Wire cutting device and wire cutting sampling method

Abstract

The invention provides a wire cutting device and a wire cutting sampling method, and the device comprises a wire cutting unit which comprises a cutting wire group, the cutting wire group can reciprocate between a cutting initial position and a cutting termination position along a first direction so as to cut a crystal bar into a plurality of crystal blocks, and the first direction is perpendicular to the axis of the crystal bar; the sampling unit comprises a clamp assembly, the clamp assembly is arranged on the side, away from the crystal bar, of the cutting line set in the first direction, the clamp assembly can reciprocate between the original point position and the clamping position in the first direction, and the clamp assembly comprises two clamping pieces capable of executing the action of clamping or releasing the crystal block; the control unit is used for controlling the clamp assembly to synchronously move from the original position to the clamping position along with the cutting line set in the process that the cutting line set moves from the cutting initial position to the cutting ending position, controlling the clamp assembly to execute the crystal bar clamping action when the clamp assembly is located at the clamping position, and resetting the clamp assembly to the original position so as to conduct sampling operation. According to the linear cutting device and the linear cutting sampling method, the production efficiency can be improved.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a wire cutting device and a wire cutting sampling method. Background Technology

[0002] In the semiconductor ingot manufacturing process, the ingot is typically cut into multiple blocks, and samples are taken from them for quality inspection. Currently, commonly used cutting methods include multi-wire cutting and single-wire cutting.

[0003] Current wire EDM equipment cannot simultaneously meet the needs of both segmentation and sample cutting. One method involves first using a multi-wire EDM machine to cut the entire crystal ingot into multiple crystal blocks in one go, and then transferring these blocks to a dedicated single-wire EDM machine for sample cutting. The drawback of this method is that sample cutting requires a secondary operation, which is time-consuming. Another method involves using only a single-wire EDM machine to sequentially complete the segmentation and sampling of the crystal ingot. This method is also time-consuming and does not improve on-site efficiency.

[0004] In addition, the following problems exist in the process of cutting and sampling: when sampling multi-wire cut samples, manual sampling is required. Due to the adhesion between the sample and the crystal block due to the tension of the cutting fluid, it is difficult for personnel to sample. Moreover, the cut sample is unsupported and the vibration of the cutting line can cause the sample to swing or vibrate, thus leaving line marks on the cutting surface and affecting the sampling quality. Summary of the Invention

[0005] To address at least one of the technical problems in the prior art, embodiments of this application provide a wire cutting device and a wire cutting sampling method.

[0006] The technical solution provided in this disclosure is as follows:

[0007] In a first aspect, embodiments of this disclosure provide a wire cutting apparatus, comprising:

[0008] A wire cutting unit includes a cutting wire group, which includes multiple parallel cutting wires. The cutting wire group can reciprocate between a cutting initial position and a cutting termination position along a first direction to cut a crystal rod into multiple crystal blocks. The first direction is a cutting travel direction perpendicular to the axis of the crystal rod.

[0009] The sampling unit includes a clamping assembly disposed on the side of the cutting line group away from the crystal rod along the first direction, and reciprocating between an origin position and a clamping position along the first direction. The clamping assembly includes two clamping members capable of clamping or releasing the crystal rod.

[0010] The control unit is connected to the wire cutting unit and the sampling unit respectively. The control unit is configured to: control the clamping assembly to move synchronously from the origin position to the clamping position along with the wire cutting assembly as the wire cutting assembly moves from the initial cutting position to the final cutting position, and control the clamping assembly to perform a crystal rod clamping action when it is in the clamping position, and reset to the origin position to perform a sampling operation.

[0011] For example, the control unit is configured to further: after the cutting line group reaches the cutting termination position, first control the clamping assembly to reset from the clamping position to the origin position, and then control the cutting line group to reset from the cutting termination position to the cutting initial position.

[0012] For example, the two clamping members correspond one-to-one with two adjacent cutting lines in the cutting line group, and the movement trajectory of the clamping members and the movement trajectory of the corresponding cutting lines are coplanar in the first direction, so that when the two clamping members reach the clamping position, they are respectively inserted into the two cutting gaps adjacent to the same crystal sample.

[0013] For example, in the second direction, the thickness of the clamping member is less than or equal to the width of the cutting gap formed by the cutting line group, so that the clamping member is inserted into the cutting gap; wherein the second direction is the axial direction of the crystal rod.

[0014] For example, the cutting line assembly moves from the initial cutting position to the final cutting position at a first speed, and the clamping member moves from the origin position to the clamping position at a second speed, wherein the first speed is greater than or equal to the second speed.

[0015] For example, it also includes:

[0016] An origin position sensor and a clamping position sensor are both disposed on the cutting unit or the sampling unit and move synchronously with the clamping member. In the first direction, the origin position sensor is located on the side of the clamping position sensor closer to the cutting line group.

[0017] A triggering component is fixed to one side of the clamping assembly. The origin position sensor and the clamping position sensor are configured to emit corresponding trigger signals based on their positional relationship with the triggering component. The control unit is configured to determine the current position of the clamping assembly based on the trigger signals.

[0018] For example, it also includes:

[0019] A purging unit is disposed on one side of the clamping member. The purging unit is configured to spray airflow into the cutting gap adjacent to the ingot sample held by the clamping member before the clamping member performs a sampling operation, so as to break the adhesion force of the cutting fluid.

[0020] For example, the purging unit includes a nozzle configured to have an extending length along the first direction, the width of which in the first direction is greater than the width in the second direction.

[0021] Secondly, this disclosure also provides a wire cutting sampling method, applied to the wire cutting apparatus described above, the method comprising:

[0022] The cutting line group is controlled to move along the cutting direction from the initial cutting position to the final cutting position in order to cut the crystal rod into multiple crystal blocks;

[0023] During the movement of the cutting line group from the initial cutting position to the final cutting position, the two clamping members of the clamping assembly are controlled to move synchronously from the origin position along the cutting direction with the cutting line group.

[0024] When the clamping member moves to the preset clamping position, the clamping member is controlled to perform a clamping action to fix the crystal sample that is being cut or has been cut by the cutting line;

[0025] The clamping assembly is controlled to hold the crystal sample and reset to the origin position to complete the sampling operation.

[0026] For example, in the method, after the cutting line group reaches the cutting termination position, the clamping assembly is first controlled to reset from the clamping position to the origin position, and then the cutting line group is controlled to reset from the cutting termination position to the cutting initial position.

[0027] For example, when the wire cutting apparatus includes a purging unit, the method further includes: before the clamping member performs a sampling operation, spraying an airflow into the cutting gap adjacent to the crystal rod clamped by the clamping member to break the adhesion force of the cutting fluid.

[0028] The beneficial effects of the embodiments disclosed herein are as follows:

[0029] In this embodiment, the wire cutting device includes not only a cutting unit but also a sampling unit. Controlled by the control unit, the clamping assembly of the sampling unit moves synchronously with the cutting wire group along the same cutting direction (first direction). In a single cutting stroke, both crystal rod segmentation and crystal sample clamping and fixing can be completed, achieving the integration of cutting and sampling into a single continuous process. Compared to the prior art's secondary operation of cutting followed by sampling, or the sequential operation of the same equipment, this improves processing efficiency. Furthermore, the wire cutting device provided in this embodiment, while improving production efficiency, also solves the quality problems of crystal samples being difficult to remove due to cutting fluid adsorption, prone to fragmentation, and developing wire marks at the end of the cutting process due to lack of support, thus ensuring the quality of the crystal samples. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the overall structure of the wire cutting device in the embodiments of this application;

[0031] Figure 2 This is a schematic diagram of the sampling unit in the wire cutting device in the embodiments of this application. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms "a" or "one," and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "connected" or "linked," and similar terms, are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right," etc., are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship also changes accordingly.

[0034] This disclosure provides a wire cutting device, including a wire cutting unit, a sampling unit, and a control unit.

[0035] like Figure 1 and Figure 2As shown, the wire cutting unit includes a cutting wire group 100, which includes a plurality of parallel cutting wires. The cutting wire group 100 can reciprocate between the initial cutting position and the final cutting position along a first direction X to cut the crystal rod 10 into a plurality of crystal blocks. The first direction X is a cutting travel direction perpendicular to the axis of the crystal rod 10.

[0036] The sampling unit 20 includes a clamping assembly 200, which is disposed on the side of the cutting line group 100 away from the crystal rod 10 along the first direction X, and can reciprocate between the origin position and the clamping position along the first direction X. The clamping assembly 200 includes two clamping members 210 that can perform clamping or releasing crystal rod actions.

[0037] The control unit (not shown in the figure) is connected to the wire cutting unit and the sampling unit respectively. The control unit is configured to: control the clamping assembly 200 to move synchronously from the origin position to the clamping position along with the wire cutting group 100 as the wire cutting group 100 moves from the initial cutting position to the cutting termination position, and control the clamping assembly 200 to perform the action of clamping the crystal rod 10 when it is in the clamping position, and reset to the origin position to perform the sampling operation.

[0038] The wire cutting sampling method based on the wire cutting apparatus of this disclosure may include the following steps:

[0039] Step S01: Control the cutting line group 100 to move from the initial cutting position to the final cutting position along the cutting direction to cut the crystal rod 10 into multiple crystal blocks;

[0040] Step S02: During the process of the cutting line group 100 moving from the initial cutting position to the final cutting position, the two clamping members 210 of the clamping assembly 200 are controlled to move synchronously from the origin position along the cutting direction with the cutting line group 100.

[0041] Step S03: When the clamping member 210 moves to the preset clamping position, control the clamping member 210 to perform the action of clamping the crystal rod 10 to fix the crystal sample that is being cut or has been cut by the cutting line.

[0042] Step S04: Control the clamping assembly to hold the crystal sample and reset it to the origin position to complete the sampling operation.

[0043] In the above scheme, the wire cutting device is equipped with not only a cutting unit but also a sampling unit. Under the control of the control unit, the clamping assembly 200 of the sampling unit can move synchronously with the cutting wire group 100 along the same cutting direction (first direction X). In a single cutting stroke, the crystal rod 10 segments and crystal block samples are clamped and fixed simultaneously, realizing the integration of the cutting and sampling processes into a single continuous process. Compared with the existing technology of cutting first and then sampling in a secondary operation or sequential operation on the same equipment, the processing efficiency is improved.

[0044] Meanwhile, because the clamping assembly 200 moves synchronously with the cutting wire assembly 100 and immediately performs a clamping action upon reaching the clamping position, the clamping member 210 can promptly separate the crystal sample from adjacent crystals. This avoids the difficulty of manually and laboriously taking samples in the cutting environment, as is required in traditional methods, and reduces the risk of fragmentation. Furthermore, in the final stage of cutting, when the crystal sample is about to be completely separated, the pre-positioned and clamped clamping member 210 provides support for the crystal sample, effectively preventing the crystal sample from swaying or vibrating under the tension of the cutting wire, thereby reducing cutting defects such as wire marks on the surface of the crystal sample and improving its surface quality.

[0045] Therefore, the wire cutting apparatus provided in this embodiment can effectively solve the quality problems of the crystal sample being difficult to remove due to the adsorption of cutting fluid, being easily fragmented, and having wire marks due to lack of support at the end of the cutting process, while improving production efficiency, thus ensuring the quality of the crystal sample.

[0046] In some exemplary embodiments, the control unit is further configured to: after the cutting line group 100 reaches the cutting termination position, first control the clamping assembly 200 to reset from the clamping position to the origin position, and then control the cutting line group 100 to reset from the cutting termination position to the cutting initial position.

[0047] After cutting is completed, if the cutting wire assembly 100 resets first, its movement path may cause spatial interference or mechanical collision with the clamping member 210, which is still in the clamping position. In the above solution, through the control strategy setting of the control unit, after the crystal sample is completely cut, the control logic executes to reset the sampling unit first, followed by the cutting wire assembly 100. This ensures that the sampling unit resets first, followed by the cutting wire assembly 100, avoiding the risk of collisions between moving parts and guaranteeing the safety and reliability of the equipment operation.

[0048] Furthermore, after the clamping assembly 200 clamps the crystal sample in the clamping position, if the cutting line group 100 moves first, the vibration or micro-motion it generates may cause the crystal sample that has not yet been removed to vibrate, increasing the risk of damage to the crystal sample. However, by prioritizing the removal of the clamping assembly 200 holding the crystal sample to the origin position first, the success rate of sampling can be guaranteed and damage to the crystal sample can be avoided.

[0049] Furthermore, the aforementioned control logic allows for better timing coordination between the sample removal action and the reset action of the cutting line group 100. Once the crystal sample is removed, subsequent processing of the sampling work can be carried out, while the cutting line group 100 can begin to reset, preparing for the cutting work of the next crystal rod 10, reducing equipment downtime and increasing production capacity.

[0050] In some exemplary embodiments, the two clamping members 210 correspond one-to-one with two adjacent cutting lines in the cutting line group 100, and the movement trajectory of the clamping member 210 and the movement trajectory of the corresponding cutting line are coplanar in the first direction X, so that when the two clamping members 210 reach the clamping position, they are smoothly inserted into the two cutting gaps adjacent to the same crystal sample.

[0051] In the above solution, by designing the movement trajectories of the clamping member 210 and the corresponding cutting line to be coplanar in the first direction X, the clamping member 210 can move along the extension direction of the cutting gap during the synchronous follow-up of the cutting line. This allows the clamping member 210 to be accurately inserted into the cutting gap, avoiding the risk of the clamping member 210 scraping against the cut portion of the crystal rod 10. Furthermore, this eliminates the need for the control unit to perform complex dynamic path planning for each cut, ensuring the clamping member 210 accurately enters the cutting gap and reducing control complexity.

[0052] Furthermore, the two clamping members 210 are respectively inserted into the cutting gaps on both sides of the crystal sample, which can clamp the crystal sample from both sides. This allows the clamping force to be applied from both sides of the crystal sample. Compared with clamping from only one side or end, this improves the clamping stability and reliability, effectively prevents the crystal sample from falling off during clamping and removal, and avoids the risk of damage to the crystal sample caused by clamping force.

[0053] In some embodiments, at the origin position, the clamping member 210 and its corresponding cutting line are in the same plane in the first direction X, so that the movement trajectory of the clamping member 210 and the movement trajectory of the corresponding cutting line are coplanar in the first direction X.

[0054] Furthermore, in some exemplary embodiments, in the second direction, the thickness of the clamping member 210 is less than or equal to the width of the cutting gap formed by the cutting line group 100, so that the clamping member 210 is inserted into the cutting gap; wherein the second direction is the axial direction of the crystal rod 10. For example, the clamping member 210 may be configured as a clip.

[0055] In the above solution, controlling the thickness of the clamping member 210 to be less than or equal to the width of the cutting gap allows the clamping member 210 to be smoothly inserted into the cutting gap, preventing friction or impact caused by the excessive size of the clamping member 210, and avoiding problems such as line marks that may be caused by the insertion action of the clamping member 210, thus ensuring that the cutting quality is not affected. The size of the cutting gap can be determined by the diameter of the cutting line and the cutting process.

[0056] Furthermore, in some exemplary embodiments, the cutting line group 100 moves from the initial cutting position to the final cutting position at a first speed, and the clamping member 210 moves from the origin position to the clamping position at a second speed, wherein the first speed is greater than or equal to the second speed.

[0057] In the above scheme, by setting the speed of the cutting line group 100 and the clamping member 210, it can be ensured that the clamping member 210 will not overtake the cutting line group 100 in the cutting direction (first direction X), so that the clamping member 210 is synchronized or lagging behind the cutting line group 100, thereby preventing the risk of impact caused by the clamping member 210 entering the cutting gap too early.

[0058] In some exemplary embodiments, the wire cutting device further includes a position detection unit, which includes an origin position sensor 410, a clamping position sensor 420, and a triggering component 430.

[0059] Both the origin position sensor 410 and the clamping position sensor 420 are disposed on the cutting unit or the sampling unit and move synchronously with the clamping member 210. In the first direction X, the origin position sensor 410 is located on the side of the clamping position sensor 420 closer to the cutting line group 100.

[0060] The triggering component 430 is fixed to one side of the clamping assembly 200. The origin position sensor 410 and the clamping position sensor 420 are configured to emit corresponding trigger signals based on their positional relationship with the triggering component 430. The control unit is configured to determine the current position of the clamping assembly based on the trigger signals.

[0061] In the above scheme, closed-loop control of the control unit can be achieved by setting the position detection unit. Specifically, the origin sensor and the clamping position sensor 420 move synchronously with the clamping member 210 to monitor their relative positional relationship with the fixed triggering component 430 in real time, thereby providing real-time position signal feedback. This allows the control unit to accurately determine the position of the clamping member 210 throughout its entire movement stroke. In particular, it enables precise determination of the two key position points: the origin position and the clamping position.

[0062] Specifically, the operation of the position detection unit is as follows:

[0063] After the device is started or reset, the control unit drives the clamping assembly 200 to move from the origin position to the clamping position. At this time, the origin position sensor 410 and the clamping position sensor 420 also move synchronously.

[0064] During the movement of the clamp assembly 200, when the fixed triggering component 430 enters the detection range of the origin position sensor 410, the origin sensor is triggered and generates a first electrical signal. The first electrical signal is sent to the control unit, which records this instantaneous position and determines that the clamp assembly 200 is at the origin position.

[0065] The clamp assembly 200 continues to move along the first direction X. When the triggering component 430 leaves the detection range of the origin position sensor 410 and enters the detection range of the clamping position sensor 420, the clamping position sensor 420 is triggered, generating a second electrical signal. After receiving the second electrical signal, the control unit determines that the clamp assembly 200 has reached the preset clamping position, and the control unit issues a command to trigger the clamp to perform a clamping action.

[0066] After sampling is completed, the control unit drives the clamp assembly 200 to move in the opposite direction and return. When the triggering component 430 re-enters and triggers the origin position sensor 410, the control unit confirms that the clamp assembly 200 has returned to the origin position.

[0067] It is understood that in other embodiments, the position detection unit is not limited to this. Furthermore, the position of the clamping member 210 can also be calculated using an open-loop control based on the motor encoder. However, using a sensor to provide real-time position signal feedback offers higher accuracy and reliability than the open-loop control method calculated by the motor encoder.

[0068] Furthermore, the cutting fluid generates adsorption forces in the cutting gap, causing the sample to adhere to adjacent crystal blocks, making manual removal difficult and resulting in easy fragmentation. In some exemplary embodiments, such as Figure 1 and Figure 2 As shown, the wire cutting device further includes a purging unit 500, which is disposed on one side of the clamping member 210 and is configured to spray airflow into the cutting gap adjacent to the crystal sample clamped by the clamping member 210 before the clamping member 210 performs a sampling operation, so as to break the adhesion force of the cutting fluid.

[0069] In the above solution, by setting up the purging unit 500 to directionally spray airflow into the cutting gap, the adhesion force of the cutting fluid can be effectively broken or weakened. This reduces the separation resistance that the clamping member 210 needs to overcome when clamping the sample, making the sampling operation easier and more reliable, and avoiding sample damage caused by forced separation, thus improving the sampling yield. Furthermore, the purging airflow not only breaks the adhesion force but also removes contaminants such as residual cutting fluid from the cutting gap and the sides of the crystal sample, preventing poor clamping caused by contaminants, thereby improving clamping stability and reliability, and avoiding secondary contamination or damage to the surface of the crystal sample.

[0070] In some embodiments, the purging unit 500 may move synchronously with the clamp assembly 200. For example, as Figure 1 and Figure 2 As shown, the blowing unit 500 can be connected to the same movable frame as the clamp assembly 200, and the blowing unit 500 may include two nozzles 510 disposed on opposite sides of the clamp assembly 200 along the third direction Z, thereby spraying airflow from the cutting gap along the opposite sides of the third direction Z, which is perpendicular to both the first direction X and the second direction.

[0071] In the above scheme, the blowing unit 500 is connected to and moves synchronously with the clamping assembly 200, ensuring that the nozzle of the blowing unit 500 maintains a constant relative position with the clamping member 210. Regardless of where the clamping member 210 moves to for sampling, the blowing airflow is always aligned with the target cutting gap, eliminating the need for additional independent positioning drive. This ensures that the blowing action acts on the target cutting gap at the same angle and distance during each sampling, avoiding changes in the blowing effect due to positional variations and guaranteeing the repeatability of the blowing process. It is understood that the blowing unit 500 can also move independently of the clamping member 210.

[0072] Furthermore, by way of example, the nozzle 510 is configured to have an extension length along the first direction X, and its width in the first direction X is greater than its width in the second direction.

[0073] In the above scheme, the cutting gap is a long, narrow slit extending along the first direction X. The nozzle is constructed such that its width along the first direction X is greater than its width along the second direction; that is, the nozzle is flat. This nozzle design allows the outlet shape of the blowing unit 500 to match the shape of the cutting gap, enabling the blown airflow to better adhere to and cover the entire longitudinally extending area of ​​the cutting gap, rather than acting only on a local area. This ensures that the airflow energy can be applied more evenly to the entire surface of the cutting gap, avoiding problems such as airflow dispersion and cleaning dead zones caused by nozzle shape mismatch.

[0074] Furthermore, this flat-nozzle design generates a high-speed, sheet-like airflow, which, compared to a circular nozzle, is more conducive to directional injection into the cutting gap. This results in stronger shearing and impact on the cutting fluid within the gap, effectively breaking down adhesion and improving purging efficiency. Additionally, this flat-nozzle design also provides better airflow directionality, reducing issues such as cooling or contamination of areas outside the cutting zone.

[0075] It should also be noted that the wire cutting unit may further include a first driving mechanism for driving the cutting wire group 100 to move along the first direction X; the sampling unit may further include a second driving mechanism for driving the clamping assembly 200 to move along the first direction X. The control unit is connected to the first driving mechanism and the second driving mechanism and is used to control the actions of the first driving mechanism and the second driving mechanism to achieve synchronous movement of the clamping assembly 200 and the cutting wire group 100.

[0076] In the above scheme, two independent drive mechanisms are employed, enabling the control unit to independently control the movement speed and start-stop sequence of the cutting wire assembly 100 and the clamping assembly 200, thereby achieving a complex synchronization relationship between them, such as the first speed being greater than or equal to the second speed. Furthermore, the control unit can adjust the movement parameters of both mechanisms according to real-time operating conditions, thus flexibly adapting to different crystal rod 10 specifications, cutting processes, or sampling requirements. The specific structure of the drive mechanism is not limited here; for example, a motor drive system, a hydraulic drive system, or a pneumatic drive system can be selected.

[0077] In addition, such as Figure 1 and Figure 2 As shown, in some embodiments, the wire cutting device may also include an outer cover 600, a roller 110, etc. The cutting unit and the sampling unit may be disposed inside the outer cover 600, and the cutting wire group 100 is disposed on the roller 110. Cutting is achieved by driving the cutting wire group 100 to move through the roller 110.

[0078] Furthermore, this disclosure also provides a wire cutting sampling method, applied to the wire cutting apparatus described above, the method comprising:

[0079] Step S01: Control the cutting line group 100 to move from the initial cutting position to the final cutting position along the cutting direction to cut the crystal rod 10 into multiple crystal blocks;

[0080] Step S02: During the process of the cutting line group 100 moving from the initial cutting position to the final cutting position, the two clamping members 210 of the clamping assembly 200 are controlled to move synchronously from the origin position along the cutting direction with the cutting line group 100.

[0081] Step S03: When the clamping member 210 moves to the preset clamping position, control the clamping member 210 to perform the action of clamping the crystal rod 10 to fix the crystal sample that is being cut or has been cut by the cutting line.

[0082] Step S04: Control the clamping assembly to hold the crystal sample and reset it to the origin position to complete the sampling operation.

[0083] For example, in the method, after the cutting line group 100 reaches the cutting termination position, the clamping assembly 200 is first controlled to reset from the clamping position to the origin position, and then the cutting line group 100 is controlled to reset from the cutting termination position to the cutting initial position.

[0084] For example, when the wire cutting apparatus includes a purging unit 500, the method further includes: before the clamping member 210 performs a sampling operation, spraying a gas flow into the cutting gap adjacent to the crystal rod 10 clamped by the clamping member 210 to break the adhesion force of the cutting fluid.

[0085] Specifically, the wire cutting device provided in this embodiment can operate as follows:

[0086] The crystal rod 10 to be cut is fixed at the cutting station, the cutting wire group 100 is in the initial cutting position, the clamping assembly 200 of the sampling unit is in the origin position, and the two clamping parts 210 are in the released state.

[0087] The control unit drives the wire cutting unit to start working, and the cutting wire assembly 100 moves from the initial cutting position to the cutting termination position along the first direction X (cutting travel direction) to perform multi-wire cutting on the crystal rod 10. At the same time as the cutting wire assembly 100 starts to move, the control unit controls the sampling unit to make the clamping assembly 200 move synchronously or at a slightly slower speed along the same first direction X from the origin position to the clamping position.

[0088] As the dicing wire assembly 100 forms a dicing gap in the crystal rod 10, the two clamping members 210 move forward and gradually insert into the two adjacent dicing gaps. The thickness design of the clamping members 210 ensures that they can smoothly enter the gaps without interfering with the dicing wires.

[0089] When the clamping assembly 200 moves to the preset clamping position, the corresponding cutting line group 100 has not yet or has just completed the complete cutting of the target sample. The control unit issues a command to drive the two clamping parts 210 to perform clamping action, firmly clamping the sample that is about to be separated or has just been separated.

[0090] After the cutting wire assembly 100 completes the cutting of the entire crystal rod 10 and reaches the cutting termination position, the control unit controls the blowing unit 500 to blow the cutting gap. Then, the clamping assembly 200 is driven to move in the opposite direction X along the first direction, and reset from the clamping position to the origin position, thereby completing the sampling operation.

[0091] After the clamp assembly 200 is reset to the origin position, the control unit drives the cutting line group 100 to reset from the cutting termination position to the cutting initial position, in preparation for the next cutting operation.

[0092] In the various method embodiments of the present invention, the sequence numbers of each step are not intended to limit the order of the steps. For those skilled in the art, any changes in the order of the steps without creative effort are also within the scope of protection of the present invention.

[0093] It should be noted that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, since the embodiments are basically similar to the product embodiments, the descriptions are relatively simple, and the relevant parts can be referred to the descriptions of the product embodiments.

[0094] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0095] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

[0096] Optionally, embodiments of this application also provide an electronic device, including a processor and a memory. The memory stores a program or instructions that can run on the processor. When the program or instructions are executed by the processor, they implement the various steps of the above-described wire cutting sampling method embodiments and achieve the same technical effect. To avoid repetition, they will not be described again here.

[0097] This application provides a readable storage medium storing a program or instructions. When the program or instructions are executed by a processor, they implement the various processes of the wire cutting sampling method embodiment described above and achieve the same technical effect. To avoid repetition, they will not be described again here.

[0098] The processor mentioned above is the processor in the terminal described in the above embodiments. The readable storage medium includes computer-readable storage media, such as computer read-only memory (ROM), random access memory (RAM), magnetic disk, or optical disk. In some examples, the readable storage medium may be a non-transient readable storage medium.

[0099] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A wire cutting device, characterized in that, include: A wire cutting unit includes a cutting wire group, which includes multiple parallel cutting wires. The cutting wire group can reciprocate between a cutting initial position and a cutting termination position along a first direction to cut a crystal rod into multiple crystal blocks. The first direction is a cutting travel direction perpendicular to the axis of the crystal rod. The sampling unit includes a clamping assembly disposed on the side of the cutting line group away from the crystal rod along the first direction, and reciprocating between an origin position and a clamping position along the first direction. The clamping assembly includes two clamping members capable of clamping or releasing the crystal rod. The control unit is connected to the wire cutting unit and the sampling unit respectively. The control unit is configured to: control the clamping assembly to move synchronously from the origin position to the clamping position along with the wire cutting group as the wire cutting group moves from the initial cutting position to the final cutting position, and control the clamping assembly to perform a crystal rod clamping action when it is in the clamping position, and reset to the origin position to complete the sampling operation.

2. The wire cutting device according to claim 1, characterized in that, The control unit is further configured to: after the cutting line group reaches the cutting termination position, first control the clamping assembly to reset from the clamping position to the origin position, and then control the cutting line group to reset from the cutting termination position to the cutting initial position.

3. The wire cutting device according to claim 1, characterized in that, The two clamping members correspond one-to-one with two adjacent cutting lines in the cutting line group, and the movement trajectory of the clamping members and the movement trajectory of the corresponding cutting lines are coplanar in the first direction, so that when the two clamping members reach the clamping position, they are respectively inserted into two cutting gaps adjacent to the same crystal sample. In the second direction, the thickness of the clamping member is less than or equal to the width of the cutting gap formed by the cutting line group, so that the clamping member is inserted into the cutting gap; The second direction is the axial direction of the crystal rod.

4. The wire cutting device according to claim 1, characterized in that, The cutting line assembly moves from the initial cutting position to the final cutting position at a first speed, and the clamping member moves from the origin position to the clamping position at a second speed, wherein the first speed is greater than or equal to the second speed.

5. The wire cutting device according to claim 1, characterized in that, Also includes: An origin position sensor and a clamping position sensor are both disposed on the cutting unit or the sampling unit and move synchronously with the clamping member. In the first direction, the origin position sensor is located on the side of the clamping position sensor closer to the cutting line group. A triggering component is fixed to one side of the clamping assembly. The origin position sensor and the clamping position sensor are configured to emit corresponding trigger signals based on their positional relationship with the triggering component. The control unit is configured to determine the current position of the clamping assembly based on the trigger signals.

6. The wire cutting device according to claim 1, characterized in that, Also includes: A purging unit is disposed on one side of the clamping member. The purging unit is configured to spray airflow into the cutting gap adjacent to the ingot sample held by the clamping member before the clamping member performs a sampling operation, so as to break the adhesion force of the cutting fluid.

7. The wire cutting apparatus according to claim 6, characterized in that, The purging unit includes a nozzle configured to have an extended length along the first direction, the width of which in the first direction is greater than the width in the second direction.

8. A wire cutting sampling method, characterized in that, Applied to the wire cutting apparatus as described in any one of claims 1 to 7, the method comprises: The cutting line group is controlled to move along the cutting direction from the initial cutting position to the final cutting position in order to cut the crystal rod into multiple crystal blocks; During the movement of the cutting line group from the initial cutting position to the final cutting position, the two clamping members of the clamping assembly are controlled to move synchronously from the origin position along the cutting direction with the cutting line group. When the clamping member moves to the preset clamping position, the clamping member is controlled to perform a clamping action to fix the crystal sample that is being cut or has been cut by the cutting line; The clamping assembly is controlled to hold the crystal sample and reset to the origin position to complete the sampling operation.

9. The method according to claim 8, characterized in that, In the method, after the cutting line group reaches the cutting termination position, the clamping assembly is first controlled to reset from the clamping position to the origin position, and then the cutting line group is controlled to reset from the cutting termination position to the cutting initial position.

10. The method according to claim 8, characterized in that, When the wire cutting apparatus includes a purging unit, the method further includes: before the clamping member performs a sampling operation, spraying an airflow into the cutting gap adjacent to the crystal rod held by the clamping member to break the adhesion force of the cutting fluid.

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