonding area of ​​the light-emitting device includes: Remove the transfer substrate; The target substrate is irradiated with a laser from the side of the target substrate away from the second surface, and alloy bonding is performed on the pins of the light-emitting device and the bonding area of ​​the light-emitting device under high temperature conditions.

8. The method for manufacturing a display panel according to claim 4, characterized in that, After the step of attaching the light-emitting device on the transfer substrate to the target substrate, the method further includes: Remove the transfer substrate while maintaining electromagnetic adsorption.

9. The method for manufacturing a display panel according to claim 4, characterized in that, A photosensitive adhesive layer is disposed on the side of the transfer substrate closest to the light-emitting device; The step of transferring the light-emitting device on the transfer substrate to the target substrate includes: The light-emitting device is separated from the transfer substrate by irradiating the photosensitive adhesive layer with a laser.

10. A method for manufacturing a light-emitting device, characterized in that, The method includes: Provide a base; An N-type gallium nitride layer, a multiple quantum well layer, and a P-type gallium nitride layer are sequentially formed on one side of the substrate; Remove the P-type gallium nitride layer and the multiple quantum well layer in the edge region of the light-emitting device until the N-type gallium nitride layer is exposed to form an N-type region; A conductive layer is formed on the surface of the N-type region and the P-type gallium nitride layer; A magnetic layer is formed on the side of the conductive layer away from the substrate; The magnetic layer, the conductive layer, the P-type gallium nitride layer, and the multiple quantum well layer are etched to form P-type electrodes and N-type electrodes, respectively.

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