Wafer adjusting device

Abstract

The invention discloses a wafer adjusting device which comprises a fixing frame, a middle connecting frame is sleeved and fixedly installed in the fixing frame, an adjusting frame is sleeved in the middle connecting frame, and the outer wall of the adjusting frame is in spherical surface fit with the inner wall of the middle connecting frame. An air suction type fixing structure is arranged between the middle connecting frame and the adjusting frame. During adjustment in the Z-axis direction, the end of the adjusting frame can abut against a reference component arranged above the end of the adjusting frame, and in the abutting process, the adjusting frame slides in the middle connecting frame through spherical surface matching of the adjusting frame and the middle connecting frame till the end face of the adjusting frame is parallel to the reference component; and then the adjusting frame is fixed through the air suction type fixing structure. The device is simple in structure, rapid and convenient in parallelism adjustment, and reliable and stable in fixation after adjustment, achieves the purposes of adjusting the position of a plane where a wafer is located and keeping the wafer parallel to a photoetching plate, and lays a foundation for guaranteeing the process effects of exposure, photoetching and the like and the product quality.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of parallelism adjustment, and particularly relates to a wafer adjustment device. BACKGROUND

[0002] At present, in the process of exposure and other processes of wafers, the wafer is directly moved to a fixed platform, and then the position of the wafer in XYZ three directions is adjusted through fine adjustment equipment below the fixed platform, and then the exposure and other processes can be carried out. The defects of this method are as follows:

[0003] Whether the wafer and the photoetch plate arranged above the fixed platform are parallel cannot be guaranteed, thereby affecting the effect of exposure, photoetching and other processes, and further affecting the quality of the final product. SUMMARY

[0004] The present application provides a wafer adjustment device to adjust the plane position of the wafer and keep the wafer parallel to the photoetch plate.

[0005] To solve the above technical problems, the technical scheme of the present application is as follows: a wafer adjustment device, comprising a fixed frame, an intermediate adapter frame is sleeved in and fixedly installed in the fixed frame, an adjustment frame is sleeved in the intermediate adapter frame, the outer wall of the adjustment frame and the inner wall of the intermediate adapter frame are spherical surface matched, and a gas suction type fixing structure is arranged between the intermediate adapter frame and the adjustment frame.

[0006] As an improvement, the gas suction type fixing structure comprises a gas groove arranged on the inner wall of the intermediate adapter frame, and the gas groove extends along the inner wall of the intermediate adapter frame in a circumferential annular shape.

[0007] A first air suction hole in communication with the gas groove is further arranged on the intermediate adapter frame.

[0008] As a further improvement, the adjustment frame and the fixed frame are both hollow structures, and an elastic support adjustment mechanism is arranged between the adjustment frame and the fixed frame.

[0009] As a further improvement, the elastic support adjustment mechanism comprises an adjustment disc arranged on the adjustment frame and a connecting disc arranged on the fixed frame, a plurality of support columns are arranged circumferentially between the adjustment disc and the connecting disc, and limit stop rings are arranged at both ends of the support columns.

[0010] Two shaft sleeves are sleeved on the support columns between the adjustment disc and the connecting disc, and an elastic element is sleeved on the support columns between the two shaft sleeves.

[0011] An active adjustment structure is arranged between the shaft sleeve close to the adjustment disc, the support column and the adjustment disc.

[0012] As a further improvement, the activity adjustment structure comprises a spherical protrusion arranged on the adjustment disc, which is matched with the spherical surface of the shaft sleeve;

[0013] The adjustment disc is provided with a through hole for the support column to pass through, and the diameter of the through hole is larger than the diameter of the support column.

[0014] As a further improvement, the spherical protrusion is integrally formed on the adjustment disc, and the adjustment disc is integrally formed on the adjustment frame; and the connecting disc is integrally formed on the fixed frame.

[0015] As a further improvement, the support column is provided with three support columns arranged in a circular array.

[0016] As a further improvement, the fixed frame is provided with a blocking disc arranged away from the adjustment frame.

[0017] As a further improvement, the inner wall of the adjustment frame is provided with a plurality of first air pipe joints, and the end surface of the adjustment frame is provided with a second air suction hole in communication with the first air pipe joints.

[0018] As a further improvement, the end of the intermediate adapter frame in the fixed frame is provided with a second air pipe joint in communication with the first air suction hole.

[0019] After the above technical scheme is adopted, the effects of the present application are as follows:

[0020] Since the adjustment device comprises a fixed frame, an intermediate adapter frame is sleeved and fixedly installed in the fixed frame, the adjustment frame is sleeved in the intermediate adapter frame, the outer wall of the adjustment frame is matched with the inner wall of the intermediate adapter frame in a spherical surface, and the air suction type fixing structure is arranged between the intermediate adapter frame and the adjustment frame, based on the above structure, the adjustment device is fixed on the fine adjustment platform and rotated and adjusted in three directions of XYZ when in use. When adjusted in the Z-axis direction, the end of the adjustment frame abuts against the reference component (the reference component is a photolithography plate frame in the wafer exposure process) arranged above it. In the abutting process, the adjustment frame slides in the intermediate adapter frame through the spherical surface matching of the adjustment frame and the intermediate adapter frame, until the end surface of the adjustment frame is parallel to the reference component, and then the adjustment frame is fixed by the air suction type fixing structure. In summary, the adjustment device has the advantages of simple structure, rapid and convenient parallelism adjustment, reliable and stable fixed adjustment, and the purpose of adjusting the position of the wafer plane and keeping the wafer parallel to the photolithography plate is achieved, which lays a foundation for ensuring the effect of exposure, photolithography and other processes and the quality of products.

[0021] The air suction type fixing structure comprises an air groove arranged on the inner wall of the intermediate connecting frame, which extends along the inner wall of the intermediate connecting frame in a circular ring shape; and a first air suction hole in communication with the air groove is arranged on the intermediate connecting frame, so that when the adjusting frame is fixed, the negative pressure is generated in the air groove through the cooperation of the air groove and the first air suction hole, and the adjusting frame is negatively adsorbed, so that the adjusting frame can be reliably and stably fixed during work.

[0022] The adjusting frame and the fixing frame are both hollow structures, and the elastic supporting and adjusting mechanism is arranged between the adjusting frame and the fixing frame, so that the weight is effectively reduced through the hollow structure, and the adjustment of the adjusting frame is facilitated; the adjusting frame is supported through the elastic supporting and adjusting mechanism, and the elastic buffer is provided when the adjusting frame abuts against the reference component, so that the safety protection is achieved.

[0023] The elastic supporting and adjusting mechanism comprises an adjusting disc arranged on the adjusting frame and a connecting disc arranged on the fixing frame, a plurality of supporting columns are arranged in a circular ring shape between the adjusting disc and the connecting disc, limit stop rings are arranged at both ends of the supporting columns, two shaft sleeves are sleeved on the supporting columns between the adjusting disc and the connecting disc, and elastic elements are sleeved on the supporting columns between the two shaft sleeves; the shaft sleeve, the supporting column and the adjusting disc are provided with a movable adjusting structure close to the adjusting disc, so that the elastic buffer and the supporting effect are achieved through the cooperation of the supporting column, the shaft sleeve and the elastic elements; the movable adjusting structure is followed when the position of the adjusting disc is adjusted, so that the hard connection is avoided to affect the position adjustment of the adjusting disc.

[0024] The movable adjusting structure comprises a spherical protrusion arranged on the adjusting disc, the spherical protrusion is matched with the spherical surface of the shaft sleeve, a through hole is arranged on the adjusting disc for the supporting column to pass through, and the diameter of the through hole is greater than the diameter of the supporting column, so that the interference between the supporting column and the adjusting disc is avoided through the large-diameter through hole when the adjusting disc is in action, and the movement space of the adjusting disc is provided, and the spherical protrusion and the shaft sleeve are matched with each other to change with the movement of the adjusting disc, so that the elastic supporting is achieved, and the interference with any component is avoided during the adjustment of the adjusting disc.

[0025] The spherical protrusion is integrally formed on the adjusting disc, the adjusting disc is integrally formed on the adjusting frame, and the connecting disc is integrally formed on the fixing frame, so that the structural strength is ensured through the integrally formed structure, and the long-term stability of the cooperation between the components is ensured during work.

[0026] The supporting column is arranged in a circular ring shape, so that the supporting effect is ensured, and the structure is effectively simplified.

[0027] The fixed frame is provided with a baffle plate arranged away from the adjusting frame, which blocks the supporting column through the baffle plate, avoids the supporting column from being separated or fallen off due to vibration in work, and effectively ensures the fixing of the working position of the supporting column.

[0028] The inner wall of the adjusting frame is provided with a plurality of first air pipe joints, and the end face of the adjusting frame is provided with a second air suction hole in communication with the first air pipe joints, so that the wafer or the carrier carrying the wafer is sucked through the second air suction hole, the air pipe line in communication with the first air pipe joints is arranged in the adjusting frame and the fixed frame, the overall structure is simple and tidy, and the problem of interference between the air pipe line and other structures in work is effectively avoided.

[0029] The end of the intermediate adapter frame in the fixed frame is provided with a second air pipe joint in communication with the first air suction hole, so that the air pipe line in communication with the second air pipe joint is arranged in the fixed frame, the overall structure is simple and tidy, and the problem of interference between the air pipe line and other structures in work is effectively avoided. BRIEF DESCRIPTION OF DRAWINGS

[0030] The application will be further described below in combination with the drawings and examples.

[0031] Figure 1 is a structural schematic diagram of the application;

[0032] Figure 2 is Figure 1 is a structural schematic diagram of the application from another angle;

[0033] Figure 3 is Figure 1 is a sectional view of the application;

[0034] Figure 4 is Figure 3 is a structural schematic diagram of the intermediate adapter frame in the application;

[0035] Figure 5 is Figure 3 is an enlarged view of A in the application;

[0036] In the application, 1 is a fixed frame, 101 is a connecting disc, 2 is an intermediate adapter frame, 201 is a gas groove, 202 is a first air suction hole, 203 is a second air pipe joint, 3 is an adjusting frame, 301 is an adjusting disc, 302 is a supporting column, 303 is a limiting baffle ring, 304 is a shaft sleeve, 305 is an elastic element, 306 is a spherical protrusion, 307 is a through hole, 308 is a first air pipe joint, 309 is a second air suction hole, 4 is a movable adjusting structure, and 5 is a baffle plate. DETAILED DESCRIPTION

[0037] The application will be further described in detail below with specific examples.

[0038] As Figures 1 to 3 As shown in the drawings, a wafer adjusting device comprises a fixed frame 1, an intermediate adapter frame 2 sleeved in the fixed frame 1 and fixedly installed in the fixed frame 1, and an adjusting frame 3 sleeved in the intermediate adapter frame 2. The outer wall of the adjusting frame 3 and the inner wall of the intermediate adapter frame 2 are spherical surface matched (i.e. the outer wall of the adjusting frame 3 and the inner wall of the intermediate adapter frame 2 are both provided with spherical surfaces), and the intermediate adapter frame 2 and the adjusting frame 3 are provided with air suction type fixing structure. Preferably, the fixed frame 1, the adjusting frame 3 and the intermediate adapter frame 2 are all cylindrical hollow structures, and the adjusting frame 3 and the fixed frame 1 are provided with elastic support adjusting mechanism.

[0039] The air suction type fixing structure comprises an air groove 201 provided on the inner wall of the intermediate adapter frame 2, which extends along the inner wall of the intermediate adapter frame 2 in a circumferential annular shape. The intermediate adapter frame 2 is also provided with a first air suction hole 202 (see Figure 4 ) communicating with the air groove 201. The end of the intermediate adapter frame 2 located in the fixed frame 1 is provided with a second air pipe joint 203, which communicates with the first air suction hole 202.

[0040] The elastic support adjusting mechanism comprises an adjusting disc 301 integrally formed on the adjusting frame 3 and a connecting disc 101 integrally formed on the fixed frame 1. A plurality of support columns 302 are circumferentially arranged between the adjusting disc 301 and the connecting disc 101. The two ends of the support column 302 are both provided with a limiting stop ring 303. The limiting stop ring 303 can also be a connecting member such as a bolt or a screw threadedly installed on the support column 302. In the present scheme, the support column 302 is provided with three support columns arranged in a circumferential annular array. Two shaft sleeves 304 are sleeved on the support column 302 between the adjusting disc 301 and the connecting disc 101. An elastic element 305 (such as a tension spring) is sleeved on the support column 302 between the two shaft sleeves 304. An active adjusting structure 4 is arranged between the shaft sleeve 304 close to the adjusting disc 301, the support column 302 and the adjusting disc 301.

[0041] The active adjusting structure 4 comprises a spherical protrusion 306 integrally formed on the adjusting disc 301, which is spherical surface matched with the shaft sleeve 304. The adjusting disc 301 is provided with a through hole 307 through which the support column 302 passes. The diameter of the through hole 307 is greater than the diameter of the support column 302 (see Figure 5 ).

[0042] In the present scheme, the fixed frame 1 is provided with a stop disc 5 arranged on the side away from the adjusting frame 3. The inner wall of the adjusting frame 3 is provided with a plurality of first air pipe joints 308. The end face of the adjusting frame 3 is provided with a second air suction hole 309 communicating with the first air pipe joints 308.

[0043] The above-described embodiments are only preferred embodiments of the present application and are not intended to limit the scope of the present application. Various modifications and alterations of the present application can be made without departing from the spirit of the present application, and such modifications and alterations are intended to fall within the scope of the present application as defined by the appended claims.

Claims

1. A wafer adjusting device comprising a fixing frame, characterized in that: The fixed frame is sleeved with an intermediate adapter frame, and the intermediate adapter frame is sleeved with an adjusting frame.

2. The adjustment device of claim 1, wherein: The air suction type fixing structure comprises air grooves arranged on the inner wall of the intermediate adapter frame. The intermediate adapter frame is further provided with first air suction holes in communication with the air grooves.

3. The adjustment device of claim 2, wherein: The adjusting frame and the fixed frame are both hollow structures, and an elastic support adjusting mechanism is arranged between the adjusting frame and the fixed frame.

4. The adjustment device of claim 3, wherein: The elastic support adjusting mechanism comprises an adjusting disc arranged on the adjusting frame and a connecting disc arranged on the fixed frame. The two ends of the support column are provided with limiting stop rings. Two shaft sleeves are sleeved on the support column between the adjusting disc and the connecting disc.

5. The adjustment device of claim 4, wherein: An active adjusting structure is arranged between the shaft sleeve close to the adjusting disc, the support column and the adjusting disc. The active adjusting structure comprises a spherical protrusion arranged on the adjusting disc.

6. The adjustment device of claim 5, wherein: The spherical protrusion is in spherical surface cooperation with the shaft sleeve.

7. The adjustment device of claim 4, wherein: The diameter of the through hole is greater than the diameter of the support column.

8. The adjustment device of claim 7, wherein: The spherical protrusion is integrally formed on the adjusting disc, and the adjusting disc is integrally formed on the adjusting frame.

9. The adjustment device of claim 3, wherein: The support column is provided with three support columns and is arranged in a ring array.

10. The adjustment device of claim 3, wherein: A stop disc is arranged on the fixed frame and is arranged away from the adjusting frame. The inner wall of the adjusting frame is provided with a plurality of first air pipe joints, and the end surface of the adjusting frame is provided with second air suction holes in communication with the first air pipe joints. The end of the intermediate adapter frame in the fixed frame is provided with a second air pipe joint in communication with the first air suction hole.

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