Method for tensioning adhesive tape on semiconductor product

Abstract

The invention belongs to the technical field of semiconductor packaging, and particularly relates to an adhesive tape tensioning method for a semiconductor product, which comprises a pretreatment stage, a packaging stage, a post-treatment stage and material selection, and specifically comprises the following steps: S1, putting an upper adhesive tape into a pressing assembly; s2, rotating the pentagonal handle; s3, the first pressing assembly and the second pressing assembly extrude each other; and S4, the spring expands to tighten the upper adhesive tape product. Through vacuum or inert gas packaging, contact pollution and damage of a semiconductor product in the testing and packaging process can be effectively prevented, meanwhile, the stability under high-speed running is achieved, on the premise that the product quality is guaranteed, the material cost and the production cost are reduced, and the production efficiency is improved. And the rejection rate can be effectively reduced through the accurate packaging process and strict quality control, and the qualified rate of products is improved, so that the production cost is reduced.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and in particular to a method for tightening tape on semiconductor products. Background Technology

[0002] With the advancement of technology, the semiconductor industry has experienced rapid development globally. From initial basic materials research to today's advanced manufacturing and packaging technologies, the semiconductor industry has undergone tremendous changes. This rapid development has driven the miniaturization, multifunctionality, and intelligence of electronic products, while also placing higher demands on semiconductor packaging technology. Packaging is a crucial step in the semiconductor manufacturing process, directly affecting the product's reliability, performance, and lifespan. Excellent packaging technology can protect semiconductor chips from external environmental interference and damage, while providing stable electrical connections and heat dissipation performance.

[0003] Therefore, continuous innovation and improvement in semiconductor product packaging and embedding methods are of great significance for improving product quality, reducing costs, and meeting market demands. Summary of the Invention

[0004] Based on the problems raised in the background art, the present invention proposes a method for tightening adhesive tape on semiconductor products.

[0005] This invention proposes a method for tightening adhesive tape on semiconductor products, comprising a pretreatment stage, a packaging stage, a post-treatment stage, and material selection. The specific steps are as follows: S1. Place the adhesive tape into the clamping assembly; S2, Rotate the five-pointed handle; S3. Clamping assembly one and clamping assembly two press against each other; S4. To expand and tighten the spring onto the adhesive tape product.

[0006] Preferably, the preprocessing stage includes feeding the product onto a carrier tray, wherein feeding the product onto the carrier tray involves performing electrical testing and visual inspection using a specific semiconductor product, and then packaging the qualified product into a carrier tape that meets the packaging requirements.

[0007] Preferably, the packaging stage is the process of encapsulating the semiconductor die onto a carrier to form a complete semiconductor device, specifically including feeding the material into the carrier tray, electrical testing, visual testing, and implantation of the carrier tape. The detailed steps are as follows: Feeding into the carrier tray: The product is fed into the space of the carrier tray by linear vibration; Electrical testing: The product undergoes electrical testing while the carrier plate rotates to the electrical testing area; Visual testing: The product undergoes visual testing while the tray rotates to the visual testing area; Implantation carrier tape: The product carrier tape, which combines electrical and visual testing, is transferred to the carrier tape for implantation.

[0008] Preferably, the encapsulation stage utilizes tracheal blowing and tracheal suction technology to implant the product from the carrier tray into the carrier tape. Specifically, during implantation, tracheal blowing technology is used to quickly blow the product into the carrier tape, and vacuum suction technology is used to suck the product into and fix it in the carrier tape for subsequent sealing.

[0009] Preferably, the post-processing electrical testing, visual testing, and implantation carrier sealing steps include: Electrical testing: The packaged semiconductor device is placed in a carrier tray for processing, and the product is subjected to electrical testing at the test location; Visual testing: The packaged semiconductor device is placed in a carrier tray for processing, so that the product can be visually tested at the visual testing position; Implantation and carrier tape sealing: The packaged semiconductor device is subjected to performance testing. Based on the test results, qualified semiconductor devices are selected and sealed in the carrier tape.

[0010] Preferably, the post-processing electrical testing, visual testing, and implantation carrier sealing selection specifically include: Electrical testing: Select equipment with good detection accuracy, speed, and clear classification; Visual testing: Select tests that offer good detection accuracy, speed, and clear classification. Implant carrier sealing: Select a carrier with good non-contact implantation to avoid contact contamination and damage.

[0011] Preferably, the first and second clamping components press against each other, causing the spring to expand and tighten the upper and lower tapes to fix the semiconductor product. The semiconductor product moves with the upper and lower tape motors.

[0012] Compared with the prior art, the present invention has the following beneficial effects: 1. The tape tensioning method for this semiconductor product, through vacuum or inert gas encapsulation, can effectively prevent contact contamination and damage to the semiconductor product during the testing and packaging process, while also solving the stability problem under high-speed operation; 2. The tape tensioning method for this semiconductor product, by selecting appropriate packaging materials and processes, can reduce material and production costs while ensuring product quality. Precise packaging processes and strict quality control can effectively reduce scrap rates and improve product qualification rates, thereby reducing production costs. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the tape tensioning process on semiconductor products proposed in this invention. Detailed Implementation

[0014] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0015] Reference Figure 1 A method for tightening adhesive tape on semiconductor products includes a pretreatment stage, a packaging stage, a post-treatment stage, and material selection. The specific steps are as follows: S1. Place the adhesive tape into the clamping assembly; S2, Rotate the five-pointed handle; S3. Clamping component one and clamping component two press against each other; S4. To expand and tighten the spring onto the adhesive tape product.

[0016] Furthermore, the product is rotated above the carrier tape: a specific method is used for rotational displacement to solve testing difficulties. The product is blown into the carrier tape from above and vacuumed from below. This method can solve the problems of product contamination, slow implantation, and unstable implantation of semiconductor products.

[0017] Furthermore, the packaging stage is the process of encapsulating the semiconductor die onto a carrier to form a complete semiconductor device. Specifically, it includes feeding the material into the carrier tray, electrical testing, visual testing, and implantation of the carrier tape. The detailed steps are as follows: Feeding into the carrier tray: The product is fed into the space of the carrier tray by linear vibration; Electrical testing: The product undergoes electrical testing while the carrier plate rotates to the electrical testing area; Visual testing: The product is subjected to visual testing when the tray rotates to the visual testing area.

[0018] Implantation carrier tape: The product carrier tape, which combines electrical and visual testing, is transferred to the carrier tape for implantation.

[0019] Example 1: A semiconductor product packaging and embedding method includes a pre-processing stage, a packaging stage, a post-processing stage, and material selection. The specific steps are as follows: S1. The product is placed into the empty space on the disc; S2. Rotate the product above the carrier belt; S3. The upper part is blown into the carrier belt by air, and the lower part is vacuumed and held in place. S4. Select adhesives and encapsulation materials for semiconductor product packaging and implantation.

[0020] Example 2: According to the semiconductor product packaging implantation method proposed in Example 1, the pre-processing stage includes product feeding into a carrier tray. The product feeding into the carrier tray involves: using a specific semiconductor product for electrical testing and visual inspection, and then packaging the qualified product into the carrier tape that meets the packaging requirements.

[0021] Example 3: According to the semiconductor product packaging and implantation method proposed in Example 1, the packaging stage is the process of encapsulating the semiconductor bare die onto the carrier to form a complete semiconductor device. Specific steps include bonding, gold wire bonding, and encapsulating adhesive injection. Detailed steps are as follows: Bonding: Adhesives are used to bond semiconductor dies to a carrier, such as a lead frame or ceramic substrate. During bonding, it is essential to ensure good compatibility between the adhesive and the semiconductor die and carrier materials to guarantee bond strength and reliability. Gold wire bonding: Using metal wires such as gold wires to connect the electrodes on the semiconductor die to the pins on the carrier. Gold wire bonding technology has the advantages of high precision and high reliability, and is one of the commonly used connection methods in semiconductor packaging. Encapsulating adhesive injection: Encapsulating adhesive is injected into the gap between the semiconductor die and the carrier to provide protection and fixation. The encapsulating adhesive must have good insulation, heat resistance and moisture resistance to protect the semiconductor device from the influence of the external environment.

[0022] Example 4: According to the semiconductor product packaging implantation method proposed in Example 1, the packaging stage utilizes tracheal blowing and tracheal suction technology to clean impurities. Specifically, before packaging, tracheal blowing technology is used to blow away dust, particles and residues on the surface of the semiconductor chip, carrier or packaging material to improve packaging quality. During the packaging process, tracheal suction technology is used to remove tiny particles and dust from the packaging environment to ensure the cleanliness of the packaging environment and product quality. Tracheal blowing and tracheal suction technologies may have potential applications in the packaging and implantation process of semiconductor products. By properly designing and using these two technologies, the packaging quality and reliability of semiconductor products can be further improved.

[0023] Example 5: According to the semiconductor product packaging and implantation method proposed in Example 1, the post-processing stage includes curing, cutting and shaping, testing and screening steps, as detailed below: Curing: The packaged semiconductor device is placed in an oven for curing to fully cure the packaging material. During the curing process, the temperature and time of the oven need to be controlled to ensure the performance of the packaging material. Cutting and shaping: The cured semiconductor device is cut from the carrier and then shaped. During cutting and shaping, it is essential to ensure that the device's size and shape meet specifications. Testing and screening: Perform performance tests on packaged semiconductor devices, such as electrical performance tests and reliability tests. Based on the test results, screen out qualified semiconductor devices and classify and label them.

[0024] Example 6: According to the semiconductor product packaging implantation method proposed in Example 1, the material selection includes the selection of adhesive, encapsulation material, metal wire, and carrier material, specifically: Adhesives: Select adhesives with good bonding strength, heat resistance and moisture resistance. At the same time, it is necessary to ensure that the adhesives have good compatibility with semiconductor wafers and carrier materials. Encapsulation materials: Select encapsulation materials with good insulation, heat resistance, and moisture resistance. The encapsulation materials also need to have low shrinkage and good flowability to ensure encapsulation quality; Metal wire: Select metal wires with good conductivity and mechanical strength. At the same time, it is necessary to ensure that the metal wires have good solderability to semiconductor wafers and carrier materials. Carrier material: Select a carrier material with good thermal conductivity and mechanical strength. The carrier material should also have good compatibility with the semiconductor die and packaging material.

[0025] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A method for tightening adhesive tape on a semiconductor product, characterized in that, The process includes pre-processing, packaging, post-processing, and material selection. The specific steps are as follows: S1. Place the adhesive tape into the clamping assembly; S2, Rotate the five-pointed handle; S3. Clamping assembly one and clamping assembly two press against each other; S4. To expand and tighten the spring onto the adhesive tape product.

2. The method for tightening adhesive tape on a semiconductor product according to claim 1, characterized in that, The pre-processing stage includes feeding the product onto a carrier tray, wherein the product is fed onto a carrier tray by performing electrical tests and visual inspections on specific semiconductor products, and then packaging qualified products into the carrier tape that meets the packaging requirements.

3. The method for tightening adhesive tape on a semiconductor product according to claim 1, characterized in that, The packaging stage is the process of encapsulating the semiconductor die onto a carrier to form a complete semiconductor device. Specifically, it includes feeding the die into the carrier, electrical testing, visual testing, and tape implantation. The detailed steps are as follows: Feeding into the carrier tray: The product is fed into the space of the carrier tray by linear vibration; Electrical testing: The product undergoes electrical testing while the carrier plate rotates to the electrical testing area; Visual testing: The product undergoes visual testing while the tray rotates to the visual testing area; Implantation carrier tape: The product carrier tape, which combines electrical and visual testing, is transferred to the carrier tape for implantation.

4. The method for tightening adhesive tape on a semiconductor product according to claim 1, characterized in that, The encapsulation stage utilizes tracheal blowing and tracheal suction techniques to implant the product from the carrier tray into the carrier tape. Specifically, during implantation, tracheal blowing technology is used to quickly blow the product into the carrier tape, and vacuum suction technology is used to suck the product into and fix it in the carrier tape for subsequent sealing.

5. The method for tightening adhesive tape on a semiconductor product according to claim 1, characterized in that, The post-processing electrical testing, visual testing, and implantation carrier sealing steps include: Electrical testing: The packaged semiconductor device is placed in a carrier tray for processing, and the product is subjected to electrical testing at the test location; Visual testing: The packaged semiconductor device is placed in a carrier tray for processing, so that the product can be visually tested at the visual testing position; Implantation and carrier tape sealing: The packaged semiconductor device is subjected to performance testing. Based on the test results, qualified semiconductor devices are selected and sealed in the carrier tape.

6. The method for tightening adhesive tape on a semiconductor product according to claim 5, characterized in that, The post-processing electrical testing, visual testing, and implantation carrier sealing selection are specifically as follows: Electrical testing: Select equipment with good detection accuracy, speed, and clear classification; Visual testing: Select tests that offer good detection accuracy, speed, and clear classification. Implant carrier sealing: Select a carrier with good non-contact implantation to avoid contact contamination and damage.

7. The method for tightening adhesive tape on a semiconductor product according to claim 1, characterized in that, The clamping components one and two press against each other, causing the spring to expand and tighten the upper and lower tapes to fix the semiconductor product. The semiconductor product moves with the upper and lower tape motor.

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