Baking method of multi-layer independent oven and multi-layer independent oven

Abstract

The invention discloses a multi-layer independent oven baking method and a multi-layer independent oven, and the method comprises the steps that a current product is sent into a first idle oven to be baked, and ovens adjacent to the first idle oven are idle ovens in a non-working state; when the first idle oven does not exist, the current product is conveyed into a second idle oven to be baked, the ovens adjacent to the second idle oven are working ovens in the constant-temperature baking state, or one of the ovens adjacent to the second idle oven is in the constant-temperature baking state, and the other one is in the non-working state. According to the multi-layer independent oven, the influence of different working time and baking states of adjacent ovens on the temperature of the product during baking can be effectively reduced when the product is baked, so that the multi-layer independent oven can be better utilized to bake the product on the premise that the size of the multi-layer independent oven is not increased, and the product quality is improved. And the product yield after baking is improved.

Description

Technical Field

[0001] This invention relates to the field of product baking technology, and in particular to a multi-layer independent oven baking method and a multi-layer independent oven. Background Technology

[0002] A multi-layer independent oven is a device with multiple independent ovens arranged vertically, each layer containing one oven. Insulation layers separate each oven to prevent temperature differences between adjacent ovens from affecting the overall oven temperature. The temperature within each oven is typically controlled entirely by the device's PID (Proportional-Integral-Derivative) control system, allowing each oven to have a different temperature depending on the control system's settings. Because of this independent temperature control, different batches or types of products can be placed in separate ovens on different layers, enabling simultaneous baking of multiple products and improving production efficiency.

[0003] Understandably, the more layers a multi-layer independent oven has, the larger its volume, and the more products it can bake simultaneously, resulting in higher production efficiency. However, limited by actual production space, to maximize the efficiency of multi-layer independent ovens, some manufacturers reduce the spacing between ovens on each layer to minimize their footprint and maximize the number of ovens that can be used. While this effectively increases the baking efficiency of a single oven, it also makes the temperature of individual ovens in a multi-layer oven more susceptible to temperature variations from adjacent ovens, potentially affecting product baking quality and increasing the defect rate.

[0004] In the manufacturing process of AA (Active Alignment) lenses, the lens needs to be baked after being glued together. The baking process generally involves three stages: cooling, heating, and constant temperature. Due to the limited production efficiency of the initial processes in the overall manufacturing workflow, the production interval between each batch is generally 10 minutes. When the second batch of products enters the independent oven for baking and is in the cooling stage, the first batch of products has already entered the heating stage. Therefore, the temperatures in the independent ovens of the two batches will differ. Since the two batches are located close to each other, they will affect each other. For example, the oven temperature of the second batch of products is relatively low, which will cause the heating rate of the first batch of products to decrease, prolonging the time it takes for the first batch of products to enter the constant temperature stage. Or, when the second batch of products enters the heating stage, the first batch of products has already entered the constant temperature stage. The oven temperatures of the second batch of products may affect the oven temperatures of the first batch of products, causing both the heating and constant temperature to exceed the preset values, thus lengthening the entire baking process. At the same time, when the temperature of the products is affected during the cooling and heating stages, the resulting temperature fluctuations will more easily affect the quality of the finished products, leading to a significant increase in the defect rate. Meanwhile, the baking process for AA lenses also requires a certain level of cleanliness in the baking environment (generally requiring a cleanliness level of 1000). Therefore, air circulation cannot be used to adjust the temperature inside the oven, which further increases the difficulty of improving product yield. Summary of the Invention

[0005] This invention provides a multi-layer independent oven baking method and a multi-layer independent oven to solve the above-mentioned or other potential problems in the prior art.

[0006] According to a first aspect of the present invention, a method for baking in a multi-layer independent oven is provided, comprising:

[0007] The current product is sent to the first idle oven for baking, wherein the adjacent ovens of the first idle oven are all idle ovens that are not in operation;

[0008] When there is no first idle oven, the current product is sent to the second idle oven for baking. The adjacent ovens of the second idle oven are both working ovens in constant temperature baking state, or one of the adjacent ovens of the second idle oven is in constant temperature baking state and the other is in non-working state; or, the current product is sent to the first idle oven or the second idle oven for baking.

[0009] The multi-layer independent oven baking method of the present invention, when obtaining new products requiring baking, places the corresponding products into a first idle oven where neither of the adjacent ovens is currently in operation. This effectively reduces the impact on the product's baking temperature caused by inconsistencies in the operating times and baking states of the adjacent ovens. When there is no first idle oven, the products are placed into a second idle oven where both adjacent ovens are in a constant-temperature baking state. Since the adjacent ovens are in a constant-temperature baking state, the temperature of the adjacent ovens does not fluctuate significantly during baking in the second idle oven, thus reducing the impact of adjacent oven temperatures on the product's baking process. Alternatively, if both a first and second idle oven are available, the product can be placed in either the first or second idle oven, similarly reducing the impact of adjacent oven temperatures on the product's baking process. Therefore, without increasing the volume of the multi-layer independent oven, it is possible to better utilize the multi-layer independent oven for product baking, thereby improving the product yield after baking.

[0010] In some embodiments, sending the current product into a first idle oven for baking includes:

[0011] Obtain the working oven data information of the working oven that is currently in operation, wherein the working oven data information includes the floor number where the working oven is located;

[0012] The first available oven is determined based on the obtained working oven data;

[0013] The current product is sent to the first idle oven for baking.

[0014] Therefore, by setting it up in this way, the first idle oven can be determined and confirmed by acquiring parameters, thus enabling fully automated control through the program.

[0015] In some implementations, when there are at least two identified first idle ovens, the step of sending the current product into the first idle oven for baking is performed as follows:

[0016] The current product is placed in the first idle oven that is closest to the oven that is currently in operation for baking.

[0017] and / or

[0018] When the current product requires baking in two or more ovens, the step of sending the current product to the first available oven for baking is performed as follows:

[0019] The current product is sent to two or more first empty ovens that are not adjacent to each other for baking.

[0020] Therefore, by setting it up in this way, the utilization rate of the first idle oven can be maximized, thereby improving the overall yield of baked products.

[0021] Therefore, by sending the current product to the first idle oven closest to the oven that is currently in operation for baking, and sending the current product to two or more first idle ovens that are not adjacent to each other for baking, the mutual interference between products sent to different ovens at the same time can be effectively reduced, and simultaneous baking can be avoided, which would affect the time for heating and cooling during baking, as well as the temperature when the temperature is constant.

[0022] In some embodiments, the oven data information further includes baking status information, which includes constant temperature baking status.

[0023] The step of sending the current product into the second idle oven for baking is as follows:

[0024] The second available oven is determined based on the obtained data from the working ovens;

[0025] The current product is then placed into the second idle oven for baking.

[0026] Therefore, by setting it up in this way, the determination and confirmation of the second idle oven can be achieved by acquiring parameters, thereby enabling fully automated control through the program.

[0027] In some implementations, the baking status information also includes a constant temperature baking time;

[0028] When there are at least two identified second idle ovens, the step of sending the current product into the second idle oven for baking is performed as follows:

[0029] Based on the constant temperature baking time, the current product is sent to the second idle oven with the longest constant temperature baking time among the adjacent working ovens for baking.

[0030] Therefore, by setting it up in this way, the impact of adjacent ovens operating at constant temperature on the baking of the current product can be minimized, and the baking of the current product can also be minimized on the baking of adjacent ovens.

[0031] In some implementations, it also includes:

[0032] Before baking the product, adjust the target temperature parameters of the heating plate in the PID system.

[0033] Therefore, by setting it up in this way, the target temperature parameter of the heating plate in the PID system can be adjusted according to the actual oven to be baked and the working status of adjacent ovens, so as to better ensure the heating and cooling time during product baking and improve the yield of baked products.

[0034] In some implementations, it also includes:

[0035] During baking, the oven temperature data is monitored, and the on / off state of the corresponding oven heating plates is controlled based on the monitored oven temperature data.

[0036] Therefore, this setup enables the PID system to malfunction in controlling the oven temperature during the baking process, or to compensate for the temperature being affected by adjacent ovens, thus preventing overheating or underheating during baking and improving the product yield when using multi-layer independent ovens.

[0037] In some embodiments, monitoring oven temperature data during baking and controlling the on / off state of the corresponding oven heating plates based on the monitored oven temperature data includes:

[0038] The heating plate is disconnected when the temperature inside the oven is detected to be higher than a first preset threshold.

[0039] When the temperature inside the oven is detected to be lower than the second preset threshold, the heating plate is connected.

[0040] Therefore, it is possible to directly monitor the temperature inside the oven. When the temperature inside the oven is too high, the heating plate can be disconnected in time to lower the temperature inside the oven. When the temperature inside the oven is too low, the heating plate can be connected again in time to raise the temperature inside the oven, so that the temperature inside the oven can be maintained within the predetermined threshold range to ensure the quality of baking.

[0041] In some implementations, after the heating plate is disconnected, the target temperature parameter of the heating plate of the corresponding oven in the PID system is adjusted.

[0042] Therefore, by setting it up in this way, the PID system can be prevented from continuously raising the target temperature of the heating plate after it is disconnected due to the detection of the continuous cooling of the heating plate. This avoids a sudden temperature rise after the heating plate is connected. By controlling and adjusting the target temperature parameter of the heating plate in the PID system, the normal heating state of the heating plate can be ensured after it is connected.

[0043] According to a second aspect of the present invention, a multi-layer independent oven control system is provided, comprising:

[0044] The working oven data information acquisition module is used to acquire the working oven data information of the working oven that is currently in operation, wherein the working oven data information includes the layer number of the working oven and the baking status information of the working oven;

[0045] The first idle oven determination module is used to determine the first idle oven based on the acquired working oven data information;

[0046] The second idle oven determination module is used to determine the second idle oven based on the acquired working oven data information.

[0047] The multi-layer independent oven control system of the present invention can acquire various parameters in the multi-layer independent oven and monitor the oven status of each layer of the overall multi-layer independent oven, so as to control the feeding of the multi-layer independent oven and improve the product baking yield of the multi-layer independent oven.

[0048] In some implementations, it also includes:

[0049] The heating plate target temperature adjustment module is used to adjust the target temperature parameter of the heating plate in the PID system.

[0050] In some implementations, it also includes:

[0051] The oven temperature monitoring module is used to monitor the oven temperature in real time during operation.

[0052] The heating plate on / off control module is used to control the on / off of the heating plate based on the oven temperature monitored by the oven temperature monitoring module during oven operation.

[0053] The heating plate target temperature adjustment module is also used to adjust the target temperature parameter of the heating plate of the corresponding oven in the PID system after the heating plate on / off control module disconnects the heating plate.

[0054] According to a third aspect of the present invention, a multi-layer independent oven is provided, which is equipped with the multi-layer independent oven control system described in the second aspect above, or a system that implements the multi-layer independent oven control method described in the first aspect above. Attached Figure Description

[0055] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0056] Figure 1 This is a flowchart of a multi-layer independent oven baking method according to an embodiment of the present invention;

[0057] Figure 2 This is a flowchart of step S11 of the multi-layer independent oven baking method according to an embodiment of the present invention under fully automated control.

[0058] Figure 3 This is a flowchart of step S12 in a multi-layer independent oven baking method according to an embodiment of the present invention under fully automated control.

[0059] Figure 4 This is a schematic diagram showing the temperature change inside the oven and the on / off changes of the heating plate when the air temperature inside the oven reaches a first preset threshold and a second preset threshold in a multi-layer independent oven baking method according to an embodiment of the present invention.

[0060] Figure 5 The baking process of the multi-layer independent oven baking method according to one embodiment of the present invention in practical application;

[0061] Figure 6 This is a flowchart illustrating the steps of a baking method in a multi-layer independent oven according to another embodiment of the present invention.

[0062] Figure 7 This is a schematic diagram of a multi-layer independent oven control system according to an embodiment of the present invention;

[0063] Figure 8 This is a schematic diagram of a multi-layer independent oven control system according to another embodiment of the present invention;

[0064] Figure 9 This is a schematic diagram of the structure of an embodiment of the electronic device of the present invention. Detailed Implementation

[0065] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0066] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0067] In the description of this invention, it should be understood that the terms "center," "middle," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential," indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Features defined with "first" and "second" are used to distinguish feature names and do not have special meanings. Furthermore, features defined with "first" and "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0068] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0069] It should also be noted that, in this document, the terms "comprising" or "including" include not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. The terminology used herein is generally that commonly used by those skilled in the art; in case of any discrepancy with commonly used terminology, the terminology used herein shall prevail.

[0070] The present invention will now be described in further detail with reference to the accompanying drawings.

[0071] Figure 1 The diagram illustrates the process of a multi-layer independent oven baking method according to an embodiment of the present invention. This method can be performed by a user operating the multi-layer independent oven to bake products, or it can be controlled by intelligent devices such as smartphones, personal computers, cloud servers, or control systems such as PID systems, PLC systems, and microcontroller systems to achieve fully automated or semi-automated baking of products. This embodiment of the invention does not limit this approach. (Refer to...) Figure 1As shown, the multi-layer independent oven baking method of the present invention includes the following steps:

[0072] S11: Send the current product into the first idle oven for baking, wherein the adjacent ovens of the first idle oven are all idle ovens in a non-working state.

[0073] S12: When there is no first idle oven, the current product is sent to the second idle oven for baking, wherein the adjacent ovens of the second idle oven are both working ovens in constant temperature baking state, or one of the adjacent ovens of the second idle oven is in constant temperature baking state and the other is in non-working state.

[0074] An idle oven is an oven that is not in operation and has no products being baked inside. A working oven is an oven that is in operation and has products being baked inside. Products can be sent to the idle oven for baking. Based on the status of its adjacent ovens, an idle oven can be classified as a first idle oven and a second idle oven. An idle oven where both adjacent ovens are in operation is classified as a first idle oven. An idle oven where both adjacent ovens are in operation, or where one adjacent oven is in operation and the other is not, is classified as a second idle oven. In a multi-layered independent oven system, an edge oven is only adjacent to one other oven. Since the side of the edge oven without adjacent ovens does not affect the temperature of that oven, the side of the edge oven without adjacent ovens should be considered an idle oven in operation. An oven in operation may be in a constant-temperature baking state, or it may be in a rising-temperature baking state or a falling-temperature baking state. Depending on the product and the baking process required, the oven may have a variety of baking states. Because the temperature of an oven in a constant-temperature baking state is relatively stable, it has a relatively small impact on the temperature of adjacent ovens. At the same time, the temperature of an oven in a constant-temperature baking state is easier to adjust and recover from. When affected by the temperature changes of adjacent ovens, it is easier to recover and adjust. Furthermore, temperature fluctuations during constant-temperature baking have a relatively smaller impact on the baking quality of the product. Therefore, in this embodiment of the invention, an oven in which both adjacent ovens are in a constant-temperature baking state, or an idle oven in which one adjacent oven is in a constant-temperature baking state and the other is in an inactive state, is classified as a second idle oven.

[0075] Optionally, when there is both a first idle oven and a second idle oven in a multi-layer independent oven, the following steps can also be performed: send the current product into the first idle oven or the second idle oven for baking.

[0076] When performing the above steps, the user can determine the status of each oven in the multi-level independent oven by observing the oven's status. The user can then operate the multi-level independent oven (e.g., via the control panel or other control components) to send the product to the first or second idle oven for baking. In other possible implementations, the system in the multi-level independent oven can be configured to intelligently determine and confirm the first and / or second idle ovens, and control the operation of the multi-level independent oven to achieve fully automated control. Specifically, refer to... Figure 2 As shown, Figure 2 This schematically illustrates the step flow of step S11 of the multi-layer independent oven baking method according to an embodiment of the present invention under fully automated control, with reference to... Figure 2 As shown, it can be implemented by including the following steps:

[0077] Step S21: Obtain the working oven data information of the working oven that is currently in operation, wherein the working oven data information includes the floor number of the working oven;

[0078] Step S22: Determine the first available oven based on the obtained working oven data;

[0079] Step S23: Send the current product into the first idle oven for baking.

[0080] Step S21 is a process for acquiring data on the working status of each oven in the current multi-layer independent oven. The acquired oven data must include at least the layer number of the oven. Specifically, when executing step S21 to acquire the working oven data of each oven in the current multi-layer independent oven, the corresponding data can be obtained based on sensors in the multi-layer independent oven. For example, it can be determined whether the oven corresponding to the current heating plate is working by monitoring whether the heating plate is working, or by monitoring the target temperature of the heating plate when it is working to determine the heating status of the oven corresponding to the current heating plate. Alternatively, an independent temperature sensor can be installed in the oven to monitor the temperature inside the oven to determine the current working status of the oven. The specific implementation method can be selected or modified according to the actual situation and existing corresponding monitoring methods. Not all methods are listed here.

[0081] Step S22 determines whether each oven in the current multi-layer independent oven system is the first idle oven based on the working oven data information obtained in step S21. Since the layer number of each working oven in the multi-layer independent oven system has been obtained in step S21, it is only necessary to determine the status of the ovens adjacent to the remaining idle ovens to identify which ovens are the first idle ovens.

[0082] After determining the first available oven in step S22, step S23 can be executed to send the current product into the first available oven for baking.

[0083] For example, consider a multi-layer independent oven with a total of 9 layers, each layer having one independent oven. The ovens are numbered sequentially from top to bottom (oven number 1 at the top and 9 at the bottom). If the layer number of the working ovens obtained in step S21 is 2 or 5, it means that ovens 2 and 5 are both in operation. In this case, step S22 determines the first idle ovens, which are ovens 7, 8, and 9.

[0084] Once the first available oven is identified, step S23 can be executed to send the current product into the first available oven for baking. When sending the current product into the first available oven, the feeding mechanism of the multi-layer independent oven can be automatically fed into the corresponding oven by program control. The specific feeding mechanism can be composed of a lead screw, motor, tray, etc. Different multi-layer independent ovens may have different feeding mechanisms. For multi-layer independent ovens without a built-in feeding mechanism, it can also be achieved by setting an additional feeding mechanism on the multi-layer independent oven. This invention does not limit this.

[0085] In the example above, when executing step S23, since there are three first idle ovens that are consecutively adjacent, in actual execution, sending the current product to any one of ovens 7, 8, or 9 can improve the yield of the baked product. However, in reality, if the current product is sent to oven 8 for baking, ovens 7 and 9 will no longer be identified as first idle ovens. Conversely, if the current product is sent to oven 7 for baking, oven 9 will still be identified as the first idle oven, allowing the next group of products to be placed in for baking. Therefore, in some possible implementations, to further improve the utilization efficiency of the multi-layer independent ovens, step S23 is executed by sending the current product to the first idle oven closest to the currently operating oven for baking. In this case, in the scenario described above, the current product will be preferentially sent to oven 7 for baking. In a scenario where all ovens in a multi-layer independent oven are idle, since no ovens are currently in operation, the ovens located at the edges can be prioritized for baking, thus maximizing the utilization of the first idle oven. For example, continuing with a multi-layer independent oven with a total of 9 layers, if all ovens are idle, the current product can be prioritized for baking in oven number 1 or oven number 9. Continuing with the example of the current product being baked in oven number 1, when the next batch of products needs baking, it can be prioritized for baking in oven number 3. Therefore, in this embodiment, a maximum of 5 batches of products can be baked in the first idle oven, maximizing its utilization.

[0086] In other scenarios, products to be baked in an oven may need to be divided into at least two groups. Since these groups are baked synchronously, the mutual interference is relatively small, allowing them to be directly placed into two or more adjacent first-empty ovens. To further improve the yield rate, in some implementations, the two or more groups can be placed into two or more non-adjacent first-empty ovens to minimize mutual interference during baking. For example, continuing with a multi-layer independent oven with nine layers, if the previous group of products was baked in oven 1, and there are two groups of products, they would be placed in ovens 3 and 5 for baking.

[0087] To enable intelligent identification of the second available oven, in some possible implementations, the oven data information obtained in step S21 may also include baking status information, which at least includes a constant temperature baking status. In other possible implementations, the baking status information may also include a heating baking status, a cooling baking status, etc., and not all statuses will be listed here. Figure 3 This schematically illustrates the process flow of step S12 in a multi-layer independent oven baking method according to an embodiment of the present invention under fully automated control, with reference to... Figure 3 As shown, it can be implemented by including the following steps:

[0088] Step S31: Determine the second available oven based on the obtained working oven data;

[0089] Step S32: Send the current product into the second idle oven for baking.

[0090] Since the working oven data information containing the considered baking status information has been obtained in step S21, the second idle oven can be directly determined in step S31 based on this working oven data information. Then, only step S32 needs to be executed to send the current product into the second idle oven for baking. When sending the current product into the second idle oven, the feeding mechanism of the multi-layer independent ovens can also be automatically fed into the corresponding oven by program control, which will not be elaborated here. Specifically, there are two types of second idle ovens: the first type is an oven where both adjacent ovens are in a constant temperature baking state; the second type is an oven where one adjacent oven is in a constant temperature baking state and the other is an idle oven. The second situation generally occurs when, during step S11, the current product is not prioritized for baking in the first idle oven closest to the currently working oven. For example, consider a multi-layer independent oven with a total of 9 layers, where the working ovens are located on layers 2, 5, and 8. In this case, there is no first idle oven in the multi-layer independent oven. If all the working ovens are in a constant temperature baking state, then the remaining ovens are all second idle ovens that satisfy the second condition described above. However, in the case where the current product is preferentially sent to the first idle oven closest to the currently working oven for baking, the working ovens in the multi-layer independent oven will be located on layers 1, 3, 5, 7, and 9. If all the working ovens are in a constant temperature baking state, then the remaining ovens are all second idle ovens that satisfy the first condition described above.

[0091] In some possible scenarios, since the start times of the various working ovens may differ, when a product needs to be baked in a second idle oven, the working oven that starts baking first will have a longer constant-temperature baking time and will complete the entire baking process faster, with less impact on the temperature of adjacent ovens. Therefore, in cases where there are two or more second idle ovens, in some possible implementations, it can be designed to prioritize sending the current product to the second idle oven with the longest constant-temperature baking time among the adjacent working ovens. In this implementation, when obtaining the baking status information of the working oven in step S21, the constant-temperature baking time may also be included. This allows for determining which second idle oven the current product should be preferentially sent to for baking based on the obtained constant-temperature baking time.

[0092] Furthermore, in existing multi-layer independent ovens, the temperatures of adjacent ovens influence each other. Consequently, in the typical PID system of a multi-layer independent oven, the target temperature parameters of the heating plates in each oven are not adjusted. Taking baking AA lens products as an example, the process includes a cooling stage, a heating stage, and a constant temperature stage. The target temperature parameter of the oven's heating plates in each stage is generally designed to be 100℃ by default. For instance, the air temperature inside the oven is approximately 85℃ before the door is opened. When the product is placed inside the oven after the door is opened, cold air enters. Since both the product and the tray are cold, although the target temperature parameter of the oven's heating plates is 100℃, the air temperature inside the oven will still tend to decrease. At this point, the air temperature inside the oven will slowly drop to approximately 79℃, thus achieving the cooling stage baking. After the cooling reaches a certain critical point, because the target temperature parameter of the heating plates is 100℃, the air temperature inside the oven will begin to slowly rise back to approximately 85℃, thus achieving the heating stage. Finally, since the target temperature parameter of the heating plate is constant at 100℃, the air temperature inside the oven will not change after heating to 85℃, achieving constant temperature baking. This existing method makes the oven more susceptible to temperature variations from adjacent ovens during actual baking, leading to prolonged baking time. Furthermore, if the PID fails, it can easily cause overheating or underheating, potentially damaging the product. Therefore, in some possible implementations, before baking the product, the target temperature parameter of the heating plate in the PID system of the multi-layer independent oven can be adjusted. This allows each heating plate to better adapt to the baking method used in this invention, resulting in a higher yield of the baked product. For example, taking the baking of AA lens products as an example, in this embodiment, the target temperature parameters of the heating plates in the PID system of the multi-layer independent oven corresponding to each stage of baking the AA lens product can be adjusted accordingly. For example, after the oven door is opened and the product is placed inside, it is a cooling stage where the oven temperature drops from approximately 85℃ to 79℃. During this stage, the target temperature parameter of the heating plate is first set to 140℃. After setting the target temperature parameter of the heating plate to 140℃, a preset time, such as 5 minutes, is set. After 5 minutes, the target temperature parameter of the heating plate is then set to 125℃. At this point, the temperature of the heating plate will gradually decrease, while the air temperature inside the oven will gradually transition from cooling to heating. During this process, the duration of the cooling phase of baking is reduced, thus minimizing the potential impact on adjacent ovens. When the air temperature inside the oven reaches 80℃, the target temperature parameter of the heating plate is then set to 100℃, which is still the heating phase. During this process, the temperature of the heating plate gradually decreases, causing the air temperature inside the oven to gradually rise, forming the heating phase of baking.Finally, when the air temperature inside the oven reaches about 85°C, the target temperature parameter of the heating plate is maintained at about 100°C and adjusted flexibly according to the actual situation to keep the air temperature inside the oven constant at about 85°C, thus achieving constant temperature baking.

[0093] In some other possible implementations, the baking method of the present invention, in addition to designing the priority of placing products into the idle oven, can also monitor the temperature data inside the oven in real time while the oven is baking. Figure 4 The schematic diagram illustrates the steps of a baking method for a multi-layer independent oven according to another embodiment of the present invention, with reference to... Figure 4 As shown, in this embodiment, the method further includes the following steps:

[0094] S13: Monitor the oven temperature data during baking and control the on / off state of the corresponding oven heating plate based on the monitored oven temperature data.

[0095] In step S13, the monitored oven temperature data refers to the air temperature inside the oven, which is the temperature at which the product is being baked. It's understood that, generally, to reach a target oven temperature, the heating plate temperature must be higher than that target temperature to maintain the overall oven temperature at that level. Furthermore, the oven temperature is affected not only by the heating plate temperature but also by the temperatures of adjacent ovens. Therefore, real-time monitoring of the oven temperature is necessary to prevent abnormal oven temperatures from affecting the quality of the baked product. The oven temperature data can be obtained through sensors in a multi-layer independent oven, or by adding additional temperature sensors to the multi-layer independent oven for monitoring the oven temperature. When the air temperature inside the oven is too high, it indicates that the current heating plate temperature is unsuitable for the current baking conditions. In this case, the circuit of the corresponding oven's heating plate can be disconnected, ceasing power supply and causing the heating plate temperature to drop. After the heating plate stops heating, the air temperature inside the oven will continue to drop. When the temperature inside the oven becomes too low, the heating plate needs to be powered on again to restore the temperature inside the oven. Therefore, in some possible implementations, step S13 can be implemented by setting a first preset threshold and a second preset threshold for each baking stage of the oven. The first preset threshold is the threshold for excessively high temperatures, and the second preset threshold is the threshold for excessively low temperatures. The monitored air temperature inside the oven can then be compared with the first and second preset thresholds. When the monitored temperature inside the oven is higher than the first preset threshold, the heating plate is disconnected; when the monitored temperature inside the oven is lower than the second preset threshold, the heating plate is connected. Specifically, the on / off control of the heating plate can be achieved by controlling the on / off of the AC contactors in the multi-layer independent ovens. When the AC contactor of one oven in the multi-layer independent ovens is disconnected, the heating plate of the corresponding oven is disconnected; when the AC contactor of one oven in the multi-layer independent ovens is connected, the heating plate of the corresponding oven is connected.

[0096] It is understandable that the first and second preset thresholds are different for different stages of baking in the oven (cooling stage, heating stage, and constant temperature stage). For example, taking the baking of AA lens products as an example, the temperature needs to be maintained at around 85℃ during the constant temperature stage. Therefore, the first preset threshold for the constant temperature stage can be set to 88℃, and the second preset threshold can be set to 84℃. During the cooling and heating stages, since the temperature is not constant, a temperature change curve can be generated by monitoring the air temperature inside the oven to determine the trend. In this case, the first and second preset thresholds can also be set to reflect the trend. When the trend of the air temperature inside the oven reaches the first preset threshold during the cooling and heating stages, the heating plate is disconnected; when the trend reaches the second preset threshold, the heating plate is connected.

[0097] In some possible scenarios, when the heating plate is disconnected, its temperature will continue to drop. In the PID system of some multi-layer independent ovens, because a target temperature parameter for the heating plate is preset, the PID system will continuously and automatically adjust the target temperature parameter when it detects a continuous drop in the heating plate temperature, hoping to restore the temperature. However, in this process, the target temperature parameter may be adjusted to a very high value, causing a sharp rise in the oven temperature when the heating plate is reconnected, affecting the baked product. Therefore, in some possible implementations, when the heating plate is disconnected, the target temperature parameter of the corresponding oven's heating plate in the PID system can be adjusted to ensure that reconnecting the heating plate does not affect the baked product. Furthermore, in this implementation, when adjusting the target temperature parameter of the heating plate after disconnection, the target temperature parameter of the current oven's heating plate can also be adjusted based on the oven temperature data of adjacent ovens. This allows the adjusted target temperature parameter to better modify the current air temperature or air temperature change trend within the oven, making the air temperature within the oven more stable and better meeting the baking process requirements of the product. For example, refer to... Figure 4 As shown, Figure 4 This diagram schematically illustrates the baking method of a multi-layer independent oven according to an embodiment of the present invention. It shows the temperature changes inside the oven and the on / off changes of the heating plates during the constant temperature stage, after the oven's heating plate is controlled by monitoring the air temperature inside the oven. The method involves controlling the on / off state of the heating plates based on monitoring the air temperature inside the oven. The diagram depicts the temperature changes inside the oven and the on / off state of the heating plates when the air temperature inside the oven reaches a first preset threshold and a second preset threshold. Figure 4As shown, when the air temperature inside the oven reaches 88℃ (the first preset threshold), the AC contactor is triggered to shut off. The air temperature inside the oven then continues to decrease until it reaches 84℃ (the second preset threshold), at which point the AC contactor is triggered to connect the heating plate, resuming heating and causing the air temperature inside the oven to rise again. Because the target temperature parameter of the heating plate is adjusted after it is disconnected, the air temperature inside the oven returns to a constant level of around 85℃ after the heating plate is reconnected, achieving constant temperature baking of the product. In other embodiments, when both a first idle oven and a second idle oven exist simultaneously, the current product can be selected to be placed in either the first or second idle oven for baking. During baking, the oven temperature data can also be monitored, and the on / off state of the heating plate in the corresponding oven can be controlled based on the monitored oven temperature data. Similarly, the target temperature parameter of the heating plate can be adjusted after it is disconnected.

[0098] Figure 5 The diagram schematically illustrates the baking process of a multi-layer independent oven according to an embodiment of the present invention in practical application. (Refer to...) Figure 5 As shown, the multi-layer independent oven has nine layers, with one independent oven on each layer. Each batch of products is sent into the oven for baking at a time, and the production time interval between two adjacent batches is 10 minutes. When sending the products into the multi-layer independent oven for baking, the products to be baked are first sent into the ovens on the odd-numbered layers of the multi-layer independent oven in sequence, i.e., as shown... Figure 5 As shown, the first group of products is first sent to oven level 1. After 10 minutes, the second group of products is prepared and then sent to oven level 3, and so on, until the fifth group of products is sent to oven level 9. At this point, the ovens on the odd-numbered levels are all first-empty ovens, maximizing the utilization of the current first-empty ovens and making the remaining empty ovens second-empty ovens. When the ovens on the odd-numbered levels in the multi-layer independent oven are all baking, the products to be baked are then sequentially sent to the ovens on the even-numbered levels in the multi-layer independent oven for baking. That is, as... Figure 5 As shown, after the sixth group of products is prepared, it is sent to oven No. 2; after the seventh group of products is prepared, it is sent to oven No. 4, and so on. At this time, the ovens sent to even-numbered layers are all second-empty ovens. Therefore, by baking the products in this way, the temperature fluctuation inside the multi-layer independent oven can be effectively reduced during the baking process, thereby improving the yield of the baked products.

[0099] The multi-layer independent oven baking method of the present invention, when obtaining new products requiring baking, places the corresponding products into a first idle oven where neither of the adjacent ovens is currently operating. This effectively reduces the impact on the product's baking temperature caused by inconsistencies in the operating times and baking conditions of adjacent ovens. When there is no first idle oven, the products are placed into a second idle oven where both adjacent ovens are in a constant-temperature baking state. Since both adjacent ovens are in a constant-temperature baking state, the temperature of the adjacent ovens does not fluctuate significantly during baking in the second idle oven, further reducing the impact of adjacent oven temperatures on the product's baking process. Therefore, without increasing the volume of the multi-layer independent oven, it is possible to better utilize the multi-layer independent oven for product baking, thereby improving the product yield after baking. Meanwhile, during the baking process, if the PID system malfunctions in controlling the oven temperature, or if the oven temperature is affected by adjacent ovens, the system can compensate by controlling the on / off state of the heating plates to prevent overheating or underheating during baking, thereby improving the product yield when using multi-layer independent ovens. Furthermore, to prevent the PID system from continuously raising the target temperature of the heating plates after disconnecting them due to detecting continuous cooling, and thus causing a sudden temperature rise after the heating plates are connected, this invention also adjusts the target temperature parameter of the corresponding heating plates in the PID system to ensure normal heating after the heating plates are connected.

[0100] Figure 7 A schematic block diagram illustrating the principle of a multi-layer independent oven control system according to an embodiment of the present invention is shown below. Figure 7 As shown, the multi-layer independent oven control system of the present invention specifically includes:

[0101] The working oven data information acquisition module 1 is used to acquire the working oven data information of the working oven that is currently in working state, wherein the working oven data information includes the layer number of the working oven and the baking status information of the working oven;

[0102] The first idle oven determination module 2 is used to determine the first idle oven based on the obtained working oven data information. The adjacent ovens of the first idle oven are all idle ovens in a non-working state.

[0103] The second idle oven determination module 3 is used to determine the second idle oven based on the obtained working oven data information. The adjacent ovens of the second idle oven are both working ovens in constant temperature baking state, or one of the adjacent ovens of the second idle oven is in constant temperature baking state and the other is in non-working state.

[0104] Optionally, the multi-layer independent oven control system may also include a feeding mechanism for feeding the current product into a first idle oven or a second idle oven according to the multi-layer independent oven baking method of the above embodiments.

[0105] Figure 8 The schematic diagram illustrates the principle block diagram of a multi-layer independent oven control system according to another embodiment of the present invention, with reference to... Figure 8 As shown, in this embodiment, with Figure 5 Compared to the implementation shown, it further includes:

[0106] Oven temperature monitoring module 4 is used to monitor the oven temperature in real time during operation;

[0107] The heating plate on / off control module 5 is used to control the on / off of the heating plate according to the oven temperature monitored by the oven temperature monitoring module during oven operation.

[0108] The heating plate target temperature adjustment module 6 is used to adjust the heating plate target temperature parameter in the PID system, and adjusts the target temperature parameter of the corresponding oven heating plate in the PID system after the heating plate on / off control module disconnects the heating plate.

[0109] It should be noted that the implementation process and principle of the multi-layer independent oven control system of this invention can be specifically referred to in the corresponding descriptions of the above method embodiments. For example, the method embodiments describe the determination and confirmation of the first idle oven and the second idle oven, as well as the product feeding order when multiple first idle ovens are present. Therefore, these will not be repeated here. Exemplarily, the multi-layer independent oven control system of this invention can be any intelligent device with a processor, including but not limited to computers, smartphones, personal computers, robots, cloud servers, etc.

[0110] In some embodiments, the present invention also provides a multi-layer independent oven, which is equipped with the multi-layer independent oven control system described in the above embodiments, or a system that implements the multi-layer independent oven control method described in the above embodiments.

[0111] For example, the multi-level independent oven also includes a feeding mechanism that can feed products into the corresponding first or second idle oven. This feeding mechanism may be, for example, a lifting mechanism with a tray or a robotic arm.

[0112] In some embodiments, the present invention provides a non-volatile computer-readable storage medium storing one or more programs including execution instructions, which can be read and executed by electronic devices (including but not limited to computers, servers, or network devices) to perform the multi-layer independent oven baking method of any of the above embodiments of the present invention.

[0113] In some embodiments, the present invention also provides a computer program product, the computer program product including a computer program stored on a non-volatile computer-readable storage medium, the computer program including program instructions, which, when executed by a computer, cause the computer to perform the multi-layer independent oven baking method of any of the above embodiments.

[0114] In some embodiments, the present invention also provides an electronic device comprising: at least one processor and a memory communicatively connected to the at least one processor, wherein the memory stores instructions executable by the at least one processor, the instructions being executed by the at least one processor to enable the at least one processor to perform the multi-layer independent oven baking method of any of the above embodiments.

[0115] In some embodiments, the present invention also provides a storage medium storing a computer program, characterized in that the program, when executed by a processor, implements the multi-layer independent oven baking method of any of the above embodiments.

[0116] Figure 9 This is a schematic diagram of the hardware structure of an electronic device for a multi-layer independent oven baking method provided in another embodiment of the present invention, as shown below. Figure 9 As shown, the device includes:

[0117] One or more processors 710 and memory 720, Figure 9 Take the 710 processor as an example.

[0118] The equipment for performing the multi-layer independent oven baking method may also include: an input device 730 and an output device 740.

[0119] The processor 710, memory 720, input device 730, and output device 740 can be connected via a bus or other means. Figure 7 Taking the example of a connection between China and Israel via a bus.

[0120] The memory 720, as a non-volatile computer-readable storage medium, can be used to store non-volatile software programs, non-volatile computer-executable programs, and modules, such as the program instructions / modules corresponding to the multi-layer independent oven baking method in this embodiment of the invention. The processor 710 executes various server functions and data processing by running the non-volatile software programs, instructions, and modules stored in the memory 720, thereby implementing the multi-layer independent oven baking method described in the above embodiment.

[0121] The memory 720 may include a program storage area and a data storage area. The program storage area may store the operating system and applications required for at least one function; the data storage area may store data created based on the use of the multi-layer independent oven baking method, etc. Furthermore, the memory 720 may include high-speed random access memory and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other non-volatile solid-state storage device. In some embodiments, the memory 720 may optionally include memory remotely located relative to the processor 710, and these remote memories can be connected to the electronic device via a network. Examples of such networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0122] The input device 730 can receive input digital or character information and generate signals related to user settings and function control of the image processing device. The output device 740 may include a display device such as a display screen.

[0123] The one or more modules are stored in the memory 720, and when executed by the one or more processors 710, they perform the multi-layer independent oven baking method in any of the above method embodiments.

[0124] The above-described product can execute the method provided in the embodiments of the present invention, and has the corresponding functional modules and beneficial effects for executing the method. Technical details not described in detail in this embodiment can be found in the method provided in the embodiments of the present invention.

[0125] The electronic devices of this invention exist in various forms, including but not limited to:

[0126] (1) Mobile communication devices: These devices are characterized by their mobile communication capabilities and primarily aim to provide voice and data communication. These terminals include: smartphones (e.g., iPhones), multimedia phones, feature phones, and low-end phones, etc.

[0127] (2) Ultra-mobile personal computer devices: These devices fall under the category of personal computers, possessing computing and processing capabilities, and generally also have mobile internet access features. These terminals include PDAs, MIDs, and UMPCs, such as the iPad.

[0128] (3) Portable entertainment devices: These devices can display and play multimedia content. This category includes: audio and video players (such as iPods), handheld game consoles, e-books, as well as smart toys and portable car navigation devices.

[0129] (4) Server: A device that provides computing services. The components of a server include a processor, hard disk, memory, system bus, etc. Servers are similar to general computer architectures, but because they need to provide highly reliable services, they have higher requirements in terms of processing power, stability, reliability, security, scalability, and manageability.

[0130] (5) Other electronic devices with data interaction functions.

[0131] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0132] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented using software plus a general-purpose hardware platform, or of course, using hardware. Based on this understanding, the above technical solutions, in essence or the parts that contribute to the related technology, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0133] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for baking in a multi-layer independent oven, characterized in that, include: The current product is sent to the first idle oven for baking, wherein the adjacent ovens of the first idle oven are all idle ovens that are not in operation; When there is no first idle oven, the current product is sent to the second idle oven for baking. The adjacent ovens of the second idle oven are both working ovens in constant temperature baking state, or one of the adjacent ovens of the second idle oven is in constant temperature baking state and the other is in non-working state. Alternatively, the current product can be placed in either the first or second idle oven for baking.

2. The baking method according to claim 1, characterized in that, The step of sending the current product into the first idle oven for baking includes: Obtain the working oven data information of the working oven that is currently in operation, wherein the working oven data information includes the floor number where the working oven is located; The first available oven is determined based on the obtained working oven data; The current product is sent to the first idle oven for baking.

3. The baking method according to claim 2, characterized in that, When there are at least two first idle ovens, the step of sending the current product to the first idle oven for baking is performed as follows: sending the current product to the first idle oven that is closest to the oven that is currently in operation for baking. And / or, When the current product needs to occupy two or more ovens for baking, the step of sending the current product to the first empty oven for baking is performed as follows: sending the current product to two or more first empty ovens that are not adjacent to each other for baking.

4. The baking method according to claim 2, characterized in that, The oven data information also includes baking status information, which includes constant temperature baking status. The step of sending the current product into the second idle oven for baking is as follows: The second available oven is determined based on the obtained data from the working ovens; The current product is then placed into the second idle oven for baking.

5. The baking method according to claim 4, characterized in that, The baking status information also includes the constant temperature baking time; When there are at least two identified second idle ovens, the step of sending the current product into the second idle oven for baking is performed as follows: Based on the constant temperature baking time, the current product is sent to the second idle oven with the longest constant temperature baking time among the adjacent working ovens for baking.

6. The baking method according to claim 1, characterized in that, Also includes: Before baking the product, adjust the target temperature parameters of the heating plate in the PID system.

7. The baking method according to claim 1, characterized in that, Also includes: During baking, the oven temperature data is monitored, and the on / off state of the corresponding oven heating plates is controlled based on the monitored oven temperature data.

8. The baking method according to claim 7, characterized in that, The method of monitoring oven temperature data during baking and controlling the on / off state of the corresponding oven heating plates based on the monitored oven temperature data includes: The heating plate is disconnected when the temperature inside the oven is detected to be higher than a first preset threshold. When the temperature inside the oven is detected to be lower than the second preset threshold, the heating plate is connected.

9. The baking method according to claim 8, characterized in that, After disconnecting the heating plate, adjust the target temperature parameter of the heating plate of the corresponding oven in the PID system.

10. A multi-layer independent oven, characterized in that, It is equipped with a system for implementing the multi-layer independent oven control method as described in any one of claims 1 to 9.

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