A silicon-based panel bonding device and bonding method thereof

Abstract

This invention provides a silicon-based panel bonding device and method, relating to the field of silicon-based panel manufacturing technology. It first calibrates the first platform unit using dual cameras in the alignment unit to eliminate mechanical movement errors, separately photographing the target component and terminal area markers to avoid switching errors. Combined with multi-directional incremental calibration, it eliminates positioning deviations, achieving micron-level alignment and solving the alignment misalignment problem of silicon-based panels. Furthermore, the initial positioning stage screens for defective target components in advance, reducing the risk of semi-finished product scrap. This multi-dimensional breakthrough overcomes technical bottlenecks and improves bonding yield and efficiency. Through the coordinated operation of the first, second, and third heat dissipation units, and the combination of directional airflow and circulating gas cooling, the temperature of the AA area is specifically protected while considering the local pressure temperature of the terminal area, resolving the contradiction between heat dissipation and high temperature. In addition, the initial positioning stage screens for defective target components in advance, reducing the risk of semi-finished product scrap and improving bonding yield and efficiency.

Description

Technical Field

[0001] This application relates to the field of silicon-based panel manufacturing technology, and in particular to a silicon-based panel bonding device and bonding method thereof. Background Technology

[0002] As display technology advances towards miniaturization, high resolution, and high reliability, silicon-based panels (such as silicon-based OLED and silicon-based MicroLED) are widely used in VR, AR, micro-projectors, and high-end automotive displays due to their advantages of high pixel density, fast response, and low power consumption. Their core characteristics include a compact structure, small size, extremely small distance between the effective display area (AA area) and the bonding terminal area, and high line density in the terminal area, requiring stringent bonding alignment accuracy.

[0003] In silicon-based panel manufacturing, bonding the terminal area to the FPC / IC is a critical process, requiring steps such as ACF attachment, pre-pressing, and final pressing. Among these, the alignment accuracy of pre-pressing directly affects the yield: due to the small size of the silicon-based panel as a whole and the marking points in the terminal area, the alignment mechanism of traditional equipment is easily affected by mechanical vibration, platform errors, and visual deviations, making it difficult to achieve precise matching. This often results in line misalignment and poor contact, leading to product scrap and hindering yield improvement.

[0004] Meanwhile, the display characteristics of silicon-based panels are sensitive to temperature. During bonding, the terminal area requires a high-temperature and high-pressure environment to ensure the curing of ACF resin and good contact of conductive particles, but heat is easily conducted to the AA area. Traditional overall heat dissipation methods cannot take into account both "high-temperature curing of the terminal area" and "low-temperature protection of the AA area". Either the temperature of the AA area exceeds the standard, or the terminal area is not cured enough, affecting the bonding reliability. Therefore, targeted local heat dissipation of the AA area is required, which has extremely high design requirements.

[0005] Furthermore, existing equipment suffers from insufficient compatibility: traditional equipment is only compatible with either FPC or IC, while in actual production, different silicon-based panels require bonding to different target components, necessitating multiple machines for enterprises, increasing costs and reducing production line flexibility and changeover efficiency. With the diversification of market demands, there is an urgent need for integrated equipment compatible with both FPC and IC loading and bonding. Summary of the Invention

[0006] This invention proposes a silicon-based panel bonding device and bonding method to solve the technical problems of insufficient alignment accuracy, heat dissipation in the AA area and the inherent voltage of the terminal area, and poor device compatibility in the prior art.

[0007] To solve the above problems, the technical solution adopted by the present invention is as follows:

[0008] This invention provides a silicon-based panel bonding device, including a first platform unit and a second platform unit for carrying the silicon-based panel; the first platform unit switches between an attachment unit and a pre-pressing unit, and the second platform unit switches between a pre-pressing unit and a self-pressing unit; an alignment unit is provided below the pre-pressing unit, and a feeding unit is provided behind the pre-pressing unit, the feeding unit temporarily storing a target component, and a transfer platform transporting the target component to the pre-pressing unit; the second platform unit includes a first heat dissipation section and a second heat dissipation section, and the self-pressing unit includes a third heat dissipation section; the second platform unit includes an adsorption platform for adsorbing the AA area, the first heat dissipation section can dissipate heat and cool the bottom surface of the adsorption platform and the self-pressing position adjacent to the self-pressing unit; the third heat dissipation section is located between the adsorption platform and the self-pressing position of the self-pressing unit, and can dissipate heat and cool the AA area of ​​the silicon-based panel located on the adsorption platform.

[0009] Furthermore, the second heat dissipation unit includes a gas channel formed on the adsorption platform, through which a flowing medium can pass; on the adsorption platform, a temperature sensing element is provided in the area where the AA zone is located.

[0010] Furthermore, the first heat dissipation part includes an air blowing block and an air blowing adjustment bracket for adjusting the vertical height of the air blowing block. The air blowing block is located below the adsorption platform. Multiple first air blowing holes are evenly distributed on the side of the air blowing block facing the adsorption platform, and the first air blowing holes are all facing the adsorption area of ​​the adsorption platform.

[0011] Furthermore, the third heat dissipation part includes an air blowing plate and an air blowing plate adjustment bracket for adjusting the vertical height and horizontal distance of the air blowing plate. The side of the air blowing plate facing the AA area is provided with a plurality of second air blowing holes, which face the AA area.

[0012] Furthermore, the alignment unit includes a marble base, on which an integrated dual-lens lens is fixed. The integrated dual-lens lens has a first light source and a second light source on its two sides respectively. The first camera of the integrated dual-lens lens is used to photograph the marking points of the target component, and the second camera of the integrated dual-lens lens is used to photograph the marking points of the terminal area of ​​the silicon-based panel.

[0013] Furthermore, the feeding unit includes a tray base plate, on which an FPC feeding section and an IC feeding section are provided. The IC feeding section includes a tray positioning component, which surrounds the tray storage cavity. The two sides of the tray positioning component protrude upwards and are higher than the thickness of the tray. The tray positioning component is also provided with a tray baffle. A spring is provided on the side of the tray baffle facing the tray, and the spring presses the tray located in the tray storage cavity to the opposite side.

[0014] In addition, a silicon-based panel bonding method based on a silicon-based panel bonding device is disclosed, including the following steps:

[0015] S1. Equipment preparation: This includes calibrating the first platform unit;

[0016] S2, Silicon-based panel loading and attachment: The first platform unit carries the silicon-based panel and moves it to the working position of the attachment unit to attach ACF to the terminal area of ​​the silicon-based panel;

[0017] S3, Target Part Loading: The loading arm grabs the target part according to the preset program and places it on the preset station of the transfer platform;

[0018] S4. Initial Positioning: The transfer platform carries the target part to the direct under the initial positioning unit, and the initial positioning unit performs initial positioning and detection of the target part.

[0019] S5. Pre-compression alignment: The transfer platform continues to move the target part processed in step S4 to the pre-compression unit, where the adsorption mechanism of the pre-compression unit grips the target part; the silicon-based panel processed in step S2 continues to move from the first platform unit to directly below the pre-compression unit. The first and second cameras of the alignment unit acquire images of the marking points on the target part and the marking points on the terminal area of ​​the silicon-based panel, respectively, and analyze and process the acquired images to obtain the positional deviation values ​​of the marking points on the target part and the marking points on the terminal area of ​​the silicon-based panel, thereby controlling the first platform unit to adjust the alignment.

[0020] S6, Pre-pressing: The pre-pressing unit pre-bonds the target component to the terminal area of ​​the silicon-based panel to obtain a semi-finished product;

[0021] S7. Semi-finished product transfer: The transfer arm transports the semi-finished product after pre-compression in step S6 to the second platform unit;

[0022] S8, Pressing: The second platform unit moves the semi-finished product to the working position of the pressing unit, and the pressing unit performs pressing bonding on the semi-finished product.

[0023] Furthermore, step S4 includes:

[0024] S4A: Input the preset standard image template of the target part into the first image processing system of the initial positioning unit;

[0025] S4B: The camera of the initial positioning unit takes a picture of the target part on the transfer platform and obtains the first image of the target part;

[0026] S4C: The first image processing system performs positional deviation analysis and foreign object inspection on the first image and the standard image template, and evaluates the similarity parameters;

[0027] S4D: Determine whether the similarity parameter is within the preset acceptable range; if the similarity parameter exceeds the acceptable range, the pre-pressing unit and the throwing unit work together to throw and recycle the target part; if the similarity parameter does not exceed the acceptable range, proceed to step S5.

[0028] Furthermore, step S1 includes:

[0029] S1A: After the first platform unit moves to the preset position, the second image processing system acquires an image of the first platform unit and obtains the first coordinates of the current position through the second image processing system;

[0030] S1B: The second image processing system performs incremental or decrement processing on the first coordinate data to obtain incremental or decrement coordinates;

[0031] S1C: The first platform unit continues to move to the position of the incremental or decrement coordinates according to the data after incremental or decrement processing, and the second image processing system performs image acquisition on the first platform unit to obtain the second coordinates of that position;

[0032] S1D: Determines the deviation between the second coordinate and the incremental or decremental coordinate;

[0033] S1E: Compensate for deviations.

[0034] Furthermore, steps S1B to S1E are repeated at least twice, and each time steps S1B to S1E are repeated, only one of the coordinate directions is increased or decreased, until the second image processing system determines that the deviation meets the preset requirements, then the calibration operation ends.

[0035] Compared with the prior art, the present invention has the following beneficial effects:

[0036] This invention provides a bonding method for a silicon-based panel bonding device. The alignment unit uses a marble base to fix an integrated dual-lens lens to reduce vibration impact. Dual cameras are used to separately photograph the target component and terminal area markings to avoid switching errors. Multi-directional incremental calibration eliminates positioning deviations caused by mechanical errors in the first platform unit, achieving micron-level alignment and solving the problem of silicon-based panel alignment misalignment. Simultaneously, a first heat dissipation unit cools the bottom of the adsorption platform near the pressure point, reducing heat conduction from the pressure point to the AA area. A third heat dissipation unit directly acts on the AA area to cool it. A second heat dissipation unit detects the temperature of the adsorption platform using a temperature sensor. When the temperature rises to a set threshold, the controller opens a solenoid valve, connecting compressed air to the gas channel. The compressed air flows through the gas channel, rapidly exchanging heat with the adsorption platform. The absorbed heat is discharged through the gas channel outlet, effectively controlling the temperature of the adsorption platform. This prevents the second heat dissipation unit from quickly intervening to cool the platform if the first and third heat dissipation units fail or their short-term cooling capacity is insufficient, thus preventing the adsorption platform from overheating. The loading unit features a flexible limiting structure compatible with IC loading sections and FPC loading sections of different specifications, reducing equipment investment and changeover costs. Furthermore, the initial positioning stage screens for defective target components in advance, reducing the risk of semi-finished product scrap. This multi-dimensional breakthrough overcomes technical bottlenecks and improves bonding yield and efficiency. Attached Figure Description

[0037] To more clearly illustrate the technical solution proposed by the present invention, a detailed description is provided below in conjunction with the embodiments and accompanying drawings. It should be understood that the accompanying drawings described below are merely some embodiments of the present invention, and those skilled in the art can make changes to these drawings under the concept of the present invention.

[0038] Figure 1 A top view of an embodiment of the COW bonding device provided by the present invention;

[0039] Figure 2 An assembly perspective view of an embodiment of the alignment unit provided by the present invention;

[0040] Figure 3 An assembly perspective view of an embodiment of the feeding unit and transfer platform provided by the present invention;

[0041] Figure 4 An assembly perspective view of an embodiment of the pre-compression unit provided by the present invention;

[0042] Figure 5 An assembly perspective view of an embodiment of the feeding unit provided by the present invention;

[0043] Figure 6 This is an overall structural diagram of the bonding device provided by the present invention;

[0044] Figure 7 for Figure 6 Enlarged view of a portion of point A in the middle;

[0045] Figure 8 An assembly perspective view of an embodiment of the first heat dissipation part, the second heat dissipation part, and the third heat dissipation part provided by the present invention;

[0046] Figure 9 An assembly perspective view of an embodiment of the second platform unit provided by the present invention;

[0047] Figure 10 An assembly perspective view of an embodiment of the first heat dissipation unit provided by the present invention;

[0048] Figure 11 An assembly perspective view of an embodiment of the second heat dissipation unit provided by the present invention.

[0049] 1. First platform unit; 2. Second platform unit; 21. First heat dissipation unit; 211. Air blowing block; 212. Air blowing adjustment bracket; 213. First air blowing hole; 22. Second heat dissipation unit; 221. Air inlet channel; 222. Air outlet channel; 23. Adsorption platform; 3. Attachment unit; 4. Pre-compression unit; 5. Base pressure unit; 51. Third heat dissipation unit; 512. Air blowing plate adjustment bracket; 513. Air blowing plate; 514. Second air blowing hole; 6. Alignment unit; 61. Marble base; 62. First camera; 63. Second camera; 64. First light source; 65. Second light source; 7. Loading unit; 71. Tray base plate; 72. FPC loading section; 73. IC loading section; 731. Tray; 732. Tray positioning component; 733. Tray retainer; 734. Spring; 8. Loading arm; 9. Transfer arm; 10. Transfer platform; 11. Initial positioning section; 12. Throwing section. Detailed Implementation

[0050] The silicon-based panel bonding device provided in this embodiment includes a first platform unit 1, a second platform unit 2, an attachment unit 3, a pre-pressing unit 4, a post-pressing unit 5, an alignment unit 6, a feeding unit 7, and a transfer platform 10. Each unit works together to achieve precise bonding between the silicon-based panel and the target component, while solving the problems of low alignment accuracy, heat dissipation issues, and insufficient compatibility of traditional equipment.

[0051] The first platform unit 1 is used to transfer the silicon-based panel; the attachment unit 3 includes an ACF unwinding mechanism and a cutting mechanism. The ACF unwinding mechanism and the cutting mechanism work together to attach a preset length of ACF (anisotropic conductive film) to the terminal area surface of the silicon-based panel.

[0052] Pre-pressing unit 4 includes a pre-pressing head that pre-presses the target component onto the terminal area of ​​the silicon-based panel. Second platform unit 2 is used to transfer the pre-pressed semi-finished product (the assembly of the silicon-based panel and the target component) and the finally bonded silicon-based panel product. Bonding unit 5 performs the final bonding of the assembly of the silicon-based panel and the target component.

[0053] The core structure of the alignment unit 6 is a marble base 61. Marble is a high-density and highly stable material that can effectively isolate vibrations generated during equipment operation, preventing vibrations from affecting the shooting accuracy. An integrated dual-lens lens is fixed on the marble base 61 by a precision clamp. The first light source 64 and the second light source 65 are connected to the two sides of the lens respectively. The first light source 64 corresponds one-to-one with the first camera 62 and is used to shoot the target part marking points, providing uniform illumination and avoiding uneven light that could cause marking point identification deviations. The second light source 65 corresponds one-to-one with the second camera 63 and is used to shoot the marking points in the silicon-based panel terminal area, providing directional illumination and highlighting the outline of the terminal area marking points.

[0054] like Figure 5 As shown, the tray base plate 71 of the feeding unit 7 integrates an FPC feeding section 72 and an IC feeding section 73. The IC feeding section 73 is equipped with a tray positioning component 732 that is compatible with trays 731 of different specifications: the tray positioning component 732 protrudes upward on both sides, and the protrusion height is higher than the uppermost edge of the tray 731, so as to reliably limit the vertical movement of the tray 731; the edge of the tray positioning component 732 is provided with a tray guard 733, and a spring piece 734 is installed on the side of the tray guard 733 facing the tray 731. First, tilt the tray 731, with one end against the spring plate 734, and continue to apply force to push the tray 731. The spring plate 734 undergoes elastic deformation under the pressure of the tray 731. Rotate the other end of the tray 731 towards the tray base plate 71 until the tray 731 contacts the tray base plate 71. At this point, the external force on the tray 731 is removed, and the spring plate 734 will spring against the tray 731 under the action of elastic force, thereby pushing the side of the tray 731 away from the spring plate 734 to press against the tray positioning component 732, thus achieving the positioning and limiting of the tray 731. Therefore, when feeding trays 731 within a certain size range, it is not necessary to replace the tray positioning component 732 to adapt to trays 731 of different sizes. The FPC feeding part 72 is evenly distributed with multiple vacuum adsorption holes, which are connected to the vacuum generator. The FPC is placed on the FPC feeding part 72, and the FPC is adsorbed onto the FPC feeding part 72 through vacuum adsorption.

[0055] The specific implementation process of the bonding method for this device is as follows:

[0056] When a new specification or batch of silicon-based panel is used in production, or when the type of target part to be bonded is changed, a calibration step is first performed to ensure that the position parameters of the first camera 62 and the second camera 63 of the alignment unit 6 are accurately matched with those of the first platform unit 1, laying the foundation for subsequent alignment. The PLC control system controls the first platform unit 1 to move along the guide rail to the pre-pressing position corresponding to the pre-pressing process. At this time, the second image processing system of the alignment unit 6 is activated, and the second camera 63 (used to capture the marker points of the terminal area of ​​the silicon-based panel placed on the first platform unit 1) captures the first platform unit 1 and analyzes and processes the captured image to obtain the first coordinate data of the current position. This first coordinate data is transmitted to the second image processing system in real time.

[0057] The second image processing system incrementally processes the first coordinate data. After the incremental processing is complete, the second image processing system feeds back the adjusted coordinates to the PLC control system of the equipment. The PLC control system controls the corresponding movement of the moving part of the first platform unit 1, moving the platform of the first platform unit 1 to the new coordinate position after incremental processing. The second camera 63 takes another picture of the platform at the new coordinate position and acquires an image of the new position. At the same time, the second image processing system analyzes the image of the first platform unit 1 at the new position to obtain the second coordinates. By comparing the second coordinates with the incremental coordinates, the movement error of the first platform unit 1 can be determined, and the control system can compensate for the movement error to improve the movement and positioning accuracy of the first platform unit 1. It should be noted that the processing strictly follows the principle of "single-direction adjustment". Each incremental adjustment is only applied to one direction among the X-axis (horizontal), Y-axis (vertical), and Q-axis (vertical rotation direction) to avoid the first platform unit 1 exceeding the effective field of view of the first camera 62 and the second camera 63 due to multi-directional superimposed movement, which would cause the data to become invalid. By using incremental adjustments in a single direction, the displacement range of each adjustment can be precisely controlled, ensuring that the first platform unit 1 is always within the camera's field of view, guaranteeing that effective coordinate data can be obtained for each adjustment, and maintaining the continuity and integrity of the calibration process. For example, the first coordinate position is set as (X1, Y1, Q1), the coordinate position after the first increment of the second image processing system is (X1+Δx, Y1, Q1), and the second coordinate position is (X2, Y2, Q2). The X-axis movement error is calculated and compensated. Then, the second coordinate increment is performed, with coordinates as (X1+Δx, Y1+Δy, Q1). After taking a picture, the image processing obtains the third coordinate (X3, Y3, Q3), and the Y-axis movement error is calculated and compensated. The third coordinate increment is performed, with coordinates as (X1+Δx, Y1+Δy, Q1+Δq). After taking a picture, the image processing obtains the third coordinate (X4, Y4, Q4), and the Q-axis movement error is calculated and compensated. ... The above process is repeated multiple times. A nine-grid point calibration method can be used to cover the main working area of ​​the platform. Each time it is repeated, different directions among the X, Y, and Q axes are selected for incremental processing until the second image processing system determines that the error or compensation in each direction is stable within the preset accuracy range, and the calibration is completed. By adjusting in multiple directions, positioning deviations caused by platform guide rail gaps and transmission component errors can be precisely eliminated, providing micron-level precision assurance for subsequent pre-loading alignment.

[0058] After calibration, the silicon-based panel loading and bonding process begins. Operators or automated loading equipment smoothly place the silicon-based panel onto the support surface of the first platform unit 1. The silicon-based panel includes a terminal area for bonding with the target component, a display area for display, and an AA area (the AA area typically refers to the active area of ​​the display panel, i.e., the area where pixel circuits (such as TFT) and light-emitting units (such as OLED or MicroLED) actually operate). The support surface of the first platform unit 1 is equipped with an adsorption structure to hold the silicon-based panel in place and prevent movement. The first platform unit 1 moves along a preset trajectory between the bonding unit 3 and the pre-pressing unit 4, moving to the bonding position of the bonding unit 3 and accurately positioning itself. The ACF unwinding mechanism and cutting mechanism of the bonding unit 3 work together to attach a preset length of ACF (anisotropic conductive film) to the surface of the terminal area of ​​the silicon-based panel. During the bonding process, bonding pressure is applied through the bonding head to ensure that the ACF completely covers the circuit area of ​​the terminal area, without bubbles or misalignment, avoiding uneven distribution of conductive particles during subsequent bonding, which could lead to poor contact. After the ACF is attached, the first platform unit 1 carries the silicon-based panel with the ACF attached and moves toward the pre-pressing unit 4, waiting to enter the pre-pressing process.

[0059] At the same time, the target component loading process is initiated simultaneously. Based on the current production plan, the type of target component to be bonded (FPC and / or IC) is determined, and targeted loading is carried out.

[0060] The loading arm 8 picks up the target part from the loading unit 7 according to the preset program, and then moves smoothly along the preset path to the top of the transfer platform 10. The target part is then accurately placed on the preset station of the transfer platform 10, completing the transfer of the target part from "loading unit 7 to transfer platform 10" and realizing seamless and compatible loading of FPC and IC.

[0061] After the loading arm 8 finishes loading, the transfer platform 10 carries the target part along the guide rail to the area below the initial positioning unit 11 to perform the initial positioning step. This process screens out defective target parts in advance, preventing them from entering subsequent processes and assembling with the terminal area of ​​the silicon-based panel, which could lead to the scrapping of the silicon-based panel. The first image processing system of the initial positioning unit 11 first calls up and inputs the standard image template of the current target part (the template includes the outline of the target part, the position of the marker points, and the surface free of foreign objects). Then, the industrial camera of the initial positioning unit 11 takes a picture of the target part on the transfer platform 10 to obtain the actual image of the target part. The first image processing system performs pixel-level comparison between the actual image and the standard image template: on the one hand, it analyzes the positional deviation between the two, such as whether the target part has a positional shift or rotation; on the other hand, it uses grayscale value analysis to detect whether there are foreign objects on the surface of the target part, such as dust, glue residue, etc., and calculates the similarity parameter based on the comparison results. The closer the similarity parameter is to 100%, the closer the target part is to the standard state.

[0062] Specifically, in this embodiment, determining whether the similarity parameter is within the preset acceptable range includes the following steps: If the parameter exceeds the acceptable range (e.g., below 95%), the target part is determined to be defective. The first image processing system sends a signal to the PLC control system, which controls the transfer platform 10 to continue moving to below the pre-pressing head of the pre-pressing unit 4. The pre-pressing head picks up the target part, and the throwing part 12 is driven to move to below the pre-pressing head of the pre-pressing unit 4. Since the pre-pressing head has already picked up the defective target part located on the transfer platform 10, when the throwing part 12 moves to below the pre-pressing head, the pre-pressing head releases the defective piece by breaking the vacuum. The defective product falls to the throwing part 12, which completes the reset and throwing recovery. If the parameter is within the acceptable range (95%-100%), the transfer platform 10 carries the target part to the position where it docks with the pre-pressing unit 4. The pre-pressing head normally picks up the target part and waits for the first platform unit 1 to reach the pre-pressing position.

[0063] When the first platform unit 1 moves the silicon-based panel with attached ACF to the pre-pressing unit 4 and positions it, it then enters the alignment step between the target component and the silicon-based panel before pre-pressing to ensure that the target component and the terminal area of ​​the silicon-based panel are accurately aligned.

[0064] Specifically, the first camera 62 and the second camera 63 are activated sequentially. When the first camera 62 is activated, the first light source 64 is turned on; when the second camera 63 is activated, the second light source 65 is turned on. The first light source 64 and the second light source 65 are activated asynchronously, respectively capturing images of the left and right marking points of the target component and the left and right marking points of the terminal area of ​​the silicon-based panel. These images are transmitted to the second image processing system. The second image processing system analyzes and processes these images, calculates the relative deviation between the target component and the terminal area (such as X-direction offset, Y-direction offset, and Q-angle deviation), and sends an adjustment signal to the PLC controller. The PLC controller controls the drive unit of the first platform unit 1 to perform fine-tuning of the X-direction, Y-direction, and Q-angle deviations until the marking points of the target component and the marking points of the terminal area of ​​the silicon-based panel are completely aligned. Furthermore, in conjunction with the calibration of the first platform unit 1, the mechanical errors of the first platform unit 1 are eliminated, thereby achieving high-precision micron-level alignment and solving the problem of poor circuit contact caused by alignment deviations in traditional equipment.

[0065] After alignment, the pre-pressing head of pre-pressing unit 4 carries the target component to the terminal area of ​​the silicon-based panel for pre-pressing: the pre-pressing head presses down, applying a preset pre-pressing pressure and temperature to the common bonding area of ​​the target component and the terminal area of ​​the silicon-based panel, completing the pre-pressing of the target component and the terminal area, forming a stable semi-finished product, ensuring accurate pre-pressing in subsequent pressing processes, and preventing premature heat damage to the AA area of ​​the silicon-based panel due to excessive pre-pressing pressure or temperature. After the pre-pressing action continues for a preset time, the pre-pressing head lifts back to its original position, completing the pre-pressing step.

[0066] Subsequently, the adapter arm 9 is activated, and its end vacuum nozzle picks up the pre-compressed semi-finished product (the combination of the silicon-based panel and the target component). After visually confirming the position of the second platform unit 2, it smoothly moves onto the bearing surface of the second platform unit 2 and precisely places the semi-finished product. The bearing surface of the second platform unit 2 is equipped with an adsorption platform 23, which only adsorbs and fixes the AA area of ​​the silicon-based panel, avoiding the terminal area. By controlling the vacuum level, the position of the semi-finished product is ensured to be stable, while avoiding the adsorption force acting on the terminal area, which could cause the temporary fixing structure after pre-compression to loosen, and effectively protecting the AA area from external pressure damage.

[0067] The second platform unit 2 carries the semi-finished product along a preset trajectory towards the location of the main pressure unit 5. After moving to the main pressure position of the main pressure unit 5 and accurately positioning it, the main pressure unit 5 starts and performs the final bonding process. Specifically, the main pressure head applies downward pressure, applying a main pressure and temperature higher than the pre-pressure to the terminal area, completing the final bonding between the target part and the terminal area.

[0068] Furthermore, to prevent overheating and heat damage to the AA area of ​​the silicon-based panel, this embodiment preferably includes a simultaneous activation of the heat dissipation system during the pressure test to specifically cool the AA area of ​​the silicon-based panel, balancing the requirements of "high-temperature pressure test in the terminal area" and "low-temperature protection of the AA area." Figure 6-10As shown, the first heat dissipation part 21 of the second platform unit 2 consists of an air blowing block 211 and an air blowing adjustment bracket 212. The vertical height between the air blowing block 211 and the adsorption platform 23 is adjusted by the air blowing adjustment bracket 212 to ensure that the airflow is accurately applied to the AA area. The air blowing block 211 has multiple array-type first air blowing holes 213 on the side facing the adsorption platform 23 to blow room temperature dry airflow into the AA area and remove the surface heat of the AA area. At the same time, the second heat dissipation part 22 includes a temperature sensor embedded in front of the adsorption AA area on the adsorption platform 23 and a temperature sensor opened in the adsorption AA area. The gas channel on platform 23 has a temperature sensor that provides a real-time temperature signal to the temperature controller. When the temperature of the adsorption platform 23 is detected to be higher than the preset target temperature, the temperature controller immediately controls the solenoid valve in the pipeline connected to the compressed air source to open. The airflow enters the gas channel through the inlet channel 221 and is then discharged through the outlet channel 222. The airflow in the gas channel exchanges heat with the adsorption platform 23, thereby absorbing the heat from the adsorption platform 23. The circulating air quickly reduces the temperature of the adsorption platform 23 and the AA zone. In addition, such as Figure 11 As shown, the third heat dissipation part 51 of this pressure unit 5 is composed of an air blowing plate 513 and an air blowing plate adjustment bracket 512. The vertical height and horizontal distance between the air blowing plate 513 and the AA area are adjusted by adjusting the bracket. Multiple strip-shaped second air blowing holes 514 are opened on the side of the air blowing plate 513 facing the AA area to blow directional heat dissipation airflow to the AA area, forming a three-dimensional heat dissipation protection with the first heat dissipation part 21 and the second heat dissipation part 22.

[0069] Through the synergistic effect of the three, the temperature of the AA area can be strictly controlled within a safe range, effectively preventing the high temperature of the pressure from being conducted to the AA area, avoiding performance degradation or permanent damage to the pixel units in the AA area due to the high temperature during bonding, and ensuring that the terminal area completes the ACF curing in a high-temperature environment, thus ensuring bonding reliability.

[0070] After the bonding step is completed (the bonding time is set according to the ACF curing characteristics), the bonding head is lifted and reset. The second platform unit 2 carries the finally bonded silicon-based panel product away from the bonding unit 5 and moves along the guide rail to the unloading or inspection stage. The unloading mechanism picks up the finished product and places it on the conveyor line, which is then sent to the subsequent appearance inspection and electrical performance testing station. At this point, a complete silicon-based panel bonding process is completed.

[0071] Throughout the bonding process, screening for defective target components during the initial positioning stage significantly reduces the scrap rate of semi-finished products. Multi-directional incremental calibration of the first platform unit 1 and the collaborative alignment of the target component and silicon-based panel using dual cameras greatly improve bonding accuracy. The coordinated heat dissipation of three heat sinks resolves the conflict between high-temperature curing and AA area protection. The flexible limiting structure and compatible design of the feeding unit 7 enable seamless production between FPC and IC. These combined designs significantly improve the bonding yield and production efficiency of the equipment, reduce equipment investment and production switchover costs for enterprises, and adapt to the multi-specification, high-reliability production requirements of silicon-based panels.

[0072] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0073] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0074] The above description represents specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A silicon-based panel bonding apparatus, characterized by, The utility model provides a kind of platform unit for carrying silicon-based panel, including first platform unit (1) and second platform unit (2);The first platform unit (1) is switched between attaching unit (3) and pre-pressing unit (4), and the second platform unit (2) is switched between the pre-pressing unit (4) and the pressing unit (5);Positioning unit (6) is equipped below the pre-pressing unit (4), and the pre-pressing unit (4) rear side is equipped with feeding unit (7), and the feeding unit (7) temporarily stores target piece, and adapter platform (10) transports the target piece to the pre-pressing unit (4);The second platform unit (2) includes first heat dissipation part (21) and second heat dissipation part (22), and the pressing unit (5) includes third heat dissipation part (51);The second platform unit (2) includes adsorption platform (23) for adsorbing AA area, and the first heat dissipation part (21) can be on the bottom surface of the adsorption platform (23), and adjacent to the pressing position of the pressing unit (5) carries out heat dissipation cooling;The third heat dissipation part (51) is located between the adsorption platform (23) and the pressing position of the pressing unit (5), and the AA area of the silicon-based panel located on the adsorption platform (23) can be heat dissipation cooling;The second heat dissipation part (22) includes gas passage opened on the adsorption platform (23), and the gas passage can be in flowing medium;Temperature sensing piece is equipped on the adsorption platform (23) in the area where the AA area is located;When the first heat dissipation part (21) and the third heat dissipation part (51) are cooled down or short-term cooling capacity is insufficient, the second heat dissipation part (22) intervenes cooling quickly.

2. The silicon-based panel bonding apparatus of claim 1, wherein The first heat dissipation part (21) includes air blowing block (211) and air blowing adjusting support (212) for adjusting the vertical height of the air blowing block (211), and the air blowing block (211) is located below the adsorption platform (23);A plurality of first air blowing holes (213) are uniformly distributed on the side of the air blowing block (211) towards the adsorption platform (23), and the first air blowing holes (213) are all towards the adsorption area of the adsorption platform (23).

3. The silicon-based panel bonding apparatus of claim 2, wherein The third heat dissipation part (51) includes air blowing plate (513) and air blowing plate adjusting support (512) for adjusting the vertical height and horizontal distance of the air blowing plate (513), and a plurality of second air blowing holes (514) are provided on the side of the air blowing plate (513) towards the AA area, and the second air blowing holes (514) are towards the AA area.

4. The silicon-based panel bonding apparatus of claim 1, wherein The positioning unit (6) includes marble base (61), and a one-piece double-mirror tube lens is fixed on the marble base (61), and a first light source (64) and a second light source (65) are respectively arranged on the two sides of the one-piece double-mirror tube lens;The first camera (62) of the one-piece double-mirror tube lens is used for shooting the mark point of the target piece, and the second camera (63) of the one-piece double-mirror tube lens is used for shooting the mark point of the terminal area of the silicon-based panel.

5. The silicon-based panel bonding apparatus of claim 1, wherein The feeding unit (7) comprises a tray bottom plate (71), and the tray bottom plate (71) is provided with an FPC feeding part (72) and an IC feeding part (73). The IC feeding part (73) comprises a tray positioning piece (732), the tray positioning piece (732) surrounds a tray storage cavity, the two sides of the tray positioning piece (732) are upwardly protruding and higher than the thickness of a tray (731), and the tray positioning piece (732) is further provided with a tray baffle (733). The side of the tray baffle (733) facing the tray (731) is provided with an elastic sheet (734), and the elastic sheet (734) elastically presses the tray (731) in the tray storage cavity to the opposite side.

6. The bonding method of a silicon-based panel bonding apparatus according to any one of claims 1 to 5, wherein The method comprises the following steps: S1, device preparation: including calibrating the first platform unit (1); S2, silicon-based panel feeding and attaching: the first platform unit (1) carries the silicon-based panel to move to the working position of the attaching unit (3), and the terminal area of the silicon-based panel is attached with ACF; S3, target piece feeding: the feeding arm (8) grasps the target piece according to a preset program and places the target piece on a preset station of the transfer platform (10); S4, preliminary positioning: the transfer platform (10) carries the target piece to move directly below the preliminary positioning part (11), and the preliminary positioning part (11) preliminarily positions and detects the position of the target piece; S5, pre-pressing alignment: the transfer platform (10) continues to carry the target piece processed in step S4 to move to the pre-pressing unit (4), and the suction mechanism of the pre-pressing unit (4) grasps the target piece; the silicon-based panel processed in step S2 continues to be moved by the first platform unit (1) to be directly below the pre-pressing unit (4), the first camera (62) and the second camera (63) of the alignment unit (6) respectively acquire images of the mark point of the target piece and the mark point of the terminal area of the silicon-based panel, analyze and process the acquired images to obtain the position deviation value of the mark point of the target piece and the mark point of the terminal area of the silicon-based panel, and control the first platform unit (1) to adjust the alignment; S6, pre-pressing: the pre-pressing unit (4) pre-presses and bonds the target piece and the terminal area of the silicon-based panel to obtain a semi-finished product; S7, semi-finished product transfer: the transfer arm (9) carries the semi-finished product pre-pressed in step S6 to the second platform unit (2); S8, final pressing: the second platform unit (2) moves the semi-finished product to the working position of the final pressing unit (5), and the final pressing unit (5) performs final pressing and bonding on the semi-finished product.

7. The bonding method of the silicon-based panel bonding device according to claim 6, wherein step S4 comprises: S4A: inputting a preset standard image template of the target piece into a first image processing system of the preliminary positioning part (11); S4B: a camera of the preliminary positioning part (11) takes a photo of the target piece on the transfer platform (10) to obtain a first image of the target piece; ​ S4C: the first image processing system performs position deviation analysis and foreign matter inspection on the first image and the standard image template, and evaluates a similarity parameter; S4D: it is judged whether the similarity parameter is within a preset qualified range; if the similarity parameter exceeds the qualified range, the pre-pressing unit (4) and the material throwing part (12) are cooperatively actuated to perform material throwing recycling processing on the target piece; if the similarity parameter does not exceed the qualified range, step S5 is entered.

8. The bonding method of the silicon-based panel bonding apparatus according to claim 7, wherein, Step S1 comprises: S1A: after the first platform unit (1) is moved to a preset position, a second image processing system performs image acquisition on the first platform unit (1), and a first coordinate of the current position is obtained through the second image processing system; S1B: the second image processing system performs increment or decrement processing on the first coordinate data to obtain an increment or decrement coordinate; S1C: the first platform unit (1) continues to move to the position of the increment or decrement coordinate according to the data after the increment or decrement processing, the second image processing system performs image acquisition on the first platform unit (1) to obtain a second coordinate of the position; S1D: it is judged whether the second coordinate deviates from the increment or decrement coordinate; S1E: the deviation is compensated.

9. The bonding method of a silicon-based panel bonding apparatus according to claim 8, wherein, Steps S1B to S1E are repeatedly executed at least twice, and each time step S1B to step S1E is repeated, only one of the coordinate directions is incremented or decremented until the second image processing system determines that the deviation meets the preset requirement, and then the calibration action is ended.

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