Wafer chuck cooling station separation device

Abstract

This invention relates to the field of temporary wafer bonding technology, specifically to a wafer chuck cooling station separation device, which mainly solves the technical problem of the difficulty in separating wafer pairs from wafer chucks in existing cooling station separation devices. The device includes a cooling mechanism, a temperature measuring mechanism, a driving mechanism, a positive pressure separation mechanism, an air blowing separation mechanism, and a lifting mechanism. The cooling mechanism includes a support and a cooling plate, which positions the inner disk of the wafer chuck. The temperature measuring mechanism detects the temperature of the outer ring of the wafer chuck. The driving mechanism actuates the preload lever of the wafer chuck. The positive pressure separation mechanism connects to the adsorption channel of the wafer chuck. The air blowing separation mechanism blows air between the wafer chuck and the wafer pair. The lifting mechanism includes a suction nozzle and a lifting drive component. This device, through the coordinated action of cooling, releasing pressure, edge separation, breaking van der Waals forces, and lifting separation, can achieve safe separation of wafer pairs from the wafer chuck.

Description

Technical Field

[0001] This invention relates to the field of temporary wafer bonding technology, and more particularly to a wafer chuck cooling station separation device. Background Technology

[0002] Temporary wafer bonding refers to the technique of coating a temporary bonding adhesive layer on the surface of an upper wafer and / or a lower wafer, and then cross-linking the temporary bonding adhesive layer through processes such as UV curing and hot pressing, thereby achieving a tight bond between the upper and lower wafers to form a wafer pair. Temporary wafer bonding is generally completed by equipment such as a loading device, an alignment device, a bonding device, and a cooling station separation device. Among them, the cooling station separation device is mainly used to separate the wafer chuck from the bonded wafer pair.

[0003] The existing cooling station separation device has the following defects: because a temporary bonding adhesive layer is coated between the upper and lower wafers, when the upper and lower wafers are bonded and fixed on the wafer chuck, adhesive overflow will occur, resulting in adhesion between the wafer pair and the wafer chuck. At the same time, there are also van der Waals forces between the wafer pair and the wafer chuck, which ultimately makes it difficult to separate the wafer pair from the wafer chuck.

[0004] Therefore, there is an urgent need for a cooling station separation device that can safely separate wafer pairs from wafer chucks. Summary of the Invention

[0005] To overcome the technical shortcomings of existing cooling station separation devices, which make it difficult to separate wafer pairs from wafer chucks, this invention provides a wafer chuck cooling station separation device.

[0006] The wafer chuck cooling station separation device provided by the present invention includes:

[0007] Support platform;

[0008] A gantry frame, which is mounted on the support platform;

[0009] A cooling mechanism includes a support member disposed on the support platform, on which a horizontally arranged cooling plate is mounted, the cooling plate being used to position the inner disk body of the wafer chuck.

[0010] A temperature measuring mechanism is mounted on the support platform and used to detect the temperature of the outer ring of the wafer chuck;

[0011] A drive mechanism, which is mounted on the support platform and used to actuate the preload lever of the wafer chuck;

[0012] A positive pressure separation mechanism is mounted on the support platform and is used to engage the adsorption channel of the wafer chuck when the wafer chuck is positioned and adsorbed onto the cooling plate.

[0013] An air-blowing separation mechanism is mounted on the column of the gantry and is used to blow air between the wafer chuck and the wafer pair;

[0014] The lifting mechanism includes a suction nozzle and a lifting drive component. The fixed part of the lifting drive component is located on the crossbeam of the gantry frame, and the output part extends outward below the crossbeam of the gantry frame. The suction nozzle is installed on the output part of the lifting drive component and is located above the cooling plate.

[0015] Optionally, the support member is a columnar structure and rests on the center of the cooling plate, the cooling plate comprising:

[0016] The chassis has cooling channels on its upper surface, and the inlet and outlet ends of the cooling channels extend to the bottom of the chassis through connectors to connect to a cooling source.

[0017] A top cover fits onto the chassis. The surface of the top cover is provided with positioning pins for positioning the wafer chuck and adsorption parts for adsorbing the wafer chuck. The adsorption parts extend through the chassis to the bottom of the chassis to connect to a negative pressure source.

[0018] Optionally, the cooling channel is circular in shape, and a radially arranged partition bar is provided inside the cooling channel, with the inlet end and outlet end of the cooling channel located on both sides of the partition bar, respectively.

[0019] Optionally, the cooling channel is further provided with a plurality of radially arranged flow equalization strips, which are formed by a plurality of spaced flow equalization blocks.

[0020] Optionally, the temperature measuring mechanism is an infrared temperature measuring head.

[0021] Optionally, the drive mechanism includes:

[0022] A lifting drive unit, the fixed part of which is provided on the support platform;

[0023] A rotary drive pair, the fixed part of which is disposed on the output part of the lifting drive pair;

[0024] The chuck is located on the output part of the rotary drive pair. The chuck moves the preload lever of the wafer chuck through lifting and rotating actions.

[0025] Optionally, the positive pressure separation mechanism includes:

[0026] A bracket, which is mounted on the support platform;

[0027] A vertical cylinder, which is mounted on the bracket and has its bottom for connecting to a positive pressure source;

[0028] The mouthpiece is located at the top of the vertical cylinder.

[0029] Optionally, the air-blowing separation mechanism includes:

[0030] A connecting seat is installed on the column of the gantry and its vertical position is adjustable. The connecting seat is provided with an air intake channel.

[0031] An air blowing head is disposed on the connecting seat and connected to the air intake channel.

[0032] Optionally, the lifting mechanism further includes a mounting plate, and multiple suction nozzles are provided and installed below the mounting plate. A tension sensor is provided between the output part of the lifting drive and the mounting plate.

[0033] Optionally, it also includes an optical alignment mechanism, which comprises:

[0034] An optical transceiver is mounted on the crossbeam with its end facing vertically downwards.

[0035] A reflector is mounted on the support platform and arranged horizontally. The reflector is located directly below the optical transceiver. The reflector and the optical transceiver are used to cooperate with the alignment hole of the wafer chuck to achieve optical alignment.

[0036] The technical solution provided by this invention has the following advantages compared with the prior art:

[0037] The wafer chuck cooling station separation device provided by this invention, through the cooperation of a cooling structure and a temperature measuring mechanism, can reduce the temperature of the wafer chuck to below 60°C. A driving mechanism can actuate the pre-pressure lever of the wafer chuck to release the pre-pressure state on the wafer pair. A positive pressure separation mechanism, in conjunction with the adsorption channel of the wafer chuck, can blow in slightly positive pressure gas to achieve separation of the wafer pair edge from the wafer chuck. A blowing separation mechanism can blow a large flow of gas between the wafer pair and the wafer chuck to break the van der Waals forces between them. A lifting mechanism can lift the wafer pair to achieve final separation from the wafer chuck. This device, through the combined effects of cooling, releasing pressure, edge separation, breaking van der Waals forces, and lifting separation, can achieve safe separation of the wafer pair from the wafer chuck. Attached Figure Description

[0038] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0039] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is a schematic diagram of the structure of the wafer chuck cooling station separation device in an embodiment of the present invention;

[0041] Figure 2 This is an exploded view of the cooling mechanism in an embodiment of the present invention;

[0042] Figure 3 This is a schematic diagram of the drive mechanism in an embodiment of the present invention;

[0043] Figure 4 This is a schematic diagram of the lifting mechanism in an embodiment of the present invention;

[0044] Figure 5 This is a schematic diagram showing the top surface structure of the wafer chuck in an embodiment of the present invention;

[0045] Figure 6 This is a schematic diagram showing the bottom structure of the wafer chuck in an embodiment of the present invention;

[0046] In the picture:

[0047] 1. Support platform; 11. Support column; 12. Platform; 2. Gantry frame; 21. Crossbeam; 22. Column; 3. Cooling mechanism; 31. Support component; 32. Cooling plate; 321. Chassis; 322. Top cover; 323. Cooling channel; 324. Inlet end; 325. Outlet end; 326. Positioning pin; 327. Adsorption section; 328. Separator strip; 329. Flow equalization strip; 4. Temperature measuring mechanism; 5. Drive mechanism; 51. Lifting drive pair; 52. Rotation drive pair; 53. Claw; 6. Positive pressure separation mechanism; 61. Bracket; 62. Vertical cylinder; 63. Nozzle; 7. Air separation mechanism; 71. Connecting seat; 72. Air blowing head; 8. Lifting mechanism; 81. Suction nozzle; 82. Lifting drive component; 83. Mounting plate; 84. Tension sensor; 9. Optical alignment mechanism; 91. Optical transceiver; 92. Reflector;

[0048] 100. Inner disc body; 200. Outer ring frame; 300. Spacer assembly; 400. Pre-compression assembly; 500. Adsorption assembly; 600. Adsorption channel; 700. Adapter assembly; 800. Positioning hole; 900. Alignment hole. Detailed Implementation

[0049] To better understand the above-mentioned objectives, features, and advantages of the present invention, the solutions of the present invention will be further described below. It should be noted that, unless otherwise specified, the embodiments of the present invention and the features thereof can be combined with each other.

[0050] In this description, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0051] Many specific details are set forth in the following description in order to provide a full understanding of the invention, but the invention may also be practiced in other ways different from those described herein; obviously, the embodiments in the specification are only some embodiments of the invention, and not all embodiments.

[0052] Since the wafer chuck cooling station separation device provided in this embodiment is used to separate the wafer chuck from the wafer pair, the design of some structures of this device is related to the wafer chuck structure. In order to clearly understand the structure of the wafer chuck cooling station separation device in this embodiment, the structure of the wafer chuck adapted to the wafer chuck cooling station separation device in this embodiment will be introduced now.

[0053] like Figure 5 and Figure 6 The wafer chuck includes an inner disk body 100 and an outer ring frame 200. The chuck is equipped with a spacer assembly 300, a pre-pressing assembly 400, and an adsorption assembly 500. The spacers of the spacer assembly 300 have a working state above the inner disk body 100 and a clearance state away from the inner disk body 100 by being pulled. The pre-pressing rod of the pre-pressing assembly 400 has a pre-pressing state above the inner disk body 100 and a storage state placed inside the outer ring frame 200 by lifting, lowering, and rotating. The adsorption assembly 500 includes an annular adsorption channel 600 located at the edge of the top surface of the inner disk body 100. The adsorption channel 600 extends to the bottom surface of the outer ring frame 200 through a transition assembly 700. The bottom surface of the inner disk body 100 is also provided with two positioning holes 800, and the edge of the outer ring frame 200 is provided with two alignment holes 900.

[0054] It should be noted that during the bonding process in the previous step, the spacer has already switched from the working state to the avoidance state. Therefore, during the cooling and separation process in this step, only the state switching of the preload rod needs to be completed.

[0055] The following is combined Figures 1 to 4 The specific structure of the wafer chuck cooling station separation device in this embodiment will be described in detail.

[0056] This embodiment provides a wafer chuck cooling station separation device, including a support platform 1, a gantry frame 2, a cooling mechanism 3, a temperature measuring mechanism 4, a driving mechanism 5, a positive pressure separation mechanism 6, an air blowing separation mechanism 7, and a lifting mechanism 8.

[0057] The support platform 1 is mainly used to provide hardware support for other components. Its structure is not limited. For example, in this embodiment, the support platform 1 includes four support columns 11 and a platform 12 fixed to the top of the support columns 11 and arranged horizontally.

[0058] Among them, the gantry frame 2 is set on the support platform 1.

[0059] It is easy to understand that the gantry frame 2 includes a crossbeam 21 and columns 22 connected to the bottom of both ends of the crossbeam 21, with the bottom of the columns 22 fixed to the platform.

[0060] The cooling mechanism 3 includes a support member 31 mounted on the support platform 1, and a horizontally arranged cooling plate 32 mounted on the support member 31. The cooling plate 32 is used to position the inner disk body 100 of the wafer chuck.

[0061] Specifically, in this embodiment, the support member 31 is a columnar structure and is supported at the center of the cooling plate 32. The cooling plate 32 includes a chassis 321 and a top cover 322. A cooling channel 323 is provided on the upper surface of the chassis 321. The inlet end 324 and the outlet end 325 of the cooling channel 323 extend to the bottom of the chassis 321 through a connector to connect to the cooling source. The top cover 322 covers the chassis 321. The surface of the top cover 322 is provided with a positioning pin 326 for positioning the wafer chuck and an adsorption part 327 for adsorbing the wafer chuck. The adsorption part 327 extends through the chassis 321 to the bottom of the chassis 321 to connect to the negative pressure source. In use, the cooling medium enters the cooling channel 323 through the inlet end 324 and then flows out through the outlet end 325, thus forming a circulating cooling system. The adsorption part 327 is connected to a negative pressure source to generate negative pressure, thereby adsorbing and fixing the wafer chuck. The positioning pin 326 is inserted into the positioning hole 800 corresponding to the wafer chuck, thereby achieving precise positioning of the wafer chuck. Water is preferred as the cooling medium, so that the cooling plate 32 is water-cooled. In this embodiment, the cooling mechanism 3 adopts a circulating cooling method, which has a better cooling effect. The support member 31 adopts a columnar structure, which can also reserve more installation space above the support platform 1. In other embodiments, the cooling mechanism 3 can also be designed as a box-shaped structure. The top of the box-shaped structure is provided with a positioning pin 326 and an adsorption part 327, and the wafer chuck is cooled down by the cooling medium inside the box-shaped structure.

[0062] More specifically, in this embodiment, the cooling channel 323 is generally circular, and a radially arranged partition bar 328 is provided inside the cooling channel 323. The inlet end 324 and the outlet end 325 of the cooling channel 323 are located on both sides of the partition bar 328, respectively. The circular cooling channel 323 can fit the inner disk 100 of the wafer chuck, thereby increasing the contact area between the cooling channel 323 and the inner disk 100, and thus improving the cooling effect. The partition bar 328 separates the inlet end 324 and the outlet end 325, so that the cooling medium entering the cooling channel 323 from the inlet end 324 must bypass the partition bar 328 before flowing out from the outlet end 325, so that the cooling medium can fully exchange heat with the wafer chuck, thereby improving the cooling effect. Of course, the cooling channel 323 can also be designed as a strip or other shapes.

[0063] As an improvement to the cooling channel 323, this embodiment further adds a plurality of radially arranged flow equalization strips 329, which are formed by a plurality of spaced flow equalization blocks. The flow equalization strips 329 enable the cooling medium to flow more uniformly, allowing the cooling medium to exchange heat more fully and further improving the cooling effect.

[0064] More specifically, the adsorption unit 327 in this embodiment includes an adsorption plate and a rubber ring disposed around the adsorption plate. The rubber ring enables a sealed connection with the wafer chuck, thereby creating a sealed environment for the adsorption plate. A negative pressure is then generated in this sealed environment through the adsorption holes on the adsorption plate, ultimately using this negative pressure to firmly adsorb the wafer chuck. The number of adsorption units 327 is not limited, for example... Figure 2 There are four adsorption sections 327 spaced apart circumferentially. Of course, the adsorption sections 327 can also be made using a nozzle 81 or other structures.

[0065] The temperature measuring mechanism 4 is installed on the support platform 1 and is used to detect the temperature of the outer ring 200 of the wafer chuck.

[0066] Specifically, the type of temperature measuring mechanism 4 is not limited. For example, in this embodiment, the temperature measuring mechanism 4 is an infrared temperature measuring head.

[0067] It should be noted that the inner disk 100 of the wafer chuck is adsorbed and fixed on the cooling plate 32. Therefore, the temperature of the inner disk 100 of the wafer chuck should be lower than or equal to that of the outer ring 200. When the temperature measuring mechanism 4 detects that the temperature of the outer ring 200 is lower than the target temperature, the temperature of the inner disk 100 will also be lower than the target temperature.

[0068] The drive mechanism 5 is mounted on the support platform 1 and is used to move the preload rod of the wafer chuck.

[0069] It is easy to understand that the design of the drive mechanism 5 should be adapted to the structure of the pre-compression assembly 400 of the wafer chuck. For example, in this embodiment, the drive mechanism 5 includes a lifting drive pair 51, a rotating drive pair 52, and a jaw 53. The fixed part of the lifting drive pair 51 is located on the support platform 1, the fixed part of the rotating drive pair 52 is located on the output part of the lifting drive pair 51, and the jaw 53 is located on the output part of the rotating drive pair 52. The jaw 53 moves the pre-compression rod of the wafer chuck through lifting and rotating actions. The lifting drive pair 51 provides lifting motion for the jaw 53, and the rotating drive pair 52 provides rotating motion for the jaw 53. The jaw 53 drives the pre-compression rod to lift and rotate, thereby realizing the switching of the lifting rod between the pre-compression state and the storage state. Of course, in other embodiments, if the pre-compression assembly 400 of the wafer chuck is designed with other structures, the drive mechanism 5 can be designed accordingly.

[0070] Specifically, the structure of the lifting drive pair 51 and the rotary drive pair 52 is not limited. The lifting drive pair 51 can be a linear power element such as a cylinder or an electric cylinder, and the rotary drive pair 52 can be a rotary power element such as a rotary cylinder or a rotary motor.

[0071] The positive pressure separation mechanism 6 is installed on the support platform 1 and is used to dock with the adsorption channel 600 of the wafer chuck when the wafer chuck is positioned and adsorbed on the cooling plate 32.

[0072] Specifically, the positive pressure separation mechanism 6 in this embodiment includes a support 61, a vertical cylinder 62, and a nozzle 63. The support 61 is mounted on the support platform 1, the vertical cylinder 62 is mounted on the support 61 and its bottom is used to connect to a positive pressure source, and the nozzle 63 is located at the top of the vertical cylinder 62. In use, the bottom end of the vertical cylinder 62 is connected to the positive pressure source, and the positive pressure gas is sequentially blown through the vertical cylinder 62, the nozzle 63, and the adsorption channel 600 of the wafer chuck towards the edge of the wafer pair to achieve separation of the edge of the wafer pair from the wafer chuck.

[0073] It is easy to understand that, in order for the wafer chuck to be adsorbed and fixed on the cooling plate 32, the nozzle 63 can be aligned with the bottom surface of the outer ring frame 200 of the wafer chuck, and the height of the nozzle 63 should be adapted to the cooling plate 32.

[0074] As an improvement to the positive pressure separation mechanism 6, the vertical cylinder 62 can be flexibly installed on the bracket 61. On the one hand, this can reduce the height requirement of the nozzle 63, and on the other hand, it can also press the nozzle 63 against the bottom surface of the outer ring frame 200 of the wafer chuck with a certain pre-tightening force, which is more conducive to ensuring the sealing of the docking.

[0075] The air-blowing separation mechanism 7 is installed on the column 22 of the gantry 2 and is used to blow air between the wafer chuck and the wafer pair.

[0076] Specifically, the air-blowing separation mechanism 7 includes a connecting seat 71 and an air-blowing head 72. The connecting seat 71 is mounted on the column 22 of the gantry 2 and its vertical position is adjustable. The connecting seat 71 has an air inlet channel, and the air-blowing head 72 is located on the connecting seat 71 and connected to the air inlet channel. In use, the air inlet channel is connected to an air source, and the gas is ejected from the air-blowing head 72 after passing through the air inlet channel. The connecting seat 71 is designed to be vertically adjustable, which makes it easier to align the air-blowing head 72 between the wafer pair and the wafer chuck. The structure upon which the position of the connecting seat 71 is adjustable is easily designed by those skilled in the art and will not be described in detail here.

[0077] It should be noted that the air-blowing separation mechanism 7 and the aforementioned positive pressure separation mechanism 6 work together. The positive pressure separation mechanism 6 is used to separate the edges of the wafer pair, while the air-blowing separation mechanism 7 is used to separate the main body of the wafer pair. During operation, the positive pressure separation mechanism 6 should first create a gap between the edges of the wafer pair and the wafer chuck, and then the air-blowing separation mechanism 7 should blow air to completely separate the wafer pair from the wafer chuck. The positive pressure separation mechanism 6 only needs to blow in a slightly positive pressure gas, while the air-blowing separation mechanism 7 needs to blow in a large flow rate of gas.

[0078] The lifting mechanism 8 includes a suction nozzle 81 and a lifting drive 82. The fixed part of the lifting drive 82 is located on the crossbeam 21 of the gantry 2, and the output part extends outward below the crossbeam 21 of the gantry 2. The suction nozzle 81 is installed on the output part of the lifting drive 82 and is located above the cooling plate 32. In use, after the wafer pair and the wafer chuck are completely separated by the positive pressure separation mechanism 6 and the air blowing separation mechanism 7, the lifting drive 82 first drives the suction nozzle 81 to descend and contact the wafer pair. The suction nozzle 81 and the wafer pair are connected by negative pressure adsorption. Then, the lifting drive 82 drives the suction nozzle 81 to rise, thereby realizing the spatial separation of the wafer pair and the wafer chuck.

[0079] Specifically, the lifting drive component 82 can be a linear power element such as a cylinder, electric cylinder, or linear push rod.

[0080] As an improvement to the lifting mechanism 8, the lifting mechanism 8 in this embodiment also includes a mounting plate 83. Multiple suction nozzles 81 are provided and installed below the mounting plate 83. A tension sensor 84 is provided between the output of the lifting drive 82 and the mounting plate 83. The tension sensor 84 allows for precise control of the lifting force exerted by the lifting mechanism 8 on the wafer pair, thereby effectively preventing fragmentation caused by excessive tension.

[0081] In addition, the wafer chuck separation device of this embodiment is further provided with an optical alignment mechanism 9. The optical alignment mechanism 9 includes an optical transceiver 91 and a reflector 92. The optical transceiver 91 is mounted on the crossbeam 21 with its end facing vertically downward. The reflector 92 is mounted on the support platform 1 and arranged horizontally, with the reflector 92 located directly below the optical transceiver 91. The reflector 92 and the optical transceiver 91 are used to cooperate with the alignment hole 900 of the wafer chuck to achieve optical alignment. In use, the optical emitter emits light. If the optical transceiver 91 can receive the reflected light from the reflector 92, it means that the light has passed through the alignment hole 900 of the wafer chuck, thus indicating that the positional accuracy of the wafer chuck meets the requirements. If the optical transceiver 91 does not receive the reflected light from the reflector 92, it means that the wafer chuck is blocking the light, and the light has not passed through the alignment hole 900 of the wafer chuck, indicating that the position of the wafer chuck has a large error.

[0082] It should be noted that, in addition to the optical alignment mechanism 9, the horizontal position accuracy of the wafer chuck can also be determined by the suction part 327 on the aforementioned cooling plate 32: if the negative pressure at the suction part 327 reaches the preset value, it indicates that the suction nozzle 81 is in close contact with the wafer chuck, and the horizontality meets the requirements; if the negative pressure at the suction part 327 fails to reach the preset value, it indicates that the suction nozzle 81 is not in close contact with the wafer chuck, and the wafer chuck has a tilt error. The vacuum level of the suction part 327 and the optical alignment mechanism 9 work together to effectively ensure the positional accuracy of the wafer chuck.

[0083] The working principle of the wafer chuck cooling station separation device in this embodiment is as follows:

[0084] 1) An external robotic arm removes the wafer chuck with the bonded wafer pair from the bonding cavity and places it on the cooling plate 32 of this device, and then the robotic arm retracts.

[0085] 2) The wafer chuck is positioned and adsorbed onto the cooling plate 32 by the adsorption part 327 and the positioning pin 326;

[0086] 3) Under the circulating cooling effect of the cooling plate 32, the temperature of the wafer chuck drops rapidly until the temperature measuring mechanism 4 detects that the temperature of the wafer chuck has dropped below 60°C;

[0087] 4) The lifting mechanism 8 is activated, and the lifting drive component 82 drives the suction nozzle 81 to descend to the top surface of the wafer pair. The suction nozzle 81 adsorbs the wafer pair through negative pressure.

[0088] 5) The drive mechanism 5 is started, outputting lifting and rotational motion, causing the preload lever of the wafer chuck to disengage from the wafer pair and release the preload state;

[0089] 6) The positive pressure separation mechanism 6 is activated, and a slightly positive pressure gas is blown between the wafer edge and the wafer chuck through the adsorption channel 600 of the wafer chuck to achieve separation between the wafer edge and the wafer chuck.

[0090] 7) The air separation mechanism 7 is activated, and a large flow of gas is blown between the wafer pair and the wafer chuck through the air blowing head 72 to break the van der Waals force between the wafer pair and the wafer chuck, thereby realizing the separation of the wafer pair body from the wafer chuck.

[0091] 8) The lifting drive unit 82 lifts the wafer pair through the suction nozzle 81 to achieve safe separation of the wafer pair from the wafer chuck.

[0092] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the present invention. Although detailed descriptions have been provided with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments, and they should all be covered within the protection scope of the claims.

Claims

1. A wafer chuck cooling station separation device, characterized in that, include: Support platform (1); A gantry frame (2) is mounted on the support platform (1); Cooling mechanism (3) includes a support member (31) provided on the support platform (1), and a horizontally arranged cooling plate (32) is installed on the support member (31). The cooling plate (32) is used to position the inner disk body (100) of the adsorbed wafer chuck. Temperature measuring mechanism (4), which is mounted on the support platform (1) and used to detect the temperature of the outer ring frame (200) of the wafer chuck; A drive mechanism (5) is mounted on the support platform (1) and is used to actuate the preload lever of the wafer chuck; Positive pressure separation mechanism (6), which is mounted on the support platform (1) and used to dock with the adsorption channel (600) of the wafer chuck when the wafer chuck is positioned and adsorbed on the cooling plate (32). An air-blowing separation mechanism (7) is installed on the column (22) of the gantry (2) and is used to blow air between the wafer chuck and the wafer pair; The lifting mechanism (8) includes a suction nozzle (81) and a lifting drive (82). The fixed part of the lifting drive (82) is provided on the crossbeam (21) of the gantry frame (2) and the output part extends outward below the crossbeam (21) of the gantry frame (2). The suction nozzle (81) is installed on the output part of the lifting drive (82) and is located above the cooling plate (32).

2. The wafer chuck cooling station separation device according to claim 1, characterized in that, The support member (31) is a columnar structure and is supported at the center of the cooling plate (32), the cooling plate (32) comprising: The chassis (321) has a cooling channel (323) on its upper surface. The inlet end (324) and outlet end (325) of the cooling channel (323) extend to the bottom of the chassis (321) through a connector to connect to the cooling source. A top cover (322) is fitted onto the chassis (321). The surface of the top cover (322) is provided with a positioning pin (326) for positioning the wafer chuck and an adsorption part (327) for adsorbing the wafer chuck. The adsorption part (327) extends through the chassis (321) to the bottom of the chassis (321) to connect to a negative pressure source.

3. The wafer chuck cooling station separation device according to claim 2, characterized in that, The cooling channel (323) is circular in shape, and a radially arranged partition strip (328) is provided inside the cooling channel (323). The inlet end (324) and outlet end (325) of the cooling channel (323) are located on both sides of the partition strip (328).

4. The wafer chuck cooling station separation device according to claim 3, characterized in that, The cooling channel (323) is also provided with a plurality of radially arranged flow equalization strips (329), which are formed by a plurality of spaced flow equalization blocks.

5. The wafer chuck cooling station separation device according to claim 1, characterized in that, The temperature measuring mechanism (4) is an infrared temperature measuring head.

6. The wafer chuck cooling station separation device according to claim 1, characterized in that, The drive mechanism (5) includes: The lifting drive unit (51) has its fixed part located on the support platform (1); A rotary drive pair (52) has its fixed part located on the output part of the lifting drive pair (51); The chuck (53) is located on the output of the rotary drive pair (52). The chuck (53) moves the preload lever of the wafer chuck by lifting and rotating.

7. The wafer chuck cooling station separation device according to claim 1, characterized in that, The positive pressure separation mechanism (6) includes: A bracket (61) is provided on the support platform (1); A vertical cylinder (62) is mounted on the bracket (61) and its bottom is used to connect to a positive pressure source; A mouthpiece (63) is located at the top of the vertical tube (62).

8. The wafer chuck cooling station separation device according to claim 1, characterized in that, The air separation mechanism (7) includes: A connecting seat (71) is installed on the column (22) of the gantry frame (2) and its vertical position is adjustable. The connecting seat (71) is provided with an air intake channel. An air blowing head (72) is provided on the connecting seat (71) and connected to the air intake channel.

9. The wafer chuck cooling station separation device according to claim 1, characterized in that, The lifting mechanism (8) also includes a mounting plate (83), and multiple suction nozzles (81) are provided and installed below the mounting plate (83). A tension sensor (84) is provided between the output part of the lifting drive (82) and the mounting plate (83).

10. The wafer chuck cooling station separation apparatus according to any one of claims 1 to 9, characterized in that, It also includes an optical alignment mechanism (9), which comprises: An optical transceiver (91) is mounted on the crossbeam (21) with its end pointing vertically downwards; A reflector (92) is mounted on the support platform (1) and arranged horizontally. The reflector (92) is located directly below the optical transceiver (91). The reflector (92) and the optical transceiver (91) are used to cooperate with the alignment hole (900) of the wafer chuck to achieve optical alignment.

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