Multi-specification wafer cassette conversion device and method for loading detection of multi-specification wafer cassettes

Abstract

The invention discloses a multi-specification wafer cassette conversion device and a method for loading detection of multi-specification wafer cassettes, the multi-specification wafer cassette conversion device is arranged on a loading platform, and the loading platform is provided with an induction mechanism for inducting whether the wafer cassettes are loaded in place or not. The conversion device comprises a bottom plate placed on the loading platform, a wafer box positioning mechanism is arranged on the side, away from the loading platform, of the bottom plate, and an induction triggering mechanism is arranged on the side, facing the loading platform, of the bottom plate. When the wafer box is placed on the bottom plate, the induction triggering mechanism can trigger the induction mechanism under the self-weight effect of the wafer box. According to the conversion device, the aim of being compatible with the loading requirements of the wafer cassettes of multiple specifications is achieved, the equipment utilization rate is increased, and the production cost is reduced.

Description

TECHNICAL FIELD

[0001] This application is a divisional application of a Chinese invention patent application No. 2022106311691, with the title of "Multi-specification wafer box conversion device", and the filing date of June 6, 2022.

[0002] The present application relates to the technical field of semiconductor processing, in particular to a multi-specification wafer box conversion device and a method for multi-specification wafer box loading detection. BACKGROUND

[0003] The semiconductor industry has developed from the earliest 4-inch, 6-inch, and 8-inch small silicon wafer process to the current mainstream 12-inch large silicon wafer process. Correspondingly, the wafer loading device has also developed from the small silicon wafer loading table for loading 4-inch and 6-inch wafers to the loading table (SMIF Port) for loading 8-inch wafers, and then to the wafer loading machine (Load Port) for loading 12-inch wafers. However, due to the requirements of related processes, some semiconductor production enterprises still retain 8-inch or smaller production processes. In order to improve the utilization rate of equipment, it is necessary to research a conversion device to enable the wafer loading machine for loading 12-inch wafers to load 8-inch or smaller wafers. SUMMARY

[0004] To overcome the above-mentioned shortcomings, the purpose of the present application is to provide a multi-specification wafer box conversion device that is compatible with multi-specification wafer box loading requirements, improves equipment utilization, and reduces production costs.

[0005] In order to achieve the above purposes, the technical scheme adopted by the present application is as follows: a multi-specification wafer box conversion device is arranged on a loading platform, and the loading platform is provided with a sensing mechanism for sensing whether the wafer box is loaded in place. The conversion device includes a bottom plate placed on the loading platform, a wafer box positioning mechanism is arranged on the side of the bottom plate away from the loading platform, and a sensing trigger mechanism is arranged on the side of the bottom plate facing the loading platform; when the wafer box is placed on the bottom plate, the sensing trigger mechanism can trigger the sensing mechanism under the action of the self-weight of the wafer box, and the sensing trigger mechanism includes a rear point trigger plate fixed to the bottom plate, which can directly press on the sensing mechanism when the bottom plate is placed on the loading platform. In use, the bottom plate is placed on the loading platform, then the 8-inch or smaller wafer box is positioned and placed on the bottom plate through the wafer box positioning mechanism, and then the sensing trigger mechanism is used to trigger the sensing mechanism to collect the signal of the wafer box loading.

[0006] The present application has the following advantages: When the small-size (4-inch, 6-inch or 8-inch) wafer box is placed on the loading platform suitable for the 12-inch wafer box, the small-size wafer box cannot contact the sensing mechanism due to the size problem, so that the sensing mechanism cannot know whether the wafer box is loaded. By adding the conversion device on the loading platform, the existing loading platform suitable for the 12-inch wafer box can be compatible with the function of loading the small-size wafer box, meet the demand of loading the wafer box of multiple specifications, and thus improve the utilization rate of the loading platform and reduce the production cost.

[0007] Further, the sensing trigger mechanism comprises a lifting bar and a linkage trigger part. The lifting bar is arranged through the bottom plate and can move up and down along the bottom plate. The upper end of the lifting bar extends out of the upper end surface of the bottom plate and forms a receiving surface for supporting the wafer box. The linkage trigger part is installed on the bottom plate and can trigger the sensing mechanism under the action of the lifting bar.

[0008] When the wafer box is placed on the bottom plate, the wafer box can press against the receiving surface and drive the lifting bar to move down, thereby driving the linkage trigger part to trigger the sensing mechanism. The lifting bar extending out of the upper end surface of the bottom plate can timely know whether there is a wafer box on the bottom plate. If there is a wafer box, the lifting bar can move down under the action of the self-weight of the wafer box and drive the linkage trigger part to trigger the sensing mechanism. If there is no wafer box, the lifting bar remains at the highest point of its movement. At this time, the linkage trigger part cannot trigger the sensing mechanism. Through the cooperation of the lifting bar and the linkage trigger part, the signal of loading the wafer box can be timely transmitted to the sensing mechanism, thereby avoiding the problem that the sensing mechanism cannot be triggered due to the small size of the wafer box.

[0009] Further, the linkage trigger part comprises a linkage rod and a trigger rod which are used in cooperation. The linkage rod and the trigger rod are both pivoted on the bottom plate, and the opposite ends of the linkage rod and the trigger rod abut against each other in the vertical direction. The ends of the linkage rod and the trigger rod away from each other abut against the lifting bar and the sensing mechanism respectively.

[0010] Further, the linkage rod comprises a linkage rod body. One end of the linkage rod body is provided with a supporting table extending towards the trigger rod, and the other end is provided with a linkage protrusion capable of extending into the lower end surface of the lifting bar.

[0011] Further, the trigger rod comprises a trigger rod body. One end of the trigger rod body is provided with a pressing table capable of pressing against the supporting table, and the other end is provided with a trigger protrusion capable of pressing against the sensing mechanism.

[0012] When the wafer box is placed on the bottom plate, the bottom of the wafer box can press against the receiving surface and drive the lifting bar to move down along the through hole. The lifting bar abuts against the linkage protrusion and drives the linkage protrusion to move down, thereby making the linkage rod body rotate and drive the supporting table to move up. The supporting table lifts the pressing table, the trigger rod body rotates and drives the trigger protrusion to move down and press against the sensing mechanism, thereby triggering the sensing mechanism.

[0013] Further, the bottom plate is provided with an installation groove for installing the linkage trigger part and a through hole for the lifting bar to move, and the installation groove and the through hole are communicated with each other.

[0014] Further, the induction trigger mechanism further comprises a lifting limiting plate and a linkage limiting plate, the lifting limiting plate is arranged on the through hole along the lower end surface of the bottom plate, and the linkage limiting plate is arranged on the installation groove along the lower end surface of the bottom plate, and the linkage limiting plate is further provided with an avoiding slot. The lifting limiting plate can limit the downward position of the lifting bar, the linkage limiting plate can limit the rotation range of the trigger rod and the linkage rod, and the avoiding slot can provide space for the action stroke of the trigger rod and the linkage rod.

[0015] Further, the lower end of the lifting bar is further provided with a limiting groove for the linkage trigger part to abut against. The limiting groove can limit the linkage protrusion and ensure the stability of the linkage protrusion during movement.

[0016] Further, the lower end of the lifting bar is further provided with a limiting groove for the linkage trigger part to abut against. The limiting groove can limit the linkage protrusion and ensure the stability of the linkage protrusion during movement.

[0017] Since the existing induction mechanism usually sets three induction points, the induction mechanism can collect the signal of the wafer box loading completion only when the three induction points are triggered at the same time. Since the positions of the three induction points are relatively dispersed, the structure of the whole conversion device is relatively complex when the lifting bar and the linkage trigger part are used to trigger the three induction points. Therefore, in the design, two induction points located on the same straight line are triggered by the structure of the lifting bar and the linkage trigger part, and the other induction point is directly triggered by the rear point trigger plate. That is, when the conversion device is placed on the loading platform, the rear point trigger plate can directly trigger one induction point, and the other two induction points need to be triggered by the cooperation of the lifting bar and the linkage trigger part after the wafer box is loaded. It should be noted that in actual application, the induction points are not limited to three. When the number of induction points is greater than three, the conversion device can still adopt the technical scheme that two induction points located on the same straight line are triggered by the structure of the lifting bar and the linkage trigger part, and the remaining points are triggered by the rear point trigger plate.

[0018] Further, the wafer box positioning mechanism comprises front positioning blocks, side positioning blocks and rear positioning blocks arranged on the bottom plate, and the front positioning blocks, the side positioning blocks and the rear positioning blocks jointly form a placing area for placing the wafer box. In actual arrangement, the positions and the number of the front positioning blocks, the side positioning blocks and the rear positioning blocks can be adjusted according to the size specifications of the wafer box, so that the front positioning blocks, the rear positioning blocks and the side positioning blocks can abut against the wafer box to position the wafer box when the wafer box is placed in the placing area.

[0019] Further, the bottom plate is also symmetrically provided with a handle for convenient taking.

[0020] The application further discloses a method for loading detection of multi-specification wafer boxes, which is realized based on the aforementioned multi-specification wafer box conversion device. The sensing mechanism comprises one rear sensing point and two side sensing points arranged on the loading platform. The rear sensing point and the two side sensing points are matched with the large-size wafer box. When the large-size wafer box is loaded, it is directly placed on the loading platform, and the bottom of the large-size wafer box can simultaneously trigger the sensing mechanism. When a wafer box smaller than the large-size wafer box is loaded, the wafer box is placed on the bottom plate on the loading platform. The side of the bottom plate away from the loading platform is provided with a wafer box positioning mechanism, and the side of the bottom plate facing the loading platform is provided with a sensing trigger mechanism. When the wafer box is placed on the bottom plate, the sensing trigger mechanism can trigger the rear sensing point and the two side sensing points of the sensing mechanism under the self-weight action of the wafer box. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 FIG. 1 is a structural schematic view of a loading platform of an embodiment of the application; Figure 2 FIG. 2 is a structural schematic view of the front side of a bottom plate of an embodiment of the application; Figure 3 FIG. 3 is a structural schematic view of the back side of the bottom plate of an embodiment of the application; Figure 4 FIG. 4 is a structural schematic view of a sensing trigger mechanism of an embodiment of the application; Figure 3 FIG. 5 is a partial enlarged view of part A in FIG. 4; Figure 5 FIG. 6 is a structural schematic view of a conversion device of an embodiment of the application when the conversion device is not loaded with a wafer box; Figure 6 FIG. 7 is a sectional view of the conversion device of an embodiment of the application in the direction of A-A in FIG. 6; Figure 7 FIG. 8 is a sectional view of the conversion device of an embodiment of the application in the direction of B-B in FIG. 6; Figure 6 FIG. 9 is a sectional view of the conversion device of an embodiment of the application in the direction of C-C in FIG. 6; Figure 8 Figure 7 FIG. 10 is a partial enlarged view of part B in FIG. 9; Figure 9 FIG. 11 is a sectional view of the conversion device of an embodiment of the application when the conversion device is loaded with a wafer box;​ Figure 10 For Figure 9 Local enlarged view of middle C part.

[0022] In the figure: 1-loading platform; 2-wafer box; 3-sensing mechanism; 31-rear sensing point; 32-lateral sensing point; 4-bottom plate; 41-through hole; 411-stop ring plate; 42-mounting groove; 5-wafer box positioning mechanism; 51-front positioning block; 52-lateral positioning block; 53-rear positioning block; 61-rear point trigger plate; 62-linkage trigger part; 621-linkage rod; 6211-linkage rod body; 6212-stand; 6213-linkage protrusion; 622-trigger rod; 6221-trigger rod body; 6222-pressing table; 6223-trigger protrusion; 63-lifting bar; 631-annular flange; 632-limiting groove; 64-lifting limiting plate; 65-linkage limiting plate; 651-avoidance slot; 7-grip. DETAILED DESCRIPTION The preferred embodiments of the present application will be described in detail below with reference to the accompanying drawings, so that the advantages and features of the present application can be more easily understood by those skilled in the art, and the scope of protection of the present application can be more clearly defined.

[0023] Embodiment Referring to the accompanying drawings, Figures 1-10 A multi-specification wafer box conversion device of the present application is arranged on a loading platform 1, and the loading platform 1 is provided with a sensing mechanism 3 for sensing whether the wafer box 2 is loaded in place. The conversion device includes a bottom plate 4 placed on the loading platform 1, and the upper end of the bottom plate 4 (i.e. the side of the bottom plate 4 away from the loading platform 1) is provided with a wafer box positioning mechanism 5, and the lower end of the bottom plate 4 (i.e. the side of the bottom plate 4 facing the loading platform 1) is provided with a sensing trigger mechanism. When the wafer box 2 is placed on the bottom plate 4, the sensing trigger mechanism can trigger the sensing mechanism 3 under the weight of the wafer box 2.

[0024] It should be noted that the loading platform 1 and the sensing mechanism 3 are prior art, and are suitable for loading 12-inch wafer boxes, wherein, referring to the accompanying drawings, Figure 1As shown, the sensing mechanism 3 includes one rear sensing point 31 and two side sensing points 32 arranged on the loading platform 1. When the 12-inch wafer box is placed on the loading platform 1, the bottom of the 12-inch wafer box can simultaneously trigger the rear sensing point 31 and the side sensing points 32, so that the sensing mechanism 3 collects the signal of the wafer box loading completion. However, due to the size, when the 8-inch or smaller wafer box is directly placed on the loading platform 1, it cannot trigger the rear sensing point 31 and the side sensing points 32, so that the sensing mechanism 3 cannot know whether the wafer box is loaded. Therefore, the conversion device of the embodiment first positions and places the 8-inch or smaller wafer box on the bottom plate 4 through the wafer box positioning mechanism 5, and then triggers the rear sensing point 31 and the side sensing points 32 of the sensing mechanism 3 through the sensing trigger mechanism, so that the sensing mechanism 3 collects the signal of the wafer box loading, thereby enabling the existing loading platform suitable for 12-inch wafer boxes to be used for loading 8-inch or smaller wafer boxes.

[0025] In an example, referring to the accompanying drawings Figure 3 As shown, the sensing trigger mechanism includes a rear point trigger plate 61, a linkage trigger part 62, and a lifting bar 63. The rear point trigger plate 61 is fixedly connected to the bottom plate 4 and used to press the rear sensing point 31. The linkage trigger part 62 is arranged one-to-one corresponding to the side sensing points 32 and can press the corresponding side sensing points 32 under the action of the lifting bar 63. The lifting bar 63 is arranged through the bottom plate 4 and can move up and down along the bottom plate 4. The upper end of the lifting bar 64 extends out of the upper end surface of the bottom plate 4 and forms a receiving surface for supporting the wafer box 2. When the wafer box 2 is placed on the bottom plate 4, the wafer box 2 can press the receiving surface and drive the lifting bar 64 to move downward, thereby driving the linkage trigger part 62 to press the corresponding side sensing points 32 and trigger the side sensing points 32.

[0026] In order to realize the installation of the sensing trigger mechanism, a through hole 41 is formed through the upper and lower end surfaces of the bottom plate 4, and a mounting groove 42 corresponding to the linkage trigger part 62 is formed in the lower end of the bottom plate 4, and the mounting groove 42 is in communication with the through hole 41. During installation, the lifting bar 63 is arranged in the through hole 41 and can move up and down along the through hole 41. The linkage trigger part 62 is installed in the corresponding mounting groove 42, and one end thereof extends to the corresponding side sensing point 32, and the other end thereof extends into the through hole 41 and abuts against the lower end surface of the lifting bar 63. The communication between the mounting groove 42 and the through hole 41 enables one lifting bar 63 to drive two linkage trigger parts 62 to act simultaneously.

[0027] In an example, referring to the accompanying drawings Figure 5 , 8As shown, the linkage triggering unit 62 includes a linkage rod 621 and a trigger rod 622 for cooperative use. The linkage rod 621 includes a linkage rod body 6211 pivotally connected in the mounting groove 42. One end of the linkage rod body 6211 is integrally provided with a support platform 6212 extending towards the trigger rod 622, and the other end is integrally provided with a linkage protrusion 6213 that can extend into the through hole 41. The trigger rod 622 includes a trigger rod body 6221 pivotally connected in the mounting groove 42. One end of the trigger rod body 6221 is integrally provided with a pressing platform 6222 that presses against the support platform 6212, and the other end is integrally provided with a trigger protrusion 6223 that can abut against the side sensing point 32.

[0028] See appendix Figures 7-8 As shown, in the initial state, the wafer cassette 2 is not placed on the base plate 4, and the lifting bar 63 is at its highest point. When the base plate 4 is placed on the loading platform 1, the rear point trigger plate 61 can press against the rear sensing point 31 and directly trigger the rear sensing point 31. Although the trigger bump 6223 abuts against the side sensing point 32, its pressure on the side sensing point 32 is insufficient to trigger the side sensing point 32. See Appendix Figures 9-10 As shown, when the wafer cassette 2 is placed on the base plate 4, the bottom of the wafer cassette 2 can press against the receiving surface and drive the lifting bar 63 to move down along the through hole 41. The lifting bar 63 then presses against the linkage protrusion 6213 and drives the linkage protrusion 6213 to move down, thereby causing the linkage rod body 6211 to rotate and drive the support platform 6212 to move up. The support platform 6212 then lifts the pressure platform 6222. The trigger rod body 6221 rotates and drives the trigger protrusion 6223 to move down and press against the corresponding side sensing point 32, thereby triggering the side sensing point 32.

[0029] See Appendix for one example. Figures 3-4 As shown, the sensing trigger mechanism 6 also includes a lifting limit plate 64 and a linkage limit plate 65. The lifting limit plate 64 covers the through hole 41 along the lower end face of the base plate 4 to limit the movement range of the lifting bar 63. The linkage limit plate 65 is provided one-to-one with the mounting groove 42 and covers the corresponding mounting groove 42 along the lower end face of the base plate 4 to limit the corresponding linkage trigger part 62. In addition, in order to avoid the linkage limit plate 65 affecting the movement stroke of the linkage trigger part 62, an avoidance slot 651 is also provided on the linkage limit plate 65. When the lifting bar 63 is at the highest point of movement, the support platform 6212 and the pressure platform 6222 are partially located in the avoidance slot 651. In this embodiment, the lifting limit plate 64 and the linkage limit plate 65 are both fixed to the lower end face of the base plate by screws.

[0030] In one example, to prevent the lifting bar 63 from slipping out of the through hole 41, an annular flange 631 is integrally provided on the lower end side wall of the lifting bar 63, and a stop ring plate 411 that can abut against the annular flange 631 is integrally provided on the upper end inner wall of the through hole 41. In addition, in order to limit the linkage protrusion 6213, a limiting groove 632 for the linkage protrusion 6213 to abut is also provided at the lower end of the lifting bar 63.

[0031] See Appendix for one example. Figure 2 As shown, the wafer cassette positioning mechanism 5 includes a front positioning block 51, a side positioning block 52, and a rear positioning block 53 disposed on the base plate 4. The front positioning block 51, side positioning block 52, and rear positioning block 53 together form a placement area for placing the wafer cassette 2. In actual installation, the position and number of the front positioning block 51, side positioning block 52, and rear positioning block 53 can be adjusted according to the size specifications of the wafer cassette to ensure that when the wafer cassette is placed in the placement area, the front positioning block 51, rear positioning block 52, and side positioning block 53 can all abut against the wafer cassette 2 to position it. In this embodiment, the rear positioning block 53 is arranged in a strip shape, and only one is provided. Four side positioning blocks 52 are provided, and two front positioning blocks 51 are provided. It should be noted that the lifting bar 63 is arranged within the placement area to ensure that when the wafer cassette 2 is placed in the placement area, the lifting bar 63 can be moved. In one example, the front positioning block 51, the side positioning block 52, and the rear positioning block 53 can all be connected to the base plate via a fine-tuning part. Taking the front positioning block 51 as an example, the fine-tuning part includes an oblong hole formed on the front positioning block 51, and a fine-tuning screw that can be threaded into the base plate 4 passes through the oblong hole. The oblong hole and the fine-tuning screw allow for fine-tuning of the installation position of the front positioning block 51 on the base plate 4, thereby improving installation accuracy.

[0032] In one example, to facilitate the loading and unloading of the base plate 4 from the loading platform 1, handles 7 are symmetrically provided on the upper end of the base plate 4.

[0033] The specific working process of this embodiment is as follows: See appendix Figures 7-8As shown, when the base plate 4 without wafer cassette 2 is placed on the loading platform 1, the rear trigger plate 61 can directly press against the rear sensing point 31 and trigger the rear sensing point 31. The trigger bump 6223 abuts against the corresponding side sensing point 32. Since the trigger rod body 6221 is pivotally connected in the mounting groove 42, the trigger bump 6223 can be pushed upward with the support of the side sensing point 32. The pressure table 6222 then presses downward against the support table 6212, thereby causing the linkage bump 6213 to push the lifting bar 63 upward, so that the lifting bar 63 moves to the highest position. At this time, only the rear sensing point 31 is triggered, while the side sensing points 32 are not triggered. Therefore, the sensing mechanism 3 will not collect the wafer cassette loading signal. See Appendix Figures 9-10 As shown, when the wafer cassette 2 is placed in the placement area under the limiting of the wafer cassette positioning mechanism 5, the bottom of the wafer cassette 2 can abut against the receiving surface. Due to the weight of the wafer cassette 2, the lifting bar 63 moves down along the through hole 41 and drives the linkage protrusion 6213 to move down. The support platform 6212 then pushes the pressure platform 6222 upward and drives the trigger protrusion 6223 to move down and press against the side sensing point 32. The side sensing point 32 is then triggered. At this time, both the rear sensing point 31 and the side sensing point 32 are triggered, and the sensing mechanism 3 then collects the signal that the wafer cassette loading is complete.

[0034] The above embodiments are only for illustrating the technical concept and features of the present invention. Their purpose is to enable those skilled in the art to understand the content of the present invention and implement it. They should not be used to limit the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A multi-specification wafer cassette conversion device, disposed on a loading platform, wherein the loading platform is provided with a sensing mechanism for sensing whether the wafer cassette is loaded into position; characterized in that: The system includes a base plate placed on the loading platform. A wafer cassette positioning mechanism is provided on the side of the base plate away from the loading platform, and a sensing trigger mechanism is provided on the side of the base plate facing the loading platform. When the wafer cassette is placed on the base plate, the sensing trigger mechanism can be triggered by the weight of the wafer cassette. The sensing trigger mechanism includes a rear position trigger plate fixed to the base plate. When the base plate is placed on the loading platform, the rear position trigger plate can directly press against the sensing mechanism.

2. The multi-specification wafer cell conversion device according to claim 1, characterized in that: The sensing triggering mechanism includes a lifting bar and a linkage triggering part; the lifting bar is disposed through the base plate and can move up and down along the base plate; and the upper end of the lifting bar extends out of the upper end surface of the base plate and forms a receiving surface for supporting the wafer cassette; the linkage triggering part is installed on the base plate and can trigger the sensing mechanism under the action of the lifting bar.

3. The multi-specification wafer cell conversion device according to claim 2, characterized in that: The linkage triggering unit includes a linkage rod and a trigger rod used in conjunction. The linkage rod and the trigger rod are both pivotally connected to the base plate, and the opposite ends of the linkage rod and the trigger rod abut against each other in the vertical direction. The ends of the linkage rod and the trigger rod that are far apart from each other abut against the lifting bar and the sensing mechanism, respectively.

4. The multi-specification wafer cell conversion device according to claim 3, characterized in that: The linkage rod includes a linkage rod body, one end of which is provided with a support extending toward the trigger rod, and the other end is provided with a linkage protrusion that can extend into the lower end face of the lifting bar.

5. The multi-specification wafer cell conversion device according to claim 4, characterized in that: The trigger rod includes a trigger rod body, one end of which is provided with a pressure plate that can press against the support platform, and the other end is provided with a trigger protrusion that can press against the sensing mechanism.

6. The multi-specification wafer cell conversion device according to any one of claims 2-5, characterized in that: The lower end surface of the base plate is provided with a mounting groove for mounting the linkage trigger and a through hole for moving the lifting bar, and the mounting groove and the through hole are interconnected.

7. The multi-specification wafer cell conversion device according to claim 6, characterized in that: The sensing triggering mechanism also includes a lifting limit plate and a linkage limit plate. The lifting limit plate covers the through hole along the lower end face of the base plate. The linkage limit plate covers the mounting groove along the lower end face of the base plate, and the linkage limit plate is also provided with an avoidance groove.

8. The multi-specification wafer cell conversion device according to claim 6, characterized in that: An annular flange is integrally provided on the lower end side wall of the lifting bar, and a stop ring plate is integrally provided on the upper end inner wall of the through hole, which can be abutted against by the annular flange.

9. The multi-specification wafer cell conversion device according to claim 8, characterized in that: The lower end of the lifting bar is also provided with a limiting groove for the linkage triggering part to abut against.

10. A method for multi-specification wafer cell loading and inspection, implemented based on the multi-specification wafer cell conversion device according to any one of claims 1-9. Its features are: The sensing mechanism includes a rear sensing point and two side sensing points disposed on the loading platform. The rear sensing point and the two side sensing points are matched with the large-size wafer cassette. When loading the large-size wafer cassette, it is placed directly on the loading platform, and the bottom of the large-size wafer cassette can simultaneously trigger the sensing mechanism. When loading wafer cassettes smaller than the large size, the wafer cassettes are placed on a base plate located on the loading platform. A wafer cassette positioning mechanism is provided on the side of the base plate away from the loading platform, and a sensing trigger mechanism is provided on the side of the base plate facing the loading platform. When the wafer cassettes are placed on the base plate, the sensing trigger mechanism can trigger the rear sensing point and two side sensing points of the sensing mechanism under the weight of the wafer cassettes.

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