A circuit board multi-hole site cooperative detection system and detection method

Abstract

This invention discloses a multi-hole collaborative inspection system and method for circuit boards, relating to the field of circuit board hole quality inspection. It includes a hole position testing platform and a multi-hole collaborative inspection mechanism. The mechanism comprises a magnetic plate, a magnetized plate, an inspection soldering plate, and hole position inspection cones. The magnetized plate is connected to the bottom of the magnetic plate, and the inspection soldering plate is detachably connected to the bottom of the magnetized plate. The inspection soldering plate has a positioning groove whose size matches the size of the circuit board to be inspected. The hole position inspection cones pass through holes on the standard circuit board and are magnetically attracted to the inspection soldering plate. The number of inspection cones corresponds one-to-one with the number of holes on the standard circuit board. The top surface of the hole position testing platform has a tooling groove located directly below the positioning groove. An annular support platform is fixed to the inner wall of the tooling groove. This eliminates the need to adjust the inspection position individually, avoiding invalid inspection of qualified holes, and is suitable for industrial mass production scenarios, significantly shortening the inspection cycle.

Description

Technical Field

[0001] This invention relates to the field of circuit board hole quality inspection, specifically to a multi-hole collaborative inspection system and method for circuit boards. Background Technology

[0002] As the core component of electronic devices, the precision of the hole machining on circuit boards directly affects the assembly accuracy of electronic components, the reliability of circuit connections, and the overall operational stability of the equipment. With the development of electronic devices towards miniaturization, high density, and high integration, the number of holes on circuit boards has increased significantly, the hole diameter has gradually decreased, and the hole distribution has become more dense, placing stringent requirements on the positional accuracy, coaxiality, and other precision indicators of multiple holes.

[0003] Currently, circuit board hole position inspection mainly employs two methods: manual inspection and single-hole inspection. Manual inspection relies on operators using tools such as magnifying glasses and calipers for visual inspection or manual measurement. This method is not only extremely inefficient and unsuitable for mass production needs, but also susceptible to human error, resulting in large measurement errors and failing to guarantee consistent and accurate results. Single-hole inspection involves moving the inspection probe to measure each hole sequentially. While this method offers improved accuracy compared to manual inspection, it requires frequent probe adjustments, leading to long inspection cycles. Furthermore, since the standard for circuit board inspection is that if even one hole fails to meet requirements, the entire circuit board is considered defective. Therefore, single-hole inspection involves inspecting a large number of compliant holes, which is unsuitable for industrial batch inspection and cannot meet the demands of multi-hole collaborative precision inspection. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a multi-hole collaborative detection system and method for circuit boards to solve the deficiencies of the prior art.

[0005] The objective of this invention is achieved through the following technical solution: a multi-hole collaborative inspection system for circuit boards, comprising a hole position testing platform and a multi-hole collaborative inspection mechanism. The multi-hole collaborative inspection mechanism includes a magnetic plate, a magnetized plate, an inspection soldering plate, and hole position detection cones. The magnetized plate is connected to the bottom of the magnetic plate, and the inspection soldering plate is detachably connected to the bottom of the magnetized plate. The inspection soldering plate has a positioning groove, the size of which matches the size of the circuit board to be inspected. The hole position detection cones pass through the holes of the standard circuit board and are magnetically attracted to the inspection soldering plate. The number of hole position detection cones is consistent with the number of holes on the standard circuit board and corresponds one-to-one. The top surface of the hole position testing platform has a tooling groove, which is located directly below the positioning groove. An annular support platform is fixed to the inner wall of the tooling groove to keep the holes to be inspected on the circuit board in a suspended and exposed state. The magnetic plate drives the hole position detection cones to move downwards, and the hole position offset is determined by the length of the hole position detection cones passing through the holes on the circuit board.

[0006] Furthermore, the multi-hole position collaborative detection mechanism also includes a mounting column, a lifting beam, and a lifting cylinder. One end of the mounting column is fixed to the top of the magnetic plate, and the other end is connected to the detection shaft of the pressure sensor through a flange. The pressure sensor is installed at the bottom of the lifting beam. The cylinder body of the lifting cylinder is vertically installed on the hole position test platform, and the telescopic shaft of the lifting cylinder is connected to the lifting beam.

[0007] Furthermore, a laser rangefinder is installed on the lifting beam, and a reflector is provided on the top surface of the hole position test platform, with the reflector located on the laser emission path of the laser rangefinder.

[0008] Furthermore, it also includes a circuit board loading device, which includes a base, a horizontal slide, a crossbeam, a loading seat, and a stacking box. Bases are provided on both sides of the hole position testing platform. A horizontal slide is slidably mounted on the base, and a loading cylinder is vertically mounted on the horizontal slide. The two ends of the crossbeam are respectively connected to the telescopic shafts of the two loading cylinders. The loading seat is slidably mounted on the crossbeam, and the moving direction of the loading seat is perpendicular to the moving direction of the horizontal slide. A negative pressure suction cup is connected to the bottom of the loading seat. The stacking box is mounted on the hole position testing platform, and a stacking slot is opened on the top of the stacking box. The circuit boards to be tested are stacked in the stacking slot, and the negative pressure suction cup is used to load the circuit boards into the tooling slot.

[0009] Furthermore, the tooling slot has a gradually decreasing size, which decreases gradually along the direction close to the annular support platform. The loading seat includes a loading base plate, a horizontal fine-tuning plate, and a vertical fine-tuning plate. The vertical fine-tuning plate is slidably mounted on the horizontal fine-tuning plate and the horizontal fine-tuning plate is slidably mounted on the loading base plate. The horizontal fine-tuning plate has a degree of freedom to move slightly along the length direction of the tooling slot, and the vertical fine-tuning plate has a degree of freedom to move slightly along the width direction of the tooling slot. The negative pressure suction cup is mounted on the vertical fine-tuning plate.

[0010] Furthermore, a first T-shaped groove is formed at the bottom of the feeding substrate, and a first T-shaped slider is fixed at the top of the horizontal fine-tuning plate. The first T-shaped slider is slidably adapted to the first T-shaped groove. A first spring is provided in the first T-shaped groove, and the two ends of the first spring are respectively connected to the first T-shaped slider and the feeding substrate. A second T-shaped groove is formed at the bottom of the horizontal fine-tuning plate, and a second T-shaped slider is fixed at the top of the vertical fine-tuning plate. The second T-shaped slider is slidably adapted to the second T-shaped groove, and a second spring is provided in the second T-shaped groove. The two ends of the second spring are respectively connected to the second T-shaped slider and the horizontal fine-tuning plate.

[0011] Furthermore, a first linear drive module is installed on the top of the base, the horizontal slide is installed on the slide of the first linear drive module, a second linear drive module is installed on the bottom of the crossbeam, the feeding plate is installed on the slide of the second linear drive module, a positioning post is fixed on the top surface of the hole position test platform, a positioning through groove is opened on the bottom of the stacking box, and the positioning post is adapted to the positioning through groove.

[0012] Furthermore, a mounting frame is fixed around the positioning groove on the top of the detection welding plate, and an annular mounting groove is formed on the bottom surface of the magnetized plate at the position corresponding to the mounting frame. The mounting frame is adapted to fit into the annular mounting groove. Grooves are formed on all four side walls of the mounting frame. An oblique hole is formed on the inner wall of the annular mounting groove at the position corresponding to the groove. The oblique hole passes through the outer wall of the magnetized plate, and the lower end of the oblique hole is close to the groove. A locking ball is movably disposed in the oblique hole. A limiting frame is slidably fitted on the magnetized plate. An annular unlocking groove is formed on the inner wall of the limiting frame. When the inner wall of the limiting frame presses the locking ball, the locking ball partially passes through the oblique hole and is located in the groove. When the locking ball disengages from the groove, the locking ball partially is located in the annular unlocking groove.

[0013] Furthermore, a top plate is fixed to the top of the limiting frame, and a circular hole is opened on the top plate for the mounting post to pass through. A drive ring is threaded onto the mounting post, and a bearing is fitted at the bottom of the drive ring. The outer ring of the bearing is fixed to the inner wall of the circular hole. An upper limiting ring and a lower limiting ring are fixedly fitted onto the mounting post, and the drive ring is located between the upper limiting ring and the lower limiting ring. When the drive ring contacts the lower limiting ring, the detection welding plate is connected to the magnetized plate. When the drive ring contacts the upper limiting ring, the detection welding plate can be removed from the magnetized plate.

[0014] A method for collaborative inspection of multiple vias on a circuit board, utilizing the aforementioned collaborative inspection system for multiple vias on a circuit board, includes the following steps:

[0015] S1. Determine the position of the hole detection cone according to the hole position on the standard circuit board; place the standard circuit board in the positioning groove, and then put the hole detection cone in the hole position of each circuit board. The maximum diameter of the hole detection cone is equal to the diameter of the standard hole position. Activate the magnetic plate to attract the hole detection cone to the detection welding plate. Remove the standard circuit board to complete the production of the multi-hole collaborative detection mechanism.

[0016] S2. Place the circuit board to be tested into the tooling slot and make the circuit board contact the annular support platform so that the holes of the circuit board are suspended and exposed.

[0017] S3. The lifting beam moves all the hole detection cones downward, so that the hole detection cones penetrate into the corresponding holes on the circuit board. The pressure feedback from the pressure sensor determines whether the hole detection cones interfere with the circuit board. The laser rangefinder detects the length of the hole detection cones penetrating into the holes, thereby detecting the offset of all holes on the circuit board. If any hole offset exceeds the set range, the circuit board is judged to be defective.

[0018] The beneficial effects of this invention are:

[0019] 1. Enables multi-hole synchronous detection, significantly improving detection efficiency: The magnetically adsorbed hole detection cone corresponds one-to-one with the hole positions on the standard circuit board. A single downward movement can complete the synchronous detection of all holes, eliminating the need to adjust the detection position one by one, avoiding invalid detection of qualified holes, adapting to industrial mass production scenarios, and significantly shortening the detection cycle.

[0020] 2. High detection accuracy and strong reliability of results: By combining the interference feedback of the pressure sensor with the penetration length of the hole detection cone detected by the laser rangefinder, the dual data work together to judge the hole position offset, and can determine whether the hole position of the circuit board meets the requirements within the required detection range.

[0021] 3. High versatility and reduced testing costs: The testing board adopts a detachable connection. For circuit boards of different models and hole distributions, only the corresponding testing board needs to be replaced and the hole testing cone is positioned through the standard circuit board. There is no need to redesign the overall tooling. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of a multi-hole collaborative detection system for circuit boards according to the present invention. Figure 1 ;

[0023] Figure 2 This is a schematic diagram of the structure of the multi-hole collaborative detection mechanism in a circuit board multi-hole collaborative detection system according to the present invention;

[0024] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0025] Figure 4 This is a schematic diagram of the structure of a multi-hole collaborative detection system for circuit boards according to the present invention. Figure 2 ;

[0026] Figure 5 This is a schematic diagram of the cooperation between the loading substrate and the lateral fine-tuning plate in a multi-hole position collaborative detection system for circuit boards according to the present invention.

[0027] Figure 6 This is a schematic diagram illustrating the cooperation between the horizontal and vertical fine-tuning plates in a multi-hole collaborative detection system for circuit boards according to the present invention. Figure 1 ;

[0028] Figure 7 This is a schematic diagram illustrating the cooperation between the horizontal and vertical fine-tuning plates in a multi-hole collaborative detection system for circuit boards according to the present invention. Figure 2 ;

[0029] Figure 8 This is a schematic diagram of the internal structure of the hole position test stage in a multi-hole position collaborative detection system for circuit boards according to the present invention;

[0030] In the diagram, 1-hole position testing platform, 2-magnetic plate, 3-magnetized plate, 4-inspection welding plate, 5-hole position detection cone, 6-positioning groove, 7-tooling groove, 8-ring support platform, 9-mounting column, 10-lifting beam, 11-lifting cylinder, 12-laser rangefinder sensor, 13-base, 14-horizontal slide, 15-crossbeam, 16-loading seat, 17-loading cylinder, 18-stacking box, 19-negative pressure suction cup, 20-stacking groove, 21-loading base plate, 22-lateral fine-tuning plate, 23-longitudinal fine-tuning plate, 24-first T-shaped slide, 25-first T-shaped slider, 26-first spring, 2 7-Second T-shaped slide groove, 28-Second T-shaped slider, 29-Second spring, 30-First linear drive module, 31-Second linear drive module, 32-Positioning post, 33-Positioning through groove, 34-Mounting frame, 35-Annular mounting groove, 36-Groove, 37-Angled hole, 38-Locking ball, 39-Limiting frame, 40-Annular unlocking groove, 41-Top plate, 42-Round hole, 43-Drive ring, 44-Bearing, 45-Upper limit ring, 46-Lower limit ring, 47-Pressure sensor, 48-Electromagnet, 49-Negative pressure chamber, 50-Negative pressure hole, 51-Lifting cylinder, 52-Lifting plate. Detailed Implementation

[0031] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited to the following description.

[0032] Example 1

[0033] like Figures 1 to 8As shown, a multi-hole collaborative inspection system for circuit boards includes a hole position testing platform 1 and a multi-hole collaborative inspection mechanism. The multi-hole collaborative inspection mechanism includes a magnetic plate 2, a magnetized plate 3, an inspection soldering plate 4, and hole position detection cones 5. The magnetized plate 3 is connected to the bottom of the magnetic plate 2, and the inspection soldering plate 4 is detachably connected to the bottom of the magnetized plate 3. The inspection soldering plate 4 has a positioning groove 6, the size of which matches the size of the circuit board to be inspected. The hole position detection cones 5 pass through the holes of the standard circuit board and are magnetically attracted to the inspection soldering plate 4. The number of hole position detection cones 5 is consistent with the number of holes on the standard circuit board and corresponds one-to-one. The top surface of the hole position testing platform 1 has a tooling... The tooling groove 7 is located directly below the positioning groove 6. The inner wall of the tooling groove 7 is fixed with an annular support platform 8, which is used to keep the hole to be tested on the circuit board in a suspended and exposed state. The magnetic plate 2 drives the hole position detection cone 5 to move downward. The hole position offset is judged by the length of the hole position detection cone 5 passing through the hole on the circuit board. First, the hole position detection cone 5 is installed according to the hole position on the standard circuit board. The hole position detection cone 5 includes a cylindrical section and a conical section. The diameter of the cylindrical section is equal to the diameter of the mating hole. The large diameter end of the conical section is fixed to the cylindrical section, and the maximum diameter of the conical section is equal to the diameter of the cylindrical section. Holes of different sizes are equipped with corresponding hole position detection cones 5.A standard circuit board is placed in the positioning slot 6 to quickly determine the position of each hole on the magnetized plate 3. Then, a corresponding hole detection cone 5 is configured for each hole. The cylindrical section of the hole detection cone 5 is inserted into the hole to contact the magnetized plate 3. After all holes have been configured with hole detection cones 5, the magnetic plate 2 is energized, causing it to generate magnetic force that attracts the hole detection cones 5 to the magnetized plate 3, thus fixing all the hole detection cones 5 at once. The hole detection cones 5 are stabilized by magnetic force and then welded to the detection welding plate 4. This allows the hole position detection cone 5 to be precisely fixed on the inspection welding plate 4. The magnetic adsorption during welding ensures that the hole position detection cone 5 will not shift during the welding process, providing high connection strength and guaranteeing accuracy. After the hole position detection cone 5 is positioned and fixed, the circuit board to be inspected is placed in the fixture slot 7. The fixture slot 7 matches the size of the circuit board, allowing for precise fixture mounting. Since the positioning slot 6 is located within the fixture slot 7... Directly above, during inspection, only the hole position detection cone 5 needs to be moved downwards. The circuit board is supported by the annular support platform 8, exposing the holes in the circuit board to be inspected. The hole position detection cone 5 penetrates the holes in the circuit board. When the conical segments of all the hole position detection cones 5 can pass through the holes on the circuit board, it indicates that the hole quality of the circuit board meets the requirements, that is, the circuit board is a good product. When a hole on the circuit board is misaligned, the conical segment of the corresponding hole position detection cone 5 cannot pass through the corresponding hole. Since the size of the conical segment is gradually changing... The method determines the offset of a hole position based on the penetration depth of the conical segment. Holes within the offset range are considered good, thus enabling rapid assessment of the quality of holes on the circuit board. If any hole detection cone 5 fails to penetrate the corresponding hole, the entire inspection board 4 cannot move further downwards. The hole position offset is then determined by the penetration depth of the hole detection cone 5. If the hole detection cone 5 reaches the corresponding position, the circuit board is considered good, avoiding invalid inspection of qualified holes. This method is suitable for industrial mass production scenarios and significantly shortens the inspection cycle.

[0034] Furthermore, the bottom of the magnetic plate 2 is provided with an installation slot, and several electromagnets 48 are installed in the installation slot. The electromagnets 48 are arranged in a rectangular array. The magnetization plate 3 is installed at the bottom of the magnetic plate 2 with screws. The installation slot is closed by the magnetization plate 3. When the electromagnets 48 are energized, magnetic force is generated, which can magnetically attract the hole position detection cone 5 to the detection welding plate 4, providing a stable tooling for the welding of the hole position detection cone 5.

[0035] Example 2

[0036] Based on Example 1, such as Figure 1As shown, the multi-hole position collaborative detection mechanism also includes a mounting column 9, a lifting beam 10, and a lifting cylinder 11. One end of the mounting column 9 is fixed to the top of the magnetic plate 2, and the other end is connected to the detection shaft of the pressure sensor 47 via a flange. The pressure sensor 47 is installed at the bottom of the lifting beam 10. The cylinder body of the lifting cylinder 11 is vertically installed on the hole position test platform 1. The telescopic shaft of the lifting cylinder 11 is connected to the lifting beam 10. A laser rangefinder 12 is installed on the lifting beam 10. A reflector is provided on the top surface of the hole position test platform 1. The reflector is located on the laser emission path of the laser rangefinder 12. The top surface of the reflector is flush with the top surface of the annular support platform 8. The thickness of the circuit board is known, while the relative position of the laser rangefinder 12 and the hole position detection cone 5 remains unchanged. Therefore, the distance between the laser rangefinder 12 and the hole detection cone 5 is also known. The distance between the laser emission point of the laser rangefinder 12 and the bottom of the hole detection cone 5 is denoted as X, the thickness of the circuit board is denoted as H, the distance between the laser emission point of the laser rangefinder 12 and the reflector is denoted as Y, and the penetration depth of the hole detection cone 5 is Z=YXH. According to the feedback from the pressure sensor 47 on the state between the hole detection cone 5 and the circuit board, when the hole detection cone 5 can no longer move downward, the hole detection cone 5 will squeeze the side wall of the corresponding hole, thereby increasing the reading of the pressure sensor 47. This determines the movement of the hole detection cone 5, and the penetration depth of the hole detection cone 5 is calculated. If the penetration depth is within the set range, the circuit board is a good product.

[0037] Example 3

[0038] Based on Example 2, such as Figures 1 to 3As shown, a mounting frame 34 is fixed around the positioning groove 6 on the top of the detection welding plate 4. An annular mounting groove 35 is formed on the bottom surface of the magnetized plate 3 at the position corresponding to the mounting frame 34. The mounting frame 34 fits into the annular mounting groove 35. Grooves 36 are formed on the four side walls of the mounting frame 34. An inclined hole 37 is formed on the inner wall of the annular mounting groove 35 at the position corresponding to the groove 36. The inclined hole 37 passes through the outer wall of the magnetized plate 3. The lower end of the inclined hole 37 is close to the groove 36. A locking ball 38 is movably disposed in the inclined hole 37. A limiting frame 39 is slidably sleeved on the magnetized plate 3. An annular unlocking groove 40 is formed on the inner wall of the limiting frame 39. When the inner wall of the limiting frame 39 presses the locking ball 38, the locking ball 38 partially passes through the inclined hole 37 and is located in the groove 36. When the locking ball 38 is disengaged from the groove 36, the locking ball 38... Part 8 is located within the annular unlocking groove 40. A top plate 41 is fixed to the top of the limiting frame 39. A circular hole 42 is provided on the top plate 41 for the mounting post 9 to pass through. A drive ring 43 is threaded onto the mounting post 9. A bearing 44 is fitted to the bottom of the drive ring 43. The outer ring of the bearing 44 is fixed to the inner wall of the circular hole 42. An upper limit ring 45 and a lower limit ring 46 are fixedly fitted onto the mounting post 9. The drive ring 43 is located between the upper limit ring 45 and the lower limit ring 46. When the drive ring 43 contacts the lower limit ring 46, the detection welding plate 4 is connected to the magnetized plate 3. When the drive ring 43 contacts the upper limit ring 45, the detection welding plate 4 can be removed from the magnetized plate 3. The detection welding plate 4 is a detachable part. Different sizes of circuit boards correspond to different detection welding plates 4. The detection welding plate 4 adopts a solid... In Example 1, the hole position detection cone 5 is configured. When replacing the detection circuit board, the corresponding detection soldering plate 4 can be replaced. The specific disassembly and assembly process is as follows: Rotate the drive ring 43 upward. Under the action of the bearing 44, the drive ring 43 and the limit frame 39 have relative rotational freedom, allowing the drive ring 43 to drive the limit frame 39 to move upward. When the drive ring 43 contacts the upper limit ring 45, the annular unlocking groove 40 moves upward to correspond to the inclined hole 37. At this time, the locking ball 38 can move from the inclined hole 37 to the annular unlocking groove 40. Then, pull the detection soldering plate 4 downward. The detection soldering plate 4 will squeeze the locking ball 38. Under the action of the spherical surface of the locking ball 38, the locking ball 38 moves. At this time, the locking ball 38 is completely located in the space formed by the inclined hole 37 and the annular unlocking groove 40, thereby enabling the detection... The test board 4 is removed, and then the corresponding test board 4 for the circuit board to be tested is installed. Different test boards 4 have the same external dimensions, and the dimensions and installation positions of the mounting frame 34 are the same. The difference lies in the size of the positioning groove 6, used to adapt to different circuit boards. Under its own weight, the locking ball 38 partially slides out of the oblique hole 37. When the mounting frame 34 is inserted into the annular mounting groove 35, the mounting frame 34 will press the locking ball 38 to move, allowing the mounting frame 34 to smoothly fit into the annular mounting groove 35. Then, under its own weight, the locking ball 38 partially slides into the groove 36. Then, the drive ring 43 is rotated downwards, causing the drive ring 43 to move the limiting frame 39 downwards. When the drive ring 43 contacts the lower limiting ring 46, the annular unlocking groove 40 is located below the oblique hole 37.The inner wall plane of the limiting frame 39 blocks the oblique hole 37 and contacts the locking ball 38, thus preventing the locking ball 38 from disengaging from the groove 36. This allows the detection welding plate 4 to be installed on the magnetized plate 3, and the installation and removal are simple and quick, requiring no attention to the screws and avoiding stripped screws. In specific implementation, the magnetic plate 2 is detachably connected to the detection shaft of the pressure sensor 47 via a flange. When determining the position of the hole position detection cone 5, the magnetic plate 2 is disassembled and placed upside down on the hole position test stage 1, with the positioning groove 6 facing upwards. Then, the standard circuit board is placed into the positioning groove 6 to configure the hole position detection cone 5, making the operation more convenient.

[0039] Example 4

[0040] To enable the tooling slot 7 to accommodate circuit boards of different sizes, based on embodiment three, such as... Figure 1 and Figure 8 As shown, the hole position testing platform 1 includes a main platform and a detachable platform plate. The top surface of the main platform has a platform plate groove, and the detachable platform plate is fitted into the platform plate groove and connected by bolts. Different sizes of circuit boards are equipped with corresponding detachable platform plates. The different detachable platform plates have the same external dimensions so that they can all be installed on the main platform. The tooling slots 7 on the different detachable platform plates have different dimensions to match different sizes of circuit boards. During testing, the corresponding detachable platform plate and test soldering plate 4 can be installed according to the size of the circuit board. Secondly, the annular support platform 8 has a negative pressure chamber 49. The top surface of the annular support platform 8 has a negative pressure hole 50 that connects to the negative pressure chamber 49. The annular support platform 8 is connected to a negative pressure pump through a pipe. The circuit board on the annular support platform 8 is tooled by negative pressure to ensure that the position of the circuit board will not shift during the hole position testing process, thus ensuring the accuracy of the test.

[0041] Example 5

[0042] Based on Example 4, such as Figures 1 to 7As shown, it also includes a circuit board loading device, which includes a base 13, a horizontal slide 14, a crossbeam 15, a loading seat 16, and a stacking box 18. Bases 13 are provided on both sides of the hole position testing platform 1. A horizontal slide 14 is slidably mounted on the base 13, and a loading cylinder 17 is vertically mounted on the horizontal slide 14. The two ends of the crossbeam 15 are respectively connected to the telescopic shafts of the two loading cylinders 17. The loading seat 16 is slidably mounted on the crossbeam 15, and the moving direction of the loading seat 16 is perpendicular to the moving direction of the horizontal slide 14. A negative pressure suction cup 19 is connected to the bottom of the loading seat 16. The stacking box 18 is mounted on the hole position testing platform 1, and a stacking slot 20 is opened on the top of the stacking box 18. The circuit boards to be tested are stacked in the stacking slot 20. The negative pressure suction cup 19 is used to load the circuit boards into the tooling slot 7. A first linear drive module 30 is mounted on the top of the base 13, and the horizontal slide 14 is mounted on the first linear drive module. On the slide of group 30, a second linear drive module 31 is installed at the bottom of the crossbeam 15. The loading seat 16 is installed on the slide of the second linear drive module 31. The top surface of the hole position test table 1 is fixed with a positioning post 32. The bottom of the stacking box 18 is provided with a positioning through groove 33. The positioning post 32 is adapted to the positioning through groove 33. The first linear drive module 30 drives the horizontal slide 14 to move, thereby driving the negative pressure suction cup 19 to move between the stacking box 18 and the tooling groove 7. The second linear drive module 31 drives the loading seat 16 to move, so that the negative pressure suction cup 19 corresponds to the stacking groove 20. The loading cylinder 17 drives the negative pressure suction cup 19 to move downward, so that the negative pressure suction cup 19 adsorbs the circuit board in the stacking groove 20. Then the circuit board is placed in the tooling groove 7. The positioning of the stacking box 18 is completed by the cooperation of the positioning post 32 and the positioning through groove 33, so that the negative pressure suction cup 19 can successfully adsorb the circuit board and place it in the tooling groove 7.

[0043] Furthermore, the hole position test bench 1 is provided with a feeding chamber, in which a lifting cylinder 51 is vertically installed. The telescopic shaft of the lifting cylinder 51 is connected to a lifting plate 52. The positioning column 32 is hollow and connected to the feeding chamber, so that the lifting cylinder 51 can drive the lifting plate 52 to move into the stacking slot 20. The lifting plate 52 lifts the circuit board, so that the feeding height of the uppermost circuit board remains unchanged, and the negative pressure suction cup 19 can feed the circuit boards one by one into the tooling slot 7 to complete the test.

[0044] Example 6

[0045] Due to the movement error of the circuit board loading device, the circuit board could not be accurately delivered into the tooling slot 7. Therefore, based on Embodiment 5, as follows: Figures 1 to 7As shown, the tooling slot 7 has a gradually decreasing size, which decreases gradually along the direction close to the annular support platform 8. The loading base 16 includes a loading base plate 21, a transverse fine-tuning plate 22, and a longitudinal fine-tuning plate 23. The longitudinal fine-tuning plate 23 is slidably mounted on the transverse fine-tuning plate 22, and the transverse fine-tuning plate 22 is slidably mounted on the loading base plate 21. The loading base plate 21 is mounted on the slide of the second linear drive module 31. The transverse fine-tuning plate 22 has a degree of freedom to move slightly along the length direction of the tooling slot 7, and the longitudinal fine-tuning plate 23 has... The negative pressure suction cup 19 is mounted on the longitudinal fine-tuning plate 23, allowing for slight movement along the width of the tooling groove 7. A first T-shaped groove 24 is provided at the bottom of the loading base plate 21. A first T-shaped slider 25 is fixed to the top of the transverse fine-tuning plate 22. The first T-shaped slider 25 slides within the first T-shaped groove 24. A first spring 26 is provided within the first T-shaped groove 24, with its two ends connected to the first T-shaped slider 25 and the loading base plate 21, respectively. A second T-shaped groove 25 is provided at the bottom of the transverse fine-tuning plate 22. The top of the vertical fine-tuning plate 23 is fixed with a second T-shaped slider 28, which slides within the second T-shaped groove 27. A second spring 29 is installed within the second T-shaped groove 27, with its two ends connected to the second T-shaped slider 28 and the horizontal fine-tuning plate 22, respectively. The negative pressure suction cup 19 has a rigid structure and horizontally places the circuit board into the tooling slot 7. When the circuit board shifts, it will press against the inner inclined surface of the tooling slot 7. Under the action of the pressure, the longitudinal fine-tuning plate 23 squeezes the second spring 29 to slide, realizing longitudinal position fine-tuning, and the transverse fine-tuning plate 22 squeezes the first spring 26 to slide, realizing transverse position fine-tuning. As the negative pressure suction cup 19 moves the circuit board closer to the annular support platform 8, the negative pressure suction cup 19 can adaptively make fine adjustments, so that the negative pressure suction cup 19 can smoothly place the circuit board on the annular support platform 8. The annular support platform 8 then uses negative pressure to adsorb the circuit board. Finally, the negative pressure suction cup 19 detaches from the circuit board to complete the precise loading of the circuit board.

[0046] Example 7

[0047] Based on Embodiment Six, a method for collaborative detection of multiple vias on a circuit board, utilizing the aforementioned collaborative detection system for multiple vias on a circuit board, includes the following steps:

[0048] S1. Determine the position of the hole detection cone 5 according to the hole position on the standard circuit board; place the standard circuit board in the positioning groove 6, and then put the hole detection cone 5 into the hole position of each circuit board. The maximum diameter of the hole detection cone 5 is equal to the diameter of the standard hole position. Power the magnetic plate 2 to attract the hole detection cone 5 onto the detection welding plate 4. Remove the standard circuit board to complete the production of the multi-hole position collaborative detection mechanism.

[0049] S2. Place the circuit board to be tested into the tooling slot 7 and make the circuit board contact the annular support platform 8, so that the holes of the circuit board are suspended and exposed.

[0050] S3. The lifting beam 10 moves all the hole detection cones 5 downwards, so that the hole detection cones 5 penetrate into the corresponding holes on the circuit board. Based on the pressure feedback of the pressure sensor 47, it is determined whether the hole detection cones 5 interfere with the circuit board. In conjunction with the laser rangefinder 12, the length of the hole detection cones 5 penetrating into the holes is detected, thereby collaboratively detecting the offset of all holes on the circuit board. If the offset of any hole exceeds the set range, the circuit board is judged to be defective.

Claims

1. A multi-hole position collaborative detection system for circuit boards, characterized in that, The test includes a hole position testing platform (1) and a multi-hole position collaborative detection mechanism. The multi-hole position collaborative detection mechanism includes a magnetic plate (2), a magnetized plate (3), a detection welding plate (4), and a hole position detection cone (5). The magnetized plate (3) is connected to the bottom of the magnetic plate (2), and the detection welding plate (4) is detachably connected to the bottom of the magnetized plate (3). The detection welding plate (4) has a positioning groove (6) with the size matching the size of the circuit board to be tested. The hole position detection cone (5) passes through the hole position of the standard circuit board and is magnetically attracted to the detection plate. On the test board (4), the number of hole detection cones (5) is consistent with the number of holes on the standard circuit board and corresponds one-to-one. The top surface of the hole testing platform (1) is provided with a tooling groove (7). The tooling groove (7) is located directly below the positioning groove (6). The inner wall of the tooling groove (7) is fixed with an annular support platform (8) to make the hole to be tested on the circuit board in a suspended and exposed state. The magnetic plate (2) drives the hole detection cones (5) to move downward. The hole offset is judged by the length of the hole detection cones (5) passing through the hole on the circuit board. It also includes a circuit board loading device, which includes a base (13), a horizontal slide (14), a crossbeam (15), a loading seat (16), and a stacking box (18). The hole position testing platform (1) has bases (13) on both sides. A horizontal slide (14) is slidably mounted on the base (13). A loading cylinder (17) is vertically mounted on the horizontal slide (14). The two ends of the crossbeam (15) are respectively connected to the telescopic shafts of the two loading cylinders (17). The loading seat (16) is slidably mounted on the crossbeam (15). The moving direction of the loading seat (16) is perpendicular to the moving direction of the horizontal slide (14). The bottom of the loading seat (16) is connected to a negative pressure suction cup (19). The stacking box (18) is mounted on the hole position test platform (1). The top of the stacking box (18) is provided with a stacking groove (20). The circuit board to be tested is stacked in the stacking groove (20). The negative pressure suction cup (19) is used to load the circuit board into the tooling groove (7).

2. The circuit board multi-hole position collaborative detection system according to claim 1, characterized in that, The multi-hole position collaborative detection mechanism also includes a mounting column (9), a lifting beam (10), and a lifting cylinder (11). One end of the mounting column (9) is fixed to the top of the magnetic plate (2), and the other end is connected to the detection shaft of the pressure sensor (47) through a flange. The pressure sensor (47) is installed at the bottom of the lifting beam (10). The cylinder body of the lifting cylinder (11) is vertically installed on the hole position test platform (1). The telescopic shaft of the lifting cylinder (11) is connected to the lifting beam (10).

3. The circuit board multi-hole position collaborative detection system according to claim 2, characterized in that, A laser rangefinder (12) is installed on the lifting beam (10), and a reflector is provided on the top surface of the hole position test platform (1). The reflector is located on the laser emission path of the laser rangefinder (12).

4. The circuit board multi-hole position collaborative detection system according to claim 1, characterized in that, The tooling groove (7) has a gradually decreasing size, and the size of the tooling groove (7) gradually decreases along the direction close to the annular support platform (8). The loading seat (16) includes a loading base plate (21), a horizontal fine adjustment plate (22) and a vertical fine adjustment plate (23). The vertical fine adjustment plate (23) is slidably disposed on the horizontal fine adjustment plate (22). The horizontal fine adjustment plate (22) is slidably disposed on the loading base plate (21). The horizontal fine adjustment plate (22) has a degree of freedom to move slightly along the length direction of the tooling groove (7). The vertical fine adjustment plate (23) has a degree of freedom to move slightly along the width direction of the tooling groove (7). The negative pressure suction cup (19) is mounted on the vertical fine adjustment plate (23).

5. The circuit board multi-hole position collaborative detection system according to claim 4, characterized in that, The bottom of the loading substrate (21) is provided with a first T-shaped groove (24), the top of the horizontal fine-tuning plate (22) is fixed with a first T-shaped slider (25), the first T-shaped slider (25) slides and adapts to the first T-shaped groove (24), the first T-shaped groove (24) is provided with a first spring (26), the two ends of the first spring (26) are respectively connected to the first T-shaped slider (25) and the loading substrate (21), the bottom of the horizontal fine-tuning plate (22) is provided with a second T-shaped groove (27), the top of the vertical fine-tuning plate (23) is fixed with a second T-shaped slider (28), the second T-shaped slider (28) slides and adapts to the second T-shaped groove (27), the second T-shaped groove (27) is provided with a second spring (29), the two ends of the second spring (29) are respectively connected to the second T-shaped slider (28) and the horizontal fine-tuning plate (22).

6. The circuit board multi-hole position collaborative detection system according to claim 4, characterized in that, The base (13) is equipped with a first linear drive module (30) on top, the horizontal slide (14) is installed on the slide of the first linear drive module (30), the crossbeam (15) is equipped with a second linear drive module (31) on bottom, the loading plate (21) is installed on the slide of the second linear drive module (31), the hole position test table (1) is fixed with a positioning post (32) on top surface, the stacking box (18) is provided with a positioning through groove (33) on bottom, and the positioning post (32) is adapted to the positioning through groove (33).

7. The circuit board multi-hole position collaborative detection system according to claim 2, characterized in that, The top of the testing welding plate (4) is fixed with a mounting frame (34) around the positioning groove (6). The bottom surface of the magnetizing plate (3) has an annular mounting groove (35) at the position corresponding to the mounting frame (34). The mounting frame (34) fits into the annular mounting groove (35). The four side walls of the mounting frame (34) are provided with grooves (36). The inner wall of the annular mounting groove (35) has an inclined hole (37) at the position corresponding to the groove (36). The inclined hole (37) passes through the outer wall of the magnetizing plate (3). The lower end of the hole (37) is close to the groove (36). A locking ball (38) is movably disposed in the inclined hole (37). A limiting frame (39) is slidably sleeved on the magnetized plate (3). An annular unlocking groove (40) is opened on the inner wall of the limiting frame (39). When the inner wall of the limiting frame (39) squeezes the locking ball (38), the locking ball (38) partially passes through the inclined hole (37) and is located in the groove (36). When the locking ball (38) is disengaged from the groove (36), the locking ball (38) is partially located in the annular unlocking groove (40).

8. The circuit board multi-hole position collaborative detection system according to claim 7, characterized in that, The top of the limiting frame (39) is fixed with a top plate (41). The top plate (41) has a round hole (42) for the mounting post (9) to pass through. The mounting post (9) is threaded with a drive ring (43). The bottom of the drive ring (43) is fitted with a bearing (44). The outer ring of the bearing (44) is fixed on the inner wall of the round hole (42). The mounting post (9) is fixed with an upper limit ring (45) and a lower limit ring (46). The drive ring (43) is located between the upper limit ring (45) and the lower limit ring (46). When the drive ring (43) contacts the lower limit ring (46), the detection welding plate (4) is connected to the magnetized plate (3). When the drive ring (43) contacts the upper limit ring (45), the detection welding plate (4) can be removed from the magnetized plate (3).

9. A method for collaborative detection of multiple vias on a circuit board, utilizing the collaborative detection system for multiple vias on a circuit board as described in claim 3, characterized in that, Includes the following steps: S1. Determine the position of the hole detection cone (5) according to the hole position on the standard circuit board; place the standard circuit board in the positioning groove (6), and then put the hole detection cone (5) in the hole position of each circuit board. The maximum diameter of the hole detection cone (5) is equal to the diameter of the standard hole position. Power the magnetic plate (2) to attract the hole detection cone (5) onto the detection soldering plate (4). Remove the standard circuit board to complete the production of the multi-hole position collaborative detection mechanism. S2. Place the circuit board to be tested into the tooling slot (7) and make the circuit board contact the annular support platform (8) so that the holes of the circuit board are suspended and exposed. S3. The lifting beam (10) drives all the hole detection cones (5) to move downward, so that the hole detection cones (5) penetrate into the corresponding hole of the circuit board. Based on the pressure feedback of the pressure sensor (47), it is determined whether the hole detection cones (5) interfere with the circuit board. The laser range sensor (12) is used to detect the length of the hole detection cones (5) penetrating into the hole, thereby detecting the offset of all holes on the circuit board. If the offset of any hole exceeds the set range, the circuit board is judged to be defective.

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